WO2023022120A1 - Composition, film, filtre optique, capteur optique, dispositif d'affichage d'images, et structure - Google Patents

Composition, film, filtre optique, capteur optique, dispositif d'affichage d'images, et structure Download PDF

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WO2023022120A1
WO2023022120A1 PCT/JP2022/030851 JP2022030851W WO2023022120A1 WO 2023022120 A1 WO2023022120 A1 WO 2023022120A1 JP 2022030851 W JP2022030851 W JP 2022030851W WO 2023022120 A1 WO2023022120 A1 WO 2023022120A1
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composition
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compounds
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PCT/JP2022/030851
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大貴 瀧下
貴規 田口
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富士フイルム株式会社
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Priority to KR1020247003841A priority Critical patent/KR20240028496A/ko
Priority to JP2023542392A priority patent/JPWO2023022120A1/ja
Publication of WO2023022120A1 publication Critical patent/WO2023022120A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F265/00—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00
    • C08F265/04—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00 on to polymers of esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/12—Polymers provided for in subclasses C08C or C08F
    • C08F290/126—Polymers of unsaturated carboxylic acids or derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F292/00—Macromolecular compounds obtained by polymerising monomers on to inorganic materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09B—ORGANIC DYES OR CLOSELY-RELATED COMPOUNDS FOR PRODUCING DYES, e.g. PIGMENTS; MORDANTS; LAKES
    • C09B67/00—Influencing the physical, e.g. the dyeing or printing properties of dyestuffs without chemical reactions, e.g. by treating with solvents grinding or grinding assistants, coating of pigments or dyes; Process features in the making of dyestuff preparations; Dyestuff preparations of a special physical nature, e.g. tablets, films
    • C09B67/006—Preparation of organic pigments
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G02B5/22—Absorbing filters
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66946—Charge transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/762—Charge transfer devices

Definitions

  • the present invention relates to a composition containing a silicone-based surfactant.
  • the present invention also relates to films, optical filters, optical sensors, image display devices and structures.
  • a composition containing a surfactant is used in the composition used to manufacture optical filters such as color filters for optical sensors.
  • Patent Document 1 discloses a colored resin composition containing (A) a colorant, (B) a dispersant, (C) a solvent, (D) a binder resin, and (E) a photopolymerization initiator, wherein (B ) The dispersant contains a dispersant (b) having a predetermined repeating unit, and the colored resin composition contains (F) a surfactant in the total solid content of 0.01% by mass or more. Inventions relating to compositions are disclosed.
  • Optical filters used in optical sensors and image display devices generally have multiple types of pixels.
  • the second and subsequent types of pixels are sequentially formed using the second and subsequent types of pixel-forming compositions. Manufactured by forming.
  • Such an optical filter is manufactured, for example, by forming partition walls for partitioning each pixel on a support, and then sequentially forming each type of pixel between the partition walls.
  • an object of the present invention is to provide a composition capable of forming a film in which color mixing is suppressed.
  • Another object of the present invention is to provide a film, an optical filter, an optical sensor, an image display device and a structure.
  • the present invention provides the following.
  • a curable compound a silicone-based surfactant A; including a solvent and
  • the silicone surfactant A has a surface tension of 26 mN at 25° C. when a solution having a solid concentration of 1000 ppm by mass is prepared by dissolving the silicone surfactant A in propylene glycol monomethyl ether acetate. / m or more, Composition.
  • the curable compound contains a resin and a polymerizable monomer, The composition according to ⁇ 1>, further comprising a photopolymerization initiator.
  • ⁇ 3> The composition according to ⁇ 1> or ⁇ 2>, further comprising a colorant.
  • the silica particles are selected from silica particles having a shape in which a plurality of spherical silicas are connected in a beaded shape, silica particles having a shape in which a plurality of spherical silicas are connected in a plane, and silica particles having a hollow structure.
  • ⁇ 7> The composition according to any one of ⁇ 4> to ⁇ 6>, wherein the content of the inorganic particles in the total solid content of the composition is 20% by mass or more.
  • ⁇ 8> The composition according to any one of ⁇ 1> to ⁇ 7>, wherein the silicone surfactant A has a hydroxyl value of 80 mgKOH/g or more.
  • silicone surfactant A is a carbinol-modified dialkylpolysiloxane.
  • silicone surfactant A is a dimethylpolysiloxane having an alkyleneoxy group and a hydroxy group.
  • ⁇ 12> The composition according to any one of ⁇ 1> to ⁇ 11>, wherein the content of the silicone surfactant A in the composition is 1 to 1000 mass ppm.
  • ⁇ 13> A film obtained using the composition according to any one of ⁇ 1> to ⁇ 12>.
  • ⁇ 14> An optical filter comprising the film according to ⁇ 13>.
  • An optical sensor comprising the film according to ⁇ 13>.
  • ⁇ 16> An image display device comprising the film according to ⁇ 13>.
  • the present invention it is possible to provide a composition, a film, an optical filter, an optical sensor, an image display device, and a structure capable of forming a film with suppressed color mixing.
  • FIG. 2 is an enlarged view schematically showing silica particles having a shape in which a plurality of spherical silica particles are connected in a beaded shape.
  • 1 is a side sectional view showing one embodiment of a structure of the present invention; FIG. It is the top view seen from just above the support body in the same structure.
  • ⁇ is used to include the numerical values before and after it as lower and upper limits.
  • a description that does not describe substitution or unsubstituted includes a group (atomic group) having no substituent as well as a group (atomic group) having a substituent.
  • an "alkyl group” includes not only an alkyl group having no substituent (unsubstituted alkyl group) but also an alkyl group having a substituent (substituted alkyl group).
  • exposure includes not only exposure using light but also drawing using particle beams such as electron beams and ion beams, unless otherwise specified.
  • Light used for exposure includes actinic rays or radiation such as emission line spectra of mercury lamps, far ultraviolet rays represented by excimer lasers, extreme ultraviolet rays (EUV light), X-rays, and electron beams.
  • EUV light extreme ultraviolet rays
  • (meth)acrylate” represents both or either acrylate and methacrylate
  • (meth)acryl represents both or either acrylic and methacrylic
  • (meth) ) acryloyl refers to acryloyl and/or methacryloyl.
  • near-infrared light refers to light with a wavelength of 700 to 2500 nm.
  • Me in the structural formulas represents a methyl group
  • Et represents an ethyl group
  • Bu represents a butyl group
  • Ph represents a phenyl group.
  • the weight average molecular weight and number average molecular weight are polystyrene equivalent values measured by GPC (gel permeation chromatography).
  • total solid content refers to the total mass of all components of the composition excluding the solvent.
  • the term “pigment” means a coloring material that is difficult to dissolve in a solvent.
  • the term "process” includes not only an independent process, but also when the intended action of the process is achieved even if it cannot be clearly distinguished from other processes. .
  • composition of the first aspect of the invention comprises a curable compound; a silicone-based surfactant A; including a solvent and The silicone surfactant A has a surface tension of 26 mN/ m or more.
  • composition of the second aspect of the present invention is inorganic particles; a silicone-based surfactant A; including a solvent and
  • the silicone surfactant A has a surface tension of 26 mN/ m or more.
  • composition of the present invention a film with suppressed color mixing can be formed.
  • the composition of the present invention can enhance the affinity of the surface of the obtained film for water by containing the silicone-based surfactant A.
  • another pixel or the like is formed.
  • deposits of other pixel-forming compositions are easily removed from the film surface by the developer or rinse solution, and as a result, residues of other pixel-forming compositions are less likely to be left on the film surface. For this reason, it is presumed that the composition of the present invention was able to form a film in which color mixing was suppressed.
  • the composition of the present invention is preferably a composition for optical sensors or image display devices, and more preferably a composition for optical sensors. More specifically, the composition of the present invention can be preferably used as a composition for forming optical filters, partition walls, and the like used in optical sensors, image display devices, and the like.
  • the composition of the first aspect is preferably used as a composition for forming optical filters.
  • the composition of the second aspect is preferably used as a composition for forming partition walls.
  • silica particles are used as the inorganic particles, a film having a small refractive index can be formed, so that it is preferably used as a composition for forming partition walls.
  • optical filters examples include color filters, near-infrared transmission filters, and near-infrared cut filters, with color filters being preferred.
  • color filters include filters having colored pixels that transmit light of a specific wavelength, and at least one colored pixel selected from red pixels, blue pixels, green pixels, yellow pixels, cyan pixels, and magenta pixels.
  • the filter has A color filter can be formed using a composition containing a chromatic colorant.
  • Examples of near-infrared cut filters include filters having a maximum absorption wavelength in the wavelength range of 700 to 1800 nm.
  • the maximum absorption wavelength of the near-infrared cut filter preferably exists in the wavelength range of 700 to 1300 nm, more preferably in the wavelength range of 700 to 1100 nm.
  • the transmittance of the near-infrared cut filter over the entire wavelength range of 400 to 650 nm is preferably 70% or more, more preferably 80% or more, and even more preferably 90% or more. Also, the transmittance at at least one point in the wavelength range of 700 to 1800 nm is preferably 20% or less.
  • absorbance Amax/absorbance A550 which is the ratio of absorbance Amax at the maximum absorption wavelength of the near-infrared cut filter and absorbance A550 at a wavelength of 550 nm, is preferably 20 to 500, more preferably 50 to 500. , more preferably 70-450, and particularly preferably 100-400.
  • a near-infrared cut filter can be formed using a composition containing a near-infrared absorbing colorant.
  • a near-infrared transmission filter is a filter that transmits at least part of near-infrared rays.
  • the near-infrared transmission filter is preferably a filter that blocks at least part of visible light and transmits at least part of near-infrared light.
  • the near-infrared transmission filter has a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10% or less) in the wavelength range of 400 to 640 nm, and has a transmittance in the wavelength range of 1100 to 1300 nm. Filters satisfying spectral characteristics with a minimum value of 70% or more (preferably 75% or more, more preferably 80% or more) are preferred.
  • the near-infrared transmission filter is preferably a filter that satisfies any one of the following spectral characteristics (1) to (5).
  • the maximum transmittance in the wavelength range of 400 to 640 nm is 20% or less (preferably 15% or less, more preferably 10% or less), and the minimum transmittance in the wavelength range of 800 to 1500 nm is A filter that is 70% or more (preferably 75% or more, more preferably 80% or more).
  • the maximum transmittance in the wavelength range of 400 to 750 nm is 20% or less (preferably 15% or less, more preferably 10% or less), and the minimum transmittance in the wavelength range of 900 to 1500 nm is A filter that is 70% or more (preferably 75% or more, more preferably 80% or more).
  • the maximum transmittance in the wavelength range of 400 to 830 nm is 20% or less (preferably 15% or less, more preferably 10% or less), and the minimum transmittance in the wavelength range of 1000 to 1500 nm is A filter that is 70% or more (preferably 75% or more, more preferably 80% or more).
  • the maximum transmittance in the wavelength range of 400 to 950 nm is 20% or less (preferably 15% or less, more preferably 10% or less), and the minimum transmittance in the wavelength range of 1100 to 1500 nm is A filter that is 70% or more (preferably 75% or more, more preferably 80% or more).
  • the maximum transmittance in the wavelength range of 400 to 1050 nm is 20% or less (preferably 15% or less, more preferably 10% or less), and the minimum transmittance in the wavelength range of 1200 to 1500 nm is A filter that is 70% or more (preferably 75% or more, more preferably 80% or more).
  • partition walls include partition walls used for partitioning adjacent pixels when pixels are formed on an imaging area of a solid-state imaging device.
  • pixels include colored pixels, transparent pixels, pixels of a near-infrared transmission filter layer, and pixels of a near-infrared cut filter layer.
  • partition walls for forming a grid structure that partitions pixels. Examples thereof include JP 2012-227478, JP 2010-232537, JP 2009-111225, FIG. 1 of JP 2017-028241, FIG. 4D of JP 2016-201524 and the like.
  • Other examples include partition walls for forming a frame structure around optical filters such as color filters, near-infrared transmission filters, and near-infrared cut filters. An example thereof is the structure described in JP-A-2014-048596, the content of which is incorporated herein.
  • composition of the present invention can also be used as a composition for forming a light shielding film.
  • the composition of the present invention preferably contains a black colorant as a colorant, and more preferably contains a black pigment.
  • the film formed using the composition of the present invention has an optical density (OD: Optical Density) is preferably 2.5 or more, more preferably 3.0 or more. Although the upper limit is not particularly limited, generally 10 or less is preferable. In this specification, the optical density per 1.5 ⁇ m film thickness in the wavelength region of 400 to 1100 nm is 2.5 or more, which means that the optical density per 1.5 ⁇ m film thickness is 2.5 or more in the entire wavelength range of 400 to 1100 nm. is 2.5 or more.
  • the reflectance of the film is preferably less than 8%, more preferably less than 6%, and even more preferably less than 4%.
  • the lower limit is preferably 0% or more.
  • the reflectance is determined from the reflectance spectrum obtained by using a spectroscope V7200 (trade name) VAR unit manufactured by JASCO Corporation to irradiate light with a wavelength of 400 to 1100 nm at an incident angle of 5°. Specifically, the reflectance of the light having the maximum reflectance in the wavelength range of 400 to 1100 nm is taken as the reflectance of the film.
  • the composition of the present invention is also preferably a composition for pattern formation by photolithography. According to this aspect, fine-sized pixels can be easily formed.
  • a composition containing a component having an ethylenically unsaturated bond-containing group e.g., a resin having an ethylenically unsaturated bond-containing group or a monomer having an ethylenically unsaturated bond-containing group
  • a photopolymerization initiator is preferably used as a composition for pattern formation in photolithography.
  • the composition for pattern formation by photolithography further contains an alkali-soluble resin.
  • the solid content concentration of the composition is preferably 5 to 30% by mass.
  • the lower limit is preferably 7.5% by mass or more, more preferably 10% by mass or more.
  • the upper limit is preferably 25% by mass or less, more preferably 20% by mass or less.
  • composition of the first aspect contains a curable compound.
  • the curable compound include polymerizable compounds and resins.
  • the resin may be a non-polymerizable resin (a resin having no polymerizable group) or a polymerizable resin (a resin having a polymerizable group).
  • Polymerizable groups include ethylenically unsaturated bond-containing groups and cyclic ether groups. Examples of ethylenically unsaturated bond-containing groups include vinyl groups, (meth)allyl groups, and (meth)acryloyl groups.
  • cyclic ether group examples include an epoxy group and an oxetanyl group, with the epoxy group being preferred.
  • the epoxy group may be a cycloaliphatic epoxy group.
  • the alicyclic epoxy group means a monovalent functional group having a cyclic structure in which an epoxy ring and a saturated hydrocarbon ring are condensed.
  • the curable compound it is preferable to use one containing at least a resin.
  • a resin preferably a resin having an acid group
  • a polymerizable monomer monomer-type polymerizable compound
  • a resin preferably a resin having an acid group
  • a polymerizable monomer monomer-type polymerizable compound having an ethylenically unsaturated bond-containing group is more preferably used.
  • polymerizable compound examples include compounds having an ethylenically unsaturated bond-containing group and compounds having a cyclic ether group.
  • a compound having an ethylenically unsaturated bond-containing group can be preferably used as a radically polymerizable compound.
  • a compound having a cyclic ether group can also be preferably used as a cationically polymerizable compound.
  • resin-type polymerizable compounds include resins containing repeating units having polymerizable groups.
  • the molecular weight of the monomer type polymerizable compound is preferably less than 2000, more preferably 1500 or less.
  • the lower limit of the molecular weight of the polymerizable monomer is preferably 100 or more, more preferably 200 or more.
  • the weight average molecular weight (Mw) of the resin-type polymerizable compound is preferably 2,000 to 2,000,000.
  • the upper limit of the weight average molecular weight is preferably 1,000,000 or less, more preferably 500,000 or less.
  • the lower limit of the weight average molecular weight is preferably 3000 or more, more preferably 5000 or more.
  • the compound having an ethylenically unsaturated bond-containing group as a polymerizable monomer is preferably a 3- to 15-functional (meth)acrylate compound, more preferably a 3- to 6-functional (meth)acrylate compound.
  • Specific examples include paragraph numbers 0095 to 0108 of JP-A-2009-288705, paragraph 0227 of JP-A-2013-029760, paragraph numbers 0254-0257 of JP-A-2008-292970, and JP-A-2013-253224.
  • Examples of compounds having an ethylenically unsaturated bond-containing group include dipentaerythritol tri(meth)acrylate (commercially available as KAYARAD D-330; manufactured by Nippon Kayaku Co., Ltd.), and dipentaerythritol tetra(meth)acrylate (commercially available).
  • KAYARAD D-320 manufactured by Nippon Kayaku Co., Ltd.
  • dipentaerythritol penta(meth)acrylate commercially available KAYARAD D-310; manufactured by Nippon Kayaku Co., Ltd.
  • dipentaerythritol hexa(meth)acrylate ) Acrylate commercially available as KAYARAD DPHA; manufactured by Nippon Kayaku Co., Ltd., NK Ester A-DPH-12E; manufactured by Shin-Nakamura Chemical Co., Ltd.
  • the (meth)acryloyl groups of these compounds are ethylene glycol and / Or a compound having a structure linked via a propylene glycol residue (for example, SR454 and SR499 commercially available from Sartomer).
  • Examples of compounds having an ethylenically unsaturated bond-containing group include diglycerin EO (ethylene oxide)-modified (meth)acrylate (commercially available as M-460; manufactured by Toagosei), pentaerythritol tetraacrylate (Shin-Nakamura Chemical Industry ( Ltd., NK Ester A-TMMT), 1,6-hexanediol diacrylate (manufactured by Nippon Kayaku Co., Ltd., KAYARAD HDDA), RP-1040 (manufactured by Nippon Kayaku Co., Ltd.), Aronix TO-2349 (manufactured by Nippon Kayaku Co., Ltd.) Toagosei Co., Ltd.), NK Oligo UA-7200 (Shin-Nakamura Chemical Co., Ltd.), 8UH-1006, 8UH-1012 (Taisei Fine Chemical Co., Ltd.), Light acrylate POB-A0 (Kyoeish
  • Examples of compounds having an ethylenically unsaturated bond-containing group include trimethylolpropane tri(meth)acrylate, trimethylolpropane propylene oxide-modified tri(meth)acrylate, trimethylolpropane ethylene oxide-modified tri(meth)acrylate, and ethylene oxide isocyanurate. It is also preferable to use trifunctional (meth)acrylate compounds such as modified tri(meth)acrylate and pentaerythritol tri(meth)acrylate. Commercial products of trifunctional (meth)acrylate compounds include Aronix M-309, M-310, M-321, M-350, M-360, M-313, M-315, M-306 and M-305.
  • M-303, M-452, M-450 manufactured by Toagosei Co., Ltd.
  • a compound having an ethylenically unsaturated bond-containing group may further have an acid group such as a carboxy group, a sulfo group, or a phosphoric acid group.
  • an acid group such as a carboxy group, a sulfo group, or a phosphoric acid group.
  • Commercially available products of such compounds include Aronix M-305, M-510, M-520 and Aronix TO-2349 (manufactured by Toagosei Co., Ltd.).
  • a compound having a caprolactone structure can also be used as the compound having an ethylenically unsaturated bond-containing group.
  • the descriptions in paragraphs 0042 to 0045 of JP-A-2013-253224 can be referred to, the contents of which are incorporated herein.
  • Compounds having a caprolactone structure include, for example, DPCA-20, DPCA-30, DPCA-60, DPCA-120, etc., which are commercially available as a series from Nippon Kayaku Co., Ltd.
  • a compound having an ethylenically unsaturated bond-containing group and an alkyleneoxy group can also be used as the compound having an ethylenically unsaturated bond-containing group.
  • Such a compound is preferably a compound having an ethylenically unsaturated bond-containing group and an ethyleneoxy group and/or a propyleneoxy group, and is a compound having an ethylenically unsaturated bond-containing group and an ethyleneoxy group. More preferably, it is a tri- to hexa-functional (meth)acrylate compound having 4 to 20 ethyleneoxy groups.
  • a polymerizable compound having a fluorene skeleton can also be used as the compound having an ethylenically unsaturated bond-containing group.
  • Commercially available products include Ogsol EA-0200 and EA-0300 (manufactured by Osaka Gas Chemicals Co., Ltd., (meth)acrylate monomer having a fluorene skeleton).
  • the compound having an ethylenically unsaturated bond-containing group it is also preferable to use a compound such as toluene that does not substantially contain environmentally regulated substances.
  • Commercially available products of such compounds include KAYARAD DPHA LT and KAYARAD DPEA-12 LT (manufactured by Nippon Kayaku Co., Ltd.).
  • Examples of compounds having an ethylenically unsaturated bond-containing group include UA-7200 (manufactured by Shin-Nakamura Chemical Co., Ltd.), DPHA-40H (manufactured by Nippon Kayaku Co., Ltd.), UA-306H, UA-306T, UA- 306I, AH-600, T-600, AI-600, LINC-202UA (manufactured by Kyoeisha Chemical Co., Ltd.), 8UH-1006, 8UH-1012 (manufactured by Taisei Fine Chemical Co., Ltd.), light acrylate POB-A0 ( Kyoeisha Chemical Co., Ltd.) and the like are also preferably used.
  • Compounds having a cyclic ether group include compounds having an epoxy group, compounds having an oxetanyl group, and the like, and compounds having an epoxy group are preferred.
  • Compounds having an epoxy group include compounds having 1 to 100 epoxy groups in one molecule.
  • the upper limit of the number of epoxy groups can be, for example, 10 or less, or 5 or less.
  • the lower limit of the number of epoxy groups is preferably two or more.
  • a compound having a cyclic ether group may be a low-molecular compound (for example, a molecular weight of less than 1000) or a macromolecule (for example, a molecular weight of 1000 or more, and in the case of a polymer, a weight-average molecular weight of 1000 or more).
  • the weight average molecular weight of the cyclic ether group is preferably from 200 to 100,000, more preferably from 500 to 50,000.
  • the upper limit of the weight average molecular weight is preferably 10,000 or less, more preferably 5,000 or less, and even more preferably 3,000 or less.
  • the composition of the present invention can use a resin as a curable compound. It is preferable to use a curable compound containing at least a resin.
  • the resin is blended, for example, for dispersing a pigment or the like in the composition or for a binder.
  • a resin that is mainly used to disperse a pigment or the like in a composition is also called a dispersant.
  • such uses of the resin are only examples, and the resin can be used for purposes other than such uses.
  • a resin having a polymerizable group also corresponds to a polymerizable compound.
  • the weight average molecular weight of the resin is preferably 3,000 to 2,000,000.
  • the upper limit is preferably 1,000,000 or less, more preferably 500,000 or less.
  • the lower limit is preferably 4000 or more, more preferably 5000 or more.
  • resins include (meth)acrylic resins, epoxy resins, ene-thiol resins, polycarbonate resins, polyether resins, polyarylate resins, polysulfone resins, polyethersulfone resins, polyphenylene resins, polyarylene ether phosphine oxide resins, polyimide resins, Polyamide resins, polyamideimide resins, polyolefin resins, cyclic olefin resins, polyester resins, styrene resins, vinyl acetate resins, polyvinyl alcohol resins, polyvinyl acetal resins, polyurethane resins, polyurea resins, and the like.
  • norbornene resin is preferable from the viewpoint of improving heat resistance.
  • Commercially available norbornene resins include, for example, the ARTON series manufactured by JSR Corporation (for example, ARTON F4520). Further, as the resin, the resin described in the examples of International Publication No.
  • a resin having a fluorene skeleton can also be preferably used.
  • the description of US Patent Application Publication No. 2017/0102610 can be referred to, the content of which is incorporated herein.
  • the resin the resin described in paragraphs 0199 to 0233 of JP-A-2020-186373, the alkali-soluble resin described in JP-A-2020-186325, and the Korean Patent Publication No. 10-2020-0078339.
  • a resin represented by the formula 1 can also be used.
  • a resin having an acid group As the resin.
  • acid groups include carboxy groups, phosphoric acid groups, sulfo groups, and phenolic hydroxy groups. Only one kind of these acid groups may be used, or two or more kinds thereof may be used.
  • a resin having an acid group can be used, for example, as an alkali-soluble resin.
  • the acid value of the resin having acid groups is preferably 30-500 mgKOH/g.
  • the lower limit is preferably 50 mgKOH/g or more, more preferably 70 mgKOH/g or more.
  • the upper limit is preferably 400 mgKOH/g or less, more preferably 200 mgKOH/g or less, still more preferably 150 mgKOH/g or less, and most preferably 120 mgKOH/g or less.
  • a resin containing a repeating unit derived from a compound represented by the formula (ED1) and/or a compound represented by the formula (ED2) (hereinafter, these compounds may be referred to as an "ether dimer"). It is also preferred to include
  • R 1 and R 2 each independently represent a hydrogen atom or a hydrocarbon group having 1 to 25 carbon atoms which may have a substituent.
  • R represents a hydrogen atom or an organic group having 1 to 30 carbon atoms.
  • the description in JP-A-2010-168539 can be referred to.
  • paragraph number 0317 of JP-A-2013-029760 can be referred to, the content of which is incorporated herein.
  • polymerizable groups include ethylenically unsaturated bond-containing groups and cyclic ether groups.
  • repeating unit Ep at least one type of repeating unit selected from repeating units represented by formula (Ep-1) and repeating units represented by formula (Ep-2).
  • a resin hereinafter also referred to as resin Ep
  • the resin Ep may contain only one of the repeating units represented by the formula (Ep-1) and the repeating unit represented by the formula (Ep-2). -1) and the repeating unit represented by formula (Ep-2) may be included.
  • the ratio of the repeating unit represented by the formula (Ep-1) to the repeating unit represented by the formula (Ep-2) is the molar ratio represented by the formula (Ep-1).
  • Repeating unit: repeating unit represented by formula (Ep-2) preferably 5:95 to 95:5, more preferably 10:90 to 90:10, 20:80 to 80 :20 is more preferred.
  • L 1 represents a single bond or a divalent linking group
  • R 1 represents a hydrogen atom or a substituent.
  • the substituent represented by R 1 includes an alkyl group and an aryl group, preferably an alkyl group.
  • the number of carbon atoms in the alkyl group is preferably 1-10, more preferably 1-5, and even more preferably 1-3.
  • R 1 is preferably a hydrogen atom or a methyl group.
  • the divalent linking group represented by L 1 includes an alkylene group (preferably an alkylene group having 1 to 12 carbon atoms), an arylene group (preferably an arylene group having 6 to 20 carbon atoms), -NH-, -SO-, -SO 2 -, -CO-, -O-, -COO-, -OCO-, -S- and groups formed by combining two or more of these.
  • the alkylene group may be linear, branched or cyclic, preferably linear or branched.
  • the alkylene group may have a substituent or may be unsubstituted. A hydroxy group, an alkoxy group, etc. are mentioned as a substituent.
  • the content of the repeating unit Ep in the resin Ep is preferably 1 to 100 mol% of all repeating units in the resin Ep.
  • the upper limit is preferably 90 mol % or less, more preferably 80 mol % or less.
  • the lower limit is preferably 2 mol % or more, more preferably 3 mol % or more.
  • the resin Ep may have other repeating units in addition to the repeating unit Ep.
  • Other repeating units include a repeating unit having an acid group, a repeating unit having an ethylenically unsaturated bond-containing group, and the like.
  • the acid group includes a phenolic hydroxy group, a carboxy group, a sulfo group, and a phosphoric acid group, preferably a phenolic hydroxy group or a carboxy group, more preferably a carboxy group.
  • ethylenically unsaturated bond-containing groups examples include vinyl groups, styrene groups, (meth)allyl groups, and (meth)acryloyl groups.
  • the content of the repeating unit having an acid group in the resin Ep is preferably 5 to 85 mol% of all repeating units in the resin Ep.
  • the upper limit is preferably 60 mol % or less, more preferably 40 mol % or less.
  • the lower limit is preferably 8 mol% or more, more preferably 10 mol% or more.
  • the content of the repeating unit having an ethylenically unsaturated bond-containing group in the resin Ep is 1 to 65 mol% of the total repeating units of the resin Ep. is preferably The upper limit is preferably 45 mol % or less, more preferably 30 mol % or less. The lower limit is preferably 2 mol % or more, more preferably 3 mol % or more.
  • the resin Ep preferably further contains a repeating unit having an aromatic hydrocarbon ring.
  • the aromatic hydrocarbon ring is preferably a benzene ring or a naphthalene ring, more preferably a benzene ring.
  • the aromatic hydrocarbon ring may have a substituent. An alkyl group etc. are mentioned as a substituent.
  • the content of the repeating unit having an aromatic hydrocarbon ring is 1 to 65 mol in all repeating units of the resin having a cyclic ether group. %.
  • the upper limit is preferably 45 mol % or less, more preferably 30 mol % or less.
  • the lower limit is preferably 2 mol % or more, more preferably 3 mol % or more.
  • Repeating units having an aromatic hydrocarbon ring include repeating units derived from monofunctional polymerizable compounds having an aromatic hydrocarbon ring, such as vinyl toluene and benzyl (meth)acrylate.
  • R 1 represents a hydrogen atom or a methyl group
  • R 21 and R 22 each independently represent an alkylene group
  • n represents an integer of 0-15.
  • the number of carbon atoms in the alkylene group represented by R 21 and R 22 is preferably 1 to 10, more preferably 1 to 5, even more preferably 1 to 3, particularly 2 or 3.
  • n is preferably an integer of 0-5, more preferably an integer of 0-4, even more preferably an integer of 0-3.
  • Examples of the compound represented by formula (X) include ethylene oxide- or propylene oxide-modified (meth)acrylate of paracumylphenol.
  • Commercially available products include Aronix M-110 (manufactured by Toagosei Co., Ltd.).
  • resin Ac a resin having an aromatic carboxy group
  • the aromatic carboxy group may be contained in the main chain of the repeating unit or may be contained in the side chain of the repeating unit.
  • the aromatic carboxy group is preferably contained in the main chain of the repeating unit.
  • an aromatic carboxy group is a group having a structure in which one or more carboxy groups are bonded to an aromatic ring.
  • the number of carboxy groups bonded to the aromatic ring is preferably 1-4, more preferably 1-2.
  • the composition of the present invention preferably contains a resin as a dispersant.
  • Dispersants include acidic dispersants (acidic resins) and basic dispersants (basic resins).
  • the acidic dispersant (acidic resin) represents a resin in which the amount of acid groups is greater than the amount of basic groups.
  • the acidic dispersant (acidic resin) a resin having an acid group content of 70 mol % or more is preferable when the total amount of the acid group and the basic group is 100 mol %.
  • the acid group possessed by the acidic dispersant (acidic resin) is preferably a carboxy group.
  • the acid value of the acidic dispersant (acidic resin) is preferably 10-105 mgKOH/g.
  • a basic dispersant represents a resin in which the amount of basic groups is greater than the amount of acid groups.
  • a resin containing more than 50 mol % of basic groups is preferable when the total amount of acid groups and basic groups is 100 mol %.
  • the basic group possessed by the basic dispersant is preferably an amino group.
  • the resin used as the dispersant is also preferably a graft resin.
  • graft resin for details of the graft resin, reference can be made to paragraphs 0025 to 0094 of JP-A-2012-255128, the contents of which are incorporated herein.
  • the resin used as the dispersant is also preferably a polyimine-based dispersant containing nitrogen atoms in at least one of its main chain and side chains.
  • the polyimine-based dispersant has a main chain having a partial structure having a functional group with a pKa of 14 or less and a side chain having 40 to 10,000 atoms, and at least one of the main chain and the side chain has a basic nitrogen atom.
  • a resin having The basic nitrogen atom is not particularly limited as long as it is a nitrogen atom exhibiting basicity.
  • the description in paragraphs 0102 to 0166 of JP-A-2012-255128 can be referred to, and the contents thereof are incorporated herein.
  • the resin used as the dispersant is also preferably a resin having a structure in which a plurality of polymer chains are bonded to the core.
  • resins include, for example, dendrimers (including star polymers). Further, specific examples of dendrimers include polymer compounds C-1 to C-31 described in paragraphs 0196 to 0209 of JP-A-2013-043962.
  • the resin used as the dispersant is also preferably a resin containing a repeating unit having an ethylenically unsaturated bond-containing group in its side chain.
  • the content of repeating units having an ethylenically unsaturated bond-containing group in the side chain is preferably 10 mol% or more, more preferably 10 to 80 mol%, more preferably 20 to 70, of the total repeating units of the resin. More preferably, it is mol %.
  • resins described in JP-A-2018-087939, block copolymers (EB-1) to (EB-9) described in paragraphs 0219 to 0221 of Japanese Patent No. 6432077, Polyethyleneimine having a polyester side chain described in International Publication No. 2016/104803, a block copolymer described in International Publication No. 2019/125940, a block polymer having an acrylamide structural unit described in JP-A-2020-066687 , a block polymer having an acrylamide structural unit described in JP-A-2020-066688, a dispersant described in WO 2016/104803, and the like can also be used.
  • Dispersants are also available as commercial products, and specific examples thereof include Disperbyk series manufactured by BYK-Chemie (e.g., Disperbyk-111, 161, 2001, etc.), Solsperse manufactured by Nippon Lubrizol Co., Ltd. series (for example, Solsperse 20000, 76500, etc.), Ajinomoto Fine-Techno Co., Inc. Ajisper series, and the like.
  • Dispersants are also available as commercial products, and specific examples thereof include Disperbyk series manufactured by BYK-Chemie (e.g., Disperbyk-111, 161, 2001, etc.), Solsperse manufactured by Nippon Lubrizol Co., Ltd. series (for example, Solsperse 20000, 76500, etc.), Ajinomoto Fine-Techno Co., Inc. Ajisper series, and the like.
  • the content of the curable compound in the total solid content of the composition is preferably 1 to 70% by mass.
  • the lower limit is preferably 2% by mass or more, more preferably 3% by mass or more, and even more preferably 5% by mass or more.
  • the upper limit is preferably 65% by mass or less, more preferably 60% by mass or less.
  • the composition of the present invention may contain only one kind of curable compound, or may contain two or more kinds. When two or more curable compounds are included, the total amount thereof is preferably within the above range.
  • the content of the polymerizable compound is preferably 1 to 70% by mass based on the total solid content of the composition.
  • the lower limit is preferably 2% by mass or more, more preferably 3% by mass or more, and even more preferably 5% by mass or more.
  • the upper limit is preferably 65% by mass or less, more preferably 60% by mass or less.
  • the composition of the present invention may contain only one polymerizable compound, or may contain two or more polymerizable compounds. When two or more polymerizable compounds are included, the total amount thereof is preferably within the above range.
  • the content of the polymerizable monomer is preferably 1 to 50% by mass based on the total solid content of the composition.
  • the lower limit is preferably 2% by mass or more, more preferably 3% by mass or more, and even more preferably 5% by mass or more.
  • the upper limit is preferably 35% by mass or less, more preferably 30% by mass or less, and even more preferably 20% by mass or less.
  • the composition of the present invention may contain only one polymerizable monomer, or may contain two or more polymerizable monomers. When two or more polymerizable monomers are included, the total amount thereof is preferably within the above range.
  • the content of the resin is preferably 1 to 70% by mass based on the total solid content of the composition.
  • the lower limit is preferably 2% by mass or more, more preferably 3% by mass or more, and even more preferably 5% by mass or more.
  • the upper limit is preferably 65% by mass or less, more preferably 60% by mass or less.
  • the content of the resin having an acid group is preferably 1 to 70% by mass based on the total solid content of the composition.
  • the lower limit is preferably 2% by mass or more, more preferably 3% by mass or more, and even more preferably 5% by mass or more.
  • the upper limit is preferably 65% by mass or less, more preferably 60% by mass or less.
  • the content of the alkali-soluble resin is preferably 1 to 70% by mass based on the total solid content of the composition.
  • the lower limit is preferably 2% by mass or more, more preferably 3% by mass or more, and even more preferably 5% by mass or more.
  • the upper limit is preferably 65% by mass or less, more preferably 60% by mass or less.
  • the content of the resin as a dispersant is preferably 0.1 to 30% by mass based on the total solid content of the composition.
  • the upper limit is preferably 25% by mass or less, more preferably 20% by mass or less.
  • the lower limit is preferably 0.5% by mass or more, more preferably 1% by mass or more.
  • the content of the resin as a dispersant is preferably 1 to 100 parts by mass with respect to 100 parts by mass of the pigment.
  • the upper limit is preferably 80 parts by mass or less, more preferably 70 parts by mass or less, and even more preferably 60 parts by mass or less.
  • the lower limit is preferably 5 parts by mass or more, more preferably 10 parts by mass or more, and even more preferably 20 parts by mass or more.
  • the composition of the present invention may contain only one resin, or may contain two or more resins. When two or more resins are included, the total amount thereof is preferably within the above range.
  • the composition of the first aspect contains a silicone-based surfactant A (hereinafter referred to as a specific silicone-based surfactant) exhibiting a specific surface tension shown below.
  • a silicone-based surfactant A hereinafter referred to as a specific silicone-based surfactant
  • the surface tension of the solution is preferably 26.5 mN/m or more, more preferably 27 mN/m or more, and even more preferably 27.2 mN/m or more.
  • the upper limit is preferably 28 mN/m or less.
  • a silicone-based surfactant is a compound having a repeating unit containing a siloxane bond in its main chain and containing a hydrophobic part and a hydrophilic part in one molecule.
  • the specific silicone-based surfactant is preferably a compound containing no fluorine atoms. According to this aspect, the uniformity of the surface tension is likely to be improved, and the effects of the present invention are likely to be obtained more remarkably.
  • the hydroxyl value of the specific silicone surfactant is preferably 80 mgKOH/g or more, more preferably 90 mgKOH/g or more, still more preferably 100 mgKOH/g or more, and preferably 110 mgKOH/g or more. Especially preferred. If the hydroxyl value of the specific silicone-based surfactant is 80 mgKOH/g or more, the affinity of the film surface for water can be further enhanced.
  • the upper limit of the hydroxyl value of the specific silicone surfactant is preferably 200 mgKOH/g or less, more preferably 190 mgKOH/g or less, and 180 mgKOH/g or less from the viewpoint of the function as a surfactant. is more preferred.
  • the kinematic viscosity at 25° C. of the specific silicone surfactant is preferably 40 mm 2 /s or less, more preferably 38 mm 2 /s or less, even more preferably 36 mm 2 /s or less. If the kinematic viscosity of the specific silicone-based surfactant is 40 mm 2 /s or less, the fluidity is high, so the fluidity of the film surface obtained by using the composition of the present invention can be enhanced. Therefore, when another pixel is formed using another pixel-forming composition at a position adjacent to the film formed using the composition of the present invention, the fluidity of the film surface is high.
  • the lower limit of the kinematic viscosity of the specific silicone-based surfactant is preferably 10 mm 2 /s or more, more preferably 15 mm 2 /s or more, and 20 mm 2 /s or more from the viewpoint of the function of the surfactant. is more preferable, and 25 mm 2 /s or more is particularly preferable.
  • the weight-average molecular weight of the specific silicone-based surfactant is preferably 500-30,000.
  • the specific silicone-based surfactant is preferably modified polysiloxane.
  • modified polysiloxane include compounds having a structure in which substituents are introduced into the side chains and/or terminals of polysiloxane.
  • substituents include groups containing functional groups selected from amino groups, epoxy groups, alicyclic epoxy groups, hydroxyl groups, mercapto groups, carboxy groups, fatty acid ester groups and fatty acid amide groups, and groups containing polyether chains. and is preferably a group containing a hydroxy group, more preferably a group having an alkyleneoxy group and a hydroxy group.
  • the group containing a hydroxy group is preferably a group represented by formula (G-1) or a group represented by formula (G-2).
  • G-1 a group represented by formula (G-2)
  • G-2 a group represented by formula (G-2)
  • LG1 represents a single bond or a divalent linking group.
  • the divalent linking group represented by L G1 includes an alkylene group (preferably an alkylene group having 1 to 12 carbon atoms, more preferably an alkylene group having 1 to 6 carbon atoms), an arylene group (preferably an arylene group having 6 to 20 carbon atoms). , more preferably 6 to 12 arylene groups), -NH-, -SO-, -SO 2 -, -CO-, -O-, -COO-, -OCO-, -S- and two or more of these A group formed by combination is mentioned.
  • m1 represents an integer of 0 or 1 or more, preferably an integer of 1 to 10, more preferably an integer of 1 to 5.
  • R G1 represents an alkylene group.
  • the number of carbon atoms in the alkylene group is preferably 1-10, more preferably 1-5, still more preferably 1-3, and particularly preferably 2 or 3.
  • the alkylene group represented by R G1 may be linear or branched.
  • the alkylene groups represented by m1 R G1 may be the same or different.
  • Groups containing polyether chains include groups represented by the following formula (G-11) and groups represented by formula (G-12).
  • LG11 represents a single bond or a divalent linking group.
  • the divalent linking group represented by L G11 includes an alkylene group (preferably an alkylene group having 1 to 12 carbon atoms, more preferably an alkylene group having 1 to 6 carbon atoms), an arylene group (preferably an arylene group having 6 to 20 carbon atoms). , more preferably 6 to 12 arylene groups), -NH-, -SO-, -SO 2 -, -CO-, -O-, -COO-, -OCO-, -S- and two or more of these A group formed by combination is mentioned.
  • m2 represents a number of 2 or more, preferably 2-200.
  • R G11 represents an alkylene group.
  • the alkylene group preferably has 1 to 10 carbon atoms, more preferably 1 to 5 carbon atoms, still more preferably 1 to 3 carbon atoms, and particularly preferably 2 or 3 carbon atoms.
  • the alkylene group represented by R G11 may be linear or branched.
  • the alkylene groups represented by m2 R G11 may be the same or different.
  • R G12 represents an alkyl group or an aryl group.
  • the number of carbon atoms in the alkyl group represented by R 1 G12 is preferably 1-10, more preferably 1-5, even more preferably 1-3.
  • Alkyl groups may be straight or branched.
  • the aryl group represented by R G12 preferably has 6 to 20 carbon atoms, more preferably 6 to 10 carbon atoms.
  • the specific silicone-based surfactant is preferably carbinol-modified polysiloxane, more preferably carbinol-modified dialkylpolysiloxane. Moreover, the specific silicone-based surfactant is preferably dimethylpolysiloxane having an alkyleneoxy group and a hydroxy group.
  • the specific silicone surfactant is preferably a compound represented by formula (Si-1) or formula (Si-2).
  • R S1 to R S7 each independently represent an alkyl group or an aryl group
  • X S1 represents a group represented by the above formula (G-1) or a group represented by formula (G-2)
  • n1 represents a number from 2 to 200;
  • R S11 to R S16 each independently represent an alkyl group or an aryl group
  • X S11 and X S12 each independently represent a group represented by formula (G-1) or a group represented by formula (G-2)
  • n11 represents a number from 2 to 200
  • the number of carbon atoms in the alkyl group represented by R S1 to R S7 in formula (Si-1) and the alkyl group represented by R S11 to R S16 in formula (Si-2) is preferably 1 to 10, more preferably 1 to 5. 1 to 3 are more preferred, and 1 is particularly preferred.
  • the above alkyl group may be linear or branched, but preferably linear.
  • the number of carbon atoms in the aryl group represented by R S1 to R S7 in formula (Si-1) and the aryl group represented by R S11 to R S16 in formula (Si-2) is preferably 6 to 20, more preferably 6 to 12. 6 is particularly preferred.
  • R S1 to R S7 and R S11 to R S16 are preferably methyl groups or phenyl groups, more preferably methyl groups.
  • n1 and n11 are preferably numbers from 1 to 100.
  • Specific examples of specific silicone-based surfactants include the compounds described in the examples below.
  • the content of the specific silicone-based surfactant in the composition is preferably 1 to 1000 mass ppm.
  • the lower limit is preferably 0.5 mass ppm or more, and preferably 1 mass ppm or more.
  • the upper limit is preferably 750 mass ppm or less, more preferably 500 mass ppm or less.
  • the composition of the first aspect may contain a surfactant (hereinafter also referred to as another surfactant) other than the specific silicone surfactant described above.
  • a surfactant hereinafter also referred to as another surfactant
  • Other surfactants include fluorosurfactants, nonionic surfactants, cationic surfactants, anionic surfactants, and the like.
  • silicone-based surfactants other than the above-mentioned specific silicone-based surfactants can also be used as other surfactants.
  • JP 2014-041318 Paragraph Nos. 0060 to 0064 (corresponding International Publication No. 2014/017669 Paragraph Nos. 0060 to 0064) surfactants described in, JP 2011- Examples include surfactants described in paragraphs 0117 to 0132 of JP-A-132503 and surfactants described in JP-A-2020-008634, the contents of which are incorporated herein.
  • Commercially available fluorosurfactants include Megafac F-171, F-172, F-173, F-176, F-177, F-141, F-142, F-143 and F-144.
  • the fluorosurfactant has a molecular structure with a functional group containing a fluorine atom, and an acrylic compound in which the functional group containing a fluorine atom is cleaved and the fluorine atom volatilizes when heat is applied is also suitable.
  • fluorine-based surfactants include MegaFac DS series manufactured by DIC Corporation (Chemical Daily (February 22, 2016), Nikkei Sangyo Shimbun (February 23, 2016)), for example, Mega Fac DS-21.
  • fluorosurfactant it is also preferable to use a polymer of a fluorine atom-containing vinyl ether compound having a fluorinated alkyl group or a fluorinated alkylene ether group and a hydrophilic vinyl ether compound as the fluorosurfactant.
  • fluorosurfactants include fluorosurfactants described in JP-A-2016-216602, the contents of which are incorporated herein.
  • a block polymer can also be used as the fluorosurfactant.
  • the fluorosurfactant has 2 or more (preferably 5 or more) repeating units derived from a (meth)acrylate compound having a fluorine atom and an alkyleneoxy group (preferably an ethyleneoxy group or a propyleneoxy group) (meta).
  • a fluorine-containing polymer compound containing a repeating unit derived from an acrylate compound can also be preferably used.
  • the fluorine-containing surfactants described in paragraphs 0016 to 0037 of JP-A-2010-032698 and the following compounds are also exemplified as fluorine-based surfactants used in the present invention.
  • the weight average molecular weight of the above compound is preferably 3000-50000, for example 14000. In the above compounds, % indicating the ratio of repeating units is mol%.
  • a fluoropolymer having an ethylenically unsaturated bond-containing group in a side chain can also be used as the fluorosurfactant.
  • Specific examples include compounds described in paragraph numbers 0050 to 0090 and paragraph numbers 0289 to 0295 of JP-A-2010-164965, MEGAFACE RS-101, RS-102 and RS-718K manufactured by DIC Corporation, and RS-72-K.
  • compounds described in paragraphs 0015 to 0158 of JP-A-2015-117327 can also be used.
  • a fluorine-containing imide salt compound represented by formula (fi-1) is a surfactant.
  • m represents 1 or 2
  • n represents an integer of 1 to 4
  • a represents 1 or 2
  • X a + is a valent metal ion, primary ammonium ion, Represents secondary ammonium ion, tertiary ammonium ion, quaternary ammonium ion or NH4 + .
  • Nonionic surfactants include glycerol, trimethylolpropane, trimethylolethane and their ethoxylates and propoxylates (e.g., glycerol propoxylate, glycerol ethoxylate, etc.), polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, Polyoxyethylene oleyl ether, polyoxyethylene octylphenyl ether, polyoxyethylene nonylphenyl ether, polyethylene glycol dilaurate, polyethylene glycol distearate, sorbitan fatty acid ester, Pluronic L10, L31, L61, L62, 10R5, 17R2, 25R2 (BASF company), Tetronic 304, 701, 704, 901, 904, 150R1 (manufactured by BASF), Solsperse 20000 (manufactured by Nippon Lubrizol Co., Ltd.), NCW-101, NCW-1001, NCW-1002 (Fuji
  • Cationic surfactants include tetraalkylammonium salts, alkylamine salts, benzalkonium salts, alkylpyridium salts, imidazolium salts, and the like. Specific examples include dihydroxyethylstearylamine, 2-heptadecenyl-hydroxyethylimidazoline, lauryldimethylbenzylammonium chloride, cetylpyridinium chloride, stearamidomethylpyridinium chloride and the like.
  • Anionic surfactants include dodecylbenzenesulfonic acid, sodium dodecylbenzenesulfonate, sodium lauryl sulfate, sodium alkyldiphenyletherdisulfonate, sodium alkylnaphthalenesulfonate, sodium dialkylsulfosuccinate, sodium stearate, potassium oleate, sodium dioctyl Sulfosuccinate, sodium polyoxyethylene alkyl ether sulfate, sodium polyoxyethylene alkyl ether sulfate, sodium polyoxyethylene alkylphenyl ether sulfate, sodium dialkyl sulfosuccinate, sodium stearate, sodium oleate, t-octylphenoxyethoxypolyethoxyethyl sodium sulfate and the like.
  • the content of other surfactants in the composition is preferably 1000 mass ppm or less, more preferably 500 mass ppm or less, and even more preferably 250 mass ppm or less.
  • the lower limit can be, for example, 1 ppm by mass or more.
  • the content of the other surfactant is preferably 100 parts by mass or less, more preferably 50 parts by mass or less, and 25 parts by mass or less with respect to 100 parts by mass of the specific silicone surfactant. is more preferable.
  • the lower limit can be, for example, 1 part by mass or more. It is also preferred that the compositions of the present invention do not contain other surfactants.
  • the composition of the first aspect contains a solvent.
  • Solvents include water and organic solvents.
  • the type of solvent is basically not particularly limited as long as it satisfies the solubility of each component and the coatability of the composition.
  • organic solvents include aliphatic hydrocarbon solvents, halogenated hydrocarbon solvents, alcohol solvents, ether solvents, ester solvents, ketone solvents, nitrile solvents, amide solvents, sulfoxide solvents, and aromatic solvents. Examples include solvents. For these details, reference can be made to paragraph 0223 of WO2015/166779, the content of which is incorporated herein.
  • Ester-based solvents substituted with cyclic alkyl groups and ketone-based solvents substituted with cyclic alkyl groups can also be preferably used.
  • organic solvents include polyethylene glycol monomethyl ether, dichloromethane, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, ethyl cellosolve acetate, ethyl lactate, diethylene glycol dimethyl ether, butyl acetate, methyl 3-methoxypropionate, 2 -heptanone, 2-pentanone, 3-pentanone, 4-heptanone, cyclohexanone, 2-methylcyclohexanone, 3-methylcyclohexanone, 4-methylcyclohexanone, cycloheptanone, cyclooctanone, cyclohexyl acetate, cyclopentanone, ethylcarbitol Acetate, butyl carbitol acetate, propylene
  • aromatic hydrocarbons (benzene, toluene, xylene, ethylbenzene, etc.) as organic solvents may be better reduced for environmental reasons (e.g., 50 mass ppm (parts per million), 10 mass ppm or less, or 1 mass ppm or less).
  • an organic solvent with a low metal content it is preferable to use an organic solvent with a low metal content.
  • the metal content of the organic solvent is preferably, for example, 10 mass ppb (parts per billion) or less. If necessary, an organic solvent at a ppt (parts per trillion) level by mass may be used, and such an organic solvent is provided, for example, by Toyo Gosei Co., Ltd. (Chemical Daily, November 13, 2015). .
  • Examples of methods for removing impurities such as metals from organic solvents include distillation (molecular distillation, thin film distillation, etc.) and filtration using a filter.
  • the filter pore size of the filter used for filtration is preferably 10 ⁇ m or less, more preferably 5 ⁇ m or less, and even more preferably 3 ⁇ m or less.
  • the material of the filter is preferably polytetrafluoroethylene, polyethylene or nylon.
  • the organic solvent may contain isomers (compounds with the same number of atoms but different structures). Moreover, only one isomer may be contained, or a plurality of isomers may be contained.
  • the content of peroxide in the organic solvent is preferably 0.8 mmol/L or less, and more preferably substantially free of peroxide.
  • the solvent content in the composition is preferably 10 to 95% by mass, more preferably 20 to 90% by mass, even more preferably 30 to 90% by mass.
  • the composition of the present invention may contain only one type of solvent, or may contain two or more types. When two or more solvents are included, the total amount thereof is preferably within the above range.
  • the composition of the first aspect preferably contains a coloring material.
  • a composition for forming optical filters more specifically, for forming pixels of optical filters.
  • colorants examples include white colorants, black colorants, chromatic colorants, and near-infrared absorbing colorants.
  • the white colorant includes not only a pure white colorant but also a light gray colorant close to white (for example, grayish white, light gray, etc.).
  • the colorant preferably contains at least one selected from the group consisting of a chromatic colorant, a black colorant, and a near-infrared absorbing colorant, and at least one selected from the group consisting of a chromatic colorant and a black colorant. It is more preferable to contain a seed, and it is still more preferable to contain a chromatic coloring material.
  • the colorant preferably contains two or more chromatic colorants and a near-infrared absorbing colorant.
  • black may be formed by a combination of two or more chromatic colorants.
  • the colorant preferably contains a black colorant and a near-infrared absorbing colorant.
  • the composition of the present invention can be preferably used as a composition for forming a near-infrared transmission filter.
  • the coloring material may be a pigment or a dye, but is preferably a pigment.
  • the average primary particle size of the pigment is preferably 1 to 200 nm.
  • the lower limit is preferably 5 nm or more, more preferably 10 nm or more.
  • the upper limit is preferably 180 nm or less, more preferably 150 nm or less, and even more preferably 100 nm or less.
  • the primary particle diameter of the pigment can be determined from the image photograph obtained by observing the primary particles of the pigment with a transmission electron microscope. Specifically, the projected area of the primary particles of the pigment is determined, and the corresponding circle-equivalent diameter is calculated as the primary particle diameter of the pigment.
  • the average primary particle size in this specification is the arithmetic mean value of the primary particle sizes of 400 primary particles of the pigment.
  • the primary particles of the pigment refer to independent particles without agglomeration.
  • chromatic coloring materials include coloring materials having a maximum absorption wavelength in the wavelength range of 400 to 700 nm. Examples thereof include green colorants, red colorants, yellow colorants, purple colorants, blue colorants, and orange colorants.
  • green colorants examples include phthalocyanine compounds and squarylium compounds, with phthalocyanine compounds being preferred.
  • the green colorant is preferably a pigment.
  • Specific examples of the green colorant include C.I. I. Green pigments such as Pigment Green 7, 10, 36, 37, 58, 59, 62, 63, 64, 65 and 66 are included.
  • a halogenated zinc phthalocyanine having an average number of halogen atoms in one molecule of 10 to 14, an average number of bromine atoms of 8 to 12, and an average number of chlorine atoms of 2 to 5 Pigments can also be used. Specific examples include compounds described in International Publication No. 2015/118720.
  • the compound described in Chinese Patent Application No. 106909027 the phthalocyanine compound having a phosphoric acid ester as a ligand described in WO 2012/102395, described in JP 2019-008014.
  • the phthalocyanine compound, the phthalocyanine compound described in JP-A-2018-180023, the compound described in JP-A-2019-038958, the aluminum phthalocyanine compound described in JP-A-2020-070426, JP-A-2020-076995 Core-shell type dyes described in, diarylmethane compounds described in JP-A-2020-504758, and the like can also be used.
  • the green coloring material is C.I. I. Pigment Green 7, 36, 58, 59, 62 and 63 are preferred, C.I. I. Pigment Green 7, 36, 58 and 59 are more preferred.
  • red colorants examples include diketopyrrolopyrrole compounds, anthraquinone compounds, azo compounds, naphthol compounds, azomethine compounds, xanthene compounds, quinacridone compounds, perylene compounds, thioindigo compounds, and diketopyrrolopyrrole compounds, anthraquinone compounds, azo It is preferably a compound, more preferably a diketopyrrolopyrrole compound. Also, the red colorant is preferably a pigment. Specific examples of the red colorant include C.I. I.
  • a red colorant a diketopyrrolopyrrole compound in which at least one bromine atom is substituted in the structure described in JP-A-2017-201384, a diketopyrrolopyrrole described in paragraph numbers 0016 to 0022 of Japanese Patent No.
  • 10-2019-0140741 anthraquinone compound described in Korean Patent Publication No. 10-2019-0140744, JP 2020 -Perylene compounds described in JP-A-079396, perylene compounds described in JP-A-2020-083982, xanthene compounds described in JP-A-2018-035345, paragraph numbers 0025 to 0041 of JP-A-2020-066702
  • the described diketopyrrolopyrrole compounds and the like can also be used.
  • red colorant a compound having a structure in which an aromatic ring group in which a group having an oxygen atom, a sulfur atom or a nitrogen atom is bonded to an aromatic ring is bonded to a diketopyrrolopyrrole skeleton is used.
  • Lumogen F Orange 240 manufactured by BASF, red pigment, perylene pigment
  • red colorant can also be used as the red colorant.
  • the red coloring material is C.I. I. Pigment Red 122, 177, 179, 254, 255, 264, 269, 272 and 291 are preferred, and C.I. I. Pigment Red 254, 264, 272 are more preferred.
  • yellow colorants examples include azo compounds, azomethine compounds, isoindoline compounds, pteridine compounds, quinophthalone compounds and perylene compounds.
  • the yellow colorant is preferably a pigment, more preferably an azo pigment, an azomethine pigment, an isoindoline pigment, a pteridine pigment, a quinophthalone pigment, or a perylene pigment, and more preferably an azo pigment or an azomethine pigment.
  • Specific examples of the yellow coloring material include C.I. I.
  • a nickel azobarbiturate complex having the following structure can also be used.
  • X 1 to X 16 each independently represent a hydrogen atom or a halogen atom
  • Z 1 represents an alkylene group having 1 to 3 carbon atoms.
  • Specific examples of the compound represented by formula (QP1) include compounds described in paragraph 0016 of Japanese Patent No. 6443711.
  • Y 1 to Y 3 each independently represent a halogen atom.
  • n and m are integers of 0 to 6; p is an integer of 0 to 5; (n+m) is 1 or more.
  • Specific examples of the compound represented by formula (QP2) include compounds described in paragraphs 0047 to 0048 of Japanese Patent No. 6432077.
  • the yellow coloring material is C.I. I. Pigment Yellow 117, 129, 138, 139, 150 and 185 are preferred.
  • C.I. I. Pigment Orange 2 5, 13, 16, 17: 1, 31, 34, 36, 38, 43, 46, 48, 49, 51, 52, 55, 59, 60, 61, 62, 64, 71, 73, etc. of orange pigments.
  • C.I. I. Purple pigments such as Pigment Violet 1, 19, 23, 27, 32, 37, 42, 60, 61 are included.
  • C.I. I. pigment blue 1, 2, 15, 15: 1, 15: 2, 15: 3, 15: 4, 15: 6, 16, 22, 29, 60, 64, 66, 79, 80, 87, 88, etc. be done.
  • An aluminum phthalocyanine compound having a phosphorus atom can also be used as the blue colorant. Specific examples include compounds described in paragraph numbers 0022 to 0030 of JP-A-2012-247591 and paragraph number 0047 of JP-A-2011-157478.
  • Dyes can also be used as chromatic colorants.
  • the dye is not particularly limited, and known dyes can be used.
  • a pigment multimer can also be used as a chromatic colorant.
  • the dye multimer is preferably a dye dissolved in an organic solvent. Further, the dye multimer may form particles. When the dye multimer is particles, it is usually used in a state of being dispersed in a solvent.
  • the particulate dye multimer can be obtained, for example, by emulsion polymerization, and specific examples include the compounds and production methods described in JP-A-2015-214682.
  • a dye multimer has two or more dye structures in one molecule, and preferably has three or more dye structures. The upper limit is not particularly limited, but may be 100 or less.
  • a plurality of dye structures in one molecule may be the same dye structure or different dye structures.
  • the weight average molecular weight (Mw) of the dye multimer is preferably 2,000 to 50,000.
  • the lower limit is more preferably 3000 or more, and even more preferably 6000 or more.
  • the upper limit is more preferably 30,000 or less, and even more preferably 20,000 or less.
  • Dye multimers are described in JP-A-2011-213925, JP-A-2013-041097, JP-A-2015-028144, JP-A-2015-030742, WO 2016/031442, etc. Compounds can also be used.
  • the chromatic colorants include diarylmethane compounds described in JP-A-2020-504758, triarylmethane dye polymers described in Korean Patent Publication No. 10-2020-0028160, and JP-A-2020-117638.
  • Xanthene compounds described phthalocyanine compounds described in International Publication No. 2020/174991, isoindoline compounds described in JP-A-2020-160279 or salts thereof,
  • Korean Patent Publication No. 10-2020-0069442 described Compound represented by Formula 1, compound represented by Formula 1 described in Korean Patent Publication No. 10-2020-0069730, represented by Formula 1 described in Korean Patent Publication No. 10-2020-0069070 Compounds, compounds represented by Formula 1 described in Korean Patent Publication No.
  • the chromatic colorant may be a rotaxane, and the dye skeleton may be used in the cyclic structure of the rotaxane, may be used in the rod-like structure, or may be used in both structures.
  • Two or more chromatic colorants may be used in combination. When two or more chromatic colorants are used in combination, black may be formed by combining two or more chromatic colorants. Examples of such combinations include the following aspects (1) to (7).
  • a mode containing a red colorant, a blue colorant, a yellow colorant, a purple colorant, and a green colorant are examples of such combinations.
  • a mode containing a red colorant, a blue colorant, a yellow colorant, and a green colorant (6) A mode containing a red colorant, a blue colorant, and a green colorant. (7) A mode containing a yellow colorant and a purple colorant.
  • White colorants include titanium oxide, strontium titanate, barium titanate, zinc oxide, magnesium oxide, zirconium oxide, aluminum oxide, barium sulfate, silica, talc, mica, aluminum hydroxide, calcium silicate, aluminum silicate, Examples include inorganic pigments (white pigments) such as zinc sulfide.
  • the white pigment is preferably particles containing titanium atoms, more preferably titanium oxide.
  • the white pigment is preferably particles having a refractive index of 2.10 or more for light with a wavelength of 589 nm. The aforementioned refractive index is preferably 2.10 to 3.00, more preferably 2.50 to 2.75.
  • the white pigment can also use the titanium oxide described in "Titanium Oxide Physical Properties and Application Techniques Manabu Seino, Pages 13-45, June 25, 1991, published by Gihodo Publishing".
  • the white pigment is not only made of a single inorganic substance, but also particles combined with other materials may be used.
  • particles having voids or other materials inside, particles in which a large number of inorganic particles are attached to a core particle, and core-shell composite particles consisting of a core particle made of polymer particles and a shell layer made of inorganic nanoparticles are used. is preferred.
  • the core and shell composite particles composed of the core particles composed of the polymer particles and the shell layer composed of the inorganic nanoparticles for example, the description of paragraphs 0012 to 0042 of JP-A-2015-047520 can be referred to, The contents of which are incorporated herein.
  • Hollow inorganic particles can also be used as the white pigment.
  • a hollow inorganic particle is an inorganic particle having a structure having a cavity inside, and refers to an inorganic particle having a cavity surrounded by an outer shell.
  • Examples of hollow inorganic particles include hollow inorganic particles described in JP 2011-075786, WO 2013/061621, JP 2015-164881, etc., the contents of which are incorporated herein. be
  • the black colorant is not particularly limited, and known ones can be used.
  • the black colorant is preferably a pigment (black pigment).
  • the black colorant means a colorant that exhibits absorption over the entire wavelength range of 400 to 700 nm.
  • inorganic black colorants include carbon black, titanium black, graphite, etc. Carbon black and titanium black are preferred, and titanium black is more preferred.
  • Titanium black is black particles containing titanium atoms, preferably low order titanium oxide or titanium oxynitride. Titanium black can be surface-modified as necessary for the purpose of improving dispersibility, suppressing cohesion, and the like.
  • Titanium black preferably has a small primary particle size and an average primary particle size of individual particles. Specifically, the average primary particle size is preferably 10 to 45 nm. Titanium black can also be used as a dispersion.
  • a dispersion containing titanium black particles and silica particles, in which the content ratio of Si atoms and Ti atoms in the dispersion is adjusted to a range of 0.20 to 0.50 may be mentioned.
  • the description in paragraphs 0020 to 0105 of JP-A-2012-169556 can be referred to, and the contents thereof are incorporated herein.
  • Commercially available examples of titanium black include titanium black 10S, 12S, 13R, 13M, 13M-C, 13R-N, 13M-T (trade name: manufactured by Mitsubishi Materials Corporation), Tilac D ( Trade name: manufactured by Ako Kasei Co., Ltd.) and the like.
  • organic black colorants examples include bisbenzofuranone compounds, azomethine compounds, perylene compounds, and azo compounds, with bisbenzofuranone compounds and perylene compounds being preferred.
  • bisbenzofuranone compound JP-A-2010-534726, JP-A-2012-515233, JP-A-2012-515234, International Publication No. 2014/208348, JP-A-2015-525260, etc. compounds, for example, available as "Irgaphor Black" manufactured by BASF.
  • a perylene compound examples include compounds described in JP-A-01-170601, JP-A-02-034664, and the like.
  • perylene black Liogen Black FK4280, etc. described in paragraphs 0016 to 0020 of JP-A-2017-226821 may be used.
  • the near-infrared absorbing colorant is preferably a compound having a maximum absorption wavelength in the wavelength range of more than 700 nm and 1400 nm or less.
  • the maximum absorption wavelength of the near-infrared absorbing colorant is preferably 1200 nm or less, more preferably 1000 nm or less, and even more preferably 950 nm or less.
  • the near-infrared absorbing colorant preferably has an A 550 /A max ratio of the absorbance A 550 at a wavelength of 550 nm to the absorbance A max at the maximum absorption wavelength of 0.1 or less, and preferably 0.05 or less.
  • the near-infrared absorbing colorant may be a pigment or a dye, preferably a pigment, more preferably an organic pigment.
  • the near-infrared absorbing colorant is not particularly limited, but pyrrolopyrrole compounds, cyanine compounds, squarylium compounds, phthalocyanine compounds, naphthalocyanine compounds, quaterrylene compounds, merocyanine compounds, croconium compounds, oxonol compounds, iminium compounds, dithiol compounds, tria
  • pyrrolopyrrole compounds cyanine compounds, squarylium compounds, phthalocyanine compounds, naphthalocyanine compounds, quaterrylene compounds, merocyanine compounds, croconium compounds, oxonol compounds, iminium compounds, dithiol compounds, tria
  • reelmethane compounds include reelmethane compounds, pyrromethene compounds, azomethine compounds, anthraquinone compounds, dibenzofuranone compounds, and dithiolene metal complexes.
  • pyrrolopyrrole compound compounds described in paragraph numbers 0016 to 0058 of JP-A-2009-263614, compounds described in paragraph numbers 0037-0052 of JP-A-2011-068731, WO 2015/166873 Compounds described in Paragraph Nos. 0010 to 0033 and the like.
  • examples of the squarylium compound include compounds described in paragraph numbers 0044 to 0049 of JP-A-2011-208101, compounds described in paragraph numbers 0060 to 0061 of Japanese Patent No. 6065169, and paragraph number 0040 of WO 2016/181987.
  • Examples of croconium compounds include compounds described in JP-A-2017-082029.
  • As the iminium compound for example, compounds described in JP-A-2008-528706, compounds described in JP-A-2012-012399, compounds described in JP-A-2007-092060, International Publication No. 2018/043564 and the compounds described in paragraphs 0048 to 0063 of.
  • phthalocyanine compound examples include compounds described in paragraph number 0093 of JP-A-2012-077153, oxytitanium phthalocyanine described in JP-A-2006-343631, and paragraph numbers 0013 to 0029 of JP-A-2013-195480. compounds, vanadium phthalocyanine compounds described in Japanese Patent No. 6081771, and compounds described in International Publication No. 2020/071470. Examples of naphthalocyanine compounds include compounds described in paragraph number 0093 of JP-A-2012-077153. Dithiolene metal complexes include compounds described in Japanese Patent No. 5733804.
  • the near-infrared absorbing colorant the squarylium compound described in JP-A-2017-197437, the squarylium compound described in JP-A-2017-025311, the squarylium compound described in International Publication No. 2016/154782, the patent Squarylium compounds described in Japanese Patent No. 5884953, squarylium compounds described in Japanese Patent No. 6036689, squarylium compounds described in Japanese Patent No. 5810604, squarylium compounds described in paragraph numbers 0090 to 0107 of International Publication No.
  • amide-linked squarylium compounds compounds having a pyrrole bis-type squarylium skeleton or croconium skeleton described in JP-A-2017-141215, dihydrocarbazole bis-type squarylium compounds described in JP-A-2017-082029, JP-A-2017 -Asymmetric compounds described in paragraphs 0027 to 0114 of JP-A-068120, pyrrole ring-containing compounds (carbazole type) described in JP-A-2017-067963, phthalocyanine compounds described in Japanese Patent No. 6251530, A squarylium compound described in JP-A-2020-075959, a copper complex described in Korean Patent Publication No. 10-2019-0135217, and the like can also be used.
  • the content of the coloring material in the total solid content of the composition is preferably 20 to 80% by mass.
  • the lower limit is preferably 30% by mass or more, more preferably 40% by mass or more, and even more preferably 50% by mass or more.
  • the upper limit is preferably 75% by mass or less, more preferably 70% by mass or less.
  • the composition of the present invention may contain only one colorant, or may contain two or more colorants. When two or more coloring materials are included, the total amount thereof preferably falls within the above range.
  • the composition of the first aspect can contain a photoinitiator.
  • a polymerizable monomer When used as the curable compound, it preferably contains a photopolymerization initiator.
  • the photopolymerization initiator is not particularly limited and can be appropriately selected from known photopolymerization initiators. For example, compounds having photosensitivity to light in the ultraviolet range to the visible range are preferred.
  • the photopolymerization initiator is preferably a photoradical polymerization initiator.
  • photopolymerization initiators include halogenated hydrocarbon derivatives (e.g., compounds having a triazine skeleton, compounds having an oxadiazole skeleton, etc.), acylphosphine compounds, hexaarylbiimidazole compounds, oxime compounds, organic peroxides, thio compounds, ketone compounds, aromatic onium salts, ⁇ -hydroxyketone compounds, ⁇ -aminoketone compounds and the like.
  • halogenated hydrocarbon derivatives e.g., compounds having a triazine skeleton, compounds having an oxadiazole skeleton, etc.
  • acylphosphine compounds e.g., acylphosphine compounds, hexaarylbiimidazole compounds, oxime compounds, organic peroxides, thio compounds, ketone compounds, aromatic onium salts, ⁇ -hydroxyketone compounds, ⁇ -aminoketone compounds and the like.
  • photopolymerization initiators include trihalomethyltriazine compounds, benzyldimethylketal compounds, ⁇ -hydroxyketone compounds, ⁇ -aminoketone compounds, acylphosphine compounds, phosphine oxide compounds, metallocene compounds, oxime compounds, hexaarylbi imidazole compounds, onium compounds, benzothiazole compounds, benzophenone compounds, acetophenone compounds, cyclopentadiene-benzene-iron complexes, halomethyloxadiazole compounds and 3-aryl-substituted coumarin compounds, oxime compounds, ⁇ -hydroxyketones compounds, ⁇ -aminoketone compounds, and acylphosphine compounds, more preferably oxime compounds.
  • hexaarylbiimidazole compounds include 2,2′,4-tris(2-chlorophenyl)-5-(3,4-dimethoxyphenyl)-4,5-diphenyl-1,1′-biimidazole, etc. is mentioned.
  • ⁇ -hydroxyketone compounds include Omnirad 184, Omnirad 1173, Omnirad 2959, Omnirad 127 (manufactured by IGM Resins B.V.), Irgacure 184, Irgacure 1173, Irgacure 2959, Irgacure 127 (above company) and the like.
  • ⁇ -aminoketone compounds include Omnirad 907, Omnirad 369, Omnirad 369E, Omnirad 379EG (manufactured by IGM Resins B.V.), Irgacure 907, Irgacure 369, Irgacure 369E, Irgacure 379EG (manufactured by Irgacure 369E, Irgacure 379EG). made), etc.
  • acylphosphine compounds include Omnirad 819, Omnirad TPO (manufactured by IGM Resins B.V.), Irgacure 819 and Irgacure TPO (manufactured by BASF).
  • Examples of oxime compounds include compounds described in JP-A-2001-233842, compounds described in JP-A-2000-080068, compounds described in JP-A-2006-342166, J. Am. C. S. Compounds described in Perkin II (1979, pp.1653-1660); C. S. Compounds described in Perkin II (1979, pp.156-162), compounds described in Journal of Photopolymer Science and Technology (1995, pp.202-232), compounds described in JP-A-2000-066385, Compounds described in JP-A-2004-534797, compounds described in JP-A-2006-342166, compounds described in JP-A-2017-019766, compounds described in Patent No. 6065596, International Publication No.
  • oxime compounds include 3-benzoyloxyiminobutane-2-one, 3-acetoxyiminobutane-2-one, 3-propionyloxyiminobutane-2-one, 2-acetoxyiminopentane-3-one, 2-acetoxyimino-1-phenylpropan-1-one, 2-benzoyloxyimino-1-phenylpropan-1-one, 3-(4-toluenesulfonyloxy)iminobutan-2-one, 2-ethoxycarbonyloxyimino -1-phenylpropane-1-one, 1-[4-(phenylthio)phenyl]-3-cyclohexyl-propane-1,2-dione-2-(
  • An oxime compound having a fluorene ring can also be used as the photopolymerization initiator.
  • Specific examples of the oxime compound having a fluorene ring include compounds described in JP-A-2014-137466, compounds described in Japanese Patent No. 6636081, and compounds described in Korean Patent Publication No. 10-2016-0109444. mentioned.
  • an oxime compound having a skeleton in which at least one benzene ring of the carbazole ring is a naphthalene ring can also be used.
  • Specific examples of such oxime compounds include compounds described in WO2013/083505.
  • An oxime compound having a fluorine atom can also be used as the photopolymerization initiator.
  • Specific examples of the oxime compound having a fluorine atom include compounds described in JP-A-2010-262028, compounds 24, 36 to 40 described in JP-A-2014-500852, and JP-A-2013-164471. and the compound (C-3) of.
  • An oxime compound having a nitro group can be used as the photopolymerization initiator.
  • the oxime compound having a nitro group is also preferably a dimer.
  • Specific examples of the oxime compound having a nitro group include the compounds described in paragraph numbers 0031 to 0047 of JP-A-2013-114249 and paragraph numbers 0008-0012 and 0070-0079 of JP-A-2014-137466; Compounds described in paragraphs 0007 to 0025 of Japanese Patent No. 4223071 and ADEKA Arkles NCI-831 (manufactured by ADEKA Corporation) can be mentioned.
  • An oxime compound having a benzofuran skeleton can also be used as the photopolymerization initiator.
  • Specific examples include OE-01 to OE-75 described in WO 2015/036910.
  • an oxime compound in which a substituent having a hydroxyl group is bonded to the carbazole skeleton can also be used.
  • Examples of such a photopolymerization initiator include the compounds described in International Publication No. 2019/088055.
  • an oxime compound having an aromatic ring group Ar 2 OX1 in which an electron-withdrawing group is introduced into the aromatic ring (hereinafter also referred to as oxime compound OX) can be used.
  • the electron-withdrawing group possessed by the aromatic ring group Ar OX1 include an acyl group, a nitro group, a trifluoromethyl group, an alkylsulfinyl group, an arylsulfinyl group, an alkylsulfonyl group, an arylsulfonyl group, and a cyano group.
  • a benzoyl group may have a substituent.
  • substituents include halogen atoms, cyano groups, nitro groups, hydroxy groups, alkyl groups, alkoxy groups, aryl groups, aryloxy groups, heterocyclic groups, heterocyclic oxy groups, alkenyl groups, alkylsulfanyl groups, arylsulfanyl groups, It is preferably an acyl group or an amino group, more preferably an alkyl group, an alkoxy group, an aryl group, an aryloxy group, a heterocyclic oxy group, an alkylsulfanyl group, an arylsulfanyl group or an amino group.
  • a sulfanyl group or an amino group is more preferred.
  • the oxime compound OX is preferably at least one selected from the compounds represented by the formula (OX1) and the compounds represented by the formula (OX2), more preferably the compound represented by the formula (OX2). preferable.
  • R X1 is an alkyl group, alkenyl group, alkoxy group, aryl group, aryloxy group, heterocyclic group, heterocyclicoxy group, alkylsulfanyl group, arylsulfanyl group, alkylsulfinyl group, arylsulfinyl group, alkylsulfonyl a group, an arylsulfonyl group, an acyl group, an acyloxy group, an amino group, a phosphinoyl group, a carbamoyl group or a sulfamoyl group
  • R X2 is an alkyl group, alkenyl group, alkoxy group, aryl group, aryloxy group, heterocyclic group,
  • electron-withdrawing groups include acyl groups, nitro groups, trifluoromethyl groups, alkylsulfinyl groups, arylsulfinyl groups, alkylsulfonyl groups, arylsulfonyl groups, and cyano groups, with acyl groups and nitro groups being preferred.
  • An acyl group is more preferred, and a benzoyl group is even more preferred, because a film having excellent properties can be easily formed.
  • R X12 is an electron-withdrawing group
  • R X10 , R X11 , R X13 and R X14 are preferably hydrogen atoms.
  • oxime compound OX examples include compounds described in paragraphs 0083 to 0105 of Japanese Patent No. 4600600.
  • oxime compounds preferably used in the present invention are shown below, but the present invention is not limited to these.
  • the oxime compound is preferably a compound having a maximum absorption wavelength in the wavelength range of 350 to 500 nm, more preferably a compound having a maximum absorption wavelength in the wavelength range of 360 to 480 nm.
  • the molar extinction coefficient of the oxime compound at a wavelength of 365 nm or a wavelength of 405 nm is preferably high from the viewpoint of sensitivity, more preferably 1000 to 300000, further preferably 2000 to 300000, even more preferably 5000 to 200000. It is particularly preferred to have
  • the molar extinction coefficient of a compound can be measured using known methods. For example, it is preferably measured at a concentration of 0.01 g/L using an ethyl acetate solvent with a spectrophotometer (Cary-5 spectrophotometer manufactured by Varian).
  • Irgacure OXE01 manufactured by BASF
  • Irgacure OXE02 manufactured by BASF
  • Omnirad 2959 manufactured by IGM Resins B.V.
  • a bifunctional or trifunctional or higher functional photoradical polymerization initiator may be used as the photopolymerization initiator.
  • a radical photopolymerization initiator two or more radicals are generated from one molecule of the radical photopolymerization initiator, so good sensitivity can be obtained.
  • the crystallinity is lowered, the solubility in a solvent or the like is improved, the precipitation becomes difficult over time, and the stability over time of the composition can be improved.
  • Specific examples of bifunctional or trifunctional or higher photoradical polymerization initiators include Japanese Patent Publication No. 2010-527339, Japanese Patent Publication No. 2011-524436, International Publication No.
  • the content of the photopolymerization initiator in the total solid content of the composition is preferably 0.1 to 20% by mass.
  • the lower limit is preferably 0.5% by mass or more, more preferably 1% by mass or more.
  • the upper limit is preferably 15% by mass or less, more preferably 10% by mass or less.
  • the composition of the present invention may contain only one type of photopolymerization initiator, or may contain two or more types. When two or more photopolymerization initiators are included, the total amount thereof preferably falls within the above range.
  • the composition of the first aspect can contain a pigment derivative.
  • Pigment derivatives are used, for example, as dispersing aids.
  • Pigment derivatives include compounds having a structure in which an acid group or a basic group is bonded to a pigment skeleton.
  • Dye skeletons constituting pigment derivatives include quinoline dye skeletons, benzimidazolone dye skeletons, benzoisoindole dye skeletons, benzothiazole dye skeletons, iminium dye skeletons, squarylium dye skeletons, croconium dye skeletons, oxonol dye skeletons, and pyrrolopyrrole dye skeletons.
  • diketopyrrolopyrrole dye skeleton azo dye skeleton, azomethine dye skeleton, phthalocyanine dye skeleton, naphthalocyanine dye skeleton, anthraquinone dye skeleton, quinacridone dye skeleton, dioxazine dye skeleton, perinone dye skeleton, perylene dye skeleton, thioindigo dye skeleton, Isoindoline dye skeletons, isoindolinone dye skeletons, quinophthalone dye skeletons, iminium dye skeletons, dithiol dye skeletons, triarylmethane dye skeletons, pyrromethene dye skeletons, and the like can be mentioned.
  • the acid group includes a carboxy group, a sulfo group, a phosphoric acid group, a boronic acid group, a carboxylic acid amide group, a sulfonic acid amide group, an imidic acid group and salts thereof.
  • Atoms or atomic groups constituting the salt include alkali metal ions (Li + , Na + , K + etc.), alkaline earth metal ions (Ca 2+ , Mg 2+ etc.), ammonium ions, imidazolium ions, pyridinium ions, phosphonium ion and the like.
  • the carboxylic acid amide group a group represented by —NHCOR X1 is preferable.
  • sulfonic acid amide group a group represented by —NHSO 2 R X2 is preferable.
  • the imidic acid group is preferably a group represented by —SO 2 NHSO 2 R X3 , —CONHSO 2 R X4 , —CONHCOR X5 or —SO 2 NHCOR X6 , more preferably —SO 2 NHSO 2 R X3 .
  • R X1 to R X6 each independently represent an alkyl group or an aryl group.
  • the alkyl groups and aryl groups represented by R X1 to R X6 may have substituents.
  • the substituent is preferably a halogen atom, more preferably a fluorine atom.
  • Basic groups include amino groups, pyridinyl groups and salts thereof, salts of ammonium groups, and phthalimidomethyl groups.
  • Atoms or atomic groups constituting salts include hydroxide ions, halogen ions, carboxylate ions, sulfonate ions, and phenoxide ions.
  • a pigment derivative having excellent visible transparency (hereinafter also referred to as a transparent pigment derivative) can also be used as the pigment derivative.
  • the maximum value ( ⁇ max) of the molar extinction coefficient of the transparent pigment derivative in the wavelength region of 400 to 700 nm is preferably 3000 L ⁇ mol ⁇ 1 ⁇ cm ⁇ 1 or less, and 1000 L ⁇ mol ⁇ 1 ⁇ cm ⁇ 1 or less. is more preferable, and 100 L ⁇ mol ⁇ 1 ⁇ cm ⁇ 1 or less is even more preferable.
  • the lower limit of ⁇ max is, for example, 1 L ⁇ mol ⁇ 1 ⁇ cm ⁇ 1 or more, and may be 10 L ⁇ mol ⁇ 1 ⁇ cm ⁇ 1 or more.
  • pigment derivatives include compounds described in JP-A-56-118462, compounds described in JP-A-63-264674, compounds described in JP-A-01-217077, JP-A-03- 009961, compounds described in JP-A-03-026767, compounds described in JP-A-03-153780, compounds described in JP-A-03-045662, JP-A-04-285669 Compounds described in publications, compounds described in JP-A-06-145546, compounds described in JP-A-06-212088, compounds described in JP-A-06-240158, JP-A-10-030063 Compounds described, compounds described in JP-A-10-195326, compounds described in paragraphs 0086 to 0098 of WO 2011/024896, WO 2012/102399 described in paragraphs 0063 to 0094 Compounds, compounds described in paragraph number 0082 of WO 2017/038252, compounds described in paragraph number 0171 of JP 2015-151530, JP 2011-25
  • the content of the pigment derivative is preferably 1 to 30 parts by mass, more preferably 3 to 20 parts by mass, based on 100 parts by mass of the above pigment. Further, the total content of the pigment derivative and the colorant is preferably 35% by mass or more, more preferably 40% by mass or more, still more preferably 45% by mass or more, and 50% by mass of the total solid content of the composition. % or more is particularly preferred.
  • the upper limit is preferably 70% by mass or less, more preferably 65% by mass or less.
  • the composition of the present invention may contain only one type of pigment derivative, or may contain two or more types. When two or more pigment derivatives are included, the total amount thereof is preferably within the above range. By containing two or more pigment derivatives, the dispersion stability of the composition can be further improved.
  • a pigment derivative with excellent visible transparency it is possible to suppress the color change of the film after the heat resistance test and the light resistance test, and the heat resistance and light resistance are further improved. Further, by using a pigment derivative having a pigment skeleton and a pigment derivative excellent in visible transparency, dispersion stability, heat resistance, and light resistance can all be achieved at a higher level.
  • the composition of the first aspect can also contain a polyalkyleneimine.
  • Polyalkyleneimines are used, for example, as dispersing aids for pigments.
  • a dispersing aid is a material that enhances the dispersibility of the pigment in the composition.
  • a polyalkyleneimine is a polymer obtained by ring-opening polymerization of an alkyleneimine and has at least a secondary amino group.
  • the polyalkyleneimine may contain a primary amino group or a tertiary amino group in addition to the secondary amino group.
  • the polyalkyleneimine is preferably a polymer having a branched structure each containing a primary amino group, a secondary amino group and a tertiary amino group.
  • the number of carbon atoms in the alkyleneimine is preferably 2 to 6, more preferably 2 to 4, still more preferably 2 or 3, and particularly preferably 2.
  • the molecular weight of the polyalkyleneimine is preferably 200 or more, more preferably 250 or more.
  • the upper limit is preferably 100,000 or less, more preferably 50,000 or less, even more preferably 10,000 or less, and particularly preferably 2,000 or less.
  • the molecular weight of the polyalkyleneimine when the molecular weight can be calculated from the structural formula, the molecular weight of the polyalkyleneimine is the value calculated from the structural formula.
  • the molecular weight of the specific amine compound cannot be calculated from the structural formula or is difficult to calculate, the value of the number average molecular weight measured by the boiling point elevation method is used.
  • the value of the number average molecular weight measured by the viscosity method is used.
  • the value of the number average molecular weight in terms of polystyrene measured by the GPC (gel permeation chromatography) method is used.
  • the amine value of the polyalkyleneimine is preferably 5 mmol/g or more, more preferably 10 mmol/g or more, and even more preferably 15 mmol/g or more.
  • alkyleneimine examples include ethyleneimine, propyleneimine, 1,2-butyleneimine, 2,3-butyleneimine and the like, preferably ethyleneimine or propyleneimine, more preferably ethyleneimine. preferable. It is particularly preferred that the polyalkyleneimine is polyethyleneimine. In addition, the polyethyleneimine preferably contains 10 mol% or more, more preferably 20 mol% or more, of the primary amino group with respect to the total of the primary amino group, the secondary amino group and the tertiary amino group. , more preferably 30 mol % or more.
  • Commercial products of polyethyleneimine include Epomin SP-003, SP-006, SP-012, SP-018, SP-200, P-1000 (manufactured by Nippon Shokubai Co., Ltd.).
  • the content of polyalkyleneimine in the total solid content of the composition is preferably 0.1 to 5% by mass.
  • the lower limit is preferably 0.2% by mass or more, more preferably 0.5% by mass or more, and even more preferably 1% by mass or more.
  • the upper limit is preferably 4.5% by mass or less, more preferably 4% by mass or less, and even more preferably 3% by mass or less.
  • the content of the polyalkyleneimine is preferably 0.5 to 20 parts by mass with respect to 100 parts by mass of the pigment.
  • the lower limit is preferably 0.6 parts by mass or more, more preferably 1 part by mass or more, and even more preferably 2 parts by mass or more.
  • the upper limit is preferably 10 parts by mass or less, more preferably 8 parts by mass or less. Only one kind of polyalkyleneimine may be used, or two or more kinds thereof may be used. When two or more types are used, the total amount thereof is preferably within the above range.
  • the composition of the first aspect can contain a curing accelerator.
  • Curing accelerators include thiol compounds, methylol compounds, amine compounds, phosphonium salt compounds, amidine salt compounds, amide compounds, base generators, isocyanate compounds, alkoxysilane compounds, onium salt compounds and the like.
  • the curing accelerator include compounds described in paragraph numbers 0094 to 0097 of WO 2018/056189, compounds described in paragraph numbers 0246 to 0253 of JP 2015-034963, JP 2013-041165 Compounds described in paragraph numbers 0186 to 0251 of the publication, ionic compounds described in JP 2014-055114, compounds described in paragraph numbers 0071 to 0080 of JP 2012-150180, JP 2011-253054 Alkoxysilane compounds having an epoxy group described in JP-A-2005-200557, compounds described in paragraphs 0085 to 0092 of Japanese Patent No. 5765059, and carboxy group-containing epoxy curing agents described in JP-A-2017-036379.
  • the content of the curing accelerator in the total solid content of the composition is preferably 0.3 to 8.9% by mass, more preferably 0.8 to 6.4% by mass. Only one curing accelerator may be used, or two or more curing accelerators may be used. When two or more types are used, the total amount thereof is preferably within the above range.
  • the composition of the first aspect can contain an ultraviolet absorber.
  • ultraviolet absorbers include conjugated diene compounds, aminodiene compounds, salicylate compounds, benzophenone compounds, benzotriazole compounds, acrylonitrile compounds, hydroxyphenyltriazine compounds, indole compounds, and triazine compounds. Specific examples of such compounds include paragraph numbers 0038 to 0052 of JP-A-2009-217221, paragraph numbers 0052-0072 of JP-A-2012-208374, paragraph numbers 0317-0317 of JP-A-2013-068814.
  • UV absorbers examples include UV-503 (manufactured by Daito Chemical Co., Ltd.), Tinuvin series and Uvinul series manufactured by BASF, and Sumisorb series manufactured by Sumika Chemtex Co., Ltd. .
  • UV-503 manufactured by Daito Chemical Co., Ltd.
  • Tinuvin series and Uvinul series manufactured by BASF Tinuvin series and Uvinul series manufactured by BASF
  • benzotriazole compound the MYUA series made from Miyoshi oil and fats (Chemical Daily, February 1, 2016) is mentioned.
  • the ultraviolet absorber is a compound described in paragraph numbers 0049 to 0059 of Japanese Patent No.
  • a thioaryl group-substituted benzotriazole-type ultraviolet absorber described in can also be used.
  • the content of the ultraviolet absorber in the total solid content of the composition is preferably 0.01 to 10% by mass, more preferably 0.01 to 5% by mass. Only one type of ultraviolet absorber may be used, or two or more types may be used. When two or more are used, the total amount thereof is preferably within the above range.
  • the composition of the first aspect can contain a polymerization inhibitor.
  • Polymerization inhibitors include hydroquinone, p-methoxyphenol, di-tert-butyl-p-cresol, pyrogallol, tert-butylcatechol, benzoquinone, 4,4′-thiobis(3-methyl-6-tert-butylphenol), 2,2′-methylenebis(4-methyl-6-t-butylphenol), N-nitrosophenylhydroxyamine salts (ammonium salts, cerous salts, etc.). Among them, p-methoxyphenol is preferred.
  • the content of the polymerization inhibitor in the total solid content of the composition is preferably 0.0001 to 5% by mass. Only 1 type may be used for a polymerization inhibitor and 2 or more types may be used for it. When two or more types are used, the total amount thereof is preferably within the above range.
  • the composition of the first aspect can contain a silane coupling agent.
  • a silane coupling agent means a silane compound having a hydrolyzable group and other functional groups.
  • the hydrolyzable group refers to a substituent that is directly bonded to a silicon atom and capable of forming a siloxane bond by at least one of hydrolysis reaction and condensation reaction.
  • Hydrolyzable groups include, for example, halogen atoms, alkoxy groups, acyloxy groups and the like, with alkoxy groups being preferred. That is, the silane coupling agent is preferably a compound having an alkoxysilyl group.
  • Examples of functional groups other than hydrolyzable groups include vinyl group, (meth)allyl group, (meth)acryloyl group, mercapto group, epoxy group, oxetanyl group, amino group, ureido group, sulfide group and isocyanate group. , phenyl group, etc., and amino group, (meth)acryloyl group and epoxy group are preferred.
  • silane coupling agent examples include N- ⁇ -aminoethyl- ⁇ -aminopropylmethyldimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., trade name KBM-602), N- ⁇ -aminoethyl- ⁇ -amino propyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., trade name KBM-603), N- ⁇ -aminoethyl- ⁇ -aminopropyltriethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., trade name KBE-602), ⁇ -aminopropyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., trade name KBM-903), ⁇ -aminopropyltriethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., trade name KBM
  • silane coupling agent examples include compounds described in paragraph numbers 0018 to 0036 of JP-A-2009-288703 and compounds described in paragraph numbers 0056-0066 of JP-A-2009-242604. , the contents of which are incorporated herein.
  • the content of the silane coupling agent in the total solid content of the composition is preferably 0.01 to 15.0% by mass, more preferably 0.05 to 10.0% by mass. Only one kind of silane coupling agent may be used, or two or more kinds thereof may be used. When two or more types are used, the total amount thereof is preferably within the above range.
  • the composition of the first aspect can contain an antioxidant.
  • Antioxidants include phenol compounds, phosphite ester compounds, thioether compounds and the like. Any phenolic compound known as a phenolic antioxidant can be used as the phenolic compound. Preferred phenolic compounds include hindered phenolic compounds. A compound having a substituent at a site adjacent to the phenolic hydroxy group (ortho position) is preferred. As the aforementioned substituent, a substituted or unsubstituted alkyl group having 1 to 22 carbon atoms is preferred.
  • the antioxidant is also preferably a compound having a phenol group and a phosphite ester group in the same molecule.
  • Phosphorus-based antioxidants can also be suitably used as antioxidants.
  • a phosphorus antioxidant tris[2-[[2,4,8,10-tetrakis(1,1-dimethylethyl)dibenzo[d,f][1,3,2]dioxaphosphepin-6 -yl]oxy]ethyl]amine, tris[2-[(4,6,9,11-tetra-tert-butyldibenzo[d,f][1,3,2]dioxaphosphepin-2-yl ) oxy]ethyl]amine, ethyl bis(2,4-di-tert-butyl-6-methylphenyl) phosphite, and the like.
  • antioxidants examples include Adekastab AO-20, Adekastab AO-30, Adekastab AO-40, Adekastab AO-50, Adekastab AO-50F, Adekastab AO-60, Adekastab AO-60G, Adekastab AO-80. , ADEKA STAB AO-330 (manufactured by ADEKA Corporation) and the like.
  • antioxidants are compounds described in paragraph numbers 0023 to 0048 of Japanese Patent No. 6268967, compounds described in WO 2017/006600, compounds described in WO 2017/164024, Compounds described in Korean Patent Publication No. 10-2019-0059371 can also be used.
  • the content of the antioxidant in the total solid content of the composition is preferably 0.01 to 20% by mass, more preferably 0.3 to 15% by mass. Only one kind of antioxidant may be used, or two or more kinds thereof may be used. When two or more types are used, the total amount thereof is preferably within the above range.
  • composition of the first aspect may optionally contain sensitizers, fillers, thermosetting accelerators, plasticizers and other auxiliaries (e.g., conductive particles, antifoaming agents, flame retardants, leveling agents, release accelerators, fragrances, surface tension modifiers, chain transfer agents, etc.). Properties such as film physical properties can be adjusted by appropriately containing these components. These components are, for example, described in JP 2012-003225, paragraph number 0183 and later (corresponding US Patent Application Publication No. 2013/0034812, paragraph number 0237), JP 2008-250074 paragraph The descriptions of numbers 0101 to 0104, 0107 to 0109, etc. can be referred to, and the contents thereof are incorporated herein.
  • auxiliaries e.g., conductive particles, antifoaming agents, flame retardants, leveling agents, release accelerators, fragrances, surface tension modifiers, chain transfer agents, etc.
  • the composition of the first aspect may also contain latent antioxidants, if desired.
  • the latent antioxidant is a compound in which the site functioning as an antioxidant is protected with a protective group, and is heated at 100 to 250°C, or heated at 80 to 200°C in the presence of an acid/base catalyst.
  • a compound that functions as an antioxidant by removing the protective group by the reaction is exemplified.
  • Examples of latent antioxidants include compounds described in International Publication No. 2014/021023, International Publication No. 2017/030005, and JP-A-2017-008219.
  • Commercially available latent antioxidants include ADEKA Arkles GPA-5001 (manufactured by ADEKA Co., Ltd.).
  • the composition of the first aspect may contain a light resistance improver.
  • a light resistance improver compounds described in paragraph numbers 0036 to 0037 of JP-A-2017-198787, compounds described in paragraph numbers 0029-0034 of JP-A-2017-146350, JP-A-2017-129774 Compounds described in paragraph numbers 0036 to 0037, 0049 to 0052 of JP 2017-129674 JP 2017-129674 paragraph numbers 0031 to 0034, 0058 to 0059 compounds described in JP 2017-122803 paragraph numbers 0036 to 0037 , compounds described in 0051 to 0054, compounds described in paragraph numbers 0025 to 0039 of WO 2017/164127, compounds described in paragraph numbers 0034 to 0047 of JP 2017-186546, JP 2015-025116 Compounds described in paragraph numbers 0019 to 0041 of JP-A-2012-145604, compounds described in paragraph numbers 0101-0125 of JP-A-2012-103475, compounds described
  • perfluoroalkylsulfonic acid and its salts may be regulated.
  • perfluoroalkylsulfonic acid especially perfluoroalkylsulfonic acid having 6 to 8 carbon atoms in the perfluoroalkyl group
  • alkylcarboxylic acid especially perfluoroalkylcarboxylic acid having 6 to 8 carbon atoms in the perfluoroalkyl group
  • its salt is in the range of 0.01ppb to 1,000ppb relative to the total solid content of the composition.
  • composition of the present invention may be substantially free of perfluoroalkylsulfonic acid and its salts and perfluoroalkylcarboxylic acid and its salts.
  • a compound that can substitute for perfluoroalkylsulfonic acid and its salt and a compound that can substitute for perfluoroalkylcarboxylic acid and its salt, perfluoroalkylsulfonic acid and its salt, and perfluoroalkylcarboxylic acid and salts thereof may be selected.
  • compositions of the present invention may contain perfluoroalkylsulfonic acids and their salts and perfluoroalkylcarboxylic acids and their salts within the maximum permissible range.
  • composition of the second aspect comprises inorganic particles.
  • inorganic particles include silica particles, titanium oxide particles, strontium titanate particles, barium titanate particles, zinc oxide particles, magnesium oxide particles, zirconium oxide particles, aluminum oxide particles, barium sulfate particles, aluminum hydroxide particles, and calcium silicate. particles, aluminum silicate particles, zinc sulfide particles, etc., and silica particles are preferred.
  • a composition using silica particles as inorganic particles is preferably used as a composition for forming partition walls.
  • silica particles examples include silica particles in which a plurality of spherical silica particles are connected in a beaded shape, silica particles in which a plurality of spherical silica particles are connected in a plane, silica particles with a hollow structure, solid silica particles, and the like. be done.
  • Commercially available solid silica particles include, for example, PL-2L-IPA (manufactured by Fuso Chemical Industry Co., Ltd.).
  • silica particles tend to form a film with a smaller refractive index
  • silica particles having a shape in which a plurality of spherical silicas are linked in a beaded shape silica particles having a shape in which a plurality of spherical silicas are planarly linked
  • Silica particles having a hollow structure are preferred, and silica particles having a shape in which a plurality of spherical silica particles are linked in a beaded shape and silica particles in a shape in which a plurality of spherical silica particles are planarly linked are preferable.
  • a silica particle having a shape in which a plurality of spherical silica particles are linked in a beaded shape and a silica particle having a shape in which a plurality of spherical silica particles are planarly linked are collectively referred to as beaded silica.
  • the silica particles having a shape in which a plurality of spherical silica particles are linked in a beaded shape may have a shape in which a plurality of spherical silica particles are planarly linked.
  • spherical in “spherical silica” means that it may be substantially spherical, and may be deformed within the scope of the effects of the present invention. For example, it includes a shape having unevenness on the surface and a flat shape having a long axis in a predetermined direction.
  • a plurality of spherical silica particles are linked in a beaded manner means a structure in which a plurality of spherical silica particles are linked in a linear and/or branched form. For example, as shown in FIG.
  • the structure in which "a plurality of spherical silica particles are linked in a beaded shape” includes not only a structure in which a ring is connected, but also a chain-like structure having an end. It also includes structures with
  • "a plurality of spherical silica particles are planarly connected” means a structure in which a plurality of spherical silica particles are connected to each other on substantially the same plane. It should be noted that “substantially the same plane” means not only the same plane, but also the vertical deviation from the same plane. For example, the vertical deviation may be within a range of 50% or less of the particle diameter of the spherical silica.
  • the beaded silica preferably has a ratio D 1 /D 2 of 3 or more between the average particle diameter D 1 measured by the dynamic light scattering method and the average particle diameter D 2 obtained by the following formula (1). Although there is no particular upper limit for D 1 /D 2 , it is preferably 1000 or less, more preferably 800 or less, and even more preferably 500 or less. Favorable optical properties can be exhibited by setting D 1 /D 2 within such a range.
  • the value of D 1 /D 2 in beaded silica is also an index of the degree of connection of spherical silica.
  • D2 2720/S (1)
  • D 2 is the average particle size of beaded silica in units of nm
  • S is the specific surface area of beaded silica measured by the nitrogen adsorption method in units of m 2 /g. be.
  • the average particle size D2 of beaded silica can be regarded as an average particle size approximate to the primary particles of spherical silica.
  • the average particle diameter D2 is preferably 1 nm or more, more preferably 3 nm or more, still more preferably 5 nm or more, and particularly preferably 7 nm or more.
  • the upper limit is preferably 100 nm or less, more preferably 80 nm or less, even more preferably 70 nm or less, even more preferably 60 nm or less, and particularly preferably 50 nm or less.
  • the average particle diameter D2 can be substituted by the equivalent circle diameter (D0) in the projected image of the spherical portion measured by a transmission electron microscope (TEM). Unless otherwise specified, the average particle diameter of 50 or more particles is evaluated as the number average of 50 or more particles.
  • D0 equivalent circle diameter
  • TEM transmission electron microscope
  • the average particle diameter D1 of beaded silica can be regarded as the number average particle diameter of secondary particles in which a plurality of spherical silica particles are aggregated. Therefore, the relationship D 1 >D 2 usually holds.
  • the average particle diameter D1 is preferably 25 nm or more, more preferably 30 nm or more, and particularly preferably 35 nm or more.
  • the upper limit is preferably 1000 nm or less, more preferably 700 nm or less, even more preferably 500 nm or less, and particularly preferably 300 nm or less.
  • Measurement of the average particle diameter D1 of the beaded silica is performed using a dynamic light scattering particle size distribution analyzer (Nikkiso Nanotrac Wave-EX150 [trade name]) unless otherwise specified.
  • the procedure is as follows. A dispersion liquid of beaded silica is put into a 20 ml sample bottle, and diluted with toluene so that the solid content concentration becomes 0.2% by mass. The sample solution after dilution is irradiated with ultrasonic waves of 40 kHz for 1 minute and immediately used for the test. A 2 ml measurement quartz cell is used at a temperature of 25° C., data is taken in 10 times, and the obtained "number average” is taken as the average particle size. For other detailed conditions, etc., refer to the description of JISZ8828:2013 "Particle Size Analysis-Dynamic Light Scattering Method" as necessary. Five samples are prepared for each level and the average value is adopted.
  • the beaded silica it is preferable that a plurality of spherical silica particles having an average particle diameter of 1 to 80 nm are connected via a connecting material.
  • the upper limit of the average particle size of spherical silica is preferably 70 nm or less, more preferably 60 nm or less, and even more preferably 50 nm or less.
  • the lower limit of the average particle size of spherical silica is preferably 3 nm or more, more preferably 5 nm or more, and even more preferably 7 nm or more.
  • the average particle size of spherical silica is determined from the equivalent circle diameter in the projected image of the spherical portion measured by a transmission electron microscope (TEM).
  • Metal oxide-containing silica can be used as a connecting material for connecting spherical silica particles.
  • metal oxides include oxides of metals selected from Ca, Mg, Sr, Ba, Zn, Sn, Pb, Ni, Co, Fe, Al, In, Y, and Ti.
  • metal oxide-containing silica include reaction products and mixtures of these metal oxides and silica (SiO 2 ).
  • the connecting member the description of International Publication No. WO 2000/015552 can be considered, and the content thereof is incorporated herein.
  • the number of spherical silica connections in beaded silica is preferably 3 or more, more preferably 5 or more.
  • the upper limit is preferably 1000 or less, more preferably 800 or less, even more preferably 500 or less.
  • the number of linkages of spherical silica can be measured by TEM.
  • beaded silica spherical silica whose surface is treated with hexamethyldisilazane or the like may be used.
  • Silica particles may be used in the form of a particle liquid (sol).
  • examples of media for dispersing silica particles include alcohols (e.g., methanol, ethanol, isopropanol), ethylene glycol, glycol ethers (e.g., propylene glycol monomethyl ether), glycol ether acetates (e.g., propylene glycol monomethyl ether acetate), and the like. be.
  • Solvent A1, solvent A2, etc., which will be described later, can also be used.
  • the particle liquid (sol) preferably has a SiO 2 concentration of 5 to 40% by mass.
  • silica sol described in Japanese Patent No. 4328935 can be used.
  • a commercial product can also be used as the particle liquid (sol) of beaded silica.
  • Nissan Chemical Co., Ltd. "Snowtex OUP”, “Snowtex UP”, “IPA-ST-UP”, “Snowtex PS-M”, “Snowtex PS-MO”, “Snowtex PS- S”, “Snowtex PS-SO”, "Fine Cataloid F-120” manufactured by Catalysts & Chemicals Co., Ltd., and "Quatron PL” manufactured by Fuso Chemical Industry Co., Ltd., and the like.
  • a commercial product can also be used as the particle liquid of silica particles with a hollow structure.
  • "Sururia 4110" manufactured by Nikki Shokubai Kasei Co., Ltd. can be used.
  • the content of inorganic particles in the composition is preferably 4% by mass or more, more preferably 6% by mass or more, and even more preferably 7% by mass or more.
  • the upper limit is preferably 15% by mass or less, more preferably 13% by mass or less, and even more preferably 11% by mass or less.
  • the content of inorganic particles in the total solid content of the composition is preferably 20% by mass or more, more preferably 40% by mass or more, further preferably 50% by mass or more, and 60% by mass or more. It is more preferably at least 70% by mass, and particularly preferably at least 70% by mass.
  • the upper limit can be 99.95% by mass or less, 99.9% by mass or less, 99% by mass or less, or 95% by mass or less.
  • the content of silica particles in the composition is preferably 4% by mass or more, more preferably 6% by mass or more, and preferably 7% by mass or more. More preferred.
  • the upper limit is preferably 15% by mass or less, more preferably 13% by mass or less, and even more preferably 11% by mass or less.
  • the content of silica particles in the total solid content of the composition is preferably 20% by mass or more, more preferably 40% by mass or more, further preferably 50% by mass or more, and 60% by mass or more. It is more preferably at least 70% by mass, and particularly preferably at least 70% by mass.
  • the upper limit can be 99.95% by mass or less, 99.9% by mass or less, 99% by mass or less, or 95% by mass or less. If the content of the silica particles is within the above range, it is easy to obtain a film with a low refractive index, a high antireflection effect, and suppressed defects. Further, when pattern formation is not performed, or when pattern formation is performed by an etching method, the content of silica particles in the total solid content of the composition is preferably high, for example, 95% by mass or more, preferably 97% by mass. The above is more preferable, and 99% by mass or more is even more preferable.
  • composition of the second aspect contains the silicone-based surfactant A (specific silicone-based surfactant) described above.
  • Specific silicone-based surfactants include materials described as specific silicone-based surfactants that can be included in the composition of the first aspect.
  • the content of the specific silicone-based surfactant in the composition is preferably 1 to 1000 mass ppm.
  • the lower limit is preferably 0.5 mass ppm or more, and preferably 1 mass ppm or more.
  • the upper limit is preferably 750 mass ppm or less, more preferably 500 mass ppm or less.
  • composition of the second aspect may contain a surfactant (other surfactant) other than the specific silicone-based surfactant.
  • Other surfactants include those materials described as other surfactants that the composition of the first aspect can contain.
  • the content of other surfactants in the composition is preferably 1000 mass ppm or less, more preferably 500 mass ppm or less, and even more preferably 250 mass ppm or less.
  • the lower limit can be, for example, 1 ppm by mass or more.
  • the content of the other surfactant is preferably 100 parts by mass or less, more preferably 50 parts by mass or less, and 25 parts by mass or less with respect to 100 parts by mass of the specific silicone surfactant. is more preferable.
  • the lower limit can be, for example, 1 part by mass or more. It is also preferred that the composition of the second aspect does not contain other surfactants.
  • the composition of the second aspect contains a solvent.
  • the solvent include organic solvents and water, and it is preferable to include at least the organic solvent.
  • organic solvents include aliphatic hydrocarbon solvents, halogenated hydrocarbon solvents, alcohol solvents, ether solvents, ester solvents, ketone solvents, nitrile solvents, amide solvents, sulfoxide solvents, and aromatic solvents. Examples include solvents.
  • the content of the solvent in the composition is preferably 70-99% by mass.
  • the upper limit is preferably 93% by mass or less, more preferably 92% by mass or less, and even more preferably 90% by mass or less.
  • the lower limit is preferably 75% by mass or more, more preferably 80% by mass or more, and even more preferably 85% by mass or more. Only 1 type may be used for a solvent and 2 or more types may be used for it. When two or more types are used, the total amount thereof is preferably within the above range.
  • the composition of the second aspect contains silica particles
  • the boiling point of the solvent is the value at 1 atmosphere (0.1 MPa).
  • the boiling point of solvent A1 is preferably 200°C or higher, more preferably 210°C or higher, and more preferably 220°C or higher.
  • the boiling point of solvent A1 is preferably 270° C. or lower, more preferably 265° C. or lower.
  • the viscosity of solvent A1 is preferably 10 mPa ⁇ s or less, more preferably 7 mPa ⁇ s or less, and more preferably 4 mPa ⁇ s or less.
  • the lower limit of the viscosity of solvent A1 is preferably 1.0 mPa ⁇ s or more, more preferably 1.4 mPa ⁇ s or more, and even more preferably 1.8 mPa ⁇ s or more from the viewpoint of coating properties. .
  • the molecular weight of solvent A1 is preferably 100 or more, more preferably 130 or more, still more preferably 140 or more, and particularly preferably 150 or more.
  • the upper limit is preferably 300 or less, more preferably 290 or less, even more preferably 280 or less, and particularly preferably 270 or less, from the viewpoint of coatability.
  • Solvent A1 preferably has a solubility parameter of 8.5 to 13.3 (cal/cm 3 ) 0.5 .
  • the upper limit is preferably 12.5 (cal/cm 3 ) 0.5 or less, more preferably 11.5 (cal/cm 3 ) 0.5 or less, and 10.5 (cal/cm 3 ) ) is more preferably 0.5 or less.
  • the lower limit is preferably 8.7 (cal/cm 3 ) 0.5 or more, more preferably 8.9 (cal/cm 3 ) 0.5 or more, and 9.1 (cal/cm 3 ) is more preferably 0.5 or more. If the solubility parameter of solvent A1 is within the above range, high affinity with silica particles can be obtained, and excellent coatability can be easily obtained. Note that 1 (cal/cm 3 ) 0.5 is 2.0455 MPa 0.5 . Solvent solubility parameters are values calculated by HSPiP.
  • the Hansen solubility parameter is used as the solubility parameter of the solvent. Specifically, a value calculated using the Hansen solubility parameter software "HSPiP 5.0.09" is used.
  • the solvent A1 is preferably an aprotic solvent.
  • an aprotic solvent as solvent A1, aggregation of silica particles during film formation can be more effectively suppressed.
  • Solvent A1 is preferably an ether-based solvent or an ester-based solvent, more preferably an ester-based solvent. Moreover, the ester-based solvent used as the solvent A1 is preferably a compound that does not contain a hydroxyl group or a terminal alkoxy group.
  • the solvent A1 is preferably at least one selected from alkylenediol diacetates and cyclic carbonates because it has a high affinity with silica particles and is likely to have excellent coatability.
  • Alkylene diol diacetates include propylene glycol diacetate, 1,4-butanediol diacetate, 1,3-butylene glycol diacetate, 1,6-hexanediol diacetate and the like.
  • Cyclic carbonates include propylene carbonate and ethylene carbonate.
  • solvent A1 examples include propylene carbonate (boiling point 240°C), ethylene carbonate (boiling point 260°C), propylene glycol diacetate (boiling point 190°C), dipropylene glycol methyl-n-propyl ether (boiling point 203°C), Propylene glycol methyl ether acetate (boiling point 213°C), 1,4-butanediol diacetate (boiling point 232°C), 1,3-butylene glycol diacetate (boiling point 232°C), 1,6-hexanediol diacetate (boiling point 260°C) ° C.), diethylene glycol monoethyl ether acetate (boiling point 217° C.), diethylene glycol monobutyl ether acetate (boiling point 247° C.), triacetin (boiling point 260° C.), dipropylene glycol
  • the solvent used in the composition of the second aspect preferably contains 3% by mass or more of the solvent A1, more preferably 4% by mass or more, and 5% by mass or more. It is more preferable that the According to this aspect, the effects of the present invention described above are likely to be obtained remarkably.
  • the upper limit is preferably 20% by mass or less, more preferably 15% by mass or less, and even more preferably 12% by mass or less. According to this aspect, it is easy to obtain a film with good surface properties. Only one kind of solvent A1 may be used, or two or more kinds thereof may be used in combination. When the composition of the second aspect contains two or more solvents A1, it is preferable that the total of them is within the above range.
  • the solvent used in the composition of the second aspect preferably further contains solvent A2 having a boiling point of 110°C or higher and lower than 190°C. According to this aspect, the drying property of the composition can be moderately increased to effectively suppress the occurrence of wavy coating unevenness, and a film with a good surface condition can be easily formed.
  • the boiling point of solvent A2 is preferably 115°C or higher, more preferably 120°C or higher, and more preferably 130°C or higher.
  • the boiling point of solvent A2 is preferably 170° C. or lower, more preferably 150° C. or lower. If the boiling point of the solvent A2 is within the above range, the effects described above are likely to be obtained more remarkably.
  • the molecular weight of solvent A2 is preferably 100 or more, more preferably 130 or more, even more preferably 140 or more, and even more preferably 150 or more, because the above-described effects are likely to be obtained more remarkably. is particularly preferred.
  • the upper limit is preferably 300 or less, more preferably 290 or less, even more preferably 280 or less, and particularly preferably 270 or less, from the viewpoint of coatability.
  • Solvent A2 preferably has a solubility parameter of 9.0 to 11.4 (cal/cm 3 ) 0.5 .
  • the upper limit is preferably 11.0 (cal/cm 3 ) 0.5 or less, more preferably 10.6 (cal/cm 3 ) 0.5 or less, and 10.2 (cal/cm 3 ) ) is more preferably 0.5 or less.
  • the lower limit is preferably 9.2 (cal/cm 3 ) 0.5 or more, more preferably 9.4 (cal/cm 3 ) 0.5 or more, and 9.6 (cal/cm 3 ) ) is more preferably 0.5 or more. If the solubility parameter of solvent A2 is within the above range, high affinity with silica particles can be obtained, and excellent coatability can be easily obtained.
  • the absolute value of the difference between the solubility parameter of solvent A1 and the solubility parameter of solvent A2 is preferably 0.01 to 1.1 (cal/cm 3 ) 0.5 .
  • the upper limit is preferably 0.9 (cal/cm 3 ) 0.5 or less, more preferably 0.7 (cal/cm 3 ) 0.5 or less, and 0.5 (cal/cm 3 ) is more preferably 0.5 or less.
  • the lower limit is preferably 0.03 (cal/cm 3 ) 0.5 or more, more preferably 0.05 (cal/cm 3 ) 0.5 or more, and 0.08 (cal/cm 3 ) ) is more preferably 0.5 or more.
  • the solvent A2 is preferably at least one selected from ether-based solvents and ester-based solvents, more preferably includes at least an ester-based solvent, and still more preferably includes an ether-based solvent and an ester-based solvent.
  • Specific examples of solvent A2 include cyclohexanol acetate (boiling point 173°C), dipropylene glycol dimethyl ether (boiling point 175°C), butyl acetate (boiling point 126°C), ethylene glycol monomethyl ether acetate (boiling point 145°C), and propylene glycol monomethyl ether.
  • the content of solvent A2 is preferably 500 to 5000 parts by mass with respect to 100 parts by mass of solvent A1.
  • the upper limit is preferably 4500 parts by mass or less, more preferably 4000 parts by mass or less, and even more preferably 3500 parts by mass or less.
  • the lower limit is preferably 600 parts by mass or more, more preferably 700 parts by mass or more, and even more preferably 750 parts by mass or more.
  • the content of solvent A2 in the total amount of solvent is preferably 50% by mass or more, more preferably 60% by mass or more, and even more preferably 70% by mass or more.
  • the upper limit is preferably 95% by mass or less, more preferably 90% by mass or less, and even more preferably 85% by mass or less.
  • the content of the solvent A2 is within the above range, the effects of the present invention are likely to be obtained more remarkably. Only one kind of solvent A2 may be used, or two or more kinds thereof may be used in combination. When the composition of the second aspect contains two or more solvents A2, the total is preferably within the above range.
  • the solvent used in the composition of the second aspect preferably contains the solvent A1 and the solvent A2 in a total content of 62% by mass or more, more preferably 72% by mass or more, and 82% by mass. % or more is more preferable.
  • the upper limit can be 100% by mass, 96% by mass or less, or 92% by mass or less.
  • the solvent used in the composition of the second aspect preferably further contains at least one solvent A3 selected from methanol, ethanol and 2-propyl alcohol. According to this aspect, high affinity with silica particles can be obtained, and excellent coatability can be easily obtained.
  • the solvent used in the composition of the second aspect further contains solvent A3, the content of solvent A3 in the total amount of solvent is preferably 0.1 to 10% by mass.
  • the upper limit is preferably 8% by mass or less, more preferably 6% by mass or less, and even more preferably 4% by mass or less.
  • the lower limit is preferably 0.3% by mass or more, more preferably 0.5% by mass or more, and even more preferably 1% by mass or more. If the content of the solvent A3 is within the above range, the above effects can be obtained more remarkably. Only one kind of solvent A3 may be used, or two or more kinds thereof may be used in combination. When the composition contains two or more solvents A3, it is preferable that the total is within the above range.
  • the solvent used in the composition of the second aspect preferably further contains water. According to this aspect, high affinity with silica particles can be obtained, and excellent coatability can be easily obtained.
  • the content of water in the total amount of the solvent is preferably 0.1 to 5% by mass.
  • the upper limit is preferably 4% by mass or less, more preferably 2.5% by mass or less, and even more preferably 1.5% by mass or less.
  • the lower limit is preferably 0.3% by mass or more, more preferably 0.5% by mass or more, and even more preferably 1.0% by mass or more. If the content of water is within the above range, the effects described above are likely to be obtained more remarkably.
  • the solvent used in the composition of the second aspect contains the above solvent A3 and water.
  • High affinity with silica particles can be obtained, and excellent coatability can be easily obtained.
  • the total content of solvent A3 and water in the total amount of solvent is preferably 0.2 to 15% by mass.
  • the upper limit is preferably 12% by mass or less, more preferably 9% by mass or less, and even more preferably 6% by mass or less.
  • the lower limit is preferably 0.4% by mass or more, more preferably 0.7% by mass or more, and even more preferably 1.5% by mass or more. If the total content of solvent A3 and water is within the above range, the above-described effects can be obtained more remarkably.
  • the solvent used in the composition of the second aspect can further contain solvent A4 with a boiling point of over 280°C.
  • solvent A4 with a boiling point of over 280°C.
  • the upper limit of the boiling point of solvent A4 is preferably 400° C. or lower, more preferably 380° C. or lower, and even more preferably 350° C. or lower.
  • Solvent A4 is preferably at least one selected from ether-based solvents and ester-based solvents. Specific examples of solvent A4 include polyethylene glycol monomethyl ether.
  • the content of solvent A4 in the total amount of solvent is preferably 0.5 to 15% by mass.
  • the upper limit is preferably 10% by mass or less, more preferably 8% by mass or less, and even more preferably 6% by mass or less.
  • the lower limit is preferably 1% by mass or more, more preferably 1.5% by mass or more, and even more preferably 2% by mass or more.
  • the solvent used in the composition of the second aspect does not substantially contain solvent A4.
  • substantially free of solvent A4" means that the content of solvent A4 in the total amount of solvent is 0.1% by mass or less, preferably 0.05% by mass or less, and 0.1% by mass or less. It is more preferably 01% by mass or less, and more preferably not contained.
  • the solvent used in the composition of the second aspect may contain solvents (other solvents) other than solvent A1, solvent A2, solvent A3, solvent A4 and water described above, but other solvents are substantially It is preferable not to contain in Note that "substantially free of other solvents" means that the content of other solvents in the total amount of solvents is 0.1% by mass or less, preferably 0.05% by mass or less, It is more preferably 0.01% by mass or less, and more preferably not contained.
  • the content of compounds having a molecular weight (weight average molecular weight in the case of a polymer) exceeding 300 is preferably 10% by mass or less, and is 8% by mass or less. is more preferably 5% by mass or less, even more preferably 3% by mass or less, and particularly preferably 1% by mass or less. According to this aspect, more excellent coatability can be easily obtained, and a film having an excellent surface condition can be easily obtained.
  • the solvent used in the composition of the second aspect preferably contains 10% by mass or less, more preferably 8% by mass or less, of compounds having a viscosity of more than 10 mPa s at 25°C. It is more preferably 5% by mass or less, even more preferably 3% by mass or less, and particularly preferably 1% by mass or less. According to this aspect, more excellent coatability can be easily obtained, and a film having an excellent surface condition can be easily obtained.
  • the composition of the second aspect can contain a curable compound.
  • the curable compound include materials such as the resins and polymerizable monomers described as the curable compound that can be included in the composition of the first aspect.
  • the curable compound preferably contains a resin.
  • the content of the curable compound in the composition is preferably 0.01% by mass or more, more preferably 0.05% by mass or more, and even more preferably 0.1% by mass or more.
  • the upper limit is preferably 10% by mass or less, more preferably 5% by mass or less, and even more preferably 3% by mass or less.
  • the content of the curable compound in the total solid content of the composition is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, and even more preferably 1% by mass or more.
  • the upper limit is preferably 30% by mass or less, more preferably 20% by mass or less, and even more preferably 10% by mass or less. Only 1 type may be used for a sclerosing
  • the total amount thereof is preferably within the above range. It is also preferred that the composition of the second aspect is free of polymerizable monomers. According to this aspect, it is easy to form a film with a lower refractive index. Furthermore, it is easy to form a film with a small haze.
  • the composition of the second aspect can contain a photoinitiator.
  • Photoinitiators include the materials described as photoinitiators that the composition of the first aspect can contain.
  • the content of the photopolymerization initiator in the composition is preferably 0.1% by mass or more, more preferably 0.2% by mass or more, and even more preferably 0.5% by mass or more.
  • the upper limit is preferably 10% by mass or less, more preferably 5% by mass or less, and more preferably 3% by mass or less.
  • the content of the photopolymerization initiator in the total solid content of the composition is preferably 1% by mass or more, more preferably 2% by mass or more, and even more preferably 5% by mass or more.
  • the upper limit is preferably 30% by mass or less, more preferably 25% by mass or less, and more preferably 20% by mass or less. Only one kind of photopolymerization initiator may be used, or two or more kinds thereof may be used.
  • the total amount thereof is preferably within the above range. It is also preferred that the composition of the second aspect does not contain a photoinitiator. According to this aspect, it is easy to form a film with a lower refractive index. Furthermore, it is easy to form a film with a small haze.
  • composition of the second aspect can contain a silane coupling agent.
  • Silane coupling agents include materials described as silane coupling agents that the composition of the first aspect can include.
  • the content of the silane coupling agent in the total solid content of the composition is preferably 0.001% by mass or more, more preferably 0.01% by mass or more, and particularly preferably 0.1% by mass or more.
  • the upper limit is preferably 20% by mass or less, more preferably 10% by mass or less, and particularly preferably 5% by mass or less. Only one kind of silane coupling agent may be used, or two or more kinds thereof may be used. When two or more types are used, the total amount thereof is preferably within the above range. It is also preferred that the composition of the second aspect does not contain a silane coupling agent.
  • Black color material>> The composition of the second aspect can contain a black colorant.
  • Black colorants include the materials described as black colorants that the composition of the first aspect can contain.
  • the content of the black colorant in the total solid content of the composition is preferably 10% by mass or less, more preferably 5% by mass or less, and particularly preferably 1% by mass or less. It is also preferred that the composition of the second aspect does not substantially contain a black colorant. In addition, when the composition does not substantially contain a black colorant, it means that the content of the black colorant in the total solid content of the composition is 0.1% by mass or less, and 0.05 % by mass or less, and more preferably contains no black colorant.
  • the composition of the second aspect can contain a chromatic colorant.
  • the chromatic colorant includes the materials described as the chromatic colorant that the composition of the first aspect can contain.
  • the content of the chromatic coloring material in the total solid content of the composition is preferably 10% by mass or less, more preferably 5% by mass or less, and particularly preferably 1% by mass or less. It is also preferred that the composition of the second aspect does not substantially contain a chromatic colorant. In addition, when the composition does not substantially contain a chromatic colorant, it means that the content of the chromatic colorant in the total solid content of the composition is 0.1% by mass or less. It is preferably 0.05% by mass or less, and more preferably does not contain a chromatic coloring material.
  • composition of the second aspect may optionally contain ultraviolet absorbers, antioxidants, latent antioxidants, polymerization inhibitors, sensitizers, fillers, thermosetting accelerators, plasticizers and other auxiliary agents.
  • ultraviolet absorbers for example, conductive particles, antifoaming agents, flame retardants, leveling agents, release accelerators, fragrances, surface tension modifiers, chain transfer agents, etc.
  • conductive particles, antifoaming agents, flame retardants, leveling agents, release accelerators, fragrances, surface tension modifiers, chain transfer agents, etc. may be contained.
  • These materials include the materials described as being capable of being included in the composition of the first aspect described above.
  • the storage container for the composition of the present invention is not particularly limited, and known storage containers can be used.
  • a storage container a multi-layer bottle whose inner wall is composed of 6 types and 6 layers of resins and a bottle with a 7-layer structure of 6 types of resins for the purpose of suppressing the contamination of raw materials and coloring compositions. It is also preferred to use Examples of such a container include the container described in JP-A-2015-123351.
  • the inner wall of the container is preferably made of glass or stainless steel for the purpose of preventing metal elution from the inner wall of the container, enhancing the storage stability of the composition, and suppressing deterioration of components.
  • compositions of the present invention can be prepared by admixing the aforementioned ingredients.
  • the composition may be produced by simultaneously dissolving and/or dispersing all the components in a solvent, or if necessary, each component may be appropriately prepared as two or more solutions or dispersions.
  • a composition may be produced by mixing these at the time of use (at the time of application).
  • a process of dispersing the pigment is included in the production of the composition.
  • mechanical forces used for dispersing pigments include compression, squeezing, impact, shearing, cavitation, and the like.
  • Specific examples of these processes include bead mills, sand mills, roll mills, ball mills, paint shakers, microfluidizers, high speed impellers, sand grinders, flow jet mixers, high pressure wet atomization, ultrasonic dispersion, and the like.
  • the particles may be made finer in the salt milling step.
  • Materials, equipment, processing conditions, etc. used in the salt milling step can be referred to, for example, Japanese Patent Application Laid-Open Nos. 2015-194521 and 2012-046629.
  • Beads used for dispersion can be zirconia, agate, quartz, titania, tungsten carbide, silicon nitride, alumina, stainless steel, glass, or combinations thereof.
  • an inorganic compound having a Mohs hardness of 2 or more can be used.
  • the composition may contain 1 to 10000 ppm of the beads.
  • any filter that has been conventionally used for filtration or the like can be used without particular limitation.
  • fluororesins such as polytetrafluoroethylene (PTFE) and polyvinylidene fluoride (PVDF)
  • polyamide resins such as nylon (eg nylon-6, nylon-6,6)
  • polyolefin resins such as polyethylene and polypropylene (PP) (including high-density, ultra-high-molecular-weight polyolefin resin) and other materials.
  • PP polypropylene
  • nylon including high density polypropylene
  • nylon including high density polypropylene
  • the pore size of the filter is preferably 0.01-7.0 ⁇ m, more preferably 0.01-3.0 ⁇ m, and even more preferably 0.05-0.5 ⁇ m. If the pore diameter of the filter is within the above range, fine foreign matter can be removed more reliably.
  • the pore size value of the filter reference can be made to the filter manufacturer's nominal value.
  • Various filters provided by Nippon Pall Co., Ltd. (DFA4201NXEY, DFA4201NAEY, DFA4201J006P, etc.), Advantech Toyo Co., Ltd., Nihon Entegris Co., Ltd. (former Japan Microlith Co., Ltd.), Kitz Micro Filter Co., Ltd., etc. can be used as filters. .
  • fibrous filter media include polypropylene fibers, nylon fibers, and glass fibers.
  • Commercially available products include SBP type series (SBP008, etc.), TPR type series (TPR002, TPR005, etc.), and SHPX type series (SHPX003, etc.) manufactured by Roki Techno.
  • filters When using filters, different filters (eg, a first filter and a second filter, etc.) may be combined. At that time, filtration with each filter may be performed only once, or may be performed twice or more. Also, filters with different pore sizes within the range described above may be combined. Further, the filtration with the first filter may be performed only on the dispersion liquid, and after mixing other components, the filtration with the second filter may be performed. In addition, the filter can be appropriately selected according to the hydrophilicity/hydrophobicity of the composition.
  • the membrane of the invention is a membrane obtained from the composition of the invention as described above.
  • the film of the present invention can be used for optical filters such as color filters, near-infrared transmission filters, and near-infrared cut filters. Also, the film of the present invention can be used as a light-shielding film, a partition wall, and the like.
  • the film thickness of the film of the present invention can be appropriately adjusted according to the purpose.
  • the film thickness is preferably 20 ⁇ m or less, more preferably 10 ⁇ m or less, and even more preferably 5 ⁇ m or less.
  • the lower limit of the film thickness is preferably 0.1 ⁇ m or more, more preferably 0.2 ⁇ m or more, and even more preferably 0.3 ⁇ m or more.
  • the film of the present invention When using the film of the present invention as a color filter, the film of the present invention preferably has a hue of green, red, blue, cyan, magenta or yellow. Moreover, the film of the present invention can be preferably used as a colored pixel of a color filter. Examples of colored pixels include red pixels, green pixels, blue pixels, magenta pixels, cyan pixels, and yellow pixels.
  • the maximum absorption wavelength of the film of the present invention preferably exists in the wavelength range of 700 to 1800 nm, more preferably in the wavelength range of 700 to 1300 nm. More preferably, it exists in the wavelength range of 700 to 1100 nm.
  • the transmittance of the film over the entire wavelength range of 400 to 650 nm is preferably 70% or more, more preferably 80% or more, and even more preferably 90% or more. Further, it is preferable that the transmittance of the film at least at one point in the wavelength range of 700 to 1800 nm is 20% or less.
  • the absorbance Amax/absorbance A550 which is the ratio of the absorbance Amax at the maximum absorption wavelength and the absorbance A550 at a wavelength of 550 nm, is preferably 20 to 500, more preferably 50 to 500, and 70 to 450. more preferably 100 to 400.
  • the film of the present invention preferably has, for example, any one of the following spectral characteristics (i1) to (i5).
  • a film having such spectral characteristics can block light in the wavelength range of 400 to 640 nm and transmit light in the wavelength range of 750 nm or more.
  • the maximum transmittance in the wavelength range of 400 to 750 nm is 20% or less (preferably 15% or less, more preferably 10% or less), and the minimum transmittance in the wavelength range of 900 to 1500 nm is A filter that is 70% or more (preferably 75% or more, more preferably 80% or more).
  • a film having such spectral characteristics can block light in the wavelength range of 400 to 750 nm and transmit light in the wavelength range of 850 nm or more.
  • the maximum transmittance in the wavelength range of 400 to 830 nm is 20% or less (preferably 15% or less, more preferably 10% or less), and the minimum transmittance in the wavelength range of 1000 to 1500 nm is A filter that is 70% or more (preferably 75% or more, more preferably 80% or more).
  • a film having such spectral characteristics can block light in the wavelength range of 400 to 830 nm and transmit light in the wavelength range of 950 nm or more.
  • the maximum transmittance in the wavelength range of 400 to 950 nm is 20% or less (preferably 15% or less, more preferably 10% or less), and the minimum transmittance in the wavelength range of 1100 to 1500 nm is A filter that is 70% or more (preferably 75% or more, more preferably 80% or more).
  • a film having such spectral characteristics can block light in the wavelength range of 400 to 950 nm and transmit light in the wavelength range of 1050 nm or more.
  • the maximum transmittance in the wavelength range of 400 to 1050 nm is 20% or less (preferably 15% or less, more preferably 10% or less), and the minimum transmittance in the wavelength range of 1200 to 1500 nm is A filter that is 70% or more (preferably 75% or more, more preferably 80% or more).
  • a film having such spectral characteristics can block light in the wavelength range of 400 to 1050 nm and transmit light in the wavelength range of 1150 nm or more.
  • the optical density (OD) per 1.5 ⁇ m film thickness in the wavelength range of 400 to 1100 nm of the film is preferably 2.5 or more, and preferably 3.0. It is more preferable to be above.
  • the upper limit is not particularly limited, it is generally preferably 10 or less.
  • the reflectance of the film is preferably less than 8%, more preferably less than 6%, and even more preferably less than 4%.
  • the lower limit is preferably 0% or more.
  • the light-shielding film is used in portable devices such as personal computers, tablets, mobile phones, smartphones, and digital cameras; OA (Office Automation) devices such as multi-function printers and scanners; industrial equipment such as automated teller machines), high-speed cameras, and equipment with personal authentication functions using face image authentication or biometric authentication; vehicle-mounted camera equipment; medical cameras such as endoscopes, capsule endoscopes, and catheters equipment; and space equipment such as biosensors, biosensors, military reconnaissance cameras, stereo map cameras, weather and ocean observation cameras, land resource exploration cameras and exploration cameras for space astronomy and deep space targets; It can be used for optical filters and modules used.
  • OA Office Automation
  • industrial equipment such as automated teller machines
  • high-speed cameras and equipment with personal authentication functions using face image authentication or biometric authentication
  • vehicle-mounted camera equipment medical cameras such as endoscopes, capsule endoscopes, and catheters equipment
  • space equipment such as biosensors, biosensors, military reconnaissance cameras, stereo map cameras, weather and ocean observation cameras, land resource exploration cameras and exploration cameras
  • the light-shielding film can also be used for applications such as micro LEDs (Light Emitting Diodes) and micro OLEDs (Organic Light Emitting Diodes).
  • Micro LEDs and micro OLEDs include, for example, examples described in Japanese Patent Publication No. 2015-500562 and Japanese Patent Publication No. 2014-533890.
  • the light shielding film can also be used for a quantum dot sensor.
  • Quantum dot sensors include, for example, examples described in US2012/37789 and WO2008/131313.
  • the refractive index of the film of the present invention for light having a wavelength of 633 nm is preferably 1.4 or less, more preferably 1.35 or less, and 1.3 or less. It is more preferably 1.27 or less.
  • the value of the said refractive index is a value in the measurement temperature of 25 degreeC.
  • the membrane of the present invention can be produced through the step of coating the composition of the present invention on a support.
  • the film manufacturing method further includes the step of forming a pattern.
  • the pattern forming method include a photolithography method and a dry etching method, and the photolithography method is preferable.
  • Pattern formation by photolithography includes the steps of forming a composition layer on a support using the composition of the present invention, patternwise exposing the composition layer, and developing the unexposed portion of the composition layer. and removing to form a pattern. If necessary, a step of baking the composition layer (pre-baking step) and a step of baking the developed pattern (post-baking step) may be provided.
  • the composition of the present invention is used to form the composition layer on the support.
  • the support is not particularly limited and can be appropriately selected depending on the application. Examples thereof include glass substrates and silicon substrates, and silicon substrates are preferred. Also, a charge-coupled device (CCD), a complementary metal oxide semiconductor (CMOS), a transparent conductive film, or the like may be formed on the silicon substrate.
  • CCD charge-coupled device
  • CMOS complementary metal oxide semiconductor
  • the silicon substrate is formed with a black matrix that isolates each pixel.
  • the silicon substrate may be provided with an underlying layer for improving adhesion with the upper layer, preventing diffusion of substances, or flattening the substrate surface.
  • a known method can be used as a method for applying the composition.
  • dropping method drop cast
  • slit coating method spray method
  • roll coating method spin coating
  • methods described in publications inkjet
  • ejection system printing such as nozzle jet, flexographic printing, screen printing, gravure printing, reverse offset printing, metal mask printing, etc.
  • Examples include various printing methods; transfer methods using molds and the like; nanoimprinting methods and the like.
  • the application method for inkjet is not particularly limited.
  • the composition layer formed on the support may be dried (pre-baked). Pre-baking may not be performed when the film is manufactured by a low-temperature process.
  • the pre-baking temperature is preferably 150° C. or lower, more preferably 120° C. or lower, and even more preferably 110° C. or lower.
  • the lower limit can be, for example, 50° C. or higher, and can also be 80° C. or higher.
  • the pre-bake time is preferably 10 to 300 seconds, more preferably 40 to 250 seconds, even more preferably 80 to 220 seconds. Pre-baking can be performed using a hot plate, an oven, or the like.
  • the composition layer is exposed in a pattern (exposure step).
  • the composition layer can be exposed in a pattern by exposing through a mask having a predetermined mask pattern using a stepper exposure machine, a scanner exposure machine, or the like. Thereby, the exposed portion can be cured.
  • Radiation (light) that can be used for exposure includes g-line, i-line, and the like.
  • Light with a wavelength of 300 nm or less (preferably light with a wavelength of 180 to 300 nm) can also be used.
  • Light having a wavelength of 300 nm or less includes KrF rays (wavelength: 248 nm), ArF rays (wavelength: 193 nm), etc., and KrF rays (wavelength: 248 nm) are preferred.
  • a long-wave light source of 300 nm or more can also be used.
  • the light when exposing, the light may be continuously irradiated and exposed, or may be irradiated and exposed in pulses (pulse exposure).
  • pulse exposure is an exposure method in which exposure is performed by repeating light irradiation and rest in short-time (for example, millisecond level or less) cycles.
  • the irradiation amount is, for example, preferably 0.03 to 2.5 J/cm 2 , more preferably 0.05 to 1.0 J/cm 2 .
  • the oxygen concentration at the time of exposure can be selected as appropriate.
  • the exposure may be in an oxygen-free atmosphere, or in a high-oxygen atmosphere with an oxygen concentration exceeding 21% by volume (for example, 22% by volume, 30% by volume, or 50% by volume).
  • the exposure illuminance can be set as appropriate, and is usually selected from the range of 1000 W/m 2 to 100000 W/m 2 (eg, 5000 W/m 2 , 15000 W/m 2 or 35000 W/m 2 ). can be done.
  • Oxygen concentration and exposure illuminance may be appropriately combined. For example, illuminance of 10000 W/m 2 at oxygen concentration of 10% by volume and illuminance of 20000 W/m 2 at oxygen concentration of 35% by volume.
  • the unexposed portion of the composition layer is removed by development to form a pattern.
  • the development and removal of the unexposed portion of the composition layer can be performed using a developer.
  • the unexposed portion of the composition layer in the exposure step is eluted into the developer, leaving only the photocured portion.
  • the temperature of the developer is preferably 20 to 30° C., for example.
  • the development time is preferably 20 to 180 seconds. Further, in order to improve the residue removability, the step of shaking off the developer every 60 seconds and then supplying new developer may be repeated several times.
  • the developer includes an organic solvent, an alkaline developer, etc., and an alkaline developer is preferably used.
  • an alkaline developer an alkaline aqueous solution (alkali developer) obtained by diluting an alkaline agent with pure water is preferable.
  • alkaline agents include ammonia, ethylamine, diethylamine, dimethylethanolamine, diglycolamine, diethanolamine, hydroxylamine, ethylenediamine, tetramethylammonium hydroxide, tetraethylammonium hydroxide, tetrapropylammonium hydroxide, and tetrabutylammonium hydroxide.
  • ethyltrimethylammonium hydroxide ethyltrimethylammonium hydroxide
  • benzyltrimethylammonium hydroxide dimethylbis(2-hydroxyethyl)ammonium hydroxide
  • choline pyrrole
  • piperidine 1,8-diazabicyclo-[5.4.0]-7-undecene
  • examples include organic alkaline compounds and inorganic alkaline compounds such as sodium hydroxide, potassium hydroxide, sodium carbonate, sodium hydrogen carbonate, sodium silicate and sodium metasilicate.
  • a compound having a large molecular weight is preferable for the alkaline agent from the standpoint of environment and safety.
  • the concentration of the alkaline agent in the alkaline aqueous solution is preferably 0.001 to 10% by mass, more preferably 0.01 to 1% by mass.
  • the developer may further contain a surfactant. From the viewpoint of transportation and storage convenience, the developer may be produced once as a concentrated solution and then diluted to the required concentration when used. Although the dilution ratio is not particularly limited, it can be set, for example, in the range of 1.5 to 100 times. It is also preferable to wash (rinse) with pure water after development. Rinsing is preferably carried out by supplying a rinse liquid to the composition layer after development while rotating the support on which the composition layer after development is formed.
  • the nozzle for discharging the rinsing liquid from the central portion of the support to the peripheral portion of the support.
  • the moving speed of the nozzle may be gradually decreased.
  • Additional exposure processing and post-baking are post-development curing treatments for complete curing.
  • the heating temperature in post-baking is, for example, preferably 100 to 240.degree. C., more preferably 200 to 240.degree.
  • Post-baking can be performed continuously or batchwise using a heating means such as a hot plate, a convection oven (hot air circulating dryer), or a high-frequency heater so that the developed film satisfies the above conditions. .
  • the light used for exposure preferably has a wavelength of 400 nm or less.
  • the additional exposure process may be performed by the method described in Korean Patent Publication No. 10-2017-0122130.
  • Pattern formation by a dry etching method includes steps of forming a composition layer on a support using the composition of the present invention, curing the entire composition layer to form a cured product layer, and forming a cured product layer. a step of forming a photoresist layer on the layer; a step of exposing the photoresist layer in a pattern and then developing it to form a resist pattern; and a step of dry etching.
  • a mode in which heat treatment after exposure and heat treatment (post-baking treatment) after development are performed is desirable.
  • pattern formation by a dry etching method descriptions in paragraphs 0010 to 0067 of JP-A-2013-064993 can be referred to, and the contents thereof are incorporated herein.
  • FIG. 2 is a side cross-sectional view showing one embodiment of the structure of the present invention
  • FIG. 3 is a plan view of the support member in the same structure viewed from directly above.
  • the structure 100 of the present invention includes a support 11, partitions 12 provided on the support 11, and regions on the support 11 partitioned by the partitions 12. and a pixel 14 provided.
  • pixels include colored pixels, transparent pixels, pixels of a near-infrared transmission filter layer, and pixels of a near-infrared cut filter layer.
  • Examples of colored pixels include red pixels, green pixels, blue pixels, magenta pixels, cyan pixels, and yellow pixels.
  • the type of support 11 is not particularly limited.
  • Substrates silicon wafers, silicon carbide wafers, silicon nitride wafers, sapphire wafers, glass wafers, etc.
  • a substrate for a solid-state imaging device on which a photodiode is formed, or the like can also be used.
  • an underlying layer may be provided for improving the adhesion with the upper layer, preventing diffusion of substances, or flattening the surface.
  • partition walls 12 are formed on the support 11 .
  • the partition walls 12 are formed in a grid pattern in a plan view seen from directly above the support 11 .
  • the shape of the region partitioned by the partitions 12 on the support 11 (hereinafter also referred to as the shape of the opening of the partition) is a square, but the shape of the opening of the partition is It is not particularly limited, and may be, for example, rectangular, circular, elliptical, or polygonal.
  • the partition wall 12 can be formed using the composition of the present invention (preferably the composition of the second aspect). Specifically, it can be formed through a step of forming a composition layer using the composition of the present invention and a step of forming a pattern on the composition layer by photolithography or dry etching.
  • the width W1 of the partition walls 12 is preferably 20 to 500 nm.
  • the lower limit is preferably 30 nm or more, more preferably 40 nm or more, and even more preferably 50 nm or more.
  • the upper limit is preferably 300 nm or less, more preferably 200 nm or less, and even more preferably 100 nm or less.
  • the height H1 of the partition wall 12 is preferably 200 nm or more, more preferably 300 nm or more, and even more preferably 400 nm or more.
  • the upper limit is preferably the thickness of the pixel 14 x 200% or less, more preferably the thickness of the pixel 14 x 150% or less, and still more preferably substantially the same as the thickness of the pixel 14 .
  • the ratio of height to width (height/width) of the partition walls 12 is preferably 1-100, more preferably 5-50, even more preferably 5-30.
  • Pixels 14 are formed in regions (openings of the partition walls) on the support 11 and partitioned by the partition walls 12 .
  • the width L1 of the pixel 14 can be appropriately selected depending on the application. For example, it is preferably 500 to 2000 nm, more preferably 500 to 1500 nm, even more preferably 500 to 1000 nm.
  • the height (thickness) H2 of the pixel 14 can be appropriately selected depending on the application. For example, it is preferably 300 to 1000 nm, more preferably 300 to 800 nm, even more preferably 300 to 600 nm.
  • the height H2 of the pixels 14 is preferably 50 to 150%, more preferably 70 to 130%, and even more preferably 90 to 110% of the height H1 of the partition walls 12.
  • a protective layer is provided on the surface of the partition wall.
  • a protective layer By providing a protective layer on the surfaces of the partition walls 12, the adhesion between the partition walls 12 and the pixels 14 can be improved.
  • Various inorganic materials and organic materials can be used as the material of the protective layer. Examples of organic materials include acrylic resins, polystyrene resins, polyimide resins, organic SOG (Spin On Glass) resins, and the like. It can also be formed using a composition containing a compound having an ethylenically unsaturated bond-containing group.
  • the structure of the present invention can be preferably used for optical filters, optical sensors, image display devices, and the like.
  • the optical filter of the present invention has the film of the present invention as described above.
  • the optical filter includes a color filter, a near-infrared transmission filter, a near-infrared cut filter, and the like, and is preferably a color filter.
  • a color filter it is preferable to have the film of the present invention as a colored pixel of the color filter.
  • the optical filter may have a structure in which each pixel is embedded in a space partitioned by partition walls, for example, in a grid pattern.
  • the optical filter may have a light shielding film.
  • a color filter, a near-infrared transmission filter, a near-infrared cut filter, or the like may be formed in the openings of the light-shielding film formed on the support.
  • the optical filter of the present invention can be used for optical sensors such as solid-state imaging devices, image display devices, and the like.
  • the film thickness of the film of the present invention can be appropriately adjusted according to the purpose.
  • the film thickness of the pixels included in the optical filter is preferably 5 ⁇ m or less, more preferably 1 ⁇ m or less, and even more preferably 0.6 ⁇ m or less.
  • the lower limit of the film thickness is preferably 0.1 ⁇ m or more, more preferably 0.2 ⁇ m or more, and even more preferably 0.3 ⁇ m or more.
  • the width of pixels included in the optical filter is preferably 0.4 to 10.0 ⁇ m.
  • the lower limit is preferably 0.4 ⁇ m or more, more preferably 0.5 ⁇ m or more, and even more preferably 0.6 ⁇ m or more.
  • the upper limit is preferably 5.0 ⁇ m or less, more preferably 2.0 ⁇ m or less, even more preferably 1.0 ⁇ m or less, and even more preferably 0.8 ⁇ m or less.
  • the Young's modulus of the pixel is preferably 0.5 to 20 GPa, more preferably 2.5 to 15 GPa.
  • Each pixel included in the optical filter preferably has high flatness.
  • the pixel surface roughness Ra is preferably 100 nm or less, more preferably 40 nm or less, and even more preferably 15 nm or less. Although the lower limit is not specified, it is preferably 0.1 nm or more, for example.
  • the surface roughness of a pixel can be measured using, for example, AFM (Atomic Force Microscope) Dimension 3100 manufactured by Veeco.
  • the contact angle of water on the pixel can be appropriately set to a preferable value, but is typically in the range of 50 to 110°. The contact angle can be measured using, for example, a contact angle meter CV-DT-A type (manufactured by Kyowa Interface Science Co., Ltd.).
  • the volume resistance value of the pixel is high.
  • the volume resistance value of the pixel is preferably 10 9 ⁇ cm or more, more preferably 10 11 ⁇ cm or more.
  • the upper limit is not specified, it is preferably 10 14 ⁇ cm or less, for example.
  • the volume resistance value of the pixel can be measured using an ultra-high resistance meter 5410 (manufactured by Advantest).
  • the film thickness of the light shielding film is preferably 5 ⁇ m or less, more preferably 2.5 ⁇ m or less.
  • the lower limit of the film thickness is preferably 0.1 ⁇ m or more, more preferably 0.5 ⁇ m or more, and even more preferably 1 ⁇ m or more.
  • a protective layer may be provided on the surface of the film of the present invention.
  • the protective layer By providing the protective layer, it is possible to impart various functions such as blocking oxygen, reducing reflection, making the film hydrophilic and hydrophobic, and blocking light of a specific wavelength (ultraviolet rays, near-infrared rays, etc.).
  • the thickness of the protective layer is preferably 0.01-10 ⁇ m, more preferably 0.1-5 ⁇ m.
  • Examples of the method of forming the protective layer include a method of applying a protective layer-forming composition, a chemical vapor deposition method, and a method of adhering a molded resin with an adhesive.
  • Components constituting the protective layer include (meth)acrylic resins, ene-thiol resins, polycarbonate resins, polyether resins, polyarylate resins, polysulfone resins, polyethersulfone resins, polyphenylene resins, polyarylene ether phosphine oxide resins, and polyimides.
  • the protective layer preferably contains a polyol resin, SiO 2 and Si 2 N 4 .
  • the protective layer preferably contains a (meth)acrylic resin and a fluororesin.
  • the protective layer contains organic/inorganic fine particles, absorbers for light of specific wavelengths (e.g., ultraviolet rays, near-infrared rays, etc.), refractive index modifiers, antioxidants, adhesion agents, additives such as surfactants. may contain.
  • organic/inorganic fine particles include polymeric fine particles (eg, silicone resin fine particles, polystyrene fine particles, melamine resin fine particles), titanium oxide, zinc oxide, zirconium oxide, indium oxide, aluminum oxide, titanium nitride, and titanium oxynitride. , magnesium fluoride, hollow silica, silica, calcium carbonate, barium sulfate, and the like.
  • a known absorber can be used as the absorber for light of a specific wavelength.
  • the content of these additives can be appropriately adjusted, but is preferably 0.1 to 70% by mass, more preferably 1 to 60% by mass, based on the total mass of the protective layer.
  • the protective layer the protective layers described in paragraphs 0073 to 0092 of JP-A-2017-151176 can also be used.
  • optical sensor of the present invention comprises the membrane of the present invention as described above.
  • optical sensors include solid-state imaging devices.
  • the configuration of the solid-state imaging device is not particularly limited as long as it functions as a solid-state imaging device.
  • a plurality of photodiodes and transfer electrodes made of polysilicon or the like are provided on the substrate, forming the light-receiving area of a solid-state imaging device (CCD (charge-coupled device) image sensor, CMOS (complementary metal-oxide semiconductor) image sensor, etc.). and a device protective film made of silicon nitride or the like formed on the light shielding film so as to cover the entire surface of the light shielding film and the photodiode light receiving portion. and a color filter on the device protective film.
  • CCD charge-coupled device
  • CMOS complementary metal-oxide semiconductor
  • the color filter may have a structure in which each color pixel is embedded in a space partitioned by partition walls, for example, in a grid pattern.
  • the partition wall preferably has a lower refractive index than each color pixel. Examples of imaging devices having such a structure include devices described in JP-A-2012-227478, JP-A-2014-179577, and International Publication No. 2018/043654.
  • an ultraviolet absorption layer may be provided in the structure of the solid-state imaging device to improve light resistance.
  • Imaging devices equipped with solid-state imaging devices can be used not only for digital cameras and electronic devices (mobile phones, etc.) having imaging functions, but also for vehicle-mounted cameras and monitoring cameras.
  • the image display device of the present invention includes the film of the present invention described above.
  • image display devices include liquid crystal display devices and organic electroluminescence display devices.
  • electroluminescence display devices For a definition of an image display device and details of each image display device, see, for example, “Electronic Display Device (by Akio Sasaki, Industrial Research Institute, 1990)", “Display Device (by Junsho Ibuki, Sangyo Tosho ( Co., Ltd.) issued in 1989).
  • Liquid crystal display devices are described, for example, in “Next Generation Liquid Crystal Display Technology (edited by Tatsuo Uchida, published by Kogyo Choukai Co., Ltd., 1994)".
  • the present invention can be applied to liquid crystal display devices of various systems described in the above-mentioned "next generation liquid crystal display technology”.
  • dispersion liquid A mixed liquid obtained by mixing raw materials shown in the table below was mixed and dispersed for 3 hours using a bead mill (zirconia beads with a diameter of 0.1 mm). Then, dispersion treatment was carried out using a high-pressure disperser NANO-3000-10 (manufactured by Nippon BEE Co., Ltd.) with a pressure reduction mechanism under conditions of a pressure of 2000 kg/cm 2 and a flow rate of 500 g/min. This dispersing treatment was repeated 10 times to obtain a dispersion. Numerical values indicating compounding amounts in the table below are parts by mass. In addition, the numerical value of the compounding quantity of a dispersing agent is a numerical value by solid content conversion.
  • PR122 C.I. I. Pigment Red 122 (red pigment) PR254: C.I. I. Pigment Red 254 (red pigment)
  • PG7 C.I. I. Pigment Green 7 (green pigment)
  • PG36 C.I. I. Pigment Green 36 (green pigment)
  • PB15:3 C.I. I. Pigment Blue 15:3 (blue pigment)
  • PB15:4 C.I. I. Pigment Blue 15:4 (blue pigment)
  • PB15:6 C.I. I. Pigment Blue 15:6 (blue pigment)
  • PB16 C.I. I. Pigment Blue 16 (blue pigment)
  • PY139 C.I. I.
  • Pigment Yellow 139 (yellow pigment) PY150: C.I. I. Pigment Yellow 150 (yellow pigment) PV23: C.I. I. Pigment Violet 23 (purple pigment)
  • TiON Titanium nitride (black pigment) TiO2-1: TTO-51 (manufactured by Ishihara Sangyo Co., Ltd., titanium oxide, white pigment)
  • TiO2-2 MPT-141 (manufactured by Ishihara Sangyo Co., Ltd., titanium oxide, white pigment)
  • Pigment A compound having the following structure (near-infrared absorbing pigment, iC 8 H 17 and iC 10 H 21 portions are isomer mixtures with different carbon numbers and branching positions)
  • D-1 Resin having the following structure (the numerical value attached to the main chain is the molar ratio, and the numerical value attached to the side chain is the number of repeating units.
  • D-2 Resin having the following structure
  • D-3 Resin having the following structure (the numerical value attached to the main chain is the molar ratio, and the numerical value attached to the side chain is the number of repeating units.
  • D-4 Resin shown below (weight average molecular weight 8000, acid value 37 mgKOH/g, ethylenically unsaturated bond-containing group value 0.22 mmol/g)
  • composition ⁇ Production of composition> The raw materials shown in the table below were mixed and filtered using Nippon Pall's DFA4201NIEY (0.45 ⁇ m nylon filter) to produce a composition. Numerical values indicating compounding amounts in the following table are parts by mass.
  • Dispersions 1 to 21 Dispersions 1 to 21 described above
  • Silica particle liquid 1 A propylene glycol monomethyl ether solution (silica particles This is a silica particle liquid prepared by adding 3.0 g of trimethylmethoxysilane as a hydrophobizing agent to 100.0 g of a solution having a concentration of 20% by mass and reacting the mixture at 20° C. for 6 hours.
  • the average particle diameter of the spherical silica was obtained by calculating the number average of the equivalent circle diameters in the projected images of the spherical portions of 50 spherical silica particles measured by a transmission electron microscope (TEM).
  • TEM transmission electron microscope
  • Dye 1 compound having the following structure (weight average molecular weight 9000)
  • M-1 KAYARAD DPHA (manufactured by Nippon Kayaku Co., Ltd.)
  • M-2 Aronix TO-2349 (manufactured by Toagosei Co., Ltd.)
  • M-3 NK ester A-DPH-12E (manufactured by Shin-Nakamura Chemical Co., Ltd.)
  • B-1 Resin having the following structure (numerical values attached to the main chain are molar ratios; weight average molecular weight: 11,000)
  • B-2 Resin having the following structure (numerical values attached to the main chain are molar ratios. Weight average molecular weight: 19000. Solid content: 40%)
  • the kinematic viscosity was measured using an Ubbelohde viscometer. Further, the surface tension was measured using a solution having a solid concentration of 1000 mass ppm prepared by dissolving each surfactant in PGMEA as a measurement sample. The temperature of this measurement sample was adjusted to 25° C., and a surface tension meter CBVP-Z (manufactured by Kyowa Interface Science Co., Ltd.) was used as a measuring device, and the plate method using a platinum plate was used for measurement.
  • a surface tension meter CBVP-Z manufactured by Kyowa Interface Science Co., Ltd.
  • a composition for forming a base layer (CT-4000L, manufactured by FUJIFILM Electronic Materials Co., Ltd.) is applied so that the dry film thickness is 0.1 ⁇ m, After drying, heat treatment was performed at 220° C. for 5 minutes to form an underlayer.
  • each composition is applied using a spin coater so that the film thickness after prebaking is 0.6 ⁇ m, and heat-treated for 120 seconds using a hot plate at 100 ° C. (pre-baking) was performed.
  • an i-line stepper exposure apparatus (FPA-3000i5+, manufactured by Canon Inc.) was used to expose the entire surface of the glass wafer to light with a wavelength of 365 nm at an exposure dose of 500 mJ/cm 2 .
  • the glass wafer having the exposed film was subjected to heat treatment (post-baking) using a hot plate at 200° C. for 300 seconds to form a film.
  • the transmittance in the wavelength range of 400 to 1100 nm was measured using a spectrophotometer (U-4150, manufactured by Hitachi, Ltd.) for the glass wafer on which the film was formed.
  • the color mixture evaluation composition was applied using a spin coater so that the film thickness after prebaking was 0.6 ⁇ m, and heat treatment (prebaking) was performed using a hot plate at 100° C. for 120 seconds.
  • the composition of Comparative Example 3-1 was used as the composition for color mixture evaluation.
  • the composition of Comparative Example 1-1 was used as a composition for color mixing evaluation.
  • the glass wafer was placed on a horizontal rotating table of a spin/shower developing machine (DW-30 type, manufactured by Chemitronics Co., Ltd.), and an alkaline developer (CD-2060, manufactured by Fuji Film Electronic Materials Co., Ltd.) was used. ) at 23° C. for 60 seconds.
  • a spin/shower developing machine DW-30 type, manufactured by Chemitronics Co., Ltd.
  • an alkaline developer CD-2060, manufactured by Fuji Film Electronic Materials Co., Ltd.
  • the transmittance of the film before and after the color mixing test The maximum value of the difference was evaluated, and color mixture was evaluated according to the following criteria.
  • Transmittance difference
  • the example was able to suppress the occurrence of color mixture more than the comparative example.

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Abstract

L'invention concerne une composition, et également un film, un filtre optique, un capteur optique, un dispositif d'affichage d'images et une structure mettant en œuvre cette composition. La composition de l'invention contient un composé durcissable, un tensio-actif à base de silicone (A) et un solvant. Ledit tensio-actif à base de silicone (A) présente une tension superficielle dans une solution à 25°C, supérieure ou égale à ２６ｍＮ／ｍ, lorsqu'une solution de １０００ｐｐｍ en masse de concentration en contenu solide, est préparée par dissolution dudit tensio-actif à base de silicone (A) dans un acétate d'éther monométhylique de propylène glycol.
PCT/JP2022/030851 2021-08-19 2022-08-15 Composition, film, filtre optique, capteur optique, dispositif d'affichage d'images, et structure WO2023022120A1 (fr)

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Citations (5)

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Publication number Priority date Publication date Assignee Title
JP2010126609A (ja) * 2008-11-26 2010-06-10 Fujifilm Corp 感光性組成物および加工基板の製造方法
JP2016071359A (ja) * 2014-09-30 2016-05-09 新日鉄住金化学株式会社 タッチパネル用感光性樹脂組成物およびその硬化膜、ならびに当該硬化膜を有するタッチパネル
JP2017222146A (ja) * 2016-06-17 2017-12-21 花王株式会社 インクジェット記録方法
JP2018120131A (ja) * 2017-01-26 2018-08-02 旭化成株式会社 フレキソ印刷版
WO2020203430A1 (fr) * 2019-03-29 2020-10-08 富士フイルム株式会社 Composition, film et procédé de production de film

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JP6911365B2 (ja) 2017-02-13 2021-07-28 三菱ケミカル株式会社 着色樹脂組成物、カラーフィルタ、及び画像表示装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010126609A (ja) * 2008-11-26 2010-06-10 Fujifilm Corp 感光性組成物および加工基板の製造方法
JP2016071359A (ja) * 2014-09-30 2016-05-09 新日鉄住金化学株式会社 タッチパネル用感光性樹脂組成物およびその硬化膜、ならびに当該硬化膜を有するタッチパネル
JP2017222146A (ja) * 2016-06-17 2017-12-21 花王株式会社 インクジェット記録方法
JP2018120131A (ja) * 2017-01-26 2018-08-02 旭化成株式会社 フレキソ印刷版
WO2020203430A1 (fr) * 2019-03-29 2020-10-08 富士フイルム株式会社 Composition, film et procédé de production de film

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