WO2022265039A1 - 接着フィルムおよび接着フィルムの製造方法 - Google Patents

接着フィルムおよび接着フィルムの製造方法 Download PDF

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Publication number
WO2022265039A1
WO2022265039A1 PCT/JP2022/023949 JP2022023949W WO2022265039A1 WO 2022265039 A1 WO2022265039 A1 WO 2022265039A1 JP 2022023949 W JP2022023949 W JP 2022023949W WO 2022265039 A1 WO2022265039 A1 WO 2022265039A1
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WIPO (PCT)
Prior art keywords
heat
resin
adhesive
resistant layer
adhesive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2022/023949
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English (en)
French (fr)
Japanese (ja)
Inventor
邦浩 武井
悠以子 吉川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zacros Corp
Original Assignee
Fujimori Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujimori Kogyo Co Ltd filed Critical Fujimori Kogyo Co Ltd
Priority to KR1020237042636A priority Critical patent/KR20240005943A/ko
Priority to EP22825027.0A priority patent/EP4357129A4/en
Priority to CN202280041928.7A priority patent/CN117500893A/zh
Priority to US18/570,516 priority patent/US20240271010A1/en
Priority to JP2023530372A priority patent/JPWO2022265039A1/ja
Publication of WO2022265039A1 publication Critical patent/WO2022265039A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/10—Presence of homo or copolymers of propene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2425/00—Presence of styrenic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2471/00—Presence of polyether
    • C09J2471/006—Presence of polyether in the substrate

Definitions

  • the present invention relates to an adhesive film and a method for producing an adhesive film.
  • This application claims priority based on Japanese Patent Application No. 2021-100064 filed on June 16, 2021, the content of which is incorporated herein.
  • Patent Literature 1 describes an adhesive tape for electronic parts in which a substrate and adhesive layers on both sides are formed from a specific polyimide.
  • the adhesive tape of the example is adhered to a metal heat sink by heating for 1 second, and then adhered to a lead frame by heating for 1 second. Time-curing to bond semiconductor chips to assemble a semiconductor package is described.
  • Adhesion to adherends and dimensional retention of the adhesive film are required for adhesive films that are heated to a high temperature for adhesion.
  • it is explained that it is used as a thermoplastic adhesive (paragraph 0029) and has high heat resistance and adhesiveness (paragraph 0118).
  • it is necessary to use a special polyimide for the base material and the adhesive layer, which makes the adhesive film expensive.
  • the present invention has been made in view of the above circumstances, and provides an adhesive film and a method for producing an adhesive film that can achieve both adhesion to an adherend and dimensional retention of the adhesive film even at high temperatures.
  • the task is to provide
  • the present invention is an adhesive film having an adhesive layer on at least one side of a heat-resistant layer, wherein the heat-resistant layer contains a thermoplastic resin having an aromatic ring in a monomer unit as an essential component, and the heat-resistant layer is 100° C. or higher, and the adhesive layer contains a modified polyolefin resin as an essential component and further contains at least one resin having a styrene structure or a cyclic hydrocarbon structure.
  • a total of 3 to 50 parts by weight of at least one resin having a styrene structure or a cyclic hydrocarbon structure may be contained in 100 parts by weight of the adhesive layer.
  • the modified polyolefin resin of the adhesive layer may be modified with an unsaturated carboxylic acid component, and 0.01 to 2 parts by weight of the unsaturated carboxylic acid component may be contained in 100 parts by weight of the modified polyolefin resin.
  • thermoplastic resin other than the thermoplastic resin having an aromatic ring in the monomer unit may be contained in 100 parts by weight of the heat-resistant layer.
  • the modified polyolefin resin may be a modified polyethylene resin or a modified polypropylene resin.
  • 1 to 30 parts by weight of a thermoplastic elastomer resin may be contained in 100 parts by weight of the adhesive layer.
  • a second adhesive layer may be provided on the adhesive layer to be adhered to the adherend of the adhesive film.
  • the present invention also provides a method for producing the adhesive film, comprising a step of melt-kneading the material of the heat-resistant layer with a melt extruder and forming the heat-resistant layer into a film by extrusion molding; and a step of melt-kneading in a melt extruder and laminating the adhesive layer on at least one side of the heat-resistant layer by extrusion lamination.
  • the present invention is a method for producing the adhesive film, wherein the materials of the heat-resistant layer and the adhesive layer are melt-kneaded by an extruder and simultaneously extruded to form the adhesive film on at least one side of the heat-resistant layer.
  • a method for producing an adhesive film comprising a step of film-forming the heat-resistant layer and the adhesive layer in a laminated state of the adhesive layer.
  • the present invention also provides a method for producing the adhesive film, comprising a step of melt-kneading the material of the heat-resistant layer with a melt extruder and forming the heat-resistant layer into a film by extrusion molding;
  • An adhesive film comprising a step of melt-kneading with a melt extruder and forming the adhesive layer into a film by extrusion molding, and a step of pressing and laminating the adhesive layer on at least one side of the heat-resistant layer with a hot roll.
  • the present invention also provides a method for producing the adhesive film, comprising a step of melt-kneading the material of the heat-resistant layer with a melt extruder and forming the heat-resistant layer into a film by extrusion molding; and dissolving in a solvent, coating on the heat-resistant layer, drying the solvent, and laminating the adhesive layer.
  • FIG. 1 is a cross-sectional view showing a first embodiment of an adhesive film
  • FIG. FIG. 4 is a cross-sectional view showing a second embodiment of an adhesive film
  • FIG. 5 is a cross-sectional view showing a third embodiment of an adhesive film
  • the adhesive films 10, 20, 30 of the embodiment have an adhesive layer 12 on at least one side of the heat-resistant layer 11.
  • An adhesive layer 12 may be provided on one side of the heat-resistant layer 11, like the adhesive film 10 shown in FIG. You may have the adhesive layer 12 on both surfaces of the heat-resistant layer 11 like the adhesive film 20 shown in FIG. These adhesive layers 12 may be used to adhere the adhesive films 10, 20 to adherends (not shown).
  • a second adhesive layer 13 to be adhered to an adherend may be provided on the adhesive layer 12 like the adhesive film 30 shown in FIG.
  • the second adhesive layer 13 can be laminated on the adhesive layer 12 on at least one side of the heat-resistant layer 11 .
  • the adhesive layer 12 and the second adhesive layer 13 may be laminated on both surfaces of the heat-resistant layer 11, respectively.
  • the heat-resistant layer 11 contains a thermoplastic resin having an aromatic ring in the monomer unit as an essential component.
  • thermoplastic resins having aromatic rings in monomer units may be collectively referred to as “aromatic ring-containing thermoplastic resins”.
  • aromatic ring-containing thermoplastic resins include polyimide (PI) resins, polyphenylene sulfide (PPS) resins, polyphenylene ether (PPE) resins, polyamideimide (PAI) resins, polystyrene (PS) resins, polyester resins, and bisphenol-type epoxy resins. Resins (phenoxy resins), polyethersulfone (PES) resins, polyetheretherketone (PEEK) resins, polyetherimide (PEI) resins, and the like.
  • the aromatic ring-containing thermoplastic resin may be a polymer alloy or the like in which two or more resins are compatible.
  • polyester resins include polyethylene terephthalate (PET) resin, polybutylene terephthalate (PBT) resin, polyethylene naphthalate (PEN) resin, and liquid crystal polymer (LCP).
  • the aromatic ring in the aromatic ring-containing thermoplastic resin is not particularly limited, but examples include benzene ring, naphthalene ring, anthracene ring, phenanthrene ring, and azulene ring. These aromatic rings may be directly connected by a single bond or the like. For example, when benzene rings are directly linked with a single bond, a biphenyl ring, a terphenyl ring, or the like is obtained.
  • Aromatic ring-containing thermoplastic resins have aromatic rings in the main chain that are repeated by polymerization of monomers.
  • the aromatic ring-containing thermoplastic resin has an imide bond [(—CO) 2 N—], a sulfide bond (—S—), an ether bond (—O—), or an amide bond between the aromatic rings contained in the monomer units. It is preferably one or more selected from a bond (--NHCO--), an ester bond (--COO--), a sulfone bond (--SO 2 --), a carbonyl group (--CO--) and the like. Furthermore, in order to improve heat resistance in a high-humidity environment, the aromatic ring-containing thermoplastic resin preferably does not contain more hydrolyzable or thermally decomposable bonds, for example, it does not contain an ester bond. preferable. Furthermore, as the aromatic ring-containing thermoplastic resin, a thermoplastic resin that does not contain an imide bond and/or an amide bond in addition to not containing an ester bond may be selected.
  • An aliphatic chain may be included between the aromatic rings in the aromatic ring-containing thermoplastic resin.
  • Specific examples of aliphatic chains include alkylene groups such as a methylene group ( --CH.sub.2-- ), an ethylene group ( --CH.sub.2CH.sub.2-- ), a trimethylene group ( --CH.sub.2CH.sub.2CH.sub.2-- ), and alkyl groups.
  • alkylene groups such as a methylene group ( --CH.sub.2-- ), an ethylene group ( --CH.sub.2CH.sub.2-- ), a trimethylene group ( --CH.sub.2CH.sub.2CH.sub.2-- ), and alkyl groups.
  • a substituted alkylene group having one or more substitutions such as a hydroxyl group, an ether bond (-O-) at one end or both ends of an unsubstituted or substituted alkylene group, a divalent having a functional group such as an ester bond (-
  • Aliphatic chains tend to have lower heat resistance than aromatic rings, so it is preferable that the number of carbon atoms in the aliphatic chain between the aromatic rings is small.
  • the aliphatic chain may have 3 or fewer, 2 or fewer, or 1 or fewer carbon atoms.
  • An aromatic ring-containing thermoplastic resin that does not have an aliphatic chain between aromatic rings may be employed.
  • the aromatic ring-containing thermoplastic resin is preferably a resin having 1 to 5 aromatic rings in total in the monomer unit. This prevents the molecular structure of the resin from being overly complicated and makes it relatively easy to obtain.
  • the number of aromatic rings means the number of "rings forming a conjugated ring system". For example, one naphthalene ring and one biphenyl ring are provided for each of these structures.
  • the aromatic ring-containing thermoplastic resin is a polymer of two or more monomers, for example, if the two monomers each have an aromatic ring, such an aromatic ring-containing thermoplastic resin is The resin is a monomer unit having a total of two aromatic rings.
  • resins having one aromatic ring in a monomer unit examples include PI resins, PPS resins, PPE resins, PAI resins, PET resins, PS resins, PEN resins, LCP, and the like.
  • resins having two aromatic rings in a monomer unit examples include PI resins, PAI resins, PES resins, and LCP.
  • PI resin, PEEK resin, LCP etc. are mentioned as resin which has three aromatic rings in a monomer unit.
  • PEI resin etc. are mentioned as resin which has five aromatic rings in a monomer unit.
  • the monomer units of the aromatic ring-containing thermoplastic resin may be units that are repeated by polymerization of monomers.
  • compounds containing polycarboxylic acid units and other functional groups may be a monomer unit, or a unit obtained by combining a polycarboxylic acid unit and a compound unit containing another functional group may be a monomer unit.
  • the compounds containing other functional groups are polyamine compounds for polyimide resins and polyol compounds for polyester resins. For this reason, for example, in a polyimide resin, when the polycarboxylic acid unit has one aromatic ring and the polyamine compound unit has two aromatic rings, the monomer unit is a resin having three aromatic rings. good too.
  • the heat-resistant layer 11 preferably has a deflection temperature under load (HDT) of 100°C or higher.
  • the HDT of the heat-resistant layer 11 is more preferably 120° C. or higher, and even more preferably 140° C. or higher.
  • the HDT of the heat-resistant layer 11 is preferably 260° C. or lower, more preferably 200° C. or lower, even more preferably 180° C. or lower, and even more preferably 170° C. or lower.
  • the HDT of the heat-resistant layer 11 can be measured, for example, by a method conforming to standards such as JIS K7191, ISO 75, ASTM D648.
  • the magnitude of the load in HDT measurement is, for example, 1.80 MPa in ISO 75 and JIS K7191 A method, and 1.82 MPa in ASTM D648 A method.
  • Deflection temperature under load (HDT) values were obtained by preparing test specimens for either a single resin layer, a mixed resin layer containing two or more resins, or a resin layer containing components other than the resin. , can be measured. Therefore, the HDT of the resin component contained in the heat-resistant layer 11 can also be measured. Since the aromatic ring-containing thermoplastic resin having an HDT of 100° C. or higher is a suitable component for imparting heat resistance to the heat-resistant layer 11 , it is preferably used as an essential component of the heat-resistant layer 11 . HDT of the polymer alloy in which two or more resins contained in the heat-resistant layer 11 are compatible with each other may be 100° C. or higher.
  • the heat-resistant layer 11 may contain only an aromatic ring-containing thermoplastic resin having an HDT of 100°C or higher as a resin component.
  • the heat-resistant layer 11 may contain a resin component other than the aromatic ring-containing thermoplastic resin.
  • the heat-resistant layer 11 may contain one or more aromatic ring-containing thermoplastic resins in a total amount of 50% by weight or more, further 70 to 100% by weight.
  • the heat-resistant layer 11 may be formed only from a heat-resistant layer containing an aromatic ring-containing thermoplastic resin, or may be formed from a heat-resistant layer containing an aromatic ring-containing thermoplastic resin in combination with another heat-resistant layer.
  • the heat-resistant layer 11 may contain a thermoplastic resin other than an aromatic ring-containing thermoplastic resin within the range of 1 to 30 parts by weight in the total amount of 100 parts by weight, and within the range of 1 to 25 parts by weight. It may be in the range of 1 to 20 parts by weight.
  • the thermoplastic resin other than the aromatic ring-containing thermoplastic resin may be a thermoplastic resin having no aromatic ring in the monomer unit.
  • the HDT of the thermoplastic resin other than the aromatic ring-containing thermoplastic resin may be 100°C or higher, or may be lower than 100°C.
  • thermoplastic resins other than aromatic ring-containing thermoplastic resins include resins obtained by polymerizing monomers having at least one structure such as ethylene, styrene, and cyclic hydrocarbons.
  • the thermoplastic resin other than the aromatic ring-containing thermoplastic resin is a resin obtained by copolymerizing at least one monomer selected from monomers having an ethylene structure, monomers having a styrene structure, and monomers having a cyclic hydrocarbon structure. or a homopolymer of these monomers.
  • Examples of monomers having an ethylene structure include ethylene, propylene, 1-butene, 1-pentene, 1-hexene, 1-heptene, 1-octene, butadiene and isoprene.
  • Examples of resins obtained by polymerizing monomers having an ethylene structure include polyolefins such as polyethylene and polypropylene.
  • Examples of monomers having a styrene structure include styrene-based monomers such as styrene, methylstyrene, and vinyltoluene.
  • Examples of resins obtained by polymerizing these monomers having a styrene structure include polystyrene and styrene-based elastomers.
  • Styrene-based elastomers include styrene-ethylene-propylene-styrene block copolymer (SEPS), styrene-ethylene-butylene-styrene block copolymer (SEBS), styrene-butadiene-styrene block copolymer (SBS), styrene - isoprene-styrene block copolymer (SIS), styrene-isoprene-butadiene-styrene block copolymer (SIBS), styrene-ethylene-butylene-olefin crystal block copolymer (SEBC), hydrogenated styrene-butadiene rubber (HSBR), etc., or two or more.
  • SEPS styrene-ethylene-propylene-styrene block copolymer
  • SEBS styrene-ethylene-butylene-styrene
  • the monomer having a cyclic hydrocarbon structure may be the above-mentioned monomer having a styrene structure, an aromatic olefin monomer such as indene, or a cyclic olefin monomer.
  • the resin obtained by polymerizing a monomer having a cyclic hydrocarbon structure may be, for example, a C5-C9 petroleum resin, a C9 petroleum resin, or the like.
  • the cyclic olefin monomer is preferably a monomer having at least one norbornene structure.
  • the cyclic olefin monomer may be a hydrocarbon-based monomer and may have a functional group such as an ester group.
  • Examples of resins obtained by polymerizing cyclic olefin monomers include cyclic olefin resins such as cycloolefin polymer (COP) and cycloolefin copolymer (COC).
  • the adhesive layer 12 contains a modified polyolefin resin as an essential component and further contains at least one resin having a styrene structure or a cyclic hydrocarbon structure.
  • the adhesive layer 12 may be a resin layer adjacent to the heat-resistant layer 11 . Since the modified polyolefin resin has high adhesiveness, it becomes an essential component for imparting adhesiveness to the adhesive layer 12 .
  • the modified polyolefin resin used for the adhesive layer 12 includes one or more of acid-modified polyolefin resin, hydroxy-modified polyolefin resin, chlorinated polyolefin resin, and the like. Among them, an acid-modified polyolefin resin modified with an unsaturated carboxylic acid component is preferred.
  • the modified polyolefin resin of the adhesive layer 12 preferably contains 0.01 to 2 parts by weight of the unsaturated carboxylic acid component per 100 parts by weight of the modified polyolefin resin.
  • the unsaturated carboxylic acid component may be a carboxy group-containing monomer having a free carboxylic acid group, or an acid anhydride group-containing monomer having a latent carboxylic acid group.
  • Carboxy group-containing monomers include acrylic acid, methacrylic acid, maleic acid, nadic acid, fumaric acid, itaconic acid, citraconic acid, crotonic acid, isocrotonic acid, tetrahydrophthalic acid, endo-bicyclo[2.2.1]-5. -heptene-2,3-dicarboxylic acid (endic acid) and other ⁇ , ⁇ -unsaturated carboxylic acid monomers.
  • Acid anhydride group-containing monomers include unsaturated dicarboxylic anhydride monomers such as maleic anhydride, nadic anhydride, itaconic anhydride, citraconic anhydride, and endic anhydride.
  • the modified polyolefin resin may be a resin obtained by copolymerizing one unsaturated carboxylic acid component, or may be a resin obtained by copolymerizing two or more unsaturated carboxylic acid components.
  • Examples of the method for producing the modified polyolefin resin include a method of graft modifying an unmodified polyolefin resin with a functional group-containing monomer by melt-kneading, a method of copolymerizing an olefin monomer and a functional group-containing monomer, and the like.
  • a functional group-containing monomer is a monomer having a polar functional group other than olefins, and includes unsaturated carboxylic acid components, hydroxy-substituted olefins, chlorinated olefins, and the like.
  • an acid-modified polyolefin resin obtained by graft modification of an unsaturated carboxylic acid component using a radical polymerization initiator can also be employed.
  • radical polymerization initiators include organic peroxides and aliphatic azo compounds.
  • Olefin monomers used in modified polyolefin resins include one or more of ethylene, propylene, 1-butene, isobutylene, 1-hexene, 1-octene, ⁇ -olefins, and the like.
  • the modified polyolefin resin may be modified polyethylene resin, modified polypropylene resin, modified poly-1-butene resin, modified polyisobutylene resin, or the like. Only one modified polyolefin may be used, or two or more thereof may be used in combination.
  • unmodified polyolefin resins used for graft modification of modified polyolefin include polyethylene, polypropylene, poly-1-butene, polyisobutylene, random copolymers of propylene and ethylene or ⁇ -olefin, and mixtures of propylene and ethylene or ⁇ -olefin.
  • a block copolymer etc. are mentioned.
  • the modified polyethylene resin used for the adhesive layer 12 is preferably a resin obtained by copolymerizing 50 parts by weight or more of ethylene with 100 parts by weight of the modified polyethylene resin.
  • a functional group-containing monomer such as an unsaturated carboxylic acid component is copolymerized with the modified polyethylene resin.
  • the modified polyethylene resin may be copolymerized with propylene, 1-butene, 1-hexene, 1-octene, etc. as olefin monomers other than ethylene.
  • the modified polypropylene resin used for the adhesive layer 12 is preferably a resin obtained by copolymerizing 50 parts by weight or more of propylene with 100 parts by weight of the modified polypropylene resin.
  • a functional group-containing monomer such as an unsaturated carboxylic acid component is copolymerized with the modified polypropylene resin.
  • the modified polypropylene resin may be copolymerized with ethylene, 1-butene, 1-hexene, 1-octene, etc. as olefin monomers other than propylene.
  • the adhesive layer 12 contains at least one resin having a styrene structure or a cyclic hydrocarbon structure in addition to the modified polyolefin resin. Thereby, the adhesiveness between the heat-resistant layer 11 and the adhesive layer 12 can be improved.
  • the adhesive layer 12 preferably contains 3 to 50 parts by weight, more preferably 3 to 40 parts by weight, of at least one resin having a styrene structure or a cyclic hydrocarbon structure in 100 parts by weight of the total amount of the adhesive layer 12. , more preferably 5 to 40 parts by weight, and even more preferably 5 to 30 parts by weight.
  • Examples of resins having a styrene structure include copolymers of monomers having a styrene structure and other monomers.
  • Examples of monomers having a styrene structure include styrene-based monomers such as styrene, methylstyrene, and vinyltoluene.
  • Monomers other than styrenic monomers include aliphatic olefins such as ethylene, propylene, ⁇ -olefins, butadiene and isoprene.
  • the resin having a styrene structure may be hydrogenated to reduce or saturate the unsaturated bonds remaining after polymerization.
  • the proportion of the styrenic monomer in the resin having a styrene structure may be, for example, 10-50% by weight, preferably 20-50% by weight, and more preferably 30-50% by weight.
  • the resin having a styrene structure may be a styrene-based elastomer.
  • the adhesive layer 12 preferably contains 3 to 30 parts by weight, preferably 5 to 25 parts by weight, of the styrene elastomer in the total amount of 100 parts by weight. Containing is more preferable.
  • Styrene-based elastomers used for the adhesive layer 12 include styrene-ethylene-propylene-styrene block copolymer (SEPS), styrene-ethylene-butylene-styrene block copolymer (SEBS), and styrene-butadiene-styrene block copolymer.
  • SEPS styrene-ethylene-propylene-styrene block copolymer
  • SEBS styrene-ethylene-butylene-styrene block copolymer
  • styrene-butadiene-styrene block copolymer styrene-butadiene-styrene block copolymer
  • SBS coalescing
  • SIBS styrene-isoprene-styrene block copolymer
  • SIBS styrene-isoprene-butadiene-styrene block copolymer
  • SEBC styrene-ethylene-butylene-olefin crystal block copolymer
  • HSBR styrene-butadiene rubber
  • Resins having a cyclic hydrocarbon structure include copolymers of monomers having a cyclic hydrocarbon structure and other monomers.
  • the monomer having a cyclic hydrocarbon structure may be a monomer having a styrene structure, a monomer having a norbornene structure, or a monomer having an alicyclic hydrocarbon structure or an aromatic hydrocarbon structure.
  • Examples of monomers having cyclic hydrocarbon structures other than styrene structures and norbornene structures include indene, allylbenzene, cycloolefins, and the like.
  • Other monomers that do not have a cyclic hydrocarbon structure include aliphatic olefins such as ethylene, propylene, ⁇ -olefins, butadiene and isoprene.
  • At least part of the resin having a cyclic hydrocarbon structure may be a resin having a styrene structure.
  • a resin having a cyclic hydrocarbon structure may be a resin having no styrene structure.
  • At least part of the resin having a cyclic hydrocarbon structure may be a cyclic olefin resin.
  • a resin having a cyclic hydrocarbon structure may not contain a cyclic olefin resin.
  • Resins having a cyclic hydrocarbon structure may be, for example, C5-C9 petroleum resins, C9 petroleum resins, and the like.
  • the adhesive layer 12 may contain a thermoplastic elastomer resin.
  • the thermoplastic elastomer resin may be an olefinic elastomer.
  • Olefinic copolymers that can be used for olefinic elastomers include propylene-ethylene copolymers, ethylene-1-butene copolymers, ethylene-1-hexene copolymers, ethylene-1-octene copolymers, and propylene.
  • - Aliphatic olefin copolymers such as ethylene-1-butene copolymers and propylene-1-butene copolymers.
  • the adhesive layer 12 may contain 1 to 30 parts by weight of the thermoplastic elastomer resin in the total amount of 100 parts by weight.
  • a desired adhesive resin can be used for the second adhesive layer 13 as long as it can be laminated on the adhesive layer 12.
  • adhesive resins include, but are not particularly limited to, acid-modified polyolefins, epoxy-based adhesives, olefin-based heat sealing agents, and the like.
  • the second adhesive layer 13 may contain two or more adhesive resins, or may contain a resin component other than the adhesive resin.
  • Antioxidants, ultraviolet absorbers, antistatic agents, lubricants, Various additives such as antiblocking agents may be contained. Any one of the heat-resistant layer 11, the adhesive layer 12, and the second adhesive layer 13 may have a composition that does not contain any one or more of these additives or all of them.
  • the method of manufacturing the adhesive films 10, 20, 30 is not particularly limited, but examples include a method of forming each layer or laminating each layer by extrusion molding, inflation molding, heat lamination, extrusion lamination, dry lamination, or the like.
  • heat-resistant layer 11 may be formed first
  • adhesive layer 12 may be formed first
  • heat-resistant layer 11 and adhesive layer 12 may be formed first.
  • the adhesive layer 12 may be molded at the same time.
  • the material of the heat-resistant layer 11 is melt-kneaded by a melt extruder, and the heat-resistant layer 11 is formed into a film by extrusion molding; and laminating the adhesive layer 12 on at least one surface of the heat-resistant layer 11 by extrusion lamination.
  • the manufacturing method of the first example since the heat resistance of the heat-resistant layer 11 is higher than that of the adhesive layer 12, it is easier to manufacture than the case where the heat-resistant layer 11 is extrusion-laminated after the adhesive layer 12 is molded first. be. Also, in the first example, it is easier to adjust the film thickness of each layer than in the second example described later. Further, in the first example, the adhesive layer 12 is laminated on the heat-resistant layer 11 in a molten state, so that the adhesion between the layers is improved as compared with the third example described later.
  • the materials of the heat-resistant layer 11 and the adhesive layer 12 are individually melt-kneaded by an extruder and extruded at the same time, so that the adhesive layer 12 is laminated on at least one side of the heat-resistant layer 11, and the heat-resistant layer is formed.
  • a manufacturing method including a step of forming the layer 11 and the adhesive layer 12 into a film is mentioned. According to the manufacturing method of the second example, compared with the first example described above and the third example described later, only one step of extrusion molding is required, and the work is shortened. Moreover, since the heat-resistant layer 11 and the adhesive layer 12 are laminated in a molten state, the adhesion between the layers is improved.
  • the heat-resistant layer 11 and the adhesive layer 12 can be molded separately and can be laminated in a desired combination as necessary, so design changes and manufacturing management are facilitated.
  • the order of film-forming the heat-resistant layer 11 and film-forming the adhesive layer 12 is not particularly limited, and it is also possible to carry out the film-forming at the same time.
  • the adhesive layers 12 on each side may be laminated on the heat-resistant layer 11 by the same method, or may be laminated on the heat-resistant layer 11 by different methods.
  • the adhesive layers 12 on both sides may be resin layers with different compositions or thicknesses, or may be resin layers with the same composition or thickness.
  • the thicknesses of the heat-resistant layer 11 and the adhesive layer 12 are not particularly limited, but for example, each layer of the heat-resistant layer 11 or the adhesive layer 12 has a thickness of about 1 to 300 ⁇ m.
  • the thickness of the adhesive films 10, 20, 30 is not particularly limited, it is, for example, about 10 to 500 ⁇ m.
  • the adhesive layer 12 may be formed prior to the second adhesive layer 13, or the second adhesive layer 13 may be formed prior to the adhesive layer 12.
  • the adhesive layer 12 and the second adhesive layer 13 may be molded at the same time.
  • the method for forming the second adhesive layer 13 is not particularly limited, and may be the same as the molding method for the adhesive layer 12 or may be a method different from that for the adhesive layer 12 .
  • the second adhesive layer 13 may be formed in the same manner as the adhesive layer 12 .
  • the adherends of the adhesive films 10, 20, 30 are not particularly limited, but include various materials such as resins, rubbers, metals, glass, ceramics, and the like. Since the adhesive layer 12 contains the modified polyolefin resin as an essential component, even if the adherend is a metal or the like, it can be preferably adhered. Examples of metals include, but are not limited to, iron, copper, aluminum, stainless steel, chromium, and nickel.
  • the surface of the adherend may be a treated surface that has been subjected to surface treatment such as roughening and chemical conversion treatment.
  • the present invention includes the following aspects.
  • An adhesive film having an adhesive layer on at least one side of a heat-resistant layer contains, as an essential component, a thermoplastic resin having an aromatic ring in a monomer unit, The heat-resistant layer has a deflection temperature under load of 100° C. or more and 260° C. or less,
  • the adhesive layer contains a modified polyolefin resin as an essential component and further contains at least one resin having a styrene structure or a cyclic hydrocarbon structure,
  • An adhesive film having an adhesive layer on at least one side of the heat-resistant layer contains, as an essential component, a thermoplastic resin having an aromatic ring in a monomer unit, The heat-resistant layer has a deflection temperature under load of 100° C. or more and 200° C. or less,
  • the adhesive layer contains a modified polyolefin resin as an essential component and further contains a resin having a styrene structure,
  • A-1 is a PPE/PS resin (polymer alloy of PPE and PS) with an HDT of 158° C. (load of 1.8 MPa).
  • the polyphenylene ether (PPE) resin is poly(2,6-dimethyl-p-phenylene ether).
  • A-2 is a PPS resin with an HDT of 105° C. (load of 1.8 MPa).
  • the polyphenylene sulfide (PPS) resin is poly(p-phenylene sulfide).
  • A-3 is a PS resin with an HDT of 70° C. (load of 1.8 MPa).
  • A-4 is a PP resin with an HDT of 60° C. (load of 1.8 MPa).
  • B-1 is a styrene-containing resin (SEBS) having a styrene content of 43% and an MFR of 3.0 g/10 min (230° C., 2.16 kg).
  • C-1 is an acid-modified polypropylene (PP) having a melting point of 140° C., an MFR of 7.0 g/10 min (230° C., 2.16 kg), and an unsaturated carboxylic acid component added to 100 parts by weight of the acid-modified polypropylene. Contains 0.08 parts by weight.
  • C-2 is an acid-modified polyethylene (PE) having a melting point of 120° C., an MFR of 6 g/10 min (230° C., 2.16 kg), and an unsaturated carboxylic acid component of 0.00 in 100 parts by weight of acid-modified polystyrene. Contains 1 part by weight.
  • D-1 is a styrene-containing resin (SEBS) having a styrene content of 43% and an MFR of 3.0 g/10 min (230°C, 2.16 kg).
  • An adhesive film having a heat-resistant layer with a thickness of 80 ⁇ m, an adhesive layer with a thickness of 20 ⁇ m, and a total thickness of 100 ⁇ m was used as a sample.
  • An aluminum foil having a thickness of 50 ⁇ m was used as an adherend. These were cut into a size of 50 mm ⁇ 50 mm, an adherend was superimposed on the sample, and heat-pressed from the adherend side under conditions of a temperature of 170° C., a pressure of 0.1 MPa, and a time of 10 sec.
  • a tensile tester (Shimadzu Corporation, trade name: Autograph (registered trademark) AG-X20 kN) was used to heat and press the sample to the adherend. It was measured by a method of 180° peeling under conditions of 300 mm/min, width of 15 mm, and measurement temperature of 110°C.
  • the adhesive films of Examples 1 to 7 had a high adhesive strength and a small amount of creep even at high temperatures, so it was found that both the adhesiveness to the adherend and the dimensional retention of the adhesive film can be achieved.
  • the adhesion of the adhesive layer to the adherend was sufficient, but the heat resistance of the heat-resistant layer was insufficient, resulting in a large amount of creep due to compression.
  • the adhesion of the adhesive layer to the adherend was sufficient, but the adhesion between the heat-resistant layer and the adhesive layer was insufficient, resulting in weak adhesive strength at high temperatures.

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  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
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