WO2022239275A1 - Power supply unit for aerosol generation device - Google Patents

Power supply unit for aerosol generation device Download PDF

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Publication number
WO2022239275A1
WO2022239275A1 PCT/JP2021/043907 JP2021043907W WO2022239275A1 WO 2022239275 A1 WO2022239275 A1 WO 2022239275A1 JP 2021043907 W JP2021043907 W JP 2021043907W WO 2022239275 A1 WO2022239275 A1 WO 2022239275A1
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WO
WIPO (PCT)
Prior art keywords
power supply
ble
supply unit
circuit
board
Prior art date
Application number
PCT/JP2021/043907
Other languages
French (fr)
Japanese (ja)
Inventor
達也 青山
拓嗣 川中子
徹 長浜
貴司 藤木
亮 吉田
Original Assignee
日本たばこ産業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本たばこ産業株式会社 filed Critical 日本たばこ産業株式会社
Publication of WO2022239275A1 publication Critical patent/WO2022239275A1/en

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    • A—HUMAN NECESSITIES
    • A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
    • A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
    • A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
    • A24F40/40—Constructional details, e.g. connection of cartridges and battery parts
    • A—HUMAN NECESSITIES
    • A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
    • A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
    • A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
    • A24F40/65—Devices with integrated communication means, e.g. wireless communication means

Definitions

  • the present invention relates to a power supply unit for an aerosol generator.
  • Patent Document 1 describes mounting an LED and a processor on the circuit board of the controller and providing the processor with a Bluetooth (registered trademark) function.
  • Patent Literatures 2 and 3 disclose an aerosol generator having LED and Bluetooth (registered trademark) functions.
  • One aspect of the present invention aims to realize a power supply unit for an aerosol generator that can mount a communication module at an appropriate position on a circuit board.
  • a first aspect of the present invention provides a communication module that communicates with an external device, a power source that supplies power to drive a heater that heats an aerosol source, and A power supply unit for an aerosol generator, comprising: a controller for controlling power supply from a power supply to the heater; and a circuit board on which the communication module, passive components, and active components are mounted, wherein A distance between a given passive component closest to the communication module and the communication module is shorter than a distance between a given active component closest to the communication module among the active components and the communication module.
  • the predetermined active component is an electronic component that does not always function.
  • the predetermined active component is an electronic component that functions in the event of an abnormality.
  • a fourth aspect of the present invention is the second aspect or the fourth aspect, wherein the predetermined passive component is an overvoltage protection diode.
  • the communication module includes a first side portion and a second side portion different from the first side portion.
  • the passive components include a first passive component mounted at a position facing the first side surface and a second passive component mounted at a position facing the second side surface. ,including.
  • the predetermined active component is mounted at a position facing the second side surface portion, and the second passive component is located closer to the predetermined active component than the predetermined active component. is mounted near the second side surface and is a passive component different from the electronic component having the smallest volume among the passive components.
  • the predetermined active component is mounted at a position facing the second side surface portion, and the second passive component is located closer to the predetermined active component than the predetermined active component. is mounted near the second side portion and has a larger capacitance than the capacitor with the smallest capacitance among the capacitors included in the passive component.
  • the communication module includes a third side portion different from the first side portion and the second side portion
  • the power supply unit includes the an insulating chassis for holding a circuit board, wherein no electronic component is mounted between the third side face and a side edge of the circuit board facing the third side face; A side edge of the circuit board facing the third side face and the chassis are adjacent in a direction parallel to the mounting surface of the circuit board.
  • the integrated circuit is mounted on the circuit board, and the predetermined passive component is the communication module and the integrated circuit. and the distance between the predetermined passive component and the communication module is shorter than the distance between the predetermined passive component and the integrated circuit.
  • the circuit board includes a non-mounting area where no electronic component is mounted between the predetermined passive component and the integrated circuit.
  • the non-mounting region includes a rectangular portion having an area equal to or larger than the larger one of the communication module and the integrated circuit.
  • part of the boundary of the square portion coincides with part of the side edge of the circuit board.
  • the predetermined active component is mounted between the communication module and the integrated circuit, and the predetermined active component and the The distance between communication modules is less than the distance between the predetermined contact active component and the integrated circuit.
  • a power supply unit for an aerosol generator that can mount a communication module at an appropriate position on a circuit board.
  • FIG. 1A is a front view of the power supply unit of the aerosol generator of this embodiment.
  • FIG. 1B is a top view of the power supply unit of the aerosol generating device of the present embodiment with the opening/closing part closed.
  • FIG. 1C is a top view of the power supply unit of the aerosol generator of the present embodiment with the opening/closing part removed.
  • FIG. 1D is a bottom view of the power supply unit of the aerosol generator of this embodiment.
  • FIG. 2A is a front view of the inner case with the outer case removed from the power supply unit of the aerosol generating device of this embodiment.
  • FIG. 1A is a front view of the inner case with the outer case removed from the power supply unit of the aerosol generating device of this embodiment.
  • FIG. 2B is a rear view of the outer case removed from the power supply unit of the aerosol generating device of this embodiment.
  • FIG. 3 is a front view of the power supply unit of the aerosol generating device according to the present embodiment with the outer case and inner case covers removed.
  • FIG. 4 is a perspective view of the power supply unit of the aerosol generating device of the present embodiment with the outer case and the inner case removed.
  • FIG. 5 is a perspective view of the state shown in FIG. 4 with the slider further removed.
  • FIG. 6 is a perspective view of the state shown in FIG. 5 with the chassis and battery further removed.
  • FIG. 7 is a perspective view showing the arrangement and mutual connection relationship of the first circuit board and other circuit boards of the power supply unit of the aerosol generating device of the present embodiment.
  • FIG. 8A is a perspective view showing the arrangement and mutual connection relationship of the second circuit board and other circuit boards of the power supply unit of the aerosol generating device of the present embodiment.
  • FIG. 8B is a perspective view showing the arrangement and mutual connection relationship of the second circuit board and other circuit boards of the power supply unit of the aerosol generating device of the present embodiment.
  • FIG. 9A is a perspective view showing the third circuit board of the power supply unit of the aerosol generating device of the present embodiment, other arrangements, and mutual connection relationships.
  • FIG. 9B is a perspective view showing the third circuit board of the power supply unit of the aerosol generating device of the present embodiment, the other arrangement, and the mutual connection relationship.
  • FIG. 9A is a perspective view showing the third circuit board of the power supply unit of the aerosol generating device of the present embodiment, other arrangements, and the mutual connection relationship.
  • FIG. 9B is a perspective view showing the third circuit board of the power supply unit of the aerosol generating device of the present embodiment, the other arrangement, and the mutual connection relationship
  • FIG. 9C is a perspective view showing the third circuit board of the power supply unit of the aerosol generating device of the present embodiment, other arrangements, and mutual connection relationships.
  • FIG. 10 is a diagram showing electronic components mounted on the BLE substrate of the power supply unit of the aerosol generating device of this embodiment.
  • FIG. 11A is a diagram showing electronic components mounted on the MCU board of the power supply unit of the aerosol generating device of this embodiment.
  • FIG. 11B is a diagram showing electronic components mounted on the MCU board of the power supply unit of the aerosol generating device of this embodiment.
  • FIG. 12A is a diagram showing electronic components mounted on the USB board of the power supply unit of the aerosol generating device of this embodiment.
  • FIG. 12B is a diagram showing electronic components mounted on the USB board of the power supply unit of the aerosol generating device of this embodiment.
  • FIG. 13 is a diagram showing a metal-prohibited area around the BLE module of the aerosol generation device of this embodiment.
  • FIG. 14 is a cross-sectional view taken along line 11-11 of FIG. 1A showing the internal configuration of the power supply unit of the aerosol generating device of this embodiment.
  • FIG. 15 is an overall circuit diagram of the power supply unit of the aerosol generator of this embodiment.
  • the power supply unit 1 of the aerosol generator of the present invention is applied to a heated cigarette that generates an aerosol and a gas containing a flavoring substance, or an aerosol, or an aerosol containing a flavoring substance by heating an aerosol source with a heater.
  • the aerosol source is, for example, a liquid such as polyhydric alcohol such as glycerin or propylene glycol.
  • the aerosol source may be a mixed solution of polyhydric alcohols and water.
  • the aerosol source may include pharmaceuticals, herbal medicines, and flavoring ingredients.
  • the aerosol source can be liquid, solid, or a mixture of liquid and solid.
  • a vapor source such as water may be used.
  • the aerosol generating device of the present invention may further include a capsule containing a flavor source, in which case a capsule holder that detachably holds the capsule is included.
  • the flavor source is, for example, a molded body obtained by molding tobacco material.
  • the flavor source may be composed of plants other than tobacco (for example, mint, herbs, Chinese medicine, coffee beans, etc.). Flavor sources such as menthol may be added to the flavor source. A flavor source may be added to the aerosol source.
  • FIG. 1A is a front view of the power supply unit of the aerosol generating device of this embodiment.
  • FIG. 1B is a top view of the power supply unit of the aerosol generating device of the present embodiment with the opening/closing part closed.
  • FIG. 1C is a top view of the power supply unit of the aerosol generator of the present embodiment with the opening/closing part removed.
  • FIG. 1D is a bottom view of the power supply unit of the aerosol generator of this embodiment.
  • FIG. 2A is a front view of the inner case with the outer case removed from the power supply unit of the aerosol generating device of this embodiment.
  • FIG. 2B is a rear view of the outer case removed from the power supply unit of the aerosol generating device of this embodiment.
  • FIG. 3 is a front view of the power supply unit 1 of the aerosol generating device of the present embodiment, with the covers of the outer case and the inner case removed.
  • the power supply unit 1 of the aerosol generating device of this embodiment includes an inner case 2 as a first panel and an outer case 3 as a second panel that constitute the overall outer shape.
  • the inner case 2 accommodates a chassis 4 , a heating unit 5 , first to fourth circuit boards 6 to 9 and a battery 10 .
  • the outer case 3 is attached to the front surface of the inner case 2 .
  • the outer case 3 is an exterior member that can be attached to and detached from the inner case 2 .
  • a pair of magnets 11a are provided on the front surface of the inner case 2 so as to be spaced apart from each other.
  • a pair of magnets 11 b are provided on the back surface of the outer case 3 at positions corresponding to the pair of magnets 11 a of the inner case 2 .
  • the inner case 2 includes a case body portion 12 with an open front surface and a cover portion 13 attached to the front surface of the case body portion 12 .
  • the cover portion 13 is fixed to the front opening of the case main body portion 12 with screws or the like.
  • a notification section 14 and an operation section 15 are provided in the case main body section 12 of the inner case 2 .
  • the notification unit 14 is a light emitting unit including an LED and a light guide plate.
  • the operation unit 15 is a push button type operation member such as a tactile switch. The lighting of the LED of the notification unit 14 is controlled according to the operating state of the device.
  • the cover portion 13 of the inner case 2 is formed with a plurality of ventilation holes 13a for heat dissipation in the lower part, and the long hole 16 for exposing the LED is formed at a position corresponding to the notification portion 14 of the case main body portion 12, A round hole 17 for exposing the tactile switch 15 is formed at a position corresponding to the operating portion 15 of the case body portion 12 .
  • the long hole 16 of the LED is a slit extending vertically in the cover portion 13 of the inner case 2 , and the round hole 17 of the tactile switch 15 is formed below the long hole 16 of the LED.
  • the outer case 3 can be made of an elastically deformable material. Thus, when the outer case 3 is pressed while the outer case 3 is held on the front surface of the inner case 2, the tactile switch 15 can be pressed through the elastically deformed outer case 3.
  • An opening/closing portion 18 is provided on the upper surface of the case main body portion 12 of the inner case 2, and a connecting portion 19 is provided on the lower surface thereof.
  • the opening/closing part 18 is a sliding lid (hereinafter referred to as a slider) capable of opening and closing the chamber part 20 for loading the heating unit 5 with the aerosol source. The user can open and close the slider 18 with the thumb of the hand holding the cases 2 and 3 while holding the cases 2 and 3 with one hand.
  • the connection unit 19 is an interface for connecting with an external device, and is, for example, a USB Type-C receptacle connector (hereinafter referred to as a USB connector).
  • a lens portion 21 that transmits LED light is provided at a position corresponding to the notification portion 14 on the front surface of the outer case 3 .
  • the case main body 12 of the inner case 2 accommodates the heating unit 5, the first to fourth circuit boards 6 to 9, and the chassis 4 that holds the battery 10.
  • the chassis 4 is made of an insulating material (made of resin, for example) that holds the first to fourth circuit boards 6 to 9, the vibration generating motor 24, the magnets 11a and 11b.
  • FIG. 4 is a perspective view of the power supply unit 1 of the aerosol generating device of this embodiment with the outer case 3 and the inner case 2 removed.
  • FIG. 5 is a perspective view of the state shown in FIG. 4 with the slider 18 further removed.
  • FIG. 6 is a perspective view of the state shown in FIG. 5 with the chassis 4 and the battery 10 further removed. Note that the magnet 11a is also removed from the power supply unit 1 of the aerosol generator in FIGS. 4-6.
  • the heating unit 5 includes a cylindrical chamber portion 20 loaded with an aerosol source, a heater 25 provided in the chamber portion 20 so as to heat the aerosol source, and a heater temperature detector 26 for detecting the temperature of the heater 25. , and a puffing motion detector 27 that detects a puffing motion (a motion of inhaling an aerosol).
  • a case temperature detector 29 for detecting the temperature inside the inner case 2 is provided near the heating unit 5 .
  • the heater 25 may be attached to the power supply unit 1 of the aerosol generator in a form that cannot be removed without destruction (for example, by soldering), or in a form that can be removed without destruction. may be attached.
  • the electrical connection by the "connector" is divided into a form in which it cannot be separated from each other without being broken, and a form in which it can be separated from each other without being broken. It will be described as any one.
  • the heating unit 5 may be composed of a combination of an induction coil and a susceptor.
  • the aerosol source is heated by induction heating.
  • the susceptor may be configured as a cylindrical chamber portion 20 or may be provided inside the aerosol source.
  • the battery 10 is a rechargeable secondary battery, capacitor, or the like, preferably a lithium ion battery.
  • a battery 10 supplies power to each component of the power supply unit 1 of the aerosol generator.
  • the temperature of the battery 10 is detected by a battery temperature detector 28 connected to the third circuit board 8 .
  • Each of the heater temperature detector 26, the puff operation detector 27, the battery temperature detector 28 and the case temperature detector 29 may be composed of a PTC thermistor or an NTC thermistor.
  • the chamber part 20 of the heating unit 5 has an opening 20a to which an aerosol source can be attached, and the opening 20a can be opened and closed by the slider 18.
  • the first to fourth circuit boards 6-9 are electrically connected by a connection frame 30 made of a conductive material.
  • the connection frame 30 preferably consists of a flexible printed circuit board.
  • FIG. 7 is a perspective view showing the mounting surface of the first circuit board 6 of the power supply unit 1 of the aerosol generating device of this embodiment, the arrangement of other circuit boards, and their mutual connection relationship.
  • FIG. 8A is a perspective view showing the arrangement and mutual connection relationship of the second circuit board and other circuit boards of the power supply unit of the aerosol generating device of the present embodiment.
  • FIG. 8B is a perspective view showing the arrangement and mutual connection relationship of the second circuit board and other circuit boards of the power supply unit of the aerosol generating device of the present embodiment.
  • FIG. 9A is a perspective view showing the third circuit board of the power supply unit of the aerosol generating device of the present embodiment, other arrangements, and mutual connection relationships.
  • FIG. 8A is a perspective view showing the arrangement and mutual connection relationship of the second circuit board and other circuit boards of the power supply unit of the aerosol generating device of the present embodiment.
  • FIG. 9B is a perspective view showing the third circuit board of the power supply unit of the aerosol generating device of the present embodiment, the other arrangement, and the mutual connection relationship.
  • FIG. 9C is a perspective view showing the third circuit board of the power supply unit of the aerosol generating device of the present embodiment, other arrangements, and mutual connection relationships.
  • FIG. 8A mainly shows the front surface of the second circuit board 7, and FIG. 8A mainly shows the back surface of the second circuit board 7.
  • FIG. 9A and 9B mainly show the back surface of the third circuit board 8, and
  • FIG. 9C mainly shows the front surface of the second circuit board 8.
  • FIG. 9B shows a state in which the temperature detector (battery thermistor) 28 of the battery 10 and the negative and positive bus bars 22a and 22b, which will be described later, are removed from the state shown in FIG. 9A for explanation.
  • the first circuit board 6 shown in FIG. 7 is a board (hereinafter referred to as a BLE substrate).
  • the BLE substrate 6 includes IC chips such as a case attachment/detachment detection circuit (Hall IC) 63 for detecting attachment/detachment of the outer case 3 with respect to the inner case 2, a Schmidt trigger circuit (inverter) 64, and the like.
  • a tactile switch 15 and other circuits and elements are implemented.
  • the Schmitt trigger circuit 64 is provided to give the output of the case attachment/detachment detection circuit 63 a hysteresis characteristic.
  • the second circuit board 7 shown in FIGS. 8A and 8B is a board on which an MCU (controller) 71 and a charging circuit (charge IC) 72a are mounted (hereinafter referred to as MCU board).
  • MCU board 7 includes a reactor (power inductor) 72b of the charging circuit 72a, a non-volatile memory (ROM) 73, load switch circuits 74a to 74c, a power switch driver circuit 75, a first Transformer circuit (DC/DC converter IC) 76a and reactor (power inductor) 76b, heater temperature detector (heater thermistor) 26 voltage detection circuit (operational amplifier A2 in FIG.
  • case temperature detector case thermistor 29 IC chips such as voltage detection circuit (operational amplifier A3 in FIG. 15) 77b, first latch circuit 78a and second latch circuit 78b, and positive/negative connectors 79a and 79b of heater temperature detector (heater thermistor) 26 , positive/negative connectors 90a and 90b of the puff action detector (puff thermistor) 27, positive/negative connectors 91a and 91b of the case temperature detector (case thermistor) 29, connector 92 of the vibration motor 24, and others. Circuits, ICs, and elements are mounted.
  • the positive/negative connectors 79a and 79b of the heater temperature detector (heater thermistor) 26 are not connected to the heater temperature detector (heater thermistor) 26 via lead wires. Note that this is merely a drawing convenience. In practice, the lead wires can be connected to the positive/negative connectors 79 a and 79 b of the heater temperature detector (heater thermistor) 26 through the gaps in the connection frame 30 . The same applies to the positive/negative connectors 90 a and 90 b of the puff action detector (puff thermistor) 27 and the positive/negative connectors 91 a and 91 b of the case temperature detector (case thermistor) 29 .
  • the third circuit board 8 shown in FIGS. 9A-9C is a board on which the USB connector 19 is mounted (hereinafter referred to as USB board).
  • the USB board 8 includes a negative bus bar 22 a connected to the negative electrode of the battery 10 , a positive bus bar 22 b connected to the positive electrode of the battery 10 , and a temperature detector (battery thermistor) 28 for the battery 10 . is connected.
  • the USB board 8 includes a battery level detection circuit (gas gauge IC) 81a, a current detection resistor 81b for the battery level detection circuit 81a, a second transformer circuit (DC/DC converter IC) 82a, and a reactor (power inductor) 82b.
  • a protection circuit (protection IC) 83a a protection circuit (protection IC) 83a, a current detection resistor 83b of the protection circuit 83a, a charge/discharge cutoff switch (MOSFET) 83c controlled by the protection circuit 83a, a heater voltage detection circuit (operational amplifier A1 in FIG. 15) 84, heater heating switch circuit (MOSFET) 85, connector 86a of negative bus bar 22a, connector 86b of positive bus bar 22b, positive/negative connectors 87a, 87b of heater 25, positive/negative connector 88 of battery temperature detector 28, A negative side switch circuit (MOSFET) 90 of the heater 25, an overvoltage protection circuit (overvoltage protection IC) 93, and other circuits, ICs, and elements are mounted.
  • protection circuit protection circuit
  • MOSFET charge/discharge cutoff switch
  • the fourth circuit board 9 shown in FIGS. 7, 8A and 8B is an open/close detection board on which an open/close detection circuit (Hall IC) 95 for detecting opening/closing of the slider 18 is mounted.
  • the BLE board 6, MCU board 7, and USB board 8 have long and narrow outlines with longitudinal and lateral directions.
  • the MCU board 7 and the USB board 8 are arranged directly below the heating unit 5 and arranged in parallel so that the back surface (second surface) of the MCU board 7 and the front surface (first surface) of the USB board 8 face each other.
  • the BLE board 6 has one end in the longitudinal direction where the BLE module 62 is mounted, located near the center in the longitudinal direction of the MCU board 7 and the USB board 8, and the distance from near the center to the other end where the BLE module is not mounted. It is offset with respect to the MCU board 7 and the USB board 8 so that the area is located between the heating unit 5 and the battery 10 . Also, the BLE board 6 is arranged such that the mounting surface (first surface) of the BLE board 6 is substantially perpendicular to the mounting surfaces (front and rear surfaces) of the MCU board 7 and the USB board 8 .
  • the MCU board 7 and the USB board 8 are electrically connected by a connector provided on the MCU board 7, a connector 34 (see FIGS. 12A and 12B) provided on the USB board 8, and a flexible board 31 connected to the MCU board 7. connected
  • the BLE board 6 is electrically connected to the MCU board 7 by the connection frame 30 .
  • the open/close detection board 9 is electrically connected to the MCU board 7 by a branch frame 32 branching from the connection frame 30 .
  • the branch frame 32 is preferably constructed from a flexible printed circuit board.
  • FIG. 15 is a circuit diagram of the power supply unit 1 of the aerosol generating device of this embodiment.
  • a power source BT is the battery 10 .
  • the protection circuit 83a is a protection IC that measures the current flowing through the path through which the current output from the power supply BT flows using a resistor R2 and protects the power supply BT according to the current.
  • the battery remaining amount detection circuit 81a is a gas gauge IC (remaining amount gauge IC) that measures the state of the power supply BT using a resistor R1 arranged in the path through which the current output from the power supply BT flows.
  • the overvoltage protection circuit 93 is an overvoltage protection IC that receives the voltage VBUS supplied from the USB connector 19 as a power supply connector and outputs the voltage VUSB to the VUSB line.
  • the overvoltage protection circuit 93 has a function of reducing the voltage V BUS supplied from the USB connector 19 to the specified voltage value and supplying it to the output side of the overvoltage protection circuit 93 even if the voltage VBUS exceeds the specified voltage value. .
  • the second transformer circuit 82 a is a DC/DC converter including a switching regulator that transforms the power supply voltage V BAT supplied from the power supply BT to generate the heater voltage V BOOST for driving the heater 25 .
  • the second transformer circuit 82a is a DC/DC converter with a step-up function, preferably a step-up DC/DC converter or a buck-boost DC/DC converter.
  • the MCU 71 When the heater 25 is to generate heat, the MCU 71 turns off the switch SM, turns on the switches SH and SS, and supplies the heater voltage V BOOST to the heater 25 through the switch SH.
  • the MCU 71 turns off the switch SH, turns on the switches SM and SS, and supplies the heater voltage V BOOST to the heater 25 through the switch SM.
  • the operational amplifier A1 measures the voltage between the positive and negative terminals of the heater 25, in other words, the voltage between the positive/negative connectors 87a and 87b of the heater 25.
  • the PA7 terminal of MCU71 is supplied with the output according to the voltage between.
  • the operational amplifier A1 functions as a temperature detection circuit that measures the resistance value or temperature of the heater 25.
  • FIG. A shunt resistor RS is arranged in a path electrically connecting the switch SM and the positive connector 87 a of the heater 25 .
  • the resistance value of the shunt resistor RS can be determined so that the switch SR is turned on while the heater 25 is heated and turned off while the temperature or resistance value of the heater 25 is measured.
  • the switch SR When the switch SR is composed of an N-channel MOSFET, the drain terminal of the switch SR is connected to the output terminal of the operational amplifier A1, and the gate terminal of the switch SR is connected between the shunt resistor RS and the positive connector 87a of the heater 25. , and the source terminal of switch SR is connected to ground. A value obtained by dividing the heater voltage V BOOST mainly by the shunt resistor RS and the heater 25 is input to the gate terminal of the switch SR. The resistance value of the shunt resistor RS can be determined so that the divided value is greater than or equal to the threshold voltage of the switch SR.
  • the current flowing through the heater 25 when the switch SH is turned off and the switches SM and SS are turned on flows through the heater 25 when the switch SH and the switch SS are turned on and the switch SM is turned off. smaller than the current. This makes it difficult for the temperature of the heater 25 to change due to the current flowing through the heater 25 when measuring the temperature or resistance of the heater 25 .
  • the load switch circuit 74c electrically disconnects the VIN terminal and the VOUT terminal when a low level is input to the ON terminal, and disconnects the VIN terminal and the VOUT terminal when a high level is input to the ON terminal. and are electrically connected to output the voltage VCC5 from the VOUT terminal to the VCC5 line.
  • the voltage value of the voltage VCC5 is, for example, 5.0 [V].
  • the V CC5 line is connected to the VBUS and VAC terminals of charging circuit 72 a and to LED 61 .
  • a collector terminal of an npn-type bipolar transistor is connected to the ON terminal of the load switch circuit 74c.
  • the emitter terminal of this bipolar transistor is connected to the ground GND7, and the base terminal is connected to the PC9 terminal of the MCU71. That is, the MCU 71 can control opening/closing of the load switch 74c through the bipolar transistor by adjusting the potential of the PC9 terminal.
  • the charging circuit 72a is a charging IC that electrically connects the SYS terminal and the BAT terminal inside and supplies charging voltage from the BAT terminal to the power supply BT in the charging mode.
  • the charge mode is enabled or activated by supplying a low level to the /CE terminal.
  • the charging circuit 72a electrically connects the VBUS terminal and the SW terminal, and receives the voltage VCC5 supplied via the VCC5 line and/or the power supply voltage supplied from the power supply BT to the BAT terminal.
  • V BAT is used to supply the voltage V CC to the V CC line.
  • the charging circuit 72a receives the power supply voltage VBAT supplied from the power supply BT to the BAT terminal, supplies the voltage VCC from the SYS terminal to the VCC line, and supplies the voltage VCC5 from the VBUS terminal to the VCC5 line. Provides VCC5 .
  • the charging circuit 72a in the OTG mode boosts the power supply voltage V BAT supplied to the BAT terminal so that the voltage V CC5 supplied from the VBUS terminal to the V CC5 line also becomes 5.0 [V] in the OTG mode. Therefore, it is preferable to supply the VCC5 line from the VBUS terminal.
  • the charging circuit 72 a operates in the default operation mode or the operation mode set by the MCU 71 among the power pass mode and the OTG mode.
  • the first transformer circuit 76a is enabled by applying voltage VCC to the VCC line. Specifically, the first transformer circuit 76a is enabled by inputting a high-level signal to the EN terminal. Since the VIN and EN terminals are connected to the VCC line, the first transformer circuit 76a is enabled by applying voltage VCC to the VCC line.
  • the first transformer circuit 76a is a DC/DC converter that includes a switching regulator that supplies voltage VCC33_0 from the VOUT terminal to the VCC33_0 line.
  • the first transformer circuit 76a is more preferably a step-up/step-down DC/DC converter.
  • the voltage value of the voltage V CC33_0 is, for example, 3.3 [V].
  • the VCC33_0 line is connected to the VIN terminal of the load switch circuit 74b, the VIN and RSTB terminals of the power switch driver circuit 75, and the VCC and D terminals of the second latch circuit 78b.
  • the load switch circuit 74b electrically disconnects the VIN terminal and the VOUT terminal when a low level is input to the ON terminal, and disconnects the VIN terminal and the VOUT terminal when a high level is input to the ON terminal. and are electrically connected to output the voltage VCC33 from the VOUT terminal to the VCC33 line.
  • the voltage value of the voltage VCC33 is, for example, 3.3 [V].
  • the VCC 33 line includes the VIN terminal of the load switch 74a, the VCC terminal of the nonvolatile memory 73, the VDD and CE terminals of the remaining battery level detection circuit 81a, the VDD terminal of the MCU 71, the VDD terminal of the case attachment/detachment detection circuit 63, and the Schmitt trigger circuit.
  • the VIN terminal of the load switch 74b is electrically connected to the VOUT terminal of the first transformer circuit 76a, and the voltage VCC33_0 is supplied from the first transformer circuit 76a.
  • the power switch driver circuit 75 outputs a low level from the RSTB terminal in response to the low level being supplied to the SW1 terminal and the SW2 terminal for a predetermined time.
  • the RSTB terminal is electrically connected to the ON terminal of the load switch circuit 74b. Accordingly, in response to the low level being supplied to the SW1 terminal and SW2 terminal of the power switch driver circuit 75, the load switch circuit 74b stops outputting the voltage VCC33 from the VOUT terminal.
  • the output of the voltage VCC33 from the VOUT terminal of the load switch circuit 74b stops, the supply of the voltage VCC33 to the VDD terminal (power supply terminal) of the MCU71 is cut off, so the MCU71 stops operating.
  • the power switch driver circuit 75 does not output a low level from the RSTB terminal after outputting a low level from the RSTB terminal.
  • the voltage VCC33_0 is input to the ON terminal of the load switch 74b, so that the load switch 74b again outputs the voltage VCC33 from the VOUT terminal to the VCC33 line.
  • the MCU 71 that has stopped operating can be restarted.
  • the load switch circuit 74a electrically disconnects the VIN terminal and the VOUT terminal when a low level is input to the ON terminal, and disconnects the VIN terminal and the VOUT terminal when a high level is input to the ON terminal. and are electrically connected to output the voltage VCC33_SLP from the VOUT terminal to the VCC33_SLP line.
  • the voltage value of the voltage V CC33_SLP is, for example, 3.3 [V].
  • the V CC33_SLP line is connected to a heater temperature detector (heater thermistor) 26 , a puff action detector (puff thermistor) 27 , and a case temperature detector (case thermistor) 29 .
  • the ON terminal of the load switch circuit 74a is electrically connected to the PC11 terminal of the MCU 71, and the MCU 71 transitions the logic level of the PC11 terminal from high level to low level when transitioning to sleep mode. When shifting to the active mode, the logic level of the PC11 terminal is changed from low level to high level.
  • the MCU 71 uses the resistance value change of the puff thermistor 27 to detect the temperature change in the air flow path due to the puff operation.
  • the MCU 71 can acquire the resistance value change of the puff thermistor 27 from the value of the voltage input to the PC4 terminal.
  • the vibration motor 24 is activated by turning on the switch SN.
  • the switch SN may be composed of a transistor, and a control signal is supplied from the PH0 terminal of the MCU 71 to the base or gate of the transistor.
  • a driver IC for the vibration motor 24 may be used instead of the switch SN.
  • the MCU 71 detects the temperature of the heater 25 using the resistance value change of the heater thermistor 26 .
  • the temperature of heater 25 may be detected indirectly by detecting the temperature in the vicinity of heater 25 .
  • the MCU 71 can acquire the resistance value change of the puff thermistor 26 from the value of the voltage input to the PA6 terminal.
  • the operational amplifier A ⁇ b>2 outputs a voltage corresponding to the resistance value of the heater thermistor 26 , in other words, a voltage corresponding to the temperature of the heater 25 .
  • the MCU 71 detects the temperature inside the inner case 2 using the change in the resistance value of the case thermistor 29 .
  • the MCU 71 can acquire the resistance value change of the case thermistor 29 from the value of the voltage input to the PA3 terminal.
  • the operational amplifier A3 outputs a voltage corresponding to the resistance value of the case thermistor 29, in other words, a voltage corresponding to the temperature of the inner case 2.
  • the MCU 71 (controller) includes a processor configured as an IC chip, and controls the overall operation of the power supply unit 1 of the aerosol generator by executing programs stored in the nonvolatile memory 73 or built-in memory.
  • the MCU 71 performs heating control of the heater 25 and charge/discharge control of the battery 10 .
  • the MCU 71 starts heating control of the heater 25 when the tactile switch 15 is pressed long while the outer case 3 is attached.
  • the heating control of the heater 25 can be started by supplying a high level from the PC12 terminal of the MCU 71 to the gate terminal of the switch SS and the EN terminal of the second transformer circuit 82a.
  • the negative connector 87b of the heater 25 is connected to the ground, and the second transformer circuit 82a outputs the heater voltage V BOOST .
  • the switch SH is turned on and the heater voltage V BOOST is supplied to the heater 25 .
  • the MCU 71 controls power supply to the heater 25 for heating the aerosol source using power from the power supply BT, and controls heat generation of the heater 25 . Specifically, the MCU 71 controls heat generation of the heater 25 by PWM control or PFM control for the switch SH. The duty ratio in PWM control or PFM control may be calculated by PID control. The MCU 71 may acquire the temperature of the heater 25 required for PID control from the output of the operational amplifier A1 or from the input to the PC6 terminal.
  • the MCU 71 starts pairing by BLE when the tactile switch 15 is pressed long while the slider 18 is closed.
  • the case attachment/detachment detection circuit 63 is a Hall IC that detects that the outer case 3 has been removed from the aerosol generator or power supply unit 1 .
  • the output of the case attachment/detachment detection circuit 63 is supplied to the SW2 terminal of the power switch driver circuit 75 and the PD2 terminal of the MCU 71 via the Schmidt trigger circuit 64 .
  • the output of the open/close detection circuit 95 is supplied to the PC13 terminal of the MCU71.
  • the BLE module 62 is a communication module that provides the MCU 71 with the function of communicating with external devices such as smartphones, mobile phones, and personal computers in compliance with short-range wireless communication standards such as Bluetooth (registered trademark).
  • the communication module is not limited to BLE, and may be a communication interface conforming to other communication standards such as NFC (Near Field Communication) and wireless LAN (Local Area Network).
  • the first latch circuit 78a is a flip-flop circuit that holds an output so as to stop charging and discharging when the heater 25 overheats.
  • the first latch circuit 78a is preferably a D-type flip-flop IC.
  • the second latch circuit 78b is a flip-flop circuit that stores the occurrence of overheating when the heater 25 overheats.
  • the second latch circuit 78b is preferably a D-type flip-flop IC.
  • the cathode of the LED 61 mounted on the BLE substrate 6 is connected to the MCU 71 of the MCU substrate 7 without being connected to the ground GND 6 of the BLE substrate 6 .
  • the ground of the BLE substrate 6 is reduced.
  • the anode of the LED 61 is connected to the load switch 74c of the MCU board 7, the voltage VCC5 is applied, and the discharge to the LED 61 is controlled by the MCU71.
  • the noise ground noise
  • the MCU 71 that controls discharge to the LED 61 is mounted on the MCU board 7 that is separate from the BLE board 6, it is possible to reduce the influence of noise due to discharge control on the BLE module 62. You can keep it in good condition.
  • FIG. 10 is a diagram showing electronic components mounted on the BLE board 6 of the power supply unit 1 of the aerosol generating device of this embodiment.
  • FIG. 11A is a diagram showing electronic components mounted on the MCU board of the power supply unit of the aerosol generating device of this embodiment.
  • FIG. 11B is a diagram showing electronic components mounted on the MCU board of the power supply unit of the aerosol generating device of this embodiment.
  • FIG. 12A is a diagram showing electronic components mounted on the USB board of the power supply unit of the aerosol generating device of this embodiment.
  • FIG. 12B is a diagram showing electronic components mounted on the USB board of the power supply unit of the aerosol generating device of this embodiment.
  • the BLE substrate 6 has a first surface 6A on which electronic components are mounted and a second surface 6B (not shown) on the back side of the first surface 6A.
  • IC chips such as an LED 61, a BLE module 62, a case attachment/detachment detection circuit 63, a Schmitt trigger circuit 64, a tactile switch 15, a crystal oscillator 161, capacitors 162a to 162h, and an overvoltage protection element.
  • Circuits and elements such as (zener diodes or varistors) 163a to 163d and resistors 164a to 164c are mounted. The mutual layout relationship of electronic components and circuit boards for maintaining a good communication state of the BLE module 62 will be described later.
  • the MCU board 7 has a first surface 7A (front surface) on which electronic components are mounted and a second surface 7B (back surface) behind the first surface 7A.
  • MCU 71, charging circuit 72a, reactor (power inductor) 72b of charging circuit 72a, load switch circuits 74b and 74c, first transformer circuit 76a and reactor 76b, and second latch circuit are provided on first surface 7A of MCU substrate 7.
  • IC chips such as 78b, positive/negative connectors 79a and 79b of the heater thermistor 26, and other circuits, ICs, and elements are mounted.
  • a nonvolatile memory (ROM) 73 On the second surface 7B of the MCU board 7, a nonvolatile memory (ROM) 73, a load switch circuit 74a, a power switch driver circuit 75, a voltage detection circuit 77a for the heater thermistor 26, a voltage detection circuit 77b for the case thermistor 29, a first IC chips such as the latch circuit 78a, the positive/negative connectors 90a and 90b of the puff thermistor 27, the positive/negative connectors 91a and 91b of the case thermistor 29, the connector 92 of the vibration motor 24, other circuits and ICs and devices are mounted.
  • ROM nonvolatile memory
  • load switch circuit 74a On the second surface 7B of the MCU board 7, a nonvolatile memory (ROM) 73, a load switch circuit 74a, a power switch driver circuit 75, a voltage detection circuit 77a for the heater thermistor 26, a voltage detection circuit 77b for the case thermistor 29,
  • a circular spacer 33 is formed on the MCU board 7 .
  • the spacer 33 is a positioning screw hole for positioning the MCU board 7 and the USB board 8 .
  • the USB board 8 has a first surface 8A (front surface) on which electronic components are mounted and a second surface 8B (back surface) behind the first surface.
  • the USB connector 19 On the first surface 8A of the USB board 8, the USB connector 19, the reactor (power inductor) 82b of the second transformer circuit 82a, the connector 86a of the negative bus bar 22a, the connector 86b of the positive bus bar 22b, and the positive side of the heater 25 are provided.
  • /Negative side connectors 87a and 87b, a positive/negative side connector 88 of the battery thermistor 28, a negative side switch circuit 89 of the heater 25, and the like are mounted.
  • a battery level detection circuit 81a a current detection circuit 81b of the battery level detection circuit 81a, a second transformer circuit 82a, a protection circuit 83a, and a current detection circuit of the protection circuit 83a are provided.
  • 83b a charge/discharge cutoff switch 83c controlled by the protection circuit 83a, a heater voltage detection circuit 84, a heater heating switch circuit 85, an overvoltage protection circuit 93, and the like are mounted.
  • a circular spacer 33 is formed on the USB board 8 .
  • the spacer 33 is a positioning screw hole for positioning the MCU board 7 and the USB board 8 .
  • a connector 34 for connecting the flexible board 31 connected to the MCU board 7 is provided on the side edge of the USB board 8 .
  • FIG. 13 is an explanatory diagram of a prohibited area for metal parts, a metal housing, sheet metal, etc., and a prohibited area for copper foil (conductor) patterns of the BLE module 62 .
  • the upper side of FIG. 13 shows the overall image of the BLE board 6 and electronic components around it, and the lower side of FIG. 13 shows an enlarged view of the BLE module 62 and its surroundings.
  • FIG. 14 is a cross-sectional view taken along line 11-11 of FIG. 1A.
  • the BLE module 62 generally has an integrated circuit section 62a and an antenna section 62b.
  • prohibited areas first It is desirable to secure a prohibited area 100 and a prohibited area (second prohibited area) 101 of the copper foil (conductor) pattern.
  • a prohibited area (first prohibited area) 100 such as a metal part, a metal housing, or a sheet metal is an area below and above a portion of the BLE substrate 6 where the antenna region 62b is mounted.
  • a copper foil (conductor) pattern prohibition area (second prohibition area) 101 is an area of the BLE substrate 6 on the side of and immediately below the antenna area 62b.
  • the BLE module 62 by mounting the BLE module 62 on the side edge of the BLE board 6, other electronic components (the LED 61, which may become a noise source, the case attachment/detachment detection circuit 63, the Schmidt trigger circuit 64, other circuits, etc.)
  • the influence of the MCU 71 mounted on the substrate, the second transformer circuit 82a, the first transformer circuit 76a, etc.) is mitigated.
  • the inner case 2, the outer case 3, and the chassis 4 to create the first prohibited area 100 for the BLE module 62, and by holding the BLE board 6 by the chassis 4, the second prohibited area 100 for the BLE module 62 is maintained. A prohibited area 101 is secured.
  • the first prohibited area 100 is an area in the vertical direction of the BLE module 62, as shown in FIG.
  • the first prohibited area 100 is preferably an area of 10 mm or more in the vertical direction of the BLE module 62 .
  • the second prohibited area 101 is an area on both sides of the antenna section 62 b of the BLE module 62 and an area overlapping the antenna section 62 b among all layers of the BLE board 6 in the thickness direction of the BLE board 6 .
  • the BLE substrate 6 has a first side edge portion 201 and a second side edge portion 202 that form two opposite sides in the short direction, and two opposite sides in the longitudinal direction. It has a substantially rectangular shape including a third side edge portion 203 and a fourth side edge portion 204 .
  • the first side edge 201 is substantially linear.
  • a protruding portion 202a is formed on the second side edge portion 202 .
  • the third side edge portion 203 is formed substantially linearly.
  • Notch portions 204a and 204b are formed in the fourth side edge portion 204 .
  • the third side edge portion 203 is formed substantially linearly.
  • the third side edge 203 is arranged close to the chassis 4 .
  • a portion of the fourth side edge 204 is positioned close to the side edge of the USB board 8 .
  • the BLE board 6 has electronic components mounted on the first surface 6A, and the third side edge 203 and the second surface 6B are fixed to the chassis 4 .
  • the BLE board 6 has a second surface 6B close to the MCU board 7 and the USB board 8 and a first surface 6A behind the second surface 6B and far from the MCU board 7 and the USB board 8 .
  • Active components, passive components, and auxiliary components are mounted on the first surface 6A of the BLE board 6 in addition to the BLE module 62 .
  • An active component is an electronic component that has an input and an output, and by applying a voltage, has a certain relationship between the input and the output, and is an electronic component that can become a noise source.
  • Active parts include, for example, an LED 61, a case attachment/detachment detection circuit (Hall IC) 63, a Schmitt trigger circuit 64, and overvoltage protection elements (Zener diodes or varistors) 163a to 163d.
  • Passive components are electronic components that do not function by themselves, but function in combination with active components. Passive components are, for example, a crystal oscillator 161, capacitors 162a-162h, and resistors 164a-164c.
  • Auxiliary parts are electronic parts that make an electric circuit energized or de-energized.
  • Auxiliary components are, for example, tactile switches 15 .
  • active components such as an LED 61, a case attachment/detachment detection circuit (Hall IC) 63, a Schmitt trigger circuit 64, overvoltage protection elements (Zener diodes or varistors) 163a to 163d, and tactile switches 15, etc.
  • active components such as an LED 61, a case attachment/detachment detection circuit (Hall IC) 63, a Schmitt trigger circuit 64, overvoltage protection elements (Zener diodes or varistors) 163a to 163d, and tactile switches 15, etc.
  • Passive components such as a crystal oscillator 161, capacitors 162a to 162h, and resistors 164a to 164c are mounted on the first surface 6A of the BLE substrate 6.
  • no electronic parts are mounted between the BLE module 62, electronic parts such as the LED 61, and IC chips such as the case attachment/detachment detection circuit (Hall IC) 63 and the Schmitt trigger circuit 64.
  • a non-mounting area 150 is provided.
  • the non-mounting region 150 is near the central portion between the first side edge portion 201 and the second side edge portion 202 on the first surface 6A of the BLE substrate 6, and is a notch of the fourth side edge portion 204. It is provided between part of the portion 204 b and the third side edge portion 203 .
  • the non-mounting region 150 includes a first boundary portion 151 substantially parallel to the first side edge portion 201 of the BLE substrate 6 and a second boundary portion 152 substantially parallel to the second side edge portion 202 of the BLE substrate 6. , a fourth boundary portion 154 substantially parallel to the fourth side edge portion 204 of the BLE substrate 6, and a third boundary portion 153 substantially parallel to the third side edge portion 203 of the BLE substrate 6.
  • the non-mounting area 150 in FIG. 10 is shown separated from other portions of the first surface 6A of the BLE substrate 6 for easy understanding.
  • the non-mounting area 150 may be part of the first surface 6A of the BLE substrate 6, and the first to fourth boundaries 151 to 154 may be virtual boundaries.
  • the non-mounting area 150 includes a rectangular portion having an area equal to or greater than the larger of the area of the BLE module 62 and the area of the case attachment/detachment detection circuit (Hall IC) 63 and Schmidt trigger circuit 64 in plan view.
  • a portion of the third boundary portion 153 of the non-mounting region 150 substantially coincides with a portion of the third side edge portion 203 of the BLE substrate 6 .
  • the BLE substrate 6 includes a first area 6A1, which is an area between the non-mounting area 150 and the first side edge portion 201 of the BLE substrate 6, where the BLE module 62 is mounted, and the non-mounting area 150. It is an area between the second side edges 202 of the BLE substrate 6 and includes a second area 6A2 including IC chips such as a case attachment/detachment detection circuit (Hall IC) 63 and a Schmidt trigger circuit 64.
  • the number (M) of active components (overvoltage protection elements 163a, 163b) included in the first area 6A1 is the number (M) of active components (LED 61, overvoltage protection elements 163c to 163d) included in the second area 6A2. N) (M ⁇ N).
  • the only active components included in the first area 6A1 are the overvoltage protection elements 163a and 163b. That is, the number (M) of active components included in the first area 6A1 is two. The number (N) of active components included in the second area 6A2 is twenty. It should be noted that the number of active components included in the first area 6A2 may be zero, that is, the configuration may be such that no active components are mounted.
  • the BLE module 62 has the antenna portion 62b arranged closest to the first side edge portion 201, and the integrated circuit portion 62a adjacent to the antenna portion 62b. is arranged at a position farther from the first side edge 201 than.
  • the integrated circuit portion 62a of the BLE module 62 has a first side portion a1 adjacent to the antenna portion 62b, and a position facing the first side portion a1 and farther from the antenna portion 62b than the first side portion a1.
  • Two capacitors 162e and 162f and two overvoltage protection elements 163a and 163b are arranged in order along the direction of the third side surface a3 of the integrated circuit section 62a.
  • the two capacitors 162e, 162f and the two overvoltage protection elements 163a, 163b are spaced apart in the direction of the first side edge 201 of the BLE substrate 6.
  • the tactile switch 15 is arranged close to the first boundary portion 151 of the non-mounting area 150 and the third side edge portion 203 of the BLE substrate 6 .
  • the eight LEDs 61 are arranged from the second boundary portion 152 of the non-mounting area 150 toward the second side edge portion 202 of the BLE substrate 6 toward the third LED 61 of the BLE substrate 6. are arranged at predetermined intervals along the side edges 203 of the .
  • one capacitor 162g is mounted between the second boundary portion 152 of the non-mounting area 150 and the second side edge portion 202 of the BLE substrate 6 and between the fourth side edge portion 204 of the BLE substrate 6 and the eight LEDs 61 .
  • one capacitor 162g is mounted between the second boundary portion 152 of the non-mounting area 150 and the second side edge portion 202 of the BLE substrate 6 and between the fourth side edge portion 204 of the BLE substrate 6 and the eight LEDs 61 .
  • one capacitor 162g is mounted between the second boundary portion 152 of the non-mounting area 150 and the second side edge portion 202 of the BLE substrate 6 and between the fourth side edge portion 204 of the BLE substrate 6 and the eight LEDs 61 .
  • three resistors 164a is mounted between the second boundary portion 152 of the non-mounting area 150 and the second side edge portion 202 of the BLE substrate 6 and between the fourth side edge portion 204 of the BLE substrate 6 and the eight LEDs 61 .
  • the nine overvoltage protection elements 163 d are arranged on the fourth side edge 204 of the BLE substrate 6 , five overvoltage protection elements and four overvoltage protection elements from the side closest to the fourth side edge 204 of the BLE substrate 6 . are arranged parallel to each other.
  • the case attachment/detachment detection circuit (Hall IC) 63, the Schmidt trigger circuit 64, and the two capacitors 162h are connected from the side near the fourth side edge 204 of the BLE substrate 6.
  • 64 are arranged along the fourth side edge 204 of the BLE board 6
  • the case attachment/detachment detection circuit 63 and the Schmitt trigger circuit and two capacitors 162 h are arranged along the fourth side edge 204 of the BLE board 6 . arranged in parallel.
  • the antenna portion 62b is closest to the first side edge portion 201 of the BLE substrate 6, and adjacent to the antenna portion 62b, the integrated circuit portion 62a is located first from the antenna portion 62b. is located far from the side edge 201 of the .
  • the BLE module 62 is arranged so that the integrated circuit portion 62 a and the antenna portion 62 b are arranged in this order toward the first side edge portion 201 .
  • the integrated circuit section 62 a and the antenna section 62 b are arranged in this order with respect to the first side edge 201 of the BLE substrate 6 closest to the BLE module 62 . That is, of the side edges of the BLE substrate 6 , the first side edge 201 closest to the BLE module is located closer to the antenna section 62 b than the integrated circuit section 62 a of the BLE module 62 .
  • the shape of the BLE board 6 and the mounting of other electronic components are greatly restricted. Such restrictions can be removed by mounting the antenna section 62b of the BLE module 62 close to the edge.
  • a large degree of freedom can be given when determining the shape of the circuit board and when mounting electronic components other than the BLE module 62, so the cost and size of the aerosol generating device can be reduced. can do.
  • the first side edge 201 closest to the BLE module is closer to the antenna part 62b than the other electronic components.
  • the distance between the side edge 201 and the BLE module 62 is shorter than the distance between the first side edge 201 of the BLE board 6 and other electronic components.
  • the antenna portion 62 b of the BLE module 62 may overlap the first side edge portion 201 of the BLE substrate 6 .
  • the antenna section 62b of the BLE module 62 may protrude outward from the first side edge section 201 of the BLE substrate 6 by a predetermined minute amount (for example, less than 1 mm). That is, part of the antenna section 62 b may be exposed to the outside of the BLE board 6 from the first side edge section 201 of the BLE module 62 .
  • the area of the circuit board can be effectively used, so it is possible to determine the shape of the circuit board and mount electronic components other than the BLE module 62, such as mounting many electronic components on the circuit board. A large degree of freedom can be given in practice, and the cost and size of the aerosol generator can be reduced.
  • the BLE board 6 is fixed by the chassis 4 at the second surface 6B behind the first surface 6A on which the BLE module 62 is mounted. Then, in the direction perpendicular to the first surface 6A of the BLE substrate 6, the chassis 4, the BLE substrate 6, and the antenna section 62b are arranged in this order. According to this configuration, the space below the antenna section 62b, where the presence of metal such as a copper foil (conductor) pattern is undesirable, is occupied by the chassis 4 having insulating properties and rigidity. As a result, it is possible to prevent metal from entering the area of the antenna section 62b even if an unexpected situation such as a fall occurs, so that a configuration in which communication interruption by the BLE module 62 is unlikely to occur can be realized.
  • the chassis 4 fixes the third side edge portion 203 of the BLE substrate 6, and the antenna portion 62b and the chassis 4 are adjacent in the direction parallel to the first surface 6A of the BLE substrate 6.
  • the chassis 4 having insulation and rigidity occupies the space on the side of the antenna section 62b where the presence of metal such as copper foil (conductor) patterns is undesirable.
  • metal such as copper foil (conductor) patterns
  • the BLE board 6 is provided with cutouts 204 a and 204 b on a fourth side edge 204 that is not fixed to the chassis 4 .
  • the antenna portion 62b of the BLE module 62 has a third side portion b3 adjacent to the chassis 4 and a fourth side portion b4 not adjacent to the chassis 4 in the direction parallel to the first surface 6A of the BLE board 6. Including, the fourth side portion b4 is closer to the notch portion 204a than the third side portion b3.
  • This configuration eliminates the need for the chassis 4 to occupy the entire side of the antenna section 62 b of the BLE module 62 .
  • the notch 204a in the BLE substrate 6 the amount of material used for manufacturing the chassis 4 and the circuit board can be reduced. Equipment costs can be reduced.
  • no other circuit board is arranged in a direction substantially perpendicular to the first surface 6A of the antenna section 62b of the BLE module 62. According to this configuration, a circuit board is not provided in the space above the antenna section 62b where the presence of metal such as a copper foil (conductor) pattern is not desirable. realizable.
  • the inner case 2 is arranged close to the antenna portion 62b of the BLE module 62 in a direction substantially perpendicular to the first surface 6A of the antenna portion 62b.
  • the insulating cover can occupy the space above the antenna section 62b where the presence of metal such as a copper foil (conductor) pattern is undesirable. This prevents metal from entering the region of the antenna section 62b even if an unexpected event such as a drop occurs, so that a configuration in which communication interruption by the BLE module 62 is unlikely to occur can be realized.
  • the outer case 3 is arranged above the inner case 2 in a direction substantially perpendicular to the first surface 6A of the BLE board 6, and the outer case 3 covers the inner case 2.
  • the area of the antenna part 62b of the BLE module 62 is double shielded by the inner case 2 and the outer case 3, so the presence of metal such as a copper foil (conductor) pattern is undesirable for the antenna.
  • a space above the portion 62b is occupied by the inner case 2 and the outer case 3.
  • the presence of the two covers makes it difficult for external noise to reach the area of the antenna section 62b, it is possible to realize a configuration in which interruption of communication by the BLE module 62 is unlikely to occur.
  • the magnet 11b provided on the outer case 3 and the magnet 11a provided on the chassis 4 magnetically coupled with the magnet 11b are arranged apart from the BLE module 62 by a predetermined distance.
  • the outer case 3 can be easily replaced according to the user's preference, and the magnetic field generated by the magnets 11 a and 11 b required for that purpose is less likely to affect communication by the BLE module 62 . Therefore, it is possible to realize a configuration in which disruption of communication by the BLE module 62 is unlikely to occur while improving the marketability of the device.
  • the passive components 161 and 162a to 162f are preferentially arranged around the integrated circuit portion 62a of the BLE module 62 on the BLE substrate 6.
  • FIG. The distances from the BLE module 62 to the passive components 161, 162a to 162f are arranged to be shorter than the distances from the BLE module 62 to the active components 163a, 163b.
  • the distance between the closest passive components 161, 162a to 162f closest to the BLE module 62 among the plurality of passive components and the BLE module 62 is the closest active components 163a, 163b closest to the BLE module 62 among the plurality of active components. and the BLE module 62.
  • the passive components are arranged closer to the BLE module 62 than the active components that may become noise sources, so that the BLE module 62 is less susceptible to noise generated by the active components.
  • BLE module 62 allows good communication.
  • the recent active components 163a and 163b include electronic components (Zener diodes or varistors) that function in an abnormal state, rather than elements that function all the time, so they do not constantly generate noise.
  • electronic components Zener diodes or varistors
  • the BLE module 62 is surrounded by a plurality of passive components 161, 162a to 162f.
  • the plurality of passive components 161, 162a to 162f are mounted between the fourth side edge portion a4 of the integrated circuit portion 62a of the BLE module 62 and the fourth side edge portion 204 of the BLE substrate 6. 162d, and passive components 162e and 162f mounted at positions facing the second side surface portion a2 of the integrated circuit portion 62a of the BLE module 62.
  • FIG. According to this configuration, since the plurality of passive components 162a to 162f can be used as physical barriers against noise directed toward the BLE module 62, the communication state of the BLE module 62 can be maintained in good condition.
  • a specific passive component (a capacitor 162f having a non-minimum capacitance) among the plurality of passive components 161 and 162a to 162f whose volume is not the smallest is combined with the BLE module 62 and the active component 163a. , 163b.
  • the active components 163a and 163b are mounted at positions facing the second side surface portion a2 of the integrated circuit portion 62a of the BLE module 62, and the specific passive component 162f is mounted on the BLE module 62 more than the active components 163a and 163b.
  • the passive component 162f having a relatively large volume (capacity) can be used as a physical barrier against noise to the BLE module 62, disruption of communication by the BLE module 62 is less likely to occur. configuration can be achieved.
  • the third side surface portion a3 of the integrated circuit portion 62a of the BLE module 62 is located close to the third side edge portion 203 of the BLE substrate 6, and the third side edge portion 203 of the BLE substrate 6 and the BLE No electronic component is mounted between the module 62 and the third side surface portion a3. Then, in a direction substantially parallel to the first surface 6A of the BLE board 6, the third side edge portion 203 of the BLE board 6 and the third side portion a3 of the BLE module 62 are in a positional relationship adjacent to the chassis 4.
  • the distance between the specific passive component 162f and the BLE module 62 is the distance between the specific passive component 162f and the IC chip other than the BLE module 62, such as the case attachment/detachment detection circuit (Hall IC) 63 and the Schmidt trigger circuit 64. It has a shorter structure than According to this configuration, the specific passive component 162f can be used as a physical barrier against noise to the BLE module 62, so the communication state of the BLE module 62 can be maintained in good condition.
  • the specific passive component 162f can be used as a physical barrier against noise to the BLE module 62, so the communication state of the BLE module 62 can be maintained in good condition.
  • the BLE substrate 6 has a non-mounting area 150 where electronic components are not mounted between the specific passive component 162f and IC chips other than the BLE module 62, such as a case attachment/detachment detection circuit (Hall IC) 63 and a Schmidt trigger circuit 64. is provided.
  • IC chips 63 and 64 other than the BLE module 62 can be sufficiently separated from the BLE module 62, the influence of noise caused by the other IC chips 63 and 64 on the BLE module 62 can be reduced, and the communication state of the BLE module 62 can be maintained in a good state.
  • the distance between the nearest active components 163a, 163b and the BLE module 62 is shorter than the distance between the nearest active components 163a, 163b and the IC chips 63, 64 other than the BLE module 62.
  • the IC chips 63 and 64 other than the BLE module 62 which may become noise sources more than the active components, can be placed sufficiently away from the BLE module 62.
  • FIG. As a result, the influence of noise caused by other IC chips 63 and 64 on the BLE module 62 can be reduced, and the communication state of the BLE module 62 can be maintained in a good state.
  • the MCU 71, the first transformer circuit (switching regulator) 76a, and the second transformer circuit (switching regulator) 82a which may become noise sources, are separated from the BLE board 6. It is mounted on the separate MCU board 7 and USB board 8 . Furthermore, the BLE module 62 is mounted at a position sufficiently distant from the MCU 71, the first transformer circuit 76a and the second transformer circuit 82a. Furthermore, the first side edge portion 201 of the BLE board 6 on which the BLE module 62 is mounted is positioned near the central portion in the longitudinal direction of the MCU board 7 and the USB board 8 with respect to the MCU board 7 and the USB board 8 . are offset from each other.
  • the BLE module 62 can be sufficiently separated from the MCU 71, the first transformer circuit 76a, and the second transformer circuit 82a, which may become noise sources, so that the communication state of the BLE module 62 is improved. can be kept in good condition.
  • the MCU 71 is mounted on the MCU board 7, the second transformer circuit 82a is mounted on the USB board 8, and the BLE board 6 is sufficiently separated from the MCU board 7 and the USB board 8, noise
  • the MCU 71 and the second transformer circuit 82a which may be the source, in a distant position, the influence of one on the other is reduced, the communication state of the BLE module 62 is maintained in a good state, Stable operation of the aerosol generator can be realized.
  • the MCU board 7 has a first surface 7A on which the MCU 71 is mounted at a position farther from the BLE substrate 6 than a second surface 7B on which the MCU 71 is not mounted.
  • the second surface 7B on which the MCU 71 is not mounted is closer to the BLE substrate 6 than the first surface 7A on which the MCU 71 is mounted.
  • the second transformer circuit is composed of the DC/DC converter IC 82a and the reactor (power inductor) 82b.
  • the second surface 8B on which the reactor 82b is not mounted is the BLE substrate rather than the first surface 8A on which the reactor 82b is mounted.
  • the first surface 8A on which the reactor 82b is mounted on the USB substrate 8 is located farther (not the closest) from the BLE substrate 6 than the second surface 8B on which the reactor 82b is not mounted.
  • a magnetic field is generated around the reactor 82 b during switching of the DC/DC converter IC 82 a , and this magnetic field may affect the BLE module 62 . Therefore, by sufficiently separating the reactor 82b of the second transformer circuit 82a from the BLE module 62, the communication state of the BLE module 62 can be maintained in a good state.
  • the DC/DC converter IC 82a and the reactor 82b that constitute the second transformer circuit the DC/DC converter IC 82a is mounted on the second surface 8B of the USB board 8, and the reactor 82b is mounted on the first surface 8A of the USB board 8.
  • Mounting the DC/DC converter IC 82a and the reactor 82b, which generate heat during switching, on different surfaces of the USB substrate 8 in this way prevents heat from being concentrated locally.
  • the BLE module 62 is less likely to be affected by heat, so the communication state of the BLE module 62 can be maintained in a good state, and the durability of the device can be improved.
  • the distance between the BLE board 6 and the MCU board 7 is longer than the distance between the BLE board 6 and the USB board 8 .
  • the MCU 71 which is more likely to become a noise source than the MCU 71 and the second transformer circuit 82a, is away from the BLE module 62, the communication state of the BLE module 62 can be maintained in a good state. can be done.
  • the first surface 7A of the MCU board 7 on which the MCU 71 is mounted is located farthest from the BLE board 6.
  • the MCU board 7 has the second surface 7B on which the MCU 71 is not mounted, which is closer to the BLE substrate 6 than the first surface 7A on which the MCU 71 is mounted.
  • LED 62...BLE module 62a Integrated circuit portion 62b of BLE module 62...Antenna portion a1 of BLE module 62...First side portion a2 of integrated circuit portion 62a of BLE module 62...BLE

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Abstract

A power supply unit 1 for an aerosol generation device is provided with: a communication module 62 that communicates with an external device; a power supply 10 that supplies electric power to drive a heater 25 for heating an aerosol source; a controller 71 that controls the supply of electric power from the power supply 10 to the heater 25; and a circuit board 6 on which the communication module 62, passive elements 161, 162, 164, and active elements 61, 63, 64, 163 are mounted. The distances between the communication module 62 and predetermined passive elements 161, 162a-162f closest to the communication module 62 among the passive elements are shorter than the distances between the communication module 62 and predetermined active elements 163a, 163b closest to the communication module 62 among the active elements.

Description

エアロゾル生成装置の電源ユニットPower supply unit for aerosol generator
　本発明は、エアロゾル生成装置の電源ユニットに関する。 The present invention relates to a power supply unit for an aerosol generator.
　エアロゾル生成装置について、特許文献１には、コントローラの回路基板にＬＥＤとプロセッサを実装し、プロセッサにＢｌｕｅｔｏｏｔｈ（登録商標）機能を設けることが記載されている。特許文献２、３には、ＬＥＤとＢｌｕｅｔｏｏｔｈ（登録商標）機能を有するエアロゾル生成装置が開示されている。 Regarding the aerosol generator, Patent Document 1 describes mounting an LED and a processor on the circuit board of the controller and providing the processor with a Bluetooth (registered trademark) function. Patent Literatures 2 and 3 disclose an aerosol generator having LED and Bluetooth (registered trademark) functions.
特開２０２０－７４５８５号公報JP 2020-74585 A 特開２０２０－１１４２４９号公報JP 2020-114249 A 特表２０２０－５２７０５３号公報Japanese Patent Publication No. 2020-527053
　上述したようにＢｌｕｅｔｏｏｔｈ（登録商標）などの通信モジュールを備えるエアロゾル生成装置が知られているが、従来は通信モジュールをどの回路基板に実装するべきであるか、あるいは回路基板のどこに実装するべきであるかについて十分に検討されておらず、改善の余地があった。 As described above, aerosol generators equipped with communication modules such as Bluetooth (registered trademark) are known. There is room for improvement, as it was not sufficiently studied.
　本発明の１つの観点は、通信モジュールを回路基板の適切な位置に実装できるエアロゾル生成装置の電源ユニットを実現することを目的とする。 One aspect of the present invention aims to realize a power supply unit for an aerosol generator that can mount a communication module at an appropriate position on a circuit board.
　上述の課題を解決し、目的を達成するため、本発明の第１の観点は、外部機器と通信する通信モジュールと、エアロゾル源を加熱するヒータを駆動するための電力を供給する電源と、前記電源から前記ヒータへの電力の供給を制御するコントローラと、前記通信モジュールと受動部品と能動部品とが実装される回路基板と、を備えるエアロゾル生成装置の電源ユニットであって、前記受動部品のうち前記通信モジュールに最も近い所定の受動部品と前記通信モジュールの間の距離は、前記能動部品のうち前記通信モジュールに最も近い所定の能動部品と前記通信モジュールの間の距離よりも短い。 In order to solve the above-described problems and achieve the object, a first aspect of the present invention provides a communication module that communicates with an external device, a power source that supplies power to drive a heater that heats an aerosol source, and A power supply unit for an aerosol generator, comprising: a controller for controlling power supply from a power supply to the heater; and a circuit board on which the communication module, passive components, and active components are mounted, wherein A distance between a given passive component closest to the communication module and the communication module is shorter than a distance between a given active component closest to the communication module among the active components and the communication module.
　本発明の第２の観点は、第１の観点において、前記所定の能動部品は、常時機能していない電子部品である。 According to a second aspect of the present invention, in the first aspect, the predetermined active component is an electronic component that does not always function.
　本発明の第３の観点は、第１の観点又は第２の観点において、前記所定の能動部品は、異常時に機能する電子部品である。 According to a third aspect of the present invention, in the first aspect or the second aspect, the predetermined active component is an electronic component that functions in the event of an abnormality.
　本発明の第４の観点は、第２の観点又は第４の観点において、前記所定の受動部品は、過電圧保護用のダイオードである。 A fourth aspect of the present invention is the second aspect or the fourth aspect, wherein the predetermined passive component is an overvoltage protection diode.
　本発明の第５の観点は、第１の観点から第４の観点のいずれかにおいて、前記通信モジュールは、第１の側面部と、前記第１の側面部とは異なる第２の側面部と、を含み、前記受動部品は、前記第１の側面部と相対する位置に実装される第１の受動部品と、前記第２の側面部と相対する位置に実装される第２の受動部品と、を含む。 According to a fifth aspect of the present invention, in any one of the first to fourth aspects, the communication module includes a first side portion and a second side portion different from the first side portion. , wherein the passive components include a first passive component mounted at a position facing the first side surface and a second passive component mounted at a position facing the second side surface. ,including.
　本発明の第６の観点は、第５の観点において、前記所定の能動部品は、前記第２の側面部と相対する位置に実装され、前記第２の受動部品は、前記所定の能動部品よりも前記第２の側面部の近くに実装され、前記受動部品のうち最も体積が小さい電子部品とは異なる受動部品である。 According to a sixth aspect of the present invention, in the fifth aspect, the predetermined active component is mounted at a position facing the second side surface portion, and the second passive component is located closer to the predetermined active component than the predetermined active component. is mounted near the second side surface and is a passive component different from the electronic component having the smallest volume among the passive components.
　本発明の第７の観点は、第５の観点において、前記所定の能動部品は、前記第２の側面部と相対する位置に実装され、前記第２の受動部品は、前記所定の能動部品よりも前記第２の側面部の近くに実装され、前記受動部品に含まれるコンデンサのうち最小の容量を持つコンデンサよりも大きな容量を持つコンデンサである。 According to a seventh aspect of the present invention, in the fifth aspect, the predetermined active component is mounted at a position facing the second side surface portion, and the second passive component is located closer to the predetermined active component than the predetermined active component. is mounted near the second side portion and has a larger capacitance than the capacitor with the smallest capacitance among the capacitors included in the passive component.
　本発明の第８の観点は、第５の観点において、前記通信モジュールは、前記第１の側面部及び前記第２の側面部とは異なる第３の側面部を含み、前記電源ユニットは、前記回路基板を保持する絶縁性のシャシーを備え、前記第３の側面部と前記第３の側面部と相対する前記回路基板の側縁部の間に電子部品は実装されておらず、前記回路基板の実装面と平行な方向において、前記第３の側面部と相対する前記回路基板の側縁部と前記シャシーが隣接している。 According to an eighth aspect of the present invention, in the fifth aspect, the communication module includes a third side portion different from the first side portion and the second side portion, and the power supply unit includes the an insulating chassis for holding a circuit board, wherein no electronic component is mounted between the third side face and a side edge of the circuit board facing the third side face; A side edge of the circuit board facing the third side face and the chassis are adjacent in a direction parallel to the mounting surface of the circuit board.
　本発明の第９の観点は、第１の観点から第８の観点のいずれかにおいて、前記回路基板に実装される集積回路を備え、前記所定の受動部品は、前記通信モジュールと前記集積回路の間に実装され、前記所定の受動部品と前記通信モジュールの間の距離は、前記所定の受動部品と前記集積回路の間の距離よりも短い。 According to a ninth aspect of the present invention, in any one of the first aspect to the eighth aspect, the integrated circuit is mounted on the circuit board, and the predetermined passive component is the communication module and the integrated circuit. and the distance between the predetermined passive component and the communication module is shorter than the distance between the predetermined passive component and the integrated circuit.
　本発明の第１０の観点は、第９の観点において、前記回路基板は、前記所定の受動部品と前記集積回路の間に電子部品が実装されない非実装領域を含む。 According to a tenth aspect of the present invention, in the ninth aspect, the circuit board includes a non-mounting area where no electronic component is mounted between the predetermined passive component and the integrated circuit.
　本発明の第１の観点は、第１０の観点において、前記非実装領域は、前記通信モジュールと前記集積回路のうち面積が大きい方の面積以上の面積を有する四角形部分を含む。 According to the first aspect of the present invention, in the tenth aspect, the non-mounting region includes a rectangular portion having an area equal to or larger than the larger one of the communication module and the integrated circuit.
　本発明の第１２の観点は、第１１の観点において、前記四角形部分の境界部の一部は、前記回路基板の側縁部の一部と一致する。 According to a twelfth aspect of the present invention, in the eleventh aspect, part of the boundary of the square portion coincides with part of the side edge of the circuit board.
　本発明の第１３の観点は、第９の観点から第１２の観点のいずれかにおいて、前記所定の能動部品は、前記通信モジュールと前記集積回路の間に実装され、前記所定の能動部品と前記通信モジュールの間の距離は、前記所定の接能動部品と前記集積回路の間の距離より短い。 According to a thirteenth aspect of the present invention, in any one of the ninth to twelfth aspects, the predetermined active component is mounted between the communication module and the integrated circuit, and the predetermined active component and the The distance between communication modules is less than the distance between the predetermined contact active component and the integrated circuit.
　本発明の１つの観点によれば、通信モジュールを回路基板の適切な位置に実装できるエアロゾル生成装置の電源ユニットを実現することができる。 According to one aspect of the present invention, it is possible to realize a power supply unit for an aerosol generator that can mount a communication module at an appropriate position on a circuit board.
　本発明のその他の特徴及び利点は、添付図面を参照とした以下の説明により明らかになるであろう。なお、添付図面においては、同じ若しくは同様の構成には、同じ参照番号を付す。 Other features and advantages of the present invention will become apparent from the following description with reference to the accompanying drawings. In the accompanying drawings, the same or similar configurations are given the same reference numerals.
　添付図面は明細書に含まれ、その一部を構成し、本発明の実施の形態を示し、その記述と共に本発明の原理を説明するために用いられる。
図１Ａは、本実施形態のエアロゾル生成装置の電源ユニットの正面図である。 図１Ｂは、本実施形態のエアロゾル生成装置の電源ユニットの開閉部を閉じた状態の上面図である。 図１Ｃは、本実施形態のエアロゾル生成装置の電源ユニットの開閉部を取り除いた状態の上面図である。 図１Ｄは、本実施形態のエアロゾル生成装置の電源ユニットの下面図である。 図２Ａは、本実施形態のエアロゾル生成装置の電源ユニットからアウターケースを取り除いた状態のインナーケースの正面図である。 図２Ｂは、本実施形態のエアロゾル生成装置の電源ユニットから取り除いたアウターケースの背面図である。 図３は、本実施形態のエアロゾル生成装置の電源ユニットからアウターケースとインナーケースのカバー部を取り除いた状態の正面図である。 図４は、本実施形態のエアロゾル生成装置の電源ユニットからアウターケースとインナーケースを取り除いた状態の斜視図である。 図５は、図４に示した状態からさらにスライダを取り除いた状態の斜視図である。 図６は、図５に示した状態からさらにシャシーとバッテリを取り除いた状態の斜視図である。 図７は、本実施形態のエアロゾル生成装置の電源ユニットの第１の回路基板とその他の回路基板の配置と相互の接続関係を示す斜視図である。 図８Ａは、本実施形態のエアロゾル生成装置の電源ユニットの第２の回路基板とその他の回路基板の配置と相互の接続関係を示す斜視図である。 図８Ｂは、本実施形態のエアロゾル生成装置の電源ユニットの第２の回路基板とその他の回路基板の配置と相互の接続関係を示す斜視図である。 図９Ａは、本実施形態のエアロゾル生成装置の電源ユニットの第３の回路基板とその他の配置と相互の接続関係を示す斜視図である。 図９Ｂは、本実施形態のエアロゾル生成装置の電源ユニットの第３の回路基板とその他の配置と相互の接続関係を示す斜視図である。 図９Ｃは、本実施形態のエアロゾル生成装置の電源ユニットの第３の回路基板とその他の配置と相互の接続関係を示す斜視図である。 図１０は、本実施形態のエアロゾル生成装置の電源ユニットのＢＬＥ基板に実装される電子部品を示す図である。 図１１Ａは、本実施形態のエアロゾル生成装置の電源ユニットのＭＣＵ基板に実装される電子部品を示す図である。 図１１Ｂは、本実施形態のエアロゾル生成装置の電源ユニットのＭＣＵ基板に実装される電子部品を示す図である。 図１２Ａは、本実施形態のエアロゾル生成装置の電源ユニットのＵＳＢ基板に実装される電子部品を示す図である。 図１２Ｂは、本実施形態のエアロゾル生成装置の電源ユニットのＵＳＢ基板に実装される電子部品を示す図である。 図１３は、本実施形態のエアロゾル生成装置のＢＬＥモジュール周辺部の金属禁止エリアを示す図である。 図１４は、本実施形態のエアロゾル生成装置の電源ユニットの内部構成を示す図１Ａの１１－１１断面図である。 図１５は、本実施形態のエアロゾル生成装置の電源ユニットの全体回路図である。 The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.
FIG. 1A is a front view of the power supply unit of the aerosol generator of this embodiment. FIG. 1B is a top view of the power supply unit of the aerosol generating device of the present embodiment with the opening/closing part closed. FIG. 1C is a top view of the power supply unit of the aerosol generator of the present embodiment with the opening/closing part removed. FIG. 1D is a bottom view of the power supply unit of the aerosol generator of this embodiment. FIG. 2A is a front view of the inner case with the outer case removed from the power supply unit of the aerosol generating device of this embodiment. FIG. 2B is a rear view of the outer case removed from the power supply unit of the aerosol generating device of this embodiment. FIG. 3 is a front view of the power supply unit of the aerosol generating device according to the present embodiment with the outer case and inner case covers removed. FIG. 4 is a perspective view of the power supply unit of the aerosol generating device of the present embodiment with the outer case and the inner case removed. FIG. 5 is a perspective view of the state shown in FIG. 4 with the slider further removed. FIG. 6 is a perspective view of the state shown in FIG. 5 with the chassis and battery further removed. FIG. 7 is a perspective view showing the arrangement and mutual connection relationship of the first circuit board and other circuit boards of the power supply unit of the aerosol generating device of the present embodiment. FIG. 8A is a perspective view showing the arrangement and mutual connection relationship of the second circuit board and other circuit boards of the power supply unit of the aerosol generating device of the present embodiment. FIG. 8B is a perspective view showing the arrangement and mutual connection relationship of the second circuit board and other circuit boards of the power supply unit of the aerosol generating device of the present embodiment. FIG. 9A is a perspective view showing the third circuit board of the power supply unit of the aerosol generating device of the present embodiment, other arrangements, and mutual connection relationships. FIG. 9B is a perspective view showing the third circuit board of the power supply unit of the aerosol generating device of the present embodiment, the other arrangement, and the mutual connection relationship. FIG. 9C is a perspective view showing the third circuit board of the power supply unit of the aerosol generating device of the present embodiment, other arrangements, and mutual connection relationships. FIG. 10 is a diagram showing electronic components mounted on the BLE substrate of the power supply unit of the aerosol generating device of this embodiment. FIG. 11A is a diagram showing electronic components mounted on the MCU board of the power supply unit of the aerosol generating device of this embodiment. FIG. 11B is a diagram showing electronic components mounted on the MCU board of the power supply unit of the aerosol generating device of this embodiment. FIG. 12A is a diagram showing electronic components mounted on the USB board of the power supply unit of the aerosol generating device of this embodiment. FIG. 12B is a diagram showing electronic components mounted on the USB board of the power supply unit of the aerosol generating device of this embodiment. FIG. 13 is a diagram showing a metal-prohibited area around the BLE module of the aerosol generation device of this embodiment. FIG. 14 is a cross-sectional view taken along line 11-11 of FIG. 1A showing the internal configuration of the power supply unit of the aerosol generating device of this embodiment. FIG. 15 is an overall circuit diagram of the power supply unit of the aerosol generator of this embodiment.
　以下、添付図面を参照して実施形態を詳しく説明する。尚、以下の実施形態は特許請求の範囲に係る発明を限定するものではなく、また実施形態で説明されている特徴の組み合わせの全てが発明に必須のものとは限らない。実施形態で説明されている複数の特徴のうち二つ以上の特徴が任意に組み合わされてもよい。また、同一若しくは同様の構成には同一の参照番号を付し、重複した説明は省略する。 Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. It should be noted that the following embodiments do not limit the invention according to the claims, and not all combinations of features described in the embodiments are essential to the invention. Two or more of the features described in the embodiments may be combined arbitrarily. Also, the same or similar configurations are denoted by the same reference numerals, and redundant explanations are omitted.
　以下では、本発明のエアロゾル生成装置の電源ユニット１を、エアロゾル源をヒータで加熱してエアロゾル及び香味物質を含む気体、又は、エアロゾル、又は、香味物質を含むエアロゾルを生成する加熱式たばこに適用した例を説明する。なお、エアロゾル源は、例えば、グリセリン又はプロピレングリコール等の多価アルコール等の液体である。エアロゾル源は、多価アルコールや水の混合溶液であってもよい。あるいは、エアロゾル源は、薬剤や漢方や香味成分を含んでもよい。エアロゾル源は、液体であってもよいし、固体であってもよいし、液体及び固体の混合物であってもよい。エアロゾル源に代えて、水等の蒸気源が用いられてもよい。 In the following, the power supply unit 1 of the aerosol generator of the present invention is applied to a heated cigarette that generates an aerosol and a gas containing a flavoring substance, or an aerosol, or an aerosol containing a flavoring substance by heating an aerosol source with a heater. An example is explained. Note that the aerosol source is, for example, a liquid such as polyhydric alcohol such as glycerin or propylene glycol. The aerosol source may be a mixed solution of polyhydric alcohols and water. Alternatively, the aerosol source may include pharmaceuticals, herbal medicines, and flavoring ingredients. The aerosol source can be liquid, solid, or a mixture of liquid and solid. Instead of an aerosol source, a vapor source such as water may be used.
　また、本発明のエアロゾル生成装置は、香味源を含むカプセルをさらに備えてもよく、この場合、カプセルを取り外し可能な状態で保持するカプセルホルダを含む。香味源は、例えば、たばこ材料を成形した成形体である。あるいは、香味源は、たばこ以外の植物（例えば、ミント、ハーブ、漢方、コーヒー豆等）によって構成されてもよい。香味源には、メントールなどの香料が付与されていてもよい。香味源は、エアロゾル源に添加されてもよい。 In addition, the aerosol generating device of the present invention may further include a capsule containing a flavor source, in which case a capsule holder that detachably holds the capsule is included. The flavor source is, for example, a molded body obtained by molding tobacco material. Alternatively, the flavor source may be composed of plants other than tobacco (for example, mint, herbs, Chinese medicine, coffee beans, etc.). Flavor sources such as menthol may be added to the flavor source. A flavor source may be added to the aerosol source.
　［全体構成］
　まず、図１Ａから図６を参照して、本実施形態のエアロゾル生成装置の電源ユニット１の全体構成について説明する。 [overall structure]
First, with reference to FIGS. 1A to 6, the overall configuration of the power supply unit 1 of the aerosol generating apparatus of this embodiment will be described.
　図１Ａは、本実施形態のエアロゾル生成装置の電源ユニットの正面図である。図１Ｂは、本実施形態のエアロゾル生成装置の電源ユニットの開閉部を閉じた状態の上面図である。図１Ｃは、本実施形態のエアロゾル生成装置の電源ユニットの開閉部を取り除いた状態の上面図である。図１Ｄは、本実施形態のエアロゾル生成装置の電源ユニットの下面図である。図２Ａは、本実施形態のエアロゾル生成装置の電源ユニットからアウターケースを取り除いた状態のインナーケースの正面図である。図２Ｂは、本実施形態のエアロゾル生成装置の電源ユニットから取り除いたアウターケースの背面図である。図３は、本実施形態のエアロゾル生成装置の電源ユニット１からアウターケースとインナーケースのカバー部を取り除いた状態の正面図である。 FIG. 1A is a front view of the power supply unit of the aerosol generating device of this embodiment. FIG. 1B is a top view of the power supply unit of the aerosol generating device of the present embodiment with the opening/closing part closed. FIG. 1C is a top view of the power supply unit of the aerosol generator of the present embodiment with the opening/closing part removed. FIG. 1D is a bottom view of the power supply unit of the aerosol generator of this embodiment. FIG. 2A is a front view of the inner case with the outer case removed from the power supply unit of the aerosol generating device of this embodiment. FIG. 2B is a rear view of the outer case removed from the power supply unit of the aerosol generating device of this embodiment. FIG. 3 is a front view of the power supply unit 1 of the aerosol generating device of the present embodiment, with the covers of the outer case and the inner case removed.
　本実施形態のエアロゾル生成装置の電源ユニット１は、全体の外形を構成する第１のパネルとしてのインナーケース２と、第２のパネルとしてのアウターケース３とを含む。インナーケース２には、シャシー４、加熱ユニット５、第１から第４の回路基板６～９、バッテリ１０が収容されている。アウターケース３は、インナーケース２の前面に装着される。アウターケース３は、インナーケース２に対して着脱可能な外装部材である。インナーケース２の前面には、上部及び下部に離間して一対のマグネット１１ａが設けられている。また、アウターケース３の裏面には、インナーケース２の一対のマグネット１１ａに対応する位置に一対のマグネット１１ｂが設けられている。そして、アウターケース３のマグネット１１ｂをインナーケース２のマグネット１１ａに吸着させることにより、アウターケース３がインナーケース２の前面に保持される。 The power supply unit 1 of the aerosol generating device of this embodiment includes an inner case 2 as a first panel and an outer case 3 as a second panel that constitute the overall outer shape. The inner case 2 accommodates a chassis 4 , a heating unit 5 , first to fourth circuit boards 6 to 9 and a battery 10 . The outer case 3 is attached to the front surface of the inner case 2 . The outer case 3 is an exterior member that can be attached to and detached from the inner case 2 . A pair of magnets 11a are provided on the front surface of the inner case 2 so as to be spaced apart from each other. A pair of magnets 11 b are provided on the back surface of the outer case 3 at positions corresponding to the pair of magnets 11 a of the inner case 2 . By attracting the magnet 11b of the outer case 3 to the magnet 11a of the inner case 2, the outer case 3 is held on the front surface of the inner case 2. As shown in FIG.
　インナーケース２は、前面が開口するケース本体部１２と、ケース本体部１２の前面に取り付けられるカバー部１３とを備える。カバー部１３は、ケース本体部１２の前面の開口部にビス等により固定される。 The inner case 2 includes a case body portion 12 with an open front surface and a cover portion 13 attached to the front surface of the case body portion 12 . The cover portion 13 is fixed to the front opening of the case main body portion 12 with screws or the like.
　インナーケース２のケース本体部１２には、通知部１４と操作部１５が設けられている。通知部１４はＬＥＤ及び導光板からなる発光部である。操作部１５は、タクタイルスイッチなどの押しボタン式の操作部材である。通知部１４は、装置の動作状態に応じてＬＥＤの点灯が制御される。 A notification section 14 and an operation section 15 are provided in the case main body section 12 of the inner case 2 . The notification unit 14 is a light emitting unit including an LED and a light guide plate. The operation unit 15 is a push button type operation member such as a tactile switch. The lighting of the LED of the notification unit 14 is controlled according to the operating state of the device.
　インナーケース２のカバー部１３には、下部に放熱用の複数の通気孔１３ａが形成され、ケース本体部１２の通知部１４に対応する位置にＬＥＤを露出させるための長孔１６が形成され、ケース本体部１２の操作部１５に対応する位置にタクタイルスイッチ１５を露出させるための丸孔１７が形成されている。ＬＥＤの長孔１６は、インナーケース２のカバー部１３において上下方向に延びるスリット状であり、タクタイルスイッチ１５の丸孔１７はＬＥＤの長孔１６の下方に形成されている。 The cover portion 13 of the inner case 2 is formed with a plurality of ventilation holes 13a for heat dissipation in the lower part, and the long hole 16 for exposing the LED is formed at a position corresponding to the notification portion 14 of the case main body portion 12, A round hole 17 for exposing the tactile switch 15 is formed at a position corresponding to the operating portion 15 of the case body portion 12 . The long hole 16 of the LED is a slit extending vertically in the cover portion 13 of the inner case 2 , and the round hole 17 of the tactile switch 15 is formed below the long hole 16 of the LED.
　アウターケース３は、弾性変形可能な材質で構成されうる。これにより、アウターケース３がインナーケース２の前面に保持されている状態で、アウターケース３が押圧されると、弾性変形したアウターケース３を介してタクタイルスイッチ１５を押下できる。 The outer case 3 can be made of an elastically deformable material. Thus, when the outer case 3 is pressed while the outer case 3 is held on the front surface of the inner case 2, the tactile switch 15 can be pressed through the elastically deformed outer case 3.
　インナーケース２のケース本体部１２の上面部に開閉部１８、下面部に接続部１９が設けられている。開閉部１８は、加熱ユニット５にエアロゾル源を装填するためのチャンバー部２０を開閉可能なスライド式の蓋（以下、スライダ）ある。ユーザは、片手でケース２、３を保持しながらケース２、３を保持する手の親指などでスライダ１８を開閉可能である。接続部１９は、外部機器と接続するためのインターフェースであり、例えば、ＵＳＢ Ｔｙｐｅ－Ｃレセプタクルコネクタ（以下、ＵＳＢコネクタ）である。 An opening/closing portion 18 is provided on the upper surface of the case main body portion 12 of the inner case 2, and a connecting portion 19 is provided on the lower surface thereof. The opening/closing part 18 is a sliding lid (hereinafter referred to as a slider) capable of opening and closing the chamber part 20 for loading the heating unit 5 with the aerosol source. The user can open and close the slider 18 with the thumb of the hand holding the cases 2 and 3 while holding the cases 2 and 3 with one hand. The connection unit 19 is an interface for connecting with an external device, and is, for example, a USB Type-C receptacle connector (hereinafter referred to as a USB connector).
　アウターケース３の前面には、通知部１４に対応する位置にＬＥＤ光を透過するレンズ部２１が設けられている。 A lens portion 21 that transmits LED light is provided at a position corresponding to the notification portion 14 on the front surface of the outer case 3 .
　インナーケース２のケース本体部１２には、加熱ユニット５、第１から第４の回路基板６～９、バッテリ１０を保持するシャシー４が収納される。 The case main body 12 of the inner case 2 accommodates the heating unit 5, the first to fourth circuit boards 6 to 9, and the chassis 4 that holds the battery 10.
　シャシー４は、第１から第４の回路基板６～９、振動発生用モータ２４、マグネット１１ａ及びマグネット１１ｂを保持する絶縁性（例えば、樹脂製）の材料からなる。 The chassis 4 is made of an insulating material (made of resin, for example) that holds the first to fourth circuit boards 6 to 9, the vibration generating motor 24, the magnets 11a and 11b.
　図４は、本実施形態のエアロゾル生成装置の電源ユニット１からアウターケース３とインナーケース２を取り除いた状態の斜視図である。図５は、図４に示した状態からさらにスライダ１８を取り除いた状態の斜視図である。図６は、図５に示した状態からさらにシャシー４とバッテリ１０を取り除いた状態の斜視図である。なお、図４から図６におけるエアロゾル生成装置の電源ユニット１からは、マグネット１１ａもあわせて取り除かれている点に留意されたい。 FIG. 4 is a perspective view of the power supply unit 1 of the aerosol generating device of this embodiment with the outer case 3 and the inner case 2 removed. FIG. 5 is a perspective view of the state shown in FIG. 4 with the slider 18 further removed. FIG. 6 is a perspective view of the state shown in FIG. 5 with the chassis 4 and the battery 10 further removed. Note that the magnet 11a is also removed from the power supply unit 1 of the aerosol generator in FIGS. 4-6.
　加熱ユニット５は、エアロゾル源が装填される円筒状のチャンバー部２０と、エアロゾル源を加熱するようにチャンバー部２０に設けられたヒータ２５と、ヒータ２５の温度を検出するヒータ温度検出器２６と、パフ動作（エアロゾルを吸引する動作）を検出するパフ動作検出器２７と、を含む。また、加熱ユニット５の近傍には、インナーケース２の内部の温度を検出するケース温度検出器２９が設けられている。ヒータ２５は、エアロゾル生成装置の電源ユニット１に対して、破壊しなければ取り外し外すことができない形態（例えば、半田付け）で取り付けられてもよいし、破壊しなくても取り外すことができる形態で取り付けられてもよい。なお、本実施形態において、「コネクタ」による電気的接続は、特に断らない限り、破壊しなければ相互に分離することができない形態と、破壊しなくても相互に分離することができる形態とのいずれでもよいものとして説明される。 The heating unit 5 includes a cylindrical chamber portion 20 loaded with an aerosol source, a heater 25 provided in the chamber portion 20 so as to heat the aerosol source, and a heater temperature detector 26 for detecting the temperature of the heater 25. , and a puffing motion detector 27 that detects a puffing motion (a motion of inhaling an aerosol). A case temperature detector 29 for detecting the temperature inside the inner case 2 is provided near the heating unit 5 . The heater 25 may be attached to the power supply unit 1 of the aerosol generator in a form that cannot be removed without destruction (for example, by soldering), or in a form that can be removed without destruction. may be attached. In this embodiment, unless otherwise specified, the electrical connection by the "connector" is divided into a form in which it cannot be separated from each other without being broken, and a form in which it can be separated from each other without being broken. It will be described as any one.
　加熱ユニット５は、誘導コイルとサセプタの組合せから構成されてもよい。この場合、エアロゾル源は誘導加熱により加熱される。サセプタは、円筒状のチャンバー部２０として構成されてもよいし、エアロゾル源の内部に設けられてもよい。 The heating unit 5 may be composed of a combination of an induction coil and a susceptor. In this case the aerosol source is heated by induction heating. The susceptor may be configured as a cylindrical chamber portion 20 or may be provided inside the aerosol source.
　バッテリ１０は、充電可能な二次電池やキャパシタなどであり、好ましくは、リチウムイオン電池である。バッテリ１０は、エアロゾル生成装置の電源ユニット１の各構成要素に電源を供給する。バッテリ１０は、第３の回路基板８に接続されたバッテリ温度検出器２８により温度が検出される。 The battery 10 is a rechargeable secondary battery, capacitor, or the like, preferably a lithium ion battery. A battery 10 supplies power to each component of the power supply unit 1 of the aerosol generator. The temperature of the battery 10 is detected by a battery temperature detector 28 connected to the third circuit board 8 .
　ヒータ温度検出器２６、パフ動作検出器２７、バッテリ温度検出器２８及びケース温度検出器２９のそれぞれは、ＰＴＣサーミスタ又はＮＴＣサーミスタから構成されてもよい。 Each of the heater temperature detector 26, the puff operation detector 27, the battery temperature detector 28 and the case temperature detector 29 may be composed of a PTC thermistor or an NTC thermistor.
　加熱ユニット５のチャンバー部２０は、エアロゾル源が装着可能な開口部２０ａを有し、開口部２０ａがスライダ１８により開閉可能である。 The chamber part 20 of the heating unit 5 has an opening 20a to which an aerosol source can be attached, and the opening 20a can be opened and closed by the slider 18.
　第１から第４の回路基板６～９は、導電性材料からなる接続フレーム３０により電気的に接続されている。接続フレーム３０は、好ましくは、フレキシブルプリント基板から構成される。 The first to fourth circuit boards 6-9 are electrically connected by a connection frame 30 made of a conductive material. The connection frame 30 preferably consists of a flexible printed circuit board.
　［回路基板の配置と相互の接続関係］
　次に、図７から図９Ｃを参照して、本実施形態のエアロゾル生成装置の電源ユニット１の回路基板の配置と相互の接続関係について説明する。 [Arrangement of circuit boards and mutual connection]
Next, with reference to FIG. 7 to FIG. 9C, the arrangement of the circuit boards of the power supply unit 1 of the aerosol generating device of this embodiment and the mutual connection relationship will be described.
　図７は、本実施形態のエアロゾル生成装置の電源ユニット１の第１の回路基板６の実装面とその他の回路基板の配置と相互の接続関係を示す斜視図である。図８Ａは、本実施形態のエアロゾル生成装置の電源ユニットの第２の回路基板とその他の回路基板の配置と相互の接続関係を示す斜視図である。図８Ｂは、本実施形態のエアロゾル生成装置の電源ユニットの第２の回路基板とその他の回路基板の配置と相互の接続関係を示す斜視図である。図９Ａは、本実施形態のエアロゾル生成装置の電源ユニットの第３の回路基板とその他の配置と相互の接続関係を示す斜視図である。図９Ｂは、本実施形態のエアロゾル生成装置の電源ユニットの第３の回路基板とその他の配置と相互の接続関係を示す斜視図である。図９Ｃは、本実施形態のエアロゾル生成装置の電源ユニットの第３の回路基板とその他の配置と相互の接続関係を示す斜視図である。 FIG. 7 is a perspective view showing the mounting surface of the first circuit board 6 of the power supply unit 1 of the aerosol generating device of this embodiment, the arrangement of other circuit boards, and their mutual connection relationship. FIG. 8A is a perspective view showing the arrangement and mutual connection relationship of the second circuit board and other circuit boards of the power supply unit of the aerosol generating device of the present embodiment. FIG. 8B is a perspective view showing the arrangement and mutual connection relationship of the second circuit board and other circuit boards of the power supply unit of the aerosol generating device of the present embodiment. FIG. 9A is a perspective view showing the third circuit board of the power supply unit of the aerosol generating device of the present embodiment, other arrangements, and mutual connection relationships. FIG. 9B is a perspective view showing the third circuit board of the power supply unit of the aerosol generating device of the present embodiment, the other arrangement, and the mutual connection relationship. FIG. 9C is a perspective view showing the third circuit board of the power supply unit of the aerosol generating device of the present embodiment, other arrangements, and mutual connection relationships.
　図８Ａは第２の回路基板７の表面を主に示しており、図８Ａは第２の回路基板７の裏面を主に示している。図９Ａ及び図９Ｂは第３の回路基板８の裏面を主に示しており、図９Ｃは第２の回路基板８の表面を主に示している。図９Ｂは、説明のため図９Ａに示す状態から、バッテリ１０の温度検出器（バッテリサーミスタ）２８、後述する負極側バスバー２２ａ及び正極側バスバー２２ｂを取り除いた状態を示している。 8A mainly shows the front surface of the second circuit board 7, and FIG. 8A mainly shows the back surface of the second circuit board 7. FIG. 9A and 9B mainly show the back surface of the third circuit board 8, and FIG. 9C mainly shows the front surface of the second circuit board 8. FIG. FIG. 9B shows a state in which the temperature detector (battery thermistor) 28 of the battery 10 and the negative and positive bus bars 22a and 22b, which will be described later, are removed from the state shown in FIG. 9A for explanation.
　図７に示される第１の回路基板６は、ＬＥＤ（Ｌｉｇｈｔ　Ｅｍｉｔｔｉｎｇ　Ｄｉｏｄｅ）６１とＢＬＥ（Ｂｌｕｅｔｏｏｔｈ（登録商標） Ｌｏｗ Ｅｎｅｒｇｙ）などの通信モジュール（以下、ＢＬＥモジュール）６２が実装される基板（以下、ＢＬＥ基板）である。ＢＬＥ基板６には、ＬＥＤ６１及びＢＬＥモジュール６２に加えて、インナーケース２に対するアウターケース３の着脱を検出するケース着脱検出回路（ホールＩＣ）６３、シュミットトリガー回路（インバータ）６４などのＩＣチップと、タクタイルスイッチ１５と、その他の回路や素子が実装される。シュミットトリガー回路６４は、ケース着脱検出回路６３の出力にヒステリシス特性を持たせるために設けられている。 The first circuit board 6 shown in FIG. 7 is a board (hereinafter referred to as a BLE substrate). In addition to the LED 61 and the BLE module 62, the BLE substrate 6 includes IC chips such as a case attachment/detachment detection circuit (Hall IC) 63 for detecting attachment/detachment of the outer case 3 with respect to the inner case 2, a Schmidt trigger circuit (inverter) 64, and the like. A tactile switch 15 and other circuits and elements are implemented. The Schmitt trigger circuit 64 is provided to give the output of the case attachment/detachment detection circuit 63 a hysteresis characteristic.
　図８Ａ－８Ｂに示される第２の回路基板７は、ＭＣＵ（コントローラ）７１及び充電回路（チャージＩＣ）７２ａが実装される基板（以下、ＭＣＵ基板）である。ＭＣＵ基板７には、ＭＣＵ７１及び充電回路７２ａに加えて、充電回路７２ａのリアクトル（パワーインダクタ）７２ｂ、不揮発性メモリ（ＲＯＭ）７３、ロードスイッチ回路７４ａ～７４ｃ、パワースイッチドライバ回路７５、第１の変圧回路（ＤＣ／ＤＣコンバータＩＣ）７６ａ及びリアクトル（パワーインダクタ）７６ｂ、ヒータ温度検出器（ヒータサーミスタ）２６の電圧検出回路（図１５のオペアンプＡ２）７７ａ、ケース温度検出器（ケースサーミスタ）２９の電圧検出回路（図１５のオペアンプＡ３）７７ｂ、第１のラッチ回路７８ａ、第２のラッチ回路７８ｂなどのＩＣチップと、ヒータ温度検出器（ヒータサーミスタ）２６の正側／負側コネクタ７９ａ、７９ｂ、パフ動作検出器（パフサーミスタ）２７の正側／負側コネクタ９０ａ、９０ｂ、ケース温度検出器（ケースサーミスタ）２９の正側／負側コネクタ９１ａ、９１ｂ、振動モータ２４のコネクタ９２、その他の回路やＩＣや素子が実装される。 The second circuit board 7 shown in FIGS. 8A and 8B is a board on which an MCU (controller) 71 and a charging circuit (charge IC) 72a are mounted (hereinafter referred to as MCU board). In addition to the MCU 71 and charging circuit 72a, the MCU board 7 includes a reactor (power inductor) 72b of the charging circuit 72a, a non-volatile memory (ROM) 73, load switch circuits 74a to 74c, a power switch driver circuit 75, a first Transformer circuit (DC/DC converter IC) 76a and reactor (power inductor) 76b, heater temperature detector (heater thermistor) 26 voltage detection circuit (operational amplifier A2 in FIG. 15) 77a, case temperature detector (case thermistor) 29 IC chips such as voltage detection circuit (operational amplifier A3 in FIG. 15) 77b, first latch circuit 78a and second latch circuit 78b, and positive/ negative connectors 79a and 79b of heater temperature detector (heater thermistor) 26 , positive/ negative connectors 90a and 90b of the puff action detector (puff thermistor) 27, positive/ negative connectors 91a and 91b of the case temperature detector (case thermistor) 29, connector 92 of the vibration motor 24, and others. Circuits, ICs, and elements are mounted.
　なお、図８Ａ－８Ｂにおいて、ヒータ温度検出器（ヒータサーミスタ）２６の正側／負側コネクタ７９ａ、７９ｂは、リード線を介してヒータ温度検出器（ヒータサーミスタ）２６へ接続されていないが、これは単に作図上の都合に過ぎない点に留意されたい。実際には、上記リード線は、接続フレーム３０の隙間から、ヒータ温度検出器（ヒータサーミスタ）２６の正側／負側コネクタ７９ａ、７９ｂへ接続されうる。これは、パフ動作検出器（パフサーミスタ）２７の正側／負側コネクタ９０ａ、９０ｂと、ケース温度検出器（ケースサーミスタ）２９の正側／負側コネクタ９１ａ、９１ｂについても同様である。 8A and 8B, the positive/ negative connectors 79a and 79b of the heater temperature detector (heater thermistor) 26 are not connected to the heater temperature detector (heater thermistor) 26 via lead wires. Note that this is merely a drawing convenience. In practice, the lead wires can be connected to the positive/ negative connectors 79 a and 79 b of the heater temperature detector (heater thermistor) 26 through the gaps in the connection frame 30 . The same applies to the positive/ negative connectors 90 a and 90 b of the puff action detector (puff thermistor) 27 and the positive/ negative connectors 91 a and 91 b of the case temperature detector (case thermistor) 29 .
　図９Ａ－９Ｃに示される第３の回路基板８は、ＵＳＢコネクタ１９が実装される基板（以下、ＵＳＢ基板）である。ＵＳＢ基板８には、ＵＳＢコネクタ１９に加えて、バッテリ１０の負極へ接続される負極側バスバー２２ａ、バッテリ１０の正極へ接続される正極側バスバー２２ｂ、バッテリ１０の温度検出器（バッテリサーミスタ）２８が接続される。ＵＳＢ基板８には、電池残量検出回路（ガスゲージＩＣ）８１ａ、電池残量検出回路８１ａの電流検出用抵抗８１ｂ、第２の変圧回路（ＤＣ／ＤＣコンバータＩＣ）８２ａ及びリアクトル（パワーインダクタ）８２ｂ、保護回路（保護ＩＣ）８３ａ、保護回路８３ａの電流検出用抵抗８３ｂ、保護回路８３ａに制御される充放電遮断スイッチ（ＭＯＳＦＥＴ）８３ｃ、ヒータ電圧検出回路（図１５のオペアンプＡ１）８４、ヒータ加熱スイッチ回路（ＭＯＳＦＥＴ）８５、負極側バスバー２２ａのコネクタ８６ａ、正極側バスバー２２ｂのコネクタ８６ｂ、ヒータ２５の正側／負側コネクタ８７ａ、８７ｂ、バッテリ温度検出器２８の正側／負側コネクタ８８、ヒータ２５の負側スイッチ回路（ＭＯＳＦＥＴ）９０、過電圧保護回路（過電圧保護ＩＣ）９３と、その他の回路やＩＣや素子が実装される。 The third circuit board 8 shown in FIGS. 9A-9C is a board on which the USB connector 19 is mounted (hereinafter referred to as USB board). In addition to the USB connector 19 , the USB board 8 includes a negative bus bar 22 a connected to the negative electrode of the battery 10 , a positive bus bar 22 b connected to the positive electrode of the battery 10 , and a temperature detector (battery thermistor) 28 for the battery 10 . is connected. The USB board 8 includes a battery level detection circuit (gas gauge IC) 81a, a current detection resistor 81b for the battery level detection circuit 81a, a second transformer circuit (DC/DC converter IC) 82a, and a reactor (power inductor) 82b. , a protection circuit (protection IC) 83a, a current detection resistor 83b of the protection circuit 83a, a charge/discharge cutoff switch (MOSFET) 83c controlled by the protection circuit 83a, a heater voltage detection circuit (operational amplifier A1 in FIG. 15) 84, heater heating switch circuit (MOSFET) 85, connector 86a of negative bus bar 22a, connector 86b of positive bus bar 22b, positive/ negative connectors 87a, 87b of heater 25, positive/negative connector 88 of battery temperature detector 28, A negative side switch circuit (MOSFET) 90 of the heater 25, an overvoltage protection circuit (overvoltage protection IC) 93, and other circuits, ICs, and elements are mounted.
　図７、図８Ａ及び図８Ｂに示される第４の回路基板９は、スライダ１８の開閉を検出する開閉検出回路（ホールＩＣ）９５が実装される開閉検出基板である。 The fourth circuit board 9 shown in FIGS. 7, 8A and 8B is an open/close detection board on which an open/close detection circuit (Hall IC) 95 for detecting opening/closing of the slider 18 is mounted.
　ＢＬＥ基板６、ＭＣＵ基板７及びＵＳＢ基板８は、長手方向及び短手方向を有する長細い外形を有する。 The BLE board 6, MCU board 7, and USB board 8 have long and narrow outlines with longitudinal and lateral directions.
　ＭＣＵ基板７とＵＳＢ基板８は、加熱ユニット５の直下の位置に配置され、ＭＣＵ基板７の裏面（第２面）とＵＳＢ基板８の表面（第１面）が向かい合うように平行に配置される。ＢＬＥ基板６は、ＢＬＥモジュール６２が実装される長手方向の一端部がＭＣＵ基板７及びＵＳＢ基板８の長手方向の中央部付近に位置し、中央部付近からＢＬＥモジュールが実装されない他端部までの領域が加熱ユニット５とバッテリ１０の間に位置するようにＭＣＵ基板７及びＵＳＢ基板８に対してオフセットして配置されている。また、ＢＬＥ基板６は、ＢＬＥ基板６の実装面（第１面）がＭＣＵ基板７及びＵＳＢ基板８の実装面（表面及びと裏面）と略直交するように配置される。 The MCU board 7 and the USB board 8 are arranged directly below the heating unit 5 and arranged in parallel so that the back surface (second surface) of the MCU board 7 and the front surface (first surface) of the USB board 8 face each other. . The BLE board 6 has one end in the longitudinal direction where the BLE module 62 is mounted, located near the center in the longitudinal direction of the MCU board 7 and the USB board 8, and the distance from near the center to the other end where the BLE module is not mounted. It is offset with respect to the MCU board 7 and the USB board 8 so that the area is located between the heating unit 5 and the battery 10 . Also, the BLE board 6 is arranged such that the mounting surface (first surface) of the BLE board 6 is substantially perpendicular to the mounting surfaces (front and rear surfaces) of the MCU board 7 and the USB board 8 .
　ＭＣＵ基板７及びＵＳＢ基板８は、ＭＣＵ基板７に設けられたコネクタと、ＵＳＢ基板８に設けられたコネクタ３４（図１２Ａ－１２Ｂ参照）と、ＭＣＵ基板７に接続されたフレキシブル基板３１とにより電気的に接続される。ＢＬＥ基板６は、接続フレーム３０によりＭＣＵ基板７に電気的に接続されている。開閉検出基板９は、接続フレーム３０から分岐して延びる分岐フレーム３２によりＭＣＵ基板７に電気的に接続されている。分岐フレーム３２は、好ましくは、フレキシブルプリント基板から構成される。 The MCU board 7 and the USB board 8 are electrically connected by a connector provided on the MCU board 7, a connector 34 (see FIGS. 12A and 12B) provided on the USB board 8, and a flexible board 31 connected to the MCU board 7. connected The BLE board 6 is electrically connected to the MCU board 7 by the connection frame 30 . The open/close detection board 9 is electrically connected to the MCU board 7 by a branch frame 32 branching from the connection frame 30 . The branch frame 32 is preferably constructed from a flexible printed circuit board.
　［回路構成］
　次に、図１５を参照して、本実施形態のエアロゾル生成装置の電源ユニット１の回路構成について説明する。 [Circuit configuration]
Next, with reference to FIG. 15, the circuit configuration of the power supply unit 1 of the aerosol generating device of this embodiment will be described.
　図１５は、本実施形態のエアロゾル生成装置の電源ユニット１の回路図である。 FIG. 15 is a circuit diagram of the power supply unit 1 of the aerosol generating device of this embodiment.
　電源ＢＴは、バッテリ１０である。保護回路８３ａは、電源ＢＴから出力される電流が流れる経路に配置された抵抗器Ｒ２を使って該経路を流れる電流を計測し、その電流に応じて電源ＢＴを保護する保護ＩＣである。電池残量検出回路８１ａは、電源ＢＴから出力される電流が流れる経路に配置された抵抗器Ｒ１を使って、電源ＢＴの状態を計測するガスゲージＩＣ（残量計ＩＣ）である。過電圧保護回路９３は、給電コネクタとしてのＵＳＢコネクタ１９から供給される電圧ＶＢＵＳを受けてＶＵＳＢラインに電圧ＶＵＳＢを出力する過電圧保護ＩＣである。過電圧保護回路９３は、ＵＳＢコネクタ１９から供給される電圧ＶＢＵＳが規定電圧値を超える電圧であっても、それを規定電圧値まで降下させて過電圧保護回路９３の出力側に供給する機能を有する。 A power source BT is the battery 10 . The protection circuit 83a is a protection IC that measures the current flowing through the path through which the current output from the power supply BT flows using a resistor R2 and protects the power supply BT according to the current. The battery remaining amount detection circuit 81a is a gas gauge IC (remaining amount gauge IC) that measures the state of the power supply BT using a resistor R1 arranged in the path through which the current output from the power supply BT flows. The overvoltage protection circuit 93 is an overvoltage protection IC that receives the voltage VBUS supplied from the USB connector 19 as a power supply connector and outputs the voltage VUSB to the VUSB line. The overvoltage protection circuit 93 has a function of reducing the voltage V BUS supplied from the USB connector 19 to the specified voltage value and supplying it to the output side of the overvoltage protection circuit 93 even if the voltage VBUS exceeds the specified voltage value. .
　第２の変圧回路８２ａは、電源ＢＴから供給される電源電圧ＶＢＡＴを変圧してヒータ２５を駆動するためのヒータ電圧ＶＢＯＯＳＴを生成するスイッチングレギュレータを含むＤＣ／ＤＣコンバータである。ヒータ２５が生成するエアロゾルの量を増大させる観点から、第２の変圧回路８２ａは、昇圧機能を備えたＤＣ／ＤＣコンバータ、好ましくは、昇圧ＤＣ／ＤＣコンバータ又は昇降圧ＤＣ／ＤＣコンバータである。 The second transformer circuit 82 a is a DC/DC converter including a switching regulator that transforms the power supply voltage V BAT supplied from the power supply BT to generate the heater voltage V BOOST for driving the heater 25 . From the viewpoint of increasing the amount of aerosol generated by the heater 25, the second transformer circuit 82a is a DC/DC converter with a step-up function, preferably a step-up DC/DC converter or a buck-boost DC/DC converter.
　ヒータ２５を発熱させるときは、ＭＣＵ７１によってスイッチＳＭがオフされ、スイッチＳＨ及びスイッチＳＳがオンされ、ヒータ電圧ＶＢＯＯＳＴは、スイッチＳＨを通してヒータ２５に供給される。ヒータ２５の温度あるいは抵抗を計測するときは、ＭＣＵ７１によってスイッチＳＨがオフされ、スイッチＳＭ及びスイッチＳＳがオンされ、ヒータ電圧ＶＢＯＯＳＴは、スイッチＳＭを通してヒータ２５に供給される。ヒータ２５の温度あるいは抵抗値を計測するときは、オペアンプＡ１は、ヒータ２５の正側端子と負側端子との間の電圧、換言すると、ヒータ２５の正側／負側コネクタ８７ａ、８７ｂとの間の電圧に応じた出力をＭＣＵ７１のＰＡ７端子に供給する。オペアンプＡ１は、ヒータ２５の抵抗値あるいは温度を計測する温度検出回路として機能する。スイッチＳＭとヒータ２５の正側コネクタ８７ａとを電気的に接続する経路には、シャント抵抗器ＲＳが配置される。シャント抵抗器ＲＳの抵抗値は、ヒータ２５を加熱する期間はスイッチＳＲがオンし、ヒータ２５の温度あるいは抵抗値を計測する期間はスイッチＳＲがオフするように決定されうる。 When the heater 25 is to generate heat, the MCU 71 turns off the switch SM, turns on the switches SH and SS, and supplies the heater voltage V BOOST to the heater 25 through the switch SH. When measuring the temperature or resistance of the heater 25, the MCU 71 turns off the switch SH, turns on the switches SM and SS, and supplies the heater voltage V BOOST to the heater 25 through the switch SM. When measuring the temperature or resistance of the heater 25, the operational amplifier A1 measures the voltage between the positive and negative terminals of the heater 25, in other words, the voltage between the positive/ negative connectors 87a and 87b of the heater 25. The PA7 terminal of MCU71 is supplied with the output according to the voltage between. The operational amplifier A1 functions as a temperature detection circuit that measures the resistance value or temperature of the heater 25. FIG. A shunt resistor RS is arranged in a path electrically connecting the switch SM and the positive connector 87 a of the heater 25 . The resistance value of the shunt resistor RS can be determined so that the switch SR is turned on while the heater 25 is heated and turned off while the temperature or resistance value of the heater 25 is measured.
　スイッチＳＲがＮチャネル型のＭＯＳＦＥＴで構成される場合、スイッチＳＲのドレイン端子はオペアンプＡ１の出力端子へ接続され、スイッチＳＲのゲート端子はシャント抵抗器ＲＳとヒータ２５の正側コネクタ８７ａの間へ接続され、スイッチＳＲのソース端子はグランドへ接続される。スイッチＳＲのゲート端子には、ヒータ電圧ＶＢＯＯＳＴを主にシャント抵抗器ＲＳとヒータ２５で分圧した値が入力される。シャント抵抗ＲＳの抵抗値は、この分圧した値がスイッチＳＲの閾値電圧以上になるように決定されうる。また、シャント抵抗器ＲＳにより、スイッチＳＨをオフし且つスイッチＳＭ及びスイッチＳＳをオンする時にヒータ２５を流れる電流は、スイッチＳＨ及びスイッチＳＳをオンとし且つスイッチＳＭをオフとする時にヒータ２５を流れる電流よりも小さい。これにより、ヒータ２５の温度あるいは抵抗を計測するとき、ヒータ２５を流れる電流によりヒータ２５の温度が変化しにくくなる。 When the switch SR is composed of an N-channel MOSFET, the drain terminal of the switch SR is connected to the output terminal of the operational amplifier A1, and the gate terminal of the switch SR is connected between the shunt resistor RS and the positive connector 87a of the heater 25. , and the source terminal of switch SR is connected to ground. A value obtained by dividing the heater voltage V BOOST mainly by the shunt resistor RS and the heater 25 is input to the gate terminal of the switch SR. The resistance value of the shunt resistor RS can be determined so that the divided value is greater than or equal to the threshold voltage of the switch SR. Also, due to the shunt resistor RS, the current flowing through the heater 25 when the switch SH is turned off and the switches SM and SS are turned on flows through the heater 25 when the switch SH and the switch SS are turned on and the switch SM is turned off. smaller than the current. This makes it difficult for the temperature of the heater 25 to change due to the current flowing through the heater 25 when measuring the temperature or resistance of the heater 25 .
　ロードスイッチ回路７４ｃは、ＯＮ端子にローレベルが入力されているときは、ＶＩＮ端子とＶＯＵＴ端子とを電気的に切断し、ＯＮ端子にハイレベルが入力されているときは、ＶＩＮ端子とＶＯＵＴ端子とを電気的に接続し、ＶＯＵＴ端子からＶＣＣ５ラインに電圧ＶＣＣ５を出力する。電圧ＶＣＣ５の電圧値は、例えば５．０［Ｖ］である。ＶＣＣ５ラインは、充電回路７２ａのＶＢＵＳ端子及びＶＡＣ端子と、ＬＥＤ６１とへ接続される。なお、ロードスイッチ回路７４ｃのＯＮ端子には、ｎｐｎ型のバイポーラトランジスタのコレクタ端子が接続される。このバイポーラトランジスタのエミッタ端子はグランドＧＮＤ７へ接続され、ベース端子はＭＣＵ７１のＰＣ９端子へ接続される。つまり、ＭＣＵ７１は、ＰＣ９端子の電位を調整することで、バイポーラトランジスタを介してロードスイッチ７４ｃの開閉を制御できる。 The load switch circuit 74c electrically disconnects the VIN terminal and the VOUT terminal when a low level is input to the ON terminal, and disconnects the VIN terminal and the VOUT terminal when a high level is input to the ON terminal. and are electrically connected to output the voltage VCC5 from the VOUT terminal to the VCC5 line. The voltage value of the voltage VCC5 is, for example, 5.0 [V]. The V CC5 line is connected to the VBUS and VAC terminals of charging circuit 72 a and to LED 61 . A collector terminal of an npn-type bipolar transistor is connected to the ON terminal of the load switch circuit 74c. The emitter terminal of this bipolar transistor is connected to the ground GND7, and the base terminal is connected to the PC9 terminal of the MCU71. That is, the MCU 71 can control opening/closing of the load switch 74c through the bipolar transistor by adjusting the potential of the PC9 terminal.
　充電回路７２ａは、充電モードにおいて、ＳＹＳ端子とＢＡＴ端子とを内部で電気的に接続し、ＢＡＴ端子から電源ＢＴに充電電圧を供給するチャージＩＣである。充電モードは、／ＣＥ端子にローレベルが供給されることによってイネーブルあるいは起動される。充電回路７２ａは、パワーパスモードにおいては、ＶＢＵＳ端子とＳＷ端子とを電気的に接続し、ＶＣＣ５ラインを介して供給される電圧ＶＣＣ５及び／又は電源ＢＴからＢＡＴ端子に供給される電源電圧ＶＢＡＴを使ってＶＣＣラインに電圧ＶＣＣを供給する。充電回路７２ａは、ＯＴＧモードにおいては、電源ＢＴからＢＡＴ端子に供給される電源電圧ＶＢＡＴを受けてＳＹＳ端子からＶＣＣラインに電圧ＶＣＣを供給するとともに、ＶＢＵＳ端子からＶＣＣ５ラインに電圧ＶＣＣ５を供給する。ＯＴＧモードにおいてＶＢＵＳ端子からＶＣＣ５ラインへ供給される電圧ＶＣＣ５もまた５．０［Ｖ］になるように、ＯＴＧモードにおける充電回路７２ａは、ＢＡＴ端子に供給される電源電圧ＶＢＡＴを昇圧して、ＶＢＵＳ端子からＶＣＣ５ラインへ供給することが好ましい。／ＣＥ端子にハイレベルが供給されると、充電回路７２ａは、パワーパスモード及びＯＴＧモードのうちデフォルトで設定されている動作モード、又は、ＭＣＵ７１によって設定された動作モードで動作する。 The charging circuit 72a is a charging IC that electrically connects the SYS terminal and the BAT terminal inside and supplies charging voltage from the BAT terminal to the power supply BT in the charging mode. The charge mode is enabled or activated by supplying a low level to the /CE terminal. In the power pass mode, the charging circuit 72a electrically connects the VBUS terminal and the SW terminal, and receives the voltage VCC5 supplied via the VCC5 line and/or the power supply voltage supplied from the power supply BT to the BAT terminal. V BAT is used to supply the voltage V CC to the V CC line. In the OTG mode, the charging circuit 72a receives the power supply voltage VBAT supplied from the power supply BT to the BAT terminal, supplies the voltage VCC from the SYS terminal to the VCC line, and supplies the voltage VCC5 from the VBUS terminal to the VCC5 line. Provides VCC5 . The charging circuit 72a in the OTG mode boosts the power supply voltage V BAT supplied to the BAT terminal so that the voltage V CC5 supplied from the VBUS terminal to the V CC5 line also becomes 5.0 [V] in the OTG mode. Therefore, it is preferable to supply the VCC5 line from the VBUS terminal. When a high level is supplied to the /CE terminal, the charging circuit 72 a operates in the default operation mode or the operation mode set by the MCU 71 among the power pass mode and the OTG mode.
　第１の変圧回路７６ａは、ＶＣＣラインに電圧ＶＣＣが供給されることによってイネーブルされる。具体的には、第１の変圧回路７６ａは、ＥＮ端子へハイレベルの信号が入力されることによってイネーブルされる。ＶＩＮ端子及びＥＮ端子はＶＣＣラインへ接続されていることから、第１の変圧回路７６ａは、ＶＣＣラインに電圧ＶＣＣが供給されることによってイネーブルされる。第１の変圧回路７６ａは、ＶＯＵＴ端子からＶＣＣ３３＿０ラインに電圧ＶＣＣ３３＿０を供給するスイッチングレギュレータを含むＤＣ／ＤＣコンバータである。第１の変圧回路７６ａは、より好ましくは、昇降圧ＤＣ／ＤＣコンバータである。電圧ＶＣＣ３３＿０の電圧値は、例えば、３．３［Ｖ］である。ＶＣＣ３３＿０ラインは、ロードスイッチ回路７４ｂのＶＩＮ端子、パワースイッチドライバ回路７５のＶＩＮ端子及びＲＳＴＢ端子、第２のラッチ回路７８ｂのＶＣＣ端子及びＤ端子へ接続される。 The first transformer circuit 76a is enabled by applying voltage VCC to the VCC line. Specifically, the first transformer circuit 76a is enabled by inputting a high-level signal to the EN terminal. Since the VIN and EN terminals are connected to the VCC line, the first transformer circuit 76a is enabled by applying voltage VCC to the VCC line. The first transformer circuit 76a is a DC/DC converter that includes a switching regulator that supplies voltage VCC33_0 from the VOUT terminal to the VCC33_0 line. The first transformer circuit 76a is more preferably a step-up/step-down DC/DC converter. The voltage value of the voltage V CC33_0 is, for example, 3.3 [V]. The VCC33_0 line is connected to the VIN terminal of the load switch circuit 74b, the VIN and RSTB terminals of the power switch driver circuit 75, and the VCC and D terminals of the second latch circuit 78b.
　ロードスイッチ回路７４ｂは、ＯＮ端子にローレベルが入力されているときは、ＶＩＮ端子とＶＯＵＴ端子とを電気的に切断し、ＯＮ端子にハイレベルが入力されているときは、ＶＩＮ端子とＶＯＵＴ端子とを電気的に接続し、ＶＯＵＴ端子からＶＣＣ３３ラインに電圧ＶＣＣ３３を出力する。電圧ＶＣＣ３３の電圧値は、例えば、３．３［Ｖ］である。ＶＣＣ３３ラインは、ロードスイッチ７４ａのＶＩＮ端子、不揮発性メモリ７３のＶＣＣ端子、電池残量検出回路８１ａのＶＤＤ端子及びＣＥ端子、ＭＣＵ７１のＶＤＤ端子、ケース着脱検出回路６３のＶＤＤ端子、シュミットトリガー回路６４のＶＣＣ端子、ＢＬＥモジュール６２のＶＣＣ＿ＮＲＦ端子、開閉検出回路９５のＶＤＤ端子、第１のラッチ回路７８ａのＶＣＣ端子及びＤ端子、オペアンプＡ１の正電源端子、オペアンプＡ２の正電源端子、オペアンプＡ３の正電源端子へ接続される。ロードスイッチ７４ｂのＶＩＮ端子は、第１の変圧回路７６ａのＶＯＵＴ端子に電気的に接続され、第１の変圧回路７６ａから電圧ＶＣＣ３３＿０が供給される。 The load switch circuit 74b electrically disconnects the VIN terminal and the VOUT terminal when a low level is input to the ON terminal, and disconnects the VIN terminal and the VOUT terminal when a high level is input to the ON terminal. and are electrically connected to output the voltage VCC33 from the VOUT terminal to the VCC33 line. The voltage value of the voltage VCC33 is, for example, 3.3 [V]. The VCC 33 line includes the VIN terminal of the load switch 74a, the VCC terminal of the nonvolatile memory 73, the VDD and CE terminals of the remaining battery level detection circuit 81a, the VDD terminal of the MCU 71, the VDD terminal of the case attachment/detachment detection circuit 63, and the Schmitt trigger circuit. 64, the VCC_NRF terminal of the BLE module 62, the VDD terminal of the open/close detection circuit 95, the VCC terminal and D terminal of the first latch circuit 78a, the positive power supply terminal of the operational amplifier A1, the positive power supply terminal of the operational amplifier A2, the operational amplifier A3. Connected to the positive supply terminal. The VIN terminal of the load switch 74b is electrically connected to the VOUT terminal of the first transformer circuit 76a, and the voltage VCC33_0 is supplied from the first transformer circuit 76a.
　パワースイッチドライバ回路７５は、ＳＷ１端子及びＳＷ２端子にローレベルが所定時間にわたって供給されたことに応じて、ＲＳＴＢ端子からローレベルを出力する。ＲＳＴＢ端子は、ロードスイッチ回路７４ｂのＯＮ端子に電気的に接続されている。したがって、パワースイッチドライバ回路７５のＳＷ１端子及びＳＷ２端子にローレベルが供給されたことに応じて、ロードスイッチ回路７４ｂは、ＶＯＵＴ端子からの電圧ＶＣＣ３３の出力を停止する。ロードスイッチ回路７４ｂのＶＯＵＴ端子からの電圧ＶＣＣ３３の出力が停止すると、ＭＣＵ７１のＶＤＤ端子（電源端子）に対する電圧ＶＣＣ３３の供給が絶たれるので、ＭＣＵ７１は、動作を停止する。 The power switch driver circuit 75 outputs a low level from the RSTB terminal in response to the low level being supplied to the SW1 terminal and the SW2 terminal for a predetermined time. The RSTB terminal is electrically connected to the ON terminal of the load switch circuit 74b. Accordingly, in response to the low level being supplied to the SW1 terminal and SW2 terminal of the power switch driver circuit 75, the load switch circuit 74b stops outputting the voltage VCC33 from the VOUT terminal. When the output of the voltage VCC33 from the VOUT terminal of the load switch circuit 74b stops, the supply of the voltage VCC33 to the VDD terminal (power supply terminal) of the MCU71 is cut off, so the MCU71 stops operating.
　パワースイッチドライバ回路７５は、ＲＳＴＢ端子からローレベルを出力した後に、ＲＳＴＢ端子からローレベルを出力しないようにすることが好ましい。ＲＳＴＢ端子からローレベルを出力しないようにされると、電圧ＶＣＣ３３＿０がロードスイッチ７４ｂのＯＮ端子へ入力されるため、ロードスイッチ７４ｂはＶＯＵＴ端子からＶＣＣ３３ラインに電圧ＶＣＣ３３を再び出力する。これにより、動作を停止したＭＣＵ７１を再起動できる。 It is preferable that the power switch driver circuit 75 does not output a low level from the RSTB terminal after outputting a low level from the RSTB terminal. When the RSTB terminal is prevented from outputting a low level, the voltage VCC33_0 is input to the ON terminal of the load switch 74b, so that the load switch 74b again outputs the voltage VCC33 from the VOUT terminal to the VCC33 line. As a result, the MCU 71 that has stopped operating can be restarted.
　アウターケース３がインナーケース２から取り外されると、ケース着脱検出回路６３からシュミットトリガー回路６４を介してパワースイッチドライバ回路７５のＳＷ２端子にローレベルが供給される。パワースイッチドライバ回路７５のＳＷ１端子とＭＣＵ７１のＰＣ１０端子は、タクタイルスイッチ１５を介してグランドＧＮＤ６へ接続される。このため、タクタイルスイッチ１５が押下されると、パワースイッチドライバ回路７５のＳＷ１端子にローレベルが供給される。よって、アウターケース３がインナーケース２から取り外れた状態でタクタイルスイッチ１５が押下されると、パワースイッチドライバ回路７５のＳＷ１端子及びＳＷ２端子にローレベルが供給される。パワースイッチドライバ回路７５は、ＳＷ１端子及びＳＷ２端子にローレベルが所定時間（例えば数秒間）継続して供給されると、エアロゾル生成装置の電源ユニット１に対するリセットあるいは再起動の指令が入力されたものと認識する。 When the outer case 3 is removed from the inner case 2 , a low level is supplied from the case attachment/detachment detection circuit 63 to the SW2 terminal of the power switch driver circuit 75 via the Schmitt trigger circuit 64 . The SW1 terminal of the power switch driver circuit 75 and the PC10 terminal of the MCU 71 are connected through the tactile switch 15 to the ground GND6. Therefore, when the tactile switch 15 is pressed, the SW1 terminal of the power switch driver circuit 75 is supplied with a low level. Therefore, when the tactile switch 15 is pressed while the outer case 3 is removed from the inner case 2, the SW1 terminal and the SW2 terminal of the power switch driver circuit 75 are supplied with a low level. In the power switch driver circuit 75, when a low level is continuously supplied to the SW1 terminal and the SW2 terminal for a predetermined time (for example, several seconds), a command to reset or restart the power supply unit 1 of the aerosol generator is input. Recognize.
　ロードスイッチ回路７４ａは、ＯＮ端子にローレベルが入力されているときは、ＶＩＮ端子とＶＯＵＴ端子とを電気的に切断し、ＯＮ端子にハイレベルが入力されているときは、ＶＩＮ端子とＶＯＵＴ端子とを電気的に接続し、ＶＯＵＴ端子からＶＣＣ３３＿ＳＬＰラインに電圧ＶＣＣ３３＿ＳＬＰを出力する。電圧ＶＣＣ３３＿ＳＬＰの電圧値は、例えば、３．３［Ｖ］である。ＶＣＣ３３＿ＳＬＰラインは、ヒータ温度検出器（ヒータサーミスタ）２６、パフ動作検出器（パフサーミスタ）２７、ケース温度検出器（ケースサーミスタ）２９へ接続される。ロードスイッチ回路７４ａのＯＮ端子は、ＭＣＵ７１のＰＣ１１端子に電気的に接続されていて、ＭＣＵ７１は、スリープモードに移行する際にＰＣ１１端子の論理レベルをハイレベルからローレベルに遷移させ、スリープモードからアクティブモードに移行する際にＰＣ１１端子の論理レベルをローレベルからハイレベルに遷移させる。 The load switch circuit 74a electrically disconnects the VIN terminal and the VOUT terminal when a low level is input to the ON terminal, and disconnects the VIN terminal and the VOUT terminal when a high level is input to the ON terminal. and are electrically connected to output the voltage VCC33_SLP from the VOUT terminal to the VCC33_SLP line. The voltage value of the voltage V CC33_SLP is, for example, 3.3 [V]. The V CC33_SLP line is connected to a heater temperature detector (heater thermistor) 26 , a puff action detector (puff thermistor) 27 , and a case temperature detector (case thermistor) 29 . The ON terminal of the load switch circuit 74a is electrically connected to the PC11 terminal of the MCU 71, and the MCU 71 transitions the logic level of the PC11 terminal from high level to low level when transitioning to sleep mode. When shifting to the active mode, the logic level of the PC11 terminal is changed from low level to high level.
　ＭＣＵ７１は、パフサーミスタ２７の抵抗値変化を用いてパフ動作に伴う空気流路の温度変化を検出する。ＭＣＵ７１は、パフサーミスタ２７の抵抗値変化を、ＰＣ４端子に入力される電圧の値から取得しうる。 The MCU 71 uses the resistance value change of the puff thermistor 27 to detect the temperature change in the air flow path due to the puff operation. The MCU 71 can acquire the resistance value change of the puff thermistor 27 from the value of the voltage input to the PC4 terminal.
　振動モータ２４、スイッチＳＮをオンさせることによって起動される。スイッチＳＮは、トランジスタで構成されてよく、トランジスタのベース又はゲートには、ＭＣＵ７１のＰＨ０端子から制御信号が供給される。スイッチＳＮに替えて、振動モータ２４のドライバＩＣを用いてもよい。 The vibration motor 24 is activated by turning on the switch SN. The switch SN may be composed of a transistor, and a control signal is supplied from the PH0 terminal of the MCU 71 to the base or gate of the transistor. A driver IC for the vibration motor 24 may be used instead of the switch SN.
　ＭＣＵ７１は、ヒータサーミスタ２６の抵抗値変化を用いてヒータ２５の温度を検出する。ヒータ２５の温度は、ヒータ２５の近傍の温度を検出することによって間接的に検出されてもよい。ＭＣＵ７１は、パフサーミスタ２６の抵抗値変化を、ＰＡ６端子に入力される電圧の値から取得しうる。オペアンプＡ２は、ヒータサーミスタ２６の抵抗値に応じた電圧、換言すると、ヒータ２５の温度に応じた電圧を出力する。 The MCU 71 detects the temperature of the heater 25 using the resistance value change of the heater thermistor 26 . The temperature of heater 25 may be detected indirectly by detecting the temperature in the vicinity of heater 25 . The MCU 71 can acquire the resistance value change of the puff thermistor 26 from the value of the voltage input to the PA6 terminal. The operational amplifier A<b>2 outputs a voltage corresponding to the resistance value of the heater thermistor 26 , in other words, a voltage corresponding to the temperature of the heater 25 .
　ＭＣＵ７１は、ケースサーミスタ２９の抵抗値変化を用いてインナーケース２の内部の温度を検出する。ＭＣＵ７１は、ケースサーミスタ２９の抵抗値変化を、ＰＡ３端子に入力される電圧の値から取得しうる。オペアンプＡ３は、ケースサーミスタ２９の抵抗値に応じた電圧、換言すると、インナーケース２の温度に応じた電圧を出力する。 The MCU 71 detects the temperature inside the inner case 2 using the change in the resistance value of the case thermistor 29 . The MCU 71 can acquire the resistance value change of the case thermistor 29 from the value of the voltage input to the PA3 terminal. The operational amplifier A3 outputs a voltage corresponding to the resistance value of the case thermistor 29, in other words, a voltage corresponding to the temperature of the inner case 2. FIG.
　ＭＣＵ７１（コントローラ）は、ＩＣチップとして構成されるプロセッサを含み、不揮発性メモリ７３又は内蔵メモリに格納されたプログラムを実行することによりエアロゾル生成装置の電源ユニット１の全体の動作を制御する。 The MCU 71 (controller) includes a processor configured as an IC chip, and controls the overall operation of the power supply unit 1 of the aerosol generator by executing programs stored in the nonvolatile memory 73 or built-in memory.
　ＭＣＵ７１は、ヒータ２５の加熱制御と、バッテリ１０の充放電制御を行う。ＭＣＵ７１は、アウターケース３が装着された状態でタクタイルスイッチ１５が長押しされることでヒータ２５の加熱制御を開始する。ヒータ２５の加熱制御は、具体的には、ＭＣＵ７１のＰＣ１２端子からスイッチＳＳのゲート端子及び第２の変圧回路８２ａのＥＮ端子へハイレベルが供給されることにより開始されうる。これにより、ヒータ２５の負側コネクタ８７ｂとグランドが接続され、且つ、第２の変圧回路８２ａがヒータ電圧ＶＢＯＯＳＴを出力する。この状態において、ＭＣＵ７１がＰＡ２端子からスイッチＳＨのゲート端子へローレベルを出力すれば、スイッチＳＨがオンされ、ヒータ２５へータ電圧ＶＢＯＯＳＴが供給される。 The MCU 71 performs heating control of the heater 25 and charge/discharge control of the battery 10 . The MCU 71 starts heating control of the heater 25 when the tactile switch 15 is pressed long while the outer case 3 is attached. Specifically, the heating control of the heater 25 can be started by supplying a high level from the PC12 terminal of the MCU 71 to the gate terminal of the switch SS and the EN terminal of the second transformer circuit 82a. As a result, the negative connector 87b of the heater 25 is connected to the ground, and the second transformer circuit 82a outputs the heater voltage V BOOST . In this state, when the MCU 71 outputs a low level from the PA2 terminal to the gate terminal of the switch SH, the switch SH is turned on and the heater voltage V BOOST is supplied to the heater 25 .
　ＭＣＵ７１は、電源ＢＴの電力を用いてエアロゾル源を加熱するためのヒータ２５への電力の供給を制御して、ヒータ２５の発熱を制御する。具体的には、ＭＣＵ７１は、ヒータ２５の発熱を、スイッチＳＨに対するＰＷＭ制御又はＰＦＭ制御によって制御する。ＰＷＭ制御又はＰＦＭ制御におけるデューティ比は、ＰＩＤ制御によって算出されてもよい。ＭＣＵ７１は、ＰＩＤ制御に必要なヒータ２５の温度を、オペアンプＡ１の出力から取得してもよいし、ＰＣ６端子への入力から取得してもよい。 The MCU 71 controls power supply to the heater 25 for heating the aerosol source using power from the power supply BT, and controls heat generation of the heater 25 . Specifically, the MCU 71 controls heat generation of the heater 25 by PWM control or PFM control for the switch SH. The duty ratio in PWM control or PFM control may be calculated by PID control. The MCU 71 may acquire the temperature of the heater 25 required for PID control from the output of the operational amplifier A1 or from the input to the PC6 terminal.
　また、ＭＣＵ７１は、スライダ１８が閉じられた状態でタクタイルスイッチ１５が長押しされることでＢＬＥによるペアリングを開始する。 Also, the MCU 71 starts pairing by BLE when the tactile switch 15 is pressed long while the slider 18 is closed.
　ケース着脱検出回路６３は、アウターケース３がエアロゾル生成装置あるいは電源ユニット１から取り外されたことを検出するホールＩＣである。ケース着脱検出回路６３の出力は、シュミットトリガー回路６４を介してパワースイッチドライバ回路７５のＳＷ２端子及びＭＣＵ７１のＰＤ２端子に供給される。開閉検出回路９５の出力は、ＭＣＵ７１のＰＣ１３端子に供給される。 The case attachment/detachment detection circuit 63 is a Hall IC that detects that the outer case 3 has been removed from the aerosol generator or power supply unit 1 . The output of the case attachment/detachment detection circuit 63 is supplied to the SW2 terminal of the power switch driver circuit 75 and the PD2 terminal of the MCU 71 via the Schmidt trigger circuit 64 . The output of the open/close detection circuit 95 is supplied to the PC13 terminal of the MCU71.
　ＢＬＥモジュール６２は、Ｂｌｕｅｔｏｏｔｈ（登録商標）などの近距離無線通信規格に準拠してスマートフォン、携帯電話、パーソナルコンピュータ等の外部機器と通信する機能をＭＣＵ７１に提供する通信モジュールである。なお、通信モジュールは、ＢＬＥに限らず、ＮＦＣ（Ｎｅａｒ Ｆｉｅｌｄ Ｃｏｍｍｕｎｉｃａｔｉｏｎ）や無線ＬＡＮ（Ｌｏｃａｌ Ａｒｅａ Ｎｅｔｗｏｒｋ）などの他の通信規格に準拠した通信インターフェースであってもよい。 The BLE module 62 is a communication module that provides the MCU 71 with the function of communicating with external devices such as smartphones, mobile phones, and personal computers in compliance with short-range wireless communication standards such as Bluetooth (registered trademark). Note that the communication module is not limited to BLE, and may be a communication interface conforming to other communication standards such as NFC (Near Field Communication) and wireless LAN (Local Area Network).
　第１のラッチ回路７８ａは、ヒータ２５のオーバーヒート時に充放電を停止するように出力を保持するフリップフロップ回路である。第１のラッチ回路７８ａは、好ましくは、Ｄ型のフリップフロップＩＣである。第２のラッチ回路７８ｂは、ヒータ２５のオーバーヒート時に当該オーバーヒートの発生を記憶するフリップフロップ回路である。第２のラッチ回路７８ｂは、好ましくは、Ｄ型のフリップフロップＩＣである。 The first latch circuit 78a is a flip-flop circuit that holds an output so as to stop charging and discharging when the heater 25 overheats. The first latch circuit 78a is preferably a D-type flip-flop IC. The second latch circuit 78b is a flip-flop circuit that stores the occurrence of overheating when the heater 25 overheats. The second latch circuit 78b is preferably a D-type flip-flop IC.
　本実施形態において、ＢＬＥ基板６に実装されるＬＥＤ６１のカソードは、ＢＬＥ基板６のグランドＧＮＤ６には接続されず、ＭＣＵ基板７のＭＣＵ７１に接続される。これにより、ＢＬＥ基板６のグランドを削減している。また、ＬＥＤ６１のアノードは、ＭＣＵ基板７のロードスイッチ７４ｃに接続され、電圧ＶＣＣ５が印加され、ＬＥＤ６１への放電がＭＣＵ７１により制御される。これにより、ＬＥＤへの放電に伴ってＢＬＥ基板６のグランドＧＮＤ６で発生するノイズ（グランド・ノイズ）がＢＬＥ基板６に与える影響を低減できるので、ＢＬＥモジュール６２による通信状態を良好な状態に保持できる。また、ＬＥＤ６１への放電を制御するＭＣＵ７１がＢＬＥ基板６とは別体のＭＣＵ基板７に実装されているので、放電制御によるノイズがＢＬＥモジュール６２に与える影響を低減できるので、ＢＬＥモジュール６２による通信状態を良好な状態に保持できる。 In this embodiment, the cathode of the LED 61 mounted on the BLE substrate 6 is connected to the MCU 71 of the MCU substrate 7 without being connected to the ground GND 6 of the BLE substrate 6 . Thereby, the ground of the BLE substrate 6 is reduced. Also, the anode of the LED 61 is connected to the load switch 74c of the MCU board 7, the voltage VCC5 is applied, and the discharge to the LED 61 is controlled by the MCU71. As a result, it is possible to reduce the influence of the noise (ground noise) generated at the ground GND6 of the BLE board 6 due to the discharge to the LED on the BLE board 6, so that the communication state of the BLE module 62 can be maintained in a good state. . In addition, since the MCU 71 that controls discharge to the LED 61 is mounted on the MCU board 7 that is separate from the BLE board 6, it is possible to reduce the influence of noise due to discharge control on the BLE module 62. You can keep it in good condition.
　［回路基板に実装される電子部品］
　次に、図１０から図１２Ｂを参照して、本実施形態のエアロゾル生成装置の電源ユニット１の回路基板に実装される電子部品について説明する。 [Electronic components mounted on circuit boards]
Next, electronic components mounted on the circuit board of the power supply unit 1 of the aerosol generating apparatus of this embodiment will be described with reference to FIGS. 10 to 12B.
　図１０は、本実施形態のエアロゾル生成装置の電源ユニット１のＢＬＥ基板６に実装される電子部品を示す図である。図１１Ａは、本実施形態のエアロゾル生成装置の電源ユニットのＭＣＵ基板に実装される電子部品を示す図である。図１１Ｂは、本実施形態のエアロゾル生成装置の電源ユニットのＭＣＵ基板に実装される電子部品を示す図である。図１２Ａは、本実施形態のエアロゾル生成装置の電源ユニットのＵＳＢ基板に実装される電子部品を示す図である。図１２Ｂは、本実施形態のエアロゾル生成装置の電源ユニットのＵＳＢ基板に実装される電子部品を示す図である。 FIG. 10 is a diagram showing electronic components mounted on the BLE board 6 of the power supply unit 1 of the aerosol generating device of this embodiment. FIG. 11A is a diagram showing electronic components mounted on the MCU board of the power supply unit of the aerosol generating device of this embodiment. FIG. 11B is a diagram showing electronic components mounted on the MCU board of the power supply unit of the aerosol generating device of this embodiment. FIG. 12A is a diagram showing electronic components mounted on the USB board of the power supply unit of the aerosol generating device of this embodiment. FIG. 12B is a diagram showing electronic components mounted on the USB board of the power supply unit of the aerosol generating device of this embodiment.
　図１０に示すように、ＢＬＥ基板６は、電子部品が実装される第１面６Ａと、第１面６Ａの裏側の第２面６Ｂ（不図示）を有する。ＢＬＥ基板６の第１面６Ａには、ＬＥＤ６１、ＢＬＥモジュール６２、ケース着脱検出回路６３、シュミットトリガー回路６４などのＩＣチップと、タクタイルスイッチ１５、水晶振動子１６１、コンデンサ１６２ａ～１６２ｈ、過電圧保護素子（ツェナーダイオード又はバリスタ）１６３ａ～１６３ｄ、抵抗１６４ａ～１６４ｃなどの回路や素子が実装される。ＢＬＥモジュール６２の通信状態を良好な状態に保持するための電子部品や回路基板の相互の配置関係については後述する。 As shown in FIG. 10, the BLE substrate 6 has a first surface 6A on which electronic components are mounted and a second surface 6B (not shown) on the back side of the first surface 6A. On the first surface 6A of the BLE substrate 6, IC chips such as an LED 61, a BLE module 62, a case attachment/detachment detection circuit 63, a Schmitt trigger circuit 64, a tactile switch 15, a crystal oscillator 161, capacitors 162a to 162h, and an overvoltage protection element. Circuits and elements such as (zener diodes or varistors) 163a to 163d and resistors 164a to 164c are mounted. The mutual layout relationship of electronic components and circuit boards for maintaining a good communication state of the BLE module 62 will be described later.
　図１１Ａ－１１Ｂに示すように、ＭＣＵ基板７は、電子部品が実装される第１面７Ａ（表面）と第１面７Ａの裏側の第２面７Ｂ（裏面）を有する。ＭＣＵ基板７の第１面７Ａには、ＭＣＵ７１、充電回路７２ａ、充電回路７２ａのリアクトル（パワーインダクタ）７２ｂ、ロードスイッチ回路７４ｂ、７４ｃ、第１の変圧回路７６ａ及びリアクトル７６ｂ、第２のラッチ回路７８ｂなどのＩＣチップと、ヒータサーミスタ２６の正側／負側コネクタ７９ａ、７９ｂ、その他の回路やＩＣや素子が実装される。 As shown in FIGS. 11A and 11B, the MCU board 7 has a first surface 7A (front surface) on which electronic components are mounted and a second surface 7B (back surface) behind the first surface 7A. MCU 71, charging circuit 72a, reactor (power inductor) 72b of charging circuit 72a, load switch circuits 74b and 74c, first transformer circuit 76a and reactor 76b, and second latch circuit are provided on first surface 7A of MCU substrate 7. IC chips such as 78b, positive/ negative connectors 79a and 79b of the heater thermistor 26, and other circuits, ICs, and elements are mounted.
　ＭＣＵ基板７の第２面７Ｂには、不揮発性メモリ（ＲＯＭ）７３、ロードスイッチ回路７４ａ、パワースイッチドライバ回路７５、ヒータサーミスタ２６の電圧検出回路７７ａ、ケースサーミスタ２９の電圧検出回路７７ｂ、第１のラッチ回路７８ａなどのＩＣチップと、パフサーミスタ２７の正側／負側コネクタ９０ａ、９０ｂ、ケースサーミスタ２９の正側／負側コネクタ９１ａ、９１ｂ、振動モータ２４のコネクタ９２、その他の回路やＩＣや素子が実装される。 On the second surface 7B of the MCU board 7, a nonvolatile memory (ROM) 73, a load switch circuit 74a, a power switch driver circuit 75, a voltage detection circuit 77a for the heater thermistor 26, a voltage detection circuit 77b for the case thermistor 29, a first IC chips such as the latch circuit 78a, the positive/ negative connectors 90a and 90b of the puff thermistor 27, the positive/ negative connectors 91a and 91b of the case thermistor 29, the connector 92 of the vibration motor 24, other circuits and ICs and devices are mounted.
　なお、ＭＣＵ基板７には、円形のスペーサ３３が形成されている。スペーサ３３は、ＭＣＵ基板７とＵＳＢ基板８とを位置決めするための位置決め用のネジ孔である。 A circular spacer 33 is formed on the MCU board 7 . The spacer 33 is a positioning screw hole for positioning the MCU board 7 and the USB board 8 .
　図１２Ａ－１２Ｂに示すように、ＵＳＢ基板８は、電子部品が実装される第１面８Ａ（表面）と第１面の裏側の第２面８Ｂ（裏面）を有する。ＵＳＢ基板８の第１面８Ａには、ＵＳＢコネクタ１９、第２の変圧回路８２ａのリアクトル（パワーインダクタ）８２ｂ、負極側バスバー２２ａのコネクタ８６ａ、正極側バスバー２２ｂのコネクタ８６ｂ、ヒータ２５の正側／負側コネクタ８７ａ、８７ｂ、バッテリサーミスタ２８の正側／負側コネクタ８８、ヒータ２５の負側スイッチ回路８９などが実装される。 As shown in FIGS. 12A and 12B, the USB board 8 has a first surface 8A (front surface) on which electronic components are mounted and a second surface 8B (back surface) behind the first surface. On the first surface 8A of the USB board 8, the USB connector 19, the reactor (power inductor) 82b of the second transformer circuit 82a, the connector 86a of the negative bus bar 22a, the connector 86b of the positive bus bar 22b, and the positive side of the heater 25 are provided. / Negative side connectors 87a and 87b, a positive/negative side connector 88 of the battery thermistor 28, a negative side switch circuit 89 of the heater 25, and the like are mounted.
　また、ＵＳＢ基板８の第２面８Ｂには、電池残量検出回路８１ａ、電池残量検出回路８１ａの電流検出回路８１ｂ、第２の変圧回路８２ａ、保護回路８３ａ、保護回路８３ａの電流検出回路８３ｂ、保護回路８３ａに制御される充放電遮断スイッチ８３ｃ、ヒータ電圧検出回路８４、ヒータ加熱用スイッチ回路８５、過電圧保護回路９３などが実装される。 Further, on the second surface 8B of the USB board 8, a battery level detection circuit 81a, a current detection circuit 81b of the battery level detection circuit 81a, a second transformer circuit 82a, a protection circuit 83a, and a current detection circuit of the protection circuit 83a are provided. 83b, a charge/discharge cutoff switch 83c controlled by the protection circuit 83a, a heater voltage detection circuit 84, a heater heating switch circuit 85, an overvoltage protection circuit 93, and the like are mounted.
　なお、ＵＳＢ基板８には、円形のスペーサ３３が形成されている。スペーサ３３は、ＭＣＵ基板７とＵＳＢ基板８とを位置決めするための位置決め用のネジ孔である。また、ＵＳＢ基板８の側縁部には、ＭＣＵ基板７に接続されたフレキシブル基板３１を接続するためのコネクタ３４が設けられている。 A circular spacer 33 is formed on the USB board 8 . The spacer 33 is a positioning screw hole for positioning the MCU board 7 and the USB board 8 . A connector 34 for connecting the flexible board 31 connected to the MCU board 7 is provided on the side edge of the USB board 8 .
　［ＢＬＥモジュールと電子部品と回路基板の配置関係］
　次に、図１から図１２Ｂに加えて、図１３～図１５を参照して、本実施形態のエアロゾル生成装置の電源ユニット１のＢＬＥモジュール６２と電子部品と回路基板の配置関係について説明する。 [Layout relationship between BLE module, electronic components, and circuit board]
Next, referring to FIGS. 13 to 15 in addition to FIGS. 1 to 12B, the layout relationship among the BLE module 62, the electronic components, and the circuit board of the power supply unit 1 of the aerosol generating apparatus of the present embodiment will be described.
　図１３は、ＢＬＥモジュール６２の金属部品、金属筐体、板金等の禁止エリア及び銅箔（導線）パターンの禁止エリアの説明図である。図１３の上側にはＢＬＥ基板６の全体像とその周囲の電子部品が示され、図１３の下側にはＢＬＥモジュール６２及びその周囲の拡大図が示されている。図１４は、図１Ａの１１－１１断面図である。 FIG. 13 is an explanatory diagram of a prohibited area for metal parts, a metal housing, sheet metal, etc., and a prohibited area for copper foil (conductor) patterns of the BLE module 62 . The upper side of FIG. 13 shows the overall image of the BLE board 6 and electronic components around it, and the lower side of FIG. 13 shows an enlarged view of the BLE module 62 and its surroundings. FIG. 14 is a cross-sectional view taken along line 11-11 of FIG. 1A.
　図１３に示すように、ＢＬＥモジュール６２は、一般的に集積回路部６２ａとアンテナ部６２ｂを有する。ＢＬＥモジュール６２をＢＬＥ基板６に実装する場合、ＢＬＥモジュール６２（特にアンテナ領域６２ｂ）に対する他の電子部品の影響を緩和するために、金属部品、金属筐体、板金等の禁止エリア（第１の禁止エリア）１００及び銅箔（導線）パターンの禁止エリア（第２の禁止エリア）１０１を確保することが望ましい。金属部品、金属筐体、板金等の禁止エリア（第１の禁止エリア）１００は、ＢＬＥ基板６のうちアンテナ領域６２ｂが実装される箇所の下方及び上方におけるエリアである。銅箔（導線）パターンの禁止エリア（第２の禁止エリア）１０１は、ＢＬＥ基板６のうちアンテナ領域の６２ｂの側方及び直下におけるエリアである。特に、第２の禁止エリア１０１ではＢＬＥ基板６の全ての層で銅箔（導線）パターンを用いないことが望ましいため、回路設計上の大きな制約となる。 As shown in FIG. 13, the BLE module 62 generally has an integrated circuit section 62a and an antenna section 62b. When mounting the BLE module 62 on the BLE board 6, in order to reduce the influence of other electronic components on the BLE module 62 (especially the antenna area 62b), prohibited areas (first It is desirable to secure a prohibited area) 100 and a prohibited area (second prohibited area) 101 of the copper foil (conductor) pattern. A prohibited area (first prohibited area) 100 such as a metal part, a metal housing, or a sheet metal is an area below and above a portion of the BLE substrate 6 where the antenna region 62b is mounted. A copper foil (conductor) pattern prohibition area (second prohibition area) 101 is an area of the BLE substrate 6 on the side of and immediately below the antenna area 62b. In particular, in the second prohibited area 101, it is desirable not to use a copper foil (conductor) pattern in all layers of the BLE substrate 6, which is a major restriction in terms of circuit design.
　本実施形態においては、ＢＬＥ基板６におけるＢＬＥモジュール６２が実装される位置の周囲には、ＢＬＥモジュール６２の通信時のノイズの影響を回避するための第１の禁止エリア１００や第２の禁止エリア１０１が設けられている。 In this embodiment, around the position where the BLE module 62 is mounted on the BLE board 6, there are a first prohibited area 100 and a second prohibited area for avoiding the influence of noise during communication of the BLE module 62. 101 is provided.
　本実施形態では、ＢＬＥ基板６の側縁部にＢＬＥモジュール６２を実装することにより他の電子部品（ノイズ源となる可能性があるＬＥＤ６１、ケース着脱検出回路６３やシュミットトリガー回路６４、他の回路基板に実装されるＭＣＵ７１や第２の変圧回路８２ａや第１の変圧回路７６ａなど）の影響を緩和している。また、インナーケース２、アウターケース３及びシャシー４を利用してＢＬＥモジュール６２の第１の禁止エリア１００を創出すると共に、ＢＬＥ基板６をシャシー４により保持することで、ＢＬＥモジュール６２の第２の禁止エリア１０１を確保している。 In this embodiment, by mounting the BLE module 62 on the side edge of the BLE board 6, other electronic components (the LED 61, which may become a noise source, the case attachment/detachment detection circuit 63, the Schmidt trigger circuit 64, other circuits, etc.) The influence of the MCU 71 mounted on the substrate, the second transformer circuit 82a, the first transformer circuit 76a, etc.) is mitigated. In addition, by using the inner case 2, the outer case 3, and the chassis 4 to create the first prohibited area 100 for the BLE module 62, and by holding the BLE board 6 by the chassis 4, the second prohibited area 100 for the BLE module 62 is maintained. A prohibited area 101 is secured.
　第１の禁止エリア１００は、図１４に示すように、ＢＬＥモジュール６２上下方向の領域になる。第１の禁止エリア１００は、好ましくはＢＬＥモジュール６２上下方向の１０ｍｍ以上の領域になる。第２の禁止エリア１０１は、ＢＬＥモジュール６２のアンテナ部６２ｂの両側の領域と、ＢＬＥ基板６の全ての層のうちアンテナ部６２ｂにＢＬＥ基板６の厚さ方向で重なる領域になる。 The first prohibited area 100 is an area in the vertical direction of the BLE module 62, as shown in FIG. The first prohibited area 100 is preferably an area of 10 mm or more in the vertical direction of the BLE module 62 . The second prohibited area 101 is an area on both sides of the antenna section 62 b of the BLE module 62 and an area overlapping the antenna section 62 b among all layers of the BLE board 6 in the thickness direction of the BLE board 6 .
　図１０に示したように、ＢＬＥ基板６は、短手方向の相対する２辺を構成する第１の側縁部２０１及び第２の側縁部２０２と、長手方向の相対する２辺を構成する第３の側縁部２０３及び第４の側縁部２０４と、を含む、略長方形状である。 As shown in FIG. 10 , the BLE substrate 6 has a first side edge portion 201 and a second side edge portion 202 that form two opposite sides in the short direction, and two opposite sides in the longitudinal direction. It has a substantially rectangular shape including a third side edge portion 203 and a fourth side edge portion 204 .
　第１の側縁部２０１は略直線状である。第２の側縁部２０２は突出部２０２ａが形成されている。第３の側縁部２０３は略直線状に形成されている。第４の側縁部２０４には切り欠き部２０４ａ、２０４ｂが形成されている。第３の側縁部２０３は略直線状に形成されている。 The first side edge 201 is substantially linear. A protruding portion 202a is formed on the second side edge portion 202 . The third side edge portion 203 is formed substantially linearly. Notch portions 204a and 204b are formed in the fourth side edge portion 204 . The third side edge portion 203 is formed substantially linearly.
　第３の側縁部２０３は、シャシー４に近接して配置されている。第４の側縁部２０４の一部は、ＵＳＢ基板８の側縁部に近接して配置されている。 The third side edge 203 is arranged close to the chassis 4 . A portion of the fourth side edge 204 is positioned close to the side edge of the USB board 8 .
　ＢＬＥ基板６は、第１面６Ａに電子部品が実装され、第３の側縁部２０３及び第２面６Ｂがシャシー４に固定されている。ＢＬＥ基板６は、第２面６ＢがＭＣＵ基板７及びＵＳＢ基板８に近接し、第１面６Ａは第２面６Ｂの裏側であってＭＣＵ基板７及びＵＳＢ基板８から遠い位置にある。 The BLE board 6 has electronic components mounted on the first surface 6A, and the third side edge 203 and the second surface 6B are fixed to the chassis 4 . The BLE board 6 has a second surface 6B close to the MCU board 7 and the USB board 8 and a first surface 6A behind the second surface 6B and far from the MCU board 7 and the USB board 8 .
　ＢＬＥ基板６の第１面６Ａには、ＢＬＥモジュール６２以外に、能動部品、受動部品及び補助部品が実装されている。 Active components, passive components, and auxiliary components are mounted on the first surface 6A of the BLE board 6 in addition to the BLE module 62 .
　能動部品は、入力と出力を持ち、電圧を印加することで、入力と出力に一定の関係を持つ電子部品であり、ノイズ源となる可能性がある電子部品である。能動部品は、例えば、ＬＥＤ６１、ケース着脱検出回路（ホールＩＣ）６３、シュミットトリガー回路６４、過電圧保護素子（ツェナーダイオード又はバリスタ）１６３ａ～１６３ｄなどである。 An active component is an electronic component that has an input and an output, and by applying a voltage, has a certain relationship between the input and the output, and is an electronic component that can become a noise source. Active parts include, for example, an LED 61, a case attachment/detachment detection circuit (Hall IC) 63, a Schmitt trigger circuit 64, and overvoltage protection elements (Zener diodes or varistors) 163a to 163d.
　受動部品は、自身では機能しないが、能動部品と組み合わせることで機能する電子部品である。受動部品は、例えば、水晶振動子１６１、コンデンサ１６２ａ～１６２ｈ、抵抗１６４ａ～１６４ｃなどである。 Passive components are electronic components that do not function by themselves, but function in combination with active components. Passive components are, for example, a crystal oscillator 161, capacitors 162a-162h, and resistors 164a-164c.
　補助部品は、電気回路を通電状態にしたり、非通電状態にしたりする電子部品である。補助部品は、例えば、タクタイルスイッチ１５である。 Auxiliary parts are electronic parts that make an electric circuit energized or de-energized. Auxiliary components are, for example, tactile switches 15 .
　ＢＬＥ基板６の第１面６Ａには、ＬＥＤ６１、ケース着脱検出回路（ホールＩＣ）６３、シュミットトリガー回路６４、過電圧保護素子（ツェナーダイオード又はバリスタ）１６３ａ～１６３ｄなどの能動部品、タクタイルスイッチ１５などの補助部品が実装される。また、ＢＬＥ基板６の第１面６Ａには、水晶振動子１６１、コンデンサ１６２ａ～１６２ｈ、抵抗１６４ａ～１６４ｃなどの受動部品が実装される。 On the first surface 6A of the BLE substrate 6, active components such as an LED 61, a case attachment/detachment detection circuit (Hall IC) 63, a Schmitt trigger circuit 64, overvoltage protection elements (Zener diodes or varistors) 163a to 163d, and tactile switches 15, etc. Auxiliary parts are mounted. Passive components such as a crystal oscillator 161, capacitors 162a to 162h, and resistors 164a to 164c are mounted on the first surface 6A of the BLE substrate 6. FIG.
　また、ＢＬＥ基板６の第１面６Ａには、ＢＬＥモジュール６２と、ＬＥＤ６１などの電子部品、ケース着脱検出回路（ホールＩＣ）６３及びシュミットトリガー回路６４などのＩＣチップの間に電子部品が実装されない非実装領域１５０が設けられている。 Further, on the first surface 6A of the BLE substrate 6, no electronic parts are mounted between the BLE module 62, electronic parts such as the LED 61, and IC chips such as the case attachment/detachment detection circuit (Hall IC) 63 and the Schmitt trigger circuit 64. A non-mounting area 150 is provided.
　非実装領域１５０は、ＢＬＥ基板６の第１面６Ａにおける第１の側縁部２０１と第２の側縁部２０２の間の中央部分付近であって、第４の側縁部２０４の切り欠き部２０４ｂの一部と第３の側縁部２０３の間に設けられている。非実装領域１５０は、ＢＬＥ基板６の第１の側縁部２０１と略平行な第１の境界部１５１と、ＢＬＥ基板６の第２の側縁部２０２と略平行な第２の境界部１５２と、ＢＬＥ基板６の第４の側縁部２０４と略平行な第４の境界部１５４と、ＢＬＥ基板６の第３の側縁部２０３と略平行な第３の境界部１５３とを有する四角形部分を占める。第１の境界部１５１と第２の境界部１５２の長さは、第４の境界部１５４と第３の境界部１５３の長さよりも短い矩形状である。理解を容易にするため、図１０における非実装領域１５０は、ＢＬＥ基板６の第１面６Ａの他の部分とは区別された状態で図示されている点に留意されたい。非実装領域１５０は、ＢＬＥ基板６の第１面６Ａの一部であってよく、第１の境界部１５１から第４の境界部１５４は仮想の境界であってもよい。 The non-mounting region 150 is near the central portion between the first side edge portion 201 and the second side edge portion 202 on the first surface 6A of the BLE substrate 6, and is a notch of the fourth side edge portion 204. It is provided between part of the portion 204 b and the third side edge portion 203 . The non-mounting region 150 includes a first boundary portion 151 substantially parallel to the first side edge portion 201 of the BLE substrate 6 and a second boundary portion 152 substantially parallel to the second side edge portion 202 of the BLE substrate 6. , a fourth boundary portion 154 substantially parallel to the fourth side edge portion 204 of the BLE substrate 6, and a third boundary portion 153 substantially parallel to the third side edge portion 203 of the BLE substrate 6. occupy a part The lengths of the first boundary portion 151 and the second boundary portion 152 are shorter than the lengths of the fourth boundary portion 154 and the third boundary portion 153 in a rectangular shape. It should be noted that the non-mounting area 150 in FIG. 10 is shown separated from other portions of the first surface 6A of the BLE substrate 6 for easy understanding. The non-mounting area 150 may be part of the first surface 6A of the BLE substrate 6, and the first to fourth boundaries 151 to 154 may be virtual boundaries.
　非実装領域１５０は、平面視でＢＬＥモジュール６２の面積とケース着脱検出回路（ホールＩＣ）６３及びシュミットトリガー回路６４の面積のいずれかのうち大きい方の面積以上の面積を有する四角形部分を含む。非実装領域１５０の第３の境界部１５３の一部は、ＢＬＥ基板６の第３の側縁部２０３の一部と略一致する。 The non-mounting area 150 includes a rectangular portion having an area equal to or greater than the larger of the area of the BLE module 62 and the area of the case attachment/detachment detection circuit (Hall IC) 63 and Schmidt trigger circuit 64 in plan view. A portion of the third boundary portion 153 of the non-mounting region 150 substantially coincides with a portion of the third side edge portion 203 of the BLE substrate 6 .
　また、ＢＬＥ基板６は、非実装領域１５０とＢＬＥ基板６の第１の側縁部２０１の間の領域であって、ＢＬＥモジュール６２が実装される第１の領域６Ａ１と、非実装領域１５０とＢＬＥ基板６の第２の側縁部２０２の間の領域であって、ケース着脱検出回路（ホールＩＣ）６３及びシュミットトリガー回路６４などのＩＣチップが含まれる第２の領域６Ａ２とを含む。そして、第１の領域６Ａ１に含まれる能動部品（過電圧保護素子１６３ａ、１６３ｂ）の数（Ｍ）は、第２の領域６Ａ２に含まれる能動部品（ＬＥＤ６１、過電圧保護素子１６３ｃ～１６３ｄ）の数（Ｎ）より少なくなるように構成されている（Ｍ＜Ｎ）。 In addition, the BLE substrate 6 includes a first area 6A1, which is an area between the non-mounting area 150 and the first side edge portion 201 of the BLE substrate 6, where the BLE module 62 is mounted, and the non-mounting area 150. It is an area between the second side edges 202 of the BLE substrate 6 and includes a second area 6A2 including IC chips such as a case attachment/detachment detection circuit (Hall IC) 63 and a Schmidt trigger circuit 64. FIG. The number (M) of active components ( overvoltage protection elements 163a, 163b) included in the first area 6A1 is the number (M) of active components (LED 61, overvoltage protection elements 163c to 163d) included in the second area 6A2. N) (M<N).
　本実施形態では、第１の領域６Ａ１に含まれる能動部品は、過電圧保護素子１６３ａ、１６３ｂのみである。つまり、第１の領域６Ａ１に含まれる能動部品の数（Ｍ）は、２である。また、第２の領域６Ａ２に含まれる能動部品の数（Ｎ）は、２０である。なお、第１の領域６Ａ２に含まれる能動部品の数をゼロ、すなわち、能動部品が実装されない構成としてもよい。 In this embodiment, the only active components included in the first area 6A1 are the overvoltage protection elements 163a and 163b. That is, the number (M) of active components included in the first area 6A1 is two. The number (N) of active components included in the second area 6A2 is twenty. It should be noted that the number of active components included in the first area 6A2 may be zero, that is, the configuration may be such that no active components are mounted.
　ＢＬＥ基板６の第１の領域６Ａ１において、ＢＬＥモジュール６２は、アンテナ部６２ｂが第１の側縁部２０１に最も近い位置に配置され、アンテナ部６２ｂに隣接して集積回路部６２ａがアンテナ部６２ｂよりも第１の側縁部２０１から遠い位置に配置されている。 In the first region 6A1 of the BLE substrate 6, the BLE module 62 has the antenna portion 62b arranged closest to the first side edge portion 201, and the integrated circuit portion 62a adjacent to the antenna portion 62b. is arranged at a position farther from the first side edge 201 than.
　ＢＬＥモジュール６２の集積回路部６２ａは、アンテナ部６２ｂに隣接する第１の側面部ａ１と、第１の側面部ａ１と相対する位置にあって第１の側面部ａ１よりもアンテナ部６２ｂから遠い位置にある第２の側面部ａ２と、ＢＬＥ基板６の第３の側縁部２０３に近接する位置にある第３の側面部ａ３と第３の側面部ａ３と相対する位置にあって第３の側面部ａ３よりもＢＬＥ基板６の第４の側縁部２０４に近い位置にある第４の側面部ａ４と、を有する。 The integrated circuit portion 62a of the BLE module 62 has a first side portion a1 adjacent to the antenna portion 62b, and a position facing the first side portion a1 and farther from the antenna portion 62b than the first side portion a1. The second side face a2 at the position facing the third side face a3 at the position close to the third side edge 203 of the BLE substrate 6 and the third side face a3 at the position facing the third side face a3 and a fourth side surface portion a4 located closer to the fourth side edge portion 204 of the BLE substrate 6 than the side surface portion a3 of.
　ＢＬＥモジュール６２の集積回路部６２ａの第４の側面部ａ４とＢＬＥ基板６の第４の側縁部２０４との間には、ＢＬＥ基板６の第１の側縁部２０１から順に４個のコンデンサ１６２ａ～１６２ｄと１個の水晶振動子１６１とが集積回路部６２ａの第４の側面部ａ４の方向に沿って配列されている。また、ＢＬＥモジュール６２の集積回路部６２ａの第２の側面部ａ２と非実装領域１５０の第１の境界部１５１との間には、非実装領域１５０の第１の境界部５１に近い方から順に２個のコンデンサ１６２ｅ、１６２ｆと２個の過電圧保護素子１６３ａ、１６３ｂが集積回路部６２ａの第３の側面部ａ３の方向に沿って配列されている。２個のコンデンサ１６２ｅ、１６２ｆ及び２個の過電圧保護素子１６３ａ、１６３ｂは、ＢＬＥ基板６の第１の側縁部２０１の方向に離間して配置されている。また、非実装領域１５０の第１の境界部１５１とＢＬＥ基板６の第３の側縁部２０３に近接してタクタイルスイッチ１５が配置されている。 Between the fourth side surface portion a4 of the integrated circuit portion 62a of the BLE module 62 and the fourth side edge portion 204 of the BLE substrate 6, four capacitors are arranged in order from the first side edge portion 201 of the BLE substrate 6. 162a to 162d and one crystal oscillator 161 are arranged along the direction of the fourth side surface portion a4 of the integrated circuit portion 62a. Also, between the second side surface portion a2 of the integrated circuit portion 62a of the BLE module 62 and the first boundary portion 151 of the non-mounting region 150, from the side closer to the first boundary portion 51 of the non-mounting region 150, Two capacitors 162e and 162f and two overvoltage protection elements 163a and 163b are arranged in order along the direction of the third side surface a3 of the integrated circuit section 62a. The two capacitors 162e, 162f and the two overvoltage protection elements 163a, 163b are spaced apart in the direction of the first side edge 201 of the BLE substrate 6. FIG. Also, the tactile switch 15 is arranged close to the first boundary portion 151 of the non-mounting area 150 and the third side edge portion 203 of the BLE substrate 6 .
　ＢＬＥ基板６の第２の領域６Ａ２において、８個のＬＥＤ６１は、非実装領域１５０の第２の境界部１５２からＢＬＥ基板６の第２の側縁部２０２に向けて、ＢＬＥ基板６の第３の側縁部２０３に沿うように所定の間隔で配列されている。 In the second area 6A2 of the BLE substrate 6, the eight LEDs 61 are arranged from the second boundary portion 152 of the non-mounting area 150 toward the second side edge portion 202 of the BLE substrate 6 toward the third LED 61 of the BLE substrate 6. are arranged at predetermined intervals along the side edges 203 of the .
　また、非実装領域１５０の第４の境界部１５４とＢＬＥ基板６の第４の側縁部２０４の間には、３個の過電圧保護素子１６３ｃと１個のコンデンサ１６２ｇが、非実装領域１５０の第４の境界部１５４及びＢＬＥ基板６の第４の側縁部２０４に沿って実装されている。 In addition, between the fourth boundary portion 154 of the non-mounting region 150 and the fourth side edge portion 204 of the BLE substrate 6, three overvoltage protection elements 163c and one capacitor 162g are provided in the non-mounting region 150. It is mounted along the fourth border 154 and the fourth side edge 204 of the BLE substrate 6 .
　また、非実装領域１５０の第２の境界部１５２とＢＬＥ基板６の第２の側縁部２０２の間であって、ＢＬＥ基板６の第４の側縁部２０４と８個のＬＥＤ６１の間には、非実装領域１５０の第２の境界部１５２からＢＬＥ基板６の第２の側縁部２０２に向けて、１個のコンデンサ１６２ｇ、３個の抵抗１６４ａ、９個の過電圧保護素子１６３ｄ、３個の抵抗１６４ｂ、シュミットトリガー回路６４、ケース着脱検出回路（ホールＩＣ）６３、２個のコンデンサ１６２ｈ、３個の抵抗１６４ｃが実装されている。 Also, between the second boundary portion 152 of the non-mounting area 150 and the second side edge portion 202 of the BLE substrate 6 and between the fourth side edge portion 204 of the BLE substrate 6 and the eight LEDs 61 , one capacitor 162g, three resistors 164a, nine overvoltage protection elements 163d, 3 A resistor 164b, a Schmidt trigger circuit 64, a case attachment/detachment detection circuit (Hall IC) 63, two capacitors 162h, and three resistors 164c are mounted.
　９個の過電圧保護素子１６３ｄは、ＢＬＥ基板６の第４の側縁部２０４に近い方から５個の過電圧保護素子と４個の過電圧保護素子がＢＬＥ基板６の第４の側縁部２０４に沿って平行に配置されている。ケース着脱検出回路（ホールＩＣ）６３とシュミットトリガー回路６４と２個のコンデンサ１６２ｈは、ＢＬＥ基板６の第４の側縁部２０４に近い方からケース着脱検出回路（ホールＩＣ）６３とシュミットトリガー回路６４がＢＬＥ基板６の第４の側縁部２０４に沿って配置され、ケース着脱検出回路６３及びシュミットトリガー回路と２個のコンデンサ１６２ｈが、ＢＬＥ基板６の第４の側縁部２０４に沿って平行に配置されている。 The nine overvoltage protection elements 163 d are arranged on the fourth side edge 204 of the BLE substrate 6 , five overvoltage protection elements and four overvoltage protection elements from the side closest to the fourth side edge 204 of the BLE substrate 6 . are arranged parallel to each other. The case attachment/detachment detection circuit (Hall IC) 63, the Schmidt trigger circuit 64, and the two capacitors 162h are connected from the side near the fourth side edge 204 of the BLE substrate 6. 64 are arranged along the fourth side edge 204 of the BLE board 6 , and the case attachment/detachment detection circuit 63 and the Schmitt trigger circuit and two capacitors 162 h are arranged along the fourth side edge 204 of the BLE board 6 . arranged in parallel.
　以下に、本実施形態のＢＬＥモジュール６２の通信状態を良好な状態に保持するための構成及び作用効果について説明する。 The configuration and effects for maintaining a good communication state of the BLE module 62 of this embodiment will be described below.
　図１０に示すように、ＢＬＥモジュール６２は、アンテナ部６２ｂがＢＬＥ基板６の第１の側縁部２０１に最も近接し、アンテナ部６２ｂに隣接して集積回路部６２ａがアンテナ部６２ｂより第１の側縁部２０１から遠い位置に配置されている。ＢＬＥモジュール６２は、第１の側縁部２０１に向けて集積回路部６２ａ、アンテナ部６２ｂの順に並ぶように配置されている。換言すると、ＢＬＥモジュール６２に最も近いＢＬＥ基板６の第１の側縁部２０１に対し、集積回路部６２ａ、アンテナ部６２ｂの順に並ぶ。すなわち、ＢＬＥ基板６の側縁部のうちＢＬＥジュールに最も近い第１の側縁部２０１は、ＢＬＥモジュール６２の集積回路部６２ａよりもアンテナ部６２ｂに近い位置にある。 As shown in FIG. 10, in the BLE module 62, the antenna portion 62b is closest to the first side edge portion 201 of the BLE substrate 6, and adjacent to the antenna portion 62b, the integrated circuit portion 62a is located first from the antenna portion 62b. is located far from the side edge 201 of the . The BLE module 62 is arranged so that the integrated circuit portion 62 a and the antenna portion 62 b are arranged in this order toward the first side edge portion 201 . In other words, the integrated circuit section 62 a and the antenna section 62 b are arranged in this order with respect to the first side edge 201 of the BLE substrate 6 closest to the BLE module 62 . That is, of the side edges of the BLE substrate 6 , the first side edge 201 closest to the BLE module is located closer to the antenna section 62 b than the integrated circuit section 62 a of the BLE module 62 .
　上述したようにＢＬＥモジュール６２による通信状態に影響を及ぼさないように、ＢＬＥモジュール６２のアンテナ部６２ｂの周囲、直上及び直下には銅箔（導線）パターンを設けないことが望ましい。換言すると、ＢＬＥモジュール６２のアンテナ部６２ｂをＢＬＥ基板６の中央やその近傍に実装した場合、ＢＬＥ基板６の形状や他の電子部品の実装に大きな制約となってしまうが、ＢＬＥ基板６の側縁部に近づけてＢＬＥモジュール６２のアンテナ部６２ｂを実装することで、このような制約を除くことができる。 As described above, in order not to affect the communication state of the BLE module 62, it is desirable not to provide a copper foil (conductor) pattern around, directly above, or directly below the antenna section 62b of the BLE module 62. In other words, when the antenna part 62b of the BLE module 62 is mounted in the center or near the BLE board 6, the shape of the BLE board 6 and the mounting of other electronic components are greatly restricted. Such restrictions can be removed by mounting the antenna section 62b of the BLE module 62 close to the edge.
　そして、本実施形態によれば、回路基板の形状を決定する際やＢＬＥモジュール６２以外の電子部品を実装する際に大きな自由度を持たせることができるので、エアロゾル生成装置のコストやサイズを低減することができる。 Further, according to this embodiment, a large degree of freedom can be given when determining the shape of the circuit board and when mounting electronic components other than the BLE module 62, so the cost and size of the aerosol generating device can be reduced. can do.
　また、ＢＬＥ基板６の側縁部のうちＢＬＥジュールに最も近い第１の側縁部２０１が他の電子部品よりもアンテナ部６２ｂの近い位置にある構成を言い換えると、ＢＬＥ基板６の第１の側縁部２０１とＢＬＥモジュール６２の間の距離は、ＢＬＥ基板６の第１の側縁部２０１と他の電子部品の間の距離より短い。また、ＢＬＥモジュール６２のアンテナ部６２ｂは、ＢＬＥ基板６の第１の側縁部２０１と重ねてもよい。この構成によれば、電子部品に銅箔（導線）パターンを接続するに際に、ＢＬＥモジュール６２のアンテナ部６２ｂの周囲及び直下を迂回するなどの複雑な配線パターンが不要になる。これにより、回路基板の形状を決定する際やＢＬＥモジュール６２以外の電子部品を実装する際に大きな自由度を持たせることができ、エアロゾル生成装置のコストやサイズを低減することができる。 Further, of the side edges of the BLE board 6, the first side edge 201 closest to the BLE module is closer to the antenna part 62b than the other electronic components. The distance between the side edge 201 and the BLE module 62 is shorter than the distance between the first side edge 201 of the BLE board 6 and other electronic components. Also, the antenna portion 62 b of the BLE module 62 may overlap the first side edge portion 201 of the BLE substrate 6 . This configuration eliminates the need for a complicated wiring pattern such as detouring around and directly under the antenna section 62b of the BLE module 62 when connecting the copper foil (conductor) pattern to the electronic component. Thereby, a large degree of freedom can be given when determining the shape of the circuit board and when mounting electronic components other than the BLE module 62, and the cost and size of the aerosol generating device can be reduced.
　また、ＢＬＥモジュール６２のアンテナ部６２ｂは、ＢＬＥ基板６の第１の側縁部２０１から所定の微小量（例えば、１ｍｍ未満）だけ外方へ突出してもよい。すなわち、アンテナ部６２ｂの一部は、ＢＬＥモジュール６２の第１の側縁部２０１からＢＬＥ基板６の外部へ露出してもよい。この構成によれば、回路基板の面積を有効活用できるようになるので、多くの電子部品を回路基板に実装するなど、回路基板の形状を決定する際やＢＬＥモジュール６２以外の電子部品を実装する際に大きな自由度を持たせることができ、エアロゾル生成装置のコストやサイズを低減することができる。 Also, the antenna section 62b of the BLE module 62 may protrude outward from the first side edge section 201 of the BLE substrate 6 by a predetermined minute amount (for example, less than 1 mm). That is, part of the antenna section 62 b may be exposed to the outside of the BLE board 6 from the first side edge section 201 of the BLE module 62 . According to this configuration, the area of the circuit board can be effectively used, so it is possible to determine the shape of the circuit board and mount electronic components other than the BLE module 62, such as mounting many electronic components on the circuit board. A large degree of freedom can be given in practice, and the cost and size of the aerosol generator can be reduced.
　また、ＢＬＥ基板６は、ＢＬＥモジュール６２が実装される第１面６Ａの裏側の第２面６Ｂがシャシー４により固定される。そして、ＢＬＥ基板６の第１面６Ａと垂直な方向において、シャシー４、ＢＬＥ基板６、アンテナ部６２ｂの順に配置される。この構成によれば、銅箔（導線）パターンなどの金属の存在が望ましくないアンテナ部６２ｂの下方の空間を、絶縁性及び剛性のあるシャシー４で占めることになる。これにより、落下などの不測の事態が生じてもアンテナ部６２ｂの領域に金属が侵入することを抑制できるので、ＢＬＥモジュール６２による通信の途絶が発生し難い構成を実現できる。 In addition, the BLE board 6 is fixed by the chassis 4 at the second surface 6B behind the first surface 6A on which the BLE module 62 is mounted. Then, in the direction perpendicular to the first surface 6A of the BLE substrate 6, the chassis 4, the BLE substrate 6, and the antenna section 62b are arranged in this order. According to this configuration, the space below the antenna section 62b, where the presence of metal such as a copper foil (conductor) pattern is undesirable, is occupied by the chassis 4 having insulating properties and rigidity. As a result, it is possible to prevent metal from entering the area of the antenna section 62b even if an unexpected situation such as a fall occurs, so that a configuration in which communication interruption by the BLE module 62 is unlikely to occur can be realized.
　さらに、シャシー４は、ＢＬＥ基板６の第３の側縁部２０３を固定し、ＢＬＥ基板６の第１面６Ａと平行な方向において、アンテナ部６２ｂとシャシー４が隣接している。このように、銅箔（導線）パターンなどの金属の存在が望ましくないアンテナ部６２ｂの側方の空間を、絶縁性及び剛性のあるシャシー４で占めることになる。これにより、落下などの不測の事態が生じてもアンテナ部６２ｂの領域に金属が侵入することを抑制できるので、ＢＬＥモジュール６２による通信の途絶が発生し難い構成を実現できる。 Further, the chassis 4 fixes the third side edge portion 203 of the BLE substrate 6, and the antenna portion 62b and the chassis 4 are adjacent in the direction parallel to the first surface 6A of the BLE substrate 6. Thus, the chassis 4 having insulation and rigidity occupies the space on the side of the antenna section 62b where the presence of metal such as copper foil (conductor) patterns is undesirable. As a result, it is possible to prevent metal from entering the area of the antenna section 62b even if an unexpected situation such as a fall occurs, so that a configuration in which communication interruption by the BLE module 62 is unlikely to occur can be realized.
　さらに、ＢＬＥ基板６は、シャシー４に固定されない第４の側縁部２０４に切り欠き部２０４ａ、２０４ｂが設けられている。そして、ＢＬＥモジュール６２のアンテナ部６２ｂは、ＢＬＥ基板６の第１面６Ａと平行な方向において、シャシー４が隣接する第３の側面部ｂ３とシャシー４が隣接しない第４の側面部ｂ４とを含み、第４の側面部ｂ４が第３の側面部ｂ３よりも切り欠き部２０４ａに近接している。この構成によれば、ＢＬＥモジュール６２のアンテナ部６２ｂの側方の全てをシャシー４で占める必要がなくなる。また、シャシー４に近接していない側方は金属の存在が望ましくないことから、ＢＬＥ基板６に切り欠き部２０４ａを設けることで、シャシー４や回路基板の作製に使用する素材の量が減り、装置のコストを低減できる。 Furthermore, the BLE board 6 is provided with cutouts 204 a and 204 b on a fourth side edge 204 that is not fixed to the chassis 4 . The antenna portion 62b of the BLE module 62 has a third side portion b3 adjacent to the chassis 4 and a fourth side portion b4 not adjacent to the chassis 4 in the direction parallel to the first surface 6A of the BLE board 6. Including, the fourth side portion b4 is closer to the notch portion 204a than the third side portion b3. This configuration eliminates the need for the chassis 4 to occupy the entire side of the antenna section 62 b of the BLE module 62 . In addition, since the presence of metal on the sides that are not close to the chassis 4 is not desirable, by providing the notch 204a in the BLE substrate 6, the amount of material used for manufacturing the chassis 4 and the circuit board can be reduced. Equipment costs can be reduced.
　また、図１４に示すように、ＢＬＥモジュール６２のアンテナ部６２ｂの第１面６Ａと略垂直な方向に他の回路基板が配置されていない。この構成によれば、銅箔（導線）パターンなどの金属の存在が望ましくないアンテナ部６２ｂの上方の空間に、回路基板が設けられないので、ＢＬＥモジュール６２による通信の途絶が発生し難い構成を実現できる。 Further, as shown in FIG. 14, no other circuit board is arranged in a direction substantially perpendicular to the first surface 6A of the antenna section 62b of the BLE module 62. According to this configuration, a circuit board is not provided in the space above the antenna section 62b where the presence of metal such as a copper foil (conductor) pattern is not desirable. realizable.
　また、ＢＬＥモジュール６２のアンテナ部６２ｂの第１面６Ａと略垂直な方向にアンテナ部６２ｂに近接してインナーケース２が配置されている。この構成によれば、銅箔（導線）パターンなどの金属の存在が望ましくないアンテナ部６２ｂの上方の空間を、絶縁性のカバーで占めることができる。これにより、落下などの不測の事態が生じてもアンテナ部６２ｂの領域に金属が侵入することが抑制されるので、ＢＬＥモジュール６２による通信の途絶が発生し難い構成を実現できる。 In addition, the inner case 2 is arranged close to the antenna portion 62b of the BLE module 62 in a direction substantially perpendicular to the first surface 6A of the antenna portion 62b. According to this configuration, the insulating cover can occupy the space above the antenna section 62b where the presence of metal such as a copper foil (conductor) pattern is undesirable. This prevents metal from entering the region of the antenna section 62b even if an unexpected event such as a drop occurs, so that a configuration in which communication interruption by the BLE module 62 is unlikely to occur can be realized.
　また、ＢＬＥ基板６の第１面６Ａと略垂直な方向において、インナーケース２の上方にアウターケース３が配置され、アウターケース３がインナーケース２を覆う。この構成によれば、ＢＬＥモジュール６２のアンテナ部６２ｂの領域はインナーケース２とアウターケース３により二重で遮蔽されることになるので、銅箔（導線）パターンなどの金属の存在が望ましくないアンテナ部６２ｂの上方の空間が、インナーケース２とアウターケース３によって占められる。また、２つのカバーの存在により外来ノイズがアンテナ部６２ｂの領域に到達しにくくなるので、ＢＬＥモジュール６２による通信の途絶が発生し難い構成を実現できる。 In addition, the outer case 3 is arranged above the inner case 2 in a direction substantially perpendicular to the first surface 6A of the BLE board 6, and the outer case 3 covers the inner case 2. According to this configuration, the area of the antenna part 62b of the BLE module 62 is double shielded by the inner case 2 and the outer case 3, so the presence of metal such as a copper foil (conductor) pattern is undesirable for the antenna. A space above the portion 62b is occupied by the inner case 2 and the outer case 3. As shown in FIG. In addition, since the presence of the two covers makes it difficult for external noise to reach the area of the antenna section 62b, it is possible to realize a configuration in which interruption of communication by the BLE module 62 is unlikely to occur.
　また、アウターケース３に設けられたマグネット１１ｂと、マグネット１１ｂと磁気結合するシャシー４に設けられたマグネット１１ａとがＢＬＥモジュール６２から所定距離だけ離間して配置されている。これにより、ユーザの好みに応じてアウターケース３を容易に交換可能としつつ、そのために必要なマグネット１１ａ、１１ｂによって生成される磁場がＢＬＥモジュール６２による通信に影響を及ぼしにくくなる。従って、装置の商品性を向上しつつ、ＢＬＥモジュール６２による通信の途絶が発生し難い構成を実現できる。 Also, the magnet 11b provided on the outer case 3 and the magnet 11a provided on the chassis 4 magnetically coupled with the magnet 11b are arranged apart from the BLE module 62 by a predetermined distance. As a result, the outer case 3 can be easily replaced according to the user's preference, and the magnetic field generated by the magnets 11 a and 11 b required for that purpose is less likely to affect communication by the BLE module 62 . Therefore, it is possible to realize a configuration in which disruption of communication by the BLE module 62 is unlikely to occur while improving the marketability of the device.
　また、本実施形態においては、ＢＬＥ基板６における、ＢＬＥモジュール６２の集積回路部６２ａの周辺に受動部品１６１、１６２ａ～１６２ｆを優先して配置している。そして、ＢＬＥモジュール６２から受動部品１６１、１６２ａ～１６２ｆまでの距離がＢＬＥモジュール６２から能動部品１６３ａ、１６３ｂまでの距離よりも短くなるように配置されている。詳しくは、複数の受動部品のうちＢＬＥモジュール６２に最も近い最近受動部品１６１、１６２ａ～１６２ｆとＢＬＥモジュール６２の間の距離が複数の能動部品のうちＢＬＥモジュール６２に最も近い最近能動部品１６３ａ、１６３ｂとＢＬＥモジュール６２の間の距離よりも短くなるように電子部品が配置されている。この構成によれば、ノイズ源になる可能性がある能動部品よりも受動部品がＢＬＥモジュール６２の近くに配置されることにより、ＢＬＥモジュール６２が能動部品で発生するノイズの影響を受けにくくなるので、ＢＬＥモジュール６２による良好な通信が可能になる。 Also, in this embodiment, the passive components 161 and 162a to 162f are preferentially arranged around the integrated circuit portion 62a of the BLE module 62 on the BLE substrate 6. FIG. The distances from the BLE module 62 to the passive components 161, 162a to 162f are arranged to be shorter than the distances from the BLE module 62 to the active components 163a, 163b. Specifically, the distance between the closest passive components 161, 162a to 162f closest to the BLE module 62 among the plurality of passive components and the BLE module 62 is the closest active components 163a, 163b closest to the BLE module 62 among the plurality of active components. and the BLE module 62. According to this configuration, the passive components are arranged closer to the BLE module 62 than the active components that may become noise sources, so that the BLE module 62 is less susceptible to noise generated by the active components. , BLE module 62 allows good communication.
　なお、最近能動部品１６３ａ、１６３ｂは、常時機能している素子ではなく、異常時に機能する電子部品（ツェナーダイオード又はバリスタ）を含むため、定常的にノイズを発生しない。このような弱いノイズ源だけＢＬＥモジュール６２の近くに配置することで、そのように配置しない場合と比べて、電子部品を実装する際に大きな自由度を持たせることができるので、エアロゾル生成装置のコストやサイズを低減できる。 It should be noted that the recent active components 163a and 163b include electronic components (Zener diodes or varistors) that function in an abnormal state, rather than elements that function all the time, so they do not constantly generate noise. By arranging only such a weak noise source near the BLE module 62, it is possible to have a greater degree of freedom in mounting electronic components than when not arranging such a noise source. Cost and size can be reduced.
　また、複数の受動部品１６１、１６２ａ～１６２ｆでＢＬＥモジュール６２の周囲を取り囲んでいる。複数の受動部品１６１、１６２ａ～１６２ｆは、ＢＬＥモジュール６２の集積回路部６２ａの第４の側面部ａ４とＢＬＥ基板６の第４の側縁部２０４の間に実装される受動部品１６１、１６２ａ～１６２ｄと、ＢＬＥモジュール６２の集積回路部６２ａの第２の側面部ａ２と相対する位置に実装される受動部品１６２ｅ、１６２ｆとを含む。この構成によれば、複数の受動部品１６２ａ～１６２ｆをＢＬＥモジュール６２へ向くノイズに対する物理的な障壁として利用することができるので、ＢＬＥモジュール６２の通信状態を良好な状態に保持できる。 Also, the BLE module 62 is surrounded by a plurality of passive components 161, 162a to 162f. The plurality of passive components 161, 162a to 162f are mounted between the fourth side edge portion a4 of the integrated circuit portion 62a of the BLE module 62 and the fourth side edge portion 204 of the BLE substrate 6. 162d, and passive components 162e and 162f mounted at positions facing the second side surface portion a2 of the integrated circuit portion 62a of the BLE module 62. FIG. According to this configuration, since the plurality of passive components 162a to 162f can be used as physical barriers against noise directed toward the BLE module 62, the communication state of the BLE module 62 can be maintained in good condition.
　また、ＢＬＥ基板６の第１の領域６Ａ１において、複数の受動部品１６１、１６２ａ～１６２ｆのうち体積が最小でない特定の受動部品（容量が最小でないコンデンサ１６２ｆ）を、ＢＬＥモジュール６２と最近能動部品１６３ａ、１６３ｂの間に配置する。最近能動部品１６３ａ、１６３ｂは、ＢＬＥモジュール６２の集積回路部６２ａの第２の側面部ａ２と相対する位置に実装され、特定の受動部品１６２ｆは、最近能動部品１６３ａ、１６３ｂよりもＢＬＥモジュール６２の集積回路部６２ａの第２の側面部ａ２の近くに実装され、かつ、複数の受動部品１６１、１６２ａ～１６２ｆのうち体積（容量）が最小の受動部品１６２ａよりも大きな体積（容量）を有する。この構成によれば、比較的大きめの体積（容量）を持つ受動部品１６２ｆをＢＬＥモジュール６２へのノイズに対する物理的な障壁として利用することができるので、ＢＬＥモジュール６２による通信の途絶が発生し難い構成を実現できる。 Further, in the first region 6A1 of the BLE board 6, a specific passive component (a capacitor 162f having a non-minimum capacitance) among the plurality of passive components 161 and 162a to 162f whose volume is not the smallest is combined with the BLE module 62 and the active component 163a. , 163b. The active components 163a and 163b are mounted at positions facing the second side surface portion a2 of the integrated circuit portion 62a of the BLE module 62, and the specific passive component 162f is mounted on the BLE module 62 more than the active components 163a and 163b. It is mounted near the second side surface a2 of the integrated circuit section 62a and has a larger volume (capacity) than the passive component 162a, which has the smallest volume (capacity) among the plurality of passive components 161, 162a to 162f. According to this configuration, since the passive component 162f having a relatively large volume (capacity) can be used as a physical barrier against noise to the BLE module 62, disruption of communication by the BLE module 62 is less likely to occur. configuration can be achieved.
　また、ＢＬＥモジュール６２の集積回路部６２ａの第３の側面部ａ３は、ＢＬＥ基板６における第３の側縁部２０３に近接した位置にあり、ＢＬＥ基板６の第３の側縁部２０３とＢＬＥモジュール６２の第３の側面部ａ３との間に電子部品は実装されていない。そして、ＢＬＥ基板６の第１面６Ａと略平行な方向において、ＢＬＥ基板６の第３の側縁部２０３とＢＬＥモジュール６２の第３の側面部ａ３がシャシー４に隣接した位置関係となっている。この構成によれば、銅箔（導線）パターンなどの金属の存在が望ましくないアンテナ部６２ｂの一側部の空間を、絶縁性及び剛性のあるシャシー４で占めることになり、落下などの不測の事態が生じてもアンテナ部６２ｂの領域への金属などの侵入を抑制でき、ＢＬＥモジュール６２による通信の途絶が発生し難い構成を実現できる。 In addition, the third side surface portion a3 of the integrated circuit portion 62a of the BLE module 62 is located close to the third side edge portion 203 of the BLE substrate 6, and the third side edge portion 203 of the BLE substrate 6 and the BLE No electronic component is mounted between the module 62 and the third side surface portion a3. Then, in a direction substantially parallel to the first surface 6A of the BLE board 6, the third side edge portion 203 of the BLE board 6 and the third side portion a3 of the BLE module 62 are in a positional relationship adjacent to the chassis 4. there is According to this configuration, the space on one side of the antenna portion 62b, where the presence of metal such as a copper foil (conductor) pattern is undesirable, is occupied by the chassis 4, which has insulating properties and rigidity. Even if a situation occurs, metal or the like can be prevented from entering the area of the antenna section 62b, and a configuration in which interruption of communication by the BLE module 62 is unlikely to occur can be realized.
　また、特定の受動部品１６２ｆとＢＬＥモジュール６２の間の距離は、特定の受動部品１６２ｆとＢＬＥモジュール６２以外のケース着脱検出回路（ホールＩＣ）６３及びシュミットトリガー回路６４などのＩＣチップの間の距離よりも短い構成となっている。この構成によれば、特定の受動部品１６２ｆをＢＬＥモジュール６２へのノイズに対する物理的な障壁として利用することができるので、ＢＬＥモジュール６２の通信状態を良好な状態に保持できる。 In addition, the distance between the specific passive component 162f and the BLE module 62 is the distance between the specific passive component 162f and the IC chip other than the BLE module 62, such as the case attachment/detachment detection circuit (Hall IC) 63 and the Schmidt trigger circuit 64. It has a shorter structure than According to this configuration, the specific passive component 162f can be used as a physical barrier against noise to the BLE module 62, so the communication state of the BLE module 62 can be maintained in good condition.
　また、ＢＬＥ基板６には、特定の受動部品１６２ｆとＢＬＥモジュール６２以外のケース着脱検出回路（ホールＩＣ）６３及びシュミットトリガー回路６４などのＩＣチップの間に電子部品が実装されない非実装領域１５０が設けられている。この構成によれば、ＢＬＥモジュール６２以外のＩＣチップ６３、６４をＢＬＥモジュール６２から十分に離して配置することができるので、他のＩＣチップ６３、６４に起因するノイズがＢＬＥモジュール６２に与える影響を低減し、ＢＬＥモジュール６２の通信状態を良好な状態に保持することができる。 In addition, the BLE substrate 6 has a non-mounting area 150 where electronic components are not mounted between the specific passive component 162f and IC chips other than the BLE module 62, such as a case attachment/detachment detection circuit (Hall IC) 63 and a Schmidt trigger circuit 64. is provided. According to this configuration, since the IC chips 63 and 64 other than the BLE module 62 can be sufficiently separated from the BLE module 62, the influence of noise caused by the other IC chips 63 and 64 on the BLE module 62 can be reduced, and the communication state of the BLE module 62 can be maintained in a good state.
　また、最近能動部品１６３ａ、１６３ｂとＢＬＥモジュール６２の間の距離は、最近能動部品１６３ａ、１６３ｂとＢＬＥモジュール６２以外の他のＩＣチップ６３、６４の間の距離より短い構成となっている。この構成によれば、能動部品よりもノイズ源になる可能性があるＢＬＥモジュール６２以外の他のＩＣチップ６３、６４をＢＬＥモジュール６２から十分に離して配置することができる。これにより、他のＩＣチップ６３，６４に起因するノイズがＢＬＥモジュール６２に与える影響を低減し、ＢＬＥモジュール６２の通信状態を良好な状態に保持することができる。 Also, the distance between the nearest active components 163a, 163b and the BLE module 62 is shorter than the distance between the nearest active components 163a, 163b and the IC chips 63, 64 other than the BLE module 62. According to this configuration, the IC chips 63 and 64 other than the BLE module 62, which may become noise sources more than the active components, can be placed sufficiently away from the BLE module 62. FIG. As a result, the influence of noise caused by other IC chips 63 and 64 on the BLE module 62 can be reduced, and the communication state of the BLE module 62 can be maintained in a good state.
　さらに、図７から図９Ｃに示すように、ノイズ源になる可能性があるＭＣＵ７１、第１の変圧回路（スイッチングレギュレータ）７６ａ及び第２の変圧回路（スイッチングレギュレータ）８２ａを、ＢＬＥ基板６とは別体のＭＣＵ基板７やＵＳＢ基板８に実装している。さらに、ＢＬＥモジュール６２を、ＭＣＵ７１、第１の変圧回路７６ａ及び第２の変圧回路８２ａから十分に離れた位置に実装している。さらに、ＢＬＥモジュール６２が実装されるＢＬＥ基板６の第１の側縁部２０１が、ＭＣＵ基板７及びＵＳＢ基板８の長手方向の中央部付近に位置するようにＭＣＵ基板７及びＵＳＢ基板８に対してオフセットして配置している。この構成によれば、ノイズ源になる可能性があるＭＣＵ７１、第１の変圧回路７６ａ及び第２の変圧回路８２ａからＢＬＥモジュール６２を十分に離すことができるので、ＢＬＥモジュール６２の通信状態を良好な状態に保持することができる。 Furthermore, as shown in FIGS. 7 to 9C, the MCU 71, the first transformer circuit (switching regulator) 76a, and the second transformer circuit (switching regulator) 82a, which may become noise sources, are separated from the BLE board 6. It is mounted on the separate MCU board 7 and USB board 8 . Furthermore, the BLE module 62 is mounted at a position sufficiently distant from the MCU 71, the first transformer circuit 76a and the second transformer circuit 82a. Furthermore, the first side edge portion 201 of the BLE board 6 on which the BLE module 62 is mounted is positioned near the central portion in the longitudinal direction of the MCU board 7 and the USB board 8 with respect to the MCU board 7 and the USB board 8 . are offset from each other. According to this configuration, the BLE module 62 can be sufficiently separated from the MCU 71, the first transformer circuit 76a, and the second transformer circuit 82a, which may become noise sources, so that the communication state of the BLE module 62 is improved. can be kept in good condition.
　さらに、ＭＣＵ７１がＭＣＵ基板７に実装され、第２の変圧回路８２ａがＵＳＢ基板８に実装され、かつ、ＢＬＥ基板６がＭＣＵ基板７及びＵＳＢ基板８から十分に離れた位置にあるので、互いにノイズ源になる可能性があるＭＣＵ７１と第２の変圧回路８２ａが離れた位置に配置されることで、一方が他方に与える影響を低減し、ＢＬＥモジュール６２の通信状態を良好な状態に保持し、エアロゾル生成装置の安定的な動作を実現できる。 Furthermore, since the MCU 71 is mounted on the MCU board 7, the second transformer circuit 82a is mounted on the USB board 8, and the BLE board 6 is sufficiently separated from the MCU board 7 and the USB board 8, noise By arranging the MCU 71 and the second transformer circuit 82a, which may be the source, in a distant position, the influence of one on the other is reduced, the communication state of the BLE module 62 is maintained in a good state, Stable operation of the aerosol generator can be realized.
　また、図１１Ａ－１１Ｂに示すように、ＭＣＵ基板７は、ＭＣＵ７１が実装される第１面７ＡがＭＣＵ７１が実装されない第２面７ＢよりもＢＬＥ基板６から遠い位置にある。換言すると、ＭＣＵ基板７は、ＭＣＵ７１が実装されない第２面７ＢがＭＣＵ７１が実装される第１面７ＡよりもＢＬＥ基板６に近い位置にある。この構成によれば、ノイズ源になる可能性があるＭＣＵ７１をＢＬＥモジュール６２からできる限り遠ざけることができるので、ＢＬＥモジュール６２の通信状態を良好な状態に保持することができる。また、本実施形態では、第２の変圧回路がＤＣ／ＤＣコンバータＩＣ８２ａ及びリアクトル（パワーインダクタ）８２ｂから構成されていると解釈することもできる。この場合、ＵＳＢ基板８は、第２の変圧回路を構成するＤＣ／ＤＣコンバータＩＣ８２ａとリアクトル８２ｂのうちリアクトル８２ｂが実装される第１面８Ａよりもリアクトル８２ｂが実装されない第２面８ＢがＢＬＥ基板６に近い位置にある。換言すると、ＵＳＢ基板８はリアクトル８２ｂが実装される第１面８Ａが、リアクトル８２ｂが実装されない第２面８ＢよりもＢＬＥ基板６から遠い位置（最も近くない位置）にある。ＤＣ／ＤＣコンバータＩＣ８２ａのスイッチング中はリアクトル８２ｂとその周囲に磁場が発生し、この磁場がＢＬＥモジュール６２に影響を及ぼす可能性がある。そこで、第２の変圧回路８２ａのリアクトル８２ｂをＢＬＥモジュール６２から十分に遠ざけることで、ＢＬＥモジュール６２の通信状態を良好な状態に保持することができる。 Also, as shown in FIGS. 11A and 11B, the MCU board 7 has a first surface 7A on which the MCU 71 is mounted at a position farther from the BLE substrate 6 than a second surface 7B on which the MCU 71 is not mounted. In other words, in the MCU board 7, the second surface 7B on which the MCU 71 is not mounted is closer to the BLE substrate 6 than the first surface 7A on which the MCU 71 is mounted. According to this configuration, the MCU 71, which may become a noise source, can be kept as far away from the BLE module 62 as possible, so that the communication state of the BLE module 62 can be maintained in a good state. Also, in this embodiment, it can be interpreted that the second transformer circuit is composed of the DC/DC converter IC 82a and the reactor (power inductor) 82b. In this case, the second surface 8B on which the reactor 82b is not mounted is the BLE substrate rather than the first surface 8A on which the reactor 82b is mounted. Located close to 6. In other words, the first surface 8A on which the reactor 82b is mounted on the USB substrate 8 is located farther (not the closest) from the BLE substrate 6 than the second surface 8B on which the reactor 82b is not mounted. A magnetic field is generated around the reactor 82 b during switching of the DC/DC converter IC 82 a , and this magnetic field may affect the BLE module 62 . Therefore, by sufficiently separating the reactor 82b of the second transformer circuit 82a from the BLE module 62, the communication state of the BLE module 62 can be maintained in a good state.
　また、第２の変圧回路を構成するＤＣ／ＤＣコンバータＩＣ８２ａとリアクトル８２ｂのうちＤＣ／ＤＣコンバータＩＣ８２ａがＵＳＢ基板８の第２面８Ｂに実装され、リアクトル８２ｂがＵＳＢ基板８の第１面８Ａに実装される。このようにスイッチング中に発熱するＤＣ／ＤＣコンバータＩＣ８２ａとリアクトル８２ｂがＵＳＢ基板８の異なる面に実装されることで、熱が局所的に集中しないようにできる。これにより、ＢＬＥモジュール６２が熱の影響を受けにくくなるので、ＢＬＥモジュール６２の通信状態を良好な状態に保持することができ、装置の耐久性を向上できる。 Among the DC/DC converter IC 82a and the reactor 82b that constitute the second transformer circuit, the DC/DC converter IC 82a is mounted on the second surface 8B of the USB board 8, and the reactor 82b is mounted on the first surface 8A of the USB board 8. Implemented. Mounting the DC/DC converter IC 82a and the reactor 82b, which generate heat during switching, on different surfaces of the USB substrate 8 in this way prevents heat from being concentrated locally. As a result, the BLE module 62 is less likely to be affected by heat, so the communication state of the BLE module 62 can be maintained in a good state, and the durability of the device can be improved.
　また、ＢＬＥ基板６とＭＣＵ基板７の間の距離は、ＢＬＥ基板６とＵＳＢ基板８の間の距離よりも遠い構成となっている。この構成によれば、ＭＣＵ７１と第２の変圧回路８２ａのうちよりノイズ源になる可能性が高いＭＣＵ７１がＢＬＥモジュール６２から離れているので、ＢＬＥモジュール６２の通信状態を良好な状態に保持することができる。 Also, the distance between the BLE board 6 and the MCU board 7 is longer than the distance between the BLE board 6 and the USB board 8 . According to this configuration, since the MCU 71, which is more likely to become a noise source than the MCU 71 and the second transformer circuit 82a, is away from the BLE module 62, the communication state of the BLE module 62 can be maintained in a good state. can be done.
　また、ＭＣＵ基板７はＭＣＵ７１が実装される第１面７ＡがＢＬＥ基板６から最も遠い位置にある。換言すると、ＭＣＵ基板７は、ＭＣＵ７１が実装されない第２面７Ｂが、ＭＣＵ７１が実装される第１面７ＡよりもＢＬＥ基板６に近い位置にある。この構成によれば、ノイズ源になる可能性があるＭＣＵ７１をＢＬＥモジュール６２から可能な限り遠い位置に実装することで、ＢＬＥモジュール６２の通信状態を良好な状態に保持することができる。 In addition, the first surface 7A of the MCU board 7 on which the MCU 71 is mounted is located farthest from the BLE board 6. In other words, the MCU board 7 has the second surface 7B on which the MCU 71 is not mounted, which is closer to the BLE substrate 6 than the first surface 7A on which the MCU 71 is mounted. According to this configuration, by mounting the MCU 71, which may become a noise source, at a position as far as possible from the BLE module 62, the communication state of the BLE module 62 can be maintained in a good state.
　なお、発明は上記の実施形態に制限されるものではなく、発明の要旨の範囲内で、種々の変形・変更が可能である。 The invention is not limited to the above embodiments, and various modifications and changes are possible within the scope of the invention.
　本願は、２０２１年５月１０日提出の日本国特許出願特願２０２１－０７９７５１を基礎として優先権を主張するものであり、その記載内容の全てを、ここに援用する。 This application claims priority based on Japanese Patent Application No. 2021-079751 filed on May 10, 2021, and the entire contents thereof are incorporated herein.
１...エアロゾル生成装置の電源ユニット
２...インナーケース（第１のパネル）
３...アウターケース（第２のパネル）
４...シャシー
５...加熱ユニット
６...第１の回路基板（ＢＬＥ基板）
６Ａ...第１の回路基板６の第１面
６Ａ１...第１の回路基板６の第１面６Ａの第１の領域
６Ａ２...第１の回路基板６の第１面６Ａの第２の領域
６Ｂ...第１の回路基板６の第２面
７...第２の回路基板（ＭＣＵ基板）
７Ａ...第２の回路基板７の第１面
７Ｂ...第２の回路基板７の第２面
８...第３の回路基板（ＵＳＢ基板）
８Ａ...第３の回路基板８の第１面
８Ｂ...第３の回路基板８の第２面
１０...バッテリ
１１ａ、１１ｂ...マグネット
２５...ヒータ
６１...ＬＥＤ
６２...ＢＬＥモジュール
６２ａ...ＢＬＥモジュール６２の集積回路部
６２ｂ...ＢＬＥモジュール６２のアンテナ部
ａ１...ＢＬＥモジュール６２の集積回路部６２ａの第１の側面部
ａ２...ＢＬＥモジュール６２の集積回路部６２ａの第２の側面部
ａ３...ＢＬＥモジュール６２の集積回路部６２ａの第３の側面部
ａ４...ＢＬＥモジュール６２の集積回路部６２ａの第４の側面部
ｂ１...ＢＬＥモジュール６２のアンテナ部６２ｂの第１の側面部
ｂ２...ＢＬＥモジュール６２のアンテナ部６２ｂの第２の側面部
ｂ３...ＢＬＥモジュール６２のアンテナ部６２ｂの第３の側面部
ｂ４...ＢＬＥモジュール６２のアンテナ部６２ｂの第４の側面部
６３...ケース着脱検出回路（ホールＩＣ）
６４...シュミットトリガー回路（インバータ）
７１...ＭＣＵ（コントローラ）
７６ａ...第１の変圧回路（ＤＣ／ＤＣコンバータＩＣ）
７６ｂ...リアクトル（パワーインダクタ）
８２ａ...第２の変圧回路（ＤＣ／ＤＣコンバータＩＣ）
８２ｂ...リアクトル（パワーインダクタ）
１５０...非実装領域
１５１...非実装領域１５０の第１の境界部
１５２...非実装領域１５０の第２の境界部
１５３...非実装領域１５０の第３の境界部
１５４...非実装領域１５０の第４の境界部
１６１...水晶振動子（受動部品）
１６２ａ～１６２ｈ...コンデンサ（受動部品）
１６３ａ～１６３ｄ...過電圧保護素子（ツェナーダイオード又はバリスタ、能動部品）
１６４ａ～１６４ｃ...抵抗（受動部品）
２０１...ＢＬＥ基板６の第１の側縁部
２０２...ＢＬＥ基板６の第２の側縁部
２０３...ＢＬＥ基板６の第３の側縁部
２０４...ＢＬＥ基板６の第４の側縁部
２０４ａ、２０４ｂ...切り欠き部 1... power supply unit of the aerosol generator 2... inner case (first panel)
3... Outer case (second panel)
4... Chassis 5... Heating unit 6... First circuit board (BLE board)
6A... First surface 6A1 of first circuit board 6... First region 6A2 of first surface 6A of first circuit board 6... First surface 6A of first circuit board 6 Second region 6B... Second surface 7 of first circuit board 6... Second circuit board (MCU board)
7A... First surface 7B of second circuit board 7... Second surface 8 of second circuit board 7... Third circuit board (USB board)
8A... First surface 8B of third circuit board 8... Second surface 10 of third circuit board 8... Battery 11a, 11b... Magnet 25... Heater 61... LED
62...BLE module 62a...Integrated circuit portion 62b of BLE module 62...Antenna portion a1 of BLE module 62...First side portion a2 of integrated circuit portion 62a of BLE module 62...BLE The second side portion a3 of the integrated circuit portion 62a of the module 62...the third side portion a4 of the integrated circuit portion 62a of the BLE module 62...the fourth side portion b1 of the integrated circuit portion 62a of the BLE module 62 ... the first side portion b2 of the antenna portion 62b of the BLE module 62 ... the second side portion b3 of the antenna portion 62b of the BLE module 62 ... the third side portion of the antenna portion 62b of the BLE module 62 b4... Fourth side part 63 of antenna part 62b of BLE module 62... Case attachment/detachment detection circuit (Hall IC)
64...Schmitt trigger circuit (inverter)
71...MCU (controller)
76a... First transformer circuit (DC/DC converter IC)
76b...Reactor (power inductor)
82a... Second transformer circuit (DC/DC converter IC)
82b...Reactor (power inductor)
150... Non-mounting area 151... First boundary 152 of non-mounting area 150... Second boundary 153 of non-mounting area 150... Third boundary 154 of non-mounting area 150 ...fourth boundary 161 of non-mounting area 150 ...crystal unit (passive component)
162a to 162h... Capacitors (passive components)
163a-163d... Overvoltage protection elements (zener diodes or varistors, active components)
164a to 164c... resistors (passive components)
201...first side edge of BLE board 6 202...second side edge of BLE board 6 203...third side edge of BLE board 6 204...of BLE board 6 Fourth side edges 204a, 204b... notches

Claims (13)

  1. 　外部機器と通信する通信モジュールと、
    　エアロゾル源を加熱するヒータを駆動するための電力を供給する電源と、
    　前記電源から前記ヒータへの電力の供給を制御するコントローラと、
    　前記通信モジュールと受動部品と能動部品とが実装される回路基板と、を備えるエアロゾル生成装置の電源ユニットであって、
    　前記受動部品のうち前記通信モジュールに最も近い所定の受動部品と前記通信モジュールの間の距離は、前記能動部品のうち前記通信モジュールに最も近い所定の能動部品と前記通信モジュールの間の距離よりも短いことを特徴とするエアロゾル生成装置の電源ユニット。     a communication module that communicates with an external device;
    a power supply that supplies power to drive a heater that heats the aerosol source;
    a controller that controls the supply of power from the power source to the heater;
    A power supply unit for an aerosol generator, comprising: a circuit board on which the communication module, passive components, and active components are mounted;
    A distance between a predetermined passive component closest to the communication module among the passive components and the communication module is greater than a distance between a predetermined active component closest to the communication module among the active components and the communication module. A power supply unit for an aerosol generator, characterized in that it is short.
  2. 　前記所定の能動部品は、常時機能していない電子部品であることを特徴とする請求項１に記載のエアロゾル生成装置の電源ユニット。 　The power supply unit of the aerosol generator according to claim 1, wherein the predetermined active component is an electronic component that does not always function.
  3. 　前記所定の能動部品は、異常時に機能する電子部品であることを特徴とする請求項１又は２に記載のエアロゾル生成装置の電源ユニット。 　The power supply unit of the aerosol generator according to claim 1 or 2, wherein the predetermined active component is an electronic component that functions in the event of an abnormality.
  4. 　前記所定の受動部品は、過電圧保護用のダイオードであることを特徴とする請求項２又は３に記載のエアロゾル生成装置の電源ユニット。 The power supply unit for an aerosol generator according to claim 2 or 3, wherein the predetermined passive component is a diode for overvoltage protection.
  5. 　前記通信モジュールは、第１の側面部と、前記第１の側面部とは異なる第２の側面部と、を含み、
    　前記受動部品は、前記第１の側面部と相対する位置に実装される第１の受動部品と、前記第２の側面部と相対する位置に実装される第２の受動部品と、を含むことを特徴とする請求項１から４のいずれか１項に記載のエアロゾル生成装置の電源ユニット。     the communication module includes a first side portion and a second side portion different from the first side portion;
    The passive components include a first passive component mounted at a position facing the first side surface and a second passive component mounted at a position facing the second side surface. The power supply unit for an aerosol generator according to any one of claims 1 to 4, characterized in that:
  6. 　前記所定の能動部品は、前記第２の側面部と相対する位置に実装され、
    　前記第２の受動部品は、前記所定の能動部品よりも前記第２の側面部の近くに実装され、前記受動部品のうち最も体積が小さい電子部品とは異なる受動部品であることを特徴とする請求項５に記載のエアロゾル生成装置の電源ユニット。     The predetermined active component is mounted at a position facing the second side surface,
    The second passive component is mounted closer to the second side surface than the predetermined active component, and is a passive component different from an electronic component having the smallest volume among the passive components. A power supply unit for an aerosol generator according to claim 5.
  7. 　前記所定の能動部品は、前記第２の側面部と相対する位置に実装され、
    　前記第２の受動部品は、前記所定の能動部品よりも前記第２の側面部の近くに実装され、前記受動部品に含まれるコンデンサのうち最小の容量を持つコンデンサよりも大きな容量を持つコンデンサであることを特徴とする請求項５に記載のエアロゾル生成装置の電源ユニット。     The predetermined active component is mounted at a position facing the second side surface,
    The second passive component is a capacitor mounted closer to the second side than the predetermined active component and having a larger capacity than a capacitor having a minimum capacity among capacitors included in the passive component. The power supply unit of the aerosol generator according to claim 5, characterized in that there is a
  8. 　前記通信モジュールは、前記第１の側面部及び前記第２の側面部とは異なる第３の側面部を含み、
    　前記電源ユニットは、
    　前記回路基板を保持する絶縁性のシャシーを備え、
    　前記第３の側面部と前記第３の側面部と相対する前記回路基板の側縁部の間に電子部品は実装されておらず、
    　前記回路基板の実装面と平行な方向において、前記第３の側面部と相対する前記回路基板の側縁部と前記シャシーが隣接していることを特徴とする請求項５に記載のエアロゾル生成装置の電源ユニット。     the communication module includes a third side portion different from the first side portion and the second side portion;
    The power supply unit
    comprising an insulating chassis that holds the circuit board;
    no electronic component is mounted between the third side face and a side edge of the circuit board facing the third side face,
    6. The aerosol generator according to claim 5, wherein the side edge of the circuit board facing the third side face and the chassis are adjacent in a direction parallel to the mounting surface of the circuit board. power supply unit.
  9. 　前記回路基板に実装される集積回路を備え、
    　前記所定の受動部品は、前記通信モジュールと前記集積回路の間に実装され、
    　前記所定の受動部品と前記通信モジュールの間の距離は、前記所定の受動部品と前記集積回路の間の距離よりも短いことを特徴とする請求項１から８のいずれか１項に記載のエアロゾル生成装置の電源ユニット。     An integrated circuit mounted on the circuit board,
    The predetermined passive component is mounted between the communication module and the integrated circuit,
    9. Aerosol according to any one of claims 1 to 8, characterized in that the distance between the given passive component and the communication module is shorter than the distance between the given passive component and the integrated circuit. Generator power unit.
  10. 　前記回路基板は、前記所定の受動部品と前記集積回路の間に電子部品が実装されない非実装領域を含むことを特徴とする請求項９に記載のエアロゾル生成装置の電源ユニット。 The power supply unit of the aerosol generating apparatus according to claim 9, wherein the circuit board includes a non-mounting area where electronic components are not mounted between the predetermined passive component and the integrated circuit.
  11. 　前記非実装領域は、前記通信モジュールと前記集積回路のうち面積が大きい方の面積以上の面積を有する四角形部分を含むことを特徴とする請求項１０に記載のエアロゾル生成装置の電源ユニット。 11. The power supply unit for an aerosol generating apparatus according to claim 10, wherein the non-mounting area includes a rectangular portion having an area equal to or larger than the area of the larger one of the communication module and the integrated circuit.
  12. 　前記四角形部分の境界部の一部は、前記回路基板の側縁部の一部と一致することを特徴とする請求項１１に記載のエアロゾル生成装置の電源ユニット。 The power supply unit for an aerosol generating device according to claim 11, wherein a part of the boundary of the square portion coincides with a part of the side edge of the circuit board.
  13. 　前記所定の能動部品は、前記通信モジュールと前記集積回路の間に実装され、
    　前記所定の能動部品と前記通信モジュールの間の距離は、前記所定の接能動部品と前記集積回路の間の距離より短いことを特徴とする請求項９から１２のいずれか１項に記載のエアロゾル生成装置の電源ユニット。     the predetermined active component is mounted between the communication module and the integrated circuit;
    13. Aerosol according to any one of claims 9 to 12, characterized in that the distance between the given active component and the communication module is smaller than the distance between the given contact active component and the integrated circuit. Generator power unit.
PCT/JP2021/043907 2021-05-10 2021-11-30 Power supply unit for aerosol generation device WO2022239275A1 (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004246503A (en) * 2003-02-12 2004-09-02 Fujitsu Ltd Device and method for calculating impedance of circuit board
WO2020213451A1 (en) * 2019-04-19 2020-10-22 株式会社村田製作所 Battery pack, non-combustion-type inhaler, electronic equipment and electric tool
JP2021003126A (en) * 2015-03-04 2021-01-14 アール・エイ・アイ・ストラテジック・ホールディングス・インコーポレイテッド Antenna for aerosol delivery device
JP6860732B1 (en) * 2020-07-09 2021-04-21 日本たばこ産業株式会社 Power supply unit of aerosol generator

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004246503A (en) * 2003-02-12 2004-09-02 Fujitsu Ltd Device and method for calculating impedance of circuit board
JP2021003126A (en) * 2015-03-04 2021-01-14 アール・エイ・アイ・ストラテジック・ホールディングス・インコーポレイテッド Antenna for aerosol delivery device
WO2020213451A1 (en) * 2019-04-19 2020-10-22 株式会社村田製作所 Battery pack, non-combustion-type inhaler, electronic equipment and electric tool
JP6860732B1 (en) * 2020-07-09 2021-04-21 日本たばこ産業株式会社 Power supply unit of aerosol generator

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