CN117320576A - Power supply unit for aerosol-generating device - Google Patents
Power supply unit for aerosol-generating device Download PDFInfo
- Publication number
- CN117320576A CN117320576A CN202180098134.XA CN202180098134A CN117320576A CN 117320576 A CN117320576 A CN 117320576A CN 202180098134 A CN202180098134 A CN 202180098134A CN 117320576 A CN117320576 A CN 117320576A
- Authority
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- China
- Prior art keywords
- power supply
- pin
- aerosol
- insulating film
- supply unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000443 aerosol Substances 0.000 claims abstract description 68
- 239000000758 substrate Substances 0.000 claims abstract description 66
- 230000015572 biosynthetic process Effects 0.000 claims description 8
- 230000005674 electromagnetic induction Effects 0.000 claims description 6
- 238000007599 discharging Methods 0.000 claims description 3
- 239000002344 surface layer Substances 0.000 abstract description 24
- 239000010410 layer Substances 0.000 description 80
- 239000003990 capacitor Substances 0.000 description 39
- 238000001514 detection method Methods 0.000 description 15
- 239000000796 flavoring agent Substances 0.000 description 15
- 235000019634 flavors Nutrition 0.000 description 15
- 230000003068 static effect Effects 0.000 description 15
- 230000005611 electricity Effects 0.000 description 14
- 238000010438 heat treatment Methods 0.000 description 14
- 230000002411 adverse Effects 0.000 description 13
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- 238000004891 communication Methods 0.000 description 12
- 230000004044 response Effects 0.000 description 10
- 230000000087 stabilizing effect Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 239000000523 sample Substances 0.000 description 6
- 230000006698 induction Effects 0.000 description 5
- 101150001853 CD63 gene Proteins 0.000 description 4
- 230000009471 action Effects 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 230000000149 penetrating effect Effects 0.000 description 4
- 241000208125 Nicotiana Species 0.000 description 3
- 235000002637 Nicotiana tabacum Nutrition 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 238000012790 confirmation Methods 0.000 description 3
- 239000003205 fragrance Substances 0.000 description 3
- 238000009499 grossing Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 230000006641 stabilisation Effects 0.000 description 3
- 238000011105 stabilization Methods 0.000 description 3
- 229920000742 Cotton Polymers 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000002485 combustion reaction Methods 0.000 description 2
- 239000003792 electrolyte Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000007257 malfunction Effects 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- NOOLISFMXDJSKH-UTLUCORTSA-N (+)-Neomenthol Chemical compound CC(C)[C@@H]1CC[C@@H](C)C[C@@H]1O NOOLISFMXDJSKH-UTLUCORTSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- NOOLISFMXDJSKH-UHFFFAOYSA-N DL-menthol Natural products CC(C)C1CCC(C)CC1O NOOLISFMXDJSKH-UHFFFAOYSA-N 0.000 description 1
- 241000196324 Embryophyta Species 0.000 description 1
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 1
- 244000246386 Mentha pulegium Species 0.000 description 1
- 235000016257 Mentha pulegium Nutrition 0.000 description 1
- 235000004357 Mentha x piperita Nutrition 0.000 description 1
- 244000290333 Vanilla fragrans Species 0.000 description 1
- 235000009499 Vanilla fragrans Nutrition 0.000 description 1
- 235000012036 Vanilla tahitensis Nutrition 0.000 description 1
- 238000000889 atomisation Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000013256 coordination polymer Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 235000001050 hortel pimenta Nutrition 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000002608 ionic liquid Substances 0.000 description 1
- 229910001416 lithium ion Inorganic materials 0.000 description 1
- 229940041616 menthol Drugs 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000000452 restraining effect Effects 0.000 description 1
- 239000007784 solid electrolyte Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- A—HUMAN NECESSITIES
- A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
- A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
- A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
- A24F40/40—Constructional details, e.g. connection of cartridges and battery parts
-
- A—HUMAN NECESSITIES
- A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
- A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
- A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
- A24F40/40—Constructional details, e.g. connection of cartridges and battery parts
- A24F40/46—Shape or structure of electric heating means
- A24F40/465—Shape or structure of electric heating means specially adapted for induction heating
Abstract
A power supply unit (10) of an aerosol aspirator (1) is provided with an MCU-mounted substrate (7). The MCU-mounted substrate (7) has: a wiring pattern (77) electrically connected to the MCU (50) and the discharge terminal (41); a ground pattern (78) electrically connected to ground; and a resist film (79) covering at least a part of the wiring pattern (77) and the ground pattern (78). The MCU-mounted substrate (7) has a main surface-side surface layer (71 a) and a sub surface-side surface layer (71 b) that have an insulating film-forming section (75) and an insulating film-non-forming section (76). The insulating film non-forming part (76) is arranged to extend along the edge of the MCU carrying substrate (7) and at least one part of the grounding pattern (78) positioned outside the wiring pattern (77) is exposed from the resist film (79).
Description
Technical Field
The present invention relates to a power supply unit (unit) of an aerosol (aerosol) generating device.
Background
A circuit board for performing heating control and the like is housed in a power supply unit of the aerosol-generating device. In a power supply unit of an aerosol-generating device, it is important to take measures so as not to perform malfunction in terms of the property of generating an aerosol by heating. As countermeasures against noise such as static electricity, various countermeasures such as smoothing noise by providing a coil in a circuit have been adopted.
For example, in a power supply unit of an aerosol-generating device described in patent document 1, a capacitor is arranged on a circuit board to smooth electrostatic noise.
Prior art literature
Patent literature
Patent document 1: japanese patent No. 6633788
Disclosure of Invention
Problems to be solved by the invention
However, in the power supply unit and the like of the aerosol-generating device described in patent document 1, electronic components such as a coil and a capacitor are required as countermeasures against noise, and there is room for improvement in downsizing and cost reduction of the power supply unit of the aerosol-generating device.
The invention provides a power supply unit of an aerosol generating device, which can restrain adverse effects caused by noise while restraining the number of components.
Means for solving the problems
The power supply unit of the aerosol-generating device of the present invention comprises:
a power supply;
a heater connector to which a load that generates an aerosol from an aerosol source by consuming electric power supplied from the power supply or a coil that transmits electric power to the load by electromagnetic induction is connected;
a control device configured to control at least one of charging and discharging of the power supply; and
a circuit board on which the control device and the heater connector are mounted,
The circuit board is provided with:
wiring electrically connected to the control device and the heater connector;
a conductive part electrically connected to ground; and
an insulating film covering at least a part of the wiring and the conductive portion,
the surface of the circuit substrate has:
an insulating film forming section formed with the insulating film; and
an insulating film non-forming portion, the insulating film not being formed,
the insulating film non-forming portion is provided so as to extend along an edge of the circuit board, and at least a portion of the conductive portion located outside the wiring is exposed from the insulating film.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the present invention, the number of components can be suppressed while suppressing adverse effects caused by noise.
Drawings
Fig. 1 is a perspective view of an aerosol aspirator 1.
Fig. 2 is a further perspective view of the aerosol inhaler 1.
Fig. 3 is a cross-sectional view of the aerosol inhaler 1.
Fig. 4 is a perspective view of the power supply unit 10.
Fig. 5 is an exploded perspective view of the power supply unit 10.
Fig. 6 is a diagram showing a circuit configuration of the power supply unit 10.
Fig. 7 is a perspective view of the power supply unit 10 with the housing 11 removed.
Fig. 8 is a view showing the main surface side surface layer 71a of the MCU-mounted substrate 7.
Fig. 9 is a diagram showing the second wiring layer 74a of the MCU-mounted substrate 7.
Fig. 10 is a view showing the sub-surface side surface layer 71b of the MCU-mounted substrate 7.
Fig. 11 is a diagram showing the fourth wiring layer 74b of the MCU-mounted substrate 7.
Fig. 12 is a diagram showing a positional relationship between the MCU-mounted substrate 7 and the discharge terminals 41.
Fig. 13 is a cross-sectional view of the MCU-mounted substrate 7.
Detailed Description
A power supply unit of an aerosol-generating device according to an embodiment of the present invention will be described below, and first, an aerosol-generating device (hereinafter referred to as an aerosol aspirator) equipped with the power supply unit will be described with reference to fig. 1 to 3.
(Aerosol aspirator)
The aerosol aspirator 1 is an instrument for attracting an aerosol having a fragrance which is not added with combustion, and has a rod shape extending in a predetermined direction (hereinafter referred to as X direction). As shown in fig. 1 and 2, the aerosol inhaler 1 is provided with a power supply unit 10, a first cartridge 20, and a second cartridge 30 in the order of the power supply unit 10, the first cartridge 20, and the second cartridge 30 in the X direction. The first cartridge 20 may be detachable from the power supply unit 10, and the second cartridge 30 may be detachable from the first cartridge 20. In other words, the first cartridge 20 and the second cartridge 30 are individually replaceable with respect to the power supply unit 10. The second cartridge 30 is also replaceable with respect to the first cartridge 20. The first cartridge 20 may be fitted and fixed to the power supply unit 10, and thus may not be easily attached and detached by the user.
(Power supply unit)
As shown in fig. 3 to 5 and 7, the power supply unit 10 of the present embodiment is configured by housing a battery pack BP, an MCU (micro control unit (Micro Controller Unit)) 50, an MCU-mounted substrate 7, a socket-mounted substrate 8, and the like in a cylindrical case 11.
The power supply BAT stored in the battery pack BP is a rechargeable secondary battery, an electric double layer capacitor, or the like, and is preferably a lithium ion secondary battery. The electrolyte of the power supply BAT may also be composed of one of a gel-like electrolyte, an electrolytic solution, a solid electrolyte, an ionic liquid, or a combination thereof.
A top (top) portion 11a located at one end side (first cartridge 20 side) in the X direction of the case 11 is provided with a discharge terminal 41. The discharge terminal 41 is composed of a positive electrode side discharge terminal 41a and a negative electrode side discharge terminal 41 b. In the present specification, the term "positive electrode side" means a side having a higher potential than the term "negative electrode side". In other words, the "negative electrode side" means a side of a lower potential than the "positive electrode side". Accordingly, the terms "positive electrode side" and "negative electrode side" in the following description may be replaced with "high potential side" and "low potential side", respectively.
The positive electrode side discharge terminal 41a and the negative electrode side discharge terminal 41b are provided so as to protrude from the top 11a toward the first cartridge 20, and are electrically connectable to the heater 21 of the first cartridge 20. Further, a low floor portion 11b having a lower height than the top portion 11a is provided around the top portion 11 a.
A peripheral wall portion on the bottom (bottom) portion 11c side located on the other end side (opposite side to the first cartridge 20) in the X direction of the case 11 is provided with a charging opening 43 (see fig. 2) that allows access to the charging terminal 42. The charging terminal 42 is electrically connected to an external power source such as a socket (content) or a mobile battery to receive power supply, and in the present embodiment, a USB (universal serial bus (Universal Serial Bus)) Type-C-shaped socket is provided, but the present invention is not limited thereto. The charging opening 43 may be provided on the bottom surface of the bottom portion 11c side instead of the peripheral wall portion of the bottom portion 11c side.
The charging terminal 42 may be configured to include a power receiving coil, for example, and to be capable of receiving electric power transmitted from an external power source without contact. In this case, the mode of power transmission (wireless power transmission (Wireless Power Transfer)) may be electromagnetic induction type, magnetic resonance type, or a combination of electromagnetic induction type and magnetic resonance type. As another example, the charging terminal 42 may be connectable to various USB terminals and the like, and may have the power receiving coil described above. With such a configuration, the charging opportunity of the power supply BAT can be increased.
Further, in the case 11, an operation portion 14 operable by a user is provided on a peripheral wall portion of the top portion 11a so as to face the opposite side to the charging opening 43. The operation unit 14 is configured by a push button switch, and is used when the MCU50 and various sensors are activated and deactivated in response to the user's intention. The operation unit 14 may be constituted by a touch panel or the like.
The aerosol-absorbing device 1 is provided with a notification unit for notifying various information. The notification portion may be constituted by a light emitting element, a vibrating element, or a sound output element. The notification unit may be a combination of two or more of the light emitting element, the vibration element, and the sound output element. The notification unit may be provided in any one of the power supply unit 10, the first cartridge 20, and the second cartridge 30, but is preferably provided in the power supply unit 10 in order to shorten the wire (i.e., the wiring distance) from the power supply BAT. The notification unit of the present embodiment is configured by an LED window 13 provided around the operation unit 14, and leds_l1 and led_l2 (see fig. 6 and 8) described later. The internal structure of the power supply unit 10 will be described later.
(first cartridge)
As shown in fig. 3, the first cartridge 20 includes a reservoir (reservoir) 23 for storing the aerosol source 22, a heater 21 for atomizing and/or vaporizing (hereinafter simply referred to as atomizing) the aerosol source 22, a core (wick) 24 for introducing the aerosol source from the reservoir 23 to the heater 21, an aerosol flow path 25 for flowing the aerosol generated by atomizing the aerosol source 22 to the second cartridge 30, and an end cap (endcap) 26 for accommodating a part of the second cartridge 30, inside a cylindrical cartridge case 27.
The reservoir 23 is formed so as to surround the aerosol flow path 25, and stores the aerosol source 22. A porous body such as a resin net or cotton may be accommodated in the reservoir 23, and the aerosol source 22 may be impregnated into the porous body. The storage unit 23 may store only the aerosol source 22 without storing a porous body on a resin net or cotton. The aerosol source 22 comprises a liquid such as glycerin, propylene glycol, water, and the like. The storage amount of the aerosol source 22 in the storage unit 23 can be visually recognized from a remaining amount confirmation window 28 (see fig. 1 and 2) provided in the first cartridge 20. A gap (not shown) serving as an air intake port is formed between the remaining amount confirmation window 28 and the cartridge case 27, and outside air is introduced into the cartridge case 27 through the gap. The air intake port is not necessarily provided around the margin check window 28. For example, a gap may be formed between the operating unit 14 provided in the power supply unit and the LED window 13, and outside air may be taken into the case 11 from the gap, or the charging opening 43 may be used. Further, communication holes may be provided in the wall surfaces of the cartridge case 27 and the case 11 to communicate the inside with the outside.
The core 24 is a liquid holding member for introducing the aerosol source 22 from the reservoir 23 to the heater 21 by capillary action, and is made of, for example, glass fiber, porous ceramic, or the like.
The heater 21 atomizes the aerosol source 22 without combustion by the electric power supplied from the power supply BAT via the discharge terminal 41. The heater 21 is constituted by an electric heating wire (coil) wound at a predetermined pitch (pitch). The heater 21 is an example of a load that can atomize the aerosol source 22 to generate an aerosol, and the load is a heating element or an ultrasonic generator, for example. Examples of the heating element include a heating resistor, a ceramic heater, and an induction heating type heater.
The aerosol flow path 25 is provided on the downstream side of the heater 21 and on the center line L of the power supply unit 10 (housing 11). The center line L is a line obtained by continuously connecting the center point of the power supply unit 10 (housing 11) in the X direction, the center point being the center point of the power supply unit 10 (housing 11) when the power supply unit 10 (housing 11) is cut off with a plane orthogonal to the X direction.
The end cap 26 includes a cartridge housing portion 26a that houses a part of the second cartridge 30, and a communication path 26b that communicates the aerosol flow path 25 with the cartridge housing portion 26a.
(second cartridge)
The second cartridge 30 stores a source of flavour 31. The second cartridge 30 is detachably accommodated in the cartridge accommodating portion 26a of the end cap 26 provided to the first cartridge 20. The end of the second cartridge 30 on the opposite side to the first cartridge 20 side becomes the user's mouthpiece 32. The mouthpiece 32 is not limited to the case of being integrally and inseparably constituted with the second cartridge 30, and may be constituted to be detachable from the second cartridge 30. The suction nozzle 32 is thus formed separately from the power supply unit 10 and the first cartridge 20, whereby hygiene of the suction nozzle 32 can be maintained.
The second cartridge 30 passes aerosol generated by atomizing the aerosol source 22 by the heater 21 through the fragrance source 31, thereby imparting a fragrance to the aerosol. As the raw material pieces constituting the flavor source 31, a molded body obtained by molding cut tobacco and tobacco raw materials into a pellet shape can be used. The flavor source 31 may be made of plants other than tobacco (e.g., peppermint, herb, vanilla, etc.). The flavor source 31 may be provided with a flavor such as menthol.
In the aerosol inhaler 1 according to the present embodiment, the aerosol with the flavor added can be generated by the aerosol source 22, the flavor source 31, and the heater 21. That is, the aerosol source 22 and the flavour source 31 can be referred to as aerosol generating sources that generate aerosols.
The structure of the aerosol-generating source used in the aerosol-generating device 1 may be a structure in which the aerosol source 22 and the flavor source 31 are formed separately, a structure in which the flavor source 31 is omitted and a substance possibly contained in the flavor source 31 is added to the aerosol source 22, a structure in which a medicine or the like is added to the aerosol source 22 instead of the flavor source 31, or the like, in addition to the structure in which the aerosol source 22 and the flavor source 31 are formed separately.
In the aerosol inhaler 1 thus configured, the heater 21 atomizes the aerosol source 22 introduced or moved from the reservoir 23 through the core 24. The aerosol generated by atomization flows through the aerosol flow path 25 together with air flowing in from a gap (not shown) which is formed between the remaining amount confirmation window 28 and the cartridge case 27 and serves as an air intake port, and is supplied to the second cartridge 30 through the communication path 26 b. The aerosol supplied to the second cartridge 30 passes through the flavour source 31, is thereby flavoured, and is supplied to the mouthpiece 32.
(circuit configuration of Power supply Unit 10)
Next, a circuit configuration of the power supply unit 10 will be described with reference to fig. 6.
In fig. 6, the electronic component illustrated in the range enclosed by the one-dot chain line is an electronic component mounted on the socket mounting substrate 8. That is, the socket mounting board 8 includes, as main electronic components: a charging terminal 42 as a socket into which a plug of USB Type-C (hereinafter, also simply referred to as a USB plug) can be inserted; and a socket mounting board side connector Cn1 connected to one end of the board connection cable Cb1, the board connection cable Cb1 connecting the socket mounting board 8 and the MCU mounting board 7. In the present embodiment, the board connection cable Cb1 is an FPC (flexible printed circuit (Flexible Printed Circuit)) cable having 6 printed wiring lines, but the present invention is not limited thereto.
In fig. 6, the electronic component illustrated in the range surrounded by the two-dot chain line is an electronic component mounted on the MCU-mounted substrate 7. That is, the MCU-mounted substrate 7 includes, as main electronic components: an MCU-mounted substrate-side connector Cn2 connected to the other end of the substrate connection cable Cb 1; the MCU50 generally controlling the entirety of the aerosol inhaler 1 including the power supply unit 10; a charging IC (integrated circuit (Integrated Circuit)) 55 for performing charging of the power supply BAT; a protection IC61 that protects the charging IC 55; an LDO (Low drop out) regulator (62) for supplying a predetermined voltage to the MCU (50) or the like; an inhalation sensor 15 for detecting an inhalation (aspiration) action of a user; discharge terminals 41 (41 a, 41 b) connected to the heater 21; a DC/DC converter 63 capable of supplying electric power to the discharge terminal 41; and a battery connector Cn3 connected to a battery connection cable Cb2, the battery connection cable Cb2 connecting the battery pack BP including the power supply BAT to the MCU-mounted substrate 7.
The MCU50, the charging IC55, the protection IC61, the LDO regulator 62, the attraction sensor 15, and the DC/DC converter 63 are configured by, for example, chipping a plurality of circuit elements, and are provided with pins (pins) as terminals for electrically connecting the inside and the outside of the device. Details of the pins of each of the electronic components that are formed into chips will be described later. Note that only the main pins among the pins included in each of the electronic components that have been formed into chips are described in the present specification and the like.
The battery pack BP includes: a power supply BAT; a fuse FS connected to the positive terminal of the power supply BAT; and a thermistor TH connected to the negative terminal of the power supply BAT and disposed in proximity to the power supply BAT. The thermistor TH is mainly composed of an element having NTC (Negative Temperature Coefficient: negative temperature coefficient of resistance) characteristics or PTC (Positive Temperature Coefficient: positive temperature coefficient of resistance) characteristics, that is, an element having a correlation between resistance and temperature. In the present embodiment, the battery connection cable Cb2 connecting the battery pack BP and the MCU-mounted substrate 7 is an FPC cable having 3 printed patterns (patterns), but the present invention is not limited thereto. The battery connection cable Cb2 may be connected by 3 wires (wire).
In fig. 6, the wiring shown by a thick solid line is a wiring connected to the ground provided in the power supply unit 10 (for example, a wiring constituted by a ground pattern 78 and the like shown in fig. 9 and 11 described later). That is, the wiring is a wiring having the same potential as the potential (ground potential) to be the reference in the power supply unit 10, and is hereinafter also referred to as a ground line.
In addition, in the Power supply unit 10, as main wirings other than the ground line, a VBUS line Ln1, a VBAT line Ln2, a d+ line Ln3a, a D-line Ln3b, a Power Path (Power-Path) line Ln4, a VSYS line Ln5, and a VHEAT line Ln6 are provided. Each of these lines (wirings) is mainly composed of a conductive pattern formed on the MCU-mounted substrate 7. The electronic components connected to these wires will be described later.
The board connection cable Cb1, the socket board side connector Cn1, and the MCU board side connector Cn2, which are electronic components connecting the socket board 8 and the MCU board 7, are hereinafter also referred to as a board connection portion Cn.
(charging terminal and protection IC)
The charging terminal 42 includes pins (terminals) connected to the pins A1, A4, A5, A6, A7, A8, A9, a12, B1, B4, B5, B6, B7, B8, B9, and B12 of the inserted USB plug, respectively. In this specification and the like, a pin of the charging terminal 42 corresponding to An pin (where n=1 to 12) of the USB plug is also referred to as An pin of the charging terminal 42. Similarly, a pin of the charging terminal 42 corresponding to the Bn pin of the USB plug is also referred to as the Bn pin of the charging terminal 42.
The A1 pin, the a12 pin, the B1 pin, and the B12 pin of the charging terminal 42 corresponding to the GND (ground) pin of the USB plug are connected to the ground line.
V with USB plug BUS Pin A4, pin A9, pin B4, and pin B9 of the charging terminal 42 corresponding to the pins are connected to VBU, which is the high-side power supply terminal of the charging IC55, via the substrate connection portion CN, VBUS line Ln1, and protection IC61And the S pins are connected. Accordingly, the power (for example, USB bus power) from the external power source, which is input to the power supply unit 10 via the A4 pin, the A9 pin, the B4 pin, or the B9 pin of the charging terminal 42, can be supplied to the charging IC55, and the charging of the power supply BAT of the charging IC55 using the power can be performed, thereby supplying the power to the MCU 50.
The protection IC61 provided between the charging terminal 42 and the charging IC55 is described in detail, and the protection IC61 includes: an IN pin as a power supply terminal on the high potential side; a VSS pin as a power supply terminal on the low potential side; a GND pin connected to ground; an OUT pin as an output terminal for outputting a first system voltage Vs1 described later; a CE pin for enabling (on) or disabling (off) (hereinafter, also referred to as enabling/disabling) the action of the protection IC 61; and a VBAT pin for detecting a connection state of the power source BAT.
The A4 pin and the B9 pin, and the A9 pin and the B4 pin of the charging terminal 42 are connected IN parallel with the IN pin of the protection IC61 via the substrate connection portion CN and the VBUS line Ln 1. IN other words, the IN pin of the protection IC61 is connected to the A4 pin and the B9 pin, and the A9 pin and the B4 pin of the charging terminal 42, respectively. The VSS pin, GND pin, and CE pin of the protection IC61 are connected to the ground line. The OUT pin of the protection IC61 is connected to the VBUS pin of the charging IC 55. The VBAT pin of the protection IC61 is connected to the positive terminal (i.e., the high potential side) of the power supply BAT via the VBAT line Ln2, the battery connector Cn3, the battery connection cable Cb2, and the fuse FS. The negative terminal (i.e., low potential side) of the power supply BAT is connected to the ground line via the battery connection cable Cb2 and the battery connector Cn 3.
The protection IC61 is operated when the power supply voltage is supplied by the difference between the potential of the IN pin and the potential of the VSS pin and the input to the CE pin is at the low level, and outputs a predetermined first system voltage Vs1 from the OUT pin or detects whether or not the power supply BAT is connected based on the input voltage to the VBAT pin. The charging IC55 in the present embodiment is enabled by being input with a low level at the CE pin, and thus is a negative logic operation. Alternatively, the protection IC61 may be used which is enabled by the positive logic operation which is input with the high level at the CE pin. IN this case, it is preferable that the CE pin is connected with the IN pin so that a high level is inputted at the CE pin.
More specifically, when a USB plug is inserted into the charging terminal 42 and a USB cable including the USB plug is connected to an external power source, a predetermined USB voltage (for example, 5[V) is supplied from the external power source to the A4 pin, A9 pin, B4 pin, and B9 pin of the charging terminal 42. This USB voltage is thereby supplied as a power supply voltage to the protection IC61. Further, since the CE pin of the protection IC61 is grounded, the input voltage to the CE pin is always at a low level. Therefore, the protection IC61 outputs the first system voltage Vs1 to the charging IC55 in accordance with the USB voltage supplied from the external power supply via the charging terminal 42.
The first system voltage Vs1 output from the protection IC61 has a voltage value included in the range of the recommended input voltage of the charging IC55 (for example, the range of 4.35 to 6.4 v).
For example, when the input voltage to the IN pin (IN other words, the potential of the IN pin) is included IN the recommended input voltage range of the charging IC55, the protection IC61 outputs the input voltage to the IN pin as the first system voltage Vs1 directly from the OUT pin. On the other hand, when the input voltage to the IN pin exceeds the maximum value of the recommended input voltage of the charging IC55, the protection IC61 converts the input voltage to the IN pin into a predetermined voltage (for example, 5.5±0.2[ v ]) included IN the range of the recommended input voltage of the charging IC55, and outputs the converted voltage from the OUT pin as the first system voltage Vs1. Thus, even if a high voltage exceeding the maximum value of the recommended input voltage of the charging IC55 is input to the protection IC61, the high voltage is prevented from being output from the protection IC61 to the charging IC55, and the charging IC55 is protected from the high voltage.
When a high voltage exceeding the maximum value of the recommended input voltage of the charging IC55 is input to the IN pin, the protection IC61 may open a circuit (not shown) IN the protection IC61 connecting the IN pin and the OUT pin, so that the high voltage input to the IN pin is not output from the OUT pin.
Further, as described above, the protection IC61 can detect whether the power supply BAT is connected or not based on the input voltage to the VBAT pin. The protection IC61 may use the detection result of whether or not the power BAT is connected to the device, or may output the detection result to the outside of the device (for example, the MCU50 or the charging IC 55). Further, the protection IC61 may have various protection functions for protecting the circuits of the power supply unit 10, such as an overcurrent detection function and an overvoltage detection function, in addition to the aforementioned function of protecting the charging IC 55.
As shown IN fig. 6, a capacitor (also referred to as a smoothing capacitor or bypass capacitor) Cd1 for stabilizing (smoothing) the input to the IN pin of the protection IC61 is appropriately connected to the VBUS line Ln1 as necessary. Similarly, a capacitor Cd2 for stabilizing the input to the VBUS pin of the charging IC55 (i.e., the first system voltage Vs1 output from the protection IC 61) is appropriately connected between the OUT pin of the protection IC61 and the VBUS pin of the charging IC55 as needed.
However, the A4 pin, A9 pin, B4 pin, and B9 pin of the charging terminal 42 connected to the IN pin of the protection IC61 are also connected to the ground line via a Varistor (Varistor) (Variable Resistor (variable resistor): nonlinear resistive element) VR 1. In this way, by connecting the A4 pin, the A9 pin, the B4 pin, and the B9 pin of the charging terminal 42 to the ground line via the varistor VR1, even if static electricity is generated at the A4 pin, the A9 pin, the B4 pin, or the B9 pin of the charging terminal 42 due to friction or the like when the USB plug is inserted into the charging terminal 42, the static electricity can be discharged to the ground line via the varistor VR 1. Therefore, the IC61 can be protected from static electricity generated at the A4 pin, the A9 pin, the B4 pin, or the B9 pin of the charging terminal 42.
The A6 pin and the B6 pin of the charging terminal 42 corresponding to the Dp (also referred to as d+) 1 pin or the Dp2 pin of the USB plug are connected to the PA11 pin of the MCU50 via the substrate connection portion CN and the d+ line Ln3 a. The A7 pin and the B7 pin of the charging terminal 42 corresponding to the Dn (also referred to as D-) 1 pin or Dp2 pin of the USB plug are connected to the PA12 pin of the MCU50 via the board connection portion CN and the D-line Ln 3B. As a result, serial communication using two signal lines, i.e., the d+ line Ln3a and the D-line Ln3b, can be performed between an external device (hereinafter, also simply referred to as an external device) to which a USB cable including a USB plug inserted into the charging terminal 42 is connected and the MCU 50. In addition, a communication system other than serial communication may be employed for communication between the external device and the MCU 50.
The A6 pin and the B6 pin of the charging terminal 42 connected to the PA11 pin of the MCU50 are also connected to the ground line via the varistor VR 2. Thus, even if static electricity is generated at the A6 pin or the B6 pin of the charging terminal 42, the static electricity can be discharged to the ground line via the varistor VR 2. Accordingly, the MCU50 can be protected from static electricity generated at the A6 or B6 pin of the charging terminal 42.
Further, as shown in fig. 6, if the resistor R11 is provided between the A6 pin and the B6 pin of the charging terminal 42 and the PA11 pin of the MCU50, a large current can be suppressed from being input to the PA11 pin of the MCU50 by the resistor R11. In the present specification and the like, the resistor is an element having a predetermined resistance value, which is formed of a resistive element, a transistor, or the like.
The A7 pin and the B7 pin of the charging terminal 42 connected to the PA12 pin of the MCU50 are also connected to the ground line via the varistor VR 3. Thus, even if static electricity is generated at the A7 pin or the B7 pin of the charging terminal 42, the static electricity can be discharged to the ground line via the varistor VR 3. Therefore, the MCU50 can be protected from static electricity generated at the A7 pin or the B7 pin of the charging terminal 42.
Further, as shown in fig. 6, if the resistor R12 is provided between the A7 pin and the B7 pin of the charging terminal 42 and the PA12 pin of the MCU50, it is also possible to suppress the input of a large current to the PA12 pin of the MCU50 by the resistor R12.
Further, in the power supply unit 10, even if the MCU50 does not recognize whether the USB plug is inserted into the charging terminal 42 in the up-side-up direction or in the down-side (up-down) direction, no problem occurs. For this purpose, the A5 pin and the B5 pin of the charging terminal 42 corresponding to the CC1 pin or the CC2 pin of the USB plug are connected to the ground line. Further, the A8 pin and the B8 pin of the charging terminal 42 corresponding to the SBU1 pin or the SBU2 pin of the USB plug are not connected to the circuit of the power supply unit 10. That is, since the pins of these charging terminals 42 are not used in the power supply unit 10, they can be omitted appropriately. This can suppress the circuit configuration of the power supply unit 10 from being complicated.
(charging IC)
The charging IC55 includes a VBUS pin as one of the high-potential-side power supply terminals, a GND pin as the low-potential-side power supply terminal, a bat_1 pin and a bat_2 pin as input/output terminals for power transfer between the charging IC55 and the power BAT, a bat_sns pin as a detection terminal for detecting input to or output from the power BAT, a sys_1, sys_2 pin, sw_1 pin and sw_2 pin as output terminals for outputting a second system voltage Vs2 described later, and a CE pin for enabling/disabling operation of the charging IC 55. The bat_1 pin and the bat_2 pin can also function as power supply terminals on the high potential side in the charging IC 55.
As described above, the VBUS pin of the charging IC55 is connected to the OUT pin of the protection IC 61. The bat_1 pin, the bat_2 pin, and the bat_sns pin of the charging IC55 are connected to the positive terminal of the power supply BAT via the VBAT line Ln2, the battery connector Cn3, the battery connection cable Cb2, and the fuse FS. The sys_1 pin, the sys_2 pin, the sw_1 pin, and the sw_2 pin of the charging IC55 are connected to the IN pin as the high-side power supply terminal of the LDO regulator 62 and the VIN pin as the high-side power supply terminal of the DC/DC converter 63 via the power supply path line Ln 4. The sw_1 pin and the sw_2 pin are connected to the power supply path line Ln4 via the reactor Rc 1. Further, the CE pin of the charging IC55 is connected to the PB14 pin of the MCU 50.
The charging IC55 is supplied with a power supply voltage by a difference between the potential of the VBUS pin, the bat_1 pin, or the bat_2 pin and the potential of the GND pin, and operates when the input to the CE pin is at a high level, and charges the power supply BAT, or supplies the power discharged from the power supply BAT to the LDO regulator 62, the DC/DC converter 63, and the like. The charging IC55 in the present embodiment is enabled by being input with a high level at the CE pin, and thus is a positive logic operation. Alternatively, the charging IC55 may be used which is enabled by a negative logic operation which is input with a low level to the CE pin.
To describe in more detail, if the first system voltage Vs1 is input to the VBUS pin, the charging IC55 outputs a voltage (e.g., the first system voltage Vs 1) for charging the power supply BAT from the bat_1 pin and the bat_2 pin to the power supply BAT. On the other hand, when the power supply BAT discharges, the output voltage (terminal voltage) of the power supply BAT is input to the bat_1 pin and the bat_2 pin. In this case, the charging IC55 outputs the second system voltage Vs2 corresponding to the input voltages to the bat_1 pin and the bat_2 pin from the sys_1 pin, the sys_2 pin, the sw_1 pin, and the sw_2 pin to the LDO regulator 62, the DC/DC converter 63, and the like. The second system voltage Vs2 is, for example, the output voltage itself of the power supply BAT, and specifically can be set to a voltage of about 3 to 4[V ].
The charging IC55 further includes an SCL pin connected to the PB8 pin of the MCU50 and an SDA pin connected to the PB9 pin of the MCU50. This enables, for example, I2C (Inter-integrated circuit (Integrated Circuit)) communication between the charging IC55 and the MCU50. The charging IC55 uses this communication to transmit, for example, battery information related to the power BAT to the MCU50. Here, the battery information is information indicating, for example, a State Of Charge (for example, during charging or during a stop Of charging) Of the power supply BAT by the charging IC55, a remaining amount (SOC: state Of Charge) Of the power supply BAT, and the like. In addition, communication methods other than I2C communication may be employed for communication between the charging IC55 and the MCU50.
As shown in fig. 6, the charging IC55 may further include an ISET pin, ILIM pin, TS pin, and the like. When the charge IC55 includes the ISET pin, the current value output from the charge IC55 to the power supply BAT can be set by the resistance value of the resistor connected between the ISET pin and the ground line. When the charging IC55 includes the ILIM pin, the upper limit of the current value output from the charging IC55 to the LDO regulator 62, the DC/DC converter 63, and the like can be set by the resistance value of the resistor connected between the ILIM pin and the ground line. When the charging IC55 includes the TS pin, the charging IC55 can detect the resistance value and the temperature of the resistor connected to the TS pin based on the input voltage to the TS pin.
As shown in fig. 6, a capacitor Cd3 for stabilizing the input to the bat_sns pin of the charging IC55 and the like is appropriately connected to the VBAT line Ln2 as necessary. Further, a capacitor Cd4 for stabilizing the second system voltage Vs2 output from the charging IC55 and a capacitor Cd5 for stabilizing the input to the IN pin of the LDO regulator 62 are appropriately connected to the power supply path line Ln4 as needed.
(LED Circuit)
A first LED circuit Cc1 for operating (e.g., lighting) led_l1 and a second LED circuit Cc2 for operating led_l2 are also connected to a power supply path line Ln4 to which the second system voltage Vs2 output from the charging IC55 is supplied.
The first LED circuit Cc1 is configured by connecting led_l1 and a switch Sw1 for switching on and off the first LED circuit Cc1 in series. One end of the first LED circuit Cc1 is connected to the power supply path line Ln4, and the other end is connected to the ground line. The switch Sw1 of the first LED circuit Cc1 is turned on in response to an on command from the MCU50, and is turned off in response to an off command from the MCU 50. When the switch Sw1 is turned on, the first LED circuit Cc1 is turned on, and the second system voltage Vs2 output from the charging IC55 is supplied to the led_l1 to turn on the led_l1.
As the switch Sw1, for example, a switch constituted by a MOSFET can be employed. In the present embodiment, as an example, the gate terminal of the MOSFET constituting the switch Sw1 is connected to the PA0 pin of the MCU50, and the output from the PA0 pin is controlled by the MCU50, whereby the gate voltage applied to the gate terminal of the switch Sw1 is changed, and the switch Sw1 is turned on or off. The switch Sw1 is not limited to a MOSFET, and may be a switch that is turned on/off in accordance with the control of the MCU 50.
The second LED circuit Cc2 is configured by connecting led_l2 and a switch Sw2 for switching on and off the second LED circuit Cc2 in series. One end of the second LED circuit Cc2 is connected to the power supply path line Ln4, and the other end is connected to the ground line. The switch Sw2 of the second LED circuit Cc2 is turned on in response to an on command from the MCU50, and is turned off in response to an off command from the MCU 50. When the switch Sw2 is turned on, the second LED circuit Cc2 is turned on, and the second system voltage Vs2 output from the charging IC55 is supplied to the led_l2, and the led_l2 is turned on.
As the switch Sw2, for example, a switch composed of a MOSFET can be used as the switch Sw 1. In the present embodiment, as an example, the gate terminal of the MOSFET constituting the switch Sw2 is connected to the PB3 pin of the MCU50, and the output from the PB3 pin is controlled by the MCU50, whereby the gate voltage applied to the gate terminal of the switch Sw2 is changed, and the switch Sw2 is turned on or off. The switch Sw2 is not limited to a MOSFET, and may be a switch that is turned on/off in accordance with the control of the MCU 50.
(LDO voltage stabilizer)
The LDO regulator 62 includes an IN pin as a high-side power supply terminal, a GND pin as a low-side power supply terminal, an OUT pin as an output terminal for outputting a third system voltage Vs3 described later, and an EN pin for enabling/disabling the operation of the LDO regulator 62.
As described above, the IN pin of the LDO regulator 62 is connected to the sys_1 pin, the sys_2 pin, and the like of the charging IC55 via the power supply path line Ln 4. The GND pin of LDO regulator 62 is connected to ground. The OUT pin of the LDO regulator 62 is connected to the VDD pin as the high-potential side power supply terminal of the MCU50 and the VDD pin as the high-potential side power supply terminal of the attraction sensor 15 via the VSYS line Ln 5. The EN pin of LDO regulator 62 is connected to power supply path line Ln 4.
The LDO regulator 62 is supplied with a power supply voltage by a difference between the potential of the IN pin and the potential of the GND pin, and operates when the input voltage to the EN pin is at a high level, and generates a predetermined third system voltage Vs3 and outputs it from the OUT pin. The LDO regulator 62 in the present embodiment is enabled by being input high at the EN pin, and thus is a positive logic operation. Alternatively, LDO regulator 62 may be used that operates with positive logic enabled by being input low on the EN pin. In this case, it is preferable that the EN pin is connected to the ground line so that a low level is always input to the EN pin.
To describe in more detail, according to the output of the second system voltage Vs2 from the charging IC55, the second system voltage Vs2 is supplied as a power supply voltage to the LDO regulator 62. When the second system voltage Vs2 is output from the charging IC55, the input voltage to the EN pin of the LDO regulator 62 becomes the second system voltage Vs2 (i.e., high level). Therefore, when the second system voltage Vs2 is output from the charging IC55, the LDO regulator 62 generates the third system voltage Vs3, and outputs the generated third system voltage Vs3 to the MCU50, the suction sensor 15, and the like.
The third system voltage Vs3 output from the LDO regulator 62 has a voltage value suitable for operating the MCU50, the attraction sensor 15, and the like. Specifically, the third system voltage Vs3 is a voltage lower than the second system voltage Vs2, and can be set to 2.5[ v ], for example.
(operating switch Circuit)
An operation switch circuit Cc3 for detecting an operation by a user who operates the switch OPS and a power supply temperature detection circuit Cc4 for detecting a temperature of the power supply BAT are also connected to a VSYS line Ln5 to which the third system voltage Vs3 output from the LDO regulator 62 is supplied.
The operation switch circuit Cc3 is constituted by a resistor R1, a resistor R2, a resistor R3, and an operation switch OPS. One end of the resistor R1 is connected to the VSYS line Ln5, and the other end is connected to one end of each of the resistor R2 and the resistor R3. Further, the other end of the resistor R2 is connected to the PC4 pin of the MCU50, and the other end of the resistor R3 is connected to one end of the operation switch OPS. The other end of the operation switch OPS is connected to a ground line.
When the operation switch OPS is not operated by the user, a voltage obtained by stepping down the third system voltage Vs3 supplied to the VSYS line Ln5 through the resistor R1 and the resistor R2 is input to the PC4 pin of the MCU 50. On the other hand, when the operation switch OPS is operated by the user, a voltage obtained by dividing the third system voltage Vs3 supplied to the VSYS line Ln5 by the resistor R1 and the resistor R3 and then reducing the voltage by the resistor R2 is inputted to the PC4 pin of the MCU 50. Accordingly, the MCU50 can detect the presence or absence of an operation of the user operating the switch OPS based on the input voltage to the PC4 pin.
(Power supply temperature detection Circuit)
The power supply temperature detection circuit Cc4 is configured by connecting a thermistor TH, a resistor R4, and a switch Sw3 for switching on and off the power supply temperature detection circuit Cc4 in series. One end of the power supply temperature detection circuit Cc4 on the side of the switch Sw3 is connected to the VSYS line Ln5, and the other end of the power supply temperature detection circuit Cc4 on the side of the thermistor TH is connected to the ground line. The pin PC1 of the MCU50 is connected to a connection point CP between the resistor R4 and the thermistor TH in the power supply temperature detection circuit Cc 4.
The switch Sw3 of the power supply temperature detection circuit Cc4 is turned on in response to an on command from the MCU50, and is turned off in response to an off command from the MCU 50. When the switch Sw3 is turned on, the power supply temperature detection circuit Cc4 is turned on, and a voltage obtained by dividing the third system voltage Vs3 supplied to the VSYS line Ln5 by the resistance value of the resistor R4 and the resistance value of the thermistor TH is input to the PC1 pin of the MCU 50. As described above, since the thermistor TH has a correlation with the resistance value and the temperature, the input voltage to the pin PC1 when the switch Sw3 is turned on varies according to the temperature of the thermistor TH. Therefore, the MCU50 can detect the temperature of the thermistor TH (i.e., the temperature of the power supply BAT) based on the input voltage to the PC1 pin when the switch Sw3 is turned on.
As the switch Sw3, for example, a switch composed of a MOSFET can be used as the switch Sw1 and the like. In the present embodiment, as an example, the gate terminal of the MOSFET constituting the switch Sw3 is connected to the PA8 pin of the MCU50, and the output from the PA8 pin is controlled by the MCU50, whereby the gate voltage applied to the gate terminal of the switch Sw3 is changed, and the switch Sw3 is turned on or off. The switch Sw3 is not limited to a MOSFET, and may be a switch that is turned on or off in accordance with the control of the MCU 50.
(DC/DC converter)
The DC/DC converter 63 includes: VIN pin as high-side power supply terminal; a GND pin as a low-potential-side power supply terminal; a SW pin to which a voltage is inputted; VOUT pin as an output terminal outputting a fourth system voltage Vs4 described later; an EN pin for enabling/disabling the action of the DC/DC converter 63; and a MODE pin for setting an operation MODE of the DC/DC converter 63.
As described above, the VIN pin of the DC/DC converter 63 is connected to the sys_1 pin, the sys_2 pin, and the like of the charging IC55 via the power supply path line Ln 4. The GND pin of the DC/DC converter 63 is connected to the ground line. The SW pin of the DC/DC converter 63 is connected to the power supply path line Ln4 via the reactor Rc 2. The VOUT pin of the DC/DC converter 63 is connected to a positive electrode side discharge terminal 41a which is a positive electrode terminal (i.e., high potential side) of the discharge terminal 41 via a VHEAT line Ln 6. The EN pin of the DC/DC converter 63 is connected to the PB2 pin of the MCU 50. The MODE pin of the DC/DC converter 63 is connected to the power supply path line Ln 4. Further, a negative electrode side discharge terminal 41b, which is a negative electrode terminal (i.e., low potential side) of the discharge terminal 41, is connected to a ground line.
The DC/DC converter 63 is supplied with a power supply voltage by a difference between the potential of the VIN pin and the potential of the GND pin, and operates when the input voltage to the EN pin is at a high level, and boosts the input voltage and outputs the boosted voltage from the VOUT pin. The DC/DC converter 63 in the present embodiment is enabled by being input with a high level at the EN pin, and thus is a positive logic operation. Alternatively, a DC/DC converter 63 having a negative logic operation enabled by being input with a low level at the EN pin may be used.
To describe in more detail, according to the output of the second system voltage Vs2 from the charging IC55, the second system voltage Vs2 is supplied as a power supply voltage to the DC/DC converter 63. When the MCU50 determines that the heater 21 is to be heated in response to a request for generating an aerosol, the voltage signal of a high level is input to the EN pin of the DC/DC converter 63. Thus, the DC/DC converter 63 outputs the fourth system voltage Vs4 obtained by boosting the voltage input to the DC/DC converter 63 to the discharge terminal 41 (i.e., the heater 21).
The fourth system voltage Vs4 output from the DC/DC converter 63 has a voltage value suitable for heating the heater 21. Specifically, the fourth system voltage Vs4 is higher than the third system voltage Vs3, and can be set to, for example, about 4.2[ v ].
The DC/DC converter 63 is, for example, a switching regulator (switching regulator), and can employ a pulse width modulation mode (hereinafter, also referred to as PWM mode) and a pulse frequency modulation mode (hereinafter, also referred to as PFM mode) as operation modes. In the present embodiment, the MODE pin of the DC/DC converter 63 is connected to the power supply line Ln4, so that the input voltage to the MODE pin when the DC/DC converter 63 is operable is set to a high level, and the DC/DC converter 63 is operated in the PWM MODE.
As shown in fig. 6, a switch Sw4 for switching on and off of the VHEAT line Ln6 is provided on the VHEAT line Ln 6. The switch Sw4 is turned on in response to an on command from the MCU50, and is turned off in response to an off command from the MCU 50. When the switch Sw4 is turned on, the VHEAT line Ln6 is turned on, and the fourth system voltage Vs4 output from the DC/DC converter 63 is supplied to the discharge terminal 41 (specifically, the positive electrode side discharge terminal 41 a), and the heater 21 is heated. Thus, the aerosol source is atomized or vaporized, and an aerosol can be generated.
As the switch Sw4, for example, a switch constituted by a MOSFET can be employed. More specifically, the switch Sw4 is preferably a power MOSFET whose switching speed is high. In the present embodiment, as an example, the gate terminal of the MOSFET constituting the switch Sw4 is connected to the PB4 pin of the MCU50, and the output from the PB4 pin is controlled by the MCU50, whereby the gate voltage applied to the gate terminal of the switch Sw4 is changed, and the switch Sw4 is turned on or off.
(other electronic component connected to VHEAT line Ln 6)
If the voltage supplied to the discharge terminal 41 becomes unstable, the amount of aerosol generated by the heater 21 varies, and the flavor may be deteriorated. Accordingly, as shown in fig. 6, a capacitor for stabilizing the fourth system voltage Vs4 output from the DC/DC converter 63 is connected to the VHEAT line Ln 6.
To describe in more detail, in the power supply unit 10, three capacitors Cd61, cd62, and Cd63 are provided in parallel as capacitors for stabilizing the fourth system voltage Vs4 output from the DC/DC converter 63. In this way, the voltage is stabilized (smoothed) by the plurality of capacitors, and thereby heat generation can be dispersed to the plurality of capacitors in association with the stabilization of the voltage. Therefore, compared with the case where the voltage is stabilized by one capacitor, the capacitor can be prevented from becoming high temperature, and deterioration and malfunction of the capacitor can be suppressed.
In particular, from the viewpoint of securing the amount of aerosol generated by the heater 21, a high voltage value is required for the fourth system voltage Vs 4. Such stabilization of a high voltage is assumed to be performed by one capacitor, and it is assumed that the capacitor has a very high temperature. As a result, not only the capacitor at high temperature is significantly degraded, but also other electronic components disposed around the capacitor may be adversely affected. Therefore, as described above, the stabilization of the fourth system voltage Vs4 is preferably performed by a plurality of capacitors.
Among the capacitor Cd61, the capacitor Cd62, and the capacitor Cd63, the capacitor Cd61 has a relatively small capacitance, and thus has a relatively small physical size. On the other hand, the capacitor Cd62 and the capacitor Cd63 have relatively large capacitance, and thus have relatively large physical dimensions. As a specific example, the capacitance of the capacitor Cd61 can be set to 0.1[ μf ], and the capacitances of the capacitor Cd62 and the capacitor Cd63 can be set to 50[ μf ]. By using a plurality of capacitors having mutually different electrostatic capacitances in this way, even if various ripple components (ripple) are included in the fourth system voltage Vs4, they can be removed.
As shown in fig. 6, in the present embodiment, a varistor VR4 is provided between the discharge terminal 41 and the switch Sw4 on the VHEAT line Ln 6. In more detail, one end of the varistor VR4 is connected to the VHEAT line Ln6, and the other end is connected to the ground line. By providing such a varistor VR4, even if static noise is generated at the discharge terminal 41 due to, for example, attachment and detachment of the first cartridge 20, the noise can be released to the ground line through the varistor VR4. Therefore, the system of the power supply unit 10 such as the switch Sw4 and the DC/DC converter 63 can be protected from noise such as static electricity generated at the discharge terminal 41.
As shown in fig. 6, a capacitor Cd7 for stabilizing the voltage supplied to the discharge terminal 41 via the switch Sw4 is also connected between the discharge terminal 41 and the switch Sw4 on the VHEAT line Ln 6. The capacitor Cd7 can also function as a protection member for protecting the system of the power supply unit 10 such as the switch Sw4 and the DC/DC converter 63 from noise such as static electricity generated at the discharge terminal 41. Therefore, the capacitor Cd7 protects the system of the power supply unit 10 such as the switch Sw4 and the DC/DC converter 63 from noise such as static electricity generated at the discharge terminal 41. In addition to the attachment and detachment of the first cartridge 20, noise such as static electricity is generated in the discharge terminal 41 when the user touches the discharge terminal 41 or when stress is applied to the discharge terminal 41.
(suction sensor)
The attraction sensor 15 includes a VDD pin as a high-potential-side power supply terminal, a GND pin as a low-potential-side power supply terminal, and an OUT pin as an output terminal.
As described above, the VDD pin of the attraction sensor 15 is connected to the OUT pin of the LDO regulator 62 via the VSYS line Ln 5. The GND pin of the attraction sensor 15 is connected to the ground line. The OUT pin of the attraction sensor 15 is connected to the PC5 pin of the MCU 50.
When the power supply voltage is supplied by the difference between the potential of the VDD pin and the potential of the GND pin, the attraction sensor 15 operates. Specifically, the attraction sensor 15 operates as a power supply voltage by being supplied with the third system voltage Vs3 output from the LDO regulator 62, and functions as a sensor device for detecting the inhalation operation of the user. For example, the suction sensor 15 is mainly configured by a condenser microphone and a pressure sensor, and outputs a signal indicating a value of a change in pressure (internal pressure) in the power supply unit 10 caused by suction of the user as a detection result from the OUT pin to the MCU 50. In addition, a sensor device other than a condenser microphone or a pressure sensor may be used for the suction sensor 15.
(MCU)
The MCU50 includes a VDD pin as a high-potential-side power supply terminal, a VSS pin as a low-potential-side power supply terminal, and a plurality of pins (hereinafter, also referred to as input/output pins) functioning as an input terminal or an output terminal. The MCU50 is operated by supplying a power supply voltage by a difference between the potential of the VDD pin and the potential of the VSS pin.
Since the MCU50 includes the PA11 pin and the PA12 pin as input/output pins, it is possible to communicate with an external device using these pins, and for example, update data of firmware and the like can be acquired from the external device. Further, since the MCU50 includes the PB8 pin and the PB9 pin as input/output pins, these pins can be used to communicate with the charging IC55, and the battery information and the like can be acquired from the charging IC 55.
Further, since the MCU50 includes the PB14 pin and the PB2 pin as input/output pins, the charging IC55 can be controlled to be activated/deactivated by the output from the PB14 pin and the DC/DC converter 63 can be controlled to be activated/deactivated by the output from the PB2 pin, respectively.
Further, since the MCU50 includes the PA0 pin, the PB3 pin, the PA8 pin, and the PB4 pin as input/output pins, the switch Sw1 can be turned on/off by the output from the PA0 pin, the switch Sw2 can be turned on/off by the output from the PB3 pin, the switch Sw3 can be turned on/off by the output from the PA8 pin, and the switch Sw4 can be turned on/off by the output from the PB4 pin, respectively.
Further, since the MCU50 includes the above-described PC5 pin, PC4 pin, and PC1 pin as input/output pins, it is possible to detect the inhalation operation of the user based on the input to the PC5 pin, detect the operation of the user with respect to the switch OPS based on the input to the PC4 pin, and detect the temperature of the thermistor TH (i.e., the temperature of the power supply BAT) based on the input to the PC1 pin when the switch Sw3 is turned on, respectively.
(internal Structure of Power supply Unit)
Next, the internal structure of the power supply unit 10 will be described with reference to fig. 5 and fig. 7 to 12.
An insulating base 12 is provided in the inner space of the case 11, and a charging terminal 42 (see fig. 3), a socket mounting board 8, a battery pack BP including a power supply BAT, and an MCU mounting board 7 are held in this order on the base 12 from the bottom 11c toward the top 11 a. The case 11 is provided with the aforementioned charging opening 43 that allows access to the charging terminal 42, an operation opening that exposes the operation portion 14 to the outside, and a pair of discharge openings that expose the discharge terminal 41 from the top 11a to the outside.
(MCU-mounted substrate)
The MCU-mounted substrate 7 is mounted with a plurality of electronic components described in the circuit configuration of the power supply unit 10 (see fig. 6, etc.). The MCU-mounted substrate 7 is a multilayer substrate formed by stacking a plurality of layers, and has a substantially rectangular shape. The MCU-mounted substrate 7 is disposed with its longitudinal direction along the extending direction (X direction) of the center line L of the case 11, and with its one element mounting surface facing the operation unit 14. In the following description, the X direction may be referred to as the longitudinal direction, the top 11a side may be referred to as the X1 direction, and the bottom 11c side may be referred to as the X2 direction. In addition, on the MCU-mounted substrate 7, a direction orthogonal to the long-side direction X is referred to as a short-side direction Y, one side (left side in fig. 7, upper side in fig. 8 and 9, and lower side in fig. 10 and 11) is referred to as a Y1 direction, and the other side (right side in fig. 7, lower side in fig. 8 and 9, and upper side in fig. 10 and 11) is referred to as a Y2 direction. The center line of the MCU-mounted substrate 7 coincides with the center line L of the power supply unit 10 (housing 11) extending in the X direction. The center line of the MCU-mounted substrate 7 is a line obtained by continuously connecting a center point in the longitudinal direction X, which is a center point in the width direction (short side direction) and the thickness direction of the MCU-mounted substrate 7 when the MCU-mounted substrate 7 is cut off with a plane orthogonal to the longitudinal direction X.
As shown in fig. 7, the MCU-mounted substrate 7 is constituted by a rectangular portion 81 that occupies a large part of the MCU-mounted substrate 7, and a protruding portion 82 that protrudes from the rectangular portion 81 in the X1 direction. Both ends of the protruding portion 82 in the short side direction Y are cut away, and the X1-direction end of the protruding portion 82 faces the top portion 11a of the housing 11, and the X1-direction end of the rectangular portion 81 where the protruding portion 82 is not provided faces the low floor portion 11b of the housing 11.
If the surface of the MCU-mounted substrate 7 on the operation portion 14 side is the main surface 7a and the surface on the opposite side is the sub-surface 7b, the MCU-mounted substrate 7 is a double-sided mounting substrate having electronic components mounted on both the main surface 7a and the sub-surface 7 b.
As shown in fig. 8, a battery connector Cn3, an MCU50, an operation switch OPS, an led_l1, an led_l2, a DC/DC converter 63, a reactor Rc2 of the DC/DC converter 63, a switch Sw4, a positive electrode side discharge terminal 41a, and the like are mounted on a main surface side surface layer 71a of the main surface 7a (hereinafter, simply referred to as a main surface 7 a).
More specifically, a push-button operation switch OPS is attached to the substantially center of the main surface 7a so as to face the operation unit 14. Thereby, the user can press the operation switch OPS via the operation portion 14 of the housing 11. Further, a pair of leds_l1, led_l2 is mounted near the operation switch OPS so as to sandwich the operation switch OPS in the short-side direction Y. Thus, the user can visually recognize the light emitted from the leds_l1 and led_l2 through the LED window 13 provided around the operation unit 14.
Further, a battery connector Cn3 is attached to the main surface 7a at the end in the X2 direction, and a positive electrode side discharge terminal 41a is attached to a protruding portion 82 which is the end in the X1 direction. As shown in fig. 7, a battery connection cable Cb2 extending from the power supply BAT is connected to the battery connector Cn3 at a position close to the power supply BAT at the end in the X2 direction. The end in the X1 direction is a position close to the first cartridge 20, and the heater 21 is connected to the positive electrode side discharge terminal 41a.
The positive electrode side discharge terminal 41a is attached to the Y2 direction side with the center line L interposed therebetween in the protruding portion 82. The switch Sw4 is attached to the protruding portion 82 on the Y1 direction side with the center line L interposed therebetween. Further, on the main surface 7a, a DC/DC converter 63 and a reactor Rc2 of the DC/DC converter 63 are mounted between the operation switch OPS and the switch Sw4 in the X direction.
As shown in fig. 10, a charging IC55, a reactor Rc1 of the charging IC55, a protection IC61, an MCU-mounted substrate-side connector Cn2, a suction sensor 15, a negative electrode-side discharge terminal 41b, and the like are mounted on a sub-surface-side surface layer 71b of the sub-surface 7b (hereinafter, simply referred to as sub-surface 7 b).
More specifically, an MCU-mounted board-side connector Cn2 is mounted in the substantially center of the sub-surface 7b, and a board connection cable Cb1 extending from the socket-mounted board 8 to which the charging terminal 42 is mounted is connected to the MCU-mounted board-side connector Cn 2.
Further, on the sub-surface 7b, a charging IC55 is mounted on the X2 direction side of the MCU-mounted substrate-side connector Cn2, a reactor Rc1 of the charging IC55 is mounted between the charging IC55 and the MCU-mounted substrate-side connector Cn2 in the X direction and on the Y1 direction side, and a protection IC61 is mounted on the Y2 direction side. Further, on the sub-surface 7b, the suction sensor 15 is mounted on the X1 direction side of the MCU-mounted substrate-side connector Cn2, and the negative electrode-side discharge terminal 41b is mounted on the protruding portion 82 which is an end portion in the X1 direction. As described above, the end in the X1 direction is a position close to the first cartridge 20, and the heater 21 is connected to the negative electrode side discharge terminal 41b.
The negative electrode side discharge terminal 41b is disposed on the Y1 direction side with the center line L interposed therebetween in the protruding portion 82. In this way, the MCU-mounted substrate 7 has the positive electrode-side discharge terminal 41a mounted on the main surface 7a and the negative electrode-side discharge terminal 41b mounted on the sub-surface 7 b. The tip portions of the positive electrode side discharge terminal 41a and the negative electrode side discharge terminal 41b exposed from the top portion 11a of the case 11 are formed as thin needle-shaped probes (probes). As shown in fig. 12, a virtual line P connecting the center Pa of the probe of the positive electrode side discharge terminal 41a and the center Pb of the probe of the negative electrode side discharge terminal 41b is arranged to pass through the center line L as viewed in the extending direction (X direction) of the center line L of the case 11, and the center Pa of the probe of the positive electrode side discharge terminal 41a and the center Pb of the probe of the negative electrode side discharge terminal 41b are arranged on a circle Q passing through the center line L.
As shown in fig. 13, in the MCU-mounted substrate 7, the first wiring layer 72a, the main surface side insulating layer 73a, and the second wiring layer 74a are provided in this order from the Base layer (Base) 70 toward the main surface side surface layer 71a, and the third wiring layer 72b, the sub surface side insulating layer 73b, and the fourth wiring layer 74b are provided in this order from the Base layer 70 toward the sub surface side surface layer 71 b. In addition, the MCU-mounted substrate 7 is not limited thereto, and various structures can be adopted. For example, a plurality of second wiring layers 74a and/or fourth wiring layers 74b may be provided, or only one of the first wiring layers 72a and the third wiring layers may be provided.
The second wiring layer 74a and the fourth wiring layer 74b are provided with conductive patterns formed of copper foil or the like. Here, when the conductive pattern constituting the power supply line and the signal line is referred to as a wiring pattern 77 and the conductive pattern constituting the ground line is referred to as a ground pattern 78, the ground pattern 78 is provided so as to surround the wiring pattern 77 as shown in fig. 9 and 11. In other words, the ground pattern 78 is located outside the wiring pattern 77. Fig. 9 is a diagram showing the second wiring layer 74a of the MCU-mounted substrate 7, and fig. 11 is a diagram showing the fourth wiring layer 74b of the MCU-mounted substrate 7. In fig. 9 and 11, the hatched portion of the diagonal line is a wiring pattern 77, and the hatched portion of the dot line is a ground pattern 78. Note that in fig. 9 and 11, only a part of the wiring patterns is shown.
As shown in fig. 13, the via hole (via) V1 is formed of a conductor penetrating from the second wiring layer 74a to the fourth wiring layer 74b, and the conductive pattern electrically connected to the via hole V1 is set to the same potential among the conductive patterns formed in the first wiring layer 72a, the second wiring layer 74a, the third wiring layer 72b, and the fourth wiring layer 74 b. For example, the wiring pattern 77 of the second wiring layer 74a and the wiring pattern 77 of the fourth wiring layer 74b are electrically connected to each other via the via hole V1. The via hole V2 is formed of a conductor penetrating from the second wiring layer 74a to the first wiring layer 72a, and the conductive pattern electrically connected to the via hole V2 among the conductive patterns formed in the first wiring layer 72a and the second wiring layer 74a is set to the same potential. The via hole V3 is formed of a conductor penetrating from the third wiring layer 72b to the fourth wiring layer 74b, and the conductive pattern electrically connected to the via hole V3 among the conductive patterns formed in the third wiring layer 72b and the fourth wiring layer 74b is set to the same potential. For example, the ground pattern 78 of the second wiring layer 74a and the conductive pattern of a part of the first wiring layer 72a are electrically connected to each other via the via hole V2, and the ground pattern 78 of the fourth wiring layer 74b and the conductive pattern of a part of the third wiring layer 72b are electrically connected to each other via the via hole V3. The via hole V4 is formed of a conductor penetrating from the first wiring layer 72a to the third wiring layer 72b, and the wirings electrically connected to the via hole V4 in the conductive patterns formed in the first wiring layer 72a and the third wiring layer 72b are set to the same potential. For example, the conductive pattern of a part of the first wiring layer 72a and the conductive pattern of a part of the third wiring layer 72b are electrically connected to each other via the via hole V4. Thus, the conductive pattern of a part of the first wiring layer 72a and the conductive pattern of a part of the third wiring layer 72b, and the ground pattern 78 of the second wiring layer 74a and the ground pattern 78 of the fourth wiring layer 74b connected to these conductive patterns can be set as a ground line having a common reference potential.
The main surface side surface layer 71a and the sub surface side surface layer 71b are formed of an insulating resist film 79 (see fig. 13), and the second wiring layer 74a and the fourth wiring layer 74b are covered to protect the wiring patterns 77 from shorting to each other and the wiring patterns 77 and the ground patterns 78 from shorting. Details of the main surface side surface layer 71a and the sub surface side surface layer 71b will be described later. The base layer 70, the main surface side insulating layer 73a, and the sub surface side insulating layer 73b are made of, for example, an insulating material including glass or epoxy resin, and are bonded while preventing short circuits between the upper and lower layers.
(principal surface side surface layer and sub surface side surface layer)
As shown in fig. 8 and 10, an insulating film forming portion 75 in which an insulating resist film 79 is formed and an insulating film non-forming portion 76 in which the resist film 79 is not formed are provided on the main surface side surface layer 71a that is the surface of the main surface 7a of the MCU-mounted substrate 7 and the sub surface side surface layer 71b that is the surface of the sub surface 7b of the MCU-mounted substrate 7, respectively. In fig. 8 and 10, a portion surrounded by a thick line is an insulating film formation portion 75.
As is clear from a combination of fig. 9 and 11, the insulating film forming portion 75 covers most of the wiring patterns 77 and 77 of the second wiring layer 74a, the ground patterns 78 of the second wiring layer 74a, and the ground patterns 78 of the fourth wiring layer 74b, which are formed in the layers below the main surface side surface layer 71a and the sub surface side surface layer 71 b. As described above, the insulating film formation section 75 prevents the wiring patterns 77 and the ground patterns 78 from being undesirably shorted.
On the other hand, the insulating film non-forming portion 76 is provided in the vicinity of the edge of the MCU-mounted substrate 7. In the insulating film non-forming portion 76, at least a part of the ground pattern 78 of the second wiring layer 74a and the ground pattern 78 of the fourth wiring layer 74b, which extend along the edge of the MCU-mounted substrate 7 and are located outside the wiring pattern 77 of the second wiring layer 74a and the wiring pattern 77 of the fourth wiring layer 74b, are exposed from the resist film 79. In other words, the boundary between the insulating film formation section 75 and the insulating film non-formation section 76 is located slightly inside the ground pattern 78 of the second wiring layer 74a and the ground pattern 78 of the fourth wiring layer 74b located near the edge of the MCU-mounted substrate 7. The distance from the edge to the ground pattern 78 of the second wiring layer 74a and the ground pattern 78 of the fourth wiring layer 74b is shorter than the distance from the edge to the wiring pattern 77 of the second wiring layer 74a and the wiring pattern 77 of the fourth wiring layer 74 b.
In this way, by the insulating film non-forming portions 76 of the main surface side surface layer 71a and the sub surface side surface layer 71b, the ground pattern 78 of the second wiring layer 74a and the ground pattern 78 of the fourth wiring layer 74b located outside the wiring pattern 77 of the second wiring layer 74a and the wiring pattern 77 of the fourth wiring layer 74b are exposed from the resist film 79, whereby noise (for example, electrostatic noise) from the outside is liable to intrude into the ground pattern 78. Noise that has entered the ground pattern 78 enters the first wiring layer 72a and the third wiring layer 72b from the ground pattern 78 through the via holes V2 and V3. Therefore, as a countermeasure against noise, even if there is no other electronic component such as a capacitor, intrusion of noise into the wiring pattern 77 and the electronic component connected to the wiring pattern 77 can be suppressed, and adverse effects due to noise can be suppressed. Further, as a countermeasure against noise, other electronic components such as a capacitor can be simplified or omitted, and thus, the power supply unit 10 can be reduced in size and cost.
The edge provided with the insulating film non-forming portion 76 may include at least one edge of the plurality of edges of the MCU-mounted substrate 7. In other words, the insulating film non-forming portion 76 need not be provided at all edges of the MCU-mounted substrate 7, but may be provided only at necessary edges. Although the electronic component can be protected from noise by providing the insulating film non-forming portion 76, it becomes important to provide the insulating film non-forming portion 76 at which edge, short-circuiting is likely to occur in the wiring pattern 77 or the like.
Here, regarding the edges of the MCU-mounted substrate 7, if the edges corresponding to the pair of long sides of the rectangular portion 81 are referred to as long edges 81d, the edges corresponding to the pair of short sides of the rectangular portion 81 are referred to as short edges 81e, the edges on the X1 side of the protruding portion 82 are referred to as upper edges 82f, and the edges on both sides in the Y direction of the protruding portion 82 are referred to as side edges 82g, the insulating film non-forming portion 76 of the present embodiment is provided along the long edges 81d of the rectangular portion 81 in the main surface 7a and the sub-surface 7 b. In the insulating film non-forming portion 76 of the present embodiment, a part of the ground pattern 78 extending along the long edge 81d and located outside the wiring pattern 77 is exposed from the resist film 79 in the vicinity of the long edge 81 d. Note that, in the insulating film non-forming portion 76 of the present embodiment, "in the vicinity of the long edge 81d, extending along the long edge 81d and located outside the wiring pattern 77" may include that the insulating film non-forming portion 76 is located between edges closest to the wiring pattern 77 (or at the closest edges). By providing the insulating film non-forming portion 76 along the long edge 81d of the rectangular portion 81, the ground pattern 78 into which noise enters can be ensured longer, and adverse effects caused by noise can be further suppressed. Conversely, the insulating film non-forming portion 76 is not provided along the short edge 81e of the rectangular portion 81 in the main surface 7a and the sub-surface 7b, and the insulating film forming portion 75 is provided at the short edge 81 e. By providing the insulating film formation part 75 instead of the insulating film non-formation part 76 at the short edge 81e of the ground pattern 78 where the entry of noise cannot be ensured for a long period of time, the MCU-mounted substrate 7 can be easily manufactured.
In the present embodiment, the insulating film non-forming portion 76 is provided continuously from the end in the X1 direction to the end in the X2 direction of the long edge 81 d. The insulating film non-forming portions 76 may be provided intermittently along the long edges 81d, but by providing them continuously, adverse effects due to noise can be effectively suppressed, and the MCU-mounted substrate 7 can be easily manufactured.
In the present embodiment, the insulating film non-forming portions 76 are provided on the same edges on the main surface 7a and the sub-surface 7b, but the present invention is not limited to this, and the edges on which the insulating film non-forming portions 76 are provided may be different on the main surface 7a and the sub-surface 7b, or the insulating film non-forming portions 76 may be provided only on one surface. The insulating film non-forming portion 76 may be provided only on the short edge 81e of the main surface 7a and/or the sub-surface 7b, or may be provided on the long edge 81d and the short edge 81e.
Noise that intrudes from the housing 11 easily enters a portion near the housing 11. This tendency becomes remarkable particularly when the case 11 is made of metal. Therefore, the insulating film non-forming portion 76 is preferably provided at a position closer to the electronic component mounted on the MCU-mounted substrate 7 than the case 11. In other words, the shortest distance from the ground pattern 78 exposed from the resist film 79 of the insulating film non-forming portion 76 to the housing 11 is preferably shorter than the shortest distance from the electronic component mounted on the MCU-mounted substrate 7 to the housing 11. Thus, even when a high-level electronic component (for example, the reactor Rc 2) is mounted on the MCU-mounted board 7, noise from the outside of the case 11 is more likely to intrude into the ground pattern 78 of the insulating film non-forming portion 76 than into the electronic component, and thus adverse effects on the electronic component due to noise can be suppressed.
In particular, in the power supply unit 10, since the MCU50 plays an important role, as shown in fig. 12, the shortest distance L1 from the ground pattern 78 exposed from the resist film 79 of the insulating film non-forming portion 76 to the case 11 is preferably shorter than the shortest distance L2 from the MCU50 to the case 11. Thus, noise from the outside of the case 11 is more likely to intrude into the ground pattern 78 of the insulating film non-forming portion 76 than into the MCU50, and thus erroneous operation of the MCU50 due to noise can be suppressed.
If the case 11 is composed of a plurality of members, noise is likely to intrude from the combined portion of the plurality of members. Therefore, in this case, the ground pattern 78 of the insulating film non-forming portion 76 is preferably present at a position closer to the electronic component mounted on the MCU-mounted substrate 7 than the combined portion of the case 11.
The insulating film non-forming portion 76 is not limited to being provided at the edge corresponding to the long side of the MCU-mounted substrate 7, and may be provided at the edge closest to the MCU50 or at the edge of both. In the present embodiment, the long edge 81d of the main surface 7a is the edge closest to the MCU50, but if the long edge 81d of the main surface 7a is not the edge closest to the MCU50, the insulating film non-forming portion 76 may be provided at the edge closest to the MCU 50. By providing the insulating film non-forming portion 76 at the edge closest to the MCU50, noise hardly intrudes into the MCU50 that plays an important role in the power supply unit 10, and thus erroneous operation of the MCU50 due to noise can be suppressed. Further, since the insulating film non-forming portion 76 is provided at the edge closest to the MCU50 and the edge facing the closest edge with the MCU50 interposed therebetween, noise is less likely to intrude into the MCU50, and thus erroneous operation of the MCU50 due to noise can be further suppressed.
Note that, regarding the selection of the edge where the insulating film non-forming portion 76 is provided, attention may be paid to the wiring pattern 77. That is, in the case where there is an edge near the thick (wide) wiring pattern 77 and an edge near the thin (wide) wiring pattern 77, the edge where the insulating film non-forming portion 76 is provided preferably includes an edge near the thick (wide) wiring pattern 77. Since the thick (wide) wiring pattern 77 is more likely to be noise-intruded than the thin (wide) wiring pattern 77, the insulating film non-forming portion 76 is provided at the edge in the vicinity of the thick (wide) wiring pattern 77, and thus the intrusion of noise into the wiring pattern 77 can be effectively suppressed. Even in this case, the distance from the ground pattern 78 exposed from the resist film 79 to the electronic component or the distance from the MCU50 is preferably longer than the distance from the ground pattern 78 to the thick (wide) wiring pattern 77. By disposing the electronic components such as the MCU50 further away from the insulating film non-forming portion 76, erroneous operation of the MCU50 due to noise can be suppressed.
Further, it is preferable that a plurality of through holes (not shown) connected to conductive patterns constituting ground lines of the first wiring layer 72a and/or the third wiring layer 72b are provided in the thick (wide) wiring pattern 77. Thus, even if noise does not enter the insulating film non-forming portion 76 and enters the thick (wide) wiring pattern 77, noise can enter the conductive patterns constituting the ground lines of the first wiring layer 72a and the third wiring layer 72b through the plurality of through holes, and adverse effects due to noise can be suppressed.
In the present embodiment, the insulating film non-forming portion 76 is not provided on the side edge 82g and the upper edge 82f, which are edges of the protruding portion 82, and the insulating film forming portion 75 is provided on the side edge 82g and the upper edge 82f of the protruding portion 82. As described above, the switch Sw4 and the positive electrode side discharge terminal 41a are attached to the protruding portion 82 of the main surface 7 a. The wiring pattern 77 formed by the protruding portion 82 shown in fig. 9 is a part of the VHEAT line Ln6 (see fig. 6) that supplies the fourth system voltage Vs4 output from the DC/DC converter 63 to the discharge terminal 41 (specifically, the positive electrode side discharge terminal 41 a), and the switch Sw4 that switches on and off the VHEAT line Ln6 is a member that greatly affects discharge control to the heater 21. By not providing the insulating film non-forming portion 76 at the side edge 82g which is the edge closest to the switch Sw4, the short circuit in the switch Sw4 can be suppressed.
In addition, the insulating film non-forming portion 76 is not provided at the upper edge 82f of the protruding portion 82, so that the short circuit in the switch Sw4 can be suppressed, and the MCU-mounted substrate 7 can be easily manufactured.
While various embodiments have been described above with reference to the drawings, the present invention is not limited to such examples. It is obvious that various modifications and corrections will be apparent to those skilled in the art within the scope of the present invention as described in the appended claims, and it is understood that they are naturally within the technical scope of the present invention. The components of the above embodiments may be arbitrarily combined within a range not departing from the gist of the invention.
For example, in the foregoing embodiment, the example was described in which the heater 21 was a heating portion that consumed the power supplied from the power supply BAT to generate the aerosol from the aerosol source, and the power was supplied from the discharge terminal 41 of the power supply unit 10 to the heater 21. For example, the heating unit for generating the aerosol may be constituted by a susceptor (inductor) incorporated in the first cartridge 20 or the like, and an induction heating coil for transmitting electric power to the susceptor by electromagnetic induction. When the heating unit is constituted by the susceptor and the induction heating coil, the discharge terminal 41 of the power supply unit 10 is connected to the induction heating coil, and supplies electric power to the induction heating coil.
In the present specification, at least the following matters are described. In addition, the components and the like corresponding to the above-described embodiments are shown in parentheses, but are not limited thereto.
(1) A power supply unit (power supply unit 10) of an aerosol-generating device (aerosol-generating device 1) is provided with:
a power supply (power supply BAT);
a heater connector (discharge terminal 41) to which a load (heater 21) that generates an aerosol from an aerosol source (aerosol source 22) by consuming electric power supplied from the power supply or a coil that transmits electric power to the load by electromagnetic induction is connected;
A control device (MCU 50) configured to control at least one of charging and discharging of the power supply; and
a circuit board (MCU-mounted board 7) on which the control device and the heater connector are mounted,
the circuit board is provided with:
wiring (wiring pattern 77) electrically connected to the control device and the heater connector;
a conductive portion (ground pattern 78) electrically connected to ground; and
an insulating film (resist film 79) covering at least a part of the wiring and the conductive portion,
the surface (main surface side surface layer 71a, sub surface side surface layer 71 b) of the circuit board has:
an insulating film forming portion (insulating film forming portion 75) in which the insulating film is formed; and
an insulating film non-forming portion (insulating film non-forming portion 76) in which the insulating film is not formed,
the insulating film non-forming portion is provided so as to extend along an edge of the circuit board, and at least a portion of the conductive portion located outside the wiring is exposed from the insulating film.
According to (1), since at least a part of the conductive portion extending along the edge of the circuit board and located outside the wiring is exposed from the insulating film in the insulating film non-forming portion, noise from outside easily intrudes into the ground via the conductive portion, and thus adverse effects due to noise can be suppressed. Further, as a countermeasure against noise, other electronic components such as a capacitor can be simplified or omitted, and thus, downsizing and cost reduction of the power supply unit of the aerosol-generating device can be achieved.
(2) The power supply unit of an aerosol-generating device according to (1), wherein,
the edge provided with the insulating film non-forming portion is at least one edge (long edge 81 d) of the plurality of edges of the circuit substrate.
According to (2), the insulating film non-forming portion may be provided only at the necessary edge.
(3) The power supply unit of an aerosol-generating device according to (1) or (2), wherein,
the circuit board has a rectangular portion (rectangular portion 81),
the edge provided with the insulating film non-forming portion includes an edge (long edge 81 d) corresponding to a long side of the rectangular portion.
According to (3), by providing the insulating film non-formed portion along the edge corresponding to the long side of the rectangular portion, the conductive portion into which noise enters can be ensured longer, and thus adverse effects due to noise can be further suppressed.
(4) The power supply unit of an aerosol-generating device according to (3), wherein,
the insulating film non-forming portion is continuous from one end of the edge to the other end.
According to (4), the adverse effect due to noise can be suppressed, and the circuit board can be easily manufactured.
(5) The power supply unit of an aerosol-generating device according to any one of (1) to (4), wherein,
The power supply unit of the aerosol-generating device comprises a housing (housing 11) for housing at least the circuit board,
an electronic component connected to the wiring is mounted on the circuit board,
the shortest distance from the conductive portion exposed from the insulating film to the frame is shorter than the shortest distance from the electronic component to the frame.
According to (5), noise from the outside of the housing is more likely to intrude into the conductive portion than into the electronic component, and thus adverse effects on the electronic component due to noise can be suppressed.
(6) The power supply unit of an aerosol-generating device according to (5), wherein,
the electronic component is the control device.
According to (6), noise from outside the housing is more likely to intrude into the conductive portion than the intrusion control device, and thus erroneous operation of the control device due to noise can be suppressed.
(7) The power supply unit of an aerosol-generating device according to any one of (1) to (6), wherein,
the edge provided with the insulating film non-forming portion includes an edge (long edge 81 d) closest to the control device.
According to (7), since noise hardly intrudes into the control device, erroneous operation of the control device due to noise can be suppressed.
(8) The power supply unit of an aerosol-generating device according to any one of (1) to (7), wherein,
the circuit substrate has a rectangular portion,
the edge provided with the insulating film non-forming portion includes:
a first edge (long edge 81 d) closest to the control means; and
a second edge (long edge 81 d) facing the first edge with the control device interposed therebetween.
According to (8), since noise is less likely to intrude into the control device, erroneous operation of the control device due to noise can be further suppressed.
(9) The power supply unit of an aerosol-generating device according to any one of (1) to (8), wherein,
the wiring includes:
a first wiring (wiring pattern 77); and
a second wiring (wiring pattern 77) having a width larger than that of the first wiring,
the insulating film non-forming portion includes an edge at a position where a distance to the second wiring is shorter than a distance to the first wiring.
According to (9), since the insulating film non-formed portion is provided at the edge of the vicinity of the wiring having a large width, which is liable to be intruded by noise, intrusion of noise into the wiring can be effectively suppressed.
(10) The power supply unit of an aerosol-generating device according to (9), wherein,
The distance from the edge provided with the insulating film non-forming portion to the control device is longer than the distance from the edge provided with the insulating film non-forming portion to the second wiring.
According to (10), by disposing the control device that plays an important role in the power supply unit of the aerosol-generating device further away from the insulating film non-forming portion, erroneous operation of the control device due to noise can be suppressed.
(11) The power supply unit of an aerosol-generating device according to (10), wherein,
the second wiring is provided with a plurality of through holes,
the through hole is connected with the ground.
According to (11), even when noise does not enter the insulating film non-forming portion and enters the second wiring, noise can be made to enter the ground via the plurality of through holes, and adverse effects due to noise can be suppressed.
(12) The power supply unit of an aerosol-generating device according to any one of (1) to (11), wherein,
the power supply unit of the aerosol-generating device includes a switch (switch Sw 4), the switch (switch Sw 4) is mounted on the circuit board, connected to the wiring, turns on/off the supply of electric power to the heater connector,
The edge provided with the insulating film non-forming portion does not include an edge (side edge 82 g) closest to the switch.
The switch is a component that greatly affects discharge control to the heater. According to (12), since the insulating film non-forming portion is not provided at the edge closest to the switch, short circuit in the switch can be suppressed.
(13) The power supply unit of an aerosol-generating device according to (12), wherein,
the circuit board is provided with:
a rectangular part (rectangular part 81) to which the control device is attached; and
a convex portion (a protruding portion 82) protruding from the rectangular portion, and the switch is mounted,
the edge provided with the insulating film non-forming portion does not include an edge (side edge 82g, upper edge 82 f) of the convex portion.
According to (13), since the insulating film non-forming portion is not provided in the convex portion, short-circuiting in the switch can be suppressed, and the circuit board can be easily manufactured.
(14) The power supply unit of an aerosol-generating device according to (13), wherein,
the heater connector is mounted on the boss.
According to (14), the heater connector and the switch can be disposed in close proximity.
(15) The power supply unit of an aerosol-generating device according to any one of (1) to (14), wherein,
The circuit board has a rectangular portion (rectangular portion 81),
the insulating film formation part includes an edge (short edge 81 e) corresponding to a short side of the rectangular part.
According to (15), the insulating film non-forming portion is not provided at the portion of the conductive portion where the noise cannot be ensured to enter for a long period of time, so that the circuit board can be easily manufactured.
Description of the reference numerals
1: an aerosol aspirator (aerosol generating device);
7: an MCU-mounted substrate (circuit board);
10: a power supply unit;
11: a housing (frame);
21: a heater (load);
22: an aerosol source;
41: discharge terminals (heater connectors);
50: MCU (control device);
71a: a main surface side surface layer (surface of the circuit board);
71b: a sub-surface side surface layer (surface of the circuit board);
75: an insulating film forming section;
76: an insulating film non-forming portion;
77: wiring patterns (wirings);
78: a ground pattern (conductive portion);
79: a resist film;
81: a rectangular portion;
81d: long edges (edges corresponding to long sides);
81e: short edges (edges corresponding to short sides);
82: a protruding portion;
82g: side edges (edges of the convex portions);
82f: upper edge (edge of the convex portion);
l1: shortest distance (shortest distance from the conductive portion exposed from the insulating film to the frame);
L2: shortest distance (from the control device to the shortest distance);
BAT: a power supply;
sw4: and (3) a switch.
Claims (15)
1. A power supply unit of an aerosol-generating device is provided with:
a power supply;
a heater connector to which a load that generates an aerosol from an aerosol source by consuming electric power supplied from the power supply or a coil that transmits electric power to the load by electromagnetic induction is connected;
a control device configured to control at least one of charging and discharging of the power supply; and
a circuit board on which the control device and the heater connector are mounted,
the circuit board is provided with:
wiring electrically connected to the control device and the heater connector;
a conductive part electrically connected to ground; and
an insulating film covering at least a part of the wiring and the conductive portion,
the surface of the circuit substrate has:
an insulating film forming section formed with the insulating film; and
an insulating film non-forming portion, the insulating film not being formed,
the insulating film non-forming portion is provided so as to extend along an edge of the circuit board, and at least a portion of the conductive portion located outside the wiring is exposed from the insulating film.
2. A power supply unit of an aerosol-generating device according to claim 1, wherein,
The edge provided with the insulating film non-forming portion is at least one edge of a plurality of edges of the circuit substrate.
3. A power supply unit of an aerosol-generating device according to claim 1 or 2, wherein,
the circuit substrate has a rectangular portion,
the edge provided with the insulating film non-forming portion includes an edge corresponding to a long side of the rectangular portion.
4. A power supply unit for an aerosol-generating device according to claim 3, wherein,
the insulating film non-forming portion is continuous from one end of the edge to the other end.
5. A power supply unit of an aerosol-generating device according to any of claims 1-4, wherein,
the power supply unit of the aerosol-generating device comprises a housing for accommodating at least the circuit board,
an electronic component connected to the wiring is mounted on the circuit board,
the shortest distance from the conductive portion exposed from the insulating film to the frame is shorter than the shortest distance from the electronic component to the frame.
6. A power supply unit of an aerosol-generating device according to claim 5, wherein,
the electronic component is the control device.
7. A power supply unit of an aerosol-generating device according to any of claims 1-6, wherein,
The edge provided with the insulating film non-forming portion includes an edge closest to the control device.
8. A power supply unit of an aerosol-generating device according to any of claims 1-7, wherein,
the circuit substrate has a rectangular portion,
the edge provided with the insulating film non-forming portion includes:
a first edge nearest to the control device; and
a second edge opposite to the first edge via the control device.
9. A power supply unit of an aerosol-generating device according to any of claims 1-8, wherein,
the wiring includes:
a first wiring; and
a second wiring having a width larger than that of the first wiring,
the insulating film non-forming portion includes an edge at a position where a distance to the second wiring is shorter than a distance to the first wiring.
10. A power supply unit of an aerosol-generating device according to claim 9, wherein,
the distance from the edge provided with the insulating film non-forming portion to the control device is longer than the distance from the edge provided with the insulating film non-forming portion to the second wiring.
11. A power supply unit of an aerosol-generating device according to claim 10, wherein,
The second wiring is provided with a plurality of through holes,
the through hole is connected with the ground.
12. A power supply unit of an aerosol-generating device according to any of claims 1-11, wherein,
the power supply unit of the aerosol-generating device includes a switch mounted on the circuit board and connected to the wiring to turn on/off the power supply to the heater connector,
the edge provided with the insulating film non-forming portion does not include an edge closest to the switch.
13. A power supply unit of an aerosol-generating device according to claim 12, wherein,
the circuit board is provided with:
a rectangular part provided with the control device; and
a convex portion protruding from the rectangular portion and mounted with the switch,
the edge provided with the insulating film non-forming portion does not include an edge of the convex portion.
14. A power supply unit of an aerosol-generating device according to claim 13, wherein,
the heater connector is mounted on the boss.
15. A power supply unit of an aerosol-generating device according to any of claims 1-14, wherein,
the circuit substrate has a rectangular portion,
The insulating film formation portion includes an edge corresponding to a short side of the rectangular portion.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2021/025828 WO2023281712A1 (en) | 2021-07-08 | 2021-07-08 | Power supply unit for aerosol generator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117320576A true CN117320576A (en) | 2023-12-29 |
Family
ID=84800537
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202180098134.XA Pending CN117320576A (en) | 2021-07-08 | 2021-07-08 | Power supply unit for aerosol-generating device |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7470870B2 (en) |
| CN (1) | CN117320576A (en) |
| WO (1) | WO2023281712A1 (en) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2006075381A1 (en) * | 2005-01-14 | 2008-06-12 | 株式会社ルネサステクノロジ | Camera module and semiconductor device |
| JP4611159B2 (en) * | 2005-09-20 | 2011-01-12 | 日東電工株式会社 | Printed circuit board |
| JP2007087817A (en) | 2005-09-22 | 2007-04-05 | Fujifilm Corp | Flexible cable |
| TWI769355B (en) | 2017-12-29 | 2022-07-01 | 瑞士商傑太日煙國際股份有限公司 | Induction heating assembly for a vapour generating device |
| JP6875595B1 (en) | 2020-07-09 | 2021-05-26 | 日本たばこ産業株式会社 | Aerosol aspirator power supply unit |
-
2021
- 2021-07-08 CN CN202180098134.XA patent/CN117320576A/en active Pending
- 2021-07-08 JP JP2023532995A patent/JP7470870B2/en active Active
- 2021-07-08 WO PCT/JP2021/025828 patent/WO2023281712A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| JP7470870B2 (en) | 2024-04-18 |
| WO2023281712A1 (en) | 2023-01-12 |
| JPWO2023281712A1 (en) | 2023-01-12 |
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