WO2023105767A1 - Unité d'alimentation électrique pour dispositif de génération d'aérosol - Google Patents

Unité d'alimentation électrique pour dispositif de génération d'aérosol Download PDF

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Publication number
WO2023105767A1
WO2023105767A1 PCT/JP2021/045593 JP2021045593W WO2023105767A1 WO 2023105767 A1 WO2023105767 A1 WO 2023105767A1 JP 2021045593 W JP2021045593 W JP 2021045593W WO 2023105767 A1 WO2023105767 A1 WO 2023105767A1
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Prior art keywords
terminal
power supply
supply unit
conductive pattern
layer
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PCT/JP2021/045593
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English (en)
Japanese (ja)
Inventor
啓司 丸橋
稔 北原
Original Assignee
日本たばこ産業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 日本たばこ産業株式会社 filed Critical 日本たばこ産業株式会社
Priority to CN202180104897.0A priority Critical patent/CN118488793A/zh
Priority to JP2023566040A priority patent/JPWO2023105767A1/ja
Priority to PCT/JP2021/045593 priority patent/WO2023105767A1/fr
Publication of WO2023105767A1 publication Critical patent/WO2023105767A1/fr

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    • A—HUMAN NECESSITIES
    • A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
    • A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
    • A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
    • A24F40/40—Constructional details, e.g. connection of cartridges and battery parts

Definitions

  • the present invention relates to a power supply unit for an aerosol generator.
  • Patent document 1 includes a heater, a battery that supplies power to heat the heater, a control unit, a main PCB and a sub-PCB that are made of a hard material, and the main PCB is an aerosol
  • the sub-PCB is arranged parallel to the longitudinal direction of the aerosol-generating device, the sub-PCB is arranged perpendicular to the longitudinal direction of the aerosol-generating device, and the main PCB and the sub-PCB are connection PCBs made of a flexible material.
  • An aerosol generating device is described that is electrically coupled by a.
  • the aerosol generator In order for the aerosol generator to generate a sufficient amount of aerosol, it is necessary to supply a large amount of power to the atomizer that atomizes the aerosol source. Therefore, it is required to reduce the heat and noise generated in the circuit board.
  • An object of the present invention is to provide a power supply unit for an aerosol generator capable of reducing heat generation and noise.
  • a power supply unit of an aerosol generating device includes a power supply, an atomizer connector electrically connected to an atomizer that atomizes an aerosol source, and a power supply from the power supply to the atomizer connector. and a flexible circuit including a plurality of conductive patterns connected to the rigid circuit board and the atomizer connector and carrying electrical power to atomize the aerosol source. a substrate, wherein the flexible circuit board includes a first layer and a second layer, and wherein the plurality of conductive patterns are formed on the first layer and the second layer.
  • FIG. 1 is a perspective view of an aerosol generator 200;
  • FIG. 2 is another perspective view of the aerosol generator 200.
  • FIG. 2 is an exploded perspective view of the aerosol generator 200.
  • FIG. It is a left view of internal unit 2A. It is a right side view of 2 A of internal units. It is a perspective view which shows the structure of the heating part 60 of internal unit 2A, and the circuit part 70.
  • FIG. 2 is a diagram showing a surface 201 of a main board 20;
  • FIG. 3 is a diagram showing a back surface 202 of the main substrate 20;
  • FIG. 2 is a diagram showing a schematic configuration of a circuit provided on a main substrate 20;
  • FIG. 10 is a circuit diagram showing electronic components related to operation in a heating mode extracted from the circuit shown in FIG.
  • FIG. 10 is a circuit diagram showing electronic components extracted from the circuit shown in FIG. 9 and related to heating control of the seat heater HTR and the liquid heater, drive control of the vibration motor 13, and drive control of the LED 21D;
  • FIG. 10 is a circuit diagram showing electronic components related to restarting of the MCU 6 extracted from the circuit shown in FIG. 9;
  • FIG. 4 is a front view of the main FPC 23 as seen from the left side when the main FPC 23 is unfolded so that the thickness direction matches the left-right direction;
  • FIG. 4 is a front view of the main FPC 23 as seen from the right side when the main FPC 23 is unfolded so that the thickness direction coincides with the left-right direction;
  • 15 is an enlarged view of a range AR shown in FIG. 14;
  • FIG. 1 The power supply unit of the aerosol generator, which is one embodiment of the present invention, will be described below.
  • an aerosol generator equipped with a power supply unit of this embodiment will be described with reference to FIGS. 1 to 8.
  • FIG. 1 An aerosol generator equipped with a power supply unit of this embodiment will be described with reference to FIGS. 1 to 8.
  • FIG. 1 An aerosol generator equipped with a power supply unit of this embodiment will be described with reference to FIGS. 1 to 8.
  • the aerosol generator 200 is a device for generating flavored aerosol without combustion and inhaling the generated aerosol.
  • the aerosol generator 200 preferably has a size that fits in the hand, and has, for example, a rounded rectangular parallelepiped shape as shown in FIGS. 1 and 2 .
  • the shape of the aerosol generating device 200 is not limited to this, and may be a rod shape, an egg shape, or the like.
  • the vertical direction, the front-rear direction, and the left-right direction are referred to in descending order of length.
  • front, rear, left, right, upper, and lower are defined as shown in FIGS. is denoted as R, upward as U, and downward as D.
  • the aerosol generator 200 includes a power supply unit 100, a first cartridge 110, and a second cartridge 120.
  • the first cartridge 110 and the second cartridge 120 are detachable from the power supply unit 100 .
  • the first cartridge 110 and the second cartridge 120 are each replaceable.
  • the power supply unit 100 includes an internal unit 2A and a case 3a, and at least part of the internal unit 2A is accommodated in the case 3a.
  • the case 3a is composed of a first case 3A and a second case 3B that are detachable in the left-right direction (thickness direction), and the first case 3A and the second case 3B are assembled in the left-right direction (thickness direction).
  • the front surface, rear surface, left surface, and right surface of the power supply unit 100 are formed.
  • the first case 3A is supported on the left surface of a chassis 50, which will be described later, included in the internal unit 2A
  • the second case 3B is supported on the right surface of the chassis 50.
  • a capsule holder 4A is provided on the upper surface of the power supply unit 100 in front.
  • the capsule holder 4A is provided with an opening 4a that opens upward.
  • the capsule holder 4A is configured such that the second cartridge 120 can be inserted through the opening 4a.
  • a mouthpiece 130 is detachably provided on the second cartridge 120 .
  • the upper surface of the power supply unit 100 is formed by an OLED (Organic Light-Emitting Diode) cover 5a arranged behind the opening 4a, and the lower surface of the power supply unit 100 is a lower cover provided with the charging terminal 1. 8a and a pivotable lower lid 7a.
  • OLED Organic Light-Emitting Diode
  • an inclined surface that slopes downward toward the rear is provided.
  • the inclined surface is provided with an operation section that can be operated by the user.
  • the operation unit of the present embodiment is a button type switch BT, but may be configured by a touch panel or the like.
  • the operation unit is used to activate/shutdown/operate a later-described MCU (Micro Controller Unit) 6 and various sensors, reflecting the user's intention of use.
  • MCU Micro Controller Unit
  • the charging terminal 1 accessible from the lower cover 8a is configured to be electrically connectable to an external power supply (not shown) capable of supplying the power supply unit 100 with power for charging the power supply ba included in the battery pack BP.
  • the charging terminal 1 is, for example, a receptacle into which a mating plug can be inserted.
  • a receptacle into which various USB terminals or the like can be inserted can be used.
  • the charging terminal 1 is a USB Type-C receptacle.
  • the charging terminal 1 may include, for example, a power receiving coil and be configured to be capable of contactlessly receiving power transmitted from an external power supply.
  • the method of power transmission in this case may be an electromagnetic induction type, a magnetic resonance type, or a combination of the electromagnetic induction type and the magnetic resonance type.
  • the charging terminal 1 may be connectable to various USB terminals and the like, and may have the power receiving coil described above.
  • the internal unit 2A includes a battery pack BP, a chassis 50, a heating section 60, a circuit section 70, a notification section, and various sensors, as shown in FIGS.
  • the chassis 50 includes a cylindrical cartridge holding portion 51 positioned at the front, a semi-cylindrical battery holding portion 52 positioned at the rear and notched on the left side, and a cartridge holding portion.
  • a plate-like connecting portion 53 that connects the portion 51 and the battery holding portion 52, and a motor holding portion 54 that is provided below and to the right of the connecting portion 53 and straddles the cartridge holding portion 51 and the battery holding portion 52.
  • a sensor holding portion 55 provided on the rear left side of the cartridge holding portion 51 .
  • the first cartridge 110 is inserted into the cartridge holding portion 51 from below with the lower lid 7a opened.
  • the first cartridge 110 is accommodated in the cartridge holding portion 51 by closing the lower lid 7a with the first cartridge 110 inserted.
  • a capsule holder 4A is attached to the upper portion of the cartridge holding portion 51 .
  • the cartridge holding portion 51 is provided with a longitudinal through-hole in the front, and the aerosol source of the first cartridge 110 can be viewed from the remaining amount confirmation window 3w provided at the joining portion of the first case 3A and the second case 3B.
  • the remaining amount and light from an LED (Light Emitting Diode) 21D which will be described later, are visible.
  • the first cartridge 110 will be described later.
  • a battery pack BP is arranged in the battery holding portion 52 .
  • the battery pack BP includes a power source ba and a power source thermistor for detecting the temperature of the power source ba.
  • the power source ba is a rechargeable secondary battery, an electric double layer capacitor, or the like, preferably a lithium ion secondary battery.
  • the electrolyte of the power supply ba may be composed of one or a combination of a gel electrolyte, an electrolytic solution, a solid electrolyte, and an ionic liquid.
  • the vibration motor 13 is arranged in the motor holding portion 54 .
  • the sensor holder 55 is provided with a later-described suction sensor 15 that outputs an output corresponding to a user's suction action (puff action).
  • the heating unit 60 includes a cylindrical heat transfer tube 61 and a seat heater HTR wound around the outer circumference of the heat transfer tube 61.
  • the aforementioned capsule holder 4A is spaced apart around the seat heater HTR.
  • An air layer between the capsule holder 4A and the seat heater HTR functions as a heat insulator.
  • the lower portion of the second cartridge 120 inserted through the opening 4a of the capsule holder 4A is accommodated in the heat transfer tube 61, and the lower portion of the second cartridge 120 is heated by the seat heater HTR. This makes it easier for the flavor source stored in the second cartridge 120 to release the flavor than in the case where the heating unit 60 is not provided, so that the flavor is easily added to the aerosol.
  • the heating unit 60 may be any element that can heat the second cartridge 120 .
  • the element include a resistance heating element, a ceramic heater, an induction heater, and the like.
  • the resistance heating element for example, one having PTC (Positive Temperature Coefficient) characteristics in which the resistance value increases as the temperature increases is preferably used. Instead of this, one having NTC (Negative Temperature Coefficient) characteristics in which the resistance value decreases as the temperature increases may be used.
  • the heating unit 60 has a function of defining a flow path for air to be supplied to the second cartridge 120 and a function of heating the second cartridge 120 .
  • the notification unit notifies various information such as the state of charge of the power supply ba, the remaining amount of the first cartridge 110, the remaining amount of the second cartridge 130, and the like.
  • the notification unit of this embodiment includes the LED 21D and the vibration motor 13.
  • the notification unit may be configured by a light emitting element such as the LED 21D, may be configured by a vibration element such as the vibration motor 13, or may be configured by a sound output element.
  • the notification unit may be a combination of two or more elements selected from the light emitting element, the vibration element, and the sound output element.
  • the various sensors include a suction sensor 15 that detects the user's puff action (suction action), a heater temperature sensor that detects the temperature of the seat heater HTR, and the like.
  • the suction sensor 15 is composed of, for example, a condenser microphone, a pressure sensor, a flow sensor, and the like. A plurality of suction sensors 15 may be spaced apart and the puffing action may be detected from the difference in their output values.
  • the heater temperature sensor includes a first thermistor th1 and a second thermistor th2. The first thermistor th1 and the second thermistor th2 are preferably in contact with or close to the seat heater HTR. If the seat heater HTR has PTC characteristics or NTC characteristics, the seat heater HTR itself may be used as the heater temperature sensor. Although the heater temperature sensor is composed of two thermistors, it may be composed of one thermistor.
  • the circuit section 70 includes four circuit boards, three FPCs (Flexible Printed Circuits), a plurality of ICs (Integrated Circuits), and a plurality of elements.
  • the four circuit boards are composed of a main board 20, a puff sensor board 21, a pogo pin board 22, and an OLED board 26.
  • the three FPCs consist of a main FPC 23, a heater FPC 24, and an OLED FPC 25. These four circuit boards are rigid and sufficiently rigid than the three FPCs.
  • the main board 20 is arranged between the battery pack BP and the rear surface of the case 3a (the rear surface of the power supply unit 100) so that the element mounting surface faces the front-rear direction.
  • the main substrate 20 is configured by stacking a plurality of substrates (six layers in this embodiment), and electronic components (elements) such as the MCU 6 and the charging IC 3 are mounted.
  • the MCU 6 stores various sensor devices such as the suction sensor 15, an operation unit, a notification unit, the number of puffing operations or the load, the energization time of the seat heater HTR, and the like. It is a control device that is connected to a memory or the like and performs various controls of the aerosol generation device 200 .
  • the MCU 6 is mainly composed of a processor, and further includes storage media such as RAM (Random Access Memory) necessary for the operation of the processor and ROM (Read Only Memory) for storing various information.
  • RAM Random Access Memory
  • ROM Read Only Memory
  • a processor in this specification is, for example, an electric circuit in which circuit elements such as semiconductor elements are combined.
  • the charging IC 3 is an IC that controls charging of the power supply ba with power input from the charging terminal 1 and supplies the power of the power supply ba to the electronic components of the main substrate 20 and the like.
  • FIG. 7 is a diagram showing the front surface 201 of the main board 20
  • FIG. 8 is a diagram showing the back surface 202 of the main board 20.
  • the main board 20 has a plate-like shape extending vertically.
  • FIGS. 7 and 8 as side surfaces orthogonal to the longitudinal direction of the main board 20, an upper side surface 20SU and a lower side surface 20SU are shown. 20SD are shown.
  • As side surfaces perpendicular to the short direction of the main board 20 a left side surface 20SL and a right side surface 20SR are shown.
  • the MCU 6 and charging IC 3 are mounted on the back surface 202 of the main substrate 20 together with the charging terminal 1.
  • a debug connector 20E is further mounted on the rear surface 202 .
  • the debug connector 20E is an interface for rewriting the program of the MCU 6 from an external device such as a personal computer.
  • on the front surface 201 of the main substrate 20 are an OLED connector 20C, a heater connector 20B, a main connector 20A, and a battery connected to the battery pack BP via lead wires 16 (see FIG. 6).
  • a connector 20D is mounted.
  • the puff sensor board 21 is placed on the sensor holding portion 55 of the chassis 50 so that the element mounting surface faces the right front and the left rear.
  • a suction sensor 15 is mounted on the puff sensor substrate 21 .
  • the OLED substrate 26 is arranged between the battery pack BP and the OLED cover 5a so that the element mounting surface faces up and down.
  • the OLED panel 17 is mounted on the OLED substrate 26 .
  • the pogo-pin board 22 is placed on the lower lid 7a so that the element mounting surface faces the vertical direction when the lower lid 7a is closed.
  • the pogo pin board 22 has input contacts P1 to P3 to which power is supplied from the main board 20 via the main FPC 23, and pogo pins p1 to P3, which are connectors electrically connected to loads provided on the first cartridge 110. p3, and wiring connecting the pogo pins p1 to p3 and the input side contacts P1 to P3 are provided.
  • the input side contacts P1 to P3 are electrically connected to the main FPC 23 only when the lower lid 7a is closed.
  • Three pogo pins p1 to p3 are provided at equal intervals in the circumferential direction, and at least two pogo pins are electrically connected to the + terminal and - terminal of the first cartridge 110 accommodated in the cartridge holding portion 51. Configured.
  • the left side of the battery pack BP held by the battery holding portion 52 is exposed from the battery holding portion 52 by the semi-cylindrical battery holding portion 52 .
  • OLED FPCs 25 are arranged so as to overlap each other.
  • the main FPC 23 is wired closest to the battery pack BP, the OLED FPC 25 is wired so as to partially overlap the main FPC 23, and the heater FPC 24 is wired so as to overlap the OLED FPC 25. That is, the heater FPC 24 to which the largest electric power is supplied among the three FPCs is arranged farthest from the battery pack BP.
  • the main FPC 23 has a substantially cross-shaped unfolded shape, and is folded backward at a portion overlapping with the heater FPC 24 . In other words, the main FPC 23 is folded wiring.
  • the folded portion of the main FPC 23 tends to float in the left-right direction, but the heater FPC 24 and the OLED FPC 25 overlap this portion, thereby preventing such floatation.
  • the switch BT is directly mounted on the main FPC 23 without a rigid substrate or the like.
  • the OLED FPC 25 has one end connected to the OLED connector 20C of the main substrate 20 and the other end connected to the OLED substrate 26 .
  • the main FPC 23 connects the main connector 20A of the main board 20, the switch BT of the operating section, the connector 21B of the puff sensor board 21, and the input side contacts P1 to P3 of the pogo pin board 22.
  • One end of the heater FPC 24 is connected to the heater connector 20B of the main board 20, and the seat heater HTR is integrally formed at the other end.
  • the first cartridge 110 contains a reservoir storing an aerosol source, an electric load atomizing the aerosol source, a wick drawing the aerosol source from the reservoir to the load, and the aerosol source inside a cylindrical cartridge case 111. and an aerosol flow path through which the aerosol generated by being atomized flows toward the second cartridge 120 .
  • Aerosol sources include liquids such as glycerin, propylene glycol, or water.
  • the load is a heating element that heats the aerosol source without combustion by electric power supplied from the power supply ba via the pogo pins p1 to p3 of the pogo pin substrate 22.
  • the load is a heating wire (coil ).
  • the load atomizes the aerosol source by heating the aerosol source.
  • a heating resistor, a ceramic heater, an induction heater, or the like can be used as the load.
  • the load provided on the first cartridge 110 is also referred to as a liquid heater.
  • the aerosol channel is connected to the second cartridge 120 via the channel forming body 19 (see FIG. 6) accommodated in the cartridge holding portion 51 of the chassis 50.
  • the second cartridge 120 stores a flavor source.
  • the flavor source is heated by heating the second cartridge 120 by the seat heater HTR.
  • the second cartridge 120 adds flavor to the aerosol by passing the aerosol generated by atomizing the aerosol source by the liquid heater through the flavor source.
  • raw material pieces constituting the flavor source cut tobacco or a molded body obtained by molding tobacco raw materials into granules can be used.
  • the flavor source may be composed of plants other than tobacco (for example, mint, Chinese medicine, herbs, etc.). Flavor sources such as menthol may be added to the flavor source.
  • the aerosol generator 200 can generate a flavored aerosol from an aerosol source and a flavor source. That is, the aerosol source and the flavor source constitute an aerosol generating source that generates a flavored aerosol.
  • the aerosol generation source in the aerosol generation device 200 is a part that the user replaces and uses. This part is provided to the user as one set, for example, one first cartridge 110 and one or more (for example, five) second cartridges 120 . Also, the battery pack BP can be repeatedly charged and discharged unless the power supply ba is significantly degraded. Therefore, in the aerosol generating device 200, the frequency of replacement of the power supply unit 100 or the battery pack BP is the lowest, the frequency of replacement of the first cartridge 110 is the second lowest, and the frequency of replacement of the second cartridge 120 is the highest. Note that the first cartridge 110 and the second cartridge 120 may be integrated into one cartridge. A configuration or the like in which a drug or the like is added to the aerosol source instead of the flavor source may be used.
  • the aerosol generator 200 configured in this way, air that has flowed in from an air intake port (not shown) provided in the case 3a or the internal unit 2A passes through the vicinity of the load of the first cartridge 110.
  • the load atomizes the aerosol source drawn from the reservoir by the wick.
  • the atomized aerosol flows through the aerosol channel together with the air that has flowed in from the inlet, and is supplied to the second cartridge 120 via the channel forming body 19 .
  • the aerosol supplied to the second cartridge 120 is flavored by passing through the flavor source and supplied to the mouthpiece 131 of the mouthpiece 130 .
  • the lower lid 7a is configured to be rotatable around a rotation axis Ax extending in the left-right direction shown in FIG. Specifically, the front end of the lower lid 7a moves counterclockwise from the closed state (the state of covering the hollow portion of the cartridge holding portion 51) shown in FIG. part is exposed).
  • the pogo-pin board 22 has a flat plate shape, and input contacts P1 to P3 are provided at the rear end of the upper surface of the pogo-pin board 22.
  • the input contacts P1 to P3 are configured by projections protruding upward.
  • pogo pins p1 to p3 are provided which are projections protruding upward.
  • the pogo pin substrate 22 is fixed to the inner surface (upper surface) of the lower lid 7a.
  • the input-side contacts P1 to P3 of the pogo pin board 22 come into contact with terminals 81T to 83T of conductive patterns 81 to 83 provided on the main FPC 23, which will be described later, thereby connecting the main FPC 23 and the pogo pin board. 22 is established.
  • the input side contacts P1-P3 of the pogo-pin board 22 are separated from the terminals 81T-83T of the conductive patterns 81-83 and are out of contact with the conductive patterns 81-83.
  • the electrical connection between the main FPC 23 and the pogo pin board 22 is released.
  • the main FPC 23 is accommodated in the case 3 so as not to be deformed by the opening and closing operation of the lower lid 7a. That the main FPC 23 does not deform means that the position of the main FPC 23 in the case 3 does not substantially change.
  • the lower lid 7a and the pogo-pin substrate 22 fixed thereto serve as places to which force is applied when the first cartridge 110 is inserted into or removed from the cartridge holding portion 51.
  • the pogo-pin board 22 is composed of a rigid circuit board.
  • the durability of the power supply unit 100 can be improved by using an inexpensive and rigid rigid circuit board in such a portion.
  • electrical connection between the pogo-pin board 22 and the main FPC 23 is established only when the lower lid 7a is closed. As a result, the main FPC 23 is less likely to be damaged than when the main FPC 23 is interlocked with the rotation of the lower lid 7a.
  • the input-side contacts P1 to P3 that come into contact with the main FPC 23 are configured by projections that require a small contact area. Therefore, the external force applied to the main FPC 23 when the lower lid 7a is opened and closed and the stress caused by this external force can be reduced. Further, in this embodiment, it is not necessary to insert or remove the first cartridge 110 when inserting or removing the second cartridge 120 into or from the capsule holder 4A.
  • the structure requires opening and closing of the lower lid 7a in order to insert and remove the first cartridge 110, which is replaced less frequently than the second cartridge 120. As shown in FIG. As a result, frequent opening and closing of the lower lid 7a can be prevented, and the durability of the power supply unit 100 can be improved.
  • FIG. 9 is a diagram showing a schematic configuration of a circuit provided on the main substrate 20. As shown in FIG. In addition to the circuit of the main board 20, FIG. , and the battery pack BP connected to the battery connector 20D.
  • main ICs which are electronic components in which a plurality of circuit elements are chipped, are provided: a protection IC 2, a charging IC 3, an LDO (Low Dropout) regulator (hereinafter referred to as LDO) 4, and a DC/DC
  • a booster circuit 5 configured by a converter
  • an MCU 6 a load switch (hereinafter referred to as LSW) 7 configured by combining a capacitor, a resistor, a transistor, etc., a multiplexer 8, and a flip-flop (hereinafter referred to as FF).
  • LSW load switch
  • FF flip-flop
  • the main board 20 further includes switches Q1 to Q9 configured by MOSFETs (metal-oxide-semiconductor field-effect transistors), resistors R1 to R12, RA and RB having fixed electrical resistance values, and a capacitor C1. , a capacitor C2, a varistor V, a varistor V1, a reactor L3 connected to the charging IC 3, a reactor L5 connected to the booster circuit 5, and a reactor L11 connected to the booster circuit 11.
  • the switch Q3, switch Q4, switch Q7, switch Q8, and switch Q9 are each composed of an N-channel MOSFET.
  • the switch Q1, switch Q2, switch Q5, and switch Q6 are each composed of a P-channel MOSFET. Each of the switches Q1 to Q8 is switched between an on state and an off state by controlling the potential of the gate terminal by the MCU6.
  • a terminal VCC and a terminal VDD mounted on the chip indicate power supply terminals on the high potential side, respectively.
  • a terminal VSS and a terminal GND mounted on the chip respectively represent power supply terminals on the low potential side (reference potential side).
  • the difference between the potential of the power supply terminal on the high potential side and the potential of the power supply terminal on the low potential side is the power supply voltage (operating voltage). Chipped electronic components use this power supply voltage to perform various functions.
  • the terminal GND and terminal VSS of each IC are each connected to a ground line.
  • the terminal GND of the charging terminal 1, the negative power supply terminal of the operational amplifier OP1, and the negative power supply terminal of the operational amplifier OP2 are each connected to a ground line.
  • a battery connector 20 ⁇ /b>D (see near left center in FIG. 9 ) provided on the main substrate 20 includes a terminal BAT connected to the detection terminal SNS of the charging IC 3 and a charging terminal BAT of the charging IC 3 , and the ground of the main substrate 20 . It has a terminal GND connected to the line and a terminal TH3 connected to terminal P25 of MCU6.
  • a terminal BAT of the battery connector 20D is connected by a lead wire 16 to a positive terminal of a power source ba included in the battery pack BP.
  • a terminal TH3 of the battery connector 20D is connected by a lead wire 16 to a positive terminal of a power supply thermistor th3 included in the battery pack BP.
  • a terminal GND of the battery connector 20D is connected by a lead wire 16 to a negative terminal of the power source ba and a negative terminal of the power source thermistor th3.
  • An OLED connector 20C (see near the lower left in FIG. 9) provided on the main board 20 includes a terminal VCC_R connected to the output terminal VOUT of the booster circuit 5, a terminal VDD connected to the output terminal OUT of the LDO 4, and a terminal VDD connected to the output terminal OUT of the LDO 4. , a communication terminal T3 connected to the communication terminal P28 of the MCU 6 via a signal line SL, and a terminal VSS connected to the ground line of the main substrate 20.
  • the terminal VCC_R of the OLED connector 20C is connected to the driving voltage supply terminal of the OLED panel 17 by the OLED FPC 25.
  • the terminal VDD of the OLED connector 20C is connected by the OLED FPC 25 to the power terminal of the control IC that controls the OLED panel 17 .
  • the voltage to be supplied to the drive voltage supply terminal of the OLED panel 17 is, for example, about 15 V, which is higher than the voltage to be supplied to the power terminal of the control IC of the OLED panel 17 .
  • the terminal VSS of the OLED connector 20C is connected by the OLED FPC 25 to the ground terminals of the OLED panel 17 and the control IC of the OLED panel 17, respectively.
  • a terminal RSTB of the OLED connector 20C is connected by an OLED FPC 25 to a terminal for restarting the control IC of the OLED panel 17 .
  • the signal line SL connected to the communication terminal T3 of the OLED connector 20C is also connected to the communication terminal T3 of the charging IC3.
  • This signal line SL allows the MCU 6 to communicate with the charging IC 3 and communicate with the control IC of the OLED panel 17 .
  • the signal line SL is for serial communication, and actually requires a plurality of signal lines such as a data line for data transmission and a clock line for synchronization. Note that the signal line SL is illustrated as one signal line in FIG. 9 for simplification. Note that the communication between the MCU 6, the charging IC 3, and the control IC of the OLED panel 17 may be performed by parallel communication instead of serial communication.
  • a debug connector 20E (see near the lower left in FIG. 9) provided on the main board 20 has a terminal VMCU connected to the output terminal OUT of the LDO 4 and a terminal T1 connected to the communication terminal P23 of the MCU6 (in the figure a terminal T2 connected to the communication terminal P22 of the MCU6 (one terminal in the figure but actually two terminals); and a terminal T2 connected to the terminal P27 of the MCU6. and a terminal GND connected to the ground line of the main board 20 .
  • Terminal NRST is also connected to the drain terminal of a switch Q9 whose gate terminal is connected to the drain terminal of switch Q7 and whose source terminal is connected to the ground line.
  • the debugging connector 20E is not used under normal operating conditions of the aerosol generating device 200, and is used only when maintenance such as rewriting of information (including programs) stored in the MCU 6 is required. or a computer provided by the seller.
  • the main connector 20A (see near the right center in FIG. 9) provided on the main board 20 has a terminal PUFF connected to the terminal P19 of the MCU6, a gate terminal connected to the terminal P20 of the MCU6 and a source terminal connected to the ground line.
  • terminal LED connected to the drain terminal of the switch Q8 connected to the terminal LED connected to the drain terminal of the switch Q8, terminal VIB connected to the output terminal OUT of the LSW7, terminal VOTG connected to the boost output terminal RN of the charging IC3, and through the resistor R5.
  • a voltage dividing circuit consisting of a terminal VMCU connected to the output terminal OUT of LDO4, a terminal GND connected to the ground line, a resistor R4 and a resistor R3 connected in series therewith, the output terminal OUT of LDO4 terminal KEY connected to , terminal HT1 (P1) connected to the drain terminal of switch Q1 whose gate terminal is connected to terminal P12 of MCU 6 and whose source terminal is connected to output terminal VOUT of booster circuit 11, and gate A drain terminal of a switch Q2 whose terminal is connected to the terminal P13 of the MCU6 and whose source terminal is connected to the output terminal VOUT of the booster circuit 11, and whose gate terminal is connected to the terminal P17 of the MCU6 and whose source terminal is connected to the ground line.
  • the terminal HT1 (P1) of the main connector 20A is connected by the main FPC 23 to the input side contact P1 connected to the pogo pin p1.
  • the terminal HT1 (P2) of the main connector 20A is connected by the main FPC 23 to the input side contact P2 connected to the pogo pin p2.
  • the terminal HT1 (P3) of the main connector 20A is connected by the main FPC 23 to the input side contact P3 connected to the pogo pin p3.
  • a terminal KEY of the main connector 20A is connected to one end of the switch BT mounted on the main FPC 23 by wiring of the main FPC 23 . The other end of this switch BT is connected to the ground line of the main FPC 23 .
  • a heater connector 20B (see near the upper right in FIG. 9) provided on the main substrate 20 is a first thermistor terminal connected to the plus side terminal of the first thermistor th1 mounted on the heater FPC 24 via wiring of the heater FPC 24.
  • TH1 the second thermistor terminal TH2 connected to the positive side terminal of the second thermistor th2 mounted on the heater FPC24 through the wiring of the heater FPC24, and the positive side of the seat heater HTR formed by the conductive pattern of the heater FPC24.
  • a seat heater terminal HT2 connected to the terminal through the wiring of the heater FPC 24 and a terminal GND connected to the ground line of the main substrate 20 are provided.
  • the heater FPC 24 is formed with wiring connected to the negative terminal of the first thermistor th1, the negative terminal of the second thermistor th2, and the negative terminal of the seat heater HTR. Connected to GND.
  • the seat heater terminal HT2 is connected to the drain terminal of a switch Q5 whose gate terminal is connected to the terminal P11 of the MCU6 and whose source terminal is connected to the output terminal VOUT of the booster circuit 11 .
  • the puff sensor board 21 (see near the bottom center in FIG. 9) includes a puff sensor connector 21A connected to the terminal group 15A of the suction sensor 15, a connector 21B connected to the main FPC 23, and a connector 21B connected to the vibration motor 13.
  • a vibration motor connector 21C, an LED 21D, a varistor V, and a capacitor C2 are mounted.
  • the connector 21B of the puff sensor board 21 is connected to each of the terminal PUFF, the terminal LED, the terminal VIB, the terminal VOTG, the terminal VMCU, and the terminal GND of the main connector 20A by wiring formed on the main FPC 23 (terminals PUFF, terminal LED, terminal VIB, terminal VOTG, terminal VMCU, and terminal GND).
  • the main FPC 23 is provided with the switch BT connected between the terminal KEY of the main connector 20A and the ground line.
  • the switch BT is pressed, the terminal KEY is connected to the ground line of the main FPC 23, and the potential of the terminal KEY becomes the ground potential.
  • the switch BT is not pressed, the terminal KEY is disconnected from the ground line of the main FPC 23, and the potential of the terminal KEY is indefinite.
  • the puff sensor connector 21A of the puff sensor substrate 21 has a terminal GATE connected to the output terminal of the suction sensor 15, a terminal GND connected to the ground terminal of the suction sensor 15, and a terminal VDD connected to the power terminal of the suction sensor 15. And prepare.
  • a terminal GATE of the puff sensor connector 21A is connected to a terminal PUFF of the connector 21B.
  • a terminal VDD of the puff sensor connector 21A is connected to a terminal VMCU of the connector 21B.
  • the terminal GND of the puff sensor connector 21A is connected to the terminal GND of the connector 21B.
  • One end of the varistor V is connected to the connection line between the terminal GATE of the puff sensor connector 21A and the terminal PUFF of the connector 21B, and the other end of the varistor V is connected to the ground line.
  • the varistor V can prevent the voltage from being input to other parts of the puff sensor board 21 and the MCU 6 even when a large voltage is input to the terminal GATE from the suction sensor 15 side.
  • One end of the capacitor C2 is connected to the connection line between the terminal VDD of the puff sensor connector 21A and the terminal VMCU of the connector 21B, and the other end of the capacitor C2 is connected to the ground line. Due to the capacitor C2, even if an unstable voltage is input to the terminal VDD of the puff sensor connector 21A from the main board 20 side, the voltage smoothed by the capacitor C2 can be input to the suction sensor 15.
  • the vibration motor connector 21C of the puff sensor board 21 has a positive side terminal connected to the terminal VIB of the connector 21B and a negative side terminal connected to the ground line.
  • a vibration motor 13 is connected to the positive terminal and the negative terminal.
  • the LED 21D of the puff sensor substrate 21 has an anode connected to the terminal VOTG of the connector 21B and a cathode connected to the terminal LED of the connector 21B.
  • the charging terminal 1 on the upper left in FIG. 9 has four terminals GND and four power supply input terminals BUS. Each power input terminal BUS of the charging terminal 1 is connected in parallel to the input terminal VIN of the protection IC2.
  • a USB plug is connected to the charging terminal 1 and a USB cable including this USB plug is connected to an external power supply, that is, when the USB connection is established, the power supply input terminal BUS of the charging terminal 1 is connected to the protection IC 2 .
  • a USB voltage VUSB is input to the input terminal VIN.
  • the protection IC 2 adjusts the USB voltage V USB input to the input terminal VIN, and outputs a bus voltage V BUS of a predetermined value (5.0 V as an example below) from the output terminal OUT.
  • the output terminal OUT of the protection IC2 is connected in parallel with the charging IC3, a voltage dividing circuit composed of a series circuit of a resistor R1 and a resistor R2, and a switch Q7.
  • the output terminal OUT of the protection IC 2 is connected to one end of the resistor R2 constituting the voltage dividing circuit, the input terminal VBUS of the charging IC 3, the gate terminal to the terminal P21 of the MCU 6, and the source terminal to the ground line. and the drain terminal of switch Q7 connected to .
  • resistor R1 One end of the resistor R1 is connected to the other end of the resistor R2, and the other end of the resistor R1 is connected to the ground line.
  • a node connecting resistors R1 and R2 is connected to terminal P2 of MCU6.
  • the charging IC 3 has a charging function of charging the power source ba based on the bus voltage VBUS input to the input terminal VBUS .
  • the charging IC 3 acquires the charging current and charging voltage of the power source ba through the detection terminal SNS, and based on these, performs charging control of the power source ba (power supply control from the charging terminal BAT to the power source ba). Further, the charging IC 3 acquires the temperature information of the power supply ba, which the MCU 6 has acquired from the power supply thermistor th3 via the terminal P25, from the MCU 6 through serial communication using the signal line SL, and uses it for charging control.
  • the charging IC 3 has a first function of generating a system power supply voltage VSYS from the voltage of the power supply ba input to the charging terminal BAT (hereinafter referred to as power supply voltage VBAT ) and outputting it from the output terminal SYS.
  • the second function is enabled only when the USB connection is established.
  • the system power supply voltage V SYS and the OTG voltage V OTG are in a normal state in which the power supply ba can supply power to the charging IC 3, and if the charging IC 3 is operating normally, the voltage from the charging IC 3 is always Output is possible.
  • the charging IC 3 has a negative logic enable terminal CE ( ⁇ ), which is connected to the terminal P1 of the MCU6.
  • CE negative logic enable terminal
  • the charging IC 3 further includes a negative logic terminal QON ( ⁇ ).
  • a terminal QON ( ⁇ ) is connected to a node N2 connecting resistors R3 and R4, and this node N2 is connected to terminal P21 of MCU6.
  • the charging IC 3 stops voltage output from the output terminal SYS when a low level signal is input to the terminal QON ( ⁇ ).
  • An LDO 4, a booster circuit 5, and a booster circuit 11 are connected in parallel to the output terminal SYS of the charging IC3.
  • the output terminal SYS of the charging IC 3 is connected to the control terminal CTL and input terminal IN of the LDO 4 , the input terminal VIN of the booster circuit 5 and the input terminal VIN of the booster circuit 11 .
  • the OTG voltage VOTG output from the boost output terminal RN of the charging IC 3 is supplied to the anode of the LED 21D via the terminal VOTG of the main connector 20A and the terminal VOTG of the connector 21B.
  • the cathode of the LED 21D is grounded through the terminal LED of the connector 21B, the terminal LED of the main connector 20A, and the switch Q8. Therefore, the MCU 6 performs ON/OFF control of the switch Q8, thereby enabling lighting control of the LED 21D using the OTG voltage VOTG .
  • the booster circuit 5 includes a switching terminal SW, a positive logic enable terminal EN connected to the terminal P26 of the MCU 6, an output terminal VOUT, and a terminal GND.
  • One end of a reactor L5 is connected to the switching terminal SW of the booster circuit 5 .
  • the other end of this reactor L5 is connected to the input terminal VIN of the booster circuit 5.
  • the booster circuit 5 performs on/off control of the built-in transistor connected to the switching terminal SW to boost the voltage input to the switching terminal SW via the reactor L5 and output it from the output terminal VOUT.
  • the OLED voltage VOLED output from the output terminal VOUT of the booster circuit 5 is a sufficiently large voltage suitable for driving the OLED panel 17, and is a voltage of 15V as an example.
  • An input terminal VIN of the booster circuit 5 constitutes a high-potential-side power supply terminal of the booster circuit 5 .
  • the booster circuit 5 outputs the OLED voltage VOLED , and the signal input from the terminal P26 of the MCU6 to the enable terminal EN. is at a low level, the output of the OLED voltage V OLED is stopped. In this manner, the OLED panel 17 is driven and controlled by the MCU6.
  • the booster circuit 11 includes an input terminal VIN, a switching terminal SW, an output terminal VOUT, a positive logic enable terminal EN, and a terminal GND.
  • One end of a reactor L ⁇ b>11 is connected to the switching terminal SW of the booster circuit 11 .
  • the other end of the reactor L11 is connected to the input terminal VIN of the booster circuit 11.
  • the booster circuit 11 performs on/off control of the built-in transistor connected to the switching terminal SW to boost the voltage input to the switching terminal SW via the reactor L11 and output it from the output terminal VOUT.
  • the heating voltage VHEAT output from the output terminal VOUT of the booster circuit 11 is, for example, a voltage of 4V.
  • An input terminal VIN of the booster circuit 11 constitutes a high-potential-side power supply terminal of the booster circuit 11 .
  • the booster circuit 11 outputs a heating voltage V HEAT when a signal input from an output terminal Y of an AND gate 10 described later to an enable terminal EN is at a high level, and inputs the heating voltage V HEAT to the enable terminal EN. output of the heating voltage V_HEAT is stopped when the signal to be supplied is at a low level.
  • the output terminal VOUT of the booster circuit 11 is connected in parallel with a capacitor C1, a voltage dividing circuit consisting of a series circuit of a resistor R7 and a resistor R6, a multiplexer 8, a switch Q1, a switch Q2, and a switch Q5. It is Specifically, the output terminal VOUT of the booster circuit 11 includes a capacitor C1 whose one end is connected to the ground line, the other end of the capacitor C1, a resistor R6 connected to the ground line, and a resistor R7 connected in series to the resistor R6. the input terminal of the voltage divider circuit (the terminal of resistor R7 opposite to resistor R6), the terminal VCC of multiplexer 8, the source terminal of switch Q1, the source terminal of switch Q2, and the source of switch Q5. connected to the terminal.
  • a resistor RA having an electrical resistance value Ra is connected in parallel to the switch Q1.
  • a resistor RB having an electrical resistance value Rb is connected in parallel to the switch Q2.
  • the multiplexer 8 has an input terminal B0, an input terminal B1, an output terminal A, and a select terminal SE.
  • the multiplexer 8 switches between a state in which the input terminal B0 and the output terminal A are connected and a state in which the input terminal B1 and the output terminal A are connected, according to a control signal input from the terminal P15 of the MCU6 to the select terminal SE.
  • the input terminal B0 of the multiplexer 8 is connected to the line connecting the switch Q1 and the terminal HT1 (P1).
  • the input terminal B1 of the multiplexer 8 is connected to the line connecting the switch Q2 and the terminal HT1 (P2).
  • the output terminal A of the multiplexer 8 is connected to the non-inverting input terminal of the operational amplifier OP1.
  • the inverting input terminal of operational amplifier OP1 is connected to the node connecting resistors R7 and R6.
  • the output terminal of operational amplifier OP1 is connected to terminal P14 of MCU6.
  • the LDO 4 maintains the voltage input to the input terminal VIN. (that is, the system power supply voltage V SYS ) is converted and output from the output terminal OUT as the system power supply voltage V MCU .
  • the system power supply voltage V SYS is, for example, a value in the range of 3.5V to 4.2V, and the system power supply voltage V MCU is 3.1V, for example.
  • the output terminal OUT of the LDO 4 is connected to the control IC of the OLED panel 17, the MCU 6, the LSW 7, the suction sensor 15, a series circuit composed of a resistor R3, a resistor R4, and a switch BT, a debugging connector 20E, are connected in parallel.
  • the output terminal OUT of the LDO 4 includes the terminal VDD of the OLED connector 20C, the terminal VDD of the MCU 6, the input terminal VIN of the LSW 7, and the resistor R5 one end of which is connected to the terminal VMCU of the main connector 20A. terminal (node N1 in the figure), the input terminal (node N1 in the figure) of a voltage dividing circuit consisting of resistors R4 and R3, and the terminal VMCU of the debug connector 20E.
  • the output terminal OUT of LDO4 is connected to the source terminal of switch Q6 whose gate terminal is connected to terminal P4 of MCU6.
  • the drain terminal of switch Q6 is connected to terminal VCC of AND gate 10, terminal VCC of FF9, one end of resistor R11, one end of resistor R12, the positive power supply terminal of operational amplifier OP2, and one end of resistor R8. , one end of the resistor R9 and the positive power supply terminal of the operational amplifier OP1 are connected in parallel.
  • the other end of the resistor R12 is connected to the second thermistor terminal TH2, and the series circuit of the resistor R12 and the second thermistor th2 connected to the second thermistor terminal TH2 is applied with the system power supply voltage V MCU . constitutes a voltage divider circuit.
  • the output of this voltage dividing circuit corresponds to the electric resistance value (in other words, temperature) of the second thermistor th2 and is input to the terminal P8 of the MCU6. This allows the MCU 6 to obtain the temperature of the second thermistor th2.
  • the second thermistor th2 the one having the NTC characteristic in which the resistance value decreases with an increase in temperature is used, but the one having the PTC characteristic in which the resistance value increases with an increase in temperature is used. may
  • resistor R10 One end of the resistor R10 is connected to the other end of the resistor R9, and the other end of the resistor R10 is connected to the ground line.
  • a series circuit of resistors R9 and R10 constitutes a voltage divider circuit to which system supply voltage V MCU is applied. The output of this voltage dividing circuit is connected to the inverting input terminal of the operational amplifier OP2, and a fixed voltage value is input to this inverting input terminal.
  • the other end of the resistor R8 is connected to the non-inverting input terminal of the operational amplifier OP2.
  • resistor R8 is further connected to first thermistor terminal TH1 and terminal P9 of MCU6.
  • a series circuit of the resistor R8 and the first thermistor th1 connected to the first thermistor terminal TH1 constitutes a voltage dividing circuit to which the system power supply voltage V MCU is applied.
  • the output of this voltage dividing circuit corresponds to the electric resistance value (in other words, temperature) of the first thermistor th1 and is input to the terminal P9 of the MCU6. This allows the MCU 6 to acquire the temperature of the first thermistor th1 (in other words, the temperature of the seat heater HTR).
  • the output of this voltage dividing circuit is also input to the non-inverting input terminal of the operational amplifier OP2.
  • the output of the operational amplifier OP2 becomes low level when the temperature of the first thermistor th1 (the temperature of the seat heater HTR) increases and becomes equal to or higher than the threshold value THD1. In other words, as long as the temperature of the first thermistor th1 (the temperature of the seat heater HTR) is within the normal range, the output of the operational amplifier OP2 is high level.
  • the output of the voltage dividing circuit consisting of the first thermistor th1 and the resistor R8 is the inverse of the operational amplifier OP2. input terminal, and the output of the voltage dividing circuit composed of the resistor R9 and the resistor R10 is connected to the non-inverting input terminal of the operational amplifier OP2. Even in this case, the output of the operational amplifier OP2 becomes low level when the temperature of the first thermistor th1 (the temperature of the seat heater HTR) rises and becomes equal to or higher than the threshold value THD1.
  • the output terminal of the operational amplifier OP2 is connected to the input terminal D of FF9.
  • a node connecting the input terminal D of FF9 and the output terminal of the operational amplifier OP2 is connected to the other end of the resistor R11 and the negative logic clear terminal CLR ( ⁇ ) provided to the FF9. That is, the input terminal D of FF9, the clear terminal CLR ( ⁇ ) of FF9, and the output terminal of the operational amplifier OP2 are each pulled up to the supply line of the system power supply voltage VMCU by the resistor R11.
  • FF9 has a clock terminal CLK, and the clock terminal CLK is connected to terminal P7 of MCU6.
  • FF 9 has an output terminal Q, which is connected to one input terminal B of AND gate 10 .
  • the clock signal is input to the clock terminal CLK from the MCU 6 and the high level signal is input to the clear terminal CLR ( ⁇ )
  • the FF9 is at the level of the signal input to the input terminal D. Therefore, the data (high or low data) is held, and the held data is output from the output terminal Q.
  • FF 9 outputs a clock signal from MCU 6 to clock terminal CLK and a low level signal to clear terminal CLR ( ⁇ ) regardless of the held data. Reset processing for outputting a low level signal from the terminal Q is performed.
  • This reset processing is canceled by re-inputting the clock signal to the clock terminal CLK while a high-level signal is input to the clear terminal CLR ( ⁇ ). That is, the supply of the clock signal to the clock terminal CLK is stopped while a high-level signal is input to the clear terminal CLR ( ⁇ ), and then the supply of the clock signal is resumed to release the clock signal.
  • the other input terminal A of the AND gate 10 is connected to the terminal P6 of the MCU6.
  • An output terminal Y of the AND gate 10 is connected to a positive logic enable terminal EN of the booster circuit 11 .
  • the AND gate 10 outputs a high level signal from the output terminal Y only when the signal input to the input terminal A and the signal input to the input terminal B are both high level.
  • the LSW7 outputs the system power supply voltage V MCU input to the input terminal VIN from the output terminal OUT when the control signal is input to the control terminal CTL from the terminal P10 of the MCU6.
  • the output terminal OUT of the LSW 7 is connected to the vibration motor 13 via the terminal VIB of the main board 20 and the terminal VIB of the puff sensor board 21 . Therefore, by inputting a control signal from the MCU 6 to the LSW 7, the vibration motor 13 can be operated using the system power supply voltage V MCU .
  • the power supply unit 100 has, as operation modes, a sleep mode for power saving, a standby mode capable of transitioning from the sleep mode, and a heating mode capable of transitioning from the standby mode (aerosol generation by heating a liquid heater and a seat heater HTR) mode), and
  • a specific operation for example, a long press operation
  • the MCU 6 switches the operation mode to the standby mode.
  • the MCU 6 detects a specific operation (for example, a short press operation) on the switch BT in the standby mode
  • the MCU 6 switches the operation mode to the heating mode.
  • FIG. 10 is a circuit diagram showing electronic components related to operation in the heating mode extracted from the circuit shown in FIG. FIG. 10 additionally shows capacitor C3, which was not shown in FIG.
  • FIG. 11 is a circuit diagram showing, extracted from the circuit shown in FIG. 9, electronic components related to heating control of the seat heater HTR and the liquid heater, driving control of the vibration motor 13, and driving control of the LED 21D. The operation of the heating mode will be described below with reference to FIGS. 10 and 11.
  • FIG. 10 is a circuit diagram showing electronic components related to operation in the heating mode extracted from the circuit shown in FIG. 10 additionally shows capacitor C3, which was not shown in FIG.
  • FIG. 11 is a circuit diagram showing, extracted from the circuit shown in FIG. 9, electronic components related to heating control of the seat heater HTR and the liquid heater, driving control of the vibration motor 13, and driving control of the LED 21D. The operation of the heating mode will be described below with reference to FIGS. 10 and 11.
  • FIG. 10 is a circuit diagram showing electronic components related to operation in the heating mode extracted from the circuit shown in
  • the MCU 6 When the MCU 6 transitions to the heating mode, it controls the switch Q6 shown in FIG. 10 to the ON state.
  • the AND gate 10, the FF9, the resistor R11, the operational amplifier OP2, the resistor R11, the resistor R9 and the resistor R10 constitute a voltage dividing circuit
  • the resistor R8 and the first thermistor th1 constitute a voltage dividing circuit
  • the resistor R12 and the second thermistor th2 and the operational amplifier OP1, respectively, are supplied with the system power supply voltage V MCU .
  • the MCU 6 controls the signal input from the terminal P6 to the input terminal A of the AND gate 10 to high level.
  • the MCU6 also starts inputting the clock signal to the clock terminal CLK of the FF9.
  • the temperature of the first thermistor th1 (the temperature of the seat heater HTR) is within the normal range (less than the threshold value THD1)
  • the output of the operational amplifier OP2 becomes high level
  • the output of FF9 becomes high level.
  • the output of the AND gate 10 becomes high level. Therefore, the heating voltage VHEAT is started to be output from the booster circuit 11, and the seat heater HTR and the liquid heater are ready to be heated.
  • the MCU 6 performs control to connect the input terminal B0 and the output terminal A of the multiplexer 8 while turning on only the switch Q4 among the switches Q1 to Q4.
  • Rx is the electrical resistance value between the terminal HT1 (P1) and the terminal HT1 (P2)
  • the voltage input to the non-inverting input terminal is compared with the above-mentioned divided voltage value when the liquid heater is connected between the terminal HT1 (P1) and the terminal HT1 (P2), and the difference is is small, the output of the operational amplifier OP1 becomes low level. Therefore, when the output of the operational amplifier OP1 becomes low level, the MCU 6 determines that the liquid heater is connected between the terminals HT1 (P1) and HT1 (P2).
  • the MCU 6 notifies an error if the output of the operational amplifier OP1 does not go low in any of the first to third steps.
  • the MCU 6 controls the heating of the seat heater HTR and the liquid heater. Start. Specifically, the MCU 6 performs heating control of the seat heater HTR by on/off controlling the switch Q5 shown in FIG. 11 (for example, PWM control or PFM control). At this time, the MCU 6 controls the temperature of the seat heater HTR so that the temperature of the seat heater HTR converges to the target temperature based on the temperature of the second thermistor th2 (in other words, the temperature of the seat heater HTR) obtained from the signal input to the terminal P8. Then, the heating control of the seat heater HTR is performed. For example, PID (Proportional-Integral-Differential) control is used for this heating control.
  • PID Proportional-Integral-Differential
  • the MCU 6 When the liquid heater is connected between the terminal HT1 (P1) and the terminal HT1 (P2), the MCU 6 turns on the switch Q4 among the switches Q1 to Q4 shown in FIG. Heating control of the liquid heater is performed by controlling the switches Q2 and Q3 to be in the OFF state and controlling the ON/OFF of the switch Q1 (for example, PWM control or PFM control).
  • the MCU 6 turns on the switch Q3 among the switches Q1 to Q4, and turns off the switches Q2 and Q4.
  • the heating control of the liquid heater is performed by controlling the state and controlling the ON/OFF of the switch Q1.
  • the MCU 6 When the liquid heater is connected between the terminals HT1 (P2) and HT1 (P3), the MCU 6 turns on the switch Q3 among the switches Q1 to Q4, and turns off the switches Q1 and Q4.
  • the heating control of the liquid heater is performed by controlling the state and controlling the ON/OFF of the switch Q2.
  • the power of the resistor R8, the resistor R9, and the resistor R10 is set so that the output of the operational amplifier OP2 becomes low level. resistance is determined.
  • a low level is input to the clear terminal CLR ( ⁇ ) of FF9.
  • the negative logic clear terminal CLR ( ⁇ ) is enabled and the output of FF9 is forced to go low, so the output of the AND gate 10 goes low, and the booster circuit 11 increases the heating voltage V Stop HEAT output.
  • the output signal of the operational amplifier OP2 is input to the booster circuit 11 that can reliably stop the power supply to the seat heater HTR, thereby enhancing safety when the seat heater HTR becomes hot.
  • the aerosol generator 200 is provided with a restart circuit RBT (see FIG. 12) capable of restarting (resetting) the MCU 6 by the user's operation of the switch BT, the details of which will be described later. If the cause of the functioning of the protection circuit is the freezing of the MCU 6, the MCU 6 is restarted by the user. By restarting MCU6, FF9 is restarted.
  • RBT restart circuit
  • the signal input to the input terminal A of the AND gate 10 becomes low level. Also, at the timing when the MCU 6 is restarted, the switch Q6 is in the OFF state, so the potential of the signal at the input terminal B of the AND gate 10 is indefinite. Therefore, the output from the booster circuit 11 is not restarted just by restarting the MCU 6 . After the MCU 6 is restarted, the operation mode shifts to the heating mode by the user's operation, so that the signal input to the input terminal A of the AND gate 10 becomes high level. Moreover, the signal input to the input terminal B of the AND gate 10 becomes high level because the switch Q6 is turned on. As a result, the output from the booster circuit 11 is resumed.
  • FIG. 12 is a circuit diagram showing the electronic components involved in restarting the MCU 6 extracted from the circuit shown in FIG. FIG. 12 shows the restart circuit RBT.
  • the restart circuit RBT includes a voltage dividing circuit consisting of a resistor R3 and a resistor R4, a switch BT, a terminal KEY and a terminal GND of the main connector 20A, a switch Q7, a switch Q9, a charging IC3, an LDO4, and a terminal NRST of the debug connector 20E.
  • the restart circuit RBT enables the MCU 6 to be restarted by operating the switch BT (long press as an example) and by issuing a command from an external device connected to the debugging connector 20E. It has become.
  • the MCU 6 is configured to be restarted when the signal input to the terminal P27 remains at a low level for a predetermined period of time.
  • the charging IC 3 is configured to restart when the signal input to the terminal QON ( ⁇ ) remains at a low level for a predetermined period of time.
  • the resistors R3 and R4 have resistance values such that the output of the voltage dividing circuit of the resistors R3 and R4 is at a high level when the switch BT is not pressed. Since this high-level signal is input to the terminal QON ( ⁇ ) of the charging IC3, the charging IC3 is not reset in this state and continues to output the system power supply voltage VSYS from the output terminal SYS. By continuing the output of the system power supply voltage VSYS , the output of the system power supply voltage V_MCU from the output terminal OUT of the LDO4 is also continued. Therefore, the MCU 6 continues to operate without stopping.
  • this high level signal is input to the gate terminal of the switch Q7. Therefore, when the USB is connected (when the bus voltage V BUS is output from the charging IC 3), the switch Q7 is turned on, and as a result, the potential of the gate terminal of the switch Q9 is low level (ground level). ), and the switch Q9 is turned off. When the switch Q9 is in the off state, the MCU6 does not restart because the potential of the terminal P27 of the MCU6 is indefinite.
  • the resistors R3 and R4 have resistance values such that the output of the voltage dividing circuit of the resistors R3 and R4 is at a low level when the switch BT is pressed. In other words, the resistors R3 and R4 have resistance values such that the value obtained by dividing the system power supply voltage V MCU becomes low level. Since this low-level signal is input to the terminal QON ( ⁇ ) of the charging IC 3, if this state continues for a predetermined time, the charging IC 3 stops outputting the system power supply voltage VSYS from the output terminal SYS. When the output of the system power supply voltage V SYS is stopped, the voltage output from the LDO 4 is stopped, the system power supply voltage V MCU is no longer input to the terminal VDD of the MCU 6, and the MCU 6 stops.
  • this low level signal is input to the gate terminal of the switch Q7. Therefore, when the USB connection is made (when the bus voltage V BUS is output from the charging IC 3), the switch Q7 is turned off, and as a result, the potential of the gate terminal of the switch Q9 becomes high level (bus voltage V BUS ), and the switch Q9 is turned on. When the switch Q9 is turned on, the potential of the terminal P27 of the MCU6 becomes low level (ground level). When the switch BT is continuously pressed for a predetermined time, a low level signal is input to the terminal P27 of the MCU 6 for a predetermined time, so the MCU 6 executes restart processing.
  • the charging IC 3 resumes outputting the system power supply voltage VSYS , so that the system power supply voltage V MCU is input to the terminal VDD of the MCU 6 that has stopped, and the MCU 6 is activated. .
  • FIG. 13 is a front view of the main FPC 23 unfolded so that the thickness direction coincides with the left-right direction and viewed from the left side.
  • FIG. 14 is a front view of the main FPC 23 unfolded so that the thickness direction coincides with the left-right direction and viewed from the right side.
  • 15 is an enlarged view of the range AR shown in FIG. 14.
  • the main FPC 23 has a two-layer structure comprising a surface layer 231 (see FIG. 13) arranged on the first case 3A side and a back layer 232 (see FIG. 14) arranged on the right side of the surface layer 231.
  • a conductive pattern and a ground pattern having a reference potential are provided on the left surface of the surface layer 231 and the right surface of the back layer 232, respectively.
  • the conductive patterns formed on the main FPC 23 include conductive patterns 81 to 83 through which power for atomizing the aerosol source (supplied power to the liquid heater) flows, and elements controlled by the MCU 6 (LED 21D and vibration motor 13). and an input conductive pattern connected to elements (suction sensor 15 and switch BT) for inputting signals to the MCU 6 .
  • the conductive patterns 81 to 83 are used to heat the liquid heater, a large amount of power flows. For this reason, the conductive patterns 81 to 83 preferably have a low resistance so as to suppress heat generation and noise and to supply power to the liquid heater with high efficiency.
  • the conductive patterns 81 to 83 are wider than the control conductive pattern and the input conductive pattern to suppress heat generation and noise.
  • the main FPC 23 is attached to the internal unit 2A while being folded along folding lines LN1 to LN6 indicated by straight dashed lines in FIGS.
  • creases formed by folding along the folding lines LN1 to LN6 are referred to as creases l1 to l6.
  • the main FPC 23 includes a plurality of portions defined by fold lines l1-l6. Specifically, the main FPC 23 includes a first portion PA1 outside (edge side) of the fold line l1, a second portion PA2 between the fold line l1 and the fold line l2, and an inner portion of the fold lines l2, l3, l4, and l5.
  • the plane area of the third portion PA3 is the largest.
  • the main FPC 23 is folded toward the front side and the right side of the paper surface of FIG. 13, and in the state shown in FIG. 4, it is folded back from the front.
  • the main FPC 23 is folded toward the front side of the paper surface of FIG. 13 at the folding line LN1.
  • the main FPC 23 is folded toward the back side of the paper surface of FIG. 13 at the folding lines LN3 to LN6.
  • the first part PA1 is fixed to the chassis 50, but the second part PA2 is in a free state without being fixed anywhere.
  • the heater FPC 24 and the OLED FPC 25 suppress the floating of the second portion PA2.
  • the second portion PA2 is narrower than the third portion PA3 and the creases at both ends extend in different directions, so stress is more likely to be applied to the second portion PA2 than to other portions.
  • the main FPC 23 is folded along each of the folding lines LN1 to LN6. Therefore, compared to the case where the main FPC 23 is bent, the space occupied by the main FPC 23 in the case 3 is reduced, and the main FPC 23 is folded.
  • the FPC 23 can be arranged flexibly within the case 3.
  • the stress applied to each of the creases 11 to 16 increases as the smaller of the angles formed by the portions adjacent to each other becomes more acute. Therefore, in order to reduce the stress, it is preferable that the smaller angle (folding angle) formed by adjacent portions of the main FPC 23 with respect to each of the folding lines 11 to 16 is 90 degrees or more. By doing so, the durability of the main FPC 23 can be improved.
  • a substrate connector CN1 is mounted on the fourth portion PA4 of the back layer 232 between the folding line LN4 and the edge 4e of the fourth portion PA4.
  • An enlarged view of the board connector CN1 is shown in the area enclosed by the two-dot chain line in FIG.
  • the board connector CN1 is a portion connected to the main connector 20A of the main board 20, and the terminal KEY, the terminal PUFF, the terminal VMCU, the terminal VOTG, the terminal LED, the terminal VIB, the terminal GND, and the terminal HT1 (P1) of the main connector 20A.
  • terminal HT1 (P2), and terminal HT1 (P3) terminal KEY, terminal PUFF, terminal VMCU, terminal VOTG, terminal LED, terminal VIB, terminal GND, terminal HT1 (P1), terminal HT1 (P2), and a terminal HT1 (P3)).
  • the thick lines shown in FIGS. 13 and 14 indicate conductive patterns made of a conductive material.
  • a terminal KEY of the board connector CN1 is connected to a via B11 formed next to the edge 4e by an input conductive pattern.
  • the vias in the main FPC 23 electrically connect the conductive pattern of the surface layer 231 and the conductive pattern of the back layer 232, and are conductors that penetrate the main FPC 23 in its thickness direction and extend in its thickness direction.
  • a terminal PUFF of the substrate connector CN1 is connected to a via B9 formed next to the edge 4e by an input conductive pattern.
  • a terminal VMCU of the board connector CN1 is connected to a via B10 formed next to the edge 4e by an input conductive pattern.
  • a terminal VOTG of the substrate connector CN1 is connected to a via B6 formed in the third portion PA3 by a control conductive pattern.
  • a terminal VLED of the substrate connector CN1 is connected to a via B7 formed in the third portion PA3 by a control conductive pattern.
  • a terminal VIB of the board connector CN1 is connected to a via B8 formed in the third portion PA3 by a control conductive pattern. For each of the vias B6 to B11, the name of the terminal to be connected is written in parentheses.
  • the vias B6 to B11 each reach the surface layer 231 as shown in FIG.
  • a via B4 and a via B5 are provided in the fifth portion PA5 of the surface layer 231 .
  • an input conductive pattern connecting the via B9 and the via B4 and an input conductive pattern connecting the via B10 and the via B5 are formed.
  • a via B1, a via B2, and a via B3 are provided in a region of the third portion PA3 of the surface layer 231 adjacent to the fifth portion PA5.
  • a control conductive pattern is formed to connect the via B6 and the via B1
  • a control conductive pattern is formed to connect the via B7 and the via B2
  • a control conductive pattern is formed to connect the via B8 and the via B3.
  • a via B12 is provided in a region of the third portion PA3 of the surface layer 231 near the second portion PA2.
  • An input conductive pattern that connects the via B11 and the via B12 is formed on the surface layer 231 .
  • a substrate connector CN2 is mounted on the fifth portion PA5 of the back layer 232 between the folding line LN3 and the edge 5e of the fifth portion PA5.
  • An enlarged view of the substrate connector CN2 is shown in the area enclosed by the two-dot chain line in FIG.
  • the substrate connector CN2 is a portion connected to the connector 21B of the puff sensor substrate 21, and has terminals (terminal VOTG , a terminal LED, a terminal VIB, a terminal GND, a terminal PUFF, and a terminal VMCU).
  • the back layer 232 includes a control conductive pattern connecting the via B1 and the terminal VOTG of the board connector CN2, a control conductive pattern connecting the via B2 and the terminal LED of the board connector CN2, a via B3 and the board connector CN2. an input conductive pattern connecting the via B4 and the terminal PUFF of the board connector CN2; and an input conductive pattern connecting the via B5 and the terminal VMCU of the board connector CN2. is formed.
  • the name of the terminal to which the board connector CN2 is connected is written in parentheses for each of the vias B1 to B5.
  • the first portion PA1 of the back layer 232 has a terminal TH to which the positive terminal of the switch BT is connected, a terminal TL to which the negative terminal of the switch BT is connected, and a reference potential.
  • a ground pattern G3 and a terminal TV to which the positive terminal of the varistor V1 shown in FIG. 9 is connected are formed.
  • the terminal TL is formed integrally with the ground pattern G3.
  • An input conductive pattern PTx is formed on the back layer 232 to connect the terminal TH and the terminal TV to the via B12. Even if external noise such as static electricity enters through the switch BT directly mounted on the main FPC 23, the noise is mounted on the main FPC 23 by the varistor V1 as an overvoltage protection element arranged near the switch BT. are designed not to affect the electrical components of the
  • the input conductive patterns PTx are arranged in parallel at the portion D1 overlapping the folding line LN1, and arranged in parallel at the portion D2 overlapping the folding line LN2. Specifically, the input conductive pattern PTx branches into two at a position closer to the third portion PA3 than the folding line LN2, and returns to one after crossing the folding line LN2 and reaching the second portion PA2. It has become. In addition, the input conductive pattern PTx is configured to branch into two at a position closer to the second portion PA2 than the folding line LN1, and return to one after crossing the folding line LN1 and reaching the first portion PA1. There is The second part PA2 is particularly stressed at the creases at both ends. By arranging the input conductive patterns PTx formed in this portion in parallel, even if one of the two input conductive patterns PTx is disconnected, the other can continue to use the input conductive pattern PTx.
  • one end of the conductive pattern 82 is connected to the terminal HT1 (P2) of the board connector CN1.
  • the conductive pattern 82 extends from the terminal HT1 (P2) of the board connector CN1 toward the edge 4e, then folds toward the third portion PA3, and reaches the seventh portion PA7 via the third portion PA3.
  • the other end of the conductive pattern 82 is connected to four vias 82b.
  • the four vias 82b reach the seventh portion PA7 of the surface layer 231, as shown in FIG.
  • the seventh portion PA7 of the surface layer 231 is provided with terminals 82T that connect to the four vias 82b.
  • one end of the conductive pattern 83 is connected to the terminal HT1 (P3) of the board connector CN1.
  • the conductive pattern 83 extends from the terminal HT1 (P3) of the substrate connector CN1 toward the third portion PA3 and reaches the seventh portion PA7 via the third portion PA3.
  • the other end of the conductive pattern 83 is connected to four vias 83b.
  • the four vias 83b reach the seventh portion PA7 of the surface layer 231, as shown in FIG.
  • a seventh portion PA7 of the surface layer 231 is provided with a terminal 83T connected to the four vias 83b.
  • one end of the conductive pattern 81 is connected to the terminal HT1 (P1) of the board connector CN1.
  • the conductive pattern 81 extends from the terminal HT1 (P1) of the board connector CN1 toward the edge 4e and is formed on the fourth portion PA4.
  • a via 81 b is connected to the conductive pattern 81 .
  • the via 81b reaches the fourth portion PA4 of the surface layer 231, as shown in FIG.
  • the fourth portion PA4 of the surface layer 231 is provided with one end of the conductive pattern 81 connected to the via 81b.
  • the conductive pattern 81 of the surface layer 231 reaches the seventh portion PA7 via the third portion PA3.
  • the other end of the conductive pattern 81 on the surface layer 231 is configured to be wide, and this portion constitutes a terminal 81T.
  • the seventh portion PA7 is a portion in which the back layer 232 is fixed to the lower surface of the chassis 50 with the thickness direction aligned with the vertical direction, and is exposed when the lower lid 7a is opened.
  • the input contact P1 of the lower lid 7a contacts the terminal 81T
  • the input contact P2 of the lower lid 7a contacts the terminal 82T
  • the input contact P3 of the lower lid 7a contacts.
  • the main FPC 23 is electrically connected to the pogo pin board 22 and the liquid heater by contacting the terminal 83T.
  • the conductive patterns 81 to 83 are in contact with the input side contacts P1 to P3 at the terminals 81T to 83T.
  • the conductive patterns 81 to 83 are thickest at the terminals 81T to 83T and thinner than the terminals 81T to 83T for the portions other than the terminals 81T to 83T. By doing so, the durability of the terminals 81T to 83T can be enhanced.
  • the conductive patterns 81 to 83 provided on the main FPC 23 are formed over the surface layer 231 and the back layer 232 . Therefore, compared to the configuration in which the conductive patterns 81 to 83 are provided in one layer, the width of each of the conductive patterns 81 to 83 can be increased if the area of the main FPC 23 is the same. Also, it is conceivable that the main FPC 23 has a three-layer structure, for example, and the conductive patterns 81 to 83 are distributed to each layer. Since the main FPC 23 of this embodiment has fewer layers than this configuration, the structure can be simplified, and the manufacturing cost and weight can be reduced.
  • the conductive patterns 81 to 83 in the main FPC 23 of this embodiment are not branched like the input conductive pattern PTx, but are configured as a single line. In this way, by making the conductive patterns 81 to 83 thick and simple in shape, it is possible to prevent disconnection at folds and to suppress heat and noise by reducing resistance and inductance.
  • the width of the portions of the main FPC 23 excluding the third portion PA3 and the fourth portion PA4 is smaller than the sum of the widths of the conductive patterns 81-83.
  • the main FPC 23 has a two-layer structure, a conductive pattern 81 is formed on the surface layer 231, and conductive patterns 82 and 83 are formed on the back layer 232, thereby excluding the third portion PA3 and the fourth portion PA4. You can reduce the width of the part. That is, according to this embodiment, three thick conductive patterns can be formed without using an excessively large main FPC 23 .
  • the conductive patterns formed on the surface layer 231 include a control conductive pattern that connects the via B1 and the via B6, a control conductive pattern that connects the via B2 and the via B7, and a control conductive pattern that connects the via B3 and the via B8. is formed extending in the front-rear direction across the conductive pattern 82 and the conductive pattern 83 formed on the back layer 232 when the main FPC 23 is viewed from the front.
  • the conductive patterns formed on the surface layer 231 include an input conductive pattern that connects the vias B11 and B12, an input conductive pattern that connects the vias B4 and B9, and an input conductive pattern that connects the vias B5 and B10.
  • the conductive pattern is formed to extend in the front-rear direction across either the conductive pattern 82 or the conductive pattern 83 formed on the back layer 232 when the main FPC 23 is viewed from the front. In this manner, the control conductive pattern and the input conductive pattern formed on the surface layer 231 overlap the conductive patterns 82 and 83 formed on the back layer 232 when the main FPC 23 is viewed from the front. With such a configuration, the widths of the conductive pattern 82 and the conductive pattern 83 can be increased without interfering with the control conductive pattern and the input conductive pattern.
  • a large-area ground pattern G1 is formed across the first portion PA1 to the sixth portion PA6.
  • the ground pattern G1 is provided with a gap Ga3 at a position overlapping with the folding line LN3, a gap Ga2 at a position overlapping with the folding line LN2, and a gap Ga1 at a position overlapping with the folding line LN1.
  • ground patterns G2 having a smaller area than the ground pattern G1 are formed across the third portion PA3 to the fifth portion PA5.
  • the ground pattern G2 on the lower left side of the drawing is connected to the terminal GND of the substrate connector CN1.
  • the ground pattern G2 on the upper right side of the drawing is connected to the terminal GND of the substrate connector CN2.
  • no ground pattern is formed in the second portion PA2, the sixth portion PA6, and the seventh portion PA7. That is, the ground pattern G2 and the ground pattern G3 are formed avoiding some of the folds l1 to l7 (folds l1, l2, l5, l6).
  • a ground pattern is generally formed of a large-area copper foil, and such a large-area copper foil has little stress relief due to folds. Therefore, in the back layer 232, a ground pattern is not provided at the folding lines l1, l2, l5, and l6, thereby ensuring a stress relief area.
  • the ground pattern G1 formed on the front layer 231 is also formed on the back layer 232 at the positions of folds l1, l2, and l5 that avoid overlapping with the ground pattern.
  • the creases where the ground patterns overlap are only the crease l3 and the crease l4 in each of the surface layer 231 and the back layer 232 .
  • the area of the ground pattern can be increased while preventing disconnection of the ground pattern.
  • the stability of the reference potential in the ground pattern largely depends on the area of the ground pattern. According to the main FPC 23, the area of the ground pattern can be increased by forming the ground pattern over the surface layer 231 and the back layer 232 as described above.
  • the second portion PA2 no ground pattern is formed on the back layer 232, and the ground pattern G1 is formed only on the surface layer 231.
  • the second portion PA2 is a portion to which stress is likely to be applied. Therefore, by providing only the input conductive pattern PTx on the back layer 232, the flexibility of the second portion PA2 can be ensured and the durability of the main FPC 23 can be improved.
  • the ground pattern G2 and the ground pattern G3 may be formed by avoiding all of the folds l1 to l7.
  • the ground pattern G1 may be formed on part or all of the folds l1 to l7.
  • a power source power source ba
  • an atomizer connector pigo pins p1-p3 electrically connected to an atomizer (liquid heater) that atomizes the aerosol source
  • a rigid circuit board main board 20
  • a flexible circuit board main FPC 23
  • the flexible circuit board includes a first layer (surface layer 231) and a second layer (back layer 232), wherein the plurality of conductive patterns are formed on the first layer and the second layer
  • a power supply unit power supply unit 100 of the aerosol generator.
  • the conductive pattern is formed over a plurality of layers of the flexible circuit board, the width of the conductive pattern can be increased. Therefore, even when generating a sufficient amount of aerosol, the heat and noise generated by the flexible circuit board can be reduced.
  • the width of the conductive pattern means the distance in the direction orthogonal to the direction of current flow.
  • the power supply unit of the aerosol generator has a portion with a width smaller than the sum of the widths of the plurality of conductive patterns (portions other than the third portion PA3 and the fourth portion PA4). Power supply unit for the aerosol generator.
  • the width of the conductive pattern can be increased without using an excessively wide flexible circuit board. Therefore, heat and noise generated in the flexible circuit board can be reduced while reducing the manufacturing cost and size of the power supply unit.
  • the plurality of conductive patterns include a first conductive pattern (conductive pattern 83) extending from the edge of the substrate connector on the first direction side and extending from the edge of the substrate connector on the second direction side different from the first direction.
  • a second conductive pattern (conductive pattern 81) extending, Power supply unit for the aerosol generator.
  • the width of the conductive pattern can be made wider than when a plurality of conductive patterns are pulled out from the edge of the board connector on the same side. can reduce the heat and noise generated by
  • the power supply unit of the aerosol generator The substrate connector is mounted on the end (fourth portion PA4) of the second layer, The first conductive pattern is formed on the second layer, The second conductive pattern is formed on the first layer and the second layer, The second conductive pattern formed on the first layer and a via (via 81b) connecting the second conductive pattern formed on the second layer, The edge on the second direction side is closer to the edge of the end portion of the second layer (edge 4e) than the edge on the first direction side, Power supply unit for the aerosol generator.
  • the portion where the second conductive pattern is connected between the first layer and the second layer is the second conductive pattern formed in the first layer, the via, and the second layer in the thickness direction. Since the second conductive pattern formed in the second conductive pattern overlaps, heat tends to concentrate. By providing such a portion where heat tends to concentrate at a position close to the edge of the flexible substrate, it becomes more susceptible to air cooling, and heat concentration can be easily eliminated. Therefore, it is possible to reduce the influence of heat on electrical components mounted on the flexible circuit board and other patterns formed on the flexible circuit board. Also, the durability of the power supply unit is improved.
  • a power supply unit for an aerosol generator according to any one of (1) to (4), Equipped with a controller (MCU6),
  • the flexible circuit board includes another conductive pattern (control conductive pattern) connected to the elements (LED 21D and vibration motor 13) controlled by the controller, different from the plurality of conductive patterns, and a signal input to the controller.
  • the number of parts of the power supply unit can be reduced, which reduces the manufacturing cost of the power supply unit. Size can be reduced.
  • the power supply unit of the aerosol generator The separate conductive pattern is formed on the first layer and the second layer, The separate conductive pattern formed on one of the first layer and the second layer overlaps the conductive pattern formed on the other of the first layer and the second layer in a front view of the flexible circuit board. , Power supply unit for the aerosol generator.
  • the width of the conductive pattern can be increased without interfering with another conductive pattern. Therefore, heat and noise that can be generated in the conductive pattern can be reduced while coexisting another conductive pattern and another conductive pattern on one flexible circuit board.
  • the power supply unit of the aerosol generator a board connector (board connector CN1) mounted on the flexible circuit board and connecting the flexible circuit board and the rigid circuit board;
  • the another conductive pattern includes a first pattern extending from an edge of the substrate connector on the first direction side, and a second pattern extending from an edge of the substrate connector on the second direction side different from the first direction.
  • a plurality of separate control or input conductive patterns increase the number of controls that can be executed by the controller and improve the accuracy of individual controls. Manufacturing cost and size can be reduced.
  • the power unit of the aerosol generator according to any one of (5) to (7),
  • the flexible circuit board includes folds (folds l1 to l6),
  • the different conductive pattern includes parallel parts (portions D1 and D2) formed in the folds (input conductive pattern PTx), Power supply unit for the aerosol generator.
  • the conductive pattern Since stress is concentrated on the crease, if there is a thin conductive pattern in the crease, the conductive pattern may be damaged (disconnected). According to (8), since the separate conductive pattern includes the part formed in the fold in parallel, even if a part of the parallelized separate conductive pattern is disconnected, the separate conductive pattern can continue to use As a result, the durability of the power supply unit is improved.
  • the conductive pattern for supplying power to the atomizer has a thick and simple shape, so that it is less likely to be damaged (disconnected) even if stress is applied to the crease.
  • Such conductive patterns are not arranged in parallel even at the crease, so that the width of the flexible circuit board can be maximized and the width can be widened.
  • a power supply unit for an aerosol generator according to any one of (1) to (9),
  • the flexible circuit board includes a ground pattern (ground patterns G1, G2, G3) having a reference potential, Power supply unit for the aerosol generator.
  • the number of parts of the power supply unit can be reduced, so the manufacturing cost and size of the power supply unit can be reduced.
  • the stability of the reference potential in the ground pattern largely depends on the area of the ground pattern. According to (11), the area of the ground pattern can be increased by forming the ground pattern over a plurality of layers of the flexible circuit board. Therefore, the reference potential is stabilized, and the operation of the power supply unit is stabilized.
  • the flexible circuit board includes folds (folds l1 to l6), Gaps (gaps Ga1, Ga2, Ga3) are provided in portions of the ground pattern formed on the folds. Power supply unit for the aerosol generator.
  • the power unit of the aerosol generator according to (1) or (2) The plurality of conductive patterns includes a first conductive pattern (conductive pattern 81), a second conductive pattern (conductive pattern 82), and a third conductive pattern (conductive pattern 83), The second conductive pattern and the third conductive pattern are formed on the second layer, wherein the first conductive pattern is formed on the first layer; Power supply unit for the aerosol generator.
  • Conductive patterns formed on layers where connectors are not mounted tend to have more complicated structures and shapes than conductive patterns formed on layers where connectors are mounted because they need to be connected with vias. be. According to (14), since the number of conductive patterns formed in the layer on which the connector is mounted is large, the flexible circuit board can be manufactured more easily, thereby reducing the manufacturing cost of the power supply unit.
  • Power supply unit 20 Main board 23

Landscapes

  • Charge And Discharge Circuits For Batteries Or The Like (AREA)

Abstract

L'invention concerne une unité d'alimentation électrique qui est destinée à un dispositif de génération d'aérosol et dans laquelle il est possible de réduire les niveaux de génération de chaleur et de bruit. Une unité d'alimentation électrique 100 comprend : une alimentation électrique ba ; des broches Pogo p1 à p3 qui sont électriquement connectées à un atomiseur pour atomiser une source d'aérosol ; un substrat principal 20 qui est conçu pour être susceptible de commander l'alimentation en électricité des broches Pogo p1 à p3 à partir de l'alimentation électrique ba ; et un FPC principal 23 qui est connecté au substrat principal 20 et aux broches Pogo p1 à p3 et qui comprend des motifs conducteurs 81 à 83 qui permettent à l'électricité destinée à l'atomisation de la source d'aérosol de circuler à travers celui-ci. Le FPC principal 23 comprend une couche avers 231 et une couche revers 232. Les motifs conducteurs 81 à 83 sont formés dans la couche avers 231 et la couche revers 232.
PCT/JP2021/045593 2021-12-10 2021-12-10 Unité d'alimentation électrique pour dispositif de génération d'aérosol WO2023105767A1 (fr)

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JP2023566040A JPWO2023105767A1 (fr) 2021-12-10 2021-12-10
PCT/JP2021/045593 WO2023105767A1 (fr) 2021-12-10 2021-12-10 Unité d'alimentation électrique pour dispositif de génération d'aérosol

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JP2011029384A (ja) * 2009-07-24 2011-02-10 Murata Mfg Co Ltd フレキシブル多層基板およびその製造方法
JP2015198103A (ja) * 2014-03-31 2015-11-09 パナソニックＩｐマネジメント株式会社 伸縮性フレキシブル基板およびその製造方法
JP2017092486A (ja) * 2014-12-01 2017-05-25 株式会社村田製作所 電気素子
CN206933340U (zh) * 2017-06-26 2018-01-30 深圳市太美亚电子科技有限公司 电子烟控制板
CN208874752U (zh) * 2018-06-12 2019-05-17 绿烟实业（深圳）有限公司 烟具内部连接电路板和采用该电路板的烟具
JP2021511039A (ja) * 2018-01-18 2021-05-06 フィリップ・モーリス・プロダクツ・ソシエテ・アノニム プリント回路基板を備えるヒーター組立品

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Publication number Priority date Publication date Assignee Title
JP2006073840A (ja) * 2004-09-03 2006-03-16 Nec Corp フレキシブル配線基板及び折り畳み式電子機器
JP2011029384A (ja) * 2009-07-24 2011-02-10 Murata Mfg Co Ltd フレキシブル多層基板およびその製造方法
JP2015198103A (ja) * 2014-03-31 2015-11-09 パナソニックＩｐマネジメント株式会社 伸縮性フレキシブル基板およびその製造方法
JP2017092486A (ja) * 2014-12-01 2017-05-25 株式会社村田製作所 電気素子
CN206933340U (zh) * 2017-06-26 2018-01-30 深圳市太美亚电子科技有限公司 电子烟控制板
JP2021511039A (ja) * 2018-01-18 2021-05-06 フィリップ・モーリス・プロダクツ・ソシエテ・アノニム プリント回路基板を備えるヒーター組立品
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