WO2022253064A1 - 一种激光切割玻璃的裂片方法及裂片装置 - Google Patents

一种激光切割玻璃的裂片方法及裂片装置 Download PDF

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Publication number
WO2022253064A1
WO2022253064A1 PCT/CN2022/094866 CN2022094866W WO2022253064A1 WO 2022253064 A1 WO2022253064 A1 WO 2022253064A1 CN 2022094866 W CN2022094866 W CN 2022094866W WO 2022253064 A1 WO2022253064 A1 WO 2022253064A1
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glass
cutting
laser
laser cutting
area
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PCT/CN2022/094866
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English (en)
French (fr)
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胡明
赵侠
戚晨阳
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浙江华工光润智能装备技术有限公司
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Priority to BR112023009553A priority Critical patent/BR112023009553A2/pt
Publication of WO2022253064A1 publication Critical patent/WO2022253064A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Definitions

  • the invention relates to the field of glass cutting, in particular to a splitting method and splitting device for laser cutting glass.
  • laser processing of glass is gradually or is replacing traditional mechanical drill/saw blade processing and water jet processing.
  • Laser cutting processing is a new type of processing method, which has many characteristics such as simple production process, no pollution, low noise, high precision, high production efficiency, and high product yield.
  • ultra-fast laser wire cutting is used to process the closed shape of glass.
  • One problem is that after laser cutting on thicker (more than 2mm) glass, the cracks formed after laser cutting are very small. Subsequent heating along the closed cutting track (using CO2 laser beam, or hot oil, or even chemical corrosion, etc.) makes the crack penetrate, but due to the small kerf, the force between the cut piece and the substrate is relatively large, It will not fall off freely, and even under the action of certain mechanical external force, it is difficult to separate the glass without damage. These methods are only suitable for cutting thinner (less than 2mm) glass.
  • the present invention provides a splitting method and splitting device for laser cutting glass, so as to increase the cutting thickness of glass and realize cutting of thicker glass.
  • the present invention provides the following scheme:
  • the invention provides a method for splitting glass by laser cutting, comprising the following steps: step 1, after the laser cutting of the required closed shape is completed on the glass, heating the outer ring area of the glass cutting closed track, or heating the The outer area of the glass cutting closed track is heated, or the outer area and the inner ring area of the glass cutting closed track are heated, and the inner ring area of the glass cutting closed track is cooled, so that the glass cutting is formed
  • step 1 after the laser cutting of the required closed shape is completed on the glass, heating the outer ring area of the glass cutting closed track, or heating the The outer area of the glass cutting closed track is heated, or the outer area and the inner ring area of the glass cutting closed track are heated, and the inner ring area of the glass cutting closed track is cooled, so that the glass cutting is formed
  • step 1 after the laser cutting of the required closed shape is completed on the glass, heating the outer ring area of the glass cutting closed track, or heating the The outer area of the glass cutting closed track is heated, or the outer area and the inner ring area of the
  • the inner ring area of the glass cutting closed track is cooled by blowing cold air and/or applying a strong cooling medium and/or contacting with a high thermal conductivity material.
  • carbon dioxide laser beam and/or water bath and/or heating furnace and / or heating by infrared radiation are preferably, in the first step.
  • ultrafast laser wire cutting is used to cut the required shape of the glass.
  • an external force is applied to the cut area of the glass, so as to split the glass.
  • the present invention also provides a splitting device for laser cutting glass, comprising: a heating device for heating the outer ring area of the glass cutting closed track after the laser cutting of the required closed shape is completed on the glass;
  • the cooling device is used for cooling the inner ring area of the glass cutting closed track.
  • the heating device includes: a carbon dioxide laser light source for emitting a carbon dioxide laser beam and a first reflector for changing the direction of the carbon dioxide laser beam;
  • the cooling device includes: a delivery pipe for delivering cold air.
  • the splitting device for laser cutting glass provided by the present invention also includes an ultrafast laser cutting device for laser cutting the glass in a desired shape, and the ultrafast laser cutting device includes a laser cutting device for emitting ultrafast laser light.
  • An ultrafast laser light source for the beam a second reflector for changing the direction of the ultrafast laser beam, and a Bessel for shaping and focusing the ultrafast laser beam after the direction of the second reflector is changed cutting head.
  • the splitting device for laser cutting glass provided by the present invention further includes an external force applying device for applying an external force to the cut area of the glass, and the external force applying device includes a plug, a first linear driving device and a second linear driving device.
  • a driving device, the first linear driving device is connected with the plug to drive the plug to reciprocate in the vertical direction
  • the second linear driving device is connected with the first linear driving device to drive the plug The first linear drive device and the plug head synchronously reciprocate along the horizontal direction.
  • the splitting method of laser cutting glass comprises the following steps: step 1, after the laser cutting of the required closed shape is completed on the glass, the outer ring area of the glass cutting closed track is heated, or the outer ring area of the glass cutting closed track is heated.
  • the outer area is heated, or the outer area and the inner ring area of the glass cutting closed track are heated, and the inner ring area of the glass cutting closed track is cooled, so that the cracks formed by glass cutting are penetrated.
  • the combination of heating and cooling makes the temperature gradient in the glass slit area sharply increased, prompting the cracks formed during the laser cutting process to penetrate rapidly and split to form wider cracks, so that under the action of the subsequent mechanical external force, Enables cutting of thicker glass.
  • Fig. 1 is a schematic diagram of the setting method of the inner ring area and the outer ring area provided in the embodiment of the present invention
  • Fig. 2 is a partial structural schematic diagram of a splitting device for laser cutting glass provided in an embodiment of the present invention
  • FIG. 3 is a schematic structural view of an ultrafast laser cutting device provided in an embodiment of the present invention.
  • Fig. 4 is a schematic structural diagram of an external force applying device provided in an embodiment of the present invention.
  • Fig. 5 is a schematic diagram of the setting method of the inner ring area and the outer area provided in the embodiment of the present invention.
  • the object of the present invention is to provide a laser cutting glass splitting method and a splitting device that can increase the glass cutting thickness and realize the cutting of thicker glass.
  • the method for splitting glass by laser cutting includes the following steps: step 1, after the laser cutting of the required closed shape is completed on the glass 18, the outer ring of the closed track 19 is cut to the glass 18 The area 20 is heated, and the inner ring area 21 of the cutting closed track 19 of the glass 18 is cooled, so that the cracks formed by cutting the glass 18 are penetrated.
  • the combination of heating and cooling makes the temperature gradient in the slit area of the glass 18 increase sharply, prompting the cracks formed in the laser cutting process to penetrate rapidly and split to form wider cracks, so that under the action of the subsequent mechanical external force , enabling the cutting of thicker glass.
  • heating and cooling are preferably performed simultaneously.
  • step 1 the inner ring area 21 of the cut closed track 19 of the glass 18 is cooled by blowing cold air and/or applying a strong cooling medium and/or contacting with a high thermal conductivity material. What kind of cold air to blow, what kind of strong cold medium to apply, and what kind of high thermal conductivity material to contact all belong to the existing technology. high material.
  • step 1 the outer ring region 20 of the cut closed track 19 of the glass 18 is heated by carbon dioxide laser beam 2 and/or water bath and/or heating furnace and/or infrared radiation.
  • hot oil can also be used to heat the outer ring region 20 of the cut closed track 19 of the glass 18 .
  • the glass 18 is cut into the desired shape by ultrafast laser wire cutting.
  • the ultrafast laser wire cutting technology belongs to the prior art, and will not be repeated here.
  • ultrafast laser refers to a pulsed laser with an output laser pulse width of 10-12s, that is, picosecond level or less than picosecond level.
  • step one or while cooling the inner ring region 21 of the glass 18 cutting closed track 19, an external force is applied to the cut area of the glass 18, so as to realize the splitting of the glass (cut pieces and substrate separation).
  • the present embodiment also provides a splitting device for laser cutting glass, including: after the glass 18 is laser cut into the required closed shape, it is used to cut the closed track 19 of the glass 18 A heating device for heating the outer ring area 20 and a cooling device for cooling the inner ring area 21 of the cut closed track 19 of the glass 18 .
  • the heating device includes: a carbon dioxide laser light source 1 for emitting a carbon dioxide laser beam 2 and a first reflector 3 for changing the direction of the carbon dioxide laser beam 2;
  • the cooling device includes: Conveyor pipe 4 for conveying cold air.
  • the delivery pipe 4 delivers cold air to the other.
  • the splitting device of laser cutting glass also includes an ultrafast laser cutting device for laser cutting of the required shape to glass 18, and the ultrafast laser cutting device includes a laser cutting device for emitting ultrafast An ultrafast laser light source 5 for the fast laser beam 6, a second reflector 7 for changing the direction of the ultrafast laser beam 6, and a shell for shaping and focusing the ultrafast laser beam 6 after the direction of the second reflector 7 is changed.
  • Serre cutting head 8 In this embodiment, an ultrafast laser is specifically selected as the laser light source.
  • the splitting device for laser cutting glass also includes a controller 10, a lens assembly 9, a monitor 12, a camera 13, and a workbench 11 provided with a suction cup.
  • the glass 18 is arranged on the workbench 11 , and the glass 18 is absorbed by the suction cup to realize the fixing of the position of the glass 18 .
  • the lens assembly 9 is arranged between the ultrafast laser light source 5 and the second reflector 7. The lens assembly 9 is used to expand and collimate the ultrafast laser beam 6 sent by the ultrafast laser light source 5.
  • the specific structure of the lens assembly 9 Belong to prior art.
  • the monitor 12 is used to facilitate manual observation, and the camera 13 collects the information of the ultrafast laser beam 6 and transmits the information of the collected ultrafast laser beam 6 to the monitor 12 and the controller 10, and the controller 10 collects the information according to the camera 13
  • the information of the ultrafast laser beam 6 controls the work of the ultrafast laser light source 5 .
  • the controller specifically selects the PLC controller.
  • the workbench 11 carries the glass 18 to be processed and moves according to the trajectory.
  • the laser beam enters the Bessel cutting head 8 through beam expansion, reflection, and irradiates the surface of the glass 18 to be cut, and the glass 18 is laser cut.
  • the splitting device for laser cutting glass also includes an external force applying device for applying an external force to the cut area of the glass 18.
  • the external force applying device includes a plug 14, a first linear drive device 16 And the second linear drive device 17, the first linear drive device 16 is connected with the plug 14 to drive the plug 14 to reciprocate in the vertical direction, the second linear drive device 17 is connected with the first linear drive device 16 to drive the first linear drive device 16 A linear drive device 16 and the plug 14 reciprocate synchronously along the horizontal direction.
  • both the first linear drive device 16 and the second linear drive device 17 are air cylinders
  • the external force applying device further includes a horizontal guide rail 15
  • the second linear drive device 17 is slidably disposed on the horizontal guide rail 15 .
  • the specific structure of the plug 14 belongs to the prior art, for example, a mechanical plug is selected.
  • the first linear drive device 16 to drive the plug 14 to move down, apply an external force to the cut area, and split the glass 18 to complete the entire process of laser cutting glass.
  • ultrasonic waves can also be applied to the plug 14 in order to strengthen the effect of mechanical external force on the split. How to specifically apply ultrasonic waves also belongs to the prior art, and will not be repeated here.
  • this embodiment includes some or all of the technical features of Embodiment 1.
  • Step 1 after the laser cutting of the required closed shape is completed on the glass 18, the closed track is cut on the glass 18.
  • the outer area 22 of glass 19 is heated, and the inner ring area 21 of glass 18 cutting closed track 19 is cooled, so that the crack formed by cutting glass 18 runs through; or the outer area 22 and inner ring area 21 of glass 18 cutting closed track 19 Heating is carried out to cool the inner ring region 21 of the cutting closed track 19 of the glass 18 , so that the cracks formed by cutting the glass 18 are penetrated.
  • the glass 18 is cut into the outer area 22 of the closed track 19 or the outer area 22 and the inner ring area 21 using a carbon dioxide laser beam 2 and/or a water bath and/or a heating furnace and/or infrared radiation. way to heat.
  • the outer area refers to the area outside the closed trajectory 19
  • the outer area 22 includes the outer ring area 21
  • the inner ring area 21 refers to the area within the closed track 19
  • the inner ring area 21 is the inner area of the closed track 19 .
  • connection should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; It can be directly connected, or indirectly connected through an intermediary, and can be internally connected between two elements.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

一种激光切割玻璃的裂片方法及裂片装置，方法包括以下步骤：步骤一，在对玻璃（18）完成所需要的封闭形状的激光切割后，对玻璃（18）切割封闭轨迹（19）的外环区域（20）进行加热，或者对玻璃（18）切割封闭轨迹（19）的外部区域（22）进行加热，或者对玻璃（18）切割封闭轨迹（19）的外部区域（22）和内环区域（21）进行加热，对玻璃（18）切割封闭轨迹（19）的内环区域（21）进行冷却，以使玻璃（18）切割形成的裂纹贯通。加热与冷却配合使玻璃（18）切缝区域的温度变化梯度激剧加大，促使在激光切割过程中形成的裂纹迅速贯通，并裂开形成更宽的裂缝，如此在后续施加的机械外力的作用下，能够实现更厚玻璃（18）的切割。

Description

一种激光切割玻璃的裂片方法及裂片装置 技术领域
本发明涉及玻璃切割领域，特别是涉及一种激光切割玻璃的裂片方法及裂片装置。
背景技术
随着半导体技术、显示技术，以及人民生活质量要求不断提高，越来越多的地方要用到各种规格的玻璃。玻璃制造加工的精度、生产效率、被加工的形状，也不断地在提升或增加。同时，激光技术发展，激光加工玻璃逐步或正在替换传统的机械钻头/锯片加工、水刀加工。激光切割加工是新型的加工手段，具有生产流程简单、无污染、低噪声、精度高、生产效率高、产品良率高等诸多特点。
但是，目前采用超快激光成丝切割对玻璃封闭形状进行加工，存在的一个问题是，在较厚(2mm以上)的玻璃上经过激光切割后，由于激光切割后形成的裂纹很小，虽然能通过后续沿着封闭切割轨迹进行加热(利用CO2激光束，或者热油，甚至化学腐蚀等)的办法使裂纹贯通，但由于切缝细小，被切割片与基片之间的作用力较大，不会自由脱落，甚至在一定机械外力的作用下，也很难无损地将玻璃分开，这些方法只适用于较薄(小于2mm)的玻璃切割。
因此，如何提高玻璃切割厚度，实现更厚玻璃的切割成为本领域技术人员目前所亟待解决的问题。
发明内容
为解决以上技术问题，本发明提供一种激光切割玻璃的裂片方法及裂片装置，以提高玻璃切割厚度，实现更厚玻璃的切割。
为实现上述目的，本发明提供了如下方案：
本发明提供一种激光切割玻璃的裂片方法，包括以下步骤：步骤一，在对玻璃完成所需要的封闭形状的激光切割后，对所述玻璃切割封闭轨迹的外环区域进行加热，或者对所述玻璃切割封闭轨迹的外部区域进行加热，或者对所述玻璃切割封闭轨迹的外部区域和内环区域进行加热，对所 述玻璃切割封闭轨迹的内环区域进行冷却，以使所述玻璃切割形成的裂纹贯通，并由于热涨冷缩产生足以进行裂片的间隙，最终实现裂片。
优选地，所述步骤一中，对所述玻璃切割封闭轨迹的所述内环区域通过吹冷气和/或涂抹强冷介质和/或接触高导热材料的方式进行冷却。
优选地，所述步骤一中，对所述玻璃切割封闭轨迹的外环区域或者所述外部区域或者所述外部区域和所述内环区域采用二氧化碳激光束和/或水浴和/或加热炉和/或红外线照射的方式进行加热。
优选地，在所述步骤一之前，利用超快激光成丝切割对所述玻璃完成所需要的形状的切割。
优选地，在所述步骤一之后，或在对所述玻璃切割封闭轨迹的所述内环区域进行冷却的同时，对所述玻璃被切割的区域施加外力，以实现所述玻璃的裂片。
本发明还提供一种激光切割玻璃的裂片装置，包括：在对玻璃完成所需要的封闭形状的激光切割后，用于对所述玻璃切割封闭轨迹的外环区域进行加热的加热装置，以及用于对所述玻璃切割封闭轨迹的内环区域进行冷却的冷却装置。
优选地，所述加热装置包括：用于发出二氧化碳激光束的二氧化碳激光光源以及用于改变所述二氧化碳激光束的方向的第一反射镜；所述冷却装置包括：用于输送冷气的输送管。
优选地，本发明提供的激光切割玻璃的裂片装置还包括用于对所述玻璃完成所需要的形状的激光切割的超快激光切割装置，所述超快激光切割装置包括用于发出超快激光光束的超快激光光源、用于改变所述超快激光光束方向的第二反射镜以及用于对所述第二反射镜改变方向后的所述超快激光光束进行整形、聚焦的贝塞尔切割头。
优选地，本发明提供的激光切割玻璃的裂片装置还包括用于对所述玻璃被切割的区域施加外力的外力施加装置，所述外力施加装置包括顶头、第一直线驱动装置以及第二直线驱动装置，所述第一直线驱动装置与所述顶头相连、以驱动所述顶头沿竖直方向往复运动，所述第二直线驱动装置与所述第一直线驱动装置相连、以驱动所述第一直线驱动装置及所述顶头沿水平方向同步往复运动。
本发明相对于现有技术取得了以下技术效果：
本发明提供的激光切割玻璃的裂片方法包括以下步骤：步骤一，在对玻璃完成所需要的封闭形状的激光切割后，对玻璃切割封闭轨迹的外环区域进行加热，或者对玻璃切割封闭轨迹的外部区域进行加热，或者对玻璃切割封闭轨迹的外部区域和内环区域进行加热，对玻璃切割封闭轨迹的内环区域进行冷却，以使玻璃切割形成的裂纹贯通。加热与冷却配合使玻璃切缝区域的温度变化梯度激剧加大，促使在激光切割过程中形成的裂纹迅速贯通，并裂开形成更宽的裂缝，如此在后续施加的机械外力的作用下，能够实现实现更厚玻璃的切割。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本发明实施例中提供的内环区域及外环区域设置方式示意图；
图2为本发明实施例中提供的激光切割玻璃的裂片装置的部分结构示意图；
图3为本发明实施例中提供的超快激光切割装置的结构示意图；
图4为本发明实施例中提供的外力施加装置的结构示意图；
图5为本发明实施例中提供的内环区域及外部区域设置方式示意图；
附图标记说明：1、二氧化碳激光光源；2、二氧化碳激光束；3、第一反射镜；4、输送管；5、超快激光光源；6、超快激光光束；7、第二反射镜；8、贝塞尔切割头；9、透镜组件；10、控制器；11、工作台；12、监视器；13、摄像头；14、顶头；15、水平导轨；16、第一直线驱动装置；17、第二直线驱动装置；18、玻璃；19、封闭轨迹；20、外环区域；21、内环区域；22、外部区域。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没 有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
本发明的目的是提供一种能够提高玻璃切割厚度，实现更厚玻璃的切割的激光切割玻璃的裂片方法及裂片装置。
为使本发明的上述目的、特征和优点能够更加明显易懂，下面结合附图和具体实施方式对本发明作进一步详细的说明。
如图1所示，本实施例提供的激光切割玻璃的裂片方法，包括以下步骤：步骤一，在对玻璃18完成所需要的封闭形状的激光切割后，对玻璃18切割封闭轨迹19的外环区域20进行加热，对玻璃18切割封闭轨迹19的内环区域21进行冷却，以使玻璃18切割形成的裂纹贯通。加热与冷却配合使玻璃18切缝区域的温度变化梯度激剧加大，促使在激光切割过程中形成的裂纹迅速贯通，并裂开形成更宽的裂缝，如此在后续施加的机械外力的作用下，能够实现实现更厚玻璃的切割。另外，加热及冷却最好同时进行。
于本实施例中，步骤一中，对玻璃18切割封闭轨迹19的内环区域21通过吹冷气和/或涂抹强冷介质和/或接触高导热材料的方式进行冷却。具体吹何种冷气、涂抹何种强冷介质以及接触何种高导热材料均属于现有技术，例如吹冷气具体可选用吹干冰或液氮，高导热材料具体可选用铜、银等导热性高的材料。
于本实施例中，步骤一中，对玻璃18切割封闭轨迹19的外环区域20采用二氧化碳激光束2和/或水浴和/或加热炉和/或红外线照射的方式进行加热。除此之外，还可采用热油对玻璃18切割封闭轨迹19的外环区域20进行加热。
于本实施例中，在步骤一之前，利用超快激光成丝切割对玻璃18完成所需要的形状的切割。超快激光成丝切割技术属于现有技术，在此不再赘述。另外，“超快激光”是指输出激光的脉冲宽度在10-12s即皮秒级别或者小于皮秒级别的脉冲激光。
于本实施例中，在步骤一之后，或在对玻璃18切割封闭轨迹19的内环区域21进行冷却的同时，对玻璃18被切割的区域施加外力，以实现玻璃的裂片(被切割片与基片的分离)。
如图2-图4所示，本实施例还提供一种激光切割玻璃的裂片装置，包括：在对玻璃18完成所需要的封闭形状的激光切割后，用于对玻璃18切割封闭轨迹19的外环区域20进行加热的加热装置以及用于对玻璃18切割封闭轨迹19的内环区域21进行冷却的冷却装置。
于本实施例中，如图2所示，加热装置包括：用于发出二氧化碳激光束2的二氧化碳激光光源1以及用于改变二氧化碳激光束2的方向的第一反射镜3；冷却装置包括：用于输送冷气的输送管4。具体使用过程中，利用二氧化碳激光束2对玻璃18切割轨迹19的外环区域20和内环区域21二者之一进行加热的同时，输送管4向另一者输送冷气。
于本实施例中，如图3所示，激光切割玻璃的裂片装置还包括用于对玻璃18完成所需要的形状的激光切割的超快激光切割装置，超快激光切割装置包括用于发出超快激光光束6的超快激光光源5、用于改变超快激光光束6方向的第二反射镜7以及用于对第二反射镜7改变方向后的超快激光光束6进行整形、聚焦的贝塞尔切割头8。本实施例中超过激光光源具体选用超快激光器。另外，激光切割玻璃的裂片装置还包括控制器10、透镜组件9、监视器12、摄像头13以及设置有吸盘的工作台11。玻璃18设置于工作台11上，通过吸盘吸附玻璃18、以实现玻璃18位置的固定。透镜组件9设置于超快激光光源5及第二反射镜7之间，透镜组件9用于对超快激光光源5发出的超快激光光束6进行扩束、准直，透镜组件9的具体结构属于现有技术。监视器12用于方便人工观察，摄像头13采集超快激光光束6的信息、并将采集到的超快激光光束6的信息传递给监视器12和控制器10，控制器10根据摄像头13采集到的超快激光光束6的信息控制超快激光光源5工作。控制器具体选用PLC控制器。切割时，工作台11承载被加工的玻璃18，并按轨迹移动，激光束通过扩束、反射、进入贝塞尔切割头8，照射到被切割玻璃18的表面，对玻璃18进行激光切割。
于本实施例中，如图4所示，激光切割玻璃的裂片装置还包括用于对玻璃18被切割的区域施加外力的外力施加装置，外力施加装置包括顶头14、第一直线驱动装置16以及第二直线驱动装置17，第一直线驱动装置16与顶头14相连、以驱动顶头14沿竖直方向往复运动，第二直线驱动 装置17与第一直线驱动装置16相连、以驱动第一直线驱动装置16及顶头14沿水平方向同步往复运动。本实施例中具体地，第一直线驱动装置16和第二直线驱动装置17均选用气缸，外力施加装置还包括水平导轨15，第二直线驱动装置17可滑动地设置于水平导轨15上。另外，顶头14的具体结构属于现有技术，例如选用机械顶头。
具体使用过程中，利用第一直线驱动装置16带动顶头14下移，对被切割的区域施加外力，将玻璃18进行裂片，即可完成整个激光切割玻璃的过程。另外，为了加强机械外力裂片的作用，还可以在顶头14上施加超声波。具体如何施加超声波同样属于现有技术，在此不再赘述。
本实施例提供的激光切割玻璃的裂片方法及裂片装置具有以下优点：
裂纹更宽，甚至出现裂逢：由于更大的温度变化梯度，造成更大的热胀冷缩变形量，形成更宽的裂纹，玻璃的粘连性更小，更易于通过一定的机械外力进行分离；
不易在裂片过程对玻璃造成损伤；
适用于更厚玻璃切割。
实施例二
如图5所示，本实施例包括实施例一的部分或者全部技术特征，不同之处在于，步骤一中，在对玻璃18完成所需要的封闭形状的激光切割后，对玻璃18切割封闭轨迹19的外部区域22进行加热，对玻璃18切割封闭轨迹19的内环区域21进行冷却，以使玻璃18切割形成的裂纹贯通；或者对玻璃18切割封闭轨迹19的外部区域22和内环区域21进行加热，对玻璃18切割封闭轨迹19的内环区域21进行冷却，以使玻璃18切割形成的裂纹贯通。
进一步地，本实施例中具体地，对玻璃18切割封闭轨迹19的外部区域22或者外部区域22和内环区域21采用二氧化碳激光束2和/或水浴和/或加热炉和/或红外线照射的方式进行加热。
需要说明的是如图5所示，外部区域指的是封闭轨迹19以外的区域，外部区域22包括外环区域21。另外，如图1所示，内环区域21指的是封闭轨迹19以内的区域，内环区域21即封闭轨迹19的内部区域。
在本发明的描述中，需要说明的是，“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本发明中的具体含义。
本说明书中应用了具体个例对本发明的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本发明的方法及其核心思想；同时，对于本领域的一般技术人员，依据本发明的思想，在具体实施方式及应用范围上均会有改变之处。综上所述，本说明书内容不应理解为对本发明的限制。

Claims (9)

  1. 一种激光切割玻璃的裂片方法，其特征在于，包括以下步骤：
    步骤一，在对玻璃完成所需要的封闭形状的激光切割后，对所述玻璃切割封闭轨迹的外环区域进行加热，或者对所述玻璃切割封闭轨迹的外部区域进行加热，或者对所述玻璃切割封闭轨迹的外部区域和内环区域进行加热，对所述玻璃切割封闭轨迹的内环区域进行冷却，以使所述玻璃切割形成的裂纹贯通。
  2. 根据权利要求1所述的激光切割玻璃的裂片方法，其特征在于，所述步骤一中，对所述玻璃切割封闭轨迹的所述内环区域通过吹冷气和/或涂抹强冷介质和/或接触高导热材料的方式进行冷却。
  3. 根据权利要求1所述的激光切割玻璃的裂片方法，其特征在于，所述步骤一中，对所述玻璃切割封闭轨迹的所述外环区域或者所述外部区域或者所述外部区域和所述内环区域采用二氧化碳激光束和/或水浴和/或加热炉和/或红外线照射的方式进行加热。
  4. 根据权利要求1所述的激光切割玻璃的裂片方法，其特征在于，在所述步骤一之前，利用超快激光成丝切割对所述玻璃完成所需要的形状的切割。
  5. 根据权利要求1所述的激光切割玻璃的裂片方法，其特征在于，在所述步骤一之后，或在对所述玻璃切割封闭轨迹的所述内环区域进行冷却的同时，对所述玻璃被切割的区域施加外力，以实现所述玻璃的裂片。
  6. 一种激光切割玻璃的裂片装置，其特征在于，包括：在对玻璃完成所需要的封闭形状的激光切割后，用于对所述玻璃切割封闭轨迹的外环区域进行加热的加热装置，以及用于对所述玻璃切割封闭轨迹的内环区域进行冷却的冷却装置。
  7. 根据权利要求6所述的激光切割玻璃的裂片装置，其特征在于，所述加热装置包括：用于发出二氧化碳激光束的二氧化碳激光光源以及用于改变所述二氧化碳激光束的方向的第一反射镜；所述冷却装置包括：用于输送冷气的输送管。
  8. 根据权利要求6所述的激光切割玻璃的裂片装置，其特征在于，还包括用于对所述玻璃完成所需要的形状的激光切割的超快激光切割装置， 所述超快激光切割装置包括用于发出超快激光光束的超快激光光源、用于改变所述超快激光光束方向的第二反射镜以及用于对所述第二反射镜改变方向后的所述超快激光光束进行整形、聚焦的贝塞尔切割头。
  9. 根据权利要求6所述的激光切割玻璃的裂片装置，其特征在于，还包括用于对所述玻璃被切割的区域施加外力的外力施加装置，所述外力施加装置包括顶头、第一直线驱动装置以及第二直线驱动装置，所述第一直线驱动装置与所述顶头相连、以驱动所述顶头沿竖直方向往复运动，所述第二直线驱动装置与所述第一直线驱动装置相连、以驱动所述第一直线驱动装置及所述顶头沿水平方向同步往复运动。
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