WO2023022383A1 - 비파괴 방식을 이용한 와이어 본딩 검사 방법 - Google Patents
비파괴 방식을 이용한 와이어 본딩 검사 방법 Download PDFInfo
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- WO2023022383A1 WO2023022383A1 PCT/KR2022/010902 KR2022010902W WO2023022383A1 WO 2023022383 A1 WO2023022383 A1 WO 2023022383A1 KR 2022010902 W KR2022010902 W KR 2022010902W WO 2023022383 A1 WO2023022383 A1 WO 2023022383A1
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- Prior art keywords
- bonding
- wire bonding
- inspection method
- wire
- area
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 66
- 238000007689 inspection Methods 0.000 title claims abstract description 36
- 230000007547 defect Effects 0.000 claims description 23
- 230000002950 deficient Effects 0.000 claims description 20
- 230000001066 destructive effect Effects 0.000 claims description 7
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 230000008569 process Effects 0.000 description 5
- 239000010949 copper Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 2
- 230000001186 cumulative effect Effects 0.000 description 2
- 238000004146 energy storage Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- 239000000809 air pollutant Substances 0.000 description 1
- 231100001243 air pollutant Toxicity 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- OJIJEKBXJYRIBZ-UHFFFAOYSA-N cadmium nickel Chemical compound [Ni].[Cd] OJIJEKBXJYRIBZ-UHFFFAOYSA-N 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000002803 fossil fuel Substances 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 229910001416 lithium ion Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910000652 nickel hydride Inorganic materials 0.000 description 1
- QELJHCBNGDEXLD-UHFFFAOYSA-N nickel zinc Chemical compound [Ni].[Zn] QELJHCBNGDEXLD-UHFFFAOYSA-N 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
- G06T7/001—Industrial image inspection using an image reference approach
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/28—Measuring arrangements characterised by the use of optical techniques for measuring areas
- G01B11/285—Measuring arrangements characterised by the use of optical techniques for measuring areas using photoelectric detection means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/28—Measuring arrangements characterised by the use of optical techniques for measuring areas
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
- G06T7/0006—Industrial image inspection using a design-rule based approach
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/60—Analysis of geometric attributes
- G06T7/62—Analysis of geometric attributes of area, perimeter, diameter or volume
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
- G01N2021/8822—Dark field detection
- G01N2021/8825—Separate detection of dark field and bright field
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8854—Grading and classifying of flaws
- G01N2021/8858—Flaw counting
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8854—Grading and classifying of flaws
- G01N2021/8874—Taking dimensions of defect into account
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30148—Semiconductor; IC; Wafer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/50—Current conducting connections for cells or batteries
- H01M50/502—Interconnectors for connecting terminals of adjacent batteries; Interconnectors for connecting cells outside a battery casing
- H01M50/514—Methods for interconnecting adjacent batteries or cells
- H01M50/516—Methods for interconnecting adjacent batteries or cells by welding, soldering or brazing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Definitions
- the present invention relates to a method for inspecting defects in wire bonding applied to a battery system using a non-destructive method.
- secondary batteries are an alternative energy source for fossil fuels that cause air pollutants, and are used in electric vehicles (EVs), hybrid electric vehicles (HEVs), plug-in hybrid electric vehicles (P-HEVs) and energy storage devices (ESSs). etc. are applied.
- EVs electric vehicles
- HEVs hybrid electric vehicles
- P-HEVs plug-in hybrid electric vehicles
- ESSs energy storage devices
- Types of secondary batteries that are currently widely used include lithium ion batteries, lithium polymer batteries, nickel cadmium batteries, nickel hydride batteries, nickel zinc batteries, and the like.
- the operating voltage of the unit secondary battery cell that is, the unit battery cell, is about 2.0V to 5.0V. Therefore, when a higher output voltage is required, a plurality of battery cells are connected in series to form a cell module assembly, and cell module assemblies are connected in series or parallel according to the required output voltage or charge/discharge capacity.
- a battery module may be configured, and it is common to manufacture a battery pack by adding additional components using at least one battery module.
- Wire bonding is used as one method of electrical connection, and a problem in wire bonding may cause problems in the entire battery system in the future, so a process of inspecting defects after wire bonding is important.
- materials for wire bonding include gold (Au), aluminum (Al), copper (Cu), etc.
- gold wire is mainly used in semiconductor processes, and the material for wire bonding used in battery systems is aluminum ( Al), copper (Cu), etc. are used.
- thermocompression bonding method various methods such as a thermocompression bonding method, an ultrasonic method, and a thermal ultrasonic method are used.
- the shape or area of the bonding part is different between the battery system and the semiconductor process, a bonding part defect inspection method different from that of the semiconductor process is required.
- an object of the present invention is to provide a method for inspecting defects in wire bonding by using a non-destructive inspection method of photographing a bonding part, calculating an area, and comparing the area.
- a wire bonding inspection method is a method of inspecting whether wire bonding applied to a battery system is defective using a non-destructive method, a) photographing a wire bonding part using a camera, b) calculating an area of the bonding part; and c) determining whether or not the wire bonding is defective based on the calculated area of the bonding part.
- the wire bonding inspection method according to the present invention is characterized in that the area is calculated using a contrast difference between the bonding portion and the peripheral portion where step b) is photographed.
- step b) compares the area of the bonding part with the area of the wire before bonding to calculate the relative area (%) of the bonding part compared to the area of the wire before bonding.
- step c) includes c-1) comparing the relative area of the bonding part with the relative area data of the normal bonding part to determine whether or not it is defective.
- the wire bonding inspection method according to the present invention is characterized in that the relative area data of the normal bonding portion is accumulated data of relative areas calculated from a plurality of bonding portions determined to be normal by an existing inspection method.
- step c) comparing the left and right areas with respect to the center of the bonding part to determine defects based on whether the degree of symmetry of the left and right areas is within the allowable range. It is characterized by including steps.
- the wire bonding inspection method according to the present invention is characterized in that the allowable range is left-right symmetric accumulated data measured from a plurality of bonding parts determined to be normal by the existing inspection method.
- step c) determines that the wire bonding is defective when at least one of the steps c-1) and c-2) determines that the wire bonding is defective.
- the battery system of the present invention is characterized by including wire bonding inspected by any one of the wire bonding inspection methods according to the present invention.
- the device of the present invention is characterized in that it comprises a battery system according to the present invention.
- the wire bonding inspection method of the present invention is a non-destructive method using ultrasonic waves, and has an advantage in that the inspection can be performed without damaging the wire bonding portion applied to the battery system.
- the wire bonding inspection method of the present invention has the advantage of being able to easily detect defects due to weak bonding, which were difficult to detect by conventional inspection methods.
- FIG. 1 is a photograph showing a wire bonding unit for which defects are determined by a method of comparing relative areas according to an embodiment of the present invention.
- FIG. 2 is a photograph showing a wire bonding unit in which defects are determined by comparing degrees of symmetry of left and right areas of the bonding unit according to an embodiment of the present invention.
- the wire bonding inspection method of the present invention is a method of inspecting whether wire bonding is defective using a non-destructive inspection method.
- the method may include photographing a wire bonding unit to be inspected using a camera, calculating an area of the captured bonding unit, and determining whether or not the wire bonding is defective based on the calculated area of the bonding unit.
- FIG. 1 is a photograph showing a wire bonding unit for which defects are determined by a method of comparing relative areas according to an embodiment of the present invention.
- the step of photographing the wire bonding portion using a camera is a step of photographing using a known photographing means such as a CCD camera, and as shown in FIG. and the wire bonding portion appears bright, and its periphery appears dark.
- the step of calculating the area of the photographed bonding part calculates the area of the bonding part from the contrast difference between the bonding part and the surrounding area using the Black & White algorithm for the photographing result as shown in FIG. 1, and compares the calculated area of the bonding part with the area of the wire before bonding. to calculate the relative area (%).
- the step of determining whether or not the wire bonding is defective based on the calculated area of the bonding unit is the cumulative data of the relative area calculated from a plurality of bonding units determined to be normal by inspecting the relative area of the bonding unit using an existing inspection method, and It includes a comparison step.
- the range of the relative area of the cumulative data calculated from the plurality of bonding parts inspected by the conventional inspection method and determined to be normal is about 140-200%.
- the relative area of the bonding part is in the range of 140-200%, it is regarded as a good product, and if it is less than 140% or exceeds 200%, it can be judged as defective. If it is less than 140%, it is regarded as a defect due to weak bonding, and if it exceeds 200%, it can be regarded as a defect due to overbonding.
- the step of determining whether or not there is a defect is in addition to the step of determining whether or not there is a defect by comparing the relative area of the bonding part with the relative area data of the normal bonding part, and comparing the left and right areas with respect to the center of the bonding part so that the left and right areas are symmetrical.
- a step of determining a defect based on whether the degree is within an acceptable range may be further included.
- FIG. 2 is a photograph showing a wire bonding unit in which defects are determined by comparing degrees of symmetry of left and right areas of the bonding unit according to an embodiment of the present invention.
- the step of determining whether or not the wire bonding is defective is not only a step of comparing whether the range of the relative area as seen above is a normal range, but also a step of comparing the left-right symmetry of the bonding unit, so that the wire bonding unit is defective with higher accuracy. be able to judge whether
- the order of performing the above two steps is not particularly limited, and the step of determining whether or not a defect is determined by comparing the degree of symmetry of the left and right areas of the bonding portion may be performed first, or both steps may be performed simultaneously.
- the battery system subjected to the wire bonding inspection can be used for electric vehicles (EVs), hybrid electric vehicles (HEVs), plug-in hybrid electric vehicles (P-HEVs) and energy storage. It can also be used for various devices such as a device (ESS).
- EVs electric vehicles
- HEVs hybrid electric vehicles
- P-HEVs plug-in hybrid electric vehicles
- ESS energy storage
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- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Electric Properties And Detecting Electric Faults (AREA)
Abstract
Description
Claims (10)
- 비파괴 방식을 이용하여 배터리 시스템에 적용된 와이어 본딩(Wire bonding)의 불량여부를 검사하는 방법으로서,a) 와이어 본딩부를 카메라를 사용하여 촬영하는 단계;b) 상기 본딩부의 면적을 계산하는 단계; 및c) 계산된 상기 본딩부의 면적을 바탕으로 상기 와이어 본딩의 불량 여부를 판단하는 단계;를 포함하는 와이어 본딩 검사 방법.
- 제1항에 있어서, 상기 b) 단계는 촬영된 상기 본딩부와 주변부의 명암차를 이용하여 면적을 계산하는 것을 특징으로 하는 와이어 본딩 검사 방법.
- 제1항에 있어서, 상기 b) 단계는 상기 본딩부의 면적과 본딩 전 와이어의 면적을 비교하여 상기 본딩 전 와이어 면적 대비 상기 본딩부의 상대 면적(%)을 계산하는 단계를 포함하는 것을 특징으로 하는 와이어 본딩 검사 방법.
- 제3항에 있어서, 상기 c) 단계는 c-1) 상기 본딩부의 상대 면적을 정상 본딩부의 상대 면적 데이터와 비교하여 불량 여부를 판단하는 단계를 포함하는 것을 특징으로 하는 와이어 본딩 검사 방법.
- 제4항에 있어서, 상기 정상 본딩부의 상대 면적 데이터는 기존의 검사 방법으로 정상 판정된 복수의 본딩부로부터 계산된 상대 면적의 누적 데이터인 것을 특징으로 하는 와이어 본딩 검사 방법.
- 제4항에 있어서, 상기 c) 단계는 c-2) 상기 본딩부의 중심을 기준으로 좌우 면적을 비교하여 상기 좌우 면적의 대칭 정도가 허용 범위에 포함되는지 여부로 불량을 판단하는 단계를 포함하는 것을 특징으로 하는 와이어 본딩 검사 방법.
- 제6항에 있어서, 상기 허용 범위는 기존의 검사 방법으로 정상 판정된 복수의 본딩부로부터 측정된 좌우 대칭의 누적 데이터인 것을 특징으로 하는 와이어 본딩 검사 방법.
- 제6항에 있어서, 상기 c) 단계는 상기 c-1) 단계와 c-2) 단계 중 하나 이상의 단계가 불량 판정 시 상기 와이어 본딩을 불량으로 판단하는 것을 특징으로 하는 와이어 본딩 검사 방법.
- 제1항 내지 제8항 중 어느 한 항의 방법으로 검사한 와이어 본딩을 포함하는 배터리 시스템.
- 제9항의 배터리 시스템을 포함하는 디바이스.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP22858622.8A EP4306942A4 (en) | 2021-08-18 | 2022-07-25 | NON-DESTRUCTIVE WIRE SOLDER INSPECTION PROCESS |
JP2023550670A JP2024507548A (ja) | 2021-08-18 | 2022-07-25 | 非破壊方式を用いるワイヤボンディング検査方法 |
CN202280018153.1A CN116917717A (zh) | 2021-08-18 | 2022-07-25 | 非破坏性的引线键合检查方法 |
US18/278,867 US20240265522A1 (en) | 2021-08-18 | 2022-07-25 | Non-Destructive Wire Bonding Inspection Method |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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KR10-2021-0108421 | 2021-08-18 | ||
KR1020210108421A KR20230026621A (ko) | 2021-08-18 | 2021-08-18 | 비파괴 방식을 이용한 와이어 본딩 검사 방법 |
Publications (1)
Publication Number | Publication Date |
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WO2023022383A1 true WO2023022383A1 (ko) | 2023-02-23 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/KR2022/010902 WO2023022383A1 (ko) | 2021-08-18 | 2022-07-25 | 비파괴 방식을 이용한 와이어 본딩 검사 방법 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20240265522A1 (ko) |
EP (1) | EP4306942A4 (ko) |
JP (1) | JP2024507548A (ko) |
KR (1) | KR20230026621A (ko) |
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KR20210108421A (ko) | 2018-12-24 | 2021-09-02 | 사노피 | 돌연변이 Fab 도메인을 포함하는 다중특이성 결합 단백질 |
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KR101305255B1 (ko) * | 2011-02-23 | 2013-09-06 | 주식회사 엘지화학 | 초음파 용접의 강도 검사 방법 및 장치 |
KR102411935B1 (ko) * | 2019-08-22 | 2022-06-22 | 삼성에스디아이 주식회사 | 배터리 팩 및 배터리 팩의 용접 검사 방법 |
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- 2022-07-25 WO PCT/KR2022/010902 patent/WO2023022383A1/ko active Application Filing
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KR900010383A (ko) * | 1988-12-28 | 1990-07-07 | 안시환 | 와이어 본딩 인식방법 |
JPH06174442A (ja) * | 1992-12-01 | 1994-06-24 | Canon Inc | ボンディングワイヤ検査装置 |
JP2000221016A (ja) * | 1999-02-02 | 2000-08-11 | Fuji Photo Film Co Ltd | 溶接検査方法 |
JP2010236976A (ja) * | 2009-03-31 | 2010-10-21 | X-Line Corp | ワイヤ検査装置、ワイヤ検査方法及びワイヤ検査用プログラム |
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KR20210108421A (ko) | 2018-12-24 | 2021-09-02 | 사노피 | 돌연변이 Fab 도메인을 포함하는 다중특이성 결합 단백질 |
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EP4306942A1 (en) | 2024-01-17 |
KR20230026621A (ko) | 2023-02-27 |
JP2024507548A (ja) | 2024-02-20 |
US20240265522A1 (en) | 2024-08-08 |
CN116917717A (zh) | 2023-10-20 |
EP4306942A4 (en) | 2024-10-23 |
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