WO2022267911A1 - 印制电路板、印制电路板总成、硬件模组和电子设备 - Google Patents

印制电路板、印制电路板总成、硬件模组和电子设备 Download PDF

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Publication number
WO2022267911A1
WO2022267911A1 PCT/CN2022/098324 CN2022098324W WO2022267911A1 WO 2022267911 A1 WO2022267911 A1 WO 2022267911A1 CN 2022098324 W CN2022098324 W CN 2022098324W WO 2022267911 A1 WO2022267911 A1 WO 2022267911A1
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WO
WIPO (PCT)
Prior art keywords
board
hardware module
printed circuit
connector
circuit board
Prior art date
Application number
PCT/CN2022/098324
Other languages
English (en)
French (fr)
Inventor
何栋培
陈龙
罗警怀
陈林
王希
Original Assignee
华为技术有限公司
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Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Publication of WO2022267911A1 publication Critical patent/WO2022267911A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present disclosure relates to the technical field of electronic equipment, in particular to a printed circuit board, a printed circuit board assembly, a hardware module and electronic equipment.
  • the hard connection method refers to the use of male and female connectors to realize the connection
  • the soft connection method refers to the use of cables to realize the connection.
  • the hard connection method has the advantages of convenient plugging and unplugging, good connection reliability and no cable blocking the air duct.
  • the hard connection method requires precise alignment of the male and female connectors. If the male and female connectors are not at the same height due to structural layout and other reasons inside the electronic device, the male and female connectors cannot be docked.
  • the first hardware module and the second hardware module need to be interconnected, and the first hardware module needs to be close to the bottom of the electronic device in order to improve space utilization, which makes the first hardware module
  • the height of the connector is lower than that of the connector of the second hardware module, so that the connectors of the first hardware module and the second hardware module cannot be docked.
  • the disclosure provides printed circuit board (printed circuit board, PCB), printed circuit board assembly (printed circuit board assembly, PCBA), hardware module and electronic equipment, which can , to improve the interconnection and docking capabilities between hardware modules through connectors.
  • PCB printed circuit board
  • PCBA printed circuit board assembly
  • hardware module and electronic equipment which can , to improve the interconnection and docking capabilities between hardware modules through connectors.
  • a printed circuit board in a first aspect, includes a first board body and a second board body; there is a gap between the first board body and the second board body; the The first board is used to support electronic components; the second board is used to support connectors; the second board can be offset relative to the first board, so that the second board and the The first plates are at least not completely on the same plane.
  • the printed circuit board can also be called a printed circuit board, which is an important electronic component, a support for electronic components, and a carrier for electrical connection of electronic components.
  • the first board is used to support electronic components, and the electronic components may be any type of electronic components.
  • the connectors used by the second board for support are connectors that need to be adjusted in position. There is a wiring between the first board and the second board, so that the connector on the second board can be smoothly connected with the electronic components on the first board.
  • the first plate body can also be called a support plate body, and the second plate body can also be called a deformed plate body.
  • the technical solution shown in this disclosure uses the characteristic that the printed circuit board allows deformation within a certain range, and creates a gap on the printed circuit board, so that the printed circuit board is divided into a first board body and a second board body, and The second board can be offset relative to the first board.
  • the connector that needs to be adjusted in position can be fixed on the second board, and the position of the connector can be adjusted by offsetting the second board relative to the first board, thereby improving the docking capability of the hardware module .
  • the positions of the second board and the connector can be changed, while the positions of most of the hardware modules (such as the first board and the electronic components on the first board) can not be changed, so that the Adjust the position of the connector in the case of affecting the internal layout of the hardware module in the electronic device.
  • the second board body can be displaced by any distance relative to the first board body, and the position of the connector can be adjusted arbitrarily within a range, which has good applicability.
  • first board body and the second board body are integrally formed.
  • the gap extends along the length direction of the printed circuit board.
  • the width of the gap is greater than 1 mm.
  • the second plate body is elongated, and the width of the second plate body is smaller than the width of the first plate body.
  • the technical solution shown in this disclosure reduces the area of the printed circuit board occupied by the second board by arranging the second board in a strip shape, and reduces the impact of the second board on the electronic components on the printed circuit board. board layout effects.
  • the second board includes a deformation part and a connector support part; one end of the deformation part is connected to the first board, and the other end is connected to the connector support part;
  • the connector support part is used to support the connector, and the width of the connector support part is greater than or equal to the width of the deformation part.
  • the width of the connector support part to be greater than or equal to the width of the deformation part, it is convenient for the connector support part to support the connector, and it is convenient for the deformation part to shift relative to the first board.
  • the minimum width of the deformation portion is greater than 5 mm.
  • the deformation part includes an extension part and a transition part; one end of the extension part is connected to the first plate body, and the other end is connected to the first end of the transition part;
  • the second end of the transition part is connected to the connector support part;
  • the width of the first end of the transition part is the same as the width of the extension part, and the width of the second end of the transition part is the same as that of the connector support part
  • the widths of the transition portions are the same, and along the direction from the first end to the second end, the width of the transition portion increases gradually.
  • a printed circuit board assembly in the second aspect, includes electronic components, connectors and the printed circuit board as described in any one of the first aspect; the electronic component The device is fixed on the first body of the printed circuit board; the connector is fixed on the second body of the printed circuit board.
  • the printed circuit board assembly is formed after the printed circuit board undergoes surface mount technology (surface mount technology, SMT) or dual in-line package technology (dual in-line package, DIP).
  • SMT surface mount technology
  • DIP dual in-line package
  • a hardware module in a third aspect, includes a housing assembly and the printed circuit board assembly as described in the second aspect; the printed circuit board assembly is fixed on the housing in the component.
  • the housing assembly may include a housing and a structural member, the printed circuit board assembly is located inside the housing, and the structural member forces the second board of the printed circuit board assembly to be relative to the first board of the printed circuit board assembly. Board shifted.
  • the housing assembly includes a first housing, a first buckle and a second buckle; both the first buckle and the second buckle are connected to the first shell
  • the body is fixedly connected, and the height of the card interface of the first buckle is different from the height of the card interface of the second buckle; the side wall of the first board extends into the card interface of the first buckle , the side wall of the second board protrudes into the snap-in port of the second buckle.
  • the second buckle is located on the first side of the connector, and the first side is opposite to the butt end of the connector; the second buckle is a plurality of , and among the plurality of second buckles, two second buckles that are closest to the connector have the same heights of the card interfaces.
  • the two second buckles force the part of the second board where the connector is located (such as the connector supporting part) to be parallel or approximately parallel to the first board, thereby making the connection
  • the device is parallel or approximately parallel to the first board.
  • the height of the connector disposed on the second board is only changed, but the posture does not change, thereby facilitating the docking of the connector and the opposite connector.
  • the part of the second board where the connector is located is not bent, so that the connector will not be deformed, thereby ensuring the reliability of the connector.
  • the housing assembly includes a second housing, a first support member, a first locking member, a second support member, and a second locking member; the first support member and the The second supports are all fixedly connected to the inner wall of the second housing, and the heights of the first supports and the second supports are different; the first supports support the first board, The first locking member passes through the first board and is fixed in the first supporting member; the second supporting member supports the second board, and the second locking member passes through The second board is fixed in the second support.
  • the second support member and the second locking member are located on a first side of the connector, and the first side is opposite to the butt end of the connector;
  • the support surface of the second support member is parallel to the plate surface of the first plate body, and the second locking member presses the second plate body and the support surface of the second support member tightly.
  • the second support member and the second locking member force the part of the second board where the connector is located (such as the connector support part) to be parallel or approximately parallel to the first board , so that the connector is parallel or approximately parallel to the first board.
  • the height of the connector disposed on the second board is only changed, but the posture is not changed, so that the docking of the connector and the opposite connector is facilitated.
  • the part of the second board where the connector is located is not bent, so that the connector will not be deformed, thereby ensuring the reliability of the connector.
  • the offset distance of the second plate body relative to the first plate body is adjustable.
  • the second support is detachably connected to the second housing, so that the hardware module can replace the second support with different heights.
  • the height of the second support member is adjustable.
  • the ratio of the maximum offset distance of the second plate body relative to the first plate body to the length of the first diagonal line of the second plate body is less than 0.75%.
  • the first diagonal line is located on one surface of the second plate body, and the first diagonal line is the longest diagonal line with the first vertex as an end point, and the first vertex Located at the junction of the gap, the first board and the second board.
  • the second plate by setting the ratio of the maximum offset distance of the second plate relative to the first plate to the length of the first diagonal of the second plate to be less than 0.75%, the second plate can be avoided.
  • the excessive deviation relative to the first board improves the reliability of the printed circuit board.
  • an electronic device in a fourth aspect, includes a first hardware module and a second hardware module, the first hardware module is the hardware module according to any one of the third aspect; The connector of the first hardware module is docked with the second hardware module.
  • the electronic device may be an information technology (information technology, IT) device such as a storage device, a server, and a network device.
  • IT information technology
  • no cable is used to connect two hardware modules, which reduces the obstruction of air flow inside the electronic device, improves the heat dissipation capability of the electronic device, and further increases the density of the electronic device.
  • the second board body of the first hardware module is offset in a vertical direction relative to the first board body.
  • the second board body of the first hardware module is offset in a horizontal direction relative to the first board body.
  • the second hardware module is the hardware module according to any one of the third aspect
  • the second board of the first hardware module is offset toward the first direction relative to the first board, and the second board of the second hardware module is offset toward the second direction relative to the first board, The first direction and the second direction are opposite.
  • FIG. 1 is a schematic diagram of a printed circuit board provided by an embodiment of the present disclosure
  • FIG. 2 is a schematic diagram of a printed circuit board provided by an embodiment of the present disclosure
  • Fig. 3 is a schematic diagram of a printed circuit board provided by an embodiment of the present disclosure.
  • FIG. 4 is a schematic diagram of a printed circuit board assembly provided by an embodiment of the present disclosure.
  • Fig. 5 is a schematic diagram of a hardware module provided by an embodiment of the present disclosure.
  • FIG. 6 is a schematic diagram of a hardware module provided by an embodiment of the present disclosure.
  • FIG. 7 is a schematic diagram of a hardware module provided by an embodiment of the present disclosure.
  • Fig. 8 is a schematic diagram of a hardware module provided by an embodiment of the present disclosure.
  • FIG. 9 is a schematic diagram of a hardware module provided by an embodiment of the present disclosure.
  • FIG. 10 is a schematic diagram of a hardware module provided by an embodiment of the present disclosure.
  • Fig. 11 is a schematic diagram of an electronic device provided by an embodiment of the present disclosure.
  • Fig. 12 is a schematic diagram of an electronic device provided by an embodiment of the present disclosure.
  • Fig. 13 is a schematic diagram of an electronic device provided by an embodiment of the present disclosure.
  • Fig. 14 is a schematic diagram of an electronic device provided by an embodiment of the present disclosure.
  • Fig. 15 is a schematic diagram of an electronic device provided by an embodiment of the present disclosure.
  • Fig. 16 is a schematic diagram of an electronic device provided by an embodiment of the present disclosure.
  • Fig. 17 is a schematic diagram of an electronic device provided by an embodiment of the present disclosure.
  • the first hardware module b. the second hardware module, c. the housing of the electronic device, d. the hard disk, e. the interface board, f. the power supply module;
  • Housing assembly 011a, first housing, 012a, first buckle, 013a, second buckle, 011b, second housing, 012b, first support member, 013b, first locking member, 014b , the second support member, 015b, the second locking member;
  • Printed circuit board 10, gap, 11, first board body, 12, second board body, 121, deformation part, 1211, extension part, 1212, transition part, 122, connector support part, 100, the first a vertex;
  • the hardware module has a printed circuit board assembly (PCBA), and the printed circuit board assembly may have a connector for interconnection with other hardware modules.
  • PCBA printed circuit board assembly
  • a hardware module may also be called a function module, a hardware module, and the like.
  • the hard connection method refers to using male and female connectors to achieve connection
  • the soft connection method refers to using cables to realize connection.
  • the hard connection method has the advantages of convenient plugging and unplugging, good connection reliability and no cable blocking the air duct.
  • the hard connection method requires the connectors of the two hardware modules to be precisely aligned. If the two connectors that need to be interconnected are not at the same height due to structural layout and other reasons inside the electronic device, there will be a situation where they cannot be connected.
  • Option 1 change the hard connection method to a soft connection method, that is, use a cable to connect two hardware modules;
  • Option 2 use a connector with a customized height;
  • Option 3 A conversion board is added between the two hardware modules, and two connectors with different heights are provided on both sides of the conversion board, and the two connectors are connected with the connectors of the two hardware modules respectively.
  • the cable in the above-mentioned solution 1 will hinder the air flow inside the electronic device, which is not conducive to the heat dissipation of the electronic device;
  • the connector with a customized height in the above-mentioned solution 2 compared with the general-purpose connector, has poor supply and low cost. High, and according to different usage scenarios, it is necessary to customize connectors of different heights, and the reusability is poor; in the above-mentioned scheme three, due to the addition of a conversion board, the cost of the electronic equipment is increased, and the space inside the electronic equipment is occupied, and , The number of connections between hardware modules increases, reducing the reliability of the connection, and moreover, increasing the production, processing and assembly process, reducing the processing efficiency.
  • the embodiments of the present disclosure provide a printed circuit board (printed circuit board, PCB), a printed circuit board assembly, a hardware module, and an electronic device, which can solve the above technical problems.
  • the printed circuit board includes a first board body 11 and a second board body 12 . There is a gap 10 between the first plate body 11 and the second plate body 12 .
  • the first board body 11 is used to support electronic components.
  • the second board body 12 is used to support the connector.
  • the second plate body 12 can be offset relative to the first plate body 11 , so that the second plate body 12 and the first plate body 11 are at least not completely on the same plane.
  • the printed circuit board can also be called a printed circuit board, which is an important electronic component, a support for electronic components, and a carrier for electrical connection of electronic components.
  • the first board body 11 is used to support electronic components, and the electronic components may be any type of electronic components.
  • the connector supported by the second board body 12 is a connector whose position needs to be adjusted. There is a wiring between the first board 11 and the second board 12 , so that the connector on the second board 12 can be smoothly connected with the electronic components on the first board 11 .
  • the first plate body 11 can also be called a support plate body, and the second plate body 12 can also be called a deformed plate body.
  • the first plate body 11 and the second plate body 12 can be integrally formed.
  • the gap 10 runs through the printed circuit board along the thickness direction, and is opened on one side wall of the printed circuit board and closed on the other side wall.
  • the gap 10 can also be called a slot.
  • the technical solution provided by the embodiments of the present disclosure uses the characteristic that the printed circuit board allows deformation within a certain range, and creates a gap 10 on the printed circuit board, so that the printed circuit board is divided into a first board body 11 and a second board body 12, and the second board body 12 can be offset relative to the first board body 11.
  • the connector that needs to be adjusted in position can be fixed on the second board body 12, and the position of the connector can be adjusted by offsetting the second board body 12 relative to the first board body 11, thereby, the hardware mold can be improved.
  • Group docking capabilities
  • the positions of the second board body 12 and the connector can be changed, and the positions of most of the hardware modules (such as the first board body 11 and the electronic components on the first board body 11) can not be changed, thereby The position of the connector can be adjusted without affecting the internal layout of the hardware module in the electronic device.
  • the second board body 12 can be offset by any distance relative to the first board body 11 , and the position of the connector can be adjusted within a certain range, which has good applicability.
  • the embodiment of the present disclosure does not limit the size and position of the gap 10 , and the specific size and position of the gap 10 are determined according to the area occupied by the connector and the offset distance required by the connector.
  • the gap 10 extends along the length direction of the printed circuit board, and the width of the gap 10 is greater than 1 mm.
  • the length and width of the gap 10 should not be too large under the premise that the second board body 12 can be offset by the target distance relative to the first board body 11. Large, such as width can be less than 10mm.
  • the embodiment of the present disclosure does not limit the shape and size of the second board body 12, as long as the second board body 12 can support the connector, and can be compared with the first board body under the premise of ensuring the reliability of the printed circuit board. 11 Offset the required distance.
  • the second board body 12 Since the second board body 12 will be deformed, in order to prevent the risk of reliability failure of electronic components from increasing, in some examples, only connectors may be arranged on the second board body 12 .
  • the influence of the second board body 12 on the layout of electronic components on the printed circuit board is reduced, as shown in Figures 1 and 2 As shown, the second plate body 12 is elongated, and the width of the second plate body 12 is smaller than the width of the first plate body 11 .
  • the second board body 12 includes a deformation portion 121 and a connector support portion 122 for supporting the connector.
  • One end of the deformation part 121 is connected to the first board body 11 , and the other end is connected to the connector supporting part 122 .
  • Embodiments of the present disclosure do not limit the widths of the deformation portion 121 and the connector support portion 122 .
  • the minimum width of the second board body 121 may be greater than 5 mm.
  • the width of the deformation portion 121 should not be set too large.
  • the width of the connector support portion 122 is determined by the width of one or more connectors to be supported.
  • the width of the connector support part 122 and the width of the deformation part 121 can be set to be equal, that is, the second board 12 is a cuboid plate body.
  • the gap 10 can be a straight gap, thereby reducing the manufacturing difficulty of the gap 10 .
  • the width of the connector supporting part 122 may be set to be greater than the width of the deforming part 121, thereby ensuring the second On the premise that the board body 12 can support the connector, the area of the printed circuit board occupied by the second board body 12 is reduced as much as possible.
  • the deformation portion 121 includes an extension 1211 and transition 1212 .
  • One end of the extension part 1211 is connected to the first plate body 11 , and the other end is connected to the first end of the transition part 1212 .
  • the second end of the transition portion 1212 is connected to the connector supporting portion 122 .
  • the width of the first end of the transition part 1212 is the same as the width of the extension part 1211, the width of the second end of the transition part 1212 is the same as the width of the connector support part 122, and along the direction from the first end to the second end, the transition part 1212 The width gradually increases.
  • the embodiment of the present disclosure does not limit the shape of the transition portion 1212.
  • the side opposite to the first plate body 11 is an inclined surface.
  • the width of the transition portion 1212 may decrease unevenly along the length direction, and the side of the transition portion 1212 located in the gap 10 (ie, the side opposite to the first board 11 ) may be an arc surface.
  • the printed circuit board assembly includes the above-mentioned printed circuit board 1 , electronic components 2 and connectors 3 .
  • the electronic components 2 are fixed on the first body 11 of the printed circuit board 1
  • the connector 3 is fixed on the second body 12 of the printed circuit board 1 .
  • the printed circuit board assembly is formed after the printed circuit board undergoes surface mount technology (surface mount technology, SMT) or dual in-line package technology (dual in-line package, DIP).
  • SMT surface mount technology
  • DIP dual in-line package
  • the second plate body 12 Since the second plate body 12 will be offset relative to the first plate body 11, that is, the second plate body 12 will be deformed, so in addition to the connector that needs to adjust the position (ie, the connector 3), generally not
  • the rest of the electronic components are arranged on the second board 12 , so as to avoid the reliability degradation of the electronic components due to deformation following the second board 12 .
  • the first board 11 does not deform, it can support any electronic component, that is, the electronic component 2 can be any type of electronic component.
  • the embodiment of the present disclosure also provides a hardware module.
  • the hardware module includes a housing assembly 01 and a printed circuit board assembly 02 .
  • the printed circuit board assembly 02 is fixed in the housing assembly 01
  • the second board body 12 of the printed circuit board assembly 02 is offset relative to the first board body 11 of the printed circuit board assembly 02 .
  • the housing assembly 01 includes a housing and a structural member
  • the printed circuit board assembly 02 is located inside the housing
  • the structural member forces the second board body 12 of the printed circuit board assembly 02 to be relative to the printed circuit board assembly
  • the first board 11 of 02 is offset, so that the position of the connector 3 can be adjusted, so that the hardware module can be smoothly connected with other hardware modules.
  • the embodiment of the present disclosure does not limit the fixing method of the printed circuit board assembly 02 inside the housing assembly 01.
  • several possible implementation methods are provided:
  • the housing assembly 01 includes a first housing 011a, a first buckle 012a and a second buckle 013a. Both the first buckle 012a and the second buckle 013a are fixedly connected to the first housing 011a, and the height of the buckle interface of the first buckle 012a is different from that of the second buckle 013a.
  • the side wall of the first plate body 11 extends into the card interface of the first buckle 012a, and the side wall of the second plate body 12 extends into the card interface of the second buckle 013a.
  • the first housing 011 a only shows one installation wall.
  • the second board body 12 Since the heights of the card interface of the first buckle 012a and the card interface of the second buckle 013a are different, the second board body 12 will be forced to shift relative to the first board body 11 .
  • the offset distance and direction of the second plate body 12 are determined according to the height relationship between the card interface of the first buckle 012a and the card interface of the second buckle 013a.
  • the height of the card interface of the first buckle 012a may be greater than the height of the card interface of the second buckle 013a, or may be smaller than the height of the card interface of the second buckle 013a (as shown in FIG. 5 ). Do limited.
  • the first buckle 012a and the second buckle 013a can be designed according to the required offset distance and offset direction of the connector.
  • the embodiment of the present disclosure does not limit the quantity and position of the first buckle 012a and the second buckle 013a.
  • there are multiple first buckles 012a and the heights of the card interfaces of the multiple first buckles 012a are the same.
  • there are three first buckles 012 a and the three first buckles 012 a are respectively distributed at three corners of the first board body 11 .
  • the second buckle 013a is located on the side of the connector 3 close to the connection end of the second board 12, and the connection end is the end where the second board 12 is connected to the first board 11 ( Or it can be understood that the second buckle 013a is located on the first side of the connector 3, and the first side is opposite to the butt end of the connector 3).
  • There are a plurality of second buckles 013a (for example, two), and among the plurality of second buckles 013a, the two second buckles 013a closest to the connector 3 have the same height of the card interface.
  • the two second buckles 013a force the part of the second board body 12 where the connector is located (such as the connector support part 122) to be parallel or approximately parallel to the first board body 11, thereby making the connector and the first board body 11 parallel or nearly parallel.
  • the height of the connector disposed on the second board 12 only changes, but the posture does not change, thereby facilitating the docking of the connector and the opposite connector.
  • the part of the second board body 12 where the connector is located is not bent, so that the connector will not be deformed, thereby ensuring the reliability of the connector.
  • the housing assembly 01 includes a second housing 011b, a first support member 012b, a first locking member 013b, a second support member 014b and a second locking member 015b .
  • Both the first support 012b and the second support 014b are fixedly connected to the second housing 011b, and the heights of the first support 012b and the second support 014b are different.
  • the first supporting member 012b is the first plate body 11, and the first locking member 013b passes through the first plate body 11 and is fixed in the first supporting member 012b.
  • the second supporting member 014b supports the second board body 12, and the second locking member 015b passes through the second board body 12 and is fixed in the second supporting member 014b.
  • the second housing 011b only shows one installation wall.
  • the second board body 12 Since the heights of the first supporting member 012b and the second supporting member 014b are different, the second board body 12 will be forced to shift relative to the first board body 11, and the distance and direction of the second board body 12 shifting, according to the first The height relationship between the first support 012b and the second support 014b is determined.
  • the height of the first supporting member 012b may be greater than the height of the second supporting member 014b (as shown in FIG. 7 ), or may be smaller than the height of the second supporting member 014b (as shown in FIG. 10 ). limited.
  • the first supporting member 012b and the second supporting member 014b can be designed according to the distance and direction that the connector needs to be offset.
  • the embodiment of the present disclosure does not limit the specific types of the first supporting member 012b, the first locking member 013b, the second supporting member 014b and the second locking member 015b.
  • the first supporting member 012b and the second supporting member 014b are supporting studs, and the first locking member 013b and the second locking member 015b are screws.
  • the first support member 012b and the second support member 014b are support columns, and the first locking member 013b and the second locking member 015b are rivets.
  • the embodiment of the present disclosure does not limit the quantity and position of the first supporting member 012b, the first locking member 013b, the second supporting member 014b and the second locking member 015b.
  • there are multiple first support members 012b and first locking members 013b for example, as shown in FIG. 7 or FIG. 10, there are four first support members 012b and first locking members 013b, And the four first support members 012b and the first locking members 013b are respectively distributed at the four corners of the first plate body 11 .
  • the second supporting member 014b and the second locking member 015b are located on the side of the connector 3 close to the connecting end of the second board body 12 , and the connecting end is the second board body 12 and the first board body 12 .
  • One end connected to the board body 11 (or understood as the second supporting member 014b and the second locking member 015b is located on the first side of the connector 3, and the first side is opposite to the butt end of the connector 3).
  • the supporting surface of the second support member 014b is parallel to the surface of the first plate body 11, and the second locking member 015b presses the second plate body 12 and the supporting surface of the second support member 014b.
  • the second supporting member 014b and the second locking member 015b force the part of the second board body 12 where the connector is located (such as the connector supporting part 122) to be parallel to the first board body 11, thereby making the connector and the first board body Body 11 is parallel.
  • the height of the connector disposed on the second board 12 only changes, but the posture does not change, thereby facilitating the docking of the connector and the opposite connector.
  • the part of the second board body 12 where the connector is located is not bent, so that the connector will not be deformed, thereby ensuring the reliability of the connector.
  • the offset distance of the second board body 12 relative to the first board body 11 is adjustable.
  • the embodiment of the present disclosure does not limit the implementation of the adjustable offset distance of the second board body 12 relative to the first board body 11. Below, several possible implementation methods are provided:
  • the second support 014b is detachably connected to the second housing 011b, and the offset distance of the second board 12 relative to the first board 11 can be adjusted by replacing the second support 014b with a different height.
  • the second supporting member 014b may be screwed to the second housing 011b.
  • the height of the second support 014b is adjustable, and the offset distance of the second board 12 relative to the first board 11 can be adjusted by adjusting the height of the second support 014b.
  • the embodiment of the present disclosure does not limit the implementation manner of the height adjustment of the second support member 014b.
  • the second support 014b includes a support body and a gasket, and the gasket is located on the side of the support body close to the second board 12, and the second support 014b can adjust the position of the second support 014b by increasing or decreasing the gasket. high.
  • the second locking member 015b passes through the washer and is screwed inside the supporting body.
  • the second supporting member 014b is screwed to the second housing 011b, and the height of the second supporting member 014b can be adjusted by rotating the second supporting member 014b on the second housing 011b.
  • the second supporting member 014b includes a cylinder and a compression spring, and the compression spring surrounds the cylinder.
  • the compression spring supports the second plate body 12, and the second locking member 015b is screwed into the cylinder, so the length of the compression spring can be adjusted by rotating the second locking member 015b, and then the height of the second supporting member 014b can be adjusted.
  • the offset distance of the second board body 12 relative to the first board body 11 can also be set to be non-adjustable, that is, in the design stage of the hardware module, that is, for the second board body 12 relative to the first board body 11
  • the offset distance of a plate body 11 is determined by design. For this type of hardware module, once the assembly is completed, the offset distance of the second board body 12 relative to the first board body 11 cannot be adjusted.
  • first support 012b and the second support 014b can be non-detachably connected with the second housing 014b, for example, the first support 012b and the second support 014b can be made with the second housing 011b as One structure.
  • the above-mentioned clamping manner may also be used to clamp the printed circuit board assembly 02 inside the first housing 11a.
  • the second board body 12 is relatively The ratio of the maximum offset distance h of the first plate body 11 to the length L of the first diagonal line of the second plate body 12 is less than or equal to 0.75%. As shown in FIGS. 8 and 9 , that is, h/L is less than or equal to 0.75%.
  • the first diagonal line is located on a plate surface of the second plate body 12, and the first diagonal line is the longest diagonal line with the first vertex 100 as an end point, the first vertex 100 is located at the junction of the gap 10 , the first plate body 11 and the second plate body 12 .
  • the maximum offset distance of the second board body 12 relative to the first board body 11 is the same as the first distance of the second board body 12 .
  • the ratio of the lengths of the diagonals is less than 0.5%.
  • the length of the second plate body 12 is not much different from the length of the first diagonal line.
  • the ratio of the maximum offset distance h of the body 11 to the length of the second plate body 12 when no deformation occurs is less than 0.75% or 0.5%.
  • an embodiment of the present disclosure also provides an electronic device.
  • the electronic device includes a first hardware module a and a second hardware module b.
  • the first hardware module a is the hardware module provided by the embodiment of the present disclosure.
  • the connector 3 of the first hardware module a is docked with the second hardware module b.
  • the electronic device further includes an electronic device housing c, and the first hardware module a and the second hardware module b can be fixed inside the electronic device housing c.
  • the electronic device may be an information technology (information technology, IT) device such as a storage device, a server, and a network device.
  • IT information technology
  • the electronic equipment provided by the embodiments of the present disclosure can at least bring the following beneficial effects:
  • No cable is used to connect two hardware modules, which reduces the obstruction of air flow inside the electronic device, improves the heat dissipation capability of the electronic device, and further increases the density of the electronic device.
  • the embodiment of the present disclosure does not limit the offset direction of the second plate body 12 relative to the first plate body 11. Below, several possible offset directions are described respectively:
  • the first boards 11 of the first hardware module a are arranged horizontally, and the second boards 12 are offset upward relative to the first boards 11 . Therefore, the height of the connector 3 can be raised to smoothly connect with the second hardware module b.
  • an electronic device which is a dual-control storage device.
  • the height of the connector of the hard disk d relative to the bottom of the device is fixed, and thus the height of the parallel backplane (second hardware module b) is also determined.
  • the interface board e and the bottom board (the first hardware module a) need to be close to the bottom of the device because of the utilization rate of the vertical space, which will cause the connector 3 of the bottom board (the first hardware module a) to be lower than the parallel back.
  • the connector of the board (the second hardware module b) so that the bottom board (the first hardware module a) and the parallel backplane (the second hardware module b) cannot be docked smoothly.
  • the connector 3 can be raised by the upward offset of the second board body 12, so that it can be smoothly connected to the parallel backplane (Second hardware module b) docking. Moreover, the overall position of the bottom plate (the first hardware module a) remains unchanged, and the bottom plate (the first hardware module a) can still be close to the bottom of the device, so that the space utilization rate of the electronic device is still high.
  • the first boards 11 of the first hardware module a are arranged horizontally, and the second boards 12 are offset downward relative to the first boards 11 . Therefore, the height of the connector 3 can be reduced to smoothly connect with the second hardware module b.
  • an electronic device is shown, and the electronic device is a dual-control storage device.
  • the hard disk d is a standard component
  • the height of the connector of the hard disk d relative to the bottom of the device is fixed, and thus the height of the parallel backplane (second hardware module b) is also determined.
  • the power module f is also a standard part, so the height of the connector of the power module f is also determined, that is, the height of the connectors on both sides of the power conversion board (the first hardware module a) has been determined, if the power If the connectors on both sides of the conversion board (the first hardware module a) are not at the same height, the power conversion board (the first hardware module a) cannot be smoothly connected to the parallel backplane (the second hardware module b) or the power module f .
  • the connector 3 can be lowered in height through the downward deviation of the second board body 12, so that it can be smoothly connected with The parallel backplane (the second hardware module b) is docked.
  • the first boards 11 of the first hardware module a are arranged vertically, and the second boards 12 are offset horizontally relative to the first boards 11 . Therefore, the position of the connector 3 can be adjusted in the horizontal direction to smoothly connect with the second hardware module b.
  • an electronic device is shown, and the electronic device is a dual-control storage device.
  • the electronic device is a dual-control storage device.
  • the dual-control storage device there are 4 hardware modules interconnected from front to back, which are power module f, power conversion board (namely the first hardware module a), vertical backplane (namely the second hardware module b) and hard drive d.
  • the connectors on the power conversion board (the first hardware module a) and the vertical backplane (the second hardware module b) may not be aligned in the horizontal direction due to the heat dissipation through the holes in the vertical backplane and the layout of the connectors of the hard disk d. .
  • the connector 3 can be adjusted in the horizontal direction through the offset of the second board body 12 in the horizontal direction. position, so that the power conversion board (the first hardware module a) can be smoothly docked with the vertical backplane (the second hardware module b).
  • the second hardware module b is also the hardware module provided by the embodiments of the present disclosure.
  • the second plate body 12 of the first hardware module a is offset toward the first direction relative to the first plate body 11, and the second plate body 12 of the second hardware module b is offset toward the second direction relative to the first plate body 11.
  • Move, the first direction is opposite to the second direction. For example, as shown in FIG. 17, the first direction is upward and the second direction is downward.
  • the relative offset of the second board body 12 of the two hardware modules can be used to reduce the The offset distance of the second board body 12 of each hardware module relative to the first board body 11 is reduced to improve the reliability of the electronic components on the printed circuit board.

Abstract

本公开提供了一种印制电路板、印制电路板总成、硬件模组和电子设备，属于电子设备技术领域。本公开利用印制电路板允许在一定范围内发生形变的特性，在印制电路板上开设间隙，使得印制电路板划分为第一板体和第二板体，且第二板体能够相对于第一板体偏移。这样，可以将需要调整位置的连接器固定在第二板体上，从而可以通过将第二板体相对于第一板体的偏移来调节连接器的位置，能够提高硬件模组的对接能力，并且，硬件模组整体位置不会发生改变，不会影响硬件模组在电子设备内部的布局。

Description

印制电路板、印制电路板总成、硬件模组和电子设备
本公开要求于2021年06月22日提交的申请号为202110690751.0、发明名称为“印制电路板、印制电路板总成、硬件模组和电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本公开涉及电子设备技术领域，特别涉及一种印制电路板、印制电路板总成、硬件模组和电子设备。
背景技术
随着电子设备组成越来越复杂，电子设备内部的硬件模组的数量也越来越多，硬件模组之间的互连关系也变得更复杂。
硬件模组之间常见的互连方式有两大类，分别为硬连接方式和软连接方式。其中，硬连接方式是指使用公母连接器互配实现连接；软连接方式是指使用线缆实现连接。硬连接方式相对于软连接方式来说，具有插拔方便、连接可靠性好和无线缆阻挡风道等优点。
然而，硬连接方式要求公母连接器精确对齐，如果电子设备内部因结构布局等原因导致公母连接器不在同一高度，就会使得公母连接器无法对接。举例来说，第一硬件模组和第二硬件模组需要互连，而第一硬件模组出于提升空间利用率的考虑，需要紧贴电子设备的底部，这使得第一硬件模组的连接器的高度低于第二硬件模组的连接器的高度，导致第一硬件模组和第二硬件模组的连接器无法对接。
发明内容
本公开提供了印制电路板(printed circuit board，PCB)、印制电路板总成(printed circuit board assembly，PCBA)、硬件模组和电子设备，能够在不影响电子设备内部结构布局的前提下，提升硬件模组之间通过连接器的互连对接能力。所述印制电路板、印制电路板总成、硬件模组和电子设备的技术方案如下所述：
第一方面，提供了一种印制电路板，所述印制电路板包括第一板体和第二板体；所述第一板体和所述第二板体之间具有间隙；所述第一板体用于支撑电子元器件；所述第二板体用于支撑连接器；所述第二板体能够相对于所述第一板体偏移，使所述第二板体与所述第一板体至少不完全在同一平面。
其中，印制电路板还可以称为印刷线路板，是重要的电子部件，是电子元器件的支撑体，也是电子元器件电连接的载体。
第一板体用于支撑电子元器件，该电子元器件可以为任何类型的电子元器件。第二板体用于支撑的连接器为需要调整位置的连接器。第一板体和第二板体之间具有走线，以使得第二板体上的连接器能够与第一板体上的电子元器件顺利对接。第一板体还可以称为支撑板体，第二板体还可以称为形变板体。
本公开所示的技术方案，利用印制电路板允许在一定范围内发生形变的特性，在印制电路板上开设间隙，使得印制电路板划分为第一板体和第二板体，且第二板体能够相对于第一板体偏移。
这样，可以将需要调整位置的连接器固定在第二板体上，并可以通过将第二板体相对于第一板体偏移来调节连接器的位置，从而能够提高硬件模组的对接能力。
并且，可以仅仅改变第二板体和连接器的位置，而硬件模组的大部分(如第一板体和第一板体上的电子元器件)的位置可以不发生变化，从而能够在不影响硬件模组在电子设备内部布局的情况下，调节连接器的位置。
再者，在印制电路板允许的形变范围内，第二板体能够相对于第一板体偏移任意距离，连接器的位置能够在一个范围内任意调整，具备良好的适用性。
在一种可能的实现方式中，所述第一板体和所述第二板体一体成型。
在一种可能的实现方式中，所述间隙沿所述印制电路板的长度方向延伸。
在一种可能的实现方式中，所述间隙的宽度大于1mm。
在一种可能的实现方式中，所述第二板体呈长条状，且所述第二板体的宽度小于所述第一板体的宽度。
本公开所示的技术方案，通过设置第二板体为长条状，减小了第二板体占用的印制电路板的面积，减小了第二板体对电子元器件在印制电路板上的布局的影响。
在一种可能的实现方式中，所述第二板体包括形变部和连接器支撑部；所述形变部的一端与所述第一板体相连，另一端与所述连接器支撑部相连；所述连接器支撑部用于支撑所述连接器，且所述连接器支撑部的宽度大于或等于所述形变部的宽度。
本公开所示的技术方案，通过设置连接器支撑部的宽度大于或等于形变部的宽度，便于连接器支撑部支撑连接器，且便于形变部相对于第一板体发生偏移。
在一种可能的实现方式中，所述形变部的最小宽度大于5mm。
在一种可能的实现方式中，所述形变部包括延伸部和过渡部；所述延伸部的一端与所述第一板体相连，另一端与所述过渡部的第一端相连；所述过渡部的第二端与所述连接器支撑部相连；所述过渡部的第一端的宽度与所述延伸部的宽度相同，所述过渡部的第二端的宽度与所述连接器支撑部的宽度相同，且沿着第一端至第二端的方向，所述过渡部的宽度逐渐增大。
本公开所示的技术方案，通过设置过渡部，使得第二板体上没有宽度的突变，减小了应力集中，增强了第二板体的强度。
第二方面，提供了一种印制电路板总成，所述印制电路板总成包括电子元器件、连接器和如第一方面任一项所述的印制电路板；所述电子元器件固定在所述印制电路板的第一板体上；所述连接器固定在所述印制电路板的第二板体上。
其中，印制电路板总成是印制电路板经过表面组装技术(surface mount technology，SMT)或经过双列直插式封装技术(dual in-line package，DIP)插件后形成的。
第三方面，提供了一种硬件模组，所述硬件模组包括壳体组件和如第二方面所述的印制电路板总成；所述印制电路板总成固定在所述壳体组件中。
其中，壳体组件可以包括壳体和结构件，印制电路板总成位于壳体的内部，结构件迫使印制电路板总成的第二板体相对于印制电路板总成的第一板体发生偏移。
本公开所示的技术方案，通过在硬件模组中应用上述印制电路板总成，使得可以通过结构件迫使印制电路板总成的第二板体相对于印制电路板总成的第一板体发生所需的偏移，从而可以调节连接器至目标位置。
在一种可能的实现方式中，所述壳体组件包括第一壳体、第一卡扣和第二卡扣；所述第一卡扣和所述第二卡扣均与所述第一壳体固定连接，且所述第一卡扣的卡接口与所述第二卡扣的卡接口的高度不同；所述第一板体的侧壁伸入至所述第一卡扣的卡接口中，所述第二板体的侧壁伸入至所述第二卡扣的卡接口中。
在一种可能的实现方式中，所述第二卡扣位于所述连接器的第一侧，所述第一侧与所述连接器的对接端相背；所述第二卡扣为多个，且多个所述第二卡扣中距离所述连接器最近的两个第二卡扣的卡接口的高度相同。
本公开所示的技术方案，通过上述设置，使得两个第二卡扣迫使连接器所在的第二板体的部分(如连接器支撑部)与第一板体平行或近似平行，进而使得连接器与第一板体平行或近似平行。与连接器设置在第一板体上相比，连接器设置在第二板体上仅仅是高度变化，而姿态没有发生变化，从而便于连接器与对端连接器的对接。而且连接器所在的第二板体的部分未发生弯折，也使得连接器不会发生形变，保证了连接器的可靠性。
在一种可能的实现方式中，所述壳体组件包括第二壳体、第一支撑件、第一锁紧件、第二支撑件和第二锁紧件；所述第一支撑件和所述第二支撑件均与所述第二壳体的内壁固定连接，且所述第一支撑件和所述第二支撑件的高度不同；所述第一支撑件支撑所述第一板体，所述第一锁紧件穿过所述第一板体，且固定在所述第一支撑件中；所述第二支撑件支撑所述第二板体，所述第二锁紧件穿过所述第二板体，且固定在所述第二支撑件中。
在一种可能的实现方式中，所述第二支撑件和所述第二锁紧件位于所述连接器的第一侧，所述第一侧与所述连接器的对接端相背；所述第二支撑件的支撑面与所述第一板体的板面平行，所述第二锁紧件将所述第二板体与所述第二支撑件的支撑面压紧。
本公开所示的技术方案，通过上述设置，使得第二支撑件和第二锁紧件迫使连接器所在的第二板体的部分(如连接器支撑部)与第一板体平行或近似平行，进而使得连接器与第一板体平行或近似平行。与连接器设置在第一板体上相比，连接器设置在第二板体上仅仅是高度变化，而姿态没有发生变化，从而，便于连接器与对端连接器的对接。而且连接器所在的第二板体的部分未发生弯折，也使得连接器不会发生形变，保证了连接器的可靠性。
在一种可能的实现方式中，所述第二板体相对于所述第一板体的偏移距离可调。
本公开所示的技术方案，通过设置第二板体相对于第一板体的偏移距离可调，便于根据实际的安装工况调节第二板体相对于第一板体的偏移距离。
在一种可能的实现方式中，所述第二支撑件与所述第二壳体可拆连接，以使得所述硬件模组能够更换不同高度的第二支撑件。
在一种可能的实现方式中，所述第二支撑件的高度可调。
在一种可能的实现方式中，所述第二板体相对于所述第一板体偏移的最大距离与所述第二板体的第一对角线的长度的比值小于0.75％。
其中，所述第一对角线位于所述第二板体的一个板面上，且所述第一对角线为以第一顶 点为一个端点的最长对角线，所述第一顶点位于所述间隙、所述第一板体和所述第二板体的交界处。
本公开所示的技术方案，通过设置第二板体相对于第一板体偏移的最大距离与第二板体的第一对角线的长度的比值小于0.75％，能够避免第二板体相对于第一板体偏移过大，提升了印制电路板的可靠性。
第四方面，提供了一种电子设备，所述电子设备包括第一硬件模组和第二硬件模组，所述第一硬件模组为如第三方面任一项所述的硬件模组；所述第一硬件模组的连接器与所述第二硬件模组对接。
其中，该电子设备可以为存储设备、服务器和网络设备等信息技术(information technology，IT)设备。
本公开所示的技术方案，通过应用上述硬件模组至少能够带来以下有益效果：
第一，不使用线缆连接两个硬件模组，减少了电子设备内部的空气流动的阻碍，提升了电子设备的散热能力，使得电子设备的密度可以进一步提升。
第二，不需要使用定制高度的连接器，降低了定制成本，并且减少了定制连接器制作所需要的周期。
第三，不需要增设转换板，降低了电子设备的成本，节约了电子设备内部的空间，缩短了信号传输路径，提高了连接的可靠性，提高了加工效率。
在一种可能的实现方式中，所述第一硬件模组的第二板体相对于第一板体在竖直方向偏移。
在一种可能的实现方式中，所述第一硬件模组的第二板体相对于第一板体在水平方向偏移。
在一种可能的实现方式中，所述第二硬件模组为如第三方面任一项所述的硬件模组；
所述第一硬件模组的第二板体相对于第一板体向着第一方向偏移，所述第二硬件模组的第二板体相对于第一板体向着第二方向偏移，所述第一方向和所述第二方向相反。
附图说明
图1是本公开实施例提供的一种印制电路板的示意图；
图2是本公开实施例提供的一种印制电路板的示意图；
图3是本公开实施例提供的一种印制电路板的示意图；
图4是本公开实施例提供的一种印制电路板总成的示意图；
图5是本公开实施例提供的一种硬件模组的示意图；
图6是本公开实施例提供的一种硬件模组的示意图；
图7是本公开实施例提供的一种硬件模组的示意图；
图8是本公开实施例提供的一种硬件模组的示意图；
图9是本公开实施例提供的一种硬件模组的示意图；
图10是本公开实施例提供的一种硬件模组的示意图；
图11是本公开实施例提供的一种电子设备的示意图；
图12是本公开实施例提供的一种电子设备的示意图；
图13是本公开实施例提供的一种电子设备的示意图；
图14是本公开实施例提供的一种电子设备的示意图；
图15是本公开实施例提供的一种电子设备的示意图；
图16是本公开实施例提供的一种电子设备的示意图；
图17是本公开实施例提供的一种电子设备的示意图。
图例说明
a、第一硬件模组，b、第二硬件模组，c、电子设备壳体，d、硬盘，e、接口板，f、电源模块；
01、壳体组件，011a、第一壳体，012a、第一卡扣，013a、第二卡扣，011b、第二壳体，012b、第一支撑件，013b、第一锁紧件，014b、第二支撑件，015b、第二锁紧件；
02、印制电路板总成；
1、印制电路板，10、间隙，11、第一板体，12、第二板体，121、形变部，1211、延伸部，1212、过渡部，122、连接器支撑部，100、第一顶点；
2、电子元器件；
3、连接器。
具体实施方式
随着存储设备和服务器等电子设备的算力、性能需求持续提升，电子设备组成越来越复杂，内部的硬件模组越来越多，硬件模组之间的互连也更加复杂。其中，硬件模组具有印制电路板总成(printed circuit board assembly，PCBA)，印制电路板总成可以具有连接器，以和其余硬件模组互连。硬件模组还可以称为功能模块和硬件模块等。
硬件模组的互连方式一般有两大类，分别为硬连接方式和软连接方式。其中，硬连接方式是指使用公母连接器互配实现连接，软连接方式是指使用线缆实现连接。硬连接方式相对于软连接方式来说，具有插拔方便、连接可靠性好和无线缆阻挡风道等优点。
但是，硬连接方式要求两个硬件模组的连接器精确对齐，如果电子设备内部因结构布局等原因导致需要互连的两个连接器不在同一个高度时，就会出现无法对接的情况。这时，相关技术中有以下三种解决方案：方案一，将硬连接方式更改为软连接方式，即使用线缆连接两个硬件模组；方案二，使用定制高度的连接器；方案三，在两个硬件模组之间增加转换板，转换板的两侧具有高度不同的两个连接器，该两个连接器分别与两个硬件模组的连接器对接。
然而，上述方案一中的线缆会阻碍电子设备内部的空气流动，不利于电子设备的散热；上述方案二中的定制高度的连接器，相对于通用的连接器来说，可供应性差且成本高，而且根据不同的使用场景，需要定制不同高度的连接器，可复用性差；上述方案三中由于增设了转换板，所以增加了电子设备的成本，并占用了电子设备内部的空间，而且，硬件模组之间连接的次数增多，降低了连接的可靠性，再者，增加了生产加工装配工序，降低了加工效率。
鉴于上述技术问题，本公开实施例提供了印制电路板(printed circuit board，PCB)、印制电路板总成、硬件模组和电子设备，能够解决上述技术问题。
下面，对本公开实施例提供的印制电路板、印制电路板总成、硬件模组和电子设备分别进行说明。
本公开实施例提供了一种印制电路板，如图1和图2所示，印制电路板包括第一板体11和第二板体12。第一板体11和第二板体12之间具有间隙10。第一板体11用于支撑电子元器件。第二板体12用于支撑连接器。第二板体12能够相对于第一板体11偏移，使第二板体12与第一板体11至少不完全在同一平面。
其中，印制电路板还可以称为印刷线路板，是重要的电子部件，是电子元器件的支撑体，也是电子元器件电连接的载体。
第一板体11用于支撑电子元器件，该电子元器件可以为任何类型的电子元器件。第二板体12支撑的连接器为需要调整位置的连接器。第一板体11和第二板体12之间具有走线，以使得第二板体12上的连接器能够与第一板体11上的电子元器件顺利相连。第一板体11也可以称为支撑板体，第二板体12也可以称为形变板体。第一板体11和第二板体12可以为一体成型。
间隙10沿厚度方向贯穿印制电路板，且在印制电路板的一个侧壁开口，另一个侧壁封闭。间隙10也可以称为开槽。
本公开实施例提供的技术方案，利用印制电路板允许在一定范围内发生形变的特性，在印制电路板上开设间隙10，使得印制电路板划分为第一板体11和第二板体12，且第二板体12能够相对于第一板体11偏移。
这样，可以将需要调整位置的连接器固定在第二板体12上，并可以通过将第二板体12相对于第一板体11偏移来调节连接器的位置，从而，能够提高硬件模组的对接能力。
并且，可以仅仅改变第二板体12和连接器的位置，而硬件模组的大部分(如第一板体11和第一板体11上的电子元器件)的位置可以不发生变化，从而能够在不影响硬件模组在电子设备内部布局的情况下，调节连接器的位置。
再者，在印制电路板允许的形变范围内，第二板体12能够相对于第一板体11偏移任意距离，连接器的位置能够在一个范围内任意调整，具备良好的适用性。
本公开实施例对间隙10的尺寸和位置不做限定，间隙10的具体尺寸和位置，根据连接器所占用的面积，以及连接器所需偏移的距离来确定。
在一些示例中，间隙10沿印制电路板的长度方向延伸，且间隙10的宽度大于1mm。另外，考虑到间隙10会占据印制电路板的一部分面积，所以，在满足第二板体12能够相对于第一板体11偏移目标距离的前提下，间隙10的长度和宽度均不宜过大，如宽度可以小于10mm。
本公开实施例对第二板体12的形状和尺寸均不做限定，只要第二板体12能够支撑连接器，且在保证印制电路板可靠性的前提下，能够相对于第一板体11偏移所需距离即可。
由于第二板体12会发生形变，所以为了防止电子元器件的可靠性失效风险升高，在一些示例中，第二板体12上可以只布局连接器。
当然，在保证电子元器件正常工作的前提下，也可以在第二板体12上布局除连接器之外的电子元器件，以充分利用印制电路板的面积。
在一些示例中，为了减小第二板体12占用的印制电路板的面积，减小第二板体12对电子元器件在印制电路板上的布局的影响，如图1和图2所示，第二板体12呈长条状，且第二板体12的宽度小于第一板体11的宽度。
在一些示例中，如图3所示，第二板体12包括形变部121和用于支撑连接器的连接器支撑部122。形变部121的一端与第一板体11相连，另一端与连接器支撑部122相连。
本公开实施例对形变部121和连接器支撑部122的宽度均不做限定。
在一些示例中，为了预留走线空间，以及保证形变部121的强度，防止形变部121折断，第二板体121的最小宽度可以大于5mm。另外，为了便于第二板体12相对于第一板体11发生偏移，以及减少第二板体12占据的印制电路板的面积，形变部121的宽度也不宜设置较大。
连接器支撑部122的宽度由所需支撑的一个或多个连接器的宽度决定。
在一些示例中，当连接器支撑部122所需支撑的一个或多个连接器的宽度较小时，可以设置连接器支撑部122的宽度和形变部121的宽度相等，也即，第二板体12为一长方体板体。间隙10可以为一直间隙，从而减小了间隙10的制作难度。
在另一些示例中，当连接器支撑部122所需支撑的一个或多个连接器的宽度较大时，可以设置连接器支撑部122的宽度大于形变部121的宽度，从而，在保证第二板体12能够支撑连接器的前提下，尽可能的减少第二板体12占用的印制电路板的面积。
另外，当连接器支撑部122的宽度大于形变部121的宽度时，为了减小应力集中，保证第二板体12的强度，在一些示例中，如图3所示，形变部121包括延伸部1211和过渡部1212。延伸部1211的一端与第一板体11相连，另一端与过渡部1212的第一端相连。过渡部1212的第二端与连接器支撑部122相连。过渡部1212的第一端的宽度与延伸部1211的宽度相同，过渡部1212的第二端的宽度与连接器支撑部122的宽度相同，且沿着第一端至第二端的方向，过渡部1212的宽度逐渐增大。
这样，第二板体12上没有宽度的突变，减小了应力集中，增强了第二板体12的强度。
本公开实施例对过渡部1212的形态不做限定，在一些示例中，如图3所示，过渡部1212的宽度沿着长度方向均匀递减，也即，过渡部1212位于间隙10的侧面(也即与第一板体11相对的侧面)为一斜面。
在另一些示例中，过渡部1212的宽度也可以沿着长度方向不均匀递减，过渡部1212位于间隙10的侧面(也即与第一板体11相对的侧面)可以为一弧面。
本公开实施例还提供了一种印制电路板总成，如图4所示，印制电路板总成包括上述印制电路板1、电子元器件2和连接器3。电子元器件2固定在印制电路板1的第一板体11上，连接器3固定在印制电路板1的第二板体12上。
其中，印制电路板总成是印制电路板经过表面组装技术(surface mount technology，SMT)或经过双列直插式封装技术(dual in-line package，DIP)插件后形成的。
由于第二板体12会相对于第一板体11发生偏移，也即，第二板体12会发生形变，所以除了需要调节位置的连接器(即连接器3)之外，一般不在第二板体12上排布其余电子元器件，以避免电子元器件因跟随第二板体12发生形变而导致可靠性下降。
当然，在保证电子元器件正常工作的前提下，也可以在第二板体12上布局除连接器之外的电子元器件，以充分利用印制电路板的面积。
第一板体11由于不发生形变，所以可以支撑任何电子元器件，也即，电子元器件2可以为任何类型的电子元器件。
本公开实施例还提供了一种硬件模组，如图5所示，硬件模组包括壳体组件01和印制电路板总成02。印制电路板总成02固定在壳体组件01中，且印制电路板总成02的第二板体12相对于印制电路板总成02的第一板体11偏移。
其中，壳体组件01包括壳体和结构件，印制电路板总成02位于壳体的内部，结构件迫使印制电路板总成02的第二板体12相对于印制电路板总成02的第一板体11发生偏移，从而能够调整连接器3的位置，使得硬件模组能够顺利的与其它硬件模组对接。
本公开实施例对印制电路板总成02在壳体组件01内部的固定方式不做限定，下面，提供几种可能的实现方式：
(1)在一些示例中，如图5所示，壳体组件01包括第一壳体011a、第一卡扣012a和第二卡扣013a。第一卡扣012a和第二卡扣013a均与第一壳体011a固定连接，且第一卡扣012a的卡接口和第二卡扣013a的卡接口的高度不同。第一板体11的侧壁伸入至第一卡扣012a的卡接口中，第二板体12的侧壁伸入至第二卡扣013a的卡接口中。
需要说明的是，为了便于显示印制电路板总成02的固定方式，第一壳体011a仅仅示出一个安装壁。
由于第一卡扣012a的卡接口和第二卡扣013a的卡接口的高度不同，所以会迫使第二板体12相对于第一板体11发生偏移。第二板体12发生偏移的距离和方向，根据第一卡扣012a的卡接口和第二卡扣013a的卡接口的高度关系来确定。
第一卡扣012a的卡接口的高度可以大于第二卡扣013a的卡接口高度，也可以小于第二卡扣013a的卡接口的高度(如图5所示)，本公开实施例对此不做限定。第一卡扣012a和第二卡扣013a可以根据连接器所需偏移的距离和偏移方向来设计。
本公开实施例对第一卡扣012a和第二卡扣013a的数量和位置均不做限定。在一些示例中，第一卡扣012a为多个，且多个第一卡扣012a的卡接口的高度相同。例如，如图5所示，第一卡扣012a为3个，且3个第一卡扣012a分别分布在第一板体11的3个角落位置。
在一些示例中，如图6所示，第二卡扣013a位于连接器3靠近第二板体12的连接端的一侧，连接端为第二板体12与第一板体11连接的一端(或理解为第二卡扣013a位于连接器3的第一侧，第一侧与连接器3的对接端相背)。第二卡扣013a为多个(如两个)，且多个第二卡扣013a中距离连接器3最近的两个第二卡扣013a的卡接口的高度相同。
这样，两个第二卡扣013a迫使连接器所在的第二板体12的部分(如连接器支撑部122)与第一板体11平行或近似平行，进而使得连接器与第一板体11平行或近似平行。与连接器设置在第一板体11上相比，连接器设置在第二板体12上仅仅是高度变化，而姿态没有发生变化，从而便于连接器与对端连接器的对接。而且连接器所在的第二板体12的部分未发生弯折，也使得连接器不会发生形变，保证了连接器的可靠性。
(2)在一些示例中，如图7所示，壳体组件01包括第二壳体011b、第一支撑件012b、第一锁紧件013b、第二支撑件014b和第二锁紧件015b。第一支撑件012b和第二支撑件014b均与第二壳体011b固定连接，且第一支撑件012b和第二支撑件014b的高度不同。第一支撑件012b第一板体11，第一锁紧件013b穿过第一板体11，且固定在第一支撑件012b中。第二支撑件014b支撑第二板体12，第二锁紧件015b穿过第二板体12，且固定在第二支撑件014b中。
需要说明的是，为了便于显示印制电路板总成02的固定方式，第二壳体011b仅仅示出 一个安装壁。
由于第一支撑件012b和第二支撑件014b的高度不同，所以会迫使第二板体12相对于第一板体11发生偏移，第二板体12发生偏移的距离和方向，根据第一支撑件012b和第二支撑件014b的高度关系来确定。
第一支撑件012b的高度可以大于第二支撑件014b的高度(如图7所示)，也可以小于第二支撑件014b的高度(如图10所示)，本公开实施例对此不做限定。第一支撑件012b和第二支撑件014b可以根据连接器所需偏移的距离和方向来设计。
本公开实施例对第一支撑件012b、第一锁紧件013b、第二支撑件014b和第二锁紧件015b的具体类型不做限定。在一些示例中，第一支撑件012b和第二支撑件014b为支撑螺柱，第一锁紧件013b和第二锁紧件015b为螺钉。在另一些示例中，第一支撑件012b和第二支撑件014b为支撑柱，第一锁紧件013b和第二锁紧件015b为铆钉。
本公开实施例对第一支撑件012b、第一锁紧件013b、第二支撑件014b和第二锁紧件015b的数量和位置均不做限定。在一些示例中，第一支撑件012b和第一锁紧件013b均为多个，例如，如图7或图10所示，第一支撑件012b和第一锁紧件013b均为4个，且4个第一支撑件012b和第一锁紧件013b分别分布在第一板体11的4个角落位置。
在一些示例中，如图8所示，第二支撑件014b和第二锁紧件015b位于连接器3靠近第二板体12的连接端的一侧，连接端为第二板体12与第一板体11连接的一端(或理解为第二支撑件014b和第二锁紧件015b位于连接器3的第一侧，第一侧与连接器3的对接端相背)。第二支撑件014b的支撑面与第一板体11的板面平行，第二锁紧件015b将第二板体12与第二支撑件014b的支撑面压紧。
这样，第二支撑件014b和第二锁紧件015b迫使连接器所在的第二板体12的部分(如连接器支撑部122)与第一板体11平行，进而使得连接器与第一板体11平行。与连接器设置在第一板体11上相比，连接器设置在第二板体12上仅仅是高度变化，而姿态没有发生变化，从而，便于连接器与对端连接器的对接。而且连接器所在的第二板体12的部分未发生弯折，也使得连接器不会发生形变，保证了连接器的可靠性。
为了连接器的高度可以根据实际的安装工况调节，在一些示例中，第二板体12相对于第一板体11的偏移距离可调。
本公开实施例对第二板体12相对于第一板体11的偏移距离可调的实现方式不做限定，下面，提供几种可能的实现方式：
在一些示例中，第二支撑件014b与第二壳体011b可拆连接，则能够通过更换不同高度的第二支撑件014b调节第二板体12相对于第一板体11的偏移距离。例如，第二支撑件014b可以与第二壳体011b螺纹连接。
在一些示例中，第二支撑件014b的高度可调，则能够通过调节第二支撑件014b的高度调节第二板体12相对于第一板体11的偏移距离。
本公开实施例对第二支撑件014b的高度可调的实现方式不做限定。
示例性的，第二支撑件014b包括支撑主体和垫片，垫片位于支撑主体靠近第二板体12的一侧，第二支撑件014b能够通过增减垫片来调节第二支撑件014b的高度。第二锁紧件015b穿过垫片并拧紧在支撑主体的内部。
再示例性的，第二支撑件014b与第二壳体011b螺纹连接，则可以通过在第二壳体011b 上旋转第二支撑件014b，调节第二支撑件014b的高度。
再示例性的，第二支撑件014b包括柱体和压缩弹簧，压缩弹簧环套柱体。压缩弹簧支撑第二板体12，第二锁紧件015b拧紧在柱体中，则可以通过旋转第二锁紧件015b，来调节压缩弹簧的长度，进而调节第二支撑件014b的高度。
当然，在实际应用中，也可以设置第二板体12相对于第一板体11的偏移距离不可调，也即，在硬件模组的设计阶段，即对第二板体12相对于第一板体11的偏移距离设计确定。对于这类硬件模组，一旦装配完成，第二板体12相对于第一板体11的偏移距离就不可调。
在这种情况下，第一支撑件012b和第二支撑件014b可以和第二壳体014b不可拆连接，例如，第一支撑件012b和第二支撑件014b可以和第二壳体011b制作为一体结构。另外，也可以采用上述卡接的方式，将印制电路板总成02卡接在第一壳体11a的内部。
在一些示例中，为了避免过大的偏移距离影响印制电路板的可靠性，根据印制电路板形变标准(或称为印制电路板翘起度标准)，第二板体12相对于第一板体11偏移的最大距离h与第二板体12的第一对角线的长度L的比值小于或等于0.75％。如图8和图9所示，也即，h/L小于或等于0.75％。
其中，如图9所示，第一对角线位于第二板体12的一个板面上，且第一对角线为以第一顶点100为一个端点的最长对角线，第一顶点100位于间隙10、第一板体11和第二板体12的交界处。
另外，考虑实际运行温度等因素，为了进一步保障硬件模组的可靠性，在一些示例中，第二板体12相对于第一板体11偏移的最大距离与第二板体12的第一对角线的长度的比值小于0.5％。
需要说明的是，由于第二板体12呈长条状，所以第二板体12的长度和第一对角线的长度相差不大，因此也可以是第二板体12相对于第一板体11偏移的最大距离h与第二板体12未发生形变时长度的比值小于0.75％或0.5％。
本公开实施例还提供了一种电子设备，如图11所示，电子设备包括第一硬件模组a和第二硬件模组b。第一硬件模组a为本公开实施例提供的硬件模组。第一硬件模组a的连接器3与第二硬件模组b对接。另外，电子设备还包括电子设备壳体c，第一硬件模组a和第二硬件模组b可以固定在电子设备壳体c的内部。
其中，该电子设备可以为存储设备、服务器和网络设备等信息技术(information technology，IT)设备。
本公开实施例提供的电子设备相较于采用相关技术的三个解决方案的电子设备至少能够带来以下有益效果：
(1)不使用线缆连接两个硬件模组，减少了电子设备内部的空气流动的阻碍，提升了电子设备的散热能力，使得电子设备的密度可以进一步提升。
(2)不需要使用定制高度的连接器，降低了定制成本，并且减少了定制连接器制作所需要的周期。
(3)不需要增设转换板，降低了电子设备的成本，节约了电子设备内部的空间，缩短了信号传输路径，提高了连接的可靠性，提高了加工效率。
本公开实施例对第二板体12相对于第一板体11的偏移方向不做限定，下面，分别对几 种可能的偏移方向进行说明：
在一些示例中，如图11所示，第一硬件模组a的第一板体11水平排布，第二板体12相对于第一板体11向上偏移。从而，可以提升连接器3的高度，以和第二硬件模组b顺利对接。
举例来说，如图12所示，示出了一种电子设备，该电子设备为双控存储设备。双控存储设备内部从前到后有4个硬件模组互连，分别为接口板e、底板(即第一硬件模组a)、平行背板(即第二硬件模组b)和硬盘d。
由于硬盘d是标准件，所以硬盘d的连接器相对于设备底部的高度固定，进而平行背板(第二硬件模组b)的高度也就确定了。而接口板e和底板(第一硬件模组a)因为在垂直空间的利用率等原因，需要紧贴设备底部，这会造成底板(第一硬件模组a)的连接器3低于平行背板(第二硬件模组b)的连接器，使得底板(第一硬件模组a)和平行背板(第二硬件模组b)不能顺利对接。
而通过在底板(第一硬件模组a)中应用本公开实施例提供的技术方案，使得连接器3可以通过第二板体12向上的偏移而抬升高度，从而能够顺利的与平行背板(第二硬件模组b)对接。并且，底板(第一硬件模组a)的整体位置保持不变，底板(第一硬件模组a)仍然可以紧贴设备的底部，使得电子设备的空间利用率仍然较高。
在一些示例中，如图13所示，第一硬件模组a的第一板体11水平排布，第二板体12相对于第一板体11向下偏移。从而，可以降低连接器3的高度，以和第二硬件模组b顺利对接。
举例来说，如图14所示，示出了一种电子设备，该电子设备为双控存储设备。双控存储设备内部从前到后有4个硬件模组互连，分别为电源模块f、电源转换板(即第一硬件模组a)、平行背板(即第二硬件模组b)和硬盘d。
由于硬盘d是标准件，所以硬盘d的连接器相对于设备底部的高度固定，进而平行背板(第二硬件模组b)的高度也就确定了。同时，电源模块f也是标准件，所以电源模块f的连接器的高度也就确定了，也即，电源转换板(第一硬件模组a)两侧的连接器的高度均已经确定，如果电源转换板(第一硬件模组a)两侧的连接器不在同一高度，则电源转换板(第一硬件模组a)无法与平行背板(第二硬件模组b)或电源模块f顺利对接。
而通过在电源转换板(第一硬件模组a)中应用本公开实施例提供的技术方案，使得连接器3可以通过第二板体12向下的偏移而降低高度，从而能够顺利的与平行背板(第二硬件模组b)对接。
需要说明的是，图14示出的仅仅是一种可能的解决方式，在实际应用中，也可以是将电源转换板(第一硬件模组a)靠近电源模块f的一侧的连接器升高。
在一些示例中，如图15所示，第一硬件模组a的第一板体11竖直排布，第二板体12相对于第一板体11在水平方向偏移。从而，可以在水平方向上调整连接器3的位置，以和第二硬件模组b顺利对接。
举例来说，如图16所示，示出了一种电子设备，该电子设备为双控存储设备。双控存储设备的内部从前到后有4个硬件模组互连，分别为电源模块f、电源转换板(即第一硬件模组a)、垂直背板(即第二硬件模组b)和硬盘d。
由于垂直背板开孔散热和硬盘d的连接器布局等原因，电源转换板(第一硬件模组a)和垂直背板(第二硬件模组b)的连接器可能在水平方向上不能对齐。
而通过在电源转换板(第一硬件模组a)中应用本公开实施例提供的技术方案，使得连 接器3可以通过第二板体12在水平方向上的偏移而调节在水平方向上的位置，从而使得电源转换板(第一硬件模组a)能够与垂直背板(第二硬件模组b)顺利对接。
在一些示例中，如图17所示，第二硬件模组b也为本公开实施例提供的硬件模组。第一硬件模组a的第二板体12相对于第一板体11向着第一方向偏移，第二硬件模组b的第二板体12相对于第一板体11向着第二方向偏移，第一方向和第二方向相反。例如，如图17所示，第一方向为向上，第二方向为向下。
通过在对接的第一硬件模组a和第二硬件模组b中均应用本公开实施例提供的技术方案，使得可以通过两个硬件模组的第二板体12的相向偏移，来减小各个硬件模组的第二板体12相对于第一板体11的偏移距离，提高印制电路板上的电子元器件的可靠性。
以上所述仅为本公开的可选实施例，并不用以限制本公开，凡在本公开的原则之内，所作的任何修改、等同替换、改进等，均应包含在本公开的保护范围之内。

Claims (21)

  1. 一种印制电路板，其特征在于，所述印制电路板包含第一板体(11)和第二板体(12)；
    所述第一板体(11)和所述第二板体(12)之间具有间隙(10)；
    所述第一板体(11)用于支撑电子元器件；
    所述第二板体(12)用于支撑连接器；
    所述第二板体(12)能够相对于所述第一板体(11)偏移，使所述第二板体(12)与所述第一板体(11)至少不完全在同一平面。
  2. 根据权利要求1所述的印制电路板，其特征在于，所述第一板体(11)和所述第二板体(12)一体成型。
  3. 根据权利要求1-2任一项所述的印制电路板，其特征在于，所述间隙(10)的宽度大于1mm。
  4. 根据权利要求1-3任一项所述的印制电路板，其特征在于，所述第二板体(12)呈长条状，且所述第二板体(12)的宽度小于所述第一板体(11)的宽度。
  5. 根据权利要求1-4任一项所述的印制电路板，其特征在于，所述第二板体(12)包括形变部(121)和连接器支撑部(122)；
    所述形变部(121)的一端与所述第一板体(11)相连，另一端与所述连接器支撑部(122)相连；
    所述连接器支撑部(122)用于支撑所述连接器，且所述连接器支撑部(122)的宽度大于或等于所述形变部(121)的宽度。
  6. 根据权利要求5所述的印制电路板，其特征在于，所述形变部(121)的最小宽度大于5mm。
  7. 根据权利要求5或6所述的印制电路板，其特征在于，所述形变部(121)包括延伸部(1211)和过渡部(1212)；
    所述延伸部(1211)的一端与所述第一板体(11)相连，另一端与所述过渡部(1212)的第一端相连；
    所述过渡部(1212)的第二端与所述连接器支撑部(122)相连；
    所述过渡部(1212)的第一端的宽度与所述延伸部(1211)的宽度相同，所述过渡部(1212)的第二端的宽度与所述连接器支撑部(122)的宽度相同，且沿着第一端至第二端的方向，所述过渡部(1212)的宽度逐渐增大。
  8. 一种印制电路板总成，其特征在于，所述印制电路板总成包括电子元器件(2)、连接 器(3)和如权利要求1-7任一项所述的印制电路板(1)；
    所述电子元器件(2)固定在所述印制电路板(1)的第一板体(11)上；
    所述连接器(3)固定在所述印制电路板(1)的第二板体(12)上。
  9. 一种硬件模组，其特征在于，所述硬件模组包括壳体组件(01)和如权利要求8所述的印制电路板总成(02)；
    所述印制电路板总成(02)固定在所述壳体组件(01)中。
  10. 根据权利要求9所述的硬件模组，其特征在于，所述壳体组件(01)包括第一壳体(011a)、第一卡扣(012a)和第二卡扣(013a)；
    所述第一卡扣(012a)和所述第二卡扣(013a)均与所述第一壳体(011a)固定连接，且所述第一卡扣(012a)的卡接口与所述第二卡扣(013a)的卡接口的高度不同；
    所述第一板体(11)的侧壁伸入至所述第一卡扣(012a)的卡接口中，所述第二板体(12)的侧壁伸入至所述第二卡扣(013a)的卡接口中。
  11. 根据权利要求10所述的硬件模组，其特征在于，所述第二卡扣(013a)位于所述连接器(3)的第一侧，所述第一侧与所述连接器(3)的对接端相背；
    所述第二卡扣(013a)为多个，且多个所述第二卡扣(013a)中距离所述连接器(3)最近的两个第二卡扣(013a)的卡接口的高度相同。
  12. 根据权利要求9所述的硬件模组，其特征在于，所述壳体组件(01)包括第二壳体(011b)、第一支撑件(012b)、第一锁紧件(013b)、第二支撑件(014b)和第二锁紧件(015b)；
    所述第一支撑件(012b)和所述第二支撑件(014b)均与所述第二壳体(011b)固定连接，且所述第一支撑件(012b)和所述第二支撑件(014b)的高度不同；
    所述第一支撑件(012b)支撑所述第一板体(11)，所述第一锁紧件(013b)穿过所述第一板体(11)，且固定在所述第一支撑件(012b)中；
    所述第二支撑件(014b)支撑所述第二板体(12)，所述第二锁紧件(015b)穿过所述第二板体(12)，且固定在所述第二支撑件(014b)中。
  13. 根据权利要求12所述的硬件模组，其特征在于，所述第二支撑件(014b)和所述第二锁紧件(015b)位于所述连接器(3)的第一侧，所述第一侧与所述连接器(3)的对接端相背；
    所述第二支撑件(014b)的支撑面与所述第一板体(11)的板面平行，所述第二锁紧件(015b)将所述第二板体(12)与所述第二支撑件(014b)的支撑面压紧。
  14. 根据权利要求12-13任一项所述的硬件模组，其特征在于，所述第二板体(12)相对于所述第一板体(11)的偏移距离可调。
  15. 根据权利要求14所述的硬件模组，其特征在于，所述第二支撑件(014b)与所述第二壳体(011b)可拆连接，以使得所述硬件模组能够更换不同高度的第二支撑件(014b)。
  16. 根据权利要求14所述的硬件模组，其特征在于，所述第二支撑件(014b)的高度可调。
  17. 根据权利要求9-16任一项所述的硬件模组，其特征在于，所述第二板体(12)相对于所述第一板体(11)偏移的最大距离与所述第二板体(12)的第一对角线的长度的比值小于0.75％；
    其中，所述第一对角线位于所述第二板体(12)的一个板面上，且所述第一对角线为以第一顶点(100)为一个端点的最长对角线，所述第一顶点(100)位于所述间隙(10)、所述第一板体(11)和所述第二板体(12)的交界处。
  18. 一种电子设备，其特征在于，所述电子设备包括第一硬件模组(a)和第二硬件模组(b)，所述第一硬件模组(a)为如权利要求9-17任一项所述的硬件模组；
    所述第一硬件模组(a)的连接器(3)与所述第二硬件模组(b)对接。
  19. 根据权利要求18所述的电子设备，其特征在于，所述第一硬件模组(a)的第二板体(12)相对于第一板体(11)在竖直方向偏移。
  20. 根据权利要求18所述的电子设备，其特征在于，所述第一硬件模组(a)的第二板体(12)相对于第一板体(11)在水平方向偏移。
  21. 根据权利要求18-20任一项所述的电子设备，其特征在于，所述第二硬件模组(b)为如权利要求9-17任一项所述的硬件模组；
    所述第一硬件模组(a)的第二板体(12)相对于第一板体(11)向着第一方向偏移，所述第二硬件模组(b)的第二板体(12)相对于第一板体(11)向着第二方向偏移，所述第一方向和所述第二方向相反。
PCT/CN2022/098324 2021-06-22 2022-06-13 印制电路板、印制电路板总成、硬件模组和电子设备 WO2022267911A1 (zh)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003234547A (ja) * 2001-12-07 2003-08-22 Seiko Epson Corp 基板および基板ユニット
CN102098867A (zh) * 2009-12-09 2011-06-15 星电株式会社 柔性布线基板
EP2408279A1 (de) * 2010-07-14 2012-01-18 FELA Hitzinger GmbH Verbiegbare Metallkernleiterplatte
CN209994608U (zh) * 2017-03-21 2020-01-24 三菱电机株式会社 印刷基板

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003234547A (ja) * 2001-12-07 2003-08-22 Seiko Epson Corp 基板および基板ユニット
CN102098867A (zh) * 2009-12-09 2011-06-15 星电株式会社 柔性布线基板
EP2408279A1 (de) * 2010-07-14 2012-01-18 FELA Hitzinger GmbH Verbiegbare Metallkernleiterplatte
CN209994608U (zh) * 2017-03-21 2020-01-24 三菱电机株式会社 印刷基板

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