WO2022249922A1 - 塗料組成物及び積層体 - Google Patents
塗料組成物及び積層体 Download PDFInfo
- Publication number
- WO2022249922A1 WO2022249922A1 PCT/JP2022/020428 JP2022020428W WO2022249922A1 WO 2022249922 A1 WO2022249922 A1 WO 2022249922A1 JP 2022020428 W JP2022020428 W JP 2022020428W WO 2022249922 A1 WO2022249922 A1 WO 2022249922A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- fluororesin
- coating composition
- group
- composition according
- coating
- Prior art date
Links
- 239000008199 coating composition Substances 0.000 title claims abstract description 55
- 125000000524 functional group Chemical group 0.000 claims abstract description 58
- 239000004094 surface-active agent Substances 0.000 claims abstract description 29
- 239000011256 inorganic filler Substances 0.000 claims abstract description 25
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 25
- 239000011247 coating layer Substances 0.000 claims abstract description 19
- 239000007788 liquid Substances 0.000 claims abstract description 8
- 229920001577 copolymer Polymers 0.000 claims description 35
- 239000002245 particle Substances 0.000 claims description 34
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 26
- 239000000758 substrate Substances 0.000 claims description 20
- 125000004432 carbon atom Chemical group C* 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 12
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 12
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 9
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 8
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 claims description 6
- 229920000642 polymer Polymers 0.000 claims description 5
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 claims description 5
- OWIKHYCFFJSOEH-UHFFFAOYSA-N Isocyanic acid Chemical group N=C=O OWIKHYCFFJSOEH-UHFFFAOYSA-N 0.000 claims description 4
- 239000003989 dielectric material Substances 0.000 claims description 4
- 150000001265 acyl fluorides Chemical group 0.000 claims description 3
- 125000001160 methoxycarbonyl group Chemical group [H]C([H])([H])OC(*)=O 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 abstract description 12
- 230000000704 physical effect Effects 0.000 abstract description 4
- 238000000576 coating method Methods 0.000 description 46
- 239000011248 coating agent Substances 0.000 description 42
- -1 maleic anhydride) Chemical class 0.000 description 28
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 18
- 239000011889 copper foil Substances 0.000 description 17
- 239000000178 monomer Substances 0.000 description 17
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 16
- 238000000034 method Methods 0.000 description 16
- 239000006185 dispersion Substances 0.000 description 15
- 239000000853 adhesive Substances 0.000 description 11
- 238000009835 boiling Methods 0.000 description 11
- 229910052731 fluorine Inorganic materials 0.000 description 11
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 10
- 239000010410 layer Substances 0.000 description 10
- 150000001875 compounds Chemical class 0.000 description 9
- 239000011737 fluorine Substances 0.000 description 9
- 239000000843 powder Substances 0.000 description 9
- 239000002904 solvent Substances 0.000 description 9
- 238000010521 absorption reaction Methods 0.000 description 8
- 238000001035 drying Methods 0.000 description 8
- 238000002844 melting Methods 0.000 description 8
- 230000008018 melting Effects 0.000 description 8
- 238000002156 mixing Methods 0.000 description 8
- 239000003973 paint Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 230000003746 surface roughness Effects 0.000 description 8
- 239000003021 water soluble solvent Substances 0.000 description 8
- 230000002776 aggregation Effects 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- 239000003505 polymerization initiator Substances 0.000 description 7
- 229920001296 polysiloxane Polymers 0.000 description 7
- 239000000377 silicon dioxide Substances 0.000 description 7
- 238000004220 aggregation Methods 0.000 description 6
- 238000003682 fluorination reaction Methods 0.000 description 6
- 239000007789 gas Substances 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 6
- 239000003960 organic solvent Substances 0.000 description 6
- 239000007787 solid Substances 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- 239000002736 nonionic surfactant Substances 0.000 description 5
- KHXKESCWFMPTFT-UHFFFAOYSA-N 1,1,1,2,2,3,3-heptafluoro-3-(1,2,2-trifluoroethenoxy)propane Chemical compound FC(F)=C(F)OC(F)(F)C(F)(F)C(F)(F)F KHXKESCWFMPTFT-UHFFFAOYSA-N 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 4
- 150000005215 alkyl ethers Chemical class 0.000 description 4
- 239000012986 chain transfer agent Substances 0.000 description 4
- 238000013329 compounding Methods 0.000 description 4
- 125000001153 fluoro group Chemical group F* 0.000 description 4
- 229920002313 fluoropolymer Polymers 0.000 description 4
- 239000004811 fluoropolymer Substances 0.000 description 4
- 230000009477 glass transition Effects 0.000 description 4
- 230000005484 gravity Effects 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- KWIUHFFTVRNATP-UHFFFAOYSA-N Betaine Natural products C[N+](C)(C)CC([O-])=O KWIUHFFTVRNATP-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- KWIUHFFTVRNATP-UHFFFAOYSA-O N,N,N-trimethylglycinium Chemical compound C[N+](C)(C)CC(O)=O KWIUHFFTVRNATP-UHFFFAOYSA-O 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 230000002411 adverse Effects 0.000 description 3
- 239000003945 anionic surfactant Substances 0.000 description 3
- 125000004429 atom Chemical group 0.000 description 3
- 229960003237 betaine Drugs 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 229910001873 dinitrogen Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000007720 emulsion polymerization reaction Methods 0.000 description 3
- 238000010304 firing Methods 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000011261 inert gas Substances 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 239000011734 sodium Substances 0.000 description 3
- 229910052708 sodium Inorganic materials 0.000 description 3
- 238000001228 spectrum Methods 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- 238000010557 suspension polymerization reaction Methods 0.000 description 3
- 230000008961 swelling Effects 0.000 description 3
- MIZLGWKEZAPEFJ-UHFFFAOYSA-N 1,1,2-trifluoroethene Chemical group FC=C(F)F MIZLGWKEZAPEFJ-UHFFFAOYSA-N 0.000 description 2
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 2
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 2
- LVYXPOCADCXMLP-UHFFFAOYSA-N 3-butoxy-n,n-dimethylpropanamide Chemical compound CCCCOCCC(=O)N(C)C LVYXPOCADCXMLP-UHFFFAOYSA-N 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- 241000282320 Panthera leo Species 0.000 description 2
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000002280 amphoteric surfactant Substances 0.000 description 2
- 230000008033 biological extinction Effects 0.000 description 2
- 229910052794 bromium Inorganic materials 0.000 description 2
- BTANRVKWQNVYAZ-UHFFFAOYSA-N butan-2-ol Chemical compound CCC(C)O BTANRVKWQNVYAZ-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 239000003093 cationic surfactant Substances 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- UUAGAQFQZIEFAH-UHFFFAOYSA-N chlorotrifluoroethylene Chemical group FC(F)=C(F)Cl UUAGAQFQZIEFAH-UHFFFAOYSA-N 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000012776 electronic material Substances 0.000 description 2
- 239000000839 emulsion Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- FJKIXWOMBXYWOQ-UHFFFAOYSA-N ethenoxyethane Chemical compound CCOC=C FJKIXWOMBXYWOQ-UHFFFAOYSA-N 0.000 description 2
- 125000003709 fluoroalkyl group Chemical group 0.000 description 2
- XUCNUKMRBVNAPB-UHFFFAOYSA-N fluoroethene Chemical compound FC=C XUCNUKMRBVNAPB-UHFFFAOYSA-N 0.000 description 2
- 239000005350 fused silica glass Substances 0.000 description 2
- 235000011187 glycerol Nutrition 0.000 description 2
- 229910003437 indium oxide Inorganic materials 0.000 description 2
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 2
- 229910052740 iodine Inorganic materials 0.000 description 2
- 239000004745 nonwoven fabric Substances 0.000 description 2
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 2
- 150000002978 peroxides Chemical class 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 230000000379 polymerizing effect Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000454 talc Substances 0.000 description 2
- 229910052623 talc Inorganic materials 0.000 description 2
- 239000002562 thickening agent Substances 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- 239000002759 woven fabric Substances 0.000 description 2
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- BLTXWCKMNMYXEA-UHFFFAOYSA-N 1,1,2-trifluoro-2-(trifluoromethoxy)ethene Chemical compound FC(F)=C(F)OC(F)(F)F BLTXWCKMNMYXEA-UHFFFAOYSA-N 0.000 description 1
- BQCIDUSAKPWEOX-UHFFFAOYSA-N 1,1-Difluoroethene Chemical compound FC(F)=C BQCIDUSAKPWEOX-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- ODYWKGZHVSUTKO-UHFFFAOYSA-N 2-ethylhexan-1-ol;oxirane Chemical class C1CO1.CCCCC(CC)CO ODYWKGZHVSUTKO-UHFFFAOYSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- AYKYXWQEBUNJCN-UHFFFAOYSA-N 3-methylfuran-2,5-dione Chemical compound CC1=CC(=O)OC1=O AYKYXWQEBUNJCN-UHFFFAOYSA-N 0.000 description 1
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 229920002943 EPDM rubber Polymers 0.000 description 1
- RAXXELZNTBOGNW-UHFFFAOYSA-O Imidazolium Chemical compound C1=C[NH+]=CN1 RAXXELZNTBOGNW-UHFFFAOYSA-O 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- UWHCKJMYHZGTIT-UHFFFAOYSA-N Tetraethylene glycol, Natural products OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 238000002835 absorbance Methods 0.000 description 1
- 238000000862 absorption spectrum Methods 0.000 description 1
- 239000006230 acetylene black Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 125000003282 alkyl amino group Chemical group 0.000 description 1
- 125000005210 alkyl ammonium group Chemical group 0.000 description 1
- 125000005907 alkyl ester group Chemical group 0.000 description 1
- OBETXYAYXDNJHR-UHFFFAOYSA-N alpha-ethylcaproic acid Natural products CCCCC(CC)C(O)=O OBETXYAYXDNJHR-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 230000003064 anti-oxidating effect Effects 0.000 description 1
- 230000002421 anti-septic effect Effects 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 229910000410 antimony oxide Inorganic materials 0.000 description 1
- 229940064004 antiseptic throat preparations Drugs 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910001593 boehmite Inorganic materials 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 238000012662 bulk polymerization Methods 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 150000001722 carbon compounds Chemical class 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 125000006297 carbonyl amino group Chemical group [H]N([*:2])C([*:1])=O 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- 238000007607 die coating method Methods 0.000 description 1
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229920001973 fluoroelastomer Polymers 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- HCDGVLDPFQMKDK-UHFFFAOYSA-N hexafluoropropylene Chemical group FC(F)=C(F)C(F)(F)F HCDGVLDPFQMKDK-UHFFFAOYSA-N 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- FAHBNUUHRFUEAI-UHFFFAOYSA-M hydroxidooxidoaluminium Chemical compound O[Al]=O FAHBNUUHRFUEAI-UHFFFAOYSA-M 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000012844 infrared spectroscopy analysis Methods 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- NNIPDXPTJYIMKW-UHFFFAOYSA-N iron tin Chemical compound [Fe].[Sn] NNIPDXPTJYIMKW-UHFFFAOYSA-N 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 239000003273 ketjen black Substances 0.000 description 1
- 238000007561 laser diffraction method Methods 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 150000004692 metal hydroxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 229910052901 montmorillonite Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 1
- 125000006353 oxyethylene group Chemical group 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 125000005010 perfluoroalkyl group Chemical group 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- ONJQDTZCDSESIW-UHFFFAOYSA-N polidocanol Chemical compound CCCCCCCCCCCCOCCOCCOCCOCCOCCOCCOCCOCCOCCO ONJQDTZCDSESIW-UHFFFAOYSA-N 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000011164 primary particle Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 238000000790 scattering method Methods 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910021647 smectite Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 239000012756 surface treatment agent Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D127/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers
- C09D127/02—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment
- C09D127/12—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
- C09D127/16—Homopolymers or copolymers of vinylidene fluoride
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D127/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers
- C09D127/02—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment
- C09D127/12—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
- C09D127/18—Homopolymers or copolymers of tetrafluoroethene
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
- C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L27/12—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
- C08L27/18—Homopolymers or copolymers or tetrafluoroethene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
- C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L27/12—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
- C08L27/20—Homopolymers or copolymers of hexafluoropropene
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/45—Anti-settling agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/20—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances liquids, e.g. oils
- H01B3/24—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances liquids, e.g. oils containing halogen in the molecules, e.g. halogenated oils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F114/00—Homopolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen
- C08F114/18—Monomers containing fluorine
- C08F114/26—Tetrafluoroethene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F214/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen
- C08F214/18—Monomers containing fluorine
- C08F214/26—Tetrafluoroethene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F214/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen
- C08F214/18—Monomers containing fluorine
- C08F214/26—Tetrafluoroethene
- C08F214/262—Tetrafluoroethene with fluorinated vinyl ethers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
- H01B3/443—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from vinylhalogenides or other halogenoethylenic compounds
- H01B3/445—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from vinylhalogenides or other halogenoethylenic compounds from vinylfluorides or other fluoroethylenic compounds
Definitions
- the present disclosure relates to coating compositions and laminates.
- Patent Documents 1 to 3 The field of electronic materials is known as one of the uses of coating compositions containing fluororesins.
- printed circuit board materials corresponding to frequencies in the high frequency band have also been studied (Patent Documents 1 to 3).
- Patent Document 4 discloses a fluororesin composition having a carbonyl group-containing functional group in a specific proportion and silica as a fluororesin in order to improve adhesion and coefficient of linear expansion.
- An object of the present disclosure is to provide a coating composition and a laminate that can be suitably used particularly in the field of electronic materials.
- the present disclosure is a coating composition containing two or more types of fluororesins, wherein at least one type of fluororesin is a fluororesin (I) having a functional group number of 30 to 1000 per 10 6 main chain carbon atoms.
- a coating composition characterized by containing an inorganic filler, a surfactant and a liquid medium.
- the functional group contained in the fluororesin (I) is preferably a carbonyl group-containing group.
- the carbonyl group-containing group is preferably at least one group selected from the group consisting of a carbonylamide group, a carboxy group, an acyl fluoride group, and a methoxycarbonyl group.
- the fluororesin (I) is preferably a tetrafluoroethylene/hexafluoropropylene copolymer (FEP) or a tetrafluoroethylene/perfluoroalkyl vinyl ether copolymer (PFA).
- the functional group contained in the fluororesin (I) is preferably at the end of the polymer main chain.
- the other fluororesin includes fluororesin (II) having less than 30 functional groups per 10 6 main chain carbon atoms. It is preferable that the average particle size of the fluororesin is less than 0.3 ⁇ m. At least one of the fluororesins is preferably PTFE.
- the inorganic filler is preferably silica particles. The silica particles preferably have a specific surface area of less than 6.5 m 2 /g.
- the surfactant is preferably a non-fluorinated surfactant.
- the liquid medium preferably contains water.
- the present disclosure also provides a laminate characterized by having a coating film layer formed by coating the above coating composition on a substrate.
- the base material is preferably a metal material.
- the laminate is preferably a printed circuit board, a dielectric material for a board, or a laminated circuit board.
- Fluoropolymers are known for their excellent heat resistance, weather resistance, oil resistance, solvent resistance, chemical resistance, and non-adhesiveness, and are used in a variety of applications and in various forms such as powders and films.
- Laminates having fluororesin insulating layers are also mainly used for printed wiring boards used for applications in the high frequency range of several tens of gigahertz, from the viewpoint of dielectric properties and hygroscopicity.
- the printed wiring board needs to be heated to a high temperature for soldering during processing. Therefore, it is necessary that the resin has excellent heat resistance. Therefore, it is necessary to have all the properties of heat resistance, film-forming properties, and adhesiveness.
- the present disclosure incorporates two or more types of fluororesins in the coating composition, and the number of functional groups of at least one type of fluororesin is 30 to 1000 per 10 6 main chain carbon atoms. It has been found that good adhesiveness can be imparted and good heat resistance performance can be obtained. The present disclosure will now be described in detail.
- the coating composition of the present disclosure contains two or more types of fluororesins, and at least one type of fluororesin has a functional group. Further, in the fluororesin having the functional group, it is essential that the number of functional groups is 30 to 1000 per 106 carbon atoms in the main chain (hereinafter referred to as fluororesin (I)).
- the functional group here means a functional group that interacts with the surface of the adherend and contributes to the improvement of adhesiveness. Specifically, the functional groups shown in Table 1 below are preferred.
- the coating composition of the present disclosure contains the fluororesin (I) and another fluororesin (hereinafter referred to as fluororesin (II)) in combination.
- the fluororesin (II) is not particularly limited, and preferably has less than 30 functional groups per 10 6 main chain carbon atoms. That is, it preferably differs from the fluororesin (I) in terms of the number of functional groups.
- the lower limit of the number of functional groups is more preferably 50, more preferably 100.
- the upper limit of the number of functional groups is more preferably 700, and still more preferably 500.
- Infrared spectroscopic analysis can be used to identify the types of functional groups and measure the number of functional groups.
- the number of functional groups can be analyzed from an aqueous dispersion of the fluororesin alone, but can also be analyzed by isolating the target fluororesin from the paint.
- the number of functional groups is measured by the following method.
- a tablet was prepared using the fluororesin powder and KBr.
- the tablet is analyzed by Fourier transform infrared spectroscopy to obtain the infrared absorption spectrum of the fluororesin, and the difference spectrum from the fully fluorinated base spectrum in which no functional groups are present. From the absorption peak of the specific functional group appearing in this difference spectrum, the number N of functional groups per 1 ⁇ 10 6 main chain carbon atoms in the fluororesin is calculated according to the following formula (A).
- N I ⁇ K/t (A)
- K Correction coefficient
- t Film thickness (mm)
- Table 1 shows absorption frequencies, molar extinction coefficients, and correction coefficients for functional groups in the present disclosure. Also, the molar extinction coefficient was determined from the FT-IR measurement data of the low-molecular-weight model compound.
- the absorption frequencies of —CH 2 CF 2 H, —CH 2 COF, —CH 2 COOH, —CH 2 COOCH 3 and —CH 2 CONH 2 are shown in the table, respectively, —CF 2 H, —COF, —
- the absorption frequencies of COOH free, -COOH bonded, -COOCH 3 and -CONH 2 are several tens of Kaiser (cm -1 ) lower. Therefore, for example, the number of functional groups of —COF is obtained from the number of functional groups obtained from the absorption peak at an absorption frequency of 1883 cm ⁇ 1 due to —CF 2 COF, and the number of functional groups obtained from the absorption peak at an absorption frequency of 1840 cm ⁇ 1 due to —CH 2 COF. It is the sum of the calculated number of functional groups.
- the above-mentioned functional groups are functional groups present at the main chain end or side chain end of the fluororesin (I) and functional groups present in the main chain or side chains.
- the functional group is preferably at the end of the polymer backbone. Adhesion can be efficiently improved by having a functional group at the end of the polymer.
- the functional group is preferably a carbonyl group-containing group, among which at least one group selected from the group consisting of a carbonylamide group, a carboxy group, an acyl fluoride group, and a methoxycarbonyl group is more preferable.
- a carboxy group and a carbonylamide group are particularly preferred from the viewpoint of imparting adhesiveness.
- the above functional groups are introduced into the fluororesin by, for example, a chain transfer agent or a polymerization initiator used in producing the fluororesin.
- a chain transfer agent or a polymerization initiator used in producing the fluororesin.
- —CH 2 OH is introduced at the main chain end of the fluorine resin.
- a monomer having a functional group for example, itaconic anhydride, citraconic anhydride, hymic anhydride, acid anhydride of unsaturated dicarboxylic acid such as maleic anhydride
- the functional group is a fluororesin may have been introduced into
- the functional group is introduced at the end of the fluororesin by a chain transfer agent or a polymerization initiator used in producing the fluororesin.
- a chain transfer agent or a polymerization initiator used in producing the fluororesin is preferable in terms of better adhesion.
- the above functional groups are those introduced at the end of the fluororesin by the chain transfer agent or polymerization initiator used in the production of the fluororesin, and are further reacted to convert to other structures. There may be. There is also a method of subjecting fluororesin powder to corona treatment to generate functional groups at the ends of the main chain.
- the fluororesin (I) preferably has a melting point of 190 to 350°C.
- the melting point is more preferably 200° C. or higher, still more preferably 220° C. or higher, particularly preferably 280° C. or higher, and more preferably 330° C. or lower.
- the above melting point is the temperature corresponding to the maximum value in the heat of fusion curve when the temperature is raised at a rate of 10° C./min using a differential scanning calorimeter [DSC].
- the fluororesin (I) a fluororesin that has fluidity when melted and is melt-processable is preferable.
- copolymers containing tetrafluoroethylene units (TFE units) and fluoroalkylallyl ether or (per)fluoro(alkyl vinyl ether) units (PAVE units) (hereinafter referred to as TFE / fluoroalkyl allyl ether or PAVE copolymer (or PFA)), and a copolymer containing TFE units and hexafluoropropylene units (HFP units) (hereinafter referred to as TFE / HFP copolymer (or More preferred is at least one copolymer selected from the group consisting of FEP)).
- TFE/ HFP copolymer More preferred is at least one copolymer selected from the group consisting of FEP)
- Perfluoro(alkyl vinyl ether) may be either fluoroalkyl vinyl ether or perfluoro(alkyl vinyl ether).
- perfluoro(alkyl vinyl ether) is an alkyl vinyl ether that does not contain a C—H bond.
- CF2 CFO( CF2CFY1O ) p- ( CF2CF2CF2O ) q - Rf (1)
- Y 1 represents F or CF 3
- R f represents a perfluoroalkyl group having 1 to 5 carbon atoms
- p represents an integer of 0 to 5
- q represents an integer of 0 to 5.
- CFX CXOCF2OR1 ( 2 )
- X is the same or different and represents H, F or CF3
- R1 is at least one atom selected from the group consisting of linear or branched H, Cl, Br and I
- a fluoroalkyl group having 1 to 6 carbon atoms which may contain 1 to 2 atoms, or 1 to 2 atoms of at least one selected from the group consisting of H, Cl, Br and I It represents a cyclic fluoroalkyl group having 5 or 6 carbon atoms.
- the PAVE is preferably a monomer represented by the general formula (1), and is selected from the group consisting of perfluoro(methyl vinyl ether), perfluoro(ethyl vinyl ether) and perfluoro(propyl vinyl ether) (PPVE). At least one selected is more preferred, and PPVE is even more preferred.
- the content of PAVE units in the TFE/PAVE copolymer is preferably 1.0 to 10% by mass, more preferably 2.0% by mass or more, and still more preferably, based on the total monomer units. is 3.5% by mass or more, particularly preferably 4.0% by mass or more, most preferably 5.0% by mass or more, more preferably 8.0% by mass or less, and still more preferably 7 0% by mass or less, particularly preferably 6.5% by mass or less, and most preferably 6.0% by mass or less.
- the above PAVE unit amount is measured by the 19 F-NMR method.
- the TFE/PAVE copolymer may be a copolymer consisting only of TFE units and PAVE units.
- the melting point is preferably 280 to 322°C, more preferably 290°C or higher, and more preferably 315°C or lower.
- the glass transition temperature (Tg) is preferably 70 to 110°C, more preferably 80°C or higher, and more preferably 100°C or lower. is.
- the glass transition temperature is a value obtained by dynamic viscoelasticity measurement.
- the TFE/HFP copolymer contains TFE units and HFP units.
- the content of TFE units in the TFE/HFP copolymer is preferably 70% by mass or more, more preferably 85% by mass or more, and preferably 99.8% by mass, based on the total monomer units. or less, more preferably 99% by mass or less, and still more preferably 98% by mass or less.
- the TFE/HFP copolymer preferably has a mass ratio of TFE units to HFP units (TFE/HFP) of 70 to 99/1 to 30 (% by mass).
- the mass ratio (TFE/HFP) is more preferably 85-95/5-15 (% by mass).
- the TFE/HFP copolymer may further contain (per)fluoro(alkyl vinyl ether) (PAVE) units.
- PAVE perfluoro(alkyl vinyl ether)
- Examples of the PAVE units contained in the TFE/HFP copolymer include the same PAVE units as those described above.
- the TFE/PAVE copolymers described above do not contain HFP units, and in that respect differ from TFE/HFP/PAVE copolymers.
- the mass ratio (TFE/HFP /PAVE) is preferably 70 to 99.8/0.1 to 25/0.1 to 25 (% by mass). More preferably, the mass ratio (TFE/HFP/PAVE) is 75-98/1.0-15/1.0-10 (% by mass).
- the TFE/HFP/PAVE copolymer preferably contains 1% by mass or more of HFP units and PAVE units in total with respect to all monomer units.
- the TFE/HFP/PAVE copolymer preferably contains HFP units in an amount of 25% by mass or less of all monomer units.
- the content of HFP units is more preferably 20% by mass or less, still more preferably 18% by mass or less, and particularly preferably 15% by mass or less.
- the content of HFP units is preferably 0.1% by mass or more, more preferably 1% by mass or more, and particularly preferably 2% by mass or more.
- the content of HFP units can be measured by the 19 F-NMR method.
- the content of PAVE units is more preferably 20% by mass or less, still more preferably 10% by mass or less. Especially preferably, it is 3% by mass or less.
- the content of PAVE units is preferably 0.1% by mass or more, more preferably 1% by mass or more.
- the PAVE unit content can be measured by the 19 F-NMR method.
- the TFE/PAVE copolymer and the TFE/HFP copolymer may further contain other ethylenic monomer ( ⁇ ) units.
- the other ethylenic monomer ( ⁇ ) unit is not particularly limited as long as it is a monomer unit copolymerizable with TFE, HFP and PAVE. Examples include vinyl fluoride (VF), vinylidene fluoride (VdF ), trifluoroethylene (TrFE) and chlorotrifluoroethylene (CTFE), and non-fluorinated ethylenic monomers such as ethylene, propylene and alkyl vinyl ether.
- the content of other ethylenic monomer ( ⁇ ) units is preferably 0 to 25% by mass, more preferably 0.1 to 25% by mass.
- the mass ratio (TFE/HFP/PAVE/other ethylenic monomer ( ⁇ )) is It is preferably 70 to 98/0.1 to 25/0.1 to 25/0.1 to 25 (% by mass).
- the TFE/HFP/PAVE/other ethylenic monomer ( ⁇ ) copolymer preferably contains 1% by mass or more of monomer units other than TFE units in total.
- the melting point of the TFE/HFP copolymer is preferably 200 to 322° C., more preferably over 200° C., still more preferably 220° C. or higher, more preferably 300° C. or lower, and still more preferably 280° C. or less.
- the glass transition temperature (Tg) of the TFE/HFP copolymer is preferably 60 to 110°C, more preferably 65°C or higher, and more preferably 100°C or lower.
- the glass transition temperature is a value obtained by dynamic viscoelasticity measurement.
- the fluororesin (I) can be produced, for example, by a conventionally known method such as emulsion polymerization or suspension polymerization by appropriately mixing additives such as monomers constituting the constituent units and polymerization initiators. can. Among them, those obtained by emulsion polymerization are more preferable.
- the fluororesin (I) preferably has an MFR value in the range of 0.5 to 100 measured at 372° C. with a load of 5 kg. Such a range is preferable in that it becomes easy to obtain the above-described amount of functional groups from the terminal functional groups.
- the coating composition of the present disclosure contains the fluororesin (I) and another fluororesin (II) in combination.
- the fluororesin (II) is not particularly limited, and preferably has less than 30 functional groups per 10 6 main chain carbon atoms. That is, it preferably differs from the fluororesin (I) in terms of the number of functional groups.
- a fluororesin having a large number of functional groups exhibits excellent performance in terms of adhesion, but on the other hand, it tends to have insufficient electrical properties and heat resistance. Therefore, it is preferable to use a combination of fluororesins having excellent electrical properties and heat resistance as the fluororesin (II). This makes it possible to form a coating film layer having excellent coating film properties such as electrical properties and heat resistance.
- the fluororesin (II) is not particularly limited as long as it is a fluorine-containing resin, and examples thereof include polytetrafluoroethylene resin (PTFE), PFA, and FEP. Among these, PTFE is particularly preferred. Furthermore, PTFE is preferable because the homopolymer of TFE has particles that are soft and stick easily, so that cracks are less likely to occur.
- the softness index is not particularly limited, but the Shore hardness (D scale) is preferably D65 or less, more preferably D60 or less, and particularly preferably D55 or less.
- PFA and FEP it is preferable to use those having the same resin composition as the fluororesin (I) described above, but different in the number of functional groups from that of the fluororesin (I).
- the method of polymerizing the fluororesin (II) is not particularly limited, and includes bulk polymerization, suspension polymerization, solution polymerization, emulsion polymerization and the like.
- the conditions such as temperature and pressure, the polymerization initiator and other additives can be appropriately set according to the desired composition and amount of the fluororesin.
- the fluororesin (II) may be converted to the fluororesin having the number of functional groups within the above range by fluorination treatment.
- the fluorination treatment can be carried out by contacting a fluororesin that has not been fluorinated with a fluorine-containing compound.
- the fluorine-containing compound is not particularly limited, but includes fluorine radical sources that generate fluorine radicals under fluorination treatment conditions.
- fluorine radical source include F 2 gas, CoF 3 , AgF 2 , UF 6 , OF 2 , N 2 F 2 , CF 3 OF, halogen fluoride (eg IF 5 and ClF 3 ), and the like.
- the fluorine radical source such as the F 2 gas may have a concentration of 100%, but from the viewpoint of ease of handling, it is preferable to mix it with an inert gas and dilute it to 5 to 50% by mass. It is more preferable to dilute to 30% by mass before use.
- the inert gas include nitrogen gas, helium gas, argon gas, etc. Nitrogen gas is preferable from the economical point of view.
- the conditions for the fluorination treatment are not particularly limited, and the fluororesin in a molten state may be brought into contact with the fluorine-containing compound. can be carried out at a temperature of 100-200°C.
- the fluorination treatment is generally carried out for 1 to 30 hours, preferably 5 to 25 hours.
- the fluorination treatment is preferably carried out by contacting an unfluorinated fluororesin with a fluorine gas ( F2 gas).
- the fluororesin in the coating composition of the present disclosure is preferably present in the coating composition in the form of particles.
- the average particle size of the fluororesin particles is preferably less than 0.3 ⁇ m.
- the average particle size is not limited to the fluororesin (I) or the fluororesin (II), but is a value calculated by measuring from particles randomly selected from the fluororesin particles contained in the coating composition. is. Specifically, the coating composition was diluted 1000 times with water, and one drop of the diluted solution was placed on an aluminum foil and allowed to air dry. It is a value obtained by measuring the particle size from the image data of 50 randomly selected particles using analysis software and calculating the average.
- the lower limit of the average particle size is preferably 0.05 ⁇ m, more preferably 0.07 ⁇ m, and even more preferably 0.1 ⁇ m.
- the coating composition of the present disclosure further contains an inorganic filler for improving electrical properties, strength, heat resistance, and the like.
- the inorganic filler is not particularly limited, and examples include silica (more specifically, crystalline silica, fused silica, spherical fused silica, etc.), titanium oxide, zirconium oxide, zinc oxide, tin oxide, silicon nitride, silicon carbide, nitride Inorganic compounds such as boron, calcium carbonate, calcium silicate, potassium titanate, aluminum nitride, indium oxide, alumina, antimony oxide, cerium oxide, magnesium oxide, iron oxide, and tin-doped indium oxide (ITO).
- silica more specifically, crystalline silica, fused silica, spherical fused silica, etc.
- titanium oxide zirconium oxide
- zinc oxide tin oxide
- silicon nitride silicon carbide
- Inorganic compounds such as boro
- minerals such as montmorillonite, talc, mica, boehmite, kaolin, smectite, xonolite, verculite and sericite.
- Other fillers include carbon compounds such as carbon black, acetylene black, ketjen black, and carbon nanotubes; metal hydroxides such as aluminum hydroxide and magnesium hydroxide; various glasses such as glass beads, glass flakes, and glass balloons. can be mentioned.
- the inorganic filler one or two or more inorganic fillers can be used. Further, the inorganic filler may be used as a powder as it is, or may be used after being dispersed in a resin.
- silica As the inorganic filler, silica, alumina, titanium oxide, boron nitride, talc, and the like are preferable, and silica, which has a specific gravity close to that of fluororesin and a low dielectric constant, is particularly preferable.
- silica which has a specific gravity close to that of fluororesin and a low dielectric constant, is particularly preferable.
- the coefficient of thermal expansion of the coating film can be kept low. In addition, this action is preferable because it is possible to suppress warping of the substrate. Furthermore, the peel strength of the coating film layer can be increased.
- the inorganic filler preferably has a BET specific surface area of less than 6.5 m 2 /g, more preferably less than 6.3 m 2 /g, for example. Also, it is preferably larger than 1 m 2 /g. When the specific surface area is within the above range, the aggregation of the inorganic filler in the film is small and the coating film surface is smooth, which is preferable.
- the inorganic filler preferably has an average particle size of 0.1 to 20 ⁇ m. When the average particle size is within the above range, less aggregation can be achieved and good surface roughness can be obtained. More preferably, the lower limit of the average particle size is 0.3 ⁇ m. The upper limit of the average particle size is more preferably 5 ⁇ m, and even more preferably 2 ⁇ m.
- the average particle size is a value measured by a laser diffraction/scattering method.
- the inorganic filler preferably has a maximum particle size of 10 ⁇ m or less.
- the maximum particle size is 10 ⁇ m or less, there is little aggregation and the dispersion state is good. Furthermore, the surface roughness of the resulting coating film can be reduced. More preferably, the maximum particle size is 5 ⁇ m or less.
- the maximum particle size was determined from image data of 200 randomly selected particles by taking SEM (scanning electron microscope) photographs and using image analysis software for SEM.
- the shape of the inorganic filler is not particularly limited, but spherical, columnar, conical, frustoconical, polyhedral, hollow and the like can be used.
- it is preferably spherical, cubic, bowl-shaped, disk-shaped, octahedral, scale-shaped, rod-shaped, plate-shaped, rod-shaped, tetrapod-shaped, or hollow, and spherical, cubic, octahedral, plate-shaped, More preferably, it is hollow.
- the inorganic filler is preferably one that can be uniformly dispersed when 70% by mass of the inorganic filler and 30% by mass of water are mixed. “Homogeneously dispersed” means that no sedimentation occurs even when the dispersion is allowed to stand and no longer flows. Insufficient dispersibility may reduce the stability of the coating composition.
- the inorganic filler may be surface-treated, for example, may be surface-treated with a silicone compound.
- the dielectric constant of the inorganic filler can be lowered by surface treatment with the above silicone compound.
- the silicone compound is not particularly limited, and conventionally known silicone compounds can be used. For example, it preferably contains at least one selected from the group consisting of silane coupling agents and organosilazanes.
- the surface treatment amount of the silicone compound is preferably 0.1 to 10, more preferably 0.3 to 7 per unit surface area (nm 2 ) of the reaction amount of the surface treatment agent on the silica particle surface. more preferred.
- the inorganic filler one type or two or more types having different physical properties can be used. Further, the inorganic filler may be used as a powder as it is, or may be used after being dispersed in a resin.
- the total amount of fluororesin: inorganic filler is preferably 10:90 to 90:10 (mass ratio).
- the lower limit of the blending amount of the fluororesin is more preferably 10, more preferably 20.
- the upper limit of the blending amount of the fluororesin is more preferably 90, more preferably 80.
- the upper limit of the compounding amount of the inorganic filler is more preferably 60, more preferably 50.
- the coating composition of the present disclosure further contains a surfactant.
- the surfactant is not particularly limited, and known surfactants can be used, but non-fluorinated surfactants are preferred.
- a non-fluorinated surfactant is preferable to a fluorinated surfactant in terms of cost.
- hydrofluoric acid is generated when the fluororesin is baked. Since this hydrofluoric acid promotes deterioration of silica particles, it is preferably not contained.
- the non-fluorinated surfactant is not particularly limited as long as it can stably disperse the fluororesin in the composition.
- Anionic surfactants, cationic surfactants, nonionic surfactants, Any amphoteric surfactant can be used.
- Anionic surfactants such as sodium alkyl sulfate, sodium alkyl ether sulfate, triethanolamine alkyl sulfate, triethanolamine alkyl ether sulfate, ammonium alkyl sulfate, ammonium alkyl ether sulfate, sodium alkyl ether phosphate, and sodium fluoroalkyl carboxylate.
- cationic surfactants such as alkylammonium salts and alkylbenzylammonium salts
- polyoxyethylene alkyl ethers polyoxyethylene phenyl ethers, polyoxyethylene alkyl esters, propylene glycol-propylene oxide copolymers, perfluoroalkylethylene oxide addition and 2-ethylhexanol ethylene oxide adducts
- amphoteric surfactants such as alkylamino betaine acetate, alkylamido acetate betaine, and imidazolium betaine.
- anionic and nonionic surfactants are preferred.
- a particularly preferred surfactant is a nonionic surfactant having an oxyethylene chain with a low thermal decomposition residue.
- nonionic surfactants include Genapol X080 (product name, manufactured by Clariant), Neugen TDS-80 (trade name), and Neugen TDS-100 (trade name).
- Leocol TD series manufactured by Lion Corporation
- Leocol TD-90 trade name
- Lionol registered trademark
- TD series manufactured by Lion Corporation
- T-Det A138 trade name
- T-Det A series manufactured by Harcros Chemicals
- Tergitol registered trademark
- 15S series manufactured by Dow
- Dispanol TOC trade name, manufactured by NOF Corporation
- Hydrocarbon surfactants silicone surfactants, acetylenic surfactants such as acetylene glycol, and the like can also be used as the non-fluorine surfactants. Moreover, you may use 1 type or in combination of 2 or more types among these non-fluorinated surfactants. In addition, it is preferable not to use a nonylphenol surfactant.
- the amount of the non-fluorinated surfactant is preferably 0.01 to 50% by mass, more preferably 0.1 to 30% by mass, and still more preferably 0% by mass with respect to 100% by mass of the total amount of the fluororesin. .2 to 20% by mass. If the amount of the surfactant added is too small, the fluororesin will not be uniformly dispersed, and a portion of the fluororesin may float. On the other hand, if the amount of the surfactant added is too large, the decomposition residue of the surfactant increases due to baking, causing coloration, and the heat resistance, non-adhesiveness, etc. of the coating film deteriorate.
- the coating composition of the present disclosure further contains a liquid medium.
- the liquid medium is not particularly limited, it preferably contains water.
- the coating composition of the present disclosure preferably contains a water-soluble solvent in combination with water.
- the water-soluble solvent has a function of wetting the fluororesin, and a solvent with a high boiling point acts as a drying retardant that binds the resins together during drying after coating and prevents the occurrence of cracks. Even a high boiling point solvent evaporates at the sintering temperature of the fluororesin, so it does not adversely affect the coating film.
- water-soluble solvent examples include low boiling point organic solvents with a boiling point of up to 100° C. such as methanol, ethanol, isopropanol, sec-butanol, t-butanol, acetone, and methyl ethyl ketone; Solvents such as methyl cellosolve and ethyl cellosolve; high-boiling organic solvents having a boiling point of 150° C.
- the water-soluble solvent a high-boiling organic solvent is preferable, and among them, a glycol-based solvent is more preferable in terms of dispersion stability.
- the glycol-based solvent preferably contains at least one selected from the group consisting of ethylene glycol, diethylene glycol monomethyl ether, glycerin, and butyl carbitol.
- the content of the water-soluble solvent is preferably 0.5 to 50% by mass, more preferably 1 to 30% by mass of the total amount of water.
- the low-boiling organic solvent if the amount is too small, entrapment of bubbles tends to occur, and if it is too large, the composition as a whole becomes flammable and the advantage of the aqueous dispersion composition is impaired.
- the medium boiling point organic solvent if the amount is too large, it may remain in the coating film even after baking and have an adverse effect.
- a high-boiling organic solvent if the blending amount is too large, it may remain in the coating film even after baking and have an adverse effect.
- the water-soluble solvent does not remain in the coating film even after the fluororesin is baked by selecting a water-soluble solvent that easily volatilizes or by adjusting the blending amount. It should be noted that the fact that the glycol-based solvent does not remain after firing the fluororesin can be confirmed by scraping off the coating film after firing and measuring by TG/DTA that there is no weight loss near the boiling point of the glycol-based solvent.
- additives that are usually added to fluororesin compositions, such as stabilizers, thickeners, decomposition accelerators, rust inhibitors, antiseptics, antifoaming agents, etc., can be added to the coating composition. .
- a laminate characterized by having a coating film layer formed by applying the above coating composition is also one aspect of the present disclosure.
- the coating composition can be applied by a coating method used in ordinary coatings, and the coating methods include spray coating, roll coating, coating with a doctor blade, dip (immersion) coating, impregnation coating, and spin flow coating. , curtain flow coating, coating with a bar coater, gravure coating, microgravure coating, die coating, and the like.
- the laminate of the present disclosure can be obtained by drying and baking.
- the drying is not particularly limited as long as it is a method capable of removing the liquid medium. Examples thereof include a method in which heating is performed as necessary at room temperature to 130° C. for 5 to 30 minutes.
- the baking is carried out at a temperature higher than the melting temperature of the fluororesin, and is preferably carried out at a temperature in the range of 200 to 400° C. for 10 to 60 minutes.
- drying and firing under an inert gas are preferred.
- a coating film formed using the coating composition of the present disclosure preferably has a thickness of 2 to 40 ⁇ m after drying and baking.
- the above lower limit is more preferably 3 ⁇ m, even more preferably 5 ⁇ m.
- the above upper limit is more preferably 35 ⁇ m, even more preferably 30 ⁇ m.
- Base materials in the laminate of the present disclosure include metals such as iron, stainless steel, copper, aluminum, and brass; glass products such as glass plates, glass fiber woven fabrics and non-woven fabrics; polypropylene, polyoxymethylene, polyimide, and modified Polyimide, polyamideimide, polysulfone, polyethersulfone, polyetheretherketone, liquid crystal polymer, etc.
- General-purpose and heat-resistant resin moldings and coatings SBR, butyl rubber, NBR, EPDM, etc. general-purpose rubber, silicone rubber, fluororubber woven fabrics and non-woven fabrics of natural fibers and synthetic fibers; or laminated substrates formed by combining these.
- the base material may be surface-treated. Examples of the surface treatment include roughening to a desired degree of roughness using sandblasting, roughening by adhering particles, and metal anti-oxidation treatment.
- the coating composition of the present disclosure can enhance adhesion to substrates.
- the adhesive strength between the coating film layer formed by applying the coating composition of the present disclosure and the substrate can be 5 N/cm or more.
- the above adhesive strength is measured by stacking a laminate consisting of a coating layer and a base material so that the coating layer is in close contact with the copper foil, and pressing the coating layer under vacuum at a heating temperature of 320 ° C. and a pressure of 3 MPa for 5 minutes. After obtaining a laminate consisting of a base material and a bonded body in which a copper foil is laminated, the bonded body is cut into strips of 10 mm in width x 40 mm in length x 3 sets to prepare a test piece.
- a 90 degree peel test was performed at a tensile speed of 50 mm / min at 25 ° C., and the peel mode was observed. It is a measured value. More preferably, the adhesive strength is 7 N/cm or more.
- the adhesive strength varies depending on the type of substrate even if the coating composition used is the same. It is particularly preferable in that even when a substrate having such a high resistance is used, excellent peel strength as described above can be obtained.
- the adhesive strength within the above range can be obtained.
- the base material is a metal base material with a small surface roughness
- the adhesive strength within the above range can be obtained.
- a copper foil having a surface roughness (Rz) of 1.0 ⁇ m or less is used as a substrate, sufficient adhesion cannot be obtained with a conventional fluorine-containing coating composition, but the coating of the present disclosure
- a coating layer comprising the composition can exhibit an adhesive strength of 5 N/cm or more.
- the surface roughness (Rz) is the ten-point average roughness specified in JIS-B0601.
- Rz is a value measured using a surface roughness meter (trade name: Surfcom 470A, manufactured by Tokyo Seiki Co., Ltd.) with a measurement length of 4 mm.
- the laminate of the present disclosure can be used in fields that require heat resistance, solvent resistance, lubricity, non-adhesiveness, etc. , dielectric materials for substrates, laminated circuit boards, etc.
- the laminate of the present disclosure has a coating layer formed from the coating composition of the present disclosure on a copper foil.
- the FEP taken out after drying had an MFR of 15 g/10 min and a melting point of 228°C.
- the surfactant content was 5.5% based on the FEP solids weight.
- the FEP particles contain a carboxylic acid derived from the initiator in the terminal group, and the number of functional groups of the obtained functional group-containing FEP particles was measured by the method described above, and was found to be 207 per 10 6 main chain carbon atoms. there were.
- the dried powder was pulverized as it was by an air jet mill (manufactured by IM Material Co., Ltd.) to obtain a fine powder having an average particle size of 10 ⁇ m.
- FEP fine powder For 100 parts by mass of the obtained FEP fine powder, 10 parts by mass of an acetylene glycol-based dispersant (Surfinol 440, manufactured by Air Products Japan) and 10 parts of a silicone-based surfactant (KP-106, manufactured by Shin-Etsu Chemical Co., Ltd.) Parts by mass and 280 parts by mass of ion-exchanged water were sufficiently stirred and mixed with FEP fine powder to obtain an FEP dispersion. When the number of functional groups of the obtained FEP particles was measured by the method described above, it was found to be 20 per 10 6 main chain carbon atoms.
- PTFE aqueous dispersion The polymer solid content concentration is 64% by mass, the nonionic surfactant concentration is 2.7% by mass based on the polytetrafluoroethylene solid content, the average primary particle diameter is 312 nm, and the standard specific gravity is 1.57. A PTFE aqueous dispersion having 10 or less functional groups per 10 6 main chain carbon atoms was used.
- Example 1 (made into paint) The obtained FEP-1 aqueous dispersion and PTFE aqueous dispersion were mixed so that the solid content ratio of FEP:PTFE was 20:80, and a surfactant (Noigen TDS-80C) was added to the solid content of FEP and PTFE. ), silica particles, and 20 parts by mass of ion-exchanged water were added to form a paint.
- the silica particles used are as follows.
- B-1 Admafine SC2500-SQ manufactured by Admatechs Average particle diameter 0.5 ⁇ m, specific surface area 6.1 m 2 /g, spherical, specific gravity 2.2 g/cm 3
- B-2 Tokuyama Silfil, average particle diameter 125 nm, specific surface area 30.0 m 2 /g, spherical, specific gravity 2.2 g/cm 3
- the average particle size of the fluororesin contained in the obtained coating composition was measured by the method described above. Table 2 shows the results.
- Examples 2-12 A paint was prepared in the same manner as in Example 1, except that each compounding component was changed as shown in Tables 2 and 3.
- Comparative Examples 1-5 A paint was prepared in the same manner as in Example 1, except that each compounding component was changed as shown in Table 4.
- a resin coating film layer was obtained according to the following method.
- a paint was applied onto a copper foil (CF-V9S-SV-18 manufactured by Fukuda Metal Foil & Powder Co., Ltd., surface roughness 0.8 ⁇ m (Rz)) using a bar coater (No. 30).
- the coated copper foil was dried at 130° C. for 15 minutes. Furthermore, it was baked at 350° C. for 15 minutes in a nitrogen gas atmosphere to prepare a coating film having a thickness of 10 ⁇ m. Furthermore, the obtained coating film was evaluated based on the following criteria.
- the adhesive strength is measured by stacking a laminate consisting of a coating layer and a base material so that the coating layer is in close contact with the copper foil, and pressing the coating layer and the base material at a heating temperature of 320 ° C. and a pressure of 3 MPa for 5 minutes. After obtaining the bonded body in which the laminated body and the copper foil are laminated, the bonded body is cut into strips of 10 mm in width x 40 mm in length x 3 sets to prepare a sample piece. Using AGS-J 5kN manufactured by Shimadzu Corporation, a peel test was performed at 25° C.
- the adhesive strength was less than 5 N/cm.
- Adhesive strength was 5 N/cm or more.
- ⁇ The adhesive strength was 7 N/cm or more.
- a laminate consisting of a coating layer and a substrate is stacked so that the coating layer is in close contact with the copper foil, and pressed under vacuum at a heating temperature of 320 ° C. and a pressure of 3 MPa for 5 minutes to form the coating layer and the substrate.
- the base material was removed by etching, and the linear expansion coefficient of the obtained coating film was measured with a load of 5 g using TMA manufactured by Hitachi High-Tech Science. ⁇ : 160 ppm or more ⁇ : less than 160 ppm
- Examples show that the coating layer obtained from the coating composition of the present disclosure has excellent adhesion to copper foil substrates and high heat resistance.
- the present disclosure it is possible to obtain a coating composition that has good adhesion to metal substrates and that can form a coating layer that is excellent in electrical properties and surface properties.
- the above coating composition is suitably used for coating printed circuit boards, dielectric materials for substrates, laminated circuit boards, and the like.
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Inorganic Chemistry (AREA)
- Paints Or Removers (AREA)
- Laminated Bodies (AREA)
- Organic Insulating Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
少なくとも1種類のフッ素樹脂は、官能基数が主鎖炭素数106個当たり30~1000個であるフッ素樹脂(I)であり、
更に、無機フィラー、界面活性剤及び液状媒体を含有することを特徴とする塗料組成物に関する。
上記カルボニル基含有基は、カルボニルアミド基、カルボキシ基、アシルフロライド基、及び、メトキシカルボニル基からなる群より選択される少なくとも1の基であることが好ましい。
上記フッ素樹脂(I)は、テトラフルオロエチレン・ヘキサフルオロプロピレン共重合体(FEP)又はテトラフルオロエチレン・パーフルオロアルキルビニルエーテル共重合体(PFA)であることが好ましい。
上記フッ素樹脂(I)に含まれる官能基は、ポリマー主鎖の末端にあることが好ましい。
上記フッ素樹脂の平均粒子径が0.3μm未満であることが好ましい。
上記フッ素樹脂は、少なくとも1種類がPTFEであることが好ましい。
上記無機フィラーは、シリカ粒子であることが好ましい。
上記シリカ粒子は、比表面積が6.5m2/g未満であることが好ましい。
上記界面活性剤は、非フッ素系界面活性剤であることが好ましい。
上記液状媒体は、水を含むことが好ましい。
上記基材は、金属素材であることが好ましい。
上記積層体は、プリント基板、基板用誘電材料又は積層回路基板であることが好ましい。
また、数十ギガヘルツレベルの高周波領域の用途で用いられるプリント配線基板にも、誘電特性や吸湿性の観点から、フッ素樹脂の絶縁層を形成した積層体が主に用いられている。
以下、本開示を詳細に説明する。
本開示の塗料組成物は、上記フッ素樹脂(I)と、他のフッ素樹脂(以下、これをフッ素樹脂(II)と記す)とを併用して含有するものである。
上記フッ素樹脂(II)としては特に限定されず、官能基数が主鎖炭素数106個当たり30個未満であることが好ましい。すなわち、官能基数という点で上記フッ素樹脂(I)と相違するものであることが好ましい。
上記官能基の種類の同定および官能基数の測定には、赤外分光分析法を用いることができる。
上記官能基数は、フッ素樹脂単独の水性分散液から分析を実施することもできるが、目的とするフッ素樹脂を塗料中から単離して分析を実施することもできる。
N=I×K/t (A)
I:吸光度
K:補正係数
t:フィルムの厚さ(mm)
したがって、たとえば、-COFの官能基数とは、-CF2COFに起因する吸収周波数1883cm-1の吸収ピークから求めた官能基数と、-CH2COFに起因する吸収周波数1840cm-1の吸収ピークから求めた官能基数との合計である。
上記官能基数は、-CF=CF2、-CF2H、-COF、-COOH、-COOCH3、-CONH2および-CH2OHの合計数であってよい。
上記フッ素樹脂(I)としては、2種以上のフッ素樹脂を併用することもできる。
上記PAVE単位を構成するPAVEとしては、一般式(1):
CF2=CFO(CF2CFY1O)p-(CF2CF2CF2O)q-Rf (1)
(式中、Y1はFまたはCF3を表し、Rfは炭素数1~5のパーフルオロアルキル基を表す。pは0~5の整数を表し、qは0~5の整数を表す。)で表される単量体、および、一般式(2):
CFX=CXOCF2OR1 (2)
(式中、Xは、同一または異なり、H、FまたはCF3を表し、R1は、直鎖または分岐した、H、Cl、BrおよびIからなる群より選択される少なくとも1種の原子を1~2個含んでいてもよい炭素数が1~6のフルオロアルキル基、若しくは、H、Cl、BrおよびIからなる群より選択される少なくとも1種の原子を1~2個含んでいてもよい炭素数が5または6の環状フルオロアルキル基を表す。)で表される単量体からなる群より選択される少なくとも1種を挙げることができる。
上記フッ素樹脂(II)としては特に限定されず、官能基数が主鎖炭素数106個当たり30個未満であることが好ましい。すなわち、官能基数という点で上記フッ素樹脂(I)と相違するものであることが好ましい。
官能基数が多いフッ素樹脂は、密着性という点で優れた性能を示すが、反面、電気特性、耐熱性が不充分となりやすい。このため、フッ素樹脂(II)として、電気特性、耐熱性に優れたフッ素樹脂を組み合わせて使用することが好ましい。これによって、電気特性、耐熱性等の塗膜物性にも優れた塗膜層を形成することができる。
上記フッ素化処理は、フッ素化処理されていないフッ素樹脂とフッ素含有化合物とを接触させることにより行うことができる。
具体的には、塗料組成物を水で1000倍に希釈し、希釈した液をアルミ箔上に1滴置いて自然乾燥させたものをSEM(走査型電子顕微鏡)写真を撮影し、SEM用画像解析ソフトウェアを用いて、無作為に選択した粒子50個の画像データより粒径を計測し、平均を算出した値である。
上記平均粒子径は、下限が0.05μmであることが好ましく、0.07μmであることがより好ましく、0.1μmであることが更に好ましい。
上記無機フィラーとしては、一種又は二種以上の無機フィラーを使用することができる。
また、無機フィラーは粉体をそのまま使用してもよく、樹脂中に分散させたものを用いてもよい。
上記シリコーン化合物としては特に限定されず、従来公知のシリコーン化合物を使用することができる。例えば、シランカップリング剤及びオルガノシラザンからなる群より選択される少なくとも一種を含むことが好ましい。
上記シリコーン化合物の表面処理量は、シリカ粒子表面への表面処理剤の反応量が単位表面積(nm2)あたり0.1~10個であることが好ましく、0.3~7個であることがより好ましい。
また、無機フィラーは粉体をそのまま使用してもよく、樹脂中に分散させたものを用いてもよい。
上記非イオン性界面活性剤の市販品としては、例えば、Genapol X080(製品名、クラリアント社製)、ノイゲンTDS-80(商品名)及びノイゲンTDS-100(商品名)を例とするノイゲンTDSシリーズ(第一工業製薬社製)、レオコールTD-90(商品名)を例とするレオコールTDシリーズ(ライオン社製)、ライオノール(登録商標)TDシリーズ(ライオン社製)、T-Det A138(商品名)を例とするT-Det Aシリーズ(Harcros Chemicals社製)、タージトール(登録商標)15Sシリーズ(ダウ社製)、ディスパノールTOC(商品名、日本油脂社製)等が挙げられる。
さらに、本開示の塗料組成物は、水と併用して水溶性溶媒を含有することが好ましい。上記水溶性溶媒は、上記フッ素樹脂を濡らす働きを有し、更に高沸点のものは、塗装後の乾燥時に樹脂同士をつなぎ、クラックの発生を防止する乾燥遅延剤として作用する。高沸点溶媒でも、フッ素樹脂の焼成温度では蒸発するので、塗膜に悪影響を及ぼすことはない。
上記グリコール系溶媒としては、エチレングリコール、ジエチレングリコールモノメチルエーテル、グリセリン、及びブチルカルビトールからなる群より選択される少なくとも1種を含むことが好ましい。
上記基材は、表面加工されたものであってもよい。上記表面加工としては、サンドブラストを用いて所望の粗度まで粗面化するもの、粒子を付着させて粗面化したもの、金属酸化防止処理を施したものが挙げられる。
上記接着強度は、塗膜層と基材とからなる積層体を塗膜層が銅箔に密着するよう重ね、真空下加熱温度:320℃、圧力:3MPaで5分間プレスすることにより塗膜層と基材からなる積層体及び銅箔が積層された接合体得た後、接合体を幅10mm×長さ40mm×3セットの短冊状に切断し、試料片を作成し、この試験片について、オートグラフ((株)島津製作所製 AGS-J 5kN)を使用して、JIS C 6481-1996に準拠し、25℃において50mm/分の引張速度で90度剥離試験を行い、剥離モードを観測して測定した値である。
上記接着強度は、7N/cm以上であることがより好ましい。
特許4306072号の実施例1に記載の方法でFEP(TFE/HFP=84/16質量比)粒子を30%含む水性分散体を得た。乾燥して取り出したFEPのMFRは15g/10min、融点は228℃であった。界面活性剤の含有量は、FEP固形分重量に対して5.5%であった。FEP粒子には開始剤由来のカルボン酸が末端基に含まれており、得られた官能基含有FEP粒子の官能基数を上述の方法により測定したところ、主鎖炭素数106個当たり207個であった。
TFEとHFPを重合開始剤(ジ(ω-ヒドロパーフルオロヘキサノイル)パーオキサイド)を用いて懸濁重合によりFEP(TFE/HFP=85.7/14.3質量比)を製造し、得られた乾燥粉末をそのまま、エアジェットミル装置(アイエムマテリアル社製)により粉砕し、平均粒子径10μmの微粉末を得た。得られたFEP微粉末100質量部に対して、アセチレングリコール系分散剤(サーフィノール440、エアプロダクツジャパン社製)10質量部、シリコーン系界面活性剤(KP-106、信越化学工業社製)10質量部及びイオン交換水280質量部をFEP微粉末と十分に撹拌・混合し、FEP分散液を得た。得られたFEP粒子の官能基数を上述の方法により測定したところ、主鎖炭素数106個当たり20個であった。
ポリマー固形分濃度が64質量%、非イオン界面活性剤濃度がポリテトラフルオロエチレン固形分に対して2.7質量%、平均一次粒子径312nm、標準比重が1.57、上述の方法により測定した官能基数が、主鎖炭素数106個当たり10個以下のPTFE水性分散体を用いた。
特許4306072号の実施例4に記載の方法で、PFA(TFE/PPVE=96.6/3.4質量比)粒子を20%含む水性分散体を得た。乾燥して取り出したPFAのMFRは22g/10min、融点は315℃であった。界面活性剤の含有量は、PFA固形分重量に対して2.9%であった。得られたPFA粒子の官能基数を上述の方法により測定したところ、主鎖炭素数106個当たり143個であった。
(塗料化)
得られたFEP-1水性分散液とPTFE水性分散液をFEP:PTFEの固形分比が20:80になるように混合し、FEPとPTFEの固形分に対して界面活性剤(ノイゲンTDS-80C)14質量部、シリカ粒子、更に、イオン交換水20質量部を加え塗料化した。
なお、使用したシリカ粒子は以下の通りである。
B-1:アドマテックス製アドマファインSC2500-SQ 平均粒子径0.5μm、比表面積6.1m2/g、球状、比重2.2g/cm3
B-2:トクヤマ製シルフィル、平均粒径125nm、比表面積30.0m2/g、球状、比重2.2g/cm3
各配合成分を表2及び3に示したように変更したこと以外は、実施例1と同様にして塗料化した。
各配合成分を表4に示したように変更したこと以外は、実施例1と同様に塗料化した。
銅箔(福田金属箔粉工業製 CF-V9S-SV-18、表面粗さ0.8μm(Rz))上にバーコーター(No.30)を用いて塗料を塗工した。塗工後の銅箔を130℃で15分間乾燥させた。さらに窒素ガス雰囲気下350℃15分間焼成し膜厚10μmの塗膜を作製した。
さらに、得られた塗膜について、以下の基準に基づいて評価を行った。
接着強度は、塗膜層と基材とからなる積層体を塗膜層が銅箔に密着するよう重ね、加熱温度:320℃、圧力:3MPaで5分間プレスすることにより塗膜層と基材からなる積層体及び銅箔が積層された接合体得た後、接合体を幅10mm×長さ40mm×3セットの短冊状に切断し、試料片を作成し、この試験片について、オートグラフ((株)島津製作所製 AGS-J 5kN)を使用して、JIS C 6481-1996に準拠し、25℃において50mm/分の引張速度で剥離試験を行い、剥離モードを観測して測定した。
×:接着強度は、5N/cm未満であった。
△:接着強度は、5N/cm以上であった。
〇:接着強度は、7N/cm以上であった。
塗膜層と基材とからなる積層体を塗膜層が銅箔に密着するよう重ね、真空下加熱温度:320℃、圧力:3MPaで5分間プレスすることにより塗膜層と基材からなる積層体及び銅箔が積層された接合体を得た後エッチングにてパターンを作製し、288℃の溶融はんだ槽に10秒間浮かべた。はんだ槽から引き上げた後に塗膜層の剥がれ、膨れの有無を目視で確認した。
×:剥がれ、膨れあり
△:剥がれなし、膨れわずかにあり
〇:剥がれ、膨れなし
塗工表面をSEMで確認し、シリカ粒子の凝集の有無を確認した。
×:凝集あり
〇:凝集なし
塗工表面を目視で確認し、塗膜欠陥の状態を確認した。
×:あり
〇:なし
塗膜層と基材とからなる積層体を塗膜層が銅箔に密着するよう重ね、真空下加熱温度:320℃、圧力:3MPaで5分間プレスすることにより塗膜層と基材からなる積層体及び銅箔が積層された接合体得た後エッチングにて基材を取り除き、得られた塗膜を日立ハイテクサイエンス製TMAを用い、荷重5gで線膨張係数を測定した。
×:160ppm以上
〇:160ppm未満
Claims (15)
- 2種類以上のフッ素樹脂を含有する塗料組成物であって
少なくとも1種類のフッ素樹脂は、官能基数が主鎖炭素数106個当たり30~1000個であるフッ素樹脂(I)であり、
更に、無機フィラー、界面活性剤及び液状媒体を含有する
ことを特徴とする塗料組成物。 - フッ素樹脂(I)に含まれる官能基は、カルボニル基含有基である請求項1記載の塗料組成物。
- カルボニル基含有基は、カルボニルアミド基、カルボキシ基、アシルフロライド基、及び、メトキシカルボニル基からなる群より選択される少なくとも1の基である請求項2記載の塗料組成物。
- フッ素樹脂(I)は、テトラフルオロエチレン・ヘキサフルオロプロピレン共重合体(FEP)又はテトラフルオロエチレン・パーフルオロアルキルビニルエーテル共重合体(PFA)である請求項1~3のいずれかに記載の塗料組成物。
- フッ素樹脂(I)に含まれる官能基は、ポリマー主鎖の末端にあることを特徴とする請求項1~4のいずれかに記載の塗料組成物。
- さらに、他のフッ素樹脂として、官能基数が主鎖炭素数106個当たり30個未満であるフッ素樹脂(II)を含む請求項1~5のいずれかに記載の塗料組成物。
- フッ素樹脂の平均粒子径が0.3μm未満である請求項1~6のいずれかに記載の塗料組成物。
- フッ素樹脂は、少なくとも1種類がPTFEである請求項1~7のいずれかに記載の塗料組成物。
- 無機フィラーは、シリカ粒子である請求項1~8のいずれかに記載の塗料組成物。
- シリカ粒子は、比表面積が6.5m2/g未満である請求項9に記載の塗料組成物。
- 界面活性剤は、非フッ素系界面活性剤である請求項1~10のいずれかに記載の塗料組成物。
- 液状媒体は、水を含む請求項1~11に記載の塗料組成物。
- 基材上に請求項1~12のいずれかに記載の塗料組成物を塗装することによって形成された皮膜層を有することを特徴とする積層体。
- 基材は、金属素材である請求項13記載の積層体。
- プリント基板用、基板用誘電材料又は積層回路基板である請求項13又は14記載の積層体。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020237040222A KR20240000567A (ko) | 2021-05-25 | 2022-05-16 | 도료 조성물 및 적층체 |
EP22811195.1A EP4349595A1 (en) | 2021-05-25 | 2022-05-16 | Coating composition and laminate |
CN202280037326.4A CN117355578A (zh) | 2021-05-25 | 2022-05-16 | 涂料组合物和层积体 |
US18/513,786 US20240084158A1 (en) | 2021-05-25 | 2023-11-20 | Coating composition and laminate |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021087944 | 2021-05-25 | ||
JP2021-087944 | 2021-05-25 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US18/513,786 Continuation US20240084158A1 (en) | 2021-05-25 | 2023-11-20 | Coating composition and laminate |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2022249922A1 true WO2022249922A1 (ja) | 2022-12-01 |
Family
ID=84230054
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2022/020428 WO2022249922A1 (ja) | 2021-05-25 | 2022-05-16 | 塗料組成物及び積層体 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20240084158A1 (ja) |
EP (1) | EP4349595A1 (ja) |
JP (2) | JP7248937B2 (ja) |
KR (1) | KR20240000567A (ja) |
CN (1) | CN117355578A (ja) |
TW (1) | TW202311456A (ja) |
WO (1) | WO2022249922A1 (ja) |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4306072B2 (ja) | 2000-01-28 | 2009-07-29 | ダイキン工業株式会社 | 溶融加工可能な含フッ素重合体水性分散液 |
JP2014223799A (ja) * | 2013-04-19 | 2014-12-04 | ダイキン工業株式会社 | 金属張積層体及びプリント配線基板 |
WO2018016644A1 (ja) | 2016-07-22 | 2018-01-25 | 旭硝子株式会社 | 液状組成物、並びに該液状組成物を使用した、フィルムおよび積層体の製造方法 |
WO2019031071A1 (ja) | 2017-08-08 | 2019-02-14 | 住友電気工業株式会社 | 高周波プリント配線板用基材 |
JP2019070081A (ja) * | 2017-10-10 | 2019-05-09 | Agc株式会社 | 水性分散液、被膜及び被覆織布 |
JP2019183005A (ja) | 2018-04-11 | 2019-10-24 | Agc株式会社 | フッ素樹脂シート、積層体及びそれらの製造方法 |
WO2020145133A1 (ja) | 2019-01-11 | 2020-07-16 | ダイキン工業株式会社 | フッ素樹脂組成物、フッ素樹脂シート、積層体及び回路用基板 |
JP2020158720A (ja) * | 2019-03-28 | 2020-10-01 | Agc株式会社 | 複合粒子、分散液、積層体の製造方法、膜の製造方法及び被覆織布の製造方法 |
-
2022
- 2022-05-16 JP JP2022079885A patent/JP7248937B2/ja active Active
- 2022-05-16 WO PCT/JP2022/020428 patent/WO2022249922A1/ja active Application Filing
- 2022-05-16 KR KR1020237040222A patent/KR20240000567A/ko unknown
- 2022-05-16 CN CN202280037326.4A patent/CN117355578A/zh active Pending
- 2022-05-16 EP EP22811195.1A patent/EP4349595A1/en active Pending
- 2022-05-20 TW TW111118941A patent/TW202311456A/zh unknown
-
2023
- 2023-03-16 JP JP2023041466A patent/JP2023088952A/ja active Pending
- 2023-11-20 US US18/513,786 patent/US20240084158A1/en active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4306072B2 (ja) | 2000-01-28 | 2009-07-29 | ダイキン工業株式会社 | 溶融加工可能な含フッ素重合体水性分散液 |
JP2014223799A (ja) * | 2013-04-19 | 2014-12-04 | ダイキン工業株式会社 | 金属張積層体及びプリント配線基板 |
WO2018016644A1 (ja) | 2016-07-22 | 2018-01-25 | 旭硝子株式会社 | 液状組成物、並びに該液状組成物を使用した、フィルムおよび積層体の製造方法 |
WO2019031071A1 (ja) | 2017-08-08 | 2019-02-14 | 住友電気工業株式会社 | 高周波プリント配線板用基材 |
JP2019070081A (ja) * | 2017-10-10 | 2019-05-09 | Agc株式会社 | 水性分散液、被膜及び被覆織布 |
JP2019183005A (ja) | 2018-04-11 | 2019-10-24 | Agc株式会社 | フッ素樹脂シート、積層体及びそれらの製造方法 |
WO2020145133A1 (ja) | 2019-01-11 | 2020-07-16 | ダイキン工業株式会社 | フッ素樹脂組成物、フッ素樹脂シート、積層体及び回路用基板 |
JP2020158720A (ja) * | 2019-03-28 | 2020-10-01 | Agc株式会社 | 複合粒子、分散液、積層体の製造方法、膜の製造方法及び被覆織布の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
TW202311456A (zh) | 2023-03-16 |
US20240084158A1 (en) | 2024-03-14 |
JP2022181179A (ja) | 2022-12-07 |
JP2023088952A (ja) | 2023-06-27 |
KR20240000567A (ko) | 2024-01-02 |
JP7248937B2 (ja) | 2023-03-30 |
EP4349595A1 (en) | 2024-04-10 |
CN117355578A (zh) | 2024-01-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2020004339A1 (ja) | パウダー分散液、積層体、膜及び含浸織布 | |
JP2020158720A (ja) | 複合粒子、分散液、積層体の製造方法、膜の製造方法及び被覆織布の製造方法 | |
WO2019235439A1 (ja) | 分散液、樹脂付金属箔の製造方法、及びプリント基板の製造方法 | |
JP7248937B2 (ja) | 塗料組成物及び積層体 | |
US20230265309A1 (en) | Aqueous coating material composition and coated article | |
JP7248938B2 (ja) | 塗料組成物及び積層体 | |
JP2021075030A (ja) | 積層体、積層体の製造方法、シート、及びプリント回路基板 | |
JP7323856B1 (ja) | 塗料組成物、絶縁材料及び積層体 | |
JP7468520B2 (ja) | 液状組成物 | |
TWI844805B (zh) | 水性塗料組成物及塗裝物品 | |
JP7089210B2 (ja) | 水性塗料組成物及び塗装物品 | |
JP2019181735A (ja) | 積層体の製造方法及び基材の製造方法 | |
TW202309181A (zh) | 包含適用於銅及電子電信物品之未交聯氟聚合物之氟聚合物組成物 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 22811195 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 20237040222 Country of ref document: KR Kind code of ref document: A |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1020237040222 Country of ref document: KR |
|
WWE | Wipo information: entry into national phase |
Ref document number: 202280037326.4 Country of ref document: CN |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2022811195 Country of ref document: EP |
|
ENP | Entry into the national phase |
Ref document number: 2022811195 Country of ref document: EP Effective date: 20240102 |