CN218931043U

CN218931043U - Wafer detection platform

Info

Publication number: CN218931043U
Application number: CN202222715283.0U
Authority: CN
Inventors: 许彬彬; 黎振江; 陈菲; 杨峥
Original assignee: Shenzhen Technology University
Current assignee: Shenzhen Technology University
Priority date: 2022-10-11
Filing date: 2022-10-11
Publication date: 2023-04-28
Anticipated expiration: 2032-10-11

Abstract

The utility model discloses a wafer detection platform, which comprises: a cabinet; the 5 vibration isolators are arranged on the cabinet; the weight plate is arranged on all vibration isolators; two X-axis linear motors which are parallel to each other and are arranged on the weight plate; the X-axis sliding blocks are arranged on the two X-axis linear motors in a sliding manner; two mutually parallel Y-axis linear motors arranged on the X-axis sliding block; the Y-axis sliding blocks are arranged on the two Y-axis linear motors in a sliding manner; the micro-motion stage is arranged on the Y-axis sliding block; the sucker is arranged on the micro-motion stage and is used for placing a wafer to be detected; the micro-motion stage drives the sucker to move along the Z-axis direction, rotate around the X-axis and rotate around the Y-axis. On the basis of setting an X-axis linear motor and a Y-axis linear motor, a micro-motion platform is arranged to realize micro-motion, and the positions of the suction cup and the wafer are adjusted from five dimensions of an X-axis coordinate, a Y-axis coordinate, a Z-axis coordinate, an included angle with the X-axis and an included angle with the Y-axis, so that the motion precision of the wafer is ensured, and the wafer detection effect is improved.

Description

Wafer detection platform

Technical Field

The utility model relates to the technical field of wafer detection, in particular to a wafer detection platform.

Background

Wafers (wafers) are made of high purity, nearly defect free single crystal material with a purity of 99.9999999% (9N) or higher. Taking silicon wafer production as an example, a silicon ingot is first sliced with a wafer saw (a wire saw). After dicing, chemical etching is performed first to remove crystal damage in the processing step, saw cuts and surface defects on the front and back sides of the wafer are removed by grinding, and finally polishing is performed to form the wafer.

The Wafer test platform is an automated inspection motion platform used by chip manufacturers to inspect the structure of Die (Die) on a Wafer (Wafer). The size of mainstream wafers is evolving from 8 inches to 12 inches, even 18 inches. In the prior art, the motion precision of the wafer test platform is low, so that the detection effect is poor.

Accordingly, the prior art is still in need of improvement and development.

Disclosure of Invention

The utility model aims to solve the technical problem that the motion precision of a wafer testing platform in the prior art is low by providing the wafer testing platform aiming at the defects in the prior art.

A wafer inspection platform, comprising:

a cabinet;

the 5 vibration isolators are arranged on the cabinet;

the weight plate is arranged on all vibration isolators;

two X-axis linear motors parallel to each other and arranged on the weight plate;

the X-axis sliding blocks are arranged on the two X-axis linear motors in a sliding manner;

two mutually parallel Y-axis linear motors arranged on the X-axis sliding block;

the Y-axis sliding blocks are arranged on the two Y-axis linear motors in a sliding manner;

the micro-motion stage is arranged on the Y-axis sliding block;

the sucker is arranged on the micro-motion stage and is used for placing the wafer to be detected;

wherein, the micro-motion stage drives the sucking disc to move along the Z-axis direction, rotate around the X-axis and rotate around the Y-axis.

The wafer detection platform is characterized in that at least 3 ejector pins are arranged on the micro-motion platform, and at least 3 ejector pin holes are formed in the sucker and used for the ejector pins to pass through.

The wafer detection platform, wherein, the X-axis slider includes:

the two ends of the I-shaped piece are respectively connected with the two X-axis linear motors in a sliding manner; the two sides of the I-shaped piece are provided with a first groove and a second groove;

the reinforcing grid is arranged in the second groove;

the two Y-axis linear motors are symmetrically arranged in the first groove.

The wafer detection platform is characterized in that a fixing piece is arranged in the middle of the first groove, and two Y-axis linear motors are symmetrically arranged on two sides of the fixing piece and connected with the fixing piece.

The wafer detection platform, wherein, the Y-axis slider includes:

the frame body is arranged around the I-shaped piece;

wherein, the frame body adopts the air supporting frame body to form the interval with the weight board between.

The wafer detection platform, wherein, the wafer detection platform still includes:

the protection casing, set up in the rack, the protection casing has the opening.

The wafer detection platform, wherein, X axle linear electric motor includes:

the X-axis stator is fixedly arranged on the weight plate;

an X-axis rotor which is arranged on the weight plate in a sliding manner;

the X-axis rotor is connected with the X-axis sliding block; and/or

The Y-axis linear motor includes:

the Y-axis stator is fixedly arranged on the X-axis sliding block;

the Y-axis rotor is arranged on the X-axis sliding block in a sliding manner;

the Y-axis rotor is connected with the Y-axis sliding block.

The wafer detection platform is characterized in that the X-axis stator adopts a U-shaped double stator; the Y-axis stator adopts a U-shaped double stator.

The wafer detection platform is characterized in that the sucking disc adopts a microporous vacuum ceramic sucking disc.

and the detection equipment is arranged on the weight plate.

The technical scheme adopted for solving the technical problems is as follows:

the beneficial effects are that: on the basis of setting an X-axis linear motor and a Y-axis linear motor, a micro-motion platform is arranged to realize micro-motion, and the positions of the suction cup and the wafer are adjusted from five dimensions of an X-axis coordinate, a Y-axis coordinate, a Z-axis coordinate, an included angle with the X-axis and an included angle with the Y-axis, so that the motion precision of the wafer is ensured, and the wafer detection effect is improved.

Drawings

FIG. 1 is a first perspective view of a wafer inspection system according to the present utility model.

Fig. 2 is a second perspective view of the wafer inspection system of the present utility model.

Fig. 3 is a third perspective view of the wafer inspection system of the present utility model.

Fig. 4 is a top view of a wafer inspection system according to the present utility model.

Fig. 5 is a first cross-sectional view of a wafer inspection platform according to the present utility model.

Fig. 6 is a second cross-sectional view of the wafer inspection platform of the present utility model.

Reference numerals illustrate:

10. a cabinet; 11. a protective cover; 20. a wafer inspection platform; 21. a vibration isolator; 22. a weight plate; 23. an X-axis linear motor; 24. an X-axis sliding block; 241. an I-shaped member; 242. reinforcing the grid; 25. a Y-axis linear motor; 26. a Y-axis slider; 261. a frame; 27. a micro-motion stage; 28. a suction cup; 281. a top pinhole; 29. a thimble; 30. a wafer carrier; 40. a wafer pre-adjustment device; 50. and a blanking device on the wafer.

Detailed Description

In order to make the objects, technical solutions and advantages of the present utility model more clear and clear, the present utility model will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.

Referring to fig. 1-6, embodiments of a wafer inspection platform are provided.

As shown in fig. 2-4, the wafer inspection platform 20 of the present utility model includes:

a cabinet 10;

5 vibration isolators 21 provided in the cabinet 10;

a weight plate 22 provided on all of the vibration isolators 21;

two X-axis linear motors 23 parallel to each other, provided to the weight plate 22;

the X-axis sliding blocks 24 are arranged on the two X-axis linear motors 23 in a sliding manner;

two parallel Y-axis linear motors 25 disposed on the X-axis slide block 24;

a Y-axis slider 26 slidably disposed on the two Y-axis linear motors 25;

a micro-stage 27 provided on the Y-axis slider 26;

the sucker is arranged on the micro-motion stage 27 and is used for placing the wafer to be detected;

wherein, the micro-motion stage 27 drives the sucker to move along the Z-axis direction, rotate around the X-axis and rotate around the Y-axis.

The wafer inspection platform 20 is a device for inspecting the quality of a wafer to be inspected, where quality inspection refers to inspection during the process of manufacturing chips by using a wafer, and specifically includes: thickness detection, warping degree detection, flaw detection, sheet resistance detection, probe detection, surface morphology detection, surface roughness detection and the like, wherein different detection needs to be provided with corresponding detection equipment, and different wafer detection platforms can be formed. The vibration isolator 21 refers to a device for isolating vibration, the weight plate 22 refers to a device having a large weight to prevent vibration, and the weight plate 22 includes a steel plate and a marble table, the steel plate being positioned on the vibration isolator 21, the marble table being positioned on the steel plate. The linear motor means a motor for driving the movable body to move in a straight line, the X-axis slider 24 means a device for sliding along the X-axis, the Y-axis slider 26 means a device for sliding along the Y-axis, the micro-stage 27 means a device for moving in a small range, the movement accuracy of the micro-stage 27 is in the order of micrometers μm, the rotation accuracy is in the order of micro-arc μrad, specifically, the micro-stage 27 moves in a small range in the Z-axis direction, for example, 5 μm, the micro-stage 27 rotates in a small range around the X-axis, for example, 2 μrad, and the micro-stage 27 rotates in a small range around the Y-axis, for example, 1.6 μrad. The suction cup 28 is a device for adsorbing a wafer, and is connected to the suction cup 28 through an air pressure reducing device such as an air pump to adsorb the wafer.

Specifically, 5 vibration isolators 21 may be provided, wherein 4 vibration isolators 21 are located at 4 corners of the mass, respectively, and 1 vibration isolator 21 is located at the center of the mass. The two X-axis linear motors 23 are arranged in parallel, and two ends of the X-axis sliding block 24 are respectively arranged on the two X-axis linear motors 23 in a sliding manner, so that the X-axis sliding block 24 can stably move along the X-axis direction. The two Y-axis linear motors 25 are arranged in parallel, the Y-axis linear motors 25 are symmetrically arranged on the X-axis sliding block 24, and the Y-axis linear motors 25 extend along the length direction of the X-axis sliding block 24. When the linear motor is adopted, the precision is higher (in particular to micro-nano precision), the structure is simple (in particular to small thickness), the dynamic response is high, the accuracy is high, and no friction force exists.

On the basis of setting the X-axis linear motor 23 and the Y-axis linear motor 25, the micro-motion is realized by setting the micro-motion stage 27, and the positions of the suction cup and the wafer are adjusted from five dimensions of an X-axis coordinate, a Y-axis coordinate, a Z-axis coordinate, an included angle with the X-axis and an included angle with the Y-axis, so that the motion precision of the wafer is ensured, and the wafer detection effect is improved.

In a preferred implementation of the embodiment of the present utility model, as shown in fig. 4 and 6, at least 3 ejector pins 29 are disposed on the micro-stage 27, and at least 3 ejector pin holes 281 are disposed on the suction cup for the ejector pins 29 to pass through.

The ejector pins 29 are members for ejecting the wafer, the ejector pins 29 are lifted by an ejector pin lifter, the ejector pin lifter is provided on the micro-stage 27, when the wafer needs to be taken out from the wafer inspection platform 20, the inspected wafer on the chuck 28 is desorbed, then the ejector pins 29 are lifted to extend out of the ejector pin holes 281, and the inspected wafer is taken out from the chuck 28. When the wafer to be detected is required to be placed on the wafer detection platform 20, the ejector pins 29 are firstly extended out of the ejector pin holes 281, then the wafer to be detected is placed on the ejector pins 29, the ejector pins 29 are then lowered to enable the wafer to be detected to be borne on the suction cups 28, and finally the wafer to be detected is adsorbed through the suction cups 28. In addition, the ejector pin 29 is inserted into the ejector pin hole 281, and may also function as a fixing chuck 28. The 3 pins 29 are disposed around the center of the chuck 28 and form an equilateral triangle so that the wafer can be stably held. Other shapes may be arranged when the number of the ejector pins 29 exceeds 3, for example, a plurality of concentric shapes, such as a concentric triangle, a concentric rectangle, a concentric circle, and the like.

In a preferred implementation of the embodiment of the present utility model, as shown in fig. 3, 4 and 5, the X-axis slider 24 includes:

the I-shaped piece 241, two ends of the I-shaped piece 241 are respectively connected with the two X-axis linear motors 23 in a sliding way; the two sides of the I-shaped piece 241 are provided with a first groove and a second groove;

a reinforcing mesh 242 disposed in the second recess;

wherein, two Y-axis linear motors 25 are symmetrically arranged in the first groove.

The i-shaped piece 241 is a device with an i-shaped section, the i-shaped piece 241 comprises two i-shaped side plates and an i-shaped transverse plate, two ends of the i-shaped transverse plate are respectively connected with the two i-shaped side plates, the i-shaped transverse plate is horizontally arranged, the i-shaped side plates are vertically arranged, a first groove is formed above, and a second groove is formed below. The reinforcing mesh 242 refers to a mesh-like device for increasing strength, and the reinforcing mesh 242 is disposed in the second groove to increase the strength of the i-piece 241.

When the i-shaped member 241 is used, not only high strength but also low deformation are ensured. And the I-shaped side plates are positioned at two sides of the I-shaped transverse plate, so that weight dispersion is facilitated, the reinforcing grid 242 is beneficial to lowering the gravity center of the X-axis sliding block 24, and the I-shaped piece 241 is more stable in moving.

In a preferred implementation manner of the embodiment of the present utility model, as shown in fig. 6, a fixing member is disposed in the middle of the first groove, and two Y-axis linear motors 25 are symmetrically disposed at two sides of the fixing member and connected to the fixing member.

The fixing member means a member for fixing other mechanical members, by which the Y-axis linear motor 25 is stably fixed to the i-member 241. The Y-axis slider 26 moves more smoothly due to the symmetrical Y-axis linear motor 25.

In a preferred implementation of the embodiment of the present utility model, as shown in fig. 6, the Y-axis slider 26 includes:

a frame 261 disposed around the I-shaped member 241;

wherein, the frame 261 is an air-floating frame and forms a space with the weight plate 22.

The frame 261 is a device with four sides connected in sequence and surrounding a middle space, the I-shaped piece 241 penetrates through the frame 261, the frame 261 is a cube-shaped frame 261 and comprises a lower bottom plate, two side plates arranged on the lower bottom plate and an upper top plate connected with the two side plates; the two side plates are located on two sides of the I-shaped piece 241, the lower bottom plate is located between the I-shaped piece 241 and the weight plate 22, and the upper top plate is located above the I-shaped piece 241. Since the gas is blown toward the weight plate 22, a space is formed between the lower plate and the weight plate 22, and the two are not in contact. The frame 261 is isolated by air floatation, and the vibration of the weight plate 22 and the X-axis slider 24 is reduced as much as possible to the wafer on the Y-axis slider 26 and the chuck 28. The lower bottom plate in the air-float frame body can be made into a ceramic bottom plate by adopting porous ceramics, and is connected with a micropore inlet in the ceramic bottom plate by a gas output device such as an air pump, gas is input into the micropore inlet, and the gas is blown out from a micropore outlet on the lower surface of the ceramic bottom plate. Micropores in the ceramic bottom plate are mutually communicated to form micropore channels, and local air buoyancy can not be overlarge due to the fact that the sizes of the micropores are smaller and the micropores are communicated to form a channel network.

In a preferred implementation of the embodiment of the present utility model, as shown in fig. 1, the wafer inspection platform 20 further includes:

and a protective cover 11 arranged on the cabinet 10, wherein the protective cover 11 is provided with an opening.

In order to prevent the external environment from influencing the wafer inspection, a protective cover 11 is disposed on the cabinet 10, the protective cover 11 covers the wafer inspection platform 20, and a display may be disposed on the protective cover 11 to display the wafer inspection state in real time. Folding screens and keyboard holders may also be provided to control the devices.

In a preferred implementation of the embodiment of the present utility model, as shown in fig. 4 and 5, the X-axis linear motor 23 includes:

an X-axis stator fixedly provided to the weight plate 22;

an X-axis mover slidably provided on the weight plate 22;

wherein the X-axis mover is connected to the X-axis slider 24.

Specifically, the X-axis stator is fixed to the weight plate 22, and the X-axis mover moves relative to the X-axis stator, thereby driving the X-axis slider 24 to move.

In a preferred implementation of the embodiment of the present utility model, as shown in fig. 4 and 6, the Y-axis linear motor 25 includes:

a Y-axis stator fixedly arranged on the X-axis sliding block 24;

a Y-axis mover slidably provided to the X-axis slider 24;

wherein the Y-axis mover is connected to the Y-axis slider 26.

Specifically, the Y-axis stator is fixed to the weight plate 22, and the Y-axis mover moves relative to the Y-axis stator, thereby moving the Y-axis slider 26.

In a preferred implementation of the embodiment of the present utility model, as shown in fig. 5 and 6, the X-axis stator adopts a U-shaped double stator; the Y-axis stator adopts a U-shaped double stator.

Specifically, the X-axis stator adopts a U-shaped double stator, which is beneficial to the stable movement of the X-axis rotor. The Y-axis stator adopts U-shaped double stators, which is beneficial to the stable movement of the Y-axis rotor.

In a preferred implementation of the embodiment of the utility model, the suction cup is a microporous vacuum ceramic suction cup.

The micropore vacuum ceramic sucker is a ceramic device which is communicated with micropores and used for adsorbing a wafer, the micropores in the micropore vacuum ceramic sucker are connected through an air pump and other air pressure reducing devices, the air pressure in the micropores is reduced, and when the wafer is placed on the micropore vacuum ceramic sucker, the wafer is pressed on the micropore vacuum ceramic sucker under the action of the external atmospheric pressure. The micropores are mutually communicated to form a micropore channel, and the micropores are communicated to form a channel network due to smaller sizes of the micropores, so that local adsorption force is not excessively large, and deformation of a wafer is not caused in the adsorption process.

In a preferred implementation of the embodiment of the present utility model, the wafer inspection platform 20 further includes:

and a detection device provided to the weight plate 22.

The inspection apparatus is an apparatus for inspecting a wafer, and according to different inspection conditions, the inspection apparatus includes: at least one of thickness detection equipment, warping degree detection equipment, flaw detection equipment, sheet resistance detection equipment, probe detection equipment, surface morphology detection equipment and surface roughness detection equipment. The detection device is also disposed on the weight plate 22, specifically may be disposed on a steel plate, so that the influence of the external environment on the detection device can be reduced, for example, the relative displacement can be reduced, and the detection accuracy can be improved.

Referring to fig. 1-6, the present utility model also provides some embodiments of a wafer inspection system.

As shown in fig. 1 to 4, the wafer inspection system of the present utility model includes:

the wafer inspection platform of any one of the embodiments above;

the wafer pre-adjustment device 40 is disposed on the cabinet 10 and is used for adjusting the orientation of the wafer to be inspected;

the wafer carrying device 30 is disposed on the cabinet 10 and located between the wafer pre-adjustment device 40 and the wafer detection platform 20;

the wafer blanking device 50 is disposed on the cabinet 10 and located on a side surface of the wafer carrying device 30, and is used for loading the wafer to be inspected and the inspected wafer;

the wafer carrying device 30 conveys the wafer to be detected on the wafer blanking device 50 to the wafer pre-adjustment device 40, conveys the wafer to be detected with the orientation adjusted on the wafer pre-adjustment device 40 to the wafer detection platform 20, and conveys the wafer detected on the wafer detection platform 20 to the wafer blanking device 50.

The wafer pre-adjustment device 40 is a device for pre-adjusting the orientation of a wafer to be inspected. The wafer carrying device 30 is a device for carrying and transporting wafers, and specifically, the wafers can be taken out from the wafer blanking device 50 and transported to the wafer pre-adjustment device 40; the wafer may be removed from the wafer pre-alignment device 40 and transported to the wafer inspection platform 20; the wafer may be removed from the wafer inspection platform 20 and transported to the wafer blanking device 50. The on-wafer discharging device 50 refers to a device for loading and discharging wafers, and the wafer to be inspected and the inspected wafer are loaded by the on-wafer discharging device 50.

It should be noted that, in the whole wafer inspection process, only the wafer to be inspected needs to be placed on the wafer blanking device 50, the wafer inspection system can automatically transfer the wafer to be inspected, adjust the orientation of the wafer to be inspected, perform relevant inspection, and finally transport the inspected wafer to the wafer blanking device 50, so that the whole wafer inspection process is automated, and the inspection efficiency is improved.

It should be emphasized that the wafer carrier 30 is located at an intermediate position, specifically, at a center position of a wafer where the plurality of wafer blanking devices 50 are located, and the wafer pre-adjustment device 40, the wafer inspection platform 20, and the wafer blanking devices 50 are disposed around the wafer carrier 30, so as to facilitate transfer and transportation of the wafer between the devices. The wafer blanking device 50 may be configured with a plurality of, for example, 2 wafer blanking devices 50, one for loading the wafer to be inspected and the other for loading the inspected wafer, and the two wafer blanking devices 50 are respectively located at two sides of the wafer carrier 30. It is also possible to configure 4 wafer blanking devices 50, 2 of which are loaded with wafers to be inspected and the other 2 of which are loaded with inspected wafers. The wafer blanking device 50 on which the wafer to be inspected is loaded and the wafer blanking device 50 on which the inspected wafer is loaded are respectively located at both sides of the wafer carrier 30.

In a preferred implementation of the embodiment of the present utility model, as shown in fig. 1-4, the wafer pre-adjustment device 40, the wafer inspection platform 20 and the wafer carrier 30 are all located in the protection cover 11, the wafer blanking device 50 is located outside the protection cover 11, and the opening is located between the wafer carrier 30 and the wafer blanking device 50.

Specifically, in order to prevent the external environment from affecting the detection of the wafer, a protection cover 11 is disposed on the cabinet 10, the protection cover 11 covers the wafer pre-adjusting device 40, the wafer detecting platform 20 and the wafer carrying device 30, and the wafer blanking device 50 is located outside the protection cover 11, so as to facilitate loading and blanking. Of course, a display may be provided on the shield 11 to display the wafer inspection status in real time. Folding screens and keyboard holders may also be provided to control the devices. The openings may be provided in 2, one on each side of the wafer carrier 30, so that the wafer carrier 30 can take and place wafers.

It is to be understood that the utility model is not limited in its application to the examples described above, but is capable of modification and variation in light of the above teachings by those skilled in the art, and that all such modifications and variations are intended to be included within the scope of the appended claims.

Claims

1. The wafer detection platform is characterized by comprising:

a cabinet;

the 5 vibration isolators are arranged on the cabinet;

the weight plate is arranged on all vibration isolators;

the micro-motion stage is arranged on the Y-axis sliding block;

the sucker is arranged on the micro-motion stage and is used for placing a wafer to be detected;

2. The wafer inspection platform of claim 1, wherein at least 3 pins are disposed on the micro-stage, and at least 3 pin holes are disposed on the suction cup for the pins to pass through.

3. The wafer inspection platform of claim 1, wherein the X-axis slider comprises:

the reinforcing grid is arranged in the second groove;

the two Y-axis linear motors are symmetrically arranged in the first groove.

4. The wafer inspection platform of claim 3, wherein a fixing member is disposed in the middle of the first groove, and two Y-axis linear motors are symmetrically disposed on two sides of the fixing member and connected to the fixing member.

5. The wafer inspection platform of claim 3, wherein the Y-axis slider comprises:

the frame body is arranged around the I-shaped piece;

6. The wafer inspection platform of claim 1, further comprising:

7. The wafer inspection platform of claim 1, wherein the X-axis linear motor comprises: