WO2022262654A1 - 一种纤维机械增强的led显示阵列以及制作方法 - Google Patents

一种纤维机械增强的led显示阵列以及制作方法 Download PDF

Info

Publication number
WO2022262654A1
WO2022262654A1 PCT/CN2022/098152 CN2022098152W WO2022262654A1 WO 2022262654 A1 WO2022262654 A1 WO 2022262654A1 CN 2022098152 W CN2022098152 W CN 2022098152W WO 2022262654 A1 WO2022262654 A1 WO 2022262654A1
Authority
WO
WIPO (PCT)
Prior art keywords
fiber
chip
chips
display array
grid
Prior art date
Application number
PCT/CN2022/098152
Other languages
English (en)
French (fr)
Inventor
郭德博
王素景
李志�
Original Assignee
南京阿吉必信息科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 南京阿吉必信息科技有限公司 filed Critical 南京阿吉必信息科技有限公司
Publication of WO2022262654A1 publication Critical patent/WO2022262654A1/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes

Definitions

  • the disclosure relates to the technical field of optoelectronic devices, in particular to a fiber mechanically reinforced LED display array and a manufacturing method.
  • Display technology from cathode ray tube (CRT, Cathode Ray Tube) to liquid crystal display is widely used in televisions, computer monitors, mobile phones and other fields. mainstream technology in the field.
  • the liquid crystal display uses the directional rearrangement of the crystal orientation of the liquid crystal under the action of the electric field to form a pattern with different transmittance to the light.
  • the light emitted by the backlight passes through the color filter film and the liquid crystal molecules to realize the light-emitting lattice.
  • the disadvantage is that the light The utilization efficiency is low (generally only 7%), the color gamut is limited by the color filter, and it is difficult to manufacture large-scale (>100 inches) and high-resolution (1200PPI) and above, and the cost is high.
  • displays above 100 inches are mainly projection displays (DLP, Digital Light Procession) and LED displays, while small-sized displays are based on organic light-emitting diode (OLED, Organic Light-Emitting Diode) technology, which has developed rapidly and has become the preferred choice for wearable electronics such as mobile phones. Display mainstream technology.
  • DLP Digital Light Procession
  • LED LED
  • OLED Organic Light-Emitting Diode
  • LED displays In terms of large-scale display, LED displays have the advantages of high brightness, wide color gamut, and large dynamic range, and are widely used in outdoor advertising, video conferences, commercial displays, and central control systems.
  • SMT Surface Mount Technology
  • COB Chip On Board
  • the purpose of the present disclosure is to provide a fiber-reinforced LED display array and a manufacturing method, which have high mechanical strength of the substrate, small thermal expansion, and high reliability; flexible curling, small volume, and low manufacturing cost; no splicing, active drive, and high performance. LED display array with low power consumption.
  • the present disclosure adopts the following technical solutions for a fiber mechanically reinforced LED display array and its manufacturing method:
  • the present disclosure provides a fiber-reinforced LED display array, comprising:
  • the chip is located on the plane
  • a fiber bundle the fiber bundle separates two adjacent chips, the fiber bundle forms a mesh structure, and there is a gap between the chip and the mesh structure.
  • Fiber bundles greatly increase the mechanical strength of the plane, reduce thermal expansion, increase reliability, and prevent chips from breaking under temperature changes and mechanical impacts; chips and fiber grids are arranged together at the same time to form an integrated flexible substrate. sewing, low cost.
  • the chip includes an LED light-emitting chip
  • the LED light-emitting chips are arrayed in matrix on the plane.
  • the chip also includes a CMOS driver chip
  • CMOS driver chips are arrayed in matrix on the plane.
  • the LED light-emitting chip, the CMOS driver chip and the fiber bundle are connected to the plane through silica gel or other organic colloids to form a flexible substrate without a carrier board; the LED light-emitting chip, the CMOS driver chip The chip and the fiber bundle are in a plane and embedded in silica gel.
  • the CMOS driver chip, LED light-emitting chip and fiber grid are arranged together at the same time to form an integrated flexible substrate with no joints and low cost. Due to the flexibility of the fiber and the good elasticity of silica gel or other organic colloids, the LED display array formed in this way has the characteristics of rollability, which is convenient for the handling and installation of large-size display screens.
  • the electrode interconnection process of all chips is performed on the side of the flexible substrate opposite to the chip.
  • the fiber bundle greatly increases the mechanical strength of the plane, reduces thermal expansion, increases reliability, and prevents the conductive interconnection between chips and the interconnection between chip and drive circuit and power supply from breaking under temperature changes and mechanical shocks.
  • semiconductor technology is used for electrode interconnection, which has high efficiency and low cost.
  • the fiber bundle is integrated into a bundle by a plurality of fiber filaments.
  • the integration of multiple fiber filaments into a fiber bundle can further improve the overall flexibility of the fiber bundle.
  • the thickness of the fiber bundle is smaller than the thickness of the display and greater than or equal to the thickness of the chip.
  • the thickness of the fiber bundle is greater than or equal to the thickness of the chip, which can play a certain supporting role for the chip and the flexible substrate.
  • the present disclosure provides a method for fabricating a fiber mechanically reinforced LED display array, which includes the following steps:
  • the fiber bundles into a grid of N rows ⁇ M rows, the grid of N rows ⁇ M rows is a mesh structure, and the periphery of the mesh structure is tightened on another frame;
  • the fiber grid is a fiber bundle arranged in a grid structure, and the fiber grid is located in the gap between the chips in the display array of N rows ⁇ M columns , but also adhere to the film.
  • the periphery of the adhesive film is fixed and tightened on a frame, specifically including:
  • the chips Arranging the chips according to a certain period of electrode downward flip-chip on the adhesive film with a certain viscosity, the chips include LED light-emitting chips and CMOS driver chips.
  • silica gel or other organic colloid is coated on the two bonded frames, and after the silica gel is cured, the chip Form an integral flexible plane with the fiber grid.
  • the frame and the adhesive film on the other side of the LED light-emitting chip and the CMOS driver chip are removed to expose the electrodes of the chip, and a semiconductor process is used to Interconnect the chip electrodes.
  • the current of each LED light-emitting chip in the LED array is controlled through the peripheral drive circuit and power supply according to the color and brightness of each pixel of the displayed image, and the brightness and ratio of the three colors of LEDs are controlled to display patterns.
  • the fiber bundle greatly increases the mechanical strength of the plane, reduces thermal expansion, increases reliability, and prevents the conductive interconnection between chips and the interconnection between chips and drive circuits and power supplies from breaking under temperature changes and mechanical shocks.
  • CMOS driver chip LED light-emitting chip and fiber grid are arranged together at the same time to form an integrated flexible substrate with no joints and low cost. Active drive, low power consumption, high contrast, high gray scale, good image display quality.
  • the silica gel or organic colloid Due to the flexibility of the fiber, the silica gel or organic colloid has better elasticity, and the LED display array formed in this way has the characteristics of curling, which is convenient for the handling and installation of large-size display screens.
  • FIG. 1 is a schematic diagram of an array structure of the present disclosure
  • Figure 2 is a schematic diagram of the arrangement of LED light-emitting chips
  • Fig. 3 is a schematic diagram of fiber bundle grid arrangement
  • Fig. 4 is a schematic diagram of bonding two frames
  • Fig. 5 is the schematic diagram after perfusion silica gel
  • Fig. 6 is a schematic diagram of an LED flexible substrate
  • Fig. 7 is a schematic diagram of the preparation of LED flexible display array row lines
  • Fig. 8 is a schematic diagram of the preparation of LED flexible display array line
  • FIG. 9 is a schematic layout diagram of an active-driven LED flexible display array chip.
  • Icons 1-LED light-emitting chip; 2-organic film; 3-frame; 4-network structure; 41-fiber bundle; 5-fiber grid structure; 6-silica gel or other organic colloid; 7-plane; 8- Electrode surface; 9-row line; 10-column line; 11-CMOS driver chip.
  • orientations or positional relationships indicated by the terms “vertical”, “peripheral surface”, etc. are based on the orientations or positional relationships shown in the drawings, or the conventional orientation when the disclosed product is used.
  • the orientation or positional relationship is only for the convenience of describing the present disclosure and simplifying the description, but does not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be construed as limiting the scope of the present disclosure. limit.
  • the terms “first”, “second”, “third”, etc. are only used for distinguishing descriptions, and should not be construed as indicating or implying relative importance.
  • vertical do not imply that a component is absolutely level or overhanging, but may be slightly inclined.
  • horizontal only means that its direction is more horizontal than “vertical”, and it does not mean that the structure must be completely horizontal, but can be slightly inclined.
  • the terms "setting”, “installation”, “connection” and “connection” should be understood in a broad sense, for example, it may be a fixed connection, It can also be a detachable connection or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediary, and it can be the internal communication of two components.
  • the terms “setting”, “installation”, “connection” and “connection” should be understood in a broad sense, for example, it may be a fixed connection, It can also be a detachable connection or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediary, and it can be the internal communication of two components.
  • the fiber bundle 41 greatly increases the mechanical strength of the plane, reduces thermal expansion, increases reliability, and prevents the chip from breaking under temperature changes and mechanical impacts; the chip and the fiber mesh structure 4 are arranged together at the same time, Form an integrated flexible substrate, no joints, and low cost.
  • the first embodiment taking the 100-inch P0.625 4K screen as an example, a fiber mechanically reinforced LED display array, including a plane 7, chips and fiber bundles 41, the fiber bundles 41 form a grid structure to divide two adjacent chips , and form a fiber mesh structure, the chip includes LED light-emitting chips 1, it can be understood that, in this embodiment, the chip includes LED light-emitting chips, and there is a gap between the chip and the fiber mesh structure 4. It can be understood that the fiber mesh structure in the present disclosure is a fiber mesh.
  • the LED light-emitting chip 1 and the fiber bundle 41 are connected to the plane 7 through silica gel or other organic colloids 6 to form a flexible substrate without a carrier; the LED light-emitting chip 1 and the fiber bundle 41 are in a plane 7, Embedded in silica gel or other organic colloids.
  • the LED light-emitting chip 1 and the fiber grid are arranged together at the same time to form an integrated flexible substrate with no joints and low cost. Due to the flexibility of the fiber and the good elasticity of the silica gel or other organic colloids, the LED display array formed in this way has the characteristic of being rollable, which is convenient for handling and installation of large-size display screens.
  • the electrode interconnection process of all chips is performed on the side of the flexible substrate opposite to the chips. It can be understood that the chip includes an LED light emitting chip 1 .
  • the fiber bundle 41 greatly increases the mechanical strength of the plane 7, reduces thermal expansion, increases reliability, and prevents the conductive interconnection between chips and the interconnection between the chip and the drive circuit and power supply from breaking under temperature changes and mechanical shocks.
  • semiconductor technology is used for electrode interconnection, which has high efficiency and low cost.
  • the present disclosure provides a fiber mechanically reinforced LED display array manufacturing method, including the following steps:
  • the fiber grid is a fiber bundle arranged in a grid structure.
  • the fiber grid is located in the gap between the chips in the display array of N rows ⁇ M columns, and at the same time Also adheres to the adhesive film.
  • the method for fabricating LED display arrays reinforced by fiber mechanics includes the following steps:
  • Step 1 Referring to Figure 2, the LED light-emitting chips 1 are transferred sequentially, with the chip electrodes facing down in sequence, and arranged on the organic adhesive film 2 with a certain viscosity according to N rows ⁇ M columns, for example, the adhesive film is an organic adhesive film 2, Such as, M and N can be identical numerical value, also can be different numerical value;
  • the arrangement period of the LED light-emitting chips 1 is 625um, which is specifically arranged according to the 4K resolution of the display screen 3840 ⁇ 2160 and the ratio of horizontal and vertical dimensions of 16:9 (4K screen standard), and the surrounding area of the organic film 2 is tightly fixed on a frame 3, for example, the frame 3 is made of stainless steel or aluminum alloy.
  • Step 2 Referring to Fig. 3, the fiber bundles 41 with a diameter of 100 microns are arranged into a grid-like network structure 4 according to a period of 625 um, and the periphery is tightened and fixed on another frame made of stainless steel or aluminum alloy (not shown in the figure) Out), a fiber mesh structure 5 is formed, and the void area of the fiber mesh structure 4 is the area where the LED light-emitting chip 1 is located.
  • the fiber bundle is integrated into a bundle by a plurality of fiber filaments.
  • a plurality of fiber filaments are integrated into a bundle of fiber bundles which can further improve the overall flexibility of the fiber bundles;
  • fiber bundles 41 can be glass fibers, nylon threads or other fibers with greater strength and toughness, and can be placed on the fiber grid structure 5 before forming
  • the fiber bundle 41 is pre-wrapped with a thin layer of silica gel or other organic colloids and pre-cured; the thickness of the fiber bundle 41 is less than the thickness of the display and greater than or equal to the thickness of the chip.
  • the thickness of the fiber bundle 41 is greater than or equal to the thickness of the chip, which can play a certain supporting role for the chip.
  • Step 3 Referring to Figure 4, align and attach the fiber mesh structure 5 with the fiber mesh structure 4 to the chip frame 3 where the LED display array is located, and the fiber mesh structure 4 is located in the P0.625mm 3840 ⁇ 2160 array where the LED emits light In the gap of the chip 1, it is also adhered to the organic film 2;
  • Step 4 Referring to Figure 5, apply silica gel or other organic colloid 6 above the two fitted frames so that the silica gel or other organic colloid 6 can penetrate the fiber grid, and here coat silica gel or other organic colloids above the two fitted frames
  • the material of the organic colloid 6 is the same as that of a thin layer of silica gel or other organic colloids wrapped on the fiber bundle 41 in advance; the whole frame formed by the two attached frames is put into a vacuum cavity to vacuumize and remove the silica gel or other organic colloids 6
  • the air bubbles in the film make the silica gel fully contact with the fiber grid and the surface of the chip, and then heat to cure the silica gel, and connect the LED light-emitting chip 1 and the fiber mesh structure 4 into a CIF (Chip in Film) flexible plane 7 with a stable mechanical structure .
  • CIF Chip in Film
  • the fiber mesh that is, the fiber mesh structure 4, greatly increases the mechanical strength of the flexible plane 7, reduces thermal expansion, increases reliability, and prevents fractures under temperature changes and mechanical impacts after conductive interconnection between chips. Due to the flexibility of the fiber, the silica gel or other organic colloids 6 have good elasticity, and the LED display array formed in this way has the characteristic of being rollable, which is convenient for handling and installation of large-size display screens.
  • the total thickness of the flexible plane is 200um-5000um, and the fiber bundle 41 can be well integrated with the silica gel or other organic colloid 6 in the flexible plane 7 because it is pre-coated with silica gel;
  • Step 5 Referring to FIG. 6, remove another frame for fixing the fiber grid, remove the chip frame 3 for fixing the organic film 2, and remove the organic film 2 to expose the electrode surface 8 where the electrode of the LED light-emitting chip 1 is located;
  • Step 6 Apply or vacuum-bond PIC photosensitive adhesive or other photoresist on the LED electrode surface 8 of the flexible plane 7, and remove the PIC photosensitive adhesive on the electrode of the LED light-emitting chip 1 by ultraviolet (UV) exposure and development methods, Expose the P electrode and N electrode of the LED light-emitting chip 1;
  • UV ultraviolet
  • Step 7 Referring to FIG. 7 , prepare the row lines 9 and column lines 10 of the LED display array on the LED electrode surface 8 of the flexible substrate.
  • the metal row lines 9 of the array are prepared by screen printing or other semiconductor processes, and the metal material is a metal with low resistivity and low cost such as solder paste, silver paste or aluminum.
  • the row lines of the array can also be prepared by sputtering or evaporating metal thin films, followed by photolithography and etching;
  • Step 8 Referring to Figure 8, apply or vacuum-press a second layer of PIC photosensitive adhesive on the first layer of PIC photosensitive adhesive layer and row line 9 as an electrical isolation layer between row line 9 and column line 10, and then follow The method of step six exposes the pins of the row leads. Then prepare the metal column lines 10 of the array by screen printing or the like;
  • an LED display array that can perform row and column scanning is formed.
  • the current of each LED light-emitting chip in the LED array is controlled through the peripheral drive circuit and power supply according to the color and brightness of each pixel of the displayed image, and the brightness and brightness of the three colors of the LED are controlled. Matching, thus showing the pattern.
  • a fiber mechanically reinforced LED display array including a plane 7, chips and fiber bundles 41, the fiber bundles 41 form a grid structure to divide two adjacent chips, and form a fiber mesh structure 4, the chips include LED light-emitting chips 1 and CMOS
  • the chip in this embodiment includes the LED light-emitting chip 1 and the CMOS driving chip 11 , and there is a gap between the chip and the fiber mesh structure 4 .
  • the fiber mesh structure in the present disclosure is a fiber mesh.
  • the LED light-emitting chip 1, the CMOS driver chip 11 and the fiber bundle 41 are connected to the plane through silica gel or other organic colloids 6 to form a flexible substrate without a carrier board; the LED light-emitting chip 1, the CMOS driver chip 11 and the The fiber bundle 41 is in a plane and embedded in silica gel.
  • the CMOS driver chip 11, the LED light-emitting chip 1 and the fiber mesh structure 4 are arranged together at the same time to form an integrated flexible substrate with no joints and low cost. Due to the flexibility of the fiber and the good elasticity of silica gel or other organic colloids, the LED display array formed in this way has the characteristics of rollability, which is convenient for the handling and installation of large-size display screens.
  • the electrode interconnection process of all chips is performed on the side of the flexible substrate opposite to the chips. It can be understood that the chip includes an LED light emitting chip 1 and a CMOS driver chip 11.
  • the fiber bundle 41 greatly increases the mechanical strength of the plane 7, reduces thermal expansion, increases reliability, and prevents the conductive interconnection between chips and the interconnection between the chip and the drive circuit and power supply from breaking under temperature changes and mechanical shocks.
  • semiconductor technology is used for electrode interconnection, which has high efficiency and low cost.
  • the fiber bundle 41 is formed of multiple fiber filaments integrated into a bundle.
  • the integration of multiple fiber filaments into a fiber bundle can further improve the overall flexibility of the fiber bundle.
  • the thickness of the fiber bundle 41 is less than the thickness of the display and greater than or equal to the thickness of the chip.
  • the thickness of the fiber bundle 41 is greater than or equal to the thickness of the chip, which can play a certain supporting role for the chip.
  • the present disclosure provides a fiber mechanically reinforced LED display array manufacturing method, including the following steps:
  • the fiber grid is a fiber bundle arranged in a grid structure.
  • the fiber grid is located in the gap between the chips in the display array of N rows ⁇ M columns, and at the same time Also adheres to the adhesive film.
  • the LED light-emitting chip 1 and the CMOS driver chip 11 are transferred in sequence, and the chip electrodes are arranged on the organic film 2 with a certain viscosity (PET or PI film) according to N rows ⁇ M columns.
  • the array period is 625um.
  • the display screen 4K resolution 3840 ⁇ 2160 and 16:9 ratio of horizontal and vertical dimensions (4K screen standard) are arranged, and the periphery of the organic film 2 is tightened and fixed on a chip frame 3 (stainless steel or aluminum alloy frame).
  • the fiber bundles Arrange the fiber bundles with a diameter of 100 microns into a fiber mesh structure 4 according to a period of 625um, and fix the periphery tightly on another stainless steel or aluminum alloy frame to form a fiber mesh structure 5, and the void area of the mesh structure 4 is an LED light-emitting chip and the area where the CMOS chip is located.
  • the two frames are laminated, filled with silica gel, cured, and the frame and organic film are removed, and the LED light-emitting chip, CMOS driver chip and fiber bundle form an integral flexible substrate through silica gel.
  • the CMOS data line leads, control line leads, LED power leads, ground leads, and electrical insulation processes between the leads of each layer of the active drive LED flexible display are carried out, and finally the image is realized. show.

Abstract

一种纤维增强的LED显示阵列，包括：平面；芯片，位于平面；纤维束，分隔相邻两个芯片，纤维束形成网状结构，芯片与网状结构之间留有间隙。一种纤维机械增强的LED显示阵列制作方法，包括如下步骤：提供具有一定粘性的胶膜；将芯片排布在胶膜的平面上，形成N行×M列显示阵列，胶膜周边固定绷紧在一个框架上；将纤维束排布成N行×M行网格，N行×M行网格为网状结构，网状结构周边绷紧在另一个框架；将带有纤维网格的框架与显示阵列所在框架对准贴合，纤维网格为排布成网格结构的纤维束，纤维网格位于N行×M列显示阵列中芯片的间隙中，同时也粘附在胶膜上。

Description

一种纤维机械增强的LED显示阵列以及制作方法
相关申请的交叉引用
本申请要求在2021年06月16日提交中国专利局、申请号为202110668235.8、申请名称为“一种纤维机械增强的LED显示阵列以及制作方法”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本公开涉及光电器件技术领域，特别涉及一种纤维机械增强的LED显示阵列以及制作方法。
背景技术
显示技术从阴极射线管(CRT，Cathode Ray Tube)到液晶显示广泛应用于电视机、计算机监视器、手机等领域，液晶显示作为第二代显示技术具有体积小、平面化等优点，是目前显示领域的主流技术。液晶显示是利用液晶晶向排列在电场作用下发生定向重排而产生对光的穿透率不同形成图案，通过背光源发出的光经滤色膜和液晶分子实现发光点阵，缺点是光的利用效率低(一般仅7％)，色域受滤色膜限制，在大尺寸(>100吋)及高分辨率(1200PPI)以上制造难度大，成本高。目前100吋以上显示主要是投影显示(DLP，Digital Light Procession)和LED显示屏，小尺寸显示则以有机发光二极管(OLED，Organic Light-Emitting Diode)技术发展较快，成为手机等可穿戴电子的显示屏主流技术。
在大尺寸显示方面LED显示屏具有高亮度、宽色域、动态范围大等优点，在户外广告、视频会议、商业显示、中央控制系统等领域得到广泛应用。但由于传统LED显示屏采用的主流技术以表面贴装(SMT，Surface Mount Technology)和芯片邦定到基板(COB，Chip On Board)技术为主，制造成本 高，安装场地和条件要求高。同时由于SMT和COB技术都是通过机械转移方式将LED发光芯片或封装体固定在电路板上(PCB，Printed Circuit Board或FPCB，Flexible Printed Circuit Board)做成模块，再进行拼接，长期使用过程中由于热胀冷缩、机械冲击等原因易形成模块间机械结构发生变化而形成缝隙，无法实现无缝拼屏，影响显示效果，并且在像素间距1.0mm以上组装困难，成本较高。采用SMT或COB技术的传统LED显示屏的基板只能为PCB等硬板，采用被动式矩阵(PM，Passive Matrix)驱动，无法实现有源驱动的柔性显示。
发明内容
本公开的目的是提供一种纤维增强的LED显示阵列以及制作方法，具有基板机械强度高、热膨胀小，可靠性高；可柔性卷曲、体积小，制作成本低；无拼接，有源驱动，功耗低的LED显示阵列。
为了实现上述公开目的，本公开一种纤维机械增强的LED显示阵列以及制作方法采用的如下技术方案：
第一方面，本公开提供一种纤维增强的LED显示阵列，包括：
平面；
芯片，所述芯片位于所述平面；
纤维束，所述纤维束分隔相邻两个所述芯片，所述纤维束形成网状结构，所述芯片与所述网状结构之间留有间隙。
纤维束使平面的机械强度大大增加，热膨胀减小，增加了可靠性，防止芯片在温度变化及机械冲击下断裂现象；芯片和纤维网格同时排布在一起，形成一体的柔性基板，无拼缝，成本低。
可选地，所述芯片包括LED发光芯片；
所述LED发光芯片矩阵阵列于所述平面。
可选地，所述芯片还包括CMOS驱动芯片；
所述CMOS驱动芯片矩阵阵列于所述平面。
可选地，所述LED发光芯片、所述CMOS驱动芯片和所述纤维束通过硅 胶或其他有机胶体连接于所述平面，形成无载板的柔性基板；所述LED发光芯片、所述CMOS驱动芯片和所述纤维束处于一个平面内，镶嵌于硅胶之中。
CMOS驱动芯片、LED发光芯片和纤维网格同时排布在一起，形成一体的柔性基板，无拼缝，成本低。由于纤维具有柔韧性，硅胶或其他有机胶体具有较好的弹性，这样形成的LED显示阵列具有可卷曲特性，便于大尺寸显示屏的搬运和安装。
可选地，所述柔性基板相对于所述芯片的一面进行所有芯片的电极互联工艺。
纤维束使平面的机械强度大大增加，热膨胀减小，增加了可靠性，防止芯片间导电互联及芯片与驱动电路和电源互联导电线路在温度变化及机械冲击下断裂现象。在柔性基板另一面采用半导体工艺进行电极互联，效率高、成本低。
可选地，所述纤维束由多根纤维丝集成一束。多根纤维丝集成为一束纤维束可以进一步提高纤维束整体的柔韧性。
可选地，所述纤维束厚度小于显示器厚度并大于等于所述芯片厚度。纤维束的厚度大于等于芯片厚度可以对芯片和柔性基板起到一定的支撑作用，当芯片和纤维网格同时排布在一起，形成一体的柔性基板，由于纤维束具有柔韧性，使得柔性基板具有可卷曲的特性，便于大尺寸的显示屏的搬运和安装。
第二方面，本公开提供一种纤维机械增强的LED显示阵列制作方法，其中，包括如下步骤：
提供具有一定粘性的胶膜；
将芯片排布在所述胶膜的平面上，形成N行×M列显示阵列，胶膜周边固定绷紧在一个框架上；
将纤维束排布成N行×M行网格，所述N行×M行网格为网状结构，所述网状结构周边绷紧在另一个框架；
将带有纤维网格的框架与显示阵列所在框架对准贴合，所述纤维网格为 排布成网格结构的纤维束，纤维网格位于N行×M列显示阵列中芯片的间隙中，同时也粘附在胶膜上。
可选地，所述将芯片排布在所述胶膜的平面上，形成N行×M列显示阵列，胶膜周边固定绷紧在一个框架上，具体包括：
将芯片按照一定周期电极向下倒装排布在具有一定粘性的胶膜上，所述芯片包括LED发光芯片和CMOS驱动芯片。
可选地，在所述将带有纤维网格的框架与显示阵列所在框架对准贴合后，在两个贴合的框架上方涂布硅胶或其他有机胶体，硅胶固化后，将所述芯片和所述纤维网格形成一个整体的柔性平面。
可选地，在所述将所述芯片和所述纤维网格形成一个整体的柔性平面后，去除框架以及LED发光芯片和CMOS驱动芯片另一侧的胶膜，露出芯片的电极，采用半导体工艺对芯片电极进行互联。
可选地，通过外围驱动电路和电源根据显示图像每个像素的颜色和亮度来控制LED阵列中每个LED发光芯片的电流，控制LED三种颜色的亮度和配比，从而显示出图案。
与现有技术相比，本公开的有益效果在于：
1、纤维束使平面的机械强度大大增加，热膨胀减小，增加了可靠性，防止芯片间导电互联及芯片与驱动电路和电源互联导电线路在温度变化及机械冲击下断裂现象。
2、CMOS驱动芯片、LED发光芯片和纤维网格同时排布在一起，形成一体的柔性基板，无拼缝，成本低。采用有源驱动，功耗低、对比度高、灰度等级高，图像显示质量好。
3、由于纤维具有柔韧性，硅胶或有机胶体具有较好的弹性，这样形成的LED显示阵列具有可卷曲特性，便于大尺寸显示屏的搬运和安装。
4、在柔性基板另一面采用半导体工艺进行电极互联，效率高。
附图说明
图1为本公开的阵列结构示意图；
图2为LED发光芯片排布示意图；
图3为纤维束网格排布示意图；
图4为两个框架贴合示意图；
图5为灌注硅胶后的示意图；
图6为LED柔性基板示意图；
图7为LED柔性显示阵列行线制备示意图；
图8为LED柔性显示阵列列线制备示意图；
图9为有源驱动LED柔性显示阵列芯片布局示意图。
图标：1-LED发光芯片；2-有机胶膜；3-框架；4-网状结构；41-纤维束；5-纤维网格结构；6-硅胶或其他有机胶体；7-平面；8-电极面；9-行线；10-列线；11-CMOS驱动芯片。
具体实施方式
下面结合具体实施方式，进一步阐明本公开，应理解这些实施方式仅用于说明本公开而不用于限制本公开的范围，在阅读了本公开之后，本领域技术人员对本公开的各种等价形式的修改均落于本申请所附权利要求所限定的范围。
应注意到：相似的标号和字母在下面的附图中表示类似项，因此，一旦某一项在一个附图中被定义，则在随后的附图中不需要对其进行进一步定义和解释。
在本公开的描述中，需要说明的是，术语“竖直”、“外周面”等指示的方位或位置关系为基于附图所示的方位或位置关系，或者是该公开产品使用时惯常摆放的方位或位置关系，仅是为了便于描述本公开和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作， 因此不能理解为对本公开的限制。此外，术语“第一”、“第二”、“第三”等仅用于区分描述，而不能理解为指示或暗示相对重要性。
此外，术语“竖直”等术语并不表示要求部件绝对水平或悬垂，而是可以稍微倾斜。如“水平”仅仅是指其方向相对“竖直”而言更加水平，并不是表示该结构一定要完全水平，而是可以稍微倾斜。
在本公开的描述中，还需要说明的是，除非另有明确的规定和限定，术语“设置”、“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本公开中的具体含义。
如图1-图8所示出的一种纤维增强的LED显示阵列，包括：
平面7；芯片位于平面7；纤维束41分隔相邻两个芯片，纤维束41形成网状结构4，芯片与网状结构4之间留有间隙。
需要说明的是，纤维束41使平面的机械强度大大增加，热膨胀减小，增加了可靠性，防止芯片在温度变化及机械冲击下断裂现象；芯片和纤维网状结构4同时排布在一起，形成一体的柔性基板，无拼缝，成本低。
第一种实施例，以100吋P0.625 4K屏为例，一种纤维机械增强的LED显示阵列，包括平面7，芯片以及纤维束41，纤维束41组成网格状结构分割相邻两芯片，并形成纤维网状结构，芯片包括LED发光芯片1，可以理解的是，本实施例中芯片包括LED发光芯片，芯片与纤维网状结构4之间留有间隙。可以理解的是，本公开中的纤维网状结构为纤维网格。
在一些具体的实施方式中，LED发光芯片1和纤维束41通过硅胶或其他有机胶体6连接于平面7，形成无载板的柔性基板；LED发光芯片1和纤维束41处于一个平面7内，镶嵌于硅胶或其他有机胶体之中。
LED发光芯片1和纤维网格同时排布在一起，形成一体的柔性基板，无拼缝，成本低。由于纤维具有柔韧性，硅胶或其他有机胶体具有较好的弹性， 这样形成的LED显示阵列具有可卷曲特性，便于大尺寸显示屏的搬运和安装。
在一些具体实施方式中，柔性基板相对于芯片的一面进行所有芯片的电极互联工艺。可以理解的是，芯片包括LED发光芯片1。
纤维束41使平面7的机械强度大大增加，热膨胀减小，增加了可靠性，防止芯片间导电互联及芯片与驱动电路和电源互联导电线路在温度变化及机械冲击下断裂现象。在柔性基板另一面采用半导体工艺进行电极互联，效率高、成本低。
本公开提供一种纤维机械增强的LED显示阵列制作方法，包括如下步骤：
提供具有一定粘性的胶膜；
将芯片排布在胶膜的平面上，形成N行×M列显示阵列，胶膜周边固定绷紧在一个框架上；
将纤维束排布成N行×M行网格，N行×M行网格为网状结构，网状结构周边绷紧在另一个框架；
将带有纤维网格的框架与显示阵列所在框架对准贴合，纤维网格为排布成网格结构的纤维束，纤维网格位于N行×M列显示阵列中芯片的间隙中，同时也粘附在胶膜上。
下面关于纤维机械增强的LED显示阵列制作方法，具体包括如下步骤：
步骤一：参阅图2，LED发光芯片1按照依次转移方式、按次序芯片电极向下，按照N行×M列排列在具有一定粘度的有机胶膜2上，例如胶膜为有机胶膜2，例如，M和N可以为相同的数值，也可以是不同的数值；有机胶膜2优选聚对苯二甲酸乙二醇酯(PET，Polyethylene terephthalate)或聚酰亚胺(PI，Polyimide)膜，LED发光芯片1的排列周期为625um，具体根据显示屏4K分辨率3840×2160以及16：9的横向与纵向尺寸比例(4K屏幕标准)排布，将有机胶膜2周边绷紧固定在一个框架3上，例如，框架3的材料为不锈钢或铝合金。
步骤二：参阅图3，将直径为100微米的纤维束41按照周期625um排布成网格状网状结构4，周边绷紧固定在不锈钢或铝合金制成的另一个框架(图中未示出)上，形成纤维网格结构5，纤维网状结构4的空隙区域为LED发 光芯片1所在区域。纤维束由多根纤维丝集成一束。多根纤维丝集成为一束纤维束可以进一步提高纤维束整体的柔韧性；纤维束41可以是玻璃纤维、尼龙线或其他强度和韧性较大的纤维，在形成纤维网格结构5之前可以在纤维束41上预先裹好薄层硅胶或其他有机胶体，预固化；纤维束41厚度小于显示器厚度并大于等于芯片厚度。纤维束41的厚度大于等于芯片厚度可以对芯片起到一定的支撑作用，当芯片和纤维网格同时排布在一起，形成一体的柔性基板，由于纤维束具有柔韧性，使得柔性基板具有可卷曲的特性，便于大尺寸的显示屏的搬运和安装。
步骤三：参阅图4，将带有纤维网状结构4的纤维网格结构5与LED显示阵列所在芯片框架3对准贴合，纤维网状结构4位于P0.625mm 3840×2160阵列中LED发光芯片1的间隙中，同时也粘附在有机胶膜2上；
步骤四：参阅图5，在两个贴合的框架上方涂布硅胶或其他有机胶体6，使硅胶或其他有机胶体6渗透纤维网格，这里在两个贴合的框架上方涂布硅胶或其他有机胶体6的材料与预先在纤维束41上裹好薄层硅胶或其他有机胶体的材料相同；将两个贴合的框架形成的整个框架放入真空腔体抽真空除去硅胶或其他有机胶体6中的气泡，使硅胶与纤维网格和芯片表面充分接触，之后进行加热使硅胶固化，将LED发光芯片1和纤维网状结构4连接成一个机械结构稳定的CIF(Chip in Film)柔性平面7。纤维网格也就是纤维网状结构4使柔性平面7的机械强度大大增加，热膨胀减小，增加了可靠性，防止芯片间导电互联后在温度变化及机械冲击下断裂现象。由于纤维具有柔韧性，硅胶或其他有机胶体6具有较好的弹性，这样形成的LED显示阵列具有可卷曲特性，便于大尺寸显示屏的搬运和安装。柔性平面的总厚度为200um-5000um，纤维束41由于预先裹涂过硅胶，可以与柔性平面7中的硅胶或其他有机胶体6很好地融合；
步骤五：参阅图6，移除固定纤维网格的另一个框架，移除固定有机胶膜2的芯片框架3，揭去有机胶膜2使LED发光芯片1的电极所在电极面8暴露出；
步骤六：在柔性平面7的LED电极面8上涂敷或真空压合PIC光敏胶或其他 光刻胶，通过紫外线(UV)曝光和显影方法，去除LED发光芯片1电极上的PIC光敏胶，露出LED发光芯片1的P电极和N电极；
步骤七：参阅图7，在柔性基板的LED电极面8上进行LED显示阵列的行线9和列线10制备。通过丝网印刷的方式或其他半导体工艺制备阵列的金属行线9，金属材料为锡膏、银浆或铝等电阻率小、成本低廉的金属。也可以采用溅射或蒸发金属薄膜，再光刻腐蚀等工艺制备阵列的行线条；
步骤八：参阅图8，在第一层PIC光敏胶层和行线9上再涂敷或真空压合第二层PIC光敏胶作为行线9与列线10之间的电隔离层，再按照步骤六的方法露出行引线的引脚。然后再通过丝网印刷等方式制备阵列的金属列线10；
这样就形成了可以进行行列扫描的LED显示阵列，通过外围驱动电路和电源根据显示图像每个像素的颜色和亮度来控制LED阵列中每个LED发光芯片的电流，控制LED三种颜色的亮度和配比，从而显示出图案。
如图9所示出的另一实施例，以有源驱动100吋P0.625 4K屏为例：
一种纤维机械增强的LED显示阵列，包括平面7，芯片以及纤维束41，纤维束41组成网格状结构分割相邻两芯片，并形成纤维网状结构4，芯片包括LED发光芯片1和CMOS驱动芯片11，可以理解的是，本实施例中芯片包括LED发光芯片1和CMOS驱动芯片11，芯片与纤维网状结构4之间留有间隙。可以理解的是，本公开中的纤维网状结构为纤维网格。
在一些具体的实施例中，LED发光芯片1、CMOS驱动芯片11和纤维束41通过硅胶或其他有机胶体6连接于平面，形成无载板的柔性基板；LED发光芯片1、CMOS驱动芯片11和纤维束41处于一个平面内，镶嵌于硅胶之中。
CMOS驱动芯片11、LED发光芯片1和纤维网状结构4同时排布在一起，形成一体的柔性基板，无拼缝，成本低。由于纤维具有柔韧性，硅胶或其他有机胶体具有较好的弹性，这样形成的LED显示阵列具有可卷曲特性，便于大尺寸显示屏的搬运和安装。
在一些具体的实施方式中，柔性基板相对于芯片的一面进行所有芯片的电极互联工艺。可以理解的是，芯片包括LED发光芯片1和CMOS驱动芯片 11。
纤维束41使平面7的机械强度大大增加，热膨胀减小，增加了可靠性，防止芯片间导电互联及芯片与驱动电路和电源互联导电线路在温度变化及机械冲击下断裂现象。在柔性基板另一面采用半导体工艺进行电极互联，效率高、成本低。
在一些具体的实施方式中，纤维束41由多根纤维丝集成一束。多根纤维丝集成为一束纤维束可以进一步提高纤维束整体的柔韧性。
当然，纤维束41厚度小于显示器厚度并大于等于芯片厚度。纤维束41的厚度大于等于芯片厚度可以对芯片起到一定的支撑作用，当芯片和纤维网格同时排布在一起，形成一体的柔性基板，由于纤维束具有柔韧性，使得柔性基板具有可卷曲的特性，便于大尺寸的显示屏的搬运和安装。
本公开提供一种纤维机械增强的LED显示阵列制作方法，包括如下步骤：
提供具有一定粘性的胶膜；
将芯片排布在胶膜的平面上，形成N行×M列显示阵列，胶膜周边固定绷紧在一个框架上；
将纤维束排布成N行×M行网格，N行×M行网格为网状结构，网状结构周边绷紧在另一个框架；
将带有纤维网格的框架与显示阵列所在框架对准贴合，纤维网格为排布成网格结构的纤维束，纤维网格位于N行×M列显示阵列中芯片的间隙中，同时也粘附在胶膜上。
LED发光芯片1和CMOS驱动芯片11按照依次转移方式、芯片电极向下按照N行×M列排列在具有一定粘度的有机胶膜2上(PET或PI膜)，阵列周期为625um，根据显示屏4K分辨率3840×2160以及16：9的横向与纵向尺寸比例(4K屏幕标准)排布，将有机胶膜2周边绷紧固定在一个芯片框架3上(不锈钢或铝合金框架)。将直径为100微米的纤维束按照周期625um排布成纤维网状结构4，周边绷紧固定在另一个不锈钢或铝合金框架，形成纤维网格结构5，网状结构4空隙区域为LED发光芯片和CMOS芯片所在区域。按照实施例一中的方 法，将两个框架贴合、灌注硅胶、固化、去除框架和有机胶膜，LED发光芯片、CMOS驱动芯片以及纤维束通过硅胶形成一个整体的柔性基板。最后参照实施例一中行列引线和电隔离工艺进行有源驱动LED柔性显示屏的CMOS数据线引线、控制线引线、LED电源引线、接地引线以及每层引线之间的电绝缘工艺，最终实现图像显示。
以上所述仅为本公开的优选实施例，凡依本公开权利要求所做的均等变化与修饰，都应属本公开的涵盖范围。

Claims (12)

  1. 一种纤维增强的LED显示阵列，其中，包括：
    平面；
    芯片，所述芯片位于所述平面；
    纤维束，所述纤维束分隔相邻两个所述芯片，所述纤维束形成网状结构，所述芯片与所述网状结构之间留有间隙。
  2. 根据权利要求1所述的纤维增强的LED显示阵列，其中，所述芯片包括LED发光芯片；
    所述LED发光芯片矩阵阵列于所述平面。
  3. 根据权利要求2所述的纤维增强的LED显示阵列，其中，所述芯片还包括CMOS驱动芯片；
    所述CMOS驱动芯片矩阵阵列于所述平面。
  4. 根据权利要求3所述的纤维增强的LED显示阵列，其中，所述LED发光芯片、所述CMOS驱动芯片和所述纤维束通过硅胶或其他有机胶体连接于所述平面，形成无载板的柔性基板；所述LED发光芯片、所述CMOS驱动芯片和所述纤维束处于一个平面内，镶嵌于硅胶之中。
  5. 根据权利要求4所述的纤维增强的LED显示阵列，其中，所述柔性基板相对于所述芯片的一面进行所有芯片的电极互联工艺。
  6. 根据权利要求1-5任一项所述的纤维增强的LED显示阵列，其中，所述纤维束由多根纤维丝集成一束。
  7. 根据权利要求1-3任一项所述的纤维增强的LED显示阵列，其中，所述纤维束厚度小于显示器厚度并大于等于所述芯片厚度。
  8. 一种纤维机械增强的LED显示阵列制作方法，其中，包括如下步骤：
    提供具有一定粘性的胶膜；
    将芯片排布在所述胶膜的平面上，形成N行×M列显示阵列，胶膜周边固定绷紧在一个框架上；
    将纤维束排布成N行×M行网格，所述N行×M行网格为网状结构，所述网状结构周边绷紧在另一个框架；
    将带有纤维网格的框架与显示阵列所在框架对准贴合，所述纤维网格为排布成网格结构的纤维束，纤维网格位于N行×M列显示阵列中芯片的间隙中，同时也粘附在胶膜上。
  9. 根据权利要求8所述的制作方法，其中，所述将芯片排布在所述胶膜的平面上，形成N行×M列显示阵列，胶膜周边固定绷紧在一个框架上，具体包括：
    将芯片按照一定周期电极向下倒装排布在具有一定粘性的胶膜上，所述芯片包括LED发光芯片和CMOS驱动芯片。
  10. 根据权利要求9所述的制作方法，其中，在所述将带有纤维网格的框架与显示阵列所在框架对准贴合后，在两个贴合的框架上方涂布硅胶或其他有机胶体，硅胶固化后，将所述芯片和所述纤维网格形成一个整体的柔性平面。
  11. 根据权利要求10所述的制作方法，其中，在所述将所述芯片和所述纤维网格形成一个整体的柔性平面后，去除框架以及LED发光芯片和CMOS驱动芯片另一侧的胶膜，露出芯片的电极，采用半导体工艺对芯片电极进行互联。
  12. 根据权利要求11所述的制作方法，其中，通过外围驱动电路和电源根据显示图像每个像素的颜色和亮度来控制LED阵列中每个LED发光芯片的电流，控制LED三种颜色的亮度和配比，从而显示出图案。
PCT/CN2022/098152 2021-06-16 2022-06-10 一种纤维机械增强的led显示阵列以及制作方法 WO2022262654A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202110668235.8A CN113410222A (zh) 2021-06-16 2021-06-16 一种纤维机械增强的led显示阵列以及制作方法
CN202110668235.8 2021-06-16

Publications (1)

Publication Number Publication Date
WO2022262654A1 true WO2022262654A1 (zh) 2022-12-22

Family

ID=77684517

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2022/098152 WO2022262654A1 (zh) 2021-06-16 2022-06-10 一种纤维机械增强的led显示阵列以及制作方法

Country Status (2)

Country Link
CN (1) CN113410222A (zh)
WO (1) WO2022262654A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113410222A (zh) * 2021-06-16 2021-09-17 南京阿吉必信息科技有限公司 一种纤维机械增强的led显示阵列以及制作方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103325926A (zh) * 2013-06-19 2013-09-25 华中科技大学 一种用于板上芯片led封装结构及其荧光粉涂覆方法
CN108230934A (zh) * 2018-03-12 2018-06-29 深圳市洲明科技股份有限公司 一种led显示屏及其制备方法
CN108417603A (zh) * 2018-02-27 2018-08-17 上海天马微电子有限公司 一种显示面板和显示装置
CN109524437A (zh) * 2018-10-16 2019-03-26 云谷（固安）科技有限公司 Oled结构及其制备方法、显示面板以及电子设备
CN113410222A (zh) * 2021-06-16 2021-09-17 南京阿吉必信息科技有限公司 一种纤维机械增强的led显示阵列以及制作方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103325926A (zh) * 2013-06-19 2013-09-25 华中科技大学 一种用于板上芯片led封装结构及其荧光粉涂覆方法
CN108417603A (zh) * 2018-02-27 2018-08-17 上海天马微电子有限公司 一种显示面板和显示装置
CN108230934A (zh) * 2018-03-12 2018-06-29 深圳市洲明科技股份有限公司 一种led显示屏及其制备方法
CN109524437A (zh) * 2018-10-16 2019-03-26 云谷（固安）科技有限公司 Oled结构及其制备方法、显示面板以及电子设备
CN113410222A (zh) * 2021-06-16 2021-09-17 南京阿吉必信息科技有限公司 一种纤维机械增强的led显示阵列以及制作方法

Also Published As

Publication number Publication date
CN113410222A (zh) 2021-09-17

Similar Documents

Publication Publication Date Title
US11489037B2 (en) Tiled displays with black-matrix support screens
US10381430B2 (en) Redistribution layer for substrate contacts
US20190027534A1 (en) Iled displays with substrate holes
CN107078132B (zh) 硅基彩色iled显示器
WO2022022044A1 (zh) Led芯片封装模块、显示屏及其制作方法
JP2022000705A (ja) 表示装置
CN109888085B (zh) 显示面板及其制备方法
WO2021160090A1 (zh) 显示面板以及显示装置
WO2021160089A1 (zh) 显示面板以及显示装置
US10403613B2 (en) Micro LED display module having light transmissive substrate
CN111081158A (zh) 拼接式显示屏及其制备方法、显示装置
EP3772752B1 (en) Display apparatus and manufacturing method thereof
US10403614B2 (en) Micro LED display module
WO2021139626A1 (zh) 显示基板、拼接显示面板及显示装置
EP3815144B1 (en) Manufacturing method of a display apparatus
WO2022262654A1 (zh) 一种纤维机械增强的led显示阵列以及制作方法
US11031380B2 (en) Manufacturing method of micro LED display module
US20210033900A1 (en) Modular flat panel display
US11817434B2 (en) Displays with embedded light emitters
US11961947B2 (en) Substrate for manufacturing display device, display device and manufacturing method thereof
KR102559945B1 (ko) 발광모듈, 발광 캐비닛 및 표시장치
US20230027671A1 (en) Display module and display apparatus including the same
US20220208747A1 (en) Display device and manufacturing method thereof
US11031523B2 (en) Manufacturing method of micro LED display module
US20240038940A1 (en) Transfer substrate used in manufacture of display apparatus, display apparatus, and manufacturing method for display apparatus

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 22824134

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE