WO2023018231A1 - 폴더블 전자 장치 - Google Patents
폴더블 전자 장치 Download PDFInfo
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- WO2023018231A1 WO2023018231A1 PCT/KR2022/011950 KR2022011950W WO2023018231A1 WO 2023018231 A1 WO2023018231 A1 WO 2023018231A1 KR 2022011950 W KR2022011950 W KR 2022011950W WO 2023018231 A1 WO2023018231 A1 WO 2023018231A1
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- magnetic body
- electronic device
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Definitions
- One or more embodiments of the present disclosure relate generally to a foldable electronic device.
- the foldable electronic device may include a first housing, a second housing foldable with respect to the first housing, a hinge structure connecting the first housing and the second housing, and a flexible display disposed across the first housing and the second housing.
- the foldable electronic device When the foldable electronic device is in a folded state, a portion of the flexible display disposed on the first housing and a portion of the flexible display disposed on the second housing may come into contact with each other. Corresponding parts of the first housing and the second housing may abut against each other.
- the foldable electronic device may fix the folded state of the foldable electronic device by further including a magnetic material at each of the portions where the first housing and the second housing come into contact with each other.
- a structure is adopted to fix the magnetic material through a cap composed of a separate injection-molded material. You may.
- a structure in which a magnetic material is installed by being seated and bonded to the rear surface of the electronic device, it may be difficult to provide sufficient magnetic force to fix the folded state of the electronic device due to a large distance between the magnetic materials. If a large-sized magnetic material is disposed to secure a strong magnetic force, a lack of mounting space for other electronic parts included in the electronic device may be caused.
- a hinge structure in a foldable electronic device, a hinge structure, a first housing connected to the hinge structure, connected to the hinge structure, and foldable with respect to the first housing around the hinge structure
- a first plate including a second housing configured to, a flexible display disposed on one surface of the first housing and one surface of the second housing, and a first surface facing a first direction, disposed inside the first housing , a second plate including a second surface facing a second direction parallel to the first direction in an unfolded state of the foldable electronic device and disposed inside the second housing, the first surface of the first plate a first magnetic body disposed at a position adjacent to one edge of the first housing and including a magnetic body arranged along the length direction of the first housing and one edge of the second housing on the second surface of the second plate. It is possible to provide a foldable electronic device including a second magnetic body disposed adjacent to and corresponding to the first magnetic body and including a magnetic body arranged along the length direction of the second housing.
- FIG. 1 is a block diagram of an electronic device in a network environment according to an embodiment of the present disclosure.
- FIG. 2 is a diagram illustrating an unfolded state of an electronic device according to an embodiment of the present disclosure.
- FIG 3 is a diagram illustrating a folded state of an electronic device according to an embodiment of the present disclosure.
- FIG. 4 is an exploded perspective view of an electronic device according to an embodiment of the present disclosure.
- FIG. 5 is an exploded perspective view of an electronic device including a first magnetic body and a second magnetic body according to an embodiment of the present disclosure.
- FIG. 6 is a diagram illustrating a first magnetic body according to an embodiment of the present disclosure.
- FIG. 7 is a diagram illustrating a second magnetic body according to an embodiment of the present disclosure.
- FIG. 8 is a perspective view illustrating a magnetic body part according to an embodiment of the present disclosure.
- FIG. 9 is a cross-sectional view of the magnetic body portion shown in FIG. 8 .
- FIG. 10 is a diagram illustrating a magnetic material array having a Halbach arrangement according to an embodiment of the present disclosure.
- FIG. 11 is a diagram illustrating plates, according to an embodiment of the present disclosure.
- FIG. 12 is a cross-sectional view of an electronic device according to an embodiment of the present disclosure.
- FIG. 13 is a diagram illustrating a cross-section of an electronic device in a folded state, according to an embodiment of the present disclosure.
- a magnetic material and a magnetic material fixing structure that employs a structure in which a magnetic material is seated and bonded to the front surface of an electronic device, but does not apply force to a flexible display.
- a magnetic fixing structure capable of stably maintaining a folded state of a foldable electronic device may be provided.
- FIG. 1 is a block diagram of an electronic device 101 in a network environment 100 according to an embodiment.
- an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or through a second network 199. It is possible to communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to one embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 .
- the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or the antenna module 197 may be included.
- at least one of these components eg, the connection terminal 178) may be omitted or one or more other components may be added.
- some of these components eg, sensor module 176, camera module 180, or antenna module 197) are integrated into a single component (eg, display module 160). It can be.
- the processor 120 for example, executes software (eg, the program 140) to cause at least one other component (eg, hardware or software component) of the electronic device 101 connected to the processor 120. It can control and perform various data processing or calculations. According to one embodiment, as at least part of data processing or operation, the processor 120 transfers instructions or data received from other components (e.g., sensor module 176 or communication module 190) to volatile memory 132. , processing commands or data stored in the volatile memory 132 , and storing resultant data in the non-volatile memory 134 .
- software eg, the program 140
- the processor 120 transfers instructions or data received from other components (e.g., sensor module 176 or communication module 190) to volatile memory 132. , processing commands or data stored in the volatile memory 132 , and storing resultant data in the non-volatile memory 134 .
- the processor 120 may include a main processor 121 (eg, a central processing unit or an application processor) or a secondary processor 123 (eg, a graphic processing unit, a neural network processing unit ( NPU: neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor).
- a main processor 121 eg, a central processing unit or an application processor
- a secondary processor 123 eg, a graphic processing unit, a neural network processing unit ( NPU: neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor.
- NPU neural network processing unit
- the secondary processor 123 may be implemented separately from or as part of the main processor 121 .
- the secondary processor 123 may, for example, take the place of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or the main processor 121 is active (eg, running an application). ) state, together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states.
- the auxiliary processor 123 eg, image signal processor or communication processor
- the auxiliary processor 123 may include a hardware structure specialized for processing an artificial intelligence model.
- AI models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself where artificial intelligence is performed, or may be performed through a separate server (eg, the server 108).
- the learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning or reinforcement learning, but in the above example Not limited.
- the artificial intelligence model may include a plurality of artificial neural network layers.
- Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the foregoing, but is not limited to the foregoing examples.
- the artificial intelligence model may include, in addition or alternatively, software structures in addition to hardware structures.
- the memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101 .
- the data may include, for example, input data or output data for software (eg, program 140) and commands related thereto.
- the memory 130 may include volatile memory 132 or non-volatile memory 134 .
- the program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142 , middleware 144 , or an application 146 .
- the input module 150 may receive a command or data to be used by a component (eg, the processor 120) of the electronic device 101 from the outside of the electronic device 101 (eg, a user).
- the input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).
- the sound output module 155 may output sound signals to the outside of the electronic device 101 .
- the sound output module 155 may include, for example, a speaker or a receiver.
- the speaker can be used for general purposes such as multimedia playback or recording playback.
- a receiver may be used to receive an incoming call. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.
- the display module 160 may visually provide information to the outside of the electronic device 101 (eg, a user).
- the display module 160 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the device.
- the display module 160 may include a touch sensor set to detect a touch or a pressure sensor set to measure the intensity of force generated by the touch.
- the audio module 170 may convert sound into an electrical signal or vice versa. According to one embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device connected directly or wirelessly to the electronic device 101 (eg: Sound may be output through the electronic device 102 (eg, a speaker or a headphone).
- the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device connected directly or wirelessly to the electronic device 101 (eg: Sound may be output through the electronic device 102 (eg, a speaker or a headphone).
- the sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the detected state. can do.
- the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a bio sensor, It may include a temperature sensor, humidity sensor, or light sensor.
- the interface 177 may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device 101 to an external electronic device (eg, the electronic device 102).
- the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
- HDMI high definition multimedia interface
- USB universal serial bus
- SD card interface Secure Digital Card interface
- audio interface audio interface
- connection terminal 178 may include a connector through which the electronic device 101 may be physically connected to an external electronic device (eg, the electronic device 102).
- the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).
- the haptic module 179 may convert electrical signals into mechanical stimuli (eg, vibration or motion) or electrical stimuli that a user may perceive through tactile or kinesthetic senses.
- the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
- the camera module 180 may capture still images and moving images. According to one embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
- the power management module 188 may manage power supplied to the electronic device 101 .
- the power management module 188 may be implemented as at least part of a power management integrated circuit (PMIC), for example.
- PMIC power management integrated circuit
- the battery 189 may supply power to at least one component of the electronic device 101 .
- the battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.
- the communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). Establishment and communication through the established communication channel may be supported.
- the communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication.
- the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : a local area network (LAN) communication module or a power line communication module).
- a wireless communication module 192 eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module
- GNSS global navigation satellite system
- wired communication module 194 eg, : a local area network (LAN) communication module or a power line communication module.
- a corresponding communication module is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (eg, legacy It may communicate with the external electronic device 104 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a telecommunications network such as a computer network (eg, a LAN or a WAN).
- a telecommunications network such as a computer network (eg, a LAN or a WAN).
- These various types of communication modules may be integrated as one component (eg, a single chip) or implemented as a plurality of separate components (eg, multiple chips).
- the wireless communication module 192 uses subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199.
- subscriber information eg, International Mobile Subscriber Identifier (IMSI)
- IMSI International Mobile Subscriber Identifier
- the electronic device 101 may be identified or authenticated.
- the wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, NR access technology (new radio access technology).
- NR access technologies include high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and access of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low latency (URLLC)).
- eMBB enhanced mobile broadband
- mMTC massive machine type communications
- URLLC ultra-reliable and low latency
- -latency communications can be supported.
- the wireless communication module 192 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example.
- the wireless communication module 192 uses various technologies for securing performance in a high frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. Technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna may be supported.
- the wireless communication module 192 may support various requirements defined for the electronic device 101, an external electronic device (eg, the electronic device 104), or a network system (eg, the second network 199).
- the wireless communication module 192 is a peak data rate for eMBB realization (eg, 20 Gbps or more), a loss coverage for mMTC realization (eg, 164 dB or less), or a U-plane latency for URLLC realization (eg, Example: downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip 1 ms or less) may be supported.
- eMBB peak data rate for eMBB realization
- a loss coverage for mMTC realization eg, 164 dB or less
- U-plane latency for URLLC realization eg, Example: downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip 1 ms or less
- the antenna module 197 may transmit or receive signals or power to the outside (eg, an external electronic device).
- the antenna module 197 may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (eg, PCB).
- the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is selected from the plurality of antennas by the communication module 190, for example. can be chosen A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna.
- other components eg, a radio frequency integrated circuit (RFIC) may be additionally formed as a part of the antenna module 197 in addition to the radiator.
- RFIC radio frequency integrated circuit
- the antenna module 197 may form a mmWave antenna module.
- the mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first surface (eg, a lower surface) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band); and a plurality of antennas (eg, array antennas) disposed on or adjacent to a second surface (eg, a top surface or a side surface) of the printed circuit board and capable of transmitting or receiving signals of the designated high frequency band. can do.
- peripheral devices eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)
- signal e.g. commands or data
- commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 .
- Each of the external electronic devices 102 or 104 may be the same as or different from the electronic device 101 .
- all or part of operations executed in the electronic device 101 may be executed in one or more external electronic devices among the external electronic devices 102 , 104 , or 108 .
- the electronic device 101 when the electronic device 101 needs to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 101 instead of executing the function or service by itself.
- one or more external electronic devices may be requested to perform the function or at least part of the service.
- One or more external electronic devices receiving the request may execute at least a part of the requested function or service or an additional function or service related to the request, and deliver the execution result to the electronic device 101 .
- the electronic device 101 may provide the result as at least part of a response to the request as it is or additionally processed.
- cloud computing distributed computing, mobile edge computing (MEC), or client-server computing technology may be used.
- the electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing.
- the external electronic device 104 may include an internet of things (IoT) device.
- Server 108 may be an intelligent server using machine learning and/or neural networks. According to one embodiment, the external electronic device 104 or server 108 may be included in the second network 199 .
- the electronic device 101 may be applied to intelligent services (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.
- the electronic device 200 as an example of the electronic device 101 shown in FIG. 1, may be a foldable or bendable electronic device.
- the electronic device 200 includes a foldable housing 201 and a flexible or foldable device disposed in a space formed by the foldable housing 201.
- a (foldable) display 250 (hereinafter referred to as “display” 250 for short) (eg, display device 160 of FIG. 1 ) may be included.
- the surface on which the display 250 is disposed (or the surface on which the display 250 is viewed from the outside of the electronic device 200) may be referred to as the front of the electronic device 200.
- a surface opposite to the front surface may be defined as a rear surface of the electronic device 200 .
- a surface surrounding a space between the front and rear surfaces may be defined as a side surface of the electronic device 200 .
- the foldable housing 201 includes a first housing 210, a second housing 220 including a sensor area, a first rear cover 215, a second rear cover 225 and A hinge structure 230 may be included.
- the hinge structure 230 may include a hinge cover covering a foldable portion of the foldable housing 201 .
- the foldable housing 201 of the electronic device 200 is not limited to the shape and combination shown in FIGS. 2 and 3 , and may be implemented by other shapes or combinations and/or combinations of parts.
- the first housing 210 and the first rear cover 215 may be integrated together, and the second housing 220 and the second rear cover 225 may be integrated together. .
- the first housing 210 is connected to the hinge structure 230 and may include a first front surface facing in a first direction and a first rear surface facing in a direction opposite to the first direction.
- the second housing 220 is connected to the hinge structure 230 and may include a second front surface facing in a second direction and a second rear surface facing in a direction opposite to the second direction.
- the second housing 220 may rotate relative to the first housing 210 about the hinge structure 230 .
- the electronic device 200 may change to a folded state or an unfolded state.
- the first housing 210 has a first side surface (spaced apart from each other in parallel with the folding axis A of the hinge structure 230) between the first front surface and the first rear surface ( 211a), and the second housing 220 is disposed between the second front surface and the second rear surface in parallel with the folding axis A of the hinge structure 230 and spaced apart from the second side surface ( 221a) may be included.
- first housing 210 is perpendicular to the first side surface 211a, one end is connected to the first side surface 211a, the other end is connected to the hinge structure 230, the third side surface 211b, the first A fourth side surface 211c perpendicular to the first side surface 211a, one end connected to the first side surface 211a and the other end connected to the hinge structure 230 and spaced apart in a direction parallel to the third side surface 211b.
- the second housing 220 has a fifth side surface 221b perpendicular to the second side surface 221a, one end connected to the second side surface 221a and the other end connected to the hinge structure 230, and the second side surface 221b.
- the sixth side surface (221c) spaced apart in a direction parallel to the fifth side surface (221b) can include
- the first front surface and the second front surface of the electronic device 200 may face each other in a fully folded state, and in a fully unfolded state, the second direction is It may be the same as the first direction. In a fully unfolded state, the distance between the first side surface 211a and the second side surface 221a may be the farthest.
- the first housing 210 and the second housing 220 are disposed on both sides of the folding axis A, and may have a generally symmetrical shape with respect to the folding axis A. As will be described later, the first housing 210 and the second housing 220 determine whether the electronic device 200 is in an unfolded state, in a folded state, or partially unfolded (or partially folded). ) Depending on whether they are in an intermediate status, the angle or distance they form may vary.
- the first housing 210 and the second housing 220 may together form a recess accommodating the display 250 .
- at least a portion of the first housing 210 and the second housing 220 may be formed of a metal material or a non-metal material having a rigidity of a size selected to support the display 250 .
- At least one metal part of the housing may provide a ground plane for the electronic device 200, and may be electrically connected to a ground line formed on a printed circuit board disposed inside the foldable housing 201. can be connected to
- the first rear cover 215 is disposed on one side of the folding axis A on the rear surface of the electronic device 200, and may have, for example, a substantially rectangular shape, 1 The edge may be wrapped by the housing 210.
- the second rear cover 225 may be disposed on the other side of the folding axis A on the rear side of the electronic device 200, and its edge may be wrapped by the second housing 220.
- the first rear cover 215 and the second rear cover 225 may have substantially symmetrical shapes around the folding axis (A). However, the first rear cover 215 and the second rear cover 225 do not necessarily have symmetrical shapes, and in another embodiment, the electronic device 200 includes various shapes of the first rear cover 215 and A second rear cover 225 may be included. In another embodiment, the first rear cover 215 may be integrated with the first housing 210 and the second rear cover 225 may be integrated with the second housing 220 .
- the first rear cover 215, the second rear cover 225, the first housing 210, and the second housing 220 are various parts (eg, printing) of the electronic device 200.
- a space in which a circuit board or a battery) may be disposed may be formed.
- one or more components may be disposed or visually exposed on the rear surface of the electronic device 200 .
- at least a portion of the sub display may be visually exposed through the first rear area 216 of the first rear cover 215 .
- one or more parts or sensors may be visually exposed through the second rear area 226 of the second rear cover 225 .
- the sensor may include a proximity sensor and/or a rear camera.
- a front camera exposed on the front surface (eg, the second front surface) of the electronic device 200 or a rear camera exposed through the second rear area 226 of the second rear cover 225 is one or more. It may include a plurality of lenses, an image sensor, and/or an image signal processor. A corresponding flash may be implemented by, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device 200 .
- a hinge cover (eg, 232 in FIG. 4 ) may be disposed between the first housing 210 and the second housing 220 to cover an internal part (eg, the hinge structure 230).
- the hinge structure 230 may be covered by parts of the first housing 210 and the second housing 220 or exposed to the outside, depending on the state of the electronic device 200. (unfolded status, intermediate status or folded status).
- the hinge structure 230 when the electronic device 200 is in an unfolded state (eg, a fully unfolded state), the hinge structure 230 is a first housing 210 ) and the second housing 220 may not be exposed.
- the hinge structure 230 when the electronic device 200 is in a folded state (eg, fully folded state), the hinge structure 230 includes the first housing 210 and It may be exposed to the outside between the second housings 220 .
- the hinge structure 230 may be partially exposed to the outside between the first housing 210 and the second housing 220 .
- the exposed area may be smaller than the completely folded state.
- the hinge structure 230 may include a curved surface.
- the display 250 may be disposed on a space formed by the foldable housing 201 .
- the display 250 is seated on a recess formed by the foldable housing 201 and covers the front surface (eg, the first front surface and/or the second front surface) of the electronic device 200.
- the display 250 may constitute most of the front surface (eg, the first front surface and/or the second front surface) of the electronic device 200 .
- the front surface (eg, the first front surface and/or the second front surface) of the electronic device 200 includes the display 250 and a portion of the first housing 210 adjacent to the display 250 and the second housing 220.
- the rear surface (eg, the first rear surface and/or the second rear surface) of the electronic device 200 includes the first rear cover 215, a partial area of the first housing 210 adjacent to the first rear cover 215, It may include the second rear cover 225 and a partial area of the second housing 220 adjacent to the second rear cover 225 .
- the display 250 may refer to a flexible display in which at least a partial area may be bent from a flat or curved surface.
- the display 250 has a folding area 253 and a first area 251 disposed on one side (eg, the left side of the folding area 253 shown in FIG. 2) based on the folding area 253. ) and a second region 252 disposed on the other side (eg, the right side of the folding region 253 shown in FIG. 2).
- the division of regions of the display 250 shown in FIG. 2 is exemplary, and the display 250 may be divided into a plurality of regions (eg, four or more or two regions) according to a structure or function.
- the area of the display 200 may be divided by the folding area 253 extending in parallel to the folding axis A, but in another embodiment, the display 200 Areas may be divided based on another folding axis (eg, a folding axis parallel to the width direction of the electronic device).
- the display 250 may be combined with or disposed adjacent to a touch panel equipped with a touch sensing circuit and a pressure sensor capable of measuring the intensity (pressure) of a touch.
- a touch panel equipped with a touch sensing circuit and a pressure sensor capable of measuring the intensity (pressure) of a touch.
- the display 250 when the display 250 is implemented as a touch panel, it may be combined with or placed adjacent to a touch panel that detects a stylus pen of an electromagnetic resonance (EMR) method.
- EMR electromagnetic resonance
- the first region 251 and the second region 252 may have generally symmetrical shapes around the folding region 253 .
- the first housing 210 and the second housing 220 according to the state of the electronic device 200 (eg, a folded state, an unfolded state, or an intermediate state) The operation and each area of the display 250 will be described.
- the first housing 210 and the second housing 220 form an angle of 180 degrees and face the same direction. can be arranged to do so.
- the surface of the first area 251 and the surface of the second area 252 of the display 250 form 180 degrees to each other and may face the same direction (eg, the front direction of the electronic device).
- the folding region 253 may form the same plane as the first region 251 and the second region 252 .
- the first housing 210 and the second housing 220 may face each other.
- the surface of the first area 251 and the surface of the second area 252 of the display 250 form a narrow angle (eg, between 0 degrees and 10 degrees) and may face each other.
- At least a portion of the folding region 253 may be formed of a curved surface having a predetermined curvature.
- the first housing 210 and the second housing 220 may be disposed at a certain angle to each other.
- the surface of the first region 251 and the surface of the second region 252 of the display 250 may form an angle greater than that of the folded state and smaller than that of the unfolded state.
- At least a portion of the folding region 253 may be formed of a curved surface having a predetermined curvature, and the curvature at this time may be smaller than that in a folded state.
- FIG 4 is an exploded perspective view of the electronic device 200 according to an embodiment of the present disclosure.
- X-axis may represent the width direction of the electronic device
- the Y axis may represent the length direction of the electronic device
- the Z axis may represent the height (or thickness) direction of the electronic device.
- 'first direction and second direction' may refer to a direction parallel to the Z axis.
- the electronic device 200 may include various electronic components disposed inside or outside the first housing 210 and the second housing 220 .
- Various electronic components may include, for example, a processor (eg, the processor 120 of FIG. 1 ), a memory (eg, the memory 130 of FIG. 1 ), an input module (eg, the input module 150 of FIG. 1 ), a sound An output module (eg, sound output module 155 in FIG. 1 ), a display 250 (eg, display module 160 in FIG. 1 ), an audio module (eg, audio module 170 in FIG. 1 ), a sensor ( Example: sensor module 176 in FIG. 1), interface (eg interface 177 in FIG. 1), connection terminal (eg connection terminal 178 in FIG.
- haptic module eg haptic in FIG. 1 module 179
- camera module eg, camera module 180 of FIG. 1
- power management module 188 batteries 261 and 262 (eg, battery 189 of FIG. 1)
- communication module Example: It may include a communication module 190 of FIG. 1), a subscriber identification module (eg, subscriber identification module 196 of FIG. 1), or an antenna module (eg, antenna module 197 of FIG. 1).
- These electronic components may be appropriately divided and disposed in the inner or outer spaces of the first housing 210 and the second housing 220 . In the electronic device 200, at least one of these components (eg, the connection terminal 178) may be omitted or one or more other components may be added. Also, some of these components or a plurality of components may be integrated into one component.
- the foldable electronic device 200 may include a plurality of batteries to supply and store power required for driving to electronic components.
- the first housing 210 and the second housing 220 may include a first battery 261 and a second battery 262 respectively disposed.
- the foldable electronic device 200 may include a plate 240 for disposing components on each of the first housing 210 and the second housing 220 .
- Various electronic components and/or printed circuit boards 271 and 272 may be disposed on the plate 240 .
- the plate 240 may include a plurality of plates 241 and 242 .
- the first plate 241 and the first printed circuit board 271 are disposed in the first housing 210, and the second plate 242 and the second printed circuit board ( 272) may be placed.
- the first plate 241 may include a first surface 241a facing a first direction
- the second plate 242 may include a second surface 242a facing a second direction.
- the first plate 241 and the second plate 242 may be folded or unfolded relative to each other by the hinge structure 230 formed to correspond to the folding area 253 of the flexible display 250 .
- the first plate 241 and the second plate 242 face each other when the device is folded, and when the device is unfolded, the first and second surfaces 241a and 242a face the same direction. It can be.
- the hinge structure 230 may include a hinge plate 231 and/or a hinge cover 232, and the first plate 241 and the second plate ( 242) may be disposed on both sides, respectively.
- Signals of the processor for implementing various functions and operations of the electronic device 200 are transmitted to electronic components through various conductive lines formed on the printed circuit boards 271 and 272 and/or a connector 273. can be conveyed
- FIG. 5 is an exploded perspective view of an electronic device including a first magnetic body and a second magnetic body according to an embodiment of the present disclosure.
- 6 is a diagram illustrating a first magnetic body according to an embodiment of the present disclosure.
- 7 is a diagram illustrating a second magnetic body according to an embodiment of the present disclosure.
- a fixing structure using a magnetic material may be provided to stably maintain the folded state.
- the foldable electronic device 200 including a fixing structure using a magnetic material is disposed adjacent to one edge of the first housing 210 and is disposed in the longitudinal direction of the first housing 210 (eg : A first magnetic body 310 including magnetic bodies arranged along the Y-axis direction of FIG. 4), a position adjacent to one edge of the second housing 220 and a position corresponding to the first magnetic body 310, A second magnetic body 320 including magnetic bodies arranged along the longitudinal direction of the second housing 220 (eg, the Y-axis direction of FIG. 4 ) may be included.
- the first magnetic body 310 and the second magnetic body 320 may be disposed on the front surface of the plate 240 .
- the first magnetic material 310 may be disposed on the first surface 241a of the first plate 241 and the second magnetic material 320 may be disposed on the second surface 242a of the second plate 242.
- the first magnetic material 310 has a first side surface (eg, FIG. 2 and may be disposed adjacent to the first side surface 211a) and parallel to the hinge structure.
- the first magnetic material 310 is disposed in a space between a first battery (eg, the first battery 261 of FIG. 4 ) and the first side surface (eg, the first side surface 211a of FIG. 2 ).
- the second magnetic body 320 has a second side surface (eg, the second side surface of FIG. 2 ) spaced apart in parallel with the hinge structure (eg, the hinge structure 230 of FIG. 3 ) in the second housing 220 . (221a)) and may be parallel to the hinge structure.
- the second magnetic material 320 is disposed in a space between the second battery (eg, the second battery 262 of FIG. 4 ) and the second side surface (eg, the second side surface 221a of FIG. 2 ). It can be.
- the first magnetic body 310 and the second magnetic body 320 may be disposed in a direction parallel to the longitudinal directions of the first housing 210 and the second housing 220 .
- a plurality of first magnetic bodies 310 and second magnetic bodies 320 may be provided.
- the first magnetic body 310 may include a 1-1 magnetic body portion 310a and a 1-2 magnetic body portion 310b
- the second magnetic body 320 may include a 2-1 magnetic body portion ( 320a) and the 2-2 magnetic body part 320b.
- the 1-1 magnetic body portion 310a and the 1-2 magnetic body portion 310b, and the 2-1 magnetic body portion 320a and the 2-2 magnetic body portion 320b have substantially the same shape, respectively.
- first magnetic body 310 and the second magnetic body 320 may each consist of three or more magnetic bodies, unlike shown in FIG. 5 .
- the plurality of magnetic bodies are virtual parallel to the longitudinal direction of the electronic device 200 (eg, the Y-axis direction in FIG. 4 ). It can be arranged along a straight line.
- the first magnetic material 310 may be accommodated in the first recess 241b formed in the first plate 241 . Accordingly, a first recess 241b having a size and shape corresponding to the first magnetic body 310 may be formed in the first plate 241 to accommodate the first magnetic body 310 . According to an embodiment, a groove 241c for assembling the first magnetic body 310 may be additionally formed inside the first recess 241b.
- the first magnetic material 310 includes a magnetic material array 311, a magnetic material housing 312 surrounding at least one surface of the magnetic material array 311, and a first protrusion 313 protruding from one side of the magnetic material housing 312 and having a fastening hole formed therein.
- the magnetic array 311 is formed by connecting a plurality of permanent magnetic bodies in one direction (eg, the longitudinal direction of the electronic device 200 (eg, the Y-axis direction in FIG. 4)), and the plurality of permanent magnetic bodies are adjacent to each other. It can be arranged to form a magnetic field in a different direction than the field.
- the number of magnetic bodies arranged here may not be limited.
- the magnetic housing 312 may be integrally molded with the magnetic array 311 .
- the magnetic housing 312 may be made of non-metal such as synthetic resin having high rigidity.
- the magnetic housing 312 may be formed of fiber reinforced plastics (FRP).
- the magnetic housing 312 may be formed by curing a resin injected around the magnetic array 311 in a state where the magnetic array 311 is seated in a certain mold.
- a housing (the first housing 210 and/or the second housing 220) of the electronic device may be formed of a metal material and used as a radiator of an antenna.
- the magnetic force of the first magnetic body 310 affects the housing of the electronic device as an antenna radiator, thereby degrading the antenna performance. can make it As a method for preventing antenna performance from deteriorating in this way, the magnetic housing 312 may be made of synthetic resin instead of metal.
- the first protrusion 313 protrudes in one direction from the magnetic housing 312 and may have a hole into which a fastening member 314 (eg, a screw) can be fastened.
- a fastening member 314 eg, a screw
- the first magnetic body 310 can be fixed to the first plate 241, and through this, the first magnetic body 310 can be connected to the second magnetic body. It may be prevented from being lifted from the first recess 241b by a gravitational force acting when disposed adjacent to the 320 .
- the second magnetic body 320 may be accommodated in the second recess 242b formed in the second plate 242 . Accordingly, a second recess 242b having a size and shape corresponding to the second magnetic body 320 may be formed in the second plate 242 to accommodate the second magnetic body 320 . According to an embodiment, a groove 242c for assembling the second magnetic body 320 may be additionally formed inside the second recess 242b.
- the second magnetic material 320 includes a magnetic material array 321, a magnetic material housing 322 surrounding at least one surface of the magnetic material array 321, and a first protrusion 323 protruding from one side of the magnetic material housing 322 and having a fastening hole formed therein.
- the magnetic body array 321 included in the second magnetic body 320, the magnetic body housing 322, and the first protrusion 323 include the magnetic body array 311 included in the first magnetic body, the magnetic body housing 312, and the first protrusion ( 313), the description thereof will be omitted.
- the magnetic material array 321 included in the second magnetic material 320 may correspond to the magnetic material array 311 included in the first magnetic material 310 .
- that the magnetic array 321 corresponds to the other magnetic array 311 may mean that the number of connected permanent magnetic bodies is the same and the entire length of the magnetic array is formed the same.
- FIG. 8 is a perspective view illustrating a magnetic body part according to an embodiment of the present disclosure.
- FIG. 9 is a diagram showing a cross section (BB' direction cross section) of the magnetic body portion shown in FIG. 8 .
- 10 is a diagram illustrating a magnetic material array having a Halbach arrangement according to an embodiment of the present disclosure.
- FIGS. 8 to 10 A fixing structure including a magnetic material included in an electronic device according to an exemplary embodiment will be described in more detail with reference to FIGS. 8 to 10 together with the drawings described above.
- the first magnetic body 310 will be described as an example. A description of this may be applied mutatis mutandis to the second magnetic body 320 .
- FIG. 8 may show a view of the first magnetic body 310 shown in FIG. 6 viewed from the opposite side.
- the first magnetic material 310 includes a magnetic material array 311 and a magnetic material housing 312 surrounding at least one surface of the magnetic material array 311 and one direction from the magnetic material housing 312 (e.g., electron It may include a first protrusion 313 protruding in the longitudinal direction of the device (the Y-axis direction in FIG. 4 ).
- the magnetic array 311 has an upper surface 311-1 facing the first direction and a lower surface 311-2 facing the opposite direction to the first direction, and a side surface between the upper surface 311-1 and the lower surface 311-2. (311-3).
- the magnetic housing 312 may be formed to surround at least one surface of the magnetic array 311, for example, the upper surface 311-1, the lower surface 311-2, and the side surface 311-3.
- the magnetic housing 312 is the thickness d1 of the portion of the magnetic housing 312 covering the upper surface 311-1 of the magnetic array 311 is the lower surface 311-2 of the magnetic array 311. ) may be thinner than the thickness d2 of the portion of the magnetic housing 312 covering the .
- the magnetic housing 312 surrounds at least one surface of the magnetic array 311 to provide a stable fixing structure, while reducing the effect of magnetic force generated from the magnetic array 311 on other components of the electronic device. .
- the first magnetic body 310 includes not only the first protrusion 313, but also the second protrusion 315 protruding from the magnetic body housing 312 in an opposite direction to the direction in which the first protrusion 313 protrudes. ) may further include.
- the second protrusion 315 corresponds to the groove 241c formed in the first recess (eg, the first recess 241b of FIG. 6 ) of the first plate (eg, the first plate 241 of FIG. 6 ).
- the first magnetic body 310 is fastened to the first plate 241 in a tightening manner by using the first protrusion 313 and the fastening member 314 (eg, a screw) on one side,
- a stable fixing structure may be implemented by fastening the second protrusion 315 to the first plate 241 in a hook (and/or fitting) method on the other side. Therefore, even if the first magnetic body 310 is disposed on the first surface of the first plate 241 (eg, the first surface 241a in FIG. 6 ), the attractive action between the first magnetic body 310 and the second magnetic body 320 As a result, a phenomenon in which the first magnetic material 310 is lifted can be prevented.
- the magnetic body array 311 may be formed such that a series of permanent magnetic bodies form a Halbach array in which a weak magnetic field is generated in one direction and a strong magnetic field is generated in the other direction.
- the magnetic body array 311 of the first magnetic body 310 (hereinafter referred to as 'the first magnetic body array 311') forms a Halbach array
- the second magnetic body 320 (hereinafter, referred to as 'second magnetic array 321') may also form a Halbach array.
- 'second magnetic array 321' may also form a Halbach array.
- the first magnetic material array 311 is parallel to the plurality of first poles 311a forming a magnetic field in a direction perpendicular to the longitudinal direction of the first magnetic material array 311 and the longitudinal direction. It includes a plurality of second poles 311b forming a magnetic field in one direction, wherein the plurality of first poles 311a and the plurality of second poles 311b alternate with each other, and also the first It may be arranged to generate a strong magnetic field toward the upper surface of the magnetic array 311 (eg, 311-1 in FIG. 9).
- the second magnetic array 321 includes a plurality of third poles 321a forming a magnetic field in a direction perpendicular to the longitudinal direction of the second magnetic array 321 and a plurality of third poles 321a forming a magnetic field in a direction parallel to the longitudinal direction.
- Including four poles 321b, the plurality of third poles 321a and the plurality of fourth poles 321b are alternately strong toward the upper surface of the second magnetic array 321. It can be arranged to generate a magnetic field. As shown in FIG.
- the first pole 311a of the first magnetic material array 311 and the second magnetic material array ( 321) face the same direction
- the second pole 311b of the first magnetic material array 311 and the fourth pole 321b of the second magnetic material array 321 face different directions.
- an attractive force may act between the magnetic arrays 311 and 321 .
- the magnetic arrays 311 and 321 are formed in a Halbach arrangement, maximum magnetic force can be implemented while minimizing the space (or area) occupied by the magnetic arrays 311 and 321 in the internal space of the electronic device 200.
- one direction (th The intensity of magnetic force in the first direction and the second direction) may be increased, but the intensity of magnetic force in other directions may be reduced.
- the advantage of not having to attach separate shielding sheets to the first magnetic body 310 and the second magnetic body 320 to protect the electronic components disposed on the rear surfaces of the first magnetic body 310 and the second magnetic body 320. can have For example, when separate shielding sheets are attached to the first magnetic body 310 and the second magnetic body 320 to protect other electronic components, the magnetic force of the first magnetic body 310 and the second magnetic body 320 may be reduced. However, according to the embodiments of the present disclosure, it is not necessary to attach a separate shielding sheet adjacent to the first magnetic body 310 and the second magnetic body 320, so that reduction in magnetic force due to the separate shielding sheet can be prevented.
- the first magnetic body 310 is formed in a shape elongated in one direction (eg, the Y-axis direction of FIG. 4 ), and on the first magnetic body 310, the first magnetic body 310 and Similarly, a shock absorbing member 316 having an elongated shape may be provided.
- shock absorbing member 316 will be described in detail with reference to the embodiments of FIGS. 11 to 13 .
- 11 is a diagram illustrating plates, according to an embodiment of the present disclosure.
- 12 is a cross-sectional view of an electronic device according to an embodiment of the present disclosure.
- 13 is a diagram illustrating a cross-section of an electronic device in a folded state, according to an embodiment of the present disclosure.
- FIG. 11 a first plate 241 and a second plate 242 on which a shielding sheet 256 is disposed are shown.
- the embodiment of FIG. 12 may represent a cross section cut in the direction C-C' of FIG. 11 in an unfolded state of the electronic device, including the display 250 and the second magnetic material accommodated in the second recess 242b ( A disposition relationship between housings (eg, the second housing 220) including 320 is shown.
- the second recess 242b formed on the rear side of the display 250 and on the second surface of the second plate 242 (eg, the second surface 242a of FIG. 7 ) 2 magnetic bodies 320 may be accommodated.
- the second magnetic body 320 may be disposed adjacent to a side surface of an electronic device housing (eg, the second housing 220).
- the magnetic body housing of the second magnetic body 320 eg, the magnetic body housing 322 of FIG. 7
- the magnetic body housing of the second magnetic body 320 is formed of a synthetic resin material rather than a metal.
- the second housing 220 when at least a portion of the second housing 220 is used as an antenna radiator, the second magnetic body 320 and the second housing 220 are spaced apart by a predetermined distance to secure antenna performance. It can be.
- the second magnetic body 320 used as an antenna radiator and the second housing 220 may be formed to have a separation distance of 1.5 mm or more.
- a plurality of panels including a digitizer panel may be stacked in multiple layers on the display 250.
- Some of the panels are COG (chip on glass) or COP (chip on panel) depending on the arrangement of display drive ICs. ) and/or may be formed in the form of a chip on film (COF).
- COG chip on glass
- COP chip on panel
- FIG. 12 shows a display 250 that includes a COP digitizer panel.
- FIG. 12 shows a COP bending portion 255 and a shielding sheet 256 disposed on the COP bending portion 255 and a plurality of layers, and the shielding sheet 256 blocks the digitizer panel from noise caused by external magnetic force. (noise) can play a role.
- a predetermined gap may be formed between the second magnetic material 320 and the display 250 .
- an attractive force acts on the shielding sheet 256 by the second magnetic material 320, and thus the COP bending part 255 moves toward the gap. can be pulled If the COP bending part 255 is pulled toward the gap, the COP bending part 255 and/or a bending protection layer (BPL) of the COP bending part 255 may be damaged.
- the electronic device may further include a shock absorbing member 326 .
- the shock absorbing member 326 (eg, sponge, poron, and/or other elastic member) is attached to the upper surface of the second magnetic body 320, and the second magnetic body 320 and the display 250 The gap between them can be filled.
- the shock absorbing member 326 may be formed to have a thickness equal to the distance of the gap. For example, when a predetermined gap between the second magnetic material 320 and the display 250 is 0.35 mm, the shock absorbing member 326 may also be formed to have a thickness of 0.35 mm.
- the electronic device 200 includes a shock absorbing member 326 for filling the gap between the second magnetic body 320 and the display 250 as well as the first magnetic body 310 and the display 250. ) may further include a shock absorbing member 316 for filling the gap between them.
- the electronic device 200 includes a first magnetic body 310 and a second magnetic body 320 respectively on the front surfaces of the first plate 241 and the second plate 242 (eg, FIG. 4 ).
- the first plate 241 is disposed on the rear surface of the second plate 242 by disposing it on the first surface 241a and the second surface 242a
- Embodiments disclosed herein also provide shock absorbing members 316 and 326 between the first magnetic body 310 and the display 250 and between the second magnetic body 320 and the display 250, thereby providing a distance between the magnetic bodies. The risk of damage due to approaching can also be prevented.
- the shock absorbing members 316 and 326 and their arrangement can act more effectively, particularly in an electronic device including a magnetic material to which a Halbach array is applied, according to an embodiment of the present disclosure.
- an electronic device may be various types of devices.
- the electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance.
- a portable communication device e.g, a smart phone
- a computer device e.g., a smart phone
- a portable multimedia device e.g., a portable medical device
- a camera e.g., a camera
- a wearable device e.g., a smart bracelet
- first, second, or first or secondary may simply be used to distinguish a given component from other corresponding components, and may be used to refer to a given component in another aspect (eg, importance or order) is not limited.
- a (e.g., first) component is said to be “coupled” or “connected” to another (e.g., second) component, with or without the terms “functionally” or “communicatively.”
- the certain component may be connected to the other component directly (eg by wire), wirelessly, or through a third component.
- module used in one embodiment of this document may include a unit implemented in hardware, software, or firmware, for example, interchangeably with terms such as logic, logic block, component, or circuit.
- a module may be an integrally constructed component or a minimal unit of components or a portion thereof that performs one or more functions.
- the module may be implemented in the form of an application-specific integrated circuit (ASIC).
- ASIC application-specific integrated circuit
- each component (eg, module or program) of the above-described components may include a single object or a plurality of entities, and some of the plurality of entities may be separately disposed in other components.
- one or more components or operations among the aforementioned corresponding components may be omitted, or one or more other components or operations may be added.
- a plurality of components eg modules or programs
- the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by a corresponding component of the plurality of components prior to the integration. .
- the actions performed by a module, program, or other component are executed sequentially, in parallel, iteratively, or heuristically, or one or more of the actions are executed in a different order, omitted, or , or one or more other operations may be added.
- a hinge structure eg, the hinge structure 230 of FIG. 3
- a first housing eg, first housing 210 in FIG. 2
- a second housing connected to the hinge structure and foldable with respect to the first housing around the hinge structure
- a flexible display disposed on one surface of the first housing and one surface of the second housing (eg, the flexible display 250 of FIG. 2 );
- a first plate including a first surface (eg, first surface 241a in FIG. 4 ) facing a first direction and disposed inside the first housing (eg, first plate 241 in FIG.
- a second surface (eg, the second surface 242a of FIG. 4 ) facing a second direction parallel to the first direction is disposed inside the second housing.
- 2 plates eg, second plate 242 in FIG. 4 );
- a first magnetic body disposed on the first surface of the first plate adjacent to one edge of the first housing and including magnetic bodies arranged along the length direction of the first housing (eg, the first magnetic body of FIG. (310)); and a second magnetic body including a magnetic body disposed on the second surface of the second plate at a position adjacent to one edge of the second housing and at a position corresponding to the first magnetic body and arranged along the longitudinal direction of the second housing.
- a foldable electronic device including may be provided.
- the first magnetic body is accommodated in a first recess formed on the first surface (eg, the first recess 241b of FIG. 6 ), and the second magnetic body is formed on the second surface. It may be accommodated in the second recess (eg, the second recess 242b of FIG. 6 ).
- the first magnetic body and the second magnetic body may include a magnetic body array (eg, the magnetic body arrays 311 and 321 of FIGS. 6 and 7 ); a magnetic housing (eg, the magnetic housings 312 and 322 of FIGS. 6 and 7) surrounding at least one surface of the magnetic array; and a first protrusion (eg, the first protrusions 313 and 323 of FIGS. 6 and 7 ) protruding from one side of the magnetic housing and having a fastening hole formed therein.
- a magnetic body array eg, the magnetic body arrays 311 and 321 of FIGS. 6 and 7
- a magnetic housing eg, the magnetic housings 312 and 322 of FIGS. 6 and 7
- a first protrusion eg, the first protrusions 313 and 323 of FIGS. 6 and 7
- the first magnetic body and the second magnetic body may further include a second protrusion protruding from the other side of the magnetic body housing (eg, the second protrusion 315 of FIG. 8 ).
- the first magnetic body and the second magnetic body may be disposed in a direction parallel to longitudinal directions of the first housing and the second housing.
- the magnetic body array included in the first magnetic body and the second magnetic body may be disposed to generate magnetic force in a first direction and a second direction.
- the magnetic array of the first magnetic body and the magnetic array of the second magnetic body may be formed in a Halbach arrangement.
- the magnetic housing may be integrated with the magnetic array.
- the magnetic housing may be formed of fiber reinforced plastics (FRP).
- FRP fiber reinforced plastics
- a first battery is included in the inner space of the first housing, the first magnetic material is disposed in a space between the first battery and the first housing, and a second battery is included in the inner space of the second housing.
- a battery may be included, and the second magnetic body may be disposed in a space between the second battery and the second housing.
- an impact absorbing member disposed between the flexible display and the first magnetic body and between the flexible display and the second magnetic body may be further included.
- a hinge structure forming a folding shaft; a first front surface connected to the hinge structure, rotatable with respect to the folding axis, and facing a first direction; a first rear surface facing in a direction opposite to the first direction; and a first side surface spaced apart from and parallel to a folding axis of the hinge structure between the first front surface and the first rear surface; a second front surface connected to the hinge structure, rotatable with respect to the folding axis, and facing a second direction; a second rear face facing a direction opposite to the second direction; and a second side surface spaced apart from and parallel to the folding axis of the hinge structure between the second front surface and the second rear surface; a flexible display disposed on the first front surface of the first housing and the second front surface of the second housing; a first plate including a first surface facing a first direction and disposed inside the first housing; a second plate including a second surface facing a second direction parallel to the first direction in
- the first magnetic body and the second magnetic body may include a magnetic body array; a magnetic body housing surrounding at least one surface of the magnetic array; and a first protrusion protruding from one side of the magnetic housing and having a fastening hole, and a second protrusion protruding from the other side of the magnetic housing.
- the magnetic body array of the first magnetic body and the magnetic body array of the second magnetic body may form a Halbach array.
- a gap may be formed between the flexible display and the first magnetic body and between the flexible display and the second magnetic body.
- a shock absorbing member disposed in a gap between the flexible display and the first magnetic body and between the flexible display and the second magnetic body may be further included.
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Abstract
Description
Claims (15)
- 폴더블 전자 장치에 있어서,힌지 구조;상기 힌지 구조에 연결되는, 제 1 하우징;상기 힌지 구조에 연결되며, 상기 힌지 구조를 중심으로 상기 제 1 하우징에 대하여 접힘 가능한 제 2 하우징;상기 제 1 하우징의 일면 및 상기 제 2 하우징의 일면 상에 배치된 플렉서블 디스플레이;제 1 방향을 향하는 제 1 면을 포함하며, 상기 제 1 하우징의 내부에 배치된 제 1 플레이트;폴더블 전자 장치의 펼침 상태에서 상기 제 1 방향과 평행한 제 2 방향을 향하는 제 2 면을 포함하며, 상기 제 2 하우징의 내부에 배치된 제 2 플레이트;상기 제 1 플레이트의 제 1 면 상에서 상기 제 1 하우징의 일측 가장자리에 인접한 위치에 배치되며, 상기 제 1 하우징의 길이 방향을 따라 배열된 자성체를 포함하는 제 1 자성체; 및상기 제 2 플레이트의 제 2 면 상에서 상기 제 2 하우징의 일측 가장자리에 인접한 위치 및 상기 제 1 자성체와 대응되는 위치에 배치되고 상기 제 2 하우징의 길이 방향을 따라 배열된 자성체를 포함하는 제 2 자성체;를 포함하는 폴더블 전자 장치.
- 제 1 항에 있어서,상기 제 1 자성체는 상기 제 1 면에 형성된 제 1 리세스에 수용되고,상기 제 2 자성체는 상기 제 2 면에 형성된 제 2 리세스에 수용된 폴더블 전자 장치.
- 제 2 항에 있어서,상기 제 1 자성체 및 상기 제 2 자성체는,자성체 어레이;상기 자성체 어레이의 적어도 일면을 감싸는 자성체 하우징; 및상기 자성체 하우징의 일측에 돌출되며 체결 홀이 형성된 제 1 돌출부를 포함하는 폴더블 전자 장치.
- 제 3 항에 있어서,상기 제 1 자성체 및 상기 제 2 자성체는,상기 자성체 하우징의 타측에 돌출된 제 2 돌출부를 더 포함하는 폴더블 전자 장치.
- 제 4 항에 있어서,상기 제 1 리세스 및 상기 제 2 리세스에는상기 제 2 돌출부를 수용하기 위한 홈이 형성된 폴더블 전자 장치.
- 제 3 항에 있어서,상기 제 1 자성체 및 상기 제 2 자성체에 포함된 상기 자성체 어레이는 각각 제 1 방향 및 제 2 방향을 향해 자력을 형성하도록 배치된 폴더블 전자 장치.
- 제 3 항에 있어서,상기 제 1 자성체의 자성체 어레이 및 상기 제 2 자성체의 자성체 어레이는 할바흐 배열을 이루는 폴더블 전자 장치.
- 제 3 항에 있어서,상기 자성체 하우징은 상기 자성체 어레이와 일체로 성형된 폴더블 전자 장치.
- 제 3 항에 있어서,상기 자성체 하우징은 섬유 강화 플라스틱(FRP; fiber reinforced plastics)으로 형성된 폴더블 전자 장치.
- 제 1 항에 있어서,상기 제 1 자성체 및 상기 제 2 자성체는,상기 제 1 하우징 및 상기 제 2 하우징의 길이 방향과 평행한 방향으로 배치된 폴더블 전자 장치.
- 제 1 항에 있어서,상기 제 1 자성체 및 상기 제 2 자성체는, 각각 복수 개의 자성체부를 포함하는 폴더블 전자 장치.
- 제 1 항에 있어서,상기 제 1 하우징 내부 공간에는 제 1 배터리가 포함되고,상기 제 1 자성체는 상기 제 1 배터리와 상기 제 1 하우징 사이의 공간에 배치되며,상기 제 2 하우징 내부 공간에는 제 2 배터리가 포함되고,상기 제 2 자성체는 상기 제 2 배터리와 상기 제 2 하우징 사이의 공간에 배치된 것을 특징으로 하는 폴더블 전자 장치.
- 제 1 항에 있어서,상기 플렉서블 디스플레이와 상기 제 1 자성체 사이 및상기 플렉서블 디스플레이와 상기 제 2 자성체 사이에는 갭이 형성된 폴더블 전자 장치.
- 제 1 항에 있어서,상기 플렉서블 디스플레이와 상기 제 1 자성체 사이 및상기 플렉서블 디스플레이와 상기 제 2 자성체 사이의 갭에 배치된 충격 흡수 부재를 더 포함하는 폴더블 전자 장치.
- 제 1 항에 있어서,상기 플렉서블 디스플레이는 디지타이저 패널 및 디지타이저 패널을 보호하기 위한 차폐 시트를 더 포함하는 폴더블 전자 장치.
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US17/884,766 US20230050984A1 (en) | 2021-08-10 | 2022-08-10 | Foldable electronic device |
CN202280055703.7A CN117813567A (zh) | 2021-08-10 | 2022-08-10 | 可折叠电子装置 |
EP22856228.6A EP4339733A1 (en) | 2021-08-10 | 2022-08-10 | Foldable electronic device |
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KR1020210105545A KR20230023418A (ko) | 2021-08-10 | 2021-08-10 | 폴더블 전자 장치 |
KR10-2021-0105545 | 2021-08-10 |
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US17/884,766 Continuation US20230050984A1 (en) | 2021-08-10 | 2022-08-10 | Foldable electronic device |
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WO2023018231A1 true WO2023018231A1 (ko) | 2023-02-16 |
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Citations (5)
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US20180067598A1 (en) * | 2015-09-16 | 2018-03-08 | Microsoft Technology Licensing, Llc | Bendable device with display in movable connection with body |
KR20190043826A (ko) * | 2017-10-19 | 2019-04-29 | 엘지디스플레이 주식회사 | 폴더블 디스플레이 장치 |
KR20210015468A (ko) * | 2019-08-02 | 2021-02-10 | 삼성전자주식회사 | 자석을 포함하는 폴더블 전자 장치 |
KR20210027008A (ko) * | 2018-07-16 | 2021-03-10 | 베이징 시아오미 모바일 소프트웨어 컴퍼니 리미티드 | 접이식 단말기 |
KR20210069596A (ko) * | 2019-12-03 | 2021-06-11 | 애플 인크. | 핸드헬드 전자 디바이스 |
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2021
- 2021-08-10 KR KR1020210105545A patent/KR20230023418A/ko unknown
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- 2022-08-10 WO PCT/KR2022/011950 patent/WO2023018231A1/ko active Application Filing
Patent Citations (5)
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US20180067598A1 (en) * | 2015-09-16 | 2018-03-08 | Microsoft Technology Licensing, Llc | Bendable device with display in movable connection with body |
KR20190043826A (ko) * | 2017-10-19 | 2019-04-29 | 엘지디스플레이 주식회사 | 폴더블 디스플레이 장치 |
KR20210027008A (ko) * | 2018-07-16 | 2021-03-10 | 베이징 시아오미 모바일 소프트웨어 컴퍼니 리미티드 | 접이식 단말기 |
KR20210015468A (ko) * | 2019-08-02 | 2021-02-10 | 삼성전자주식회사 | 자석을 포함하는 폴더블 전자 장치 |
KR20210069596A (ko) * | 2019-12-03 | 2021-06-11 | 애플 인크. | 핸드헬드 전자 디바이스 |
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