WO2022250092A1 - 光源モジュール - Google Patents

光源モジュール Download PDF

Info

Publication number
WO2022250092A1
WO2022250092A1 PCT/JP2022/021443 JP2022021443W WO2022250092A1 WO 2022250092 A1 WO2022250092 A1 WO 2022250092A1 JP 2022021443 W JP2022021443 W JP 2022021443W WO 2022250092 A1 WO2022250092 A1 WO 2022250092A1
Authority
WO
WIPO (PCT)
Prior art keywords
light emitting
emitting element
light
waveguide
section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2022/021443
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
康弘 藤本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to EP22811362.7A priority Critical patent/EP4350401A4/en
Priority to CN202280038118.6A priority patent/CN117396785A/zh
Priority to JP2023523510A priority patent/JPWO2022250092A1/ja
Priority to US18/564,408 priority patent/US12292590B2/en
Publication of WO2022250092A1 publication Critical patent/WO2022250092A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/28—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals
    • G02B6/2804—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals forming multipart couplers without wavelength selective elements, e.g. "T" couplers, star couplers
    • G02B6/2821—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals forming multipart couplers without wavelength selective elements, e.g. "T" couplers, star couplers using lateral coupling between contiguous fibres to split or combine optical signals
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0005—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being of the fibre type
    • G02B6/0006—Coupling light into the fibre
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0005—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being of the fibre type
    • G02B6/0008—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being of the fibre type the light being emitted at the end of the fibre
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G02B6/125—Bends, branchings or intersections
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B21/00—Projectors or projection-type viewers; Accessories therefor
    • G03B21/14—Details
    • G03B21/20—Lamp housings
    • G03B21/2006—Lamp housings characterised by the light source
    • G03B21/2013—Plural light sources
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B21/00—Projectors or projection-type viewers; Accessories therefor
    • G03B21/14—Details
    • G03B21/20—Lamp housings
    • G03B21/2046—Positional adjustment of light sources
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4012—Beam combining, e.g. by the use of fibres, gratings, polarisers, prisms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02253—Out-coupling of light using lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/068—Stabilisation of laser output parameters
    • H01S5/0683—Stabilisation of laser output parameters by monitoring the optical output parameters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/1028—Coupling to elements in the cavity, e.g. coupling to waveguides adjacent the active region, e.g. forward coupled [DFC] structures
    • H01S5/1032—Coupling to elements comprising an optical axis that is not aligned with the optical axis of the active region
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H01S5/4087—Array arrangements, e.g. constituted by discrete laser diodes or laser bar emitting more than one wavelength
    • H01S5/4093—Red, green and blue [RGB] generated directly by laser action or by a combination of laser action with nonlinear frequency conversion

Definitions

  • the present disclosure relates to light source modules.
  • Patent Document 1 An example of conventional technology is described in Patent Document 1.
  • the light source module of the present disclosure includes a first light emitting element that emits light of a first wavelength, a second light emitting element that emits light of a second wavelength different from the first wavelength, and the first wavelength and the second wavelength. comprises a third light emitting element emitting light of a third different wavelength, a clad, and a core located within the clad.
  • the core includes a first waveguide portion through which light emitted from the first light emitting element propagates, a second waveguide portion through which light emitted from the second light emitting element propagates, and from the third light emitting element a third waveguide through which the emitted light propagates; and a multiplexing portion where at least two of the first waveguide, the second waveguide, and the third waveguide meet.
  • the at least two waveguides have a first portion into which light is incident and a second portion adjacent to the multiplexing portion, wherein the width of the first portion is greater than the width of the second portion. big.
  • FIG. 1 is an exploded perspective view of a light source module according to an embodiment of the present disclosure
  • FIG. FIG. 2 is a perspective view of the light source module of FIG. 1 omitting a lid
  • FIG. 3 is a cross-sectional view cut along the cutting plane line III-III in FIG. 2
  • 2 is a plan view of the light source module of FIG. 1
  • FIG. FIG. 5 is an end view cut along the cutting plane line VV in FIG. 4
  • FIG. 2 is an enlarged plan view showing a main part of the light source module of FIG. 1
  • FIG. 2 is an enlarged plan view showing a main part of the light source module of FIG. 1
  • 1 is a plan view showing a light source module according to an embodiment of the present disclosure
  • FIG. FIG. 10 is a plan view showing a modification of the light source module according to the embodiment of the present disclosure
  • Patent Document 1 discloses an optical waveguide circuit having a tapered waveguide that can be applied to such a light source module.
  • the light source module of the present disclosure will be described below with reference to the accompanying drawings.
  • the figures used in the following description are schematic.
  • the dimensional ratios and the like on the drawings do not necessarily match the actual ones.
  • the light source module of the present disclosure may be used with any direction directed upward or downward, for the sake of convenience, a rectangular coordinate system (X, Y, Z) is defined herein and , the positive side in the Z-axis direction is defined as the upper side, and terms such as the upper surface and the lower surface are used.
  • FIG. 1 is an exploded perspective view showing a light source module according to an embodiment of the present disclosure
  • FIG. 2 is a perspective view of the light source module in FIG. 1 with the cover omitted
  • FIG. 4 is a plan view of the light source module of FIG. 1
  • FIG. 5 is an end view of FIG. 4 taken along line VV of FIG. 4
  • 6 and 7 are plan views showing enlarged main parts of the light source module in FIG. 1
  • FIG. 8 is a plan view showing a light source module according to an embodiment of the present disclosure
  • FIG. Fig. 10 is a plan view showing a modification of the light source module according to the embodiment of 1
  • FIG. 2 shows a perspective view from a direction different from that of FIG. In FIG. 4, the lid is omitted for illustration.
  • FIGS. 6 and 7 shows an enlarged view of the A part of FIG. 4, and FIG. 7 shows an enlarged view of the B part of FIG.
  • the constituent elements other than the first light emitting element, the second light emitting element, the third light emitting element, the core and the substrate are omitted.
  • FIGS. 8 and 9 among the constituent elements of the light source module, constituent elements other than the first light emitting element, the second light emitting element, the third light emitting element, the clad, the core and the substrate are omitted.
  • the light source module 100 of this embodiment includes a first light emitting element 21, a second light emitting element 22, a third light emitting element 23, a clad 3, and a core 4.
  • the first light emitting element 21, the second light emitting element 22 and the third light emitting element 23 may be semiconductor lasers, light emitting diodes, or the like, for example. In the following description, it is assumed that the first light emitting element 21, the second light emitting element 22 and the third light emitting element 23 are semiconductor lasers. In addition, when the first light emitting element 21, the second light emitting element 22 and the third light emitting element 23 are not distinguished from each other, they may be collectively referred to as the light emitting element 20 in some cases.
  • the first light emitting element 21 emits light having a peak emission intensity at the first wavelength.
  • the second light emitting element 22 emits light having a peak emission intensity at a second wavelength.
  • the third light emitting element 23 emits light having a peak emission intensity at the third wavelength.
  • the first, second and third wavelengths are different from each other.
  • the second wavelength may be longer than the first wavelength, for example.
  • the third wavelength may be, for example, a longer wavelength than the second wavelength.
  • the first wavelength may be located in a wavelength range of approximately 400-500 nm.
  • a blue semiconductor laser can be used as the first light emitting element 21 that emits light in such a wavelength region.
  • the second wavelength may be located in the wavelength region of about 500-600 nm.
  • a green semiconductor laser may be used as the second light emitting element 22 that emits light in such a wavelength region.
  • the third wavelength may be located in the wavelength region of about 600-700 nm.
  • a red semiconductor laser can be used as the third light emitting element 23 that emits light in such a wavelength region.
  • the first light emitting element 21 is a blue semiconductor laser
  • the second light emitting element 22 is a green semiconductor laser
  • the third light emitting element 23 is a red semiconductor laser.
  • the first light emitting element 21 and the second light emitting element 22 may have a length of about 500 to 700 ⁇ m, a width of about 100 to 400 ⁇ m, and a height of about 50 to 150 ⁇ m.
  • the third light emitting element 23 may have a length of about 200 to 400 ⁇ m, a width of about 100 to 300 ⁇ m, and a height of about 50 to 150 ⁇ m.
  • the optical waveguide layer 5 is composed of the clad 3 and the core 4 .
  • the core 4 is located within the cladding 3, for example as shown in FIGS. 1-5.
  • the light source module 100 may comprise a substrate 1 , in which case the clad 3 is positioned on the first surface 1 a and the core 4 is positioned to extend along the first surface 1 a of the substrate 1 .
  • the substrate 1 may be a ceramic wiring substrate made of a ceramic material.
  • ceramic materials used in ceramic wiring boards include aluminum oxide sintered bodies, mullite sintered bodies, silicon carbide sintered bodies, aluminum nitride sintered bodies, and glass ceramic sintered bodies.
  • the ceramic wiring substrate may be provided with conductors such as connection pads, internal wiring conductors, and external connection terminals for electrical connection between the light emitting element 20 and an external circuit. Note that the ceramic wiring board may be a laminate.
  • the substrate 1 may be an organic wiring substrate made of an organic material.
  • the organic wiring board may be, for example, a printed wiring board, a build-up wiring board, a flexible wiring board, or the like.
  • organic materials used for organic wiring boards include epoxy resins, polyimide resins, polyester resins, acrylic resins, phenolic resins, and fluorine resins. Note that the organic wiring board may be a laminate.
  • the substrate 1 may be, for example, a substrate using a compound semiconductor.
  • Materials used for substrates using compound semiconductors include, for example, silicon (Si), germanium (Ge), gallium (Ga), arsenic (As), indium (In), phosphorus (P), sapphire ( Al2O3 ) . ) and the like.
  • the optical waveguide layer 5 may be made of, for example, glass such as quartz, or may be made of resin such as polymethyl methacrylate or fluororesin.
  • both the clad 3 and the core 4 may be made of glass or resin, or one of the clad 3 and the core 4 may be made of glass and the other made of resin.
  • core 4 has a higher refractive index than clad 3 .
  • the optical waveguide layer 5 utilizes the difference in refractive index between the clad 3 and the core 4 to totally reflect the light propagating through the core 4 .
  • the optical waveguide layer 5 can confine light in the core 4 with a high refractive index by forming a path with a material with a high refractive index and surrounding the path with a material with a low refractive index.
  • the light propagates inside the core 4 while repeating total reflection at the boundary between the core 4 and the clad 3 .
  • the clad 3 may be configured by laminating a lower clad layer 31 and an upper clad layer 32 as shown in FIG. 5, for example.
  • Core 4 may extend between lower clad layer 31 and upper clad layer 32 .
  • the upper clad layer 32 may have a ridge portion 32 a corresponding to the shape of the core 4 on the upper surface opposite to the lower surface facing the lower clad layer 31 .
  • the optical waveguide layer 5 may have a refractive index difference of 0.05 to 0.30 between the clad 3 and the core 4. In this case, the optical waveguide layer 5 stably propagates multimode light. can be done.
  • the core 4 may have a constant length (height) in the height direction (Z direction). The height of the core 4 may be about 1 to 5 ⁇ m.
  • the optical waveguide layer 5 can be formed, for example, using techniques similar to photolithography and etching techniques used in semiconductor device manufacturing processes.
  • the core 4 includes a first waveguide 41 , a second waveguide 42 and a third waveguide 43 .
  • the first waveguide 41 is configured to propagate light emitted from the first light emitting element 21 .
  • the first waveguide part 41 has a first incident surface 41a on which the light emitted from the first light emitting element 21 is incident.
  • the first entrance surface 41 a faces the light exit surface of the first light emitting element 21 .
  • the second waveguide part 42 is configured to propagate the light emitted from the second light emitting element 22 .
  • the second waveguide part 42 has a second incident surface 42a on which the light emitted from the second light emitting element 22 is incident.
  • the second entrance surface 42 a faces the light exit surface of the second light emitting element 22 .
  • the third waveguide 43 is configured to propagate light emitted from the third light emitting element 23 .
  • the third waveguide part 43 has a third incident surface 43a on which the light emitted from the third light emitting element 23 is incident.
  • the third incident surface 43 a faces the light exit surface of the third light emitting element 23 .
  • the first waveguide section 41 , the second waveguide section 42 and the third waveguide section 43 may be collectively referred to as the waveguide section 40 .
  • Each of the at least two waveguides meeting at the multiplexing section 44 includes an incident portion 40a as a first portion and a pre-multiplexing portion 40b as a second portion.
  • the incident portion 40a is a portion into which the light (also referred to as beam) emitted from the light emitting element is incident.
  • the incident portion 40a may have a constant width (ie, equal width).
  • the incident portion 40a may have a length of about 50 to 600 ⁇ m.
  • the length of each portion of the waveguide 40 it means the length along the propagation direction of light
  • the width of each portion of the waveguide 40 means the length in the direction perpendicular to the propagation direction of light when viewed from above.
  • the pre-multiplexing portion 40 b is a portion adjacent to the multiplexing section 44 , that is, a portion connected to the multiplexing section 44 .
  • the pre-multiplexing portion 40 b may be a portion immediately before meeting with the multiplexing portion 44 or may be a surface connected to the multiplexing portion 44 .
  • the at least two waveguides meeting at the combining portion 44 may have equal widths in the pre-combining portions 40b, in which case the light from the at least two waveguides meeting at the combining portion 44 may be combined. It becomes possible to make the light incident on the wave portion 44 evenly. Further, in adjusting the beam shape after multiplexing, the widths of the pre-multiplexing portions 40b of at least two waveguides meeting at the multiplexing portion 44 may be made different from each other.
  • the light source module 100 is configured such that the width of the incident portion 40a is larger than the width of the pre-multiplexing portion 40b.
  • the width of the incident portion 40a may be about 5 to 10 ⁇ m, or about 7 ⁇ m.
  • the width of the pre-combining portion 40b may be about 1.5 to 5 ⁇ m, or about 3 ⁇ m.
  • the beam incident on the incident portion 40a is shaped into a beam having a shape suitable for projection onto a screen (for example, a Gaussian beam of high beam quality). Afterwards, it can be made incident on the multiplexing section 44 .
  • Each of the at least two waveguides meeting at the combining portion 44 has a third portion (also referred to as a tapered waveguide portion) 40c located between the incident portion 40a and the pre-combining portion 40b in the light propagation direction. may have The tapered waveguide portion 40c may gradually decrease in width toward the pre-combining portion 40b. The width of the tapered waveguide portion 40c on the incident portion 40a side may match the width of the incident portion 40a, and the width on the pre-multiplexing portion 40b side may match the width of the pre-multiplexing portion 40b.
  • the entrance portion 40a has a uniform width, and the tapered waveguide portion 40c located closer to the exit portion 46 than the entrance portion 40a is tapered, so that the shape of the beam emitted from the exit portion 46 conforms to that of the light emitting element 20. It is possible to reduce the risk of destabilization due to the positional deviation between the exit surface of the waveguide section 40 and the entrance surface of the waveguide section 40 .
  • At least two waveguides meeting at the multiplexing portion 44 have tapered waveguide portions 40c, the cross-sectional areas of the at least two waveguides perpendicular to the light propagation direction gradually decrease. do. As a result, at least two waveguides that meet at the multiplexing portion 44 can reduce the phase variation that occurs when the beam from the light emitting element 20 is incident on the incident portion 40a. can be propagated.
  • the multiplexing section 44 may have a fourth portion (also referred to as a tapered multiplexing portion) 44a.
  • Tapered combining portion 44 a may be adjacent to at least two waveguides that meet at combining portion 44 .
  • the tapered combining portion 44 a may gradually decrease in width toward the output portion 46 .
  • the tapered multiplexing portion 44a may have a symmetrical shape with respect to the central axis CA of the tapered multiplexing portion 44a, as shown in FIG. 7, for example. In this case, the light from at least two waveguides meeting at the multiplexing portion 44 can be equally incident on the tapered multiplexing portion 44a and efficiently propagated through the tapered multiplexing portion 44a.
  • tapered multiplexing portion 44a gradually decreases in the cross-sectional area of the plane orthogonal to the light propagation direction, it is possible to reduce the phase variation of the beams incident on the tapered multiplexing portion 44a. , can propagate coherent beams.
  • the tapered multiplexing portion 44a may have a shape such as an isosceles trapezoidal shape or a substantially isosceles trapezoidal shape in a plan view.
  • the width of the tapered multiplexing portion 44a on the waveguide 40 side may be about 4 to 30 ⁇ m, or may be about 6 to 9 ⁇ m.
  • the tapered multiplexing portion 44a may have a width of about 1.5 to 5 ⁇ m, or may be about 3 ⁇ m, on the output portion 46 side.
  • the tapered multiplexing portion 44a may have a length of about 100 to 600 ⁇ m, or about 150 to 350 ⁇ m.
  • the combining section 44 may have a fifth portion (also referred to as a pre-emission portion) 44b.
  • the pre-emission portion 44b may be positioned between the tapered combining portion 44a and the exit portion 46.
  • the front exit portion 44b may have a constant width. Since the front emission portion 44b has the same width, it is possible to reduce the possibility that the front emission portion 44b disturbs the phase of the beam. As a result, the light source module 100 can emit a beam suitable for projection onto a screen or the like.
  • the width of the front emission portion 44b may be about 1.5 to 5 ⁇ m, or may be about 3 ⁇ m.
  • the clad 3 has a second surface 3a, which is a lower surface facing the substrate 1, and a third surface 3b, which is an upper surface opposite to the second surface 3a. It may have three through-holes 33 penetrating from 3b to the second surface 3a.
  • the first light emitting element 21, the second light emitting element 22, and the third light emitting element 23 may be positioned within three through holes 33, for example, as shown in FIG. In this case, by forming the through holes 33 according to the sizes of the first to third light emitting elements 21, 22, and 23, the opening of the through holes 33 can be reduced. Therefore, the rigidity of the clad 3 becomes high, and distortion of the clad 3 and the core 4 in the clad 3 can be reduced.
  • the distortion of the inner surface of the through-hole 33 where the entrance surfaces 41a, 42a, 43a of the core 4 are located is reduced, so that the light emitted from the first to third light emitting elements 21, 22, 23 can be efficiently emitted. It can be made incident on the core 4 .
  • the size and shape of the through hole 33 may be adapted to the outlines of the first to third light emitting elements 21, 22, 23. FIG. By arranging the first to third light emitting elements 21, 22, 23 in the through holes 33, they can be easily positioned.
  • the through-holes 33 are not limited to each element, and may be a single through-hole 34 as shown in FIG. 9, for example. All of the first light emitting element 21 , the second light emitting element 22 and the third light emitting element 23 may be positioned within a single through hole 34 .
  • the opening of a single through-hole 34 may have a shape that includes the openings of three through-holes 33 . In this case, when the light-emitting element 20 is mounted on the substrate 1, the possibility of the light-emitting element 20 colliding with the opening or the inner peripheral surface of the through-hole 34 can be reduced, thereby facilitating the mounting process of the light-emitting element 20.
  • the positions of the first incident surface 41a, the second incident surface 42a, and the third incident surface 43a are the same in the case of forming the through hole 33 for each element and the case of forming the single through hole 34. be able to.
  • the through hole 33 is formed for each element, at least one of the width direction (the Y direction in the drawing) and the length direction (the X direction in the drawing) of the through hole 33 is It may be larger than the light emitting element 20 .
  • the rigidity of the clad 3 can be increased compared to a single large through-hole 34 .
  • the light source module 100 may further include a lid body 6, a seal ring 7, and a condenser lens 8, as shown in FIGS. 1 and 3, for example.
  • the lid 6 is located on the third surface 3 b of the clad 3 and covers the first light emitting element 21 , the second light emitting element 22 and the third light emitting element 23 .
  • a seal ring 7 is positioned between the lid 6 and the clad 3 .
  • the seal ring 7 has a continuous annular shape, and collectively surrounds the openings of the three through holes 33 in plan view.
  • the lid 6 can be directly bonded to the clad by using heat bonding, for example. There is a possibility that optical axis misalignment may occur between them.
  • the mechanical strength around the through-hole 33 can be improved and the distortion of the clad 3 and the core 4 can be reduced. As a result, optical axis deviation between the light emitting element 20 and the core 4 can be suppressed.
  • Such a configuration can also be applied when the clad 3 has a single through-hole 34, and the effect of reducing strain on the clad 3 and the core 4 becomes more pronounced.
  • the lid 6 may be made of a glass material such as quartz, borosilicate glass, sapphire, or the like. Moreover, the lid 6 may be made of a compound semiconductor such as silicon, a metal such as Fe, Ni, Co, or an alloy containing these metals.
  • the seal ring 7 may be made of, for example, metals such as Ti, Ni, Au, Pt, and Cr, or alloys containing these metals. The seal ring 7 is fixed on the third surface 3b of the clad 3 by vapor deposition, sputtering, ion plating, plating, or the like.
  • the lid body 6 uses a sealing ring 7 and a bonding material such as Au—Sn or Sn—Ag—Cu solder, Ag, Cu, or other metallic nanoparticle paste, or glass paste, for example, to form a thermosetting bond. Alternatively, they may be joined by laser welding or the like.
  • a bonding material such as Au—Sn or Sn—Ag—Cu solder, Ag, Cu, or other metallic nanoparticle paste, or glass paste, for example, to form a thermosetting bond. Alternatively, they may be joined by laser welding or the like.
  • the seal ring 7 may be provided not on the clad 3 but on a portion of the lid 6 facing the clad 3 .
  • the seal ring 7 may be made of, for example, metals such as Ti, Ni, Au, Pt, and Cr, or alloys containing these metals.
  • the seal ring 7 may be fixed to the lid 6 by vapor deposition, sputtering, ion plating, plating, or the like.
  • the clad 3 uses a seal ring 7 and a bonding material such as Au—Sn or Sn—Ag—Cu solder, metal nanoparticle paste such as Ag or Cu, or glass paste for thermosetting bonding or They may be joined by laser welding or the like.
  • the seal ring 7 may be provided on both the clad 3 and the lid 6.
  • the seal rings 7 provided on each of the clad 3 and the lid 6 are bonded by, for example, Au--Sn-based or Sn--Ag--Cu-based solder, metal-based nanoparticle paste such as Ag or Cu, or glass paste. It may be joined by thermosetting joining, laser welding, or the like using a material.
  • the seal ring 7 is not essential, and may be used as long as the clad 3 and the lid 6 can be joined together to maintain a high degree of airtightness.
  • the condenser lens 8 is positioned on the optical path of the light emitted from the emission section 46 .
  • the condenser lens 8 may be configured to collimate the light emitted from the emission section 46 or may be configured to collect the light emitted from the emission section 46 .
  • the condenser lens 8 may be a plano-convex lens having a plane entrance surface facing the exit portion 46 and a convex exit surface.
  • the light source module 100 further includes a plurality of electrodes 9 for supplying driving current to the light emitting elements 20.
  • two electrodes 9 are arranged for each of the first light emitting element 21, the second light emitting element 22 and the third light emitting element 23.
  • the two electrodes 9 may be two parallel strip-shaped wires arranged on the first surface 1 a of the substrate 1 .
  • Each strip-shaped wiring has one end located in a region surrounded by the inner peripheral surface of the through hole 33 on the first surface 1a and the other end located in a region exposed from the clad 3 on the first surface 1a in plan view. may be located.
  • One end of each strip-shaped wiring is electrically connected to an electrode (p-electrode or n-electrode) of light-emitting element 20, and the other end of each strip-shaped wiring is electrically connected to an external power supply circuit.
  • the light source module 100 of the present disclosure includes a first light emitting element 21 that emits light of a first wavelength, a second light emitting element 22 that emits light of a second wavelength different from the first wavelength, the first wavelength and the second wavelength.
  • a third light emitting element 23 that emits light of a third wavelength different from the two wavelengths, a clad 3 , and a core 4 located within the clad 3 are provided.
  • the core 4 includes a first waveguide portion 41 through which light emitted from the first light emitting element 21 propagates, a second waveguide portion 42 through which light emitted from the second light emitting element 22 propagates, and the A third waveguide portion 43 through which light emitted from the third light emitting element 23 propagates, and at least two of the first waveguide portion 41, the second waveguide portion 42, and the third waveguide portion 43 It has a multiplexing section 44 where the waveguides 40 meet, and an output section 46 positioned at one end of the multiplexing wave section 44 .
  • the at least two waveguide portions 40 have a first portion 40a into which light is incident and a second portion 40b adjacent to the multiplexing portion 44, and the width of the first portion 40a is equal to the width of the second portion 40b. greater than the width of portion 40b.
  • the light source module 100 of the present disclosure can efficiently cause the light emitted from the light emitting element 20 to enter the waveguide section 40 .

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Semiconductor Lasers (AREA)
  • Optical Integrated Circuits (AREA)
PCT/JP2022/021443 2021-05-28 2022-05-25 光源モジュール Ceased WO2022250092A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP22811362.7A EP4350401A4 (en) 2021-05-28 2022-05-25 Light source module
CN202280038118.6A CN117396785A (zh) 2021-05-28 2022-05-25 光源模块
JP2023523510A JPWO2022250092A1 (https=) 2021-05-28 2022-05-25
US18/564,408 US12292590B2 (en) 2021-05-28 2022-05-25 Light source module

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021090062 2021-05-28
JP2021-090062 2021-05-28

Publications (1)

Publication Number Publication Date
WO2022250092A1 true WO2022250092A1 (ja) 2022-12-01

Family

ID=84230128

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2022/021443 Ceased WO2022250092A1 (ja) 2021-05-28 2022-05-25 光源モジュール

Country Status (6)

Country Link
US (1) US12292590B2 (https=)
EP (1) EP4350401A4 (https=)
JP (1) JPWO2022250092A1 (https=)
CN (1) CN117396785A (https=)
TW (1) TWI873424B (https=)
WO (1) WO2022250092A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62183405A (ja) 1986-02-08 1987-08-11 Agency Of Ind Science & Technol テ−パ付光導波回路及びその製造方法
KR20040017539A (ko) * 2002-08-22 2004-02-27 우리로광통신주식회사 3분기형 광 도파로
JP2005070573A (ja) * 2003-08-27 2005-03-17 Sony Corp 光導波路、光源モジュール、並びに光情報処理装置
JP2005266657A (ja) * 2004-03-22 2005-09-29 Sony Corp 光導波路、光導波路装置及び光情報処理装置
JP2020194071A (ja) * 2019-05-28 2020-12-03 京セラ株式会社 光導波路及びｒｇｂ発光装置
WO2021065948A1 (ja) * 2019-09-30 2021-04-08 京セラ株式会社 光導波路パッケージおよび発光装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10256365A1 (de) * 2001-12-04 2003-07-17 Ccs Inc Lichtabstrahlungsvorrichtung, Lichtquellenvorrichtung, Beleuchtungseinheit und Lichtverbindungsmechanismus
JP2006012888A (ja) * 2004-06-22 2006-01-12 Fuji Photo Film Co Ltd 合波レーザ光照射方法および装置
JP2007041378A (ja) * 2005-08-04 2007-02-15 Fujifilm Corp 合波光源
WO2017090333A1 (ja) * 2015-11-27 2017-06-01 シャープ株式会社 光導波路素子及び光源モジュール
JP7187148B2 (ja) * 2017-12-13 2022-12-12 日東電工株式会社 光導波路
US12181723B2 (en) * 2019-09-30 2024-12-31 Kyocera Corporation Optical waveguide package and light-emitting device
US12512252B2 (en) 2022-06-15 2025-12-30 Analog Devices, Inc. Monolithic or multi-die integrated circuit transformer

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62183405A (ja) 1986-02-08 1987-08-11 Agency Of Ind Science & Technol テ−パ付光導波回路及びその製造方法
KR20040017539A (ko) * 2002-08-22 2004-02-27 우리로광통신주식회사 3분기형 광 도파로
JP2005070573A (ja) * 2003-08-27 2005-03-17 Sony Corp 光導波路、光源モジュール、並びに光情報処理装置
JP2005266657A (ja) * 2004-03-22 2005-09-29 Sony Corp 光導波路、光導波路装置及び光情報処理装置
JP2020194071A (ja) * 2019-05-28 2020-12-03 京セラ株式会社 光導波路及びｒｇｂ発光装置
WO2021065948A1 (ja) * 2019-09-30 2021-04-08 京セラ株式会社 光導波路パッケージおよび発光装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP4350401A4

Also Published As

Publication number Publication date
TW202305484A (zh) 2023-02-01
US12292590B2 (en) 2025-05-06
CN117396785A (zh) 2024-01-12
US20240255686A1 (en) 2024-08-01
JPWO2022250092A1 (https=) 2022-12-01
EP4350401A4 (en) 2025-04-30
TWI873424B (zh) 2025-02-21
EP4350401A1 (en) 2024-04-10

Similar Documents

Publication Publication Date Title
JP7528213B2 (ja) 光導波路パッケージ、発光装置および投影システム
US20220350097A1 (en) Optical waveguide package and light-emitting device
US20220390689A1 (en) Optical waveguide package and light-emitting device
JP6848245B2 (ja) 発光装置
US12191628B2 (en) Semiconductor light emitting device
WO2022250092A1 (ja) 光源モジュール
JP7711212B2 (ja) 光導波路パッケージおよび光源モジュール
US20240372315A1 (en) Semiconductor light emitting device
EP4400879A1 (en) Light-emitting device
CN121420435A (zh) 激光封装件和包括激光封装件的激光装置
US12276823B2 (en) Light source module
US20250306319A1 (en) Optical waveguide package and light-emitting device
TW202443215A (zh) 光波導封裝及光源模組
US20250023001A1 (en) Optical waveguide package and light-emitting device
US20080031575A1 (en) Optoelectronic module
JP2021057363A (ja) 発光装置の製造方法及び発光装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 22811362

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 202280038118.6

Country of ref document: CN

Ref document number: 18564408

Country of ref document: US

Ref document number: 2023523510

Country of ref document: JP

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 2022811362

Country of ref document: EP

ENP Entry into the national phase

Ref document number: 2022811362

Country of ref document: EP

Effective date: 20240102

WWW Wipo information: withdrawn in national office

Ref document number: 2022811362

Country of ref document: EP

WWG Wipo information: grant in national office

Ref document number: 18564408

Country of ref document: US