WO2022222642A1 - 热桥和电子设备 - Google Patents

热桥和电子设备 Download PDF

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Publication number
WO2022222642A1
WO2022222642A1 PCT/CN2022/080663 CN2022080663W WO2022222642A1 WO 2022222642 A1 WO2022222642 A1 WO 2022222642A1 CN 2022080663 W CN2022080663 W CN 2022080663W WO 2022222642 A1 WO2022222642 A1 WO 2022222642A1
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WO
WIPO (PCT)
Prior art keywords
heat
conducting
thermally conductive
elastic
protrusions
Prior art date
Application number
PCT/CN2022/080663
Other languages
English (en)
French (fr)
Inventor
傅杰
聂志东
Original Assignee
中兴通讯股份有限公司
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Filing date
Publication date
Application filed by 中兴通讯股份有限公司 filed Critical 中兴通讯股份有限公司
Publication of WO2022222642A1 publication Critical patent/WO2022222642A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/2049—Pressing means used to urge contact, e.g. springs

Definitions

  • Embodiments of the present disclosure relate to, but are not limited to, the field of electronic devices, and in particular, relate to a thermal bridge and an electronic device including the thermal bridge.
  • the printed circuit board is also provided with functional modules such as an optical module, an input/output (I/O) module and the like, which are arranged on the printed circuit board through slots or guide rails.
  • functional modules such as an optical module, an input/output (I/O) module and the like, which are arranged on the printed circuit board through slots or guide rails.
  • the printed circuit board provided with the electrical components and the functional modules also needs to be arranged in the protective casing. Heat will be generated in the working process of electrical components and functional modules. If the heat cannot be dissipated in time, the normal operation of electrical components and functional modules will be affected.
  • the present disclosure provides a thermal bridge and an electronic device including the thermal bridge.
  • a thermal bridge is provided, wherein the thermal bridge includes a first thermally conductive block, a second thermally conductive block and an elastic thermally conductive member,
  • the first heat-conducting block includes a first heat-conducting block body and a plurality of first heat-conducting protrusions, the first heat-conducting block body includes a first heat-dissipating surface and a first mounting surface disposed oppositely, and the plurality of first heat-conducting protrusions is arranged on the first mounting surface, and a space is formed between any two adjacent first thermally conductive protrusions;
  • the second heat-conducting block includes a second heat-conducting block body and a plurality of second heat-conducting protrusions, the second heat-conducting block body includes a second heat-dissipating surface and a second mounting surface disposed oppositely, and the plurality of second heat-conducting protrusions is arranged on the second mounting surface, and a space is formed between any two adjacent second thermally conductive protrusions;
  • the first mounting surface of the first heat-conducting block body and the second mounting surface of the second heat-conducting block body are disposed opposite to each other, the plurality of first heat-conducting protrusions and the plurality of second heat-conducting protrusions and the side surfaces of the first heat-conducting protrusions are in contact with the side surfaces of the second heat-conducting protrusions adjacent to the first heat-conducting protrusions, and the first heat-conducting protrusions and the A first accommodating cavity is formed between the second heat-conducting protrusions adjacent to the first heat-conducting protrusions and the second mounting surface, and the second heat-conducting protrusions and the second heat-conducting protrusions A second accommodating cavity is formed between the adjacent first heat conducting protrusions and the first mounting surface;
  • the elastic heat-conducting member is disposed in at least one of the first accommodating cavity and the second accommodating cavity, so that relative movement can occur between the first heat-conducting block and the second heat-conducting block.
  • the thermal bridge further includes at least one positioning guide, each of which has a corresponding positioning guide hole;
  • One end of the positioning guide is fixed on one of the first thermally conductive block body and the second thermally conductive block body, and the other of the first thermally conductive block body and the second thermally conductive block body
  • the positioning guide hole corresponding to the positioning guide is formed thereon, the other end of the positioning guide passes through the positioning guide hole corresponding to the positioning guide, and the positioning guide can Reciprocate along the axial direction of the positioning guide hole.
  • the positioning guide member includes a connecting rod and a threaded portion located at one end of the connecting rod, the other end of the connecting rod is inserted into the positioning guide hole, an external thread is formed on the threaded portion, and the A threaded hole is formed on one of the first heat-conducting block body and the second heat-conducting block body that is fixedly connected with the positioning guide, and the threaded portion is threadedly matched with the threaded hole.
  • the positioning guide member further includes a first limit member, the first limit member is formed on the other end of the connecting rod, and the first limit member is located at the position away from the positioning guide hole. At one end of the threaded portion, the maximum distance between the side surface of the first limiting member and the axis of the positioning guide hole is greater than the radius of the positioning guide hole;
  • An accommodating groove is also formed on the outer surface of one of the first heat-conducting block body and the second heat-conducting block body where the positioning guide hole is formed, and the opening of the positioning guide hole is located on the bottom wall of the accommodating groove and the first limiting member is located in the accommodating groove.
  • the positioning guide member further includes a second limiting member disposed on the outer surface of the connecting rod, and the second limiting member is located between the threaded portion and the first limiting member.
  • the position of the second limiting member is set so that the elastic heat-conducting member is in an undeformed state.
  • the first heat-conducting protrusions are strip-shaped pieces, and the plurality of first heat-conducting protrusions are parallel to each other;
  • the second heat-conducting protrusions are strip-shaped pieces, the plurality of second heat-conducting protrusions are parallel to each other, and the second heat-conducting protrusions and the first heat-conducting protrusions are parallel to each other.
  • the elastic heat-conducting member is a strip-shaped member, and the elastic heat-conducting member includes a plurality of elastic connecting members and a plurality of first arc-shaped elastic sheets, and the plurality of first arc-shaped elastic sheets are connected to each other to form a strip-shaped member. structure, the two ends of the strip structure are respectively provided with one of the elastic connecting pieces;
  • the elastic heat-conducting member is disposed on the end face of the first heat-conducting protrusion facing the second heat-conducting block body, and the elastic heat-conducting member disposed on the first heat-conducting protrusion passes through the elastic heat-conducting member
  • the elastic connecting piece is connected with the end face of the first heat conducting protrusion facing the second heat conducting block body, and the first heat conducting element of the elastic heat conducting piece disposed on the first heat conducting protrusion
  • the arc-shaped elastic sheet protrudes toward the second mounting surface of the second thermally conductive block body; and/or
  • the elastic heat-conducting member is disposed on the end face of the second heat-conducting protrusion facing the first heat-conducting block body, and the elastic heat-conducting member disposed on the second heat-conducting protrusion passes through the elastic heat-conducting member
  • the elastic connecting piece is connected with the end face of the second heat conducting protrusion facing the first heat conducting block body, and the first arc shape of the elastic heat conducting piece disposed on the second heat conducting protrusion
  • the elastic sheet protrudes toward the first mounting surface of the first thermally conductive block body.
  • the elastic connecting member is connected between two adjacent first arc-shaped elastic sheets.
  • a second arc-shaped elastic sheet is connected between two adjacent first arc-shaped elastic sheets, and the bulge direction of the second arc-shaped elastic sheet is the same as that of the second arc-shaped elastic sheet.
  • the protruding direction of the first arc-shaped elastic sheet is opposite.
  • a plurality of the elastic heat-conducting members located on the first heat-conducting block are integrated, and/or a plurality of the elastic heat-conducting members located on the second heat-conducting block are integrated.
  • an electronic device in one embodiment, includes a circuit board, at least one electrical module formed on the circuit board, and a circuit board for accommodating the circuit board and The heat dissipation housing of the electrical module, wherein the electronic device further includes at least one thermal bridge, the thermal bridge is the thermal bridge provided in the first aspect of the disclosure, and at least one of the electrical modules is provided with the thermal bridge.
  • the first heat dissipation surface of the heat bridge is in contact with the inner surface of the heat dissipation shell, and the second heat dissipation surface of the heat bridge is in contact with the electrical module.
  • the elastic thermally conductive member has both elasticity and good thermal conductivity.
  • force can be applied to the second heat-conducting block to deform the elastic heat-conducting member and reduce the distance between the first heat-dissipating surface and the second heat-dissipating surface, thereby completing the assembly smoothly.
  • the second heat-conducting block is pushed to a state of close contact with the heat dissipation shell, and the first heat-conductive block is also pushed to a state of close contact with the electrical module, thereby Ensure good cooling effect.
  • FIG. 1 is a schematic diagram of an electronic device provided with a thermally conductive member
  • FIG. 2 is a schematic diagram of a thermal bridge provided by an embodiment of the present disclosure
  • FIG. 3 is a partial cross-sectional view of a thermal bridge provided by an embodiment of the present disclosure.
  • FIG. 4a is a schematic diagram of a first thermally conductive block in a thermal bridge provided by an embodiment of the present disclosure
  • FIG. 4b is a schematic diagram of a second thermally conductive block in a thermal bridge provided by an embodiment of the present disclosure
  • 4c is a schematic diagram of heat dissipation of a thermal bridge provided by an embodiment of the present disclosure
  • FIG. 5 is a schematic three-dimensional structural diagram of a thermal bridge provided by an embodiment of the present disclosure.
  • FIG. 6 is a schematic cross-sectional view of an elastic thermally conductive member in the thermal bridge shown in FIG. 5;
  • FIG. 7 is a schematic three-dimensional structure diagram of a thermal bridge provided by another embodiment of the present disclosure.
  • FIG. 8 is a schematic cross-sectional view of the elastic thermally conductive member in the thermal bridge shown in FIG. 7;
  • FIG. 9 is a schematic three-dimensional structural diagram of a thermal bridge provided by another embodiment of the present disclosure.
  • FIG. 10 is a schematic cross-sectional view of the elastic thermally conductive member in the thermal bridge shown in FIG. 9;
  • FIG. 11 is a schematic top view of the elastic thermally conductive member shown in FIG. 10;
  • FIG. 12 is a schematic three-dimensional structural diagram of a thermal bridge provided by another embodiment of the present disclosure.
  • FIG. 13 is a schematic top view of the elastic thermally conductive member shown in FIG. 12;
  • FIG. 14 is a schematic three-dimensional structure diagram of the thermal bridge provided by the embodiment of the present disclosure when used in the main chip;
  • 15 is a schematic diagram of an exploded structure when the thermal bridge provided by an embodiment of the present disclosure is used in a main chip;
  • thermo bridge 16 is a schematic cross-sectional view of the thermal bridge provided by the embodiment of the present disclosure when used in the main chip
  • FIG. 17 is a schematic three-dimensional structural diagram of the thermal bridge provided by the embodiment of the present disclosure when used in an optical module;
  • FIG. 18 is a schematic diagram of an exploded structure when the thermal bridge provided by an embodiment of the present disclosure is used in an optical module;
  • FIG. 19 is a schematic cross-sectional view of a thermal bridge provided by an embodiment of the present disclosure when used in an optical module.
  • Figure 1 shows a thermally conductive member.
  • the heat conduction member 10 is respectively connected with the electrical element 20 and the protective casing 30 , and the protective casing 30 also has a heat dissipation function.
  • the heat conduction member 10 can conduct the heat generated by the electrical components 20 to the protective casing 30 and dissipate the heat from the protective casing to the outside.
  • a thermal bridge is provided in one embodiment. As shown in FIGS. 2 and 3 , the thermal bridge includes a first thermally conductive block 100 , a second thermally conductive block 200 and an elastic thermally conductive member 300 .
  • the first thermally conductive block 100 includes a first thermally conductive block body 110 and a plurality of first thermally conductive protrusions 120, and the first thermally conductive block body 100 includes oppositely disposed first heat dissipation surfaces (the upper surface in FIG. 4a ) and the first mounting surface (the lower surface in FIG. 4 a ), a plurality of first thermally conductive protrusions 120 are disposed on the first mounting surface, and a space is formed between any two adjacent first thermally conductive protrusions 120 .
  • the second thermally conductive block 200 includes a second thermally conductive block body 210 and a plurality of second thermally conductive protrusions 220
  • the second thermally conductive block body 210 includes a second heat dissipation surface (the lower surface in FIG. 4b ) disposed opposite to each other.
  • the second mounting surface (the upper surface in FIG. 4 b )
  • a plurality of second thermally conductive protrusions 220 are disposed on the second mounting surface, and a space is formed between any two adjacent second thermally conductive protrusions 220 .
  • the first mounting surface of the first thermally conductive block body 110 and the second mounting surface of the second thermally conductive block body 210 are disposed opposite to each other, and a plurality of first thermally conductive protrusions 120 and a plurality of second thermally conductive protrusions are provided.
  • the settings are interleaved with each other.
  • the side surfaces of the first thermally conductive protrusions 120 are in contact with the side surfaces of the second thermally conductive protrusions 220 adjacent to the first thermally conductive protrusions 120 .
  • a first accommodating cavity is formed between the two thermally conductive protrusions 220 and the second mounting surface, and the second thermally conductive protrusions 220, the first thermally conductive protrusions 120 adjacent to the second thermally conductive protrusions 220, and the A second accommodating cavity is formed between the first mounting surfaces.
  • At least one of the first accommodating cavity and the second accommodating cavity is provided with an elastic heat-conducting member 300 to enable relative movement between the first heat-conducting block and the second heat-conducting block.
  • the thermal bridge is used in electronic equipment, typically, the electronic equipment includes a circuit board, at least one electrical module formed on the circuit board, and a heat dissipation housing for accommodating the circuit board and the electrical module.
  • the first heat dissipation surface of the thermal bridge is brought into contact with the inner surface of the heat dissipation shell, and the second heat dissipation surface of the heat bridge is brought into contact with the thermal module of the heat dissipation shell.
  • the relative movement between the first thermally conductive block 100 and the second thermally conductive block 200 means that the first heat dissipation surface of the first thermally conductive block 100 and the second thermally conductive block 200
  • the distances between the heat dissipation surfaces can be close to each other or away from each other.
  • the elastic thermally conductive member 300 has both elasticity and good thermal conductivity.
  • force can be applied to the second heat-conducting block 100 to deform the elastic heat-conducting member 300 and reduce the distance between the first heat-dissipating surface and the second heat-dissipating surface, so that the assembly can be successfully completed.
  • the second heat-conducting block 200 is pushed to a state in close contact with the heat dissipation shell, and the first heat-conducting block 100 is also pushed to a state in close contact with the electrical module. state to ensure good heat dissipation.
  • the straight line with the arrow in FIG. 4c shows the schematic diagram of the heat dissipation path.
  • the heat is firstly conducted to the second heat-conducting block body through the second heat dissipation surface, and then transferred to the elastic heat-conducting member 300 and the second heat-conducting protrusion 220 from the second heat-conducting block body respectively.
  • the side surfaces of the second thermally conductive protrusions 220 are in contact with the side surfaces of the first thermally conductive protrusions 120 , so as to transfer heat to the first thermally conductive protrusions 120 .
  • the first thermally conductive protrusion 120 then transfers the heat to the first thermally conductive block body 110 , and finally transfers the heat from the second thermally conductive block body 210 to the heat dissipation housing. Since the first thermally conductive protrusions 120 and the second thermally conductive protrusions 220 are in contact with each other and realize heat conduction together with the elastic thermally conductive member 300 , the thermal resistance of the thermal bridge is reduced, and the heat dissipation effect is further improved.
  • the thermal bridge When the thermal bridge is in a pressurized state, the contact surface between the first thermally conductive protrusion 120 and the second thermally conductive protrusion 220 increases, the thermal resistance of the elastic thermally conductive member 300 decreases, and the thermal conductivity of the thermal bridge improves.
  • first thermally conductive protrusions on the first thermally conductive block and the second thermally conductive protrusions on the second thermally conductive block are in a staggered shape, which facilitates plugging and detaching in a pluggable application scenario.
  • thermal bridge has the characteristics of high thermal conductivity and high tolerance
  • the thermal bridge is especially suitable for the following two situations: the first situation, the electrical components that cannot receive excessive pressure, and the presence of plug-in Pull out the module of the application scenario; in the second case, the device to be dissipated or the module itself has a large dimensional tolerance, or needs to be compatible with multiple specifications and the size fluctuates greatly.
  • the elastic heat-conducting member 300 provided in the thermal bridge provided by the present disclosure can absorb the pressure exerted by the outside world, and can solve the problems of excessive stress and difficult insertion and removal during the assembly process of the electronic device and after the assembly is completed.
  • the device to be dissipated may be a packaged chip.
  • the elastic heat-conducting member 300 can provide a floating characteristic, it can absorb the tolerance from the device or module to be dissipated, so as to achieve the effect of compatibility.
  • the thermal bridge further includes at least one positioning guide member 400 , and each positioning guide member 400 corresponds to a positioning guide hole 500 (shown in FIG. 4 b ).
  • One end of the positioning guide member 400 is fixed on one of the first thermally conductive block body 110 and the second thermally conductive block body 210 , and a positioning guide is formed on the other of the first thermally conductive block body 110 and the second thermally conductive block body 210 .
  • the other end of the positioning guide 400 passes through the positioning guide hole 500 corresponding to the positioning guide 400 , and the positioning guide 400 can reciprocate along the axial direction of the positioning guide hole 500 .
  • the moving direction of the second heat-conducting block can be restricted, and the second heat-conducting block 200 will not be shaken when the elastic heat-conducting member 300 pushes the second heat-conducting block 200, thereby preventing the second heat-conducting block 200 from shaking. It can avoid damage to the electrical module and improve the service life of the electronic equipment.
  • the positioning guide member 400 is fixed on the first heat conducting block 100 , and the positioning guide hole 500 is provided on the second heat conducting block 200 .
  • the present disclosure is not limited to this, and the positioning guide member 400 may also be fixed on the second heat conducting block 200 , and the positioning guide hole 500 may be provided on the first heat conducting block 100 .
  • the first thermally conductive block body 110 and the second thermally conductive block body 210 are both rectangular plates.
  • the thermal bridge includes four positioning guides 400 , and the four positioning guides are respectively arranged at the four corners of the rectangle.
  • the delivery positioning guide 400 may be fixed on one of the first heat conducting block body 110 and the second heat conducting block body 210 by means of screw connection.
  • the positioning guide 400 includes a connecting rod 430 and a threaded portion 410 located at one end of the connecting rod 430. The other end of the connecting rod 430 is inserted into the positioning guide hole, and the threaded portion 410 is formed with an external thread.
  • One of the thermally conductive block body 110 and the second thermally conductive block body 210 that is fixedly connected with the positioning guide 400 is formed with a threaded hole (in the embodiment shown in FIG. 4a, the threaded hole 130 is formed in the first thermally conductive block body 110), the threaded portion 410 is threadedly engaged with the threaded hole.
  • the positioning guide 400 may further include a first limiting member 420 , and the first limiting member 420 is formed on the positioning guide 400 .
  • the end opposite to the threaded portion 410, and the first limiting member 420 is located at the end of the positioning guide hole away from the threaded portion, the maximum distance between the side surface of the first limiting member and the axis of the positioning guide hole larger than the radius of the positioning guide hole.
  • a receiving groove A is also formed on the outer surface of one of the first heat conducting block body and the second heat conducting block body where the positioning guide holes are formed, and the positioning guide holes The opening is located on the bottom wall of the accommodating groove, and the first limiting member 420 is located in the accommodating groove.
  • the radius of the first limiting member 420 is larger than the radius of the positioning guide hole. Therefore, when the second heat conducting block 200 moves upward, it can only move to the first limiting member 420 and the first limiting member 420 . The position where the end faces of the thermally conductive block body are in contact.
  • the positioning guide member 400 further includes a second limiting member 440, the second limiting member is located between the threaded portion and the first limiting member.
  • the size of the distance H1 and the specific position of the second limiting member 440 on the connecting rod 430 can be determined as follows:
  • the distance H1 can ensure that the elastic heat-conducting member 300 is in a state of no compression or less compression.
  • the second limiting member 440 Since the second limiting member 440 is provided, it can be ensured that the elastic heat-conducting member can rebound well after the external force disappears, and the thermal bridge can be returned to the initial state.
  • the second limiting member 440 is annular, and the second limiting member 440 is disposed around the positioning guide member 400 .
  • a receiving hole 140 is also formed on the surface of the part of the first thermally conductive block 100 where the threaded hole 130 is formed facing the second thermally conductive block 200 , and the second limiting member 440 is disposed in the receiving hole 140 middle.
  • the specific shapes of the first thermally conductive protrusions 120 and the second thermally conductive protrusions 220 are not particularly limited, as long as they can be interdigitated with each other.
  • the first thermally conductive protrusions 120 are strip-shaped pieces, a plurality of first thermally conductive protrusions 120 are parallel to each other, and the second thermally conductive protrusions 120 are parallel to each other.
  • the protrusions 220 are also strip-shaped pieces.
  • the plurality of second heat-conducting protrusions 220 are parallel to each other, and the second heat-conducting protrusions 220 and the first heat-conducting protrusions 120 are parallel to each other.
  • the second thermally conductive protrusions 220 located on the second thermally conductive block body 210 have two specific implementations:
  • the two second heat-conducting protrusions 220 located on the outermost side are a complete strip; in the second type, the second heat-conducting protrusions located in the middle are divided into two sub-protrusions 221 by the gap in the middle thereof.
  • the specific shape of the elastic heat-conducting member 300 is not particularly limited.
  • the elastic heat-conducting member 300 can also be a strip-shaped piece, so that it is convenient for the first thermally conductive protrusions 120 and the second thermally conductive protrusions 220
  • An elastic heat-conducting member 300 is provided on the upper portion.
  • the elastic heat-conducting member 300 includes a plurality of elastic connecting members 320 and a plurality of first arc-shaped elastic sheets 310 , and the plurality of first arc-shaped elastic sheets 310 are connected to each other to form a bar The two ends of the strip-like structure are respectively provided with an elastic connecting piece 320 .
  • the first arc-shaped elastic sheet 310 disposed on the first heat-conducting protrusion 120 protrudes toward the second mounting surface of the second heat-conducting block body 210; and the first arc-shaped elastic sheet 310 disposed on the second heat-conducting protrusion 220 The sheet 310 protrudes toward the first mounting surface of the first thermally conductive block body 110 .
  • the elastic connector 320 may be fixed on the first thermally conductive protrusion 120 by means of rivets, screws, welding, or bonding. Likewise, the elastic connecting member 320 can be fixed on the second thermally conductive protrusion 220 by means of rivets, screws, welding, bonding or the like.
  • the elastic heat-conducting member may be provided only on the first heat-conducting protrusion 120, the elastic heat-conducting member may only be provided on the second heat-conducting protrusion 220, or the first heat-conducting protrusion 120 and the second heat-conducting protrusion may be provided.
  • an elastic heat-conducting member is arranged on 220 .
  • two adjacent first arc-shaped elastic sheets 310 are adjacent to each other through elastic connecting pieces 320 , and the elastic connecting pieces 320 are provided with connections penetrating the elastic connecting pieces 320 in the thickness direction.
  • Through hole 321 As shown in FIG. 5 , the elastic heat-conducting member is fixed on the second heat-conducting protrusion 220 by the rivet 300 a passing through the connecting through hole 321 .
  • a second arc-shaped elastic sheet 330 is connected between two adjacent first arc-shaped elastic members 310 .
  • the second arc-shaped elastic sheet The protruding direction of 330 is opposite to the protruding direction of the first arc-shaped elastic piece 310 .
  • the elastic heat-conducting member is fixed on the second heat-conducting protrusion 220 by rivets passing through the connecting through holes 321 on the elastic connecting member 320 .
  • an auxiliary through hole can also be provided on the second arc-shaped elastic sheet 330, and the second arc-shaped elastic sheet 330 can be fixed on the second thermal conductive protrusion by passing through the auxiliary through hole by rivets. From 220 onwards.
  • the cross section of the connecting through hole 321 in FIG. 6 is circular, and the cross section of the connecting through hole 321 in FIG. 7 is a shape with arcs at both ends and a straight segment in the middle.
  • a plurality of elastic heat-conducting members located on the first heat-conducting block 100 are formed into one body, and/or, a plurality of elastic heat-conducting members located on the second heat-conducting block 100 are formed as a whole one.
  • the same metal plate can be punched to obtain a plurality of elastic heat-conducting members that are integrated.
  • both the first heat conducting block 100 and the second heat conducting block 200 are provided with elastic heat conducting members 300
  • the elastic heat conducting members 300 include elastic The connecting piece 320 and the first arc-shaped elastic piece 310 .
  • the integrated structure formed by the plurality of elastic heat-conducting members 300 further includes a remaining edge 340 located around the first arc-shaped elastic sheet. That is to say, after the metal plate is punched, the remaining edges 340 are not removed, but are fixed on the first heat conducting block 100 and the second heat conducting block 200 together as a part of the integrated structure.
  • both the first heat conducting block 100 and the second heat conducting block 200 are provided with elastic heat conducting members 300 , and, in the embodiment shown in FIG. 12 , the elastic heat conducting members 300 include elastic The connecting piece 320 , the first arc-shaped elastic sheet 310 and the second arc-shaped elastic sheet 330 .
  • any two adjacent elastic heat-conducting members 300 are connected to each other through the integral connecting member 350 .
  • the metal material used to make the elastic thermally conductive member 300 there is no special limitation on the metal material used to make the elastic thermally conductive member 300 .
  • the elastic thermally conductive member 300 can be made of any one of copper, copper, copper alloy, and aluminum alloy.
  • the elastic thermally conductive member 300 is made of a metal material is described above, but the present disclosure is not limited thereto.
  • the elastic heat-conducting member 300 can also be made of a composite heat-conducting material with reinforcing materials such as rubber, glass fiber, polyester, etc. as the matrix.
  • the first thermally conductive block and the second thermally conductive block may be made of the same material as the elastic thermally conductive member 300 .
  • an electronic device including a circuit board, at least one electrical module formed on the circuit board, and a module for accommodating the circuit board and the electrical module A heat dissipation housing, the electronic device further includes at least one thermal bridge, the thermal bridge is the thermal bridge provided in the first aspect of the present disclosure, at least one of the electrical modules is provided with the thermal bridge, and the thermal bridge The first heat dissipation surface of the thermal bridge is in contact with the inner surface of the heat dissipation shell, and the second heat dissipation surface of the thermal bridge is in contact with the electrical module.
  • the elastic thermally conductive member has both elasticity and good thermal conductivity.
  • force can be applied to the second heat-conducting block to deform the elastic heat-conducting member and reduce the distance between the first heat-dissipating surface and the second heat-dissipating surface, thereby completing the assembly smoothly.
  • the second heat-conducting block is pushed to a state of close contact with the heat dissipation shell, and the first heat-conductive block is also pushed to a state of close contact with the electrical module, thereby Ensure good cooling effect.
  • the specific structure of the electronic device is not particularly limited.
  • the electrical module in the electronic device may be any one of a main chip (packaged chip), an optical module, and the like.
  • the electronic device may include the protective casing 30 , the thermal bridge, the main chip 805 , and the circuit board 90 .
  • the main chip 805 is fixed on the circuit board 90 by SMT (Surface Mount Technology), and the thermal bridge is fixed on the heat dissipation boss of the protective casing 30 by means of structural limit and other methods, and then the two are assembled together to the main chip 805 Fire circuit board 90.
  • SMT Surface Mount Technology
  • thermal interface material such as thermally conductive silica gel
  • thermally conductive silica gel can also be added between the contact interfaces of different devices.
  • the electronic device may be an active antenna processing unit (AAU, Active Antenna Unit) or a remote radio unit (RRU, Remote Radio Unit).
  • AAU Active Antenna Unit
  • RRU Remote Radio Unit
  • the electronic device may include a protective housing 30 , a fastener 801 , a thermal bridge, an optical squirrel cage 802 , an optical module 803 , an optical module electrical connector 804 , a circuit board 90.
  • the optical module electrical connector 804 is fixed on the circuit board 90 by SMT (Surface Mount Technology), the optical squirrel cage 802 is crimped to the circuit board 90, the fastener 801 assembles the thermal bridge to the circuit board 90, and the optical The module 803 is plugged and unplugged inside the optical squirrel cage 802 (playing the role of guide rail, electromagnetic radiation protection, etc.) as required.
  • the heat generated by the optical/electrical devices inside the optical module 803 is thermally conducted to the upper surface thereof, and then conducted to the heat dissipation bosses and the heat dissipation teeth of the protective casing 30 through the heat bridge.
  • thermal interface material such as thermally conductive silica gel
  • thermally conductive silica gel can also be added between the contact interfaces of different devices.
  • the thermal bridge tolerance function is divided into two times.
  • the first time is when the protective shell 30 is assembled to realize the processing tolerance and assembly tolerance of the protective shell 30, and the second time is when the optical module 803 is inserted and removed. Tolerance for the thickness of the light module 803 .
  • thermal bridge may also be disposed at other positions on the electronic device that need heat dissipation.

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  • Thermal Sciences (AREA)
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  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种热桥，包括第一导热块（100）、第二导热块（200）和弹性导热件（300），第一导热块包括第一导热块本体（110）和多个第一导热凸起（120），第一导热块本体包括第一散热面和第一安装面，第一导热凸起设置在第一安装面上；第二导热块包括第二导热块本体（210）和多个第二导热凸起（220），第二导热块本体包括第二散热面和第二安装面，第二导热凸起设置在第二安装面上；多个第一导热凸起和多个第二导热凸起互相交错设置，第一导热凸起、与该第一导热凸起相邻的第二导热凸起、以及第二安装面形成第一容纳腔，第二导热凸起、与该第二导热凸起相邻的第一导热凸起、以及第一安装面形成第二容纳腔；第一容纳腔和第二容纳腔中的至少一者中设置有弹性导热件。

Description

热桥和电子设备
相关申请的交叉引用
本公开要求在2021年4月19日提交国家知识产权局、申请号为202110418697.4、发明名称为“热桥和电子设备”的中国专利申请的优先权，该申请的全部内容通过引用结合在本公开中。
技术领域
本公开的实施例涉及但不限于电子设备领域，具体地，涉及一种热桥和一种包括所述热桥的电子设备。
背景技术
诸如电容、电阻、集成芯片之类的电气元件通常通过表面贴装技术(SMT，Surface Mounted Technology)固定在印刷电路板上。印刷电路板上还设置有通过插槽或者导轨设置在该印刷电路板上的光模块、输入输出(Input/Output，I/O)模块等功能模块。为了对功能模块进行机械防护、防水、防尘灯，还需将设置有电气元件以及功能模块的印刷电路板设置在保护壳体内。在电气元件以及功能模块的工作过程中会产生热量，如不能及时散热，会影响电气元件以及功能模块的正常工作。
为了解决上述问题，需要设置热传导件。但是，设置了热传导件的电子设备存在着装配困难、散热效果不理想的问题。
发明内容
本公开提供一种热桥和一种包括所述热桥的电子设备。
作为本公开的一个方面，在一个实施例中提供一种热桥，其中，所述热桥包括第一导热块、第二导热块和弹性导热件，
所述第一导热块包括第一导热块本体和多个第一导热凸起，所述第一导热块本体包括相对设置的第一散热面和第一安装面，所述多个第一导热凸起设置在所述第一安装面上，且任意相邻两个所述第一导热凸起之间形成有间隔；
所述第二导热块包括第二导热块本体和多个第二导热凸起，所述第二导热块本体包括相对设置的第二散热面和第二安装面，所述多个第二导热凸起设置在所述第二安装面上，且任意相邻两个所述第二导热凸起之间形成有间隔；
所述第一导热块本体的所述第一安装面和所述第二导热块本体的所述第二安装面相对设置，所述多个第一导热凸起和所述多个第二导热凸起互相交错设置，并且，所述第一导热凸起的侧面和与该所述第一导热凸起相邻的所述第二导热凸起的侧面相接触，所述第一导热凸起、与所述第一导热凸起相邻的所述第二导热凸起、以及所述第二安装面之间形成第一容纳腔，所述第二导热凸起、与该所述第二导热凸起相邻的所述第一导热凸起、以及所述第一安装面之间形成第二容纳腔；
所述第一容纳腔和所述第二容纳腔中的至少一者中设置有所述弹性导热件，以使得所述第一导热块和所述第二导热块之间能够发生相对移动。
可选地，所述热桥还包括至少一个定位导向件，每个所述定位导向件均对应有定位导向孔；
所述定位导向件的一端固定在所述第一导热块本体和所述第二导热块本体中的一者上，所述第一导热块本体和所述第二导热块本体中的另一者上形成与所述定位导向件相对应的所述定位导向孔，所述定位导向件的另一端穿过与该所述定位导向件相对应的所述定位导向孔，且所述定位导向件能够沿所述定位导向孔的轴向往复移动。
可选地，所述定位导向件包括连接杆和位于所述连接杆一端的螺纹部，所述连接杆的另一端插入所述定位导向孔中，所述螺纹部上形成有外螺纹，所述第一导热块本体和所述第二导热块本体中与所述定位导向件固定相连的一者上形成有螺纹孔，所述螺纹部与所述螺纹孔螺纹配合。
可选地，所述定位导向件还包括第一限位件，所述第一限位件形成在所述连接杆的另一端，且所述第一限位件位于所述定位导向孔背离所述螺纹部的一端，所述第一限位件的侧面与所述定位导向孔的轴线之间的最大距离大于所述定位导向孔的半径；
所述第一导热块本体和所述第二导热块本体中形成所述定位导向孔的一者的外表面上还形成有容纳槽，所述定位导向孔的开口位于所述容纳槽的底壁上，且所述第一限位件位于所述容纳槽中。
可选地，所述定位导向件还包括设置在所述连接杆外表面上的第二限位件，所述第二限位件位于所述螺纹部和所述第一限位件之间。
可选地，所述第二限位件的位置设置为能够使得所述弹性导热件处于未变形状态。
可选地，所述第一导热凸起为条形件，所述多个第一导热凸起互相平行；
所述第二导热凸起为条形件，所述多个第二导热凸起互相平行，且所述第二导热凸起与所述第一导热凸起互相平行。
可选地，所述弹性导热件为条形件，所述弹性导热件包括多个弹性连接件和多个第一弧形弹性片，所述多个第一弧形弹性片互相连接形成条状结构，所述条状结构的两端分别设置有一个所述弹性连接件；
所述第一导热凸起的朝向所述第二导热块本体的端面上设置有所述弹性导热件，设置在所述第一导热凸起上的所述弹性导热件通过该所述弹性导热件的所述弹性连接件与所述第一导热凸起的朝向所述第二导热块本体的端面相连，并且，设置在所述第一导热凸起上的所述弹性导热件的所述第一弧形弹性片朝向所述第二导热块本体的所述第二安装面凸起；和/或
所述第二导热凸起的朝向所述第一导热块本体的端面上设置有所述弹性导热件，设置在所述第二导热凸起上的所述弹性导热件通过该所述弹性导热件的所述弹性连接件与所述第二导热凸起的朝向所述第一导热块本体的端面相连，并且，设置在所述第二导热凸起上的所述弹性导热件的 第一弧形弹性片朝向所述第一导热块本体的所述第一安装面凸起。
可选地，对于同一个所述弹性导热件，相邻两个所述第一弧形弹性片之间连接有所述弹性连接件。
可选地，对于同一个所述弹性导热件，相邻两个所述第一弧形弹性片之间连接有第二弧形弹性片，所述第二弧形弹性片的凸起方向与所述第一弧形弹性片的凸起方向相反。
可选地，位于所述第一导热块上的多个所述弹性导热件形成为一体，和/或，位于所述第二导热块上的多个所述弹性导热件形成为一体。
作为本公开的第二个方面，在一个实施例中提供一种电子设备，所述电子设备包括电路板、形成在所述电路板上的至少一个电模块、以及用于容纳所述电路板和所述电模块的散热壳体，其中，所述电子设备还包括至少一个热桥，所述热桥为本公开第一个方面所提供的热桥，至少一个所述电模块上设置有所述热桥，所述热桥的所述第一散热面与所述散热壳体的内表面相接触，所述热桥的所述第二散热面与所述电模块相接触。
根据本公开的实施例，弹性导热件既具有弹性、又具有良好的热传导性能。在对所述电子设备进行整机装配时，可以向第二导热块施加力，使得弹性导热件变形、并使得第一散热面和第二散热面之间的距离减小，顺利完成装配。装配结束后，在弹性导热件的弹性恢复力的作用下，第二导热块被推至与散热壳体紧密接触的状态，并且第一导热块也被推至与电模块紧密接触的状态，从而确保良好的散热效果。
附图说明
图1是设置有热传导件的电子设备的示意图；
图2是本公开的实施例所提供的热桥的示意图；
图3是本公开的实施例所提供的热桥的局部剖视图；
图4a是本公开的实施例所提供的热桥中的第一导热块的示意图；
图4b是本公开的实施例所提供的热桥中的第二导热块的示意图；
图4c是本公开实施例所提供的热桥的散热示意图；
图5是本公开的实施例所提供的热桥的立体结构示意图；
图6是图5中所示的热桥中，弹性导热件的剖视示意图；
图7是本公开的另一个实施例所提供的热桥的立体结构示意图；
图8是图7中所示的热桥中，弹性导热件的剖视示意图；
图9是本公开的另一个实施例所提供的热桥的立体结构示意图；
图10是图9中所示的热桥中，弹性导热件的剖视示意图；
图11是图10中所示的弹性导热件的俯视示意图；
图12是本公开的另一个实施例所提供的热桥的立体结构示意图；
图13是图12中所示的弹性导热件的俯视示意图；
图14是本公开的实施例所提供的热桥用于主芯片时的立体结构示意图；
图15是本公开的实施例所提供的热桥用于主芯片时的分解结构示意图；
图16是本公开的实施例所提供的热桥用于主芯片时的剖视示意图
图17是本公开的实施例所提供的热桥用于光模块时的立体结构示意图；
图18是本公开的实施例所提供的热桥用于光模块时的分解结构示意图；
图19是本公开的实施例所提供的热桥用于光模块时的剖视示意图。
具体实施方式
为使本领域的技术人员更好地理解本公开的技术方案，下面结合附图对本公开提供热桥和电子设备进行详细描述。
在下文中将参考附图更充分地描述示例实施例，但是所述示例实施例可以以不同形式来体现且不应当被解释为限于本文阐述的实施例。反之，提供这些实施例的目的在于使本公开透彻和完整，并将使本领域技术人员充分理解本公开的范围。
在不冲突的情况下，本公开各实施例及实施例中的各特征可相互组合。
如本文所使用的，术语“和/或”包括一个或多个相关列举条目的任何和所有组合。
本文所使用的术语仅用于描述特定实施例，且不意欲限制本公开。如本文所使用的，单数形式“一个”和“该”也意欲包括复数形式，除非上下文另外清楚指出。还将理解的是，当本说明书中使用术语“包括”和/或“由……制成”时，指定存在所述特征、整体、步骤、操作、元件和/或组件，但不排除存在或添加一个或多个其它特征、整体、步骤、操作、元件、组件和/或其群组。
除非另外限定，否则本文所用的所有术语(包括技术和科学术语)的含义与本领域普通技术人员通常理解的含义相同。还将理解，诸如那些在常用字典中限定的那些术语应当被解释为具有与其在相关技术以及本公开的背景下的含义一致的含义，且将不解释为具有理想化或过度形式上的含义，除非本文明确如此限定。
图1示出一种热传导件。具体地，热传导件10分别与电气元件20和保护壳体30相连，且保护壳体30也具有散热功能。热传导件10可以将电气元件20产生的热量传导至保护壳体30，并由保护壳体发散至外界。
作为本公开的一个方面，在一个实施例中提供一种热桥。如图2和图3所示，所述热桥包括第一导热块100、第二导热块200和弹性导热件300。
如图4a所示，第一导热块100包括第一导热块本体110和多个第一导热凸起120，第一导热块本体100包括相对设置的第一散热面(图4a中的上表面)和第一安装面(图4a中的下表面)，多个第一导热凸起120设置在所述第一安装面上，且任意相邻两个第一导热凸起120之间形成有间隔。
如图4b所示，第二导热块200包括第二导热块本体210和多个第二 导热凸起220，第二导热块本体210包括相对设置的第二散热面(图4b中的下表面)和第二安装面(图4b中的上表面)，多个第二导热凸起220设置在所述第二安装面上，且任意相邻两个第二导热凸起220之间形成有间隔。
如图2和图3所示，第一导热块本体110的第一安装面和第二导热块本体210的第二安装面相对设置，多个第一导热凸起120和多个第二导热凸起220互相交错设置。第一导热凸起120的侧面和与该第一导热凸起120相邻的第二导热凸起220的侧面相接触，第一导热凸起120、与该第一导热凸起120相邻的第二导热凸起220、以及所述第二安装面之间形成第一容纳腔，并且第二导热凸起220、与该第二导热凸起220相邻的第一导热凸起120、以及所述第一安装面之间形成第二容纳腔。
所述第一容纳腔和所述第二容纳腔中的至少一者中设置有弹性导热件300，以使得所述第一导热块和所述第二导热块之间能够发生相对移动。
所述热桥用于电子设备中，通常，电子设备包括电路板、形成在所述电路板上的至少一个电模块、以及用于容纳所述电路板和所述电模块的散热壳体。将所述热桥的第一散热面与所述散热壳体的内表面接触、将所述热桥的第二散热面与所述散热壳体的热模块相接触。
在本实施例所述热桥中，第一导热块100和第二导热块200之间能够发生相对移动的意思是，第一导热块100的第一散热面和第二导热块200的第二散热面之间的距离可以互相靠近、或者互相远离。
在本公开中，弹性导热件300既具有弹性、又具有良好的热传导性能。在对所述电子设备进行整机装配时，可以向第二导热块100施加力，使得弹性导热件300变形、并使得第一散热面和第二散热面之间的距离减小，顺利完成装配。装配结束后，在弹性导热件300的弹性恢复力的作用下，第二导热块200被推至与散热壳体紧密接触的状态，并且第一导热块100也被推至与电模块紧密接触的状态，从而确保良好的散热效果。
图4c中带箭头的直线所示出的是散热路径示意图。电模块发热后，首先通过第二散热面将热量传导至第二导热块本体，并由第二导热块本体分 别传递至弹性导热件300和第二导热凸起220。第二导热凸起220的侧面与第一导热凸起120的侧面相贴合，从而将热量传递至第一导热凸起120。第一导热凸起120再将热量传递至第一导热块本体110，并最后由第二导热块本体210传递至散热壳体。由于第一导热凸起120和第二导热凸起220相贴合，与弹性导热件300共同实现导热，降低了所述热桥的热阻，进一步提高了散热效果。
当热桥处于受压状态时，第一导热凸起120和第二导热凸起220的接触面增加，弹性导热件300的热阻降低，热桥的导热性能提高。
对于电子设备而言，各个部件(包括印刷电路板、电模块、散热壳体)的加工都存在误差，整机装配也存在公差。由于第一散热面和第二散热面之间的距离可变，实现了高容差，可以满足装配需求。
此外，在本公开中，第一导热块上的第一导热凸起、以及第二导热块上的第二导热凸起呈交错状，便于在插拔的应用场景中进行插拔拆装。
在本公开中，对所述热桥的具体应用场景不做特殊的限定。由于所述热桥具有高导热、和高容差这两个特性，所述热桥尤其适用于如下两种情况：第一种情况、不能收到过大压力作用的电器元部件、以及存在插拔应用场景的模块；第二种情况，待散热的器件或者模块自身尺寸公差较大、或者需要兼容多种规格且尺寸波动较大的情况。
针对第一种情况，本公开所提供的热桥中设置的弹性导热件300可以吸收外界施加的压力，可以解决在电子设备装配过程中、以及装配结束后的应力过大、插拔困难的问题。在第一种情况中，待散热的器件可以是封装芯片。
针对第二种情况，由于弹性导热件300可以提供浮动特时能够，可以吸收来自待散热的器件或者模块的公差，从而达到兼容涉及的效果。
在图2至图4中所示的实施方式中，所述热桥还包括至少一个定位导向件400，每个定位导向件400均对应有定位导向孔500(在图4b中示出)。
定位导向件400的一端固定在第一导热块本体110和第二导热块本体210中的一者上，第一导热块本体110和第二导热块本体210中的另一者 上形成与定位导向件400相对应的定位导向孔500，定位导向件400的另一端穿过与该定位导向件400相对应的定位导向孔500，且定位导向件400能够沿定位导向孔500的轴向往复移动。
通过设置定位导向件400和与之配合的定位导向孔500可以限制第二导热块的移动方向、防止在弹性导热件300在推动第二导热块200时第二导热块200不会发生晃动，从而可以避免损坏电模块，提高电子设备的使用寿命。
在图3中所示的实施方式中，定位导向件400固定在第一导热块100上，定位导向孔500设置在第二导热块200上。当然，本公开并不限于此，也可以将定位导向件400固定在第二导热块200上、而将定位导向孔500设置在第一导热块100上。
在图5、图7、图9以及图12中所示的具体实施方式中，第一导热块本体110和第二导热块本体210均为矩形板。，相应地，所述热桥包括四个定位导向件400，该四个定位导向件分别设置在矩形的四个角部。
在本公开中，对如何固定设置定位导向件400不做特殊的限定。为了便于拆卸和维护，可以通过螺纹连接的方式将递给定位导向件400固定在第一导热块本体110和第二导热块本体210中的一者上。具体地，如图3所示，定位导向件400包括连接杆430和位于连接杆430一端的螺纹部410，连接杆430的另一端插入定位导向孔中，螺纹部410上形成有外螺纹，第一导热块本体110和第二导热块本体210中与定位导向件400固定相连的一者上形成有螺纹孔(在图4a中所示的实施方式中，螺纹孔130形成在第一导热块本体110上)，螺纹部410与所述螺纹孔螺纹配合。
为了限制第一导热块100和第二导热块200之间相对移动的距离，可选地，定位导向件400还可以包括第一限位件420，第一限位件420形成在定位导向件400上与螺纹部410相对的一端，且第一限位件420位于定位导向孔背离所述螺纹部的一端，所述第一限位件的侧面与所述定位导向孔的轴线之间的最大距离大于所述定位导向孔的半径。
为了设置第一限位件420，所述第一导热块本体和所述第二导热块本 体中形成所述定位导向孔的一者的外表面上还形成有容纳槽A，所述定位导向孔的开口位于所述容纳槽的底壁上，第一限位件420位于所述容纳槽中。
以图3中的实施方式为例，第一限位件420的半径尺寸大于定位导向孔的半径，因此，第二导热块200向上移动时，只能移动至第一限位件420与第一导热块本体的端面相接触的位置。
为了确保在无外力的情况下第一散热面和第二散热面之间的距离H1为定值，可选地，定位导向件400还包括第二限位件440，所述第二限位件位于所述螺纹部和所述第一限位件之间。
可以按照如下方式确定距离H1的大小、以及第二限位件440在连接杆430上的具体位置：
距离H1可以确保弹性导热件300处于不受压、或者受压较小的状态。
由于设置了第二限位件440，可以确保外力消失后弹性导热件可以很好的回弹、并使得热桥回到初始状态。
作为一种可选实施方式，第二限位件440为环状，且该第二限位件440环绕定位导向件400设置。
在图4a中所示的实施方式中，第一导热块100的形成螺纹孔130的部分朝向第二导热块200的表面上还形成有容纳孔140，第二限位件440设置在容纳孔140中。
在本公开中，对第一导热凸起120、以及第二导热凸起220的具体形状不做特殊的限定，只要二者能够互相交错啮合即可。作为一种可选实施方式，如图5、图7、图9、图12所示，所述第一导热凸起120为条形件，多个第一导热凸起120互相平行，第二导热凸起220也为条形件，多个第二导热凸起220互相平行，且第二导热凸起220与第一导热凸起120互相平行。
在图9中所示的实施方式中，位于第二导热块本体210上的第二导热凸起220具有两种具体实施方式：
第一种，位于最外侧的两个第二导热凸起220为一个完整的条形件；第二种，位于中间的第二导热凸起被其中部的缺口划分为两个子凸起221。
在本公开中，对弹性导热件300的具体形状也不做特殊的限定。在第一导热凸起120和第二导热凸起220均为条形件的基础上，弹性导热件300也可以为条形件，从而便于在第一导热凸起120和第二导热凸起220上设置弹性导热件300。
在图5至图6中所示的具体实施方式中，弹性导热件300包括多个弹性连接件320和多个第一弧形弹性片310，多个第一弧形弹性片310互相连接形成条状结构，并且所述条状结构的两端分别设置有一个弹性连接件320。
其中，设置在第一导热凸起120上的第一弧形弹性片310朝向第二导热块本体210的第二安装面凸起；而设置在第二导热凸起220上的第一弧形弹性片310朝向第一导热块本体110的第一安装面凸起。
可以通过铆钉、螺钉、或者焊接、粘结等方式将弹性连接件320固定在第一导热凸起120上。同样地，可以通过铆钉、螺钉、或者焊接、粘结等方式将弹性连接件320固定在第二导热凸220起上。
也就是说，可以只在第一导热凸120起上设置弹性导热件、也可以只在第二导热凸起220上设置弹性导热件，还可以在第一导热凸起120和第二导热凸起220上同时设置弹性导热件。
在图6中所示的实施方式中，相邻两个第一弧形弹性片310通过弹性连接件320相邻，并且在弹性连接件320上设置有沿厚度方向贯穿该弹性连接件320的连接通孔321。如图5所示，利用穿过该连接通孔321的铆钉300a将弹性导热件固定在第二导热凸起220上。
在图7和图8中所示的实施方式中，对于同一个弹性导热件，相邻两个第一弧形弹性件310之间连接有第二弧形弹性片330，第二弧形弹性片330的凸起方向与第一弧形弹性片310的凸起方向相反。
同样地，通过贯穿弹性连接件320上的连接通孔321的铆钉将弹性导热件固定在第二导热凸起220上。为了增加连接的稳定性，可选地，也可 以在第二弧形弹性片330上设置辅助通孔，并通过铆钉穿过该辅助通孔将第二弧形弹性片330固定在第二导热凸起220上。
图6中的连接通孔321的横截面为圆形，图7中的连接通孔321的横截面为两端为圆弧、中间为直线段的形状。
为了便于制造和安装，作为一种可选实施方式，位于第一导热块100上的多个弹性导热件形成为一体，和/或，位于第二导热块100上的多个弹性导热件形成为一体。
可以对同一金属板进行冲压，获得形成为一体的多个弹性导热件。
在图9中所示的实施方式中，第一导热块100和第二导热块200上均设置有弹性导热件300，并且，在图9中所示的实施方式中，弹性导热件300包括弹性连接件320和第一弧形弹性片310。如图10和图11中所示，多个弹性导热件300形成的一体结构还包括位于第一弧形弹性片周围剩余边340。也就是说，在金属板上完成冲压后，不去除剩余边340，将其作为一体结构的一部分，一起固定在第一导热块100以及第二导热块200上。
在图12中所示的实施方式中，第一导热块100和第二导热块200上均设置有弹性导热件300，并且，在图12中所示的实施方式中，弹性导热件300包括弹性连接件320、第一弧形弹性片310和第二弧形弹性片330。
针对第一导热块100和第二导热块200任意一者上的多个弹性导热件300而言，如图11、13中所示，多个弹性导热件通过一体连接件350连接成一体。也就是说，任意相邻两弹性导热件300之间通过一体连接件350互相连接。
在本公开中，对制成弹性导热件300的金属材料不做特殊的限定。例如，可以利用铜、率、铜合金、铝合金中的任意一者制成弹性导热件300。
上文中描述了利用金属材料制成弹性导热件300的实施方式，但是，本公开并不限于此。在一些实施方式中，还可以利用橡胶、玻璃纤维、聚酯等增强材料为基体的复合导热材料制成弹性导热件300。
在本公开中，可以利用与弹性导热件300相同的材料制成第一导热块和第二导热块。
作为本公开的第二个方面，提供一种电子设备，所述电子设备包括电路板、形成在所述电路板上的至少一个电模块、以及用于容纳所述电路板和所述电模块的散热壳体，所述电子设备还包括至少一个热桥，所述热桥为本公开第一个方面所提供的热桥，至少一个所述电模块上设置有所述热桥，所述热桥的第一散热面与所述散热壳体的内表面相接触，所述热桥的第二散热面与所述电模块相接触。
如上文中所述，弹性导热件既具有弹性、又具有良好的热传导性能。在对所述电子设备进行整机装配时，可以向第二导热块施加力，使得弹性导热件变形、并使得第一散热面和第二散热面之间的距离减小，顺利完成装配。装配结束后，在弹性导热件的弹性恢复力的作用下，第二导热块被推至与散热壳体紧密接触的状态，并且第一导热块也被推至与电模块紧密接触的状态，从而确保良好的散热效果。
在本公开中，对所述电子设备的具体结构不做特殊的限定。
作为一种实施方式，所述电子设备中的电模块可以是主芯片(封装芯片)、光模块等中的任意一者。
例如，当所述电模块为主芯片时，在图14至图16中所示的实施方式中，电子设备可包括保护壳体30、热桥、主芯片805、线路板90。
其中，主芯片805通过SMT(表面组装技术)方式固定在线路板90上，而热桥通过结构限位等方式固定在保护壳体30的散热凸台上，再将两者一起组装到主芯片805火线路板90上。
其中，为追求更好的导热效果，还可以在不同器件的接触界面之间增加热界面材料(如导热硅胶)。
当所述电模块为光模块时，所述电子设备可以是有源天线处理单元(AAU，Active Antenna Unit)或者射频拉远单元(RRU，Remote Radio Unit)。例如，在图17至图19中所示的实施方式中，电子设备可包括保护壳体30、扣具801、热桥、光鼠笼802，光模块803，光模块电连接器804、线路板90。
其中，光模块电连接器804通过SMT(表面组装技术)方式固定在线路板90上，光鼠笼802插针压接到线路板90，扣具801将热桥组装到线路板90上，光模块803根据需要在光鼠笼802(起到导轨、电磁辐射防护等作用)内部进行插拔操作。由此，光模块803内部的光/电器件产生的热量热传导到其上表面，再通过热桥传导到保护壳体30的散热凸台、散热齿上。
其中，为追求更好的导热效果，还可以在不同器件的接触界面之间增加热界面材料(如导热硅胶)。
其中，热桥容差作用分为二次，第一次是组装保护壳体30的时候，实现对保护壳体30的加工公差、装配公差，第二次是光模块803插拔操作的时候实现对光模块803厚度的容差。
当然，本公开并不限于此，也可以将所述热桥设置在所述电子设备上其他需要散热的位置。
一般说明性含义，并且不用于限制的目的。在一些实例中，对本领域技术人员显而易见的是，除非另外明确指出，否则可单独使用与特定实施例相结合描述的特征、特性和/或元素，或可与其它实施例相结合描述的特征、特性和/或元件组合使用。因此，本领域技术人员将理解，在不脱离由所附的权利要求阐明的本公开的范围的情况下，可进行各种形式和细节上的改变。

Claims (12)

  1. 一种热桥，所述热桥包括第一导热块、第二导热块和弹性导热件，其中
    所述第一导热块包括第一导热块本体和多个第一导热凸起，所述第一导热块本体包括相对设置的第一散热面和第一安装面，所述多个第一导热凸起设置在所述第一安装面上，且任意相邻两个所述第一导热凸起之间形成有间隔；
    所述第二导热块包括第二导热块本体和多个第二导热凸起，所述第二导热块本体包括相对设置的第二散热面和第二安装面，所述多个第二导热凸起设置在所述第二安装面上，且任意相邻两个所述第二导热凸起之间形成有间隔；
    所述第一导热块本体的所述第一安装面与所述第二导热块本体的所述第二安装面相对设置，所述多个第一导热凸起与所述多个第二导热凸起互相交错设置，所述第一导热凸起的侧面和与该所述第一导热凸起相邻的所述第二导热凸起的侧面相接触，所述第一导热凸起、与所述第一导热凸起相邻的所述第二导热凸起、以及所述第二安装面之间形成第一容纳腔，并且所述第二导热凸起、与该所述第二导热凸起相邻的所述第一导热凸起、以及所述第一安装面之间形成第二容纳腔；
    所述第一容纳腔和所述第二容纳腔中的至少一者中设置有所述弹性导热件，以使得所述第一导热块和所述第二导热块之间能够发生相对移动。
  2. 根据权利要求1所述的热桥，其中，所述热桥还包括至少一个定位导向件，每个所述定位导向件均对应有定位导向孔；
    所述定位导向件的一端固定在所述第一导热块本体和所述第二导热块本体中的一者上，所述第一导热块本体和所述第二导热块本体中的另一者上形成与所述定位导向件相对应的所述定位导向孔，所述定位导向件的另一端穿过与该所述定位导向件相对应的所述定位导向孔，且所述定位导向件能够沿所述定位导向孔的轴向往复移动。
  3. 根据权利要求2所述的热桥，其中，所述定位导向件包括连接杆和位于所述连接杆一端的螺纹部，所述连接杆的另一端插入所述定位导向孔中，所述螺纹部上形成有外螺纹，所述第一导热块本体和所述第二导热块本体中与所述定位导向件固定相连的一者上形成有螺纹孔，所述螺纹部与所述螺纹孔螺纹配合。
  4. 根据权利要求3所述的热桥，其中，所述定位导向件还包括第一限位件，所述第一限位件形成在所述连接杆的另一端，且所述第一限位件位于所述定位导向孔背离所述螺纹部的一端，所述第一限位件的侧面与所述定位导向孔的轴线之间的最大距离大于所述定位导向孔的半径；
    所述第一导热块本体和所述第二导热块本体中形成所述定位导向孔的一者的外表面上还形成有容纳槽，所述定位导向孔的开口位于所述容纳槽的底壁上，且所述第一限位件位于所述容纳槽中。
  5. 根据权利要求4所述的热桥，其中，所述定位导向件还包括设置在所述连接杆外表面上的第二限位件，所述第二限位件位于所述螺纹部和所述第一限位件之间。
  6. 根据权利要求5所述的热桥，其中，所述第二限位件的位置设置为能够使得所述弹性导热件处于未变形状态。
  7. 根据权利要求1至6中任意一项所述的热桥，其中，所述第一导热凸起为条形件，所述多个第一导热凸起互相平行；
    所述第二导热凸起为条形件，所述多个第二导热凸起互相平行，且所述第二导热凸起与所述第一导热凸起互相平行。
  8. 根据权利要求7所述的热桥，其中，所述弹性导热件为条形件，所述弹性导热件包括多个弹性连接件和多个第一弧形弹性片，所述多个第一弧形弹性片互相连接形成条状结构，所述条状结构的两端分别设置有一个所述弹性连接件；
    所述第一导热凸起的朝向所述第二导热块本体的端面上设置有所述弹性导热件，设置在所述第一导热凸起上的所述弹性导热件通过该所述弹性导热件的所述弹性连接件与所述第一导热凸起的朝向所述第二导热块本体的端面相连，并且，设置在所述第一导热凸起上的所述弹性导热件的所述第一弧形弹性片朝向所述第二导热块本体的所述第二安装面凸起；和/或
    所述第二导热凸起的朝向所述第一导热块本体的端面上设置有所述弹性导热件，设置在所述第二导热凸起上的所述弹性导热件通过该所述弹性导热件的所述弹性连接件与所述第二导热凸起的朝向所述第一导热块本体的端面相连，并且，设置在所述第二导热凸起上的所述弹性导热件的所述第一弧形弹性片朝向所述第一导热块本体的所述第一安装面凸起。
  9. 根据权利要求8所述的热桥，其中，对于同一个所述弹性导热件，相邻两个所述第一弧形弹性片之间连接有所述弹性连接件。
  10. 根据权利要求8所述的热桥，其中，对于同一个所述弹性导热件，相邻两个所述第一弧形弹性片之间连接有第二弧形弹性片，所述第二弧形弹性片的凸起方向与所述第一弧形弹性片的凸起方向相反。
  11. 根据权利要求8所述的热桥，其中，位于所述第一导热块上的多个所述弹性导热件形成为一体，和/或，位于所述第二导热块上的多个所述弹性导热件形成为一体。
  12. 一种电子设备，所述电子设备包括电路板、形成在所述电路板上的至少一个电模块、以及用于容纳所述电路板和所述电模块的散热壳体，其中，
    所述电子设备还包括至少一个热桥，所述热桥为权利要求1至11中任意一项所述的热桥，所述至少一个电模块上设置有所述热桥，所述热桥的所述第一散热面与所述散热壳体的内表面相接触，所述热桥的所述第二散热面与所述电模块相接触。
PCT/CN2022/080663 2021-04-19 2022-03-14 热桥和电子设备 WO2022222642A1 (zh)

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CN1357740A (zh) * 2000-12-06 2002-07-10 台达电子工业股份有限公司 复合式高密度散热装置及其制作方法
CN102906870A (zh) * 2010-06-18 2013-01-30 夏普株式会社 电子设备的散热结构
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CN109887894A (zh) * 2019-02-28 2019-06-14 北京比特大陆科技有限公司 散热器、电路板和计算设备
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JPH10117077A (ja) * 1996-10-11 1998-05-06 Fujikura Ltd ヒートシンク
CN1357740A (zh) * 2000-12-06 2002-07-10 台达电子工业股份有限公司 复合式高密度散热装置及其制作方法
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