WO2023003309A1 - Appareil de traitement de substrat et procédé d'entraînement d'ensemble porte - Google Patents

Appareil de traitement de substrat et procédé d'entraînement d'ensemble porte Download PDF

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Publication number
WO2023003309A1
WO2023003309A1 PCT/KR2022/010490 KR2022010490W WO2023003309A1 WO 2023003309 A1 WO2023003309 A1 WO 2023003309A1 KR 2022010490 W KR2022010490 W KR 2022010490W WO 2023003309 A1 WO2023003309 A1 WO 2023003309A1
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WO
WIPO (PCT)
Prior art keywords
door
valve
passage
chamber
substrate
Prior art date
Application number
PCT/KR2022/010490
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English (en)
Korean (ko)
Inventor
강정현
Original Assignee
피에스케이 주식회사
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Publication date
Application filed by 피에스케이 주식회사 filed Critical 피에스케이 주식회사
Publication of WO2023003309A1 publication Critical patent/WO2023003309A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K3/00—Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing
    • F16K3/02—Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing with flat sealing faces; Packings therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K3/00—Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing
    • F16K3/02—Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing with flat sealing faces; Packings therefor
    • F16K3/0281—Guillotine or blade-type valves, e.g. no passage through the valve member
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K51/00—Other details not peculiar to particular types of valves or cut-off apparatus
    • F16K51/02—Other details not peculiar to particular types of valves or cut-off apparatus specially adapted for high-vacuum installations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32733—Means for moving the material to be treated
    • H01J37/32743—Means for moving the material to be treated for introducing the material into processing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching

Definitions

  • the present invention relates to a substrate processing apparatus and a door assembly driving method, and more particularly, to a substrate processing apparatus processing a substrate using plasma and a door assembly driving method.
  • Plasma refers to an ionized gaseous state composed of ions, radicals, and electrons. Plasma is generated by very high temperatures, strong electric fields or RF Electromagnetic Fields. Etching, deposition, and cleaning processes are used as these processes.
  • FIG. 1 is a view showing a state in which a door is opened on one side wall of a typical process chamber.
  • FIG. 2 is an enlarged view of portion A of FIG. 1 .
  • the chamber 9000 has a loading port through which substrates are carried in or taken out.
  • a door assembly 9200 that opens or closes the carry-in port is provided in order to isolate the chamber 9000 from the external environment.
  • the pressure inside the chamber and the pressure outside the chamber are provided differently. Accordingly, when the door assembly moves to open and close the carry-in port, airflow from the outside of the chamber is introduced into the chamber through a space between the door assembly and the carry-in port.
  • the air flow outside the chamber includes various particles. As a result, particles are introduced into the chamber. Particles introduced into the chamber affect the environment inside the chamber and cause defects in the substrate processing process.
  • An object of the present invention is to provide a substrate processing apparatus and a door assembly driving method capable of minimizing a difference between an internal pressure of a chamber and an external pressure of the chamber before opening the door of the chamber.
  • an object of the present invention is to provide a substrate processing apparatus and a door assembly driving method capable of minimizing the inflow of particles into a chamber.
  • An apparatus for processing a substrate includes a chamber having a processing space for processing a substrate and having an entrance through which a substrate enters and exits, a gas supply unit for supplying process gas to the processing space, a plasma unit for generating plasma from the process gas, and the above process gas.
  • a door assembly that opens and closes a carry-in port, wherein the door assembly includes a door that opens and closes the carry-in port and a door driver that moves the door between an open position and a closed position, wherein the door has one side of which air flows in
  • a passage is formed and may include a housing having an inner space, a valve that opens or closes the passage, and a valve actuator that moves the valve between an open position and a closed position.
  • the apparatus further includes a controller controlling the door driver and the valve driver, and the controller controls the valve driver to move the valve to an open position when a substrate is unloaded from the processing space. and then control the door actuator to move the door to an open position.
  • a perforated member having a perforated hole through which the airflow flows may be provided in the inner space.
  • the perforated member may include a filter.
  • the perforated member is disposed on the other side facing the one side of the door, and may include a plate having a plurality of perforated holes.
  • the perforated member is disposed on one side and the other side facing the door, and may include a plate having a plurality of perforations and a filter disposed between the passage and the plate.
  • the perforated hole may be provided with a smaller area than the passage.
  • An apparatus for processing substrates includes a chamber having an entrance through which substrates enter and exit, and a door assembly that opens and closes the entrance, and the door assembly is located outside the chamber and includes a door that opens and closes the entrance and the door.
  • the apparatus further includes a controller controlling the door driver and the valve driver, and the controller controls the valve driver to move the valve to an open position when a substrate is unloaded from the chamber. , After the valve moves to the open position, the door actuator may be controlled to move the door to the open position.
  • the inner space may include a perforated member having a perforated hole through which the airflow flows.
  • the perforated member may include a filter.
  • the perforated member is disposed on one side and the other side facing the door, and may include a plate having a plurality of perforations and a filter disposed between the passage and the plate.
  • the perforated hole may be provided with a smaller area than the passage.
  • the present invention provides a method of driving a door assembly in an apparatus for processing a substrate.
  • the method of driving the door assembly may include a valve opening step of moving the valve to an open position and opening the passage, and a door opening step of moving the door to an open position after the valve opening step.
  • the substrate processing device may be a device for processing a substrate under vacuum pressure.
  • FIG. 1 is a view showing a state in which a door is opened on one side wall of a typical process chamber.
  • FIG. 2 is an enlarged view of portion A of FIG. 1 .
  • FIG. 3 is a diagram schematically showing a substrate processing apparatus of the present invention.
  • FIG. 4 is a diagram schematically illustrating an embodiment of a process chamber performing a plasma treatment process among process chambers of the substrate processing apparatus of FIG. 3 .
  • FIG. 5 is a schematic view of a door assembly according to an exemplary embodiment of FIG. 4 .
  • FIG. 6 is a diagram schematically showing the flow of airflow when the valve of FIG. 5 is moved to an open position.
  • FIG. 7 and 8 are views schematically showing a door assembly according to another embodiment of FIG. 4 .
  • FIG. 9 is a schematic view of a door assembly according to another embodiment of FIG. 4 .
  • FIG. 10 is a diagram schematically showing the flow of air flow when the valve of FIG. 9 is moved to an open position.
  • FIG. 11 is a flowchart of a method for driving a door assembly according to an embodiment of the present invention.
  • FIG. 12 is a diagram schematically illustrating a plasma treatment step of FIG. 11 .
  • FIG. 13 is a diagram schematically showing the valve opening step of FIG. 11 .
  • FIG. 14 is a diagram schematically illustrating a door opening step of FIG. 11 .
  • FIG. 15 is a diagram schematically illustrating the step of unloading the substrate of FIG. 11 .
  • the substrate processing apparatus 1 has a front end module (Equipment Front End Module, EFEM) 20 and a processing module 30 .
  • the front end module 20 and the processing module 30 are arranged in one direction.
  • the front end module 20 has a load port (Load port, 200) and a transfer frame (220).
  • the load port 200 is disposed in front of the front end module 20 in the first direction 2 .
  • the load port 200 has a plurality of support parts 202 . Each support part 202 is arranged in a row in the second direction 4, and a carrier C (eg, a cassette, FOUP, etc.) is settled. In the carrier C, a substrate W to be subjected to a process and a substrate W after processing are accommodated.
  • the transfer frame 220 is disposed between the load port 200 and the processing module 30 .
  • the transfer frame 220 includes a first transfer robot 222 disposed therein and transferring the substrate W between the load port 200 and the processing module 30 .
  • the first transfer robot 222 moves along the transfer rail 224 provided in the second direction (4) to transfer the substrate (W) between the carrier (C) and the processing module (30).
  • the processing module 30 includes a load lock chamber 300 , a transfer chamber 400 , and a process chamber 500 .
  • a chamber having a processing space for processing substrates and having an entrance through which substrates enter and exit includes a load lock chamber 300 , a transfer chamber 400 , and a process chamber 500 .
  • the load lock chamber 300 is disposed adjacent to the transport frame 220 .
  • the load lock chamber 300 may be disposed between the transfer chamber 400 and the front end module 20 .
  • the load lock chamber 300 serves as a waiting space before a substrate W to be processed is transferred to the process chamber 500 or before a substrate W after processing is transferred to the front module 20. to provide.
  • the transfer chamber 400 is disposed adjacent to the load lock chamber 300 .
  • the transfer chamber 400 When viewed from the top, the transfer chamber 400 has a polygonal body.
  • the transfer chamber 400 may have a pentagonal body when viewed from the top.
  • a load lock chamber 300 and a plurality of process chambers 500 are disposed outside the body along the circumference of the body.
  • a passage (not shown) through which the substrate W enters and exits is formed on each sidewall of the body, and the passage connects the transfer chamber 400 and the load lock chamber 300 or the process chambers 500 .
  • Each passage is provided with a door (not shown) that opens and closes the passage to seal the inside.
  • a second transfer robot 420 that transfers the substrate W between the load lock chamber 300 and the process chamber 500 is disposed in the inner space of the transfer chamber 400 .
  • the second transfer robot 420 transfers an unprocessed substrate W waiting in the load lock chamber 300 to the process chamber 500 or transfers a substrate W after processing has been completed to the load lock chamber 300. do.
  • the substrates W are transferred between the process chambers 500 in order to sequentially provide the substrates W to the plurality of process chambers 500 .
  • load lock chambers 300 are disposed on sidewalls adjacent to the front end module 20, respectively, and process chambers 500 are disposed on the remaining sidewalls. are placed consecutively.
  • the shape of the transfer chamber 400 is not limited thereto, and may be modified and provided in various shapes according to required process modules.
  • the process chamber 500 is disposed along the circumference of the transfer chamber 400 .
  • a plurality of process chambers 500 may be provided.
  • processing of the substrate W is performed.
  • the process chamber 500 receives the substrate W from the second transfer robot 420 and processes the substrate W, and provides the substrate W upon completion of the process to the second transfer robot 420 .
  • Processes performed in each process chamber 500 may be different from each other.
  • FIG. 4 is a diagram schematically illustrating a process chamber in which a plasma treatment process is performed among process chambers of the substrate processing apparatus of FIG. 1 .
  • a process chamber 500 performs a predetermined process on a substrate W using plasma.
  • the thin film on the substrate W may be etched or ashed.
  • the thin film may be various types of films such as a polysilicon film, an oxide film, and a silicon nitride film.
  • the thin film may be a natural oxide film or a chemically generated oxide film.
  • the process chamber 500 includes a processing chamber 520 , a plasma generation chamber 540 , a diffusion chamber 560 , and an exhaust chamber 580 .
  • the processing chamber 520 provides a processing space 5200 in which a substrate W is placed and processing of the substrate W is performed.
  • Plasma is generated by discharging a process gas in a plasma generating chamber 540 to be described later, and is supplied to the processing space 5200 of the processing chamber 520 .
  • Process gases remaining in the processing chamber 520 and/or reaction by-products generated in the process of processing the substrate W are discharged to the outside through an exhaust chamber 580 to be described later. Due to this, the pressure in the processing chamber 520 can be maintained at the set pressure.
  • the processing chamber 520 may include a housing 5220 , a support unit 5240 , and an exhaust baffle 5260 .
  • the housing 5220 may have a processing space 5200 in which a substrate processing process is performed.
  • the housing 5220 may have an open top.
  • An outer wall of the housing 5220 may be provided as a conductor.
  • the outer wall of the housing 5220 may be made of a metal material including aluminum.
  • An exhaust hole 5222 is formed on the bottom surface of the housing 5220 . Process gases and/or by-products in the processing space 5200 may be exhausted to the outside of the processing space 5200 through the exhaust hole 5222 .
  • the exhaust hole 5222 may be connected to components included in an exhaust chamber 580 to be described later.
  • a carrying inlet 5201 may be formed on a sidewall of the housing 5220 .
  • the carry-in port 5201 may function as a space in which the substrate W is carried in or taken out.
  • the substrate W is carried into the housing 5220 through the carrying inlet 5201.
  • the substrate W is carried out of the housing 5220 through the carrying inlet 5201 .
  • the entrance 5201 may be opened and closed by the door assembly 600 .
  • FIG. 5 is a schematic view of a door assembly according to an exemplary embodiment of FIG. 4 .
  • the door assembly 600 may open or close the entrance 5201 .
  • the door assembly 600 may include a door 620 and a door actuator 640 .
  • the door 620 may open or close the entrance 5201 .
  • the door 620 may be moved between an open position and a closed position by a door driver 640 to be described later.
  • the door 620 may include a housing 622 , a valve 624 , a valve actuator 626 , and a perforated member 630 .
  • the housing 622 may be provided in a substantially rectangular parallelepiped shape. When viewed from the front, the housing 622 may have a larger area than the carrying port 5201 . The housing 622 may cover the carry-in port 5201 when viewed from the front. Accordingly, when the door 620 is moved to a closed position by a door actuator 640 to be described later, the entrance 5201 may be closed by the door 620 .
  • the housing 622 has an interior space.
  • a filter 634 to be described later may be provided in the inner space of the housing 622 .
  • a passage 621 through which air flow is introduced is formed on one side of the housing 622 .
  • a passage 621 through which air current outside the process chamber 500 flows is formed on one side of the housing 622 facing the other side of the housing 622 adjacent to the processing space 5200 .
  • a plate 632 to be described later may be provided on the other side of the housing 622 .
  • the valve 624 may be located outside the door 620 .
  • a valve 624 may be located on one side of the housing 622 .
  • the valve 624 may be located on an outer surface of the housing 622 in which the passage 621 is formed. When viewed from the front, the area of the valve 624 may be provided larger than that of the passage 621 .
  • Valve 624 may open or close passage 621 .
  • the valve 624 can be moved between an open position and a closed position by a valve actuator 626 described below.
  • the open position may be defined as a position in which the valve 624 opens the passage 621 .
  • the valve 624 may be positioned outside the passage 621 .
  • the valve actuator 626 moves the valve 624 downward to place the valve 624 in an open position
  • the upper end of the valve 624 is lower than the lower end of the passage 621. can do. That is, in the open position, the valve 624 and the passage 621 may not overlap each other.
  • the valve 624 opens the passage 621 so that airflow outside the process chamber 500 can flow into the inner space of the housing 622 .
  • the closed position may be defined as a position where the valve 624 closes the passage 621 .
  • valve 624 may overlap passage 621 .
  • the valve 624 can completely cover the entire area of the passage 621 . That is, when the valve 624 is positioned in the closed position, the passage 621 may be closed by the valve 624 .
  • the valve actuator 626 moves the valve 624 upward to place the valve 624 in the closed position, the upper end of the valve 624 is positioned higher than the upper end of the passage 621. can do.
  • the valve 624 may block an air flow outside the process chamber 500 from being introduced into the inner space of the housing 622 .
  • the valve actuator 626 may be installed outside the housing 622 .
  • the valve actuator 626 may be installed on an outer surface of the housing 622 .
  • the valve actuator 626 may move the valve 624 in a vertical direction relative to the side of the housing 622 .
  • Valve actuator 626 can move valve 624 to an open position where passage 621 is opened.
  • Valve actuator 626 can move valve 624 to a closed position where passage 621 is closed.
  • valve actuator 626 may vertically move the valve 624 in a downward direction when moving the valve 624 to an open position.
  • the valve actuator 626 may vertically move the valve 624 in an upward direction when moving the valve 624 to a closed position.
  • the valve actuator 626 may be modified and provided with various known devices capable of providing a driving force.
  • the perforated member 630 may be provided within the housing 622 .
  • the perforated member 630 may be provided in the inner space of the housing 622 .
  • a plurality of perforations are formed in the perforation member 630 .
  • the perforated hole formed in the perforated member 630 may function as a path through which airflow outside the process chamber 500 flows through the passage 621 when the valve 624 is opened.
  • the area of the perforation formed in the perforation member 630 may be smaller than the area of the passage 621 .
  • the perforated member 630 may include a plate 632 and a filter 634 .
  • the plate 632 may be disposed on the other side of the door 620 facing one side of the door 620 where the passage 621 is formed.
  • the plate 632 may be disposed on the other side of the housing 622 facing one side of the housing 622 where the passage 621 is formed. When viewed from the front, the plate 632 may be formed in a shape corresponding to the inner space of the housing 622 .
  • a plurality of perforations are formed in the plate 632 .
  • a plurality of perforations may be spaced apart from each other along the circumferential direction of the plate 632 .
  • a plurality of perforations may be spaced apart from each other over the entire area of the plate 632 .
  • An area of each of the plurality of perforations may be smaller than that of the passage 621 .
  • a plurality of perforated holes may be formed by vertically penetrating the plate 632 .
  • a plurality of perforated holes may be provided with the same diameter as each other.
  • a plurality of perforated holes may be provided with different diameters.
  • a through direction of the plurality of perforations may be formed in a direction parallel to a direction in which air current outside the process chamber 500 flows.
  • a plurality of perforated holes may be provided in parallel with a longitudinal direction of the passage 621 and a penetration direction within the plate 632 .
  • the plate 632 may be integrally formed with the housing 622 . However, it is not limited thereto, and the plate 632 may be separated from the housing 622 and disposed on the other side of the housing 622 .
  • the filter 634 may filter impurities such as particles included in the airflow introduced from the outside of the housing 622 . Fine perforations through which impurities can be filtered may be formed in the filter 634 . An air flow introduced from the outside of the housing 622 may flow toward the plate 632 through a hole formed in the filter 634 . Impurities included in the airflow introduced from the outside of the housing 622 may not pass through the hole formed in the filter 634 . Thus, impurities included in the airflow may be removed by the filter 634 .
  • the filter 634 according to an embodiment may be a known filter capable of filtering impurities.
  • the filter 634 may be disposed in an inner space of the housing 622 .
  • the filter 634 may be disposed between one side of the housing 622 and the other side of the housing 622 on the inner space.
  • the filter 634 may be disposed between the passage 621 and the plate 632 on the inner space.
  • the filter 634 may have a longitudinal direction perpendicular to a through direction of a plurality of perforated holes provided in the plate 632 .
  • the height of the filter 634 may correspond to the height of the inner space of the housing 622
  • the width of the filter 634 may correspond to the width of the inner space of the housing 622. That is, when viewed from the front, the filter 634 may overlap the inner space of the housing 622 .
  • the door driver 640 may move the door 620 to an open position in which the entrance 5201 is opened.
  • the door actuator 640 may move the door 620 to a closed position where the entrance 5201 is closed.
  • the door actuator 640 may move the door 620 vertically or horizontally with respect to the sidewall of the housing 5220 .
  • the door actuator 640 moves the door 620 to an open position
  • the door 620 moves horizontally in a direction away from the sidewall of the housing 5220, and then moves the door 620 downward.
  • the door actuator 640 moves the door 620 to the closed position
  • the door 620 is vertically moved in an upward direction, and then the door 620 is brought closer to the sidewall of the housing 5220.
  • the door 620 may be horizontally moved in the losing direction.
  • the door driver 640 may include a motor 642 and a connecting member 644 connecting the motor 642 and the door 620 .
  • the connecting member 644 When the connecting member 644 is moved vertically or horizontally by driving the motor 642 , the door 620 may move vertically or horizontally with respect to the sidewall of the housing 5220 .
  • the motor 642 may be provided with a variety of well-known devices that provide driving force.
  • the door actuator 640 may perform horizontal movement, vertical movement, or/and inclined movement with respect to the ground.
  • the door driver 640 may be driven so that the door 620 moves generally 'Z'.
  • the controller 700 may control the valve actuator 626 and the door actuator 640 .
  • the controller 700 may control the valve actuator 626 to move the valve actuator 626 to an open position and a closed position.
  • the controller 700 may control the door actuator 640 to move the door actuator 640 to an open position and a closed position.
  • the controller 700 may control the valve actuator 626 to move the valve 624 to an open position when the substrate W is unloaded from the processing space 5200 .
  • the controller 700 operates a valve actuator to vertically move the valve 624 downward after plasma processing of the substrate W is completed and before transporting the substrate W from the processing space 5200 .
  • the controller 700 operates as a valve driver so that the valve 624 opens a portion of the passage 621 after the plasma treatment of the substrate W is completed and before the substrate W is taken out of the processing space 5200. (626) can be controlled.
  • the controller 700 may control the valve actuator 626 so that the valve 624 fully opens the passage 621 after the valve 624 is partially opened and a set time is elapsed. In other words.
  • the controller 700 controls the valve driver 626 to increase the opening rate of the passage 621 from the time when the plasma treatment of the substrate W is completed to the time when the valve 624 fully opens the passage 621. can do.
  • the controller 700 may control the door actuator 640 to move the door 620 to an open position after the valve 624 completely opens the passage 621 .
  • the controller 700 may control the door actuator 640 to horizontally move the door 620 away from the entrance 5201 after the valve 624 completely opens the passage 621 .
  • the controller 700 may control the door actuator 640 to vertically move the door 620 downward.
  • the substrate W may be transported through the loading port 5201 .
  • the intake 5201 is Before opening, a pressure difference between the inside and outside of the process chamber 500 may be minimized.
  • the inflow of external airflow including particles into the process chamber 500 may be minimized. Due to this, it is possible to minimize defects in the substrate processing process.
  • FIG. 6 is a diagram schematically showing the flow of airflow when the valve of FIG. 5 is moved to an open position.
  • the perforated member 630 is disposed in the inner space of the door 620, thereby minimizing the flow of external airflow and particles included therein into the processing space 5200 according to the opening of the valve 624. can do.
  • particles included in the external airflow are primarily filtered by the filter 634 to prevent particles from being introduced into the processing space 5200 .
  • the flow rate of the external airflow introduced through the passage 621 may be reduced by the filter 634 .
  • Particles included in the external air flow may be secondarily filtered by the plate 632 .
  • the flow rate of the external airflow may be further reduced.
  • the support unit 5240 supports the substrate W in the processing space 5200 .
  • the support unit 5240 may include a support plate 5242 and a support shaft 5244 .
  • the support plate 5242 may support the substrate W in the processing space 5200 .
  • the support plate 5242 may be supported by a support shaft 5244.
  • the support plate 5242 is connected to an external power source and may generate static electricity by the applied power. The electrostatic force of the generated static electricity may fix the substrate W to the support unit 5240 .
  • the support shaft 5244 can move the object.
  • the support shaft 5244 may move the substrate W in a vertical direction.
  • the support shaft 5244 is coupled to the support plate 5242 and moves the substrate W by moving the support plate 5242 up and down.
  • the exhaust baffle 5260 uniformly exhausts the plasma for each area in the processing space 5200 .
  • the exhaust baffle 5260 has an annular ring shape.
  • An exhaust baffle 5260 is located between the inner wall of the housing 5220 and the support unit 5240 within the processing space 5200 .
  • a plurality of exhaust holes 5262 are formed in the exhaust baffle 5260 .
  • Exhaust holes 5262 are provided to face up and down.
  • Exhaust holes 5262 are provided as holes extending from the top to the bottom of the exhaust baffle 5260 .
  • the exhaust holes 5262 are arranged spaced apart from each other along the circumferential direction of the exhaust baffle 5260 .
  • the plasma generation chamber 540 may generate plasma by discharging a process gas supplied from a gas supply unit 5440 to be described later, and supply the generated plasma to the processing space 5200 .
  • the plasma generating chamber 540 may be located above the processing chamber 520 .
  • the plasma generation chamber 540 may be located above the housing 5220 and the diffusion chamber 560 to be described later.
  • the processing chamber 520, the diffusion chamber 560, and the plasma generating chamber 540 are sequentially positioned from the ground along a third direction 6 perpendicular to both the first direction 2 and the second direction 4 can do.
  • the plasma generation chamber 540 may include a plasma chamber 5420, a gas supply unit 5440, and a power application unit 5460.
  • the plasma chamber 5420 may have a shape with open top and bottom surfaces.
  • the plasma chamber 5420 may have a cylindrical shape with open top and bottom surfaces.
  • the plasma chamber 5420 may have a cylindrical shape with open top and bottom surfaces.
  • An opening having a diameter D1 may be formed at upper and lower ends of the plasma chamber 5420 .
  • the plasma chamber 5420 may have a plasma generating space 5422 .
  • the plasma chamber 5420 may be made of a material including aluminum oxide (Al2O3).
  • An upper surface of the plasma chamber 5420 may be sealed by a gas supply port 5424 .
  • the gas supply port 5424 may be connected to a gas supply unit 5440 to be described later.
  • Process gas may be supplied to the plasma generating space 5422 through the gas supply port 5424 .
  • the process gas supplied to the plasma generating space 5422 may be uniformly distributed to the processing space 5200 via a distribution plate 5640 described later.
  • the gas supply unit 5440 may supply a process gas.
  • the gas supply unit 5440 may be connected to the gas supply port 5424 .
  • the process gas supplied by the gas supply unit 5440 may include fluorine and/or hydrogen.
  • the power application unit 5460 applies high frequency power to the plasma generating space 5422 .
  • the power application unit 5460 may be a plasma source that generates plasma by exciting a process gas in the plasma generating space 5422 .
  • the power application unit 5460 may include an antenna 5462 and a power source 5464 .
  • Antenna 5462 may be an inductively coupled plasma (ICP) antenna.
  • the antenna 5462 may be provided in a coil shape.
  • the antenna 5462 may wind the plasma chamber 5420 multiple times from the outside of the plasma chamber 5420 .
  • the antenna 5462 may spiral around the plasma chamber 5420 multiple times from the outside of the plasma chamber 5420 .
  • the antenna 5462 may be wound around the plasma chamber 5420 in a region corresponding to the plasma generating space 5422 .
  • One end of the antenna 5462 may be provided at a height corresponding to an upper region of the plasma chamber 5420 when viewed from a front end surface of the plasma chamber 5420 .
  • the other end of the antenna 5462 may be provided at a height corresponding to a lower region of the plasma chamber 5420 when viewed from the front end of the plasma chamber 5420 .
  • a power source 5464 can apply power to the antenna 5462 .
  • the power source 5464 may apply a high-frequency alternating current to the antenna 5462 .
  • the high-frequency alternating current applied to the antenna 5462 may form an induced electric field in the plasma generating space 5422 .
  • the process gas supplied into the plasma generation space 5422 may be converted into a plasma state by obtaining energy required for ionization from the induced electric field.
  • a power source 5464 may be coupled to one end of the antenna 5462.
  • the power source 5464 may be connected to one end of an antenna 5462 provided at a height corresponding to the upper region of the plasma chamber 5420 .
  • the other end of the antenna 5462 may be grounded.
  • the other end of the antenna 5462 provided at a height corresponding to the lower region of the plasma chamber 5420 may be grounded.
  • the present invention is not limited thereto, and one end of the antenna 5462 may be grounded and the power source 5464 may be connected to the other end of the antenna 5462.
  • the diffusion chamber 560 may diffuse the plasma generated in the plasma generating chamber 540 into the processing space 5200 .
  • the diffusion chamber 560 may include a diffusion chamber 5620 and a baffle 5640 .
  • the diffusion chamber 5620 provides a plasma diffusion space 5622 in which plasma generated in the plasma chamber 5420 is diffused.
  • the diffusion chamber 5620 may have an overall inverted funnel shape.
  • the diffusion chamber 5620 may have an open top and bottom shape.
  • Plasma generated in the plasma generation chamber 540 may diffuse while passing through the plasma diffusion space 5622 .
  • Plasma introduced into the plasma diffusion space 5622 may be uniformly distributed to the processing space 5200 via a baffle 5640 described below.
  • the diffusion chamber 5620 may be located below the plasma chamber 5420 .
  • a diffusion chamber 5620 may be located between the housing 5220 and the plasma chamber 5420 .
  • the housing 5220, the diffusion chamber 5620, and the plasma chamber 5420 may be sequentially positioned from the ground along the third direction 6.
  • An inner circumferential surface of the diffusion chamber 5620 may be provided with an insulator.
  • an inner circumferential surface of the diffusion chamber 5620 may be made of a material including quartz.
  • the baffle 5640 uniformly supplies plasma flowing into the processing space 5200 to the substrate W.
  • a plurality of baffle holes 5642 may be formed in the baffle 5640 .
  • the plurality of baffle holes 5642 may be provided as through holes extending from the upper surface to the lower surface of the baffle 5640 .
  • a plurality of baffle holes 5642 may be uniformly formed in each area of the baffle 5640 .
  • the baffle 5640 is positioned on top of the support unit 5240 to face the support unit 5240.
  • the baffle 5640 may be positioned between the support unit 5240 and the plasma generating chamber 540 . Plasma generated in the plasma generating chamber 540 may pass through a plurality of baffle holes 5642 formed in the baffle 5640 .
  • the exhaust chamber 580 may exhaust process gases and impurities inside the processing chamber 520 to the outside.
  • the exhaust chamber 580 may exhaust impurities generated during processing of the substrate W to the outside of the process chamber 500 .
  • the exhaust chamber 580 may exhaust the process gas supplied into the processing space 5200 to the outside.
  • the exhaust chamber 580 may include an exhaust line 5820 and a pressure reducing member 5840 .
  • the exhaust line 5820 may be connected to an exhaust hole 5222 formed on a bottom surface of the housing 5220 .
  • the exhaust line 5820 may be connected to a pressure reducing member 5840 that provides pressure.
  • the pressure reducing member 5840 may provide pressure to the treatment space 5200 .
  • the pressure reducing member 5840 may discharge plasma and impurities remaining in the processing space 5200 to the outside of the housing 5220 .
  • the pressure reducing member 5840 may provide pressure to maintain the pressure in the processing space 5200 at a preset pressure.
  • the pressure reducing member 5840 may be a pump. However, it is not limited thereto, and the decompression member 5840 may be provided as a known device that provides decompression.
  • the door assembly 600 is provided in the process chamber 500 and the door assembly 600 is driven.
  • the door assembly 600 may be provided to the load lock chamber 300 and the transfer chamber 400 to be driven similarly.
  • FIG. 7 and 8 are views schematically showing a door assembly according to another embodiment of FIG. 4 . Except for the case of additional description among the descriptions of the substrate processing apparatus according to another embodiment of the present invention described below, it is similar to the description of the substrate processing apparatus according to one embodiment of the present invention described above, and duplication of contents is prevented. In order to do so, descriptions of similar configurations are omitted below.
  • a door 620 may open or close the entrance 5201 .
  • the door 620 can be moved between an open position and a closed position by the door actuator 640 .
  • the door 620 may include a housing 622 , a valve 624 , a valve actuator 626 , and a perforated member 630 .
  • the housing 622 may be provided in a substantially rectangular parallelepiped shape. When viewed from the front, the housing 622 may have a larger area than the carrying port 5201 . The housing 622 may cover the carry-in port 5201 when viewed from the front. Accordingly, when the door 620 is moved to a closed position by a door actuator 640 to be described later, the entrance 5201 may be closed by the door 620 .
  • the housing 622 has an interior space.
  • a filter 634 to be described later may be provided in the inner space of the housing 622 .
  • a passage 621 through which air flow is introduced is formed on one side of the housing 622 .
  • a passage 621 through which air current outside the process chamber 500 flows is formed at one side of the housing 622 facing the other side of the housing 622 adjacent to the processing space 5200 .
  • the valve 624 may be located outside the door 620 .
  • a valve 624 may be located on one side of the housing 622 .
  • the valve 624 may be located on an outer surface of the housing 622 in which the passage 621 is formed. When viewed from the front, the area of the valve 624 may be provided larger than that of the passage 621 .
  • Valve 624 may open or close passage 621 .
  • Valve 624 can be moved between an open position and a closed position by valve actuator 626 .
  • the valve 624 opens the passage 621 so that airflow outside the process chamber 500 can flow into the inner space of the housing 622 .
  • By closing the passage 621 the valve 624 may block an air flow outside the process chamber 500 from being introduced into the inner space of the housing 622 .
  • the valve actuator 626 may be installed outside the housing 622 .
  • the valve actuator 626 may be installed on an outer surface of the housing 622 .
  • Valve actuator 626 can move valve 624 to an open position where passage 621 is opened.
  • Valve actuator 626 can move valve 624 to a closed position where passage 621 is closed.
  • the valve actuator 626 may move the valve 624 in a vertical direction relative to the side of the housing 622 .
  • valve actuator 626 may vertically move the valve 624 in a downward direction when moving the valve 624 to an open position.
  • the valve actuator 626 may vertically move the valve 624 in an upward direction when moving the valve 624 to a closed position.
  • the valve actuator 626 may be modified and provided with various known devices capable of providing a driving force.
  • the perforated member 630 may be provided within the housing 622 .
  • the perforated member 630 may be provided in the inner space of the housing 622 .
  • a perforation is formed in the perforation member 630 .
  • the perforation formed in the perforation member 630 may be provided as a space in which an air current outside the process chamber 500 flows through the passage 621 when the valve 624 is opened.
  • the area of the perforation formed in the perforation member 630 may be smaller than the area of the passage 621 .
  • the perforated member 630 may include a filter 634 .
  • the filter 634 may be disposed in an inner space of the housing 622 .
  • the filter 634 may be disposed between one side of the housing 622 and the other side of the housing 622 on the inner space.
  • the filter 634 may be disposed between the passage 621 and the plate 632 on the inner space. Accordingly, the flow of air outside the process chamber 500 according to the opening of the valve 624 and particles included therein may be removed by the filter 634 and introduced into the processing space 5200 may be minimized. Also, when the valve 624 is opened, the flow rate of the external air flow flowing into the process chamber 500 may be reduced. Accordingly, rapid pressure fluctuations in the process chamber 500 may be minimized.
  • a door 620 may open or close the entrance 5201 .
  • the door 620 can be moved between an open position and a closed position by the door actuator 640 .
  • the door 620 may include a housing 622 , a valve 624 , a valve actuator 626 , and a perforated member 630 .
  • the housing 622 may be provided in a substantially rectangular parallelepiped shape. When viewed from the front, the housing 622 may have a larger area than the carrying port 5201 . The housing 622 may cover the carry-in port 5201 when viewed from the front. Accordingly, when the door 620 is moved to a closed position by a door actuator 640 to be described later, the entrance 5201 may be closed by the door 620 .
  • the housing 622 has an interior space.
  • a passage 621 through which air flow is introduced is formed on one side of the housing 622 .
  • a passage 621 through which air current outside the process chamber 500 flows is formed at one side of the housing 622 facing the other side of the housing 622 adjacent to the processing space 5200 .
  • a plate 632 to be described later may be provided on the other side of the housing 622 .
  • the valve 624 may be located outside the door 620 .
  • a valve 624 may be located on one side of the housing 622 .
  • the valve 624 may be located on an outer surface of the housing 622 in which the passage 621 is formed. When viewed from the front, the area of the valve 624 may be provided larger than that of the passage 621 .
  • Valve 624 may open or close passage 621 .
  • Valve 624 can be moved between an open position and a closed position by valve actuator 626 .
  • the valve 624 opens the passage 621 so that airflow outside the process chamber 500 can flow into the inner space of the housing 622 .
  • By closing the passage 621 the valve 624 may block an air flow outside the process chamber 500 from being introduced into the inner space of the housing 622 .
  • the valve actuator 626 may be installed outside the housing 622 .
  • the valve actuator 626 may be installed on an outer surface of the housing 622 .
  • Valve actuator 626 can move valve 624 to an open position where passage 621 is opened.
  • Valve actuator 626 can move valve 624 to a closed position where passage 621 is closed.
  • the valve actuator 626 may move the valve 624 in a vertical direction relative to the side of the housing 622 .
  • valve actuator 626 may vertically move the valve 624 in a downward direction when moving the valve 624 to an open position.
  • the valve actuator 626 may vertically move the valve 624 in an upward direction when moving the valve 624 to a closed position.
  • the valve actuator 626 may be modified and provided with various known devices capable of providing a driving force.
  • the perforated member 630 may be provided within the housing 622 .
  • the perforated member 630 may be provided in the inner space of the housing 622 .
  • a perforation is formed in the perforation member 630 .
  • the perforation formed in the perforation member 630 may be provided as a space in which an air current outside the process chamber 500 flows through the passage 621 when the valve 624 is opened.
  • the area of the perforation formed in the perforation member 630 may be smaller than the area of the passage 621 .
  • the perforated member 630 may include a plate 632 .
  • the plate 632 may be disposed on the other side of the door 620 facing one side of the door 620 where the passage 621 is formed.
  • the plate 632 may be disposed on the other side of the housing 622 facing one side of the housing 622 where the passage 621 is formed.
  • a plurality of perforations are formed in the plate 632 .
  • the area of the plurality of perforations may be smaller than the area of the passage 621 .
  • a plurality of perforated holes may be formed by vertically penetrating the plate 632 .
  • a plurality of perforated holes may be provided with the same diameter as each other.
  • a plurality of perforated holes may be provided with different diameters.
  • a through direction of the plurality of perforations may be formed in a direction parallel to a direction in which air current outside the process chamber 500 flows.
  • a plurality of perforated holes may be provided in parallel with a longitudinal direction of the passage 621 and a penetration direction within the plate 632 .
  • the plate 632 may be integrally formed with the housing 622 . However, it is not limited thereto, and the plate 632 may be separated from the housing 622 and disposed on the other side of the housing 622 .
  • the plurality of perforations are formed in the plate 632, airflow outside the process chamber 500 and particles included in the process chamber 500 according to the opening of the valve 624 collide with the portion of the plate 632 where the perforations are not formed. Accordingly, it is possible to minimize the flow of external air and particles included therein directly into the process chamber 500 due to the opening of the valve 624 . Also, when the valve 624 is opened, the flow rate of the external air flow flowing into the process chamber 500 may be reduced. Accordingly, rapid pressure fluctuations in the process chamber 500 may be minimized.
  • FIG. 9 is a schematic view of a door assembly according to another embodiment of FIG. 4 .
  • FIG. 10 is a diagram schematically showing the flow of air flow when the valve of FIG. 9 is moved to an open position.
  • a door assembly according to another embodiment of the present invention described below is provided similarly to the door assembly according to an embodiment of the present invention described in FIGS. 5 and 6 except for a plate. Accordingly, descriptions of similar configurations are omitted in order to exclude overlapping descriptions.
  • the plate 632 may be disposed on the other side of the door 620 facing one side of the door 620 where the passage 621 is formed.
  • the plate 632 may be disposed on the other side of the housing 622 facing one side of the housing 622 where the passage 621 is formed.
  • the plate 632 may be integrally formed with the housing 622 . However, it is not limited thereto, and the plate 632 may be separated from the housing 622 and disposed on the other side of the housing 622 .
  • the plate 632 When looking at the door 620 from the front, the plate 632 may have a first area and a second area.
  • the first region may include the center of the plate 632 .
  • the first area When the door 620 is viewed from the front in a state in which the valve 624 is in the closed position, the first area may be an area overlapping the passage 621 .
  • the second area may be an area surrounding the first area.
  • a plurality of perforations are formed in the plate 632 .
  • the area of the plurality of perforations may be smaller than the area of the passage 621 .
  • a plurality of perforated holes may be formed by vertically penetrating the plate 632 .
  • a plurality of perforated holes may be provided with the same diameter as each other.
  • a plurality of perforated holes may be provided with different diameters.
  • a through direction of the plurality of perforations may be formed in a direction parallel to a direction in which air current outside the process chamber 500 flows.
  • a plurality of perforated holes may be provided in parallel with a longitudinal direction of the passage 621 and a penetration direction within the plate 632 .
  • a plurality of perforated holes may be formed in the second area of the first area and the second area.
  • a plurality of perforated holes may be formed only in the second region.
  • the perforated member 630 since the perforated member 630 is disposed in the inner space of the door 620, the external air flow and particles included therein according to the opening of the valve 624 flow into the processing space 5200. inflow can be minimized. Specifically, particles included in the external airflow are primarily filtered by the filter 634 to prevent particles from being introduced into the processing space 5200 . Furthermore, the flow rate of the external airflow introduced through the passage 621 may be reduced by the filter 634 .
  • Particles included in the external air flow may be secondarily filtered by the plate 632 .
  • External airflow passes through the passage 621 and flows into the inner space of the housing 622 . Therefore, by not forming a perforation in the first area of the plate 632, the external airflow passing through the passage 621 collides with the first area where the perforation is not formed, thereby effectively reducing the flow rate of the external airflow. there is.
  • valve 624 In the above-described embodiments of the present invention, the case where the valve 624 is moved to an open position and a closed position to open and close the passage 621 has been described as an example. However, it is not limited thereto, and the valve 624 may be provided as an aperture capable of adjusting an aperture ratio. When the valve 624 moves to the open position, the iris of the valve 624 can be completely opened. When the valve 624 moves to the closed position, the iris of the valve 624 can be completely closed. When the valve 624 is intended to control the amount of airflow introduced from the outside of the process chamber 500, the valve 624 may control the amount of airflow introduced from the outside by adjusting the opening rate of the aperture.
  • valve 624 is moved up and down by the valve actuator 626 to move between a closed position and an open position, but is not limited thereto.
  • the valve actuator 626 can move the valve 624 left and right between an open position and a closed position.
  • the valve actuator 626 may move the valve 624 left and right on a horizontal plane.
  • valve actuator 626 can move valve 624 forward and backward on a horizontal plane. That is, the valve actuator 626 may move the valve 624 in one direction on a horizontal plane so as to cover the entire area of the passage 621 when viewed from the front. Also, when viewed from the front, the valve actuator 626 may move the valve 624 in one direction on a horizontal plane so that the valve 624 does not overlap the passage 621 .
  • valve actuator 626 may move the valve 624 diagonally as well as move the valve 624 up and down or left and right.
  • the valve actuator 626 may move the valve 624 in a curved manner based on one axis. For example, the valve 624 may be moved while drawing an arc by the valve actuator 626 .
  • FIG. 11 is a flowchart of a method for driving a door assembly according to an embodiment of the present invention.
  • FIG. 12 is a diagram schematically illustrating a plasma treatment step of FIG. 11 .
  • FIG. 13 is a diagram schematically showing the valve opening step of FIG. 11 .
  • FIG. 14 is a diagram schematically illustrating a door opening step of FIG. 11 .
  • FIG. 15 is a diagram schematically illustrating the step of unloading the substrate of FIG. 11 .
  • a method for driving a door assembly according to an embodiment of the present invention will be described in detail with reference to FIGS. 11 to 15 .
  • the door assembly driving method includes a plasma treatment step (S10), a valve opening step (S20), a door opening step (S30), a substrate unloading step (S40), and a substrate loading step. (S50), and valve closing and door closing steps (S60) may be sequentially performed.
  • the plasma processing step ( S10 ) plasma processing is performed on the substrate W in the process chamber 500 .
  • each of the door 620 and the valve 624 is positioned in a closed position. Accordingly, in the plasma processing step ( S10 ), the vacuum pressure may be maintained with respect to the inside of the processing space 5200 .
  • valve opening step (S20) in the valve opening step (S20), the valve 624 moves to an open position.
  • the valve 624 moves from the closed position to the open position.
  • the valve 624 may move vertically downward by the valve actuator 626 .
  • the valve 624 can slide downward by the valve actuator 626 .
  • the valve 624 may move to an open position when the substrate W is unloaded from the processing space 5200 .
  • the valve 624 may move downward.
  • the valve 624 moves a certain distance downward to form part of the passage 621. can be opened.
  • the valve 624 may move downward again to open the entire passage 621. That is, the valve 624 moves downward so that the opening rate of the passage 621 gradually increases from the point at which the plasma treatment of the substrate W is completed to the point at which the valve 624 fully opens the passage 621.
  • valve opening step S20 the valve 624 may be positioned at the fully open position until the external pressure of the process chamber 500 and the internal pressure of the process chamber 500 become equal.
  • the intake port 5201 is opened in the door opening step (S30) to be described later, it is possible to minimize the rapid flow of external airflow into the processing space 5200 due to the pressure difference.
  • the door 620 moves to an open position.
  • the door opening step (S30) after the valve 624 completely opens the passage 621 in the valve opening step (S20), the door 620 moves from the closed position to the open position.
  • the door 620 moves horizontally in a direction away from the carrying inlet 5201 .
  • the door 620 vertically moves downward.
  • the door 620 may further perform an inclined movement with respect to the ground. After the door 620 performs the inclined movement, the door 620 may move vertically in a downward direction.
  • the door opening step (S30) is completed.
  • the processed substrate W is unloaded from the process chamber 500 .
  • the processed substrate W is transported from the process chamber 500 to the transfer chamber 400 by the second transfer robot 420 .
  • the substrate loading step ( S50 ) the substrate W is loaded into the process chamber 500 .
  • the substrate loading step ( S50 ) the substrate W is loaded from the transfer chamber 400 into the process chamber 500 by the second transfer robot 420 .
  • valve closing and door closing step (S60) the valve 624 moves to the closed position and the door 620 moves to the closed position.
  • step S60 of closing the valve and closing the door after the substrate W is transported into the process chamber 500, the valve 624 and the door 620 are moved to a closed position.
  • the process of moving the valve 624 and the door 620 to the closed position proceeds in the reverse order of the valve opening step (S20) and the door opening step (S30), respectively.
  • the plasma treatment step (S10) is performed again.
  • the door assembly 600 is provided in the process chamber 500 and the door assembly 600 is driven in the process chamber 500 has been described.
  • the door assembly 600 may be provided in various chambers such as the load lock chamber 300 and the transfer chamber 400 .
  • the door assembly 600 may be applied to all chambers having entrances through which substrates enter and exit.

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Abstract

La présente invention concerne un appareil de traitement d'un substrat. L'appareil de traitement d'un substrat comprend : une chambre qui possède un espace de traitement destiné à traiter un substrat et une entrée par laquelle un substrat entre et sort ; une unité d'alimentation en gaz qui apporte un gaz de traitement à l'espace de traitement ; une unité de plasma qui produit un plasma à partir du gaz de traitement ; et un ensemble porte qui ouvre et ferme l'entrée, l'ensemble porte comprenant une porte qui ouvre et ferme l'entrée, et un actionneur de porte qui déplace la porte entre une position ouverte et une position fermée, et la porte peut comprendre un boîtier possédant un passage au niveau d'un côté de celui-ci, un flux d'air étant induit dans le passage, et un espace interne, un clapet qui ouvre ou ferme le passage, et un actionneur de clapet qui déplace le clapet entre une position ouverte et une position fermée.
PCT/KR2022/010490 2021-07-22 2022-07-19 Appareil de traitement de substrat et procédé d'entraînement d'ensemble porte WO2023003309A1 (fr)

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KR20150116003A (ko) * 2014-04-03 2015-10-15 피에스케이 주식회사 기판 처리 장치, 기판 처리 설비, 그리고 기판 처리 방법
KR101654619B1 (ko) * 2014-07-07 2016-09-23 세메스 주식회사 기판 처리 장치
US20200166154A1 (en) * 2017-06-30 2020-05-28 Vat Holding Ag Vacuum valve having a pressure sensor
KR20200049739A (ko) * 2017-10-26 2020-05-08 세메스 주식회사 기판 처리 장치 및 기판 처리 방법

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