JP2020145446A - Wafer inspection apparatus - Google Patents

Abstract

To provide a wafer inspection apparatus capable of easily mounting a probe card and a pogo frame to a test head to be maintained.SOLUTION: A wafer inspection apparatus 10 includes a plurality of cells 11 arranged one above the other. Each of the cells 11 internally has: a test head 15; a probe card 18; and a pogo frame 19 for holding a pogo pin for electrically connecting the probe card 18 and a main board of the test head 15. A seal member 20 is disposed between the probe card 18 and the pogo frame 19. A seal member 21 is disposed between the pogo frame 19 and the test head 15. By reducing the pressure in a space surrounded by the seal members 20, 21, the probe card 18 and the pogo frame 19 are attached to the test head 15 by vacuum suction.SELECTED DRAWING: Figure 2

Description

The present invention relates to a wafer inspection apparatus having a plurality of test heads.

A prober as a wafer inspection device is used to inspect the electrical characteristics of each semiconductor device in a semiconductor wafer on which a large number of semiconductor devices are formed (hereinafter, simply referred to as "wafer"). The prober includes a probe card facing the wafer, and the probe card has a contact probe which is a plurality of columnar contact terminals (see, for example, Patent Document 1). In this prober, each contact probe of the probe card inspects the continuity state of the electric circuit of the semiconductor device by sending an inspection signal to the semiconductor device connected to the electrode pad or the solder bump in the semiconductor device.

An inspection signal is sent to each contact probe of the probe card from a test head equipped with a main board, which is an inspection circuit. In recent years, in order to improve the inspection efficiency of wafers, a plurality of tests in which a probe card is attached to each of them are performed. A wafer inspection device having a head and capable of inspecting a semiconductor device of a wafer with another test head while the wafer is being transferred to one test head by a transfer stage has been developed. In this wafer inspection apparatus, cells accommodating a plurality of test heads are arranged in a multi-tiered manner from the viewpoint of reducing the footprint.

Since the main board of each test head is a kind of consumable item, it needs to be replaced regularly, but in order to replace the main board, the test head needs to be pulled out from the wafer inspection device onto the maintenance trolley. ..

Japanese Unexamined Patent Publication No. 2012-063227

However, since the test head weighs about 70 kgf and is supported by the slide rail, it is difficult to move the test head in a direction other than the pull-out direction. Therefore, it is necessary to accurately align the position of the maintenance trolley with the position of the test head, but the maintenance trolley has a lift mechanism and the like, and it is difficult to finely adjust the position due to its heavy weight. There is a problem that it is difficult to pull out the head.

An object of the present invention is to provide a wafer inspection apparatus capable of easily pulling out a test head.

In order to achieve the above object, the wafer inspection apparatus of the present invention includes at least a plurality of inspection chambers arranged on top of each other, and at least one of the plurality of inspection chambers has a semiconductor inside. A test head to be maintained used when inspecting a wafer on which a device is formed, a probe card, and a pogo frame holding a pogo pin for electrically connecting the probe card and the main board of the test head to be maintained. A first seal member is arranged between the probe card and the pogo frame, and a second seal member is arranged between the pogo frame and the test head to be maintained. By reducing the pressure in the space surrounded by the second sealing member, the probe card and the pogo frame are attached to the test head to be maintained by vacuum suction.

According to the present invention, the probe card and the pogo frame can be easily attached to the test head to be maintained.

It is a perspective view which shows schematic structure of the wafer inspection apparatus as a prober which concerns on embodiment of this invention. It is a figure for demonstrating the component built into each cell of the cell tower in FIG. 1, FIG. 2 (A) is a perspective view of a test head, and FIG. 2 (B) is a tester head and a pogo frame in each cell. It is a front view which shows the arrangement state of the probe card. It is a figure which shows roughly the structure of the maintenance carriage used for the prober which concerns on this embodiment, FIG. 3A is a side view, and FIG. 3B is a front view. 3 (A) and 3 (B) are views schematically showing the configuration of the lifter and the test head case, FIG. 4 (A) is a side view, and FIG. 4 (B) is a front view. It is a partially enlarged view for demonstrating the play of a guide part with a guide rail. It is a side view which shows the structure of the simple maintenance trolley schematicly, FIG. 6A shows the case of arranging the test head of the 1st stage cell in a cell tower, and FIG. The case where the test head of the cell of is maintained is shown. It is a process drawing for demonstrating the maintenance method of the wafer inspection apparatus using the maintenance carriage of FIG. It is a front view which shows the modification of the arrangement of the maintenance carriage of FIG.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

First, the prober according to the present embodiment will be described.

FIG. 1 is a perspective view schematically showing a configuration of a wafer inspection device as a prober according to the present embodiment.

In FIG. 1, the wafer inspection apparatus 10 has a cell tower 12 in which a plurality of inspection chambers (cells) 11 are arranged in multiple stages, for example, four stages, and a transfer mechanism (not shown) arranged adjacent to the cell tower 12. It is provided with a loader 13 that is built in and carries in and out of the wafer into each cell 11. The cell tower 12 and the loader 13 each have a rectangular parallelepiped shape, and the height is, for example, 2.4 m.

In the wafer inspection device 10, a space is secured on the opposite side (hereinafter, referred to as “outside”) of the cell tower 12 adjacent to the loader 13 so that an operator can perform maintenance work on each cell 11, which will be described later. A maintenance trolley 27 is arranged.

2A and 2B are views for explaining the components incorporated in each cell of the cell tower in FIG. 1, FIG. 2A is a perspective view of a test head, and FIG. 2B is a tester in each cell. It is a front view which shows the arrangement state of a head, a pogo frame and a probe card.

In FIG. 2A, the test head 15 has a main body 16 formed of a rectangular parallelepiped housing, and a flange 17 projecting laterally from the upper side surface of the main body 16 in the longitudinal direction, and the main body 16 is an inspection circuit. Accommodates a main board (not shown).

Further, as shown in FIG. 2B, each cell 11 internally holds a test head 15, a probe card 18, and a pogo pin (not shown) that electrically connects the probe card 18 and the main board. It has a pogo frame 19. Seal members 20 and 21 are arranged between the probe card 18 and the pogo frame 19, and the pogo frame 19 and the test head 15, and the space surrounded by the seal members 20 and 21 is depressurized so that the probe card 18 is decompressed. And the pogo frame 19 is attached to the test head 15 by vacuum suction.

The probe card 18 has a disk-shaped main body 24 and a plurality of contact probes 25 which are a large number of columnar contact terminals arranged so as to project downward in the drawing from the lower surface of the main body 24. When a wafer (not shown) comes into contact with the probe card 18, each contact probe 25 comes into contact with an electrode pad or a solder bump (not shown) of each semiconductor device formed on the wafer.

Returning to FIG. 1, a maintenance opening 26 is opened on the outside of each cell 11, and the test head 15 is pulled out through the maintenance opening 26. The operator removes the worn main board from the pulled out test head 15 and installs a new main board.

By the way, since the weight of the test head 15 is about 70 kgf and it is difficult to handle it only by the force of an operator, the test head 15 is in the cell 11 in the longitudinal direction of the test head 15 (hereinafter, simply "longitudinal direction"). It is supported via a flange 17 by a slide rail (not shown) arranged along the slide rail, and is configured to be retractable in the longitudinal direction by a plurality of ball pedestals provided on the upper surface of the slide rail.

In the wafer inspection device 10, in order for the operator to easily replace the main board, a support mechanism for supporting the pulled out test head 15 is required, and in response to this, maintenance described later in the present embodiment is required. A trolley 27 is provided.

3A and 3B are views schematically showing the configuration of a maintenance carriage used for the prober according to the present embodiment, FIG. 3A is a side view, and FIG. 3B is a front view.

In FIGS. 3A and 3B, the maintenance trolley 27 is erected from a trolley base 29 which is supported by a plurality of rollers 28 (wheels) and is movable, and the trolley base 29. It has a lift mechanism 30 and a housing-shaped test head case 31 (case) capable of accommodating the test head 15.

A handle 32 is provided on the trolley base 29, and the operator moves the maintenance trolley 27 by pushing or pulling the handle 32. Since each roller 28 is composed of twin wheels and is configured so that the orientation can be freely changed, the degree of freedom regarding the movement of the maintenance carriage 27 is improved.

The lift mechanism 30 is a support column 33 that extends upward from the bogie base 29 in the drawing, and a lifter that is attached to the support column 33 and moves in the vertical direction in the drawing by moving along the extension direction of the support column 33. It has a 34 and a motor (not shown) for moving the lifter 34.

Each roller 28 of the bogie base 29 has a brake (not shown), and the brake is released only when the lifter 34 is located at the lowest point in the vertical direction.

FIG. 4 is a diagram schematically showing the configuration of the lifter and the test head case in FIGS. 3 (A) and 3 (B). FIG. 4 (A) is a side view, and FIG. 4 (B) is a front view. For the sake of simplicity, the test head 15 is shown by a broken line in FIGS. 4 (A) and 4 (B), and further, FIG. 4 (B) shows the slide rail cover 40 described later as a chain line. The slide rail cover 40 is shown in a transparent state.

As shown in FIGS. 4 (A) and 4 (B), the test head case 31 has a rectangular parallelepiped shape, and both ends in the longitudinal direction are opened to form an opening, and when the test head 15 is pulled out from the cell 11. , One of the openings at both ends faces the maintenance opening 26 of the cell 11, and the test head 15 pulled out through the maintenance opening 26 is housed inside. Further, since the upper surface of the test head case 31 is also open, the operator can access the housed test head 15 from the upper surface of the test head case 31, and the main board is replaced through the upper surface.

The test head case 31 is supported by the lifter 34 via the horizontal position adjustment stage 35. The horizontal position adjusting stage 35 is composed of a base portion 35a and a moving portion 35b which are vertically stacked disc-shaped members, and a large number of ball bearings (not shown) are spread between the base portion 35a and the moving portion 35b, and the moving portion is provided. The 35b can move horizontally with respect to the base 35a. The base 35a is connected to the lifter 34 and the moving portion 35b is connected to the test head case 31. As a result, the horizontal position adjustment stage 35 can move the test head case 31 horizontally with respect to the lifter 34.

Further, in the horizontal position adjustment stage 35, the moving portion 35b can be fixed to the base portion 35a by engaging a part of the base portion 35a and a part of the moving portion 35b by sending air from the outside. ..

Since the movement of the moving portion 35b is realized by a large number of ball bearings, the movement of the moving portion 35b does not require a large force, and as a result, the test head case 31 can be easily moved horizontally by the operator. When the plate-shaped stopper 36 projects downward from the lower surface of the test head case 31 and the amount of movement of the test head case 31 in the horizontal direction reaches a predetermined amount, the stopper 36 moves to the base 35a of the horizontal position adjustment stage 35. The amount of movement of the test head case 31 in the horizontal direction is regulated by abutting against.

A slide rail 37 composed of a plurality of ball pedestals is arranged above both side surfaces of the test head case 31 in the longitudinal direction. The slide rail 37 supports the flange 17 of the test head 15 housed in the test head case 31 and slides the test head 15 in the longitudinal direction of the test head case 31.

Further, stopper mechanisms 38 (fixing mechanisms) are arranged at both ends of the upper portions of both side surfaces of the test head case 31 in the longitudinal direction. The stopper mechanism 38 has a protruding contactor 39 that can project freely, and when the contactor 39 projects and contacts the flange 17 of the test head 15, the position of the test head 15 is fixed to the test head case 31. Will be done. The lift mechanism 30 is configured such that when the test head 15 is housed in the test head case 31, the lifter 34 cannot move up and down if the contactor 39 is not in contact with the flange 17.

When the test head 15 is slid in the longitudinal direction of the test head case 31, there is a risk that the operator's hand, particularly a finger, may be caught between the flange 17 and the slide rail 37. Therefore, the slide rail 37 is the slide rail cover 40. Covered by.

In the maintenance trolley 27, the lift mechanism 30 has a height at which the position of the test head case 31 faces the flange 17 of the test head 15 in which the slide rail 37 of the test head case 31 is housed in the first-stage cell 11. , The height of the slide rail 37 facing the flange 17 of the test head 15 housed in the second-stage cell 11, and the same slide rail 37 as the flange 17 of the test head 15 housed in the third-stage cell 11. The slide rail 37 can be fixed to the height facing each other and the height facing the flange 17 of the test head 15 housed in the fourth-stage cell 11.

Returning to FIG. 1, a guide rail 41 is arranged below the outside of the cell tower 12. The guide rail 41 is a tubular body having a rectangular cross section along the longitudinal direction of the cell tower 12, and a slit 42 is formed in the side wall 41a opposite to the cell tower 12. On the other hand, as shown in FIG. 3B, the maintenance trolley 27 has a guide portion 43 (guide mechanism) arranged on the trolley base 29.

As shown in FIG. 5, the guide portion 43 has a bracket 43a projecting laterally from the carriage base 29 and a roller 43b provided at the tip of the bracket 43a and rotating horizontally, and the bracket 43a is a guide rail 41. The roller 43b is housed inside the guide rail 41 by entering the inside of the guide rail 41 through the slit 42 of the guide rail 41. That is, the guide portion 43 engages with the guide rail 41, and at this time, the side wall 41a of the guide rail 41 is interposed between the roller 43b and the bogie base 29.

The maintenance trolley 27 described above is used when pulling out the entire test head 15, but when servicing the test head 15, it may not be necessary to pull out the entire test head 15. In such a case, the wafer inspection device 10 uses a simple maintenance trolley 44 on which the test head 15 is partially mounted instead of the maintenance trolley 27.

FIG. 6 is a side view schematically showing the configuration of the simple maintenance trolley, FIG. 6A shows a case where the test head of the first stage cell in the cell tower is maintained, and FIG. 6B shows the cell tower. The case where the test head of the second-stage cell in is maintained is shown.

In FIGS. 6A and 6B, the simple maintenance trolley 44 includes a main frame 46 in which a plurality of rollers 45 are arranged at the bottom, and a maintenance pedestal 47 that can move up and down with respect to the main frame 46. Have. The maintenance table 47 has a slide rail 48 composed of a plurality of ball pedestals, and the slide rail 48 supports the flange 17 of the partially pulled out test head 15. The maintenance table 47 has a first height in which the slide rail 48 faces the flange 17 of the test head 15 housed in the first-stage cell 11, and a test in which the slide rail 48 is housed in the second-stage cell 11. It is configured to be fixable at each of the second heights facing the flange 17 of the head 15.

Since the simple maintenance trolley 44 is significantly simpler and lighter than the maintenance trolley 27 and has a plurality of rollers 45 arranged at the bottom of the main frame 46, the operator can use the simple maintenance trolley 44. The position of the test head 15 can be easily adjusted, so that the flange 17 of the test head 15 housed in the first or second stage cell 11 and the slide rail 48 of the maintenance stand 47 are accurately opposed to each other. Can be done. As a result, the test head 15 can be easily partially pulled out from the first-stage or second-stage cell 11.

FIG. 7 is a process diagram for explaining a maintenance method of the wafer inspection device using the maintenance carriage of FIG.

First, at the end of the guide rail 41, the roller 43b of the guide portion 43 is housed inside the guide rail 41, and then the maintenance trolley 27 is maintained while the roller 43b is housed inside the guide rail 41. It is roughly moved to the position where the cell 11 in which the head 15 is housed exists. After that, the brakes on each roller 28 of the carriage base 29 are activated to fix the position of the maintenance carriage 27 (FIG. 7 (A)).

Next, the lift mechanism 30 raises the test head case 31 to a height facing the flange 17 of the test head 15 to be maintained by the slide rail 37 of the test head case 31, and then fixes the position of the test head case 31. (Fig. 7 (B)).

Next, the position of the test head case 31 is finely adjusted in the horizontal direction by the horizontal position adjustment stage 35, and the slide rail 37 is accurately faced with the flange 17 of the test head 15 to be maintained (FIG. 7 (C)). This maintenance method is completed.

According to the maintenance trolley 27 according to the present embodiment, the test head case 31 in which the horizontal position adjusting stage 35 houses the lifter 34 of the lift mechanism 30 erected from the movable trolley base 29 and the test head 15. Since the test head case 31 is moved horizontally with respect to the lifter 34, the position of the trolley base 29 is fixed, and the test head case 31 is raised and lowered to the position where the test head 15 for maintenance exists. After fixing the position of the test head case 31, the position of the test head case 31 can be finely adjusted in the horizontal direction so that the slide rail 37 can be accurately faced with the flange 17 of the test head 15 to be maintained. As a result, the test head 15 can be easily pulled out toward the test head case 31.

In the maintenance trolley 27 described above, a slide rail 37 for sliding the test head 15 in the longitudinal direction of the test head case 31 is arranged above both side surfaces of the test head case 31 in the longitudinal direction, and the slide rail 37 is a test head. Since the stopper mechanism 38 for fixing the position of the 15 is provided, the test head 15 housed in the test head case 31 can be moved to a desired position in the test head case 31 and then fixed at that position. , The efficiency of the maintenance work of the test head 15 can be improved.

Further, since the maintenance trolley 27 described above further includes a guide portion 43 that interacts with the guide rail 41 provided at the lower part of the cell tower 12, the maintenance trolley 27 can be accurately moved along the cell tower 12. Therefore, the adjustment time for the position of the maintenance carriage 27 can be shortened.

Further, in the above-mentioned maintenance trolley 27, the side wall 41a of the guide rail 41 is interposed between the roller 43b provided at the tip of the bracket 43a protruding laterally from the trolley base 29 and the trolley base 29 for maintenance. When the carriage 27 is tilted, the roller 43b engages with the side wall 41a of the guide rail 41 to prevent the maintenance carriage 27 from tipping over.

Although the present invention has been described above with reference to the above-described embodiment, the present invention is not limited to the above-described embodiment.

For example, the maintenance trolley 27 described above is arranged only on the outside of one cell tower 12, but as shown in FIG. 8, the two cell towers 12 are arranged so that the outsides of the two cell towers 12 face each other. The maintenance trolley 27 may be arranged so as to be sandwiched between the two. At this time, the test head case 31 of the maintenance trolley 27 has openings at both ends in the longitudinal direction, and each of the openings faces the maintenance opening 26 in each cell 11 of the wafer inspection device 10. The test head 15 of the wafer inspection device 10 can also be housed in the test head case 31, and thus the efficiency of the maintenance work of the test head 15 can be improved.

10 Wafer inspection device 15 Test head 17 Flange 27 Maintenance trolley 29 Cart base 30 Lift mechanism 31 Test head case 35 Horizontal position adjustment stage 37 Slide rail 38 Stopper mechanism 41 Guide rail 43 Guide part 43b Roller

Claims (1)

It has at least multiple laboratories that are stacked one above the other.
At least one of the plurality of inspection rooms is a test head to be maintained, a probe card, a probe card, and a test head to be maintained, which are used for inspecting a wafer having a semiconductor device formed therein. Equipped with a pogo frame, which holds a pogo pin that electrically connects the main board of the
A first seal member is arranged between the probe card and the pogo frame, and a second seal member is arranged between the pogo frame and the test head to be maintained.
The space surrounded by the first seal member and the second seal member is decompressed, so that the probe card and the pogo frame are attached to the test head to be maintained by vacuum suction. Wafer inspection equipment.

Images