WO2022262907A1 - Roboter zur handhabung flacher substrate sowie ausrichtungseinrichtung - Google Patents
Roboter zur handhabung flacher substrate sowie ausrichtungseinrichtung Download PDFInfo
- Publication number
- WO2022262907A1 WO2022262907A1 PCT/DE2022/100447 DE2022100447W WO2022262907A1 WO 2022262907 A1 WO2022262907 A1 WO 2022262907A1 DE 2022100447 W DE2022100447 W DE 2022100447W WO 2022262907 A1 WO2022262907 A1 WO 2022262907A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- leg
- alignment device
- screw
- robot
- segment
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 105
- 230000006835 compression Effects 0.000 claims description 2
- 238000007906 compression Methods 0.000 claims description 2
- 125000006850 spacer group Chemical group 0.000 description 13
- 235000012431 wafers Nutrition 0.000 description 7
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 230000002829 reductive effect Effects 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 239000012636 effector Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 230000000284 resting effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/0014—Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/0052—Gripping heads and other end effectors multiple gripper units or multiple end effectors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J18/00—Arms
- B25J18/002—Arms comprising beam bending compensation means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/067—Sheet handling, means, e.g. manipulators, devices for turning or tilting sheet glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
Definitions
- Robot for handling flat substrates and alignment device Robot for handling flat substrates and alignment device
- the invention relates to a robot for handling flat substrates. It also relates to an alignment device which is suitable, for example, for such a robot.
- robots are used for handling substrates such as wafers.
- the robots enable the transport of one or more flat substrates, which includes picking up the substrates before they are transported and depositing them after the transport.
- the robots have a gripping device that can be used to pick up, transport and set down the flat substrate or substrates. Gripping devices that allow the simultaneous handling of several flat substrates are also referred to as multiple gripping devices in the technical jargon.
- a multiple gripping device therefore has its own gripping element with position elements for each substrate.
- a distance piece which is also referred to as a spacer, is required between these gripping elements in order to produce the correct spacing in the substrate tray.
- the gripping elements, the positioning elements and the spacers together form the gripper package of a multiple gripping device.
- the weight of the gripper package increases with the increasing number of gripping elements, position elements and spacers.
- the rigidity of materials is limited.
- Deformation of the arm is largely due to the dead weight of the gripper pack, while deformation due to picking up of substrates is present but usually involved to a much lesser extent.
- Auxiliary solutions such as adding spacer elements are not serviceable. Manufacturing parts with inclined surfaces for horizontal handling is also not to be regarded as suitable for industry.
- WO 99/62107 A1 describes a robot with a multiple gripping device which is intended to enable horizontal handling of substrates.
- the substrates lie on the gripping elements known as end effectors, which are fixed to a carrier block that is attached directly to the robot's arm.
- US 2003/0230384 A1 also describes a robot with a multiple gripping device which is intended to enable horizontal handling of substrates.
- the substrates lie on the gripping elements, which are fixed in a holder that is attached directly to the robot's arm.
- FIGs 1A, 1B and 2 are intended to illustrate a multiple gripping device 200 according to the prior art in more detail.
- the multiple gripping device 200 has a support block 202 which is attached by means of fasteners 205 to a robot arm 201 of a robot.
- the support block 202 forms the holder in which the gripping elements 203 are fixed.
- the number n of gripping elements 203 depends on the intended use of the multiple gripping device 200 .
- the gripping elements 203 are numbered, with the numbers being given in square brackets.
- Flat substrates 101 lie on the gripping elements 203 in a horizontal orientation.
- the gripping members 203 are spaced apart by spacers 204 which are part of the support block. The vertical distance between two adjacent gripping elements is the pitch.
- the carrier block 202 which includes the gripping elements 203 and the spacers 204, is part of the multiple gripping device.
- FIG. 1B a flat substrate 101a with circular face sides and a flat substrate 101b with square face sides are shown resting on the gripping element 203 .
- the deformation 206 of the arm 201 can be seen, which is largely due to the dead weight of the multiple gripping device.
- the object of the invention is to eliminate the disadvantages of the prior art.
- a robot is to be specified which enables horizontal handling of substrates without overloading the robot arm.
- an alignment device is to be specified which, for example, ensures a horizontal position of substrates.
- a robot for handling flat substrates comprising:
- each substrate holder being intended for holding one of the substrates horizontally
- a support block which holds the substrate holder or, if several substrate holders are provided, which holds the substrate holders at a distance from one another, and
- the support block is fastened to the robot arm by means of an alignment device, the alignment device being intended for aligning the support block.
- the support block can be aligned by means of the alignment device in such a way that the substrate holders enable the substrates to be held in a horizontal position.
- the alignment device enables the support block to be aligned. It also serves as the connection between the carrier block and the robot arm.
- the carrier block forms the active machine element together with the substrate holder(s).
- the carrier block is also referred to as a gripper block together with the substrate holder or holders.
- the substrate holders correspond to the gripping elements that have been described in connection with the prior art, for example in WO99/62107 A1.
- the support block can be one from the prior art, z. B. WO99/62107 A1, correspond to known support blocks, apart from the fact that the support block is not attached directly to the arm of the robot, but rather to the alignment device provided according to the invention.
- the robot and the robotic arm can be those of the prior art, e.g. B. WO99 / 62107 Al, correspond to known robots or robots poor, apart from the fact that the robot arm is not the Support block, but the alignment device provided according to the invention is fastened be.
- the term “handling” means picking up, transporting and setting down a flat substrate.
- the robot according to the invention has a plurality of substrate holders, it can have one or more spacers, as are known per se from the prior art. Adjacent substrate holders can be kept at a predetermined distance, the pitch, from one another by means of a spacer.
- the number of spacers corresponds to the number of substrate holders reduced by 1. It can be provided that the spacers belong to the carrier block. It can be provided that the substrate holder and the spacers belong to the carrier block.
- the robot according to the invention is used for handling flat substrates.
- the number of flat substrates that can be handled by the robot corresponds to the number of its substrate holders.
- a flat substrate can be, for example, a wafer such as a silicon wafer.
- the term “flat substrate” is understood to mean a body that has a greater extent, typically a much greater extent, in two directions of a Cartesian coordinate system than in the third direction of the Cartesian coordinate system. In other words, the width and length of the flat substrate is greater, typically much greater, than its height. In the case of flat substrates with a substantially circular cross-section, its radius is greater than its height.
- a flat substrate may have a first surface side and a second surface side.
- the first surface side and the second surface side preferably run parallel and in alignment with one another.
- the flat substrate or substrates can be held in such a way that at least one of the surface sides of the respective substrate lies in a horizontal plane. Both surface sides of the respective substrate preferably lie in horizontal planes.
- the alignment device can have a connecting element.
- the support block is fastened to the robot arm via the connecting element.
- the connecting element can have a first leg and a second leg have, which are passed from each other to form a gap.
- the alignment device can also have at least one adjustment element for adjusting the distance between the first and the second leg. The distance between the two legs in the vertical direction can be changed by means of the adjustment element or elements.
- the alignment device has a first adjustment element and a second adjustment element.
- the first adjustment element is preferably a tension screw and the second adjustment element is a pressure screw.
- the distance between the two legs can be changed using the tension screw.
- the distance between the two legs can also be changed using the pressure screw.
- the tension screw and the pressure screw can be arranged side by side.
- the train screw and the pressure screw have parallel or at least approximately parallel axes of rotation.
- the tension screw and pressure screw have parallel or at least approximately parallel axes of rotation.
- the one or more adjustment elements can be arranged covered to prevent unintentional actuation.
- a tension screw connection can be produced between the first and the second leg by means of the tension screw.
- angle compensation parts are used in order to compensate for an inclination of the tension screw. If the robot arm is not deformed, the axis of rotation is in its original length, for example its axis of rotation runs vertically. When the robot arm is deformed, the axis of rotation of the tension screw can incline compared to its initial position. This inclination is preferably compensated, for example by means of one or more angle compensation parts.
- the gap weakens the connecting element in a targeted manner.
- a relative movement between the two legs can be achieved by introducing limited forces by means of the adjusting element or elements.
- the connecting element has a first segment, to which the carrier block is attached, and a second segment, which is attached to the robot arm, the gap in the second segment being formed in such a way that that the second leg is above the first leg.
- the connecting element can have a bar-shaped base body, with the gap being introduced on one end face of the base body. The first leg faces the ground, the second leg faces away from the ground.
- the robot arm rests against the second leg.
- the first segment is adjacent to the second segment. Provision can be made for the pressure screw to be at a greater distance from the end face in which the gap is introduced than the tension screw. In other words, the tension screw is spaced more from the first segment than the compression screw.
- the one or more adjustment elements can be used to enforce relative positions in the positive and negative directions. Screw connections could be made using simple machine elements. For example, one or more pressure screws, one or more tension screws or a combination of one or more pressure screws and one or more tension screws can be provided. Depending on the direction of the compensation that is to be made in order to keep the flat substrates in a horizontal position, the appropriate screw connection can then be used for adjustment, while the other can be used to secure the setting.
- a first through-bore can be formed in the first leg for the passage of the tension screw.
- a second through hole can be formed in the first leg to produce a screw connection with the pressure screw.
- the two bores in the first leg are through bores.
- the pressure screw can rest with the end face of its shank on the second leg, preferably on the surface side of the second leg that faces the gap between the two legs.
- In the second leg can be formed from a bore for producing a screw connection with the tension screw.
- This hole is not a through hole. It can be formed on the surface side of the second leg that faces the gap between the two's angles.
- the distance between the first leg and the second leg can be changed.
- the distance between the first leg and the second leg can be changed by turning the pressure screw, which is passed through the second bore in the second leg and the end face of its shaft rests against the first leg. The distance can be reduced or increased.
- the indication "distance between the legs" can refer to their distance at the end face of the second segment.
- the connecting element is preferably made of a metallic material such as steel. It is used to connect the carrier block to the robot arm.
- the connecting element is preferably in one piece.
- the one or more adjustment elements are preferably made of a metallic material such as steel. They are used to align the carrier block and with it the substrate holder, which ensures that the flat sub strate lying on the substrate holders are in a horizontal position.
- the alignment device provided according to the invention makes it possible to compensate for the pre-shaping of the robot arm. It can be manufactured in a comparatively simple manner without impairing its robustness and lifespan, is very flexible in terms of its geometric design and can be designed as a lightweight element. All this does not affect the robustness and service life.
- the alignment device provided according to the invention enables the compensation of inclined positions of the carrier block and thus of the substrate holder. It is particularly suitable for gripping devices that have one or more substrate holders. However, the alignment device provided according to the invention can also be used to compensate for other machine elements.
- the robot arm In addition to the deformations of the robot arm already described, it can be flatter in handling systems for picking up, transporting and storing Substrates other sources of resilience and deformation exist, such as e.g. B. guide elements, connections, adapters, other arms, housing and frame parts. In such a case, the deformation occurring at the point of action, ie the robot arm, is the sum of all these individual amounts. Such a deformation is of course individual for each system, even if the design is otherwise identical, which is due to manufacturing and assembly tolerances. It is therefore advantageous if the alignment device is arranged as close as possible to the point of action. In this way, further deformations between the alignment device and the point of action can be prevented.
- the alignment device be as compact and lightweight as possible.
- the alignment device is preferably maintenance-free and durable and consists of as few individual parts as possible.
- the alignment device according to the invention is preferably robust. It is simple and easy to adjust by means of the adjustment element or elements. The adjustment, for example by turning the tension screw and/or the pressure screw, can be carried out by an operator of the robot.
- the person skilled in the art is able to design the alignment device provided according to the invention in such a way that its arrangement is as space-saving as possible and without interfering contours.
- the mode of operation of the alignment device described in the present application offers numerous possible variations for this.
- the person skilled in the art is also able to arrange the setting elements in a concealed manner in order to avoid unintentional maladjustment. All current and known solutions for positioning and connecting machine elements can be used in combination with this alignment device.
- the robot according to the invention can be used to handle one or more flat substrates. If the robot according to the invention is to be used only for handling a single flat substrate, it has only a single substrate holder. He is then a single gripper. If the robot according to the invention is only to be used for handling two or more flat substrates, then it has the corresponding number of substrate holders. He is then a multiple or multi gripper. Single grippers and multiple grippers are also collectively referred to as substrate grippers.
- the alignment device provided according to the invention can be used to prevent the tilting of substrate grippers, in particular single grippers or multiple grippers, by creating an adjustable connection between the gripping elements and the robot arm.
- an alignment device for aligning a carrier block which holds one or more substrate holders at a distance from one another, the substrate holders each being intended for holding a flat substrate horizontally.
- the alignment device comprises a connection element with a first leg and a second leg which are separated from one another to form a gap, the alignment device further comprising at least one adjustment element for adjusting the distance between the first and second leg.
- the alignment device according to the invention is suitable for all types of machine elements and assemblies which, due to their arrangement, are subject to shape and position tolerances and whose spatial position should be adjusted for proper functioning.
- the invention is explained in more detail below with reference to the drawings using exemplary embodiments, which are not intended to limit the invention. show it
- FIG. 1 shows schematic representations of a multiple gripping device according to the prior art (FIG. 1A: side view; FIG. 1B: top view);
- Fig. 2 is a schematic side view of the prior art multiple gripper shown in Fig. 1, in which the arm is deformed;
- FIG. 3 shows schematic representations of an embodiment of a robot according to the invention (FIG. 3A: partial sectional view from the side, with the alignment device being shown in section; FIG. 3B: plan view);
- Fig. 4 shows schematic representations of the alignment device (Fig. 4A: top view; Fig. 4B: side view; Fig. 4C: view from below; Fig. 4D: sectional view taken along section line BB of Fig. 4C; Fig. 4E: view to the first end face Fig. 4F: view of the second end face Fig. 4G: sectional view along section line BB of Fig. 4C without showing the screws); and
- FIG. 5 shows a schematic representation of the embodiment shown in FIG. 3 of a robot according to the invention with a deformed robot arm.
- FIG. 3 of a robot 1 has a robot arm 2 to which an alignment device 3 is attached.
- a carrier block 4 is also attached to the alignment device 3 and carries a plurality of substrate holders 5 for holding wafers 102 horizontally.
- the substrate holders 5 represent the gripping elements. Adjacent substrate holders 5 can be held at a predetermined distance, the pitch P, from one another by means of distancing pieces 6 .
- the number n of substrate holders 5 depends on the application robot 1 according to the invention. For this reason, in FIGS. 3A and 5 the carrier block 4 is partially shown with dashed lines. In addition, the substrate holders 5 are numbered, with the numbers being given in square brackets.
- the robot arm 2 is mounted on a base 7 in a known manner and can be moved via a controller 8, as described for example in WO/9962107.
- the robot 1 shown in Fig. 3 corresponds, apart from the alignment device 3, to industrial robots known per se for handling flat substrates such as wafers 102, for example.
- the alignment device 3 has a connecting element 31 , a tension screw 32 and a pressure screw 33 .
- the connecting element 31 has a bar-shaped base body with a first segment 311 and a second segment 312 .
- the longitudinal axis A of the bar-shaped base body runs from the robot arm 2 to the support block 4.
- the first segment 311 and the second segment 312 adjoin one another.
- the carrier block 4 is fastened to the first segment 311 by means of one or more fastening elements 10 .
- the second segment 312 is attached to the robot arm 2 by means of attachment elements 9 .
- the Befest onlysele elements 9, 10 are indicated to simplify the illustration in Figures 3A and 5 only by a dashed line.
- the connecting member 31 has a first face 31a formed on the first segment 311 and a second face 31b formed on the second segment.
- the connecting element 31 also has an underside 31c and an upper side 3ld, which are connected to one another via longitudinal sides 3le, 3lf.
- the bottom 31c faces the floor, the top 3 ld faces the floor.
- a gap 34 is formed on the second end face 31b of the connecting element 31, which extends in the direction of the first end face 31a and over the entire extent of the connecting element 31 between the longitudinal sides 31e, 31f.
- the gap 34 is thus at the second end face 3 lb of the second segment 312 and at the long sides 31e, 31f open.
- the gap 34 is delimited by a first leg 313 and a second leg 314 belonging to the second segment 312 and connected via a base 315 which also belongs to the second segment 312 .
- the second segment 312 accordingly has a U-shaped cross section.
- the gap 34 extends essentially in the horizontal direction, the surface sides of the two legs 313, 314 delimiting it lie approximately in a horizontal plane, provided that an adjustment by means of the tension screw 32 and the pressure screw 33, with which the direction of the legs 313, 314 can be changed, disregards.
- the second segment 312 rests on its upper side, which is part of the upper side 3 ld, on the robot arm 2 .
- a first through hole 316 for the tension screw 32 and a second through hole 317 are formed (see Fig. 4G).
- the bore 318 has an internal thread into which an external thread engages, which is formed on the shank 321 of the tension screw 32 .
- the first through hole 316 has no internal thread.
- the train is screw 32 with the screw head 322 on the underside 31 c of the Vietnamesesele Mentes 31 at.
- the expansion of the gap 34 between the two legs 313, 314 can be changed by turning the tension screw.
- the second passage bore 317 has an internal thread, which is engaged by an external thread formed on the shank of the pressure screw 33 .
- the pressure screw 33 extends into the gap 34 and can bear against the second leg 314 with the end face of its shank. By turning the pressure screw, the extent of the gap 34 between the two legs 313, 314 can be changed. It can be seen in Fig. 5 that by means of the two screws 32, 33, a deformation 11 of the robot arm 2 can be compensated. Despite the deformation 11, the wafers 102 are in a horizontal position. The length of the gap 34 determines a compensation area that extends from the base 315 of the second segment 312 to the point of action of the deformation 11 of the robot arm 2 . It can also be seen in FIG. 5 that the alignment device is arranged close to the effective point of the deformation 11 .
- the tension screw 32 and the pressure screw 33 are preferably formed in the middle, relative to the extent of the connecting element 31 between its longitudinal sides 3 le, 3 lf.
- the distance between the pressure screw 33 and the end face 31b of the connecting element 31 is greater than the distance between the tension screw 32 and this end face.
- the axes of rotation of the tension screw 32 and the pressure screw 33 run approximately in the vertical.
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- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2024504591A JP2024514226A (ja) | 2021-06-18 | 2022-06-15 | 平らなサブストレートを処理するためのロボット並びに位置合わせ装置 |
EP22743728.2A EP4356421A1 (de) | 2021-06-18 | 2022-06-15 | Roboter zur handhabung flacher substrate sowie ausrichtungseinrichtung |
CA3212833A CA3212833A1 (en) | 2021-06-18 | 2022-06-15 | Robot for handling flat substrates as well as alignment facility |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102021115853.2 | 2021-06-18 | ||
DE102021115853.2A DE102021115853B3 (de) | 2021-06-18 | 2021-06-18 | Roboter zur Handhabung flacher Substrate sowie Ausrichtungseinrichtung |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2022262907A1 true WO2022262907A1 (de) | 2022-12-22 |
Family
ID=81846772
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2022/100447 WO2022262907A1 (de) | 2021-06-18 | 2022-06-15 | Roboter zur handhabung flacher substrate sowie ausrichtungseinrichtung |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP4356421A1 (de) |
JP (1) | JP2024514226A (de) |
CA (1) | CA3212833A1 (de) |
DE (1) | DE102021115853B3 (de) |
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Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09213768A (ja) * | 1996-02-02 | 1997-08-15 | Yaskawa Electric Corp | ウェハ搬送装置 |
WO1999062107A1 (en) | 1998-05-27 | 1999-12-02 | Varian Semiconductor Equipment Associates, Inc. | Batch end effector for semiconductor wafer handling |
KR20030000092A (ko) * | 2001-06-22 | 2003-01-06 | 삼성전자 주식회사 | 웨이퍼 이송 장치 |
US20030230384A1 (en) | 2002-06-14 | 2003-12-18 | Taiwan Semiconductor Manufacturing Co., Ltd. | Wafer transfer robot having wafer blades equipped with sensors |
KR100767264B1 (ko) * | 2006-09-18 | 2007-10-17 | 최일승 | 웨이퍼 이동암 |
US20140007731A1 (en) * | 2012-07-06 | 2014-01-09 | Persimmon Technologies Corporation | High capacity robot arm |
JP2015037173A (ja) * | 2013-08-16 | 2015-02-23 | 株式会社ディスコ | 固定機構 |
JP2021019172A (ja) * | 2019-07-24 | 2021-02-15 | 川崎重工業株式会社 | ロボットハンド、ロボット、及び固定装置 |
US20210086373A1 (en) * | 2019-09-24 | 2021-03-25 | Thermo Crs Ltd. | Multi-Axis Gripper For Lab Automation Robot |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10090188B2 (en) | 2016-05-05 | 2018-10-02 | Applied Materials, Inc. | Robot subassemblies, end effector assemblies, and methods with reduced cracking |
US20210146554A1 (en) | 2019-11-15 | 2021-05-20 | Applied Materials, Inc. | Multi-finger robot apparatus, electronic device manufacturing apparatus, and methods adapted to transport multiple substrates in electronic device manufacturing |
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2021
- 2021-06-18 DE DE102021115853.2A patent/DE102021115853B3/de active Active
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2022
- 2022-06-15 CA CA3212833A patent/CA3212833A1/en active Pending
- 2022-06-15 WO PCT/DE2022/100447 patent/WO2022262907A1/de active Application Filing
- 2022-06-15 EP EP22743728.2A patent/EP4356421A1/de active Pending
- 2022-06-15 JP JP2024504591A patent/JP2024514226A/ja active Pending
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09213768A (ja) * | 1996-02-02 | 1997-08-15 | Yaskawa Electric Corp | ウェハ搬送装置 |
WO1999062107A1 (en) | 1998-05-27 | 1999-12-02 | Varian Semiconductor Equipment Associates, Inc. | Batch end effector for semiconductor wafer handling |
KR20030000092A (ko) * | 2001-06-22 | 2003-01-06 | 삼성전자 주식회사 | 웨이퍼 이송 장치 |
US20030230384A1 (en) | 2002-06-14 | 2003-12-18 | Taiwan Semiconductor Manufacturing Co., Ltd. | Wafer transfer robot having wafer blades equipped with sensors |
KR100767264B1 (ko) * | 2006-09-18 | 2007-10-17 | 최일승 | 웨이퍼 이동암 |
US20140007731A1 (en) * | 2012-07-06 | 2014-01-09 | Persimmon Technologies Corporation | High capacity robot arm |
JP2015037173A (ja) * | 2013-08-16 | 2015-02-23 | 株式会社ディスコ | 固定機構 |
JP2021019172A (ja) * | 2019-07-24 | 2021-02-15 | 川崎重工業株式会社 | ロボットハンド、ロボット、及び固定装置 |
US20210086373A1 (en) * | 2019-09-24 | 2021-03-25 | Thermo Crs Ltd. | Multi-Axis Gripper For Lab Automation Robot |
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CA3212833A1 (en) | 2022-12-22 |
JP2024514226A (ja) | 2024-03-28 |
EP4356421A1 (de) | 2024-04-24 |
DE102021115853B3 (de) | 2022-06-23 |
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