WO2023015953A1 - 屏蔽罩、电路板组件及电子设备 - Google Patents

屏蔽罩、电路板组件及电子设备 Download PDF

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Publication number
WO2023015953A1
WO2023015953A1 PCT/CN2022/089348 CN2022089348W WO2023015953A1 WO 2023015953 A1 WO2023015953 A1 WO 2023015953A1 CN 2022089348 W CN2022089348 W CN 2022089348W WO 2023015953 A1 WO2023015953 A1 WO 2023015953A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
cover
shielding
area
components
Prior art date
Application number
PCT/CN2022/089348
Other languages
English (en)
French (fr)
Inventor
高久亮
张翼鹤
Original Assignee
荣耀终端有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 荣耀终端有限公司 filed Critical 荣耀终端有限公司
Priority to EP22757465.4A priority Critical patent/EP4156881A4/en
Priority to CN202280054334.XA priority patent/CN117751694A/zh
Publication of WO2023015953A1 publication Critical patent/WO2023015953A1/zh

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/002Casings with localised screening
    • H05K9/0022Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/002Casings with localised screening
    • H05K9/0022Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0032Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/002Casings with localised screening
    • H05K9/0022Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0032Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
    • H05K9/0035Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids with retainers mounted beforehand on the PCB, e.g. clips

Definitions

  • the present application relates to the technical field of electromagnetic shielding, in particular to a shielding cover, a circuit board assembly and electronic equipment.
  • terminal devices such as mobile phones, tablet computers, notebook computers, and personal digital assistants (Personal Digital Assistant, PDA) are usually equipped with shielding covers for shielding electromagnetic wave signals.
  • PDA Personal Digital Assistant
  • the shielding cover erected on the circuit board includes a support frame and a cover body.
  • the support frame is fixed on the circuit board.
  • the components on the circuit board are located in the area surrounded by the support frame.
  • the cover body is connected to the support frame. Externally, the enclosure completely wraps the components inside to form a complete shielding structure.
  • the application provides a shielding case, a circuit board assembly and electronic equipment.
  • the shielding case has good support, high strength, and good reliability, and can save space for arranging components on the circuit board and improve the space utilization rate of the circuit board.
  • the present application provides a shielding cover, which is installed on the side surface of the circuit board provided with components, including a cover body, the cover body is arranged on the circuit board, and a shielding area is enclosed between the cover body and the circuit board , at least some components are located in the shielding area; the components located in the shielding area include at least one first device, and the first device has a stepped surface facing the cover;
  • the cover is provided with a reinforcing part, and at least part of the reinforcing part is located in the area of the cover facing the step surface.
  • the shielding case includes a shielding body, and the shielding body and the circuit board together form a shielding area, and at least part of the components on the circuit board are housed inside the shielding case.
  • the components located inside the cover include a first component, the first component has a stepped surface facing the cover, and an available space is formed between the stepped surface of the first component and the area facing the stepped surface on the cover, through the cover A reinforcing part is arranged on the area corresponding to the stepped surface of the first device, at least part of the structure of the reinforced part is located in the area of the cover facing the stepped surface, and the available space formed above the stepped surface of the first device is utilized to add a reinforcing part.
  • the spacing between the first device and adjacent components can remain unchanged, or the increase in the spacing between the first device and adjacent components can be reduced, so that the circuit board maintains a densely arranged layout structure , save the layout area of circuit board components, and improve the space utilization rate of the circuit board.
  • the cover body includes a support frame and a cover plate, the support frame is supported on the circuit board, and the cover plate is arranged on the outside of the support frame.
  • the support frame is installed on the circuit board to form a support frame.
  • the cover plate and the circuit board together form a shielding area, and the components are covered in the cover body.
  • the support frame includes a frame body and at least one support plate, the frame body surrounds the edge of the shielded area, the support plate is connected to the inner side of the frame body, and the support plate forms a reinforcement part.
  • the support plate By connecting the support plate in the frame, the support plate can support the corresponding parts of the cover plate to prevent the partial area of the cover plate from collapsing, improve the stability of the cover plate, and ensure the reliability of the shielding cover.
  • the support plate supports the corresponding part of the cover plate, so that the area around the support plate on the cover plate can be prevented from collapsing , improve the stability of the cover, and improve the reliability of the shield.
  • a recessed part is provided on the cover plate, the recessed part protrudes toward the step surface, and the recessed part forms a reinforcement part.
  • the concave part on the cover plate By setting the concave part on the cover plate as a reinforcement part, the concave part on the cover plate will generate a force opposite to the gravitational direction of the cover plate on the surrounding area, and play a supporting role on the area around the concave part on the cover plate, which can Prevent the region around the recess from collapsing, enhance the strength and stability of the cover plate, and improve the reliability of the cover body.
  • the reinforcing part located above the step surface of the first device and on the side of the upper part of the first device, in the horizontal direction, by making a gap between the reinforcing part and the upper part of the first device, it is possible to Interference between the reinforcement part and the first component is avoided, and the normal installation of the shielding cover is ensured without affecting the performance of the first component.
  • the reinforcement part extends along the length direction of the step surface and at least covers the edge of the first component.
  • the utilization rate of the space between the step surface of the first device and the cover plate is improved, the length of the reinforcement part is extended, and the supporting effect of the reinforcement part on the cover is enhanced Force, improve the strength and stability of the cover body.
  • a partial area of the projection of the reinforcement part on the circuit board is located in the area covered by the step surface.
  • the partial area of the projection of the reinforcing part on the circuit board be located in the area covered by the stepped surface, that is, part of the width area of the reinforcing part is located above the stepped surface, and another part of the width area of the reinforcing part extends to the side of the first device, increasing the The width of the reinforcement part is increased, the area of the reinforcement part is enlarged, and the force of the reinforcement part on the shielding cover is improved.
  • the thickness of the components adjacent to the first device is smaller than the thickness of the first device; the part of the projected area of the reinforcement part on the circuit board is located at the same Within the coverage area of the adjacent components of the first device.
  • the reinforcing part on the circuit board By making the partial area of the projection of the reinforcing part on the circuit board be located in the coverage area of the components on the side of the first device, that is, the reinforcing part extends from the space above the step surface of the first device to the components on the side of the first device In the upper space, the coverage of the reinforcing part is increased, the supporting force of the reinforcing part to the cover body is increased, and the stability and reliability of the cover body are improved.
  • the frame body of the support frame includes a side wall, a fixed edge and an overlapping edge, the side wall is supported on the circuit board, the fixed edge and the overlapping edge are respectively located at two ends of the side wall, and the fixed edge is attached to the Closed on the circuit board, the lap joint edge is attached to the cover plate.
  • the support frame is supported on the circuit board through the side wall of the frame body, and by setting a fixed edge on the side wall facing the circuit board, the fixed edge can increase the contact area between the frame body and the circuit board, ensuring that the support frame
  • the installation is firm; by setting an overlapping edge on the end of the side wall facing the cover plate, the overlapping edge can increase the contact area between the frame body and the cover plate, and ensure that the support frame and the cover plate are firmly connected.
  • the fixed edge is located outside the area surrounded by the side walls
  • the overlapping edge is located inside the area enclosed by the side walls
  • the support plate is connected to the overlapping edge.
  • the fixed edge attached to the circuit board By arranging the fixed edge attached to the circuit board on the outside of the side wall, the fixed edge is prevented from occupying the space in the shield, the distance between the side wall and the peripheral components in the shield is reduced, and the space of the support frame is reduced reduce the space occupied by the shielding frame; by arranging the overlapping edge attached to the cover plate on the inner side of the side wall, the overlapping edge will not occupy the extra space outside the side wall, reducing the space occupied by the support frame and reducing the The space occupied by the shielding frame is small, and the edge of the cover plate can extend to the side wall of the frame body along the overlapping edge, increasing the connection area between the support frame and the cover plate, and enhancing the connection strength between the support frame and the cover plate.
  • the cover plate includes a plate body, at least a partial area of the outer edge of the plate body extends from a side edge, and the side edge is attached to the side wall.
  • the edge of the plate body of the cover plate is attached to the overlapping edge of the frame body, the side edge of the cover plate is attached to the side wall of the frame body, and the cover plate
  • the edge of the plate body and the side edge of the cover can be respectively connected with the lap edge of the frame and the side wall of the frame to increase the connection area between the cover and the support frame and improve the connection strength between the cover and the support .
  • the present application provides a circuit board assembly, including a circuit board and the above-mentioned shielding case, a plurality of components are arranged on one side surface of the circuit board, and the shielding case is arranged outside at least some of the components.
  • the circuit board assembly includes a circuit board and a shielding cover.
  • a plurality of components are arranged on the component surface of the circuit board.
  • the shielding cover includes a cover body. At least part of the components on the board are covered inside it.
  • the components located inside the cover include a first component, the first component has a stepped surface facing the cover, and an available space is formed between the stepped surface of the first component and the area facing the stepped surface on the cover, through the cover
  • a reinforcing part is arranged on the area corresponding to the stepped surface of the first device, at least part of the structure of the reinforced part is located in the area of the cover facing the stepped surface, and the available space formed above the stepped surface of the first device is utilized to add a reinforcing part.
  • the spacing between the first device and adjacent components can remain unchanged, or the increase in the spacing between the first device and adjacent components can be reduced, so that the circuit board maintains a densely arranged layout structure , save the layout area of circuit board components, and improve the space utilization rate of the circuit board.
  • the present application provides an electronic device, including at least one circuit board assembly as described above.
  • the electronic equipment provided by the present application includes a circuit board assembly, the circuit board assembly includes a circuit board and a shielding cover, a plurality of components are arranged on the component surface of the circuit board, and the shielding cover includes a cover body, and the component surface of the cover body and the circuit board is in common A shielded area is formed, and at least part of the components on the circuit board are covered inside.
  • the components located inside the cover include a first component, the first component has a stepped surface facing the cover, and an available space is formed between the stepped surface of the first component and the area facing the stepped surface on the cover, through the cover
  • a reinforcing part is arranged on the area corresponding to the stepped surface of the first device, at least part of the structure of the reinforced part is located in the area of the cover facing the stepped surface, and the available space formed above the stepped surface of the first device is utilized to add a reinforcing part. part to increase the strength of the shield, avoid the collapse of the surrounding area of the shield corresponding to the stepped surface, and improve the stability and reliability of the shield.
  • the spacing between the first device and adjacent components can remain unchanged, or the increase in the spacing between the first device and adjacent components can be reduced, so that the circuit board maintains a densely arranged layout structure , save the layout area of circuit board components, and improve the space utilization rate of the circuit board.
  • Fig. 1 is a schematic structural diagram of setting a shielding cover on a circuit board in the related art
  • Fig. 2 is another structural schematic diagram of setting a shielding cover on a circuit board in the related art
  • FIG. 3 is a schematic structural diagram of a circuit board assembly provided in an embodiment of the present application.
  • Figure 4 is an exploded view of Figure 3;
  • Fig. 5 is a schematic structural diagram of a circuit board provided by an embodiment of the present application.
  • FIG. 6 is a schematic structural diagram of a shielding cover provided in an embodiment of the present application.
  • FIG. 7 is an exploded view of the circuit board assembly provided by the embodiment of the present application.
  • FIG. 8 is a schematic structural diagram of a support frame provided by an embodiment of the present application.
  • FIG. 9 is a schematic structural view of the support frame provided by the embodiment of the present application assembled on the circuit board;
  • Fig. 10 is a schematic partial cross-sectional view at A-A in Fig. 3;
  • FIG. 11 is a schematic structural diagram of another circuit board assembly provided by an embodiment of the present application.
  • 10-cover body 10a-reinforcing part; 11-support frame; 12-cover plate; 21-component surface; 22-positioning hole; 31-first device;
  • 1111-side wall 1112-fixed edge; 1113-overlap edge; 1121-support part; 1211-recessed part; 1221-protrusion;
  • the shielding case can shield the influence of external electromagnetic waves on the circuit in the shielding case, and can also prevent the electromagnetic waves generated inside the shielding case from radiating outward.
  • the circuit board in the mobile phone is usually provided with a shielding cover, and the shielding cover covers the components on the circuit board inside, which can prevent the components inside the shielding cover from causing interference to other components in the mobile phone.
  • FIG. 1 is a structural schematic view of a shielding case on a circuit board in the related art
  • FIG. 2 is another structural schematic view of a shielding case on a circuit board in the related art.
  • the shielding case 1 generally includes a support frame 101 and a shield cover 102, the support frame 101 is fixed on the circuit board 2, the support frame 101 is usually an annular frame, and the The periphery of component 3.
  • the supporting frame 101 forms a supporting base, and the shielding cover 102 is connected to the outside of the supporting frame 101 .
  • the shielding cover 102 and the supporting frame 101 form a complete surrounding structure, completely covering the components 3 located in the surrounding area of the supporting frame 101 .
  • the support frame 101 is usually connected with a support beam 1011 , the support beam 1011 is located in the opening area of the support frame 101 , and the support beam 1011 is supported under the shield cover 102 .
  • the support of the shielding cover 102 by the support beam 1011 improves the stability of the shielding cover 102 to prevent the partial collapse of the shielding cover 102 .
  • a plurality of support beams 1011 can be connected to the support frame 101, and the plurality of support beams 1011 can be distributed in different positions, so as to support different positions of the shielding cover 102 through the plurality of support beams 1011, so as to ensure a long-span shielding cover 102 stability.
  • a densely arranged area of components 3 (hereinafter referred to as a densely arranged area) where the components 3 are densely packed and the layout space is compact. Due to the large number of components 3 in the densely arranged area and the compact layout, especially for the limited height space in the shielding case 1, it is often difficult to arrange the support beam 1011 in this area, and the area corresponding to this area of the shielding cover 102 cannot be obtained. effective support.
  • FIG. 1 shows a schematic structural view of a shielding case 1 in a densely laid out area in the related art, with adjacent first components 301 and second components 302 shown in FIG. 1 as
  • the distance between the first component 301 and the second component 302 is small, and the thickness of the first component 301 is large, and the height space occupied by the first component 301 is more, resulting in the first component 301 and the second component 302
  • the gap between the shielding shells 1 is small. Therefore, in order to keep the area densely arranged and ensure the compact layout of the components 3 on the circuit board 2 , the support beam 1011 is generally not provided in the space between the first component 301 and the second component 302 .
  • FIG. 2 shows a structural schematic diagram of another shielding case 1 in a densely laid out area in the related art.
  • Increase the spacing between the first component 301 and the second component 302 reserve a space for the support beam 1011 between the first component 301 and the second component 302, and support the support beam 1011 on the support frame 101 Arranged in the space between the first component 301 and the second component 302 , the support beam 1011 supports the portion of the shielding cover 102 between the first component 301 and the second component 302 .
  • the spacing between the first components 301 and the second components 302 is maintained, and the layout of the circuit board 2 is kept compact.
  • the area of the shielding cover 102 is prone to deformation and collapse, and the stability of the shielding cover 102 is poor, which affects the reliability of the shielding case 1, and will affect the performance of the shielding case 1 and the working performance of the components 3 inside the shielding case 1 .
  • the embodiment of the present application provides an electronic device
  • the electronic device can be a mobile phone, a tablet computer, a notebook computer, a personal digital assistant (Personal Digital Assistant, PDA), a smart wearable device, a sales terminal (Point of Sales, POS)
  • the electronic device may also be a fixed terminal device such as a smart TV, a server, or a switch, which is not limited in this embodiment.
  • FIG. 3 is a schematic structural diagram of a circuit board assembly provided by an embodiment of the present application
  • FIG. 4 is an exploded view of FIG. 3 .
  • an electronic device such as a mobile phone is provided with a circuit board assembly 100 , and the circuit board assembly 100 includes a circuit board 2 and a shielding case 1 .
  • the side surface of the circuit board 2 on which the components 3 are arranged can be defined as the component surface 21 of the circuit board 2 , and the circuit board 2 can be fixedly installed in the electronic device through the other side surface.
  • a printed circuit board Printed Circuit Board, PCB
  • one side surface of the PCB is the component surface 21 where the components 3 are arranged, and the other side surface of the PCB is usually placed with printed wires and soldered. This side surface can be called the printing surface.
  • components 3 may be arranged on both sides of the circuit board 2 , so that both sides of the circuit board 2 serve as component surfaces 21 . This embodiment does not limit this.
  • the circuit board 2 can be the main board in the mobile phone, and the circuit board 2 is arranged with a central processing unit (Central Processing Unit, CPU), a double rate memory (Double Data Rate, DDR), a charged erasable programmable read-only Chips such as memory (Electrically Erasable Programmable Read-Only Memory, EEPROM) and power manager, capacitors, resistors, connectors and other components 3 may also be arranged on the circuit board 2 .
  • a central processing unit Central Processing Unit, CPU
  • DDR Double Rate
  • EEPROM Electrical Erasable Programmable Read-Only Memory
  • power manager capacitors, resistors, connectors and other components 3 may also be arranged on the circuit board 2 .
  • the shielding case 1 is arranged on the component surface 21 of the circuit board 2, and the shielding case 1 covers at least part of the components 3 on the component surface 21 of the circuit board 2 inside, so as not to be located in the shielding case 1.
  • the components 3 inside the shield 1 cause electromagnetic interference to other components outside, and other components outside the shield 1 can also prevent the performance of the components 3 inside the shield 1 from being affected.
  • the shielding case 1 forms a protective barrier for the internal components 3 , which can prevent other external elements from affecting the stability of the components 3 in the shielding case 1 .
  • all components 3 on the component surface 21 of the circuit board 2 may be located inside the shielding case 1 .
  • a shielding case 1 can be arranged on the component surface 21 of the circuit board 2, and the shielding case 1 covers all the components 3 inside; If the area is large and there are many components 3 to be laid out, multiple shielding cases 1 can be arranged on the circuit board 2 in different regions, and each shielding case 1 covers the components 3 in each region.
  • the circuit board 2 will be introduced in detail below.
  • FIG. 5 is a schematic structural diagram of a circuit board provided by an embodiment of the present application.
  • some chips will be stacked on the circuit board 2 using a stacking process.
  • the chips are stacked on the component surface 21 of the circuit board 2 along the thickness direction thereof, and are stacked on the circuit board 2 in the form of a stacked chip group.
  • at least two chips are usually stacked as a stacked chipset to save the space occupied by the chips.
  • the impedance of the circuit can also be reduced.
  • the DDR Chips are stacked on top of a CPU chip to form a stacked chipset.
  • the DDR chip By stacking the DDR chip and the CPU chip, on the one hand, the DDR chip is located in the coverage area of the CPU chip on the circuit board 2, and the DDR chip does not additionally occupy the layout area of the circuit board 2, which can save the layout space of the circuit board 2 , improve the board layout utilization of circuit board 2; The impedance of the circuit.
  • the DDR chip and the CPU chip are arranged side by side on the circuit board 2, when the DDR chip and the CPU chip are connected by wires, it can be that the DDR chip and the CPU chip are both opposite and close to each other.
  • the two sides of the DDR chip and the CPU chip are connected by wires; or, the two sides of the DDR chip and the CPU chip are connected in the same direction; or, the DDR chip and the CPU chip are connected in other ways Connect the two.
  • the DDR chip and the CPU chip are arranged side by side, when the two are connected by a wire, a relatively long wire is needed to connect each other. Therefore, the impedance generated in the circuit formed between the two is also relatively large.
  • the DDR chip and the CPU chip can be connected by a wire on the same side in the thickness direction, which greatly shortens the length of the wire connected between the DDR chip and the CPU chip, and can effectively reduce the DDR chip.
  • the impedance of the circuit formed between the chip and the CPU chip is also relatively large.
  • the layout design of the components 3 on the circuit board 2 in addition to the stacked arrangement of the DDR chip and the CPU chip, other chips can also be stacked to form a stacked chipset, for example, the stacked arrangement of the EEPROM chip and the CPU chip, the EEPROM chip and the DDR chip
  • the stacking arrangement, or, the EEPROM chip, the DDR chip and the CPU chip are stacked together, which is not specifically limited in this embodiment.
  • the layout space of the circuit board 2 can be saved, the layout utilization rate of the circuit board 2 can be improved, and the circuit can also be reduced. Impedance, no more details.
  • chips with a smaller planar size are usually stacked on a chip with a larger planar size to ensure the stability of the stacked chips and to facilitate fixing the upper chip on the lower chip.
  • a stepped surface 311 is formed between the chip on the upper layer and the chip on the lower layer. Since the planar size of the chip on the upper layer is relatively small, the stepped surface 311 is the outside of the chip on the lower layer exposed to the upper layer chip. Part of the surface of the step surface 311 faces away from the element surface 21 of the circuit board 2 .
  • some components 3 with relatively special shapes are arranged on the circuit board 2.
  • the outline of the components 3 with special shapes may be similar to the outline of the aforementioned stacked chipset, that is, The special-shaped component 3 has a width difference between the upper and lower parts in the thickness direction, and the upper part of the component 3 has a smaller width and the lower part has a larger width.
  • the outer contour of the special-shaped component 3 is "convex", that is, the longitudinal cross-sectional shape of the special-shaped component 3 is "convex”.
  • the special-shaped component 3 has a stepped surface 311 , and the orientation of the stepped surface 311 is away from the component surface 21 of the circuit board 2 .
  • the component 3 with a special shape may be a capacitor, a resistor, a connector or other circuit components 3 .
  • the above-mentioned stacked chipset and components 3 with special shapes are collectively referred to as the first device 31, that is, the vertical cross-sectional shape of the first device 31 as shown in FIG. 3 is "convex"
  • both sides of the outer contour of the first device 31 have multi-level stepped surfaces 311 that gradually expand toward the component surface 21 of the circuit board 2, for example, the first device 31 is a stacked chipset with at least three layers of chips stacked. In this way, the first device 31 has a stepped surface 311 away from the component surface 21 of the circuit board 2 .
  • the circuit board 2 has at least one first component 31 .
  • the first device 31 is, for example, a component 3 with a large planar size.
  • the first device 31 is the aforementioned stacked chipset composed of CPU chips and DDR chips; or, the first device 31 is the aforementioned component 3 with a "convex" vertical cross-sectional shape and a large plane size.
  • other components 3 with a larger planar size may also be arranged on the side of the first device 31 with a larger planar size.
  • a plurality of chips with smaller plane sizes may be arranged at intervals on the adjacent side of the first device 31. , which may include stacked chip groups; or, the adjacent side of the first device 31 may be provided with a single-layer chip with a larger planar size, or the adjacent side of the first device 31 may be provided with a stacked chip with a larger planar size Group.
  • the arranged components 3 include the above-mentioned first device 31, and the layout of the first device 31 and its surrounding components 3 is compact, and the circuit board 2
  • this embodiment designs the shielding case 1 and utilizes the space between the stepped surface 311 of the first device 31 and the shielding case 1 to create an A reinforcing portion 10a is provided on the cover 1 to increase the strength of the shield 1 , avoid partial collapse of the shield 1 , and improve the reliability of the shield 1 .
  • the distance between the first device 31 and the components 3 on its side can be kept unchanged, or the increase range of the distance between the first device 31 and the components 3 on its side can be reduced, so that the components can be kept
  • the closely arranged layout of 3 saves the layout space of the circuit board 2 , reduces the area for laying the components 3 , and improves the space utilization rate of the circuit board 2 .
  • the shielding case 1 will be described in detail below in conjunction with the circuit board 2 .
  • Figure 6 is a schematic structural view of the shielding cover provided by the embodiment of the present application
  • Figure 7 is an exploded view of the circuit board assembly provided by the embodiment of the present application
  • Figure 8 is a schematic structural view of the support frame provided by the embodiment of the present application
  • the shielding cover 1 includes a cover body 10, the cover body 10 is arranged on the component surface 21 of the circuit board 2, the cover body 10 is a semi-enclosed structure, and the cover body 10 faces the side of the component surface 21 of the circuit board 2 Open, the cover body 10 is covered on the component surface 21 of the circuit board 2 , and a shielding area is enclosed between the cover body 10 and the component surface 21 of the circuit board 2 .
  • the cover body 10 is a metal piece, so that the shielding cover 1 has the function of shielding signals.
  • the material for making the cover body 10 can be nickel nickel or iron.
  • the cover 10 matches the outer contour of the circuit board 2, for example, the edge of the cover 10 can be flush with the edge of the circuit board 2 , the cover body 10 covers all the components 3 on the component surface 21 of the circuit board 2 therein. In other embodiments, the cover body 10 can only cover some components 3 on the circuit board 2, for example, the cover body 10 covers the first component 31 and some components 3 closely arranged around the first component 31. .
  • the thickness of the first device 31 is relatively large, for example, the first device 31 is the above-mentioned stacked chip group, after a plurality of chips are laminated, the thickness of the first device 31 is increased, and the surface of the first device 31 and the cover body 10 The vertical distance between them is very small, and there is usually not enough space for supporting structures in the area between the surface of the first device 31 facing the cover 10 , resulting in low strength in this part of the cover 10 . Moreover, since other components 3 are closely arranged around the first device 31 , the space in this area of the cover 10 is relatively tight, and it is difficult to install a supporting structure, and the suspended area of the cover 10 is relatively large, with poor stability.
  • the area of the cover body 10 directly above the first device 31 is larger, and other components 3 arranged around the first device 31, the area of the densely arranged area on the circuit board 2 is relatively large. If the size is too large, the suspended area of the cover body 10 will increase correspondingly, and the cover body 10 will easily collapse in this area, and the reliability of the cover body 10 will decrease.
  • the surface of the first device 31 refers to the surface of the first device 31 exposed on the component surface 21 of the circuit board 2
  • the vertical distance between the surface of the first device 31 and the cover 10 refers to In the thickness direction of the circuit board 2 , the distance between the surface of the first device 31 and the area of the cover 10 facing the first device 31 .
  • the space between the stepped surface 311 of the first device 31 and the area facing the stepped surface 311 on the cover 10 is used
  • a reinforcing part 10a (not shown in the figure) is provided on the cover body 10, and at least part of the structure of the reinforcing part 10a on the cover body 10 is located in the area of the step surface 311 facing the first device 31 on the cover body 10.
  • the space between the stepped surface 311 of the first device 31 and the facing stepped surface 311 on the cover 10 is defined as the available space below.
  • the reinforcing portion 10a utilizes the available space between the stepped surface 311 of the first component 31 and the cover 10, there is no need to increase the distance between the first component 31 and the adjacent components 3 , or reduce the increase in the spacing between the first device 31 and its adjacent components 3, so that the components 3 on the circuit board 2 maintain a densely arranged layout structure, saving the components of the circuit board 2 3 layout area, improve the space utilization rate of the circuit board 2.
  • the reinforcing part 10a may be completely located in the available space above the stepped surface 311 of the first component 31 .
  • part of the structure of the reinforcing part 10a may be located in the available space above the step surface 311 of the first component 31, and another part of the structure of the reinforcing part 10a may be located between the first component 31 and adjacent components. within the gap between devices 3 .
  • the cover body 10 can include a support frame 11 and a cover plate 12, the support frame 11 can be a frame structure, the cover plate 12 is covered on the outside of the support frame 11, the support frame 11 supports the cover plate 12, and the cover plate 12 is covered.
  • the board 12 is mainly used as a covering structure, and the cover board 12 and the bracket together constitute the cover body 10 .
  • the support frame 11 is fixed on the component surface 21 of the circuit board 2, the support frame 11 surrounds the components 3 on the circuit board 2 inside, and the cover plate 12 covers the outside of the support frame 11.
  • the cover plate 12 , the support frame 11 and the component surface 21 of the circuit board 2 together form a shielding area, which shields the components 3 inside the cover body 10 .
  • the support frame 11 can be welded on the component surface 21 of the circuit board 2 to provide a connection basis for the cover plate 12 , and the cover plate 12 can be glued or welded on the support frame 11 .
  • the support frame 11 is a frame structure, the bonding area is limited, and both the support frame 11 and the cover plate 12 are metal parts, therefore, the cover plate 12 and the support frame 11 can be welded to ensure that the cover plate 12 and the support Frame 11 is firmly connected.
  • the support frame 11 includes a frame body 111, which surrounds the periphery of the shielded area.
  • the frame body 111 serves as the main structure of the support frame 11 and defines the size of the support frame 11.
  • the shape and size of the cover plate 12 can be consistent with that of the frame
  • the shape and size of the body 111 match, and the edge portion of the cover plate 12 is connected to the frame body 111 , for example, the edge portion of the cover plate 12 is welded to the frame body 111 .
  • the frame body 111 of the support frame 11 may include a side wall 1111, a fixed edge 1112 and an overlapping edge 1113.
  • 1113 is an integral structure.
  • the side wall 1111 , the fixing edge 1112 and the overlapping edge 1113 of the frame body 111 can be formed by a stamping process.
  • the side wall 1111 of the frame body 111 is supported on the circuit board 2, the side wall 1111 of the frame body 111 constitutes the structural basis of the support frame 11, and the extension direction of the side wall 1111 of the frame body 111 is inclined to the circuit board 2
  • the plane where the component surface 21 of the circuit board 2 is located, for example, the side wall 1111 of the frame body 111 extends along the direction perpendicular to the component surface 21 of the circuit board 2, so that the support frame 11 has a certain height on the circuit board 2, so that the cover is located on the support frame 11
  • a shielding space is formed between the outer cover plate 12 and the component surface 21 of the circuit board 2 , and the components 3 can be wrapped in the shielding case 1 .
  • the height of the side wall 1111 of the support frame 11 should be greater than the component 3 with the largest thickness in the shielding case 1, so that the cover plate 12 and There is a certain gap between the components 3 with the largest thickness to prevent the shielding case 1 from contacting the components 3 so as not to affect the performance of the shielding case 1 and the components 3 .
  • the fixed edge 1112 of the frame body 111 is located at one end of the side wall 1111 facing the component surface 21 of the circuit board 2, the fixed edge 1112 extends along the component surface 21 of the circuit board 2, and the fixed edge 1112 is attached to the component surface 21 of the circuit board 2,
  • the fixing edge 1112 can increase the contact area between the support frame 11 and the circuit board 2 and improve the stability of the support frame 11 .
  • the support frame 11 is installed on the circuit board 2 through the fixed edge 1112.
  • the fixed edge 1112 of the frame body 111 is welded on the component surface 21 of the circuit board 2, and the welding area between the fixed edge 1112 and the circuit board 2 is relatively large. It can ensure that the support frame 11 is firmly welded.
  • the fixed edge 1112 of the frame body 111 can also be provided with an installation hole 1112 a, and the circuit board 2 can be connected with
  • the position corresponding to the installation hole 1112a of the frame body 111 can be provided with a positioning hole 22, the installation hole 1112a of the frame body 111 and the positioning hole 22 of the circuit board 2 can be pierced with connecting pieces such as screws and rivets, and the support frame 11 is locked by the connecting piece on board 2.
  • the support frame 11 and the circuit board 2 are only fixedly connected by connecting pieces.
  • the overlapping edge 1113 of the frame body 111 is located at the end of the side wall 1111 facing the cover plate 12, the surface of the cover plate 12 facing the component surface 21 of the circuit board 2 is defined as the inner surface of the cover plate 12, and the overlapping edge 1113 is along the cover plate 12 The inner surface of the cover plate 12 is extended, and the overlapping edge 1113 is attached to the inner surface of the cover plate 12 .
  • the contact area between the support frame 11 and the cover plate 12 can be increased by setting the overlapping edge 1113 on the support frame 11 to fit the inner surface of the cover plate 12, and the frame body 111
  • the overlapping edge 1113 of the can be welded together with the inner surface of the cover plate 12 to ensure that the support frame 11 and the cover plate 12 are firmly welded.
  • the fixed edge 1112 and the overlapping edge 1113 located at both ends of the side wall 1111 of the frame body 111 can be connected with the side wall 1111 perpendicular to each other.
  • the fixed edge 1112 attached to the component surface 21 of the circuit board 2 can be located outside the area surrounded by the side wall 1111, and the fixed edge 1112 does not occupy the space in the area enclosed by the side wall 1111.
  • the side wall 1111 can be set close to the peripheral components 3 inside it.
  • the space volume of the support frame 11 can be reduced, the size of the shielding frame can be reduced, and the The space occupied by the small circuit board assembly 100 reserves a larger layout space for other components in the electronic device.
  • the overlapping edge 1113 located at the end of the side wall 1111 facing the cover plate 12 can be located inside the area surrounded by the side wall 1111, so as to prevent the overlapping edge 1113 from occupying the extra space on the periphery of the side wall 1111 and reduce the space occupied by the support frame 11.
  • the space occupied by the shielding frame is reduced, thereby reducing the space occupied by the circuit board assembly 100, which is beneficial to the layout design of other components in the electronic device.
  • the overlapping edge 1113 extending to the inner side of the side wall 1111 matches the orientation of the support frame 11 wrapped by the cover plate 12, and the area of the side wall 1111 can be used to increase the connection area between the support frame 11 and the cover plate 12 to enhance the support.
  • the cover plate 12 includes a board body 121 and a side edge 122, the board body 121 is generally parallel to the component surface 21 of the circuit board 2, the side edge 122 is located at the outer edge of the board body 121, and the side edge 122 is in contact with the side wall 1111 of the frame body 111 Fitting, the edge portion of the plate body 121 of the cover plate 12 is bonded to the overlapping edge 1113 of the frame body 111, and the side edge 122 of the cover plate 12 and the edge portion of the plate body 121 are respectively connected to the side wall 1111 and the overlapping edge portion of the frame body 111.
  • the connecting edge 1113 is connected to ensure that the cover plate 12 and the support frame 11 are firmly connected.
  • a concave-convex structure that cooperates with each other can also be provided between the support frame 11 and the cover plate 12 .
  • the side edge 122 of the cover plate 12 is provided with a protrusion 1221 protruding toward the side wall 1111 of the support frame 11, and the side wall 1111 of the support frame 11 is provided with a recess 1111a.
  • the pit 1111a on the support frame 11 can be a recessed area
  • the protrusion 1221 and the pit 1111a can increase the contact area between the cover plate 12 and the support frame 11, and increase the contact area between the cover plate 12 and the support frame 11.
  • the welding area increases the welding strength of the two.
  • the recess 1111 a on the support frame 11 may be a through hole, and the protrusion 1221 on the cover plate 12 is snapped into the through hole on the support frame 11 .
  • the support frame 11 has a protrusion facing the cover surface 12, and the cover plate 12 has a recessed area facing the support frame 11. The position of the protrusion and the recessed area is opposite.
  • the cover plate When the cover plate is installed on the support frame It can be limited to increase the installation strength.
  • the cover plate 12 matches the shape of the frame body 111 of the support frame 11, and the edge of the plate body 121 of the cover plate 12 has a corner with a sudden extension direction.
  • the side edge 122 can only be provided on the outer edge of the plate body 121 in the straight section, and the corner of the plate body 121 is not provided with a side edge.
  • the corner of the plate body 121 is not provided with a side edge.
  • a support plate 112 is usually provided on the support frame 11.
  • the support plate 112 is located inside the frame body 111 of the support frame 11. At least one of the two ends of the support plate 112 is connected to the frame body 111.
  • the overlapping edge 1113 is connected, the support plate 112 and the overlapping edge 1113 are in the same plane, and the supporting plate 112 is attached to the inner surface of the cover plate 12 to support the cover plate 12 and prevent the local area of the cover plate 12 from collapsing , improve the stability of the cover plate 12.
  • a support plate 112 can be set on the support frame 11, for example, the support plate 112 is located in the central area of the cover plate 12, so as to support both sides of the cover plate 12 stably, so that the cover plate 12 The two sides of the area remain horizontal; or, for a larger shield 1, a plurality of support plates 112 can be arranged at intervals inside the frame body 111 of the support frame 11, and the plurality of support plates 112 can be correspondingly arranged on the cover plate 12. different regions. This embodiment does not limit this.
  • the support plate 112 can be located in an area where the arrangement density of the components 3 is low, and the space between the components 3 in this area is large, which facilitates the setting of the support plate 112, wherein the support plate 112 can be located in the adjacent In the gap between components 3. Moreover, the support plate 112 can be disposed in the area where the cover plate 12 is likely to collapse, so that the support plate 112 can play an effective supporting role.
  • This embodiment does not limit the specific shape and size of the support plate 112 on the support frame 11.
  • the support plate 112 can be a flat structure.
  • the support plate 112 connected to the overlapping edge 1113 of the frame body 111 as an example in FIG. 1121 is arranged on the component surface 21 of the circuit board 2 , and the supporting portion 1121 may be located in a gap between two adjacent components 3 , for example.
  • the reinforcing portion 10a on the cover body 10 may be a support plate 112 provided on the support frame 11, that is, the support frame 11 There is a support plate 112 in the available space above the step surface 311 of the first device 31, and by setting the support plate 112 on the support frame 11 corresponding to the step surface 311 of the first device 31, the first device is effectively utilized.
  • the stability of the cover plate 12 improves the reliability of the shielding case 1 .
  • the support plate 112 cannot be provided.
  • the support plate 112 in the available space between the stepped surface 311 of the edge of the first device 31 and the cover plate 12, the supporting force of the support plate 112 on the corresponding part of the cover plate 12 can be spread to The surrounding area of this position of the cover plate 12, so that the surrounding area of the cover plate 12 supported by the support plate 112 will not collapse, improve the stability of the area of the cover plate 12 corresponding to the surface of the first device 31, and avoid A local area on the cover plate 12 above the first device 31 collapses to affect the performance of the first device 31 .
  • the support plate 112 is used as the reinforcing part 10a, and at least part of its structure is located in the available space formed between the top of the step surface 311 of the first device 31 and the cover plate 12.
  • the first device 31 as an example of a stacked chipset, it supports The plate 112 is located above the step surface 311 formed between the lower chip and the upper chip in the stacked chipset, that is, the support plate 112 is located above the lower chip, and the support plate 112 is located on the side of the uppermost chip; the first device 31 is referred to as "
  • the support plate 112 is located above the step surface 311 of the component 3, and the support plate 112 is located on the side of the upper part of the component 3 with a smaller size.
  • the support plate 112 corresponding to the step surface 311 of the first device 31 on the support frame 11 and the first device 31 have no influence on each other, and the support plate 112 at this position
  • the first component 31 will not be damaged, and correspondingly, the first component 31 will not affect the stability of the support plate 112 .
  • the support plate 112 as the reinforcing part 10a can extend along the length direction of the stepped surface 311 of the first component 31, so that the gap between the stepped surface 311 and the cover plate 12 at the edge of the first component 31 can be adjusted.
  • the available space formed is all utilized, and a longer support plate 112 can be arranged above the step surface 311 on the edge of the first device 31, which can improve the support force of the support plate 112 to the cover plate 12, and enhance the support effect of the support plate 112.
  • the stability of the cover plate 12 is improved, and the reliability of the shielding case 1 is improved.
  • the support plate extending along the length direction of the stepped surface 311 of the first device 31 may cover at least the edge of the first device 31 .
  • the support plate 112 covers at least the entire side range of the side of the first device 31 along its length direction.
  • FIG. 9 shows that the support plate 112 located on one side of the first device 31 covers the entire side range of the side of the first device 31 .
  • a support plate 112 may be provided on at least one side of the first component 31, or a support plate 112 may be provided on at least two sides of the first component 31, for example, a support plate 112 may be provided on each circumferential side of the first component 31 , so as to improve the utilization rate of the available space formed between the stepped surface 311 of the first device 31 and the cover plate 12 , and enhance the supporting force of the support plate 112 to the cover plate 12 .
  • the support plate 112 extending along the edge of the first device 31 can be extended to connect with both sides of the frame body 111, thereby extending the length of the support plate 112 and lifting the
  • the strength and rigidity of the support frame 11 increases the support force of the support plate 112 to the cover plate 12 , and increases the strength and stability of the shielding case 1 .
  • the support plate 112 can be completely located in the available space formed between the step surface 311 of the first device 31 and the facing cover plate 12, or part of the structure of the support plate 112 is located in the available space, and the support plate 112 Another part of the structure 112 is located in the gap between the first device 31 and the adjacent components 3 .
  • the support plate 112 may extend to an area beyond the available space above the step surface 311 .
  • FIG. 10 is a schematic partial cross-sectional view at A-A in FIG. 3 .
  • the partial area of the projection of the support plate 112 on the circuit board 2 is located on the stepped surface 311 In the covered area, that is to say, a part of the width of the support plate 112 is located above the step surface 311 of the first device 31 , and another part of the width of the support plate 112 extends to the side area of the first device 31 .
  • the width of the support plate 112 is increased, the area of the support plate 112 is enlarged, and the support force of the support plate 112 to the cover plate 12 can be enhanced.
  • the support plate 112 above the step surface 311 of the first device 31 can extend to the top of the components 3 adjacent to the first device 31, that is, the position of the support plate 112 on the circuit board 2 Part of the projected area is located within the coverage area of the component 3 adjacent to the first device 31 .
  • the support plate 112 by extending the support plate 112 to cover the space above the components 3 on the side of the first device 31, the components 3 on the side of the first device 31 and the components 3
  • the space formed between the cover plates 12 is also utilized to increase the width and area of the support plate 112 and enhance the support force of the support plate 112 to the cover plate 12 .
  • the cover plate 12 is designed so that the area corresponding to the first component 31 on the cover plate 12 protrudes in a direction away from the circuit board 2 relative to its surrounding area, on the basis of maintaining a suitable gap between the first component 31 and the cover plate 12
  • the gap between the cover plate 12 and the components 3 around the first device 31 is reduced, and the space occupied by the shielding case 1 is reduced.
  • the holes saved by the shielding case 1 can be used to lay out other components in the electronic equipment.
  • the cover plate 12 is on the step surface 311 corresponding to the first device 31 and the elements on the side of the first device 31 A height difference is formed between parts of the device 3.
  • FIG. 11 is a schematic structural diagram of another circuit board assembly provided by an embodiment of the present application.
  • the reinforcing portion 10a on the cover body 10 may be a recessed portion 1211 provided on the cover plate 12 , and the recessed portion 1211 is located on the cover plate 12
  • the upper part corresponds to the region of the stepped surface 311 of the first device 31 .
  • the recessed portion 1211 may be disposed facing the stepped surface 311 of the first device 31 , and the projection of the recessed portion 1211 on the circuit board 2 may be completely located within the stepped surface 311 of the first device 31 .
  • a part of the recess 1211 is located in the area facing the step surface 311 on the cover plate 12
  • another part of the recess 1211 is located in the gap between the first device 31 and the adjacent component 3 .
  • the cover plate 12 is recessed toward the circuit board 2 in the area where the recessed portion 1211 is located, and the cover plate 12 is partially deformed at the position where the recessed portion 1211 is located, changing the area above the stepped surface 311 corresponding to the first device 31 on the cover plate 12
  • the extending direction of the material, the concave part 1211 on the cover plate 12 produces a force opposite to the gravitational direction of the cover plate 12 on the surrounding area, and supports the area around the concave part 1211 on the cover plate 12, which can strengthen the depression
  • the stability of the area around the portion 1211 can prevent the area around the recessed portion 1211 from collapsing, enhance the strength and stability of the cover plate 12 , and improve the reliability of the cover 10 .
  • the recessed portion 1211 on the cover plate 12 may extend along the length direction of the stepped surface 311 of the first device 31 , and the recessed portion 1211 may at least cover the edge of the first device 31 .
  • the recessed part 1211 can extend into the space on the side of the first device 31. For the case where the thickness of the component 3 on the side of the first device 31 is small, the recessed part 1211 can extend to cover The space above the component 3 on the side of the first component 31 will not be repeated here.
  • the recessed part 1211 may be a continuous groove structure extending along the length direction of the stepped surface 311 on the cover plate 12, or the recessed part 1211 may be a plurality of pit structures arranged at intervals along the length direction of the stepped surface 311 .
  • the recess 1211 provided on the cover plate 12 corresponds to at least one side of the first device 31, and the recess 1211 provided on the cover plate 12 corresponds to one side of the first device 31.
  • recessed parts 1211 are provided on each side of the circumferential direction, the recessed part 1211 can form an annular groove structure, or the recessed part 1211 can be a plurality of recessed structures arranged at intervals and surrounded by a ring.
  • the cover plate 12 and the support frame 11 can be processed and formed separately, and the cover plate 12 is connected to the support frame 11 to form the cover body 10; or, The cover plate 12 and the support frame 11 can be integrally formed.
  • the cover body 10 is an integrally formed part.
  • the reinforcement part 10a is formed.
  • the reinforcement part 10a can be formed on the cover body 10 through a stamping process.
  • connection should be understood in a broad sense, for example, it can be a fixed connection or a An indirect connection through an intermediary may be an internal communication between two elements or an interaction relationship between two elements.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

本申请提供一种屏蔽罩、电路板组件及电子设备,屏蔽罩包括罩体,罩体和电路板共同围成遮蔽区域,将电路板上的至少部分元器件罩设在其内部。位于罩体内部的元器件包括第一器件,第一器件具有面向罩体的台阶面,通过在罩体上对应第一器件的台阶面的区域设置加强部,加强部的至少部分结构位于罩体上正对台阶面的区域内,对第一器件的台阶面上方形成的空间加以利用,增设加强部来增大罩体的强度,避免罩体上对应台阶面的部位的周围区域发生塌陷,提升屏蔽罩的稳定性和可靠性。并且,第一器件与相邻的元器件之间的间距保持不变或增幅减小,可使电路板保持密集排列的布局结构,节省电路板的元器件布设面积,提高电路板的空间利用率。

Description

屏蔽罩、电路板组件及电子设备
本申请要求于2021年08月12日提交中国专利局、申请号为CN202110925358.5、申请名称为“屏蔽罩、电路板组件及电子设备”的中国专利申请的优先权,其全部内容通过引用结合在本申请中。
技术领域
本申请涉及电磁屏蔽技术领域,特别涉及一种屏蔽罩、电路板组件及电子设备。
背景技术
目前,手机、平板电脑、笔记本电脑、个人数字助理(Personal Digital Assistant,PDA)等终端设备中,通常都设置有用于屏蔽电磁波信号的屏蔽罩。
以电路板为例,电路板上架设的屏蔽罩包括支撑框架和罩体,支撑框架固定在电路板上,电路板上的元器件位于支撑框架围设的区域内,罩体连接在支撑框架的外部,罩体将元器件完全包裹在其内部,以形成完整的屏蔽结构。
然而,在电路板上元器件堆积密集、空间紧凑的区域,罩体容易出现塌陷现象,对屏蔽罩的可靠性造成威胁。
发明内容
本申请提供一种屏蔽罩、电路板组件及电子设备,屏蔽罩的支撑性好、强度高,可靠性好,且可节省电路板上元器件的排布空间,提高电路板的空间利用率。
第一方面,本申请提供一种屏蔽罩,安装在电路板的设有元器件的一侧表面上,包括罩体,罩体设置在电路板上,罩体和电路板之间围成遮蔽区域,至少部分元器件位于遮蔽区域内;位于遮蔽区域内的元器件中包括至少一个第一器件,第一器件具有面向罩体的台阶面;
其中,罩体上设置有加强部,至少部分加强部位于罩体上正对台阶面的区域内。
本申请提供的屏蔽罩,屏蔽罩包括罩体,罩体和电路板共同围成遮蔽区域,将电路板上的至少部分元器件罩设在其内部。位于罩体内部的元器件包括第一器件,第一器件具有面向罩体的台阶面,第一器件的台阶面和罩体上正对台阶面的区域之间形成可利用空间,通过在罩体上对应第一器件的台阶面的区域设置加强部,加强部的至少部分结构位于罩体上正对台阶面的区域内,对第一器件的台阶面上方形成的可利用空间加以利用,增设加强部来增大罩体的强度,避免罩体上对应台阶面的部位的周围区域发生塌陷,提升屏蔽罩的稳定性和可靠性。并且,第一器件与相邻的元器件之间的间距可以保持不变,或者,第一器件与相邻元器件之间的间距的增大幅度减小,使电路板保持密集排列的布局结构,节省电路板的元器件布设面积,提高电路板的空间利用率。
在一种可能的实施方式中,罩体包括支撑架和盖板,支撑架支撑在电路板上,盖板盖 设在支撑架外部。
作为罩体的支撑基础,支撑架安装在电路板上,形成支撑骨架,通过将盖板盖设在支撑架外部,盖板和电路板共同围成遮蔽区域,将元器件罩设在罩体内。
在一种可能的实施方式中,支撑架包括框体和至少一个支撑板,框体围设在遮蔽区域的边缘,支撑板连接在框体的内侧,支撑板形成加强部。
通过在框体内连接支撑板,支撑板可以对盖板的相应部位进行支撑,以防盖板的局部区域发生塌陷,提升盖板的稳定性,保证屏蔽罩的可靠性。
并且,通过在第一器件的台阶面与盖板上正对台阶面之间的空间内设置支撑板,支撑板对盖板的相应部位进行支撑,可防止盖板上位于支撑板周围的区域塌陷,提高盖板的稳定性,提升屏蔽罩的可靠性。
在一种可能的实施方式中,盖板上设置有凹陷部,凹陷部朝向台阶面伸出,凹陷部形成加强部。
通过在盖板上设置凹陷部作为加强部,盖板上的凹陷部对其周围的区域产生与盖板的重力方向相反的作用力,对盖板上凹陷部周围的区域起到支撑作用,可防止凹陷部周围的区域发生塌陷,增强盖板的强度和稳定性,提升罩体的可靠性。
在一种可能的实施方式中,在电路板的板面的延伸方向上,第一器件的靠近罩体的表面与加强部之间具有间距。
通过使位于第一器件的台阶面上方、且位于第一器件的上侧部位的侧方的加强部,在水平方向上,通过使加强部和第一器件的上侧部位之间具有间隙,可避免加强部与第一器件之间发生干涉,保证屏蔽罩正常安装,且不影响第一器件的性能。
在一种可能的实施方式中,加强部沿台阶面的长度方向延伸并至少覆盖第一器件的边缘。
通过使加强部沿第一器件的台阶面的长度方向延伸,提高对第一器件的台阶面和盖板之间的空间的利用率,延长加强部的长度,增强加强部对罩体的支撑作用力,提升罩体的强度和稳定性。
在一种可能的实施方式中,加强部在电路板上的投影的部分区域位于台阶面覆盖的区域内。
通过使加强部在电路板上的投影的部分区域位于台阶面覆盖的区域内,即加强部的部分宽度区域位于台阶面上方,加强部的另一部分宽度区域延伸至第一器件的侧方,增大加强部的宽度,扩大加强部的面积,提高加强部对屏蔽罩的作用力。
在一种可能的实施方式中,在台阶面的宽度方向上,与第一器件相邻设置的元器件的厚度小于第一器件的厚度;加强部在电路板上的投影的部分区域,位于与第一器件相邻的元器件的覆盖区域内。
通过使加强部在电路板上的投影的部分区域位于第一器件侧方的元器件的覆盖区域内,即加强部从第一器件的台阶面上方的空间延伸至第一器件侧方的元器件上方的空间内,增大了加强部的覆盖范围,提高了加强部对罩体的支撑作用力,提升了罩体的稳定性和可靠性。
在一种可能的实施方式中,支撑架的框体包括侧壁、固定沿和搭接沿,侧壁支撑在电路板上,固定沿和搭接沿分别位于侧壁的两端,固定沿贴合在电路板上,搭接沿与盖板贴 合。
支撑架通过框体的侧壁支撑在电路板上,通过在侧壁面向电路板的一端设置与电路板贴合的固定沿,固定沿可增大框体与电路板的接触面积,确保支撑架安装牢固;通过在侧壁面向盖板的一端设置与盖板贴合的搭接沿,搭接沿可增大框体与盖板的接触面积,确保支撑架与盖板连接牢固。
在一种可能的实施方式中,固定沿位于侧壁围成的区域的外侧,搭接沿位于侧壁围成的区域的内侧,支撑板连接在搭接沿上。
通过将贴合在电路板上的固定沿设置在侧壁的外侧,以免固定沿占据屏蔽罩内的空间,缩小侧壁与屏蔽罩内的外围元器件之间的间距,减小支撑架的空间体积,减小屏蔽框的占用空间;通过将贴合在盖板上的搭接沿设置在侧壁的内侧,以免搭接沿占据侧壁外围的额外空间,减小支撑架占据的空间,减小屏蔽框的占用空间,并且,盖板的边缘可沿搭接沿延伸至框体的侧壁,增大支撑架与盖板的连接面积,增强支撑架与盖板的连接强度。
在一种可能的实施方式中,盖板包括板体,板体的外缘的至少部分区域延伸出侧沿,侧沿贴合在侧壁上。
通过在板体的外缘的至少部分区域设置侧沿,盖板的板体的边缘部位贴合在框体的搭接沿上,盖板的侧沿贴合在框体的侧壁上,盖板的板体的边缘部位及盖板的侧沿可以分别与框体的搭接沿及框体的侧壁连接,增大盖板与支撑架的连接面积,提高盖板与支撑架的连接强度。
第二方面,本申请提供一种电路板组件,包括电路板和如上所述的屏蔽罩,电路板的一侧表面上布置有多个元器件,屏蔽罩罩设在至少部分元器件的外部。
本申请提供的电路板组件,包括电路板和屏蔽罩,电路板的元件面上布置有多个元器件,屏蔽罩包括罩体,罩体和电路板的元件面共同围成遮蔽区域,将电路板上的至少部分元器件罩设在其内部。位于罩体内部的元器件包括第一器件,第一器件具有面向罩体的台阶面,第一器件的台阶面和罩体上正对台阶面的区域之间形成可利用空间,通过在罩体上对应第一器件的台阶面的区域设置加强部,加强部的至少部分结构位于罩体上正对台阶面的区域内,对第一器件的台阶面上方形成的可利用空间加以利用,增设加强部来增大罩体的强度,避免罩体上对应台阶面的部位的周围区域发生塌陷,提升屏蔽罩的稳定性和可靠性。并且,第一器件与相邻的元器件之间的间距可以保持不变,或者,第一器件与相邻元器件之间的间距的增大幅度减小,使电路板保持密集排列的布局结构,节省电路板的元器件布设面积,提高电路板的空间利用率。
第三方面,本申请提供一种电子设备,包括至少一个如上所述的电路板组件。
本申请提供的电子设备,包括电路板组件,电路板组件包括电路板和屏蔽罩,电路板的元件面上布置有多个元器件,屏蔽罩包括罩体,罩体和电路板的元件面共同围成遮蔽区域,将电路板上的至少部分元器件罩设在其内部。位于罩体内部的元器件包括第一器件,第一器件具有面向罩体的台阶面,第一器件的台阶面和罩体上正对台阶面的区域之间形成可利用空间,通过在罩体上对应第一器件的台阶面的区域设置加强部,加强部的至少部分结构位于罩体上正对台阶面的区域内,对第一器件的台阶面上方形成的可利用空间加以利用,增设加强部来增大罩体的强度,避免罩体上对应台阶面的部位的周围区域发生塌陷,提升屏蔽罩的稳定性和可靠性。并且,第一器件与相邻的元器件之间的间距可以保持不变, 或者,第一器件与相邻元器件之间的间距的增大幅度减小,使电路板保持密集排列的布局结构,节省电路板的元器件布设面积,提高电路板的空间利用率。
附图说明
图1为相关技术中一种在电路板上设置屏蔽罩的结构示意图;
图2为相关技术中另一种在电路板上设置屏蔽罩的结构示意图;
图3为本申请实施例提供的一种电路板组件的结构示意图;
图4为图3的爆炸图;
图5本申请实施例提供的电路板的结构示意图;
图6为本申请实施例提供的屏蔽罩的结构示意图;
图7为本申请实施例提供的电路板组件的爆炸图;
图8为本申请实施例提供的支撑架的结构示意图;
图9为本申请实施例提供的支撑架组装在电路板上的结构示意图;
图10为图3中A-A处的局部截面示意图;
图11为本申请实施例提供的另一种电路板组件的结构示意图。
附图标记说明:
100-电路板组件;
1-屏蔽罩;2-电路板;3-元器件;
101-支撑框架;1011-支撑梁;102-屏蔽盖;301-第一元器件;302-第二元器件;
10-罩体;10a-加强部;11-支撑架;12-盖板;21-元件面;22-定位孔;31-第一器件;
111-框体;112-支撑板;121-板体;122-侧沿;311-台阶面;
1111-侧壁;1112-固定沿;1113-搭接沿;1121-支撑部;1211-凹陷部;1221-凸起;
1111a-凹坑;1112a-安装孔。
具体实施方式
本申请的实施方式部分使用的术语仅用于对本申请的具体实施例进行解释,而非旨在限定本申请。
为了提高电子设备尤其是便携式移动电子设备的灵敏度、抗干扰等性能,通常需要使用屏蔽罩对敏感信号或干扰源进行屏蔽。屏蔽罩可以屏蔽外界电磁波对屏蔽罩内的电路的影响,也能避免屏蔽罩内部产生的电磁波向外辐射。
以手机为例,手机内的电路板上通常设置有屏蔽罩,屏蔽罩将电路板上的元器件罩设在其内部,可以避免屏蔽罩内部的元器件对手机内的其他部件造成干扰。
图1为相关技术中一种在电路板上设置屏蔽罩的结构示意图;图2为相关技术中另一种在电路板上设置屏蔽罩的结构示意图。
参照图1和图2所示,屏蔽罩1通常包括支撑框架101和屏蔽盖102,支撑框架101固定在电路板2上,支撑框架101通常为环状框体,围设在电路板2上的元器件3的外周。支撑框架101形成支撑基础,屏蔽盖102连接在支撑框架101的外部,屏蔽盖102和支撑框架101构成完整的包围结构,完全遮盖位于支撑框架101的围设区域内的元器件3。
在实际应用中,存在电路板2上布置的元器件3较多的情况,此时,屏蔽罩1内包含 的元器件3较多,屏蔽盖102的跨距较大,仅依靠位于围设区域外缘的支撑框架101难以支撑整个屏蔽盖102,可能会导致屏蔽盖102的局部区域出现变形、坍塌的情况,例如,屏蔽盖102的中心区域朝向电路板2塌陷,降低了屏蔽罩1的稳定性,若罩体接触内部的元器件3,则还可能影响屏蔽罩1的性能,影响元器件3的工作性能。
因此,在跨距较大的屏蔽罩1中,支撑框架101上通常还连接有支撑梁1011,支撑梁1011位于支撑框架101的开口区域内,支撑梁1011支撑在屏蔽盖102的下方。通过支撑梁1011的对屏蔽盖102的支撑作用,提升屏蔽盖102的稳定性,以防屏蔽盖102出现局部塌陷的情况。其中,支撑框架101内可以连接有多个支撑梁1011,多个支撑梁1011可以分布在不同部位,以通过多个支撑梁1011对屏蔽盖102的不同部位进行支撑,保证大跨距的屏蔽盖102的稳定性。
然而,对于布置的元器件3较多的电路板2,会出现元器件3堆积密集、布局空间紧凑的元器件3密集布设区域(以下简称密集布设区域)。由于密集布设区域内的元器件3数量多且布局紧凑,尤其对于屏蔽罩1内的高度空间有限的情况,往往该区域内难以设置支撑梁1011,屏蔽盖102的对应该区域的区域得不到有效支撑。
参照图1所示,图1示出了相关技术中一种密集布设区域内的屏蔽罩1的结构示意图,以图1中示出的相邻的第一元器件301和第二元器件302为例,第一元器件301和第二元器件302之间的间距较小,且第一元器件301的厚度较大,第一元器件301占据的高度空间较多,导致第一元器件301与屏蔽罩1之间的间隙较小。因而,为了使该区域维持密集排布方式,保证电路板2上元器件3布局的紧凑性,在第一元器件301和第二元器件302之间的空间内通常不设置支撑梁1011。
参照图2所示,图2示出了相关技术中另一种密集布设区域内的屏蔽罩1的结构示意图,为了在第一元器件301和第二元器件302之间架设支撑梁1011,增大了第一元器件301和第二元器件302之间的间距,在第一元器件301和第二元器件302之间预留出支撑梁1011的空间,将支撑框架101上的支撑梁1011设置在第一元器件301和第二元器件302之间的空间内,该支撑梁1011对屏蔽盖102上位于第一元器件301和第二元器件302之间的部位进行支撑。
然而,如图1所示的保持第一元器件301和第二元器件302之间的间距,保持电路板2布局紧凑,但由于密集布设区域内没有设置支撑梁1011,位于密集布设区域内的屏蔽盖102的区域容易发生变形、塌陷,屏蔽盖102的稳定性较差,影响了屏蔽罩1的可靠性,会对屏蔽罩1的性能及屏蔽罩1内部的元器件3的工作性能造成影响。
如图2所示的在第一元器件301和第二元器件302之间预留足够的空间,在该空间内设置支撑梁1011,通过支撑梁1011对屏蔽盖102的支撑作用,增强了屏蔽盖102的稳定性,可防止屏蔽盖102出现局部塌陷的情况,保证了屏蔽罩1的可靠性。但是,由于增大了第一元器件301和第二元器件302之间的间距,增大了元器件3的布设面积,造成了电路板2的布设面积的浪费,降低了电路板2的布板利用率;另外,由于元器件3的布设面积增大,屏蔽罩1罩设的区域增大,会增大屏蔽罩1的体积,屏蔽罩1的占用空间较大,成本较高,且相应缩小了电子设备内其他部件的布局空间,影响电子设备内的合理布局。
针对于此,本申请实施例提供一种电子设备,电子设备可以为手机、平板电脑、笔记本电脑、个人数字助理(Personal Digital Assistant,PDA)、智能穿戴设备、销售终端(Point  of Sales,POS)等移动终端设备,或者,电子设备也可以为智能电视、服务器、交换机等固定终端设备,本实施例对此不作限制。
图3为本申请实施例提供的一种电路板组件的结构示意图;图4为图3的爆炸图。
参照图3所示,电子设备例如手机内设置有电路板组件100,电路板组件100包括电路板2和屏蔽罩1。
参照图4所示,电路板2上布置有多个元器件3,所有元器件3可以布置在电路板2的同一侧表面上。其中,电路板2上布置有元器件3的一侧表面可以定义为电路板2的元件面21,电路板2可以通过其另一侧表面固定安装在电子设备内。以印制电路板2(Printed Circuit Board,PCB)为例,PCB的一侧表面为布设元器件3的元件面21,PCB的另一侧表面通常放置印制导线并进行焊接,该侧表面可以称为印制面。
或者,电路板2的两侧表面均可以布置有元器件3,如此,电路板2的两侧表面均作为元件面21。本实施例对此不作限制。
示例性的,电路板2可以为手机内的主板,电路板2上布置有中央处理器(Central Processing Unit,CPU)、双倍速率存储器(Double Data Rate,DDR)、带电可擦可编程只读存储器(Electrically Erasable Programmable Read-Only Memory,EEPROM)和电源管理器等芯片,电路板2上还可以布置有电容、电阻、连接器及其他元器件3。
继续参照图4所示,屏蔽罩1设置在电路板2的元件面21上,屏蔽罩1将电路板2的元件面21上的至少部分元器件3罩设在其内部,以免位于屏蔽罩1内的元器件3对外部的其他部件造成电磁干扰,也可避免屏蔽罩1外部的其他部件影响屏蔽罩1内的元器件3的性能。另外,屏蔽罩1对其内部的元器件3形成保护屏障,可避免外部的其他元件影响屏蔽罩1内的元器件3的稳定性。
示例性的,电路板2的元件面21上的所有元器件3均可以位于屏蔽罩1的内部。其中,可以在电路板2的元件面21上设置一个屏蔽罩1,该屏蔽罩1将所有元器件3罩设在其内部;或者,针对于电路板2的元件面21上布设元器件3的面积较大,布设的元器件3较多的情况,可以在电路板2上分区域设置多个屏蔽罩1,各屏蔽罩1将各区域内的元器件3罩设其中。
以下对电路板2进行详细介绍。
图5本申请实施例提供的电路板的结构示意图。参照图5所示,在实际应用中,为了有效利用电路板2上的布设空间,提高电路板2的布板利用率,部分芯片会采用叠层工艺叠设在电路板2上,例如,这些芯片沿其厚度方向层叠设置在电路板2的元件面21上,以层叠芯片组的方式设置在电路板2上。对于一些尺寸较大的芯片,通常采用将至少两个芯片层叠作为层叠芯片组的方式,节省芯片占用的空间。另外,还可以降低电路的阻抗。
示例性的,以CPU芯片和DDR芯片为例,由于DDR芯片和CPU芯片的尺寸较大,且DDR芯片的平面尺寸通常小于CPU芯片的平面尺寸,在电路板2的布局设计中,通常将DDR芯片叠放在CPU芯片上形成层叠芯片组。
通过将DDR芯片和CPU芯片层叠设置,一方面,DDR芯片位于CPU芯片在电路板2上的覆盖区域内,DDR芯片不额外占用电路板2的布板面积,可以节省电路板2的布板空间,提高电路板2的布板利用率;另一方面,缩短了DDR芯片和CPU芯片之间连接的导线的长度,既节省了导线的占用空间,又可以降低DDR芯片和CPU芯片之间构成的电路的阻抗。
其中,可以理解的是,若DDR芯片和CPU芯片并排设置在电路板2上,DDR芯片和CPU 芯片之间通过导线连接时,可以是DDR芯片和CPU芯片两者相对的、相互靠近的两侧之间通过导线连接,DDR芯片和CPU芯片相互远离的两侧之间通过导线连接;或者,DDR芯片和CPU芯片的位于同一方位的两侧之间连接;或者,DDR芯片和CPU芯片以其他方式将两者连接起来。
显然,DDR芯片和CPU芯片并排设置时,两者之间采用导线连接时,需要较长的导线来连接彼此,因而,两者之间构成的电路中产生的阻抗也较大。对此,通过将DDR芯片层叠在CPU芯片上,可以将DDR芯片和CPU芯片在厚度方向上的同一侧通过导线连接,大大缩短了DDR芯片和CPU芯片之间连接的导线长度,可以有效降低DDR芯片和CPU芯片之间构成的电路的阻抗。
在电路板2上的元器件3的布局设计中,除了DDR芯片和CPU芯片层叠设置外,还可以将其他芯片层叠形成层叠芯片组,例如,EEPROM芯片和CPU芯片层叠设置,EEPROM芯片和DDR芯片层叠设置,或者,EEPROM芯片、DDR芯片和CPU芯片三者层叠设置在一起,本实施例对此不作具体限制。其中,与前述DDR芯片和CPU芯片层叠设置类似的,通过将不同的芯片层叠在一起,可以节省电路板2的布板空间,提高电路板2的布板利用率,并且,还可以降低电路的阻抗,不再赘述。
在具体应用中,通常将平面尺寸较小的芯片层叠在平面尺寸较大的芯片上,以确保层叠的芯片的稳定性,且便于将上方的芯片固定在下方的芯片上。如此一来,层叠芯片组中,位于上层的芯片和位于下层的芯片之间形成台阶面311,由于上层的芯片的平面尺寸较小,因而,台阶面311为下层芯片上暴露于上层芯片的外部的部分表面,该台阶面311的朝向背离于电路板2的元件面21。
另外,在其他一些场景中,电路板2上布置有一些形状较为特殊的元器件3,示例性的,该特殊形状的元器件3的外轮廓可以类似于前述的层叠芯片组的外轮廓,即该形状特殊的元器件3在其厚度方向上的上、下部位之间具有宽度差,该元器件3的上部的宽度小、下部的宽度大。例如,在电路板2的元件面21的侧视方向上,该特殊形状的元器件3的外轮廓呈“凸”字形,即该特殊形状的元器件3的纵截面形状呈“凸”字形。与层叠芯片组类似的,该特殊形状的元器件3具有台阶面311,该台阶面311的朝向背离于电路板2的元件面21。
示例性的,该特殊形状的元器件3可以为电容、电阻、连接器或其他电路元器件3。
为了便于表述,本实施例中,将上述层叠芯片组和具有特殊形状的元器件3统称为第一器件31,即,如图3所示的第一器件31的纵截面形状呈“凸”字形,或者,第一器件31的外轮廓的两侧具有向电路板2的元件面21逐渐外扩的多级台阶面311,例如,第一器件31为层叠有至少三层芯片的层叠芯片组。如此,第一器件31具有背离于电路板2的元件面21的台阶面311。
可以理解的是,在电路板2上布置的众多元器件3中,至少具有一组上述层叠芯片组或具有特殊形状的元器件3,即电路板2上具有至少一个第一器件31。
参照图4所示,作为一种具体实施方式,第一器件31例如为平面尺寸较大的元器件3。示例性的,第一器件31为前述由CPU芯片和DDR芯片构成的层叠芯片组;或者,第一器件31为前述纵截面形状呈“凸”字形的平面尺寸较大的元器件3。在电路板2的元件面21上,第一器件31的侧方布置有多个其他元器件3,例如图3中所示,第一器件31的一侧以行或列间隔的形式排布有多个尺寸较小的元器件3。
在其他场景中,平面尺寸较大的第一器件31的侧方也可以布置平面尺寸较大的其他元器件3。本实施例中,对与第一器件31相邻设置的元器件3的形状、尺寸及布局方式不作具体限制,例如,第一器件31的相邻侧可以间隔设置多个平面尺寸较小的芯片,其中,可以包括层叠设置的芯片组;或者,第一器件31的相邻侧可以设置平面尺寸较大的单层芯片,或第一器件31的相邻侧可以设置平面尺寸较大的层叠芯片组。
为了将电路板2的元件面21上的元器件3的布置结构合理化,高效利用电路板2的布设面积,参照图3所示,第一器件31侧方的多个元器件3和第一器件31之间紧密排列,第一器件31和与之相邻的元器件3之间的间隔较小。对于第一器件31侧方为平面尺寸较大的元器件3,该平面尺寸较大的元器件3和第一器件31的间隔较小。
结合图4所示,针对于电路板2上布置的元器件3较多,布置的元器件3包括上述第一器件31,且第一器件31和其周围的元器件3布局紧凑,电路板2上布局空间紧张的情况,尤其对于平面尺寸较大的第一器件31,本实施例通过对屏蔽罩1进行设计,利用第一器件31的台阶面311与屏蔽罩1之间的空间,在屏蔽罩1上设置加强部10a,增大屏蔽罩1的强度,避免屏蔽罩1出现局部塌陷的现象,提升屏蔽罩1的可靠性。并且,第一器件31与其侧方的元器件3之间的间距可以保持不变,或者,第一器件31与其侧方的元器件3之间的间距的增大幅度减小,可保持元器件3的紧密排列布局,节省电路板2的布设空间,减小布设元器件3的面积,提高电路板2的空间利用率。
以下结合电路板2对屏蔽罩1进行详细介绍。
图6为本申请实施例提供的屏蔽罩的结构示意图;图7为本申请实施例提供的电路板组件的爆炸图;图8为本申请实施例提供的支撑架的结构示意图;图9为本申请实施例提供的支撑架组装在电路板上的结构示意图。
结合图4所示,屏蔽罩1包括罩体10,罩体10设置在电路板2的元件面21上,罩体10为半包围结构,罩体10面向电路板2的元件面21的一侧敞开,罩体10罩设在电路板2的元件面21上,罩体10和电路板2的元件面21之间围成遮蔽区域。其中,罩体10为金属件,以使屏蔽罩1具有屏蔽信号的功能。例如,制作罩体10的材料可以为洋白铜或铁。
作为一种具体实施方式,如图4中示出的罩体10,罩体10的外轮廓与电路板2的外轮廓相匹配,例如,罩体10的边缘可以和电路板2的边缘平齐,罩体10将电路板2的元件面21上的所有元器件3均罩设于其中。在其他实施方式中,罩体10可以仅罩设电路板2上的部分元器件3,例如,罩体10将第一器件31及第一器件31周围紧密排布的部分元器件3罩设其中。
对于第一器件31的厚度较大的情况,例如,第一器件31为上述层叠芯片组,多个芯片层叠之后,增大了第一器件31的厚度,第一器件31的表面和罩体10之间的竖向间距很小,第一器件31表面正对罩体10之间的区域内通常没有充足的空间设置支撑结构,导致罩体10的该部分区域的强度较低。并且,由于第一器件31周围紧密排列有其他元器件3,罩体10内该区域的空间较为紧张,难以设置支撑结构,罩体10悬空的区域较大,稳定性较差。
对于平面尺寸较大的第一器件31,第一器件31上方正对的罩体10的面积较大,加之第一器件31周围设置的其他元器件3,电路板2上的密集布设区域面积较大,罩体10悬空的区域相应增大,罩体10在该区域内容易发生塌陷,罩体10的可靠性降低。
其中,应理解,第一器件31的表面是指第一器件31暴露在电路板2的元件面21上的表面,第一器件31的表面和罩体10之间的竖向间距,则是指在电路板2的厚度方向上,第一 器件31的表面与正对第一器件31的罩体10的区域之间的间距。
为了提高罩体10的可靠性,防止罩体10发生局部塌陷的现象,本申请实施例中,利用第一器件31的台阶面311与罩体10上正对台阶面311的区域之间的空间,在罩体10上设置加强部10a(图中未示出),罩体10上的加强部10a的至少部分结构位于罩体10上正对第一器件31的台阶面311的区域内。通过罩体10上的加强部10a,增大罩体10的位于密集布设区域内的强度,提升罩体10的稳定性,防止罩体10发生局部塌陷的现象,保证罩体10的可靠性。
为便于描述,以下将第一器件31的台阶面311与罩体10上正对台阶面311之间的空间定义为可利用空间。通过在罩体10上对应可利用空间的区域设置加强部10a,加强部10a增大了罩体10的强度,通过加强部10a使罩体10的可靠性得到保障。并且,由于加强部10a利用的是第一器件31的台阶面311与罩体10之间的可利用空间,因而,无需增大第一器件31和与之相邻的元器件3之间的间距,或者,减小第一器件31和与之相邻的元器件3之间的间距的增大幅度,使电路板2上的元器件3保持密集排列的布局结构,节省电路板2的元器件3布设面积,提高电路板2的空间利用率。
其中,作为一种实施方式,加强部10a可以完全位于第一器件31的台阶面311上方的可利用空间内。作为另一种实施方式,加强部10a的部分结构可以位于第一器件31的台阶面311上方的可利用空间内,加强部10a的另一部分结构可以位于第一器件31和与之相邻的元器件3之间的间隙内。
参照图6所示,罩体10可以包括支撑架11和盖板12,支撑架11可以为框架结构,盖板12盖设在支撑架11的外部,支撑架11对盖板12进行支撑,盖板12主要作为遮盖结构,盖板12和支架共同构成罩体10。参照图7所示,支撑架11固定在电路板2的元件面21上,支撑架11将电路板2上的元器件3围设在其内部,盖板12盖设在支撑架11的外部,盖板12、支撑架11和电路板2的元件面21之间共同围成遮蔽区域,将元器件3遮蔽于罩体10内部。
在实际应用中,支撑架11可以焊接在电路板2的元件面21上,为盖板12提供连接基础,盖板12可以粘接或焊接在支撑架11上。示例性的,由于支撑架11为框架结构,粘接面积有限,且支撑架11和盖板12均为金属件,因而,可以将盖板12和支撑架11焊接连接,确保盖板12和支撑架11连接牢固。
参照图8所示,支撑架11包括框体111,围设在遮蔽区域外围,框体111作为支撑架11的主体结构,限定出支撑架11的尺寸,盖板12的形状、尺寸可以和框体111的形状、尺寸相匹配,盖板12的边缘部位与框体111连接,例如,盖板12的边缘部位与框体111焊接连接。
具体的,支撑架11的框体111可以包括侧壁1111、固定沿1112和搭接沿1113,支撑架11可以为一体成型件,即框体111的侧壁1111、固定沿1112和搭接沿1113为一体结构。示例性的,可以通过冲压成型工艺形成框体111的侧壁1111、固定沿1112和搭接沿1113。
参照图9所示,框体111的侧壁1111支撑在电路板2上,框体111的侧壁1111构成支撑架11的结构基础,框体111的侧壁1111的延伸方向倾斜于电路板2的元件面21所在的平面,例如,框体111的侧壁1111沿垂直于电路板2的元件面21的方向延伸,以使支撑架11在电路板2具有一定高度,使盖设在支撑架11外部的盖板12和电路板2的元件面21之间形成遮蔽空间,能够将元器件3包裹在屏蔽罩1内。
其中,以框体111的侧壁1111垂直于电路板2的元件面21为例,支撑架11的侧壁1111的高度应大于屏蔽罩1内的厚度最大的元器件3,使盖板12和厚度最大的元器件3之间具有一 定间隙,防止屏蔽罩1和元器件3接触,以免影响屏蔽罩1和元器件3的性能。
框体111的固定沿1112位于侧壁1111面向电路板2的元件面21的一端,固定沿1112沿电路板2的元件面21延伸,固定沿1112贴合在电路板2的元件面21上,固定沿1112可增大支撑架11与电路板2的接触面积,提高支撑架11的稳定性。通过固定沿1112将支撑架11安装在电路板2上,例如,框体111的固定沿1112焊接在电路板2的元件面21上,固定沿1112与电路板2之间的焊接面积较大,可保证支撑架11焊接牢固。
另外,结合图7所示,在框体111的固定沿1112与电路板2的元件面21焊接连接的基础上,框体111的固定沿1112上还可以设置安装孔1112a,电路板2上与框体111的安装孔1112a对应的部位可以设置定位孔22,框体111的安装孔1112a和电路板2的定位孔22内可以穿设螺钉、铆钉等连接件,支撑架11通过连接件锁固在电路板2上。或者,支撑架11和电路板2之间仅通过连接件固定连接。
框体111的搭接沿1113位于侧壁1111面向盖板12的一端,将盖板12面向电路板2的元件面21的表面定义为盖板12的内表面,搭接沿1113沿盖板12的内表面延伸,搭接沿1113贴合在盖板12的内表面上。与框体111的固定沿1112类似的,通过在支撑架11上设置与盖板12的内表面贴合的搭接沿1113,可增大支撑架11与盖板12的接触面积,框体111的搭接沿1113和盖板12的内表面之间可以焊接在一起,保证支撑架11与盖板12焊接牢固。
示例性的,以框体111的侧壁1111垂直支撑在电路板2的元件面21上为例,位于框体111的侧壁1111两端的固定沿1112和搭接沿1113均可以和侧壁1111相互垂直。
继续参照图9所示,贴合在电路板2的元件面21上的固定沿1112可以位于侧壁1111围成的区域的外侧,固定沿1112不占据侧壁1111围成的区域内的空间,侧壁1111可以贴近其内部的外围元器件3设置,在将需要被保护的元器件3都围设在内的前提下,可以减小支撑架11的空间体积,减小屏蔽框的尺寸,减小电路板组件100占据的空间,为电子设备内的其他部件预留较大的布局空间。
位于侧壁1111面向盖板12的一端的搭接沿1113可以位于侧壁1111围成的区域的内侧,以免搭接沿1113占据侧壁1111外围的额外空间,减小支撑架11占据的空间,减小屏蔽框的占用空间,从而,减小电路板组件100的占用空间,有利于电子设备内的其他部件的布局设计。并且,向侧壁1111的内侧延伸的搭接沿1113,与盖板12包裹支撑架11的方位相匹配,可以利用侧壁1111的面积增大支撑架11与盖板12的连接面积,增强支撑架11与盖板12的连接强度。
为了增大盖板12与框体111的连接面积,结合图7所示,盖板12边缘可以沿框体111的搭接沿1113延伸至与框体111的侧壁1111贴合,以增大盖板12和支撑架11之间的接触面积,盖板12和框体111的搭接沿1113及侧壁1111之间均连接,可增大盖板12与支撑架11的连接强度。
其中,盖板12包括板体121和侧沿122,板体121整体与电路板2的元件面21平行,侧沿122位于板体121的外缘,侧沿122与框体111的侧壁1111贴合,盖板12的板体121的边缘部位与框体111的搭接沿1113贴合,盖板12的侧沿122及板体121的边缘部位分别与框体111的侧壁1111及搭接沿1113连接,保证盖板12与支撑架11连接牢固。
另外,为了提高支撑架11和盖板12之间的连接强度,支撑架11和盖板12之间还可以设置有相互配合的凹凸结构。示例性的,参照图7所示,盖板12的侧沿122上设置有朝向支撑 架11的侧壁1111凸出的凸起1221,支撑架11的侧壁1111上设置有凹坑1111a,盖板12装配到支撑架11上后,盖板12上的凸起1221陷入支撑架11上的凹坑1111a内,通过盖板12上的凸起1221和支撑架11上的凹坑1111a之间的相互限位作用,可以使盖板12牢固的安装在支撑架11上。
其中,支撑架11上的凹坑1111a可以是凹陷区域,凸起1221和的凹坑1111a可以增大盖板12和支撑架11之间的接触面积,增大盖板12和支撑架11之间的焊接面积,增大两者的焊接强度。或者,支撑架11上的凹坑1111a可以为通孔,盖板12上的凸起1221卡入支撑架11上的通孔内。
可以理解地,支撑架11上具有朝向盖面12的凸起,盖板12上具有朝向支撑架11的凹陷区域,该凸起和该凹陷区域的位置相对,盖板安装在支撑架上的时候可以进行限位,增加安装强度。
其中,参照图7所示,由于支撑架11为框架结构,盖板12与支撑架11的框体111的形状相匹配,盖板12的板体121的边缘具有延伸方向突变的角部。以盖板12经冲压工艺制作而成为例,为了便于盖板12成型,可以仅在板体121的外缘上位于平直段的区域设置侧沿122,而板体121的角部不设置侧沿122。
由于盖板12的板体121覆盖支撑架11的框体111内的整个区域,盖板12的板体121的面积较大,且盖板12通常较薄,刚度有限,受自身重量的原因,盖板12上远离边缘部位的区域容易产生塌陷。对此,参照图8所示,支撑架11上通常还设置有支撑板112,支撑板112位于支撑架11的框体111的内侧,支撑板112的两端中的至少一端与框体111的搭接沿1113连接,支撑板112与搭接沿1113处于同一平面内,支撑板112贴合在盖板12的内表面上,以对盖板12进行支撑,防止盖板12的局部区域产生塌陷,提高盖板12的稳定性。
根据屏蔽罩1的实际尺寸大小,可以在支撑架11上设置一个支撑板112,例如,该支撑板112位于盖板12的中心区域,以将盖板12的两侧支撑平稳,使盖板12的两侧区域保持水平;或者,对于尺寸较大的屏蔽罩1,可以在支撑架11的框体111内侧间隔设置多个支撑板112,该多个支撑板112可以对应设置在盖板12的不同区域。本实施例对此不作限制。
示例性的,支撑板112可以位于元器件3的布置密度较小的区域,此区域的元器件3之间的空隙较大,便于支撑板112的设置,其中,支撑板112可以位于相邻的元器件3之间的间隙内。并且,支撑板112可以设置在盖板12易塌陷的区域内,以使支撑板112发挥有效的支撑作用。
本实施例对支撑架11上的支撑板112的具体形状和尺寸不进行限制,以支撑板112的两端均与框体111的搭接沿1113连接为例,支撑板112可以为平板状结构;以图9中的一端连接在框体111的搭接沿1113上的支撑板112为例,支撑板112的另一端可以形成朝向电路板2的元件面21弯折的支撑部1121,支撑部1121抵设在电路板2的元件面21上,该支撑部1121例如可以位于相邻的两个元器件3之间的间隙内。
参照图9所示,作为在罩体10上设置加强部10a的一种实施方式,罩体10上的加强部10a可以为设置在支撑架11上的支撑板112,也就是说,支撑架11上具有位于第一器件31的台阶面311上方的可利用空间内的支撑板112,通过在支撑架11上对应第一器件31的台阶面311的部位设置支撑板112,有效利用了第一器件31的台阶面311和盖板12之间的可利用空间,该部位设置的支撑板112支撑在盖板12下方,通过支撑板112对盖板12的支撑力,可防 止盖板12塌陷,提高盖板12的稳定性,提升屏蔽罩1的可靠性。
如前所述,结合图7所示,对于平面尺寸较大的第一器件31,由于第一器件31的表面和盖板12之间的间隙较小,第一器件31的表面所在的区域内无法设置支撑板112,通过在第一器件31的边缘的台阶面311与盖板12之间的可利用空间内设置支撑板112,支撑板112对盖板12的相应部位的支撑力可扩散至盖板12的该部位的周围区域,以使盖板12的被该支撑板112支撑部位的周围区域不会产生塌陷,提高第一器件31表面所对应的盖板12的区域的稳定性,避免盖板12上位于第一器件31上方的局部区域塌陷而影响第一器件31的性能。
支撑板112作为加强部10a,其至少部分结构位于第一器件31的台阶面311的正上方与盖板12之间形成的可利用空间内,以第一器件31为层叠芯片组为例,支撑板112位于层叠芯片组中下层芯片和上层芯片之间形成的台阶面311上方,即支撑板112位于下层芯片的上方,且支撑板112位于最上层芯片的侧方;以第一器件31为“凸”字形的元器件3为例,支撑板112位于该元器件3的台阶面311的上方,且支撑板112位于该元器件3中尺寸较小的上侧部位的侧方。
继续参照图9所示,为了避免支撑板112和第一器件31之间产生干涉,在电路板2的板面的延伸方向上,支撑板112与第一器件31的靠近罩体10的表面之间具有间距,即位于层叠芯片组中的最上层芯片的侧方的支撑板112和最上层芯片的边缘之间具有间距,或者,位于“凸”字形的元器件3中尺寸较小的上侧部位的侧方的支撑板112和该元器件3的上侧部位的边缘之间具有间距。这样,便于支撑架11在电路板2上的组装,支撑架11上对应于第一器件31的台阶面311部位的支撑板112和第一器件31之间相互无影响,该部位的支撑板112不会对第一器件31造成损伤,相应的,第一器件31也不会影响支撑板112的稳定性。
作为一种实施方式,作为加强部10a的支撑板112可以沿第一器件31的台阶面311的长度方向延伸,这样,可以对第一器件31的边缘部位的台阶面311与盖板12之间形成的可利用空间都加以利用,可以在第一器件31边缘的台阶面311上方设置较长的支撑板112,可以提高支撑板112对盖板12的支撑力,增强支撑板112的支撑效果,提升盖板12的平稳性,提升屏蔽罩1的可靠性。
为了对第一器件31的侧边的整个台阶面311上方的可利用空间均加以利用,沿第一器件31的台阶面311的长度方向延伸(即沿第一器件31的边缘延伸)的支撑板112可至少覆盖第一器件31的边缘。以位于第一器件31的一侧的支撑板112为例,支撑板112在其长度方向上至少覆盖第一器件31的该侧的整个侧边范围。
示例性的,参照图9所示,图9示出了位于第一器件31的一侧的支撑板112覆盖第一器件31的该侧的整个侧边范围。可以理解的是,对于第一器件31的周向各侧中的至少两侧具有台阶面311的情况,例如,以层叠芯片组为例,第一器件31的周向四侧均可以具有台阶面311,可以在第一器件31的至少一侧设置支撑板112,或者,在第一器件31的至少两侧设置支撑板112,例如,在第一器件31的周向各侧均设置支撑板112,以提高对第一器件31的台阶面311与盖板12之间形成的可利用空间的利用率,增强支撑板112对盖板12的支撑力。
另外,根据第一器件31周围的元器件3的布局设计,沿第一器件31的边缘延伸的支撑板112可以延伸至与框体111的两侧连接,进而,延长支撑板112的长度,提升支撑架11的强度和刚度,提高支撑板112对盖板12的支撑力,增大屏蔽罩1的强度和稳定性。
如前所述,支撑板112可以完全位于第一器件31的台阶面311和正对的盖板12之间形成 的可利用空间内,或者,支撑板112的部分结构位于可利用空间内,支撑板112的另一部分结构位于第一器件31和与之相邻的元器件3之间的间隙内。其中,为了扩大支撑板112的覆盖范围,增强支撑板112对盖板12的支撑力,支撑板112可以延伸至台阶面311上方的可利用空间以外的区域。
图10为图3中A-A处的局部截面示意图。参照图10所示,具体的,以支撑板112沿台阶面311的长度方向延伸为例,在台阶面311的宽度方向上,支撑板112在电路板2上的投影的部分区域位于台阶面311覆盖的区域内,也就是说,支撑板112的部分宽度区域位于第一器件31的台阶面311上方,支撑板112的另一部分宽度区域延伸至第一器件31的侧方区域。如此,增大了支撑板112的宽度,扩大了支撑板112的面积,可增强支撑板112对盖板12的支撑力。
继续参照图10所示,在实际应用中,若与第一器件31相邻设置的元器件3的厚度小于第一器件31的厚度,与第一器件31相邻的元器件3与盖板12之间形成的空间较大,则位于第一器件31的台阶面311上方的支撑板112可以延伸至与第一器件31相邻的元器件3的上方,即支撑板112在电路板2上的投影的部分区域位于与第一器件31相邻的元器件3的覆盖区域内。
结合图9所示,在支撑板112的宽度方向上,通过使支撑板112延伸至覆盖位于第一器件31侧方的元器件3上方的空间,对第一器件31侧方的元器件3与盖板12之间形成的空间也加以利用,增大支撑板112的宽度,扩大支撑板112的面积,增强支撑板112对盖板12的支撑力。
另外,结合图7和图10所示,对于第一器件31的侧方设置的元器件3的厚度小于第一器件31的厚度的情况,为了减小屏蔽罩1的占用空间,可以对盖板12进行设计,使盖板12上对应第一器件31的区域相对于其周围的区域向背离电路板2的方向凸起,在保持第一器件31和盖板12之间具有合适的间隙的基础上,减小盖板12与第一器件31周围的元器件3之间的间隙,减小屏蔽罩1的占用空间。可利用屏蔽罩1节省出来的孔家,布局电子设备内的其他部件。
对于盖板12上对应第一器件31的区域相对其周围区域向背离电路板2的方向凸起的结构,盖板12在对应第一器件31的台阶面311和第一器件31侧方的元器件3的部位之间形成高度差,通过使支撑板112延伸至第一器件31侧方的元器件3上方的空间内,对于沿电路板2的元件面21水平延伸的支撑板112,支撑板112位于第一器件31台阶面311上方的部分结构悬空,而支撑板112位于第一器件31侧方的元器件3上方的部分结构贴合在盖板12的内表面上。
图11为本申请实施例提供的另一种电路板组件的结构示意图。参照图11所示,作为在罩体10上设置加强部10a的另一种实施方式,罩体10上的加强部10a可以是盖板12上设置的凹陷部1211,凹陷部1211位于盖板12上对应第一器件31的台阶面311的区域。其中,凹陷部1211可以正对第一器件31的台阶面311设置,凹陷部1211在电路板2上的投影可以完全位于第一器件31的台阶面311内。或者,凹陷部1211的部分区域位于盖板12上正对台阶面311的区域内,凹陷部1211的另一部分区域位于第一器件31和与至相邻的元器件3之间的间隙内。
盖板12在设有凹陷部1211的区域朝向电路板2凹陷,盖板12在凹陷部1211所在的部位 产生局部变形,改变了盖板12上对应于第一器件31的台阶面311上方的区域的材料延展方向,盖板12上的凹陷部1211对其周围的区域产生与盖板12的重力方向相反的作用力,对盖板12上凹陷部1211周围的区域起到支撑作用,可增强凹陷部1211周围区域的稳定性,可防止凹陷部1211周围的区域发生塌陷,能够增强盖板12的强度和稳定性,提高罩体10的可靠性。
其中,与前述的支撑架11上的支撑板112类似的,在电路板2的板面的延伸方向上,盖板12上的凹陷部1211与第一器件31的上侧部位的边缘之间应具有间距,以防凹陷部1211和第一器件31发生干涉。另外,盖板12上的凹陷部1211可以沿第一器件31的台阶面311的长度方向延伸,且凹陷部1211可以至少覆盖第一器件31的边缘。在凹陷部1211的宽度方向上,凹陷部1211可以延伸至第一器件31侧方的空间内,对于第一器件31侧方的元器件3的厚度较小的情况,凹陷部1211可以延伸至覆盖第一器件31侧方的元器件3的上方空间,此处不再赘述。
示例性的,凹陷部1211可以为盖板12上沿台阶面311的长度方向延伸的连续的凹槽结构,或者,凹陷部1211可以为沿台阶面311的长度方向间隔设置的多个凹坑结构。对于第一器件31的周向上的各侧均具有台阶面311的情况,盖板12上设置的凹陷部1211至少对应于第一器件31的一侧,以盖板12上对应于第一器件31的周向各侧的部位均设置有凹陷部1211为例,凹陷部1211可以形成环状的凹槽结构,或者,凹陷部1211可以为间隔设置且围成环状的多个凹坑结构。
应理解,对于在盖板12上设置凹陷部1211作为加强部10a的情况,盖板12和支撑架11可以单独加工成型,并将盖板12连接在支撑架11上构成罩体10;或者,盖板12和支撑架11可以为一体成型结构,例如,罩体10为一体成型件,通过在罩体10上对应第一器件31的台阶面311的区域加工凹陷部1211,在罩体10上形成加强部10a。示例性的,可以通过冲压成型工艺在罩体10上形成加强部10a。
在本申请实施例的描述中,需要说明的是,除非另有明确的规定和限定,术语“安装”、“相连”、“连接”应作广义理解,例如,可以是固定连接,也可以是通过中间媒介间接相连,可以是两个元件内部的连通或者两个元件的相互作用关系。对于本领域的普通技术人员而言,可以根据具体情况理解上述术语在本申请实施例中的具体含义。
本申请实施例的说明书和权利要求书及上述附图中的术语“第一”、“第二”、“第三”、“第四”等(如果存在)是用于区别类似的对象,而不必用于描述特定的顺序或先后次序。

Claims (13)

  1. 一种屏蔽罩,安装在电路板的设有元器件的一侧表面上,其特征在于,包括罩体,所述罩体设置在所述电路板上,所述罩体和所述电路板之间围成遮蔽区域,至少部分所述元器件位于所述遮蔽区域内;位于所述遮蔽区域内的所述元器件中包括至少一个第一器件,所述第一器件具有面向所述罩体的台阶面;
    其中,所述罩体上设置有加强部,至少部分所述加强部位于所述罩体上正对所述台阶面的区域内。
  2. 根据权利要求1所述的屏蔽罩,其特征在于,所述罩体包括支撑架和盖板,所述支撑架支撑在所述电路板上,所述盖板盖设在所述支撑架外部。
  3. 根据权利要求2所述的屏蔽罩,其特征在于,所述支撑架包括框体和至少一个支撑板,所述框体围设在所述遮蔽区域的边缘,所述支撑板连接在所述框体的内侧,所述支撑板形成所述加强部。
  4. 根据权利要求2所述的屏蔽罩,其特征在于,所述盖板上设置有凹陷部,所述凹陷部朝向所述台阶面伸出,所述凹陷部形成所述加强部。
  5. 根据权利要求1-4任一项所述的屏蔽罩,其特征在于,在所述电路板的板面的延伸方向上,所述第一器件的靠近所述罩体的表面与所述加强部之间具有间距。
  6. 根据权利要求1-5任一项所述的屏蔽罩,其特征在于,所述加强部沿所述台阶面的长度方向延伸并至少覆盖所述第一器件的边缘。
  7. 根据权利要求6所述的屏蔽罩,其特征在于,所述加强部在所述电路板上的投影的部分区域位于所述台阶面覆盖的区域内。
  8. 根据权利要求7所述的屏蔽罩,其特征在于,在所述台阶面的宽度方向上,与所述第一器件相邻设置的元器件的厚度小于所述第一器件的厚度;所述加强部在所述电路板上的投影的部分区域,位于与所述第一器件相邻的器件的覆盖区域内。
  9. 根据权利要求3所述的屏蔽罩,其特征在于,所述框体包括侧壁、固定沿和搭接沿,所述侧壁支撑在所述电路板上,所述固定沿和所述搭接沿分别位于所述侧壁的两端,所述固定沿贴合在所述电路板上,所述搭接沿与所述盖板贴合。
  10. 根据权利要求9所述的屏蔽罩,其特征在于,所述固定沿位于所述侧壁围成的区域的外侧,所述搭接沿位于所述侧壁围成的区域的内侧,所述支撑板连接在所述搭接沿上。
  11. 根据权利要求10所述的屏蔽罩,其特征在于,所述盖板包括板体,所述板体的外缘的至少部分区域延伸出侧沿,所述侧沿贴合在所述侧壁上。
  12. 一种电路板组件,其特征在于,包括电路板和权利要求1-11任一项所述的屏蔽罩,所述电路板的一侧表面上布置有多个元器件,所述屏蔽罩罩设在至少部分所述元器件的外部。
  13. 一种电子设备,其特征在于,包括至少一个权利要求12所述的电路板组件。
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