JP2012163410A - Wiring board adjustment jig of probe card, wiring board correction method, inspection method using probe card adjusted by using wiring board adjustment jig and inspection system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To adjust flatness of a tip of a probe needle with high accuracy and suppress deflection due to a negative pressure so as to perform an accurate inspection.SOLUTION: A wiring board adjustment jig for correcting flatness of a tip of a probe needle is an inspection device comprising: a connection unit; and a probe card. The connection unit includes: a pogo pin block; and a pogo pin block supporting section. The probe card includes: a wiring board, to which a plurality of probe needles are mounted; a wiring board supporting section that supports the wiring board and maintains a pogo pin block side of the wiring board at a negative pressure; and an anchor for supporting the wiring board against the negative pressure. The wiring board adjustment jig comprises: a mounting hole for a pogo pin disposed on the pogo pin block; the pogo pin mounted to the mounting hole for the pog pin; and a sucking means for generating the negative pressure at the pogo pin block side of the wiring board. The wiring board adjustment jig vacuums by the sucking means so as to reproduce deformation of the wiring board in actual usage thereof during an inspection. In addition, other inventions are a wiring board correction method using the wiring board adjustment jig, an inspection method and an inspection system.

Description

  The present invention uses a probe card wiring board adjustment jig, a wiring board correction method, and a wiring board adjustment jig that correct the height position of the probe tip of each probe needle that contacts an electrode of a flat electronic device or the like. The present invention relates to an inspection method and an inspection system using an adjusted probe card.

  2. Description of the Related Art A vacuum contact type inspection apparatus that uses a vacuum when inspecting an electrode of an electronic device with a probe needle of a probe card is generally known. An example of such an inspection apparatus is a probing apparatus described in Patent Document 1. This probing device is outlined below.

  As shown in FIG. 1, the probing apparatus 1 is supported by a first space 6 between the chuck top 3 of the inspection stage 2 and the probe card 5 supported by the card base 4 and the probe card 5 and the card base 4. The second space 10 between the performance board 7 and the performance board 7 is maintained airtight from the outside by the first seal 8 and the second seal 9, respectively, and the first space 6 and the second space 10 are respectively It is possible to evacuate through the first suction hole 11 and the second suction hole 12, and the intermediate body 13 disposed below the performance board 7 is brought into contact with both the probe card 5 and the performance board 7.

  As a result, the probe card 5 is prevented from bending when the needle tip of the contact 14 and the electrode of the object 15 to be inspected are relatively pressed, and the pressing force acting on the contact 14 Via the performance board 7. Thereby, the uneven load which acts between the electrode of the to-be-inspected object 15 and the contactor 14 is suppressed.

  As a result, the uneven load is prevented from acting between the electrode of the device under test 15 and the contact 14. This enables an accurate inspection.

  Another example is a semiconductor inspection apparatus described in Patent Document 2. This semiconductor inspection apparatus is not a vacuum contact system, but includes a coupling portion having the same function as that of the intermediate body 13. This coupling portion is provided between the probe substrate and the support member, like the intermediate body 13. The coupling portion is provided integrally with the probe substrate and is fixed to the support member side with a lever or the like, and a distance between the probe substrate having a plurality of probe needles and the support member for suppressing the deflection of the probe substrate is a predetermined value. Held in the distance. Thereby, the tip of the probe needle is held at a predetermined plane height position.

  As a result, the deflection due to the uneven load is suppressed, and an accurate inspection is possible.

JP 2009-295686 A JP 2008-300481 A

  By the way, in each of the above conventional techniques, it is possible to perform an accurate inspection while suppressing the bending due to the negative pressure or the needle pressure, but in recent years, the diameter of the inspection object plate such as a semiconductor wafer is increased and the circuit is highly integrated. Therefore, higher accuracy has been required for the flatness of the probe tips of each probe needle of the probe card. In order to perform inspection with higher accuracy, it may be necessary to make fine adjustments to the probe card after the intermediate body 13 or the like for holding at a set interval is provided. That is, in consideration of the deformation state of the probe card during actual inspection, it is required to adjust the probe tip flatness of each probe needle to fall within a reference value (for example, 30 μm).

  However, in each of the above prior arts, fine adjustment cannot be performed when a probe card or the like is incorporated into an inspection apparatus. That is, fine adjustment cannot be performed in consideration of the deformation state of the probe card under inspection.

  For this reason, a method that can accurately adjust the needle tip flatness of each probe needle within a reference value is desired.

  The present invention has been made in view of such problems, and a probe card wiring board adjustment jig and wiring board correction capable of easily adjusting the needle tip flatness of each probe needle of the probe card with high accuracy. It is an object of the present invention to provide an inspection method and an inspection system using a probe card adjusted using a method and a wiring board adjustment jig.

  A wiring board adjustment jig for a probe card according to the present invention is an inspection apparatus including a connection unit and a probe card attached to the connection unit, wherein the connection unit is a pogo pin on which a plurality of pogo pins are mounted. A plurality of blocks, and a pogo pin block support portion that is airtightly attached to a test head on the tester side and supports the pogo pin block from its periphery, and the probe card is electrically connected to the plurality of pogo pins, respectively. A wiring board on which the probe needle is mounted, and a wiring board support part that is airtightly attached to the pogo pin block support part to support the wiring board from its periphery and keep the pogo pin block side of the wiring board at a negative pressure. The wiring board is attached to the wiring board to obtain a reaction force to the pogo pin block and resists the negative pressure. In the wiring board adjustment jig for correcting the probe tip flatness of the probe needle of the inspection apparatus having a supporting anchor, an opening is formed on the wiring board side at a position corresponding to each pogo pin mounted on the pogo pin block. A pogo pin mounting hole, a pogo pin mounted in the pogo pin mounting hole, and a suction means for applying a negative pressure to the pogo pin block side of the wiring board, and airtightly mounted on the wiring board support portion. In this case, the wiring board is attached to the probe card in place of the connection unit and is evacuated by the suction means to reproduce the deformation of the wiring board during actual inspection use.

  A probe card wiring board correction method according to the present invention is an inspection apparatus including a connection unit and a probe card attached to the connection unit, wherein the connection unit is a pogo pin block on which a plurality of pogo pins are mounted. And a pogo pin block support portion that is airtightly attached to a test head on the tester side and supports the pogo pin block from its periphery, and the probe card is electrically connected to the plurality of pogo pins, respectively. A wiring board on which a probe needle is mounted, a wiring board support part that is airtightly attached to the pogo pin block support part, supports the wiring board from its periphery, and maintains the pogo pin block side of the wiring board at a negative pressure; The wiring board is attached to the wiring board to obtain a reaction force on the pogo pin block and resists the negative pressure. In the wiring board correction method of correcting the probe tip flatness of the probe needle of the inspection apparatus having a supporting anchor, the inspection apparatus is opened to the wiring board side at a position corresponding to each pogo pin mounted on the pogo pin block. A wiring board adjustment jig provided with a pogo pin mounting hole, a pogo pin mounted in the pogo pin mounting hole, and a suction means for making negative pressure on the pogo pin block side of the wiring board. A vacuum that reproduces the deformation of the wiring board during actual inspection use by attaching an adjustment jig to the wiring board support section in an airtight manner and attaching to the probe card instead of the connection unit and evacuating the suction means. A flatness detecting step for detecting a change in flatness of the probe tip due to deformation of the wiring board in the vacuuming step, and the flatness detection A correction step of adjusting the height of the anchor in the vicinity of the position where the probe needle flatness detected in the process is deviated from the reference value to correct the deviation of the probe needle height position. It is structured.

  An inspection method using a probe card adjusted using a wiring board adjustment jig according to the present invention includes a pogo pin block supply step for supplying a pogo pin block to an inspection apparatus, and a probe card supply for supplying a probe card to the inspection apparatus. A pogo pin block preparing step for preparing the pogo pin block with adjusted flatness, and a tester for the pogo pin block. A pogo pin block attaching step for attaching to the test head on the side, a pogo pin block parallelism adjusting step for adjusting the parallelism between the wafer stage and the pogo pin block, and a probe card attaching step for attaching the probe card to the pogo pin block. The probe card supplying step is a needle A probe card preparation step of preparing a probe card with adjusted flatness, an adjustment jig preparation step of preparing the wiring board adjustment jig according to claim 1 in parallel with the probe card preparation step, and the wiring board The probe card is attached to the adjustment jig and vacuum-adsorbed to reproduce the deformation of the wiring board at the time of actual inspection use, and the needle tip flatness readjustment step is performed to readjust the needle tip flatness. It is characterized by that.

  An inspection system using a probe card adjusted using a wiring board adjustment jig according to the present invention supplies a pogo pin block to an inspection unit in an inspection system that applies an inspection signal to each electrode of a semiconductor wafer. A pogo pin block supply line, a probe card supply line for supplying a probe card to the inspection unit, and an inspection unit for inspecting the semiconductor wafer, wherein the pogo pin block supply line has the flatness adjusted. A pogo pin block preparing part for preparing a block, a pogo pin block attaching part for attaching the pogo pin block to a test head on the tester side, a pogo pin block parallelism adjusting part for adjusting parallelism between a wafer stage and the pogo pin block, and the probe A professional who attaches the card to the above pogo pin block The wiring board according to claim 1, wherein the probe card supply line includes a probe card preparation unit that prepares a probe card with adjusted needle tip flatness, and the probe card preparation unit. An adjustment jig preparation section for preparing an adjustment jig, and the probe card is attached to the wiring board adjustment jig and vacuum-sucked to reproduce the deformation of the wiring board at the time of actual inspection use. And a needle tip flatness readjustment unit for readjustment of the needle tip.

  The probe card wiring board adjustment jig, the wiring board correction method, the inspection method using the probe card adjusted using the wiring board adjustment jig, and the inspection system are used to determine the flatness of each probe needle of the probe card. It can be easily adjusted with high accuracy, and accurate inspection can be performed while suppressing bending due to negative pressure or the like.

It is sectional drawing which shows the principal part of the conventional inspection apparatus. It is sectional drawing which shows the principal part of the inspection apparatus which concerns on embodiment of this invention. It is a top view which shows the example of the other connection unit used for the test | inspection apparatus which concerns on embodiment of this invention. It is sectional drawing of the connection unit of FIG. It is sectional drawing which shows the pogo pin block support part of the connection unit of FIG. It is sectional drawing which shows the probe card of the test | inspection apparatus which concerns on embodiment of this invention. It is sectional drawing which shows the state which mounted | wore the probe card with the wiring board adjustment jig which concerns on embodiment of this invention. It is sectional drawing which shows the state evacuated with the wiring board adjustment jig | tool of FIG. It is sectional drawing which shows the state which adjusted the needle point height of each probe needle with the wiring board adjustment jig of FIG. It is a flowchart which shows the flow of the test | inspection with the conventional test | inspection apparatus. It is a flowchart which shows roughly the flow of the test | inspection in the test | inspection apparatus which concerns on embodiment of this invention. It is a flowchart which shows the flow of the test | inspection in the test | inspection apparatus based on 1st Example of this invention. It is a flowchart which shows the flow of the test | inspection in the test | inspection apparatus based on 2nd Example of this invention.

  Hereinafter, a probe card wiring board adjustment jig and wiring board correction method according to an embodiment of the present invention, an inspection method and an inspection system using a probe card adjusted using the wiring board adjustment jig, refer to the attached drawings. While explaining. The probe card wiring board adjusting jig and the wiring board correcting method according to the present invention are used for a probe card of a vacuum contact type inspection apparatus. The probe card wiring board adjusting jig and the wiring board correcting method of the present invention can be used for all existing vacuum contact type inspection apparatuses. Furthermore, the inspection method and inspection system using the probe card adjusted using the wiring board adjustment jig can use all the existing vacuum contact type inspection apparatuses. For this reason, below, it demonstrates centering on the probe card used for the inspection apparatus of the existing vacuum contact system. The existing vacuum contact type inspection apparatus has various configurations, and the probe card attached thereto has various configurations, but the present invention can be applied to all of these probe cards. Hereinafter, in the present embodiment, an example of the various probe cards will be described together with the peripheral technology, and a wiring board correction method, an inspection method, and an inspection system will be described using the probe card.

  As shown in FIG. 2, a connection unit 22 and a probe card 23 are attached to the test head 21 on the tester side.

  The connection unit 22 is a member for electrically connecting each probe needle 42 of the probe card 23 described later and each electrode (not shown) of the test head wiring board 25 of the test head 21. The connection unit 22 includes a pogo pin block 26 and a pogo pin block support portion 27.

  The pogo pin block 26 is a member for supporting a plurality of pogo pins 28. The pogo pin block 26 is formed in a thick disk shape and includes a plurality of pogo pin insertion holes 29. Each pogo pin insertion hole 29 is provided in accordance with the position of an electrode (not shown) on the upper surface of the probe card 23. The pogo pin insertion hole 29 is provided so as to penetrate up and down the pogo pin block 26. The pogo pin 28 is mounted in the pogo pin insertion hole 29 so that the upper and lower ends protrude upward and downward of the pogo pin block 26. A flange portion 26 </ b> A is provided around the pogo pin block 26. The flange portion 26 </ b> A is a portion for integrally coupling with the pogo pin block support portion 27.

  An anchor abutting portion 30 that abuts on an anchor 45 of a probe card 23 described later is provided on the lower surface of the pogo pin block 26. The anchor contact portion 30 is formed in a concave shape on the lower surface of the pogo pin block 26 or is formed in a flat surface shape. A plurality of anchor contact portions 30 are provided on the entire lower surface of the pogo pin block 26. These anchor contact portions 30 are arranged so that the load is dispersed and the bending of the probe card 23 is suppressed. The contact surface 30A of the anchor contact portion 30 that directly contacts the anchor 45 of the probe card 23 is maintained at high flatness. For example, the contact surfaces 30A of all the anchor contact portions 30 are finished with high flatness so as to be within 5 μm.

  The pogo pin block support portion 27 is a member that is airtightly attached to the test head 21 on the tester side via the test head wiring board 25 and supports the pogo pin block 26 from its periphery. The pogo pin block support portion 27 of the pogo pin block 26 is positioned by the test head wiring board 25 and positioning pins (not shown) and supported by a support mechanism (not shown). Thereby, the pogo pin block support portion 27 is supported by the test head 21 and is airtightly coupled to the test head wiring board 25. An annular groove 32 is provided on the upper side surface of the pogo pin block support portion 27. An O-ring 33 is attached to the annular groove 32. Thus, when the pogo pin block support portion 27 is integrally coupled to the test head 21, the space between the pogo pin block support portion 27 and the test head wiring board 25 of the test head 21 is kept airtight.

  There are various configurations of the connection unit 22, for example, a connection unit 35 configured as shown in FIGS. 3 to 5. The connection unit 35 includes a pogo pin block 36 and a pogo pin block support portion 37.

  The pogo pin block 36 has its pogo pin insertion holes 38 arranged in a fan-shaped region (a region divided into a fan shape by dividing a circle into eight equal parts). The pogo pin block support portion 37 is configured by a housing composed of an outer peripheral ring 39 and a support plate 40. The support plate 40 is configured to be divided into eight pieces in a radial manner, and is integrally coupled to the outer peripheral ring 39. Thereby, a fan-shaped region in which the circle is divided into eight equal parts is formed. The pogo pin block 36 is integrally fitted to the outer peripheral ring 39 and the support plate 40 to form a connection unit 35.

  The probe card 23 is a device for applying an inspection signal from a tester to the electrodes of each circuit of an inspection target plate such as a semiconductor wafer. As shown in FIGS. 2 and 6, the probe card 23 includes a plurality of probe needles 42 on the lower surface thereof. Each probe needle 42 is provided at a position where the needle tip thereof is aligned with the electrode of each circuit of the inspection object plate, and is in contact with each other. The probe card 23 includes a probe card wiring board 43, a wiring board support 44, and an anchor 45.

  The probe card wiring board 43 is a member for supporting a plurality of probe needles 42 and bringing each probe needle 42 into contact with an electrode of each circuit of the inspection target plate. The probe card wiring board 43 is formed in a thick disk shape, a plurality of probe needles 42 are directly mounted on the lower side surface, and electrodes (not shown) of the probe needles 42 are provided on the upper side surface. . The electrodes are electrically connected to the pogo pins 28, and the probe needles 42 and the pogo pins 28 are electrically connected to each other.

  Accordingly, each probe needle 42 is electrically connected to the tester side via the plurality of pogo pins 28 of the connection unit 22. A flange portion 43 </ b> A is provided around the probe card wiring board 43. The flange portion 43 </ b> A is a portion for integrally coupling with the wiring board support portion 44.

  The wiring board support portion 44 supports the probe card wiring board 43 in an airtight and integrated manner, and is a space on the pogo pin blocks 26 and 36 (hereinafter, only “26”) side (upper side) of the probe card wiring board 43. Is a member for maintaining a negative pressure. The wiring board support portion 44 is formed in a ring shape and supports the probe card wiring board 43 from the outer periphery thereof. An annular groove 47 is provided on the upper side surface of the wiring board support portion 44. An O-ring 48 is attached to the annular groove 47. Thereby, when the wiring board support part 44 is integrally coupled to the pogo pin block support part 27, the wiring board support part 44 and the pogo pin block support part 27 are kept airtight. Thereby, the wiring board support part 44 is airtightly attached to the pogo pin block support part 27, supports the probe card wiring board 43 in an airtight manner, and the space on the pogo pin block 26 side of the probe card wiring board 43 (around the anchor 45). ) Is kept at a negative pressure.

  The anchor 45 is a member for supporting the probe card wiring board 43 against a negative pressure. The anchor 45 is attached to the upper side surface of the probe card wiring board 43 so as to face the pogo pin block 26. The anchor 45 is disposed at a position corresponding to the anchor contact portion 30 of the pogo pin block 26. With this arrangement, the load due to the negative pressure and the needle pressure of the probe needle 42 applied so as to warp the probe card wiring board 43 toward the pogo pin block 26 are dispersed and supported. Specifically, each anchor 45 having a reaction force on the pogo pin block 26 supports the probe card wiring board 43 so as not to warp against the negative pressure against the pogo pin block 26 side. The anchor 45 can be finely adjusted by inserting one or a plurality of shims 50 (see FIG. 9) having a predetermined thickness. The height of each anchor 45 is adjusted so that its upper side is aligned with the same plane (anchor plane B in FIG. 6).

[Wiring board adjustment jig]
Next, the wiring board adjustment jig will be described.

  The wiring board adjustment jig 52 (see FIG. 7) is a jig for correcting the needle tip flatness of a plurality of probe needles 42 provided below the probe card wiring board 43 of the probe card 23. Here, the needle tip flatness is the degree of deviation of the needle tips of all the probe needles 42 with respect to the same plane (the needle tip plane A in FIG. 6).

  As shown in FIG. 7, the wiring board adjustment jig 52 is formed in a thick disk shape similar to the pogo pin block 26. The peripheral edge of the lower side surface of the wiring board adjustment jig 52 is formed in a flat surface so that the O-ring 48 of the probe card 23 comes into airtight contact. The wiring board adjustment jig 52 includes a pogo pin mounting hole 53, a pogo pin 54, and a suction means 55.

  The pogo pin mounting hole 53 is a hole for mounting the pogo pin 54. The pogo pin mounting hole 53 is provided at a position corresponding to each pogo pin 28 mounted on the pogo pin block 26. The pogo pin mounting hole 53 is provided to open to the probe card wiring board 43 side. The pogo pin 54 is the same as the pogo pin 28 attached to the pogo pin block 26. The suction means 55 is a device for applying a negative pressure to the pogo pin block 26 side of the probe card wiring board 43. The suction means 55 evacuates the space surrounded by the wiring board adjustment jig 52 and the probe card 23. The suction means 55 includes a communication hole 57 opened on the lower surface of the wiring board adjusting jig 52, a communication pipe 58 connected to the communication hole 57, and a vacuum pump (not shown) connected to the communication pipe 58. And is configured.

  The wiring board adjusting jig 52 is airtightly attached to the wiring board support portion 44 and attached to the probe card 23 instead of the connection unit 22. Then, the suction means 55 is evacuated to reproduce the deformation of the probe card wiring board 43 at the time of actual inspection use, and the variation in the needle tip height of the probe needle 42 due to the bending of the probe card wiring board 43 is reproduced. Readjust.

[Wiring board correction method]
Next, a method for correcting a wiring board using the wiring board adjusting jig 52 will be described.

  The wiring board correction method is a method of correcting the needle tip flatness of a plurality of probe needles 42 provided below the probe card wiring board 43 of the probe card 23. The wiring board adjustment jig 52 is used in this wiring board correction method. The depth of the pogo pin mounting hole 53 of the wiring board adjustment jig 52 is obtained by adding the amount of bending of the pogo pin block 26 caused by the negative pressure due to the vacuuming and the pressing force by the anchor 45 or the pogo pin 28 of the probe card wiring board 43. Is set.

  The wiring board correction method includes a evacuation step, a flatness detection step, and a correction step. This wiring board correction method is performed before supplying the probe card 23 to the inspection apparatus.

  In the evacuation step, as shown in FIG. 7, the wiring board adjusting jig 52 is attached to the probe card 23, and the suction means 55 is evacuated to deform the probe card wiring board 43 during actual inspection use. It is a process to reproduce. Specifically, the wiring board adjustment jig 52 is air-tightly attached to the wiring board support portion 44, and the suction means is evacuated to reproduce the deformation of the wiring board during actual inspection use.

  As shown in FIG. 8, when the probe card wiring board 43 is deformed in the evacuation step, the flatness detection step is a step of detecting a change in the flatness of the probe tip 42 due to the deformation. Specifically, the probe needles according to known techniques such as the contact order when the probe tips of the plurality of probe needles 42 are in contact with the flat electrode plate for inspection and the difference in resistance value when a voltage is applied in contact with the probe tips. 42 needle tip flatness is detected.

  The correction step is a step of correcting the deviation of the needle tip height position of the probe needle 42. As shown in FIG. 9, the correction step adjusts the height of the anchor 45 in the vicinity of the position where the needle tip flatness of the probe needle 42 detected in the flatness detection step is deviated from the reference value. The deviation of the 42 needle tip height position is corrected. The height of the anchor 45 is adjusted by adding or removing a shim 50 to the anchor 45. For example, a plurality of shims 50 are attached to all the anchors 45 in advance, and the shim 50 at a shifted position is removed or newly added for adjustment.

[First inspection method]
Next, a first inspection method using the inspection apparatus, the wiring board adjustment jig 52, and the wiring board correction method will be described in comparison with a conventional inspection method.

  As shown in FIG. 10, the conventional inspection method includes a step S1 of adjusting the parallelism of the probe card mounting surface of the wafer stage and the card holder, a step S2 of preparing a probe card with adjusted needle tip flatness, It consists of a step S3 for attaching the probe card to the card holder, a step S4 for connecting the pogo pin block and the probe card, and a step S5 for measuring the semiconductor of the wafer. The flatness of the probe card was adjusted in advance, and it was not adjusted again. On the other hand, the inspection method of the present invention adjusts the flatness of the probe card again.

  As shown in FIG. 11, the first inspection method of this embodiment includes a pogo pin block supply step S7 for supplying the pogo pin block 26 to the inspection device, a probe card supply step S8 for supplying the probe card 23 to the inspection device, A probe card mounting step S9 for mounting the probe card 23 to the pogo pin block 26 and an inspection step S10 for inspecting a semiconductor wafer which is an inspection target plate by the inspection apparatus are provided.

  As shown in FIG. 12, the pogo pin block supplying step S7 includes a pogo pin block preparing step S11, a pogo pin block attaching step S12, and a pogo pin block parallelism adjusting step S13.

  The pogo pin block preparation step S11 is a step of preparing the pogo pin block 26 with the flatness adjusted. After the pogo pin block 26 is manufactured, its flatness is adjusted and supplied to the inspection apparatus.

  The pogo pin block preparation step S11 includes a pogo pin block flatness adjustment step (not shown) and a pogo pin block assembly step (not shown). In the pogo pin block flatness adjustment step, the flatness of the abutment surface 30A which is one side surface of the casing of the pogo pin block 26 and abuts on the probe card 23 side is adjusted. In the pogo pin block assembling step, the pogo pin block 26 is assembled.

  The pogo pin block attaching step S12 is a step for attaching the pogo pin block 26 to the test head 21 on the tester side. The pogo pin block 26 is hermetically attached to the test head 21 by fixing the pogo pin block support portion 27 that supports the pogo pin block 26 to the test head 21.

  The pogo pin block parallelism adjusting step S13 is a step of adjusting the parallelism between the wafer stage (not shown) of the inspection apparatus and the pogo pin block 26. Adjustment is made so that the upper surface of the wafer stage and the contact surfaces 30A of the anchor contact portions 30 provided in plurality on the entire lower surface of the pogo pin block 26 are parallel to each other. Specifically, the distance between the upper surface of the wafer stage and the contact surface 30A of the anchor contact portion 30 is measured at a plurality of locations, and the parallelism between these is measured and adjusted with high accuracy. . The interval is measured using a mechanical measuring device, an optical measuring device using laser light, or the like.

  Thus, the parallelism between the upper side surface of the wafer stage on which the semiconductor wafer is placed and the lower contact surface 30A of the pogo pin block 26 is guaranteed. In addition, the parallelism between the plane of the anchor 45 of the probe card 23 in contact with the contact surface 30A of the pogo pin block 26 and the needle tip plane of the probe needle 42 is ensured in the anchor parallelism adjustment step described later. Parallelism between the needle tip plane of the probe needle 42 of the probe card 23 attached to the lower surface of the pogo pin block 26 and the upper surface of the wafer on the wafer stage is guaranteed.

  The probe card supply step S8 includes a probe card preparation step S14, an adjustment jig preparation step S15, and a needle tip flatness readjustment step S16.

  The probe card preparation step S14 is a step of preparing the probe card 23 in which the needle tip flatness is adjusted. After the probe card 23 is manufactured, the needle tip flatness of each probe needle 42 is adjusted and supplied to the inspection apparatus.

  This probe card preparation step S14 includes a probe card manufacturing step (not shown), a needle tip flatness adjusting step (not shown), an anchor flatness adjusting step (not shown), and an anchor parallelism adjusting step ( (Not shown).

  The probe card manufacturing process is a process for manufacturing the probe card 23. The probe needle 42 of the probe card 23 is manufactured with a certain degree of needle tip flatness. The needle tip flatness adjusting step is a step of adjusting the needle tip flatness of the probe needle 42 of the probe card 23. The needle tip flatness is adjusted by the method described above. The anchor flatness adjusting step is a step of adjusting the flatness of the anchor 45 of the probe card 23. The flatness is adjusted by the method described above. The anchor parallelism adjustment step is a step of adjusting the parallelism between the needle tip plane of the probe needle 42 adjusted in the needle tip flatness adjustment step and the plane of the anchor 45 adjusted in the anchor flatness adjustment step. The parallelism is adjusted by the method described above.

  The adjustment jig preparation step S15 is performed in parallel with the probe card preparation step S14, and is a step of preparing the wiring board adjustment jig 52. The wiring board adjustment jig 52 is manufactured. The pogo pin mounting hole 53 of the wiring board adjustment jig 52 is formed to a set depth. That is, the pogo pin mounting hole 53 is formed to a depth set by adding the negative pressure due to the vacuuming and the deflection of the pogo pin block 26 caused by the pressing force by the anchor 45 or the pogo pin 28 of the probe card wiring board 43. ing.

  The adjustment jig preparation step S15 includes a contact surface flatness adjustment step (not shown) and an adjustment jig assembly step (not shown). In the contact surface flatness adjusting step, the flatness of the contact surface of the wiring board adjusting jig 52 with the anchor 45 of the probe card 23 is adjusted. The adjustment jig assembling step is a step of assembling the pogo pin 54 in the jig body. At this time, the depth of the pogo pin mounting hole 53 is also set.

  In the needle tip flatness readjustment step S16, the probe card 23 is attached to the wiring board adjustment jig 52 and vacuum-sucked to reproduce the deformation of the probe card wiring board 43 during actual inspection and use. This is a step of readjusting the flatness. This step is performed before the probe card 23 is supplied to the inspection apparatus. That is, as shown in FIG. 7, the probe card 23 is attached to the wiring board adjusting jig 52 and vacuum-sucked, and as shown in FIG. 8, the deformation of the probe card wiring board 43 during actual inspection use is reproduced. As shown in FIG. 9, the shim 50 is added or removed, and the needle tip flatness is readjusted. This step is performed before the probe card 23 is supplied to the inspection apparatus. By this readjustment, the needle tip flatness of each probe needle 42 of the probe card 23 is finished with high accuracy and then supplied to the probe card mounting step S9. Thereby, the inspection target plate is inspected by the inspection apparatus using the probe card 23 having a high needle tip flatness of each probe needle 42.

  This needle tip flatness readjustment step S16 includes a evacuation step (not shown), a flatness detection step (not shown), and a correction step (not shown). The evacuation step is a step in which the probe card 23 is attached to the wiring board adjustment jig 52 and vacuum suction is performed to reproduce the deformation of the probe card wiring board 43 of the probe card 23 during actual inspection use (see FIG. 7). The flatness detection step is a step of detecting a change in the flatness of the probe tip 42 due to the deformation of the probe card wiring board 43 in the vacuuming step (see FIG. 8). The correction step adjusts the height of the anchor 45 in the vicinity of the position where the needle tip flatness of the probe needle 42 detected in the flatness detection step deviates from the reference value, thereby adjusting the needle tip height position of the probe needle 42. This is a step of correcting the deviation (see FIG. 9).

  In the probe card attachment step S9, the probe card 23 readjusted in the needle tip flatness readjustment step S16 is airtightly attached to the pogo pin block 26 whose parallelism with the wafer stage is adjusted in the pogo pin block parallelism adjustment step S13. It is done.

  In the inspection step S10, the inspection is performed by bringing the probe needle 42 of the probe card 23 attached to the pogo pin block 26 into contact with the inspection object plate placed on the wafer stage of the inspection apparatus.

  By this inspection method, the needle tip flatness of each probe needle 42 of the probe card 23 can be easily adjusted with high accuracy, and it becomes possible to perform an accurate inspection while suppressing the bending due to the negative pressure.

[Second inspection method]
Next, the second inspection method will be described. This inspection method is obtained by changing a part of the first inspection method according to the difference in the mounting structure of the probe card 23. That is, the second inspection method is an inspection method using an inspection apparatus having a structure in which the probe card 23 is attached to the card holder in the same manner as in FIG. Specifically, in place of the pogo pin block parallelism adjustment step S13 of the pogo pin block supply step S7 of the first inspection method, a probe card parallelism adjustment step S18 is provided, and the probe card attachment step of the first inspection method is provided. Instead of S9, a card holder attaching step S19 and a connecting step S20 are provided.

  The probe card parallelism adjustment step S18 is a step of adjusting the parallelism between the upper side surface of the wafer stage and the probe card mounting surface of the card holder that supports the probe card 23.

  The card holder attaching step S19 is a step of attaching the probe card 23 to the card holder.

  The connecting step S20 is a step of connecting the pogo pin block 26 and the probe card 23.

  The other steps are the same as in the first inspection method.

  Also by this inspection method, as in the first inspection method, the needle tip flatness of each probe needle 42 of the probe card 23 can be easily adjusted with high accuracy, and accurate inspection can be performed while suppressing bending due to negative pressure. It becomes possible.

[First inspection system]
Next, the inspection system will be described. This inspection system is an apparatus for performing the inspection method. That is, this inspection system is a system for performing inspection by applying an inspection signal to each electrode of an inspection target plate such as a semiconductor wafer. In addition, since this inspection system is a device for specifically realizing the processing in each step of each of the above inspection methods, the specific configuration of this inspection system is based on each step of each of the above inspection methods. It can be realized by replacing. For this reason, the following description will be made with reference to the processes in FIGS.

  The inspection system of the present embodiment includes a pogo pin block supply line (S7), a probe card supply line (S8), a probe card attachment part (S9), and an inspection part (S10).

  The pogo pin block supply line (S7) is a line for supplying the pogo pin block 26 to the inspection unit. The probe card supply line (S8) is a line for supplying the probe card 23 to the inspection unit. The probe card attachment portion (S9) is a device for attaching the probe card 23 to the pogo pin block 26. The inspection unit (S10) is a device for directly inspecting the inspection object plate. These apparatuses are constituted by an assembly apparatus or a prober in a production line.

  The pogo pin block supply line (S7) includes a pogo pin block preparation portion (S11), a pogo pin block mounting portion (S12), and a pogo pin block parallelism adjustment portion (S13).

  The pogo pin block preparation unit (S11) is a device for preparing the pogo pin block 26 with adjusted flatness. The pogo pin block preparation unit (S11) includes a pogo pin block flatness adjustment unit and a pogo pin block assembly unit. The pogo pin block flatness adjusting unit is a device that adjusts the flatness of an abutting surface that is one side of the casing of the pogo pin block 26 and abuts on the probe card 23 side. The pogo pin block assembly part is an apparatus for assembling the pogo pin block 26.

  The pogo pin block attachment portion (S12) is a device for attaching the pogo pin block 26 to the test head 21 on the tester side. The pogo pin block parallelism adjusting unit (S13) is a device for adjusting the parallelism between the wafer stage and the pogo pin block 26.

  The probe card supply line (S8) includes a probe card preparation unit (S14), an adjustment jig preparation unit (S15), and a needle tip flatness readjustment unit (S16).

  The adjustment jig preparation unit (S15) is an apparatus for preparing the wiring board adjustment jig 52 in parallel with the probe card preparation unit (S14). The needle tip flatness readjustment unit (S16) attaches the probe card 23 to the wiring board adjustment jig 52 and vacuum-sucks it to reproduce the deformation of the wiring board during actual inspection use. It is a device for readjusting the degree.

  The probe card preparation unit (S14) is an apparatus for preparing the probe card 23 in which the probe tip flatness of each probe needle 42 is adjusted.

  The probe card preparation unit (S14) includes a probe card manufacturing unit, a needle tip flatness adjusting unit, an anchor flatness adjusting unit, and an anchor parallelism adjusting unit.

  The probe card manufacturing unit is a device for manufacturing the probe card. The needle tip flatness adjusting unit is a device that adjusts the needle tip flatness of the probe needle 42 of the probe card 23. The anchor flatness adjusting unit is a device that adjusts the flatness of the anchor 45 of the probe card 23. The anchor parallelism adjusting unit is a device that adjusts the parallelism between the needle tip plane of the probe needle 42 adjusted by the needle tip flatness adjusting unit and the plane of the anchor 45 adjusted by the anchor flatness adjusting unit.

  The adjustment jig preparation part (S15) includes a contact surface flatness adjustment part and an adjustment jig assembly part.

  The contact surface flatness adjusting unit is a device for adjusting the flatness of the contact surface with the anchor 45 of the probe card 23 in the jig body of the wiring board adjustment jig. The adjustment jig assembling unit is an apparatus for assembling the pogo pin 54 in the jig body.

  The needle tip flatness readjustment unit (S16) includes a vacuum pump, a flatness detection unit, and a correction unit.

  The vacuum pump is an apparatus for reproducing the deformation of the probe card wiring board 43 of the probe card 23 during the actual inspection use by attaching the probe card 23 to the wiring board adjusting jig 52 and vacuum-sucking it. The flatness detection unit is a device that detects a change in the flatness of the probe tip 42 due to the deformation of the probe card wiring board 43 caused by evacuation by the vacuum pump. The correction unit adjusts the height of the anchor 45 in the vicinity of the position where the needle tip flatness of the probe needle 42 detected in the flatness detection step deviates from the reference value to adjust the needle tip height position of the probe needle 42. This is a device for correcting the deviation.

  By using the inspection system configured as described above, the needle tip flatness of each probe needle 42 of the probe card 23 can be easily adjusted with high accuracy, and accurate inspection can be performed while suppressing bending due to negative pressure. It becomes possible.

[Second inspection system]
Next, the second inspection system will be described. This inspection system is obtained by changing a part of the first inspection system according to the difference in the mounting structure of the probe card 23. In other words, the second inspection system is a system that uses an inspection unit having a structure in which the probe card 23 is attached to the card holder. Specifically, in place of the pogo pin block parallelism adjustment unit (S13) of the pogo pin block supply line (S7) of the first inspection system, a probe card parallelism adjustment unit (S18) is provided, and the first inspection is performed. Instead of the probe card attachment part (S9) of the system, a card holder attachment part (S19) and a connection part (S20) are provided.

  The probe card parallelism adjustment unit (S18) is a device for adjusting the parallelism between the upper side surface of the wafer stage and the probe card mounting surface of the card holder that supports the probe card 23. The card holder attaching part (S19) is an apparatus for attaching the probe card 23 to the card holder. The connection portion (S20) is a device for connecting the pogo pin block 26 and the probe card 23.

  Other devices are the same as those in the first inspection system.

  Also with this inspection system, as with the first inspection system, the needle tip flatness of each probe needle 42 of the probe card 23 can be easily adjusted with high accuracy, and accurate inspection can be performed while suppressing bending due to negative pressure. It becomes possible.

  21: Test head on tester side, 22: Connection unit 22, 23: Probe card, 25: Test head wiring board, 26: Pogo pin block, 26A: Flange part, 27: Pogo pin block support part, 28: Pogo pin, 29: Pogo pin Insertion hole, 30: anchor contact part, 30A: contact surface, 32: annular groove, 35: connection unit, 36: pogo pin block, 37: pogo pin block support part, 38: pogo pin insertion hole, 39: outer ring, 40 : Support plate, 42: probe needle, 43: probe card wiring board, 44: wiring board support, 45: anchor, 47: annular groove, 48: O-ring, 50: shim, 52: wiring board adjustment jig, 53 : Pogo pin mounting hole, 54: Pogo pin, 55: suction means, 57: communication hole, 58: communication pipe.

Claims (16)

An inspection apparatus comprising a connection unit and a probe card attached to the connection unit, wherein the connection unit is airtightly attached to a pogo pin block on which a plurality of pogo pins are mounted and a test head on a tester side. A wiring board having a plurality of probe needles, each of which has a pogo pin block support portion for supporting the pogo pin block from its periphery, and the probe card is electrically connected to the plurality of pogo pins, and the pogo pin block A wiring board support part that is airtightly attached to the support part and supports the wiring board from its periphery to keep the pogo pin block side of the wiring board at a negative pressure, and a reaction force applied to the pogo pin block attached to the wiring board. The inspection apparatus having an anchor for supporting the wiring board against the negative pressure obtained above, In the wiring board adjustment jig to fix the needle tip flatness lobes needle,
A pogo pin mounting hole provided in the position corresponding to each of the pogo pins mounted on the pogo pin block and opened to the wiring board side, a pogo pin mounted on the pogo pin mounting hole, and the pogo pin block side of the wiring board A suction means for negative pressure,
It is attached to the wiring board support section in an airtight manner, is attached to the probe card instead of the connection unit, and is evacuated by the suction means to reproduce the deformation of the wiring board during actual inspection use. Probe card wiring board adjustment jig. An inspection apparatus comprising a connection unit and a probe card attached to the connection unit, wherein the connection unit is airtightly attached to a pogo pin block on which a plurality of pogo pins are mounted and a test head on a tester side. A wiring board having a plurality of probe needles, each of which has a pogo pin block support portion for supporting the pogo pin block from its periphery, and the probe card is electrically connected to the plurality of pogo pins, and the pogo pin block A wiring board support part that is airtightly attached to the support part and supports the wiring board from its periphery to keep the pogo pin block side of the wiring board at a negative pressure, and a reaction force applied to the pogo pin block attached to the wiring board. The inspection apparatus having an anchor for supporting the wiring board against the negative pressure obtained above, In the wiring board correction method for correcting the needle tip flatness lobes needle,
A pogo pin mounting hole provided in the position corresponding to each of the pogo pins mounted on the pogo pin block and opened to the wiring board side, a pogo pin mounted on the pogo pin mounting hole, and the pogo pin block side of the wiring board Using a wiring board adjustment jig equipped with a suction means for negative pressure,
The wiring board adjustment jig is airtightly attached to the wiring board support part, attached to the probe card instead of the connection unit, and evacuated by the suction means to deform the wiring board during actual inspection use. Reproducing evacuation step, flatness detection step for detecting a change in probe needle flatness due to deformation of the wiring board in the evacuation step, and probe needle tip detected in the flatness detection step A probe comprising: a correction step of correcting the deviation of the tip height position of the probe needle by adjusting the height of the anchor in the vicinity of the position where the flatness is deviated from the reference value. Card wiring board correction method. In the probe card wiring board correction method according to claim 2,
A method for correcting a wiring board of a probe card, wherein height adjustment of the anchor is performed by adding or removing shims to the anchor. In the probe card wiring board correction method according to claim 2 or 3,
The depth of the pogo pin mounting hole of the adjustment jig is set by adding the amount of bending of the pogo pin block generated by the negative pressure due to the vacuuming and the pressing force by the anchor of the wiring board. Wiring board correction method. A pogo pin block supply process for supplying the pogo pin block to the inspection device;
A probe card supplying step of supplying the probe card to the inspection device;
An inspection process for inspecting a semiconductor wafer with the inspection apparatus,
The pogo pin block supplying step is
A pogo pin block preparation step of preparing the pogo pin block with the flatness adjusted;
A pogo pin block attaching step for attaching the pogo pin block to the test head on the tester side;
A pogo pin block parallelism adjustment step for adjusting the parallelism between the wafer stage and the pogo pin block;
It consists of a probe card attachment process for attaching the probe card to the pogo pin block,
The probe card supplying step is
A probe card preparation step of preparing a probe card with adjusted needle tip flatness;
An adjustment jig preparation step for preparing the wiring board adjustment jig according to claim 1 in parallel with the probe card preparation step,
A probe tip flatness readjustment step in which the probe card is attached to the wiring board adjustment jig and vacuum-adsorbed to reproduce the deformation of the wiring board at the time of actual inspection use and readjust the needle tip flatness. An inspection method characterized by being provided. The inspection method according to claim 5,
Instead of the pogo pin block parallelism adjustment step and the probe card mounting step in the pogo pin block supply step,
A probe card parallelism adjustment step of adjusting the parallelism between the upper side surface of the wafer stage and the probe card mounting surface of the card holder that supports the probe card;
A card holder attaching step for attaching the probe card to the card holder;
An inspection method comprising a connecting step of connecting the pogo pin block and the probe card. The inspection method according to claim 5 or 6,
The pogo pin block preparation step includes a pogo pin block flatness adjustment step of adjusting the flatness of a contact surface that is one side surface of the pogo pin block and contacts the probe card side, and a pogo pin block assembly for assembling the pogo pin block An inspection method comprising: a process. The inspection method according to claim 5 or 6,
The probe card preparation process
A probe card manufacturing process for manufacturing the probe card;
A needle tip flatness adjusting step for adjusting the needle tip flatness of the probe needle of the probe card;
Anchor flatness adjustment step for adjusting the flatness of the anchor of the probe card,
An anchor parallelism adjustment step for adjusting the parallelism between the needle tip plane of the probe needle adjusted in the needle tip flatness adjustment step and the anchor plane adjusted in the anchor flatness adjustment step. A characteristic inspection method. The inspection method according to claim 5 or 6,
The adjustment jig preparing step includes a contact surface flatness adjustment step of adjusting a flatness of a contact surface with the anchor of the probe card among the jig main body of the wiring board adjustment jig, and the jig main body. An inspection method comprising an adjustment jig assembling step for assembling pogo pins. The inspection method according to claim 5 or 6,
The needle tip flatness readjustment step includes attaching the probe card to the wiring board adjustment jig and vacuum-sucking to reproduce the deformation of the wiring board of the probe card during actual inspection use; and A flatness detection step for detecting a change in the flatness of the probe tip of the probe needle due to the deformation of the wiring board in the evacuation step; An inspection method comprising: a correction step of adjusting a height of the anchor in the vicinity of the position where the anchor is located to correct a deviation in the needle tip height position of the probe needle. In an inspection system for inspecting by applying an inspection signal to each electrode of a semiconductor wafer,
A pogo pin block supply line for supplying the pogo pin block to the inspection unit;
A probe card supply line for supplying the probe card to the inspection unit;
An inspection unit for inspecting the semiconductor wafer,
The pogo pin block supply line
A pogo pin block preparation unit for preparing the pogo pin block having the flatness adjusted;
A pogo pin block mounting portion for attaching the pogo pin block to the test head on the tester side;
A pogo pin block parallelism adjustment unit that adjusts the parallelism between the wafer stage and the pogo pin block;
It consists of a probe card mounting part for mounting the probe card to the pogo pin block,
The probe card supply line
A probe card preparation unit for preparing a probe card with adjusted needle tip flatness;
An adjustment jig preparation part for preparing the wiring board adjustment jig according to claim 1 in parallel with the probe card preparation part,
The probe card is attached to the wiring board adjustment jig and vacuum-adsorbed to reproduce the deformation of the wiring board at the time of actual inspection use, and a needle tip flatness readjustment unit that readjusts the needle tip flatness. An inspection system characterized by comprising. The inspection system according to claim 11,
Instead of the pogo pin block parallelism adjustment section and the probe card mounting section of the pogo pin block supply line,
A probe card parallelism adjusting unit that adjusts the parallelism between the upper side surface of the wafer stage and the probe card mounting surface of the card holder that supports the probe card;
A card holder attaching portion for attaching the probe card to the card holder;
An inspection system comprising: a connecting portion for connecting the pogo pin block and the probe card. The inspection system according to claim 11 or 12,
A pogo pin block flatness adjusting unit that adjusts the flatness of a contact surface that is one side surface of the pogo pin block and contacts the probe card side, and the pogo pin block assembly that assembles the pogo pin block. And an inspection system characterized by comprising a part. The inspection system according to claim 11 or 12,
The probe card preparation unit
A probe card production section for producing the probe card;
A needle tip flatness adjusting unit for adjusting the needle tip flatness of the probe needle of the probe card;
An anchor flatness adjusting section for adjusting the flatness of the anchor of the probe card;
An anchor parallelism adjusting unit that adjusts the parallelism between the needle tip plane of the probe needle adjusted by the needle tip flatness adjusting unit and the anchor plane adjusted by the anchor flatness adjusting unit; Characteristic inspection system. The inspection system according to claim 11 or 12,
The adjustment jig preparing portion includes a contact surface flatness adjusting portion for adjusting a flatness of a contact surface with the anchor of the probe card among the jig main body of the wiring board adjustment jig, and the jig main body. An inspection system comprising an adjustment jig assembling unit for inserting and assembling pogo pins. The inspection system according to claim 11 or 12,
The needle tip flatness readjustment unit attaches the probe card to the wiring board adjustment jig and vacuum-sucks it to reproduce the deformation of the wiring board of the probe card during actual inspection use, and the vacuum A flatness detection unit that detects a change in the probe tip flatness due to deformation of the wiring board caused by evacuation by a pump, and a probe tip flatness detected by the flatness detection unit is deviated from a reference value. An inspection system comprising: a correction unit that adjusts a height of an anchor in the vicinity of a fixed position to correct a deviation of a probe tip height position of the probe needle.

Images