CN113814560B - Multi-pulse width laser processing device and method - Google Patents

Multi-pulse width laser processing device and method Download PDF

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Publication number
CN113814560B
CN113814560B CN202111064535.1A CN202111064535A CN113814560B CN 113814560 B CN113814560 B CN 113814560B CN 202111064535 A CN202111064535 A CN 202111064535A CN 113814560 B CN113814560 B CN 113814560B
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laser
pulse width
processing
ultrasonic vibration
jet
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CN113814560A (en
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王成勇
王军
杜策之
郑李娟
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Guangdong University of Technology
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Guangdong University of Technology
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Priority to PCT/CN2021/129349 priority patent/WO2023035395A1/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0652—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/703—Cooling arrangements

Abstract

The application relates to a multi-pulse width laser processing device and a method. The device comprises: the device comprises a multi-pulse-width laser output assembly, a jet flow nozzle, an ultrasonic vibration assembly, a processing platform and a controller; the controller is respectively and electrically connected with the multi-pulse-width laser output assembly, the jet flow nozzle and the ultrasonic vibration assembly; the processing platform is used for placing a workpiece to be processed; the multi-pulse width laser output assembly is arranged above the object placing surface of the processing platform; the multi-pulse width laser output assembly comprises: the device comprises a first laser transmitter, a second laser transmitter and a light beam coupling device; the beam coupling device is used for coupling the lasers emitted by the first laser emitter and the second laser emitter to form a common-path laser beam; the jet nozzle is arranged on the side of the processing platform and faces the processing platform; the ultrasonic vibration component is arranged below the object placing surface of the processing platform and drives the processing platform to vibrate through ultrasonic waves. The scheme that this application provided can high-efficient not damaged processing.

Description

Multi-pulse width laser processing device and method
Technical Field
The application relates to the technical field of laser processing, in particular to a multi-pulse width laser processing device and method.
Background
With the high-speed development of the fields of 3C electronics, automobiles, molds, energy sources, aerospace and the like, in the face of great requirements on chips, high-frequency circuit boards, aircraft engines, medical instruments, and material part processing cutters of various industries, high-value-added hard and brittle materials such as monocrystalline silicon, superhard ceramics, polycrystalline diamond and the like are widely applied, and the requirements of the market on processing quality and processing efficiency are continuously improved, particularly on nondestructive processing. The polycrystalline diamond cutter with the special cutting edge structure and the rake face microstructure can obviously improve the material processing precision and reduce the processing heat influence, but the large-scale mass production of the polycrystalline diamond cutter with the special structure needs high-efficiency high-precision processing equipment and process support, and the cutter production cost is high.
Therefore, in the related art, a non-contact machining process such as ion beam, electric spark, laser, etc. is used for machining materials, and although the machining process has good machining precision and machining efficiency, the machining process still has the problem that the machining heat affected zone is large, and efficient nondestructive machining is difficult to achieve. For example, the ultrashort pulse laser can significantly reduce the processing heat affected zone of a hard and brittle material, but the ultrashort pulse laser still has a heat accumulation phenomenon in the high-frequency pulse processing process, and the low-frequency pulse processing efficiency is too low to meet the requirement of high-efficiency processing. Therefore, in the prior art, it is still difficult to balance the relationship between the machining efficiency and the thermal influence, and to realize efficient damage-free machining.
Disclosure of Invention
In order to overcome the problems in the related art, the application provides a multi-pulse width laser processing device and method, which can balance the relation between the processing efficiency and the thermal influence and realize efficient nondestructive processing.
The present application provides in a first aspect a multiple pulse width laser processing apparatus, comprising:
the device comprises a multi-pulse width laser output assembly 10, a jet flow nozzle 20, an ultrasonic vibration assembly 30, a processing platform 40 and a controller 50;
the controller 50 is electrically connected with the multi-pulse width laser output assembly 10, the jet nozzle 20 and the ultrasonic vibration assembly 30 respectively;
the processing platform 40 is used for placing a workpiece 60 to be processed; the multi-pulse width laser output assembly 10 is arranged above the object placing surface of the processing platform 40; the multiple pulse width laser output assembly 10 includes: a first laser transmitter 101, a second laser transmitter 102 and a beam coupling device 103; the beam coupling device 103 is configured to couple laser beams emitted by the first laser emitter 101 and the second laser emitter 102 to form a common laser beam;
the jet nozzle 20 is arranged at the side of the processing platform 40, and the jet nozzle 20 faces the processing platform 40;
the ultrasonic vibration component 30 is arranged below the object placing surface of the processing platform 40, and drives the processing platform 40 to vibrate through ultrasonic waves.
In one embodiment, the included angle between the central axis of the jet nozzle 20 and the processing platform 40 is in the range of 10 ° to 85 °; the jet flow generated by the jet flow nozzle 20 has the pressure range of 10MPa to 50MPa, and the distance between the incident point and the action point of the common path laser beam is less than 30mm.
In one embodiment, the direction of vibration of the ultrasonic vibration assembly 30 is adjustable; the ultrasonic vibration component 30 has an ultrasonic vibration frequency of more than 20kHz and an amplitude of more than 2 μm.
In one embodiment, the beam coupling device 103 includes: a beam splitting prism.
A second aspect of the present application provides a multi-pulse width laser processing method, which is implemented based on any one of the above multi-pulse width laser processing apparatuses, and includes:
acquiring fracture toughness parameters of a workpiece to be processed;
setting a multi-pulse width laser output assembly, a jet nozzle and an ultrasonic vibration assembly according to the comparison result of the fracture toughness parameter and the fracture toughness threshold value;
and starting the multi-pulse-width laser output assembly, the jet flow nozzle and the ultrasonic vibration assembly for a preset processing time to finish processing.
In one embodiment, the setting the multi-pulse width laser output assembly, the jet nozzle, and the ultrasonic vibration assembly according to the comparison of the fracture toughness parameter to the fracture toughness threshold comprises:
judging whether the fracture toughness parameter is smaller than a fracture toughness threshold value, if so, setting the multi-pulse width laser output assembly, the jet flow nozzle and the ultrasonic vibration assembly according to a first processing strategy;
if not, acquiring the workpiece thickness of the workpiece to be processed, judging whether the workpiece thickness is smaller than a thickness threshold value, and if so, setting the multi-pulse-width laser output assembly, the jet flow nozzle and the ultrasonic vibration assembly according to a second processing strategy;
and if not, setting the multi-pulse width laser output assembly, the jet flow nozzle and the ultrasonic vibration assembly according to a third processing strategy.
In one embodiment, the fracture toughness threshold value is 4MPa/m 2 (ii) a The thickness threshold value is 500 μm.
In one embodiment, the first processing strategy comprises: the power of the multi-pulse width laser output assembly is larger than 10W, wherein the value range of the pulse width of the first laser transmitter is 6ps to 10ps, the value range of the pulse width of the second laser transmitter is 10fs to 500fs, and the value range of the laser emission interval of the first laser transmitter and the second laser transmitter is 10 mu s to 200 mu s; the included angle between the central axis of the jet nozzle and the processing platform ranges from 10 degrees to 50 degrees, and the pressure of jet generated by the jet nozzle ranges from 20MPa to 50MPa; the ultrasonic vibration component has the ultrasonic vibration frequency of more than 50kHz and the amplitude of more than 3 mu m, and the ultrasonic vibration component vibrates in two directions in a coordinated manner.
In one embodiment, the second processing strategy comprises: the power of the multi-pulse-width laser output assembly is more than 10W, wherein the pulse width of the first laser transmitter is less than 10ps, the pulse width of the second laser transmitter is less than 500fs, and the value range of the laser transmitting interval of the first laser transmitter and the second laser transmitter is 100 mu s-1 ms; the included angle between the central axis of the jet nozzle and the processing platform ranges from 10 degrees to 50 degrees, and the pressure of jet generated by the jet nozzle ranges from 10MPa to 30MPa; the ultrasonic vibration frequency of the ultrasonic vibration component is greater than 20kHz, the amplitude is greater than 3 mu m, and the ultrasonic vibration component vibrates in two directions in a coordinated mode.
In one embodiment, the third processing strategy comprises: the power of the multi-pulse-width laser output assembly is more than 20W, wherein the value range of the pulse width of the first laser transmitter is 6ps to 10ps, the value range of the pulse width of the second laser transmitter is 10fs to 500fs, and the value range of the laser emission interval of the first laser transmitter and the second laser transmitter is 1 mu s to 100 mu s; the included angle between the central axis of the jet nozzle and the processing platform ranges from 50 degrees to 80 degrees, and the pressure of jet generated by the jet nozzle ranges from 20MPa to 50MPa; the ultrasonic vibration frequency of the ultrasonic vibration component is larger than 50kHz, the amplitude is larger than 5 mu m, and the ultrasonic vibration component vibrates in three directions in a coordinated mode.
The technical scheme provided by the application can comprise the following beneficial effects:
the application provides a multi-pulse width laser processing device, which comprises a multi-pulse width laser output assembly, a jet flow nozzle, an ultrasonic vibration assembly, a processing platform and a controller; the controller is respectively and electrically connected with the multi-pulse-width laser output assembly, the jet flow nozzle and the ultrasonic vibration assembly, and the multi-pulse-width laser output assembly comprises a first laser transmitter, a second laser transmitter and a light beam coupling device, and the light beam coupling device can couple laser emitted by the first laser transmitter and the second laser transmitter to form a common-path laser beam, so that the first laser transmitter and the second laser transmitter can respectively output laser pulses with different pulse widths according to certain interval duration to process the same position of a workpiece to be processed on the processing platform under the control of the controller, and the laser pulses with different pulse widths are used for alternative processing to prevent the heat affected area from being too large due to continuous high-frequency processing; simultaneously, the controller control efflux nozzle is towards treating the processing work piece ejection water efflux from the side of processing platform, under the impact of water jet, further treats the processing work piece and processes to take away some heat that the processing produced through rivers, reduce the processing heat damage, the ultrasonic vibration subassembly passes through the vibration of ultrasonic drive processing platform, makes the piece that the processing produced break away from treating the processing work piece, in order to improve machining efficiency.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.
Drawings
The foregoing and other objects, features and advantages of the application will be apparent from the following more particular descriptions of exemplary embodiments of the application, as illustrated in the accompanying drawings wherein like reference numbers generally represent like parts throughout the exemplary embodiments of the application.
Fig. 1 is a schematic structural diagram of a multi-pulse width laser processing apparatus according to an embodiment of the present application;
FIG. 2 is a schematic flow chart diagram of a multi-pulse width laser processing method according to an embodiment of the present application;
fig. 3 is another schematic flow chart of a multi-pulse width laser processing method according to an embodiment of the present application.
Detailed Description
Preferred embodiments of the present application will be described in more detail below with reference to the accompanying drawings. While the preferred embodiments of the present application are shown in the drawings, it should be understood that the present application may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in this application and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.
It should be understood that although the terms "first," "second," "third," etc. may be used herein to describe various information, these information should not be limited to these terms. These terms are only used to distinguish one type of information from another. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the present application. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
Example one
In the related art, a non-contact processing technology such as ion beam, electric spark, laser and the like is adopted to process materials, and although the processing technology has better processing precision and processing efficiency, the processing technology still has the problems that the processing heat affected zone is larger, and efficient nondestructive processing is difficult to realize. For example, ultrashort pulse laser can significantly reduce the processing heat affected zone of a hard and brittle material, but the heat accumulation phenomenon still exists in the high-frequency pulse processing process, and the low-frequency pulse processing efficiency is too low, which does not meet the requirement of high-efficiency processing.
In view of the above problems, embodiments of the present application provide a multi-pulse width laser processing apparatus, which can balance the relationship between processing efficiency and thermal influence, and realize efficient non-destructive processing.
The technical solutions of the embodiments of the present application are described in detail below with reference to the accompanying drawings.
Fig. 1 is a schematic structural diagram of a multi-pulse width laser processing apparatus according to an embodiment of the present application.
Referring to fig. 1, the multi-pulse width laser processing apparatus includes:
the device comprises a multi-pulse width laser output assembly 10, a jet flow nozzle 20, an ultrasonic vibration assembly 30, a processing platform 40 and a controller 50;
the controller 50 is electrically connected to the multi-pulse width laser output assembly 10, the jet nozzle 20 and the ultrasonic vibration assembly 30, and controls the pulses output by the multi-pulse width laser output assembly 10, the pressure, the incident angle and the incident point position of the water jet formed by the jet nozzle 20, and the vibration frequency and the amplitude of the ultrasonic vibration assembly 30 according to the processing instruction.
In the embodiment of the present application, the controller 50 sets the operating parameters of the multi-pulse width laser output assembly 10, the jet nozzle 20 and the ultrasonic vibration assembly 30, and can adjust the operating parameters according to the material characteristics of the workpiece to be processed, so as to process the workpiece to be processed according to a set of processing scheme matching the material characteristics of the workpiece to be processed, thereby completing efficient processing without damaging the workpiece to be processed.
The processing platform 40 is used for placing a workpiece 60 to be processed; the multi-pulse width laser output assembly 10 is arranged above the object placing surface of the processing platform 40;
the multiple pulse width laser output assembly 10 includes: a first laser transmitter 101, a second laser transmitter 102 and a beam coupling device 103; the beam coupling device 103 is configured to couple laser beams emitted by the first laser emitter 101 and the second laser emitter 102 to form a common laser beam;
in the embodiment of the present application, the optical beam coupling device 103 includes: a beam splitter prism. The beam splitter prism can adjust the propagation direction of the laser that laser emitter sent, for example, first laser emitter and second laser emitter are 90 settings to the laser mutually perpendicular that first laser emitter and second laser emitter sent, through setting up the beam splitter prism, make the propagation path of the laser that first laser emitter sent take place 90 buckling, thereby make the laser that first laser emitter and second laser emitter sent propagate along same route, form common path laser beam.
In this application embodiment, first laser emitter and second laser emitter are the laser emitter of different pulse width, and in practical application process, first laser emitter and second laser emitter can all be any one in picosecond laser emitter, femto second laser emitter and nanosecond laser emitter, and the pulse width of the laser of first laser emitter and the production of second laser emitter is adjustable.
It should be noted that the above description of the first laser transmitter and the second laser transmitter is only an example in the embodiment of the present application, and in practical applications, the first laser transmitter and the second laser transmitter may also be microsecond laser transmitters, i.e. the selection of the first laser transmitter and the second laser transmitter does not constitute the only limitation of the present application.
Further, in order to prevent the workpiece to be processed from deviating in position under impact during processing, a position limiting structure may be disposed on the processing platform, including but not limited to: a suction cup or an adjustable limiting block; the suction disc adsorbs a workpiece to be processed on the processing platform by utilizing atmospheric pressure; the adjustable limiting block can adjust the position of the workpiece to be machined according to the size of the workpiece to be machined, so that the workpiece to be machined is limited to move, and the workpiece to be machined is fixed on the machining platform.
The jet nozzle 20 is arranged at the side of the processing platform 40, and the jet nozzle 20 faces the processing platform 40;
in the embodiment of the present application, the jet nozzle 20 sprays the water jet under the control of the controller 50, and since the water jet has a certain pressure, after the region to be processed of the workpiece 60 to be processed is softened by the laser, the water jet can further process the region to be processed, so as to expand the processing degree of the region to be processed, and then the generated processing debris is removed by the low-frequency laser.
The ultrasonic vibration component 30 is arranged below the object placing surface of the processing platform 40 and drives the processing platform 40 to vibrate through ultrasonic waves.
In this application embodiment, the ultrasonic wave that utilizes the ultrasonic vibration subassembly to produce drives the processing platform and takes place high-frequency vibration, and then will adhere to the vibration of the processing piece of waiting to process the workpiece surface and get rid of to its processing effect that influences laser and water jet.
In the embodiment of the application, the direction of the ultrasonic vibration component is adjustable; for example, a three-dimensional coordinate system is established with a plane in which the processing platform is located as a plane formed by an x-axis and a z-axis, and a direction perpendicular to the processing platform as a y-axis direction, and the ultrasonic vibration unit can generate ultrasonic waves that propagate in one or more of the x-axis, the y-axis, and the z-axis, thereby enabling the processing platform to vibrate in any one or more directions.
In the embodiment of the application, the ultrasonic vibration frequency of the ultrasonic vibration component is more than 20kHz, and the amplitude is more than 2 μm; the specific values of the ultrasonic vibration frequency and the amplitude can be adjusted according to actual conditions, and are not limited here.
The embodiment of the application provides a multi-pulse-width laser processing device, which comprises a multi-pulse-width laser output assembly, a jet nozzle, an ultrasonic vibration assembly, a processing platform and a controller; the controller is respectively and electrically connected with the multi-pulse-width laser output assembly, the jet flow nozzle and the ultrasonic vibration assembly, and the multi-pulse-width laser output assembly comprises a first laser transmitter, a second laser transmitter and a beam coupling device, and the beam coupling device can couple laser emitted by the first laser transmitter and the second laser transmitter to form a common laser beam, so that the first laser transmitter and the second laser transmitter can respectively output laser pulses with different pulse widths according to certain interval duration to process the same position of a workpiece to be processed on the processing platform, and the laser pulses with different pulse widths are used for alternative processing to prevent the heat affected area from being overlarge due to continuous high-frequency processing; simultaneously, the controller control efflux nozzle is towards treating the processing work piece ejection water efflux from the side of processing platform, under the impact of water jet, further treats the processing work piece and processes to take away some heat that the processing produced through rivers, reduce the processing heat damage, the ultrasonic vibration subassembly passes through the vibration of ultrasonic drive processing platform, makes the piece that the processing produced break away from treating the processing work piece, in order to improve machining efficiency.
Example two
Although the laser processing technology has good processing precision and processing efficiency, the problem that a processing heat affected zone is large still exists, in order to reduce the heat affected by the processing technology, the processing efficiency is often sacrificed, and the laser frequency is reduced, while the water jet can not only reduce the processing heat affected by the water flow, but also has certain processing capacity of the high-pressure water jet, therefore, based on the multi-pulse-width laser processing device shown in the first embodiment, the working parameters of the jet nozzle are designed, so that the working parameters of the jet nozzle can be reduced, and the secondary processing can be performed on the workpiece to be processed at the same time of reducing the processing heat affected.
The multi-pulse width laser processing device shown in the embodiment of the application comprises:
the device comprises a multi-pulse width laser output assembly 10, a jet flow nozzle 20, an ultrasonic vibration assembly 30, a processing platform 40 and a controller 50;
the controller 50 is electrically connected with the multi-pulse width laser output assembly 10, the jet nozzle 20 and the ultrasonic vibration assembly 30 respectively; the processing platform 40 is used for placing a workpiece 60 to be processed; the multi-pulse width laser output assembly 10 is arranged above the object placing surface of the processing platform 40; the multiple pulse width laser output assembly 10 includes: a first laser transmitter 101, a second laser transmitter 102 and a beam coupling device 103; the beam coupling device 103 is configured to couple laser beams emitted by the first laser emitter 101 and the second laser emitter 102 to form a common laser beam; the ultrasonic vibration component 30 is arranged below the object placing surface of the processing platform 40, and drives the processing platform 40 to vibrate through ultrasonic waves;
the jet nozzle 20 is arranged at the side of the processing platform 40, and the jet nozzle faces the processing platform; wherein the included angle between the central axis of the jet nozzle and the processing platform is in the range of 10-85 degrees; the pressure range of the jet flow generated by the jet flow nozzle is 10MPa to 50MPa, and the distance between the incident point and the action point of the common path laser beam is less than 30mm.
In this embodiment, an included angle between the central axis of the jet nozzle and the processing platform is 10 ° to 85 °, that is, an included angle between a water jet formed by the jet nozzle and the processing platform is 10 ° to 85 °, and preferably, an included angle between the central axis of the jet nozzle and the processing platform is 60 °.
In the embodiment of the application, the controller controls the water jet formed by the jet nozzle to be in a high-pressure state of 10-50 MPa. After the workpiece to be processed is subjected to laser processing, the processing area of the workpiece to be processed is in a softening state, damage is enlarged through water jet impact in a high-pressure state, and processing is further completed.
It should be noted that, in practical applications, the pressure of the water jet may be adjusted according to the material and the thickness of the workpiece to be processed, and is not limited herein.
The embodiment of the application provides a multi-pulse width laser processing device, which comprises a multi-pulse width laser output assembly, a jet flow nozzle, an ultrasonic vibration assembly, a processing platform and a controller, wherein the multi-pulse width laser output assembly is connected with the jet flow nozzle; the controller controls the jet nozzle to jet high-pressure water jet with the pressure within the range of 10MPa to 50MPa from the side of the processing platform to the workpiece to be processed, after the workpiece to be processed is roughly processed by laser to be softened, the workpiece to be processed is further processed by utilizing the impact of the water jet, and part of heat generated by processing is taken away by the water flow, so that the processing heat damage is reduced; therefore, under the condition of not sacrificing the processing efficiency, the heat damage caused by the laser processing technology is reduced; and the incidence angle of the water jet is adjusted, so that the chips generated by machining are washed away by the water jet, and the machining of the machining area is prevented from being influenced.
EXAMPLE III
Corresponding to the device embodiment, the application also provides a multi-pulse width laser processing method and a corresponding embodiment.
Fig. 2 is a schematic flow chart of a multi-pulse width laser processing method according to an embodiment of the present application.
Referring to fig. 2, the multi-pulse width laser processing method includes:
201. acquiring fracture toughness parameters of a workpiece to be processed;
in the embodiment of the application, the fracture toughness parameter of the workpiece to be processed can be obtained by real-time detection of a fracture toughness testing machine or obtained based on processing information imported by a processing person.
It is to be understood that the above-described process of obtaining the fracture toughness parameter is not intended as a limitation on the present application.
202. Setting a multi-pulse-width laser output assembly, a jet nozzle and an ultrasonic vibration assembly according to the comparison result of the fracture toughness parameter and the fracture toughness threshold value;
in the embodiment of the application, the fracture toughness threshold value is 4MPa/m 2 If the fracture toughness parameter of the workpiece to be processed is greater than or equal to the fracture toughness threshold, it indicates that the critical stress required for the unstable propagation of the crack of the workpiece to be processed is relatively large, that is, the capability of preventing the crack from propagating is relatively strong, so that the workpiece can be processed by using laser with relatively high frequency and water jet with relatively high pressure to improve the processing efficiency; if the fracture toughness parameter of the workpiece to be processed is smaller than the fracture toughness threshold, it indicates that the critical stress required for the unstable crack propagation of the workpiece to be processed is smaller, that is, the crack propagation preventing capability is weaker, and therefore, a lower frequency laser and a lower pressure water jet are required to be used for processing the workpiece to be processed so as to avoid causing additional damage to the workpiece to be processed.
203. And starting the multi-pulse-width laser output assembly, the jet nozzle and the ultrasonic vibration assembly for a preset processing time to finish processing.
In the embodiment of the present application, the preset processing time may be adjusted according to actual conditions, and is not limited herein.
The embodiment of the application provides a multi-pulse width laser processing method, wherein a fracture toughness parameter of a workpiece to be processed is compared with a fracture toughness threshold value, and the workpiece to be processed with the fracture toughness parameter being larger than or equal to the fracture toughness threshold value, namely the workpiece to be processed with stronger crack propagation resistance is processed by adopting laser with higher frequency and water jet with higher pressure, so that the time required by processing is reduced; and for the workpiece to be processed with the fracture toughness parameter smaller than the fracture toughness threshold value, namely the workpiece to be processed with weaker crack propagation resistance, the low-frequency laser and the low-pressure water jet are adopted for processing, so that the processing damage of the workpiece to be processed is prevented from being too large, different processing schemes are adopted for materials with different characteristics, and the processing process is more accurate.
Example four
The embodiment of the present application designs step 202 in the third embodiment, and the following describes in detail the technical solution of the embodiment of the present application with reference to the drawings.
Referring to fig. 3, a multi-pulse width laser processing method includes:
301. judging whether the fracture toughness parameter is smaller than a fracture toughness threshold value;
if yes, go to step 302; if not, go to step 303.
In the embodiment of the application, the fracture toughness threshold value is 4MPa/m 2 。
302. Setting the multi-pulse width laser output assembly, the jet nozzle, and the ultrasonic vibration assembly in accordance with a first machining strategy;
in an embodiment of the present application, the first processing strategy includes: the power of the multi-pulse width laser output assembly is larger than 10W, wherein the value range of the pulse width of the first laser transmitter is 6ps to 10ps, the value range of the pulse width of the second laser transmitter is 10fs to 500fs, and the value range of the laser emission interval of the first laser transmitter and the second laser transmitter is 10 mus to 200 mus; the included angle between the central axis of the jet nozzle and the processing platform ranges from 10 degrees to 50 degrees, and the pressure of jet generated by the jet nozzle ranges from 20MPa to 50MPa; the ultrasonic vibration frequency of the ultrasonic vibration component is larger than 50kHz, the amplitude is larger than 3 mu m, and the ultrasonic vibration component vibrates in two directions in a coordinated mode.
It should be noted that, the value ranges of the pulse widths of the first laser transmitter and the second laser transmitter may be reversed, that is, the value range of the pulse width of the first laser transmitter is 10fs to 500fs, and the value range of the pulse width of the second laser transmitter is 6ps to 10ps.
Preferably, the power of the multi-pulse width laser output assembly is 20W, wherein the range of the pulse width of the first laser transmitter is 8ps, the range of the pulse width of the second laser transmitter is 300fs, and the range of the laser emission interval between the first laser transmitter and the second laser transmitter is 150 μ s; the included angle between the central axis of the jet nozzle and the processing platform is 35 degrees, and the pressure of jet generated by the jet nozzle is 40Mpa; the ultrasonic vibration component vibrated in two directions in cooperation with each other had an ultrasonic vibration frequency of 100kHz and an amplitude of 6 μm.
In the embodiment of the application, the workpiece to be machined, of which the fracture toughness parameter is smaller than the fracture toughness threshold value, has a relatively weak crack propagation prevention capability, and the values of the pulse widths of the first laser emitter and the second laser emitter, the values of the laser emission intervals of the first laser emitter and the second laser emitter, and the pressure value of the jet generated by the jet nozzle need to be controlled within a certain range, so that the machining damage of the workpiece to be machined caused by the high-energy laser and the water jet is prevented from being too large.
303. Acquiring the workpiece thickness of the workpiece to be processed, and judging whether the workpiece thickness is smaller than a thickness threshold value;
if yes, go to step 304; if not, go to step 305.
In the embodiment of the present application, the thickness threshold is 500 μm.
304. Setting the multi-pulse width laser output assembly, the jet nozzle, and the ultrasonic vibration assembly in accordance with a second machining strategy;
in an embodiment of the present application, the second processing strategy includes: the power of the multi-pulse width laser output assembly is larger than 10W, wherein the pulse width of the first laser transmitter is smaller than 10ps, the pulse width of the second laser transmitter is smaller than 500fs, and the value range of the laser emission interval of the first laser transmitter and the second laser transmitter is 100 mus-1 ms; the included angle between the central axis of the jet nozzle and the processing platform ranges from 10 degrees to 50 degrees, and the pressure of jet generated by the jet nozzle ranges from 10MPa to 30MPa; the ultrasonic vibration component has the ultrasonic vibration frequency of more than 20kHz and the amplitude of more than 3 mu m, and the ultrasonic vibration component vibrates in two directions in a coordinated manner.
In the embodiment of the application, the workpiece to be machined, of which the fracture toughness parameter is greater than or equal to the fracture toughness threshold value, has stronger crack propagation resistance, but when the thickness of the workpiece is less than the thickness threshold value, the workpiece to be machined is thinner, and the requirement on machining strength is lower; therefore, preferably, the power of the multi-pulse width laser output assembly is 25W, wherein the value range of the pulse width of the first laser transmitter is 6ps, the value range of the pulse width of the second laser transmitter is 200fs, and the value range of the laser emission interval between the first laser transmitter and the second laser transmitter is 300 μ s; the included angle between the central axis of the jet nozzle and the processing platform is 30 degrees, and the pressure of jet generated by the jet nozzle is 20Mpa; the ultrasonic vibration component vibrated in two directions in cooperation with each other had an ultrasonic vibration frequency of 50kHz and an amplitude of 6 μm.
305. The multi-pulse width laser output assembly, the jet nozzle, and the ultrasonic vibration assembly are arranged in accordance with a third machining strategy.
In an embodiment of the present application, the third processing strategy includes: the power of the multi-pulse width laser output assembly is larger than 20W, wherein the value range of the pulse width of the first laser transmitter is 6ps to 10ps, the value range of the pulse width of the second laser transmitter is 10fs to 500fs, and the value range of the laser emission interval of the first laser transmitter and the second laser transmitter is 1 mus to 100 mus; the included angle between the central axis of the jet nozzle and the processing platform ranges from 50 degrees to 80 degrees, and the pressure of jet generated by the jet nozzle ranges from 20MPa to 50MPa; the ultrasonic vibration frequency of the ultrasonic vibration component is larger than 50kHz, the amplitude is larger than 5 mu m, and the ultrasonic vibration component vibrates in three directions in a coordinated mode.
In the embodiment of the present application, for a workpiece to be processed whose fracture toughness parameter is greater than or equal to a fracture toughness threshold and whose workpiece thickness is greater than or equal to a thickness threshold, too long processing time may be caused by too low laser energy or too low water jet pressure, which is not favorable for improving processing efficiency, and therefore, preferably, the power of the multi-pulse width laser output assembly is 50W, where a value range of a pulse width of the first laser emitter is 6ps, a value range of a pulse width of the second laser emitter is 100fs, and a value range of a laser emission interval between the first laser emitter and the second laser emitter is 50 μ s; the included angle between the central axis of the jet nozzle and the processing platform is 65 degrees, and the pressure of jet generated by the jet nozzle is 40Mpa; the ultrasonic vibration component had an ultrasonic vibration frequency of 100kHz and an amplitude of 8 μm, and was vibrated in three directions in cooperation.
In the embodiment of the application, the workpieces to be processed are classified according to the fracture toughness parameters and the thickness of the workpieces to be processed, and processing schemes with different processing strengths are adopted for the workpieces to be processed of different types, so that the relation between the processing efficiency and the thermal influence can be balanced in the processing process of the workpieces to be processed under each type, and the processing efficiency cannot be reduced due to the thermal influence or the workpieces are scrapped due to overlarge processing damage caused by pursuing the processing efficiency.
The aspects of the present application have been described in detail hereinabove with reference to the accompanying drawings. In the above embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments. Those skilled in the art should also appreciate that acts and modules referred to in the specification are not necessarily required in the present application. In addition, it can be understood that the steps in the method of the embodiment of the present application may be sequentially adjusted, combined, and deleted according to actual needs, and the modules in the device of the embodiment of the present application may be combined, divided, and deleted according to actual needs.
Those of skill would further appreciate that the various illustrative logical blocks, modules, circuits, and algorithm steps described in connection with the applications disclosed herein may be implemented as electronic hardware, computer software, or combinations of both.
The flowchart and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of systems and methods according to various embodiments of the present application. In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). It should also be noted that, in some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. It will also be noted that each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware-based systems which perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.
The foregoing description of the embodiments of the present application has been presented for purposes of illustration and description and is not intended to be exhaustive or limited to the embodiments disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The terminology used herein was chosen in order to best explain the principles of the embodiments, the practical application, or improvements to the technology in the marketplace, or to enable others of ordinary skill in the art to understand the embodiments disclosed herein.

Claims (8)

1. A multi-pulse width laser processing method is realized based on a multi-pulse width laser processing device, and is characterized in that the multi-pulse width laser processing device comprises a multi-pulse width laser output assembly, a jet flow nozzle, an ultrasonic vibration assembly, a processing platform and a controller;
the controller is respectively and electrically connected with the multi-pulse-width laser output assembly, the jet nozzle and the ultrasonic vibration assembly;
the processing platform is used for placing a workpiece to be processed; the multi-pulse width laser output assembly is arranged above the object placing surface of the processing platform; the multi-pulse width laser output assembly comprises: the device comprises a first laser transmitter, a second laser transmitter and a beam coupling device; the beam coupling device is used for coupling the laser emitted by the first laser emitter and the laser emitted by the second laser emitter to form a common-path laser beam;
the jet flow nozzle is arranged on the side of the processing platform and faces the processing platform;
the ultrasonic vibration component is arranged below the object placing surface of the processing platform and drives the processing platform to vibrate through ultrasonic waves, and the method comprises the following steps:
acquiring fracture toughness parameters of a workpiece to be processed;
setting a multi-pulse-width laser output assembly, a jet nozzle and an ultrasonic vibration assembly according to the comparison result of the fracture toughness parameter and the fracture toughness threshold value;
starting the multi-pulse-width laser output assembly, the jet nozzle and the ultrasonic vibration assembly for a preset processing time to finish processing;
according to the result of the comparison between the fracture toughness parameter and the fracture toughness threshold, the multi-pulse-width laser output assembly, the jet nozzle and the ultrasonic vibration assembly are set, and the method comprises the following steps:
judging whether the fracture toughness parameter is smaller than a fracture toughness threshold value, if so, setting the multi-pulse width laser output assembly, the jet flow nozzle and the ultrasonic vibration assembly according to a first processing strategy;
if not, acquiring the workpiece thickness of the workpiece to be processed, judging whether the workpiece thickness is smaller than a thickness threshold value, and if so, setting the multi-pulse-width laser output assembly, the jet flow nozzle and the ultrasonic vibration assembly according to a second processing strategy;
and if not, setting the multi-pulse width laser output assembly, the jet flow nozzle and the ultrasonic vibration assembly according to a third processing strategy.
2. The multiple pulse width laser processing method according to claim 1,
the value of the fracture toughness threshold is 4MPa/m 2 (ii) a The thickness threshold value is 500 μm.
3. The multiple pulse width laser processing method according to claim 1,
the first processing strategy comprises: the power of the multi-pulse width laser output assembly is larger than 10W, wherein the value range of the pulse width of the first laser transmitter is 6ps to 10ps, the value range of the pulse width of the second laser transmitter is 10fs to 500fs, and the value range of the laser emission interval of the first laser transmitter and the second laser transmitter is 10 mus to 200 mus; the included angle between the central axis of the jet nozzle and the processing platform ranges from 10 degrees to 50 degrees, and the pressure of jet generated by the jet nozzle ranges from 20MPa to 50MPa; the ultrasonic vibration frequency of the ultrasonic vibration component is larger than 50kHz, the amplitude is larger than 3 mu m, and the ultrasonic vibration component vibrates in two directions in a coordinated mode.
4. The multiple pulse width laser processing method according to claim 1,
the second processing strategy comprises: the power of the multi-pulse-width laser output assembly is more than 10W, wherein the pulse width of the first laser transmitter is less than 10ps, the pulse width of the second laser transmitter is less than 500fs, and the value range of the laser transmitting interval of the first laser transmitter and the second laser transmitter is 100 mu s-1 ms; the included angle between the central axis of the jet nozzle and the processing platform ranges from 10 degrees to 50 degrees, and the pressure of jet generated by the jet nozzle ranges from 10MPa to 30MPa; the ultrasonic vibration component has the ultrasonic vibration frequency of more than 20kHz and the amplitude of more than 3 mu m, and the ultrasonic vibration component vibrates in two directions in a coordinated manner.
5. The multiple pulse width laser processing method according to claim 1,
the third processing strategy comprises: the power of the multi-pulse-width laser output assembly is more than 20W, wherein the value range of the pulse width of the first laser transmitter is 6ps to 10ps, the value range of the pulse width of the second laser transmitter is 10fs to 500fs, and the value range of the laser emission interval of the first laser transmitter and the second laser transmitter is 1 mu s to 100 mu s; the included angle between the central axis of the jet nozzle and the processing platform ranges from 50 degrees to 80 degrees, and the pressure of jet generated by the jet nozzle ranges from 20MPa to 50MPa; the ultrasonic vibration component has the ultrasonic vibration frequency of more than 50kHz and the amplitude of more than 5 mu m, and the ultrasonic vibration component vibrates in three directions in a coordinated manner.
6. The multiple pulse width laser processing method according to claim 1,
the included angle between the central axis of the jet nozzle and the processing platform ranges from 10 degrees to 85 degrees; the pressure range of the jet flow generated by the jet flow nozzle is 10MPa to 50MPa, and the distance between the incident point and the action point of the common path laser beam is less than 30mm.
7. The multiple pulse width laser processing method according to claim 1,
the vibration direction of the ultrasonic vibration component is adjustable; the ultrasonic vibration frequency of the ultrasonic vibration component is more than 20kHz, and the amplitude is more than 2 mu m.
8. The multiple pulse width laser processing method according to claim 1,
the optical beam coupling device includes: a beam splitter prism.
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Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1099978A (en) * 1996-09-27 1998-04-21 Hitachi Ltd Laser beam machine
JP2000317659A (en) * 1999-05-07 2000-11-21 Hitachi Engineering & Services Co Ltd Method and device for cutting by laser beam, and cutting method for graphite block when demolishing waste nuclear reactor
WO2003028943A1 (en) * 2001-10-03 2003-04-10 Lambda Physik Application Center, L.L.C. Method and apparatus for fine liquid spray assisted laser material processing
CN1972046A (en) * 2006-11-21 2007-05-30 北京工业大学 High-power semiconductor laser polarization coupling apparatus and its method
CN103008882A (en) * 2012-12-12 2013-04-03 桂林电子科技大学 Micro-processing method and system for pulse laser fragile material
US9649722B2 (en) * 2013-03-15 2017-05-16 Illinois Institute Of Technology Ultrasound-assisted water-confined laser micromachining
CN204028412U (en) * 2014-09-01 2014-12-17 北京杏林睿光科技有限公司 Double-wavelength semiconductor laser beam coupled structure
JP6482251B2 (en) * 2014-11-21 2019-03-13 株式会社ミツトヨ Shape measuring device
CN104942442A (en) * 2015-06-11 2015-09-30 温州大学 Laser micro-processing device and method thereof
CN105127604A (en) * 2015-09-06 2015-12-09 深圳英诺激光科技有限公司 Laser processing system and method
CN107520535A (en) * 2016-06-20 2017-12-29 南京魔迪多维数码科技有限公司 Generate the method and device of brittle substrate processing technology
CN107267742B (en) * 2017-05-18 2019-08-02 江苏大学 A kind of different-thickness small-hole components laser shock peening method
NL2018981B1 (en) * 2017-05-26 2018-12-07 Univ Johannesburg Witwatersrand Method and system for improving the surface fracture toughness of brittle materials, and a cutting tool produced by such method
DE102017212324A1 (en) * 2017-07-19 2019-01-24 Robert Bosch Gmbh Method and apparatus for high pressure fluid processing
CN207695856U (en) * 2017-12-13 2018-08-07 卢迪 Ceramic underwater laser and ultrasonic compound process system
CN207656103U (en) * 2017-12-21 2018-07-27 英诺激光科技股份有限公司 A kind of high refractive index, low-rigidity transparent material laser cutter device
CN108411227B (en) * 2018-01-30 2020-04-28 华南理工大学 Whisker toughening processing method of surface microstructure
CN111069793B (en) * 2019-12-31 2021-03-16 武汉大学 Double-pulse laser invisible cutting method
CN111515526A (en) * 2020-05-15 2020-08-11 广东正业科技股份有限公司 Multi-beam processing device and method
CN111889895A (en) * 2020-07-02 2020-11-06 松山湖材料实验室 Jet-assisted multi-pulse-width laser ingot stripping method
CN111889896B (en) * 2020-07-02 2022-05-03 松山湖材料实验室 Ingot stripping method by ultrasonic-laser cooperation

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