WO2023013048A1 - 封止構造体及びその製造方法 - Google Patents

封止構造体及びその製造方法 Download PDF

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Publication number
WO2023013048A1
WO2023013048A1 PCT/JP2021/029363 JP2021029363W WO2023013048A1 WO 2023013048 A1 WO2023013048 A1 WO 2023013048A1 JP 2021029363 W JP2021029363 W JP 2021029363W WO 2023013048 A1 WO2023013048 A1 WO 2023013048A1
Authority
WO
WIPO (PCT)
Prior art keywords
sealing
case body
joint
sealing member
sealing structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2021/029363
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English (en)
French (fr)
Japanese (ja)
Inventor
英樹 山岸
勤 小幡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyama Prefecture
Original Assignee
Toyama Prefecture
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyama Prefecture filed Critical Toyama Prefecture
Priority to JP2023539558A priority Critical patent/JP7586449B2/ja
Priority to PCT/JP2021/029363 priority patent/WO2023013048A1/ja
Publication of WO2023013048A1 publication Critical patent/WO2023013048A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16J—PISTONS; CYLINDERS; SEALINGS
    • F16J15/00—Sealings
    • F16J15/02—Sealings between relatively-stationary surfaces
    • F16J15/04—Sealings between relatively-stationary surfaces without packing between the surfaces, e.g. with ground surfaces, with cutting edge
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Definitions

  • the present invention relates to a sealed structure whose interior is sealed and a method for manufacturing the same.
  • sealing structures are used in various fields, such as sealing structures for vessels. are fastened with bolts or pins, mechanical means for caulking the sealing member to the housing, and fusion joining means such as brazing and welding are used.
  • Patent Literature 1 discloses a battery case in which a top cover is used to close the opening of a tray that houses a battery with bolts
  • Patent Literature 2 discloses a heat sink structure water-sealed with a packing material. These are mechanical sealing structures and cannot be said to be a highly productive assembly process.
  • Patent Document 3 discloses a technique of plating one joint with gold and the other with tin, forming a gold-tin alloy by heating, and sealing the joint. and low productivity. In addition, it is difficult to seal at low temperatures and is not suitable for use in devices that are susceptible to heat damage.
  • Patent Document 4 discloses a package structure including a substrate having a device arranged on a main surface thereof and a lid having a recess opening toward the substrate side and arranged on the substrate so as to cover the device.
  • the joints are brazing material formed by plating or printing.
  • Patent Document 5 a metal metallized layer having nickel plating or gold plating on the surface is formed on a ceramic case, a metal lid having a silver alloy or aluminum alloy film formed on one side is placed, and local heating is performed by an electron beam.
  • the process is complicated and the productivity is low.
  • An object of the present invention is to provide a sealing structure that is excellent in bonding strength and reliability and that can be bonded in a short time by a simple process, and a method for manufacturing the same.
  • a sealing structure according to the present invention is a sealing structure for hermetically holding an internal structure or a component provided therein, and includes a case body and a sealing joint that is sealed and joined to the case body by a sealing joint portion. and a sealing member, wherein the sealing joint is a diffusion joint between the same or different metals, and a plastic flow layer is formed in the diffusion joint.
  • the internal structure refers to sealing the inside of the case body obtained by pressing, casting, machining, etc.
  • the parts provided inside refer to the battery, electronic parts, functional parts, etc. mounted in the case body. It means to seal the opening of the case body.
  • packing materials, brazing, welding, etc. have been adopted as means for sealing and joining, whereas the present invention is characterized by using a diffusion joining method that forms a plastic flow layer at the joint.
  • a means for forming this plastic fluidized layer there is a method for manufacturing a sealing structure for sealingly holding the internal structure or parts provided inside, wherein the case body and the sealing member are superimposed on each other. The parts are heated and pressure-bonded within a range in which a liquid phase does not occur at the joint.
  • a fragile intermetallic compound is generally easily generated at the joint interface.
  • IMC intermetallic compound
  • the joint interface is heated to a relatively low temperature within a range in which a liquid phase does not occur, and the thickness of the overlapped portion of the case body and the sealing member is reduced by using a press or the like. It pressurizes in a short time.
  • such a construction method is expressed as forge welding as needed.
  • T0 the total thickness of the metal on both sides of the joint to be pressurized before joining
  • T 1 the total thickness of the metal on both sides after pressure joining.
  • R the value of "T 0 /T 1 " is defined as the reduction ratio R.
  • An increase in plastic flow at the bond interface results in an increase in the nascent surface. This enables a more efficient diffusion reaction, realizing low-temperature and short-time bonding that can suppress the growth of intermetallic compounds.
  • PCT/JP2021/3018 the total thickness of the metal on both sides of the joint to be pressurized before joining
  • T 1 the total thickness of the metal on both sides after pressure joining.
  • R the value of "T 0 /T 1 " is defined as the reduction ratio R.
  • Examples of combinations of metal materials suitable for forge welding include the following. Al--Al, Cu--Cu, Fe--Fe, Mg--Mg, Ni--Ni, Ti--Ti and the like are examples of similar metals. Examples of dissimilar metals include Al--Fe, Al--Cu, Al--Ti, Al--Ni and Al--Mg. In addition, the said metal also contains the alloy.
  • the sealing structure according to the present invention may have an insert layer made of metal between the case body and the sealing member. Heat and pressure bonding is performed with the insert layer. Alternatively, it is also possible to heat only the insert material separately and use the heat to secure an appropriate bonding temperature at the bonding interface for pressure bonding.
  • the insert layer insert material
  • the insert layer may be a so-called metal gasket.
  • a metal layer may be formed by plating, vapor deposition, or the like.
  • the sealing structure according to the present invention is excellent in joint strength and joint reliability because the joint portion is formed by forge welding.
  • Such a joint can be obtained using a versatile press machine or the like, and can be formed at a relatively low temperature in a much shorter time than conventional welding and brazing, so productivity is high. expensive.
  • the forge welding process according to the present invention can be easily incorporated into the process of press-molding the case body or the like.
  • secondary materials such as brazing material, welding rods, and packing materials, as well as incidental equipment, can be reduced.
  • (a) shows a component configuration example of a sealing structure, and (b) shows a forge welding process.
  • An example is shown in which the case body is a housing in which a channel groove or the like is formed.
  • (a) shows a configuration example of a component, and (b) shows a forge welding process.
  • 1 shows an example of electronic component packaging.
  • (a) shows a configuration example of a component, and (b) shows a forge welding process.
  • (a) shows a cross-sectional photograph of the joint interface of the Al--Al combination, and (b) shows a cross-sectional photograph of the joint interface of the Fe--Al combination.
  • FIG. 1 shows, as an example of the case body 11, a housing in which various parts are arranged and mounted.
  • a flange portion 11a is formed along the entire circumference of the opening of the case body 11 and forge welded to the sealing member 12 at this portion.
  • a sealing member 12 made of a plate-shaped metal material may be superimposed on the flange portion 11a of the case body 11 and directly sealed and joined, but in the embodiment shown in FIG. In this example, the insert member 13 is sandwiched between the flange portion 11a and the sealing member 12 for forge welding.
  • the superimposed flange portions are preheated and pressurized with a press or the like using upper and lower pressurizing jigs so that the draft ratio R is 1.3 or more.
  • FIG. 2 shows an example in which a case body 11 is a heat exchange component such as a heat sink having a channel groove or the like formed therein, and the opening is forge welded to the sealing member 12 .
  • This embodiment is also an example in which the insert material 13 is interposed, but the insert material does not necessarily need to be used depending on the combination of metal materials.
  • FIG. 2(b) shows the flow of forge welding by pressing. In this case, the reduction ratio is evaluated by the change in the thickness of the portion where the thickness is substantially reduced. This is because the thickness is reduced due to plastic flow.
  • FIG. 3 shows an example of packaging an electronic component by laminating two or more layers of substrates.
  • a metal layer 14a is formed on the sealing joint portion of the ceramic plate 14 by plating or vapor deposition.
  • a substrate 15 made of a silicon substrate is packaged between this and a sealing member 16 made of a glass plate.
  • a frame-shaped metal layer 15a is plated or vapor-deposited on the front and back surfaces of the substrate 15 .
  • a frame-shaped metal layer 16 a is formed on the facing surface of the sealing member 16 .
  • An insert member 13 made of a metal gasket is arranged between the ceramic plate 14 and the substrate 15 and between the substrate 15 and a sealing member 16 made of a glass plate.
  • the substrate to be composed is, for example, silicon, glass, ceramic, aluminum, iron, kovar, nickel, copper, magnesium, etc., and is made of a material having a strength that can withstand the forge welding process. Any material to be formed can be selected without being limited to these. Also, by appropriately designing metal patterns of, for example, ceramic substrates laminated in multiple layers, it is possible to achieve electrical continuity between substrates.
  • FIG. 3(b) shows the flow of forge welding. When the sealing joint portion is pressurized to a predetermined temperature and pressurized with a press machine or the like, a plastic flow layer is formed in the joint portion and the sealing joint is completed.
  • FIG. 4 shows an example of a cross-sectional photograph of a sealing joint obtained by forge welding according to the present invention.
  • a cross-sectional photograph of this Al/Al bonding interface is shown in FIG. Since the main elements are of the same material, no reaction layer such as IMC was observed, and a highly crystalline bonded interface was formed from which the contaminant layer was removed.
  • FIG. 4 shows an example of a cross-sectional photograph of a sealing joint obtained by forge welding according to the present invention.
  • the flange portion of the case body is made of an aluminum alloy consisting of AA6061, which is an Al-Mg-Si alloy, and
  • the preheating temperature is about 420°C.
  • the reduction ratio R was about 2.6.
  • the junction interface had an IMC thickness of several nanometers. It is a high-quality joint interface that is sufficiently thinner than 1 ⁇ m, is uniform, and does not cause a decrease in strength.
  • the present invention relates to a sealing structure that needs to be sealed inside, and can be applied not only to automobiles and electronic equipment, but also to many other industrial fields.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Gasket Seals (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
PCT/JP2021/029363 2021-08-06 2021-08-06 封止構造体及びその製造方法 Ceased WO2023013048A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2023539558A JP7586449B2 (ja) 2021-08-06 2021-08-06 封止構造体の製造方法
PCT/JP2021/029363 WO2023013048A1 (ja) 2021-08-06 2021-08-06 封止構造体及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/029363 WO2023013048A1 (ja) 2021-08-06 2021-08-06 封止構造体及びその製造方法

Publications (1)

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WO2023013048A1 true WO2023013048A1 (ja) 2023-02-09

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PCT/JP2021/029363 Ceased WO2023013048A1 (ja) 2021-08-06 2021-08-06 封止構造体及びその製造方法

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WO (1) WO2023013048A1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000011964A (ja) * 1998-06-29 2000-01-14 Showa Denko Kk 電池用アルミニウムケースの製造方法
JP2004042117A (ja) * 2002-07-15 2004-02-12 Hitachi Ltd 摩擦攪拌接合方法とその方法によって接合された部品
JP2006263809A (ja) * 2005-02-25 2006-10-05 Origin Electric Co Ltd 金属の拡散接合方法
JP2009108784A (ja) * 2007-10-31 2009-05-21 Hitachi Ltd 高圧燃料供給ポンプおよびその製造方法
JP2019000858A (ja) * 2017-06-13 2019-01-10 マツダ株式会社 プロジェクション接合装置及びプロジェクション接合方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3078544B2 (ja) * 1998-09-24 2000-08-21 住友特殊金属株式会社 電子部品用パッケージ、その蓋体用の蓋材およびその蓋材の製造方法
JP2007296495A (ja) * 2006-05-02 2007-11-15 Dainippon Printing Co Ltd マイクロリアクターおよびその製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000011964A (ja) * 1998-06-29 2000-01-14 Showa Denko Kk 電池用アルミニウムケースの製造方法
JP2004042117A (ja) * 2002-07-15 2004-02-12 Hitachi Ltd 摩擦攪拌接合方法とその方法によって接合された部品
JP2006263809A (ja) * 2005-02-25 2006-10-05 Origin Electric Co Ltd 金属の拡散接合方法
JP2009108784A (ja) * 2007-10-31 2009-05-21 Hitachi Ltd 高圧燃料供給ポンプおよびその製造方法
JP2019000858A (ja) * 2017-06-13 2019-01-10 マツダ株式会社 プロジェクション接合装置及びプロジェクション接合方法

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JP7586449B2 (ja) 2024-11-19

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