WO2023024097A1 - 显示面板及其制作方法、显示装置 - Google Patents

显示面板及其制作方法、显示装置 Download PDF

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Publication number
WO2023024097A1
WO2023024097A1 PCT/CN2021/115116 CN2021115116W WO2023024097A1 WO 2023024097 A1 WO2023024097 A1 WO 2023024097A1 CN 2021115116 W CN2021115116 W CN 2021115116W WO 2023024097 A1 WO2023024097 A1 WO 2023024097A1
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WIPO (PCT)
Prior art keywords
layer
area
display
touch
display panel
Prior art date
Application number
PCT/CN2021/115116
Other languages
English (en)
French (fr)
Inventor
胡宏锦
王畅
张家祥
鞠亮亮
王明强
朱超群
李新
左堃
Original Assignee
京东方科技集团股份有限公司
成都京东方光电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 京东方科技集团股份有限公司, 成都京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to CN202180002308.8A priority Critical patent/CN116034332A/zh
Priority to DE112021008167.5T priority patent/DE112021008167T5/de
Priority to US17/796,117 priority patent/US20240188387A1/en
Priority to PCT/CN2021/115116 priority patent/WO2023024097A1/zh
Publication of WO2023024097A1 publication Critical patent/WO2023024097A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40—OLEDs integrated with touch screens
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/90—Assemblies of multiple devices comprising at least one organic light-emitting element
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/50—Forming devices by joining two substrates together, e.g. lamination techniques

Definitions

  • the present disclosure relates to the field of display technology, and in particular to a display panel, a manufacturing method thereof, and a display device.
  • a touch display panel refers to a panel that integrates a touch function and a display function.
  • the touch display panel includes a touch screen, a polarizing layer attached to the surface of the touch screen, a touch flexible circuit board (Touch Flexible Printed Circuit, flexible circuit board) bound on the surface of the touch screen, and the flexible circuit board and the polarizing layer are arranged at intervals on the surface of the touch screen , the above-mentioned touch display panel structure is also called a polarizer sensor touch (Polarizer Sensor Touch, PST) structure.
  • Embodiments of the present disclosure provide a display panel, a manufacturing method thereof, and a display device, which can solve the short circuit problem of the signal line of the touch layer and improve the stability of the display panel. Described technical scheme is as follows:
  • a display panel is provided, and the display panel includes:
  • a display substrate having a display area, a binding area, and a spacer area between the display area and the binding area;
  • a touch layer located on the surface of the display substrate and continuously disposed on the display area, the spacer area and at least part of the binding area;
  • a polarizing layer located on a side of the touch layer away from the display substrate and disposed in the display area;
  • a flexible circuit board connected to the touch layer in the binding area, and located on the same surface of the touch layer as the polarizing layer;
  • the display panel further includes an adhesive layer located between the polarizing layer and the touch layer, the protective structure includes an adhesive structure integrally formed with the adhesive layer;
  • a covering structure covering the touch layer in the interval area not covered by the adhesive structure.
  • the display panel also includes:
  • Conductive glue located between the flexible circuit board and the touch layer and arranged in the binding area;
  • a leveling layer located on the side of the flexible circuit board in the binding area away from the display substrate;
  • the covering structure is integrally formed with at least one layer of the flexible circuit board, the conductive glue and the leveling layer.
  • the touch layer includes:
  • Welding pads are located in the binding area, and the welding pads are bound to the flexible circuit board through the conductive glue;
  • the conductive glue extends from the binding area to the spacer area, and the covering structure is integrally formed with the conductive glue;
  • the side of the conductive glue and the side of the adhesive structure are connected in the interval area; or, a part of the conductive glue is superimposed on the adhesive structure.
  • the width of the overlapping portion of the conductive glue and the adhesive structure in the first direction ranges from 50nm to 100nm;
  • the first direction is an arrangement direction of the display area, the interval area and the binding area.
  • the flexible circuit board includes a metal layer and an insulating film layer located on the surface of the metal layer, the metal layer is bound to the pad of the touch layer in the binding area, and the insulating film A layer extends from the binding area to the spacer area, the cover structure is integrally formed with the insulating film layer, a portion of the insulating film layer overlies the adhesive structure.
  • the width of the overlapping portion of the insulating film layer and the adhesive structure in the first direction ranges from 50 nm to 100 nm;
  • the first direction is an arrangement direction of the display area, the interval area and the binding area.
  • the distance between the metal layer and the adhesive structure ranges from 50 nm to 100 nm.
  • the filling layer extends from the binding area to the spacer area, the covering structure is integrally formed with the filling layer, and a part of the filling layer is superimposed on the adhesive structure .
  • the width of the overlapping portion of the leveling layer and the adhesive structure in the first direction ranges from 50 nm to 100 nm;
  • the first direction is an arrangement direction of the display area, the interval area and the binding area.
  • a display device including a display panel and a power supply component, the display panel is the display panel described in any one of the foregoing, and the power supply component is used to supply power to the display panel.
  • a method for manufacturing a display panel comprising:
  • a display substrate is provided, the display substrate has a display area, a binding area, and a spacer area between the display area and the binding area;
  • a touch layer is fabricated on the surface of the display substrate, and the touch layer is continuously arranged in the display area, the spacer area and at least part of the binding area;
  • a protective structure covering the touch layer of the spaced area is fabricated in the spaced area.
  • the protection structure includes an adhesive structure and a covering structure
  • the formation of the protection structure covering the touch layer of the separation area in the separation area includes:
  • a covering structure is fabricated on the touch layer not covered by the adhesive structure in the spacer region.
  • the forming a covering structure on the touch layer not covered by the adhesive structure in the interval region includes:
  • the conductive glue and the leveling layer When making at least one layer of the flexible circuit board, the conductive glue and the leveling layer, it is integrally formed with at least one layer of the flexible circuit board, the conductive glue and the leveling layer the covering structure.
  • the touch layer is covered by making a polarizing layer in the display area, the touch layer is covered by making a flexible circuit board in the binding area, and the touch layer is covered by setting a protective structure in the interval area, so that The entire touch layer has no exposed part, avoiding the corrosion of the exposed touch layer by iodine and water vapor in the polarizing layer, solving the short circuit problem of the signal line of the touch layer, and improving the stability of the display panel.
  • FIG. 1 is a schematic diagram of a corroded signal line structure in the related art
  • Fig. 2 is a schematic structural diagram of a display panel provided by some embodiments of the present disclosure.
  • Fig. 3 is a top view of a display panel provided by some embodiments of the present disclosure.
  • FIG. 4 is a schematic structural diagram of a signal line of a display panel provided by some embodiments of the present disclosure after an environmental reliability test;
  • Fig. 5 is a schematic structural diagram of a display panel provided by some embodiments of the present disclosure.
  • Fig. 6 is a schematic structural diagram of a touch layer provided by some embodiments of the present disclosure.
  • Fig. 7 is a schematic structural diagram of a display panel provided by some embodiments of the present disclosure.
  • Fig. 8 is a schematic structural diagram of a display panel provided by some embodiments of the present disclosure.
  • Fig. 9 is a schematic structural diagram of a display panel provided by some embodiments of the present disclosure.
  • Fig. 10 is a schematic structural diagram of a display panel provided by some embodiments of the present disclosure.
  • Fig. 11 is a schematic structural diagram of a display panel provided by some embodiments of the present disclosure.
  • Fig. 12 is a schematic structural diagram of a display panel provided by some embodiments of the present disclosure.
  • Fig. 13 is a schematic structural diagram of a display panel provided by some embodiments of the present disclosure.
  • Fig. 14 is a top view of a display panel provided by some embodiments of the present disclosure.
  • Fig. 15 is a schematic structural diagram of a display panel provided by some embodiments of the present disclosure.
  • Fig. 16 is a schematic structural diagram of a display device provided by some embodiments of the present disclosure.
  • Fig. 17 is a flow chart of a method for manufacturing a display panel provided by some embodiments of the present disclosure.
  • Fig. 18 is a flowchart of a method for manufacturing a display panel provided by some embodiments of the present disclosure.
  • Fig. 19 is a schematic structural diagram of a display panel during the manufacturing process provided by some embodiments of the present disclosure.
  • Fig. 20 is a schematic structural diagram of a display panel during the manufacturing process provided by some embodiments of the present disclosure.
  • Fig. 21 is a schematic structural diagram of a display panel during the manufacturing process provided by some embodiments of the present disclosure.
  • the signal wires are generally metal signal wires, such as copper signal wires.
  • the polarizing layer contains iodine element, which is precipitated by water in the environmental reliability test, such as high temperature and high humidity (85°C temperature, 85% humidity), and then corrodes the exposed copper signal line together with water vapor.
  • Fig. 1 is a schematic diagram of the corroded structure of the signal line in the related art. Referring to Fig. 1, three adjacent signal lines Rx1, Rx2 and Rx3 are all corroded, and the corrosion substance Y is scattered to the space between the adjacent signal lines (such as Rx1 and Rx2).
  • FIG. 2 is a display panel provided by some embodiments of the present disclosure.
  • the display panel includes: a display substrate 14 , a touch layer 15 , a polarizer (Polarizer, POL) 20 , a flexible circuit board 30 and a protection structure 40 .
  • Fig. 3 is a top view of a display panel provided by some embodiments of the present disclosure. 2 and 3, the display substrate 14 has a display area 11, a bonding area (Bonding Area) 12, and a spacer area 13 between the display area 11 and the bonding area 12.
  • the touch layer 15 is located on the surface of the display substrate 14 and is continuously arranged on the display area 11, the spacer area 13 and at least part of the binding area 12, and the polarizing layer 20 is located on the touch panel of the display area 11.
  • the layer 15 is away from the side of the display substrate 14, the flexible circuit board 30 is connected to the touch layer 15 of the binding area 12, and is located on the same surface of the touch layer 15 as the polarizing layer 20, and the protective structure 40
  • the touch layer 15 covering the interval area 13 .
  • the flexible circuit board 30 and the polarizing layer 20 are located on the same surface of the touch layer 15, including the direct contact between the flexible circuit board 30 and the polarizing layer 20 and the surface of the touch layer 15, and also including the flexible circuit board 30 and the polarizing layer 20 being in contact with the surface of the touch layer 15.
  • the surface of the touch layer 15 is in indirect contact.
  • the protective structure 40 covers the touch layer 15 located in the space area 13, and does not necessarily need to completely cover the entire space area 13, but only needs to cover the metal part of the touch layer 15 in the space area 13. .
  • a polarizing layer is made on the entire surface of the display substrate 14, but in order to make the flexible circuit board 30, an opening will be made on the polarizing layer, and the area corresponding to the opening is the aforementioned spacing area 13 and binding area 12, so the spacing area 13 and binding area
  • the fixed area 12 can be called the opening area (Open Cutting Area) together, and the interval area 13 is also called the contact area (Contact Area).
  • the touch screen is usually composed of a display substrate and a touch substrate.
  • the touch substrate may be an add-on touch substrate.
  • the display substrate may be realized by using an organic light-emitting diode (Organic Light-Emitting Diode, OLED) display substrate.
  • OLED Organic Light-Emitting Diode
  • the touch control substrate includes the aforementioned touch layer. That is, the aforementioned display substrate 14 and touch layer 15 constitute the touch screen 10 .
  • the structure provided by the embodiments of the present disclosure in which the polarizing layer is pasted on the external touch substrate may also be referred to as a polarizing layer sensor touch (POL Sensor Touch, PST) structure.
  • POL Sensor Touch PST
  • the polarizing layer 20 is a sandwich structure consisting of two layers of triacetyl cellulose (Triacetyl Cellulose, TAC) and a layer of polyvinyl alcohol (Polyvinyl Alcohol, PVA) sandwiched in the middle, wherein the PVA material contains a large amount of iodine element, Allows linearly polarized light in a single direction to pass through.
  • the iodine element in the PVA material is precipitated by water in the state of high temperature and high humidity (such as 8585 (85°C temperature, 85% humidity) environmental reliability test), if it contacts with the touch layer metal of the touch substrate, such as copper metal, it will produce Redox reaction and formation of copper iodide.
  • the structure of the touch layer is a plurality of signal lines arranged at intervals, that is, touch traces (Trace), and the aforementioned oxidation-reduction reaction will cause a short circuit between adjacent signal lines.
  • the flexible circuit board 30 refers to a flexible circuit board bound on a touch substrate, that is, a touch flexible printed circuit (Touch Flexible Printed Circuit, TFPC).
  • TFPC Touch Flexible Printed Circuit
  • the touch layer is covered by making a polarizing layer in the display area, the touch layer is covered by making a flexible circuit board in the binding area, and the touch layer is covered by setting a protective structure in the interval area, so that The entire touch layer has no exposed part, avoiding the corrosion of the exposed touch layer by iodine and water vapor in the polarizing layer, solving the short circuit problem of the signal line of the touch layer, and improving the stability of the display panel.
  • Fig. 4 is a schematic structural diagram of the signal lines of the display panel provided by the embodiment of the present disclosure after the environmental reliability test. Referring to Fig. Corroded, insulation between adjacent signal lines (such as Rx1 and Rx2) is maintained, avoiding short circuit problems. Compared with the related technology shown in FIG. 1 , the short circuit problem of the signal line of the touch layer is solved, and the stability of the display panel is improved.
  • Fig. 5 is a schematic structural diagram of a display panel provided by some embodiments of the present disclosure.
  • the display panel further includes an adhesive layer 50 between the polarizing layer 20 and the touch layer 15;
  • the protective structure 40 includes an adhesive structure 41 and a covering structure 42 .
  • the adhesive structure 41 is integrally formed with the adhesive layer 50 .
  • the adhesive structure 41 is a part extending from the display area 11 to the spacer area 13 when the adhesive layer 50 is manufactured.
  • the covering structure 42 covers the area in the spacing area 13 not covered by the adhesive structure 41 .
  • the part of the touch layer in the interval area 13 is covered by the adhesive structure, and there is a certain gap between the adhesive structure and the flexible circuit board, and the touch layer in the gap is covered by the covering structure 42, which overcomes the manufacturing process. Insufficient on.
  • the adhesive layer 50 is a thermoplastic-optical clear film (Thermoplastic-Optical Clear Film, OCF) layer, which is a protective layer on the touch layer, and plays the role of bonding the touch screen and the polarizing layer at the same time.
  • OCF thermoplastic-optical Clear Film
  • the covering structure 42 can be realized by extending the flexible circuit board and its related film layers to the spaced area, or a new layer can be made on the basis of the flexible circuit board and its related film layers as the covering structure. The following two situations are described separately:
  • One feasible implementation is to implement the covering structure by extending the flexible circuit board and its related film layers to the spacer area.
  • the film layer related to the flexible circuit board includes a conductive adhesive and a leveling layer.
  • the conductive glue is located between the flexible circuit board 30 and the touch layer 15 and is arranged in the binding area 12 to realize the binding of the flexible circuit board and the touch layer;
  • the side of the flexible circuit board 30 in the binding area 12 away from the display substrate 14 is used to fill up the height difference (level difference) between the surface of the flexible circuit board and the surface of the polarizing layer.
  • the conductive adhesive is anisotropic conductive film (Anisotropic Conductive Film, ACF), and the conductive film is a bonding layer containing conductive particles. Under high temperature and pressure, the conductive particles are broken to expose the conductive particles, and the flexible circuit The panel and the display substrate conduct and are electrically connected when energized.
  • the leveling layer is a space film (Space Film, SF), such as a film made of plastic, foam and other materials.
  • Fig. 6 is a schematic structural diagram of a touch layer provided by some embodiments of the present disclosure.
  • the touch layer 15 includes: touch electrodes 141 , pads 142 , and signal lines 143 connecting the touch electrodes 141 and the pads 142 .
  • the touch electrode 141 is located in the display area 11, the pad 142 is located in the binding area 12, the pad 142 is bound to the flexible circuit board 30 through the conductive glue 60, and the signal line 143 is located in the bonding area 12. Part of the spacer region 13 is covered by the protective structure 40 .
  • touch electrodes 141 shown in FIG. 6 are strip-shaped electrodes, and in other embodiments, the touch electrodes 141 may also use electrodes of other shapes, such as block electrodes.
  • the numbers of touch electrodes, signal lines and pads in the figure are only examples, and are not limitations of the present disclosure.
  • the covering structure 42 is integrally formed with at least one layer of the flexible circuit board 30 , the conductive adhesive 60 and the leveling layer 70 .
  • the covering structure 42 is a part extending from the bonding area 12 to the spacer area 13 when at least one layer of the flexible circuit board 30 , the conductive glue 60 and the leveling layer 70 is fabricated.
  • the covering structure 42 is integrally formed with the conductive adhesive 60 , that is, the covering structure 42 is a part of the conductive adhesive 60 extending from the binding area 12 to the spacing area 13 .
  • the covering structure 42 is integrally formed with the conductive adhesive 60 , that is, the covering structure 42 is a part of the conductive adhesive 60 extending from the binding area 12 to the spacing area 13 .
  • Fig. 7 is a schematic structural diagram of a display panel provided by some embodiments of the present disclosure.
  • the conductive glue 60 extends from the bonding area 12 to the spacer area 13 , and the sides of the conductive glue 60 and the sides of the adhesive structure 41 meet in the spacer area 13 , so as to completely cover the touch layer in the spaced area.
  • Fig. 8 is a schematic structural diagram of a display panel provided by some embodiments of the present disclosure.
  • the conductive glue 60 extends from the binding area 12 to the spacer area 13, the difference from FIG. 7 is only that a part of the conductive glue 60 is superimposed on the adhesive structure 41, so that Completely cover the touch layer in the spacer area.
  • the width B of the overlapping portion of the conductive glue 60 and the adhesive structure 41 in the first direction A ranges from 50 nm to 100 nm.
  • the first direction is an arrangement direction of the display area 11 , the separation area 13 and the binding area 12 .
  • the width B is 50 nm.
  • the touch layer in the space area is covered by the conductive glue extending to the space area, so as to prevent the touch layer from being exposed to the outside and being corroded.
  • the above functions are realized by using conductive adhesive.
  • a part of the conductive adhesive covers the part of the touch layer in the binding area.
  • a part of the conductive adhesive refers to the part used to connect the touch layer and the flexible circuit board, and the conductive adhesive This part is located in the binding area and is adjacent to the spacer area. In the two directions parallel and perpendicular to the surface of the touch layer, the distance between the conductive adhesive and the touch layer in the spacer area to be covered is relatively close.
  • the conductive adhesive has good adhesiveness, and when covered on the touch layer, it can completely seal the touch layer, and can overlap with the adhesive structure located in the spacer area, so as to realize the complete seal of the touch layer.
  • the conductive glue 60 can also be located only in the binding area 12, and not extend to the spacer area 13.
  • the touch layer is covered by at least one of the aforementioned flexible circuit board and leveling layer. Finish.
  • the covering structure 42 is integrally formed with the flexible circuit board 30 , that is, the covering structure 42 is a part of the flexible circuit board 30 extending from the binding area 12 to the spacer area 13 .
  • the covering structure 42 is integrally formed with the flexible circuit board 30 , that is, the covering structure 42 is a part of the flexible circuit board 30 extending from the binding area 12 to the spacer area 13 .
  • Fig. 9 is a schematic structural diagram of a display panel provided by some embodiments of the present disclosure.
  • the flexible circuit board 30 includes a metal layer 31 and an insulating film layer 32 located on the surface of the metal layer 31 , the metal layer 31 is bonded to the pad of the touch layer 15 in the bonding area 12 , the insulating film layer 32 extends from the bonding area 12 to the spacer area 13, a part of the insulating film layer 32 is superimposed on the adhesive structure 41, thereby completely covering the touch layer of the spacer area live.
  • the width C of the overlapping portion of the insulating film layer 32 and the adhesive structure 41 in the first direction A ranges from 50 nm to 100 nm.
  • the width C is 50 nm.
  • the distance D between the metal layer 31 and the adhesive structure 41 ranges from 50 nm to 100 nm.
  • the distance D is 50 nm.
  • the TPFC 30 also includes an ink layer 33, the ink layer 33 is located on the side of the metal layer 31 facing away from the insulating film layer 32, and the ink layer 33 is located outside the touch screen 10.
  • the ink layer 33 is located on the side of the metal layer 31 facing away from the insulating film layer 32, and the ink layer 33 is located outside the touch screen 10.
  • the metal layer 31 is a copper (Cu) metal layer.
  • the insulating film layer 32 is a polyimide film (Polyimide, PI) layer.
  • the covering structure 42 is integrally formed with the leveling layer 70 , that is, the covering structure 42 is a part of the leveling layer 70 extending from the binding area 12 to the spacer area 13 .
  • the covering structure 42 is integrally formed with the leveling layer 70 , that is, the covering structure 42 is a part of the leveling layer 70 extending from the binding area 12 to the spacer area 13 .
  • Fig. 10 is a schematic structural diagram of a display panel provided by some embodiments of the present disclosure.
  • the filling layer 70 extends from the binding area 12 to the spacer area 13, and a part of the filling layer 70 is superimposed on the adhesive structure 41, so that the touch of the spacer area layer completely covered.
  • the width E of the overlapping portion of the leveling layer 70 and the adhesive structure 41 in the first direction A ranges from 50 nm to 100 nm.
  • the width E is 50 nm.
  • the distance F between the leveling layer 70 and the polarizing layer 20 ranges from 50 nm to 100 nm.
  • the spacing F is 100 nm.
  • FIG. 7 to FIG. 10 show that the touch layer coverage is realized by one film layer.
  • multiple film layers can also be used to simultaneously realize the touch layer coverage.
  • Other exemplary structures of the covering structure 42 are described below in conjunction with accompanying drawings 11 to 14 :
  • Fig. 11 is a schematic structural diagram of a display panel provided by some embodiments of the present disclosure.
  • the insulating film layer 32 and the leveling layer 70 of the flexible circuit board 30 extend to the spaced area 13 at the same time, so as to cover the touch layer of the spaced area.
  • Fig. 12 is a schematic structural diagram of a display panel provided by some embodiments of the present disclosure.
  • the conductive glue 60 , the insulating film layer 32 of the flexible circuit board 30 and the leveling layer 70 extend to the spaced area 13 at the same time, so as to cover the touch layer in the spaced area.
  • the width of the conductive glue 60 , the insulating film layer 32 and the leveling layer 70 in the spacing region 13 is 100 nm.
  • Fig. 13 is a schematic structural diagram of a display panel provided by some embodiments of the present disclosure.
  • the conductive adhesive 60, the insulating film layer 32 of the flexible circuit board 30 and the leveling layer 70 extend to the spacer area 13 at the same time, the only difference from Fig. 12 is that the conductive adhesive 60 does not cover the adhesive structure 41 in Fig. 13, realizing The touch layer of the spaced area covers the adhesive structure 41 , but only adheres to the side of the adhesive structure 41 .
  • Fig. 14 is a top view of the display panel shown in Fig. 13, referring to Fig. 14, the boundary of the adhesive structure 41 coincides with the boundary of the conductive adhesive 60, and the insulating film layer 32, the leveling layer 70 and the adhesive structure 41 overlap, that is, insulation The film layer 32 and the leveling layer 70 simultaneously extend onto the adhesive structure 41 .
  • the width of the conductive glue 60 in the space area 13 is 50 nm, and the width of the insulating film layer 32 and the leveling layer 70 in the space area 13 is 100 nm.
  • the material of the insulating film layer is transparent, soft and does not contain corrosive elements; the leveling layer 70 has a relatively large thickness, which not only plays a role of sealing, but also can play the role of pressing down the insulating film layer so that it can be attached to the adhesive structure due to its heavy weight. .
  • the leveling layer 70 can also protect the interval area from physical damage in this area caused by the impact of external force.
  • Another feasible implementation solution is to make a new layer on the basis of the flexible circuit board and its related film layers as a covering structure.
  • Fig. 15 is a schematic structural diagram of a display panel provided by some embodiments of the present disclosure. Referring to FIG. 15 , neither the insulating film layer 32 nor the leveling layer 70 of the flexible circuit board 30 extends to the spacer region 13 , and there is a covering structure 42 above the leveling layer 70 and the polarizing layer 20 , and the covering structure 42 extends to The spacing area 13 realizes the coverage of the touch layer in the spacing area.
  • the covering structure is made of organic or inorganic transparent materials.
  • the first solution has fewer process steps than the second solution, and can solve the problem of short circuit of the signal line of the touch layer in the related art without adding new materials and new processes; and the entire display
  • the thickness of the panel is smaller, which is conducive to realizing thinner and lighter display panels.
  • the display panel further includes a transparent cover plate located on the polarizing layer and the leveling layer, and the transparent cover plate is used to realize packaging of the display panel.
  • the transparent cover is a glass cover.
  • An embodiment of the present disclosure also provides a display device, which includes any one of the above display panels and a power supply component, where the power supply component is used to supply power to the display panel.
  • the display device in the embodiments of the present disclosure may be any product or component with a display function such as a mobile phone, a tablet computer, a television, a monitor, a notebook computer, a digital photo frame, a navigator, a wearable device, and the like.
  • FIG. 16 is a schematic structural diagram of a display device provided by some embodiments of the present disclosure.
  • the display device includes any one of the above-mentioned display panels, and the display area of the display panel includes sub-pixel regions Px arranged in rows and columns. Each of the data lines in the above display area can be between two adjacent columns of sub-pixel regions Px, so as to transmit the connected data signal or test signal to each sub-pixel region Px.
  • the touch layer is covered by making a polarizing layer in the display area, the touch layer is covered by making a flexible circuit board in the binding area, and the touch layer is covered by setting a protective structure in the interval area, so that The entire touch layer has no exposed part, avoiding the corrosion of the exposed touch layer by iodine and water vapor in the polarizing layer, solving the short circuit problem of the signal line of the touch layer, and improving the stability of the display panel.
  • Fig. 17 is a flowchart of a method for manufacturing a display panel provided by some embodiments of the present disclosure. Referring to Figure 17, the method includes:
  • the display substrate has a display area, a binding area, and a spacer area between the display area and the binding area.
  • a polarizing layer is pasted on a side of the touch layer in the display area away from the display substrate.
  • step 1403 and step 1402 may not have a sequential relationship, that is, step 1403 and step 1402 are performed simultaneously. Or there is a sequence relationship between step 1403 and step 1402, that is, step 1403 is performed after step 1402.
  • the touch layer is covered by making a polarizing layer in the display area, the touch layer is covered by making a flexible circuit board in the binding area, and the touch layer is covered by setting a protective structure in the interval area, so that The entire touch layer has no exposed part, avoiding the corrosion of the exposed touch layer by iodine and water vapor in the polarizing layer, solving the short circuit problem of the signal line of the touch layer, and improving the stability of the display panel.
  • the protection structure includes an adhesive structure and a covering structure, and a protection structure covering the touch layer of the separation area is fabricated in the separation area, including:
  • an integrally formed adhesive layer and an adhesive structure are formed on the touch layer; here the adhesive layer is used to protect the touch layer and realize bonding of the polarizing layer and the touch screen.
  • a covering structure is fabricated on the touch layer not covered by the adhesive structure in the spacer region.
  • the making a covering structure on the touch layer not covered by the adhesive structure in the interval area includes:
  • the conductive glue and the leveling layer When making at least one layer of the flexible circuit board, the conductive glue and the leveling layer, it is integrally formed with at least one layer of the flexible circuit board, the conductive glue and the leveling layer the covering structure.
  • the covering structure is realized by the flexible circuit board and related film layers.
  • the flexible circuit board and related film layers When making the flexible circuit board and related film layers, let it extend from the binding area to the spacer area, and at this time it is located in the spacer area
  • the part that covers the touch layer, that is, the aforementioned covering structure is realized by the flexible circuit board and related film layers.
  • Fig. 18 is a flowchart of a method for manufacturing a display panel provided by some embodiments of the present disclosure. Referring to Figure 18, the method includes:
  • the display substrate has a display area, a binding area, and a spacer area between the display area and the binding area.
  • the display substrate and the touch layer located on the surface of the display substrate form a touch screen.
  • a layer of adhesive layer 50 is coated on the touch layer 15 , and then the polarizing layer 20 is pasted through the adhesive layer 50 .
  • part of the adhesive layer 50 extends from the display area 11 into the spacer area 13 , that is, the adhesive structure 41 .
  • a conductive glue 60 is pasted on the touch layer 15 of the binding area 12 and the spacer area 13 , the conductive glue covers the binding area 12 and the spacer area 13 , and the sides of the conductive glue 60 and the The sides of the adhesive structure 41 meet in the spacer region 13 .
  • the portion of the conductive glue 60 located in the spacer region 13 belongs to the covering structure.
  • the flexible circuit board 30 is bound on the touch screen through conductive glue 60 .
  • the flexible circuit board 30 includes a metal layer 31 and an insulating film layer 32 located on the surface of the metal layer 31, the metal layer 31 is bound to the pad of the touch layer 15 in the bonding area 12, and the insulating film layer 32 extends from the binding area 12 to the spacing area 13, and a part of the insulating film layer 32 is superimposed on the adhesive structure 41, so as to completely cover the touch layer in the spacing area.
  • the part of the insulating film layer 32 located in the spacer region 13 belongs to the covering structure.
  • a leveling layer 70 is pasted on the flexible circuit board 30 .
  • the leveling layer 70 extends from the binding area 12 to the spacer area 13 , and a part of the leveling layer 70 is superimposed on the adhesive structure 41 , so as to completely cover the touch layer in the spacer area.
  • the portion of the leveling layer 70 located in the spacer region 13 belongs to the covering structure.
  • the width of the conductive glue 60 in the space area 13 is 50 nm, and the width of the insulating film layer 32 and the leveling layer 70 in the space area 13 is 100 nm.
  • three film layers are used to cover the originally exposed touch layer in the interval area, and multiple seals are made, so as to realize a fully enclosed design for the touch layer, thereby avoiding iodine and Water vapor corrodes the touch layer.
  • the attachment accuracy of the conductive adhesive is less than the binding accuracy of the flexible circuit board, when the conductive adhesive attachment process deviates and fails to completely cover the touch layer according to the theoretical design, the upper flexible circuit board and the leveling layer The sealing of the touch layer can still be guaranteed.
  • the material of the insulating film layer is transparent, soft and does not contain corrosive elements; the leveling layer 70 has a relatively large thickness, which not only plays a role of sealing, but also can play the role of pressing down the insulating film layer so that it can be attached to the adhesive structure due to its heavy weight. .
  • the leveling layer 70 can also protect the interval area from physical damage in this area caused by the impact of external force.

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Abstract

本公开提供了一种显示面板及其制作方法、显示装置，属于显示技术领域。所述显示面板包括：显示基板，具有显示区域、绑定区域、以及位于显示区域与绑定区域之间的间隔区域；触控层，位于显示基板表面且连续设置于显示区域、间隔区域及至少部分绑定区域；偏光层，位于所述触控层远离所述显示基板一侧且设置于所述显示区域；柔性电路板，与绑定区域的触控层连接，且与偏光层位于触控层的同一表面；保护结构，覆盖间隔区域的触控层。在间隔区域通过设置保护结构来覆盖触控层，从而使得整个触控层没有裸露在外的部分，避免了触控层被腐蚀，解决了触控层的信号线短路问题。

Description

显示面板及其制作方法、显示装置 技术领域
本公开涉及显示技术领域，特别涉及一种显示面板及其制作方法、显示装置。
背景技术
触摸式显示面板是指集成了触控功能和显示功能的面板。触摸式显示面板包括触摸屏、贴附在触摸屏表面的偏光层、绑定在触摸屏表面的触控柔性电路板(Touch Flexible Printed Circuit，柔性电路板)，柔性电路板和偏光层在触摸屏的表面间隔布置，上述这种触摸式显示面板结构也称为偏光层传感器触控(Polarizer Sensor Touch，PST)结构。
由于工艺限制，触摸屏和柔性电路板绑定之后，触摸屏的触控层的信号线一部分裸露在外，容易发生短路。
发明内容
本公开实施例提供了一种显示面板及其制作方法、显示装置，能够解决触控层的信号线短路问题，提高显示面板的稳定性。所述技术方案如下：
一方面，提供了一种显示面板，所述显示面板包括：
显示基板，具有显示区域、绑定区域、以及位于所述显示区域与所述绑定区域之间的间隔区域；
触控层，位于所述显示基板表面且连续设置于所述显示区域、所述间隔区域及至少部分所述绑定区域；
偏光层，位于所述触控层远离所述显示基板一侧且设置于所述显示区域；
柔性电路板，与所述绑定区域的所述触控层连接，且与所述偏光层位于所述触控层的同一表面；
保护结构，覆盖所述间隔区域的所述触控层。
可选地，所述显示面板还包括位于所述偏光层和所述触控层之间的粘性层，所述保护结构包括粘性结构，所述粘性结构与所述粘性层一体成型；
覆盖结构，覆盖所述间隔区域内未被所述粘性结构覆盖的触控层。
可选地，所述显示面板还包括：
导电胶，位于所述柔性电路板和所述触控层之间且设置于所述绑定区域；
填平层，位于所述绑定区域的所述柔性电路板远离所述显示基板一侧；
所述覆盖结构与所述柔性电路板、所述导电胶和所述填平层中的至少一层一体成型。
可选地，所述触控层包括：
触控电极，位于所述显示区域；
焊盘，位于所述绑定区域，所述焊盘通过所述导电胶与所述柔性电路板绑定；
以及信号线，至少部分位于所述间隔区域，以连接所述触控电极和所述焊盘的，且所述间隔区域的所述信号线被所述保护结构覆盖。
可选地，所述导电胶从所述绑定区域延伸到所述间隔区域，所述覆盖结构与所述导电胶一体成型；
所述导电胶的侧边和所述粘性结构的侧边在所述间隔区域内相接；或者，所述导电胶的一部分叠置于所述粘性结构上。
可选地，所述导电胶和所述粘性结构的重叠部分在第一方向上的宽度的取值范围为50nm至100nm；
其中，所述第一方向为所述显示区域、所述间隔区域和所述绑定区域的排布方向。
可选地，所述柔性电路板包括金属层和位于所述金属层表面的绝缘薄膜层，所述金属层在所述绑定区域与所述触控层的焊盘绑定，所述绝缘薄膜层从所述绑定区域延伸到所述间隔区域，所述覆盖结构与所述绝缘薄膜层一体成型，所述绝缘薄膜层的一部分叠置于所述粘性结构上。
可选地，所述绝缘薄膜层和所述粘性结构的重叠部分在第一方向上的宽度的取值范围为50nm至100nm；
其中，所述第一方向为所述显示区域、所述间隔区域和所述绑定区域的排布方向。
可选地，在所述第一方向上，所述金属层和所述粘性结构的间距的取值范围为50nm至100nm。
可选地，所述填平层从所述绑定区域延伸到所述间隔区域，所述覆盖结构 与所述填平层一体成型，所述填平层的一部分叠置于所述粘性结构上。
可选地，所述填平层和所述粘性结构重叠部分在第一方向上的宽度的取值范围为50nm至100nm；
其中，所述第一方向为所述显示区域、所述间隔区域和所述绑定区域的排布方向。
另一方面，提供了一种显示装置，包括显示面板和供电组件，所述显示面板为前述任一项所述的显示面板，所述供电组件用于为所述显示面板供电。
另一方面，提供一种显示面板制作方法，所述方法包括：
提供一显示基板，所述显示基板具有显示区域、绑定区域、以及位于所述显示区域与所述绑定区域之间的间隔区域；
在所示显示基板的表面制作触控层，所述触控层连续设置于所述显示区域、所述间隔区域及至少部分所述绑定区域；
在所述显示区域的所述触控层远离所述显示基板一侧制作偏光层，并在所述绑定区域的所述触控层制作柔性电路板；
在所述间隔区域制作覆盖所述间隔区域的触控层的保护结构。
可选地，所述保护结构包括粘性结构和覆盖结构，所述在所述间隔区域制作覆盖所述间隔区域的触控层的保护结构，包括：
在制作所述偏光层之前，在所述触控层上制作一体成型的粘性层和粘性结构；
在所述间隔区域内未被所述粘性结构覆盖的触控层上制作覆盖结构。
可选地，所述在所述间隔区域内未被所述粘性结构覆盖的触控层上制作覆盖结构，包括：
在制作所述柔性电路板之前，在所述绑定区域的所述触控层上制作一层导电胶；
在制作所述柔性电路板之后，在所述绑定区域的所述柔性电路板上制作一层填平层；
在制作所述柔性电路板、所述导电胶和所述填平层中的至少一层时，制作与所述柔性电路板、所述导电胶和所述填平层中的至少一层一体成型的覆盖结构。
本公开实施例提供的技术方案带来的有益效果是：
在本公开实施例中，在显示区域通过制作偏光层来覆盖触控层，在绑定区域通过制作柔性电路板来覆盖触控层，在间隔区域通过设置保护结构来覆盖触控层，从而使得整个触控层没有裸露在外的部分，避免了偏光层中的碘和水汽一起对裸露的触控层造成腐蚀，解决了触控层的信号线短路问题，提高显示面板的稳定性。
附图说明
为了更清楚地说明本公开实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本公开的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是相关技术中信号线被腐蚀的结构示意图；
图2是本公开一些实施例提供的一种显示面板的结构示意图；
图3是本公开一些实施例提供的一种显示面板的俯视图；
图4是本公开一些实施例提供的显示面板经过环境信赖性试验后信号线的结构示意图；
图5是本公开一些实施例提供的一种显示面板的结构示意图；
图6是本公开一些实施例提供的一种触控层的结构示意图；
图7是本公开一些实施例提供的一种显示面板的结构示意图；
图8是本公开一些实施例提供的一种显示面板的结构示意图；
图9是本公开一些实施例提供的一种显示面板的结构示意图；
图10是本公开一些实施例提供的一种显示面板的结构示意图；
图11是本公开一些实施例提供的一种显示面板的结构示意图；
图12是本公开一些实施例提供的一种显示面板的结构示意图；
图13是本公开一些实施例提供的一种显示面板的结构示意图；
图14是本公开一些实施例提供的一种显示面板的俯视图；
图15是本公开一些实施例提供的一种显示面板的结构示意图；
图16是本公开一些实施例提供的一种显示装置的结构示意图；
图17是本公开一些实施例提供的一种显示面板制作方法的流程图；
图18是本公开一些实施例提供的一种显示面板制作方法的流程图；
图19是本公开一些实施例提供的显示面板在制作过程中的结构示意图；
图20是本公开一些实施例提供的显示面板在制作过程中的结构示意图；
图21是本公开一些实施例提供的显示面板在制作过程中的结构示意图。
具体实施方式
为使本公开的目的、技术方案和优点更加清楚，下面将结合附图对本公开实施方式作进一步地详细描述。
相关技术中，触摸屏的触控层的信号线一部分裸露在外。信号线一般为金属信号线，例如铜信号线。偏光层中含有碘元素，碘元素在环境信赖性试验，例如高温高湿(85℃温度、85％湿度)状态被水析出，然后和水汽一起对裸露的铜信号线造成腐蚀。图1是相关技术中信号线被腐蚀的结构示意图，参见图1，三根相邻信号线Rx1、Rx2和Rx3均被腐蚀，腐蚀物质Y散落到相邻信号线(例如Rx1和Rx2)之间的区域，造成相邻的信号线(例如Rx1和Rx2)搭接，从而使得触控层的信号线发生短路。需要说明的是，偏光层中含有碘元素在常规环境下也会析出对信号线造成腐蚀，只是速度更慢。
图2是本公开一些实施例提供的一种显示面板，所述显示面板包括：显示基板14、触控层15、偏光层(Polarizer，POL)20、柔性电路板30和保护结构40。图3是本公开一些实施例提供的一种显示面板的俯视图。参见图2和图3，显示基板14具有显示区域11、绑定区域(Bonding Area)12、以及位于所述显示区域11与所述绑定区域12之间的间隔区域13。
触控层15位于所述显示基板14表面且连续设置于所述显示区域11、所述间隔区域13及至少部分所述绑定区域12，偏光层20位于所述显示区域11的所述触控层15远离所述显示基板14一侧，柔性电路板30与所述绑定区域12的触控层15连接，且与所述偏光层20位于所述触控层15的同一表面，保护结构40覆盖所述间隔区域13的触控层15。
其中，柔性电路板30和偏光层20位于触控层15的同一表面，既包括柔性电路板30和偏光层20与触控层15的表面直接接触，也包括柔性电路板30和偏光层20与触控层15的表面间接接触。
需要说明的是，保护结构40覆盖位于所述间隔区域13的触控层15，并不 一定需要完全覆盖整个间隔区域13，而是将间隔区域13中的触控层15的金属部分覆盖即可。
通常，显示基板14整面制作偏光层，但为了制作柔性电路板30，会在偏光层上开口，而该开口对应的区域即为前述间隔区域13和绑定区域12，因此间隔区域13和绑定区域12合起来又可以称为开口区域(Open Cutting Area)，间隔区域13又称为接触区域(Contact Area)。
其中，触摸屏通常由显示基板加上触控基板组合而成，在本公开实施例中触控基板可以是外挂式触控基板。显示基板可以采用有机发光二极管(Organic Light-Emitting Diode，OLED)显示基板实现。该触控基板中包括前述触控层。也即，前述显示基板14和触控层15构成触摸屏10。
本公开实施例所提供的将偏光层贴合在外挂式触摸基板上的结构也可以称为偏光层传感器触控(POL Sensor Touch，PST)结构。
其中，偏光层20为三明治结构，由两层三醋酸纤维素(Triacetyl Cellulose，TAC)以及夹设在中间的一层聚乙烯醇(Polyvinyl Alcohol，PVA)构成，其中PVA材料中含有大量碘元素，使得单一方向的线偏振光通过。PVA材料中的碘元素在高温高湿(例如8585(85℃温度、85％湿度)环境信赖性试验)状态被水析出，如果和触控基板的触控层金属，例如铜金属接触，会产生氧化还原反应并生成碘化铜。在间隔区域，触控层的结构为多根间隔排布的信号线，也即触控走线(Trace)，前述氧化还原反应会导致相邻信号线短路。
其中，柔性电路板30是指绑定在触控基板上的柔性电路板，也即触控柔性电路板(Touch Flexible Printed Circuit，TFPC)。
在本公开实施例中，在显示区域通过制作偏光层来覆盖触控层，在绑定区域通过制作柔性电路板来覆盖触控层，在间隔区域通过设置保护结构来覆盖触控层，从而使得整个触控层没有裸露在外的部分，避免了偏光层中的碘和水汽一起对裸露的触控层造成腐蚀，解决了触控层的信号线短路问题，提高显示面板的稳定性。
对本公开实施例提供的显示面板进行环境信赖性试验，腐蚀不良造成的短路明显得到改善。图4是本公开实施例提供的显示面板经过环境信赖性试验后信号线的结构示意图，参见图4，本公开实施例显示面板经过环境信赖性试验后，信号线(Rx1、Rx2、Rx3)没有被腐蚀，相邻信号线(例如Rx1和Rx2)之间保持绝缘，避免了短路问题。与图1所示的相关技术相比，解决了触控层的信 号线短路问题，提高显示面板的稳定性。
图5是本公开一些实施例提供的一种显示面板的结构示意图。参见图5，所述显示面板还包括位于所述偏光层20和所述触控层15之间的粘性层50；
该保护结构40包括粘性结构41和覆盖结构42。
粘性结构41与所述粘性层50一体成型。在本公开实施例中，粘性结构41是粘性层50制作时从显示区域11延伸到间隔区域13的部分。
覆盖结构42覆盖所述间隔区域13内未被所述粘性结构41覆盖的区域。
在本公开实施例中，间隔区域13的触控层的部分被粘性结构覆盖，粘性结构和柔性电路板之间存在一定间隙，该间隙处的触控层采用覆盖结构42覆盖，克服了制作工艺上的不足。
示例性地，粘性层50为热可塑性光学胶膜(Thermoplastic-Optical Clear Film，OCF)层，是触控层上的一层保护层，同时起到粘接触摸屏和偏光层的作用。
图5中仅示出了覆盖结构42的一部分，也即位于中间层的部分。而实际制作过程中，覆盖结构42可以利用柔性电路板及其相关膜层延伸到间隔区域来实现，或者在柔性电路板及其相关膜层的基础上重新制作一层作为覆盖结构。下面分两种情况分别说明：
一种可行的实施方案是，利用柔性电路板及其相关膜层延伸到间隔区域来实现覆盖结构。
在本公开实施例中，柔性电路板相关膜层包括导电胶和填平层。
其中，导电胶位于所述柔性电路板30和所述触控层15之间且设置于所述绑定区域12，用来实现柔性电路板和触控层的绑定；填平层位于所述绑定区域12的所述柔性电路板30远离所述显示基板14一侧，用于填平柔性电路板表面和偏光层表面的高度差(段差)。
示例性地，导电胶为各向异性导电胶膜(Anisotropic Conductive Film，ACF)，导电胶膜是含有导电粒子的粘结层，在高温和压力作用下，导电粒子破裂露出导电颗粒，将柔性电路板和显示基板导通，在通电时电连接。填平层为空间膜(Space Film，SF)，例如塑料、泡棉等材料制成的薄膜。
图6是本公开一些实施例提供的一种触控层的结构示意图。所述触控层15包括：触控电极141、焊盘142、以及连接所述触控电极141和所述焊盘142的信号线143。
触控电极141位于所述显示区域11，焊盘142位于所述绑定区域12，所述焊盘142通过所述导电胶60与所述柔性电路板30绑定，所述信号线143位于所述间隔区域13的部分被所述保护结构40覆盖。
需要说明的是，图6中所示的触控电极141为条状电极，在其他实施例中触控电极141也可以采用其他形状的电极，例如块状电极等。另外，图中触控电极、信号线和焊盘的数量仅为示例，不作为本公开的限制。
在本公开实施例中，所述覆盖结构42与所述柔性电路板30、导电胶60和填平层70中的至少一层一体成型。在本公开实施例中，覆盖结构42是柔性电路板30、导电胶60和填平层70中的至少一层制作时从绑定区域12延伸到间隔区域13的部分。
下面结合附图7至图10对覆盖结构42的一些示例性结构进行说明：
示例性地，覆盖结构42与导电胶60一体成型，也即覆盖结构42是导电胶60从绑定区域12延伸到间隔区域13的部分。下面结合图7和图8进行说明：
图7是本公开一些实施例提供的一种显示面板的结构示意图。参见图7，所述导电胶60从所述绑定区域12延伸到所述间隔区域13，所述导电胶60的侧边和所述粘性结构41的侧边在所述间隔区域13内相接，从而将间隔区域的触控层完全覆盖住。
图8是本公开一些实施例提供的一种显示面板的结构示意图。参见图8，所述导电胶60从所述绑定区域12延伸到所述间隔区域13，与图7的区别仅在于，所述导电胶60的一部分叠置于所述粘性结构41上，从而将间隔区域的触控层完全覆盖住。
在图8所示的实现方式中，所述导电胶60和所述粘性结构41的重叠部分在第一方向A上的宽度B的取值范围为50nm至100nm。
其中，所述第一方向为所述显示区域11、所述间隔区域13和所述绑定区域12的排布方向。
示例性地，宽度B为50nm。
在该实现方式中，通过导电胶延伸到间隔区域来覆盖间隔区域内的触控层，从而避免触控层暴露在外受到腐蚀。采用导电胶实现上述功能，一方面制作方便，导电胶的一部分覆盖触控层在绑定区域的部分，这里导电胶的一部分是指用来连接触控层和柔性电路板的部分，并且导电胶的这一部分位于绑定区域，且位置和间隔区域相邻，在平行和垂直于触控层表面的两个方向上，导电胶与 需要覆盖的位于间隔区域的触控层的距离都较近，导电胶制作时延伸到间隔区域的触控层上更方便。另一方面，导电胶粘性好，覆盖在触控层上时，能够对触控层实现完全密封，并且能够和位于间隔区域内的粘性结构搭接，从而实现对触控层的完全密封。
在其他实现方式中，导电胶60还可以仅位于绑定区域12，而并未延伸到间隔区域13，这种情况下，触控层的覆盖由前述柔性电路板和填平层中的至少一个完成。
示例性地，覆盖结构42与柔性电路板30一体成型，也即覆盖结构42是柔性电路板30从绑定区域12延伸到间隔区域13的部分。下面结合图9进行说明：
图9是本公开一些实施例提供的一种显示面板的结构示意图。参见图8，所述柔性电路板30包括金属层31和位于金属层31表面的绝缘薄膜层32，所述金属层31在所述绑定区域12与所述触控层15的焊盘绑定，所述绝缘薄膜层32从所述绑定区域12延伸到所述间隔区域13，所述绝缘薄膜层32的一部分叠置于所述粘性结构41上，从而将间隔区域的触控层完全覆盖住。
在图9所示的实现方式中，所述绝缘薄膜层32和所述粘性结构41重叠部分在第一方向A上的宽度C的取值范围为50nm至100nm。
示例性地，宽度C为50nm。
在图9所示的实现方式中，在所述第一方向A上，所述金属层31和所述粘性结构41的间距D的取值范围为50nm至100nm。
示例性地，间距D为50nm。
参见图9，该TPFC 30还包括油墨层33，油墨层33位于金属层31背向绝缘薄膜层32的一侧，且油墨层33位于触摸屏10之外。通过使用油墨层33覆盖金属层的另一侧，增加TPFC的弯折性能。
示例性地，金属层31为铜(Cu)金属层。
示例性地，绝缘薄膜层32为聚酰亚胺薄膜(Polyimide，PI)层。
示例性地，覆盖结构42与填平层70一体成型，也即覆盖结构42是填平层70从绑定区域12延伸到间隔区域13的部分。下面结合图10进行说明：
图10是本公开一些实施例提供的一种显示面板的结构示意图。参见图10，所述填平层70从所述绑定区域12延伸到所述间隔区域13，所述填平层70的一部分叠置于所述粘性结构41上，从而将间隔区域的触控层完全覆盖住。
在图10所示的实现方式中，所述填平层70和所述粘性结构41重叠部分在第一方向A上的宽度E的取值范围为50nm至100nm。
示例性地，宽度E为50nm。
在图10所示的实现方式中，在所述第一方向A上，所述填平层70和所述偏光层20的间距F的取值范围为50nm至100nm。
示例性地，间距F为100nm。
前述图7至图10中示出的都是通过一个膜层来实现的触控层覆盖，在其他实施例中，也可以采用多个膜层同时实现触控层覆盖。下面结合附图11至图14对覆盖结构42的另一些示例性结构进行说明：
图11是本公开一些实施例提供的一种显示面板的结构示意图。参见图11，柔性电路板30的绝缘薄膜层32和填平层70同时延伸到间隔区域13，实现对间隔区域的触控层的覆盖。
图12是本公开一些实施例提供的一种显示面板的结构示意图。参见图12，导电胶60、柔性电路板30的绝缘薄膜层32和填平层70同时延伸到间隔区域13，实现对间隔区域的触控层的覆盖。
示例性地，在第一方向上，导电胶60、绝缘薄膜层32和填平层70在间隔区域13中的宽度为100nm。
图13是本公开一些实施例提供的一种显示面板的结构示意图。参见图13，导电胶60、柔性电路板30的绝缘薄膜层32和填平层70同时延伸到间隔区域13，与图12的区别仅在于，图13中导电胶60没有覆盖粘性结构41，实现对间隔区域的触控层的覆盖粘性结构41上，而仅仅是与粘性结构41的侧边贴合。
图14是图13所示的显示面板的俯视图，参见图14，粘性结构41的边界和导电胶60的边界重合，绝缘薄膜层32、填平层70和粘性结构41有交叠，也即绝缘薄膜层32和填平层70同时延伸到粘性结构41上。
示例性地，在第一方向上，导电胶60在间隔区域13中的宽度为50nm，绝缘薄膜层32和填平层70在间隔区域13中的宽度为100nm。
在图12和图13所示的方案中，通过三个膜层来覆盖间隔区域原本露出的触控层，制作多道密封，从而实现对触控层的全封闭设计，从而避免碘和水汽对触控层的腐蚀。而且由于导电胶的贴附精度小于柔性电路板的绑定精度，在导电胶贴附工艺出现偏差，未能按照理论设计完全覆盖触控层的情况下，通过 上层的柔性电路板和填平层仍然能够保证对触控层的密封。
绝缘薄膜层材质透明轻柔且不含腐蚀元素；填平层70厚度较大，除了起到密封作用，还由于其自身重量大，能够起到下压绝缘薄膜层使其贴附于粘性结构的作用。
此外，填平层70还能起到对间隔区域的保护，使其免受外力的冲击导致该区域物理损伤的出现。
另一种可行的实施方案是，在柔性电路板及其相关膜层的基础上重新制作一层作为覆盖结构。
图15是本公开一些实施例提供的一种显示面板的结构示意图。参见图15，柔性电路板30的绝缘薄膜层32和填平层70均未延伸到间隔区域13，在填平层70及偏光层20的上方具有一层覆盖结构42，该覆盖结构42延伸到间隔区域13，实现对间隔区域的触控层的覆盖。
示例性地，该覆盖结构采用有机或者无机的透明材料制作而成。
可以看出，第一种方案相比于第二种方案工艺步骤更少，在不加入新材料和新工艺的情况下即可解决相关技术中的触控层的信号线短路问题；并且整个显示面板的厚度更小，有利于实现显示面板的轻薄化。
在本公开实施例中，显示面板还包括位于偏光层和填平层上的透明盖板，该透明盖板用于实现显示面板的封装。通常透明盖板为玻璃盖板。
本公开实施例还提供一种显示装置，该显示装置包括上述任意一种的显示面板以及和供电组件，供电组件用于为所述显示面板供电。
本公开实施例中的显示装置可以为：手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪、可穿戴设备等任何具有显示功能的产品或部件。作为一种示例，图16是本公开一些实施例提供的一种显示装置的结构示意图。所述显示装置包括上述任意一种显示面板，该显示面板的显示区内包括行列设置的子像素区域Px。上述显示区中的数据线中的每一条可以在相邻两列子像素区域Px之间，以将所接入的数据信号或测试信号传输至每个子像素区域Px之中。
在本公开实施例中，在显示区域通过制作偏光层来覆盖触控层，在绑定区域通过制作柔性电路板来覆盖触控层，在间隔区域通过设置保护结构来覆盖触控层，从而使得整个触控层没有裸露在外的部分，避免了偏光层中的碘和水汽 一起对裸露的触控层造成腐蚀，解决了触控层的信号线短路问题，提高显示面板的稳定性。
图17是本公开一些实施例提供的一种显示面板制作方法的流程图。参见图17，该方法包括：
1400：提供一显示基板，所述显示基板具有显示区域、绑定区域、以及位于所述显示区域与所述绑定区域之间的间隔区域。
1401：在所示显示基板的表面制作触控层，所述触控层连续设置于所述显示区域、所述间隔区域及至少部分所述绑定区域。
1402：在所述显示区域的所述触控层远离所述显示基板一侧制作偏光层，并在所述绑定区域的所述触控层制作柔性电路板。
示例性地，在所述显示区域的所述触控层远离所述显示基板一侧贴合偏光层。
1403：在所述间隔区域制作覆盖所述间隔区域的触控层的保护结构。
这里，步骤1403和步骤1402可以没有先后顺序关系，也即步骤1403和步骤1402同时进行。或者步骤1403和步骤1402存在先后顺序关系，也即步骤1403在步骤1402之后进行。
在本公开实施例中，在显示区域通过制作偏光层来覆盖触控层，在绑定区域通过制作柔性电路板来覆盖触控层，在间隔区域通过设置保护结构来覆盖触控层，从而使得整个触控层没有裸露在外的部分，避免了偏光层中的碘和水汽一起对裸露的触控层造成腐蚀，解决了触控层的信号线短路问题，提高显示面板的稳定性。
在一种可能的实现方式中，所述保护结构包括粘性结构和覆盖结构，在所述间隔区域制作覆盖所述间隔区域的触控层的保护结构，包括：
在制作所述偏光层之前，在所述触控层上制作一体成型的粘性层和粘性结构；这里粘性层是用来保护触控层，并且实现偏光层和触摸屏贴合的。
在所述间隔区域内未被所述粘性结构覆盖的触控层上制作覆盖结构。
示例性地，所述在所述间隔区域内未被所述粘性结构覆盖的触控层上制作覆盖结构，包括：
在制作所述柔性电路板之前，在所述绑定区域的所述触控层上制作一层导电胶；
在制作所述柔性电路板之后，在所述绑定区域的所述柔性电路板上制作一层填平层；
在制作所述柔性电路板、所述导电胶和所述填平层中的至少一层时，制作与所述柔性电路板、所述导电胶和所述填平层中的至少一层一体成型的覆盖结构。
在这种实现方式中，覆盖结构是由柔性电路板以及相关膜层实现的，在制作柔性电路板以及相关膜层时，让其从绑定区域延伸到所述间隔区域，此时位于间隔区域的部分即起到覆盖触控层的作用，也即为前述覆盖结构。
下面以图13所示的显示面板的制作过程为例，对显示面板的制作方法进行详细说明：
图18是本公开一些实施例提供的一种显示面板制作方法的流程图。参见图18，该方法包括：
1500：提供一显示基板，所述显示基板具有显示区域、绑定区域、以及位于所述显示区域与所述绑定区域之间的间隔区域。
1501：在所示显示基板的表面制作触控层，所述触控层连续设置于所述显示区域、所述间隔区域及至少部分所述绑定区域。
其中，显示基板和位于所述显示基板表面的触控层构成触摸屏。
1502：在所述显示区域的所述触控层远离所述显示基板一侧制作偏光层。
如图19所示，在触控层15上涂覆一层粘性层50，然后通过粘性层50贴合偏光层20。其中，粘性层50的部分从显示区域11延伸到间隔区域13中，也即粘性结构41。
需要说明的是，粘性层50在涂覆时，由于工艺精度限制，既难以仅覆盖显示区域11，而不覆盖间隔区域13，也难以覆盖整个间隔区域13。
1503：在所述绑定区域和间隔区域的所述触控层上制作导电胶。
如图20所示，在绑定区域12和间隔区域13的触控层15上贴附导电胶60，该导电胶覆盖绑定区域12和间隔区域13，且导电胶60的侧边和所述粘性结构41的侧边在所述间隔区域13内相接。导电胶60位于间隔区域13的部分属于覆盖结构。
1504：通过导电胶在触摸屏上制作柔性电路板。
如图21所示，通过导电胶60在触摸屏上绑定柔性电路板30。柔性电路板30包括金属层31和位于金属层31表面的绝缘薄膜层32，所述金属层31在所 述绑定区域12与所述触控层15的焊盘绑定，所述绝缘薄膜层32从所述绑定区域12延伸到所述间隔区域13，所述绝缘薄膜层32的一部分叠置于所述粘性结构41上，从而将间隔区域的触控层完全覆盖住。绝缘薄膜层32位于间隔区域13的部分属于覆盖结构。
1505：在柔性电路板上制作填平层。
如图13所示，在柔性电路板30上贴附填平层70。填平层70从所述绑定区域12延伸到所述间隔区域13，所述填平层70的一部分叠置于所述粘性结构41上，从而将间隔区域的触控层完全覆盖住。填平层70位于间隔区域13的部分属于覆盖结构。
示例性地，在第一方向上，导电胶60在间隔区域13中的宽度为50nm，绝缘薄膜层32和填平层70在间隔区域13中的宽度为100nm。
在本公开实施例提供的上述显示面板制作方法中，通过三个膜层来覆盖间隔区域原本露出的触控层，制作多道密封，从而实现对触控层的全封闭设计，从而避免碘和水汽对触控层的腐蚀。而且由于导电胶的贴附精度小于柔性电路板的绑定精度，在导电胶贴附工艺出现偏差，未能按照理论设计完全覆盖触控层的情况下，通过上层的柔性电路板和填平层仍然能够保证对触控层的密封。
绝缘薄膜层材质透明轻柔且不含腐蚀元素；填平层70厚度较大，除了起到密封作用，还由于其自身重量大，能够起到下压绝缘薄膜层使其贴附于粘性结构的作用。
此外，填平层70还能起到对间隔区域的保护，使其免受外力的冲击导致该区域物理损伤的出现。
以上所述仅为本公开的可选实施例，并不用以限制本公开，凡在本公开的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本公开的保护范围之内。

Claims (15)

  1. 一种显示面板，其特征在于，所述显示面板包括：
    显示基板(14)，具有显示区域(11)、绑定区域(12)、以及位于所述显示区域(11)与所述绑定区域(12)之间的间隔区域(13)；
    触控层(15)，位于所述显示基板(14)表面且连续设置于所述显示区域(11)、所述间隔区域(13)及至少部分所述绑定区域(12)；
    偏光层(20)，位于所述触控层(15)远离所述显示基板(14)一侧且设置于所述显示区域(11)；
    柔性电路板(30)，与所述绑定区域(12)的所述触控层(15)连接，且与所述偏光层(20)位于所述触控层(15)的同一表面；
    保护结构(40)，覆盖所述间隔区域(13)的所述触控层(15)。
  2. 根据权利要求1所述的显示面板，其特征在于，所述显示面板还包括位于所述偏光层(20)和所述触控层(15)之间的粘性层(50)，所述保护结构(40)包括粘性结构(41)，所述粘性结构(41)与所述粘性层(50)一体成型；
    覆盖结构(42)，覆盖所述间隔区域(13)内未被所述粘性结构(41)覆盖的触控层(15)。
  3. 根据权利要求2所述的显示面板，其特征在于，所述显示面板还包括：
    导电胶(60)，位于所述柔性电路板(30)和所述触控层(15)之间且设置于所述绑定区域(12)；
    填平层(70)，位于所述绑定区域(12)的所述柔性电路板(30)远离所述显示基板(14)一侧；
    所述覆盖结构(42)与所述柔性电路板(30)、所述导电胶(60)和所述填平层(70)中的至少一层一体成型。
  4. 根据权利要求3所述的显示面板，其特征在于，所述触控层(15)包括：
    触控电极(141)，位于所述显示区域(11)；
    焊盘(142)，位于所述绑定区域(12)，所述焊盘(142)通过所述导电胶(60)与所述柔性电路板(30)绑定连接；
    以及，信号线(143)，至少部分位于所述间隔区域(13)，以连接所述触控电极(141)和所述焊盘(142)的，且所述间隔区域(13)的所述信号线(143)被所述保护结构(40)覆盖。
  5. 根据权利要求3所述的显示面板，其特征在于，所述导电胶(60)从所述绑定区域(12)延伸到所述间隔区域(13)，所述覆盖结构(42)与所述导电胶(60)一体成型；
    所述导电胶(60)的侧边和所述粘性结构(41)的侧边在所述间隔区域(13)内相接；或者，所述导电胶(60)的一部分叠置于所述粘性结构(41)上。
  6. 根据权利要求5所述的显示面板，其特征在于，所述导电胶(60)和所述粘性结构(41)的重叠部分在第一方向上的宽度的取值范围为50nm至100nm；
    其中，所述第一方向为所述显示区域(11)、所述间隔区域(13)和所述绑定区域(12)的排布方向。
  7. 根据权利要求4所述的显示面板，其特征在于，所述柔性电路板(30)包括金属层(31)和位于所述金属层(31)与所述填平层之间的绝缘薄膜层(32)，所述金属层(31)在所述绑定区域(12)与所述触控层(15)的焊盘(142)绑定，所述绝缘薄膜层(32)从所述绑定区域(12)延伸到所述间隔区域(13)，所述覆盖结构(42)与所述绝缘薄膜层(32)一体成型，且所述绝缘薄膜层(32)的一部分叠置于所述粘性结构(41)上。
  8. 根据权利要求7所述的显示面板，其特征在于，所述绝缘薄膜层(32)和所述粘性结构(41)的重叠部分在第一方向上的宽度的取值范围为50nm至100nm；
    其中，所述第一方向为所述显示区域(11)、所述间隔区域(13)和所述绑定区域(12)的排布方向。
  9. 根据权利要求8所述的显示面板，其特征在于，在所述第一方向上，所述金属层(31)和所述粘性结构(41)的间距的取值范围为50nm至100nm。
  10. 根据权利要求3所述的显示面板，其特征在于，所述填平层(70)从所述绑定区域(12)延伸到所述间隔区域(13)，所述覆盖结构(42)与所述填平层(70)一体成型，所述填平层(70)的一部分叠置于所述粘性结构(41)上。
  11. 根据权利要求10所述的显示面板，其特征在于，所述填平层(70)和所述粘性结构(41)的重叠部分在第一方向上的宽度的取值范围为50nm至100nm；
    其中，所述第一方向为所述显示区域(11)、所述间隔区域(13)和所述绑定区域(12)的排布方向。
  12. 一种显示装置，其特征在于，包括显示面板和供电组件，所述显示面板为如权利要求1至11任一项所述的显示面板，所述供电组件用于为所述显示面板供电。
  13. 一种显示面板制作方法，其特征在于，所述方法包括：
    提供一显示基板，所述显示基板具有显示区域、绑定区域、以及位于所述显示区域与所述绑定区域之间的间隔区域；
    在所示显示基板的表面制作触控层，所述触控层连续设置于所述显示区域、所述间隔区域及至少部分所述绑定区域；
    在所述显示区域的所述触控层远离所述显示基板一侧制作偏光层，并在所述绑定区域的所述触控层制作柔性电路板；
    在所述间隔区域制作覆盖所述间隔区域的触控层的保护结构。
  14. 根据权利要求13所述的方法，其特征在于，所述保护结构包括粘性结构和覆盖结构，所述在所述间隔区域制作覆盖所述间隔区域的触控层的保护结构，包括：
    在制作所述偏光层之前，在所述触控层上制作一体成型的粘性层和粘性结构；
    在所述间隔区域内未被所述粘性结构覆盖的触控层上制作覆盖结构。
  15. 根据权利要求14所述的方法，其特征在于，所述在所述间隔区域内未被所述粘性结构覆盖的触控层上制作覆盖结构，包括：
    在制作所述柔性电路板之前，在所述绑定区域的所述触控层上制作一层导电胶；
    在制作所述柔性电路板之后，在所述绑定区域的所述柔性电路板上制作一层填平层；
    在制作所述柔性电路板、所述导电胶和所述填平层中的至少一层时，制作与所述柔性电路板、所述导电胶和所述填平层中的至少一层一体成型的覆盖结构。
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