Classifications

• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/004—Photosensitive materials
  • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
  • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/004—Photosensitive materials
  • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
  • G03F7/091—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by antireflection means or light filtering or absorbing means, e.g. anti-halation, contrast enhancement
• • C—CHEMISTRY; METALLURGY
  • C07—ORGANIC CHEMISTRY
  • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
  • C07C25/00—Compounds containing at least one halogen atom bound to a six-membered aromatic ring
  • C07C25/02—Monocyclic aromatic halogenated hydrocarbons
• • C—CHEMISTRY; METALLURGY
  • C07—ORGANIC CHEMISTRY
  • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
  • C07C309/00—Sulfonic acids; Halides, esters, or anhydrides thereof
  • C07C309/01—Sulfonic acids
  • C07C309/02—Sulfonic acids having sulfo groups bound to acyclic carbon atoms
  • C07C309/03—Sulfonic acids having sulfo groups bound to acyclic carbon atoms of an acyclic saturated carbon skeleton
  • C07C309/06—Sulfonic acids having sulfo groups bound to acyclic carbon atoms of an acyclic saturated carbon skeleton containing halogen atoms, or nitro or nitroso groups bound to the carbon skeleton
• • C—CHEMISTRY; METALLURGY
  • C07—ORGANIC CHEMISTRY
  • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
  • C07C39/00—Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring
  • C07C39/18—Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring monocyclic with unsaturation outside the aromatic ring
  • C07C39/19—Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring monocyclic with unsaturation outside the aromatic ring containing carbon-to-carbon double bonds but no carbon-to-carbon triple bonds
• • C—CHEMISTRY; METALLURGY
  • C07—ORGANIC CHEMISTRY
  • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
  • C07C69/00—Esters of carboxylic acids; Esters of carbonic or haloformic acids
  • C07C69/52—Esters of acyclic unsaturated carboxylic acids having the esterified carboxyl group bound to an acyclic carbon atom
  • C07C69/533—Monocarboxylic acid esters having only one carbon-to-carbon double bond
  • C07C69/54—Acrylic acid esters; Methacrylic acid esters
• • C—CHEMISTRY; METALLURGY
  • C07—ORGANIC CHEMISTRY
  • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
  • C07C69/00—Esters of carboxylic acids; Esters of carbonic or haloformic acids
  • C07C69/66—Esters of carboxylic acids having esterified carboxylic groups bound to acyclic carbon atoms and having any of the groups OH, O—metal, —CHO, keto, ether, acyloxy, groups, groups, or in the acid moiety
  • C07C69/67—Esters of carboxylic acids having esterified carboxylic groups bound to acyclic carbon atoms and having any of the groups OH, O—metal, —CHO, keto, ether, acyloxy, groups, groups, or in the acid moiety of saturated acids
  • C07C69/675—Esters of carboxylic acids having esterified carboxylic groups bound to acyclic carbon atoms and having any of the groups OH, O—metal, —CHO, keto, ether, acyloxy, groups, groups, or in the acid moiety of saturated acids of saturated hydroxy-carboxylic acids
• • C—CHEMISTRY; METALLURGY
  • C07—ORGANIC CHEMISTRY
  • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
  • C07C69/00—Esters of carboxylic acids; Esters of carbonic or haloformic acids
  • C07C69/66—Esters of carboxylic acids having esterified carboxylic groups bound to acyclic carbon atoms and having any of the groups OH, O—metal, —CHO, keto, ether, acyloxy, groups, groups, or in the acid moiety
  • C07C69/67—Esters of carboxylic acids having esterified carboxylic groups bound to acyclic carbon atoms and having any of the groups OH, O—metal, —CHO, keto, ether, acyloxy, groups, groups, or in the acid moiety of saturated acids
  • C07C69/708—Ethers
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
  • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
  • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
  • C08F220/10—Esters
  • C08F220/12—Esters of monohydric alcohols or phenols
  • C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
  • C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
  • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
  • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
  • C08F220/10—Esters
  • C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
  • C08F220/28—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/0035—Multiple processes, e.g. applying a further resist layer on an already in a previously step, processed pattern or textured surface
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/004—Photosensitive materials
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/004—Photosensitive materials
  • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/004—Photosensitive materials
  • G03F7/0048—Photosensitive materials characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/004—Photosensitive materials
  • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/004—Photosensitive materials
  • G03F7/075—Silicon-containing compounds
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/004—Photosensitive materials
  • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
  • G03F7/094—Multilayer resist systems, e.g. planarising layers
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/20—Exposure; Apparatus therefor
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/26—Processing photosensitive materials; Apparatus therefor
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/26—Processing photosensitive materials; Apparatus therefor
  • G03F7/40—Treatment after imagewise removal, e.g. baking

Definitions

• the present invention relates to a resist-auxiliary film composition and a pattern forming method using the composition.
• a light source for lithography used when forming a resist pattern As a light source for lithography used when forming a resist pattern, light exposure using g-line (436 nm) or i-line (365 nm) of a mercury lamp as a light source is widely used in areas with low integration.
• lithography using shorter-wavelength KrF excimer lasers (248 nm) and ArF excimer lasers (193 nm) has also been put to practical use in areas where the degree of integration is high and miniaturization is required. Lithography using extreme ultraviolet rays (EUV, 13.5 nm) is also approaching practical use.
• EUV extreme ultraviolet rays
• various resist auxiliary films are used to improve the performance of the photoresist.
• Known antireflection films include inorganic antireflection films made of titanium, titanium dioxide, titanium nitride, chromium oxide, carbon, ⁇ -silicon, etc., and organic antireflection films made of a light-absorbing substance and a polymer compound. While the former requires equipment such as a vacuum deposition device, a CVD device, and a sputtering device for film formation, the latter is advantageous in that it does not require special equipment, and has been extensively studied.
• an acrylic resin type antireflection film having a hydroxyl group and a light absorbing group as a cross-linking reaction group in the same molecule see Patent Document 1
• a novolak resin type having a hydroxyl group as a cross-linking reaction group and a light absorbing group in the same molecule see Patent Document 2
• Patent Document 2 an antireflection film
• Desirable physical properties for an organic anti-reflection coating material include high absorbance for light and radiation, no intermixing with the photoresist layer (insolubility in resist solvents), and heat-drying during coating. It is described that there are no low-molecular-weight substances diffusing from the antireflection film material into the overcoating resist, and that the dry etching rate is higher than that of the photoresist (see Non-Patent Document 1).
• the pattern of the EUV lithography resist becomes skirted or undercut due to the adverse effects of the underlying substrate and EUV, making it impossible to form a good straight resist pattern.
• sensitivity to EUV is low and sufficient throughput cannot be obtained. Therefore, in the EUV lithography process, a resist underlayer film (antireflection film) having antireflection ability is not required, but these adverse effects are reduced, a good straight resist pattern is formed, and resist sensitivity is improved. There is a need for a resist underlayer film for EUV lithography that enables this.
• the resist underlayer film for EUV lithography since the resist underlayer film for EUV lithography is coated with a resist after the film is formed, it must not cause intermixing with the resist layer (it must be insoluble in a resist solvent), similar to the antireflection film. Excellent adhesion to the resist is an essential property.
• the width of the resist pattern will become extremely fine, so it is desirable to make the EUV lithography resist thinner. Therefore, it is necessary to greatly reduce the time required for the removal process by etching of the organic antireflection film, and EUV lithography resist underlayer films that can be used in thin films or EUV lithography resists with a high etching rate selectivity ratio.
• a resist underlayer film for lithography is required.
• the ratio of the pattern height to the pattern line width increases in the single-layer resist method used as a typical resist pattern formation method, and the development time is reduced. It is well known that pattern collapse occurs due to the surface tension of the developer. Therefore, it is known that a multilayer resist method, in which films having different dry etching characteristics are laminated to form a pattern, is excellent for forming a pattern with a high aspect ratio on a stepped substrate.
• a two-layer resist method in which a photoresist layer made of a silicon-containing photosensitive polymer is combined with a lower layer made of an organic polymer containing carbon, hydrogen and oxygen as main constituent elements, such as a novolac polymer (see, for example, Patent Document 3).
• a three-layer resist method for example, Patent Document 4 in which a photoresist layer made of an organic photosensitive polymer used in a single-layer resist method is combined with an intermediate layer made of a silicon-based polymer or a silicon-based CVD film and a lower layer made of an organic polymer.
• a pattern of a photoresist layer is transferred to a silicon-containing intermediate layer using a fluorocarbon-based dry etching gas.
• a pattern is transferred by dry etching to an organic underlayer film as a constituent element, and pattern formation is performed on a substrate to be processed by dry etching using this as a mask.
• the organic underlayer film pattern is used as a hard mask and the pattern is transferred to a substrate to be processed by dry etching, a phenomenon is observed in which the underlayer film pattern is twisted or bent.
• a carbon hard mask formed on a substrate to be processed is generally an amorphous carbon (hereinafter referred to as CVD-C) film produced by a CVD method using methane gas, ethane gas, acetylene gas, etc. as raw materials.
• This CVD-C film is known to be extremely effective in reducing the number of hydrogen atoms in the film, and is very effective against the above-mentioned pattern distortion and bending.
• a substrate with steps is embedded with a CVD-C film and then patterned with photoresist
• the steps of the substrate cause steps to be applied to the photoresist coating surface, resulting in an increase in the thickness of the photoresist.
• Non-uniformity results, resulting in deterioration of focus tolerance and pattern shape during lithography.
• underlayer film materials spin-on carbon film materials
• spin coating method that can form a film with high etching resistance and high flatness on the substrate to be processed when performing dry etching processing of the substrate to be processed.
• methods for forming underlayer films (spin-on carbon films) are needed.
• materials with a high carbon content are used for spin-on carbon films.
• a material having a high carbon content is used for the resist underlayer film in this way, etching resistance during substrate processing is improved, and as a result, more accurate pattern transfer becomes possible.
• Phenol novolac resin is well known as such a spin-on carbon film (see, for example, Patent Document 5). Further, it is known that a spin-on carbon film formed from a resist spin-on carbon film composition containing an acenaphthylene-based polymer exhibits excellent properties (see, for example, Patent Document 6).
• a resist-auxiliary film composition containing a resin and a solvent containing a compound having a specific structure wherein the content of active ingredients is limited to a predetermined value or less. It was found that the above problems could be solved by That is, the present invention is as follows. [1] A resist-auxiliary film composition containing a resin (A) and a solvent (B) containing a compound (B1) represented by the following general formula (b-1), A resist-auxiliary film composition, wherein the active ingredient content is 45% by mass or less based on the total amount of the resist-auxiliary film composition. [In the above formula (b-1), R 1 is an alkyl group having 1 to 10 carbon atoms.
• R 1 in the general formula (b-1) is a methyl group, ethyl group, n-propyl group, i-propyl group, n-butyl group, i-butyl group, s-butyl group, or t -The resist-auxiliary film composition according to [1] or [2] above, which is a butyl group.
• R 1 in the general formula (b-1) is an ethyl group, n-propyl group, i-propyl group, n-butyl group, i-butyl group, s-butyl group, or t-butyl group
• the solvent (B) is selected from the group consisting of methyl ⁇ -methoxyisobutyrate, methyl ⁇ -formyloxyisobutyrate, methyl ⁇ -acetyloxyisobutyrate, and methyl 3-hydroxyisobutyrate as the solvent (B2).
• the solvent (B) contains methyl ⁇ -methoxyisobutyrate, methyl ⁇ -formyloxyisobutyrate, methyl ⁇ -acetyloxyisobutyrate, methyl 3-hydroxyisobutyrate, and 1-methoxy as the solvent (B2).
• the resist-auxiliary film composition according to [5] above which contains one or more selected from the group consisting of 2-propanol.
• [8] The resist-auxiliary film composition according to any one of [5] to [7] above, wherein the solvent (B2) contains 100% by mass or less based on the total amount (100% by mass) of the compound (B1). .
• [9] The resist-auxiliary film composition according to [8] above, wherein the solvent (B2) contains 0.0001% by mass or more based on the total amount (100% by mass) of the compound (B1).
• a method of forming a pattern comprising [18]
• the resist auxiliary agent composition of a preferred aspect of the present invention is capable of forming a resist auxiliary film suitable for manufacturing various devices, although the content of active ingredients including a resin is limited to a predetermined value or less. It is possible.
• the resist-auxiliary film composition of the present invention comprises a resin (A) (hereinafter also referred to as “component (A)”) and a solvent (B) containing a compound (B1) represented by general formula (b-1) ( hereinafter also referred to as “component (B)”).
• component (A) hereinafter also referred to as "component (A)
• component (B) a compound represented by general formula (b-1)
• resist auxiliary film refers to all films used as the upper layer of the resist and films used as the lower layer of the resist, including, for example, a resist upper layer film, a resist intermediate layer film, and a resist lower layer film.
• the resist-auxiliary film composition of one embodiment of the present invention further contains at least one additive (C) selected from photosensitizers and acid generators (hereinafter also referred to as “component (C)").
• component (C) selected from photosensitizers and acid generators
• the content of active ingredients is limited to 45% by mass or less based on the total amount (100% by mass) of the resist-auxiliary film composition.
• active ingredient means an ingredient other than ingredient (B) among the ingredients contained in the resist-auxiliary film composition.
• the resin (A), the additive (C), and the acid cross-linking agent, acid diffusion control agent, dissolution accelerator, dissolution control agent, sensitizer, interface that may be contained as other additives described later
• Activators organic carboxylic acids or phosphorus oxo acids or their derivatives, dyes, pigments, adhesion aids, antihalation agents, storage stabilizers, antifoaming agents, shape modifiers, and the like.
• the resist-auxiliary film composition of the present invention uses the compound represented by the general formula (b-1) as a solvent, thereby reducing the content of active ingredients including resins to 45% by mass or less. Even so, it can be a photoresist auxiliary film material capable of forming a thick resist auxiliary film. In addition, since the resist-auxiliary film composition of the present invention has a reduced active ingredient content of 45% by mass or less, it is economically superior.
• the content of the active ingredient is 42% by mass or less, 40% by mass or less, 36% by mass or less, relative to the total amount (100% by mass) of the resist-auxiliary film composition. % by mass or less, 31% by mass or less, 26% by mass or less, 23% by mass or less, 20% by mass or less, 18% by mass or less, 16% by mass or less, 12% by mass or less, 10% by mass or less, 6% by mass or less, or It may be appropriately set to 3% by mass or less depending on the application.
• the lower limit of the content of the active ingredient is appropriately set according to the application. It can be 4% by mass or more, 7% by mass or more, or 10% by mass or more.
• the content of the active ingredient can be appropriately selected from the options for the upper limit and the lower limit described above, and can be defined by any combination.
• the content of component (A) in the active ingredients is Preferably 50 to 100% by mass, more preferably 60 to 100% by mass, even more preferably 70 to 100% by mass, and even more preferably 70% to 100% by mass, based on the total amount (100% by mass) of active ingredients contained in the resist-auxiliary film composition. is 75 to 100% by weight, particularly preferably 80 to 100% by weight.
• the resist-auxiliary film composition of one embodiment of the present invention may contain other components in addition to the above components (A) to (C) depending on the application.
• the total content of components (A), (B) and (C) is preferably based on the total amount (100% by mass) of the resist-auxiliary film composition. is 30 to 100% by mass, more preferably 40 to 100% by mass, still more preferably 60 to 100% by mass, even more preferably 80 to 100% by mass, and particularly preferably 90 to 100% by mass.
• the resin (A) contained in the resist-auxiliary film composition of one embodiment of the present invention is not particularly limited, and is a known antireflection film for KrF excimer laser or ArF excimer laser or a photoresist underlayer film material for EUV lithography.
• the term "resin” means a compound having a given structure in addition to a polymer having a given constitutional unit.
• the weight average molecular weight (Mw) of the resin used in one aspect of the present invention is preferably 500 to 50,000, more preferably 1,000 to 40,000, and still more preferably 1,000 to 30,000.
• the content of component (A) is 45% by mass or less, 42% by mass or less, 40% by mass or less, based on the total amount (100% by mass) of the resist-auxiliary film composition. 35% by mass or less, 31% by mass or less, 26% by mass or less, 23% by mass or less, 20% by mass or less, 18% by mass or less, 16% by mass or less, 12% by mass or less, 10% by mass or less, 6% by mass or less, Alternatively, it may be appropriately set to 3% by mass or less depending on the application.
• the lower limit of the content of component (A) is also appropriately set according to the application. It can be 4% by mass or more, 7% by mass or more, or 10% by mass or more.
• the content of the component (A) can be appropriately selected from the options for the upper limit and the lower limit described above, and can be defined by any combination.
• the resist auxiliary film composition is an antireflection film for KrF excimer laser or ArF excimer laser, a photoresist underlayer film material for EUV lithography, a spin-on carbon film used in a two-layer resist method or a three-layer resist method, a three-layer resist It is suitably used as a spin-on glass film used in the method.
• the resin (A) is a novolak resin (A1) or an ethylenically unsaturated resin. It is desirable to include (A2).
• a high-carbon resin (A3) is used, and in the case of a spin-on glass film used in a three-layer resist method, silicon It is desirable to include a contained resin (A4).
• the resin (A) contained in the resist-auxiliary film composition of one embodiment of the present invention contains only one selected from these resins (A1), (A2), (A3) and (A4). may be contained in combination of two or more.
• the resin (A) may also contain resins other than the resins (A1), (A2), (A3) and (A4).
• the total content of resins (A1), (A2), (A3) and (A4) in resin (A) used in one embodiment of the present invention is based on the total amount (100% by mass) of resin (A) , preferably 60 to 100% by mass, more preferably 70 to 100% by mass, still more preferably 80 to 100% by mass, even more preferably 90 to 100% by mass, particularly preferably 95 to 100% by mass.
• Novolak resin (A1) As the novolak resin (A1) used in one aspect of the present invention, for example, phenols are reacted with at least one of aldehydes and ketones in the presence of an acidic catalyst (eg, hydrochloric acid, sulfuric acid, oxalic acid, etc.). and a resin obtained by The novolak type resin (A1) is not particularly limited, and known resins are used. For example, resins listed in JP-A-2009-173623, WO 2013-024779, and WO 2015-137486 can be applied. .
• an acidic catalyst eg, hydrochloric acid, sulfuric acid, oxalic acid, etc.
• phenols include phenol, ortho-cresol, meta-cresol, para-cresol, 2,3-dimethylphenol, 2,5-dimethylphenol, 3,4-dimethylphenol, 3,5-dimethylphenol, 2,4- Dimethylphenol, 2,6-dimethylphenol, 2,3,5-trimethylphenol, 2,3,6-trimethylphenol, 2-t-butylphenol, 3-t-butylphenol, 4-t-butylphenol, 2-methylresorcinol , 4-methylresorcinol, 5-methylresorcinol, 4-t-butylcatechol, 2-methoxyphenol, 3-methoxyphenol, 2-propylphenol, 3-propylphenol, 4-propylphenol, 2-isopropylphenol, 2- Methoxy-5-methylphenol, 2-t-butyl-5-methylphenol, thymol, isothymol, 4,4′-biphenol, 1-naphthol, 2-naphthol, hydroxyanthracene, hydroxypyrene, 2,6-d
• aldehydes include formaldehyde, paraformaldehyde, trioxane, acetaldehyde, propionaldehyde, benzaldehyde, phenylacetaldehyde, ⁇ -phenylpropionaldehyde, ⁇ -phenylpropionaldehyde, benzaldehyde, 4-biphenylaldehyde, o-hydroxybenzaldehyde, m- hydroxybenzaldehyde, p-hydroxybenzaldehyde, o-chlorobenzaldehyde, m-chlorobenzaldehyde, p-chlorobenzaldehyde, o-methylbenzaldehyde, m-methylbenzaldehyde, p-methylbenzaldehyde, p-ethylbenzaldehyde, 3,4-dimethylbenzaldehyde, pn-propylbenzaldehyde, pn
• ketones include acetone, methyl ethyl ketone, diethyl ketone, acetophenone, diphenyl ketone and the like. These aldehydes and ketones may be used alone or in combination of two or more.
• the novolak resin (A1) used in one embodiment of the present invention a resin obtained by condensation reaction of cresol and aldehydes is preferable, and at least one of meta-cresol and para-cresol and formaldehyde and para-formaldehyde A resin obtained by a condensation reaction with at least one of them is more preferable, and a resin obtained by using both meta-cresol and para-cresol and performing a condensation reaction with at least one of formaldehyde and paraformaldehyde is even more preferable.
• the compounding ratio of the raw materials meta-cresol and para-cresol is preferably 10/90 to 90/10, more preferably 20, in terms of mass ratio. /80 to 80/20, more preferably 50/50 to 70/30.
• the weight average molecular weight (Mw) of the novolak resin (A1) used in one aspect of the present invention is preferably 500 to 30,000, more preferably 1,000 to 20,000, still more preferably 1,000 to 15,000. 000, more preferably 1,000 to 10,000.
• the ethylenically unsaturated resin (A2) used in one aspect of the present invention is not particularly limited, and known resins are used. It may be a resin (A2a) having at least one of the structural units (a2-2) that can be decomposed by the action of acid, base or heat to form an acidic functional group, wherein the structural unit (a2-1) and the structural unit It may be a copolymer having both (a2-2). A resin having at least one of the structural unit (a2-1) and the structural unit (a2-2) can increase the solubility of the compound (B1).
• the total content of the structural unit (a2-1) and the structural unit (a2-2) is based on the total amount (100 mol%) of the structural units of the resin (A2a).
• it is preferably 30 mol % or more, more preferably 50 mol % or more, still more preferably 60 mol % or more, still more preferably 70 mol % or more, and particularly preferably 80 mol % or more.
• the resin (A2a) used in one aspect of the present invention is a copolymer having both the structural unit (a2-1) and the structural unit (a2-2), the structural unit (a2-1) and the structural unit
• the content ratio [(a2-1)/(a2-2)] with (a2-2) is preferably 1/10 to 10/1, more preferably 1/5 to 8/1, in terms of molar ratio. More preferably 1/2 to 6/1, still more preferably 1/1 to 4/1.
• Examples of the phenolic hydroxyl group-containing compound constituting the structural unit (a2-1) include hydroxystyrene (o-hydroxystyrene, m-hydroxystyrene, p-hydroxystyrene), isopropenylphenol (o-isopropenylphenol, m -isopropenylphenol, p-isopropenylphenol), etc., and hydroxystyrene is preferred.
• Examples of acidic functional groups that can be formed by decomposition of the structural unit (a2-2) by the action of acid, base or heat include phenolic hydroxyl groups and carboxyl groups.
• Examples of structural unit monomers capable of forming phenolic hydroxyl groups include p-(1-methoxyethoxy)styrene, p-(1-ethoxyethoxy)styrene, p-(1-n-propoxyethoxy)styrene, p- (1-i-propoxyethoxy)styrene, p-(1-cyclohexyloxyethoxy)styrene, and hydroxy( ⁇ -methyl)styrenes protected with an acetal group such as ⁇ -methyl-substituted products thereof; p-acetoxystyrene , t-butoxycarbonylstyrene, t-butoxystyrene, and ⁇ -methyl-substituted products thereof.
• Examples of structural unit monomers capable of forming a carboxyl group include t-butyl (meth)acrylate, tetrahydropyranyl (meth)acrylate, 2-methoxybutyl (meth)acrylate, and 2-ethoxyethyl (meth)acrylate.
• 2-t-butoxycarbonylethyl (meth)acrylate 2-benzyloxycarbonylethyl (meth)acrylate, 2-phenoxycarbonylethyl (meth)acrylate, 2-cyclohexyloxycarbonyl (meth)acrylate, 2-isobornyloxy
• (meth)acrylates protected with an acid-decomposable ester group such as carbonylethyl (meth)acrylate and 2-tricyclodecanyloxycarbonylethyl (meth)acrylate. These may be used alone or in combination of two or more.
• monomers constituting the structural unit (a2-2) include t-butyl (meth)acrylate, tetrahydropyranyl (meth)acrylate, 2-cyclohexyloxycarbonylethyl (meth)acrylate, and p-(1 -ethoxyethoxy)styrene is preferred.
• the resin (A2a) used in one aspect of the present invention may be a resin having at least one of the structural unit (a2-1) and the structural unit (a2-2) as described above. You may have a structural unit.
• Monomers constituting such other structural units include, for example, alkyl (meth)acrylates; hydroxyl group-containing monomers; epoxy group-containing monomers; alicyclic structure-containing monomers; olefins such as ethylene, propylene and isobutylene; Halogenated olefins such as vinyl and vinylidene chloride; Diene monomers such as butadiene, isoprene and chloroprene; Aromatic vinyl monomers such as styrene, ⁇ -methylstyrene, p-methylstyrene, p-chlorostyrene and p-methoxystyrene ; (meth)acrylonitrile, cyano group-containing vinyl monomers such as vinylidene cyanide; (
• alkyl (meth)acrylate examples include compounds other than the monomer constituting the structural unit (a2-2), such as methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate (n-propyl (meth)acrylate, i-propyl (meth)acrylate) and the like.
• hydroxy-containing monomer examples include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 3-hydroxybutyl ( and hydroxyalkyl (meth)acrylates such as meth)acrylate and 4-hydroxybutyl (meth)acrylate.
• the number of carbon atoms in the alkyl group of the hydroxyalkyl (meth)acrylates is preferably 1 to 10, more preferably 1 to 8, still more preferably 1 to 6, and even more preferably 2 to 4.
• the alkyl group may be a straight chain alkyl group or a branched chain alkyl group.
• epoxy-containing monomer examples include glycidyl (meth)acrylate, ⁇ -methylglycidyl (meth)acrylate, (3,4-epoxycyclohexyl)methyl (meth)acrylate, 3-epoxycyclo-2-hydroxypropyl (meth)acrylate, Epoxy group-containing (meth)acrylic acid esters such as acrylate; glycidyl crotonate, allyl glycidyl ether and the like.
• alicyclic structure-containing monomers examples include cyclopropyl (meth)acrylate, cyclobutyl (meth)acrylate, cyclopentyl (meth)acrylate, cyclohexyl (meth)acrylate, cycloheptyl (meth)acrylate, cyclooctyl (meth)acrylate, and the like.
• the resin (A2a) used in one aspect of the present invention may be a resin having a structural unit derived from adamantyl (meth)acrylate as a structural unit derived from an alicyclic structure-containing monomer.
• the resin corresponds to the resin (A2a) and also to the resin (A2b) described later.
• the resin (A2a) used in one embodiment of the present invention includes a compound having two or more hydroxyl groups in the molecule such as a dihydric or higher polyhydric alcohol, polyether diol, polyester diol, and (meth)acrylic acid.
• Such monomers include, for example, ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate, dipropylene glycol di(meth)acrylate, Tripropylene glycol di(meth)acrylate, butanediol di(meth)acrylate, trimethylolpropane di(meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate , tricyclodecanedimethanol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, N,N'-methylenebis(meth)acrylamide, di(meth)acrylate of ethylene glycol adduct or propyl glycol adduct of bisphenol A and (poly)alkylene glyco
• the weight average molecular weight (Mw) of the resin (A2a) used in one aspect of the present invention is preferably 400 to 50,000, more preferably 1,000 to 40,000, still more preferably 1,000 to 30,000, Even more preferably 1,000 to 25,000.
• the resin (A2) used in one embodiment of the present invention may be a resin (A2b) having a structural unit (b2-1) having an adamantane structure, and may be decomposed by the action of an acid to form an acidic functional group. It is desirable to have structural units. Further, from the viewpoint of solubility in solvents and adhesion to substrates, it is practically preferable to be a copolymer having a structural unit (b2-2) having a lactone structure together with the structural unit (b2-1). .
• At least one of the hydrogen atoms bonded to the carbon atoms forming the adamantane structure of the structural unit (b2-1) may be substituted with a substituent R.
• at least one of the hydrogen atoms bonded to the carbon atoms forming the lactone structure of the structural unit (b2-2) may be substituted with a substituent R.
• substituent R examples include an alkyl group having 1 to 6 carbon atoms, a hydroxyalkyl group having 1 to 6 carbon atoms, a cycloalkyl group having 3 to 6 carbon atoms, a halogen atom (fluorine atom, chlorine atom, bromine atom, iodine atom), deuterium atom, hydroxy group, amino group, nitro group, cyano group, and groups represented by the following formula (i) or (ii).
• R a and R b each independently represent an alkyl group having 1 to 6 carbon atoms, a hydroxyalkyl group having 1 to 6 carbon atoms, or a cyclo It is an alkyl group.
• m is an integer of 1-10, preferably an integer of 1-6, more preferably an integer of 1-3, and still more preferably an integer of 1-2.
• A is an alkylene group having 1 to 6 carbon atoms (preferably 1 to 4 carbon atoms, more preferably 2 to 3 carbon atoms).
• alkylene group examples include methylene group, ethylene group, n-propylene group, i-propylene group, 1,4-butylene group, 1,3-butylene group, tetramethylene group, 1,5-pentylene group, 1 ,4-pentylene group, 1,3-pentylene group and the like.
• the content of the structural unit (b2-1 ⁇ ) having an adamantane structure substituted with a hydroxy group, which is the structural unit (b2-1), is the same as that of the resin (A2b ) is preferably less than 50 mol%, more preferably less than 44 mol%, even more preferably less than 39 mol%, and even more preferably less than 34 mol%, relative to the total amount (100 mol%) of the constituent units of ).
• the structural unit (b2-1) is a structural unit (b2-1-1) represented by the following formula (b2-1-i) or represented by the following formula (b2-1-ii) is preferably a structural unit (b2-1-2).
• each n is independently an integer of 0 to 14, preferably an integer of 0 to 4, more preferably an integer of 0 to 2, and still more preferably an integer of 0 to 1.
• Each R x is independently a hydrogen atom or a methyl group.
• Each R is independently a substituent R that the adamantane structure may have, specifically as described above, preferably an alkyl group having 1 to 6 carbon atoms, and 1 carbon atom More preferably, it is an alkyl group of ⁇ 3.
• Each X 1 is independently a single bond, an alkylene group having 1 to 6 carbon atoms, or a divalent linking group represented by any of the following formulas.
• * 1 indicates the bonding position with the oxygen atom in the above formula (b2-1-i) or (b2-1-ii), * 2 indicates the bonding position with the carbon atom of the adamantane structure show.
• a 1 represents an alkylene group having 1 to 6 carbon atoms.
• the structural unit (b2-2) is a structural unit (b2-2-1) represented by the following formula (b2-2-i), the following formula (b2-2-ii) and a structural unit (b2-2-3) represented by the following formula (b2-2-iii).
• n1 is an integer of 0-5, preferably an integer of 0-2, more preferably an integer of 0-1.
• n2 is an integer of 0-9, preferably an integer of 0-2, more preferably an integer of 0-1.
• n3 is an integer of 0-9, preferably an integer of 0-2, more preferably an integer of 0-1.
• R y is a hydrogen atom or a methyl group.
• Each R is independently a substituent R that the lactone structure may have, specifically as described above, preferably an alkyl group having 1 to 6 carbon atoms, and 1 More preferably, it is an alkyl group of ⁇ 3. When there are multiple R's, the multiple R's may be the same group or different groups.
• X 2 is a single bond, an alkylene group having 1 to 6 carbon atoms, or a divalent linking group represented by any of the following formulas.
• *1 indicates the bonding position with the oxygen atom in the above formula (b2-2-i), (b2-2-ii), or (b2-2-iii), *2 is the lactone Indicates the position of attachment to the carbon atoms of the structure.
• a 1 represents an alkylene group having 1 to 6 carbon atoms.
• the resin (A2b) used in one aspect of the present invention may have other structural units in addition to the structural units (b2-1) and (b2-2).
• other structural units include alkyl (meth)acrylates; hydroxyl group-containing monomers; epoxy group-containing monomers; alicyclic structure-containing monomers; olefins such as ethylene, propylene and isobutylene; Halogenated olefins; diene monomers such as butadiene, isoprene and chloroprene; styrene, ⁇ -methylstyrene, vinyltoluene, acrylonitrile, (meth)acrylamide, (meth)acrylonitrile, (meth)acryloylmorpholine, N-vinylpyrrolidone, etc Structural units derived from monomers of Details of these monomers are the same as those described in the item of resin (A2a).
• the total content of the structural units (b2-1) and (b2-2) is based on the total amount (100 mol%) of the structural units of the resin (A2b) It is preferably 30 to 100 mol%, more preferably 50 to 100 mol%, still more preferably 70 to 100 mol%, even more preferably 80 to 100 mol%, and particularly preferably 90 to 100 mol%.
• the weight average molecular weight (Mw) of the resin (A2b) used in one aspect of the present invention is preferably 400 to 50,000, more preferably 2,000 to 40,000, still more preferably 3,000 to 30,000, Even more preferably 4,000 to 20,000.
• the molecular weight distribution (Mw/Mn) of the resin (A2b) is preferably 6.0 or less, more preferably 5.0 or less, even more preferably 4.0 or less, still more preferably 3.2 or less, and It is preferably 1.01 or more, more preferably 1.05 or more, and still more preferably 1.1 or more.
• the resin (A2) used in one aspect of the present invention includes a structural unit (a2-1) derived from a phenolic hydroxyl group-containing compound, a structural unit that can be decomposed by the action of an acid, a base, or heat to form an acidic functional group ( a2-2), a structural unit (b2-1) having an adamantane structure, and a structural unit (b2-2) having a lactone structure (A2c) having two or more structural units (however, resin (A2a) and resin (A2b)).
• the resin (A2c) is not particularly limited, and known resins are used. -137935, International Patent Publication No. 2021-029395, and International Patent Publication No. 2021-029396 can be applied.
• the weight average molecular weight (Mw) of the resin (A2c) used in one aspect of the present invention is preferably 500 to 50,000, more preferably 2,000 to 40,000, still more preferably 3,000 to 30,000, Even more preferably 4,000 to 20,000.
• the molecular weight distribution (Mw/Mn) of the resin (A2c) is preferably 6.0 or less, more preferably 5.0 or less, even more preferably 4.0 or less, still more preferably 3.2 or less, and It is preferably 1.01 or more, more preferably 1.05 or more, and still more preferably 1.1 or more.
• the high-carbon resin (A3) used in one aspect of the present invention is a resin in which the weight of carbon atoms contained in the resin exceeds 60% of the weight of all elements. Among them, resins with a weight of carbon atoms of more than 70% are preferred, more preferably more than 80%, even more preferably more than 90%. Specific examples of the high-carbon resin (A3) are not particularly limited, but include known resins described in International Publication No. 2020/145406 and the like.
• the weight average molecular weight (Mw) of the resin (A3) used in one aspect of the present invention is preferably 400 to 50,000, more preferably 2,000 to 40,000, still more preferably 3,000 to 30,000, Even more preferably 4,000 to 20,000.
• the molecular weight distribution (Mw/Mn) of the resin (A3) is preferably 6.0 or less, more preferably 5.0 or less, even more preferably 4.0 or less, still more preferably 3.2 or less, and It is preferably 1.01 or more, more preferably 1.05 or more, and still more preferably 1.1 or more.
• the silicon-containing resin (A4) used in one aspect of the present invention is not particularly limited as long as it is a resin containing silicon atoms. Known resins can be mentioned.
• the weight average molecular weight (Mw) of the resin (A4) used in one aspect of the present invention is preferably 400 to 50,000, more preferably 2,000 to 40,000, still more preferably 3,000 to 30,000, Even more preferably 4,000 to 20,000.
• the molecular weight distribution (Mw/Mn) of the resin (A4) is preferably 6.0 or less, more preferably 5.0 or less, even more preferably 4.0 or less, still more preferably 3.2 or less, and It is preferably 1.01 or more, more preferably 1.05 or more, and still more preferably 1.1 or more.
• a resist-auxiliary film composition of one embodiment of the present invention contains a solvent (B) containing a compound (B1) represented by the following general formula (b-1).
• Compound (B1) may be used alone, or two or more of them may be used in combination.
• R 1 is an alkyl group having 1 to 10 carbon atoms.
• the said alkyl group may be a linear alkyl group, and may be a branched alkyl group.
• the alkyl group that can be selected as R 1 includes, for example, methyl group, ethyl group, n-propyl group, i-propyl group, n-butyl group, i-butyl group, s-butyl group, or t-butyl group, pentyl group, hexyl group, heptyl group, octyl group, 2-ethylhexyl group, nonyl group, decyl group and the like.
• R 1 in the general formula (b-1) is a methyl group, an ethyl group, an n-propyl group, an i-propyl group, an n-butyl group, an i-butyl group. , s-butyl group, or t-butyl group is preferred, and ethyl group, n-propyl group, i-propyl group, n-butyl group, i-butyl group, s-butyl group, or t-butyl group is more preferred.
• n-propyl group, i-propyl group, n-butyl group, i-butyl group, s-butyl group, or t-butyl group is more preferable, i-propyl group, n-butyl group, or i-butyl group is even more preferred.
• the resist-auxiliary film composition of one embodiment of the present invention may contain a solvent (B2) other than the compound (B1) as the component (B).
• the solvent (B2) include lactones such as ⁇ -butyrolactone; ketones such as acetone, methyl ethyl ketone, cyclohexanone, methyl-n-pentyl ketone, methyl isopentyl ketone and 2-heptanone; ethylene glycol, diethylene glycol and propylene glycol.
• Polyhydric alcohols such as dipropylene glycol; Ethylene glycol monoacetate, diethylene glycol monoacetate, propylene glycol monoacetate, compounds having an ester bond such as dipropylene glycol monoacetate; Said polyhydric alcohols such as 1-methoxy 2-propanol compounds having an ether bond such as monomethyl ether, monoethyl ether, monopropyl ether, monobutyl ether, etc.
• cyclic ethers such as dioxane, and lactic acid methyl, ethyl lactate, methyl acetate, ethyl acetate, butyl acetate, methyl pyruvate, ethyl pyruvate, methyl ⁇ -methoxyisobutyrate, methyl ⁇ -methoxyisobutyrate, ethyl 2-ethoxyisobutyrate, methyl methoxypropionate, ethyl ethoxypropionate, Esters other than compound (B1) such as methyl ⁇ -formyloxyisobutyrate, methyl ⁇ -formyloxyisobutyrate, and methyl 3-hydroxyisobutyrate; anisole, ethylbenzyl ether, cresyl methyl ether, diphenyl ether, dibenzyl ether, aromatic organic solvents such as phenetole, butylpheny
• the content of compound (B1) in component (B) is Preferably 20 to 100% by mass, more preferably 30 to 100% by mass, still more preferably 50 to 100% by mass, and still more It is preferably 60 to 100% by mass, particularly preferably 70 to 100% by mass.
• the component (B) used in one aspect of the present invention includes methyl ⁇ -methoxyisobutyrate, methyl ⁇ -formyloxyisobutyrate, methyl ⁇ -acetyloxyisobutyrate, methyl 3-hydroxyisobutyrate, and 1-methoxy-2-propanol is preferably contained from the viewpoint of the solubility of the acid generator used in the resist-auxiliary film composition.
• the inclusion of methyl ⁇ -methoxyisobutyrate is preferable from the viewpoint of the solubility of the resin used in the resist-auxiliary film composition.
• methyl ⁇ -formyloxyisobutyrate and methyl ⁇ -acetyloxyisobutyrate is preferable from the viewpoint of increasing the thickness of the resist film in which the resin used in the resist-auxiliary film composition is soluble.
• Containing methyl 3-hydroxyisobutyrate is preferable from the viewpoint of obtaining a coating film having a good surface condition in high-temperature baking.
• Containing 1-methoxy-2-propanol is preferable from the viewpoint of obtaining a coating film with high in-plane uniformity.
• the method for mixing methyl ⁇ -methoxyisobutyrate, methyl ⁇ -formyloxyisobutyrate, methyl ⁇ -acetyloxyisobutyrate, methyl 3-hydroxyisobutyrate, or 1-methoxy-2-propanol is not particularly limited, but the compound ( A method of adding methyl ⁇ -methoxyisobutyrate, methyl ⁇ -formyloxyisobutyrate, methyl ⁇ -acetyloxyisobutyrate, methyl 3-hydroxyisobutyrate, or 1-methoxy-2-propanol to B1); It can be contained by either a method of mixing as a by-product or being mixed in the manufacturing process.
• the content of the solvent (B2) is not limited, but based on the total amount (100% by mass) of the compound (B1), from the viewpoint of improving productivity by shortening the drying time of the coating film, it is preferably less than 100% by mass, and 70% by mass. % or less, 60% by mass or less, 50% by mass or less, 40% by mass or less, 30% by mass or less, 20% by mass or less, 10% by mass or less, from the viewpoint of increasing the dissolving power of the solvent while ensuring an appropriate drying time, 5 It is more preferably 1% by mass or less, further preferably 0.1% by mass or less, and particularly preferably 0.01% by mass or less.
• the content of methyl ⁇ -methoxyisobutyrate, methyl ⁇ -formyloxyisobutyrate, methyl ⁇ -acetyloxyisobutyrate, methyl 3-hydroxyisobutyrate, or 1-methoxy-2-propanol is not limited, but the resist auxiliary film Based on the total amount (100% by mass) of the composition, it is preferably less than 100% by mass from the viewpoint of improving productivity by shortening the drying time of the coating film, 70% by mass or less, 60% by mass or less, 50% by mass or less, 40% by mass.
• mass % or less 20 mass % or less, 10 mass % or less, 5 mass % or less, and 1 mass % or less are more preferable, 0.1 mass % or less is more preferable, and 0.01 mass % or less is particularly preferable. It is preferably 0.0001% by mass or more from the viewpoint of improving the storage stability of the resist-auxiliary film composition, and more preferably 0.001% by mass or more from the viewpoint of improving the solubility of the active ingredient of the resist-auxiliary film composition. From the viewpoint of suppressing defects in the film, it is more preferably 0.01% by mass or more.
• the content of methyl ⁇ -methoxyisobutyrate, methyl ⁇ -formyloxyisobutyrate, methyl ⁇ -acetyloxyisobutyrate, methyl 3-hydroxyisobutyrate, or 1-methoxy-2-propanol is the total amount of compound (B1) ( 100% by mass), preferably 100% by mass or less from the viewpoint of improving productivity by shortening the drying time of the resist-auxiliary film composition, 70% by mass or less, 60% by mass or less, 50% by mass or less, 40% by mass or less, 30% by mass or less, 20% by mass or less, 10% by mass or less, 5% by mass or less, or 1% by mass or less is more preferable, 0.1% by mass or less is more preferable, and 0.01% by mass or less is particularly preferable.
• the content of 1-methoxy-2-propanol should be 1 to 98% by mass based on the total amount (100% by mass) of the resist-assisting film composition from the viewpoint of in-plane uniformity of the coating film. is also preferred, and 16 to 98% by mass is more preferred. It is also preferably 1 to 99% by mass, more preferably 30 to 99% by mass, based on the total amount (100% by mass) of compound (B1).
• the solvent (B2) is one selected from the group consisting of methyl ⁇ -formyloxyisobutyrate, methyl ⁇ -acetyloxyisobutyrate, and methyl 3-hydroxyisobutyrate. Embodiments including more than one are also preferred.
• the content of component (B) is appropriately set according to the application. 54% by mass or more, 58% by mass or more, 60% by mass or more, 65% by mass or more, 69% by mass or more, 74% by mass or more, 77% by mass or more, 80% by mass or more, 82% by mass or more, 84% by mass or more, It can be 88% by mass or more, 90% by mass or more, 94% by mass or more, or 97% by mass or more.
• the upper limit of the content of the component (B) is appropriately set in accordance with the content of the component (A), but is 99% by mass or less based on the total amount (100% by mass) of the resist-auxiliary film composition.
• the content of the component (B) can be appropriately selected from the options for the upper limit and the lower limit described above, and can be defined by any combination.
• the resist-auxiliary film composition of one aspect of the present invention preferably contains at least one additive (C) selected from photosensitizers and acid generators.
• component (C) may be used independently and may use 2 or more types together.
• the content of component (C) is preferably 0.01 to 80 mass parts with respect to 100 mass parts of resin (A) contained in the resist-auxiliary film composition. parts, more preferably 0.05 to 65 parts by mass, still more preferably 0.1 to 50 parts by mass, and even more preferably 0.5 to 30 parts by mass.
• the photosensitive agent and acid generator contained as component (C) are described below.
• the photosensitive agent that can be selected as component (C) is not particularly limited as long as it is generally used as a photosensitive component in resist-auxiliary film compositions. Those used in resist compositions can also be used.
• the photosensitizers may be used alone or in combination of two or more.
• Examples of the photosensitizer used in one embodiment of the present invention include a reaction product of an acid chloride and a compound having a functional group (hydroxyl group, amino group, etc.) capable of condensing with the acid chloride.
• acid chlorides include naphthoquinonediazide sulfonyl chloride and benzoquinonediazide sulfonyl chloride, and specific examples include 1,2-naphthoquinonediazide-5-sulfonyl chloride and 1,2-naphthoquinonediazide-4-sulfonyl chloride. is mentioned.
• Examples of compounds having functional groups that can be condensed with acid chlorides include hydroquinone, resorcinol, 2,4-dihydroxybenzophenone, 2,3,4-trihydroxybenzophenone, 2,4,6-trihydroxybenzophenone, 2,4 ,4'-trihydroxybenzophenone, 2,3,4,4'-tetrahydroxybenzophenone, 2,2',4,4'-tetrahydroxybenzophenone, 2,2',3,4,6'-pentahydroxybenzophenone Hydroxybenzophenones such as bis(2,4-dihydroxyphenyl)methane, bis(2,3,4-trihydroxyphenyl)methane, bis(2,4-dihydroxyphenyl)propane and other hydroxyphenylalkanes, 4, 4′,3′′,4′′-tetrahydroxy-3,5,3′,5′-tetramethyltriphenylmethane, 4,4′,2′′,3′′,4′′-pentahydroxy-3,5,3 and hydroxytriphen
• DTEP-350 a diazonaphthoquinone type photosensitizer manufactured by Daito Chemix Co., Ltd.
• DTEP-350 a diazonaphthoquinone type photosensitizer manufactured by Daito Chemix Co., Ltd.
• the acid generator that can be selected as component (C) can be obtained by heating or irradiation with radiation such as visible light, ultraviolet light, excimer lasers, electron beams, extreme ultraviolet (EUV), X-rays, and ion beams. Any compound can be used as long as it can directly or indirectly generate an acid.
• radiation such as visible light, ultraviolet light, excimer lasers, electron beams, extreme ultraviolet (EUV), X-rays, and ion beams. Any compound can be used as long as it can directly or indirectly generate an acid.
• compounds represented by any one of the following general formulas (c-1) to (c-8) are preferred.
• each R 13 is independently a hydrogen atom, a linear, branched or cyclic alkyl group, a linear, branched or cyclic alkoxy group, a hydroxyl group, or a halogen atom.
• X - is a sulfonate or halide ion having an alkyl group, an aryl group, a halogen-substituted alkyl group, or a halogen-substituted aryl group.
• Examples of the compound represented by the general formula (c-1) include triphenylsulfonium trifluoromethanesulfonate, triphenylsulfonium nonafluoro-n-butanesulfonate, diphenyltolylsulfonium nonafluoro-n-butanesulfonate, triphenylsulfonium perfluoro -n-octane sulfonate, diphenyl-4-methylphenylsulfonium trifluoromethanesulfonate, di-2,4,6-trimethylphenylsulfonium trifluoromethanesulfonate, diphenyl-4-t-butoxyphenylsulfonium trifluoromethanesulfonate, diphenyl-4-t -butoxyphenylsulfonium trifluoromethanesulfonate, diphenyl-4-t -butoxyphenylsulfonium nona
• each R 14 is independently a hydrogen atom, a linear, branched or cyclic alkyl group, a linear, branched or cyclic alkoxy group, a hydroxyl group, or a halogen atom.
• X - is a sulfonate or halide ion having an alkyl group, an aryl group, a halogen-substituted alkyl group, or a halogen-substituted aryl group.
• Examples of the compound represented by the general formula (c-2) include bis(4-t-butylphenyl)iodonium trifluoromethanesulfonate, bis(4-t-butylphenyl)iodonium nonafluoro-n-butanesulfonate, bis( 4-t-butylphenyl)iodonium perfluoro-n-octanesulfonate, bis(4-t-butylphenyl)iodonium p-toluenesulfonate, bis(4-t-butylphenyl)iodonium benzenesulfonate, bis(4-t- Butylphenyl)iodonium-2-trifluoromethylbenzenesulfonate, bis(4-t-butylphenyl)iodonium-4-trifluoromethylbenzenesulfonate, bis(4-t-butylphenyl)iodonium-2,4-
• Q is an alkylene group, an arylene group, or an alkoxylene group.
• R 15 is an alkyl group, an aryl group, a halogen-substituted alkyl group, or a halogen-substituted aryl group.
• Examples of the compound represented by the general formula (c-3) include N-(trifluoromethylsulfonyloxy)succinimide, N-(trifluoromethylsulfonyloxy)phthalimide, N-(trifluoromethylsulfonyloxy)diphenylmaleimide, N-(trifluoromethylsulfonyloxy)bicyclo[2.2.1]hept-5-ene-2,3-dicarboximide, N-(trifluoromethylsulfonyloxy)naphthylimide, N-(10-camphor sulfonyloxy)succinimide, N-(10-camphorsulfonyloxy)phthalimide, N-(10-camphorsulfonyloxy)diphenylmaleimide, N-(10-camphorsulfonyloxy)bicyclo[2.2.1]hept-5- ene-2,3-dicarboximide, N-(10-camphor
• each R 16 is independently a linear, branched or cyclic alkyl group, aryl group, heteroaryl group or aralkyl group, and at least one of these groups Hydrogen may be substituted by any substituent.
• Examples of the compound represented by the general formula (c-4) include diphenyldisulfone, di(4-methylphenyl)disulfone, dinaphthyldisulfone, di(4-t-butylphenyl)disulfone, di(4-hydroxy phenyl)disulfone, di(3-hydroxynaphthyl)disulfone, di(4-fluorophenyl)disulfone, di(2-fluorophenyl)disulfone, and di(4-trifluoromethylphenyl)disulfone.
• One type is preferred.
• each R 17 is independently a linear, branched or cyclic alkyl group, aryl group, heteroaryl group or aralkyl group, and at least one of these groups Hydrogen may be substituted by any substituent.
• Examples of the compound represented by the general formula (c-5) include ⁇ -(methylsulfonyloxyimino)-phenylacetonitrile, ⁇ -(methylsulfonyloxyimino)-4-methoxyphenylacetonitrile, ⁇ -(trifluoromethylsulfonyl oximino)-phenylacetonitrile, ⁇ -(trifluoromethylsulfonyloxyimino)-4-methoxyphenylacetonitrile, ⁇ -(ethylsulfonyloxyimino)-4-methoxyphenylacetonitrile, ⁇ -(propylsulfonyloxyimino)-4- It is preferably at least one selected from the group consisting of methylphenylacetonitrile and ⁇ -(methylsulfonyloxyimino)-4-bromophenylacetonitrile.
• each R 18 is independently a halogenated alkyl group having one or more chlorine atoms and one or more bromine atoms.
• the number of carbon atoms in the halogenated alkyl group is preferably 1-5.
• R 19 and R 20 are each independently an alkyl group having 1 to 3 carbon atoms (methyl group, ethyl group, n-propyl group, i-propyl group, etc.), a cycloalkyl group having 3 to 6 carbon atoms (cyclopentyl group, cyclohexyl group, etc.), an alkoxyl group having 1 to 3 carbon atoms (methoxy group, ethoxy group, propoxy group, etc.), or an aryl group having 6 to 10 carbon atoms. group (phenyl group, toluyl group, naphthyl group), preferably an aryl group having 6 to 10 carbon atoms.
• L 19 and L 20 are each independently an organic group having a 1,2-naphthoquinonediazide group, specifically a 1,2-naphthoquinonediazide-4-sulfonyl group, a 1,2-naphthoquinonediazide- 1,2-quinonediazide sulfonyl groups such as 5-sulfonyl group and 1,2-naphthoquinonediazide-6-sulfonyl group are preferred, and 1,2-naphthoquinonediazide-4-sulfonyl group or 1,2-naphthoquinonediazide-5- A sulfonyl group is more preferred.
• J 19 is a single bond, an alkylene group having 1 to 4 carbon atoms, a cycloalkylene group having 3 to 6 carbon atoms, a phenylene group, a group represented by the following formula (c-7-i), a carbonyl group, an ester group, It is an amide group or -O-.
• Y 19 is a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or an aryl group having 6 to 10 carbon atoms, and each X 20 is independently represented by the following formula (c-8-i) is the base.
• each Z 22 is independently an alkyl group having 1 to 6 carbon atoms, a cycloalkyl group having 3 to 6 carbon atoms, or an aryl group having 6 to 10 carbon atoms.
• Each R 22 is independently an alkyl group having 1 to 6 carbon atoms, a cycloalkyl group having 3 to 6 carbon atoms, or an alkoxyl group having 1 to 6 carbon atoms, and r is an integer of 0 to 3.
• acid generators other than the compounds represented by any of the general formulas (c-1) to (c-8) may be used.
• examples of such other acid generators include bis(p-toluenesulfonyl)diazomethane, bis(2,4-dimethylphenylsulfonyl)diazomethane, bis(tert-butylsulfonyl)diazomethane, bis(n-butylsulfonyl).
• Diazomethane bis(isobutylsulfonyl)diazomethane, bis(isopropylsulfonyl)diazomethane, bis(n-propylsulfonyl)diazomethane, bis(cyclohexylsulfonyl)diazomethane, bis(isopropylsulfonyl)diazomethane, 1,3-bis(cyclohexylsulfonylazomethylsulfonyl) ) bissulfonyldiazomethanes such as propane, 1,4-bis(phenylsulfonylazomethylsulfonyl)butane, 1,6-bis(phenylsulfonylazomethylsulfonyl)hexane, 1,10-bis(cyclohexylsulfonylazomethylsulfonyl)decane , 2-(4-methoxyphenyl)
• the resist-auxiliary film composition of one embodiment of the present invention may contain components other than the components (A) to (C) described above.
• Other components include, for example, one selected from acid cross-linking agents, acid diffusion controllers, dissolution accelerators, dissolution controllers, sensitizers, surfactants, organic carboxylic acids, phosphorus oxoacids, derivatives thereof, and the like. The above are mentioned.
• the content of each of these other components is appropriately selected depending on the type of component and the type of resin (A). , preferably 0.001 to 100 parts by mass, more preferably 0.01 to 70 parts by mass, still more preferably 0.1 to 50 parts by mass, and even more preferably 0.3 to 30 parts by mass.
• the acid cross-linking agent may be any compound having a cross-linkable group capable of cross-linking with the resin (A), and is appropriately selected depending on the type of the resin (A).
• Examples of acid crosslinking agents used in one embodiment of the present invention include methylol group-containing compounds such as methylol group-containing melamine compounds, methylol group-containing benzoguanamine compounds, methylol group-containing urea compounds, methylol group-containing glycoluril compounds, and methylol group-containing phenol compounds.
• alkoxyalkyl group-containing compounds such as alkoxyalkyl group-containing melamine compounds, alkoxyalkyl group-containing benzoguanamine compounds, alkoxyalkyl group-containing urea compounds, alkoxyalkyl group-containing glycoluril compounds, alkoxyalkyl group-containing phenol compounds; carboxymethyl group-containing melamine carboxymethyl group-containing compounds such as compounds, carboxymethyl group-containing benzoguanamine compounds, carboxymethyl group-containing urea compounds, carboxymethyl group-containing glycoluril compounds, and carboxymethyl group-containing phenol compounds; bisphenol A type epoxy compounds, bisphenol F type epoxy compounds, epoxy compounds such as bisphenol S-type epoxy compounds, novolak resin-type epoxy compounds, resol resin-type epoxy compounds, poly(hydroxystyrene)-type epoxy compounds; These acid cross-linking agents may be used alone or in combination of two or more.
• the acid diffusion control agent is an additive that controls the diffusion of the acid generated from the acid generator in the resist auxiliary film to prevent undesirable chemical reactions.
• the acid diffusion control agent used in one aspect of the present invention is not particularly limited, and examples thereof include radiolytic basic compounds such as nitrogen atom-containing basic compounds, basic sulfonium compounds, and basic iodonium compounds. These acid diffusion controllers may be used alone or in combination of two or more.
• the dissolution accelerator is an additive that enhances the solubility of the resin (A) in a developer and moderately increases the dissolution rate of the resin (A) during development.
• the dissolution accelerator used in one aspect of the present invention is not particularly limited, and examples thereof include phenolic compounds such as bisphenols and tris(hydroxyphenyl)methane. These dissolution accelerators may be used alone or in combination of two or more.
• the dissolution controller is an additive that has the effect of controlling the solubility of the resin (A) in the developing solution to moderately decrease the dissolution rate during development when the solubility of the resin (A) in the developer is too high.
• the dissolution controller used in one embodiment of the present invention is not particularly limited, but examples include aromatic hydrocarbons such as phenanthrene, anthracene, and acenaphthene; ketones such as acetophenone, benzophenone, and phenylnaphthyl ketone; Examples include sulfones such as diphenylsulfone and dinaphthylsulfone. These dissolution control agents may be used alone or in combination of two or more.
• sensitizer is an additive that absorbs the energy of irradiated radiation and transmits the energy to the acid generator, thereby increasing the amount of acid produced. It is also an additive having a function of absorbing light of a specific wavelength. Examples of the sensitizer used in one embodiment of the present invention include benzophenones, biacetyls, pyrenes, phenothiazines, fluorenes and the like. These sensitizers may be used alone or in combination of two or more.
• Surfactants are additives that improve the coatability and striation of the resist-auxiliary film composition, the developability of the resist-auxiliary film composition, and the like.
• Surfactants used in one aspect of the present invention may be any of anionic surfactants, cationic surfactants, nonionic surfactants, and amphoteric surfactants. is preferred.
• nonionic surfactants include polyoxyethylene higher alkyl ethers, polyoxyethylene higher alkylphenyl ethers, and higher fatty acid diesters of polyethylene glycol. These surfactants may be used alone or in combination of two or more.
• Organic carboxylic acid or phosphorus oxo acid or derivative thereof is an additive that has an effect of preventing deterioration of sensitivity or improving resist pattern shape, storage stability and the like.
• the organic carboxylic acid used in one embodiment of the present invention is not particularly limited, and examples thereof include malonic acid, citric acid, malic acid, succinic acid, benzoic acid, and salicylic acid.
• Examples of phosphorus oxoacids or derivatives thereof include phosphoric acid, phosphoric acid such as di-n-butyl phosphoric acid and diphenyl phosphoric acid, derivatives such as phosphoric acid and esters thereof, phosphonic acid, dimethyl phosphonate, Phosphonic acid such as di-n-butyl phosphonic acid, phenylphosphonic acid, diphenyl phosphonic acid, dibenzyl phosphonic acid, derivatives such as esters thereof, phosphinic acid such as phosphinic acid, phosphinic acid such as phenylphosphinic acid and esters thereof, etc. derivatives of These may be used alone or in combination of two or more.
• the resist-assisting film composition of one aspect of the present invention contains dyes, pigments, adhesion aids, antihalation agents, storage stabilizers, antifoaming agents, shape modifiers, etc., in addition to the other components described above. You may
• one of the present embodiments is a pattern forming method, and the pattern forming method includes a step (A-1) of forming a resist underlayer film on a substrate using the resist-auxiliary film composition of the present embodiment. a step (A-2) of forming at least one photoresist layer on the resist underlayer film; and after the step (A-2), irradiating a predetermined region of the photoresist layer with radiation. , and a step (A-3) of performing development.
• the resist-auxiliary film composition of one aspect of the present invention is a thick-film resist suitable for manufacturing various devices, although the content of active ingredients including resin is limited to a predetermined value or less.
• An auxiliary film here, a resist underlayer film may be formed.
• the step of forming a resist underlayer film using the resist auxiliary film composition of the present embodiment (B- 1), forming a resist intermediate layer film on the resist underlayer film (B-2), and forming at least one photoresist layer on the resist intermediate layer film (B-3).
• the resist intermediate layer film is etched using the resist pattern as a mask
• the resist underlayer film is etched using the obtained resist intermediate layer film pattern as an etching mask
• the substrate is etched using the obtained resist underlayer film pattern as an etching mask.
• the formation method is not particularly limited, and known techniques can be applied.
• the organic solvent is volatilized to remove the resist underlayer.
• a film can be formed.
• the baking temperature is not particularly limited, but is preferably in the range of 80 to 600.degree. C., more preferably 200 to 400.degree.
• the baking time is not particularly limited, but is preferably within the range of 10 to 300 seconds.
• the thickness of the resist underlayer film can be appropriately selected according to the required performance, and is not particularly limited. , more preferably 50 to 1000 nm.
• a single-layer resist layer can be formed thereon when using an antireflection film for KrF excimer laser or ArF excimer laser or a photoresist underlayer film material for EUV lithography.
• an antireflection film for KrF excimer laser or ArF excimer laser or a photoresist underlayer film material for EUV lithography preferable.
• a known photoresist material can be used for forming this resist layer.
• a silicon-containing resist material for a two-layer process from the viewpoint of oxygen gas etching resistance, a silicon atom-containing polymer such as a polysilsesquioxane derivative or a vinylsilane derivative is used as a base polymer, and an organic solvent, an acid generator, A positive photoresist material containing a basic compound or the like, if necessary, is preferably used.
• the silicon atom-containing polymer a known polymer used in this type of resist material can be used.
• a polysilsesquioxane-based intermediate layer is preferably used as the silicon-containing intermediate layer for the three-layer process. Reflection tends to be effectively suppressed by providing the intermediate layer with an antireflection film effect. For example, in the 193 nm exposure process, if a material containing many aromatic groups and having high substrate etching resistance is used as the resist underlayer film, the k value tends to increase and the substrate reflection tends to increase, but the intermediate layer suppresses the reflection. By doing so, the substrate reflection can be reduced to 0.5% or less.
• the intermediate layer having such an antireflection effect is not limited to the following, but for 193 nm exposure, an acid- or heat-crosslinkable polysilsesquioxylate having a phenyl group or a silicon-silicon bond-containing light-absorbing group is introduced. Sun is preferably used.
• An intermediate layer formed by a Chemical Vapor Deposition (CVD) method can also be used.
• a SiON film is known as an intermediate layer that is highly effective as an antireflection film produced by a CVD method.
• forming an intermediate layer by a wet process such as a spin coating method or screen printing is simpler and more cost effective than a CVD method.
• the upper layer resist in the three-layer process may be either positive type or negative type, and may be the same as a commonly used single layer resist.
• a wet process such as spin coating or screen printing is preferably used, as in the case of forming the resist underlayer film.
• prebaking is usually performed, and it is preferable to perform this prebaking at 80 to 180° C. for 10 to 300 seconds.
• exposure, post-exposure baking (PEB), and development are carried out according to a conventional method, whereby a resist pattern can be obtained.
• the thickness of the resist film is not particularly limited, it is generally preferably 10 to 50,000 nm, more preferably 20 to 20,000 nm, still more preferably 50 to 15,000 nm.
• the exposure light may be appropriately selected and used according to the photoresist material to be used.
• high-energy rays with a wavelength of 300 nm or less, specifically excimer lasers of 248 nm, 193 nm and 157 nm, soft X-rays of 3 to 20 nm, electron beams, X-rays and the like can be used.
• etching is performed using the obtained resist pattern as a mask.
• Gas etching is preferably used for etching the resist underlayer film in the two-layer process.
• oxygen gas is suitable.
• inert gases such as He and Ar, and CO, CO2 , NH3 , SO2, N2 , NO2 and H2 gases.
• Gas etching can also be performed using only CO, CO 2 , NH 3 , N 2 , NO 2 and H 2 gases without using oxygen gas.
• the latter gas is preferably used for sidewall protection to prevent undercutting of pattern sidewalls.
• gas etching is also preferably used for etching the intermediate layer in the three-layer process.
• the gas etching the same one as described in the above two-layer process can be applied.
• a silicon oxide film, a silicon nitride film, or a silicon oxynitride film is formed by a CVD method, an ALD method, or the like.
• the method for forming the nitride film is not limited to the following, for example, the methods described in JP-A-2002-334869 and WO2004/066377 can be used.
• a photoresist film can be formed directly on such a resist intermediate layer film. may be formed.
• a polysilsesquioxane-based intermediate layer is also preferably used as the intermediate layer. Reflection tends to be effectively suppressed by giving the resist intermediate layer film an effect as an antireflection film.
• specific materials for the polysilsesquioxane-based intermediate layer are not limited to the following, for example, those described in JP-A-2007-226170 and JP-A-2007-226204 can be used.
• Etching of the next substrate can also be carried out by a conventional method.
• the substrate is SiO 2 or SiN
• etching mainly using Freon-based gas; Gas-based etching can be performed.
• the substrate is etched with a flon-based gas
• the silicon-containing resist in the two-layer resist process and the silicon-containing intermediate layer in the three-layer process are stripped off at the same time as the substrate is processed.
• the substrate is etched with a chlorine-based or bromine-based gas
• the silicon-containing resist layer or the silicon-containing intermediate layer is removed separately, and generally, after the substrate is processed, the dry-etching removal is performed with a flon-based gas. .
• the resist underlayer film according to this embodiment is characterized by excellent etching resistance for these substrates.
• the substrate can be appropriately selected and used from known substrates, and is not particularly limited, but examples include Si, ⁇ -Si, p-Si, SiO 2 , SiN, SiON, W, TiN, and Al. .
• the substrate may also be a laminate having a film to be processed (substrate to be processed) on a base material (support).
• Such films to be processed include various Low-k films such as Si, SiO 2 , SiON, SiN, p-Si, ⁇ -Si, W, W-Si, Al, Cu, and Al-Si, and their stopper films.
• the thickness of the substrate to be processed or the film to be processed is not particularly limited, but is generally preferably about 50 to 1,000,000 nm, more preferably 75 to 500,000 nm.
• a method for forming a pattern according to another embodiment of the present invention comprises a step (B-1) of forming a resist underlayer film on a substrate; The step (B-2) of forming a resist intermediate layer film using the step (B-3) of forming at least one photoresist layer on the resist intermediate layer film, and the step (B-3 ), a step (B-4) of irradiating a predetermined region of the photoresist layer with radiation and developing to form a resist pattern, and after the step (B-4), using the resist pattern as a mask.
• the resist intermediate layer film is etched, the resist underlayer film is etched using the obtained resist intermediate layer film pattern as an etching mask, and the substrate is etched using the obtained resist underlayer film pattern as an etching mask, thereby forming a pattern on the substrate. and a step of forming (B-5).
• film thickness of coating film The film thickness of the coating film formed from the resist-auxiliary film composition was measured using a film thickness measurement system (equipment name "F20” manufactured by Filmetrics) at a temperature of 23°C and a humidity of 50%. (relative humidity) in a constant temperature and constant humidity room.
• a film thickness measurement system equipment name "F20” manufactured by Filmetrics
• Solvents used in the following examples and comparative examples are as follows.
• HBM methyl 2-hydroxyisobutyrate, a compound in which R1 is a methyl group in the general formula (b-1).
• iPHIB isopropyl 2-hydroxyisobutyrate, a compound in which R 1 is an i-propyl group in the general formula (b-1).
• iBHIB isobutyl 2-hydroxyisobutyrate, a compound in which R 1 is an i-butyl group in the general formula (b-1).
• nBHIB n-butyl 2-hydroxyisobutyrate, a compound in which R1 is an n-butyl group in the general formula (b-1).
• resist-auxiliary film compositions having concentrations of active ingredients (the cresol novolak resin and the photosensitizer) shown in Tables 1 and 2 were prepared. Then, the prepared resist-assisting film composition is spin-coated on a silicon wafer at 1600 rpm to form a coating film, and the coating film is pre-baked at 110° C. for 90 seconds to form a resist-assisting film. was formed, and the film thickness at 5 arbitrarily selected locations on the resist auxiliary film was measured, and the average value of the film thicknesses at the 5 locations was calculated as the average film thickness. The results are shown in Tables 1 and 2.
• the resist-auxiliary film compositions prepared in Examples 1a to 14a form thicker resist-auxiliary films than the resist-auxiliary film compositions of Comparative Examples 1b to 6b having similar resin content concentrations. i know i can get it.
• the resist-auxiliary film compositions prepared in Examples 15a to 47a can form thick resist-auxiliary films even though the novolac resin content is as low as 20 to 25% by mass. I understand.
• the prepared resist-assisting film composition is spin-coated on a silicon wafer at 1600 rpm to form a coating film, and the coating film is pre-baked at 110° C. for 90 seconds to form a resist-assisting film. was formed, and the film thickness at five arbitrarily selected locations on the resist auxiliary film was measured, and the average value of the film thicknesses at the five locations was calculated as the average film thickness. Tables 3 and 4 show the results.
• the resist-auxiliary film compositions prepared in Examples 1b to 35b formed thicker auxiliary film resist films than the resist-auxiliary film compositions of Comparative Examples 1b to 19b having the same resin concentration. It turns out that it can be formed.
• EADM 2-ethyl-2-adamantyl methacrylate
• MADM 2-methyl-2-adamantyl methacrylate
• NML 2-methacryloyloxy-4-oxatricyclo[4.2.1.0 3.7 ]nonane-5- ON
• GBLM ⁇ -methacryloyloxy- ⁇ -butyrolactone
• HADM 3-hydroxy-1-adamantyl methacrylate
• Examples 1c-18c, Comparative Examples 1c-12c Any of the ethylenically unsaturated resins (i) to (vi) obtained in Synthesis Examples 1 to 6 above is mixed with solvents of the types shown in Tables 7 and 8, and the active ingredients shown in Tables 7 and 8 ( Resist-auxiliary film compositions having concentrations of ethylenically unsaturated resins (i) to (vi)) were prepared. Then, the prepared resist-assisting film composition is spin-coated on a silicon wafer at 3000 rpm to form a coating film, and the coating film is pre-baked at 90° C. for 60 seconds to form a resist-assisting film. was formed, and the film thickness at five arbitrarily selected locations on the resist auxiliary film was measured, and the average value of the film thicknesses at the five locations was calculated as the average film thickness. The results are shown in Tables 7 and 8.
• the resist-auxiliary film compositions prepared in Examples 1c to 18c form thicker resist-auxiliary films than the resist-auxiliary film compositions of Comparative Examples 1c to 12c having the same resin concentration. I know it can be done.
• Underlayer film compositions were prepared so as to have the compositions shown in Table 9. The following polymers, acid generators, cross-linking agents and organic solvents were used.
• TMOM-BP compound represented by the following formula
• Example 1d the underlayer film composition prepared in Example 1d was coated on a SiO2 substrate with a thickness of 300 nm and baked at 240° C. for 60 seconds and further at 400° C. for 120 seconds to form an underlayer film with a thickness of 85 nm. formed.
• An ArF resist solution was applied onto the underlayer film and baked at 130° C. for 60 seconds to form a photoresist layer with a film thickness of 140 nm.
• the ArF resist solution contains 5 parts by mass of a resin represented by the following formula (1d), 1 part by mass of triphenylsulfonium nonafluoromethanesulfonate, 2 parts by mass of tributylamine, and 92 parts by mass of PGMEA. I used the one prepared by
• the resin of formula (1d) below was prepared as follows. That is, 4.15 g of 2-methyl-2-methacryloyloxyadamantane, 3.00 g of methacryloyloxy- ⁇ -butyrolactone, 2.08 g of 3-hydroxy-1-adamantyl methacrylate, and 0.38 g of azobisisobutyronitrile were added to tetrahydrofuran. It was made to melt
• Example 1d A photoresist layer was formed directly on the SiO 2 substrate in the same manner as in Example 1d, except that no resist underlayer film was formed, to obtain a positive resist pattern.
• Example 1d and Comparative Example 1d For each of Example 1d and Comparative Example 1d, the shapes of the obtained 40 nm L/S (1:1) and 80 nm L/S (1:1) resist patterns were observed with an electron microscope "S-4800" manufactured by Hitachi, Ltd. was observed using The shape of the resist pattern after development was evaluated as "good” when there was no pattern collapse and good rectangularity, and as "bad” when it was not. Further, as a result of the observation, the minimum line width with good rectangularity without pattern collapse was used as an index for evaluation as resolution. Furthermore, the sensitivity was defined as the minimum energy amount of electron beams that enables drawing of a good pattern shape, and this was used as an index for evaluation. Table 10 shows the results.
• Example 1d As is clear from Table 10, it was confirmed that the resist pattern in Example 1d was significantly superior in both resolution and sensitivity compared to Comparative Example 1d. Such results are considered to be due to the influence of the resist-auxiliary film composition that enhances the adhesion of the resist pattern. In addition, in Example 1d, it was confirmed that the shape of the resist pattern after development was free from pattern collapse and that the rectangularity was good. Furthermore, the difference in resist pattern shape after development indicated that the resist-auxiliary film composition in Example 1d had good adhesion to the resist material.
• Example 2d The resist auxiliary film composition prepared in Example 1d was coated on a SiO2 substrate with a thickness of 300 nm and baked at 240° C. for 60 seconds and then at 400° C. for 120 seconds to form a resist underlayer film with a thickness of 90 nm. formed.
• a silicon-containing intermediate layer material was applied onto this resist underlayer film and baked at 200° C. for 60 seconds to form a resist intermediate layer film having a thickness of 35 nm.
• the above resist solution for ArF was applied on the resist intermediate layer film and baked at 130° C. for 60 seconds to form a photoresist layer with a film thickness of 150 nm.
• a polymer containing silicon atoms (polymer 1) described in ⁇ Synthesis Example 1> of Japanese Patent Application Laid-Open No. 2007-226170 was used as the material for the silicon-containing intermediate layer.
• the photoresist layer was mask-exposed, baked (PEB) at 115° C. for 90 seconds, and 2.38% by mass of tetramethylammonium hydroxy
• a positive resist pattern of 45 nm L/S (1:1) was obtained by developing with an aqueous solution (TMAH) for 60 seconds.
• the silicon-containing resist intermediate layer film was dry-etched.
• the resist underlayer film was dry-etched using the obtained silicon-containing resist intermediate layer film pattern as a mask, and the SiO 2 film was dry-etched using the resist underlayer film pattern obtained as a mask.
• resist-auxiliary film composition containing ethylenically unsaturated resin (0) and acid generator A resist-auxiliary film composition was prepared according to the formulation shown in Tables 11 and 12, and dissolved in resins (i) to (v) and acid generators (i) to (iv) used as raw materials shown in Tables 11 and 12. A sex evaluation was performed.
• HBM methyl 2-hydroxyisobutyrate (manufactured by Mitsubishi Gas Chemical Company)
• MBM methyl ⁇ -methoxyisobutyrate (synthesized with reference to “US2014/0275016”)
• FBM methyl ⁇ -formyloxyisobutyrate (synthesized with reference to “WO2020/004467”)
• WO2020/004466 methyl ⁇ -acetyloxyisobutyrate (synthesized with reference to “WO2020/004466”)
• 3HBM methyl 3-hydroxyisobutyrate (manufactured by Tokyo Chemical Industry Co., Ltd.)
• iPHIB isopropyl 2-hydroxyisobutyrate (manufactured by Mitsubishi Gas Chemical Company, Inc.)
• PGME 1-methoxy-2-propanol (manufactured by Sigma-Aldrich)
• ⁇ Resin> A resin having the following composition (molecular weight) was synthesized by the above method
• a resin of the type shown in Table 11 was added to a solvent of the type shown in Table 11 so that the resin concentration was 15 wt%, and an acid generator of the type shown in Table 11 was added so that the acid generator concentration was 1 wt%. Then, resist-auxiliary film compositions of Examples A1-1 to A1-4 and Comparative Example A1-1 were prepared. The state after stirring at room temperature for 24 hours was visually evaluated according to the following criteria. Evaluation S: dissolution (visually confirm clear solution) Evaluation A: Almost dissolved (visually confirm almost clear solution) Evaluation C: insoluble (visually confirm cloudy solution)
• a resin shown in Table 12 was added to the solvent shown in Table 12 so that the resin concentration was 40 wt %, and an acid generator of the type shown in Table 12 was added so that the acid generator concentration reached a predetermined concentration.
• Resist-auxiliary film compositions of Examples A2-1a to A2-5d and Comparative Example A2-1 were prepared, respectively. After stirring for 1 hour at room temperature, the state was visually evaluated according to the following criteria. Evaluation S: 5 wt% dissolved (visually confirm clear solution) Evaluation A: 1 wt% dissolved (visually confirm clear solution) Evaluation C: 1 wt% insoluble (visually confirm cloudy solution) The results are shown in Tables 11 and 12.
• the resist-auxiliary film compositions prepared in Examples A1-1 to A1-5 have excellent solubility in resins compared to the resist-auxiliary film composition of Comparative Example A1-1, and various resist-auxiliary films. It can be seen that compositions can be prepared.
• the solvent (B) of the resist-auxiliary film composition containing ⁇ FBM as the solvent (B2) exhibits high solubility in any resin and is preferably used.
• a resist-auxiliary film composition can also be prepared using a generator.
• a resist-auxiliary film composition in which the solvent (B) contains ⁇ MBM, ⁇ FBM, 3HBM, or PGME as the solvent (B2) exhibits high solubility in any acid generator and is preferably used.
• the prepared resist-assisting film composition is spin-coated on a silicon wafer at 1500 rpm to form a coating film, and the coating film is pre-baked at 140° C. for 60 seconds to form a resist-assisting film. formed.
• the film thickness was measured at five arbitrarily selected locations on the resist auxiliary film, and the average value of the film thicknesses at the five locations was calculated as the average film thickness to evaluate the film thickness.
• the film uniformity was evaluated by dividing the film thickness difference between the maximum film thickness and the minimum film thickness by the average value. The results are shown in Table 13.
• Evaluation A 20 ⁇ m or more Evaluation B: 15 ⁇ m or more and less than 20 ⁇ m Evaluation C: Less than 15 ⁇ m Film uniformity: Evaluation A: Less than 15 Evaluation B: 15 or more and less than 30 Evaluation C: 30 or more
• the resist-auxiliary film compositions prepared in Examples A3-1a to A3-5c formed thicker resist-auxiliary films than the resist-auxiliary film compositions of Comparative Examples A3-1a to A3-1b. I know it can be done.
• a resist-assisting film composition in which the solvent (B) contains ⁇ MBM, ⁇ FBM, 3HBM, or PGME as the solvent (B2) is preferably used because of its excellent film uniformity.
• a resist-auxiliary film composition containing ⁇ FBM is preferably used because it can achieve a film thickness of 20 ⁇ m or more when the resin concentration is 40 wt %.
• a resist-auxiliary film composition containing ⁇ MBM is preferably used because it can have a resin concentration of 45 wt % and a film thickness of 20 ⁇ m or more.
• a resist-auxiliary film composition was prepared so as to have the composition shown in Table 15.
• the following polymers, acid generators, cross-linking agents and organic solvents were used.
• R1-1) Acid generator Ditert-butyldiphenyliodonium nonafluoromethanesulfonate (DTDPI) manufactured by Midori Chemical Co., Ltd.
• Cross-linking agent Nikalac MX270 (Nikalac) manufactured by Sanwa Chemical Co., Ltd. Honshu Chemical Industry Co., Ltd.
• TMOM-BP compound represented by the following formula
• Organic solvent methyl 2-hydroxyisobutyrate (HBM) Methyl ⁇ -methoxyisobutyrate ( ⁇ MBM) Methyl ⁇ -formyloxyisobutyrate ( ⁇ FBM) Methyl 3-hydroxyisobutyrate (3HBM) Isopropyl 2-hydroxyisobutyrate (iPHIB) 1-methoxy-2-propanol (PGME)
• the resist-auxiliary film compositions prepared in Examples A5-1 to A5-16 were coated on a 300 nm thick SiO 2 substrate and baked at 240° C. for 60 seconds and then at 400° C. for 120 seconds. , a resist underlayer film having a film thickness of 85 nm was formed. A photoresist solution having a thickness of 140 nm was formed on the resist underlayer film by applying an ArF resist solution and baking at 130° C. for 60 seconds.
• the ArF resist solution contains 5 parts by mass of a resin represented by the following formula (1d), 1 part by mass of triphenylsulfonium nonafluoromethanesulfonate, 2 parts by mass of tributylamine, and 92 parts by mass of PGMEA. I used the one prepared by
• the resin of formula (1d) below was prepared as follows. That is, 4.15 g of 2-methyl-2-methacryloyloxyadamantane, 3.00 g of methacryloyloxy- ⁇ -butyrolactone, 2.08 g of 3-hydroxy-1-adamantyl methacrylate, and 0.38 g of azobisisobutyronitrile were added to tetrahydrofuran. It was made to melt
• Example A4 A photoresist layer was formed directly on the SiO 2 substrate in the same manner as in Example A5-1, except that no resist underlayer film was formed, to obtain a positive resist pattern.
• Examples A6-1 to A6-16 The resist-auxiliary film compositions prepared in Examples A5-1 to A5-16 were coated on a 300 nm-thickness SiO 2 substrate and baked at 240° C. for 60 seconds and then at 400° C. for 120 seconds. A resist underlayer film of 90 nm was formed. A silicon-containing intermediate layer material was applied onto this resist underlayer film and baked at 200° C. for 60 seconds to form a resist intermediate layer film having a thickness of 35 nm. Further, the above resist solution for ArF was applied onto this resist intermediate layer film and baked at 130° C. for 60 seconds to form a photoresist layer with a film thickness of 150 nm. As the material for the silicon-containing intermediate layer, a polymer containing silicon atoms (polymer 1) described in ⁇ Synthesis Example 1> of JP-A-2007-226170 was used.
• the photoresist layer was mask-exposed, baked (PEB) at 115° C. for 90 seconds, and 2.38% by mass of tetramethylammonium hydroxy
• a positive resist pattern of 45 nm L/S (1:1) was obtained by developing with an aqueous solution (TMAH) for 60 seconds.
• the silicon-containing resist intermediate layer film was dry-etched.
• the resist underlayer film was dry-etched using the obtained silicon-containing resist intermediate layer film pattern as a mask, and the SiO 2 film was dry-etched using the resist underlayer film pattern obtained as a mask.
• Pattern cross sections (shapes of SiO films after etching) of Examples A6-1 to A6-11 and A6-14 to A6-16 obtained as described above were examined using an electron microscope "S -4800", the shape of the SiO2 film after etching in the multi-layer resist processing was rectangular, and no defects were observed in the examples using the resist-auxiliary film composition of the present embodiment. One thing has been confirmed.
• the above-obtained resist-assisting film was formed on a SiO2 stepped substrate in which trenches of 100 nm width, 150 nm pitch, and 150 nm depth (aspect ratio: 1.5) and trenches (open spaces) of 5 ⁇ m width and 150 nm depth were mixed. Each composition was applied. After that, it was baked at 400° C. for 120 seconds in an air atmosphere to form a resist underlayer film with a thickness of 100 nm. The shape of this resist underlayer film was observed with a scanning electron microscope ("S-4800" by Hitachi High-Technologies Corporation), and the difference ( ⁇ FT) between the maximum and minimum values of the film thickness of the resist underlayer film on the trench or space. was measured.
• S-4800 scanning electron microscope
• a resist-auxiliary film composition A7 was prepared in the same manner as in Example A5-4 except that the solvent was changed from HBM to 1-methoxy-2-propanol (PGME).
• Examples A7-1 to A7-7 obtained as described above had good step fillability and flatness.
• a resist-auxiliary film composition in which the solvent (B) contains 3HBM as the solvent (B2) or iPHIB as the solvent (B1) is preferably excellent in step fillability and flatness. used.
• compositions other than the resist-auxiliary film composition described in the examples are satisfied, the same effects are exhibited with compositions other than the resist-auxiliary film composition described in the examples.

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