WO2022220622A1

WO2022220622A1 - Electronic apparatus comprising structure connecting frame and plate

Info

Publication number: WO2022220622A1
Application number: PCT/KR2022/005432
Authority: WO
Inventors: 신광하; 박정규; 신윤성; 조영경; 윤병욱
Original assignee: 삼성전자 주식회사
Priority date: 2021-04-14
Filing date: 2022-04-14
Publication date: 2022-10-20
Also published as: KR20220142173A

Abstract

An electronic device according to various embodiments of the present disclosure may comprise a metal frame forming at least a part of the side surface of the electronic apparatus, and a metal plate arranged in the electronic apparatus. The metal frame may include a first connecting portion which extends from a first point of the metal frame, and the metal plate may include a second connecting portion corresponding to the first connecting portion. The second connecting portion may come into contact with the first connecting portion along the edge of the first connecting portion, and the metal frame and the metal plate can be coupled via a welding operation carried out along at least one edge of the first connecting portion.

Description

Electronic device including a structure connecting a frame and a plate

Embodiments disclosed in this document relate to an electronic device including a structure connecting a frame and a plate.

The electronic device may include a frame structure that forms a side surface of the electronic device. Also, the electronic device may include a plate for supporting various electronic components (eg, a battery) therein. During the assembly process of the electronic device, the frame structure and the plate may be coupled, and the frame structure and the plate may be coupled through welding.

On the other hand, pores may occur when welding metals, and when two different metals are welded, the number and size of pores may vary depending on the silicon (Si) content of the metal to be welded. For example, in the case of welding to the first metal having a relatively high silicon content in order to combine the first metal and the second metal, compared to the case of welding to the second metal having a relatively low silicon content, the amount of pores generated They can be numerous and large in size.

Therefore, when welding a plate having a relatively high silicon content for bonding between the frame structure and the plate, more pores may be generated than when welding the frame structure, and the size of the generated pores may be large. Cracks may occur in the frame structure and the welded portion between the plates due to the generated pores. When there is an external shock or shaking to the electronic device, the frame structure and the junction between the plates may be separated due to the crack, and the frame structure and the coupling between the plates may be broken. Also, the electrical connection between the frame structure and the plate may be blocked.

Various embodiments disclosed in this document provide a structure and method capable of increasing the bonding strength between a frame and a plate of an electronic device.

According to various embodiments of the present disclosure, an electronic device may include a metal frame forming at least a portion of a side surface of the electronic device and a metal plate disposed in the electronic device, wherein the metal frame is a first part of the metal frame. may include a first connection portion extending from a point, the metal plate may include a second connection portion corresponding to the first connection portion, wherein the second connection portion is the first connection portion along an edge of the first connection portion may be in contact with, and the metal frame and the metal plate may be coupled to each other by welding performed along at least one edge of the first connection part.

According to various embodiments of the present disclosure, an electronic device may include a metal frame forming at least a portion of a side surface of the electronic device and a metal plate disposed in the electronic device, wherein the metal frame is a first part of the metal frame. may include a first connecting portion extending from a point by a first length, the first connecting portion may have a first width shorter than the first length, and the metal plate may include a second connecting portion corresponding to the first connecting portion. may include, and the second connection part may be in contact with the first connection part along an edge of the first connection part, and the metal frame and the metal plate may be coupled by welding to the edge of the first connection part. The silicon content of the metal frame may be lower than the silicon content of the metal plate.

According to various embodiments disclosed in this document, it is possible to increase the bonding strength of the bond between the frame structure and the metal plate by reducing the number and size of pores generated through welding to the frame structure having a lower silicon content compared to the metal plate. .

Also, according to various embodiments, the bonding strength of the bond between the frame structure and the metal plate may be increased through line welding along the edge of the first connection part of the frame structure.

Also, according to various embodiments, the bonding strength may be increased through double line welding along the first edge and the second edge of the first connection part of the frame structure.

In addition, various effects directly or indirectly identified through this document may be provided.

1 is a block diagram of an electronic device in a network environment, according to various embodiments of the present disclosure;

2 is a view illustrating a front and a side view of an electronic device according to an exemplary embodiment.

3 is an exploded perspective view of an electronic device according to an exemplary embodiment;

4A is a view illustrating a first connection part and a third connection part and a plate of a frame structure as viewed from a rear side of an electronic device according to an exemplary embodiment.

4B is a view comparing the width length of the first connection part and the third connection part and the length in the extending direction, according to an exemplary embodiment.

4C is a view illustrating a second connection part and a fourth connection part of a plate viewed from the rear side of the electronic device according to an exemplary embodiment.

5A is a view of the first connection part and the second connection part viewed from the front of the electronic device when the first connection part is accommodated in the second connection part, according to an exemplary embodiment;

FIG. 5B is a view of the first connection part and the second connection part when the first connection part is accommodated in the second connection part, as viewed from the rear side of the electronic device, according to an exemplary embodiment;

6 is a view illustrating a welding part between the first connection part and the second connection part by welding to the first connection part according to an embodiment.

7 is a view showing an injection member is added in the embodiment of FIG. 6 according to an embodiment.

8 is a view illustrating a flow chart of processing and coupling of a frame structure and a plate according to an embodiment.

9 is a diagram illustrating a specific example of a frame structure and a plate corresponding to the flowchart of FIG. 8 according to an embodiment.

10 is a view for comparing the number and size of pores generated according to the silicon content of the metal to be welded according to an embodiment.

11 is a diagram for comparing point welding and line welding according to an exemplary embodiment.

12 is a view for explaining an electrical connection relationship between a first frame and a plate by welding according to an embodiment.

13 is a graph illustrating antenna radiation performance according to whether a frame structure and a plate are coupled when power is supplied to a point of the frame structure according to an embodiment.

Hereinafter, various embodiments of the present invention will be described with reference to the accompanying drawings. However, this is not intended to limit the present invention to specific embodiments, and it should be understood that various modifications, equivalents, or alternatives of the embodiments of the present invention are included.

1 is a block diagram of an electronic device 101 in a network environment 100, according to various embodiments. Referring to FIG. 1 , in a network environment 100 , an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or a second network 199 . It may communicate with at least one of the electronic device 104 and the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 . According to an embodiment, the electronic device 101 includes a processor 120 , a memory 130 , an input module 150 , a sound output module 155 , a display module 160 , an audio module 170 , and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or an antenna module 197 . In some embodiments, at least one of these components (eg, the connection terminal 178 ) may be omitted or one or more other components may be added to the electronic device 101 . In some embodiments, some of these components (eg, sensor module 176 , camera module 180 , or antenna module 197 ) are integrated into one component (eg, display module 160 ). can be

The processor 120, for example, executes software (eg, a program 140) to execute at least one other component (eg, a hardware or software component) of the electronic device 101 connected to the processor 120. It can control and perform various data processing or operations. According to one embodiment, as at least part of data processing or operation, the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190 ) to the volatile memory 132 . may be stored in , process commands or data stored in the volatile memory 132 , and store the result data in the non-volatile memory 134 . According to an embodiment, the processor 120 is the main processor 121 (eg, a central processing unit or an application processor) or a secondary processor 123 (eg, a graphic processing unit, a neural network processing unit (eg, a graphic processing unit, a neural network processing unit) a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, when the electronic device 101 includes the main processor 121 and the sub-processor 123 , the sub-processor 123 uses less power than the main processor 121 or is set to be specialized for a specified function. can The auxiliary processor 123 may be implemented separately from or as a part of the main processor 121 .

The secondary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or when the main processor 121 is active (eg, executing an application). ), together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states. According to an embodiment, the coprocessor 123 (eg, an image signal processor or a communication processor) may be implemented as part of another functionally related component (eg, the camera module 180 or the communication module 190 ). have. According to an embodiment, the auxiliary processor 123 (eg, a neural network processing device) may include a hardware structure specialized for processing an artificial intelligence model. Artificial intelligence models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself on which the artificial intelligence model is performed, or may be performed through a separate server (eg, the server 108). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but in the above example not limited The artificial intelligence model may include a plurality of artificial neural network layers. Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the above example. The artificial intelligence model may include, in addition to, or alternatively, a software structure in addition to the hardware structure.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176 ) of the electronic device 101 . The data may include, for example, input data or output data for software (eg, the program 140 ) and instructions related thereto. The memory 130 may include a volatile memory 132 or a non-volatile memory 134 .

The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system 142 , middleware 144 , or an application 146 .

The input module 150 may receive a command or data to be used by a component (eg, the processor 120 ) of the electronic device 101 from the outside (eg, a user) of the electronic device 101 . The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).

The sound output module 155 may output a sound signal to the outside of the electronic device 101 . The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from or as part of the speaker.

The display module 160 may visually provide information to the outside (eg, a user) of the electronic device 101 . The display module 160 may include, for example, a control circuit for controlling a display, a hologram device, or a projector and a corresponding device. According to an embodiment, the display module 160 may include a touch sensor configured to sense a touch or a pressure sensor configured to measure the intensity of a force generated by the touch.

The audio module 170 may convert a sound into an electric signal or, conversely, convert an electric signal into a sound. According to an embodiment, the audio module 170 acquires a sound through the input module 150 , or an external electronic device (eg, a sound output module 155 ) connected directly or wirelessly with the electronic device 101 . The electronic device 102) (eg, a speaker or headphones) may output a sound.

The sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the sensed state. can do. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.

The interface 177 may support one or more specified protocols that may be used by the electronic device 101 to directly or wirelessly connect with an external electronic device (eg, the electronic device 102 ). According to an embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102 ). According to an embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 may capture still images and moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 may manage power supplied to the electronic device 101 . According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101 . According to one embodiment, battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

The communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). It can support establishment and communication performance through the established communication channel. The communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication. According to one embodiment, the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : It may include a local area network (LAN) communication module, or a power line communication module). A corresponding communication module among these communication modules is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (eg, legacy It may communicate with the external electronic device 104 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (eg, a telecommunication network such as a LAN or a WAN). These various types of communication modules may be integrated into one component (eg, a single chip) or may be implemented as a plurality of components (eg, multiple chips) separate from each other. The wireless communication module 192 uses subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199 . The electronic device 101 may be identified or authenticated.

The wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, a new radio access technology (NR). NR access technology includes high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency) -latency communications)). The wireless communication module 192 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example. The wireless communication module 192 uses various techniques for securing performance in a high-frequency band, for example, beamforming, massive multiple-input and multiple-output (MIMO), all-dimensional multiplexing. It may support technologies such as full dimensional MIMO (FD-MIMO), an array antenna, analog beam-forming, or a large scale antenna. The wireless communication module 192 may support various requirements defined in the electronic device 101 , an external electronic device (eg, the electronic device 104 ), or a network system (eg, the second network 199 ). According to an embodiment, the wireless communication module 192 may include a peak data rate (eg, 20 Gbps or more) for realizing eMBB, loss coverage (eg, 164 dB or less) for realizing mMTC, or U-plane latency for realizing URLLC ( Example: Downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) can be supported.

The antenna module 197 may transmit or receive a signal or power to the outside (eg, an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern. According to an embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected from the plurality of antennas by, for example, the communication module 190 . can be selected. A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna. According to some embodiments, other components (eg, a radio frequency integrated circuit (RFIC)) other than the radiator may be additionally formed as a part of the antenna module 197 .

According to various embodiments, the antenna module 197 may form a mmWave antenna module. According to one embodiment, the mmWave antenna module comprises a printed circuit board, an RFIC disposed on or adjacent to a first side (eg, bottom side) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band); and a plurality of antennas (eg, an array antenna) disposed on or adjacent to a second side (eg, top or side) of the printed circuit board and capable of transmitting or receiving signals of the designated high frequency band. can do.

At least some of the components are connected to each other through a communication method between peripheral devices (eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and a signal ( e.g. commands or data) can be exchanged with each other.

According to an embodiment, the command or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 . Each of the external

electronic devices

102 or 104 may be the same as or different from the electronic device 101 . According to an embodiment, all or a part of operations executed in the electronic device 101 may be executed in one or more external

electronic devices

102 , 104 , or 108 . For example, when the electronic device 101 needs to perform a function or service automatically or in response to a request from a user or other device, the electronic device 101 may perform the function or service itself instead of executing the function or service itself. Alternatively or additionally, one or more external electronic devices may be requested to perform at least a part of the function or the service. One or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 101 . The electronic device 101 may process the result as it is or additionally and provide it as at least a part of a response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an Internet of things (IoT) device. The server 108 may be an intelligent server using machine learning and/or neural networks. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199 . The electronic device 101 may be applied to an intelligent service (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.

Referring to FIG. 2 , the electronic device 101 according to an embodiment may include a frame structure 210 and a display 260 . In an embodiment, the surface on which the display 260 is disposed may be defined as the front surface of the electronic device 101 , and the opposite surface of the front surface may be defined as the rear surface of the electronic device 101 . Also, a surface surrounding the space between the front and rear surfaces may be defined as a side surface of the electronic device 101 . In an embodiment, the frame structure 210 may form at least a portion of a side surface of the electronic device 101 .

According to an embodiment, the frame structure 210 includes a first frame 211 , a second frame 212 , a third frame 213 , a fourth frame 214 and/or a fifth frame 215 . can do. In an embodiment, at least a portion of the frame structure 210 may include a conductive material (eg, metal). In an embodiment, the segmental part 200 may be disposed on a side surface of the electronic device 101 to be included in the frame structure 210 . For example, the first segment 201 may be positioned between the first frame 211 and the fifth frame 215 . As another example, the second segment 202 may be positioned between the first frame 211 and the second frame 212 , and the third segment 202 may be positioned between the second frame 212 and the third frame 213 . The segmented part 203 may be positioned, the fourth segmented part 204 may be positioned between the third frame 213 and the fourth frame 214 , and the fourth frame 214 and the fifth frame ( A fifth segment 205 may be positioned between the 215 . In an embodiment, the segmental part 200 may include an insulating material (eg, ceramic, plastic, or resin). As another example, the segmental part 200 may be described as a structure separate from the frame structure 210 . For example, the frame structure 210 may be formed of a conductive material, the segmented portion 200 may be formed of a non-conductive material, and the segmented portion 200 may be formed of a frame structure 210 together with the electronic device 101 . ) can be formed.

According to an embodiment, the display 260 may occupy most of the front surface of the electronic device 101 . In an embodiment, the display 260 may emit light from a pixel to transmit information to a user, and the light emitted from the pixel may be transmitted to the outside of the electronic device 101 through the display 260 . . In one embodiment, the display 260 may include a protective layer such as tempered glass.

The electronic device 101 illustrated in FIG. 2 corresponds to one example, and the form of the device to which the technical idea disclosed in this document is applied is not limited. The technical idea disclosed in this document is applicable to various user devices. For example, by employing a flexible display and a hinge structure, the technical idea disclosed in this document may be applied to a foldable electronic device that can be folded in a horizontal direction or a foldable electronic device in a vertical direction, a tablet, or a notebook computer. As another example, by adopting a flexible display and a sliding structure, the flexible display may be drawn out from or drawn into the housing of the electronic device depending on the state of the electronic device. The technical idea disclosed in the document may be applied.

Hereinafter, various embodiments will be described with reference to the electronic device 101 illustrated in FIG. 2 for convenience of description.

Referring to FIG. 3 , the electronic device 101 according to an embodiment includes a display 260 , a frame structure 210 , a plate 310 , a battery 320 , a printed circuit board (PCB) 330 , and a bracket ( bracket) 340 and/or a rear cover 350 .

According to an embodiment, at least a portion of the frame structure 210 may operate as an antenna radiator for transmitting and receiving wireless communication signals. At least a portion of the frame structure 210 used as the antenna radiator may include a conductive material (eg, metal).

According to an embodiment, the plate 310 may be disposed inside the electronic device 101 . The plate 310 may be coupled to a frame structure 210 forming a side surface of the electronic device 101 . In an embodiment, the plate 310 may support various components of the electronic device 101 or provide a space for fixing components of the electronic device 101 . For example, the plate 310 may be disposed under the display 260 (eg, in the -z direction) to support the display 260 . As another example, the plate 310 may provide a space for fixing the battery 320 .

According to an embodiment, the battery 320 may be fixed by the plate 310 and disposed inside the electronic device 101 . The battery 320 may store power required for the electronic device 101 . For example, battery 320 may include a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell. The battery 320 may be integrally disposed inside the electronic device 101 , or may be disposed to be detachably attached from the electronic device 101 .

According to an embodiment, the PCB 330 may be disposed between the plate 310 and the bracket 340 . The PCB 330 may be supported by a plate 310 and/or a bracket 340 . In an embodiment, a processor 120 , a memory 130 , and an interface 177 may be located in the PCB 330 . In an embodiment, the PCB 330 may provide an electrical connection path between various components of the electronic device 101 . For example, the camera module 112 , the battery 320 , the display 260 and the processor 120 are each directly or indirectly electrically connected to the PCB 330 , and the processor 120 is connected to the PCB 330 . It may be operatively coupled to the camera module 112 , the battery 320 , and the display 260 through an electrical connection path provided by the .

According to an embodiment, the bracket 340 may be disposed under the PCB 330 and the battery 320 (eg, in the -z direction) to support the PCB 330 and the battery 320 . The bracket 340 may include a metal and/or a non-metal (eg, a polymer).

According to an embodiment, the rear cover 350 may be disposed under the bracket 340 (eg, -z direction). In an embodiment, the rear cover 350 may be physically coupled to the frame structure 210 . For example, the rear cover 350 may be coupled to the frame structure 210 by at least one coupling member (eg, a screw) not shown. In another example, the back cover 350 may be coupled to the frame structure 210 by an adhesive member (eg, an adhesive tape or an adhesive solution) not shown. In one embodiment, the back cover 350 is made of coated or tinted glass, ceramic, polymer, metal (eg, aluminum, stainless steel, or magnesium), or a combination of at least two of the above materials. can be formed. The rear cover 350 may include a curved portion that is bent toward the frame structure 210 forming at least a portion of the side surface and extends seamlessly.

Referring to FIG. 4A , the first frame 211 according to an embodiment may be coupled to the plate 310 . In an embodiment, the first frame 211 may include a first portion 211a coupled to the plate 310 . Referring to the enlarged drawing of the first part 211a, the first frame 211 includes a first connection part 411 and a third connection part 412 extending in an inward direction of the electronic device 101 . may include.

According to an embodiment, the first connection part 411 may include a plurality of surfaces. For example, the first connection part 411 may include a first surface 411a, a second surface 411b parallel to the first surface 411a, and/or a third surface 411c. In one embodiment, the first surface 411a may be in contact with the third surface 411c and the first edge 431 , and the second surface 411b may be in contact with the third surface 411c and the second edge 432 . can be accessed at For example, the first surface 411a may correspond to a surface facing the +z direction, the second surface 411b may correspond to a surface facing the -z direction, and the third surface 411c may be a surface facing the -z direction. It may correspond to a surface surrounding the space between the first surface 411a and the second surface 411b.

In an embodiment, the third connection part 412 may include a plurality of surfaces. For example, the third connection part 412 may include a fourth surface 412a, a fifth surface 412b parallel to the fourth surface 412a, and a sixth surface 412c. In one embodiment, the fourth surface 412a and the sixth surface 412c may contact the third edge 433 , and the fifth surface 412b and the sixth surface 412c may contact the fourth edge 434 . can be accessed at For example, the fourth surface 412a may correspond to a surface facing the +z direction, the fifth surface 412b may correspond to a surface facing the -z direction, and the sixth surface 412c may correspond to the It may correspond to a surface surrounding the space between the fourth surface 412a and the fifth surface 412b.

Although only a part of the first edge 431 illustrated in FIG. 4A is covered by the first connection part 411 , it may extend along the third surface 411c like the second edge 432 . Similarly, the third edge 433 illustrated in FIG. 4A is covered by the third connection part 412 and only partially illustrated in the drawing, but may extend along the sixth surface 412c like the fourth edge 434 .

In an embodiment, the first connection part 411 and/or the third connection part 412 may have various shapes. For example, the first connection part 411 and/or the third connection part 412 may have a U-shaped shape. As another example, the first connection part 411 and/or the third connection part 412 may have a rectangular shape. The first connection part 411 and the third connection part 412 of the first frame 211 disclosed in this document may be replaced with terms of a first coupling protrusion and a second coupling protrusion in order, respectively.

In an embodiment, the position and number of the connection parts (eg, the first connection part 411 ) of the first frame 211 are not limited to the position and number of the connection parts shown in FIG. 4A . For example, the first frame 211 may further include a connection part in addition to the first connection part 411 and the third connection part 412 . As another example, different from that shown in FIG. 4A , the first connection part 411 and the third connection part 412 may be positioned side by side.

In an embodiment, the first connection part 411 and the third connection part 412 for coupling between the first frame 211 and the plate 310 are illustrated, but this is an example, and the second frame of the frame structure 210 is shown. 212 , the third frame 213 , the fourth frame 214 , and/or the fifth frame 215 may include additional connections for coupling with the plate 310 . In addition, the plate 310 includes a second frame 212 , a third frame 213 , a fourth frame 214 and/or a second connection part 421 and a fourth connection part 422 , which will be described later in FIG. 4C . 5 It may further include a connection portion corresponding to the additional connection portion of the frame 215 .

Referring to FIG. 4B , the first connection part 411 and/or the third connection part 412 according to an embodiment have a length longer than a width and are located at a point of the first frame 211 ( 101) may extend in the inward direction. For example, the first connecting portion 411 may have a width length of the first length L1 , and the first connecting portion 411 may have a second length L2 longer than the first length L1 and the first It may extend in a first direction (eg, a +x direction) from a first point of the frame 211 . As another example, the third connecting portion 412 may have a width length of the third length L3, and the third connecting portion 412 may have a fourth length L4 longer than the third length L3. It may extend in a second direction (eg, a +y direction) from a second point of the first frame.

Referring to FIG. 4C , the plate 310 according to an embodiment may include a second portion 310a coupled to the frame structure 210 . Referring to the enlarged drawing of the second part 310a, the plate 310 may include a second connection part 421 corresponding to the first connection part 411 in the second part 310a, A fourth connection part 422 may be included to correspond to the third connection part 412 . In an embodiment, the second connection part 421 and/or the fourth connection part 422 of the plate 310 has the shape of the first connection part 411 and/or the third connection part 412 of the first frame 211 . may have a groove shape corresponding to . For example, when the first connection part 411 is U-shaped, the second connection part 421 may have a U-shaped groove shape. The second connection part 421 and the fourth connection part 422 disclosed in this document may be replaced with terms of a first accommodating groove and a second accommodating groove in order, respectively. As a result, the first frame 211 may include a first coupling protrusion and/or a second coupling protrusion, and the plate 310 may include a first receiving groove and/or a second coupling protrusion corresponding to the first coupling protrusion. It may include a second receiving groove corresponding to the. The first coupling protrusion of the first frame 211 may be coupled to the first receiving groove of the plate 310 , and the second coupling protrusion of the first frame 211 may be coupled to the second receiving recess of the plate 310 . can do.

Referring to FIG. 5A , the first connection part 411 according to an embodiment may be engaged with the second connection part 421 along the first edge 431 . In addition, the third connection part 412 may be engaged with the fourth connection part 422 along the third edge 433 . Although covered by the plate 310 in the drawing shown in FIG. 5A , the second connection part 421 may contact the third surface 411c of the first connection part 411 in one area. The fourth connection part 422 may contact the sixth surface 412c of the third connection part 412 in one area.

Referring to FIG. 5B , the first connection part 411 according to an embodiment may be engaged with the second connection part 421 along the second edge 432 . Also, the third connector 412 may be engaged with the fourth connector 422 along the fourth edge 434 .

Referring to FIG. 6 , the first frame 211 and the first connection part 411 and the third connection part 412 respectively extending from the first frame 211 according to an embodiment are made of silicon ( Si) may include a low metal content. For example, the first frame 211, the first connection part 411, and the third connection part 412 may include a metal having a silicon content of about 0.3 to 1.0% (eg, an Al 60-based aluminum alloy). have. The plate 310 may include a metal (eg, S33N) having a silicon content of about 6.2 to 6.7%. In an embodiment, when welding to a metal having a relatively low silicon content, the number or size of pores generated by welding may be smaller than when welding to a metal having a relatively high silicon content. In addition, when welding to a metal having a relatively low silicon content, welding may be performed for a longer period of time than when welding to a metal having a relatively high silicon content. Therefore, when welding to a metal having a relatively low silicon content, cracks can be prevented by reducing the number and size of pores, and joint strength can be increased through long-term welding. In an embodiment, welding may be performed on the first connection portion 411 having a relatively low silicon content in order to couple the first connection portion 411 and the second connection portion 421 . In the case of welding to the first connection part 411 , a relatively small number of pores may be generated, and welding may be possible for a long time. Accordingly, the first connection part 411 and the second connection part 421 may be coupled to each other with high bonding strength. As another example, as the third connection part 412 is welded, the third connection part 412 and the fourth connection part 422 may be coupled with high bonding strength.

In an embodiment, the first connecting portion 411 may be welded along the first edge 431 . For example, the first connecting portion 411 may be welded at the first welding portion 611 along the first edge 431 to be coupled to the second connecting portion 421 . In another example, the first connection portion 411 may be welded at the second welding portion 612 along the first edge 431 to be coupled to the second connection portion 421 . Also, the first connecting portion 411 may be welded along the second edge 432 . For example, the first connection portion 411 may be welded to the third welding portion 613 along the second edge 432 to be coupled to the second connection portion 421 . As another example, the first connection portion 411 may be welded at the fourth weld portion 614 along the second edge 432 to be coupled to the second connection portion 421 . As the first connection part 411 and the second connection part 421 are double welded along the first edge 431 and the second edge 432 and combined, the first connection part 411 and the second connection part 421 are Compared to the case of welding along one edge, it can be joined more reliably.

According to an embodiment, the third connection part 412 may be welded along the third edge 433 . For example, the third connection portion 412 may be welded at the fifth welding portion 615 along the third edge 433 to be coupled to the fourth connection portion 422 . As another example, the third connection portion 412 may be welded at the sixth weld portion 616 along the third edge 433 to be coupled to the fourth connection portion 422 . In one embodiment, the third connector 412 may be welded along the fourth edge 434 . For example, the third connection portion 412 may be welded along the fourth edge 434 at the seventh weld portion 617 to be coupled to the fourth connection portion 422 . As another example, the third connector 412 may be welded along the fourth edge 434 at the eighth welded portion 618 to engage the fourth connector 422 . As the third connecting portion 412 and the fourth connecting portion 422 are double welded along the third edge 433 and the fourth edge 434 and coupled, the third connecting portion 412 and the fourth connecting portion 422 are Compared to the case of welding along one edge, it can be joined more reliably.

According to an embodiment, as the first connection part 411 and the second connection part 421 are line-welded along the first edge 431 and/or the second edge 432 , the welding to a point Compared to point welding, the first connection part 411 and the second connection part 421 may be coupled with high bonding strength. Accordingly, it is possible to prevent the disconnection of the connection between the first connection part 411 and the second connection part 421 due to the occurrence of a crack when there is an external shock or shaking with respect to the electronic device 101 . As another example, as the third connection portion 412 and the fourth connection portion 422 are line welded along the third edge 433 and/or the fourth edge 434, the third connection portion 412 and the fourth connection portion ( 422) can be combined with high bonding strength.

Referring to the cross-sectional view A-A' of the portion where the first connection part 411 and the second connection part 421 are coupled according to an embodiment, the first welding part through long-time welding to the first connection part 411 having a low silicon content 611 , second welded portion 612 , third welded portion 613 , and/or fourth welded portion 614 may have a weld depth greater than or equal to a specified length. For example, the second welding portion 612 may have a welding depth of the first depth D1 . In one embodiment, the first welding portion 611 , the second welding portion 612 , the third welding portion 613 and/or the fourth welding portion of the first connection portion 411 and the second connection portion 421 . As the welded portion 614 has a welding depth greater than or equal to a specified length, the first connecting portion 411 and the second connecting portion 421 may be joined with a high joint strength. As another example, the fifth welded portion 615 , the sixth welded portion 616 , the seventh welded portion 617 , and/or the eighth welded portion that is a welded portion of the third and fourth connecting

portions

412 and 422 . As the portion 618 has a welding depth greater than or equal to a specified length, the third connection portion 412 and the fourth connection portion 422 may be joined with high bonding strength.

Referring to FIG. 7 , the electronic device 101 according to an embodiment may further include a first connection part 411 , a third connection part 412 , and/or an injection member 700 disposed on the plate 310 . can In an embodiment, the injection member 700 may be disposed in a first direction (eg, a +z direction) and/or a second direction (eg, a -z direction) with respect to the plate 310 . In one embodiment, the injection member 700 is disposed adjacent to the first connection part 411, the third connection part 412, and the plate 310, and the first connection part 411, the first connection part 411 when there is an external shock or shaking. 3 It is possible to minimize the impact applied to the connection portion 412 and the plate 310 . In addition, the injection member 700 may include an insulating material (eg, plastic resin), and the frame structure 210 and the plate 310 are electrically connected through the first connection part 411 and the second connection part 421 . impact can be minimized. For example, when an electrical path including the first connection part 411 and the second connection part 421 is formed, the injection member 700 including the insulating material is formed with the first connection part 411 and the second connection part 421 . and may not be electromagnetically coupled.

Referring to FIG. 8 , the frame structure 210 and the plate 310 of the electronic device 101 may be processed in process 801 according to an embodiment. In an embodiment, the frame structure 210 and the plate 310 to be processed may include a conductive material (eg, aluminum). The silicon content of the frame structure 210 may be lower than the silicon content of the plate 310 .

In step 803 according to an embodiment, welding of the frame structure 210 and the plate 310 may be performed. In an embodiment, welding between the frame structure 210 and the plate 310 may be performed through laser welding on the frame structure 210 having a relatively low silicon content. In addition, welding may be performed according to various welding methods (eg, ultrasonic welding). In an embodiment, welding to the frame structure 210 may be performed through line welding along an edge of a connection portion (eg, the first connection portion 411) of the frame structure 210 .

In step 805 according to an embodiment, insert injection may be performed on the frame structure 210 and the plate 310 coupled by welding. Through the insert injection, the injection member 700 may be disposed adjacent to the frame structure 210 and the plate 310 as shown in FIG. 7 .

Additional processing may be performed on the frame structure 210 in step 807 according to an embodiment. For example, cutting of the edge of the frame structure 210 may be performed according to the standard of the electronic device 101 .

According to an embodiment, the first step of FIG. 9 shows the frame structure 210 and the plate 310 formed through the process 801 of FIG. 8 . The second step shows the frame structure 210 and the plate 310 joined by welding in step 803 of FIG. 8 . The third step shows the injection member 700 inserted into the frame structure 210 and plate 310 joined in step 805 of FIG. 8 . The fourth step is a diagram illustrating a shape in which additional processing is performed along a portion of an edge of the frame structure 210 according to the standard of the electronic device 101 in step 807 of FIG. 8 .

Referring to FIG. 10 , a metal having a relatively low silicon content (eg, Al 60 series) according to an embodiment may have a smaller number of pores generated by welding compared to a metal having a relatively high silicon content (eg, S33N). and the pore size may be smaller. Accordingly, cracks due to pores generated by welding to metals having a relatively low silicon content (eg, AL 60 series) can be prevented, and high bonding strength can be secured during welding.

In one embodiment, the frame structure 210 and the plate 310 through welding to a connection portion containing a metal having a relatively low silicon content (eg, the first connection portion 411 in FIG. 4A ) provides a high bonding strength when combined. can have

Referring to FIG. 11 , during line welding according to an exemplary embodiment, coupling through welding may be possible in a wider area than point welding. In one embodiment, the frame structure 210 and the plate 310 through line welding for the connection portion (eg, the first connection portion 411) may be combined in a larger area than point welding. Accordingly, the frame structure 210 and the plate 310 may have high bonding strength when combined through line welding. In an embodiment, line welding may refer to a welding method in which welding is performed for a length longer than a specified length along an edge of a connection part (eg, the first connection part 411 ) of the frame structure 210 .

Referring to FIG. 12 , the first frame 211 and the plate 310 according to an embodiment may be electrically connected to each other through at least one welding portion with respect to the first connecting portion 411 . For example, the first frame 211 and the plate 310 may include a first welded portion 611 , a second welded portion 612 , a third welded portion 613 and/or a first welded portion 613 to the first connection 411 . It may be electrically connected through the fourth welding portion 614 . In an embodiment, as at least one welding portion exists between the first frame 211 and the plate 310 , even if some of the plurality of welding portions are disconnected, the first frame 211 and the plate 310 are electrically connected to each other. can be connected to For example, even if the bonding of the first welding portion 611 among the welding portions to the first connection portion 411 is broken due to external impact or crack generation, the first frame 211 and the plate 310 are connected to the second It may be electrically connected through a weld portion 612 , a third weld portion 613 , and/or a fourth weld portion 614 . As another example, even if the first welding portion 611 , the second welding portion 612 , and the third welding portion 613 are disconnected from each other, the first frame 211 and the plate 310 are connected to the fourth welding portion It may be electrically connected through (614).

According to an embodiment, the first frame 211 and the plate 310 may be electrically connected to each other through at least one welding portion to the third connecting portion 412 . For example, the first frame 211 and the plate 310 may be connected to a fifth welded portion 615 , a sixth welded portion 616 , a seventh welded portion 617 and/or to the third connection 412 . It may be electrically connected through the eighth welding portion 618 . In an embodiment, as at least one welding portion exists between the first frame 211 and the plate 310, even if some of the plurality of welding portions are disconnected, the first frame 211 and the plate 310 are first 3 It may be electrically connected through the connection part 412 . Accordingly, the first frame 211 and the plate 310 may have a stable electrical connection relationship through the plurality of welding parts.

Referring to FIG. 13 , when power is supplied to a point of the frame structure 210 in a state in which the frame structure 210 and the plate 310 are coupled by welding, the antenna using the frame structure 210 according to an embodiment. A radiation performance graph 1301 of (hereinafter, a first graph) is shown. In addition, when power is supplied to a point of the frame structure 210 when the coupling by welding between the frame structure 210 and the plate 310 is separated, the antenna radiation performance graph 1302 using the frame structure 210 (hereinafter, A second graph) is shown.

According to an embodiment, it can be seen that the second graph 1302 shows a lower radiation efficiency than the first graph 1301 in a frequency band of about 1,400 to 1800 MHz. Therefore, when the coupling between the frame structure 210 and the plate 310 is separated, it can be seen that the antenna using the frame structure 210 of the electronic device 101 deteriorates in radiation efficiency in a frequency band of about 1,400 to 1800 MHz. have.

According to an embodiment, as described above with reference to FIG. 12 , the frame structure 210 and the plate 310 may be electrically connected through a plurality of welding portions. Even if some of the welding parts are broken, the frame structure 210 and the plate 310 may be electrically connected, and accordingly, the electronic device 101 deteriorates radiation efficiency in a frequency band of about 1,400 to 1800 MHz. can be prevented from becoming

An electronic device according to various embodiments of the present disclosure may include a metal frame forming at least a portion of a side surface of the electronic device and a metal plate disposed in the electronic device, wherein the metal frame is a first point of the metal frame may include a first connection portion extending from the , the metal plate may include a second connection portion corresponding to the first connection portion, the second connection portion along the edge of the first connection portion and the first connection portion may be in contact, and the metal frame and the metal plate may be coupled to each other by welding performed along at least one edge of the first connection part.

According to an embodiment, the silicon content of the metal frame may be lower than the silicon content of the metal plate.

According to an embodiment, the silicon content of the metal frame may correspond to 0.3 to 1.0%.

According to an embodiment, the silicon content of the metal plate may correspond to 6.2 to 6.7%.

According to an embodiment, the first connection part may include a first surface, a second surface parallel to the first surface, and a third surface surrounding the first surface and the second surface, and the first The at least one edge of the connection part may include a first edge formed by the first surface and the third surface and a second edge formed by the second surface and the third surface.

According to an embodiment, the metal frame and the metal plate may be electrically connected by welding to the first edge.

According to an embodiment, the metal frame and the metal plate may be electrically connected by welding to the first edge and the second edge.

According to an embodiment, the second connection part may be coupled to the third surface of the first connection part in one region.

According to an embodiment, by welding to the first edge, the metal frame and the metal plate may be coupled to each other having a predetermined depth in a direction from the first edge to the second edge.

According to an embodiment, the first connection part may have a first width, and the first connection part may extend from the first point of the metal frame by a first length greater than the first width.

According to an embodiment, the first connection part may have a U-shaped shape.

According to an embodiment, an injection member disposed adjacent to the first connection part and the second connection part may be further included.

According to an embodiment, the first connection part may extend inward of the electronic device from the first point of the metal frame.

According to an embodiment, the metal frame may include a third connection part extending from a second point of the metal frame, and the metal plate may include a fourth connection part corresponding to the third connection part, and the A third connection part may be in contact with the fourth connection part along an edge of the fourth connection part, and the metal frame and the metal plate may be coupled by welding to at least one edge of the fourth connection part.

According to an embodiment, the first connection part and the third connection part of the metal frame may be electrically connected through the metal plate.

The electronic device according to an embodiment may include a metal frame forming at least a part of a side surface of the electronic device and a metal plate disposed in the electronic device, wherein the metal frame is formed at a first point at a first point of the metal frame. may include a first connection portion extending by a length, the first connection portion may have a first width shorter than the first length, the metal plate may include a second connection portion corresponding to the first connection portion and the second connection part may be in contact with the first connection part along an edge of the first connection part, and the metal frame and the metal plate may be coupled to each other by welding to the edge of the first connection part, and The silicon content of the metal frame may be lower than the silicon content of the metal plate.

According to an embodiment, the metal frame may include a third connection part extending from a second point of the metal frame, and the metal plate may include a fourth connection part corresponding to the third connection part, and the A fourth connection part may be in contact with the third connection part along an edge of the third connection part, and the metal frame and the metal plate may be coupled by welding to the edge of the third connection part.

According to an embodiment, the first connection part and the second connection part may be electrically connected by welding to an edge of the first connection part.

The electronic device according to various embodiments disclosed in this document may have various types of devices. The electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device. The electronic device according to the embodiment of the present document is not limited to the above-described devices.

The various embodiments of this document and terms used therein are not intended to limit the technical features described in this document to specific embodiments, but it should be understood to include various modifications, equivalents, or substitutions of the embodiments. In connection with the description of the drawings, like reference numerals may be used for similar or related components. The singular form of the noun corresponding to the item may include one or more of the item, unless the relevant context clearly dictates otherwise. As used herein, "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C", and "A , B, or C," each of which may include any one of the items listed together in the corresponding one of the phrases, or all possible combinations thereof. Terms such as "first", "second", or "first" or "second" may simply be used to distinguish an element from other elements in question, and may refer elements to other aspects (e.g., importance or order) is not limited. It is said that one (eg, first) component is “coupled” or “connected” to another (eg, second) component, with or without the terms “functionally” or “communicatively”. When referenced, it means that one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.

The term “module” used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as, for example, logic, logic block, component, or circuit. can be used as A module may be an integrally formed part or a minimum unit or a part of the part that performs one or more functions. For example, according to an embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of the present document include one or more instructions stored in a storage medium (eg, internal memory 136 or external memory 138) readable by a machine (eg, electronic device 101). may be implemented as software (eg, the program 140) including For example, the processor (eg, the processor 120 ) of the device (eg, the electronic device 101 ) may call at least one of the one or more instructions stored from the storage medium and execute it. This makes it possible for the device to be operated to perform at least one function according to the called at least one command. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The device-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' only means that the storage medium is a tangible device and does not contain a signal (eg, electromagnetic wave), and this term is used in cases where data is semi-permanently stored in the storage medium and It does not distinguish between temporary storage cases.

According to one embodiment, the method according to various embodiments disclosed in this document may be provided in a computer program product (computer program product). Computer program products may be traded between sellers and buyers as commodities. The computer program product is distributed in the form of a machine-readable storage medium (eg compact disc read only memory (CD-ROM)), or via an application store (eg Play Store ^TM ) or on two user devices ( It can be distributed (eg downloaded or uploaded) directly, online between smartphones (eg: smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created in a machine-readable storage medium such as a memory of a server of a manufacturer, a server of an application store, or a relay server.

According to various embodiments, each component (eg, a module or a program) of the above-described components may include a singular or a plurality of entities, and some of the plurality of entities may be separately disposed in other components. have. According to various embodiments, one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg, a module or a program) may be integrated into one component. In this case, the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component are executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations are executed in a different order, or omitted. , or one or more other operations may be added.

Claims

In an electronic device,

a metal frame forming at least a portion of a side surface of the electronic device; and

It includes a metal plate disposed in the electronic device,

The metal frame includes a first connection portion extending from a first point of the metal frame,

The metal plate includes a second connection portion corresponding to the first connection portion, and the second connection portion is in contact with the first connection portion along an edge of the first connection portion,

The electronic device of claim 1, wherein the metal frame and the metal plate are coupled to each other by welding performed along at least one edge of the first connection part.
The method according to claim 1,

The silicon content of the metal frame is lower than the silicon content of the metal plate, the electronic device.
3. The method according to claim 2,

The silicon content of the metal frame corresponds to 0.3 to 1.0%, the electronic device.
3. The method according to claim 2,

The silicon content of the metal plate corresponds to 6.2 to 6.7%, the electronic device.
The method according to claim 1,

The first connection portion includes a first surface, a second surface parallel to the first surface, and a third surface surrounding the first surface and the second surface,

The at least one edge of the first connection part includes a first edge formed by the first surface and the third surface and a second edge formed by the second surface and the third surface.
6. The method of claim 5,

The electronic device, wherein the metal frame and the metal plate are electrically connected by welding to the first edge.
6. The method of claim 5,

and the metal frame and the metal plate are electrically connected by welding to the first edge and the second edge.
6. The method of claim 5,

The second connection part is coupled to the third surface of the first connection part in one region.
6. The method of claim 5,

The electronic device of claim 1, wherein the metal frame and the metal plate are coupled with a predetermined depth in a direction from the first edge toward the second edge by welding to the first edge.
The method according to claim 1,

The first connection portion has a first width, and the first connection portion extends from the first point of the metal frame by a first length greater than the first width.
The method according to claim 1,

The first connection part has a U-shaped (U-shaped) electronic device.
The method according to claim 1,

The electronic device further comprising an injection member disposed adjacent to the first connection part and the second connection part.
The method according to claim 1,

and the first connection portion extends inward of the electronic device from the first point of the metal frame.
The method according to claim 1,

The metal frame includes a third connection portion extending from the second point of the metal frame,

The metal plate includes a fourth connection portion corresponding to the third connection portion,

The third connection portion is in contact with the fourth connection portion along an edge of the fourth connection portion,

and the metal frame and the metal plate are coupled to each other by welding to at least one edge of the fourth connection part.
15. The method of claim 14,

The electronic device of claim 1, wherein the first connection part and the third connection part of the metal frame are electrically connected through the metal plate.