WO2022268149A1 - 半导体工艺设备及其运动部件的控制方法和装置 - Google Patents

半导体工艺设备及其运动部件的控制方法和装置 Download PDF

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Publication number
WO2022268149A1
WO2022268149A1 PCT/CN2022/100658 CN2022100658W WO2022268149A1 WO 2022268149 A1 WO2022268149 A1 WO 2022268149A1 CN 2022100658 W CN2022100658 W CN 2022100658W WO 2022268149 A1 WO2022268149 A1 WO 2022268149A1
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action
current
sub
task
executed
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PCT/CN2022/100658
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English (en)
French (fr)
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朱金恒
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北京北方华创微电子装备有限公司
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Priority to KR1020237044930A priority Critical patent/KR20240013806A/ko
Priority to EP22827641.6A priority patent/EP4362072A1/en
Publication of WO2022268149A1 publication Critical patent/WO2022268149A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41865—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Definitions

  • the present application relates to the field of semiconductor process technology, and in particular to a control method and device for semiconductor process equipment and its moving parts.
  • the upper computer mainly includes a coordination module (Coordinator) and a scheduling module (Scheduler).
  • the scheduling module is used to calculate the optimized execution sequence of the process task (Job) according to the machine information input by the coordination module to ensure the production capacity of the machine; the coordination module is used to interact with the scheduling module, receive the action task sequence output from the scheduling module, and control
  • the lower computer (such as the transmission control module and/or the process control module, etc.) completes the corresponding process tasks.
  • One of the core functions of the control software in the host computer is to control the process tasks.
  • the coordination module will continuously receive the action sequences output from the scheduling module, and will assign the action tasks in the action sequences to The corresponding moving part (such as a robot arm or a slot cover) executes the action.
  • the process tasks output by the scheduling module include multiple action tasks (Move): Move1, Move2, ..., MoveN in Figure 1; each action task includes at least one sub-action object with a designed execution sequence (Action): As shown in Figure 1, Move1 includes Action11 and Action12, and Move2 includes Action21, Action22 and Action23; for each sub-action object, the coordination module will send the specific action name and parameters to be executed to the corresponding moving parts (Module), Each sub-action object is executed by the corresponding moving parts: as shown in Figure 1, Action11 in Move1 is executed by Module1, Action12 is executed by Module2, Action21 in Move2 is executed by Module1, and both Action22 and Action23 are executed by Module3.
  • Action11 in Move1 is executed by Module1
  • Action12 is executed by Module2
  • Action21 in Move2 is executed by Module1
  • both Action22 and Action23 are executed by Module3.
  • the coordination module will set the moving parts involved in all the sub-action objects contained in the action task as occupied until all the sub-action objects contained in the action task are executed, and the relevant moving parts will be occupied. will be released.
  • the motion part can continuously scan itself for sub-action objects that need to be executed, but it will only execute the sub-action objects in the motion task that sets itself as occupied.
  • This design can guarantee to a certain extent that before all the sub-action objects of the previous action task are completely executed, the relevant moving parts will not execute the sub-action objects of other action tasks, so that the sub-action objects of each action task can interact with each other. non-interference.
  • the occupancy mechanism of the moving parts is too absolute, which may easily lead to low utilization of the moving parts, which may affect the corresponding machine production capacity.
  • the present application provides a method and device for controlling semiconductor process equipment and its moving parts, so as to solve the problem of low utilization of moving parts in the traditional solution, which may affect the production capacity of the machine.
  • the first aspect of the present application provides a method for controlling moving parts in semiconductor process equipment, the semiconductor process equipment includes a plurality of moving parts, and the control method includes:
  • the sub-action object to be executed is configured to be executed after the current sub-action object
  • the moving state of the current moving part is set as available.
  • control method before the acquisition of the current action task, the control method further includes:
  • control method further includes:
  • the standby moving parts include the current moving part, maintaining the motion state of the current moving part as occupied.
  • control method further includes:
  • the motion states of each associated motion component are set to be available.
  • control method further includes:
  • the second aspect of the present application provides a control device for moving parts in semiconductor process equipment, the semiconductor process equipment includes a plurality of moving parts, and the control device includes:
  • an acquisition unit configured to acquire a current action task, where the current action task includes a plurality of sub-action objects
  • a first determining unit configured to determine a current sub-action object and a sub-action object to be executed from the plurality of sub-action objects, the sub-action object to be executed is configured to be executed after the current sub-action object;
  • a first control unit configured to control the current moving part associated with the current sub-action object to execute the current sub-action object
  • the second determination unit is configured to determine the motion component to be used associated with the sub-action object to be executed after the execution of the current sub-action object;
  • a first setting unit configured to set the motion state of the current motion part as available when the motion part to be used does not include the current motion part.
  • control device also includes:
  • a receiving unit configured to receive multiple action tasks, and use the action task received first as the current action task
  • An identification unit configured to identify the moving parts associated with each sub-action object in the current action task
  • the second setting unit is configured to set the motion state of the moving parts associated with each sub-action object to be occupied.
  • the first setting unit is also used for:
  • the standby moving parts include the current moving part, maintaining the motion state of the current moving part as occupied.
  • control device also includes:
  • a second control unit configured to control the to-be-used moving parts to sequentially execute the to-be-executed sub-action objects
  • the third setting unit is configured to set the motion state of each associated motion component as available after all sub-action objects of the current motion task are executed.
  • control device also includes:
  • a third determining unit configured to determine whether a sub-action object associated with the current moving part is included in the action task after the current action task;
  • a third control unit configured to control the current moving part to execute the sub-action object in advance when the action task following the current action task contains a sub-action object associated with the current moving part.
  • a third aspect of the present application provides a semiconductor process equipment, including a control device for any moving part in the semiconductor process equipment described above.
  • the method and device for controlling semiconductor process equipment and its moving parts described above in the present application determine the current sub-action object and the sub-action object to be executed from multiple sub-action objects by obtaining the current action task, and control the current moving part to execute the current sub-action object. After executing the current sub-action object, determine the motion parts to be used associated with the sub-action object to be executed. When the motion parts to be used do not include the current motion part, set the motion state of the current motion part to available, so that it can be released in advance The current moving part makes the current moving part available for other action tasks without waiting until all sub-action objects contained in the action task are executed, which provides the possibility for the early execution of other action tasks.
  • a mechanism for executing the sub-action objects associated with the current moving part in advance is added to further improve the utilization rate of the moving part and the continuity of actions with other moving parts, shorten the execution time of the corresponding action task, and shorten the process task. The total execution time, thereby increasing machine productivity.
  • Figure 1 is a schematic diagram of the relationship between action tasks and moving parts of semiconductor process equipment
  • Fig. 2 is a schematic diagram of a traditional moving part control process
  • FIG. 3 is a schematic flowchart of a method for controlling moving parts in semiconductor process equipment according to an embodiment of the present application
  • FIG. 4 is a schematic flowchart of a control method for moving parts in conductor processing equipment according to another embodiment of the present application.
  • Fig. 5 is a schematic diagram of the motion state setting process of the current action task-associated motion parts in an embodiment of the present application
  • Fig. 6 is a schematic diagram of the execution process of a specific sub-action object in an embodiment of the present application.
  • FIG. 7 is a schematic structural diagram of a control device for moving parts in semiconductor process equipment in an embodiment of the present application.
  • FIG. 8 is a schematic structural diagram of semiconductor process equipment in an embodiment of the present application.
  • the action task execution process described in FIG. 2 can be referred to.
  • the coordination module receives the action task from the scheduling module, and identifies whether the moving parts corresponding to each sub-action object in the action task In the available state, set all relevant moving parts to be occupied, and then execute each sub-action object in turn. After all sub-action objects are executed, set the related moving parts to be available, and the current action task is executed at this time.
  • analyze the status of each action task output by the scheduling module the Move1 task will occupy Module1 and Module2.
  • the Move2 task will occupy Module1 and Module3.
  • Module1 will be in a non-action state after executing the task of Action11, but because Module1 itself is occupied by Move1, it needs to wait until all sub-action objects contained in the Action task of Move1 are executed before being released, resulting in the task of Move2 being inactive. It will not start until all child action objects have executed. It can be seen that in the traditional action task execution process, the occupation mechanism of the moving parts is too absolute, resulting in low utilization of the moving parts and easily affecting the production capacity of the machine.
  • this application provides a control method and device for semiconductor process equipment and its moving parts, which newly establishes a monitoring mechanism for the execution completion timing of sub-action objects.
  • the current moving part executes the current sub-action object, detect the relationship between the to-be-used moving part and the current moving part, if the waiting moving part does not include the current moving part, then set the motion state of the current moving part to be There is an opportunity to update the motion state before the current action task is completed, so that it is possible to release the current moving parts in advance, which can improve the utilization rate of the moving parts released in advance, thereby increasing the machine capacity.
  • the first aspect of the present application provides a method for controlling moving parts in semiconductor process equipment.
  • the semiconductor process equipment includes a plurality of moving parts. Referring to FIG. 3, the above control method includes:
  • S220 Determine a current sub-action object and a sub-action object to be executed from a plurality of sub-action objects, and the sub-action object to be executed is configured to be executed after the current sub-action object;
  • the scheduling module of the semiconductor process equipment sets the flow of each action task in the program design stage, so that each action task includes at least one sub-action object, and at least one sub-action object is executed in sequence.
  • the coordination module obtains the action task to be executed, identifies each sub-action object included in the action task, and sequentially controls the corresponding moving parts to execute each sub-action object according to the execution sequence.
  • a moving part executes a sub-action object, it will continuously feed back its motion status (such as availability or occupancy) to the coordination module, so that the coordination module can monitor the execution completion timing of all sub-action objects in the action task.
  • the coordination module acquires the current action task and controls each moving part to execute the corresponding sub-action object.
  • the sub-action object being executed is the current sub-action object
  • the sub-action object whose execution sequence is after the current sub-action object is the To execute a sub-action object
  • the moving part associated with the current sub-action object is the current moving part
  • the moving part associated with the sub-action object to be executed is the waiting moving part.
  • the above-mentioned current motion components include various motion components that execute and assist the execution of the current sub-action object
  • the to-be-used motion components include various motion components that execute and assist the execution of each to-be-executed sub-action object.
  • the to-be-used moving part associated with the to-be-executed sub-action object is determined, and when the to-be-used moving part does not include the current moving part, the motion state of the current moving part is set to It can be used to update the motion state of the current moving part before the current action task is completed, so that the current moving part has the opportunity to update the motion state before the current action task is completed, so that the current moving part can be released in advance, which can improve the movement of the early release Component utilization.
  • control method of the above-mentioned moving parts in the semiconductor process equipment can also refer to FIG. 4 .
  • control method provided in this embodiment before the acquisition of the current action task, it may also include:
  • the action task received first is used as the current action task
  • the moving parts associated with each sub-action object in the current action task are identified, and the motion state of each identified moving part is set.
  • the corresponding moving parts are sequentially controlled to execute each sub-action object according to the execution sequence, so that the current action task can be executed in time, that is, the first received action task is executed in time, which is conducive to maintaining the order in the process of executing each action task sex.
  • setting the motion states of the moving parts associated with each sub-action object to be occupied may include:
  • step S132 judging whether the motion states of the moving parts associated with each sub-action object are available; if so, then execute step S133;
  • Each moving part associated with each sub-action object is used to execute the current action task after being released by other action tasks to ensure the execution effect of other action tasks;
  • the coordination module of the semiconductor process equipment may also set the current action task according to other rules. For example, if multiple received action tasks carry priority flags, the action task with the highest priority may be set as the current action task, and so on.
  • control method may further include:
  • the moving parts to be used include the current moving part, keep the motion state of the current moving part as occupied, so that the current moving part continues to be used to execute the corresponding sub-action object in the current action task, so as to ensure the smooth execution of the current action task.
  • control method after setting the current motion state of the moving part as available or keeping the current motion state of the moving part as occupied, the control method further includes:
  • the motion states of each associated motion component are set to be available.
  • the motion state of each associated moving part is set to be available, so that these moving parts can be called by other action tasks, which can further ensure the utilization of these moving parts Rate.
  • control method after setting the current motion state of the moving part to be available, the control method further includes:
  • the sub-action object associated with the current moving part can be called a specific sub-action object, and the specific sub-action object includes one or more actions that need to be executed first. After the motion state is set to available, even if it is set to be occupied by other action tasks, it will definitely execute the specific sub-action object first before executing the sub-action objects corresponding to other action tasks.
  • a specific sub-action object can be regarded as The previous action or the first few actions of other action tasks.
  • the moving part is controlled to execute a specific sub-action object first.
  • the next action of this moving part when the next action of this moving part can be determined, the next action task has been executed in advance.
  • the next action task has been executed in advance.
  • only the specific sub-action object executed in advance can be detected to save the corresponding execution time; in other cases, although it is still possible to execute this movement
  • the specific sub-action object that the component has executed in advance, but once the moving part is in the state of executing the specific sub-action object, the related action service program will return immediately, and will not repeatedly execute the specific sub-action object, which can still reduce time consumption .
  • the coordination module After the coordination module makes the transmission component available, it controls the transmission component to perform the homing action in advance; if the transmission component is performing other action tasks after the transmission sub-action object, the coordination module can only perform the homing action that requires At this time, the execution time of the homing action can be saved; if the coordination module still needs to control the transmission component to perform the homing action, since the transmission component is already in the state of executing the homing action, the action service program will return immediately , at this time, the time consumption corresponding to the homing action can still be reduced.
  • the wafer pick-and-place action includes opening the wafer cassette (OpenerLoad), take out the wafer from the wafer box (PickWaferFromOpener) and exchange wafers to the central transfer unit (PlaceWaferToCTU) three sub-action objects
  • the wafer box transfer action includes closing the wafer box (OpenerUnload), switching the module from the wafer box Take out the wafer box (PickFoupFromOpener) and transfer the wafer box to the wafer box buffer
  • the moving parts associated with the wafer pick-and-place action include the wafer box switch module (Opener), the wafer pick-and-place robot (WHR) and the central transmission unit (CTU).
  • the specific execution process is: the wafer box switch module opens the wafer box, The wafer pick-and-place manipulator takes out the wafers from the opened wafer cassette, and the wafer pick-and-place manipulator alternately takes out the wafers to the central transfer unit; it can be seen that the wafer cassette associated with the wafer cassette switch module is opened, and the wafer is taken out from the wafer cassette.
  • the wafer-associated wafer cassette switch module and the wafer pick-and-place manipulator interact with the wafer-associated wafer pick-and-place manipulator and the central transfer unit to the central transfer unit.
  • the moving parts associated with the cassette transfer action include the cassette switch module, the cassette transfer robot (FTR) and the cassette buffer table (Shelf).
  • the specific execution process is: the cassette switch module closes the cassette, the cassette Cassette transfer manipulator takes out the cassette from the cassette switch module, and transfers the cassette to the cassette buffer station; it can be seen that the wafer cassette associated with the cassette switch module is closed, and the cassette is taken out from the cassette switch module Associate the wafer cassette switch module with the wafer cassette transfer manipulator, and transfer the wafer cassette to the wafer cassette buffer station.
  • closing the pod means that after the pod switch module is made available, the associated sub-action objects (specific sub-action objects) in other subsequent action tasks are executed.
  • the wafer is taken out from the wafer cassette, which is realized by the wafer pick-and-place action.
  • the empty wafer cassette is passed to the wafer cassette buffer table for buffering, and the wafer cassette switch module is vacated to continue to be used for the incoming and outgoing of subsequent wafers, which are transferred by the wafer cassette The action is realized.
  • the associated wafer cassette switch module is not associated with the subsequent exchange of wafers to the central transmission unit, and the movement state of the wafer cassette switch module can be set If it is available, it is released early, which makes it possible to start and execute the cassette transfer action in advance.
  • the wafer cassette switch module can be released and continue to execute closing the wafer.
  • the specific sub-action object of box when both the pod switch module and the pod buffer table are available, and the pod transfer action meets the start execution conditions, according to the execution sequence of the designed sub-action objects, in some cases first It is still possible to execute the action of closing the wafer cassette, but the closing of the wafer cassette has been completed in advance, so the service of the lower computer will return immediately, which can still reduce the time consumption of executing the closing of the wafer cassette.
  • the above control method of moving parts in semiconductor process equipment aims at the problems existing in the action execution mechanism of moving parts in semiconductor process equipment, improves the control process of sub-action objects, increases the mechanism of releasing moving parts in advance and executes the follow-up response of moving parts in advance, etc.
  • the mechanism of action tasks that must be executed first can improve the utilization rate of moving parts and the continuity of actions with other moving parts, shorten the execution time of corresponding action tasks, thereby shortening the total execution time of corresponding process tasks, and then improve Corresponding machine capacity.
  • the present application provides a control device for moving parts in semiconductor process equipment, wherein the semiconductor process equipment includes a plurality of moving parts, as shown in FIG. 7 , the control device includes:
  • An acquiring unit 210 configured to acquire a current action task, where the current action task includes multiple sub-action objects;
  • the first determining unit 220 is configured to determine a current sub-action object and a sub-action object to be executed from the plurality of sub-action objects, and the sub-action object to be executed is configured to be executed after the current sub-action object;
  • the first control unit 230 is configured to control the current moving part associated with the current sub-action object to execute the current sub-action object;
  • the second determining unit 240 is configured to, after executing the current sub-action object, determine the motion component to be used associated with the sub-action object to be executed;
  • the first setting unit 250 is configured to set the motion state of the current motion part as available when the to-be-used motion part does not include the current motion part.
  • control device also includes:
  • a receiving unit configured to receive multiple action tasks, and use the first received action task as the current action task
  • An identification unit configured to identify moving parts associated with each sub-action object in the current action task
  • the second setting unit is configured to set the motion states of the moving parts associated with each sub-action object as occupied.
  • the first setting unit is also used for:
  • the standby moving parts include the current moving part, maintaining the motion state of the current moving part as occupied.
  • control device also includes:
  • a second control unit configured to control the to-be-used moving parts to sequentially execute the to-be-executed sub-action objects
  • the third setting unit is configured to set the motion state of each associated motion component as available after all sub-action objects of the current motion task are executed.
  • control device also includes:
  • a third determining unit configured to determine whether a sub-action object associated with the current moving part is included in the action task after the current action task;
  • a third control unit configured to control the current moving part to execute the sub-action object in advance when the action task following the current action task contains a sub-action object associated with the current moving part.
  • Each unit in the control device of the moving parts in the above-mentioned semiconductor process equipment can be fully or partially realized by software, hardware and a combination thereof.
  • Each of the above units may be embedded in or independent of the processor in the computer device in the form of hardware, and may also be stored in the memory of the computer device in the form of software, so that the processor can invoke and execute the corresponding operations of the above units.
  • the present application provides a semiconductor process equipment, including the control device for moving parts in the semiconductor process equipment described in any one of the above embodiments, which has all the beneficial effects of the above control device, and the production capacity of the machine is effectively improved.
  • the semiconductor process equipment includes a processor, a storage medium, and a plurality of moving parts; program codes are stored on the storage medium; the processor is used for The program code stored in the storage medium is called to execute the method for controlling the moving parts in the semiconductor process equipment described in any one of the above embodiments.
  • the above-mentioned semiconductor process equipment executes the control method of the moving parts in the above-mentioned semiconductor process equipment, a mechanism for releasing the moving parts in advance and a mechanism for executing the sub-action objects associated with the moving parts in advance, so as to improve the utilization rate of the moving parts, and The continuity of actions among other moving parts shortens the execution time of corresponding action tasks, thereby shortening the total execution time of process tasks and improving machine productivity.
  • first and second are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, features defined as “first” and “second” may explicitly or implicitly include one or more features. In the description of the present application, “plurality” means two or more, unless otherwise specifically defined.

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Abstract

本申请公开一种半导体工艺设备及其运动部件的控制方法和装置，其中控制方法包括：获取当前动作任务，所述当前动作任务包括多个子动作对象；确定当前子动作对象和待执行子动作对象，所述待执行子动作对象被配置为在所述当前子动作对象之后执行；控制与所述当前子动作对象关联的当前运动部件执行所述当前子动作对象；在执行完所述当前子动作对象之后，确定与所述待执行子动作对象关联的待用运动部件；在所述待用运动部件不包括所述当前运动部件时，将所述当前运动部件的运动状态设置为可用。其可以提高运动部件的利用率，缩短相应动作任务的执行时间，从而缩短工艺任务的总执行时间，提高相应机台产能。

Description

半导体工艺设备及其运动部件的控制方法和装置 技术领域
本申请涉及半导体工艺技术领域，具体涉及一种半导体工艺设备及其运动部件的控制方法和装置。
背景技术
在半导体工艺设备(例如晶圆清洗设备)中，上位机主要包括协调模块(Coordinator)和调度模块(Scheduler)。调度模块用于根据协调模块输入的机台信息，计算工艺任务(Job)的优化执行序列，保障机台产能；协调模块用于与调度模块交互，接收从调度模块输出的动作任务序列，并控制下位机(如传输控制模块和/或工艺控制模块等)完成对应的工艺任务。上位机中控制软件的核心功能之一是对工艺任务的控制，在执行工艺任务的过程中，协调模块会不断收到来自调度模块输出的动作序列，并会将动作序列中的动作任务分配给对应的运动部件(比如机械手或者槽盖)执行动作。
具体可以参考图1所示，调度模块输出的工艺任务包括多个动作任务(Move)：如图1中Move1、Move2、…、MoveN；各个动作任务包括至少一个设计好了执行顺序的子动作对象(Action)：如图1中Move1包括Action11和Action12，Move2包括Action21、Action22和Action23；针对每个子动作对象，协调模块会将具体要执行的动作名称及参数发送给对应的运动部件(Module)，由对应的运动部件执行各个子动作对象：如图1所示Move1中Action11由Module1执行，Action12由Module2执行，Move2中Action21由Module1执行，Action22和Action23均由Module3执行。其中，每个动作任务开始执行前，协调模块会将该动作任务包含的所有子动作对象涉及到的运动部件设置为占用，直到该动作任务包含的所有子动作对象都执行完，相 关运动部件才会被释放。运动部件可以持续扫描自己是否有子动作对象需要执行，但只会执行把自己设置为占用的动作任务中的子动作对象。这种设计可以在一定程度上保证上一个动作任务的所有子动作对象没有完全执行完前，相关运动部件不会去执行其它动作任务的子动作对象，使各个动作任务之间的子动作对象互不干涉。然而，上述动作任务在执行过程中，对运动部件的占用机制过于绝对，容易导致运动部件的利用率低，从而可能影响对应的机台产能。
发明内容
鉴于此，本申请提供一种半导体工艺设备及其运动部件的控制方法和装置，以解决传统方案中运动部件利用率低，可能影响机台产能的问题。
本申请第一方面提供一种半导体工艺设备中运动部件的控制方法，所述半导体工艺设备包括多个运动部件，所述控制方法包括：
获取当前动作任务，所述当前动作任务包括多个子动作对象；
从所述多个子动作对象中确定当前子动作对象和待执行子动作对象，所述待执行子动作对象被配置为在所述当前子动作对象之后执行；
控制与所述当前子动作对象关联的当前运动部件执行所述当前子动作对象；
在执行完所述当前子动作对象之后，确定与所述待执行子动作对象关联的待用运动部件；
在所述待用运动部件不包括所述当前运动部件时，将所述当前运动部件的运动状态设置为可用。
可选地，在所述获取当前动作任务之前，所述控制方法还包括：
接收多个动作任务，将最先接收到的所述动作任务作为所述当前动作任务；
识别所述当前动作任务中与各个子动作对象关联的运动部件；
将与各个子动作对象关联的运动部件的运动状态均设置为占用。
可选地，在所述确定与所述待执行子动作对象关联的待用运动部件之后，所述控制方法还包括：
在所述待用运动部件包括所述当前运动部件时，将所述当前运动部件的运动状态保持为占用。
可选地，在所述将所述当前运动部件的运动状态设置为可用或者将所述当前运动部件的运动状态保持为占用之后，所述控制方法还包括：
控制所述待用运动部件依次执行所述待执行子动作对象；
在所述当前动作任务的所有子动作对象均执行完成后，将各个关联的运动部件的运动状态均设置为可用。
可选地，在所述将所述当前运动部件的运动状态设置为可用之后，所述控制方法还包括：
确定所述当前动作任务之后的所述动作任务中，是否包含与所述当前运动部件关联的子动作对象；
若是，则控制所述当前运动部件提前执行该子动作对象。
本申请第二方面提供一种半导体工艺设备中运动部件的控制装置，所述半导体工艺设备包括多个运动部件，所述控制装置包括：
获取单元，用于获取当前动作任务，所述当前动作任务包括多个子动作对象；
第一确定单元，用于从所述多个子动作对象中确定当前子动作对象和待执行子动作对象，所述待执行子动作对象被配置为在所述当前子动作对象之后执行；
第一控制单元，用于控制与所述当前子动作对象关联的当前运动部件执行所述当前子动作对象；
第二确定单元，用于在执行完所述当前子动作对象之后，确定与所述待执行子动作对象关联的待用运动部件；
第一设置单元，用于在所述待用运动部件不包括所述当前运动部件时，将所述当前运动部件的运动状态设置为可用。
可选地，所述控制装置还包括：
接收单元，用于接收多个动作任务，将最先接收到的所述动作任务作为所述当前动作任务；
识别单元，用于识别所述当前动作任务中与各个子动作对象关联的运动部件；
第二设置单元，用于将各个子动作对象关联的运动部件的运动状态均设置为占用。
可选地，所述第一设置单元还用于：
在所述待用运动部件包括所述当前运动部件时，将所述当前运动部件的运动状态保持为占用。
可选地，所述控制装置还包括：
第二控制单元，用于控制所述待用运动部件依次执行所述待执行子动作对象；
第三设置单元，用于在所述当前动作任务的所有子动作对象均执行完成后，将各个关联的运动部件的运动状态均设置为可用。
可选地，所述控制装置还包括：
第三确定单元，用于确定所述当前动作任务之后的所述动作任务中，是否包含与所述当前运动部件关联的子动作对象；
第三控制单元，用于在所述当前动作任务之后的所述动作任务中包含与所述当前运动部件关联的子动作对象时，控制所述当前运动部件提前执行该子动作对象。
本申请第三方面提供一种半导体工艺设备，包括上述任一种半导体工艺设备中运动部件的控制装置。
本申请上述半导体工艺设备及其运动部件的控制方法和装置，通过获取当前动作任务，从多个子动作对象中确定当前子动作对象和待执行子动作对象，控制当前运动部件执行当前子动作对象，在执行完当前子动作对象之后，确定与待执行子动作对象关联的待用运动部件，在待用运动部件不包括当前运动部件时，将当前运动部件的运动状态设置为可用，这样可以提前释放当前运动部件，使当前运动部件可供其他动作任务调用，无需等到动作任务包含的所有子动作对象都执行完，为其他动作任务的提前执行提供可能性。进一步的，还增设提前执行当前运动部件后续关联的子动作对象的机制，进一步提高运动部件的利用率，以及与其他运动部件间动作的连贯性，缩短相应动作任务的执行时间，从而缩短工艺任务的总执行时间，进而提高机台产能。
附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是半导体工艺设备的动作任务与运动部件之间的关系示意图；
图2是传统的运动部件控制过程示意图；
图3是本申请一实施例的半导体工艺设备中运动部件的控制方法流程示意图；
图4是本申请另一实施例的导体工艺设备中运动部件的控制方法流程示意图；
图5是本申请一实施例中当前动作任务关联运动部件的运动状态设置过程示意图；
图6是本申请一实施例中特定子动作对象的执行过程示意图；
图7是本申请一实施例中半导体工艺设备中运动部件的控制装置结构示意图；
图8是本申请一实施例中半导体工艺设备的结构示意图。
具体实施方式
背景技术所述的动作任务执行过程可以参考图2所示，协调模块收到调度模块的动作任务，识别动作任务中各个子动作对象对应的运动部件是否都处于可用状态，在各个运动部件都处于可用状态时，将所有相关运动部件设置为占用，再依次执行各个子动作对象，在所有子动作对象执行完成后，将所述相关运动部件设置为可用，此时当前的动作任务执行完毕。结合图1对调度模块输出的各个动作任务情况进行分析：Move1任务会占用Module1和Module2。Move2任务会占用Module1和Module3。Module1在执行完Action11的任务后，会处于无动作的状态，但由于Module1本身被Move1占用，需等待到Move1动作任务包含的所有子动作对象都执行完，才会被释放，导致Move2的任务在所有子动作对象都执行完之前也不会启动。可见传统的动作任务执行过程中，对运动部件的占用机制过于绝对，导致运动部件利用率低，容易影响机台产能，具体表现为对于只是在动作任务的开始阶段执行一次动作的运动部件(后续其它运动部件的动作也不会对此运动部件的动作产生干扰)，在执行完当前动作任务分配的动作后，会长时间处于空闲状态，无法执行其它动作任务。
针对目前半导体工艺设备中运动部件的动作执行机制存在的问题，本申请提供一种半导体工艺设备及其运动部件的控制方法和装置，其新设了子动作对象的执行完成时机的监测机制，在当前运动部件执行完当前子动作对象后，检测待用运动部件与当前运动部件的关系，若待用运动部件不包括当前 运动部件，则将当前运动部件的运动状态设置为可用，使当前运动部件在当前动作任务完成前具有更新运动状态的机会，这样当前运动部件提前释放成为可能，能够提高得到提前释放的运动部件的利用率，从而提高机台产能。
下面结合附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本申请一部分实施例，而非全部实施例。基于本申请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。在不冲突的情况下，下述各个实施例及其技术特征可以相互组合。
本申请第一方面提供一种半导体工艺设备中运动部件的控制方法，该半导体工艺设备包括多个运动部件，参考图3所示，上述控制方法包括：
S210，获取当前动作任务，该当前动作任务包括多个子动作对象；
S220，从多个子动作对象中确定当前子动作对象和待执行子动作对象，所述待执行子动作对象被配置为在所述当前子动作对象之后执行；
S230，控制与所述当前子动作对象关联的当前运动部件执行所述当前子动作对象；
S240，在执行完所述当前子动作对象之后，确定与所述待执行子动作对象关联的待用运动部件；
S250，在所述待用运动部件不包括所述当前运动部件时，将所述当前运动部件的运动状态设置为可用。
半导体工艺设备的调度模块在程序设计阶段设置各个动作任务的流程，使各个动作任务包括至少一个子动作对象，至少一个子动作对象按顺序执行。协调模块获取需要执行的动作任务，识别该动作任务包括的各个子动作对象，按照执行顺序依次控制对应的运动部件执行各个子动作对象。运动部件在执行某个子动作对象时，会持续反馈其运动状态(例如可用或占用)给协调模块，使协调模块能够对该动作任务中所有子动作对象的执行完成时机进行监 测。
具体地，协调模块获取当前动作任务，控制各个运动部件执行其中对应子动作对象的过程中，正在执行的子动作对象为当前子动作对象，执行顺序在当前子动作对象之后的子动作对象为待执行子动作对象，当前子动作对象关联的运动部件为当前运动部件，待执行子动作对象关联的运动部件为待用运动部件。上述当前运动部件包括执行和协助执行当前子动作对象的各个运动部件，待用运动部件包括执行和协助执行各个待执行子动作对象的各个运动部件。
本实施例在当前运动部件执行完当前子动作对象后，确定与待执行子动作对象关联的待用运动部件，在待用运动部件不包括当前运动部件时，将当前运动部件的运动状态设置为可用，以在当前动作任务完成前更新当前运动部件的运动状态，使当前运动部件在当前动作任务完成前具有更新运动状态的机会，这样当前运动部件提前释放成为可能，能够提高得到提前释放的运动部件的利用率。
在一个实施例中，上述半导体工艺设备中运动部件的控制方法也可以参考图4所示，本实施例提供的控制方法中，在所述获取当前动作任务之前，还可以包括：
S110，接收多个动作任务，将最先接收到的动作任务作为上述当前动作任务；
S120，识别上述当前动作任务中与各个子动作对象关联的运动部件；
S130，将各个子动作对象关联的运动部件的运动状态均设置为占用。
本实施例在接收多个动作任务时，将最先接收到的动作任务作为当前动作任务，识别当前动作任务中各个子动作对象关联的运动部件，将所识别的各个运动部件的运动状态均设置为占用后，按照执行顺序依次控制对应的运动部件执行各个子动作对象，使当前动作任务得到及时执行，即及时执行最 先接收到的动作任务，有利于维持执行各个动作任务过程中的有序性。
具体地，参考图5所示，上述步骤S130，将各个子动作对象关联的运动部件的运动状态均设置为占用可以包括：
S131，识别各个子动作对象关联的运动部件的运动状态；
S132，判断各个子动作对象关联的运动部件的运动状态是否均为可用；若是，则执行步骤S133；若否，则返回执行步骤S132，直至检测到所关联的各个运动部件均为可用，以使各个子动作对象关联的各个运动部件在被其他动作任务释放后再用于执行当前动作任务，确保其他动作任务的执行效果；
S133，将各个子动作对象关联的运动部件的运动状态均设为占用，以使这些运动部件均用于执行当前动作任务；
在其他实施例中，半导体工艺设备的协调模块也可以按照其他规则设置当前动作任务。例如，若接收的多个动作任务携带优先级标志，则可以将其中最高优先级的动作任务设为当前动作任务，等等。
进一步地，参考图4所示，在所述确定与所述待执行子动作对象关联的待用运动部件之后，上述控制方法还可以包括：
S260，在所述待用运动部件包括所述当前运动部件时，将所述当前运动部件的运动状态保持为占用。
这里在待用运动部件包括当前运动部件时，将当前运动部件的运动状态保持为占用，使当前运动部件继续用于执行当前动作任务中相应子动作对象，以保证当前动作任务得到顺利执行。
在一个示例中，在所述将所述当前运动部件的运动状态设置为可用或者将所述当前运动部件的运动状态保持为占用之后，所述控制方法还包括：
控制所述待用运动部件依次执行所述待执行子动作对象；
在所述当前动作任务的所有子动作对象均执行完成后，将各个关联的运动部件的运动状态均设置为可用。
本示例在当前动作任务的所有子动作对象均执行完成后，将关联的各个运动部件的运动状态均设置为可用，使这些运动部件均可供其他动作任务调用，可用进一步保证这些运动部件的利用率。
在一个实施例中，参考图6所示，在所述将所述当前运动部件的运动状态设置为可用之后，所述控制方法还包括：
S271，确定所述当前动作任务之后的所述动作任务中，是否包含与所述当前运动部件关联的子动作对象；若是，则执行步骤S272；若否，则所述当前运动部件不动作；
S272，控制所述当前运动部件提前执行该子动作对象。
本实施例中，上述与当前运动部件关联的子动作对象可以称为特定子动作对象，该特定子动作对象包括需要优先执行的一个或者几个动作，所谓优先执行，是指在当前运动部件的运动状态设置为可用之后，即使被其他动作任务设为占用，也一定会在执行其他动作任务对应的子动作对象之前，优先执行该特定子动作对象，换句话说，特定子动作对象可以视为其他动作任务的前一个动作或者前几个动作。
具体地，在某运动部件设置为可用之后，控制该运动部件先执行特定子动作对象，根据相关业务流程，可以确定此运动部件的下个动作时，已提前执行下个动作任务关于此运动部件的特定子动作对象。在一些情况下，当下个关联此运动部件动作的动作任务启动时，可以仅对提前执行的特定子动作对象进行检测，节省对应的执行时间；在另外一些情况下，虽然还是可能要执行此运动部件已提前执行的特定子动作对象，但一旦此运动部件已经处于执行完特定子动作对象的状态，相关动作服务程序便会立刻返回，不会重复执行特定子动作对象，这仍然可以减少时间消耗。
以某传输部件执行传输子动作对象为例进行说明，该传输部件在当前动作任务中完成传输子动作对象后，被设置为可用，其在执行之后的其他动作 任务中的传输子动作对象时，需要先执行归位动作，这一归位动作便为该传输部件对应的特定子动作对象。协调模块将该传输部件置为可用之后，控制该传输部件提前执行该归位动作；若该传输部件在执行之后其他动作任务的传输子动作对象时，协调模块可以仅对需该归位动作进行检测，此时可以节省归位动作的执行时间；若协调模块还需要控制该传输部件执行该归位动作，由于该传输部件已经处于执行完归位动作的状态，其中动作服务程序便会立刻返回，此时仍然可以减少归位动作对应的时间消耗。
在一个示例中，以某半导体清洗设备(如300mm Cassette-less)中，将晶圆从晶圆盒(Foup盒)中取出的过程为例对上述半导体工艺设备中运动部件的控制方法进行说明，上述将晶圆从晶圆盒中取出的过程包括表1所示两个动作任务：晶圆取放动作(WHRTransferMove)和晶圆盒传送动作(FTRFoupMove)；晶圆取放动作包括开启晶圆盒(OpenerLoad)、从晶圆盒取出晶圆(PickWaferFromOpener)和向中央传输单元交互晶圆(PlaceWaferToCTU)三个子动作对象；晶圆盒传送动作包括关闭晶圆盒(OpenerUnload)、从晶圆盒开关模块取出晶圆盒(PickFoupFromOpener)和向晶圆盒缓存台传送晶圆盒(PlaceFoupToShelf)三个子动作对象。晶圆取放动作关联的运动部件包括晶圆盒开关模块(Opener)、晶圆取放机械手(WHR)和中央传输单元(CTU)，具体执行过程为：晶圆盒开关模块开启晶圆盒，晶圆取放机械手从开启的晶圆盒中取出晶圆，晶圆取放机械手向中央传输单元交互取出的晶圆；可见，开启晶圆盒关联晶圆盒开关模块，从晶圆盒取出晶圆关联晶圆盒开关模块和晶圆取放机械手，向中央传输单元交互晶圆关联晶圆取放机械手和中央传输单元。晶圆盒传送动作关联的运动部件包括晶圆盒开关模块、晶圆盒传输机械手(FTR)和晶圆盒缓存台(Shelf)，具体执行过程为：晶圆盒开关模块关闭晶圆盒、晶圆盒传输机械手从晶圆盒开关模块取出晶圆盒，并向晶圆盒缓存台传送晶圆盒；可见，关闭晶圆盒关联晶圆盒开 关模块，从晶圆盒开关模块取出晶圆盒关联晶圆盒开关模块和晶圆盒传输机械手，向晶圆盒缓存台传送晶圆盒关联晶圆盒传输机械手和晶圆盒缓存台。其中，关闭晶圆盒为晶圆盒开关模块被置为可用之后，执行之后的其他动作任务中关联的子动作对象(特定子动作对象)。
表1
Figure PCTCN2022100658-appb-000001
如表1所示，晶圆从晶圆盒中取出，由晶圆取放动作实现。晶圆被取出后，空晶圆盒被传到晶圆盒缓存台上缓存起来，将晶圆盒开关模块空出来，以继续用于后续晶圆的传入、传出，由晶圆盒传送动作实现。晶圆取放动作中，从晶圆盒取出晶圆执行完后，其关联的晶圆盒开关模块与后续向中央传输单元交互晶圆没有关联，晶圆盒开关模块的运动状态便可以被设置为可用，得到提前释放，令晶圆盒传送动作提前启动执行成为可能。
在需要执行晶圆盒传送动作时，如果此时晶圆盒传输机械手正在忙于其它动作任务，在晶圆取放动作执行过程中，可以在晶圆盒开关模块被释放后，继续执行关闭晶圆盒这一特定子动作对象，当晶圆盒开关模块和晶圆盒缓存 台均为可用，晶圆盒传送动作具备启动执行条件后，根据设计好的子动作对象的执行顺序，一些情况下首先还是可能执行关闭晶圆盒这一动作，但关闭晶圆盒已提前执行完成，所以下位机服务会立刻返回，仍然能够减少执行关闭晶圆盒的时间消耗。
以上半导体工艺设备中运动部件的控制方法，针对目前半导体工艺设备中运动部件的动作执行机制存在的问题，改进子动作对象的控制流程，增加提前释放运动部件的机制和提前执行运动部件后续响应其他动作任务一定需要先执行的动作的机制，可以提高运动部件的利用率，以及与其他运动部件间动作的连贯性，缩短相应动作任务的执行时间，从而缩短相应工艺任务的总执行时间，进而提高对应机台产能。
本申请在第二方面提供一种半导体工艺设备中运动部件的控制装置，其中半导体工艺设备包括多个运动部件，如图7所示，该控制装置包括：
获取单元210，用于获取当前动作任务，所述当前动作任务包括多个子动作对象；
第一确定单元220，用于从所述多个子动作对象中确定当前子动作对象和待执行子动作对象，所述待执行子动作对象被配置为在所述当前子动作对象之后执行；
第一控制单元230，用于控制与所述当前子动作对象关联的当前运动部件执行所述当前子动作对象；
第二确定单元240，用于在执行完所述当前子动作对象之后，确定与所述待执行子动作对象关联的待用运动部件；
第一设置单元250，用于在所述待用运动部件不包括所述当前运动部件时，将所述当前运动部件的运动状态设置为可用。
在一个实施例中，所述控制装置还包括：
接收单元，用于接收多个动作任务，将最先接收到的所述动作任务作为 所述当前动作任务；
识别单元，用于识别所述当前动作任务中各个子动作对象关联的运动部件；
第二设置单元，用于将与各个子动作对象关联的运动部件的运动状态均设置为占用。
具体地，所述第一设置单元还用于：
在所述待用运动部件包括所述当前运动部件时，将所述当前运动部件的运动状态保持为占用。
具体地，所述控制装置还包括：
第二控制单元，用于控制所述待用运动部件依次执行所述待执行子动作对象；
第三设置单元，用于在所述当前动作任务的所有子动作对象均执行完成后，将各个关联的运动部件的运动状态均设置为可用。
在一个实施例中，所述控制装置还包括：
第三确定单元，用于确定所述当前动作任务之后的所述动作任务中，是否包含与所述当前运动部件关联的子动作对象；
第三控制单元，用于在所述当前动作任务之后的所述动作任务中包含与所述当前运动部件关联的子动作对象时，则控制所述当前运动部件提前执行该子动作对象。
关于半导体工艺设备中运动部件的控制装置的具体限定可以参见上文中对于半导体工艺设备中运动部件的控制方法的限定，在此不再赘述。上述半导体工艺设备中运动部件的控制装置中的各个单元可全部或部分通过软件、硬件及其组合来实现。上述各单元可以硬件形式内嵌于或独立于计算机设备中的处理器中，也可以以软件形式存储于计算机设备中的存储器中，以便于处理器调用执行以上各个单元对应的操作。
本申请在第三方面提供一种半导体工艺设备，包括上述任一实施例所述的半导体工艺设备中运动部件的控制装置，具有上述控制装置的所有有益效果，机台产能得到有效提升。
本申请在第四方面提供一种半导体工艺设备，参考图8所示，该半导体工艺设备包括处理器、存储介质和多个运动部件；所述存储介质上存储有程序代码；所述处理器用于调用所述存储介质存储的程序代码，以执行上述任一实施例所述的半导体工艺设备中运动部件的控制方法。
上述半导体工艺设备在执行上述半导体工艺设备中运动部件的控制方法时，设置提前释放运动部件的机制和提前执行运动部件后续关联的子动作对象的的机制，以提高运动部件的利用率，以及与其他运动部件间动作的连贯性，缩短相应动作任务的执行时间，从而缩短工艺任务的总执行时间，提高机台产能。
尽管已经相对于一个或多个实现方式示出并描述了本申请，但是本领域技术人员基于对本说明书和附图的阅读和理解将会想到等价变型和修改。本申请包括所有这样的修改和变型，并且仅由所附权利要求的范围限制。特别地关于由上述组件执行的各种功能，用于描述这样的组件的术语旨在对应于执行所述组件的指定功能(例如其在功能上是等价的)的任意组件(除非另外指示)，即使在结构上与执行本文所示的本说明书的示范性实现方式中的功能的公开结构不等同。
即，以上所述仅为本申请的实施例，并非因此限制本申请的专利范围，凡是利用本申请说明书及附图内容所作的等效结构或等效流程变换，例如各实施例之间技术特征的相互结合，或直接或间接运用在其他相关的技术领域，均同理包括在本申请的专利保护范围内。
此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、 “第二”的特征可以明示或者隐含地包括一个或者更多个特征。在本申请的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。
在本申请中，“示例性”一词是用来表示“用作例子、例证或说明”。本申请中被描述为“示例性”的任何一个实施例不一定被解释为比其它实施例更加优选或更加具优势。为了使本领域任何技术人员能够实现和使用本申请，本申请给出了以上描述。在以上描述中，为了解释的目的而列出了各个细节。应当明白的是，本领域普通技术人员可以认识到，在不使用这些特定细节的情况下也可以实现本申请。在其它实施例中，不会对公知的结构和过程进行详细阐述，以避免不必要的细节使本申请的描述变得晦涩。因此，本申请并非旨在限于所示的实施例，而是与符合本申请所公开的原理和特征的最广范围相一致。

Claims (11)

  1. 一种半导体工艺设备中运动部件的控制方法，所述半导体工艺设备包括多个运动部件，其特征在于，所述控制方法包括：
    获取当前动作任务，所述当前动作任务包括多个子动作对象；
    从所述多个子动作对象中确定当前子动作对象和待执行子动作对象，所述待执行子动作对象被配置为在所述当前子动作对象之后执行；
    控制与所述当前子动作对象关联的当前运动部件执行所述当前子动作对象；
    在执行完所述当前子动作对象之后，确定与所述待执行子动作对象关联的待用运动部件；
    在所述待用运动部件不包括所述当前运动部件时，将所述当前运动部件的运动状态设置为可用。
  2. 根据权利要求1所述的控制方法，其特征在于，在所述获取当前动作任务之前，所述控制方法还包括：
    接收多个动作任务，将最先接收到的所述动作任务作为所述当前动作任务；
    识别所述当前动作任务中与各个子动作对象关联的运动部件；
    将与各个子动作对象关联的运动部件的运动状态均设置为占用。
  3. 根据权利要求2所述的控制方法，其特征在于，在所述确定与所述待执行子动作对象关联的待用运动部件之后，所述控制方法还包括：
    在所述待用运动部件包括所述当前运动部件时，将所述当前运动部件的运动状态保持为占用。
  4. 根据权利要求3所述的控制方法，其特征在于，在所述将所述当前 运动部件的运动状态设置为可用或者将所述当前运动部件的运动状态保持为占用之后，所述控制方法还包括：
    控制所述待用运动部件依次执行所述待执行子动作对象；
    在所述当前动作任务的所有子动作对象均执行完成后，将各个关联的运动部件的运动状态均设置为可用。
  5. 根据权利要求1所述的控制方法，其特征在于，在所述将所述当前运动部件的运动状态设置为可用之后，所述控制方法还包括：
    确定所述当前动作任务之后的所述动作任务中，是否包含与所述当前运动部件关联的子动作对象；
    若是，则控制所述当前运动部件提前执行该子动作对象。
  6. 一种半导体工艺设备中运动部件的控制装置，所述半导体工艺设备包括多个运动部件，其特征在于，所述控制装置包括：
    获取单元，用于获取当前动作任务，所述当前动作任务包括多个子动作对象；
    第一确定单元，用于从所述多个子动作对象中确定当前子动作对象和待执行子动作对象，所述待执行子动作对象被配置为在所述当前子动作对象之后执行；
    第一控制单元，用于控制与所述当前子动作对象关联的当前运动部件执行所述当前子动作对象；
    第二确定单元，用于在执行完所述当前子动作对象之后，确定与所述待执行子动作对象关联的待用运动部件；
    第一设置单元，用于在所述待用运动部件不包括所述当前运动部件时，将所述当前运动部件的运动状态设置为可用。
  7. 根据权利要求6所述的控制装置，其特征在于，所述控制装置还包 括：
    接收单元，用于接收多个动作任务，将最先接收到的所述动作任务作为所述当前动作任务；
    识别单元，用于识别所述当前动作任务中与各个子动作对象关联的运动部件；
    第二设置单元，用于将与各个子动作对象关联的运动部件的运动状态均设置为占用。
  8. 根据权利要求7所述的控制装置，其特征在于，所述第一设置单元还用于：
    在所述待用运动部件包括所述当前运动部件时，将所述当前运动部件的运动状态保持为占用。
  9. 根据权利要求8所述的控制装置，其特征在于，所述控制装置还包括：
    第二控制单元，用于控制所述待用运动部件依次执行所述待执行子动作对象；
    第三设置单元，用于在所述当前动作任务的所有子动作对象均执行完成后，将各个关联的运动部件的运动状态均设置为可用。
  10. 根据权利要求6所述的控制装置，其特征在于，所述控制装置还包括：
    第三确定单元，用于确定所述当前动作任务之后的所述动作任务中，是否包含与所述当前运动部件关联的子动作对象；
    第三控制单元，用于在所述当前动作任务之后的所述动作任务中包含与所述当前运动部件关联的子动作对象时，控制所述当前运动部件提前执行该子动作对象。
  11. 一种半导体工艺设备，其特征在于，包括权利要求6至10任一项所述的半导体工艺设备中运动部件的控制装置。
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