WO2022235005A1

WO2022235005A1 - Probe array gripper and probe array bonding equipment comprising same

Info

Publication number: WO2022235005A1
Application number: PCT/KR2022/006012
Authority: WO
Inventors: 이재하
Original assignee: 화인인스트루먼트 (주); 이재하
Priority date: 2021-05-06
Filing date: 2022-04-27
Publication date: 2022-11-10

Abstract

The present invention relates to a probe array gripper and probe array bonding equipment comprising same. The probe array gripper of the present invention grasps a probe array on which a plurality of probe pins are fixedly arranged, and includes a gripper body and a gripper window. The gripper body has a vacuum hole formed in at least one end, which is connected to a gripper instrument of a position control apparatus and is provided to form vacuum pressure therein, and thus, one side of the gripper body is connected to a vacuum apparatus on the outside and the other side of the gripper body is exposed to the lower portion of a portion spaced apart from the one end. In addition, the gripper window is installed in the lower portion of the gripper body to be connected to the vacuum hole, and has a plurality of grasp holes penetrating therethrough in the vertical direction and being formed to be in communication with the vacuum hole. In addition, the gripper window has, at the lower surface thereof, a grasping surface grasping the probe array via vacuum pressure provided to the plurality of grasp holes through the vacuum hole, and transmits light.

Description

Probe array gripper and probe array bonding equipment including the same

The present invention relates to a device for manufacturing a probe head, and more particularly, to a device under test (DUT) unit, which is a semiconductor device, by holding a probe array in which probe pins are disposed and moving it to a bonding position of a probe head substrate, and a laser beam A probe that holds the position of the probe array without changing during the bonding process, and transmits a laser beam to the bonding area of the held probe array to bond the probe pins disposed on the probe array to the probe head substrate. It relates to an array gripper and probe array bonding equipment including the same.

As is well known in semiconductor manufacturing processes, a series of semiconductor manufacturing processes are completed on a wafer. After a plurality of semiconductor chips are formed on a wafer, an electrical inspection process performed in a wafer state is required in order to inspect whether the semiconductor chips have defects or the like.

In this electrical inspection process, a probe card is used to electrically connect a semiconductor chip to be inspected and inspection equipment.

In general, an electrical inspection process is performed by simultaneously contacting a plurality of probe pins to a plurality of pads that are electrical paths of a plurality of semiconductor chips formed on a wafer. After receiving a signal from the test equipment through the probe pins of the probe card in contact with the test device and performing an operation, the processing result is again output to the test equipment through the probe pins of the probe card.

Currently, for quick and efficient inspection, an electrical inspection process is performed by contacting all memory semiconductor chips on a 300mm wafer at once.

In order to solve these technical requirements, a multi-layer ceramic (MLC) substrate with a size of about 320 mm is mainly used as a probe head substrate for a probe card that inspects a 300 mm memory wafer.

As a method of bonding the probe pins to the MLC board for 300mm wafer, which is the current probe head board, a gripper that grips the probe pins one by one is used to move and position the probe pins one by one on the MLC board, and then irradiate the laser beam to bond them. The method using automatic laser bonding equipment is almost the only one used.

The problem with this method is that it takes too long to manufacture the probe head of the probe card as the number of probe pins increases. For example, if it takes 17 seconds to bond one pin, it takes about 20 days to manufacture a probe head with a scale of 100,000 pins.

[Prior art literature]

[Patent Literature]

Korean Patent Registration No. 10-1718717 (Registered on Mar. 16, 2017)

For this reason, there is a need for a method for manufacturing a probe head of a probe card that is economical by manufacturing a simple and fast manufacturing process for the purpose of high productivity, rapid delivery, and lower manufacturing cost.

In order to solve the above problems, the inventor of the present invention, in the extension of Patent Application No. 10-2020-0094509 (name: probe array bonding equipment and probe bonding method using the same), probe pins on the MLC substrate as the probe head substrate In probe bonding equipment that uses a laser beam to bond the A probe array gripper having a structure that can effectively perform the bonding process of the probe pins by passing through the portion holding the probe array and irradiating a laser beam to the held probe array and the probe head substrate while continuing to hold the probe array, and An object of the present invention is to provide a probe array bonding device including the same.

In order to achieve the above object, the present invention provides a probe array gripper for gripping a probe array in which a plurality of probe pins are fixedly arranged, at least one end connected to a gripper mechanism of a position control device, and a vacuum for forming a vacuum pressure therein. a gripper body in which a hole is formed, one side of which is connected to an external vacuum device and the other side of which is exposed under a portion spaced apart from the one end; and a vacuum provided at a lower portion of the gripper body to be connected to the vacuum hole, a plurality of gripping holes penetrating up and down are formed to communicate with the vacuum hole, and the plurality of gripping holes are provided through the vacuum holes on the lower surface. Provided is a probe array gripper comprising a gripper window having a gripping surface for gripping the probe array with pressure and transmitting light.

The gripper body has an upper end connected to the gripper mechanism of the position control device, and a gripper vacuum room connected to the vacuum hole is formed at the other end to open downward, and the gripper window is joined below the gripper vacuum room. The gripper vacuum chamber may be covered.

The gripper body has upper portions of both ends connected to the gripper mechanism of the position control device, and a gripper vacuum room connected to the vacuum hole is formed in the central portion to open downward, and the gripper window is joined below the gripper vacuum room. The gripper vacuum chamber may be covered.

The gripper body may be formed such that the gripper vacuum room penetrates vertically.

The probe array gripper according to the present invention may further include a body cover window that is bonded to the gripper vacuum room to cover the gripper vacuum room and transmits light.

A gripper vacuum room connected to the vacuum hole may be formed on an upper surface of the gripper window, and the plurality of gripper holes may be formed in the gripper vacuum room.

The material of the gripper body may be Invar, Kovar, ceramic, quartz, or glass.

The material of the gripper window may be quartz or glass through which a laser beam is transmitted.

The material of the body cover window may be quartz or glass through which a laser beam is transmitted.

The gripper window may have an array holder space in which the probe array is inserted and gripped on the gripping surface, and the plurality of gripping holes may be formed in the array holder space.

The gripper body may further include a cooling unit formed around the gripper window to dissipate heat generated from the gripper window to the outside.

The cooling unit has an installation surface on which a gripper window is installed at a lower portion, a cooling room is formed to be opened to an upper portion on an upper portion of the installation surface, and an input/output hole for inputting and outputting a refrigerant into the cooling room is formed outside the cooling unit, a cooling plate for cooling the gripper window installed below the installation surface with a refrigerant circulating to the room; and a cooling cover coupled to the cooling plate and sealing the cooling room through a cooling gasket.

The present invention also provides at least one probe array tray unit in which probe arrays having probe pins disposed in units of DUTs are disposed; a probe array holder holding the probe array disposed on the probe array tray unit and moving it to an alignment unit; the alignment unit including a first vision camera device for aligning positions of the probe array; the probe array gripper holding the probe array aligned in the alignment unit and transferring the light to the probe head substrate; a second vision camera device for checking whether or not the probe array is defective and a position of the probe array gripped by the probe array gripper; a chuck unit for fixing and aligning the probe head substrate to which the probe pins disposed on the probe array are bonded; a third vision camera device for aligning the probe array gripped by the probe array gripper and the probe head substrate; and a laser unit that transmits a surface light source laser beam through the probe array gripper and irradiates the probe array gripped by the probe array gripper to collectively bond the probe pins disposed on the probe array and the pads of the probe head substrate through a conductive adhesive. ; provides a probe array bonding equipment comprising a.

In addition, the present invention provides at least one probe array tray unit in which probe arrays having probe pins disposed in units of DUTs are disposed; an alignment unit on which the probe array tray unit is mounted, the alignment unit including a first vision camera device for aligning positions of the probe array disposed on the probe array tray unit; the probe array gripper holding the probe array aligned in the alignment unit and transferring the light to the probe head substrate; a second vision camera device for checking whether or not the probe array is defective and a position of the probe array gripped by the probe array gripper; a chuck unit for fixing and aligning the probe head substrate to which the probe pins disposed on the probe array are bonded; a third vision camera device for aligning the probe array gripped by the probe array gripper and the probe head substrate; and a laser unit that transmits a surface light source laser beam through the probe array gripper and irradiates the probe array gripped by the probe array gripper to collectively bond the probe pins disposed on the probe array and the pads of the probe head substrate through a conductive adhesive. ; provides a probe array bonding equipment comprising a.

According to the present invention, in the process of manufacturing the probe head of the probe card using the probe array bonding device, the probe array gripper grips the probe array to which a plurality of probe pins are fixed, moves it to a position where it is bonded to the probe head substrate, and removes the probe pins. During the bonding process, the probe array is continuously held so that the position of the probe array is not changed. In addition, the probe array gripper allows the surface light source laser beam to be transmitted through and irradiated to the probe array, so that a plurality of probe pins fixed to the probe array can be simultaneously bonded to the probe head substrate without changing their positions.

For this reason, when using the probe array bonding equipment including the probe array gripper according to the present invention, the positional accuracy of the probe pins is excellent and the probe head is manufactured compared to the conventional laser bonding method of bonding the probe pins one by one using a laser. By dramatically shortening the process time, it is possible to dramatically improve the production yield per equipment.

In the process of bonding the probe array to the probe head substrate using the probe array gripper, a cooling unit is installed in the gripper window that grips the probe array to prevent the probe array from being overheated by the laser beam irradiated to the gripper window. .

That is, since the ceramic forming the probe head substrate serves as a heat sink for the pad formed on the probe head substrate, high-power laser beam irradiation is required to bond the probe pin to the pad. However, when a high-power laser beam is irradiated to the probe array held on the gripping surface of the gripper window, higher heat is applied to the probe array than to the probe head substrate. The emission properties are poor. This may cause a temperature difference between the probe array and the probe head substrate. However, in the present invention, it is possible to prevent the probe array from being overheated by the laser beam irradiated to the gripper window by installing a cooling unit in the gripper window holding the probe array.

In addition, by adjusting the temperature of the gripper window to be similar to that of the probe head substrate through the cooling unit to stably maintain the soldering temperature condition for bonding the probe array to the probe head substrate, the probe array can be stably bonded to the probe head substrate. .

1 is a side perspective view of a probe array gripper according to a first embodiment of the present invention.

2 is an exploded perspective view of the probe array gripper according to the first embodiment of the present invention.

3 is a perspective view of a probe array gripper according to a second embodiment of the present invention.

4 is an exploded perspective view of a probe array gripper according to a third embodiment of the present invention.

5 is a side perspective view of a probe array gripper according to a third embodiment of the present invention.

6 is an exploded perspective view of a probe array gripper according to a fourth embodiment of the present invention.

7 is a perspective view of a probe array gripper according to a fifth embodiment of the present invention.

8 is an exploded perspective view of the gripper body in which the cooling unit of FIG. 7 is installed.

9 is a perspective view of the gripper body of FIG. 8 ;

FIG. 10 is a bottom perspective view of the gripper body of FIG. 8 .

11 is a perspective view of a probe array bonding apparatus according to a sixth embodiment of the present invention.

12 is a perspective view of a probe array tray unit of a probe array bonding apparatus according to a sixth embodiment of the present invention.

13 is a perspective view of a probe array bonding apparatus according to a seventh embodiment of the present invention.

It should be noted that, in the following description, only parts necessary for understanding the embodiments of the present invention are described, and descriptions of other parts will be omitted without departing from the gist of the present invention.

The terms or words used in the present specification and claims described below should not be construed as being limited to their ordinary or dictionary meanings, and the inventors have appropriate concepts of terms to describe their invention in the best way. It should be interpreted as meaning and concept consistent with the technical idea of the present invention based on the principle that it can be defined in Accordingly, the embodiments described in this specification and the configurations shown in the drawings are only preferred embodiments of the present invention, and do not represent all the technical spirit of the present invention, so various equivalents that can be substituted for them at the time of the present application It should be understood that there may be variations and variations.

Hereinafter, embodiments of the present invention will be described in more detail with reference to the accompanying drawings.

[First embodiment]

1 and 2 are views showing the probe array gripper 10 according to the first embodiment of the present invention. 1 is a side perspective view of the probe array gripper 10 according to the first embodiment of the present invention. 2 is an exploded perspective view of the probe array gripper 10 according to the first embodiment of the present invention.

1 and 2 , the probe array gripper 10 according to the first embodiment holds the probe array 71 in which a plurality of probe pins are fixedly arranged and transmits light such as a laser beam. It includes a body 20 and a gripper window 40 . At least one end of the gripper body 20 is connected to the gripper mechanism 60 of the position control device, and a vacuum hole 21 for forming a vacuum pressure is formed therein, so that one end is connected to an external vacuum device and the other end is one end. exposed on the lower part of the spaced part. The gripper window 40 is installed at the lower portion of the gripper body 20 to be connected to the vacuum hole 21 , and a plurality of gripping holes 41 penetrating vertically are formed to communicate with the vacuum hole 21 . The gripper window 40 has a gripping surface 42 on its lower surface for gripping the probe array 71 with vacuum pressure provided to the plurality of gripping holes 41 through the vacuum hole 21, and transmits light.

In addition, the probe array gripper 10 according to the first embodiment may further include a body cover window 30 .

Here, a vacuum hole 21 is formed in the gripper body 20 to form a vacuum pressure for gripping the probe array 71 . One end of the vacuum hole 21 is extended and connected to the gripper vacuum room 50, and a fitting device for connecting to the tube pipe of the vacuum device supplying vacuum pressure is fixed at the other end portion, although not shown in the drawing. Connected. The size of the gripper vacuum room 50 formed in the gripper body 20 may be larger than the size of the probe array 71 to be gripped by the probe array gripper 10 . The gripper vacuum room 50 may serve as a mask for the surface light source laser beam to match the size of the probe array 71 without separately adjusting the size of the surface light source laser irradiated from the laser optical system.

The gripper body 20 is fixedly operated to the gripper mechanism 60 operated by the controller in the probe array bonding equipment. In the first embodiment, an example in which the gripper mechanism 60 is connected to one end of the gripper body 20 is disclosed.

As a material of the gripper body 20 , Invar, Kovar, ceramic, quartz, or glass having a small coefficient of thermal expansion may be used.

The body cover window 30 is jointly fixed over the gripper vacuum room 50 of the gripper body 20 to allow a vacuum pressure to be formed in the gripper vacuum room 50 . The body cover window 30 may be made of a quartz or glass material through which light is transmitted so as to irradiate a laser beam to the probe array 71 .

In addition, although not shown in the figure, the body cover window 30 may have a mask for changing the size and shape of the laser beam on the upper surface or the lower surface.

The gripper window 40 is bonded and fixed below the gripper vacuum room 50 of the gripper body 20 , and gripping holes 41 are formed vertically through the gripper body 20 , so that one side is connected to the gripper vacuum room 50 and the opposite side. Silver is connected to the gripping surface 42 of the gripper window 40 to suck the probe array 71 with vacuum pressure and grip the probe array 71 on the gripping surface 42 of the gripper window 40 . Meanwhile, the gripper window 40 is formed of a quartz or glass material through which light is transmitted, so that the laser beam passes through the body cover window 30 and then passes through the gripper vacuum room 50 and passes through the gripper window 40 to pass through the gripper window. A laser beam can be irradiated to the probe array 71 gripped by the vacuum pressure of the gripping hole 41 on the gripping surface 42 of (40).

As described above, in the probe array gripper 10 according to the first embodiment, the probe array 71 is mounted on the probe head substrate and irradiated with the probe array gripper 10 while the probe array 71 is fixed as it is. The probe pins of the probe array 71 may be bonded to the pad of the probe head substrate with the laser beam of the surface light source. At this time, the laser beam irradiated by the probe array gripper 10 passes through the body cover window 30 and the gripper vacuum room 50 , and the probe array 10 and the probe gripped on the gripping surface 42 through the gripper window 40 . Since the bonding process can be performed while the probe array 71 is fixed on the probe head substrate with the probe array gripper 10 by being applied to the head substrate, the probe pins of the probe array are collectively attached to the pads of the probe head substrate. can be accurately connected.

Since the probe array gripper 10 according to the first embodiment can be used to bond to the probe head substrate in units of the probe array 71 corresponding to the DUT, the positional accuracy of the probe pins is excellent and the probe head manufacturing process time is excellent. By remarkably shortening the production yield per equipment, it is possible to dramatically improve the production yield.

On the other hand, although the first embodiment discloses an example in which the vacuum room 50 penetrates vertically, it is not limited thereto. For example, when the material of the gripper body is made of quartz or glass that transmits light, the vacuum room may be formed in the form of a pocket that is opened only downward. In this case, the gripper window is fixed to the lower part of the vacuum room, but since the upper part of the vacuum room is closed, the installation of the body cover window can be omitted.

[Second embodiment]

3 is a perspective view of a probe array gripper 10 according to a second embodiment of the present invention. Here, FIG. 3 shows a state in which the probe array 71 is gripped in the array holder space 43 formed in the gripper window 40 .

A portion “A” of FIG. 3 shows a portion in which an array holder space 43 for stably gripping the probe array 71 is formed at the position of the gripping surface 42 of the gripper window 40 according to the second embodiment. show enlarged.

Referring to FIG. 3 , the probe array gripper according to the second embodiment is similar to that of the first embodiment, except that an array holder space 43 in which the probe array 71 can be inserted and seated is formed in the gripper window 40 . Since it has the same structure as the probe array gripper according to the present invention, the array holder space 43 will be mainly described as follows.

The array holder space 43 may be formed to a predetermined depth inward with respect to the gripping surface 42 . The predetermined depth is a depth into which a part of the probe array 71 can be inserted. The predetermined depth is such that a portion of the probe pin to be bonded to the probe head substrate can protrude out of the gripping surface 42 so that the probe pins disposed in the probe array 71 can be bonded to the probe head substrate. A plurality of gripping holes 41 are disposed on the bottom surface of the array holder space 43 so that the probe array 71 can be sucked by vacuum pressure.

The sidewall of the array holder space 43 is formed so that the size of the entrance surface of the array holder space 43 is wider than the size of the probe array 71 so that the probe array 71 can easily enter and exit. The size of the gripping surface 42 on which the probe array 71 is gripped by the vacuum pressure of the gripping hole 41 is formed to match the size of the probe array 71 , so that the sidewall of the array holder space 43 has a holder inclined surface 44 . ) can be formed.

The array holder space 43 serves to constantly fix the position of the probe array 71 when gripping the probe array 71 . That is, the probe array 71 gripped on the gripping surface 42 without the array holder space 43 contracts and expands the gripper body 20 due to the rise and fall of heat generated in the process of bonding with a laser beam, and When the probe pins are bonded to the pad of the probe head substrate, if the force such as tension at the moment when the metal adhesive hardens is greater than the vacuum pressure of the gripping surface 42 , the position of the probe array 71 gripped on the gripping surface 42 may change. can The position change of the probe array 71 may not be uniform whenever the probe array 71 is bonded depending on the magnitude of the vacuum pressure and various conditions. However, as in the second embodiment, when the probe array frame 71 is fixed to the array holder space 43 , a position value that may occur in each process of bonding the probe array 71 is provided to be able to constantly control.

Meanwhile, although the second embodiment discloses an example in which the holder inclined surface of the array holder space 43 is formed under the gripping surface 42 , the present invention is not limited thereto. For example, the array holder space 43 may be formed by protruding the holder inclined surface 44 from the gripping surface 42 .

[Third embodiment]

Meanwhile, although an example of forming the gripper vacuum room 50 in the gripper body 20 is disclosed in the first and second embodiments, the present invention is not limited thereto. For example, as shown in FIGS. 4 and 5 , the gripper vacuum room 50 may be formed in the gripper window 40 .

4 and 5 are views showing the probe array gripper 10 according to the third embodiment of the present invention.

4 and 5 , the probe array gripper 10 according to the third embodiment includes a gripper body 20 and a gripper window 40 .

The gripper body 20 is formed of a quartz or glass material through which a laser beam can pass, and a vacuum hole 21 for forming a vacuum is formed therein. One end of the vacuum hole 21 is fixedly connected to a fitting device for connection to a tube pipe of a vacuum device for supplying vacuum pressure. The other end of the vacuum hole 21 extends to a position where the gripper window 40 is attached and is exposed to the lower portion of the gripper body 20 .

The gripper body 20 is fixed to the gripper mechanism 60 on the opposite side of the portion where the gripper window 40 is positioned and operates in the probe array bonding equipment.

The gripper window 40 is fixed by being bonded to the lower surface of the gripper body 20 to which the other side of the vacuum hole 21 is exposed. The gripper window 40 has a gripper vacuum room 50 that supplies vacuum pressure to the gripping holes 41 formed inside the gripper window 40 on an upper surface joined to the gripper body 20 .

The gripper window 40 vertically penetrates the bottom surface of the gripper vacuum room 50 to have gripping holes 41 formed therein. The gripper vacuum room 50 is connected to the vacuum hole 21 .

In the gripper window 40 , as shown in FIG. 5B , the array holder space 43 described in the second embodiment is formed in a portion where the probe array 71 is gripped. Gripping holes 41 are formed in the bottom surface of the array holder space 43 . The probe array 71 is held by suction by vacuum pressure on the bottom surface of the array holder space 43 .

Meanwhile, although the third embodiment discloses an example in which the gripper vacuum room 50 for supplying vacuum pressure to the gripping holes 41 is formed on the upper portion of the gripper window 40 , the present invention is not limited thereto. For example, the gripper vacuum room may be formed in the form of a pocket on the lower surface of the gripper body where the vacuum hole extends, and the gripper window may be joined to cover the gripper vacuum room.

[Fourth embodiment]

Meanwhile, in the first to third embodiments, an example in which one side of the gripper body 20 is connected to the gripper mechanism 60 is disclosed, but the present invention is not limited thereto. For example, as shown in FIG. 6 , both sides of the gripper body 20 may be connected to the gripper mechanism 60 .

6 is a view showing the probe array gripper 10 according to the fourth embodiment of the present invention.

Referring to FIG. 6 , in the probe array 10 according to the fourth embodiment, the gripper vacuum room 50 is positioned so that the position of the gripper window 40 for gripping the probe array 71 in the gripper body 20 is located in the middle. It is formed in the middle of the gripper body 20 , and the body cover window 30 is attached to the upper surface of the gripper vacuum room 50 , and the gripper window 40 is joined to the lower surface of the gripper vacuum room 50 . It is made up of a composition that is In the probe array bonding equipment, portions fixed to the gripper mechanism 60 operated by the controller are formed at both ends of the gripper body 20 .

Depending on the material of the gripper body 20, the size of thermal expansion at the melting point temperature of the metal adhesive may range from several μm to several dozen μm. It is desirable to minimize the positional deformation of the probe array 71 in which the probe pins are arranged and fixed.

Therefore, in the probe array gripper 10 according to the fourth embodiment, the reason why the gripper structures 60 are symmetrically connected to both sides around the gripper window 40 is that the probe pins of the held probe array 71 are connected to the probe head. This is to attach the probe array 71 to the probe head substrate in a fixed position by minimizing the positional deformation of the probe array 71 due to heat generated or applied during bonding to the substrate.

That is, the probe array gripper 10 applies a laser beam to the body cover window 30 , the gripper vacuum room 50 , and the gripper window 40 to bond the probe pins fixedly arranged on the probe array 71 to the probe head substrate. is transmitted and irradiated to the probe array 71 held by the gripper window 40 . High heat generated in the probe array 71 by the irradiated laser beam is transferred to the gripper body 20 through the gripper window 40, and the gripper is heated by the heat generated during the laser bonding process time of several seconds to several tens of seconds. As the body 20 is expanded, the position of the probe array 71 may be changed.

As described above, the high heat generated for bonding the probe pins with the laser beam causes the gripper body 20 to expand. The probe gripped by the gripper window 40 installed in the center of the gripper body 20 by causing the expansion to occur in the center so that the expansion of the same size proceeds in the direction of both gripper mechanisms 60 with the gripper body 20 as the center. Positional deformation of the array 71 can be minimized.

[Example 5]

7 is a perspective view of a probe array gripper according to a fifth embodiment of the present invention. 8 is an exploded perspective view of the gripper body in which the cooling unit of FIG. 7 is installed. 9 is a perspective view of the gripper body of FIG. 8 ; and FIG. 10 is a bottom perspective view of the gripper body of FIG. 8 .

7 to 10 , in the probe array gripper 10 according to the fifth embodiment, the position of the probe array is deformed by heat generated or applied while bonding the probe pins of the gripped probe array to the probe head substrate. In order to minimize this, a gripper body 20 having a cooling unit 23 is included.

The cooling unit 23 is formed around the gripper window 40 to dissipate heat generated in the gripper window 40 to the outside.

The cooling unit 23 may include a cooling plate 24 and a cooling cover 28 . The cooling plate 24 has an installation surface 25 on which the gripper window 40 is installed. The cooling plate 24 is formed on the upper portion of the installation surface 25 so that the cooling room 26 is opened upward, and the input/output hole 27 for inputting and outputting the refrigerant into the cooling room 26 is formed outside the cooling room. Cooling the gripper window (40) installed under the installation surface (25) with the refrigerant circulating in (26). And the cooling cover 28 is coupled on the cooling plate 24 so as to cover the cooling room 26 , and seals the cooling room 26 through the cooling gasket 29 .

The cooling plate 24 is provided with a gripper vacuum room 50 penetrating up and down in the central portion. The upper portion of the gripper vacuum room 50 is covered by the body cover window 30 , and the lower portion of the gripper vacuum room 50 is covered by the gripper window 40 bonded to the mounting surface 25 .

The gripper window 40 has a larger contact area with the installation surface 25 of the cooling plate 24 to dissipate heat acting on the gripper window 40 through the cooling plate 24, thereby gripping the gripper window 400. The temperature of the probe array can be adjusted to a temperature suitable for bonding the probe pins.

The cooling room 26 is formed to surround the gripper vacuum room 50 . The cooling room 26 is formed to surround the gripper vacuum room 50 with a ring-shaped pocket around the gripper vacuum room 50 . The cooling room 26 and the vacuum room 50 are isolated from each other by an outer wall forming the vacuum room 50 .

The input/output hole 27 includes an input hole and an output hole, and is formed in communication with the cooling room 26 from the outside of the cooling plate 24 to circulate the refrigerant to the cooling room 26 . In this case, a heat medium capable of heat exchange may be used as the refrigerant, for example, a refrigerant in liquid or gas form may be used.

By exchanging heat acting on the gripper window 40 with the refrigerant through refrigerant circulation in the cooling room, the temperature of the probe array held by the gripper window 400 can be adjusted to a temperature suitable for bonding the probe pins.

The vacuum hole 21 is connected to the gripper vacuum room 50 through a vacuum path 22 that crosses the cooling room 26 .

The input/output hole 27 and the vacuum hole 21 may be formed adjacent to each other. Of course, the input/output hole 27 and the vacuum hole 21 may be formed to be spaced apart from each other.

In addition, cooling holes 24a may be formed in the cooling plate 24 . The cooling holes 24a may be formed by vertically penetrating the flesh portion of the cooling plate 24 around the cooling room 26 . The cooling hole 24a is basically in charge of not only a heat dissipation function but also a function of reducing the weight of the cooling plate 24 .

In the process of bonding the probe array to the probe head substrate by using the probe array gripper 10 as described above, the cooling unit 23 is installed in the gripper window 40 that grips the probe array, and is irradiated with the gripper window 40 . It is possible to prevent the probe array from being overheated by the laser beam.

That is, since the ceramic forming the probe head substrate serves as a heat sink for the pad formed on the probe head substrate, high-power laser beam irradiation is required to bond the probe pin to the pad. However, when a high-power laser beam is irradiated to the probe array held on the gripping surface 42 of the gripper window 40 , higher heat is applied to the probe array than to the probe head substrate, so the gripper window 4 is the probe array. Even if it acts as a heat sink, it has inferior heat dissipation characteristics than the probe head substrate. This may cause a temperature difference between the probe array and the probe head substrate. However, in the fifth embodiment, the cooling unit 23 is installed in the gripper window 40 that grips the probe array to prevent the probe array from being overheated by the laser beam irradiated to the gripper window 40 .

In addition, by adjusting the temperature of the gripper window 40 to be similar to the temperature of the probe head substrate through the cooling unit 23 and stably maintaining the soldering temperature condition for bonding the probe array to the probe head substrate, the probe array is transferred to the probe head. It can be stably bonded to the substrate.

Meanwhile, although the cooling unit 23 according to the fifth embodiment discloses an example of controlling the temperature of the probe array held by the gripper window 30 through the cooling plate 24 and the refrigerant circulation, only one of the cooling plate and the refrigerant circulation is disclosed. It is also possible to adjust the temperature of the probe array by application.

In addition, although the example in which the gripper vacuum room 50 according to the first or fourth embodiment is applied to the probe array gripper 10 according to the fifth embodiment is disclosed, the gripper vacuum room 50 according to the second or third embodiment is disclosed. ) can be applied.

The probe array bonding apparatus 100 including the probe array gripper 10 according to the first to fifth embodiments will be described with reference to FIGS. 11 to 13 as follows.

[Sixth embodiment]

11 is a perspective view of the probe array bonding apparatus 100 according to the sixth embodiment of the present invention. 12 is a perspective view of the probe array tray unit 72 of the probe array bonding apparatus 100 according to the sixth embodiment of the present invention.

7 and 8 , the probe array bonding device 100 according to the sixth embodiment is a bonding device to which the probe array gripper 10 according to the first to fifth embodiments is applied.

The probe array bonding apparatus 100 according to the sixth embodiment includes a probe array tray unit 72 on which a plurality of probe arrays 71 are disposed, a probe array tray unit 72 , and a probe array tray unit ( An alignment unit 78 including a first vision camera device 10 for aligning gripping positions of the probe array 71 disposed on the probe array 71 and the probe array gripper 10, and the probe array aligned in the alignment unit 78 For checking and aligning the probe array gripper 10 that holds the 71 and moves it to the probe head substrate 79 and transmits light, and the probe array 71 that is gripped and transferred by the probe array gripper 10 is defective. The second vision camera device 74, the chuck unit 75 for holding the probe head substrate 79 to which the probe pins 80 of the probe array 71 are bonded, and the probe array 71 are attached to the probe head substrate. (79) for bonding the probe pins 80 fixedly arranged to the third vision camera device 76 for alignment at the bonding position above, and the probe array 71 aligned at the bonding position of the probe head substrate 79 It may include a laser unit 77 for irradiating a surface light source laser, and a control unit for driving each of the units and devices, although not shown in the drawing.

Meanwhile, the probe array tray unit 72 and the chuck unit 74 may be controlled and operated in four directions x, y, z, and θ by a stage located below.

8 shows the probe array tray unit 72 in which the probe arrays 71 are arranged at regular intervals. 8C is an enlarged view showing the state of the probe array 71 disposed on the probe array tray unit 72 . 8(C-1) and 8(C-2) show the shapes of the probe array 71 in which the 2D MEMS probe pins 80 are disposed. 8(C-3) shows the shapes of the probe array 71 in which the 3D MEMS probe pins 80 are disposed.

In the probe array tray unit 72 , a plurality of probe arrays 71 formed in the size of a DUT that is a semiconductor chip formed on a wafer may be disposed in the tray groove 72a. In the probe array tray unit 72 , the probe support portion of the probe pin 80 that is bonded to the pad of the probe head substrate 79 in the probe array 71 faces downward, and a plate-shaped jig in which the probe pins 80 are inserted is provided. The probe array grooves 72a may be formed at regular intervals so as to be positioned thereon. The probe array gripper 10 is controlled to sequentially move the probe arrays 71 positioned in the probe array tray unit 72 to the alignment unit 40 by the controller.

The probe array gripper 10 operates the probe array 71 in the x-direction using the first vision camera device 73 to grip it at an accurate position, and attaches the probe array 71 to the probe array 71 with the second vision camera device 74 . After confirming the presence and location of defects in the fixed probe pins 80 , a third vision camera 76 is attached to the bonding position of the probe head substrate 79 fixed on the chuck unit 75 to the non-defective probe array 71 . In a state in which the probe pins 80 arranged on the probe array 71 by using the laser unit 77 to be bonded to the probe head substrate 79 by using the laser unit 77, the surface light source laser of the laser unit 76 is held. A function of allowing the beam to be transmitted through and irradiated to the probe array 71 is provided.

The chuck unit 75 has four directions: z, y, z, θ to align the bonding position of the probe head 79 held thereon with the probe array 71 using the third vision camera device 76 . may be controlled by

In addition, the third vision camera device 76 and the laser unit 77 operate in the y and z directions to align the probe head substrate 79 mounted on the probe array 71 and the chuck unit 75 and fixed, Thereafter, the laser beam of the surface light source may be irradiated to the probe array 71 through the probe array gripper 10 .

By repeating this series of processes, using the probe array 71 on the entire large-area substrate such as the probe head substrate 79 of 300 mm MLC, the probe pins 80 are positioned very precisely in DUT units, and the probe pins 80 are quickly bonded. can do.

Through this series of processes, the probe head substrate 79 to which all of the probe arrays 71 are bonded is removed from the plate-shaped jig of the probe array 71 through a wet etching or dry etching process in the next step, and is then used as a probe head. can be manufactured.

[Seventh embodiment]

Meanwhile, in the probe array bonding apparatus 100 according to the sixth embodiment, the probe array gripper 10 grips the probe array 71 from the probe array tray unit 72 and directly transfers the probe array 71 to the probe head substrate 79 . disclosed, but not limited thereto. For example, as shown in FIG. 13 , after the probe array holder 11 holds the probe array 71 from the probe array tray unit 72 and transfers it to the alignment unit 78 , the probe array gripper 10 is aligned. The unit 78 may grip the probe array 71 aligned in position and transfer it to the probe head substrate 79 .

13 is a perspective view of a probe array bonding apparatus 100 according to a seventh embodiment of the present invention.

12 and 13 , the probe array bonding device 100 according to the seventh embodiment is a bonding device to which the probe array gripper 10 and the probe array holder 11 according to the first to fifth embodiments are applied. .

The probe array bonding apparatus 100 according to the seventh embodiment holds the probe array 71 from the probe array tray unit 72 and the probe array tray unit 72 on which a plurality of probe arrays 71 are disposed. The probe array holder 11 to be moved and the aligning unit 78 for precisely aligning the probe array 71 moved by the probe array holder 11 to the gripping position, and the probe aligned to the gripping position in the alignment unit 78 The probe array gripper 10 grips the array 71 and moves it to the bonding position, and the first vision camera device 73 aligns the gripping positions of the probe array 71 and the probe array gripper 10 on the alignment unit 78 . ), a second vision camera device 74 for checking and aligning whether the probe array 71 held by the probe array gripper 10 is defective, and a probe head to which the probe pins 80 of the probe array 71 are bonded. A chuck unit 75 for fixing the substrate 79 , a third vision camera device 76 for aligning the probe array 71 to a bonding position on the probe head substrate 79 , and bonding of the probe head substrate 79 . A laser unit 77 irradiating a surface light source laser to bond the probe pins 80 fixedly arranged to the probe array 71 aligned in position, and a laser unit 77 for driving each of the units and devices although not shown in the drawing It may include a control unit.

On the other hand, the probe array tray unit 72 , the alignment unit 78 , and the chuck unit 74 may be operated by being controlled in the four directions x, y, z, and θ by the stage at the bottom. For example, the operation of the probe array tray unit 72 may be controlled by the tray stage 72a moving in the y-direction. The third vision camera device 76 and the laser unit 77 operate in the y-direction and the z-direction to align the probe head substrate 79 held on the probe array 71 and the chuck unit 75 and hold the probe. The surface light source laser beam may be irradiated to the probe array 71 through the array gripper 10 .

When explaining the operation of the alignment unit 78, the bonding positions of the probe arrays 71 in the probe array bonding apparatus 100 must be controlled so that they are bonded in the minimum tolerance range of 1 μm or less as possible to the entire 300mm probe head substrate ( 79), the alignment state of the probe pins 80 bonded to the entirety can be manufactured best.

For the above reasons, it is very important to constantly control the position of the probe array 71 in the operation of moving the probe array 71. In order to achieve this purpose, the probe array holder 11 is used in the tray stage 72a. The probe array 71 transferred to the alignment unit 78 may be controlled by a simple mechanical method, but for more precise control, the alignment unit 78 includes an alignment plate 78a on which the probe array 71 is mounted. and an automatic stage 78b controlled in three directions x, y, and θ under the alignment plate 78a.

The first vision camera device 73 is positioned so that the probe array 71 mounted on the alignment plate 78a can be automatically aligned with vision. When the operation of the first vision camera device 73 is described, the position is determined based on the gripping position of the probe array gripper 10 manufactured in the size of the probe array 71 while checking the image of the first vision camera device 73 . A teaching control operation of moving the misaligned probe array 71 to the gripping position of the probe array gripper 100 may be performed. The gripping position of the probe array gripper 10 may be a position in the array holder space.

Meanwhile, for convenience of explanation, the reference for the non-alignment operation was described with the gripping position of the probe array gripper 10 and the size of the probe array 71 , but the aligner for aligning the probe array 71 and the probe array gripper 10 . Position alignment may be controlled by forming in-marks.

The probe array holder 11 is a pick and place mechanism that performs a function similar to that of the probe array gripper 10 in that it holds and moves the probe array 71 through vacuum suction. The probe array gripper 10 may be used as the probe array holder 11 .

On the other hand, the embodiments disclosed in the present specification and drawings are merely presented as specific examples to aid understanding, and are not intended to limit the scope of the present invention. It is apparent to those of ordinary skill in the art to which the present invention pertains that other modifications based on the technical spirit of the present invention can be implemented in addition to the embodiments disclosed herein.

[Explanation of code]

10: probe array gripper 11: probe array holder

20: gripper body 21: vacuum hole 22: vacuum furnace

23: cooling unit 24: cooling plate 24a: cooling hole

25: installation surface 26: cooling room 27: input/output hole

28: cooling shroud 29: cooling gasket 30: body cover window

40: gripper window 41: gripping hole 42: gripping surface

43: array holder space 44: holder inclined plane 50: gripper vacuum room

60: gripper mechanism 71: probe array

72: probe array tray unit 72a: tray stage

73: first vision camera device 74: second vision camera device

75: chuck unit 76: third vision camera device

77: laser unit 78: alignment unit 78a: alignment plate

78b: automatic stage 79: probe head board

80: probe pin 100: probe array bonding equipment

Claims

A probe array gripper for gripping a probe array in which a plurality of probe pins are fixedly arranged, comprising:

At least one end of the gripper body is connected to the gripper mechanism of the position control device, and a vacuum hole for forming vacuum pressure is formed therein, so that one end is connected to an external vacuum device and the other end is exposed to the lower portion of the spaced apart part. ; and

A vacuum pressure provided at a lower portion of the gripper body to be connected to the vacuum hole, a plurality of gripping holes penetrating up and down are formed to communicate with the vacuum hole, and the plurality of gripping holes are provided through the vacuum hole on the lower surface. a gripper window having a gripping surface for gripping the probe array and transmitting light;

A probe array gripper comprising a.
According to claim 1, wherein the gripper body is

The upper end of one end is connected to the gripper mechanism of the position control device, and the gripper vacuum room connected to the vacuum hole is formed at the other end to open downward, and the gripper window is joined below the gripper vacuum room to close the gripper vacuum room. A probe array gripper, characterized in that it covers.
According to claim 1, wherein the gripper body,

The upper portions of both ends are connected to the gripper mechanism of the position control device, and the gripper vacuum room connected to the vacuum hole is formed in the central portion to open downward, and the gripper window is joined below the gripper vacuum room to close the gripper vacuum room. A probe array gripper, characterized in that it covers.
4. The method of claim 2 or 3,

The gripper body is formed such that the gripper vacuum room penetrates up and down,

a body cover window joined over the gripper vacuum room to cover the gripper vacuum room and transmitting light;

Probe array gripper, characterized in that it further comprises.
According to claim 1, wherein the gripper window,

A gripper vacuum room connected to the vacuum hole is formed on an upper surface of the probe array gripper, and the plurality of gripping holes are formed in the gripper vacuum room.
According to claim 1,

The probe array gripper, characterized in that the material of the gripper body is Invar, Kovar, ceramic, quartz, or glass.
According to claim 1,

The probe array gripper, characterized in that the material of the gripper window is quartz or glass through which the laser beam passes.
5. The method of claim 4,

The probe array gripper, characterized in that the material of the body cover window is quartz or glass through which the laser beam passes.
According to claim 1, wherein the gripper window,

An array holder space in which the probe array is inserted and gripped is formed in the gripping surface, and the plurality of gripping holes are formed in the array holder space.
According to claim 1, wherein the gripper body,

a cooling unit formed around the gripper window to dissipate heat generated from the gripper window to the outside;

Probe array gripper, characterized in that it further comprises.
The method of claim 10, wherein the cooling unit,

It has an installation surface on which a gripper window is installed at a lower portion, a cooling room is formed to be opened upwardly on the upper portion of the installation surface, and an input/output hole for inputting and outputting a refrigerant to and from the cooling room is formed on the outside to circulate to the cooling room a cooling plate for cooling the gripper window installed below the installation surface with a refrigerant; and

a cooling cover coupled to the cooling plate and sealing the cooling room through a cooling gasket;

A probe array gripper comprising a.
at least one probe array tray unit in which probe arrays having probe pins disposed in units of DUTs are disposed;

a probe array holder holding the probe array disposed on the probe array tray unit and moving it to an alignment unit;

the alignment unit including a first vision camera device for aligning positions of the probe array;

a probe array gripper holding the probe array aligned in the alignment unit and transferring it to the probe head substrate and transmitting light;

a second vision camera device for checking whether or not the probe array is defective and a position of the probe array gripped by the probe array gripper;

a chuck unit for fixing and aligning the probe head substrate to which the probe pins disposed on the probe array are bonded;

a third vision camera device for aligning the probe array gripped by the probe array gripper and the probe head substrate; and

a laser unit that transmits a surface light source laser beam through the probe array gripper and irradiates the probe array gripped by the probe array gripper to collectively bond the probe pins disposed on the probe array and the pads of the probe head substrate through a conductive adhesive; including,

The probe array gripper,

At least one end of the gripper body is connected to the gripper mechanism of the position control device, and a vacuum hole for forming vacuum pressure is formed therein, so that one end is connected to an external vacuum device and the other end is exposed to the lower portion of the spaced apart part. ; and

A vacuum pressure provided at a lower portion of the gripper body to be connected to the vacuum hole, a plurality of gripping holes penetrating up and down are formed to communicate with the vacuum hole, and the plurality of gripping holes are provided through the vacuum hole on the lower surface. a gripper window having a gripping surface for gripping the probe array and transmitting light;

Probe array bonding equipment comprising a.
at least one probe array tray unit in which probe arrays having probe pins disposed in units of DUTs are disposed;

an alignment unit on which the probe array tray unit is mounted, the alignment unit including a first vision camera device for aligning positions of the probe array disposed on the probe array tray unit;

a probe array gripper holding the probe array aligned in the alignment unit and transferring it to the probe head substrate and transmitting light;

a second vision camera device for checking whether or not the probe array is defective and a position of the probe array gripped by the probe array gripper;

a chuck unit for fixing and aligning the probe head substrate to which the probe pins disposed on the probe array are bonded;

a third vision camera device for aligning the probe array gripped by the probe array gripper and the probe head substrate; and

a laser unit that transmits a surface light source laser beam through the probe array gripper and irradiates the probe array gripped by the probe array gripper to collectively bond the probe pins disposed on the probe array and the pads of the probe head substrate through a conductive adhesive; including,

The probe array gripper,

At least one end of the gripper body is connected to the gripper mechanism of the position control device, and a vacuum hole for forming vacuum pressure is formed therein, so that one end is connected to an external vacuum device and the other end is exposed to the lower portion of the spaced apart part. ; and

A vacuum pressure provided at a lower portion of the gripper body to be connected to the vacuum hole, a plurality of gripping holes penetrating up and down are formed to communicate with the vacuum hole, and the plurality of gripping holes are provided through the vacuum hole on the lower surface. a gripper window having a gripping surface for gripping the probe array and transmitting light;

Probe array bonding equipment comprising a.