WO2023024807A1 - 一种无线通信装置及无线通信系统 - Google Patents

一种无线通信装置及无线通信系统 Download PDF

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Publication number
WO2023024807A1
WO2023024807A1 PCT/CN2022/108160 CN2022108160W WO2023024807A1 WO 2023024807 A1 WO2023024807 A1 WO 2023024807A1 CN 2022108160 W CN2022108160 W CN 2022108160W WO 2023024807 A1 WO2023024807 A1 WO 2023024807A1
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WO
WIPO (PCT)
Prior art keywords
housing
wireless communication
cable assembly
conductive
optical module
Prior art date
Application number
PCT/CN2022/108160
Other languages
English (en)
French (fr)
Inventor
程维昶
张格子
潘友兵
陈凯凯
Original Assignee
华为技术有限公司
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Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Publication of WO2023024807A1 publication Critical patent/WO2023024807A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/27—Arrangements for networking
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields

Definitions

  • the present application relates to the field of communication technologies, and in particular to a wireless communication device and a wireless communication system.
  • the interconnection form between the optical module and the base band unite has evolved from the board-level interconnection to the optical port to the single board (OTB) interconnection.
  • OTB single board
  • the optical module and the processing board of the baseband processing unit are interconnected through an overhead cable (flyover cable), which can reduce costs, reduce power consumption, and improve heat dissipation performance the benefits of.
  • the cable assembly usually has no shielding measures, or the shielding strength is weak, the cable assembly will cause interference to other electronic devices in the wireless communication system, and the interference risk of the system will increase significantly.
  • the cable assembly will cause interference to the antenna unit on the same board as the baseband processing unit, and the distance between the antenna unit and the baseband processing unit is small, which makes the antenna unit more vulnerable to the cables responsible for transmitting high-speed signals in the receiving band. Interference of components, the function of the antenna unit can be significantly affected. Therefore, how to reduce the interference risk of the system is an urgent problem to be solved for the wireless communication system that adopts the interconnection between the optical port and the single board.
  • the present application provides a wireless communication device and a wireless communication system, which are used to reduce the interference risk of the wireless communication system.
  • the present application provides a wireless communication device, including a housing and a circuit board disposed in the housing.
  • the circuit board is provided with a baseband processing unit
  • the side wall of the casing is provided with an optical module assembly.
  • the optical module assembly is electrically connected to the circuit board through a cable assembly, so as to be electrically connected to the baseband processing unit.
  • the cable assembly includes a wire harness and a conductive sleeve.
  • the conductive sleeve sleeves the entire length of the wire harness along the length direction.
  • the conductive sleeve is electrically connected to the cage structure of the optical module assembly and the ground layer of the circuit board.
  • the inner wall is electrically connected.
  • the conductive sleeve wraps the wiring harness, and the conductive sleeve shields all the wrapped wiring harnesses as a whole, so as to reduce the interference of the wiring harness to other electronic devices of the wireless communication system.
  • One end of the conductive sleeve along its own length direction is conductively connected to the cage structure of the optical module component, and the other end of the conductive sleeve along its own length direction is conductively connected to the ground layer of the circuit board, realizing the common ground of the optical module component, circuit board and cable component , so that the signal is fully shielded on the complete signal transmission path from the optical module assembly to the circuit board through the cable assembly, so as to avoid interference to other electronic devices of the wireless communication device due to signal leakage on the transmission path.
  • the conductive sleeve is also conductively connected with the inner wall of the housing, and the housing is used as the ground of the wireless communication device, so that the conductive sleeve is connected to the ground of the wireless communication device, and the three of the above-mentioned complete signal transmission paths are connected to the ground of the wireless communication device. To strengthen the shielding effect on the wiring harness.
  • the conductive sleeve is conductively connected to the inner wall of the casing along the entire length direction. Strengthen the shielding effect on the wiring harness.
  • the inner wall of the housing is provided with a channel structure for accommodating the whole or part of the cable assembly along the length direction, the channel structure extends from the circuit board to the optical module assembly, and the cable assembly is arranged in the channel structure , and the conductive sleeve abuts against the inner wall of the channel structure.
  • the cable assembly is positioned on the casing through the channel structure, so that the position of the cable assembly is stable, and the conductive connection effect between the cable assembly and the casing is enhanced.
  • the channel structure When specifically setting the channel structure, the channel structure is arranged inside the inner wall of the housing, and the channel structure is a through-hole structure.
  • the setting of the through-hole structure can make the cable assembly be stably limited and stably contact the inner wall of the through-hole structure, so that the cable assembly is stably electrically connected to the housing, and the through-hole structure has a shielding effect, The interference of the cable assembly accommodated in the through-hole structure to other electronic devices is further reduced.
  • the inner wall of the casing is provided with a first positioning groove, and the circuit board is arranged in the first positioning groove.
  • the inner wall of the housing is also provided with a second positioning groove, and the cage structure of the optical module assembly is disposed in the second positioning groove.
  • the first end and the second end of the channel structure along the length direction are respectively connected with the first positioning groove and the second positioning groove.
  • the setting of the first positioning groove and the second positioning groove can prevent the end of the cable assembly from being exposed in the cavity of the housing, so that the entire length of the cable assembly can be shielded, preventing the cable assembly from being damaged by energy. leakage and cause interference to other electronic devices.
  • the channel structure When specifically setting the channel structure, the channel structure is arranged on the inner wall surface of the casing, and the channel structure is a groove structure.
  • the cable assembly is embedded in the groove structure, the position of the cable assembly is stable, and the conductive connection between the cable assembly and the casing is reliable.
  • the channel structure When specifically setting the channel structure, the channel structure has a first section, a middle section and a second section connected in sequence along the length direction.
  • the middle section is arranged inside the inner wall of the casing, and the middle section has a through-hole structure.
  • the first section and the second section are respectively arranged on the inner wall surface of the casing, and the first section and the second section are groove structures respectively.
  • the cable assembly is fixed on the casing through the cooperation of the through hole structure and the groove structure, so that the cable assembly can be stably fixed on the casing, and the cable assembly can be reliably electrically connected to the casing.
  • the two ends of the channel structure along the length direction respectively have openings, and the two ends of the conductive sleeve along the length direction extend out of the channel structure through the openings, and are exposed outside the channel structure.
  • the part of the conductive sleeve exposed outside the channel structure is conductively connected with the inner wall of the casing through the auxiliary conductive structure.
  • the cable assembly is fixed at the opening of the channel structure through the auxiliary conductive structure, so that the conductive sleeve is in good contact with the shell, and the grounding effect of the conductive sleeve extending outside the channel structure is improved, thereby improving the cable assembly at the opening of the channel structure
  • the problem of energy leakage improves the shielding effect of the entire cable assembly.
  • the auxiliary conductive structure When specifically setting up the auxiliary conductive structure, the auxiliary conductive structure includes an upper conductive structure and a lower conductive structure that are detachably connected. Conductively connected to the inner wall of the housing.
  • the auxiliary conductive structure has a simple structure, is easy to assemble with the housing, and is convenient to cooperate with the cable assembly.
  • the channel structure has at least one bent section, and the conductive sleeve is pressed against the inner wall of the channel structure by the tension of the wire harness.
  • the wire harness located in the bending section of the channel structure presses the conductive sleeve against the side wall of the channel structure through its own tension, which ensures the position stability of the cable assembly on the housing and also makes the conductive sleeve and the housing electrically conductive. The connection is more reliable.
  • the present application provides a wireless communication system, including the aforementioned wireless communication device, and the optical module body of the optical module assembly is used for conductive connection with an external optical fiber.
  • the baseband processing unit and the optical module assembly of the wireless communication device adopt the form of interconnection from the optical port to the single board.
  • the ground connection of the device, the interference risk of the wireless communication device is small, and the wireless communication system is stable and reliable.
  • FIG. 1 is a possible implementation manner of a wireless communication device provided in an embodiment of the present application
  • FIG. 2 is a schematic diagram of connection of a cable assembly of a wireless communication device provided by an embodiment of the present application
  • FIG. 3 is a schematic structural diagram of a cable assembly of a wireless communication device provided in an embodiment of the present application
  • FIG. 4 is another schematic structural diagram of a cable assembly of a wireless communication device provided in an embodiment of the present application.
  • FIG. 5 is a schematic structural diagram of a wireless communication device provided by an embodiment of the present application.
  • Figure 6 is an enlarged view of the structure at A in Figure 5;
  • FIG. 7 is a schematic diagram of assembly of a cable assembly and a housing of a wireless communication device provided by an embodiment of the present application.
  • FIG. 8 is a schematic structural diagram of a channel structure of a wireless communication device provided in an embodiment of the present application.
  • FIG. 9 is another schematic structural diagram of a channel structure of a wireless communication device provided in an embodiment of the present application.
  • Figure 10 is an enlarged view of the structure at B in Figure 5;
  • FIG. 11 is an exploded schematic diagram of an auxiliary conductive structure of a wireless communication device provided by an embodiment of the present application.
  • FIG. 12 and FIG. 13 are actual measurement diagrams of differential-mode isolation and common-mode isolation of the cable assembly of the wireless communication device provided by the embodiment of the present application at different frequencies.
  • the wireless communication system can convert, receive and transmit high and low frequency wireless signals.
  • the wireless communication system includes a wireless communication device.
  • the wireless communication device may include a housing 1, a circuit board 2 and an antenna unit 3 disposed in the housing 1, and, A baseband processing unit 6 is arranged on the circuit board 2 , and an optical module assembly 5 is arranged on the side wall of the housing 1 .
  • the optical module assembly 5 and the baseband processing unit 6 can adopt the interconnection form of an optical port to a single board (OTB). 5 is electrically connected to the baseband processing unit 6 .
  • OTB single board
  • the optical module assembly 5 includes an optical module body 51 and a cage structure 52 , and the optical module body 51 is fixed in the cage structure 52 .
  • the optical module body 51 can be directly clamped in the cage structure 52 to achieve fixation, or can be fixed in the cage structure 52 through threaded connectors (bolts or screws, etc.); the cage structure 52 can be made of metal to shield external signal pairs.
  • the optical module body 51 interferes, and the cage structure 52 is electrically connected to the housing 1 .
  • a fixing plate 9 can be installed in the housing 1 , and the fixing plate 9 can be fixed on the inner wall of the housing 1 by threaded connectors (bolts or screws, etc.). Moreover, the fixing plate 9 is not only used as a connection between the optical module assembly 5 and the housing 1, but also as a grounding part of the optical module assembly 5.
  • the fixing plate 9 can be a metal plate prepared from a common conductive metal material , such as copper plate, aluminum plate or iron plate, etc., the fixed plate 9 is electrically connected to the housing 1, when the cage structure 52 is fixed on the fixed plate 9, the cage structure 52 is electrically connected to the fixed plate 9, so that the cage structure 52 is connected to the housing 1 Conductive connection, the shell is used as the ground of the wireless communication device, that is, the cage structure 52 is connected to the ground of the wireless communication device, and the shielding of the optical module body 51 is strengthened. The cage structure 52 of the optical module assembly 5 is fixed on the fixing plate 9 , thereby fixing the optical module assembly 5 in the housing 1 .
  • a common conductive metal material such as copper plate, aluminum plate or iron plate, etc.
  • the cage structure 52 can be fixed on the fixing plate 9 by welding, bonding, clamping, etc., or can be detachably fixed on the fixing plate 9 by threaded connectors (bolts or screws, etc.).
  • the cable assembly 4 When the cable assembly 4 is connected to the optical module assembly 5 , the cable assembly 4 can be fixed on the fixing plate 9 through the cable tie 10 , so as to realize the fixing of the cable assembly 4 relative to the fixing plate 9 .
  • the housing 1 can have a connection port, one end of the optical module assembly 5 can be exposed to the housing 1 through the connection port, and the external optical fiber 7 can be conductively connected with the optical module body 51, and the optical module body 51 converts the high-speed data transmitted by the optical fiber 7 into electrical signal to complete the conversion from light to electricity.
  • the optical fiber 7 can be electrically connected to the optical module body 51 through a plug-in connector.
  • the baseband processing unit 6 is arranged on the circuit board 2 and is conductively connected with the circuit board 2.
  • the circuit board 2 is used as the processing board of the baseband processing unit 6, and the antenna unit 3 can also be arranged on the circuit board 2, that is, the antenna unit 3 can be connected with the circuit board 2.
  • the baseband processing unit 6 is arranged on a common board.
  • the baseband processing unit 6 and the optical module assembly 5 can be interconnected from an optical port to a single board (OTB).
  • the baseband processing unit 6 is conductively connected to realize electrical signal transmission between the optical module body 51 and the baseband processing unit 6 .
  • the cable assembly 4 can be electrically connected to the circuit board 2 through the connector 8 , that is, the cable assembly 4 is directly connected to the optical module assembly 5 and the connector 8 .
  • the connector 8 is a board-end connector, and the connector 8 may be a plug-in connector.
  • the connector 8 includes a shielding shell and internal connecting terminals. When connecting, the shielding shell of the connector 8 is fixed on the circuit board 2 and electrically connected to the ground layer of the circuit board 2.
  • the connecting terminals are connected to the circuit layer of the circuit board 2.
  • Conductive connection It should be understood that the specific arrangement of the connection terminals of the connector 8 and the shielding shell can adopt the arrangement of the existing board-end connector, and will not be repeated here.
  • the cable assembly 4 can be electrically connected to the optical module body 51 through a plug-in connector.
  • the number and connection conditions of the optical module assembly 5 and the connector 8 are not specifically limited. 8 for corresponding connection, or one optical module assembly 5 may be used for corresponding connection with multiple connectors 8 through one cable assembly 4 .
  • FIG. 3 shows a schematic structural diagram of a cable assembly of a wireless communication device provided in an embodiment of the present application, which is a schematic cross-sectional view of the cable assembly.
  • the cable assembly 4 may include a conductive sleeve 41 and a wire harness 42, and the conductive sleeve 41 is along the wire harness 42.
  • the length direction of the wire harness 42 is sheathed in its entirety.
  • wire harnesses 42 There may be multiple wire harnesses 42 , and all the wire bundles 42 are wrapped together by the conductive sleeve 41 .
  • One end of the wire harness 42 is connected to the optical module body of the optical module assembly, and the other end is connected to the above-mentioned connector to transmit signals between the optical module body and the connector.
  • the wire harness 42 can be used to transmit high-speed signals and power signals And different signals such as low-speed signals.
  • the wire bundle 42 may be wrapped with aluminum foil to shield the transmitted signal.
  • the conductive sleeve 41 wraps the above-mentioned wire harness 42 to shield all the wrapped wire bundles 42 as a whole, so as to reduce the interference of the wire harness 42 to other electronic devices of the wireless communication system.
  • the conductive sleeve 41 can wrap all the wire harnesses 42 along the length direction of the wire harness 42 by winding, or the conductive sleeve 41 adopts a tubular structure, and all the wire bundles 42 are inserted into the conductive sleeve 41 in its entirety .
  • One end of the conductive sleeve 41 along its own length direction is electrically connected to the cage structure of the optical module assembly, specifically, it can be electrically connected to the above-mentioned fixing plate to be electrically connected to the cage structure, and the other end of the conductive sleeve 41 along its own length direction is connected to the ground layer of the circuit board.
  • Conductive connection specifically, it can be conductively connected with the shielding shell of the above-mentioned connector to be conductively connected with the ground layer of the circuit board, so as to realize the common ground of the optical module component, the circuit board and the cable component 4, so that the “optical module component-line The signal is fully shielded on the complete signal transmission path of "cable assembly-circuit board" to avoid interference to other electronic devices of the wireless communication device due to signal leakage on the transmission path.
  • the conductive sleeve 41 can also be conductively connected to the inner wall of the housing, and the housing is used as the ground of the wireless communication device, so as to realize the connection of the conductive sleeve 41 to the ground of the wireless communication device, strengthen the shielding effect of the conductive sleeve 41 on the wire harness 42, and realize the circuit board The stratum and shell co-ground effect.
  • the conductive sleeve 41 can be the outermost structure of the cable assembly 4. At this time, the entire conductive sleeve 41 is exposed on the outer surface of the cable assembly 4.
  • the conductive sleeve 41 and The housing 1 is conductively connected, that is, the conductive sleeve 41 is connected to the ground of the wireless communication device. At this time, single-point, multiple or full-section grounding of the conductive sleeve 41 can be realized.
  • the wiring harness 42 is a bendable flexible cable.
  • the contact pressure between the conductive sleeve 41 and the casing 1 can be provided by the tension of the wire harness 42, thereby ensuring the grounding effect.
  • the conductive sleeve 41 also has a certain degree of flexibility.
  • the conductive sleeve 41 can be a double-layer conductive cloth, which has a good conductive effect, a certain structural strength, and a certain degree of flexibility. 42 bends to fit the shell more closely.
  • the cable assembly 4 shown in FIG. 3 is only an example.
  • the conductive sleeve 41 can be fully exposed, or the conductive sleeve 41 can only be partially exposed on the cable assembly 4.
  • the outside setting method is only an example.
  • FIG. 4 shows another schematic structural diagram of a cable assembly of a wireless communication device provided in an embodiment of the present application, which is also a schematic cross-sectional diagram of the cable assembly.
  • the cable assembly 4 may sequentially include a wire harness 42 , a conductive sleeve 41 and an insulating layer 43 from inside to outside.
  • the conductive sleeve 41 is the inner layer of the cable assembly 4
  • the outermost layer of the cable assembly 4 is the insulating layer 43 .
  • a gap or a window is provided on the insulating layer 43, so that the conductive sleeve 41 is partially exposed in the gap or the window.
  • the cable assembly 4 When the cable assembly 4 is installed in the housing, it is conductively connected to the housing 1 through the part of the conductive sleeve 41 exposed in the gap or window. At this time, single-point or multi-point grounding of the conductive sleeve 41 can be realized.
  • the insulating layer 43 has multiple windows or notches, and the multiple notches or windows are arranged along the length direction of the conductive sleeve 41, so that the conductive sleeve 41 can have multiple contacts with the housing 1 in the length direction. At this time, the conductive sleeve 41 can be grounded at multiple points to improve the grounding effect of the conductive sleeve 41 .
  • one end of the wire harness 42 is electrically connected to the optical module body of the optical module assembly, and the other end of the wire harness 42 is electrically connected to the connecting terminal of the connector. , and then conductively connected with the circuit layer of the circuit board; one end of the conductive sleeve 41 is conductively connected with the cage structure of the optical module assembly, and then conductively connected with the housing, and the other end of the conductive sleeve 41 is conductively connected with the shielding shell of the connector, and then It is conductively connected with the ground layer of the circuit board; the conductive sleeve 41 is also directly connected with the shell to realize the conductive connection.
  • the wire harness 42 is wrapped by a complete and continuous conductive shielding structure (cage structure, conductive sleeve 41, shielding shell of the connector), and the ground layer of the circuit board and the housing share the same ground effect through the conductive sleeve 41, thereby ensuring the protection against
  • the shielding effect of the signal transmitted by the wiring harness 42 avoids interference to other electronic devices of the wireless communication device due to leakage of the high-speed signal during transmission.
  • FIG. 5 is a schematic structural diagram of a wireless communication device provided by an embodiment of the present application.
  • the figure illustrates an internal structure of a housing and layout of some electronic devices.
  • a circuit board 2 is arranged in the casing 1
  • a baseband processing unit 6 is arranged on the circuit board 2
  • an antenna unit 3 is also arranged on the circuit board 2, that is, the antenna unit 3 and the baseband processing unit 6 are arranged on the same board.
  • the housing 1 is also provided with an optical module assembly 5 , and the optical module assembly 5 is connected to the circuit board 2 through the cable assembly 4 arranged in the housing 1 .
  • the shell 1 is a metal shell, which not only accommodates the circuit board 2 and the cable assembly 4 and other electronic components, but also protects and shields the internal electronic components.
  • the cable assembly 4 is assembled in the housing 1, one end of the cable assembly 4 is connected to the optical module assembly 5, specifically, the conductive sleeve of the cable assembly 4 is electrically connected to the cage structure of the optical module assembly 5, and the cable assembly 4 is electrically connected to the optical module body of the optical module assembly 5; the other end of the cable assembly 4 is connected to the circuit board 2, specifically, the conductive sleeve of the cable assembly 4 is electrically connected to the ground layer of the circuit board 2, and the cable assembly 4 is conductively connected to the circuit layer of the circuit board 2.
  • FIG. 6 shows an enlarged view of A in FIG. 5 .
  • the conductive sleeve of the cable assembly 4 is in pressing contact with the side wall of the housing 1 , so as to realize the conductive connection between the conductive sleeve and the housing 1 .
  • a channel structure for accommodating the cable assembly 4 is provided on the inner wall of the housing 1 .
  • the layout path of the channel structure generally extends from the circuit board to the optical module assembly, and can be adaptively adjusted according to the layout position of each electronic device in the housing, and is not specifically limited.
  • the cable assembly 4 is arranged in the channel structure, and the channel structure can accommodate the entire cable assembly along the length direction, and can also accommodate a part of the cable assembly along the length direction.
  • the conductive sleeve of the cable assembly 4 abuts against the inner wall of the channel structure, so as to realize the conductive connection between the conductive sleeve and the housing 1 .
  • the channel structure can be arranged on the inner wall surface of the casing, and the channel structure is a groove structure.
  • the groove structure 101 can be arranged on the side wall of one side of the housing 1, the groove structure 101 can extend along the length direction of the side wall of the housing 1, and the cable assembly 4 is accommodated in the groove structure 101, Both ends of the groove structure 101 are open, so that the cable assembly 4 can extend from the groove structure 101 into the cavity of the housing 1 .
  • the cable assembly 4 is located in the groove structure 101 and extends along the length direction of the groove structure 101 .
  • the two ends of the cable assembly 4 respectively extend into the cavity of the housing 1 through the openings at both ends of the groove structure 101 , so as to be respectively connected with the optical module assembly and the circuit board.
  • the groove structure 101 may be disposed on the upper surface of the side wall of the casing 1 .
  • the groove structure 101 can also be arranged at other positions in the casing 1, which is not specifically limited in this embodiment of the present application.
  • the groove structure 101 can be directly formed on the inner wall of the housing 1 by etching, or the groove structure 101 can be integrally formed directly on the inner wall of the housing 1 when the housing 1 is prepared.
  • Fig. 7 shows a schematic diagram of the assembly of the cable assembly and the housing.
  • the figure illustrates the state when the cable assembly is fixed in the groove structure.
  • the groove structure is not shown in the figure.
  • the shape of determines the shape of the groove structure.
  • the cable assembly 4 is limited in the groove structure by a plurality of tie-wraps 102 .
  • a plurality of cable ties 102 are arranged along the extending direction of the cable assembly 4, so that the cable assembly 4 is limited in the groove structure through the cable ties 102, which not only strengthens the pressure contact between the cable assembly 4 and the side wall of the groove structure , and ensure that the cable assembly 4 is stably accommodated in the groove structure.
  • FIG. 8 shows a schematic structural diagram of the channel structure, and the cable assembly is not shown in the figure.
  • the channel structure can also be arranged inside the inner wall of the housing 1 , and the channel structure is a through-hole structure 103 (indicated by a dotted line in the figure).
  • the through-hole structure 103 can be arranged on the side wall of one side of the housing 1, the through-hole structure 103 can extend along the length direction of the side wall of the housing 1, the cable assembly is inserted in the through-hole structure 103, and the through-hole structure 103 Both ends are open, so that the cable assembly can extend from the through hole structure 103 into the cavity of the housing 1 .
  • the cable assembly When the cable assembly is assembled, the cable assembly is inserted into the through hole structure 103 and extends along the length direction of the through hole structure 103 .
  • the two ends of the cable assembly pass through the openings at both ends of the through-hole structure 103 and extend into the cavity of the housing 1 to connect with the optical module assembly and the circuit board respectively.
  • the aperture size of the through-hole structure 103 can be adapted according to the cable assembly, and can be equal to or slightly larger than the diameter of the cable assembly.
  • the setting of the through-hole structure 103 can make the cable assembly be stably limited and in stable pressure contact with the inner wall of the through-hole structure 103, and since the shell 1 is a metal shell, the through-hole structure 103 naturally has a shielding effect , so that the interference of the cable assembly accommodated in the through-hole structure 103 to other electronic devices is further reduced.
  • the through hole structure 103 can be formed on the joint surface of the upper cover and the lower cover, such as forming a groove on the joint surface of the upper cover, and forming a groove on the joint surface of the lower cover. Grooves are also formed on the joint surface of the upper cover and the lower cover, and the grooves on the upper cover and the lower cover are butted to form a through hole structure 103 when the upper cover and the lower cover are joined.
  • the through-hole structure 103 can be directly formed on the housing 1 by etching, or formed in other ways.
  • the inner wall of the housing can be provided with a first positioning groove, the first positioning groove corresponds to the position of the above-mentioned circuit board, and the circuit board is arranged in the first positioning groove, so that the circuit board can be clamped in the
  • the inner wall of the housing can realize that the bottom surface of the circuit board is lower than the inner surface of the housing, and further can realize that the top surface of the circuit board is flush with the inner surface of the housing, or slightly lower than the inner surface of the housing, which can be understood as a circuit
  • the plate is sunken on the inner wall of the casing.
  • the distance to the circuit board is relatively close, and the cable assembly is exposed on the side of the housing.
  • the part inside the cavity is shorter and may not even be exposed in the cavity of the housing.
  • the first end of the through hole structure 103 can be connected with the first positioning groove, the opening of the first end of the through hole structure 103 is formed on the side wall of the first positioning groove, and the top surface of the circuit board is connected with the through hole structure.
  • the opening of the first end of 103 is flush, and the cable assembly is directly connected to the circuit board through the plug-in connector after protruding from the opening of the first end of the through-hole structure 103, so that the cable assembly is not exposed to the cavity of the housing in vivo.
  • the inner wall of the housing is also provided with a second positioning groove, the second positioning groove corresponds to the position of the above-mentioned optical module assembly, and the cage structure of the optical module assembly is arranged in the second positioning groove , so that the optical module assembly can be clamped on the inner wall of the housing, the bottom surface of the optical module assembly can be lower than the inner surface of the housing, and the socket of the optical module body of the optical module assembly can be flush with the inner surface of the housing , or slightly lower than the inner surface of the housing, it can be understood that the optical module assembly is sunk on the inner wall of the housing.
  • the distance from the optical module body is relatively close, and the cable assembly is exposed on the shell.
  • the part in the cavity of the body is relatively short and may not even be exposed in the cavity of the housing.
  • the second end of the through-hole structure 103 can be connected to the second positioning groove, the opening of the second end of the through-hole structure 103 is formed on the side wall of the second positioning groove, and the socket of the optical module body is connected to the through-hole structure.
  • the opening of the second end of 103 is flush, and the cable assembly protrudes from the opening of the second end of the through-hole structure 103 and is directly connected to the plug port of the optical module body through the plug-in connector, so that the cable assembly is not exposed to the housing. in the cavity.
  • the arrangement of the first positioning groove and the second positioning groove can prevent the end of the cable assembly from being exposed in the cavity of the housing, so that the entire length of the cable assembly can be shielded.
  • FIG. 9 shows another structural schematic view of the channel structure, and the cable assembly is not shown in the figure.
  • the channel structure has a first section, a middle section and a second section sequentially connected along the length direction.
  • the middle section is arranged inside the inner wall of the housing 1
  • the middle section is a through-hole structure 103 (indicated by a dotted line in the figure)
  • the first section and the second section are respectively arranged on the inner wall surface of the housing 1
  • the second section is arranged on the inner wall surface of the housing 1.
  • the first segment and the second segment are groove structures 101 respectively.
  • the channel structure can be arranged on the side wall on one side of the housing 1, the channel structure can extend along the length direction of the side wall of the housing 1, the middle section of the cable assembly is inserted into the through hole structure 103, and the sections at both ends of the middle section are embedded in the recesses.
  • Both ends of the channel structure are open, that is, the ends of the two groove structures 101 corresponding to both ends of the channel structure are open, so that the cable assembly can extend from the through hole structure 103 into the cavity of the housing 1 .
  • the middle section of the cable assembly is inserted into the through-hole structure 103, and the sections at both ends of the middle section are embedded in the groove structure 101.
  • the cable assembly extends along the length direction of the channel structure.
  • the two ends of the cable assembly pass through the openings at both ends of the channel structure and extend into the cavity of the housing 1 to be respectively connected to the optical module assembly and the circuit board.
  • the aperture size of the through-hole structure 103 can be adapted according to the cable assembly, and can be equal to or slightly larger than the diameter of the cable assembly.
  • the arrangement of the through-hole structure 103 enables the cable assembly to be stably limited and in stable pressure contact with the inner wall of the through-hole structure 103 , and the through-hole structure 103 has a shielding effect.
  • the area of the shell corresponding to the groove structure 101 may be provided with a cable tie, and the cable assembly is limited in the groove structure 101 by a plurality of tie fasteners.
  • a plurality of cable ties are arranged along the extending direction of the cable assembly, so as to limit the cable assembly in the groove structure 101 through the cable ties, so as to ensure that the cable assembly is stably accommodated in the groove structure 101, and at the same time strengthen the cable assembly It is in pressure contact with the sidewall of the groove structure 101 .
  • the channel structure may have at least one bent section, and the conductive sleeve of the cable assembly is pressed against the inner wall of the channel structure by the tension of the wire harness to ensure the contact effect between the conductive sleeve and the housing.
  • the wire harness is a bendable flexible cable, which has a certain tension when bent.
  • the wire harness located in the bent section of the channel structure presses the conductive sleeve against the side wall of the channel structure through its own tension, thereby realizing the conductive connection between the conductive sleeve and the housing, and, The position stability of the cable assembly on the housing is guaranteed.
  • the channel structure may be in different bent shapes such as serpentine or Z-shaped. It should be understood that the curvature of the bent section of the channel structure should ensure that the cable assembly reliably abuts against the channel wall at that location by virtue of its own diastolic stress.
  • the above-mentioned embodiments of fixing the cable assembly through the channel structure can realize the conductive connection between the conductive sleeve and the inner wall of the housing along the entire length direction.
  • the casing may not have a channel structure, and the cable assembly is directly laid on the inner wall surface of the casing.
  • the tightening force presses the conductive sleeve of the cable assembly against the inner wall of the casing to realize the conductive connection between the conductive sleeve and the casing.
  • the conductive sleeve can be electrically connected to the inner wall of the housing along the entire length direction.
  • FIG. 10 shows a partially enlarged view at B in FIG. 5 .
  • the part of the conductive sleeve of the cable assembly 4 exposed outside the opening of the channel structure is conductively connected with the housing 1 through the auxiliary conductive structure 11 , so as to shield and fix this part of the cable assembly 4 .
  • the connection condition of the auxiliary conductive structure 11 can be determined according to the condition that the end of the cable assembly 4 is exposed outside the channel structure.
  • the auxiliary conductive structure 11 may be directly connected to the housing 1 .
  • the auxiliary conductive structure 11 can be directly connected to the housing 1; it can also be connected to the circuit board, specifically the top surface of the circuit board; it can also be connected to the housing 1 at the same time. Body 1 and the circuit board.
  • FIG. 11 shows a schematic structural view of the auxiliary conductive structure, in which the auxiliary conductive structure is decomposed.
  • the auxiliary conductive structure 11 can be a hoop structure, specifically including an upper conductive structure 111 and a lower conductive structure 112 that are detachably connected.
  • the two surround A through hole for accommodating the cable assembly 4 is formed, and the cable assembly 4 can pass through the through hole.
  • a platform for accommodating the lower conductive structure 112 may be provided at the opening of the channel structure, and the lower conductive structure 112 is placed on the platform, and then the cable assembly 4 is placed in the recessed space of the lower conductive structure 112, and then The upper conductive structure 111 is fastened to the lower conductive structure 112 , so that the cable assembly 4 is fixed on the housing 1 , and the conductive sleeve of the cable assembly 4 is electrically connected to the housing 1 .
  • the upper conductive structure 111 can be locked on the inner wall of the housing 1 through threaded connectors 113 (bolts or screws, etc.), and the lower conductive structure 112 is pressed against the inner wall of the housing 1 and connected with the housing 1. Conductive connection, while the upper conductive structure 111 and the lower conductive structure 112 clamp the cable assembly 4 .
  • the upper conductive structure 111 is in contact with the lower conductive structure 112 and electrically connected, so that the part of the conductive sleeve exposed outside the groove is electrically connected to the housing 1 through the lower conductive structure 112 and the upper conductive structure 111, that is, conductively connected to the wireless communication device. land.
  • the cable assembly 4 is reliably fixed on the housing 1 through the channel structure or/and the cable tie; on the other hand, the auxiliary conductive structure 11 fixes the cable assembly 4 at the opening of the channel structure , in good contact with the conductive sleeve, improving the grounding effect of the conductive sleeve extending beyond the channel structure, thereby improving the energy leakage problem of the cable assembly 4 at the opening of the channel structure, and improving the shielding effect of the entire cable assembly 4 .
  • the lower conductive structure 112 may be electrically connected to the housing 1 by means of bonding, clamping, etc., in addition to being electrically connected to the housing 1 by pressing.
  • the upper conductive structure 111 and the lower conductive structure 112 can be made of different metal materials, such as copper, aluminum, iron, etc., and can also be made of non-metallic materials with metal coating, such as plastic, resin and other materials, and then coated Metallic coating for electrical conductivity.
  • the auxiliary conductive structure can also adopt a cylindrical structure, which is sleeved on the cable assembly and electrically connected with the conductive sleeve. After that, the auxiliary conductive structure is inserted into the opening of the channel structure, and the The auxiliary conductive structure is conductively connected to the wall of the channel structure by pressing, thereby improving the grounding effect of the part of the cable assembly exposed outside the channel structure.
  • the cable assembly is shielded as a whole, which avoids energy leakage of the signal transmitted by it and prevents the signal transmitted by it from causing interference to other electronic devices of the communication system.
  • the cable assembly is assembled in the housing for actual measurement.
  • the isolation and common-mode isolation are shown in Figure 12 and Figure 13.
  • the two horizontal lines in Figure 12 and Figure 13 are the differential mode limit and the common mode limit of the system requirements respectively, and the two curves are the measured differential mode isolation and common mode isolation of the cable assembly in different frequency bands, respectively. Both the mode isolation and common mode isolation have been buried in the noise floor, and the differential mode isolation and common mode isolation of the cable assembly in different frequency bands meet the system specifications.
  • a complete and continuous conductive sleeve is formed through the outer layer of the cable assembly to shield the internal wiring harness of the cable assembly, and realize the common ground design of the optical module assembly, cable assembly and circuit board, and connect the conductive sleeve and the wireless communication device.
  • Ground conductive connection greatly improves the isolation of cables; at the same time, the implementation scheme is simple and the process is less difficult.

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Abstract

本申请提供了一种无线通信装置及无线通信系统。该无线通信装置包括壳体以及设置在壳体内的电路板。电路板设置有基带处理单元，壳体侧壁设置有光模块组件，光模块组件通过线缆组件与电路板导电连接，以与基带处理单元导电连接。线缆组件包括线束及导电套，导电套将线束沿长度方向全段套设在内，导电套对线束进行屏蔽。导电套分别与光模块组件的笼子结构和电路板的地层导电连接，实现光模块组件、电路板及线缆组件三者共地，从而在由光模块组件通过线缆组件至电路板的这条完整的信号传输路径上对信号进行全面屏蔽，且导电套与壳体的内壁导电连接，壳体作为无线通信装置的地，从而强化对线束的屏蔽效果。

Description

一种无线通信装置及无线通信系统
相关申请的交叉引用
本申请要求在2021年08月26日提交中国专利局、申请号为202110990781.3、申请名称为“一种无线通信装置及无线通信系统”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及到通信技术领域，尤其涉及到一种无线通信装置及无线通信系统。
背景技术
现有的无线通信系统，随着系统架构的改进，光模块与基带处理单元(base band unite，BBU)的互连形式由板级互连演进为光口到单板(optical to board，OTB)互连。在光口到单板互连这种形式中，光模块与基带处理单元的处理板卡通过架空线缆(flyover cable)实现互连，由此能够带来成本降低，功耗降低、散热性能提升的好处。但是，由于线缆组件通常无屏蔽措施，或者屏蔽力度较弱，使得线缆组件会对无线通信系统的其他电子器件造成干扰，系统的干扰风险显著增加。比如线缆组件会对与基带处理单元共板的天线单元造成干扰，而天线单元与基带处理单元的间距又较小，这就使得天线单元在接收带内更加容易受到负责传输高速信号的线缆组件的干扰，天线单元的功能会受到明显影响。由此，对于采用光口到单板互连的无线通信系统，如何降低系统的干扰风险是亟需解决的问题。
发明内容
本申请提供了一种无线通信装置及无线通信系统，用以降低无线通信系统的干扰风险。
第一方面，本申请提供了一种无线通信装置，包括壳体以及设置在壳体内的电路板。电路板设置有基带处理单元，壳体侧壁设置有光模块组件，光模块组件通过线缆组件与电路板导电连接，以与基带处理单元导电连接。其中，线缆组件包括线束及导电套，导电套将线束沿长度方向全段套设在内，导电套分别与光模块组件的笼子结构和电路板的地层导电连接，且导电套与壳体的内壁导电连接。
本申请提供的技术方案，导电套包裹线束，导电套对所包裹的所有线束进行整体屏蔽，减轻线束对无线通信系统的其他电子器件的干扰。导电套沿自身长度方向的一端与光模块组件的笼子结构导电连接，导电套沿自身长度方向的另一端与电路板的地层导电连接，实现光模块组件、电路板及线缆组件三者共地，从而在由光模块组件通过线缆组件至电路板的这条完整的信号传输路径上对信号进行全面屏蔽，避免因信号在该传输路径上泄露而对无线通信装置的其他电子器件造成干扰。且导电套还与壳体的内壁导电连接，壳体作为无线通信装置的地，从而实现导电套连接到无线通信装置的地，实现上述完整的信号传输路径上的三者连接到无线通信装置的地，强化对线束的屏蔽效果。
在一个具体的可实施方案中，导电套沿长度方向全段与壳体的内壁导电连接。强化对线束的屏蔽效果。
在一个具体的可实施方案中，壳体的内壁设置有用于容纳沿长度方向全段或部分线缆组件的通道结构，通道结构由电路板向光模块组件延伸，线缆组件布设在通道结构内，且导电套与通道结构的内壁抵接。通过通道结构实现将线缆组件定位在壳体上，使得线缆组件的位置稳定，且加强线缆组件与壳体的导电连接效果。
在具体设置通道结构时，通道结构设置在壳体的内壁内部，通道结构为通孔结构。通孔结构的设置能够使线缆组件稳定地被限位，稳定地与通孔结构的内壁抵压接触，从而使线缆组件稳定地与壳体导电连接，并且，通孔结构具有屏蔽作用，使得被容纳在通孔结构内的线缆组件对其他电子器件的干扰进一步减轻。
在一个具体的可实施方案中，壳体的内壁设置有第一定位槽，电路板设置在第一定位槽内。壳体的内壁还设置有第二定位槽，光模块组件的笼子结构设置在第二定位槽内。通道结构沿长度方向的第一端和第二端分别与第一定位槽和第二定位槽连接。第一定位槽和第二定位槽的设置，可以使线缆组件的端部不暴露在壳体的腔体内，从而可以使线缆组件沿长度方向全段均被屏蔽，避免线缆组件因能量泄露而对其他电子器件造成干扰。
在具体设置通道结构时，通道结构设置在壳体的内壁表面，通道结构为凹槽结构。线缆组件嵌入在凹槽结构内，线缆组件的位置稳定，线缆组件与壳体的导电连接可靠。
在具体设置通道结构时，通道结构沿长度方向具有依次连接的第一段、中间段和第二段。中间段设置在壳体的内壁内部，中间段为通孔结构。第一段和第二段分别设置在壳体的内壁表面，第一段和第二段分别为凹槽结构。通过通孔结构和凹槽结构共同配合将线缆组件固定在壳体上，使得线缆组件得以稳定地固定在壳体上，线缆组件得以可靠地与壳体导电连接。
在一个具体的可实施方案中，通道结构沿长度方向的两端分别具有开口，导电套沿长度方向的两端分别由开口伸出通道结构，以外露在通道结构外。导电套外露在通道结构外的部分通过辅助导电结构与壳体的内壁导电连接。通过辅助导电结构在通道结构的开口处固定线缆组件，使导电套与壳体良好接触，提高了导电套延伸到通道结构以外部分的接地效果，从而改善了线缆组件在通道结构的开口处能量泄漏的问题，提高了整个线缆组件的屏蔽效果。
在具体设置辅助导电结构时，辅助导电结构包括可拆卸连接的上导电结构及下导电结构，上导电结构和下导电结构扣合在导电套上，并分别与导电套导电连接，且下导电结构与壳体的内壁导电连接。辅助导电结构的结构简单，易于与壳体装配，便于与线缆组件配合。
在一个具体的可实施方案中，通道结构具有至少一个弯折段，导电套通过线束的张力抵压在通道结构的内壁。位于通道结构的弯折段内的线束通过自身的张力将导电套抵压在通道结构的侧壁，保证了线缆组件在壳体上的位置稳定性，同时也使得导电套与壳体的导电连接更为可靠。
第二方面，本申请提供了一种无线通信系统，包括如前述的无线通信装置，光模块组件的光模块本体用于与外部光纤导电连接。无线通信装置的基带处理单元与光模块组件采用光口到单板的互连形式，连接基带处理单元与光模块组件的线缆组件的线束全段由导电套屏蔽，且线缆组件与无线通信装置的地连接，无线通信装置存在的干扰风险较小，无线通信系统工作稳定且可靠。
附图说明
图1为本申请实施例提供的无线通信装置的一种可能的实施方式；
图2为本申请实施例提供的无线通信装置的线缆组件的连接示意图；
图3为本申请实施例提供的无线通信装置的线缆组件的一种结构示意图；
图4为本申请实施例提供的无线通信装置的线缆组件的另一种结构示意图；
图5为本申请实施例提供的无线通信装置的一种结构示意图；
图6为图5中A处的结构放大图；
图7为本申请实施例提供的无线通信装置的线缆组件与壳体的装配示意图；
图8为本申请实施例提供的无线通信装置的通道结构的一种结构示意图；
图9为本申请实施例提供的无线通信装置的通道结构的另一种结构示意图；
图10为图5中B处的结构放大图；
图11为本申请实施例提供的无线通信装置的辅助导电结构的分解示意图；
图12和图13为本申请实施例提供的无线通信装置的线缆组件在不同频率下的差模隔离度和共模隔离度的实测图。
具体实施方式
为方便理解本申请实施例提供的无线通信系统，下面首先说明其应用场景。无线通信系统可以进行高低频无线信号的转换、接收及发射。无线通信系统包括无线通信装置，作为本申请一种可能的实施方式，如图1所示，无线通信装置可以包括壳体1以及设置在壳体1内的电路板2及天线单元3，并且，电路板2上设置有基带处理单元6，壳体1侧壁上设置有光模块组件5。其中，光模块组件5与基带处理单元6可以采用光口到单板(OTB)的互连形式，具体实施时，光模块组件5通过线缆组件4与电路板2导电连接，实现光模块组件5与基带处理单元6导电连接。
其中，结合图2，光模块组件5包括光模块本体51及笼子结构52，光模块本体51固定在笼子结构52内。具体地，光模块本体51可以直接卡装在笼子结构52内实现固定，或者通过螺纹连接件(螺栓或螺钉等)固定在笼子结构52内；笼子结构52可以为金属材质，以屏蔽外部信号对光模块本体51的干扰，且笼子结构52与壳体1导电连接。为方便将光模块组件5固定在壳体1内，可以在壳体1内安装一个固定板9，固定板9可以通过螺纹连接件(螺栓或螺钉等)固定在壳体1的内壁上。并且，固定板9除了作为光模块组件5与壳体1的连接件以外，还作为光模块组件5的接地部件，示例性地，固定板9可以为常见的导电金属材质制备而成的金属板，如铜板、铝板或者铁板等，固定板9与壳体1导电连接，在笼子结构52固定在固定板9时，笼子结构52与固定板9导电连接，从而笼子结构52实现与壳体1导电连接，壳体作为无线通信装置的地，即实现笼子结构52连接到无线通信装置的地，强化对光模块本体51的屏蔽。光模块组件5的笼子结构52固定在固定板9上，从而将光模块组件5固定在壳体1内。示例性地，笼子结构52可以通过焊接、粘接、卡接等不同的方式固定在固定板9上，或者可以通过螺纹连接件(螺栓或螺钉等)可拆卸地固定在固定板9上。线缆组件4与光模块组件5连接时，线缆组件4可以通过束线扣10固定在固定板9上，从而实现线缆组件4相对于固定板9的固定。
壳体1可以具有连接口，光模块组件5的一端可以由连接口外露于壳体1，外部光纤 7可以与光模块本体51导电连接，光模块本体51将光纤7传输的高速数据转化为电信号，完成光到电的转换。具体地，光纤7可以通过插拔式连接器实现与光模块本体51的导电连接。
基带处理单元6设置在电路板2上并与电路板2导电连接，电路板2作为基带处理单元6的处理板卡，且天线单元3也可以设置在电路板2上，即天线单元3可以与基带处理单元6共板设置。
基带处理单元6与光模块组件5可以采用光口到单板(OTB)的互连形式，具体地，光模块组件5的光模块本体51与电路板2通过线缆组件4导电连接，从而与基带处理单元6导电连接，实现光模块本体51与基带处理单元6之间的电信号传输。在具体实施时，线缆组件4可以通过连接器8实现与电路板2的导电连接，即线缆组件4直接连接的是光模块组件5与连接器8。连接器8为板端连接器，连接器8可以采用插拔式连接器。连接器8包括屏蔽壳体和内部的连接端子，在连接时，连接器8的屏蔽壳体固定在电路板2上，并与电路板2的地层导电连接，连接端子与电路板2的电路层导电连接。应理解，连接器8的连接端子以及屏蔽壳体的具体设置方式可采用现有的板端连接器的设置方式，在此不再赘述。相似地，线缆组件4可以通过插拔式连接器实现与光模块本体51的导电连接。在本申请实施例中，对光模块组件5和连接器8的个数及连接情况不作具体限定，示例性地，可以采用一个或多个光模块组件5通过一个线缆组件4与一个连接器8对应连接，也可以采用一个光模块组件5通过一个线缆组件4与多个连接器8对应连接。
参考图3，图3示出了本申请实施例提供的无线通信装置的线缆组件的一种结构示意图，该图为线缆组件的横截面示意图。如图3所示，为了减轻线缆组件4对无线通信装置的其他电子器件的干扰，降低无线通信系统的干扰风险，线缆组件4可以包括导电套41及线束42，导电套41沿线束42的长度方向将线束42全段套设在内。
线束42的个数可以为多个，所有的线束42共同被导电套41包裹在内。线束42的一端与光模块组件的光模块本体连接，另一端与上述的连接器连接，以在光模块本体和连接器之间传输信号，示例性地，线束42可用于传输高速信号、电源信号以及低速信号等不同信号。作为一个可选的方案，对于单个线束42而言，线束42可以采用铝箔包裹以实现对所传输信号进行屏蔽。
导电套41包裹上述线束42，以对所包裹的所有的线束42进行整体屏蔽，减轻线束42对无线通信系统的其他电子器件的干扰。在包裹时，导电套41可通过缠绕的方式沿线束42的长度方向将所有的线束42全段包裹起来，或者导电套41采用一管状结构，所有的线束42均全段穿插在导电套41内。
导电套41沿自身长度方向的一端与光模块组件的笼子结构导电连接，具体可与上述的固定板导电连接以与笼子结构导电连接，导电套41沿自身长度方向的另一端与电路板的地层导电连接，具体可与上述的连接器的屏蔽壳体导电连接以与电路板的地层导电连接，实现光模块组件、电路板及线缆组件4三者共地，从而在“光模块组件-线缆组件-电路板”这条完整的信号传输路径上对信号进行全面屏蔽，避免因信号在该传输路径上泄露而对无线通信装置的其他电子器件造成干扰。
导电套41还可以与壳体的内壁导电连接，壳体作为无线通信装置的地，从而实现导电套41连接到无线通信装置的地，强化导电套41对线束42的屏蔽效果，还实现电路板的地层与壳体共地的效果。
作为一个示例，导电套41可为线缆组件4的最外层结构，此时导电套41整个外露在线缆组件4的外表面，当线缆组件4装配在壳体内时，导电套41与壳体1导电连接，即导电套41连接到无线通信装置的地，此时可以实现导电套41的单点、多个或全段接地。在导电套41与壳体1连接时，为保证导电套41的接地效果，线束42为可折弯的柔性线缆。由此，可通过线束42的张力来提供导电套41与壳体1的接触压力，从而保证接地效果。
导电套41也具有一定的柔性，作为一个可选的方案，导电套41可以为双层导电布，从而具有较好的导电效果，以及一定的结构强度，还具有一定的柔韧性，便于随线束42弯折，能够更紧密地贴合壳体。
应理解，图3所示的线缆组件4仅为一个示例，在设置导电套41时，既可采用导电套41全部外露的设置方式，也可采用导电套41仅部分外露在线缆组件4的外侧的设置方式。
参考图4，图4示出了本申请实施例提供的无线通信装置的线缆组件的另一种结构示意图，该图也为线缆组件的横截面示意图。如图4所示，线缆组件4由内到外可以依次包括线束42、导电套41以及绝缘层43。此时，导电套41为线缆组件4的内层，线缆组件4的最外层为绝缘层43。在绝缘层43上设置缺口或者开窗，使得导电套41部分外露在缺口或开窗中。线缆组件4设置在壳体内时，通过导电套41外露在缺口或开窗的部分与壳体1导电连接，此时可以实现导电套41的单点或多点接地。示例性地，绝缘层43的开窗或者缺口为多个，且多个缺口或开窗沿导电套41的长度方向排列，从而使得导电套41在长度方向上能够有多个与壳体1接触的点，此时可以实现导电套41多点接地，以提高导电套41的接地效果。
由上述描述可看出，本申请实施例提供的线缆组件4在传输信号时，线束42的一端与光模块组件的光模块本体导电连接，线束42的另一端与连接器的连接端子导电连接，进而与电路板的电路层导电连接；导电套41的一端与光模块组件的笼子结构导电连接，进而与壳体导电连接，导电套41的另一端与连接器的屏蔽壳体导电连接，进而与电路板的地层导电连接；导电套41还与壳体直接连接而实现导电连接。线束42被完整且连续的导电屏蔽结构(笼子结构、导电套41、连接器的屏蔽壳体)包裹，且通过导电套41实现了电路板的地层与壳体共地的效果，从而保证了对线束42所传输信号的屏蔽效果，避免了由于高速信号在传输过程中泄露而对无线通信装置的其他电子器件造成干扰。
参考图5，图5为本申请实施例提供的无线通信装置的一种结构示意图，图中示例了壳体的内部结构及一些电子器件的布设情况。如图5所示，壳体1内设置有电路板2，电路板2上设置有基带处理单元6，电路板2上还设置有天线单元3，即天线单元3与基带处理单元6共板设置。壳体1内还设置有光模块组件5，光模块组件5与电路板2通过布设在壳体1内的线缆组件4连接。
壳体1为一金属壳体，其除了具有容纳电路板2以及线缆组件4等电子器件的作用，还具有保护内部电子器件以及对其进行屏蔽的作用。在线缆组件4装配在壳体1内时，线缆组件4的一端与光模块组件5连接，具体地，线缆组件4的导电套与光模块组件5的笼子结构导电连接，线缆组件4的线束与光模块组件5的光模块本体导电连接；线缆组件4的另一端与电路板2连接，具体地，线缆组件4的导电套与电路板2的地层导电连接，线缆组件4的线束与电路板2的电路层导电连接。
参考图6，图6示出了图5中的A处放大图。如图6所示，线缆组件4的导电套与壳体1的侧壁抵压接触，从而实现导电套与壳体1导电连接。壳体1的内壁上设置有用于容纳线缆组件4的通道结构。通道结构的布设路径大体上是由电路板向光模块组件延伸，可以根据壳体内各个电子器件的布设位置而适应性调整，不作具体限定。线缆组件4布设在通道结构内，通道结构可以容纳沿长度方向全段的线缆组件，也可以容纳沿长度方向一部分的线缆组件。线缆组件4的导电套与通道结构的内壁抵接，以实现导电套与壳体1导电连接。
在一种实施例中，通道结构可以设置在壳体的内壁表面，通道结构为凹槽结构。示例性地，凹槽结构101可以设置在壳体1一侧的侧壁上，凹槽结构101可以沿壳体1的侧壁的长度方向延伸，线缆组件4容纳在凹槽结构101内，凹槽结构101的两端开口，以使得线缆组件4可从凹槽结构101中延伸到壳体1的腔体内。线缆组件4装配时，线缆组件4位于凹槽结构101中，并沿凹槽结构101的长度方向延伸。另外，线缆组件4的两端分别穿过凹槽结构101两端的开口延伸到壳体1的腔体中，以分别与光模块组件和电路板连接。
作为一可选的方案，凹槽结构101可以设置在壳体1侧壁的上表面。当然，凹槽结构101也可设置在壳体1内的其他位置，在本申请实施例中不作具体限定。凹槽结构101可通过刻蚀的方式直接形成在壳体1的内壁，或者也可在制备壳体1时，直接在壳体1的内壁一体成型凹槽结构101。
参考图7，图7示出了线缆组件与壳体的装配示意图，图中示例了线缆组件固定在凹槽结构内时的状态，图中未示出凹槽结构，可根据线缆组件的形状确定凹槽结构的形状。如图7所示，作为一个可选的方案，为了避免线缆组件4由于舒张应力从凹槽结构中脱出，线缆组件4通过多个束线扣102限位在凹槽结构内。多个束线扣102沿线缆组件4的延伸方向设置，以通过束线扣102将线缆组件4限定在凹槽结构内，既加强线缆组件4与凹槽结构的侧壁抵压接触，又保证线缆组件4稳定地容纳在凹槽结构内。
参考图8，图8示出了通道结构的一种结构示意图，图中未示出线缆组件。在一种实施例中，如图8所示，通道结构还可以设置在壳体1的内壁内部，通道结构为通孔结构103(图中用虚线表示)。通孔结构103可以设置在壳体1一侧的侧壁上，通孔结构103可以沿壳体1的侧壁的长度方向延伸，线缆组件穿插在通孔结构103内，通孔结构103的两端开口，以使得线缆组件可从通孔结构103中延伸到壳体1的腔体内。线缆组件装配时，线缆组件穿插在通孔结构103中，并沿通孔结构103的长度方向延伸。另外，线缆组件的两端分别穿出通孔结构103两端的开口延伸到壳体1的腔体中，以分别与光模块组件和电路板连接。通孔结构103的孔径大小可以根据线缆组件适配，可以等于或略大于线缆组件的直径。通孔结构103的设置能够使线缆组件稳定地被限位，稳定地与通孔结构103的内壁抵压接触，并且，由于壳体1为金属壳体，通孔结构103自然地具有屏蔽作用，使得被容纳在通孔结构103内的线缆组件对其他电子器件的干扰进一步减轻。
作为一可选的方案，当壳体1由上盖和下盖装配成型时，通孔结构103可以形成在上盖和下盖的接合面，如在上盖的接合面形成凹槽，在下盖的接合面也形成凹槽，上盖和下盖接合时，上盖上的凹槽和下盖上的凹槽对接形成通孔结构103。在具体实施中，通孔结构103可通过刻蚀的方式直接形成在壳体1上，或者采用其他方式成型。
作为一可选的方案，壳体的内壁可以设置有第一定位槽，第一定位槽与上述的电路板的位置相对应，电路板设置在第一定位槽内，从而电路板可以卡接在壳体的内壁，可以实 现电路板的底面低于壳体的内表面，进一步可以实现电路板的顶面与壳体的内表面平齐，或略低于壳体的内表面，可以理解为电路板在壳体的内壁下沉设置。进而，线缆组件的端部穿出通孔结构103的第一端(通孔结构103的靠近电路板的一端)的开口后，与电路板的距离较近，线缆组件暴露在壳体的腔体内的部分较短，甚至可以不暴露在壳体的腔体内。示例性地，通孔结构103的第一端可以与第一定位槽连接，通孔结构103的第一端的开口形成在第一定位槽的侧壁上，电路板的顶面与通孔结构103的第一端的开口平齐，线缆组件由通孔结构103的第一端的开口伸出后直接通过插拔式连接器与电路板连接，从而线缆组件不暴露在壳体的腔体内。
作为一可选的方案，相似地，壳体的内壁还设置有第二定位槽，第二定位槽与上述的光模块组件的位置相对应，光模块组件的笼子结构设置在第二定位槽内，从而光模块组件可以卡接在壳体的内壁，可以实现光模块组件的底面低于壳体的内表面，进一步可以实现光模块组件的光模块本体的插接口与壳体的内表面平齐，或略低于壳体的内表面，可以理解为光模块组件在壳体的内壁下沉设置。进而，线缆组件的端部穿出通孔结构103的第二端(通孔结构103的靠近光模块组件的一端)的开口后，与光模块本体的距离较近，线缆组件暴露在壳体的腔体内的部分较短，甚至可以不暴露在壳体的腔体内。示例性地，通孔结构103的第二端可以与第二定位槽连接，通孔结构103的第二端的开口形成在第二定位槽的侧壁上，光模块本体的插接口与通孔结构103的第二端的开口平齐，线缆组件由通孔结构103的第二端的开口伸出后直接通过插拔式连接器连接在光模块本体的插接口，从而线缆组件不暴露在壳体的腔体内。结合上述，第一定位槽和第二定位槽的设置，可以使线缆组件的端部不暴露在壳体的腔体内，从而可以使线缆组件沿长度方向全段均被屏蔽。
参考图9，图9示出了通道结构的另一种结构示意图，图中未示出线缆组件。在一种实施例中，通道结构沿长度方向具有依次连接的第一段、中间段和第二段。如图9所示，中间段设置在壳体1的内壁内部，中间段为通孔结构103(图中用虚线表示)，第一段和第二段分别设置在壳体1的内壁表面，第一段和第二段分别为凹槽结构101。通道结构可以设置在壳体1一侧的侧壁上，通道结构可以沿壳体1的侧壁的长度方向延伸，线缆组件的中段穿插在通孔结构103内，中段两端的区段嵌入凹槽结构101内。通道结构整体的两端开口，即两个凹槽结构101的对应通道结构两端的端部开口，以使得线缆组件可从通孔结构103中延伸到壳体1的腔体内。线缆组件装配时，线缆组件的中段穿插在通孔结构103中，中段两端的区段嵌入凹槽结构101内，整体上，线缆组件沿通道结构的长度方向延伸。另外，线缆组件的两端分别穿出通道结构两端的开口延伸到壳体1的腔体中，以分别与光模块组件和电路板连接。通孔结构103的孔径大小可以根据线缆组件适配，可以等于或略大于线缆组件的直径。通孔结构103的设置能够使线缆组件稳定地被限位，稳定地与通孔结构103的内壁抵压接触，且通孔结构103具有屏蔽作用。壳体上对应凹槽结构101的区域可以设置有束线扣，线缆组件通过多个束线扣限位在凹槽结构101内。多个束线扣沿线缆组件的延伸方向设置，以通过束线扣将线缆组件限定在凹槽结构101内，保证线缆组件稳定地容纳在凹槽结构101内，同时加强线缆组件与凹槽结构101的侧壁抵压接触。
作为一个示例，通道结构可以具有至少一个弯折段，线缆组件的导电套通过线束的张力抵压在通道结构的内壁，保证导电套与壳体的接触效果。由此，线束为可弯折的柔性线缆，其在弯折的情况下具有一定的张力。在线缆组件放置在通道结构内时，位于通道结构的弯折段内的线束通过自身的张力将导电套抵压在通道结构的侧壁，从而实现导电套与壳 体的导电连接，并且，保证了线缆组件在壳体上的位置稳定性。示例性地，通道结构可以为蛇形或者Z型等不同的弯折形状。应理解，通道结构的弯折段的曲率应保证线缆组件在该曲率下依靠自身的舒张应力与该处的通道壁可靠抵接。
由上述描述可以看出，上述几种通过通道结构固定线缆组件的实施例，可实现导电套沿长度方向全段与壳体的内壁导电连接。
当然，壳体上也可以不设置通道结构，线缆组件直接布设在壳体的内壁表面，此时，线缆组件可通过束线扣固定在壳体的内壁上，并通过束线扣的压紧力将线缆组件的导电套抵压在壳体的内壁上，实现导电套与壳体的导电连接。当束线扣的数量较多，沿线缆组件的延伸方向较密集地分布时，可实现导电套沿长度方向全段与壳体的内壁导电连接。
参考图10，图10示出了图5中的B处的局部放大图。如图10所示，在线缆组件4穿过通道结构的开口向壳体1的腔体内延伸时，在通道结构的开口处会存在能量泄漏和干扰风险，为了改善能量泄露和干扰的风险，线缆组件4的导电套外露在通道结构的开口外的部分通过辅助导电结构11与壳体1导电连接，实现对线缆组件4的这部分的屏蔽及固定。可以根据线缆组件4的端部外露在通道结构外的情况，确定辅助导电结构11的连接情况。例如固定线缆组件4与光模块组件连接的一端时，辅助导电结构11可以直接连接在壳体1上。固定线缆组件4与电路板连接的一端时，辅助导电结构11可以直接连接在壳体1上；也可以连接在电路板上，具体可连接在电路板的顶面；还可以同时连接在壳体1和电路板上。
参考图11，图11示出了辅助导电结构的结构示意图，图中分解了辅助导电结构。如图11所示，辅助导电结构11可以为一个抱箍结构，具体包括可拆卸连接的上导电结构111及下导电结构112，在上导电结构111和下导电结构112扣合时，两者围成容纳线缆组件4的通孔，线缆组件4可穿过该通孔。在与壳体1连接时，通道结构的开口处可以设置有容纳下导电结构112的平台，下导电结构112放置于该平台，之后将线缆组件4放置在下导电结构112的凹陷空间内，再将上导电结构111扣合在下导电结构112上，实现线缆组件4固定在壳体1上，并实现线缆组件4的导电套与壳体1导电连接。
在具体实施中，可以通过螺纹连接件113(螺栓或螺钉等)将上导电结构111锁紧在壳体1的内壁上，下导电结构112被压紧在壳体1的内壁并与壳体1导电连接，同时上导电结构111与下导电结构112将线缆组件4夹紧。上导电结构111与下导电结构112接触并导电连接，从而实现导电套外露在凹槽外的部分通过下导电结构112以及上导电结构111与壳体1导电连接，即导电连接到无线通信装置的地。在采用上述结构时，一方面，通过通道结构或/和束线扣将线缆组件4可靠地固定在壳体1上，另一方面，辅助导电结构11在通道结构的开口处固定线缆组件4，与导电套良好接触，提高了导电套延伸到通道结构以外部分的接地效果，从而改善了线缆组件4在通道结构的开口处能量泄漏问题，提高了整个线缆组件4的屏蔽效果。
应理解，下导电结构112除采用压紧的方式实现与壳体1导电连接外，还可采用粘接、卡接等方式与壳体1导电连接。上导电结构111和下导电结构112可选用不同的金属材质制备而成，如铜、铝、铁等，还可采用带金属涂层的非金属材料，如采用塑料、树脂等材料制备，之后涂覆金属涂层，以实现导电。
作为一个可选的方案，辅助导电结构还可采用筒状结构，该筒状结构套装在线缆组件上，并与导电套导电连接，之后将辅助导电结构塞入到通道结构的开口，通过挤压的方式 将辅助导电结构与通道结构的壁导电连接，从而改善线缆组件外露在通道结构外的部分的接地效果。
通过上述描述可看出，线缆组件整体被屏蔽，避免了其传输的信号出现能量泄露，避免了其传输的信号对通信系统的其他电子器件造成干扰。为方便理解本申请实施例提供的无线通信装置的效果，将线缆组件装配在壳体内进行实测，实测线缆组件在不同的频段差模隔离度和共模隔离度，其中不同的频段差模隔离度和共模隔离度如图12和图13所示。图12和图13中两条横线分别为系统需求的差模限值和共模限值，两条曲线分别为实测的线缆组件在不同频段的差模隔离度和共模隔离度，差模隔离度与共模隔离度均已埋入底噪，线缆组件在不同的频段的差模隔离度和共模隔离度均满足系统指标。
通过线缆组件外被层形成完整且连续的导电套实现对线缆组件内部线束的屏蔽，并实现光模块组件、线缆组件和电路板的共地设计，并将导电套与无线通信装置的地导电连接，大幅提升线缆的隔离度；与此同时，实现方案简单，工艺难度较小。
显然，本领域的技术人员可以对本申请进行各种改动和变型而不脱离本申请的精神和范围。这样，倘若本申请的这些修改和变型属于本申请权利要求及其等同技术的范围之内，则本申请也意图包含这些改动和变型在内。

Claims (11)

  1. 一种无线通信装置，其特征在于，包括壳体以及设置在所述壳体内的电路板，所述电路板设置有基带处理单元，所述壳体侧壁设置有光模块组件，所述光模块组件通过线缆组件与所述电路板导电连接，以与所述基带处理单元导电连接；其中：
    所述线缆组件包括线束及导电套，所述导电套将所述线束沿长度方向全段套设在内，所述导电套分别与所述光模块组件的笼子结构和所述电路板的地层导电连接，且所述导电套与所述壳体的内壁导电连接。
  2. 如权利要求1所述的无线通信装置，其特征在于，所述导电套沿长度方向全段与所述壳体的内壁导电连接。
  3. 如权利要求1或2所述的无线通信装置，其特征在于，所述壳体的内壁设置有用于容纳沿长度方向全段或部分所述线缆组件的通道结构，所述通道结构由所述电路板向所述光模块组件延伸，所述线缆组件布设在所述通道结构内，且所述导电套与所述通道结构的内壁抵接。
  4. 如权利要求3所述的无线通信装置，其特征在于，所述通道结构设置在所述壳体的内壁内部，所述通道结构为通孔结构。
  5. 如权利要求4所述的无线通信装置，其特征在于，所述壳体的内壁设置有第一定位槽，所述电路板设置在所述第一定位槽内；
    所述壳体的内壁还设置有第二定位槽，所述光模块组件的笼子结构设置在所述第二定位槽内；
    所述通道结构沿长度方向的第一端和第二端分别与所述第一定位槽和所述第二定位槽连接。
  6. 如权利要求3所述的无线通信装置，其特征在于，所述通道结构设置在所述壳体的内壁表面，所述通道结构为凹槽结构。
  7. 如权利要求3所述的无线通信装置，其特征在于，所述通道结构沿长度方向具有依次连接的第一段、中间段和第二段；
    所述中间段设置在所述壳体的内壁内部，所述中间段为通孔结构；
    所述第一段和所述第二段分别设置在所述壳体的内壁表面，所述第一段和所述第二段分别为凹槽结构。
  8. 如权利要求6或7所述的无线通信装置，其特征在于，所述通道结构沿长度方向的两端分别具有开口，所述导电套沿长度方向的两端分别由所述开口伸出所述通道结构，以外露在所述通道结构外；
    所述导电套外露在所述通道结构外的部分通过辅助导电结构与所述壳体的内壁导电连接。
  9. 如权利要求8所述的无线通信装置，其特征在于，所述辅助导电结构包括可拆卸连接的上导电结构及下导电结构，所述上导电结构和所述下导电结构扣合在所述导电套上，并分别与所述导电套导电连接，且所述下导电结构与所述壳体的内壁导电连接。
  10. 如权利要求3～9任一项所述的无线通信装置，其特征在于，所述通道结构具有至少一个弯折段，所述导电套通过所述线束的张力抵压在所述通道结构的内壁。
  11. 一种无线通信系统，其特征在于，包括如权利要求1～10任一项所述的无线通信装 置，所述光模块组件的光模块本体用于与外部光纤导电连接。
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