WO2022262637A1 - 印刷电路板结构及电子设备 - Google Patents
印刷电路板结构及电子设备 Download PDFInfo
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- WO2022262637A1 WO2022262637A1 PCT/CN2022/097858 CN2022097858W WO2022262637A1 WO 2022262637 A1 WO2022262637 A1 WO 2022262637A1 CN 2022097858 W CN2022097858 W CN 2022097858W WO 2022262637 A1 WO2022262637 A1 WO 2022262637A1
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- Prior art keywords
- circuit board
- substrate
- printed circuit
- board
- structure according
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims abstract description 74
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 26
- 238000003860 storage Methods 0.000 claims description 7
- 230000002787 reinforcement Effects 0.000 claims description 4
- 239000003351 stiffener Substances 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 6
- 230000004308 accommodation Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
Definitions
- the application belongs to the technical field of electronic equipment, and in particular relates to a printed circuit board structure and electronic equipment.
- the purpose of the embodiments of the present application is to provide a printed circuit board structure and electronic equipment, which can solve the problem in the related art that the layout of electronic components on the printed circuit board is limited.
- the embodiment of the present application provides a printed circuit board structure, including a first circuit board and a second circuit board, at least one second circuit board is provided on at least one side of the first circuit board;
- the second circuit board includes a substrate and a reinforcing rib connected to the periphery of the substrate, the reinforcing rib forms a receiving cavity with the substrate, and the reinforcing rib encloses and forms a side wall of the receiving cavity,
- the reinforcing rib is connected to the target circuit board, and the target circuit board is the first circuit board or the second circuit board; the side of the first circuit board facing the second circuit board is provided with a second An electronic component, the first electronic component is located in the accommodating cavity, the side of the substrate facing away from the first circuit board is connected to the first shielding case or the second circuit board, and the The side of the substrate facing away from the first circuit board is provided with second electronic components, and the second electronic components are located in the first shielding case or located in the second circuit connected to the substrate. inside the housing of the board.
- the embodiment of the present application further provides an electronic device, including the printed circuit board structure as described in the first aspect.
- the receiving cavity is formed by enclosing the reinforcing rib on one side of the second circuit board, and the first electronic components arranged on the first circuit board can also be accommodated in the second circuit board.
- the first circuit board and the second circuit board can realize the stacking design of printed circuit boards , so that the printed circuit board structure can lay out more electronic components, avoiding the problem that the layout of electronic components is limited due to the increase in battery size.
- Fig. 1 is one of the schematic diagrams of a printed circuit board structure provided by the embodiment of the present application.
- Fig. 2 is a schematic diagram of the size of the pads on the ribs and the size of the pads on the existing intermediate connection frame PCB in a printed circuit board structure provided by the embodiment of the present application;
- Fig. 3 is one of the partial schematic diagrams of a printed circuit board structure provided by the embodiment of the present application.
- Fig. 4 is the second partial schematic diagram of a printed circuit board structure provided by the embodiment of the present application.
- Fig. 5 is the second schematic diagram of a printed circuit board structure provided by the embodiment of the present application.
- Fig. 6 is the third schematic diagram of a printed circuit board structure provided by the embodiment of the present application.
- Fig. 7 is a schematic diagram of a second circuit board in a printed circuit board structure provided by an embodiment of the present application.
- FIG. 8 is a fourth schematic diagram of a printed circuit board structure provided by an embodiment of the present application.
- the embodiment of the present application provides a printed circuit board structure.
- the printed circuit board structure provided by the embodiment of the present application includes a first circuit board 10 and a second circuit board 20, at least one side of the first circuit board 10 is provided with at least one second circuit plate 20.
- a second circuit board 20 may be provided on one side of the first circuit board 10; or a second circuit board 20 may be provided on both sides of the first circuit board 10. board 20; or it can also be that one side of the first circuit board 10 is provided with two second circuit boards 20 side by side, or one side of the first circuit board 10 is provided with a second circuit board 20, the second The side of the circuit board 20 facing away from the first circuit board 10 is provided with another second circuit board 20 and so on.
- the possible arrangements of the first circuit board 10 and the at least one second circuit board 20 include various solutions, which are not listed here in this embodiment of the present application.
- first circuit board 10 and the second circuit board 20 in the embodiment of the present application are both printed circuit boards (Printed Circuit Board, PCB).
- the second circuit board 20 includes a substrate 22 and a rib 21 connected to the periphery of the substrate 22, the rib 21 and the substrate 22 form a receiving cavity 200, and the rib 21 surrounds and forms The side wall of the receiving cavity 200, the reinforcing rib 21 is connected with the target circuit board, and the target circuit board is the first circuit board 10 or the second circuit board 20;
- There is a first electronic component 101 the first electronic component 101 is located in the housing cavity 200, and the side of the substrate 22 facing away from the first circuit board 10 is connected with the first shielding case 31 or the second circuit board 20 , and the side of the substrate 22 facing away from the first circuit board 10 is provided with a second electronic component 201, and the second electronic component 201 is located in the first shielding case 31 or on the second circuit board connected to the substrate 22 20 in the accommodation chamber 200.
- the base plate 22 and the rib 21 can be integrally formed, for example, one side of the second circuit board 20 can be hollowed out to form at least one receiving cavity 200, and the side wall of the receiving cavity 200 can also be The ribs 21 are formed. In this way, there is no need to connect the ribs 21 and the substrate 22 through solder balls, which saves the manufacturing process and hardware cost of the printed circuit board structure.
- At least one receiving cavity 200 is formed on one side of the second circuit board 20 , and three receiving cavities 200 are formed as shown in FIG. 7 .
- the ribs 21 forming the receiving cavity 200 are used to connect with the first circuit board 10 or the second circuit board 20 , for example, through solder balls.
- a second circuit board 20 is provided on one side of the first circuit board 10, and the ribs 21 of the first circuit board 10 and the second circuit board 20 are connected by solder balls.
- the installed first electronic components 101 can also be accommodated in the accommodation cavity 200 formed by the second circuit board 20 .
- the second circuit board 20 is welded on the target circuit board (such as the first circuit board 10 or the second circuit board 20) through the reinforcing rib 21, and the reinforcing rib 21 is provided with pads for welding solder balls.
- the size of the pads on the ribs 21 in the embodiment of the present application can be designed to be smaller.
- FIG. 2 A shows the size and layout of the solder pads on the existing intermediate connection frame PCB board in FIG. 2, and B shows the ribs in the second circuit board 20 provided by the embodiment of the present application. 21 pad size and arrangement.
- This application can be the application of laser hole technology on the High Density Interconnector (HDI) board.
- HDI High Density Interconnector
- the size of the pad between the rib 21 and the target circuit board is compared to that of the existing middle
- the size of the pads on the connection frame PCB board is smaller, for example, from the existing 0.4mm to 0.275mm, reducing the size by more than 30%.
- the width of the reinforcing rib 21 can be designed to be smaller, compared to the width of the existing intermediate connection frame PCB board, which is reduced by more than 20% (for example: 2.4mm is reduced to 1.9mm), and then it can be Reducing the area occupied by the ribs 21 on the target circuit board allows more electronic components to be laid out on the target circuit board, and furthermore, the layout space of the electronic components in the printed circuit board structure is larger.
- the number of the second circuit board 20 is at least one, and the first electronic components 101 on the first circuit board 10 are arranged on the side where the second circuit board 20 is connected.
- the number of the second circuit board 20 is one, and the first circuit board 10 may be provided with a first electronic component 101 on one side, and the first electronic component 101 is accommodated in the receiving cavity 200 of the second circuit board 20, Furthermore, a stacking design of two circuit boards can be realized.
- the number of the second circuit board 20 is two, and the front and back sides of the first circuit board 10 can be provided with the first electronic components 101, and then the front and back sides of the first circuit board 10 are respectively connected with A second circuit board 20, thus realizing the stacking design of three circuit boards.
- a second electronic component 201 is provided on the side of the second circuit board 20 facing away from the first circuit board 10, and the second electronic component 201 may be housed in the first shielding case 31 or housed in It is in another receiving cavity 200 of the second circuit board 20 .
- two second circuit boards 20 are stacked on one side of the first circuit board 10, and the second electronic components 201 on the second circuit board 20 in the middle are also accommodated in another second circuit board 20.
- the side of the second circuit board 20 located at the outermost side facing away from the first circuit board 10 is connected with a first shielding cover 31, and the second electronic components 201 on the second circuit board 20 are accommodated in the second circuit board 20.
- Inside a shielding case 31 In this way, the stacking design of multiple second circuit boards 20 and the first circuit board 10 can be realized, and the layout space of electronic components in the electronic device can be further improved.
- the rib 21 of the second circuit board 20 includes a first connecting portion 211 and a second connecting portion 212, the first connecting portion 211 and the second connecting portion 212 are connected to the substrate 22, the first connecting portion The portion 211 is perpendicular to the substrate 22 , and the second connecting portion 212 is located on a side of the first connecting portion 211 facing the receiving cavity 200 and protrudes toward the receiving cavity 200 .
- both the first connecting portion 211 and the second connecting portion 212 are connected to the substrate 22, the second connecting portion 212 is at least connected to the top of the first connecting portion 211, and the second connecting portion 212 protrudes toward the inside of the receiving cavity 200, Furthermore, the protruding second connecting portion 212 connects both the first connecting portion 211 and the substrate 22, and can support the substrate 22 and the first connecting portion 211, so as to strengthen the vertical connection between the first connecting portion 211 and the substrate 22. The strength between the first connecting portion 211 and the substrate 22 is ensured.
- the first connecting portion 211 includes a first side 2111 facing the storage cavity 200
- the second connecting portion 212 includes a second side (not marked) facing the storage cavity 200
- the substrate 22 includes a third side facing the storage cavity 200 221
- two ends of the second side are respectively connected to the first side 2111 and the third side 221
- the first side 2111 is perpendicular to the third side 221
- the second side is inclined relative to the first side 2111
- the second side can be an inclined plane (as shown in FIG. 3 ), or can also be an arc.
- the second connecting portion 212 is inclined relative to the first connecting portion 211 and the substrate 22, and the setting of the second connecting portion 212 can also enhance the strength between the vertically arranged first connecting portion 211 and the substrate 22. .
- the second side includes connected first sub-sides 2121 and second sub-sides 2122, the first sub-side 2121 is connected to the first side 2111 and is perpendicular to the first side 2111, and the second sub-side 2122 is connected
- the third side 221 is perpendicular to the third side 221 .
- the second connecting part 212 is a small square arranged on the top of the first connecting part 211, and the small square is also connected to the substrate 22, so that the connection between the vertically arranged first connecting part 211 and the substrate 22 can be strengthened. Strength of.
- the second connecting portion 212 may also have other shapes, which are not specifically limited in this embodiment of the present application.
- the second circuit board 20 includes a plurality of reinforcing ribs 21, and the second connecting portion 212 provided at the connection between different reinforcing ribs 21 and the substrate 22 may have the same shape or different shapes, This embodiment of the present application does not specifically limit it.
- the height of the first electronic component 101 or the second electronic component 201 located below the second connecting portion 212 corresponds to the characteristics of the second connecting portion 212 provided at the corner of the rib 21 and the substrate 22. smaller.
- the height of the electronic components 1011 below the second connecting portion 212 should be smaller than the height of the electronic components 1012 not located below the second connecting portion 212, and then to ensure the location area There is a certain safety gap between the electronic components 1011 and the second connecting portion 212 to ensure the normal use of the electronic components 1011 .
- the base plate 22 also includes a reinforcing plate 23 extending into the housing cavity 200, and the end of the reinforcing plate 23 away from the base plate 22 is connected to the target circuit board, that is, to the first circuit board 10 or to another The second circuit board 20 is connected. It can be understood that the side of the substrate 22 facing away from the housing cavity 200 is used for setting the second electronic components 201. When the number of the second electronic components 201 is large, the weight to be carried by the substrate 22 will increase accordingly.
- the arrangement of the plate 23 can play a certain role in supporting the substrate 22 . Please refer to FIG.
- the first circuit board 10 is provided with a first electronic component 101 accommodated in the receiving cavity 200 of the second circuit board 20, and the first electronic component
- the first circuit board 10 will be pressed down, and the substrate 22 connected to the first circuit board 10 is arranged on the substrate 22, so that the first circuit board 10 can be pushed upward to a certain extent accordingly.
- the pulling force is used to buffer the downward deformation of the first circuit board 10 .
- the setting of reinforcing plate 23 also can play a supporting and stable effect on the first circuit board 10 and the substrate 22, so as to avoid the deformation of the first circuit board 10 and the substrate 22, and ensure that the electronic components and the first circuit board 10 Or a safety gap between substrates 22 .
- corresponding soldering pads are provided at positions corresponding to the reinforcing board 23 on the reinforcing board 23 and the target circuit board, and the connection is realized by printing solder.
- the shape and quantity of the welding pads can be designed in many different ways according to the shape and size of the stiffener 23 , including but not limited to circle, square, ring, rectangle and so on.
- the shape of the stiffener 23 can also be designed into a variety of different shapes according to the layout of the electronic components on the target circuit board, including but not limited to: cuboid, cylinder, cone, L-shaped body and so on.
- the multiple reinforcement boards 23 are arranged at intervals to further support and stabilize the first circuit board 10 and the base plate 22 .
- the side of the substrate 22 facing away from the storage cavity 200 is also connected with a board-to-board connector 40 , and the board-to-board connector 40 is located at Outside the first shielding case 31, the side of the board-to-board connector 40 facing away from the substrate 22 is flush with the side of the first shielding case 31 facing away from the substrate 22, or located on the side of the first shielding case 31 facing away from the substrate 22. under the side. That is to say, the height of the board-to-board connector 40 does not protrude beyond the first shielding case 31 to avoid increasing the overall height of the printed circuit board structure.
- the substrate 22 includes a first region 222 connecting the board-to-board connector 40 and a second region 223 other than the first region 222 , and the height of the second region 223 in the thickness direction of the substrate 22 is greater than that of the first region 222 .
- a height of a region 222 in the thickness direction of the substrate 22 that is to say, the side of the substrate 22 facing away from the housing cavity 200 is designed in a stepped shape, the first shielding cover 31 is arranged in the second area 223 with a higher height, and the board-to-board connector 40 is arranged in the first area with a shorter height. region 222, so that the height of the board-to-board connector 40 can be prevented from exceeding the first shielding case 31, so as to avoid increasing the overall height of the printed circuit board structure.
- the board-to-board connector 40 may be connected to the main board of the electronic device through the flexible circuit board 41 .
- a third electronic component (not shown) is disposed on the side of the substrate 22 facing the receiving cavity 200 . That is to say, electronic components are provided on both front and back sides of the substrate 22 , and the third electronic component is accommodated in the accommodation cavity 200 .
- the layout space on the substrate 22 and the layout space in the accommodating cavity 200 can be effectively utilized, and more electronic components can be laid out in the printed circuit board structure without increasing the size of the printed circuit board structure. , effectively utilizing the space of the printed circuit board structure.
- one side of the first circuit board 10 is provided with the second circuit board 20, and the other side of the first circuit board 10 board is provided with the second shield 32, and the other side of the first circuit board 10
- a fourth electronic component 102 accommodated in the second shielding case 32 is provided on one side. That is to say, electronic components can be arranged on the front and back sides of the first circuit board 10 , so as to effectively utilize the layout space on the first circuit board 10 , so that more electronic components can be laid out in the printed circuit board structure.
- both the first shielding case 31 and the second shielding case 32 are metal shielding cases, so as to avoid the interference of external electric field, magnetic field or electromagnetic field on the electronic components in the metal shielding case.
- the embodiment of the present application also provides an electronic device, the electronic device includes the printed circuit board structure described in the above embodiment. It should be noted that the electronic device includes all the technical features of the printed circuit board structure in the above-mentioned embodiments, and can achieve the same technical effect. To avoid repetition, details are not repeated here.
- electronic devices include but are not limited to electronic products such as mobile phones, tablet computers, notebook computers, desktop computers, and smart wearable devices.
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Abstract
本申请公开了一种印刷电路板结构及电子设备，属于电子设备领域。其中，印刷电路板结构包括第一电路板及第二电路板，第一电路板的至少一个侧面上设有至少一个第二电路板；第二电路板包括基板及连接在基板周沿的加强筋，加强筋与基板形成收容腔，且所述加强筋围合形成收容腔的侧壁，所述加强筋与目标电路板连接，目标电路板为第一电路板或第二电路板；第一电路板的朝向第二电路板的侧面上设有第一电子元器件，第一电子元器件位于收容腔内，基板的背对第一电路板的一侧连接有第一屏蔽罩或第二电路板，且基板的背对第一电路板的一侧设有第二电子元器件，第二电子元器件位于所述第一屏蔽罩内或位于与所述基板连接的所述第二电路板的收容腔内。
Description
相关申请的交叉引用
本申请主张在2021年06月16日在中国提交的中国专利申请No.202110664399.3的优先权，其全部内容通过引用包含于此。
本申请属于电子设备技术领域，具体涉及一种印刷电路板结构及电子设备。
随着通信技术的发展和用户需求的提升，手机、平板电脑等电子设备的功能越来越多，电子设备印刷电路板上需要承载的电子元器件也越来越多，造成电子设备的功耗也相应增加，对于电池容量与尺寸的要求也越来越大，这也就导致电子设备内留给印刷电路板的空间也越来越小，电子元器件的布局受到限制。
发明内容
本申请实施例的目的是提供一种印刷电路板结构及电子设备，能够解决相关技术中，印刷电路板上电子元器件的布局受到限制的问题。
第一方面，本申请实施例提供了一种印刷电路板结构，包括第一电路板及第二电路板，所述第一电路板的至少一个侧面上设有至少一个所述第二电路板；
其中，所述第二电路板包括基板及连接在所述基板周沿的加强筋，所述加强筋与所述基板形成收容腔，且所述加强筋围合形成所述收容腔的侧壁，所述加强筋与目标电路板连接，所述目标电路板为所述第一电路板或所述第二电路板；所述第一电路板的朝向所述第二电路板的侧面上设有第一电子元器件，所述第一电子元器件位于所述收容腔内，所述基板的背对所述第一电路板的一侧连接有第一屏蔽罩或所述第二电路板，且所述基板的背对所述第 一电路板的一侧设有第二电子元器件，所述第二电子元器件位于所述第一屏蔽罩内或位于与所述基板连接的所述第二电路板的收容腔内。
第二方面，本申请实施例还提供了一种电子设备，包括如第一方面所述的印刷电路板结构。
本申请实施例提供的技术方案中，通过加强筋在第二电路板的一侧围合形成收容腔，第一电路板上设置的第一电子元器件也就能够收容在第二电路板形成的收容腔内，这样也就无需再额外通过单独的中间连接框架PCB板作为两个电路板之间的连接器件进行连接，使得第一电路板和第二电路板就能够实现印刷电路板的堆叠设计，使得印刷电路板结构能够布局更多的电子元器件，避免电子元器件的布局因电池尺寸增大而被限制的问题。
图1是本申请实施例提供的一种印刷电路板结构的示意图之一；
图2是本申请实施例提供的一种印刷电路板结构中加强筋上焊盘尺寸与现有中间连接框架PCB板上焊盘尺寸的示意图；
图3是本申请实施例提供的一种印刷电路板结构的局部示意图之一；
图4是本申请实施例提供的一种印刷电路板结构的局部示意图之二；
图5是本申请实施例提供的一种印刷电路板结构的示意图之二；
图6是本申请实施例提供的一种印刷电路板结构的示意图之三；
图7是本申请实施例提供的一种印刷电路板结构中第二电路板的示意图；
图8是本申请实施例提供的一种印刷电路板结构的示意图之四。
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请的说明书和权利要求书中的术语“第一”、“第二”等是用于区别类似的对象，而不用于描述特定的顺序或先后次序。应该理解这样使用的数 据在适当情况下可以互换，以便本申请的实施例能够以除了在这里图示或描述的那些以外的顺序实施，且“第一”、“第二”等所区分的对象通常为一类，并不限定对象的个数，例如第一对象可以是一个，也可以是多个。此外，说明书以及权利要求中“和/或”表示所连接对象的至少其中之一，字符“/”，一般表示前后关联对象是一种“或”的关系。
本申请实施例提供了一种印刷电路板结构。
请参照图1至图8，本申请实施例提供的印刷电路板结构包括第一电路板10及第二电路板20，第一电路板10的至少一个侧面上设有至少一个所述第二电路板20。例如图1所示，可以是第一电路板10的其中一个侧面上设有一个第二电路板20；或者也可以是第一电路板10的正反两个侧面上都设有一个第二电路板20；或者还可以是第一电路板10的一个侧面上并排设有两个第二电路板20，或者是第一电路板10的一个侧面上设有一个第二电路板20，该第二电路板20的背对第一电路板10的一侧设有另一个第二电路板20，等等。可以理解地，第一电路板10及至少一个第二电路板20的可能设置形式包括多种方案，本申请实施例在此不做一一列举。
需要说明的是，本申请实施例中的第一电路板10及第二电路板20均为印刷电路板(Printed Circuit Board，PCB)。
请参照图1和图7，第二电路板20包括基板22及连接在所述基板22周沿的加强筋21，加强筋21与基板22形成收容腔200，且所述加强筋21围合形成收容腔200的侧壁，加强筋21与目标电路板连接，所述目标电路板为第一电路板10或第二电路板20；第一电路板10的朝向第二电路板20的侧面上设有第一电子元器件101，第一电子元器件101位于所述收容腔200内，所述基板22的背对第一电路板10的一侧连接有第一屏蔽罩31或第二电路板20，且所述基板22的背对第一电路板10的一侧设有第二电子元器件201，第二电子元器件201位于第一屏蔽罩31内或位于与基板22连接的第二电路板20的收容腔200内。
本申请实施例中，基板22与加强筋21可以是一体成型，例如可以是对 第二电路板20的一侧进行挖空处理以形成至少一个收容腔200，进而收容腔200的侧壁也就形成了所述加强筋21。这样，加强筋21与基板22之间也就无需再通过焊球来进行连接，节省了印刷电路板结构的制造工艺和硬件成本。
可选地，第二电路板20的一侧形成有至少一个收容腔200，如图7所示形成有三个收容腔200。其中，形成收容腔200的加强筋21用于与第一电路板10连接或与第二电路板20连接，例如可以是通过焊球连接。如图1所示，第一电路板10的一侧设有第二电路板20，该第一电路板10与该第二电路板20的加强筋21通过焊球连接，第一电路板10上设置的第一电子元器件101也就能够收容在第二电路板20形成的收容腔200内。这样，也就无需再额外通过单独的中间连接框架PCB板作为两个电路板之间的连接器件进行连接，通过在第二电路板20的一侧形成能够收容电子元器件的收容腔200，使得第一电路板10和第二电路板20就能够实现印刷电路板的堆叠设计，节省了堆叠设计的印刷电路板的硬件成本。
另外，通过在第二电路板20的一侧形成收容腔200，使得第二电路板20通过加强筋21焊接在目标电路板(如第一电路板10或第二电路板20)上，加强筋21上设置有用于焊接焊球的焊盘，相比于现有的中间连接框架PCB板上的焊盘，本申请实施例中加强筋21上的焊盘尺寸可以设计得更小。
请参照图2，图2中A所示为现有的中间连接框架PCB板上的焊盘尺寸及排布，图2中B所示为本申请实施例提供的第二电路板20中加强筋21上的焊盘尺寸及排布。本申请可以是应用高密度互连(High Density Interconnector，HDI)板上的激光孔技术，从图2中可以看出，加强筋21与目标电路板之间焊盘尺寸相比于现有的中间连接框架PCB板上的焊盘尺寸更小，例如从现有的0.4mm减小到0.275mm，减小超过30％的尺寸。这样，也就能够将加强筋21的宽度设计的更小，相比于现有的中间连接框架PCB板的宽度减小超过20％(例如：2.4mm减小到1.9mm)，进而也就能够减小加强筋21在目标电路板上所占用的面积，使得目标电路板上能够布局更多的电子元器件，进而印刷电路板结构整体的电子元器件的布局空间也就更大。
本申请实施例中，第二电路板20的数量为至少一个，第一电路板10上的第一电子元器件101设置在连接有第二电路板20的一侧。例如，第二电路板20的数量为一个，第一电路板10可以是一侧设置有第一电子元器件101，该第一电子元器件101收容在第二电路板20的收容腔200中，进而以实现两个电路板的堆叠设计。或者，第二电路板20的数量为两个，第一电路板10的正反两侧都可以是设置有第一电子元器件101，进而第一电路板10的正反两侧都各连接有一个第二电路板20，这样也就实现了三个电路板的堆叠设计。
需要说明的是，第二电路板20的背对第一电路板10的一侧设有第二电子元器件201，该第二电子元器件201可以是收容在第一屏蔽罩31内或者是收容在另一个第二电路板20的收容腔200内。例如，第一电路板10的一侧堆叠有两个第二电路板20，则位于中间的第二电路板20上的第二电子元器件201也就收容在另一个第二电路板20的收容腔200中，位于最外侧的第二电路板20的背对第一电路板10的一侧连接有第一屏蔽罩31，该第二电路板20上的第二电子元器件201收容在该第一屏蔽罩31内。这样，也就能够实现多个第二电路板20与第一电路板10的堆叠设计，也就能够进一步提升电子设备内电子元器件的布局空间。
请参照图3至图6，第二电路板20的加强筋21包括第一连接部211及第二连接部212，第一连接部211及第二连接部212均与基板22连接，第一连接部211垂直基板22，第二连接部212位于第一连接部211的朝向收容腔200的一侧，且向收容腔200的方向凸出。其中，第一连接部211和第二连接部212都与基板22连接，则第二连接部212至少与第一连接部211的顶部连接，且第二连接部212朝向收容腔200内凸出，进而凸出的第二连接部212既连接第一连接部211也连接基板22，能够对基板22及第一连接部211起到支撑作用，以增强垂直连接的第一连接部211与基板22之间的强度，确保第一连接部211与基板22的稳固性。
可选地，第一连接部211包括朝向收容腔200的第一侧面2111，第二连接部212包括朝向收容腔200的第二侧面(未标示)，基板22包括朝向收容 腔200的第三侧面221，第二侧面的两端分别连接第一侧面2111及第三侧面221，第一侧面2111与第三侧面221垂直，第二侧面相对于第一侧面2111倾斜设置。可选地，第二侧面相对于第一侧面2111可以是斜面(如图3所示)，或者也可以是弧面。这样，第二连接部212相对于第一连接部211及基板22都是倾斜设置的，进而第二连接部212的设置也就能够增强垂直设置的第一连接部211与基板22之间的强度。
或者，请参照图4，第二侧面包括相连接的第一子侧面2121及第二子侧面2122，第一子侧面2121连接第一侧面2111且与第一侧面2111垂直，第二子侧面2122连接第三侧面221且与第三侧面221垂直。也就是说，第二连接部212为设置在第一连接部211顶部的一小方块，且该小方块也连接基板22，这样也就能够增强垂直设置的第一连接部211与基板22之间的强度。
可选地，第二连接部212还可以是其他的形状，本申请实施例对此不做具体限定。需要说明的是，第二电路板20包括多个加强筋21，进而不同的加强筋21与基板22的连接处设置的第二连接部212可以是一样的形状，或者也可以是不同的形状，本申请实施例对此也不做具体限定。
可以理解地，对应于加强筋21与基板22的拐角处设置的第二连接部212的特点，位于该第二连接部212下方的第一电子元器件101或第二电子元器件201的高度相应较小。请参照图5，第二连接部212下方的电子元器件1011的高度(例如高度小于等于0.7mm)，要小于不位于第二连接部212下方电子元器件1012的高度，进而以确保该位置区域的电子元器件1011与第二连接部212之间具有一定的安全间隙，保障电子元器件1011的正常使用。
请参照图6和图7，基板22还包括向收容腔200内延伸的增强板23，增强板23的远离基板22的一端与目标电路板连接，也即与第一电路板10或与另一个第二电路板20连接。可以理解地，基板22的背对收容腔200的一侧用于设置第二电子元器件201，当第二电子元器件201的数量较多时，基板22所需要承载的重量也就相应增加，增强板23的设置能够对基板22起到一定的支撑作用。请参照图6，以目标电路板是第一电路板10为例，第一电路 板10上设有收容在第二电路板20的收容腔200内的第一电子元器件101，第一电子元器件101数量较多时，也就会将第一电路板10向下压，而在基板22上设置连接第一电路板10的基板22，也就能够相应地对第一电路板10产生一定的向上的拉力，以缓冲第一电路板10向下的形变。增强板23的设置，也就能够对第一电路板10和基板22板起到支撑和稳固的作用，以避免第一电路板10和基板22的形变，确保电子元器件与第一电路板10或基板22之间的安全间隙。
需要说明的是，增强板23及目标电路板上对应增强板23的位置都设有相对应的焊盘，并通过印刷焊锡实现连接。其中，焊盘的形状与数量可以是根据增强板23的形状与尺寸设计为多种不同的方式，包括但不限于圆形、方形、环形、长方形等。增强板23的形状也可以是根据目标电路板上的电子元器件的布局情况设计为多种不同的形状，包括但不限于：长方体、圆柱体、椎体、L型体等。
可选地，增强板23的数量为至少一个。在增强板23的数量为多个的情况下，多个增强板23间隔设置，以更进一步对第一电路板10和基板22板起到支撑和稳固的作用。
本申请实施例中，在基板22连接所述第一屏蔽罩31的情况下，基板22的背对收容腔200的一侧还连接有板对板连接器40，且板对板连接器40位于第一屏蔽罩31之外，板对板连接器40的背对基板22的侧面与第一屏蔽罩31的背对基板22的侧面齐平，或位于第一屏蔽罩31的背对基板22的侧面之下。也就是说，板对板连接器40的高度不会突出于第一屏蔽罩31，以避免增加印刷电路板结构的整体高度。
请参照图8，基板22包括连接板对板连接器40的第一区域222及除所述第一区域222之外的第二区域223，第二区域223在基板22厚度方向上的高度大于第一区域222在所述基板22厚度方向上的高度。也就是说，基板22的背对收容腔200的一侧设计成阶梯形，第一屏蔽罩31设置在高度更高的第二区域223，板对板连接器40设置在高度较矮的第一区域222，这样也 就能够避免板对板连接器40的高度超出第一屏蔽罩31，以避免增加印刷电路板结构的整体高度。
其中，板对板连接器40可以是通过柔性电路板41与电子设备的主板连接。
可选地，基板22的朝向收容腔200的一侧上设有第三电子元器件(图未示)。也就是说，基板22的正反两个侧面上都设有电子元器件，且第三电子元器件收容在收容腔200中。这样，也就能够有效利用基板22上的布局空间，以及收容腔200中的布局空间，在不增加印刷电路板结构的尺寸的情况下，能够在印刷电路板结构中布局更多的电子元器件，有效利用印刷电路板结构的空间。
请参照图6，第一电路板10的一个侧面设有第二电路板20，第一电路板10板的另一个侧面上设有第二屏蔽罩32，且第一电路板10的所述另一个侧面上设有收容于第二屏蔽罩32内的第四电子元器件102。也就是说，第一电路板10的正反两个侧面上都能够设置电子元器件，以有效利用第一电路板10上的布局空间，使得印刷电路板结构能够布局更多的电子元器件。
可选地，第一屏蔽罩31和第二屏蔽罩32都为金属屏蔽罩，以避免外界电场、磁场或电磁场对金属屏蔽罩内电子元器件的干扰。
本申请实施例还提供了一种电子设备，所述电子设备包括上述实施例中所述的印刷电路板结构。需要说明的是，该电子设备包括上述实施例中印刷电路板结构的全部技术特征，并能达到相同的技术效果，为避免重复，此处不再赘述。
可选地，电子设备包括但不限定于是手机、平板电脑、笔记本电脑、台式计算机、智能穿戴设备等电子产品。
上面结合附图对本申请的实施例进行了描述，但是本申请并不局限于上述的具体实施方式，上述的具体实施方式仅仅是示意性的，而不是限制性的，本领域的普通技术人员在本申请的启示下，在不脱离本申请宗旨和权利要求所保护的范围情况下，还可做出很多形式，均属于本申请的保护之内。
Claims (11)
- 一种印刷电路板结构，包括第一电路板及第二电路板，所述第一电路板的至少一个侧面上设有至少一个所述第二电路板；其中，所述第二电路板包括基板及连接在所述基板周沿的加强筋，所述加强筋与所述基板形成收容腔，且所述加强筋围合形成所述收容腔的侧壁，所述加强筋与目标电路板连接，所述目标电路板为所述第一电路板或所述第二电路板；所述第一电路板的朝向所述第二电路板的侧面上设有第一电子元器件，所述第一电子元器件位于所述收容腔内，所述基板的背对所述第一电路板的一侧连接有第一屏蔽罩或所述第二电路板，且所述基板的背对所述第一电路板的一侧设有第二电子元器件，所述第二电子元器件位于所述第一屏蔽罩内或位于与所述基板连接的所述第二电路板的收容腔内。
- 根据权利要求1所述的印刷电路板结构，其中，所述加强筋包括第一连接部及第二连接部，且所述第一连接部及所述第二连接部均与所述基板连接，所述第一连接部垂直所述基板，所述第二连接部位于所述第一连接部的朝向所述收容腔的一侧，且向所述收容腔的方向凸出。
- 根据权利要求2所述的印刷电路板结构，其中，所述第一连接部包括朝向所述收容腔的第一侧面，所述第二连接部包括朝向所述收容腔的第二侧面，所述基板包括朝向所述收容腔的第三侧面，所述第二侧面的两端分别连接所述第一侧面及所述第三侧面，所述第一侧面与所述第三侧面垂直，所述第二侧面相对于所述第一侧面倾斜设置；或者，所述第二侧面包括相连接的第一子侧面及第二子侧面，所述第一子侧面连接所述第一侧面且与所述第一侧面垂直，所述第二子侧面连接所述第三侧面且与所述第三侧面垂直。
- 根据权利要求1所述的印刷电路板结构，其中，所述基板还包括向所述收容腔内延伸的增强板，所述增强板的远离所述基板的一端与所述目标电路板连接。
- 根据权利要求4所述的印刷电路板结构，其中，所述增强板的数量为至少一个。
- 根据权利要求1所述的印刷电路板结构，其中，在所述基板连接所述第一屏蔽罩的情况下，所述基板的背对所述收容腔的一侧还连接有板对板连接器，且所述板对板连接器位于所述第一屏蔽罩之外，所述板对板连接器的背对所述基板的侧面与所述第一屏蔽罩的背对所述基板的侧面齐平，或位于所述第一屏蔽罩的背对所述基板的侧面之下。
- 根据权利要求6所述的印刷电路板结构，其中，所述基板包括连接所述板对板连接器的第一区域及除所述第一区域之外的第二区域，所述第二区域在所述基板厚度方向上的高度大于所述第一区域在所述基板厚度方向上的高度。
- 根据权利要求1所述的印刷电路板结构，其中，所述基板的朝向所述收容腔的一侧上设有第三电子元器件。
- 根据权利要求1所述的印刷电路板结构，其中，所述第一电路板的一个侧面设有所述第二电路板，所述第一电路板板的另一个侧面上设有第二屏蔽罩，且所述第一电路板的所述另一个侧面上设有收容于所述第二屏蔽罩内的第四电子元器件。
- 根据权利要求1所述的印刷电路板结构，其中，所述基板与所述加强筋一体成型。
- 一种电子设备，所述电子设备包括如权利要求1-10中任一项所述的印刷电路板结构。
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| CN110621122A (zh) * | 2019-09-03 | 2019-12-27 | Oppo（重庆）智能科技有限公司 | 多层电路板的制作方法、多层电路板和电子设备 |
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| CN113347788A (zh) * | 2021-06-16 | 2021-09-03 | 维沃移动通信有限公司 | 印刷电路板结构及电子设备 |
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| US20180184550A1 (en) * | 2016-12-28 | 2018-06-28 | Microsoft Technology Licensing, Llc | Metal additive structures on printed circuit boards |
| JP7016256B2 (ja) * | 2017-12-28 | 2022-02-04 | 京セラ株式会社 | 印刷配線板の製造方法 |
| CN111619970B (zh) * | 2019-02-27 | 2022-12-20 | 中集安瑞环科技股份有限公司 | 罐式集装箱 |
| CN110149762A (zh) * | 2019-04-28 | 2019-08-20 | 华为技术有限公司 | 一种印刷电路板及其制作方法和电子设备 |
| CN211930993U (zh) * | 2020-05-25 | 2020-11-13 | 江苏佰元鸿金属科技有限公司 | 一种可控制蚀刻时间的旋转蚀刻装置 |
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| CN207985446U (zh) * | 2018-03-29 | 2018-10-19 | 深圳瑞隆新能源科技有限公司 | 一种软包电池吸塑盒 |
| CN108633170A (zh) * | 2018-06-25 | 2018-10-09 | 维沃移动通信有限公司 | 一种印刷电路板组件及电子设备 |
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| CN110621122A (zh) * | 2019-09-03 | 2019-12-27 | Oppo（重庆）智能科技有限公司 | 多层电路板的制作方法、多层电路板和电子设备 |
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