WO2022239275A1 - Unité d'alimentation électrique pour dispositif de génération d'aérosol - Google Patents

Unité d'alimentation électrique pour dispositif de génération d'aérosol Download PDF

Info

Publication number
WO2022239275A1
WO2022239275A1 PCT/JP2021/043907 JP2021043907W WO2022239275A1 WO 2022239275 A1 WO2022239275 A1 WO 2022239275A1 JP 2021043907 W JP2021043907 W JP 2021043907W WO 2022239275 A1 WO2022239275 A1 WO 2022239275A1
Authority
WO
WIPO (PCT)
Prior art keywords
power supply
ble
supply unit
circuit
board
Prior art date
Application number
PCT/JP2021/043907
Other languages
English (en)
Japanese (ja)
Inventor
達也 青山
拓嗣 川中子
徹 長浜
貴司 藤木
亮 吉田
Original Assignee
日本たばこ産業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本たばこ産業株式会社 filed Critical 日本たばこ産業株式会社
Publication of WO2022239275A1 publication Critical patent/WO2022239275A1/fr

Links

Images

Classifications

    • A—HUMAN NECESSITIES
    • A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
    • A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
    • A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
    • A24F40/40—Constructional details, e.g. connection of cartridges and battery parts
    • A—HUMAN NECESSITIES
    • A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
    • A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
    • A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
    • A24F40/65—Devices with integrated communication means, e.g. wireless communication means

Definitions

  • the present invention relates to a power supply unit for an aerosol generator.
  • Patent Document 1 describes mounting an LED and a processor on the circuit board of the controller and providing the processor with a Bluetooth (registered trademark) function.
  • Patent Literatures 2 and 3 disclose an aerosol generator having LED and Bluetooth (registered trademark) functions.
  • One aspect of the present invention aims to realize a power supply unit for an aerosol generator that can mount a communication module at an appropriate position on a circuit board.
  • a first aspect of the present invention provides a communication module that communicates with an external device, a power source that supplies power to drive a heater that heats an aerosol source, and A power supply unit for an aerosol generator, comprising: a controller for controlling power supply from a power supply to the heater; and a circuit board on which the communication module, passive components, and active components are mounted, wherein A distance between a given passive component closest to the communication module and the communication module is shorter than a distance between a given active component closest to the communication module among the active components and the communication module.
  • the predetermined active component is an electronic component that does not always function.
  • the predetermined active component is an electronic component that functions in the event of an abnormality.
  • a fourth aspect of the present invention is the second aspect or the fourth aspect, wherein the predetermined passive component is an overvoltage protection diode.
  • the communication module includes a first side portion and a second side portion different from the first side portion.
  • the passive components include a first passive component mounted at a position facing the first side surface and a second passive component mounted at a position facing the second side surface. ,including.
  • the predetermined active component is mounted at a position facing the second side surface portion, and the second passive component is located closer to the predetermined active component than the predetermined active component. is mounted near the second side surface and is a passive component different from the electronic component having the smallest volume among the passive components.
  • the predetermined active component is mounted at a position facing the second side surface portion, and the second passive component is located closer to the predetermined active component than the predetermined active component. is mounted near the second side portion and has a larger capacitance than the capacitor with the smallest capacitance among the capacitors included in the passive component.
  • the communication module includes a third side portion different from the first side portion and the second side portion
  • the power supply unit includes the an insulating chassis for holding a circuit board, wherein no electronic component is mounted between the third side face and a side edge of the circuit board facing the third side face; A side edge of the circuit board facing the third side face and the chassis are adjacent in a direction parallel to the mounting surface of the circuit board.
  • the integrated circuit is mounted on the circuit board, and the predetermined passive component is the communication module and the integrated circuit. and the distance between the predetermined passive component and the communication module is shorter than the distance between the predetermined passive component and the integrated circuit.
  • the circuit board includes a non-mounting area where no electronic component is mounted between the predetermined passive component and the integrated circuit.
  • the non-mounting region includes a rectangular portion having an area equal to or larger than the larger one of the communication module and the integrated circuit.
  • part of the boundary of the square portion coincides with part of the side edge of the circuit board.
  • the predetermined active component is mounted between the communication module and the integrated circuit, and the predetermined active component and the The distance between communication modules is less than the distance between the predetermined contact active component and the integrated circuit.
  • a power supply unit for an aerosol generator that can mount a communication module at an appropriate position on a circuit board.
  • FIG. 1A is a front view of the power supply unit of the aerosol generator of this embodiment.
  • FIG. 1B is a top view of the power supply unit of the aerosol generating device of the present embodiment with the opening/closing part closed.
  • FIG. 1C is a top view of the power supply unit of the aerosol generator of the present embodiment with the opening/closing part removed.
  • FIG. 1D is a bottom view of the power supply unit of the aerosol generator of this embodiment.
  • FIG. 2A is a front view of the inner case with the outer case removed from the power supply unit of the aerosol generating device of this embodiment.
  • FIG. 1A is a front view of the inner case with the outer case removed from the power supply unit of the aerosol generating device of this embodiment.
  • FIG. 2B is a rear view of the outer case removed from the power supply unit of the aerosol generating device of this embodiment.
  • FIG. 3 is a front view of the power supply unit of the aerosol generating device according to the present embodiment with the outer case and inner case covers removed.
  • FIG. 4 is a perspective view of the power supply unit of the aerosol generating device of the present embodiment with the outer case and the inner case removed.
  • FIG. 5 is a perspective view of the state shown in FIG. 4 with the slider further removed.
  • FIG. 6 is a perspective view of the state shown in FIG. 5 with the chassis and battery further removed.
  • FIG. 7 is a perspective view showing the arrangement and mutual connection relationship of the first circuit board and other circuit boards of the power supply unit of the aerosol generating device of the present embodiment.
  • FIG. 8A is a perspective view showing the arrangement and mutual connection relationship of the second circuit board and other circuit boards of the power supply unit of the aerosol generating device of the present embodiment.
  • FIG. 8B is a perspective view showing the arrangement and mutual connection relationship of the second circuit board and other circuit boards of the power supply unit of the aerosol generating device of the present embodiment.
  • FIG. 9A is a perspective view showing the third circuit board of the power supply unit of the aerosol generating device of the present embodiment, other arrangements, and mutual connection relationships.
  • FIG. 9B is a perspective view showing the third circuit board of the power supply unit of the aerosol generating device of the present embodiment, the other arrangement, and the mutual connection relationship.
  • FIG. 9A is a perspective view showing the third circuit board of the power supply unit of the aerosol generating device of the present embodiment, other arrangements, and the mutual connection relationship.
  • FIG. 9B is a perspective view showing the third circuit board of the power supply unit of the aerosol generating device of the present embodiment, the other arrangement, and the mutual connection relationship
  • FIG. 9C is a perspective view showing the third circuit board of the power supply unit of the aerosol generating device of the present embodiment, other arrangements, and mutual connection relationships.
  • FIG. 10 is a diagram showing electronic components mounted on the BLE substrate of the power supply unit of the aerosol generating device of this embodiment.
  • FIG. 11A is a diagram showing electronic components mounted on the MCU board of the power supply unit of the aerosol generating device of this embodiment.
  • FIG. 11B is a diagram showing electronic components mounted on the MCU board of the power supply unit of the aerosol generating device of this embodiment.
  • FIG. 12A is a diagram showing electronic components mounted on the USB board of the power supply unit of the aerosol generating device of this embodiment.
  • FIG. 12B is a diagram showing electronic components mounted on the USB board of the power supply unit of the aerosol generating device of this embodiment.
  • FIG. 13 is a diagram showing a metal-prohibited area around the BLE module of the aerosol generation device of this embodiment.
  • FIG. 14 is a cross-sectional view taken along line 11-11 of FIG. 1A showing the internal configuration of the power supply unit of the aerosol generating device of this embodiment.
  • FIG. 15 is an overall circuit diagram of the power supply unit of the aerosol generator of this embodiment.
  • the power supply unit 1 of the aerosol generator of the present invention is applied to a heated cigarette that generates an aerosol and a gas containing a flavoring substance, or an aerosol, or an aerosol containing a flavoring substance by heating an aerosol source with a heater.
  • the aerosol source is, for example, a liquid such as polyhydric alcohol such as glycerin or propylene glycol.
  • the aerosol source may be a mixed solution of polyhydric alcohols and water.
  • the aerosol source may include pharmaceuticals, herbal medicines, and flavoring ingredients.
  • the aerosol source can be liquid, solid, or a mixture of liquid and solid.
  • a vapor source such as water may be used.
  • the aerosol generating device of the present invention may further include a capsule containing a flavor source, in which case a capsule holder that detachably holds the capsule is included.
  • the flavor source is, for example, a molded body obtained by molding tobacco material.
  • the flavor source may be composed of plants other than tobacco (for example, mint, herbs, Chinese medicine, coffee beans, etc.). Flavor sources such as menthol may be added to the flavor source. A flavor source may be added to the aerosol source.
  • FIG. 1A is a front view of the power supply unit of the aerosol generating device of this embodiment.
  • FIG. 1B is a top view of the power supply unit of the aerosol generating device of the present embodiment with the opening/closing part closed.
  • FIG. 1C is a top view of the power supply unit of the aerosol generator of the present embodiment with the opening/closing part removed.
  • FIG. 1D is a bottom view of the power supply unit of the aerosol generator of this embodiment.
  • FIG. 2A is a front view of the inner case with the outer case removed from the power supply unit of the aerosol generating device of this embodiment.
  • FIG. 2B is a rear view of the outer case removed from the power supply unit of the aerosol generating device of this embodiment.
  • FIG. 3 is a front view of the power supply unit 1 of the aerosol generating device of the present embodiment, with the covers of the outer case and the inner case removed.
  • the power supply unit 1 of the aerosol generating device of this embodiment includes an inner case 2 as a first panel and an outer case 3 as a second panel that constitute the overall outer shape.
  • the inner case 2 accommodates a chassis 4 , a heating unit 5 , first to fourth circuit boards 6 to 9 and a battery 10 .
  • the outer case 3 is attached to the front surface of the inner case 2 .
  • the outer case 3 is an exterior member that can be attached to and detached from the inner case 2 .
  • a pair of magnets 11a are provided on the front surface of the inner case 2 so as to be spaced apart from each other.
  • a pair of magnets 11 b are provided on the back surface of the outer case 3 at positions corresponding to the pair of magnets 11 a of the inner case 2 .
  • the inner case 2 includes a case body portion 12 with an open front surface and a cover portion 13 attached to the front surface of the case body portion 12 .
  • the cover portion 13 is fixed to the front opening of the case main body portion 12 with screws or the like.
  • a notification section 14 and an operation section 15 are provided in the case main body section 12 of the inner case 2 .
  • the notification unit 14 is a light emitting unit including an LED and a light guide plate.
  • the operation unit 15 is a push button type operation member such as a tactile switch. The lighting of the LED of the notification unit 14 is controlled according to the operating state of the device.
  • the cover portion 13 of the inner case 2 is formed with a plurality of ventilation holes 13a for heat dissipation in the lower part, and the long hole 16 for exposing the LED is formed at a position corresponding to the notification portion 14 of the case main body portion 12, A round hole 17 for exposing the tactile switch 15 is formed at a position corresponding to the operating portion 15 of the case body portion 12 .
  • the long hole 16 of the LED is a slit extending vertically in the cover portion 13 of the inner case 2 , and the round hole 17 of the tactile switch 15 is formed below the long hole 16 of the LED.
  • the outer case 3 can be made of an elastically deformable material. Thus, when the outer case 3 is pressed while the outer case 3 is held on the front surface of the inner case 2, the tactile switch 15 can be pressed through the elastically deformed outer case 3.
  • An opening/closing portion 18 is provided on the upper surface of the case main body portion 12 of the inner case 2, and a connecting portion 19 is provided on the lower surface thereof.
  • the opening/closing part 18 is a sliding lid (hereinafter referred to as a slider) capable of opening and closing the chamber part 20 for loading the heating unit 5 with the aerosol source. The user can open and close the slider 18 with the thumb of the hand holding the cases 2 and 3 while holding the cases 2 and 3 with one hand.
  • the connection unit 19 is an interface for connecting with an external device, and is, for example, a USB Type-C receptacle connector (hereinafter referred to as a USB connector).
  • a lens portion 21 that transmits LED light is provided at a position corresponding to the notification portion 14 on the front surface of the outer case 3 .
  • the case main body 12 of the inner case 2 accommodates the heating unit 5, the first to fourth circuit boards 6 to 9, and the chassis 4 that holds the battery 10.
  • the chassis 4 is made of an insulating material (made of resin, for example) that holds the first to fourth circuit boards 6 to 9, the vibration generating motor 24, the magnets 11a and 11b.
  • FIG. 4 is a perspective view of the power supply unit 1 of the aerosol generating device of this embodiment with the outer case 3 and the inner case 2 removed.
  • FIG. 5 is a perspective view of the state shown in FIG. 4 with the slider 18 further removed.
  • FIG. 6 is a perspective view of the state shown in FIG. 5 with the chassis 4 and the battery 10 further removed. Note that the magnet 11a is also removed from the power supply unit 1 of the aerosol generator in FIGS. 4-6.
  • the heating unit 5 includes a cylindrical chamber portion 20 loaded with an aerosol source, a heater 25 provided in the chamber portion 20 so as to heat the aerosol source, and a heater temperature detector 26 for detecting the temperature of the heater 25. , and a puffing motion detector 27 that detects a puffing motion (a motion of inhaling an aerosol).
  • a case temperature detector 29 for detecting the temperature inside the inner case 2 is provided near the heating unit 5 .
  • the heater 25 may be attached to the power supply unit 1 of the aerosol generator in a form that cannot be removed without destruction (for example, by soldering), or in a form that can be removed without destruction. may be attached.
  • the electrical connection by the "connector" is divided into a form in which it cannot be separated from each other without being broken, and a form in which it can be separated from each other without being broken. It will be described as any one.
  • the heating unit 5 may be composed of a combination of an induction coil and a susceptor.
  • the aerosol source is heated by induction heating.
  • the susceptor may be configured as a cylindrical chamber portion 20 or may be provided inside the aerosol source.
  • the battery 10 is a rechargeable secondary battery, capacitor, or the like, preferably a lithium ion battery.
  • a battery 10 supplies power to each component of the power supply unit 1 of the aerosol generator.
  • the temperature of the battery 10 is detected by a battery temperature detector 28 connected to the third circuit board 8 .
  • Each of the heater temperature detector 26, the puff operation detector 27, the battery temperature detector 28 and the case temperature detector 29 may be composed of a PTC thermistor or an NTC thermistor.
  • the chamber part 20 of the heating unit 5 has an opening 20a to which an aerosol source can be attached, and the opening 20a can be opened and closed by the slider 18.
  • the first to fourth circuit boards 6-9 are electrically connected by a connection frame 30 made of a conductive material.
  • the connection frame 30 preferably consists of a flexible printed circuit board.
  • FIG. 7 is a perspective view showing the mounting surface of the first circuit board 6 of the power supply unit 1 of the aerosol generating device of this embodiment, the arrangement of other circuit boards, and their mutual connection relationship.
  • FIG. 8A is a perspective view showing the arrangement and mutual connection relationship of the second circuit board and other circuit boards of the power supply unit of the aerosol generating device of the present embodiment.
  • FIG. 8B is a perspective view showing the arrangement and mutual connection relationship of the second circuit board and other circuit boards of the power supply unit of the aerosol generating device of the present embodiment.
  • FIG. 9A is a perspective view showing the third circuit board of the power supply unit of the aerosol generating device of the present embodiment, other arrangements, and mutual connection relationships.
  • FIG. 8A is a perspective view showing the arrangement and mutual connection relationship of the second circuit board and other circuit boards of the power supply unit of the aerosol generating device of the present embodiment.
  • FIG. 9B is a perspective view showing the third circuit board of the power supply unit of the aerosol generating device of the present embodiment, the other arrangement, and the mutual connection relationship.
  • FIG. 9C is a perspective view showing the third circuit board of the power supply unit of the aerosol generating device of the present embodiment, other arrangements, and mutual connection relationships.
  • FIG. 8A mainly shows the front surface of the second circuit board 7, and FIG. 8A mainly shows the back surface of the second circuit board 7.
  • FIG. 9A and 9B mainly show the back surface of the third circuit board 8, and
  • FIG. 9C mainly shows the front surface of the second circuit board 8.
  • FIG. 9B shows a state in which the temperature detector (battery thermistor) 28 of the battery 10 and the negative and positive bus bars 22a and 22b, which will be described later, are removed from the state shown in FIG. 9A for explanation.
  • the first circuit board 6 shown in FIG. 7 is a board (hereinafter referred to as a BLE substrate).
  • the BLE substrate 6 includes IC chips such as a case attachment/detachment detection circuit (Hall IC) 63 for detecting attachment/detachment of the outer case 3 with respect to the inner case 2, a Schmidt trigger circuit (inverter) 64, and the like.
  • a tactile switch 15 and other circuits and elements are implemented.
  • the Schmitt trigger circuit 64 is provided to give the output of the case attachment/detachment detection circuit 63 a hysteresis characteristic.
  • the second circuit board 7 shown in FIGS. 8A and 8B is a board on which an MCU (controller) 71 and a charging circuit (charge IC) 72a are mounted (hereinafter referred to as MCU board).
  • MCU board 7 includes a reactor (power inductor) 72b of the charging circuit 72a, a non-volatile memory (ROM) 73, load switch circuits 74a to 74c, a power switch driver circuit 75, a first Transformer circuit (DC/DC converter IC) 76a and reactor (power inductor) 76b, heater temperature detector (heater thermistor) 26 voltage detection circuit (operational amplifier A2 in FIG.
  • case temperature detector case thermistor 29 IC chips such as voltage detection circuit (operational amplifier A3 in FIG. 15) 77b, first latch circuit 78a and second latch circuit 78b, and positive/negative connectors 79a and 79b of heater temperature detector (heater thermistor) 26 , positive/negative connectors 90a and 90b of the puff action detector (puff thermistor) 27, positive/negative connectors 91a and 91b of the case temperature detector (case thermistor) 29, connector 92 of the vibration motor 24, and others. Circuits, ICs, and elements are mounted.
  • the positive/negative connectors 79a and 79b of the heater temperature detector (heater thermistor) 26 are not connected to the heater temperature detector (heater thermistor) 26 via lead wires. Note that this is merely a drawing convenience. In practice, the lead wires can be connected to the positive/negative connectors 79 a and 79 b of the heater temperature detector (heater thermistor) 26 through the gaps in the connection frame 30 . The same applies to the positive/negative connectors 90 a and 90 b of the puff action detector (puff thermistor) 27 and the positive/negative connectors 91 a and 91 b of the case temperature detector (case thermistor) 29 .
  • the third circuit board 8 shown in FIGS. 9A-9C is a board on which the USB connector 19 is mounted (hereinafter referred to as USB board).
  • the USB board 8 includes a negative bus bar 22 a connected to the negative electrode of the battery 10 , a positive bus bar 22 b connected to the positive electrode of the battery 10 , and a temperature detector (battery thermistor) 28 for the battery 10 . is connected.
  • the USB board 8 includes a battery level detection circuit (gas gauge IC) 81a, a current detection resistor 81b for the battery level detection circuit 81a, a second transformer circuit (DC/DC converter IC) 82a, and a reactor (power inductor) 82b.
  • a protection circuit (protection IC) 83a a protection circuit (protection IC) 83a, a current detection resistor 83b of the protection circuit 83a, a charge/discharge cutoff switch (MOSFET) 83c controlled by the protection circuit 83a, a heater voltage detection circuit (operational amplifier A1 in FIG. 15) 84, heater heating switch circuit (MOSFET) 85, connector 86a of negative bus bar 22a, connector 86b of positive bus bar 22b, positive/negative connectors 87a, 87b of heater 25, positive/negative connector 88 of battery temperature detector 28, A negative side switch circuit (MOSFET) 90 of the heater 25, an overvoltage protection circuit (overvoltage protection IC) 93, and other circuits, ICs, and elements are mounted.
  • protection circuit protection circuit
  • MOSFET charge/discharge cutoff switch
  • the fourth circuit board 9 shown in FIGS. 7, 8A and 8B is an open/close detection board on which an open/close detection circuit (Hall IC) 95 for detecting opening/closing of the slider 18 is mounted.
  • the BLE board 6, MCU board 7, and USB board 8 have long and narrow outlines with longitudinal and lateral directions.
  • the MCU board 7 and the USB board 8 are arranged directly below the heating unit 5 and arranged in parallel so that the back surface (second surface) of the MCU board 7 and the front surface (first surface) of the USB board 8 face each other.
  • the BLE board 6 has one end in the longitudinal direction where the BLE module 62 is mounted, located near the center in the longitudinal direction of the MCU board 7 and the USB board 8, and the distance from near the center to the other end where the BLE module is not mounted. It is offset with respect to the MCU board 7 and the USB board 8 so that the area is located between the heating unit 5 and the battery 10 . Also, the BLE board 6 is arranged such that the mounting surface (first surface) of the BLE board 6 is substantially perpendicular to the mounting surfaces (front and rear surfaces) of the MCU board 7 and the USB board 8 .
  • the MCU board 7 and the USB board 8 are electrically connected by a connector provided on the MCU board 7, a connector 34 (see FIGS. 12A and 12B) provided on the USB board 8, and a flexible board 31 connected to the MCU board 7. connected
  • the BLE board 6 is electrically connected to the MCU board 7 by the connection frame 30 .
  • the open/close detection board 9 is electrically connected to the MCU board 7 by a branch frame 32 branching from the connection frame 30 .
  • the branch frame 32 is preferably constructed from a flexible printed circuit board.
  • FIG. 15 is a circuit diagram of the power supply unit 1 of the aerosol generating device of this embodiment.
  • a power source BT is the battery 10 .
  • the protection circuit 83a is a protection IC that measures the current flowing through the path through which the current output from the power supply BT flows using a resistor R2 and protects the power supply BT according to the current.
  • the battery remaining amount detection circuit 81a is a gas gauge IC (remaining amount gauge IC) that measures the state of the power supply BT using a resistor R1 arranged in the path through which the current output from the power supply BT flows.
  • the overvoltage protection circuit 93 is an overvoltage protection IC that receives the voltage VBUS supplied from the USB connector 19 as a power supply connector and outputs the voltage VUSB to the VUSB line.
  • the overvoltage protection circuit 93 has a function of reducing the voltage V BUS supplied from the USB connector 19 to the specified voltage value and supplying it to the output side of the overvoltage protection circuit 93 even if the voltage VBUS exceeds the specified voltage value. .
  • the second transformer circuit 82 a is a DC/DC converter including a switching regulator that transforms the power supply voltage V BAT supplied from the power supply BT to generate the heater voltage V BOOST for driving the heater 25 .
  • the second transformer circuit 82a is a DC/DC converter with a step-up function, preferably a step-up DC/DC converter or a buck-boost DC/DC converter.
  • the MCU 71 When the heater 25 is to generate heat, the MCU 71 turns off the switch SM, turns on the switches SH and SS, and supplies the heater voltage V BOOST to the heater 25 through the switch SH.
  • the MCU 71 turns off the switch SH, turns on the switches SM and SS, and supplies the heater voltage V BOOST to the heater 25 through the switch SM.
  • the operational amplifier A1 measures the voltage between the positive and negative terminals of the heater 25, in other words, the voltage between the positive/negative connectors 87a and 87b of the heater 25.
  • the PA7 terminal of MCU71 is supplied with the output according to the voltage between.
  • the operational amplifier A1 functions as a temperature detection circuit that measures the resistance value or temperature of the heater 25.
  • FIG. A shunt resistor RS is arranged in a path electrically connecting the switch SM and the positive connector 87 a of the heater 25 .
  • the resistance value of the shunt resistor RS can be determined so that the switch SR is turned on while the heater 25 is heated and turned off while the temperature or resistance value of the heater 25 is measured.
  • the switch SR When the switch SR is composed of an N-channel MOSFET, the drain terminal of the switch SR is connected to the output terminal of the operational amplifier A1, and the gate terminal of the switch SR is connected between the shunt resistor RS and the positive connector 87a of the heater 25. , and the source terminal of switch SR is connected to ground. A value obtained by dividing the heater voltage V BOOST mainly by the shunt resistor RS and the heater 25 is input to the gate terminal of the switch SR. The resistance value of the shunt resistor RS can be determined so that the divided value is greater than or equal to the threshold voltage of the switch SR.
  • the current flowing through the heater 25 when the switch SH is turned off and the switches SM and SS are turned on flows through the heater 25 when the switch SH and the switch SS are turned on and the switch SM is turned off. smaller than the current. This makes it difficult for the temperature of the heater 25 to change due to the current flowing through the heater 25 when measuring the temperature or resistance of the heater 25 .
  • the load switch circuit 74c electrically disconnects the VIN terminal and the VOUT terminal when a low level is input to the ON terminal, and disconnects the VIN terminal and the VOUT terminal when a high level is input to the ON terminal. and are electrically connected to output the voltage VCC5 from the VOUT terminal to the VCC5 line.
  • the voltage value of the voltage VCC5 is, for example, 5.0 [V].
  • the V CC5 line is connected to the VBUS and VAC terminals of charging circuit 72 a and to LED 61 .
  • a collector terminal of an npn-type bipolar transistor is connected to the ON terminal of the load switch circuit 74c.
  • the emitter terminal of this bipolar transistor is connected to the ground GND7, and the base terminal is connected to the PC9 terminal of the MCU71. That is, the MCU 71 can control opening/closing of the load switch 74c through the bipolar transistor by adjusting the potential of the PC9 terminal.
  • the charging circuit 72a is a charging IC that electrically connects the SYS terminal and the BAT terminal inside and supplies charging voltage from the BAT terminal to the power supply BT in the charging mode.
  • the charge mode is enabled or activated by supplying a low level to the /CE terminal.
  • the charging circuit 72a electrically connects the VBUS terminal and the SW terminal, and receives the voltage VCC5 supplied via the VCC5 line and/or the power supply voltage supplied from the power supply BT to the BAT terminal.
  • V BAT is used to supply the voltage V CC to the V CC line.
  • the charging circuit 72a receives the power supply voltage VBAT supplied from the power supply BT to the BAT terminal, supplies the voltage VCC from the SYS terminal to the VCC line, and supplies the voltage VCC5 from the VBUS terminal to the VCC5 line. Provides VCC5 .
  • the charging circuit 72a in the OTG mode boosts the power supply voltage V BAT supplied to the BAT terminal so that the voltage V CC5 supplied from the VBUS terminal to the V CC5 line also becomes 5.0 [V] in the OTG mode. Therefore, it is preferable to supply the VCC5 line from the VBUS terminal.
  • the charging circuit 72 a operates in the default operation mode or the operation mode set by the MCU 71 among the power pass mode and the OTG mode.
  • the first transformer circuit 76a is enabled by applying voltage VCC to the VCC line. Specifically, the first transformer circuit 76a is enabled by inputting a high-level signal to the EN terminal. Since the VIN and EN terminals are connected to the VCC line, the first transformer circuit 76a is enabled by applying voltage VCC to the VCC line.
  • the first transformer circuit 76a is a DC/DC converter that includes a switching regulator that supplies voltage VCC33_0 from the VOUT terminal to the VCC33_0 line.
  • the first transformer circuit 76a is more preferably a step-up/step-down DC/DC converter.
  • the voltage value of the voltage V CC33_0 is, for example, 3.3 [V].
  • the VCC33_0 line is connected to the VIN terminal of the load switch circuit 74b, the VIN and RSTB terminals of the power switch driver circuit 75, and the VCC and D terminals of the second latch circuit 78b.
  • the load switch circuit 74b electrically disconnects the VIN terminal and the VOUT terminal when a low level is input to the ON terminal, and disconnects the VIN terminal and the VOUT terminal when a high level is input to the ON terminal. and are electrically connected to output the voltage VCC33 from the VOUT terminal to the VCC33 line.
  • the voltage value of the voltage VCC33 is, for example, 3.3 [V].
  • the VCC 33 line includes the VIN terminal of the load switch 74a, the VCC terminal of the nonvolatile memory 73, the VDD and CE terminals of the remaining battery level detection circuit 81a, the VDD terminal of the MCU 71, the VDD terminal of the case attachment/detachment detection circuit 63, and the Schmitt trigger circuit.
  • the VIN terminal of the load switch 74b is electrically connected to the VOUT terminal of the first transformer circuit 76a, and the voltage VCC33_0 is supplied from the first transformer circuit 76a.
  • the power switch driver circuit 75 outputs a low level from the RSTB terminal in response to the low level being supplied to the SW1 terminal and the SW2 terminal for a predetermined time.
  • the RSTB terminal is electrically connected to the ON terminal of the load switch circuit 74b. Accordingly, in response to the low level being supplied to the SW1 terminal and SW2 terminal of the power switch driver circuit 75, the load switch circuit 74b stops outputting the voltage VCC33 from the VOUT terminal.
  • the output of the voltage VCC33 from the VOUT terminal of the load switch circuit 74b stops, the supply of the voltage VCC33 to the VDD terminal (power supply terminal) of the MCU71 is cut off, so the MCU71 stops operating.
  • the power switch driver circuit 75 does not output a low level from the RSTB terminal after outputting a low level from the RSTB terminal.
  • the voltage VCC33_0 is input to the ON terminal of the load switch 74b, so that the load switch 74b again outputs the voltage VCC33 from the VOUT terminal to the VCC33 line.
  • the MCU 71 that has stopped operating can be restarted.
  • the load switch circuit 74a electrically disconnects the VIN terminal and the VOUT terminal when a low level is input to the ON terminal, and disconnects the VIN terminal and the VOUT terminal when a high level is input to the ON terminal. and are electrically connected to output the voltage VCC33_SLP from the VOUT terminal to the VCC33_SLP line.
  • the voltage value of the voltage V CC33_SLP is, for example, 3.3 [V].
  • the V CC33_SLP line is connected to a heater temperature detector (heater thermistor) 26 , a puff action detector (puff thermistor) 27 , and a case temperature detector (case thermistor) 29 .
  • the ON terminal of the load switch circuit 74a is electrically connected to the PC11 terminal of the MCU 71, and the MCU 71 transitions the logic level of the PC11 terminal from high level to low level when transitioning to sleep mode. When shifting to the active mode, the logic level of the PC11 terminal is changed from low level to high level.
  • the MCU 71 uses the resistance value change of the puff thermistor 27 to detect the temperature change in the air flow path due to the puff operation.
  • the MCU 71 can acquire the resistance value change of the puff thermistor 27 from the value of the voltage input to the PC4 terminal.
  • the vibration motor 24 is activated by turning on the switch SN.
  • the switch SN may be composed of a transistor, and a control signal is supplied from the PH0 terminal of the MCU 71 to the base or gate of the transistor.
  • a driver IC for the vibration motor 24 may be used instead of the switch SN.
  • the MCU 71 detects the temperature of the heater 25 using the resistance value change of the heater thermistor 26 .
  • the temperature of heater 25 may be detected indirectly by detecting the temperature in the vicinity of heater 25 .
  • the MCU 71 can acquire the resistance value change of the puff thermistor 26 from the value of the voltage input to the PA6 terminal.
  • the operational amplifier A ⁇ b>2 outputs a voltage corresponding to the resistance value of the heater thermistor 26 , in other words, a voltage corresponding to the temperature of the heater 25 .
  • the MCU 71 detects the temperature inside the inner case 2 using the change in the resistance value of the case thermistor 29 .
  • the MCU 71 can acquire the resistance value change of the case thermistor 29 from the value of the voltage input to the PA3 terminal.
  • the operational amplifier A3 outputs a voltage corresponding to the resistance value of the case thermistor 29, in other words, a voltage corresponding to the temperature of the inner case 2.
  • the MCU 71 (controller) includes a processor configured as an IC chip, and controls the overall operation of the power supply unit 1 of the aerosol generator by executing programs stored in the nonvolatile memory 73 or built-in memory.
  • the MCU 71 performs heating control of the heater 25 and charge/discharge control of the battery 10 .
  • the MCU 71 starts heating control of the heater 25 when the tactile switch 15 is pressed long while the outer case 3 is attached.
  • the heating control of the heater 25 can be started by supplying a high level from the PC12 terminal of the MCU 71 to the gate terminal of the switch SS and the EN terminal of the second transformer circuit 82a.
  • the negative connector 87b of the heater 25 is connected to the ground, and the second transformer circuit 82a outputs the heater voltage V BOOST .
  • the switch SH is turned on and the heater voltage V BOOST is supplied to the heater 25 .
  • the MCU 71 controls power supply to the heater 25 for heating the aerosol source using power from the power supply BT, and controls heat generation of the heater 25 . Specifically, the MCU 71 controls heat generation of the heater 25 by PWM control or PFM control for the switch SH. The duty ratio in PWM control or PFM control may be calculated by PID control. The MCU 71 may acquire the temperature of the heater 25 required for PID control from the output of the operational amplifier A1 or from the input to the PC6 terminal.
  • the MCU 71 starts pairing by BLE when the tactile switch 15 is pressed long while the slider 18 is closed.
  • the case attachment/detachment detection circuit 63 is a Hall IC that detects that the outer case 3 has been removed from the aerosol generator or power supply unit 1 .
  • the output of the case attachment/detachment detection circuit 63 is supplied to the SW2 terminal of the power switch driver circuit 75 and the PD2 terminal of the MCU 71 via the Schmidt trigger circuit 64 .
  • the output of the open/close detection circuit 95 is supplied to the PC13 terminal of the MCU71.
  • the BLE module 62 is a communication module that provides the MCU 71 with the function of communicating with external devices such as smartphones, mobile phones, and personal computers in compliance with short-range wireless communication standards such as Bluetooth (registered trademark).
  • the communication module is not limited to BLE, and may be a communication interface conforming to other communication standards such as NFC (Near Field Communication) and wireless LAN (Local Area Network).
  • the first latch circuit 78a is a flip-flop circuit that holds an output so as to stop charging and discharging when the heater 25 overheats.
  • the first latch circuit 78a is preferably a D-type flip-flop IC.
  • the second latch circuit 78b is a flip-flop circuit that stores the occurrence of overheating when the heater 25 overheats.
  • the second latch circuit 78b is preferably a D-type flip-flop IC.
  • the cathode of the LED 61 mounted on the BLE substrate 6 is connected to the MCU 71 of the MCU substrate 7 without being connected to the ground GND 6 of the BLE substrate 6 .
  • the ground of the BLE substrate 6 is reduced.
  • the anode of the LED 61 is connected to the load switch 74c of the MCU board 7, the voltage VCC5 is applied, and the discharge to the LED 61 is controlled by the MCU71.
  • the noise ground noise
  • the MCU 71 that controls discharge to the LED 61 is mounted on the MCU board 7 that is separate from the BLE board 6, it is possible to reduce the influence of noise due to discharge control on the BLE module 62. You can keep it in good condition.
  • FIG. 10 is a diagram showing electronic components mounted on the BLE board 6 of the power supply unit 1 of the aerosol generating device of this embodiment.
  • FIG. 11A is a diagram showing electronic components mounted on the MCU board of the power supply unit of the aerosol generating device of this embodiment.
  • FIG. 11B is a diagram showing electronic components mounted on the MCU board of the power supply unit of the aerosol generating device of this embodiment.
  • FIG. 12A is a diagram showing electronic components mounted on the USB board of the power supply unit of the aerosol generating device of this embodiment.
  • FIG. 12B is a diagram showing electronic components mounted on the USB board of the power supply unit of the aerosol generating device of this embodiment.
  • the BLE substrate 6 has a first surface 6A on which electronic components are mounted and a second surface 6B (not shown) on the back side of the first surface 6A.
  • IC chips such as an LED 61, a BLE module 62, a case attachment/detachment detection circuit 63, a Schmitt trigger circuit 64, a tactile switch 15, a crystal oscillator 161, capacitors 162a to 162h, and an overvoltage protection element.
  • Circuits and elements such as (zener diodes or varistors) 163a to 163d and resistors 164a to 164c are mounted. The mutual layout relationship of electronic components and circuit boards for maintaining a good communication state of the BLE module 62 will be described later.
  • the MCU board 7 has a first surface 7A (front surface) on which electronic components are mounted and a second surface 7B (back surface) behind the first surface 7A.
  • MCU 71, charging circuit 72a, reactor (power inductor) 72b of charging circuit 72a, load switch circuits 74b and 74c, first transformer circuit 76a and reactor 76b, and second latch circuit are provided on first surface 7A of MCU substrate 7.
  • IC chips such as 78b, positive/negative connectors 79a and 79b of the heater thermistor 26, and other circuits, ICs, and elements are mounted.
  • a nonvolatile memory (ROM) 73 On the second surface 7B of the MCU board 7, a nonvolatile memory (ROM) 73, a load switch circuit 74a, a power switch driver circuit 75, a voltage detection circuit 77a for the heater thermistor 26, a voltage detection circuit 77b for the case thermistor 29, a first IC chips such as the latch circuit 78a, the positive/negative connectors 90a and 90b of the puff thermistor 27, the positive/negative connectors 91a and 91b of the case thermistor 29, the connector 92 of the vibration motor 24, other circuits and ICs and devices are mounted.
  • ROM nonvolatile memory
  • load switch circuit 74a On the second surface 7B of the MCU board 7, a nonvolatile memory (ROM) 73, a load switch circuit 74a, a power switch driver circuit 75, a voltage detection circuit 77a for the heater thermistor 26, a voltage detection circuit 77b for the case thermistor 29,
  • a circular spacer 33 is formed on the MCU board 7 .
  • the spacer 33 is a positioning screw hole for positioning the MCU board 7 and the USB board 8 .
  • the USB board 8 has a first surface 8A (front surface) on which electronic components are mounted and a second surface 8B (back surface) behind the first surface.
  • the USB connector 19 On the first surface 8A of the USB board 8, the USB connector 19, the reactor (power inductor) 82b of the second transformer circuit 82a, the connector 86a of the negative bus bar 22a, the connector 86b of the positive bus bar 22b, and the positive side of the heater 25 are provided.
  • /Negative side connectors 87a and 87b, a positive/negative side connector 88 of the battery thermistor 28, a negative side switch circuit 89 of the heater 25, and the like are mounted.
  • a battery level detection circuit 81a a current detection circuit 81b of the battery level detection circuit 81a, a second transformer circuit 82a, a protection circuit 83a, and a current detection circuit of the protection circuit 83a are provided.
  • 83b a charge/discharge cutoff switch 83c controlled by the protection circuit 83a, a heater voltage detection circuit 84, a heater heating switch circuit 85, an overvoltage protection circuit 93, and the like are mounted.
  • a circular spacer 33 is formed on the USB board 8 .
  • the spacer 33 is a positioning screw hole for positioning the MCU board 7 and the USB board 8 .
  • a connector 34 for connecting the flexible board 31 connected to the MCU board 7 is provided on the side edge of the USB board 8 .
  • FIG. 13 is an explanatory diagram of a prohibited area for metal parts, a metal housing, sheet metal, etc., and a prohibited area for copper foil (conductor) patterns of the BLE module 62 .
  • the upper side of FIG. 13 shows the overall image of the BLE board 6 and electronic components around it, and the lower side of FIG. 13 shows an enlarged view of the BLE module 62 and its surroundings.
  • FIG. 14 is a cross-sectional view taken along line 11-11 of FIG. 1A.
  • the BLE module 62 generally has an integrated circuit section 62a and an antenna section 62b.
  • prohibited areas first It is desirable to secure a prohibited area 100 and a prohibited area (second prohibited area) 101 of the copper foil (conductor) pattern.
  • a prohibited area (first prohibited area) 100 such as a metal part, a metal housing, or a sheet metal is an area below and above a portion of the BLE substrate 6 where the antenna region 62b is mounted.
  • a copper foil (conductor) pattern prohibition area (second prohibition area) 101 is an area of the BLE substrate 6 on the side of and immediately below the antenna area 62b.
  • the BLE module 62 by mounting the BLE module 62 on the side edge of the BLE board 6, other electronic components (the LED 61, which may become a noise source, the case attachment/detachment detection circuit 63, the Schmidt trigger circuit 64, other circuits, etc.)
  • the influence of the MCU 71 mounted on the substrate, the second transformer circuit 82a, the first transformer circuit 76a, etc.) is mitigated.
  • the inner case 2, the outer case 3, and the chassis 4 to create the first prohibited area 100 for the BLE module 62, and by holding the BLE board 6 by the chassis 4, the second prohibited area 100 for the BLE module 62 is maintained. A prohibited area 101 is secured.
  • the first prohibited area 100 is an area in the vertical direction of the BLE module 62, as shown in FIG.
  • the first prohibited area 100 is preferably an area of 10 mm or more in the vertical direction of the BLE module 62 .
  • the second prohibited area 101 is an area on both sides of the antenna section 62 b of the BLE module 62 and an area overlapping the antenna section 62 b among all layers of the BLE board 6 in the thickness direction of the BLE board 6 .
  • the BLE substrate 6 has a first side edge portion 201 and a second side edge portion 202 that form two opposite sides in the short direction, and two opposite sides in the longitudinal direction. It has a substantially rectangular shape including a third side edge portion 203 and a fourth side edge portion 204 .
  • the first side edge 201 is substantially linear.
  • a protruding portion 202a is formed on the second side edge portion 202 .
  • the third side edge portion 203 is formed substantially linearly.
  • Notch portions 204a and 204b are formed in the fourth side edge portion 204 .
  • the third side edge portion 203 is formed substantially linearly.
  • the third side edge 203 is arranged close to the chassis 4 .
  • a portion of the fourth side edge 204 is positioned close to the side edge of the USB board 8 .
  • the BLE board 6 has electronic components mounted on the first surface 6A, and the third side edge 203 and the second surface 6B are fixed to the chassis 4 .
  • the BLE board 6 has a second surface 6B close to the MCU board 7 and the USB board 8 and a first surface 6A behind the second surface 6B and far from the MCU board 7 and the USB board 8 .
  • Active components, passive components, and auxiliary components are mounted on the first surface 6A of the BLE board 6 in addition to the BLE module 62 .
  • An active component is an electronic component that has an input and an output, and by applying a voltage, has a certain relationship between the input and the output, and is an electronic component that can become a noise source.
  • Active parts include, for example, an LED 61, a case attachment/detachment detection circuit (Hall IC) 63, a Schmitt trigger circuit 64, and overvoltage protection elements (Zener diodes or varistors) 163a to 163d.
  • Passive components are electronic components that do not function by themselves, but function in combination with active components. Passive components are, for example, a crystal oscillator 161, capacitors 162a-162h, and resistors 164a-164c.
  • Auxiliary parts are electronic parts that make an electric circuit energized or de-energized.
  • Auxiliary components are, for example, tactile switches 15 .
  • active components such as an LED 61, a case attachment/detachment detection circuit (Hall IC) 63, a Schmitt trigger circuit 64, overvoltage protection elements (Zener diodes or varistors) 163a to 163d, and tactile switches 15, etc.
  • active components such as an LED 61, a case attachment/detachment detection circuit (Hall IC) 63, a Schmitt trigger circuit 64, overvoltage protection elements (Zener diodes or varistors) 163a to 163d, and tactile switches 15, etc.
  • Passive components such as a crystal oscillator 161, capacitors 162a to 162h, and resistors 164a to 164c are mounted on the first surface 6A of the BLE substrate 6.
  • no electronic parts are mounted between the BLE module 62, electronic parts such as the LED 61, and IC chips such as the case attachment/detachment detection circuit (Hall IC) 63 and the Schmitt trigger circuit 64.
  • a non-mounting area 150 is provided.
  • the non-mounting region 150 is near the central portion between the first side edge portion 201 and the second side edge portion 202 on the first surface 6A of the BLE substrate 6, and is a notch of the fourth side edge portion 204. It is provided between part of the portion 204 b and the third side edge portion 203 .
  • the non-mounting region 150 includes a first boundary portion 151 substantially parallel to the first side edge portion 201 of the BLE substrate 6 and a second boundary portion 152 substantially parallel to the second side edge portion 202 of the BLE substrate 6. , a fourth boundary portion 154 substantially parallel to the fourth side edge portion 204 of the BLE substrate 6, and a third boundary portion 153 substantially parallel to the third side edge portion 203 of the BLE substrate 6.
  • the non-mounting area 150 in FIG. 10 is shown separated from other portions of the first surface 6A of the BLE substrate 6 for easy understanding.
  • the non-mounting area 150 may be part of the first surface 6A of the BLE substrate 6, and the first to fourth boundaries 151 to 154 may be virtual boundaries.
  • the non-mounting area 150 includes a rectangular portion having an area equal to or greater than the larger of the area of the BLE module 62 and the area of the case attachment/detachment detection circuit (Hall IC) 63 and Schmidt trigger circuit 64 in plan view.
  • a portion of the third boundary portion 153 of the non-mounting region 150 substantially coincides with a portion of the third side edge portion 203 of the BLE substrate 6 .
  • the BLE substrate 6 includes a first area 6A1, which is an area between the non-mounting area 150 and the first side edge portion 201 of the BLE substrate 6, where the BLE module 62 is mounted, and the non-mounting area 150. It is an area between the second side edges 202 of the BLE substrate 6 and includes a second area 6A2 including IC chips such as a case attachment/detachment detection circuit (Hall IC) 63 and a Schmidt trigger circuit 64.
  • the number (M) of active components (overvoltage protection elements 163a, 163b) included in the first area 6A1 is the number (M) of active components (LED 61, overvoltage protection elements 163c to 163d) included in the second area 6A2. N) (M ⁇ N).
  • the only active components included in the first area 6A1 are the overvoltage protection elements 163a and 163b. That is, the number (M) of active components included in the first area 6A1 is two. The number (N) of active components included in the second area 6A2 is twenty. It should be noted that the number of active components included in the first area 6A2 may be zero, that is, the configuration may be such that no active components are mounted.
  • the BLE module 62 has the antenna portion 62b arranged closest to the first side edge portion 201, and the integrated circuit portion 62a adjacent to the antenna portion 62b. is arranged at a position farther from the first side edge 201 than.
  • the integrated circuit portion 62a of the BLE module 62 has a first side portion a1 adjacent to the antenna portion 62b, and a position facing the first side portion a1 and farther from the antenna portion 62b than the first side portion a1.
  • Two capacitors 162e and 162f and two overvoltage protection elements 163a and 163b are arranged in order along the direction of the third side surface a3 of the integrated circuit section 62a.
  • the two capacitors 162e, 162f and the two overvoltage protection elements 163a, 163b are spaced apart in the direction of the first side edge 201 of the BLE substrate 6.
  • the tactile switch 15 is arranged close to the first boundary portion 151 of the non-mounting area 150 and the third side edge portion 203 of the BLE substrate 6 .
  • the eight LEDs 61 are arranged from the second boundary portion 152 of the non-mounting area 150 toward the second side edge portion 202 of the BLE substrate 6 toward the third LED 61 of the BLE substrate 6. are arranged at predetermined intervals along the side edges 203 of the .
  • one capacitor 162g is mounted between the second boundary portion 152 of the non-mounting area 150 and the second side edge portion 202 of the BLE substrate 6 and between the fourth side edge portion 204 of the BLE substrate 6 and the eight LEDs 61 .
  • one capacitor 162g is mounted between the second boundary portion 152 of the non-mounting area 150 and the second side edge portion 202 of the BLE substrate 6 and between the fourth side edge portion 204 of the BLE substrate 6 and the eight LEDs 61 .
  • one capacitor 162g is mounted between the second boundary portion 152 of the non-mounting area 150 and the second side edge portion 202 of the BLE substrate 6 and between the fourth side edge portion 204 of the BLE substrate 6 and the eight LEDs 61 .
  • three resistors 164a is mounted between the second boundary portion 152 of the non-mounting area 150 and the second side edge portion 202 of the BLE substrate 6 and between the fourth side edge portion 204 of the BLE substrate 6 and the eight LEDs 61 .
  • the nine overvoltage protection elements 163 d are arranged on the fourth side edge 204 of the BLE substrate 6 , five overvoltage protection elements and four overvoltage protection elements from the side closest to the fourth side edge 204 of the BLE substrate 6 . are arranged parallel to each other.
  • the case attachment/detachment detection circuit (Hall IC) 63, the Schmidt trigger circuit 64, and the two capacitors 162h are connected from the side near the fourth side edge 204 of the BLE substrate 6.
  • 64 are arranged along the fourth side edge 204 of the BLE board 6
  • the case attachment/detachment detection circuit 63 and the Schmitt trigger circuit and two capacitors 162 h are arranged along the fourth side edge 204 of the BLE board 6 . arranged in parallel.
  • the antenna portion 62b is closest to the first side edge portion 201 of the BLE substrate 6, and adjacent to the antenna portion 62b, the integrated circuit portion 62a is located first from the antenna portion 62b. is located far from the side edge 201 of the .
  • the BLE module 62 is arranged so that the integrated circuit portion 62 a and the antenna portion 62 b are arranged in this order toward the first side edge portion 201 .
  • the integrated circuit section 62 a and the antenna section 62 b are arranged in this order with respect to the first side edge 201 of the BLE substrate 6 closest to the BLE module 62 . That is, of the side edges of the BLE substrate 6 , the first side edge 201 closest to the BLE module is located closer to the antenna section 62 b than the integrated circuit section 62 a of the BLE module 62 .
  • the shape of the BLE board 6 and the mounting of other electronic components are greatly restricted. Such restrictions can be removed by mounting the antenna section 62b of the BLE module 62 close to the edge.
  • a large degree of freedom can be given when determining the shape of the circuit board and when mounting electronic components other than the BLE module 62, so the cost and size of the aerosol generating device can be reduced. can do.
  • the first side edge 201 closest to the BLE module is closer to the antenna part 62b than the other electronic components.
  • the distance between the side edge 201 and the BLE module 62 is shorter than the distance between the first side edge 201 of the BLE board 6 and other electronic components.
  • the antenna portion 62 b of the BLE module 62 may overlap the first side edge portion 201 of the BLE substrate 6 .
  • the antenna section 62b of the BLE module 62 may protrude outward from the first side edge section 201 of the BLE substrate 6 by a predetermined minute amount (for example, less than 1 mm). That is, part of the antenna section 62 b may be exposed to the outside of the BLE board 6 from the first side edge section 201 of the BLE module 62 .
  • the area of the circuit board can be effectively used, so it is possible to determine the shape of the circuit board and mount electronic components other than the BLE module 62, such as mounting many electronic components on the circuit board. A large degree of freedom can be given in practice, and the cost and size of the aerosol generator can be reduced.
  • the BLE board 6 is fixed by the chassis 4 at the second surface 6B behind the first surface 6A on which the BLE module 62 is mounted. Then, in the direction perpendicular to the first surface 6A of the BLE substrate 6, the chassis 4, the BLE substrate 6, and the antenna section 62b are arranged in this order. According to this configuration, the space below the antenna section 62b, where the presence of metal such as a copper foil (conductor) pattern is undesirable, is occupied by the chassis 4 having insulating properties and rigidity. As a result, it is possible to prevent metal from entering the area of the antenna section 62b even if an unexpected situation such as a fall occurs, so that a configuration in which communication interruption by the BLE module 62 is unlikely to occur can be realized.
  • the chassis 4 fixes the third side edge portion 203 of the BLE substrate 6, and the antenna portion 62b and the chassis 4 are adjacent in the direction parallel to the first surface 6A of the BLE substrate 6.
  • the chassis 4 having insulation and rigidity occupies the space on the side of the antenna section 62b where the presence of metal such as copper foil (conductor) patterns is undesirable.
  • metal such as copper foil (conductor) patterns
  • the BLE board 6 is provided with cutouts 204 a and 204 b on a fourth side edge 204 that is not fixed to the chassis 4 .
  • the antenna portion 62b of the BLE module 62 has a third side portion b3 adjacent to the chassis 4 and a fourth side portion b4 not adjacent to the chassis 4 in the direction parallel to the first surface 6A of the BLE board 6. Including, the fourth side portion b4 is closer to the notch portion 204a than the third side portion b3.
  • This configuration eliminates the need for the chassis 4 to occupy the entire side of the antenna section 62 b of the BLE module 62 .
  • the notch 204a in the BLE substrate 6 the amount of material used for manufacturing the chassis 4 and the circuit board can be reduced. Equipment costs can be reduced.
  • no other circuit board is arranged in a direction substantially perpendicular to the first surface 6A of the antenna section 62b of the BLE module 62. According to this configuration, a circuit board is not provided in the space above the antenna section 62b where the presence of metal such as a copper foil (conductor) pattern is not desirable. realizable.
  • the inner case 2 is arranged close to the antenna portion 62b of the BLE module 62 in a direction substantially perpendicular to the first surface 6A of the antenna portion 62b.
  • the insulating cover can occupy the space above the antenna section 62b where the presence of metal such as a copper foil (conductor) pattern is undesirable. This prevents metal from entering the region of the antenna section 62b even if an unexpected event such as a drop occurs, so that a configuration in which communication interruption by the BLE module 62 is unlikely to occur can be realized.
  • the outer case 3 is arranged above the inner case 2 in a direction substantially perpendicular to the first surface 6A of the BLE board 6, and the outer case 3 covers the inner case 2.
  • the area of the antenna part 62b of the BLE module 62 is double shielded by the inner case 2 and the outer case 3, so the presence of metal such as a copper foil (conductor) pattern is undesirable for the antenna.
  • a space above the portion 62b is occupied by the inner case 2 and the outer case 3.
  • the presence of the two covers makes it difficult for external noise to reach the area of the antenna section 62b, it is possible to realize a configuration in which interruption of communication by the BLE module 62 is unlikely to occur.
  • the magnet 11b provided on the outer case 3 and the magnet 11a provided on the chassis 4 magnetically coupled with the magnet 11b are arranged apart from the BLE module 62 by a predetermined distance.
  • the outer case 3 can be easily replaced according to the user's preference, and the magnetic field generated by the magnets 11 a and 11 b required for that purpose is less likely to affect communication by the BLE module 62 . Therefore, it is possible to realize a configuration in which disruption of communication by the BLE module 62 is unlikely to occur while improving the marketability of the device.
  • the passive components 161 and 162a to 162f are preferentially arranged around the integrated circuit portion 62a of the BLE module 62 on the BLE substrate 6.
  • FIG. The distances from the BLE module 62 to the passive components 161, 162a to 162f are arranged to be shorter than the distances from the BLE module 62 to the active components 163a, 163b.
  • the distance between the closest passive components 161, 162a to 162f closest to the BLE module 62 among the plurality of passive components and the BLE module 62 is the closest active components 163a, 163b closest to the BLE module 62 among the plurality of active components. and the BLE module 62.
  • the passive components are arranged closer to the BLE module 62 than the active components that may become noise sources, so that the BLE module 62 is less susceptible to noise generated by the active components.
  • BLE module 62 allows good communication.
  • the recent active components 163a and 163b include electronic components (Zener diodes or varistors) that function in an abnormal state, rather than elements that function all the time, so they do not constantly generate noise.
  • electronic components Zener diodes or varistors
  • the BLE module 62 is surrounded by a plurality of passive components 161, 162a to 162f.
  • the plurality of passive components 161, 162a to 162f are mounted between the fourth side edge portion a4 of the integrated circuit portion 62a of the BLE module 62 and the fourth side edge portion 204 of the BLE substrate 6. 162d, and passive components 162e and 162f mounted at positions facing the second side surface portion a2 of the integrated circuit portion 62a of the BLE module 62.
  • FIG. According to this configuration, since the plurality of passive components 162a to 162f can be used as physical barriers against noise directed toward the BLE module 62, the communication state of the BLE module 62 can be maintained in good condition.
  • a specific passive component (a capacitor 162f having a non-minimum capacitance) among the plurality of passive components 161 and 162a to 162f whose volume is not the smallest is combined with the BLE module 62 and the active component 163a. , 163b.
  • the active components 163a and 163b are mounted at positions facing the second side surface portion a2 of the integrated circuit portion 62a of the BLE module 62, and the specific passive component 162f is mounted on the BLE module 62 more than the active components 163a and 163b.
  • the passive component 162f having a relatively large volume (capacity) can be used as a physical barrier against noise to the BLE module 62, disruption of communication by the BLE module 62 is less likely to occur. configuration can be achieved.
  • the third side surface portion a3 of the integrated circuit portion 62a of the BLE module 62 is located close to the third side edge portion 203 of the BLE substrate 6, and the third side edge portion 203 of the BLE substrate 6 and the BLE No electronic component is mounted between the module 62 and the third side surface portion a3. Then, in a direction substantially parallel to the first surface 6A of the BLE board 6, the third side edge portion 203 of the BLE board 6 and the third side portion a3 of the BLE module 62 are in a positional relationship adjacent to the chassis 4.
  • the distance between the specific passive component 162f and the BLE module 62 is the distance between the specific passive component 162f and the IC chip other than the BLE module 62, such as the case attachment/detachment detection circuit (Hall IC) 63 and the Schmidt trigger circuit 64. It has a shorter structure than According to this configuration, the specific passive component 162f can be used as a physical barrier against noise to the BLE module 62, so the communication state of the BLE module 62 can be maintained in good condition.
  • the specific passive component 162f can be used as a physical barrier against noise to the BLE module 62, so the communication state of the BLE module 62 can be maintained in good condition.
  • the BLE substrate 6 has a non-mounting area 150 where electronic components are not mounted between the specific passive component 162f and IC chips other than the BLE module 62, such as a case attachment/detachment detection circuit (Hall IC) 63 and a Schmidt trigger circuit 64. is provided.
  • IC chips 63 and 64 other than the BLE module 62 can be sufficiently separated from the BLE module 62, the influence of noise caused by the other IC chips 63 and 64 on the BLE module 62 can be reduced, and the communication state of the BLE module 62 can be maintained in a good state.
  • the distance between the nearest active components 163a, 163b and the BLE module 62 is shorter than the distance between the nearest active components 163a, 163b and the IC chips 63, 64 other than the BLE module 62.
  • the IC chips 63 and 64 other than the BLE module 62 which may become noise sources more than the active components, can be placed sufficiently away from the BLE module 62.
  • FIG. As a result, the influence of noise caused by other IC chips 63 and 64 on the BLE module 62 can be reduced, and the communication state of the BLE module 62 can be maintained in a good state.
  • the MCU 71, the first transformer circuit (switching regulator) 76a, and the second transformer circuit (switching regulator) 82a which may become noise sources, are separated from the BLE board 6. It is mounted on the separate MCU board 7 and USB board 8 . Furthermore, the BLE module 62 is mounted at a position sufficiently distant from the MCU 71, the first transformer circuit 76a and the second transformer circuit 82a. Furthermore, the first side edge portion 201 of the BLE board 6 on which the BLE module 62 is mounted is positioned near the central portion in the longitudinal direction of the MCU board 7 and the USB board 8 with respect to the MCU board 7 and the USB board 8 . are offset from each other.
  • the BLE module 62 can be sufficiently separated from the MCU 71, the first transformer circuit 76a, and the second transformer circuit 82a, which may become noise sources, so that the communication state of the BLE module 62 is improved. can be kept in good condition.
  • the MCU 71 is mounted on the MCU board 7, the second transformer circuit 82a is mounted on the USB board 8, and the BLE board 6 is sufficiently separated from the MCU board 7 and the USB board 8, noise
  • the MCU 71 and the second transformer circuit 82a which may be the source, in a distant position, the influence of one on the other is reduced, the communication state of the BLE module 62 is maintained in a good state, Stable operation of the aerosol generator can be realized.
  • the MCU board 7 has a first surface 7A on which the MCU 71 is mounted at a position farther from the BLE substrate 6 than a second surface 7B on which the MCU 71 is not mounted.
  • the second surface 7B on which the MCU 71 is not mounted is closer to the BLE substrate 6 than the first surface 7A on which the MCU 71 is mounted.
  • the second transformer circuit is composed of the DC/DC converter IC 82a and the reactor (power inductor) 82b.
  • the second surface 8B on which the reactor 82b is not mounted is the BLE substrate rather than the first surface 8A on which the reactor 82b is mounted.
  • the first surface 8A on which the reactor 82b is mounted on the USB substrate 8 is located farther (not the closest) from the BLE substrate 6 than the second surface 8B on which the reactor 82b is not mounted.
  • a magnetic field is generated around the reactor 82 b during switching of the DC/DC converter IC 82 a , and this magnetic field may affect the BLE module 62 . Therefore, by sufficiently separating the reactor 82b of the second transformer circuit 82a from the BLE module 62, the communication state of the BLE module 62 can be maintained in a good state.
  • the DC/DC converter IC 82a and the reactor 82b that constitute the second transformer circuit the DC/DC converter IC 82a is mounted on the second surface 8B of the USB board 8, and the reactor 82b is mounted on the first surface 8A of the USB board 8.
  • Mounting the DC/DC converter IC 82a and the reactor 82b, which generate heat during switching, on different surfaces of the USB substrate 8 in this way prevents heat from being concentrated locally.
  • the BLE module 62 is less likely to be affected by heat, so the communication state of the BLE module 62 can be maintained in a good state, and the durability of the device can be improved.
  • the distance between the BLE board 6 and the MCU board 7 is longer than the distance between the BLE board 6 and the USB board 8 .
  • the MCU 71 which is more likely to become a noise source than the MCU 71 and the second transformer circuit 82a, is away from the BLE module 62, the communication state of the BLE module 62 can be maintained in a good state. can be done.
  • the first surface 7A of the MCU board 7 on which the MCU 71 is mounted is located farthest from the BLE board 6.
  • the MCU board 7 has the second surface 7B on which the MCU 71 is not mounted, which is closer to the BLE substrate 6 than the first surface 7A on which the MCU 71 is mounted.
  • LED 62...BLE module 62a Integrated circuit portion 62b of BLE module 62...Antenna portion a1 of BLE module 62...First side portion a2 of integrated circuit portion 62a of BLE module 62...BLE

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Dc-Dc Converters (AREA)

Abstract

Unité d'alimentation électrique (1) pour un dispositif de génération d'aérosol comprenant : un module de communication (62) qui communique avec un dispositif externe ; une alimentation électrique (10) qui fournit de l'énergie électrique pour entraîner un dispositif de chauffage (25) pour chauffer une source d'aérosol ; un dispositif de commande (71) qui commande l'alimentation en énergie électrique de l'alimentation électrique (10) au dispositif de chauffage (25) ; et une carte de circuit imprimé (6) sur laquelle le module de communication (62), des éléments passifs (161, 162, 164) et des éléments actifs (61, 63, 64, 163) sont montés. Les distances entre le module de communication (62) et des éléments passifs prédéterminés (161, 162a -162f) les plus proches du module de communication (62) parmi les éléments passifs sont plus courts que les distances entre le module de communication (62) et des éléments actifs prédéterminés (163a, 163b) les plus proches du module de communication (62) parmi les éléments actifs.
PCT/JP2021/043907 2021-05-10 2021-11-30 Unité d'alimentation électrique pour dispositif de génération d'aérosol WO2022239275A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-079751 2021-05-10
JP2021079751 2021-05-10

Publications (1)

Publication Number Publication Date
WO2022239275A1 true WO2022239275A1 (fr) 2022-11-17

Family

ID=84028096

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2021/043907 WO2022239275A1 (fr) 2021-05-10 2021-11-30 Unité d'alimentation électrique pour dispositif de génération d'aérosol

Country Status (1)

Country Link
WO (1) WO2022239275A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004246503A (ja) * 2003-02-12 2004-09-02 Fujitsu Ltd 回路基板のインピーダンスを計算する装置および方法
WO2020213451A1 (fr) * 2019-04-19 2020-10-22 株式会社村田製作所 Bloc-batterie inhalateur de type sans combustion, équipement électronique, et outil électrique
JP2021003126A (ja) * 2015-03-04 2021-01-14 アール・エイ・アイ・ストラテジック・ホールディングス・インコーポレイテッド エアロゾル送達デバイスのためのアンテナ
JP6860732B1 (ja) * 2020-07-09 2021-04-21 日本たばこ産業株式会社 エアロゾル生成装置の電源ユニット

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004246503A (ja) * 2003-02-12 2004-09-02 Fujitsu Ltd 回路基板のインピーダンスを計算する装置および方法
JP2021003126A (ja) * 2015-03-04 2021-01-14 アール・エイ・アイ・ストラテジック・ホールディングス・インコーポレイテッド エアロゾル送達デバイスのためのアンテナ
WO2020213451A1 (fr) * 2019-04-19 2020-10-22 株式会社村田製作所 Bloc-batterie inhalateur de type sans combustion, équipement électronique, et outil électrique
JP6860732B1 (ja) * 2020-07-09 2021-04-21 日本たばこ産業株式会社 エアロゾル生成装置の電源ユニット

Similar Documents

Publication Publication Date Title
US20240057688A1 (en) Power source unit for aerosol generation device
US20240138026A1 (en) Power supply unit of aerosol generating device
WO2022239275A1 (fr) Unité d'alimentation électrique pour dispositif de génération d'aérosol
WO2022239277A1 (fr) Unité de source d'énergie pour dispositif de génération d'aérosol
WO2022239278A1 (fr) Unité d'alimentation électrique pour dispositif de génération d'aérosol
US20240148058A1 (en) Power supply unit of aerosol generating device
JP7540084B2 (ja) エアロゾル生成装置の電源ユニット
KR20240100416A (ko) 에어로졸 생성 장치의 전원 유닛
US20240138488A1 (en) Power supply unit of aerosol generating device
JP7467769B2 (ja) エアロゾル生成装置の電源ユニット
WO2023105776A1 (fr) Unité d'alimentation électrique pour dispositif de génération d'aérosol
WO2023105775A1 (fr) Unité alimentation électrique pour dispositif de génération d'aérosol
WO2022239473A1 (fr) Unité d'alimentation électrique pour dispositif de génération d'aérosol
WO2023105767A1 (fr) Unité d'alimentation électrique pour dispositif de génération d'aérosol
WO2023105773A1 (fr) Unité d'alimentation électrique pour dispositif de génération d'aérosol
WO2022239474A1 (fr) Unité d'alimentation électrique pour dispositif de génération d'aérosol
WO2023105772A1 (fr) Unité d'alimentation électrique pour dispositif de génération d'aérosol
US20240138487A1 (en) Power supply unit of aerosol generating device
WO2022239472A1 (fr) Unité d'alimentation électrique pour dispositif de génération d'aérosol
WO2023105764A1 (fr) Unité alimentation électrique pour dispositif de génération d'aérosol
JP2024116317A (ja) エアロゾル生成装置の電源ユニット
CN118382373A (zh) 气溶胶生成装置的电源单元
CN118369006A (zh) 气溶胶生成装置的电源单元
CN117320576A (zh) 气溶胶生成装置的电源单元
CN118369008A (zh) 气溶胶生成装置的电源单元

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21942003

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 21942003

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: JP