WO2023033116A1 - Laminate plate, circuit board, and method for manufacturing laminate plate - Google Patents

Laminate plate, circuit board, and method for manufacturing laminate plate Download PDF

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Publication number
WO2023033116A1
WO2023033116A1 PCT/JP2022/033002 JP2022033002W WO2023033116A1 WO 2023033116 A1 WO2023033116 A1 WO 2023033116A1 JP 2022033002 W JP2022033002 W JP 2022033002W WO 2023033116 A1 WO2023033116 A1 WO 2023033116A1
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Prior art keywords
less
sheet
insulating layer
metal
laminate
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PCT/JP2022/033002
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French (fr)
Japanese (ja)
Inventor
美香 賀川
Original Assignee
住友ベークライト株式会社
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Priority to JP2023513117A priority Critical patent/JP7311071B1/en
Publication of WO2023033116A1 publication Critical patent/WO2023033116A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B7/00—Presses characterised by a particular arrangement of the pressing members
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/025—Electric or magnetic properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Definitions

  • the present invention relates to laminates, circuit boards, and methods of manufacturing laminates.
  • Patent Document 1 for the purpose of eliminating warpage, even if a flattening process is performed, a metal base substrate can be manufactured that ensures internal insulation, and a manufacturing method using such a metal base substrate is disclosed. and a heating element-mounted substrate having a heating element mounted on the circuit board.
  • the present invention has been made in view of such circumstances, and an object of the present invention is to provide a technique for reducing the quality, particularly warpage, of a laminate having metal layers on both sides of an insulating layer and a circuit board using the same. do.
  • an insulating layer a first metal layer provided on one surface of the insulating layer; a second metal layer provided on the other surface of the insulating layer; A laminate having a rectangular shape when viewed from above, A laminate having a warp amount ( ⁇ 1) of 0.1 mm or more and 1.0 mm or less.
  • Claim 1 wherein a value ( ⁇ 1/a1) obtained by dividing the warp amount ( ⁇ 1) by the length (a1) of one side of the rectangular shape is 1.0 ⁇ 10 ⁇ 4 or more and 4.0 ⁇ 10 ⁇ 3 or less.
  • the value ( ⁇ 1/b1) obtained by dividing the warp amount ( ⁇ 1) by the length (b1) of the diagonal line of the rectangular shape is 0.5 ⁇ 10 ⁇ 4 or more and 2.0 ⁇ 10 ⁇ 3 or less [1] Or the laminate according to [2].
  • the value ( ⁇ 2/a1) obtained by dividing the warp amount ( ⁇ 2) by the length (a1) of one side of the rectangular shape is 1.0 ⁇ 10 ⁇ 4 or more and 2.0 ⁇ 10 ⁇ 3 or less [4]
  • the value ( ⁇ 2/b1) obtained by dividing the warp amount ( ⁇ 2) by the diagonal length (b1) of the rectangular shape is 7.0 ⁇ 10 ⁇ 5 or more and 9.0 ⁇ 10 ⁇ 4 or less [4] Or the circuit board according to [5].
  • a laminated sheet group obtained by stacking a plurality of laminated sheets each having an insulating sheet, a first metal sheet provided on one side of the insulating sheet, and a second metal sheet provided on the other side of the insulating sheet.
  • a pressing step of obtaining a laminate having has In the step of arranging the laminated sheet group, a cushion sheet made of an elastic member is arranged on at least one surface of the laminated sheet group.
  • a method of manufacturing a laminate [8] The method for producing a laminate according to [7], wherein the elastic member has a thickness of 2.0 mm or more and 10 mm or less.
  • the elastic member when the amount of thickness change when applying a surface pressure of 0.5 to 10 MPa and when applying a surface pressure of 0.5 to 12 MPa at room temperature is used as an index showing cushioning properties, the elastic member The method for producing a laminate according to [7] or [8], wherein the index indicating the cushioning property of is 200 ⁇ m or more and 1000 ⁇ m or less. [10] The method for producing a laminate according to any one of [7] to [9], wherein the thermal resistance of the elastic member is 1.0 Sec° C./J or more and 6.0 Sec° C./J or less. [11] The method for producing a laminate according to any one of [7] to [10], wherein the elastic member has an elastic modulus of 5 GPa or more and 15 GPa or less.
  • FIG. 3 illustrates a laminate, according to an embodiment
  • FIG. 2 illustrates a circuit board, according to an embodiment
  • FIG. 3 is a diagram showing a configuration example (mainly a cushion sheet and kraft paper) of a press device according to an example of the embodiment
  • FIG. 1( a ) A basic process for manufacturing the laminate 2 and the circuit board 1 will be described with reference to FIG.
  • a lower die 71 presses a plurality of laminated sheets 10 (first metal sheet 121 , insulating sheet 120 , and second metal sheet 122 ) to press a laminated sheet group 100 .
  • a metal plate 151 as a backing plate, a cushion sheet 162, and a metal plate 152 as a backing plate are arranged from the lower mold 71 side between the laminated sheet group 100 and the lower mold 71 .
  • a metal plate 151 as a backing plate, a cushion sheet 162, and a metal plate 152 as a backing plate are arranged from the upper die 72 side.
  • a metal plate 153 as a backing plate is arranged between the laminated sheets 10 .
  • the metal plate 153 between the laminated sheets 10 may be omitted.
  • the number of metal plates 151, 152, 153 may be one or more in each arrangement.
  • the laminate 2 is cut into small pieces, and one metal layer (for example, the first metal layer 21) shown in FIG.
  • one metal layer for example, the first metal layer 21
  • the circuit board 1 mounted with the electronic component 5 shown in FIG. 1(d) is obtained.
  • the laminated plate 2 in FIG. 1B and the circuit board 1 before mounting the electronic component 5 in FIG. 1C are warped in a concave shape.
  • This bow is also referred to as downward convex smile bow and upward convex climb bow.
  • the lamination sheet 10 placed near the molds lower mold 71, upper mold 72
  • the laminate 2 make the amount of concave warp in the following fixed range.
  • the warp amount ( ⁇ 1) of the laminated plate 2 is 0.1 mm or more and 1.0 mm or less.
  • the warpage amount ⁇ 2 of the circuit board 1 is 0.01 mm or more and 0.10 mm or less.
  • FIG. 2(a) is a plan view of the laminated plate 2
  • FIG. 2(b) is a cross-sectional view (cross-sectional view along line AA in FIG. 2(a))
  • FIG. 2(c) is a warp of the laminated plate 2. It is a side view explaining the state of.
  • the laminated plate 2 has a rectangular shape when viewed from above.
  • the rectangular shape is a rectangle having a short side length a1 and a long side length a2.
  • the short side length a1 can be 270 mm and the long side length a2 can be 525 mm.
  • the rectangular shape is not limited to rectangular and may be square.
  • the laminated plate 2 includes an insulating layer 20, a first metal layer 21 provided on one surface (the upper surface in the drawing) of the insulating layer 20, and an insulating layer 20. It has a second metal layer 22 provided on the other surface (lower surface in the drawing).
  • the warp amount ( ⁇ 1) of the laminated plate 2 is 0.1 mm or more and 1.0 mm or less as described above.
  • the amount of warpage ( ⁇ 1) is defined as the difference between the maximum and minimum values of displacement when the surface of the object to be measured (laminated plate 2 in this case) is measured by a three-dimensional laser shape measuring machine (JIS B6210 compliant).
  • the value ( ⁇ 1/a1) obtained by dividing the warp amount ( ⁇ 1) by the length a1 of one side of the rectangular shape (the length of the short side in the case of a rectangle and the length of one side in the case of a square) is 1. It is 0 ⁇ 10 ⁇ 4 or more and 4.0 ⁇ 10 ⁇ 3 or less.
  • the upper limit of ⁇ 1/a1 is preferably 2.0 ⁇ 10 ⁇ 3 or less, more preferably 1.0 ⁇ 10 ⁇ 3 or less.
  • the value ( ⁇ 1/b1) obtained by dividing the warp amount ( ⁇ 1) by the length (b1) of the diagonal line of the rectangular shape is 0.5 ⁇ 10 ⁇ 4 or more and 2.0 ⁇ 10 ⁇ 3 or less.
  • the upper limit of ⁇ 1/b1 is preferably 1.0 ⁇ 10 ⁇ 3 or less, more preferably 0.5 ⁇ 10 ⁇ 3 or less.
  • the resin material constituting the insulating layer 20 is not limited to a specific type, but for example, thermosetting resins such as epoxy resin, phenol resin, urea resin, melamine resin, polyester (unsaturated polyester) resin, and polyimide resin. , silicone resins, polyurethane resins, cyanate resins, phenoxy resins, and the like.
  • thermosetting resins such as epoxy resin, phenol resin, urea resin, melamine resin, polyester (unsaturated polyester) resin, and polyimide resin.
  • silicone resins, polyurethane resins, cyanate resins, phenoxy resins, and the like for the resin material, one or more of these resins can be mixed and used.
  • a filler composed of particles having electrical insulation and high thermal conductivity can be mixed in the resin material forming the insulating layer 20 .
  • constituent materials of such filler particles include metal oxides such as alumina and nitrides such as boron nitride.
  • the thickness T0 of the insulating layer 20 is appropriately set according to the purpose.
  • the thickness of the insulating layer 20 is determined from the viewpoint that the heat from the electronic component 5 can be more effectively transmitted to the first metal layer 21 and the second metal layer 22 while improving the mechanical strength and heat resistance.
  • T0 is preferably 40 ⁇ m or more and 400 ⁇ m or less, and is more preferably set to 80 ⁇ m or more and 300 ⁇ m or less from the viewpoint of further improving the balance between heat dissipation and insulation from the second metal layer 22 .
  • the thickness T0 of the insulating layer 20 By setting the thickness T0 of the insulating layer 20 to be equal to or less than the upper limit value, heat from the electronic component 5 can be easily transferred to the second metal layer 22 .
  • the thickness T0 of the insulating layer 20 is set to be equal to or greater than the above lower limit value, generation of thermal stress due to a difference in coefficient of thermal expansion between the first metal layer 21 or the second metal layer 22 and the insulating layer 20 can be suppressed. 20 is sufficient to relax.
  • the first metal layer 21 is made of a conductive metal material, and is electrically connected to the electronic component 5 (such as an LED) by soldering, for example. As described above, the first metal layer 21 is an element that forms the circuit pattern 21a having a predetermined circuit pattern on the circuit board 1 .
  • a circuit pattern 21a is formed by processing the first metal layer 21 into a predetermined pattern by cutting or etching.
  • the thickness T1 of the first metal layer 21 can be, for example, 0.1 mm to 5.0 mm.
  • the lower limit is preferably 0.2 mm or more, more preferably 0.3 mm. If it is more than such a numerical value, heat generation of the circuit pattern can be suppressed even in applications requiring a high current.
  • the upper limit is, for example, preferably 4.0 mm or less, more preferably 3.0 mm or less. If it is less than such a numerical value, it is possible to improve the circuit workability and to reduce the thickness of the substrate as a whole.
  • the second metal layer 22 is a layer made of a metal material, and serves as the metal substrate 22a in the circuit board 1 shown in FIGS.
  • Heat dissipation means (not shown) such as heat dissipation fins and radiators are appropriately attached to the lower surface of the metal substrate 22a.
  • the metal material forming the second metal layer 22 is not limited to a specific type, but copper, copper alloys, aluminum, aluminum alloys, etc. can be used, for example.
  • the thickness T2 of the second metal layer 22 is, for example, 0.1 mm to 20.0 mm.
  • the upper limit is preferably 5.0 mm or less, more preferably 3.0 mm or less.
  • the lower limit of the thickness T2 of the second metal layer 22 is preferably 0.5 mm or more, more preferably 1.0 mm or more.
  • the circuit board 1 is a rectangular board obtained by cutting the laminated plate 2 into small pieces, and is provided with a circuit pattern 21a formed by patterning one metal layer (here, the upper first metal layer 21).
  • the circuit pattern 21a is formed, for example, by cutting and etching the first metal layer 21 laminated on the insulating layer 20 in the laminate 2 shown in FIG. 3 into a predetermined pattern.
  • the thickness T1 of the circuit pattern 21 a can be made the same as the thickness T1 of the first metal layer 21 .
  • the rectangular shape of the circuit pattern 21a may be either square or rectangular.
  • the length a3 of one side can be 50 mm or 100 mm.
  • the short side length a3 can be 50 mm
  • the long side length a4 can be 100 mm.
  • the amount of warpage ( ⁇ 2) of the circuit board 1 is calculated from the result of measuring the surface of the object to be measured (here, the circuit board 1) with a laser three-dimensional shape measuring machine, and from the plane (least square plane) calculated by the least squares method. is defined as the displacement (absolute value) of (JIS B6210 compliant).
  • the value ( ⁇ 2/a3) obtained by dividing the warpage amount ( ⁇ 2) of the circuit board 1 by the length a3 of one side of the rectangular shape (the length of the short side in the case of a rectangle and the length of one side in the case of a square) is It is 1.0 ⁇ 10 ⁇ 4 or more and 2.0 ⁇ 10 ⁇ 3 or less.
  • the upper limit of ⁇ 2/a3 is preferably 1.0 ⁇ 10 ⁇ 3 or less, more preferably 5.0 ⁇ 10 ⁇ 4 or less.
  • a value ( ⁇ 2/b3) obtained by dividing the warp amount ( ⁇ 2) of the circuit board 1 by the length (b3) of the diagonal line of the rectangular shape is 7.0 ⁇ 10 ⁇ 5 or more and 9.0 ⁇ 10 ⁇ 4 or less.
  • the upper limit of ⁇ 2/b3 is preferably 4.5 ⁇ 10 ⁇ 4 or less, more preferably 2.5 ⁇ 10 ⁇ 4 or less.
  • an insulating sheet 120 As described with reference to FIG. 1A, an insulating sheet 120, a first metal sheet 121 provided on one side (here, the upper side) of the insulating sheet 120, and a metal sheet 121 on the other side of the insulating sheet 120.
  • the laminated plate 2 is obtained by pressing and compressing the laminated sheet 10 having the provided second metal sheet 122 .
  • a specific description will be given below.
  • the insulating sheet 120 serves as the insulating layer 20
  • the first metal sheet 121 serves as the first metal layer 21
  • the second metal sheet 122 serves as the second metal layer. It becomes layer 22 .
  • the lower mold 71 and the upper mold 72 are made of stainless steel, for example. At this time, between the laminated sheet 10 arranged on the lowermost side of the laminated sheet group 100 and the lower die 71, the metal plate 151 functioning as a backing plate, the cushion sheet 162, and the backing plate are placed in order from the lower die 71 side. A metal plate 152 is provided. In addition, between the laminated sheet 10 arranged on the uppermost side of the laminated sheet group 100 and the upper mold 72, a metal plate 151 functioning as a backing plate, a cushion sheet 162, and a metal plate functioning as a backing plate are placed in order from the upper mold 72 side. A plate 152 is provided. The metal plate 151 and the cushion sheet 162 are preferably provided on both the lower die 71 side and the upper die 72 side, but may be provided on at least one side.
  • a metal plate 151 arranged between the mold (lower mold 71 or upper mold 72) and the cushion sheet 162 is introduced to avoid direct contact between the lower mold 71 or upper mold 72 and the cushion sheet 162. . This prevents the lower mold 71 and the upper mold 72 from corroding when the cushion sheet 162 and the lower mold 71 and the upper mold 72 come into contact with each other.
  • a desired material is selected for the metal plate 151 with importance placed on thermal conductivity and surface smoothness (hardness). For example, copper (including copper alloys) and SUS (stainless steel) can be used.
  • the metal plate 151 may be composed of one sheet or a plurality of sheets, and there is no limitation on the thickness.
  • the metal plate 152 arranged between the cushion sheet 162 and the laminated sheet group 100 (laminated sheet 10) is such that the soft cushion sheet 162 and the laminated sheet 10 come into contact with each other and the irregularities are transferred to the laminated sheet 10 side. to prevent
  • the metal plate 152 can be made of the same material as the metal plate 151 described above, and there are no restrictions on the number and thickness of the metal plates. From the viewpoint of reducing warpage, the material of the metal plate 152 is preferably the same material as the first metal layer 21 and the second metal layer 22 .
  • a metal plate 153 functioning as a backing plate is arranged between the laminated sheets 10 .
  • the material of the metal plate 153 is preferably the same as the material of the contact portion of the laminate sheet 10 from the viewpoint of preventing warping due to the difference in linear expansion between the contact portion of the metal plate 153 and the laminate sheet 10 . It should be noted that the metal plate 153 does not have to be arranged when the contact between the laminated sheets 10 does not cause damage or when the upper and lower layers of the laminated sheet 10 have the same metal composition.
  • the cushion sheet 162 is made of an elastic member having a predetermined cushioning property.
  • the thickness of the cushion sheet 162 (that is, the elastic member) is 2.0 mm or more and 10 mm or less.
  • the lower limit of the thickness is preferably 3.0 mm or more, more preferably 4.0 mm or more.
  • the upper limit of the thickness is preferably 8.0 mm or less, more preferably 7.0 mm or less.
  • the amount of change in thickness when a surface pressure of 0.5 to 10 MPa and a surface pressure of 0.5 to 12 MPa are applied at room temperature is an index showing the cushioning property.
  • the index indicating the cushioning property of the elastic member is 300 ⁇ m or more and 1000 ⁇ m or less.
  • the thermal resistance of the elastic member is 1.0 sec° C./J or more and 6.0 sec° C./J or less.
  • the elastic modulus of the elastic member is 5 GPa or more and 15 GPa or less.
  • Press step S12 In the pressing step S12, the laminated sheet group 100 is heated and pressurized in the state where the laminated sheet group 100, the metal plates 151, 152, 153 and the cushion sheet 162 are arranged as described above, and the laminated plate 2 is obtained.
  • Pressing conditions can be, for example, a pressure of 0.5 to 15 MPa, a temperature of 100 to 230° C., and a time of 30 minutes or more.
  • the laminate 2 of the present embodiment includes an insulating layer 20, a first metal layer 21 provided on one surface of the insulating layer 20; a second metal layer 22 provided on the other surface of the insulating layer 20; A laminate having a rectangular shape when viewed from above,
  • the amount of warpage ( ⁇ 1) is 0.1 mm or more and 1.0 mm or less.
  • a value ( ⁇ 1/a1) obtained by dividing the warp amount ( ⁇ 1) by the length (a1) of one side of the rectangular shape is 1.0 ⁇ 10 ⁇ 4 or more and 4.0 ⁇ 10 ⁇ 3 or less. By setting ⁇ 1/a1 within the above range, the warping of the circuit board 1 made from the laminate 2 can be further suppressed, and the mounting accuracy of the electronic components mounted on the circuit board 1 can be increased.
  • a value ( ⁇ 1/b1) obtained by dividing the amount of warpage ( ⁇ 1) by the length (b1) of the diagonal line of the rectangular shape is 0.5 ⁇ 10 ⁇ 4 or more and 2.0 ⁇ 10 ⁇ 3 or less. By setting ⁇ 1/b1 within the above range, the warping of the circuit board 1 made from the laminate 2 can be further suppressed, and the mounting accuracy of electronic components mounted on the circuit board 1 can be increased.
  • the circuit board 1 of the present embodiment includes an insulating layer 20, a first metal layer 21 provided on one surface of the insulating layer 20; a second metal layer 22 provided on the other surface of the insulating layer; A circuit board 1 in which a first metal layer 21 is subjected to circuit processing (circuit pattern 21a) in a laminate 2 having a rectangular shape when viewed from the top,
  • the warp amount ( ⁇ 2) is 0.01 mm or more and 0.10 mm or less.
  • a value ( ⁇ 2/a3) obtained by dividing the warp amount ( ⁇ 2) by the length (a3) of one side of the rectangular shape is 1.0 ⁇ 10 ⁇ 4 or more and 2.0 ⁇ 10 ⁇ 3 or less. By setting ⁇ 2/a3 within the above range, the mounting accuracy of electronic components mounted on the circuit board 1 can be further improved.
  • a value ( ⁇ 2/b3) obtained by dividing the amount of warpage ( ⁇ 2) by the diagonal length (b3) of the rectangular shape is 7.0 ⁇ 10 ⁇ 5 or more and 9.0 ⁇ 10 ⁇ 4 or less. By setting ⁇ 2/b3 within the above range, the mounting accuracy of electronic components mounted on the circuit board 1 can be further improved.
  • the method for manufacturing the laminate 2 of the present embodiment includes A plurality of laminated sheets 10 each having an insulating sheet 120, a first metal sheet 121 provided on one side of the insulating sheet 120, and a second metal sheet 122 provided on the other side of the insulating sheet 120 are stacked.
  • a cushion sheet 162 made of an elastic member is arranged on at least one surface of the laminated sheet group 100 .
  • the thickness of the elastic member is 2.0 mm or more and 10 mm or less.
  • the thermal resistance of the elastic member is 1.0 sec° C./J or more and 6.0 sec° C./J or less.
  • the modulus of elasticity of the elastic member is 5 GPa or more and 15 GPa or less. As a result, uneven pressure, cushioning properties, and restoring properties can be well balanced, and as a result, warping of the laminated plate 2 can be suppressed.
  • Table 1 shows compounding examples and evaluation results of the materials of Examples 1 to 6 and Comparative Examples 1 and 2.
  • FIG. 4 shows configuration examples (mainly for cushion sheets and kraft paper) of press apparatuses of Examples 1 to 6 and Comparative Examples 1 and 2.
  • FIG. 18 sets of laminate sheets (first metal sheet, insulating sheet, second metal sheet) were set in a pressing machine, and 18 laminate sheets were obtained by a hot press process, and each was evaluated.
  • the amount of warp in the table represents the largest amount of warp.
  • Insulating sheet As the insulating sheet, the member having the composition shown in Table 1 for the insulating layer was used. Examples 1, 3-5 have the same formulation. Example 2 differs in the formulation of the thermosetting resin. The formulations of curing agent, curing catalyst, and boron nitride particles are all the same. The thickness of the insulating sheet is 100-200 ⁇ m.
  • the thickness of the first metal sheet is 0.5 mm.
  • the thickness of the second metal sheet is 2.0 mm.
  • Configuration 4 (Example 5): One cushion sheet (2) was arranged on the lower side of the laminated sheet (1) and the upper side of the laminated sheet (18).
  • Configuration 5 (Comparative Examples 1 and 2) Five sheets of kraft paper were placed on the lower side of the laminated sheet (1) and on the upper side of the laminated sheet (18).
  • As the cushion sheet (1) a cushion material having the following specifications was used. Thickness: 3.31-3.65mm Cushioning: 370-490 ⁇ m Thermal resistance: 3.4-4.4Sec°C/J Elastic modulus: about 10 GPa
  • As the cushion sheet (2) a cushion material having the following specifications was used. Thickness: 1.55-1.99mm Cushioning: 160-280 ⁇ m Thermal resistance: 1.5-2.5Sec°C/J Elastic modulus: about 10 GPa
  • Press working conditions The hot press working conditions by the press machine are as follows. Press pressure: 10MPa Heating time: 180°C or higher for 30 minutes Maximum temperature reached: 180°C
  • Warp amount measurement results For Examples 1 to 6 and Comparative Examples 1 and 2 under the above conditions, the warp amount ( ⁇ 1), the ratio of the warp amount ( ⁇ 1) to the short side (a1) ⁇ 1/a1, the warp amount ( ⁇ 1 ) and the diagonal line (b1) was measured. In Examples 1 to 6, the warpage amount ( ⁇ 1), the ratio ⁇ 1/a1, and the ratio ⁇ 1/b1 were all within the above ranges. In both Comparative Examples 1 and 2, the amount of warpage ( ⁇ 1) was 1 mm or more.
  • Circuit board 2 Laminated plate 5
  • Electronic component 10 Laminated sheet 21 First metal layer 21a Circuit pattern 22
  • Second metal layer 71 Lower die 72 Upper die 100
  • Laminated sheet group 120 Insulating sheet 121 First metal sheet 122 Second layer Metal sheets 151, 152, 153
  • Metal plates (backing plates) 162 cushion seat 99 press device

Abstract

This laminate plate (2) has: an insulating layer (20); a first metal layer (21) provided on one surface of the insulating layer (20); and a second metal layer (22) provided on the other surface of the insulating layer (20), the laminate plate having a rectangular shape when viewed from the top, wherein the surface side of the first metal layer (21) and the surface side of the second metal layer (22) are concavely bent, and the concavely bent amount (δ1) is 0.1-1.0 mm inclusive.

Description

積層板、回路基板、および積層板の製造方法Laminates, circuit boards, and methods of making laminates
　本発明は、積層板、回路基板、および積層板の製造方法
に関する。 TECHNICAL FIELD The present invention relates to laminates, circuit boards, and methods of manufacturing laminates.
　近年、ＩＧＢＴ素子等を搭載したパワーモジュールの市場が拡大している。パワーモジュールは、高信頼性・高耐熱が要求される。パワーモジュールの様な放熱機能を有する回路基板において様々な開発がなされてきており、基板の反りを解消させる技術が提案されている（例えば、特許文献１参照）。特許文献１には、反りを解消させることを目的に、平坦化加工を施したとしても、内部における絶縁性が確保された回路基板を製造し得る金属ベース基板、かかる金属ベース基板を用いて製造された回路基板、および、かかる回路基板に発熱体が搭載された発熱体搭載基板が開示されている。 In recent years, the market for power modules equipped with IGBT elements, etc. has been expanding. Power modules are required to have high reliability and high heat resistance. Various developments have been made in circuit boards having a heat dissipation function such as power modules, and techniques for eliminating warpage of the boards have been proposed (see, for example, Patent Document 1). In Patent Document 1, for the purpose of eliminating warpage, even if a flattening process is performed, a metal base substrate can be manufactured that ensures internal insulation, and a manufacturing method using such a metal base substrate is disclosed. and a heating element-mounted substrate having a heating element mounted on the circuit board.
再表２０１７－０８６４７４号公報Retable 2017-086474
　近年、そのような回路基板に対して一層高い品質が求められるようになってきている。特に、絶縁層の両面に金属層を有する積層板からなる回路基板の反りに対する要求が厳しくなっており、改善の技術が求められていた。 In recent years, even higher quality has been required for such circuit boards. In particular, the demand for warping of circuit boards made of laminates having metal layers on both sides of an insulating layer has become severe, and a technology for improvement has been sought.
　本発明はこのような状況に鑑みなされたものであって、絶縁層の両面に金属層を有する積層板やそれを用いた回路基板の品質、特に反りを低減させる技術を提供することを目的とする。 The present invention has been made in view of such circumstances, and an object of the present invention is to provide a technique for reducing the quality, particularly warpage, of a laminate having metal layers on both sides of an insulating layer and a circuit board using the same. do.
　本発明によれば、次の発明が提供される。
［１］
　絶縁層と、
　前記絶縁層の一方の面に設けられた第１の金属層と、
　前記絶縁層の他方の面に設けられた第２の金属層と、
　を有し、上面視で矩形形状を呈する積層板であって、
　反り量（δ１）が０．１ｍｍ以上１．０ｍｍ以下である、積層板。
［２］
　前記反り量（δ１）を前記矩形形状の一辺の長さ（ａ１）で除した値（δ１／ａ１）が１．０×１０－４以上４．０×１０－３以下である、請求項１に記載の積層板。
［３］
　前記反り量（δ１）を前記矩形形状の対角線の長さ（ｂ１）で除した値（δ１／ｂ１）が０．５×１０－４以上２．０×１０－３以下である、［１］または［２］に記載の積層板。
［４］
　絶縁層と、
　前記絶縁層の一方の面に設けられた第１の金属層と、
　前記絶縁層の他方の面に設けられた第２の金属層と、
　を有し、上面視で矩形形状を呈する積層板において、前記第１の金属層に回路加工が施された回路基板であって、
　反り量（δ２）が０．０１ｍｍ以上０．１０ｍｍ以下である、回路基板。
［５］
　前記反り量（δ２）を前記矩形形状の一辺の長さ（ａ１）で除した値（δ２／ａ１）が１．０×１０－４以上２．０×１０－３以下である、［４］に記載の回路基板。
［６］ 
　前記反り量（δ２）を前記矩形形状の対角線の長さ（ｂ１）で除した値（δ２／ｂ１）が７．０×１０－５以上９．０×１０－４以下である、［４］または［５］に記載の回路基板。
［７］
　絶縁シートと、前記絶縁シートの一方の面に設けられた第１の金属シートと、前記絶縁シートの他方の面に設けられた第２の金属シートとを有する積層シートを複数重ねた積層シート群を配置する工程と、
　前記積層シート群を加熱・加圧して、絶縁層と、前記絶縁層の一方の面に設けられた第１の金属層と、前記絶縁層の他方の面に設けられた第２の金属層と、を有する積層板を得るプレス工程と、
　を有し、
　前記積層シート群を配置する工程において、前記積層シート群の少なくとも一方の面に弾性部材で形成されたクッションシートを配置する、
　積層板の製造方法。
［８］
　前記弾性部材の厚みが２．０ｍｍ以上１０ｍｍ以下である、［７］に記載の積層板の製造方法。
［９］
　オートグラフ加圧機を用いて、常温時における面圧０．５～１０ＭＰａ加圧時及び面圧０．５～１２ＭＰａ加圧時の厚み変化量をクッション性を示す指標とした場合に、前記弾性部材のクッション性を示す指数が２００μｍ以上１０００μｍ以下である、［７］または［８］に記載の積層板の製造方法。
［１０］
　前記弾性部材の熱抵抗が１．０Ｓｅｃ℃／Ｊ以上６．０Ｓｅｃ℃／Ｊ以下である、［７］から［９］までのいずれか１に記載の積層板の製造方法。
［１１］
　前記弾性部材の弾性率が５ＧＰａ以上１５ＧＰａ以下である、［７］から［１０］までのいずれか１に記載の積層板の製造方法。 According to the present invention, the following inventions are provided.
[1]
an insulating layer;
a first metal layer provided on one surface of the insulating layer;
a second metal layer provided on the other surface of the insulating layer;
A laminate having a rectangular shape when viewed from above,
A laminate having a warp amount (δ1) of 0.1 mm or more and 1.0 mm or less.
[2]
Claim 1, wherein a value (δ1/a1) obtained by dividing the warp amount (δ1) by the length (a1) of one side of the rectangular shape is 1.0×10 −4 or more and 4.0×10 −3 or less. Laminate according to .
[3]
The value (δ1/b1) obtained by dividing the warp amount (δ1) by the length (b1) of the diagonal line of the rectangular shape is 0.5×10 −4 or more and 2.0×10 −3 or less [1] Or the laminate according to [2].
[4]
an insulating layer;
a first metal layer provided on one surface of the insulating layer;
a second metal layer provided on the other surface of the insulating layer;
and having a rectangular shape in a top view, a circuit board in which the first metal layer is subjected to circuit processing,
A circuit board having an amount of warpage (δ2) of 0.01 mm or more and 0.10 mm or less.
[5]
The value (δ2/a1) obtained by dividing the warp amount (δ2) by the length (a1) of one side of the rectangular shape is 1.0×10 −4 or more and 2.0×10 −3 or less [4] The circuit board according to .
[6]
The value (δ2/b1) obtained by dividing the warp amount (δ2) by the diagonal length (b1) of the rectangular shape is 7.0×10 −5 or more and 9.0×10 −4 or less [4] Or the circuit board according to [5].
[7]
A laminated sheet group obtained by stacking a plurality of laminated sheets each having an insulating sheet, a first metal sheet provided on one side of the insulating sheet, and a second metal sheet provided on the other side of the insulating sheet. placing a
The laminated sheet group is heated and pressurized to form an insulating layer, a first metal layer provided on one side of the insulating layer, and a second metal layer provided on the other side of the insulating layer. a pressing step of obtaining a laminate having
has
In the step of arranging the laminated sheet group, a cushion sheet made of an elastic member is arranged on at least one surface of the laminated sheet group.
A method of manufacturing a laminate.
[8]
The method for producing a laminate according to [7], wherein the elastic member has a thickness of 2.0 mm or more and 10 mm or less.
[9]
Using an Autograph pressurizer, when the amount of thickness change when applying a surface pressure of 0.5 to 10 MPa and when applying a surface pressure of 0.5 to 12 MPa at room temperature is used as an index showing cushioning properties, the elastic member The method for producing a laminate according to [7] or [8], wherein the index indicating the cushioning property of is 200 μm or more and 1000 μm or less.
[10]
The method for producing a laminate according to any one of [7] to [9], wherein the thermal resistance of the elastic member is 1.0 Sec° C./J or more and 6.0 Sec° C./J or less.
[11]
The method for producing a laminate according to any one of [7] to [10], wherein the elastic member has an elastic modulus of 5 GPa or more and 15 GPa or less.
　本発明によれば、絶縁層の両面に金属層を有する積層板の品質を向上させる技術を提供することができる。 According to the present invention, it is possible to provide a technique for improving the quality of a laminate having metal layers on both sides of an insulating layer.
実施形態に係る積層板および回路基板を製造する基本的な工程を示すチャート図である。It is a chart figure showing a basic process of manufacturing a laminate and a circuit board concerning an embodiment. 実施形態に係る、積層板を示す図である。FIG. 3 illustrates a laminate, according to an embodiment; 実施形態に係る、回路基板を示す図である。FIG. 2 illustrates a circuit board, according to an embodiment; 実施形態の実施例に係る、プレス装置の構成例（主にクッションシート及びクラフト紙）を示す図である。FIG. 3 is a diagram showing a configuration example (mainly a cushion sheet and kraft paper) of a press device according to an example of the embodiment;
　以下、本発明の実施の形態について、図面を用いてする。
＜回路基板の概要＞
　図１を参照して、積層板２および回路基板１を製造する基本的な工程を説明する。
　図１（ａ）に示すように、プレス装置９９に複数の積層シート１０（第１の金属シート１２１、絶縁シート１２０、第２の金属シート１２２）を積み重ねた積層シート群１００を下型７１と上型７２との間に配置し熱プレス工程により、図１（ｂ）に示す絶縁層２０の両面に金属層（第１の金属層２１、第２の金属層２２）を積層した積層板２を得る。このとき、積層シート群１００と下型７１との間に、下型７１側から当て板である金属板１５１、クッションシート１６２、当て板である金属板１５２を配置する。積層シート群１００と上型７２との間についても同様に、上型７２側から当て板である金属板１５１、クッションシート１６２、当て板である金属板１５２を配置する。積層シート群１００において、積層シート１０間には当て板である金属板１５３を配置する。積層シート１０間の金属板１５３は省かれてもよい。また、金属板１５１、１５２、１５３は、それぞれの配置において１枚であってもよいし、複数であってもよい。
　つづいて、積層板２を小片化し、図１（ｃ）に示す一方の金属層（例えば第１の金属層２１）をパターニングして回路パターン２１ａを形成し回路基板１を得る。回路パターン２１ａにリフローにより電子部品５を実装することで、図１（ｄ）に示す電子部品５を実装した回路基板１を得る。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.
<Overview of circuit board>
A basic process for manufacturing the laminate 2 and the circuit board 1 will be described with reference to FIG.
As shown in FIG. 1( a ), a lower die 71 presses a plurality of laminated sheets 10 (first metal sheet 121 , insulating sheet 120 , and second metal sheet 122 ) to press a laminated sheet group 100 . Laminate plate 2 in which metal layers (first metal layer 21, second metal layer 22) are laminated on both sides of insulating layer 20 shown in FIG. get At this time, a metal plate 151 as a backing plate, a cushion sheet 162, and a metal plate 152 as a backing plate are arranged from the lower mold 71 side between the laminated sheet group 100 and the lower mold 71 . Similarly, between the laminated sheet group 100 and the upper die 72, a metal plate 151 as a backing plate, a cushion sheet 162, and a metal plate 152 as a backing plate are arranged from the upper die 72 side. In the laminated sheet group 100 , a metal plate 153 as a backing plate is arranged between the laminated sheets 10 . The metal plate 153 between the laminated sheets 10 may be omitted. Also, the number of metal plates 151, 152, 153 may be one or more in each arrangement.
Subsequently, the laminate 2 is cut into small pieces, and one metal layer (for example, the first metal layer 21) shown in FIG. By mounting the electronic component 5 on the circuit pattern 21a by reflow, the circuit board 1 mounted with the electronic component 5 shown in FIG. 1(d) is obtained.
　図１（ｂ）の積層板２や図１（ｃ）の電子部品５の実装前の回路基板１において、凹状の反りが生じる場合がある。この反りは、下側に凸状のスマイル反り、上側に凸状のクライム反りとも称される。特に、金型（下型７１、上型７２）に近い位置に配置された積層シート１０において反りが大きくなる傾向がある。本実施形態では、従来であれば熱プレス工程においてクラフト紙を用いていたところに、上述したクッションシート１６２を用いることで、１枚取りであっても複数枚取りであっても、積層板２の凹状の反り量を下記の様な一定範囲内にする。これによって、回路基板１に電子部品５が実装されるときの実装精度を高くする。
　積層板２の反り量（δ１）は、０．１ｍｍ以上１．０ｍｍ以下である。回路基板１の反り量δ２は、０．０１ｍｍ以上０．１０ｍｍ以下である。
　以下、具体的に説明する。 In some cases, the laminated plate 2 in FIG. 1B and the circuit board 1 before mounting the electronic component 5 in FIG. 1C are warped in a concave shape. This bow is also referred to as downward convex smile bow and upward convex climb bow. In particular, there is a tendency for the lamination sheet 10 placed near the molds (lower mold 71, upper mold 72) to be warped more. In the present embodiment, by using the above-described cushion sheet 162 instead of conventionally using kraft paper in the hot press process, the laminate 2 Make the amount of concave warp in the following fixed range. As a result, the mounting accuracy when the electronic component 5 is mounted on the circuit board 1 is increased.
The warp amount (δ1) of the laminated plate 2 is 0.1 mm or more and 1.0 mm or less. The warpage amount δ2 of the circuit board 1 is 0.01 mm or more and 0.10 mm or less.
A specific description will be given below.
＜積層板２の概要＞
　図２を参照して積層板２を説明する。図２（ａ）は積層板２の平面図であり、図２（ｂ）は断面図（図２（ａ）のＡ－Ａ断面図）であり、図２（ｃ）は積層板２の反りの状態を説明する側面図である。 <Overview of laminate 2>
The laminated plate 2 will be described with reference to FIG. 2(a) is a plan view of the laminated plate 2, FIG. 2(b) is a cross-sectional view (cross-sectional view along line AA in FIG. 2(a)), and FIG. 2(c) is a warp of the laminated plate 2. It is a side view explaining the state of.
　図２（ａ）に示すように、積層板２は上面視で矩形形状を呈している。ここでは矩形形状は、短辺の長さａ１、長辺の長さａ２の長方形である。矩形形状の寸法は、例えば長方形の場合において、短辺の長さａ１を２７０ｍｍ、長辺の長さａ２を５２５ｍｍとすることができる。矩形形状は、長方形に限らず正方形であってもよい。積層板２を小片化して回路基板１とする場合に、例えば、積層板２が上記寸法の長方形形状であれば、短辺を２等分割、長辺を５分割して合計１０ピースに分割することができる。 As shown in FIG. 2(a), the laminated plate 2 has a rectangular shape when viewed from above. Here, the rectangular shape is a rectangle having a short side length a1 and a long side length a2. As for the dimensions of the rectangular shape, for example, in the case of a rectangle, the short side length a1 can be 270 mm and the long side length a2 can be 525 mm. The rectangular shape is not limited to rectangular and may be square. When the laminated plate 2 is cut into small pieces to form the circuit board 1, for example, if the laminated plate 2 has a rectangular shape with the above dimensions, the short sides are divided into two equal parts and the long sides are divided into 5 parts, so that a total of 10 pieces are divided. be able to.
　図２（ｂ）に示すように、積層板２は、絶縁層２０と、絶縁層２０の一方の面（図示では上側の面）に設けられた第１の金属層２１と、絶縁層２０の他方の面に（図示では下側の面）に設けられた第２の金属層２２とを有する。 As shown in FIG. 2B, the laminated plate 2 includes an insulating layer 20, a first metal layer 21 provided on one surface (the upper surface in the drawing) of the insulating layer 20, and an insulating layer 20. It has a second metal layer 22 provided on the other surface (lower surface in the drawing).
　積層板２の反り量（δ１）は、上述のように０．１ｍｍ以上１．０ｍｍ以下である。反り量（δ１）とは、測定対象物（ここでは積層板２）の表面をレーザー三次元形状測定機により測定したときの変位の最大値と最小値の差と定義する（ＪＩＳ Ｂ６２１０準拠）。
　また、反り量（δ１）を矩形形状の一辺の長さａ１（長方形の場合は短辺の長さ、正方形の場合は１辺の長さ）で除した値（δ１／ａ１）は、１．０×１０－４以上４．０×１０－３以下である。
　δ１／ａ１の上限値は、好ましくは２．０×１０－３以下であり、より好ましくは１．０×１０－３以下である。
　δ１／ａ１を上記範囲とすることで、電子部品５の実装精度を高くできる。 The warp amount (δ1) of the laminated plate 2 is 0.1 mm or more and 1.0 mm or less as described above. The amount of warpage (δ1) is defined as the difference between the maximum and minimum values of displacement when the surface of the object to be measured (laminated plate 2 in this case) is measured by a three-dimensional laser shape measuring machine (JIS B6210 compliant).
Further, the value (δ1/a1) obtained by dividing the warp amount (δ1) by the length a1 of one side of the rectangular shape (the length of the short side in the case of a rectangle and the length of one side in the case of a square) is 1. It is 0×10 −4 or more and 4.0×10 −3 or less.
The upper limit of δ1/a1 is preferably 2.0×10 −3 or less, more preferably 1.0×10 −3 or less.
By setting δ1/a1 within the above range, the mounting accuracy of the electronic component 5 can be increased.
　また、反り量（δ１）を矩形形状の対角線の長さ（ｂ１）で除した値（δ１／ｂ１）は、０．５×１０－４以上２．０×１０－３以下である。
　δ１／ｂ１の上限値は、好ましくは１．０×１０－３以下であり、より好ましくは０．５×１０－３以下である。
　δ１／ｂ１を上記範囲とすることで、電子部品５の実装精度を高くできる。 Also, the value (δ1/b1) obtained by dividing the warp amount (δ1) by the length (b1) of the diagonal line of the rectangular shape is 0.5×10 −4 or more and 2.0×10 −3 or less.
The upper limit of δ1/b1 is preferably 1.0×10 −3 or less, more preferably 0.5×10 −3 or less.
By setting δ1/b1 within the above range, the mounting accuracy of the electronic component 5 can be increased.
＜絶縁層２０＞
　絶縁層２０を構成する樹脂材料としては、特定の種類に限定されないが、例えば、熱硬化性樹脂である、エポキシ樹脂、フェノール樹脂、ユリア樹脂、メラミン樹脂、ポリエステル（不飽和ポリエステル）樹脂、ポリイミド樹脂、シリコーン樹脂、ポリウレタン樹脂、シアネート樹脂、フェノキシ樹脂等が挙げられる。なお、樹脂材料には、これらの樹脂のうちの１種または２種以上を混合して用いることができる。 <Insulating layer 20>
The resin material constituting the insulating layer 20 is not limited to a specific type, but for example, thermosetting resins such as epoxy resin, phenol resin, urea resin, melamine resin, polyester (unsaturated polyester) resin, and polyimide resin. , silicone resins, polyurethane resins, cyanate resins, phenoxy resins, and the like. For the resin material, one or more of these resins can be mixed and used.
　絶縁層２０を構成する樹脂材料中には、電気絶縁性かつ高熱伝導性を有する粒子で構成されるフィラーを混合することもできる。かかるフィラーの粒子の構成材料としては、例えば、アルミナ等の金属酸化物、窒化ホウ素等の窒化物が挙げられる。 A filler composed of particles having electrical insulation and high thermal conductivity can be mixed in the resin material forming the insulating layer 20 . Examples of constituent materials of such filler particles include metal oxides such as alumina and nitrides such as boron nitride.
　絶縁層２０の厚みＴ０は目的に合わせて適宜設定される。機械的強度や耐熱性の向上を図りつつ、電子部品５からの熱をより効果的に第１の金属層２１や第２の金属層２２へ伝えることができる観点から、絶縁層２０の厚さＴ０は４０μｍ以上４００μｍ以下が好ましく、第２の金属層２２からの放熱性と絶縁性のバランスがより一層優れる観点から、８０μｍ以上３００μｍ以下に設定することがより好ましい。絶縁層２０の厚さＴ０を上記上限値以下とすることで、電子部品５からの熱を第２の金属層２２に伝達させやすくすることができる。また、絶縁層２０の厚さＴ０を上記下限値以上とすることで、第１の金属層２１や第２の金属層２２と絶縁層２０との熱膨張率差による熱応力の発生を絶縁層２０で緩和することが十分にできる。 The thickness T0 of the insulating layer 20 is appropriately set according to the purpose. The thickness of the insulating layer 20 is determined from the viewpoint that the heat from the electronic component 5 can be more effectively transmitted to the first metal layer 21 and the second metal layer 22 while improving the mechanical strength and heat resistance. T0 is preferably 40 μm or more and 400 μm or less, and is more preferably set to 80 μm or more and 300 μm or less from the viewpoint of further improving the balance between heat dissipation and insulation from the second metal layer 22 . By setting the thickness T0 of the insulating layer 20 to be equal to or less than the upper limit value, heat from the electronic component 5 can be easily transferred to the second metal layer 22 . In addition, by setting the thickness T0 of the insulating layer 20 to be equal to or greater than the above lower limit value, generation of thermal stress due to a difference in coefficient of thermal expansion between the first metal layer 21 or the second metal layer 22 and the insulating layer 20 can be suppressed. 20 is sufficient to relax.
＜第１の金属層２１＞
　第１の金属層２１は、導電性を有する金属材料で構成されており、例えば半田により電子部品５（ＬＥＤ等）等と電気的に接続される。第１の金属層２１は、上述したように、回路基板１において、所定の回路パターンを施した回路パターン２１ａとなる要素である。 <First metal layer 21>
The first metal layer 21 is made of a conductive metal material, and is electrically connected to the electronic component 5 (such as an LED) by soldering, for example. As described above, the first metal layer 21 is an element that forms the circuit pattern 21a having a predetermined circuit pattern on the circuit board 1 .
　第１の金属層２１を構成する金属材料には、例えば、銅を好適に用いることができる。第１の金属層２１を切削やエッチングにより所定のパターンに加工することにより、回路パターン２１ａが形成される。 For example, copper can be suitably used as the metal material forming the first metal layer 21 . A circuit pattern 21a is formed by processing the first metal layer 21 into a predetermined pattern by cutting or etching.
　第１の金属層２１の厚さＴ１は、例えば、０．１ｍｍ～５．０ｍｍとすることができる。下限値は、好ましくは、０．２ｍｍ以上であり、より好ましくは０．３ｍｍである。このような数値以上であれば、高電流を要する用途であっても、回路パターンの発熱を抑えることができる。また、上限値は、例えば、好ましくは４．０ｍｍ以下であり、より好ましくは３．０ｍｍ以下である。このような数値以下であれば、回路加工性を向上させることができ、また、基板全体としての薄型化を図ることができる。 The thickness T1 of the first metal layer 21 can be, for example, 0.1 mm to 5.0 mm. The lower limit is preferably 0.2 mm or more, more preferably 0.3 mm. If it is more than such a numerical value, heat generation of the circuit pattern can be suppressed even in applications requiring a high current. Also, the upper limit is, for example, preferably 4.0 mm or less, more preferably 3.0 mm or less. If it is less than such a numerical value, it is possible to improve the circuit workability and to reduce the thickness of the substrate as a whole.
＜第２の金属層２２＞
　第２の金属層２２は、金属材料で構成された層であって、図１や図３に示す回路基板１における金属基板２２ａとなる層である。金属基板２２ａの下面に放熱フィンやラジエータなどの放熱手段（図示せず）が適宜取り付けられる。 <Second metal layer 22>
The second metal layer 22 is a layer made of a metal material, and serves as the metal substrate 22a in the circuit board 1 shown in FIGS. Heat dissipation means (not shown) such as heat dissipation fins and radiators are appropriately attached to the lower surface of the metal substrate 22a.
　第２の金属層２２を構成する金属材料としては、特定の種類に限定されないが、例えば、銅、銅合金、アルミニウム、アルミニウム合金などを用いることができる。 The metal material forming the second metal layer 22 is not limited to a specific type, but copper, copper alloys, aluminum, aluminum alloys, etc. can be used, for example.
　第２の金属層２２の厚さＴ２は、例えば、０．１ｍｍ～２０．０ｍｍである。上限値は、好ましくは５．０ｍｍ以下であり、より好ましくは３．０ｍｍ以下である。この上限値以下の第２の金属層２２を用いることで、積層板２（または回路基板１）全体としての薄型化を行うことができる。 The thickness T2 of the second metal layer 22 is, for example, 0.1 mm to 20.0 mm. The upper limit is preferably 5.0 mm or less, more preferably 3.0 mm or less. By using the second metal layer 22 having a thickness equal to or less than the upper limit value, it is possible to reduce the thickness of the laminate 2 (or the circuit board 1) as a whole.
　また、第２の金属層２２の厚さＴ２の下限値は、好ましくは０．５ｍｍ以上であり、さらに好ましくは１．０ｍｍ以上である。この下限値以上の第２の金属層２２を用いることで、積層板２全体としての放熱性を向上させることができる。 Also, the lower limit of the thickness T2 of the second metal layer 22 is preferably 0.5 mm or more, more preferably 1.0 mm or more. By using the second metal layer 22 having a thickness equal to or greater than the lower limit, the heat dissipation of the laminate 2 as a whole can be improved.
＜回路基板１＞
　回路基板１は、積層板２が小片化された矩形形状の基板であって、一方の金属層（ここでは上側の第１の金属層２１）をパターニングした回路パターン２１ａが設けられている。 <Circuit board 1>
The circuit board 1 is a rectangular board obtained by cutting the laminated plate 2 into small pieces, and is provided with a circuit pattern 21a formed by patterning one metal layer (here, the upper first metal layer 21).
　回路パターン２１ａは、例えば図３に示す積層板２において絶縁層２０に積層された第１の金属層２１を切削及びエッチングにより所定のパターンに加工することにより形成される。回路パターン２１ａの厚さＴ１は、第１の金属層２１の厚さＴ１と同様とすることができる。 The circuit pattern 21a is formed, for example, by cutting and etching the first metal layer 21 laminated on the insulating layer 20 in the laminate 2 shown in FIG. 3 into a predetermined pattern. The thickness T1 of the circuit pattern 21 a can be made the same as the thickness T1 of the first metal layer 21 .
　回路パターン２１ａの矩形形状は、正方形や長方形のいずれであってもよい。矩形形状の寸法は、例えば、矩形形状が正方形の場合、一辺の長さａ３を５０ｍｍや１００ｍｍとすることができる。長方形の場合において、短辺の長さａ３を５０ｍｍ、長辺の長さａ４を１００ｍｍとすることができる。 The rectangular shape of the circuit pattern 21a may be either square or rectangular. As for the dimensions of the rectangular shape, for example, when the rectangular shape is square, the length a3 of one side can be 50 mm or 100 mm. In the case of a rectangle, the short side length a3 can be 50 mm, and the long side length a4 can be 100 mm.
　回路基板１の反り量（δ２）は、測定対象物（ここでは回路基板１）の表面をレーザー三次元形状測定機により測定した結果から、最小二乗法により算出される平面（最小二乗平面）からの変位（絶対値）と定義する（ＪＩＳ Ｂ６２１０準拠）。回路基板１の反り量（δ２）を矩形形状の一辺の長さａ３（長方形の場合は短辺の長さ、正方形の場合は１辺の長さ）で除した値（δ２／ａ３）は、１．０×１０－４以上２．０×１０－３以下である。
　δ２／ａ３の上限値は、好ましくは１．０×１０－３以下であり、より好ましくは５．０×１０－４以下である。
　δ２／ａ３を上記範囲とすることで、電子部品の実装精度を高くできる。 The amount of warpage (δ2) of the circuit board 1 is calculated from the result of measuring the surface of the object to be measured (here, the circuit board 1) with a laser three-dimensional shape measuring machine, and from the plane (least square plane) calculated by the least squares method. is defined as the displacement (absolute value) of (JIS B6210 compliant). The value (δ2/a3) obtained by dividing the warpage amount (δ2) of the circuit board 1 by the length a3 of one side of the rectangular shape (the length of the short side in the case of a rectangle and the length of one side in the case of a square) is It is 1.0×10 −4 or more and 2.0×10 −3 or less.
The upper limit of δ2/a3 is preferably 1.0×10 −3 or less, more preferably 5.0×10 −4 or less.
By setting δ2/a3 within the above range, it is possible to improve the mounting accuracy of the electronic component.
　回路基板１の反り量（δ２）を矩形形状の対角線の長さ（ｂ３）で除した値（δ２／ｂ３）は、７．０×１０－５以上９．０×１０－４以下である。
　δ２／ｂ３の上限値は、好ましくは４．５×１０－４以下であり、より好ましくは２．５×１０－４以下である。
　δ２／ｂ３を上記範囲とすることで、電子部品の実装精度を高くできる。 A value (δ2/b3) obtained by dividing the warp amount (δ2) of the circuit board 1 by the length (b3) of the diagonal line of the rectangular shape is 7.0×10 −5 or more and 9.0×10 −4 or less.
The upper limit of δ2/b3 is preferably 4.5×10 −4 or less, more preferably 2.5×10 −4 or less.
By setting δ2/b3 within the above range, it is possible to improve the mounting accuracy of the electronic component.
　＜積層板２の製造方法＞
　図１（ａ）で説明したように、絶縁シート１２０と、絶縁シート１２０の一方の面（ここでは上側の面）に設けられた第１の金属シート１２１と、絶縁シート１２０の他方の面に設けられた第２の金属シート１２２とを有する積層シート１０を加圧・圧縮することで積層板２を得る。このとき、複数の組の積層シート１０（すなわち積層シート群１００）を重ねてプレス装置９９にセットし、一度に複数の積層板２を得ることも可能である。以下、具体的に説明する。 <Method for manufacturing laminated plate 2>
As described with reference to FIG. 1A, an insulating sheet 120, a first metal sheet 121 provided on one side (here, the upper side) of the insulating sheet 120, and a metal sheet 121 on the other side of the insulating sheet 120. The laminated plate 2 is obtained by pressing and compressing the laminated sheet 10 having the provided second metal sheet 122 . At this time, it is also possible to stack a plurality of sets of laminated sheets 10 (that is, laminated sheet group 100) and set them in the press device 99 to obtain a plurality of laminated sheets 2 at once. A specific description will be given below.
　（複数積層シート配置工程Ｓ１０）
　複数積層シート配置工程Ｓ１０として、絶縁シート１２０と、絶縁シート１２０の一方の面（ここでは上側の面）に設けられた第１の金属シート１２１と、絶縁シート１２０の他方の面に設けられた第２の金属シート１２２とを有する積層シート１０を複数重ねた積層シート群１００を、下側の金型（下型７１）と上側の金型（上型７２）の間に配置する。 (Plural Laminated Sheet Arranging Step S10)
In the multiple laminated sheet arrangement step S10, the insulating sheet 120, the first metal sheet 121 provided on one surface (here, the upper surface) of the insulating sheet 120, and the metal sheet 121 provided on the other surface of the insulating sheet 120 A laminated sheet group 100 in which a plurality of laminated sheets 10 having a second metal sheet 122 are stacked is placed between a lower mold (lower mold 71) and an upper mold (upper mold 72).
　次のプレス工程Ｓ１２において積層板２が形成されたとき、絶縁シート１２０が絶縁層２０に、第１の金属シート１２１が第１の金属層２１に、第２の金属シート１２２が第２の金属層２２となる。 When the laminated plate 2 is formed in the next pressing step S12, the insulating sheet 120 serves as the insulating layer 20, the first metal sheet 121 serves as the first metal layer 21, and the second metal sheet 122 serves as the second metal layer. It becomes layer 22 .
　下型７１と上型７２は、例えばステンレス鋼からなる。
このとき、積層シート群１００の最も下側に配置された積層シート１０と下型７１の間に、下型７１側から順に、当て板として機能する金属板１５１、クッションシート１６２及び当て板として機能する金属板１５２が設けられている。
　また、積層シート群１００の最も上側に配置された積層シート１０と上型７２の間に、上型７２側から順に、当て板として機能する金属板１５１、クッションシート１６２及び当て板として機能する金属板１５２とが設けられている。
　金属板１５１とクッションシート１６２は、下型７１側および上型７２側の両方に設けられることが好ましいが、少なくとも一方に設けられることもある。 The lower mold 71 and the upper mold 72 are made of stainless steel, for example.
At this time, between the laminated sheet 10 arranged on the lowermost side of the laminated sheet group 100 and the lower die 71, the metal plate 151 functioning as a backing plate, the cushion sheet 162, and the backing plate are placed in order from the lower die 71 side. A metal plate 152 is provided.
In addition, between the laminated sheet 10 arranged on the uppermost side of the laminated sheet group 100 and the upper mold 72, a metal plate 151 functioning as a backing plate, a cushion sheet 162, and a metal plate functioning as a backing plate are placed in order from the upper mold 72 side. A plate 152 is provided.
The metal plate 151 and the cushion sheet 162 are preferably provided on both the lower die 71 side and the upper die 72 side, but may be provided on at least one side.
　金型（下型７１や上型７２）とクッションシート１６２との間に配置される金属板１５１は、下型７１や上型７２とクッションシート１６２を直接接触させることを避けるために導入される。これにより、下型７１や上型７２とクッションシート１６２とが接触したときに下型７１や上型７２が腐食してしまうことを防止できる。金属板１５１として、熱伝導性と表面平滑性（硬さ）が重要視されて所望の材料が選択され、例えば、銅（銅合金を含む）やＳＵＳ（ステンレス鋼）を用いることができる。また、金属板１５１は１枚でもよいし複数枚で構成されてもよく、厚みについても制限は無い。 A metal plate 151 arranged between the mold (lower mold 71 or upper mold 72) and the cushion sheet 162 is introduced to avoid direct contact between the lower mold 71 or upper mold 72 and the cushion sheet 162. . This prevents the lower mold 71 and the upper mold 72 from corroding when the cushion sheet 162 and the lower mold 71 and the upper mold 72 come into contact with each other. A desired material is selected for the metal plate 151 with importance placed on thermal conductivity and surface smoothness (hardness). For example, copper (including copper alloys) and SUS (stainless steel) can be used. Also, the metal plate 151 may be composed of one sheet or a plurality of sheets, and there is no limitation on the thickness.
　クッションシート１６２と積層シート群１００（積層シート１０）との間に配置される金属板１５２は、柔らかいクッションシート１６２と積層シート１０とが接触して積層シート１０側に凹凸が転写されてしまうことを防止する。金属板１５２の材料は、上述の金属板１５１と同じ材料とすることができ、配置される枚数、厚みについても制限は無い。なお、反り低減の観点から、金属板１５２の材料は、第１の金属層２１や第２の金属層２２と同種材料であることが好ましい。 The metal plate 152 arranged between the cushion sheet 162 and the laminated sheet group 100 (laminated sheet 10) is such that the soft cushion sheet 162 and the laminated sheet 10 come into contact with each other and the irregularities are transferred to the laminated sheet 10 side. to prevent The metal plate 152 can be made of the same material as the metal plate 151 described above, and there are no restrictions on the number and thickness of the metal plates. From the viewpoint of reducing warpage, the material of the metal plate 152 is preferably the same material as the first metal layer 21 and the second metal layer 22 .
　積層シート群１００において、積層シート１０間に当て板として機能する金属板１５３が配置される。これによって、積層シート１０同士の接触により、傷や凹凸が生じることを防止できる。金属板１５３の材料としては、金属板１５３と積層シート１０の接触する部分とにおける線膨張差による反り防止の観点から、積層シート１０の接触する部分の材料と同じであることが好ましい。なお、積層シート１０同士の接触によって傷不良が発生しない場合や、積層シート１０の上下の金属組成が同じ場合には、金属板１５３を配置しなくともよい。 In the laminated sheet group 100 , a metal plate 153 functioning as a backing plate is arranged between the laminated sheets 10 . As a result, it is possible to prevent scratches and irregularities from occurring due to contact between the laminated sheets 10 . The material of the metal plate 153 is preferably the same as the material of the contact portion of the laminate sheet 10 from the viewpoint of preventing warping due to the difference in linear expansion between the contact portion of the metal plate 153 and the laminate sheet 10 . It should be noted that the metal plate 153 does not have to be arranged when the contact between the laminated sheets 10 does not cause damage or when the upper and lower layers of the laminated sheet 10 have the same metal composition.
　クッションシート１６２は、所定のクッション性を有する弾性部材からなる。
　クッションシート１６２（すなわち弾性部材）の厚みが２．０ｍｍ以上１０ｍｍ以下である。厚みの下限値は、好ましくは３．０ｍｍ以上であり、より好ましくは４．０ｍｍ以上である。厚みの上限値は、好ましくは８．０ｍｍ以下であり、より好ましくは７．０ｍｍ以下である。 The cushion sheet 162 is made of an elastic member having a predetermined cushioning property.
The thickness of the cushion sheet 162 (that is, the elastic member) is 2.0 mm or more and 10 mm or less. The lower limit of the thickness is preferably 3.0 mm or more, more preferably 4.0 mm or more. The upper limit of the thickness is preferably 8.0 mm or less, more preferably 7.0 mm or less.
　クッションシート１６２のクッション性として、オートグラフ加圧機を用いて、常温時における面圧０．５～１０ＭＰａ加圧時及び面圧０．５～１２ＭＰａ加圧時の厚み変化量をクッション性を示す指標とした場合に、弾性部材のクッション性を示す指数が３００μｍ以上１０００μｍ以下である。
　また、弾性部材の熱抵抗が１．０Ｓｅｃ℃／Ｊ以上６．０Ｓｅｃ℃／Ｊ以下である。
　また、弾性部材の弾性率が５ＧＰａ以上１５ＧＰａ以下である。
　このようなクッションシート１６２を用いることで、優れたクッション性と復元性によって、加圧ムラを抑制することができ、また、加熱時における高温にも対応することができる。 As the cushioning property of the cushion sheet 162, using an Autograph pressurizer, the amount of change in thickness when a surface pressure of 0.5 to 10 MPa and a surface pressure of 0.5 to 12 MPa are applied at room temperature is an index showing the cushioning property. , the index indicating the cushioning property of the elastic member is 300 μm or more and 1000 μm or less.
Moreover, the thermal resistance of the elastic member is 1.0 sec° C./J or more and 6.0 sec° C./J or less.
Moreover, the elastic modulus of the elastic member is 5 GPa or more and 15 GPa or less.
By using such a cushion sheet 162, it is possible to suppress uneven pressurization due to its excellent cushioning properties and resilience, and it is also possible to cope with high temperatures during heating.
　（プレス工程Ｓ１２）
　プレス工程Ｓ１２として、上記のように積層シート群１００および金属板１５１、１５２、１５３とクッションシート１６２を配置した状態で、積層シート群１００を加熱・加圧して、積層板２を得る。
　プレス条件は、例えば圧力０．５～１５ＭＰａ、温度１００～２３０℃、時間３０分以上とすることができる。 (Press step S12)
In the pressing step S12, the laminated sheet group 100 is heated and pressurized in the state where the laminated sheet group 100, the metal plates 151, 152, 153 and the cushion sheet 162 are arranged as described above, and the laminated plate 2 is obtained.
Pressing conditions can be, for example, a pressure of 0.5 to 15 MPa, a temperature of 100 to 230° C., and a time of 30 minutes or more.
　＜実施形態の効果＞
　実施形態の特徴および効果をまとめると次の通りである。
（１）本実施形態の積層板２は、絶縁層２０と、
　絶縁層２０の一方の面に設けられた第１の金属層２１と、
　絶縁層２０の他方の面に設けられた第２の金属層２２と、
　を有し、上面視で矩形形状を呈する積層板であって、
　反り量（δ１）が０．１ｍｍ以上１．０ｍｍ以下である。
　反り量（δ１）を上記範囲とすることで、積層板２から作られる回路基板１の反りを抑制することができ、さらに回路基板１に実装する電子部品の実装精度を高くできる。
（２）反り量（δ１）を矩形形状の一辺の長さ（ａ１）で除した値（δ１／ａ１）が１．０×１０－４以上４．０×１０－３以下である。
　δ１／ａ１を上記範囲とすることで、積層板２から作られる回路基板１の反りを一層抑制することができ、さらに回路基板１に実装する電子部品の実装精度を高くできる。
（３）反り量（δ１）を矩形形状の対角線の長さ（ｂ１）で除した値（δ１／ｂ１）が０．５×１０－４以上２．０×１０－３以下である。
　δ１／ｂ１を上記範囲とすることで、積層板２から作られる回路基板１の反りを一層抑制することができ、さらに回路基板１に実装する電子部品の実装精度を高くできる。 <Effects of Embodiment>
The features and effects of the embodiment are summarized as follows.
(1) The laminate 2 of the present embodiment includes an insulating layer 20,
a first metal layer 21 provided on one surface of the insulating layer 20;
a second metal layer 22 provided on the other surface of the insulating layer 20;
A laminate having a rectangular shape when viewed from above,
The amount of warpage (δ1) is 0.1 mm or more and 1.0 mm or less.
By setting the amount of warp (δ1) within the above range, warping of the circuit board 1 made from the laminate 2 can be suppressed, and the mounting accuracy of electronic components mounted on the circuit board 1 can be increased.
(2) A value (δ1/a1) obtained by dividing the warp amount (δ1) by the length (a1) of one side of the rectangular shape is 1.0×10 −4 or more and 4.0×10 −3 or less.
By setting δ1/a1 within the above range, the warping of the circuit board 1 made from the laminate 2 can be further suppressed, and the mounting accuracy of the electronic components mounted on the circuit board 1 can be increased.
(3) A value (δ1/b1) obtained by dividing the amount of warpage (δ1) by the length (b1) of the diagonal line of the rectangular shape is 0.5×10 −4 or more and 2.0×10 −3 or less.
By setting δ1/b1 within the above range, the warping of the circuit board 1 made from the laminate 2 can be further suppressed, and the mounting accuracy of electronic components mounted on the circuit board 1 can be increased.
（４）本実施形態の回路基板１は、絶縁層２０と、
　絶縁層２０の一方の面に設けられた第１の金属層２１と、
　前記絶縁層の他方の面に設けられた第２の金属層２２と、
　を有し、上面視で矩形形状を呈する積層板２において、第１の金属層２１に回路加工（回路パターン２１ａ）が施された回路基板１であって、
　反り量（δ２）が０．０１ｍｍ以上０．１０ｍｍ以下である。
　反り量（δ２）を上記範囲とすることで、回路基板１に実装する電子部品の実装精度を高くできる。
（５）反り量（δ２）を矩形形状の一辺の長さ（ａ３）で除した値（δ２／ａ３）が１．０×１０－４以上２．０×１０－３以下である。
　δ２／ａ３を上記範囲とすることで、回路基板１に実装する電子部品の実装精度を一層高くできる。
（６）反り量（δ２）を矩形形状の対角線の長さ（ｂ３）で除した値（δ２／ｂ３）が７．０×１０－５以上９．０×１０－４以下である。
　δ２／ｂ３を上記範囲とすることで、回路基板１に実装する電子部品の実装精度を一層高くできる。 (4) The circuit board 1 of the present embodiment includes an insulating layer 20,
a first metal layer 21 provided on one surface of the insulating layer 20;
a second metal layer 22 provided on the other surface of the insulating layer;
A circuit board 1 in which a first metal layer 21 is subjected to circuit processing (circuit pattern 21a) in a laminate 2 having a rectangular shape when viewed from the top,
The warp amount (δ2) is 0.01 mm or more and 0.10 mm or less.
By setting the amount of warp (δ2) within the above range, the mounting accuracy of the electronic component mounted on the circuit board 1 can be increased.
(5) A value (δ2/a3) obtained by dividing the warp amount (δ2) by the length (a3) of one side of the rectangular shape is 1.0×10 −4 or more and 2.0×10 −3 or less.
By setting δ2/a3 within the above range, the mounting accuracy of electronic components mounted on the circuit board 1 can be further improved.
(6) A value (δ2/b3) obtained by dividing the amount of warpage (δ2) by the diagonal length (b3) of the rectangular shape is 7.0×10 −5 or more and 9.0×10 −4 or less.
By setting δ2/b3 within the above range, the mounting accuracy of electronic components mounted on the circuit board 1 can be further improved.
（７）本実施形態の積層板２の製造方法は、
　絶縁シート１２０と、絶縁シート１２０の一方の面に設けられた第１の金属シート１２１と、絶縁シート１２０の他方の面に設けられた第２の金属シート１２２とを有する積層シート１０を複数重ねた積層シート群１００を配置する積層シート配置工程（Ｓ１０）と、
　積層シート群１００を加熱・加圧して、絶縁層２０と、絶縁層２０の一方の面に設けられた第１の金属層２１と、絶縁層２０の他方の面に設けられた第２の金属層２２と、を有する積層板２を得るプレス工程（Ｓ１２）と、を有し、
　積層シート配置工程（Ｓ１０）において、積層シート群１００の少なくとも一方の面に弾性部材で形成されたクッションシート１６２を配置する。
　クッションシート１６２を用いることで、その優れたクッション性と復元性によって、加圧ムラと加熱ムラを抑制することができ、結果として積層板２に生じる反りを抑制することができる。
（８）弾性部材の厚みが２．０ｍｍ以上１０ｍｍ以下である。
　これによって、クッション性と復元性とのバランスを良好にとることができ、効果的に加圧ムラを抑制することができる。結果として積層板２に生じる反りを抑制することができる。
（９）オートグラフ加圧機を用いて、常温時における面圧０．５～１０ＭＰａ加圧時及び面圧０．５～１２ＭＰａ加圧時の厚み変化量をクッション性を示す指標とした場合に、前記弾性部材のクッション性を示す指数が２００μｍ以上１０００μｍ以下である。
　これによって、クッション性と復元性とのバランスを良好にとることができ、効果的に加圧ムラを抑制することができる。結果として積層板２に生じる反りを抑制することができる。
（１０）弾性部材の熱抵抗が１．０Ｓｅｃ℃／Ｊ以上６．０Ｓｅｃ℃／Ｊ以下である。
　弾性部材が一様の熱抵抗になるように構成されることで、熱伝達のムラ（すなわち加熱ムラ）の制御および、熱伝達のスピードを制御することができ、その結果、積層板２に生じる反りを抑制することができる。
（１１）弾性部材の弾性率が５ＧＰａ以上１５ＧＰａ以下である。
　これによって、加圧ムラやクッション性、復元性のバランスを良好にとることができ、結果として積層板２に生じる反りを抑制することができる。 (7) The method for manufacturing the laminate 2 of the present embodiment includes
A plurality of laminated sheets 10 each having an insulating sheet 120, a first metal sheet 121 provided on one side of the insulating sheet 120, and a second metal sheet 122 provided on the other side of the insulating sheet 120 are stacked. A laminated sheet arrangement step (S10) for arranging the laminated sheet group 100;
The laminated sheet group 100 is heated and pressurized to form the insulating layer 20, the first metal layer 21 provided on one side of the insulating layer 20, and the second metal layer 21 provided on the other side of the insulating layer 20. and a pressing step (S12) for obtaining a laminate 2 having a layer 22,
In the laminated sheet arrangement step ( S<b>10 ), a cushion sheet 162 made of an elastic member is arranged on at least one surface of the laminated sheet group 100 .
By using the cushion sheet 162, it is possible to suppress pressure unevenness and heating unevenness due to its excellent cushioning properties and resilience.
(8) The thickness of the elastic member is 2.0 mm or more and 10 mm or less.
As a result, it is possible to achieve a good balance between the cushioning property and the restoring property, and effectively suppress uneven pressure application. As a result, the warp that occurs in the laminated plate 2 can be suppressed.
(9) Using an Autograph pressurizer, when the amount of thickness change when applying a surface pressure of 0.5 to 10 MPa and when applying a surface pressure of 0.5 to 12 MPa at room temperature is used as an index showing cushioning properties, The index indicating the cushioning property of the elastic member is 200 μm or more and 1000 μm or less.
As a result, it is possible to achieve a good balance between the cushioning property and the restoring property, and effectively suppress uneven pressure application. As a result, the warp that occurs in the laminated plate 2 can be suppressed.
(10) The thermal resistance of the elastic member is 1.0 sec° C./J or more and 6.0 sec° C./J or less.
By configuring the elastic member to have a uniform heat resistance, it is possible to control uneven heat transfer (that is, uneven heating) and control the speed of heat transfer. Warping can be suppressed.
(11) The modulus of elasticity of the elastic member is 5 GPa or more and 15 GPa or less.
As a result, uneven pressure, cushioning properties, and restoring properties can be well balanced, and as a result, warping of the laminated plate 2 can be suppressed.
　以上、本発明の実施形態について述べたが、これらは本発明の例示であり、上記以外の様々な構成を採用することもできる。 Although the embodiments of the present invention have been described above, these are examples of the present invention, and various configurations other than those described above can also be adopted.
　以下、実施例に基づいて本発明をより具体的に説明する。 The present invention will be described more specifically below based on examples.
　表１が実施例１～６及び比較例１～２の材料の配合例及び評価結果を示す。図４に実施例１～６及び比較例１～２のプレス装置の構成例（主にクッションシート及びクラフト紙）を示す。プレス装置に１８組の積層シート（第１の金属シート、絶縁シート、第２の金属シート）をセットして、熱プレス工程により１８枚の積層板を得て、それぞれで評価した。表中の反り量は、最も反り量が大きかったものを表記している。 Table 1 shows compounding examples and evaluation results of the materials of Examples 1 to 6 and Comparative Examples 1 and 2. FIG. 4 shows configuration examples (mainly for cushion sheets and kraft paper) of press apparatuses of Examples 1 to 6 and Comparative Examples 1 and 2. As shown in FIG. 18 sets of laminate sheets (first metal sheet, insulating sheet, second metal sheet) were set in a pressing machine, and 18 laminate sheets were obtained by a hot press process, and each was evaluated. The amount of warp in the table represents the largest amount of warp.
１．絶縁シート（絶縁層）
　絶縁シートとして、表１の絶縁層に示す配合の部材を用いた。
　実施例１、３～５は同じ配合である。実施例２は熱硬化性樹脂の配合が異なる。硬化剤、硬化触媒、窒化ホウ素粒子の配合は全て同じ配合である。
　絶縁シートの厚みは、１００～２００μｍである。 1. Insulating sheet (insulating layer)
As the insulating sheet, the member having the composition shown in Table 1 for the insulating layer was used.
Examples 1, 3-5 have the same formulation. Example 2 differs in the formulation of the thermosetting resin. The formulations of curing agent, curing catalyst, and boron nitride particles are all the same.
The thickness of the insulating sheet is 100-200 μm.
２．第１及び第２の金属シート（金属層）
　絶縁シートに積層される第１及び第２の金属シート（金属層）として、銅板を用いた。
　第１の金属シートの厚みは、０．５ｍｍである。
　第２の金属シートの厚みは、２．０ｍｍである。 2. First and second metal sheets (metal layers)
Copper plates were used as the first and second metal sheets (metal layers) laminated on the insulating sheet.
The thickness of the first metal sheet is 0.5 mm.
The thickness of the second metal sheet is 2.0 mm.
３．積層板の寸法
　積層板の寸法は以下の通りである。
　実施例１、２、４～６：　２７０ｍｍ（ａ１）×５２５ｍｍ（ａ２）
　実施例３：　３１１ｍｍ（ａ１）×４４４ｍｍ（ａ２） 3. Dimensions of Laminate The dimensions of the laminate are as follows.
Examples 1, 2, 4-6: 270 mm (a1) x 525 mm (a2)
Example 3: 311 mm (a1) x 444 mm (a2)
４．プレス装置の構成例
　プレス装置における実施例１～６のクッションシートおよび比較例１、２のクラフト紙の構成例を以下の通りであり、図４に概略図を示す。１８組の積層シートについて、下型から順に積層シート（１）・・・・積層シート（１８）と番号を付している。
　構成１（実施例１－３）…積層シート（１）の下側及び積層シート（１８）の上側にクッションシート（１）を１枚ずつ配置した。
　構成２（実施例４）…積層シート（１）の下側及び積層シート（１８）の上側にクッションシート（１）をそれぞれ２枚重ねて配置した。
　構成３（実施例５）…積層シート（１）の下側及び積層シート（１８）の上側にクッションシート（２）をそれぞれ２枚重ねて配置した。
　構成４（実施例５）…積層シート（１）の下側及び積層シート（１８）の上側にクッションシート（２）を１枚ずつ配置した。
　構成５（比較例１、２）…積層シート（１）の下側及び積層シート（１８）の上側にクラフト紙を５枚ずつ配置した。
クッションシート（１）として、下記の仕様のクッション材を用いた。
　　厚み：　３．３１～３．６５ｍｍ
　　クッション性：　３７０～４９０μｍ
　　熱抵抗：　３．４～４．４Ｓｅｃ℃／Ｊ
　　弾性率：　約１０ＧＰａ
クッションシート（２）として、下記の仕様のクッション材を用いた。
　　厚み：　１．５５～１．９９ｍｍ
　　クッション性：　１６０～２８０μｍ
　　熱抵抗：　１．５～２．５Ｓｅｃ℃／Ｊ
　　弾性率：　約１０ＧＰａ 4. Structural Example of Press Device Structural examples of the cushion sheets of Examples 1 to 6 and the kraft paper of Comparative Examples 1 and 2 in the press device are as follows, and a schematic diagram is shown in FIG. The 18 sets of laminated sheets are numbered as laminated sheet (1) . . . laminated sheet (18) in order from the lower mold.
Configuration 1 (Example 1-3): One cushion sheet (1) was arranged on the lower side of the laminated sheet (1) and the upper side of the laminated sheet (18).
Configuration 2 (Example 4): Two cushion sheets (1) were placed under the laminate sheet (1) and above the laminate sheet (18).
Configuration 3 (Example 5): Two cushion sheets (2) were placed under the laminate sheet (1) and above the laminate sheet (18).
Configuration 4 (Example 5): One cushion sheet (2) was arranged on the lower side of the laminated sheet (1) and the upper side of the laminated sheet (18).
Configuration 5 (Comparative Examples 1 and 2) Five sheets of kraft paper were placed on the lower side of the laminated sheet (1) and on the upper side of the laminated sheet (18).
As the cushion sheet (1), a cushion material having the following specifications was used.
Thickness: 3.31-3.65mm
Cushioning: 370-490 μm
Thermal resistance: 3.4-4.4Sec°C/J
Elastic modulus: about 10 GPa
As the cushion sheet (2), a cushion material having the following specifications was used.
Thickness: 1.55-1.99mm
Cushioning: 160-280 μm
Thermal resistance: 1.5-2.5Sec°C/J
Elastic modulus: about 10 GPa
５．プレス加工条件
　プレス装置による熱プレス加工条件は次の通りである。
　プレス圧：　１０ＭＰａ
　加熱時間：　１８０℃以上３０分
　最高到達温度：　１８０℃ 5. Press working conditions The hot press working conditions by the press machine are as follows.
Press pressure: 10MPa
Heating time: 180°C or higher for 30 minutes Maximum temperature reached: 180°C
６．反り量の測定結果
　上記の条件の実施例１～実施例６、比較例１、２について反り量（δ１）、反り量（δ１）と短辺（ａ１）の比δ１／ａ１、反り量（δ１）と対角線（ｂ１）の比δ１／ｂ１を測定したところ、実施例１～６では、反り量（δ１）、比δ１／ａ１、比δ１／ｂ１のいずれも上記の範囲内であった。比較例１、２のいずれにおいても、反り量（δ１）が１ｍｍ以上であった。 6. Warp amount measurement results For Examples 1 to 6 and Comparative Examples 1 and 2 under the above conditions, the warp amount (δ1), the ratio of the warp amount (δ1) to the short side (a1) δ1/a1, the warp amount (δ1 ) and the diagonal line (b1) was measured. In Examples 1 to 6, the warpage amount (δ1), the ratio δ1/a1, and the ratio δ1/b1 were all within the above ranges. In both Comparative Examples 1 and 2, the amount of warpage (δ1) was 1 mm or more.
７．製品評価（製品反り）
　積層板を小片化した回路基板の反り量（δ２）を以下の基準で評価した。
　　Ａ：　０．０５ｍｍ以下
　　Ｂ：　０．０５ｍｍ超～０．１ｍｍ以下
　　Ｃ：　０．１ｍｍ超
　実施例１～６は、いずれの場合も反り量（δ２）が０．０５ｍｍ以下であった。比較例１では、積層板の反り量が不適な範囲であったが１．２と比較的小さかったこともあり、小片化時の反りは適正な範囲（「Ｂ」）に収まった。 7. Product evaluation (product warpage)
The amount of warpage (δ2) of the circuit board obtained by cutting the laminate into small pieces was evaluated according to the following criteria.
A: 0.05 mm or less B: More than 0.05 mm to 0.1 mm or less C: More than 0.1 mm In Examples 1 to 6, the amount of warpage (δ2) was 0.05 mm or less in all cases. In Comparative Example 1, the amount of warpage of the laminate was in an unsuitable range, but because it was relatively small at 1.2, the warpage at the time of fragmentation fell within an appropriate range (“B”).
８．製品評価（耐熱後製品反り）
　電子部品をリフローにより実装するときと同じ耐熱処理を施した回路基板の反り量（δ２）を以下の基準で評価した。
　　Ａ：　０．０５ｍｍ以下
　　Ｂ：　０．０５ｍｍ超～０．１ｍｍ以下
　　Ｃ：　０．１ｍｍ超
　実施例１～６は、いずれの場合も反り量（δ２）が０．０５ｍｍ以下であった。
　比較例１は、製品評価（製品反り）では適正な範囲（「Ｂ」）であったが、耐熱処理後では反り量は適切な範囲から外れた。 8. Product evaluation (product warpage after heat resistance)
The amount of warpage (δ2) of the circuit board subjected to the same heat-resistant treatment as that for mounting the electronic component by reflow was evaluated according to the following criteria.
A: 0.05 mm or less B: More than 0.05 mm to 0.1 mm or less C: More than 0.1 mm In Examples 1 to 6, the amount of warpage (δ2) was 0.05 mm or less in all cases.
In Comparative Example 1, the product evaluation (product warpage) was in the appropriate range (“B”), but the amount of warpage was out of the appropriate range after the heat treatment.
９．製品評価（加工性）
　積層板の第１の金属層を切削して回路加工したときの切削バラツキについて評価した。
　　Ａ：　バラツキ無し　　　　 　；バラツキ　±０．０５ｍｍ未満
　　Ｂ：　若干のバラツキ有り　；バラツキ　±０．０５ｍｍ以上０．１ｍｍ以下
　　Ｃ：　バラツキ有り　　　　　；バラツキ　±０．１ｍｍ超
　実施例１～６では、切削バラツキが無かったが、比較例１、２ではバラツキが生じた。また、反り量（δ１）が上記範囲を超える場合、第１の金属層の表面に塗布する半田ペーストなども高さばらつきが生じた。 9. Product evaluation (processability)
Variation in cutting was evaluated when the first metal layer of the laminate was cut to perform circuit processing.
A: No variation; variation less than ±0.05 mm B: Slight variation; variation ±0.05 mm or more and 0.1 mm or less C: Variation; variation greater than ±0.1 mm In Examples 1 to 6, there was no cutting variation. However, in Comparative Examples 1 and 2, variations occurred. Moreover, when the amount of warp (δ1) exceeded the above range, the height of the solder paste applied to the surface of the first metal layer also varied.
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000001
　この出願は、２０２１年９月１日に出願された日本出願特願２０２１－１４２２０８号を基礎とする優先権を主張し、その開示の全てをここに取り込む。 This application claims priority based on Japanese Patent Application No. 2021-142208 filed on September 1, 2021, and the entire disclosure thereof is incorporated herein.
１　回路基板
２　積層板
５　電子部品
１０　積層シート
２１　第１の金属層
２１ａ　回路パターン
２２　第２の金属層
７１　下型
７２　上型
１００　積層シート群
１２０　絶縁シート
１２１　第１の金属シート
１２２　第２の金属シート
１５１、１５２、１５３　金属板（当て板）
１６２　クッションシート
９９　プレス装置 1 Circuit board 2 Laminated plate 5 Electronic component 10 Laminated sheet 21 First metal layer 21a Circuit pattern 22 Second metal layer 71 Lower die 72 Upper die 100 Laminated sheet group 120 Insulating sheet 121 First metal sheet 122 Second layer Metal sheets 151, 152, 153 Metal plates (backing plates)
162 cushion seat 99 press device

Claims (11)

  1. 　絶縁層と、
    　前記絶縁層の一方の面に設けられた第１の金属層と、
    　前記絶縁層の他方の面に設けられた第２の金属層と、
    　を有し、上面視で矩形形状を呈する積層板であって、
    　反り量（δ１）が０．１ｍｍ以上１．０ｍｍ以下である、積層板。     an insulating layer;
    a first metal layer provided on one surface of the insulating layer;
    a second metal layer provided on the other surface of the insulating layer;
    A laminate having a rectangular shape when viewed from above,
    A laminate having a warp amount (δ1) of 0.1 mm or more and 1.0 mm or less.
  2. 　前記反り量（δ１）を前記矩形形状の一辺の長さ（ａ１）で除した値（δ１／ａ１）が１．０×１０－４以上４．０×１０－３以下である、請求項１に記載の積層板。 Claim 1, wherein a value (δ1/a1) obtained by dividing the warp amount (δ1) by the length (a1) of one side of the rectangular shape is 1.0×10 −4 or more and 4.0×10 −3 or less. Laminate according to .
  3. 　前記反り量（δ１）を前記矩形形状の対角線の長さ（ｂ１）で除した値（δ１／ｂ１）が０．５×１０－４以上２．０×１０－３以下である、請求項１または２に記載の積層板。 Claim 1, wherein a value (δ1/b1) obtained by dividing the warp amount (δ1) by the length (b1) of the diagonal line of the rectangular shape is 0.5×10 −4 or more and 2.0×10 −3 or less. 3. Or the laminated board of 2.
  4. 　絶縁層と、
    　前記絶縁層の一方の面に設けられた第１の金属層と、
    　前記絶縁層の他方の面に設けられた第２の金属層と、
    　を有し、上面視で矩形形状を呈する積層板において、前記第１の金属層に回路加工が施された回路基板であって、
    　反り量（δ２）が０．０１ｍｍ以上０．１０ｍｍ以下である、回路基板。     an insulating layer;
    a first metal layer provided on one surface of the insulating layer;
    a second metal layer provided on the other surface of the insulating layer;
    and having a rectangular shape in a top view, a circuit board in which the first metal layer is subjected to circuit processing,
    A circuit board having an amount of warpage (δ2) of 0.01 mm or more and 0.10 mm or less.
  5. 　前記反り量（δ２）を前記矩形形状の一辺の長さ（ａ３）で除した値（δ２／ａ３）が１．０×１０－４以上２．０×１０－３以下である、請求項４に記載の回路基板。 4. A value (δ2/a3) obtained by dividing the warpage amount (δ2) by the length (a3) of one side of the rectangular shape is 1.0×10 −4 or more and 2.0×10 −3 or less. The circuit board according to .
  6. 　前記反り量（δ２）を前記矩形形状の対角線の長さ（ｂ３）で除した値（δ２／ｂ３）が７．０×１０－５以上９．０×１０－４以下である、請求項４または５に記載の回路基板。 4. A value (δ2/b3) obtained by dividing the warp amount (δ2) by the diagonal length (b3) of the rectangular shape is 7.0×10 −5 or more and 9.0×10 −4 or less. 6. or the circuit board according to 5.
  7. 　絶縁シートと、前記絶縁シートの一方の面に設けられた第１の金属シートと、前記絶縁シートの他方の面に設けられた第２の金属シートとを有する積層シートを複数重ねた積層シート群を配置する工程と、
    　前記積層シート群を加熱・加圧して、絶縁層と、前記絶縁層の一方の面に設けられた第１の金属層と、前記絶縁層の他方の面に設けられた第２の金属層と、を有する積層板を得るプレス工程と、
    　を有し、
    　前記積層シート群を配置する工程において、前記積層シート群の少なくとも一方の面に弾性部材で形成されたクッションシートを配置する、
    　積層板の製造方法。     A laminated sheet group obtained by stacking a plurality of laminated sheets each having an insulating sheet, a first metal sheet provided on one side of the insulating sheet, and a second metal sheet provided on the other side of the insulating sheet. placing a
    The laminated sheet group is heated and pressurized to form an insulating layer, a first metal layer provided on one side of the insulating layer, and a second metal layer provided on the other side of the insulating layer. a pressing step of obtaining a laminate having
    has
    In the step of arranging the laminated sheet group, a cushion sheet made of an elastic member is arranged on at least one surface of the laminated sheet group.
    A method of manufacturing a laminate.
  8. 　前記弾性部材の厚みが２．０ｍｍ以上１０ｍｍ以下である、請求項７に記載の積層板の製造方法。 The method for producing a laminate according to claim 7, wherein the elastic member has a thickness of 2.0 mm or more and 10 mm or less.
  9. 　オートグラフ加圧機を用いて、常温時における面圧０．５～１０ＭＰａ加圧時及び面圧０．５～１２ＭＰａ加圧時の厚み変化量をクッション性を示す指標とした場合に、前記弾性部材のクッション性を示す指数が２００μｍ以上１０００μｍ以下である、請求項７または８に記載の積層板の製造方法。 Using an Autograph pressurizer, when the amount of thickness change when applying a surface pressure of 0.5 to 10 MPa and when applying a surface pressure of 0.5 to 12 MPa at room temperature is used as an index showing cushioning properties, the elastic member 9. The method for producing a laminate according to claim 7, wherein the cushioning property index of is 200 μm or more and 1000 μm or less.
  10. 　前記弾性部材の熱抵抗が１．０Ｓｅｃ℃／Ｊ以上６．０Ｓｅｃ℃／Ｊ以下である、請求項７または８に記載の積層板の製造方法。 The method for producing a laminate according to claim 7 or 8, wherein the thermal resistance of the elastic member is 1.0 sec°C/J or more and 6.0 sec°C/J or less.
  11. 　前記弾性部材の弾性率が５ＧＰａ以上１５ＧＰａ以下である、請求項７または８に記載の積層板の製造方法。 The method for producing a laminate according to claim 7 or 8, wherein the elastic modulus of the elastic member is 5 GPa or more and 15 GPa or less.
PCT/JP2022/033002 2021-09-01 2022-09-01 Laminate plate, circuit board, and method for manufacturing laminate plate WO2023033116A1 (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11330308A (en) * 1998-05-13 1999-11-30 Toshiba Corp Ceramic circuit board and manufacture thereof
JP2003273289A (en) * 2002-03-15 2003-09-26 Dowa Mining Co Ltd Ceramic circuit board and power module
JP2013069767A (en) * 2011-09-21 2013-04-18 Mitsubishi Materials Corp Power module substrate and method of manufacturing the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11330308A (en) * 1998-05-13 1999-11-30 Toshiba Corp Ceramic circuit board and manufacture thereof
JP2003273289A (en) * 2002-03-15 2003-09-26 Dowa Mining Co Ltd Ceramic circuit board and power module
JP2013069767A (en) * 2011-09-21 2013-04-18 Mitsubishi Materials Corp Power module substrate and method of manufacturing the same

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