KR102509706B1 - Probe array, method for manufacturing the same, and method for manufacturing probe head of probe card using the same - Google Patents

Abstract

The present invention relates to a probe array, a method for manufacturing the same, and a method for manufacturing a probe head of a probe card using the same. In the present invention, a probe array having probe pins in units of DUT (Device Under Test) is mounted on a probe head substrate in a jig. Heat is applied to the probe pins of the probe array to bond the probe pins to the probe head board at once in units of DUTs. By repeating the mounting and bonding steps, the probe pins are bonded to the entire probe head board in units of DUTs. The probe head of the probe card having probe pins bonded to the entire probe head substrate is obtained by removing the jig of the probe arrays installed on the probe head substrate.

Description

Probe array, method for manufacturing the same, and method for manufacturing a probe head of a probe card using the same {Probe array, method for manufacturing the same, and method for manufacturing probe head of probe card using the same}

The present invention relates to a probe card and a method for manufacturing the same, and more particularly, to a probe array for manufacturing a probe head of a probe card by sequentially implanting probe pins of a DUT unit into a probe head substrate using a probe array, and a method for manufacturing the same and a method for manufacturing a probe head of a probe card using the same.

As is well known, after a series of semiconductor manufacturing processes are completed on a wafer and numerous semiconductor devices are formed, an electrical inspection process performed in a wafer state is required to check whether defects have occurred in the semiconductor devices. In this electrical inspection process, a probe card is used as a medium for electrically connecting a semiconductor device to be inspected and inspection equipment.

Meanwhile, on the surface of the semiconductor device, input/output pads, which are electrical connection passages exposed to the outside, are formed. The probe card includes probe pins capable of inputting/outputting electrical signals by physically contacting these input/output pads. And the main printed circuit board of the probe card is connected to the test equipment. The semiconductor device receives signals from the test equipment through probe pins in contact with the input/output pads, performs an operation, and then outputs the processing result to the test equipment through the probe pins. The inspection equipment inspects the electrical characteristics of the semiconductor device through this and determines whether the semiconductor device is defective.

In general, such an inspection process is performed by simultaneously contacting probe pins to input/output pads of a plurality of semiconductor devices, and is sometimes performed by contacting all semiconductor devices on a 300 mm wafer at once for rapid and efficient inspection. In order to achieve this inspection method, in the probe card, signals coming from the inspection equipment are transmitted to a plurality of semiconductor devices in order to test by contacting at once the semiconductor devices on the wafer, which are generated far more than the number of semiconductor devices that can be inspected by the inspection equipment. A signal sharing or TRE (Test Resource Extension) method that branches to and uses must be implemented. To this end, signal divergence should be possible not only on the main printed circuit board but also on the probe head board of the probe head, so that it can be implemented more easily.

A 300mm large-area MLC (Multi Layer Ceramic) substrate is mainly used as a probe head substrate of a probe card that meets such technical requirements. Pads to which probe pins are bonded are formed on the MLC substrate, and small probe pins of 1 mm to 3 mm in size manufactured using the MEMS (Micro Electro Mechanical System) process that makes microstructures are bonded to the MLC pads to manufacture a probe head. there is. Two methods, 2D MEMS and 3D MEMS, are used to manufacture probe pins using the MEMS process.

First, the 2D MEMS method uses an MEMS process to mass-manufacture standardized thin blade-shaped probe pins on a wafer. The manufactured probe pins are picked up from the laser bonding equipment one by one with a gripper, placed on the pad of the MLC board so that they can contact the input/output pad of the semiconductor device, and then melted the conductive adhesive with a laser beam and bonded to the MLC board. way to do it

This 2D MEMS method is known as the only way to fabricate a probe head by bonding probe pins to a 300mm MLC substrate. However, since the 2D MEMS method needs to move and attach the probe pins one by one, it takes too much time to manufacture the probe head, and the number of probe pins to be transplanted to the probe card increases or several expensive laser equipment is required to manufacture a large number of probe cards. The disadvantage is that additional investment is required.

Second, the 3D MEMS method is a wet and dry process used in the wafer etching process of the MEMS process, a photolithography (photograph) process, and a dry wet plating process to contact the probe pins of the implantation wafer with the input/output pads of the semiconductor device. This is a manufacturing method in which the wafer for transplantation, which is the sacrificial layer, is removed after the batch production is performed so that the probe pins are formed on the entire MLC substrate, bonded together through a reflow process, and then the wafer for transplantation is removed.

There is an advantage in that a large number of probe pins can be in contact with the entire MLC board at once in an excellent alignment. However, the 3D MEMS method was able to achieve alignment of the probe pins up to bonding to a 6-inch or smaller MLC substrate, but when the probe pins of the transplant wafer are collectively bonded to the entire 300mm MLC substrate at once, the alignment A problem arises. In other words, since the difference in thermal expansion between the probe head substrate and the wafer for implantation causes a positional deformation between the probe pin and the bonding pad, the 3D MEMS method is successfully applied to the 300mm MLC substrate as a technical challenge in correcting the positional deformation. are unable to

So, currently, a method of manufacturing a probe head by bonding 3D MEMS probe pins to an MLC substrate in the form of a block of a DUT (Device Under Test) unit and placing them on a 300mm substrate is used. .

Unlike the 300mm MLC board, which is a probe head board, this dunet method cannot achieve signal branching in MLC, so it has a very complicated structure in which a separate circuit configuration for signal branching must be designed. The downside is that it takes a long time.

In accordance with such circumstances, there is a demand for a method for manufacturing a probe head of a probe card having an economical manufacturing cost through a simple and fast manufacturing process for the purpose of improving productivity and reducing production cost.

In the meantime, in order to facilitate the manufacture of probe cards, the present inventors have been working on the patented inventions of Korean Patent Registration No. 10-0979904 (Probe Card and Manufacturing Method Thereof) and Korean Patent Registration No. 10-1284774 (Probe Card and Manufacturing Method Thereof). Through this, we have continuously suggested improvement measures for the probe card.

And Korean Patent Application No. 10-2019-0148004 (Probe Head Manufacturing Method for Probe Card) and Korean Patent Application No. 10-2019-0154551 (Probe Head Manufacturing Method for Probe Card) produced by 2D MEMS and 3D MEMS processes An improvement was proposed as a method of quickly bonding the probe pins to the large-area probe head substrate.

As an extension of the improvement, the present invention improves the bonding method by efficiently repeating the method of aligning and bonding probe pins in DUT units at once to a large-area MLC probe head substrate such as 300 mm, thereby dramatically shortening the manufacturing period. It is an object of the present invention to provide a shortenable probe array, a method for manufacturing the same, and a method for manufacturing a probe head for a probe card using the same.

In order to achieve the above object, the present invention provides a method comprising: mounting a probe array having probe pins on a probe head substrate in a device under test (DUT) unit of a probe head substrate; applying heat to probe pins of the probe array to bond the probe pins to the probe head substrate at once in units of DUTs; bonding probe pins to the entire probe head substrate in units of DUTs by repeating the mounting and bonding steps; and removing a jig of the probe arrays installed on the probe head substrate.

In the bonding step, the heat is applied to the probe pins by a heat transfer method using a laser beam or heating.

Bonding pads corresponding to input/output pads of a plurality of DUTs are formed on an upper surface of the probe head substrate, and a conductive adhesive is applied to each of the bonding pads.

In the mounting step, the probe array is mounted on the probe head substrate so that the probe pins are mounted on bonding pads corresponding to the DUT to be bonded.

The probe array may include a jig having probe pin insertion grooves formed at positions corresponding to the input/output pads of the DUT; and probe pins respectively inserted into the probe pin insertion grooves of the jig.

The material of the jig may include a silicon wafer or glass.

In the removing step, the jigs of the probe arrays on the probe head substrate are selectively removed by wet etching, leaving probe pins of the probe arrays bonded on the probe head substrate.

The probe pins include a bonding portion bonded to the bonding pad.

The junction protrudes out of the probe pin insertion groove.

The probe pins are manufactured by a 2D MEMS process, are inserted into the probe pin insertion grooves, and contact the input/output pads of the DUT and extend downward toward the lower surface of the jig; an elastic part connected to the tip part and extended to one side, at least a part of which is inserted into the probe pin insertion groove; and a support portion that is connected to the elastic portion, extends over the upper surface of the jig, and protrudes out of the probe pin insertion groove. At this time, the support part is the junction part.

The probe array may further include a fixing part formed on the jig and fixing the probe pins inserted into the probe pin insertion grooves.

The fixing part is removed together with the jig in the step of removing the jig.

In the probe pins, a portion of the elastic part connected to the support part protrudes out of the probe pin insertion groove through a side surface of the jig.

The support part is connected to the elastic part and protrudes above the fixing part.

The probe pins are manufactured in the jig by a 3D MEMS process, and are inserted into the probe pin insertion grooves and contact the input/output pads of the DUT and extend downward; and an elastic part connected to the tip part, extending to one side, and protruding out of the probe pin insertion groove. The elastic part is the joint part.

In the mounting step, an array gripper may vacuum the probe array and mount the probe array on the probe head substrate.

In the bonding step, the probe pins of the probe array may be bonded to the probe head substrate by irradiating the probe array with a laser beam of a surface light source through the array gripper.

The array gripper includes an attachment plate for vacuum adsorbing the probe array. The material of the attachment plate may include quartz or glass that transmits a laser beam.

In the bonding step, the array gripper is heated with heat supplied from a heat source, and the jig and probe pins of the probe array adsorbed to the heated array gripper are heated to bond the probe pins of the probe array to the probe head substrate. can do.

The array gripper includes an attachment plate for vacuum adsorbing the probe array. The material of the attachment plate may include Invar, Kovar, or ceramic materials having thermal conductivity and a low coefficient of thermal expansion.

The present invention also provides a probe array having probe pins for each device under test (DUT) unit of a probe head substrate, comprising: a jig having probe pin insertion grooves formed at positions corresponding to input/output pads of the DUT; and the probe pins respectively inserted into the probe pin insertion grooves of the jig.

Forming probe pin insertion grooves at positions corresponding to input/output pads of the DUT in a jig having a size corresponding to the size of a device under test (DUT) of a probe head substrate; inserting probe pins into respective probe pin insertion grooves of the jig; and forming fixing parts on the jig to fix the probe pins inserted into the probe pin insertion grooves.

Further, the present invention includes preparing a jig original plate having a plurality of jigs having a size corresponding to the size of a device under test (DUT) of a probe head substrate; forming tip grooves in the plurality of jigs at positions corresponding to the input/output pads of the DUT, respectively; forming tip portions by filling the tip portion grooves with plating; forming elastic part grooves respectively connected to the tip parts through a photoresist process on an upper part of the jig disc; forming probe pins having elastic parts respectively connected to the tip parts by filling the elastic part grooves with plating; exposing the elastic parts of the probe pins to the upper surface of the jig by removing the photoresist forming the elastic part grooves; and obtaining probe arrays having probe pins formed on the jig by dividing the jig disk into units of the jig.

According to the present invention, a probe array capable of dramatically shortening the manufacturing period by improving a bonding method by repeating a method of aligning and bonding probe pins in units of DUTs to a large-area probe head substrate such as 300 mm at a time; A manufacturing method thereof and a method of manufacturing a probe head of a probe card using the same are provided.

That is, in the process of manufacturing the probe head of the probe card, a probe array in which probe pins are arranged in DUT units is manufactured, a bonding laser equipment is used as bonding equipment, the probe array is positioned on the probe head substrate with a quartz array gripper, and then the laser The beam is irradiated to the DUT area where the probe array is located, and the probe pins are bonded on the probe head substrate at once in DUT units. join The probe head according to the present invention can be manufactured by removing the probe arrays installed in DUT units from the probe head substrate.

Alternatively, in splicing equipment that uses a heating plate, position the probe array on the probe head substrate with an array gripper made of metal or ceramic, and heat the array gripper with the heating plate to transfer heat to the probe array to move the probe head to DUT units at a time. Probe pins are bonded on the substrate, and the probe pins are bonded to the entire probe head substrate by repeating the bonding process of the probe pins using the probe array of the DUT unit. The probe head according to the present invention can be manufactured by removing the probe arrays installed in DUT units from the probe head substrate.

Since the method of manufacturing the probe head of the probe substrate according to the present invention can bond the probe pins to the probe head substrate at once in units of DUTs, it is possible to bond the probe head to the probe head substrate more than the conventional 2D MEMS method of bonding individual probe pins to the probe head substrate. Productivity can be increased by drastically shortening the production period.

In the method of manufacturing the probe head of the probe substrate according to the present invention, since the probe head is manufactured by repeating the process of bonding probe pins to the probe head substrate at once in units of DUT, a large area MLC probe head substrate having a size of 300 mm is manufactured. Even with manufacturing, alignment errors between the probe pins and bonding pads rarely occur. Therefore, the manufacturing method of the probe head of the probe substrate according to the present invention can manufacture a probe head using a large-area probe head substrate for 300 mm, which has not been applied to the existing 3D MEMS process, so that the manufacturing process is less expensive than the existing 3D MEMS process. By simplifying the process, the probe head can be manufactured much faster and at a lower cost.

1 is a perspective view of a probe array according to a first embodiment of the present invention.
2 is an exploded perspective view showing a state in which probe pins are positioned in the probe array of FIG. 1;
3 is a side view of a probe array according to a first embodiment of the present invention.
4 is a front cut-away perspective view of the probe array according to the first embodiment of the present invention.
5 is a side and front cutaway perspective view of a case where a 2D MEMS probe pin with a narrow tip is used in the probe array according to the first embodiment of the present invention.
6 is a perspective view of a modified probe array according to a first embodiment of the present invention.
7 is a perspective view of an array gripper according to a first embodiment of the present invention.
8 to 10 are diagrams for explaining a method of manufacturing a probe head of a probe card according to a first embodiment of the present invention.
11 is a diagram for explaining a method of manufacturing a probe array to which 3D MEMS probe pins according to a second embodiment of the present invention are applied.
12 is a perspective view of a probe array to which 3D MEMS probe pins according to a second embodiment of the present invention are applied.
13 and 14 are diagrams for explaining a manufacturing method of a probe head of a probe card according to a second embodiment of the present invention.
15 is a perspective view of an array gripper according to a second embodiment of the present invention.
16 and 17 are diagrams for explaining a method of manufacturing a probe head of a probe card using an array gripper according to a second embodiment of the present invention.

It should be noted that in the following description, only parts necessary for understanding the embodiments of the present invention are described, and descriptions of other parts will be omitted without departing from the gist of the present invention.

The terms or words used in this specification and claims described below should not be construed as being limited to ordinary or dictionary meanings, and the inventors have appropriately used the concept of terms to describe their inventions in the best way. It should be interpreted as a meaning and concept consistent with the technical spirit of the present invention based on the principle that it can be defined in the following way. Therefore, the embodiments described in this specification and the configurations shown in the drawings are only preferred embodiments of the present invention, and do not represent all of the technical spirit of the present invention, so various equivalents that can replace them at the time of the present application. It should be understood that there may be variations and variations.

Hereinafter, embodiments of the present invention will be described in more detail with reference to the accompanying drawings.

[First Embodiment]

1 is a perspective view of a probe array according to a first embodiment of the present invention. 2 is an exploded perspective view showing a state in which probe pins are positioned in the probe array of FIG. 1 .

Referring to FIGS. 1 and 2 , the probe array 30a according to the first embodiment is a probe array having probe pins 10 in units of DUTs (Device Under Test), and positions corresponding to input/output pads of the DUT. It includes a jig 20 in which probe pin insertion grooves are formed, and probe pins 10 respectively inserted into the probe pin insertion grooves of the jig 20 .

The probe array 30a according to the first embodiment may further include fixing parts 40 formed on the jig 20 and fixing the probe pins 10 inserted into the probe pin insertion grooves.

In the probe array 30a according to the first embodiment, the probe pins 10 are positioned on the jig 20 on a plate corresponding to the size of the DUT in order to arrange the probe pins 10 in units of DUT, which is the size of a semiconductor device. The probe pins 10 are fixed to the jig 20 by aligning the probe pins 10 to the jig 20 by forming the fixing part 40 using an adhesive containing ceramic, metal, or carbon and not deforming at a high temperature.

3 is a side view of the probe array 30a according to the first embodiment of the present invention.

Referring to FIG. 3 , the probe pins 10 included in the probe array 30a are 2D MEMS probe pins.

The 2D MEMS probe pin 10 will be described as follows.

The probe pin 10 includes a bonding portion bonded to a bonding pad ( 51 in FIG. 8 ) of a probe head substrate ( 50 in FIG. 8 ). The junction protrudes out of the probe pin insertion groove.

The probe pin 10 includes a support part 11 , an elastic part 12 and a tip part 14 .

The support part 11 is bonded to the bonding pad ( 51 in FIG. 8 ) of the probe head substrate ( 50 in FIG. 8 ). That is, the support part 11 is a junction part.

The elastic part 12 has one end connected to the lower end of the support part 11 and extends in the horizontal direction, and one or more through parts 13 are formed in the central part in the horizontal direction. The elastic part 12 has at least one pin pressure adjusting bar connecting one side of the ceiling or side of the penetrating part 13 and the other side of the floor or side.

And the tip part 14 is formed by being connected to the other end of the elastic part 12 and protruding downward.

Here, the tip portion 14 is a contact portion having a contact support portion 15 connected to the elastic portion 12, a contact tip 18 extending under the contact support portion 15 and contacting an input/output pad of a semiconductor device formed on a wafer ( 16), and an aligning portion 17 connected in an oblique line from the contact portion 16 toward the elastic portion 12 and going down. At this time, the contact support portion 15 may be formed to be wider than or equal to the size of the contact portion 16 and the alignment portion 17 . Alternatively, only the tip portion 14 may be formed without forming the contact support portion 15 .

In addition, as shown in FIG. 5, the tip portion 14 includes the thickness of the contact tip 18 located at the center of the thickness width of the probe pin 10 and formed with a narrow width, and the contact tip 18 is the reference As a result, both sides or one side of the thickness of the probe pin 10 located on the left or right side may be thinned to form a shape thinner than the entire thickness of the probe pin 10. For example, the tip portion 14 may be formed with a thickness of 50% to 100% of the thickness of the elastic portion.

The jig 20 included in the probe array 30a is used to implant the probe pins 10 on a probe head substrate in units of DUTs.

This jig 20 has a size corresponding to the DUT, which is a semiconductor device. In the jig 20, probe pin insertion grooves are formed at positions corresponding to the input/output pads of the DUT. The probe pin insertion groove includes a tip groove 21 and an elastic groove 22 .

The jig 20 has a tip portion groove 21 where the tip portion 14 of the probe pin 10 is located. An elastic part groove 22 is formed in the tip part groove 21, extending upward and extending to one side, where the elastic part 12 of the probe pin 10 is positioned. The material of the jig 20 may be a silicon wafer or glass, which is easy to manufacture through a photolithography process.

Although the jig 20 is manufactured based on the size of the semiconductor device, it is preferable to manufacture it in a size that minimizes positional deformation of the probe pins 20 caused by a difference in thermal expansion between the jig 20 and the probe head substrate in the bonding process. do. The jig 20 may be manufactured in a size smaller than that of the semiconductor device or several times the size of the semiconductor device according to specifications for positioning of the probe pins 10 .

The position and spacing of the tip part grooves 21 formed in the jig 20 are formed to be in contact with the input/output pads formed in the semiconductor device of the wafer and the spacing. The tip part groove 21 is manufactured to a minimum size that allows the tip part 14 of the probe pin 10 to enter the tip part groove 21 by 2 μm or less than the size of the tip part 14 of the probe pin 10. Minimize the positional tolerance of (14).

Since the elastic part groove 22 is a long hole formed long, the middle part is formed larger in consideration of the straightness of the elastic part 12 of the probe pin 10 . The elastic part groove 22 is formed to be within 2 μm larger than the elastic part 12 at the part where the support part 11 is located and the part close to the tip part 14, so that the probe pins 10 are positioned with a minimum clearance. The depth of the elastic part groove 22 may be equal to or lower than the height of the elastic part 12 of the probe pin 10 .

The reason why the size of the tip part groove 21 and the elastic part groove 22 is formed within 2 μm of the size of the probe pin 10 is that when the probe pin 10 is bonded to the probe head substrate, the size of the jig 20 This is to minimize a positional error of the probe pin 10 that may occur due to the size of the tip part groove 21 and the elastic part groove 22 to within 2 μm in a DUT unit that is the size of the probe array 30a.

An inclined surface 23 may be formed at an upper end of the tip part groove 21 and the elastic part groove 22 formed in the jig 20 . The reason why the inclined surface 23 is formed in this way is that when the probe pins 10 are placed in order to insert the probe pins 10 into the probe pin insertion grooves of the jig 20, margin tolerance is formed to form the probe pins 10. This is because they can be easily guided to be inserted into the probe pin insertion groove.

In addition, the contact support portion 15 of the tip portion 14 of the probe pin 10 becomes a section finally located in the tip portion groove 21, and a narrow inclined surface 23 is provided toward the contact portion 16 to form a contact portion of the probe pin 10. When the tip 14 is positioned in the tip groove 21, the contact tip 18 and the alignment portion ( 17) The tip part 12 of the probe pin 10 enters the tip part groove 21 without damage, and the contact support part 15 easily enters the tip part groove 21 without damage. make it possible to position

In addition, although not shown in the drawings, in order to match the shape of the probe pin 10, the tip groove 21 formed on the jig 20 is formed in two steps, and a larger tip groove is formed in the portion connected to the elastic part 12. 21 may be formed and a tip portion groove 21 in which the contact portion 16 of the tip portion 14 is located below may be formed.

4 is a front cutaway perspective view of a portion where the probe tip 14 of the probe pin 10 is positioned in the jig 20 included in the probe array 30a according to the first embodiment of the present invention. Here, (a) of FIG. 4 is a cross-sectional view viewed from the front of the jig 20, and (b) of FIG. 4 is a plan view viewed from the upper surface of the jig 20.

Referring to FIG. 4 , the probe array 30a forms an inclined surface 23 at the upper entrance of the tip groove 21 and the elastic groove 22 formed in the jig 20 to form the probe pin 10 in the jig 20. ), it can be positioned with a margin tolerance as much as c and d.

The reason why the inclined surface 23 is formed in the tip groove 21 and the elastic groove 22 formed in the jig 20 where the probe pins 10 are located is that the operator does not have the ability to position the probe pins 10. This is to minimize the problem of speed and productivity and the problem of damaging the probe pin 10 due to operator's mistake. In addition, when the task of locating the probe pins 10 on the jig 20 is performed by automation equipment to increase productivity, the tolerance of the precision of locating the probe pins 10 in the automation equipment is increased to increase the probe pin 10 more quickly This is to place them on the jig 20 to manufacture the probe array 30a.

And the fixing part 40, as shown in FIG. 1, is formed on the jig 20 and fixes the probe pins 10 inserted into the probe pin insertion grooves. As the fixing part 40, a material that can be removed together when the jig 20 is removed with a solvent such as KOH or TMAH may be used. For example, as the fixing part 40, a fixing plate made of ceramic, metal, or adhesive containing carbon and not deformed at a high temperature or silicon material may be used.

The support part 11 of the probe pin 10 protrudes above the fixing part 40 through the top of the jig 20 so that it can be stably contacted with the bonding pad when the probe array 30a is mounted on the probe head substrate. has been

5 is a side and front cutaway perspective view of a case where a 2D MEMS probe pin 10 having a narrow tip portion 14 is used in the probe array 30a according to the first embodiment of the present invention.

Here, (a) of FIG. 5 is a side-cut perspective view of the elastic part 12 using the 2D MEMS probe pin 10 having a narrow tip part 14 in the probe array 30a according to the first embodiment. (b) is a cutaway perspective view showing a state in which the tips 14 of the 2D MEMS probe pins 10 are positioned on the jig 20 of the probe array 30a. And FIG. 5(C) is an enlarged view of part C of FIG. 5 .

Referring to FIG. 5 , the tip portion 14 is formed narrower downward than the elastic portion 12, and accordingly, the tip portion groove 21 formed in the jig 20 is also formed narrower than the elastic portion groove 22.

The reason for narrowing the tip portion 14 is that when the probe pins 10 can be arranged on both left and right sides instead of on one side, the intervals between the tip grooves 21 are narrower than the intervals between the elastic grooves 22. At this time, the size of the tip grooves 21 arranged at a narrower interval than the size of the elastic grooves 22 is reduced so that even if the interval between the tip grooves 21 in the jig 20 is narrow, it can be formed without difficulty through the photo etching process. This is to facilitate the manufacture of the probe array 30a.

6 is a perspective view of a modified probe array 30b according to the first embodiment of the present invention.

Referring to FIG. 6 , the tip portion 14 of the probe pin 10 and a portion of the elastic portion 12 are positioned in the jig 20, and the portion of the elastic portion 12 of the probe pins 10 positioned in the jig 20 They are fixed to the jig 20 with the fixing part 40. Portions of the support portion 11 of the probe pin 10 are exposed outside the jig 20 . That is, in the probe pins 10, a part of the elastic part 12 connected to the support part 11 protrudes out of the probe pin insertion groove through the side surface of the jig 20. The support part 11 is connected to the elastic part 12 and protrudes above the fixing part 40 .

In this way, when the probe pins 10 arranged in the probe array 30b are positioned on the probe head substrate ( 50 in FIG. 9 ) in a state in which the supports 11 are exposed, the probe pins 10 are placed on the probe head substrate ( When irradiating a laser beam for bonding the bonding pads 51 of 50) to the bonding pads 51 of the probe head substrate 50 ( 51) can be irradiated simultaneously to equalize the total heat sources in the three places. That is, the bonding process of the bonding pads 51 of the probe pins 10 is performed by irradiating a laser beam directly to the support portion 11 of the probe pins 10, the conductive adhesive, and the bonding pad 51 without going through the jig 20. can be done quickly.

7 is a perspective view of the array gripper 60 according to the first embodiment of the present invention.

Referring to FIG. 7 , the array gripper 60 is a probe array transfer member that vacuums a probe array and mounts the probe array on a probe head substrate.

The array gripper 60 includes an array attachment table 63 having an attachment plate 61 for vacuum suction and gripping of the probe array. Vacuum holes 62 are located inside the array mount 63 to form a vacuum. On the opposite side of the attachment plate 61 of the array attachment 63, there is an array gripper fixing part 64 for fixing the array gripper 60. Although not shown in the drawing, the array gripper fixing part 64 is connected and fixed to a mechanical device operated according to a computer numerical control function automatically operated by a program in laser bonding equipment. In the laser equipment, the array frame gripper 60 holds a DUT-sized probe array, and a junction in which probe pins are bonded to the probe head substrate to correspond to the input/output pads of the semiconductor devices in order to inspect hundreds of semiconductor devices produced on the wafer. It allows to repeatedly perform an operation of placing array frames of the size of the DUT on the pads one by one.

The array gripper 60 may be made of quartz or glass suitable for transmitting the laser beam to the probe array 30 held by the array gripper 60 through transmission of the laser beam.

8 to 10 are diagrams for explaining a manufacturing method of the probe head 100 of the probe card according to the first embodiment of the present invention.

8 to 10, bonding pads 51 corresponding to input/output pads of a plurality of DUTs are formed on the upper surface of the probe head substrate 50, and a conductive adhesive is applied to the bonding pads 51, respectively. is spread out

This probe head substrate 50 is an MLC substrate. That is, the probe head substrate 50 includes an MLC substrate body on which bonding pads 51 are formed, and a solder mask layer covering the upper surface of the MLC substrate body except for the bonding pads 51 . As a material for the solder mask layer, dry film solder resist (DFSR) or photo solder resist (PSR) may be used.

As the MLC substrate, a High Temperature Co-fired Ceramic (HTCC) substrate or a Low Temperature Co-fired Ceramic (LTCC) substrate may be used. Here, the HTCC substrate is a ceramic substrate manufactured by firing at a temperature of 1500° C. or higher. The LTCC substrate is a ceramic substrate manufactured by firing at 1000°C or less.

The bonding pad 51 may be formed on the MLC substrate body using a sputtering process and a plating process.

A method of manufacturing the probe head 100 of the probe card according to the first embodiment will be described.

First, referring to FIG. 8 , the array gripper 60 grabs the probe array 30a of the size of the DUT and aligns and positions the probe array 30a at the bonding position with a mechanical unit operated by computer numerical control, and then the laser beam 70 is irradiated and bonded.

Here, in the probe array 30a, the probe pins 10 are all disposed inside the jig 20 of the size of the DUT, the laser beam 70 heats the jig 20, and the heated jig 20 heats the probe pins. Heat transferred to the probe pins 10 and to the support 11 of the probe pins 10 is transferred to the conductive adhesive located on the bonding pad 51 of the probe head substrate 50, so that the conductive adhesive is attached to the probe pin 10. The support parts 11 of the probe head substrate 50 are bonded to the bonding pads 51 .

At this time, the laser beam 70 of the surface light source is irradiated to the probe array 30a. The area to which the laser beam is irradiated may correspond to the size of the probe array 30a. For example, the cross section of the laser beam may be a rectangle corresponding to the cross section of the probe array 30a.

Therefore, the probe pins 10 of the probe array 30a are collectively attached to the bonding pads 51 of the probe head substrate 50 by locally irradiating the laser beam 70 to the probe array 30a to be subjected to the bonding process. can be joined with Furthermore, since the laser beam 70 is locally irradiated to the probe array 30a to be bonded, the probe array 30a already bonded or the bonding pad 51 exposed to the outside without being bonded to the probe array 30a Thermal effects on the above conductive adhesive can be suppressed.

9 are views for explaining a method of manufacturing a probe head of a probe card using a modified probe array 30b according to the first embodiment.

Referring to FIG. 9, the jig 20 of the probe array 30b holds only the elastic parts 12 of the probe pins 10, and the support parts 11 of the probe pins 10 are exposed to irradiate the laser beam 70. ) is joined by The advantage of this method is that the laser beam 70 simultaneously irradiates the supports 11 of the probe pins 10, the bonding pads 51 of the probe head substrate 50, and the conductive adhesive located therebetween to generate heat. It is to transfer stably and rapidly.

In this laser bonding method, a preheating function is also placed on the chuck for raising the probe head substrate 50 inside the laser equipment, and the output of the laser beam 70 is adjusted together to prevent damage to the probe head substrate 50. You can connect quickly while doing it.

As shown in FIGS. 8 and 9 , by repeatedly performing a process of mounting and bonding the probe arrays 30a and 30b on the probe head substrate 50 using the array gripper 60, (50) The probe pins 10 may be collectively bonded to positions corresponding to the entire DUT via the jig 20 of the probe arrays 30a and 30b, respectively.

After the probe pins 10 are bonded to the entire probe head substrate 50, the jig 20 and the fixing part 40 of the probe arrays 30a and 30b installed on the probe head substrate 50 are removed. As shown in FIG. 10 , the probe head 100 of the probe card having the probe head substrate 50 to which the probe pins 10 are bonded may be manufactured.

Here, FIG. 10 shows the probe pins 10 of the DUT unit probe array 30 bonded to all DUT positions on the probe head substrate 50, and the jig 20 constituting the probe array 30 and the fixing part (shown in FIG. 8 and 40 in FIG. 9) are dissolved or removed with a solvent such as KOH or TMAH, and only the probe pins 10 remain to form the probe head 100.

[Second Embodiment]

11 is a diagram for explaining a method of manufacturing a probe array 130a to which the 3D MEMS probe pins 110 according to the second embodiment of the present invention are applied.

Referring to FIG. 11 , the probe array 130a according to the second embodiment may be manufactured as follows.

First, as shown in (a) of FIG. 11 , the tip portion grooves 21 in which the tip portion 14 of the probe pin 110 is formed are formed in the jig 20 by a 3D MEMS process to correspond to the position of the input/output pad of the semiconductor device. form

Next, as shown in (b) of FIG. 11 , the tip portion 14 is collectively formed and flattened by filling the metal material through a dry or wet plating process.

Next, as shown in (c) of FIG. 11 , elastic part grooves 22 are formed with photoresist or a second metal through a photolithography process, which is a photolithography process.

Next, as shown in (d) of FIG. 11, the dry and wet plating processes are repeated to form the elastic part 12 at once, and the flattening operation is performed to form the tip part 14 and the elastic part 12 of the 3D MEMS probe pin. ) to form

And, as shown in (g1) of FIG. 11, the probe array 130a according to the second embodiment can be manufactured by removing the photoresist or the second metal forming the elastic part groove 22 and then dividing it into the size of the DUT. there is.

On the other hand, as the distance between the probe pins 110 narrows, the thickness of the elastic parts 12 of the probe pins 110 becomes thinner, which may cause a problem in that pin pressure of the probe pins 110 is lowered.

In order to solve this problem, the probe pin 110 can be manufactured as follows.

It forms part of the elastic part connected to the tip part 14 according to (a) to (d) of FIG. 11 .

Next, as shown in (e) and (f) of FIG. 11, a photo process using a photoresist or a third metal, a dry wet plating process, and a flattening process are repeated in a laminated manner. Elasticity with holes inside part 12 is formed. By forming a hole in the elastic portion 12, the pin pressure of the probe pin to be manufactured can be increased.

And, as shown in (g2) of FIG. 11, after removing the photoresist or the third metal formed in (e) and (f) of FIG. 11, the probe array according to the second embodiment is divided into DUT sizes ( 130a) can be produced.

Unlike the conventional 3D MEMS manufacturing process in which the positions of DUTs formed on the jig 20 correspond to the positions of semiconductor devices formed on a wafer, the manufacturing process of the probe array 130a according to the second embodiment is , DUT unit position is formed differently, and unlike the existing 3D MEMS bonding process in which even one pin of one DUT cannot be used if there is a problem in the whole, it is divided into DUT units and only good probe arrays 130 without problems can be used. Therefore, the effect of reducing the defect rate and increasing productivity can be expected.

In the probe array 130a according to the second embodiment, the elastic parts 12 of the probe pins 110 protrude out of the upper surface of the jig 20 . Since the probe pin 110 manufactured by 3D MEMS does not have a support part, the elastic part 12 is used as a bonding part bonded to the bonding pad of the probe head substrate. The probe array 130a does not have a fixing part.

Meanwhile, the probe array 130a according to the second embodiment shown in FIG. 11 discloses an example in which the probe pins 110 are formed in the jig 20, but is not limited thereto.

For example, as shown in (a) of FIG. 12, in the modified probe array 130b according to the second embodiment, a part of the elastic part 12 protrudes to the outer surface of the jig 20, Probe pins 110 protruding above the upper surface may be provided. That is, when dividing the jig disc into individual jigs 20 after forming the elastic part 12, by dividing the jig disc so that a part of the elastic part 12 protrudes to the outer surface of the jig 20, the second A modified probe array 130b according to the embodiment may be manufactured.

The modified probe array 130b according to the second embodiment may be manufactured in the same form as the modified probe array (30b in FIG. 6) according to the first embodiment.

12 is a perspective view of probe arrays 130a and 130b to which the 3D MEMS probe pins 110 according to the second embodiment of the present invention are applied.

12 is a perspective view of probe arrays 130a and 130b according to a second embodiment of the present invention.

Referring to (a) of FIG. 12, in the probe array 130b, a portion of the elastic part 12 bonded to the support part 11 of the probe pin 110 formed on the bonding pad of the probe head substrate is exposed from the jig 20. it is a form The elastic part 12 protrudes above the jig 20 .

Referring to (b) of FIG. 12 , in the probe array 130a, both the tip portion 14 and the elastic portion 12 are covered by the jig 20 . The elastic part 12 protrudes above the jig 20 .

13 and 14 are diagrams for explaining a manufacturing method of the probe head 200 of the probe card according to the second embodiment of the present invention.

Referring to FIGS. 13 and 14, as in the case of the first embodiment, the probe arrays 130a and 130b of the DUT unit are moved to the probe head substrate 50 using the array gripper 60 through which the laser beam 70 is transmitted. , and the laser beam 70 is irradiated so that the elastic parts 12 of the probe pins 110 disposed on the probe arrays 130a and 130b and the bonding pads 51 of the probe head substrate 50 are conductive. bonded with an adhesive.

At this time, the difference between the exposed and non-exposed parts of the elastic parts 12 of the probe pins 110 is the probe head of the probe card using the probe arrays 30 and 30a according to the first embodiment described above (Fig. It is the same as the description of the manufacturing method of 10 of 100).

After the probe pins 110 of the DUT-unit probe arrays 130a and 130b according to the second embodiment are bonded to all DUTs of the probe head substrate 50, the jig constituting the probe arrays 130a and 130b ( 20) is removed with a solvent such as KOH or TMAH, and only the probe pins 110 remain to form the probe head 200.

[Array gripper according to the second embodiment]

15 is a perspective view of an array gripper 160 according to a second embodiment of the present invention.

Referring to FIG. 15 , the array gripper 160 according to the second embodiment includes an array attachment table 63 having an attachment plate 61 for holding and vacuuming a probe array. Vacuum holes 62 are located inside the array mount 63 to form a vacuum. A sensor groove 65 in which a temperature sensor is located is formed inside the array mount 63. On the opposite side of the attachment plate 61 of the array attachment 63, there is an array gripper fixing part 64 for fixing the array gripper 160. The array gripper fixing part 64 is bonded and fixed to the heating plate. Although not shown in the drawing, the heating plate is connected and fixed to a mechanical device operated according to a computer numerical control function automatically operated by a program in the bonding equipment.

In the bonding equipment, the array gripper 160 holds a DUT-sized probe array, and in order to inspect hundreds of semiconductor devices produced on a wafer, a DUT-sized probe such that probe pins correspond to bonding pads of each DUT on a probe head substrate. The arrays are aligned and positioned one by one at the bonding location. Heat heated through a heating plate is transferred to the probe array, and an operation of bonding probe pins disposed on the probe array to bonding pads of the probe head substrate through a conductive adhesive is repeatedly performed.

The array gripper 160 transmits heat but has low thermal expansion, and a material capable of transferring heat from a heating plate to probe pins of the probe array is used. For example, the material of the array gripper 160 may be Invar, Kovar, or ceramic-based materials. Mullite may be used as a ceramic-based material. In addition, heat may be directly transferred to the probe array without a heating plate by inserting a heat source such as a heater into the array gripper 60 .

16 are views for explaining a method of manufacturing a probe head of a probe card using the array gripper 160 according to the second embodiment of the present invention. Here, the probe array 30a according to the first embodiment was used as the probe array.

Referring to (a) of FIG. 16 , the probe pins 10 formed of 2D MEMS are arranged on a DUT-sized jig 20 and the probe array 30a fixed by the fixing part 40 is moved by the array gripper 160. It is moved to the bonding position of the probe head substrate 50 and positioned.

Next, referring to (b) of FIG. 16, the probe array 30a is placed on the probe head substrate 50 and the heating plate 80 is heated to pass through the array gripper 160 to the probe array 30a jig ( 20) and the probe pins 10 are bonded to the bonding pads 51 of the probe head substrate 50 and the probe pins 10 via a conductive adhesive.

When the conductive adhesive between the probe pins 10 and the bonding pad 51 of the probe head substrate 50 is melted by heating for a certain period of time, the heating plate 80 is stopped to set the temperature of the array gripper 160 to the sensor groove. After waiting for a time to reach the temperature below the melting point of the conductive adhesive through the temperature sensor located at 65, and after the conductive adhesive is completely hardened so that the probe pins 10 of the probe array 30a cannot move, the array gripper 160 is operated for the next operation. move for

The bonding method using the heating plate 80 may take more time than the bonding method using a laser beam, but the heating plate equipment has an advantage in that it can be manufactured simply at a lower cost than the laser equipment.

17 are views for explaining a method of manufacturing a probe head of a probe card using an array gripper 160 according to a second embodiment of the present invention. Here, the probe array 130a according to the second embodiment was used as the probe array.

Referring to FIG. 17, the probe head of the probe card is the same as in FIG. 16 except that the array gripper 160 is used in the second embodiment, but the probe array 130a according to the second embodiment is used as the probe array. to manufacture

That is, the probe head of the probe substrate is manufactured by bonding the probe pins 110 of the DUT-sized probe array 130a created by 3D MEMS to the support portion 11 formed on the bonding pad 51 of the probe head substrate 50. .

As described above, in the manufacturing method according to the second embodiment, the chuck for raising the probe head substrate 50 inside the bonding equipment has a preheating function to adjust the temperature of the array gripper 160 through the heating plate 80. Thus, it is possible to provide a condition in which the probe pins 110 and the bonding pads 51 of the probe head substrate 50 are well bonded through the conductive adhesive.

On the other hand, the embodiments disclosed in this specification and drawings are only presented as specific examples to aid understanding, and are not intended to limit the scope of the present invention. In addition to the embodiments disclosed herein, it is obvious to those skilled in the art that other modifications based on the technical idea of the present invention can be implemented.

10,110: probe pin
11: support
12: elastic part
13: Penetration
14: tip part
15: contact support
16: contact
17: alignment part
18: contact tip
20 : jig
21: tip part groove
22: elastic part groove
23: slope
30a, 30b, 130a, 130b: probe array
40: fixed part
50: probe head board
51: junction pad
60,160: array gripper
61: attachment plate
62: vacuum hole
63: attachment
64: gripper fixing part
65: sensor hole
70: laser beam
80: heating plate
100,200: probe head

Claims (22)

mounting a probe array having probe pins in units of DUT (Device Under Test) of the probe head substrate to a jig on the probe head substrate;
applying heat to probe pins of the probe array to bond the probe pins to the probe head substrate at once in units of DUTs;
bonding probe pins to the entire probe head substrate in units of DUTs by repeating the mounting and bonding steps; and
removing a jig of the probe arrays installed on the probe head substrate;
A method of manufacturing a probe head of a probe card using a probe array comprising a. The method of claim 1, wherein in the bonding step,
The method of manufacturing a probe head of a probe card using a probe array, characterized in that the heat is applied to the probe pins by a heat transfer method by a laser beam or heating. According to claim 1,
bonding pads corresponding to input/output pads of a plurality of DUTs are formed on an upper surface of the probe head substrate, and a conductive adhesive is applied to each of the bonding pads;
In the mounting step,
The method of manufacturing a probe head of a probe card using a probe array, characterized in that the probe array is mounted on the probe head substrate so that the probe pins are mounted on bonding pads corresponding to the DUT to be bonded. The method of claim 3, wherein the probe array,
a jig having probe pin insertion grooves formed at positions corresponding to input/output pads of the DUT; and
probe pins respectively inserted into probe pin insertion grooves of the jig;
A method of manufacturing a probe head of a probe card comprising a. According to claim 4,
The material of the jig includes silicon wafer or glass,
In the removing step,
A method of manufacturing a probe head of a probe card using a probe array, characterized in that the probe pins of the probe arrays bonded on the probe head substrate are left by selectively removing the jig of the probe arrays on the probe head substrate by wet etching. . The method of claim 4, wherein the probe pins,
A bonding portion bonded to the bonding pad; includes,
The manufacturing method of the probe head of the probe card, characterized in that the junction protrudes out of the probe pin insertion groove. The method of claim 6, wherein the probe pins are manufactured by a 2D MEMS process,
a tip portion inserted into the probe pin insertion groove, contacting an input/output pad of the DUT, and extending downward toward the lower surface of the jig;
an elastic part connected to the tip part and extended to one side, at least a part of which is inserted into the probe pin insertion groove; and
A support part connected to the elastic part, extending over the upper surface of the jig, and protruding out of the probe pin insertion groove;
A method of manufacturing a probe head of a probe card, characterized in that the support portion is a joint portion. The method of claim 7, wherein the probe array,
A fixing part formed on the jig and fixing the probe pins inserted into the probe pin insertion grooves;
The method of manufacturing a probe head of a probe card, characterized in that the fixing part is removed together with the jig in the step of removing the jig. The method of claim 8, wherein the probe pins,
A part of the elastic part connected to the support part protrudes out of the probe pin insertion groove through a side surface of the jig,
The method of manufacturing a probe head of a probe card, characterized in that the support portion is connected to the elastic portion and protrudes above the fixing portion. The method of claim 6, wherein the probe pins are manufactured on the jig by a 3D MEMS process,
a tip portion inserted into the probe pin insertion groove, contacting an input/output pad of the DUT, and extending downward; and
An elastic part connected to the tip part, extending to one side, and protruding out of the probe pin insertion groove;
The manufacturing method of the probe head of the probe card, characterized in that the elastic part is the junction part. The method of claim 1, wherein in the loading step,
The method of manufacturing a probe head of a probe card, characterized in that an array gripper vacuums the probe array and mounts it on the probe head substrate. The method of claim 11, wherein in the bonding step,
A method of manufacturing a probe head of a probe card, characterized in that the probe pins of the probe array are bonded to the probe head substrate by irradiating the probe array with a laser beam of a surface light source through the array gripper. The method of claim 12, wherein the array gripper,
An attachment plate for vacuum adsorbing the probe array;
The method of manufacturing a probe head of a probe card, characterized in that the material of the attachment plate includes quartz or glass that transmits the laser beam. The method of claim 11, wherein in the bonding step,
The array gripper is heated with heat supplied from a heat source, and the probe pins of the probe array are bonded to the probe head substrate by heating the jig and probe pins of the probe array adsorbed to the heated array gripper. A method for manufacturing a probe head for a card. The method of claim 14, wherein the array gripper,
An attachment plate for vacuum adsorbing the probe array;
The method of manufacturing a probe head of a probe card, characterized in that the material of the attachment plate includes Invar, Kovar or ceramic materials having thermal conductivity and a low thermal expansion coefficient. A probe array having probe pins in units of a device under test (DUT) of a probe head substrate,
a jig having probe pin insertion grooves formed at positions corresponding to the input/output pads of the DUT; and
the probe pins respectively inserted into the probe pin insertion grooves of the jig;
A probe array for a probe head of a probe card comprising a. 17. The method of claim 16, wherein the probe pins are manufactured by a 2D MEMS process,
a tip portion inserted into the probe pin insertion groove, contacting an input/output pad of the DUT, and extending downward toward the lower surface of the jig;
an elastic part connected to the tip part and extended to one side, at least a part of which is inserted into the probe pin insertion groove; and
a support portion connected to the elastic portion, extending over the upper surface of the jig, and protruding out of the probe pin insertion groove;
A probe array for a probe head of a probe card comprising a. According to claim 17,
a fixing part formed on the jig and fixing the probe pins inserted into the probe pin insertion grooves;
Probe array for the probe head of the probe card, characterized in that it further comprises. The method of claim 18, wherein the probe pins,
A part of the elastic part connected to the support part protrudes out of the probe pin insertion groove through a side surface of the jig,
The probe array for the probe head of the probe card, characterized in that the support portion is connected to the elastic portion and protrudes above the fixing portion. The method of claim 16, wherein the probe pins are manufactured in the jig by a 3D MEMS process,
a tip portion inserted into the probe pin insertion groove, contacting an input/output pad of the DUT, and extending downward; and
an elastic part connected to the tip part, extending to one side, and protruding out of the probe pin insertion groove;
A probe array for a probe head of a probe card comprising a. forming probe pin insertion grooves at positions corresponding to input/output pads of the DUT in a jig having a size corresponding to that of a device under test (DUT) of a probe head substrate;
inserting probe pins into respective probe pin insertion grooves of the jig; and
forming a fixing part fixing the probe pins inserted into the probe pin insertion grooves on the jig;
A method of manufacturing a probe array for a probe head of a probe card comprising a. Preparing a jig original plate having a plurality of jigs having a size corresponding to a size of a device under test (DUT) of a probe head substrate;
forming tip grooves in the plurality of jigs at positions corresponding to the input/output pads of the DUT, respectively;
forming tip portions by filling the tip portion grooves with plating;
forming elastic part grooves respectively connected to the tip parts through a photoresist process on an upper part of the jig disc;
forming probe pins having elastic parts respectively connected to the tip parts by filling the elastic part grooves with plating;
exposing the elastic parts of the probe pins to the upper surface of the jig by removing the photoresist forming the elastic part grooves; and
obtaining probe arrays having probe pins formed on the jig by dividing the jig disc into units of the jig;
A method of manufacturing a probe array for a probe head of a probe card comprising a.

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