WO2022197155A1

WO2022197155A1 - Electronic device comprising flexible circuit board

Info

Publication number: WO2022197155A1
Application number: PCT/KR2022/003841
Authority: WO
Inventors: 박정훈; 조정규; 강승구; 이용승; 손동일
Original assignee: 삼성전자 주식회사
Priority date: 2021-03-19
Filing date: 2022-03-18
Publication date: 2022-09-22
Also published as: KR20220131013A

Abstract

An electronic device according to various embodiments of the present disclosure comprises: a first component assembly including a housing, a circuit board positioned within the housing and having a first connecting member disposed in one region, a first component, and a second connecting member extending from the first component and disposed on the first connecting member of the circuit board; and a second component assembly including a second component and at least one third connecting member extending from the second component and disposed on the second connecting member, wherein the second connecting member forms an electrical contact with the first connecting member so as to electrically connect the first component to the circuit board, and the third connecting member forms an electrical contact with the first connecting member via the second connecting member so as to electrically connect the second component to the circuit board. Various other embodiments may be possible.

Description

Electronic device including flexible circuit board

The present disclosure relates to an electronic device including a flexible printed circuit board (FPCB) and a method of the electronic device including the FPCB.

Due to the development of information and communication technology and semiconductor technology, various functions are being integrated into one portable electronic device. For example, the electronic device may implement not only a communication function, but also an entertainment function such as a game, a multimedia function such as music/video playback, a communication and security function for mobile banking, schedule management, and an electronic wallet function. Such electronic devices are being miniaturized so that users can conveniently carry them.

In the electronic device, the camera assembly and the side key assembly may be electrically connected to the main printed circuit board. For example, a partial area of the camera assembly and a partial area of the side key assembly may be mounted on the main printed circuit board. A connection part of the camera assembly may be stacked on the connection part of the main printed circuit board and electrically connected. The side key assembly may be electrically connected to the main printed circuit board using a connecting material. Front water can be loaded on the camera assembly and the side key assembly. To prevent detachment of the camera assembly, a connecting material such as a poron may be attached between the camera assembly and the front.

As electronic devices are miniaturized and their functions are diversified, a mounting space in the electronic device is becoming important. In addition, a structure in which electrical components in the electronic device are mounted may reduce an accommodating space of the battery.

According to various embodiments of the present disclosure, it is possible to provide a method of securing a mounting space by efficiently changing the structure of a main printed circuit board. The secured mounting space may be used for the purpose of securing battery space.

An electronic device according to various embodiments of the present disclosure includes a housing, a circuit board positioned in the housing, a first connecting member disposed in one area, a first pu boom, and the first component extending from the first part of the circuit board A flexible circuit board having a first component assembly including a second connecting member disposed over the first connecting member, a second component, and at least one third connecting member extending from the second connecting member and disposed over the second connecting member A second component assembly including a flexible printed circuit board (FPCB) may be included. The second connecting member forms an electrical contact with the first connecting member to electrically connect the first component to the circuit board, and the third connecting member is connected to the first connecting member via the second connecting member By forming an electrical contact, the second component may be electrically connected to the circuit board.

An electronic device according to various embodiments of the present disclosure includes a housing, a circuit board located in a housing, a first connecting member disposed in one area, a first component, and a first component extending from the first component, and comprising: A flexible printed circuit board (FPCB) including a first component assembly including a second connection member disposed on a first connection member and at least one third connection member disposed on the second connection member, and a second component; and a second component assembly extending from the second component and including a third connecting member disposed on the flexible circuit board, wherein the second connecting member forms an electrical contact with the first connecting member to form an electrical contact with the first connecting member. The first component assembly is electrically connected to the circuit board, and the third connecting member forms an electrical contact with the second connecting member through the flexible circuit board, thereby electrically connecting the second component assembly to the first component assembly. It is characterized by connecting to

According to the device according to various embodiments of the present disclosure, it is possible to secure an accommodating space for a battery by expanding a mounting space in miniaturized electronic devices.

Effects obtainable in the present disclosure are not limited to the above-mentioned effects, and other effects not mentioned may be clearly understood by those of ordinary skill in the art to which the present disclosure belongs from the description below. will be.

1 is a block diagram of an electronic device according to various embodiments of the present disclosure;

2 is a front perspective view of an electronic device, according to various embodiments of the present disclosure;

3 is a rear perspective view of a tank device, according to various embodiments of the present disclosure;

4 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure;

5 is an internal projection view in which a front plate of an electronic device is removed, according to various embodiments of the present disclosure;

6 is a diagram illustrating a connection structure and an arrangement structure between electronic components mounted on a circuit board in an electronic device according to various embodiments of the present disclosure;

7A and 7B are enlarged views illustrating an area after cutting the line A to A' of FIG. 5 .

8 is a diagram illustrating a connection structure and an arrangement structure between electronic components mounted on a circuit board in an electronic device according to various embodiments of the present disclosure;

9A and 9B are diagrams schematically illustrating a structure for electrically connecting electrical components using a connection member between electrical components according to various embodiments of the present disclosure;

10A, 10B, and 10C are diagrams illustrating a connection structure and an arrangement structure of a flexible printed circuit board according to various embodiments of the present disclosure;

1 is a block diagram of an electronic device in a network environment, according to various embodiments of the present disclosure;

Referring to FIG. 1 , in a network environment 100 , the electronic device 101 communicates with the electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or a second network 199 . It may communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 . According to an embodiment, the electronic device 101 includes a processor 120 , a memory 130 , an input module 150 , a sound output module 155 , a display module 160 , an audio module 170 , and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or an antenna module 197 . In some embodiments, at least one of these components (eg, the connection terminal 178 ) may be omitted or one or more other components may be added to the electronic device 101 . In some embodiments, some of these components (eg, sensor module 176 , camera module 180 , or antenna module 197 ) are integrated into one component (eg, display module 160 ). can be

The processor 120, for example, executes software (eg, the program 140) to execute at least one other component (eg, a hardware or software component) of the electronic device 101 connected to the processor 120 . It can control and perform various data processing or operations. According to one embodiment, as at least part of data processing or operation, the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190 ) to the volatile memory 132 . may be stored in , process commands or data stored in the volatile memory 132 , and store the result data in the non-volatile memory 134 . According to an embodiment, the processor 120 is the main processor 121 (eg, a central processing unit or an application processor), or a secondary processor 123 (eg, a graphic processing unit, a neural network processing unit) that can be operated independently or together with the main processor 121 . (NPU: neural processing unit), image signal processor, sensor hub processor, or communication processor). For example, when the electronic device 101 includes the main processor 121 and the sub-processor 123 , the sub-processor 123 uses less power than the main processor 121 or is set to be specialized for a specified function. can be The auxiliary processor 123 may be implemented separately from or as a part of the main processor 121 .

The secondary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or when the main processor 121 is active (eg, executing an application). ), together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states. According to an embodiment, the coprocessor 123 (eg, an image signal processor or a communication processor) may be implemented as part of another functionally related component (eg, the camera module 180 or the communication module 190). have. According to an embodiment, the auxiliary processor 123 (eg, a neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. Artificial intelligence models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself on which artificial intelligence is performed, or may be performed through a separate server (eg, the server 108). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but in the above example not limited The artificial intelligence model may include a plurality of artificial neural network layers. Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the above example. The artificial intelligence model may include, in addition to, or alternatively, a software structure in addition to the hardware structure.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176 ) of the electronic device 101 . The data may include, for example, input data or output data for software (eg, the program 140 ) and instructions related thereto. The memory 130 may include a volatile memory 132 or a non-volatile memory 134 .

The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system 142 , middleware 144 , or an application 146 .

The input module 150 may receive a command or data to be used by a component (eg, the processor 120 ) of the electronic device 101 from the outside (eg, a user) of the electronic device 101 . The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).

The sound output module 155 may output a sound signal to the outside of the electronic device 101 . The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from or as part of the speaker.

The display module 160 may visually provide information to the outside (eg, a user) of the electronic device 101 . The display module 160 may include, for example, a control circuit for controlling a display, a hologram device, or a projector and a corresponding device. According to an embodiment, the display module 160 may include a touch sensor configured to sense a touch or a pressure sensor configured to measure the intensity of a force generated by the touch.

The audio module 170 may convert a sound into an electric signal or, conversely, convert an electric signal into a sound. According to an embodiment, the audio module 170 acquires a sound through the input module 150 or an external electronic device (eg, a sound output module 155 ) directly or wirelessly connected to the electronic device 101 . The electronic device 102) (eg, a speaker or headphones) may output a sound.

The sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the sensed state. can do. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.

The interface 177 may support one or more specified protocols that may be used by the electronic device 101 to directly or wirelessly connect with an external electronic device (eg, the electronic device 102 ). According to an embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102 ). According to an embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 may capture still images and moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 may manage power supplied to the electronic device 101 . According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101 . According to one embodiment, battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

The communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). It can support establishment and communication performance through the established communication channel. The communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication. According to one embodiment, the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : It may include a local area network (LAN) communication module, or a power line communication module). A corresponding communication module among these communication modules is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (eg, legacy It may communicate with an external electronic device through a cellular network, a 5G network, a next-generation communication network, the Internet, or a telecommunication network such as a computer network (eg, LAN or WAN). These various types of communication modules may be integrated into one component (eg, a single chip) or may be implemented as a plurality of components (eg, multiple chips) separate from each other. The wireless communication module 192 uses subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199 . The electronic device 101 may be identified or authenticated.

The wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, a new radio access technology (NR). NR access technology includes high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency) -latency communications)). The wireless communication module 192 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example. The wireless communication module 192 uses various techniques for securing performance in a high-frequency band, for example, beamforming, massive multiple-input and multiple-output (MIMO), all-dimensional multiplexing. It may support technologies such as full dimensional MIMO (FD-MIMO), an array antenna, analog beam-forming, or a large scale antenna. The wireless communication module 192 may support various requirements defined in the electronic device 101 , an external electronic device (eg, the electronic device 104 ), or a network system (eg, the second network 199 ). According to an embodiment, the wireless communication module 192 may include a peak data rate (eg, 20 Gbps or more) for realizing eMBB, loss coverage (eg, 164 dB or less) for realizing mMTC, or U-plane latency for realizing URLLC ( Example: Downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) can be supported.

The antenna module 197 may transmit or receive a signal or power to the outside (eg, an external electronic device). According to an embodiment, the antenna module may include an antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern. According to an embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected from the plurality of antennas by, for example, the communication module 190 . can be selected. A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna. According to some embodiments, other components (eg, a radio frequency integrated circuit (RFIC)) other than the radiator may be additionally formed as a part of the antenna module 197 .

According to various embodiments, the antenna module 197 may form a mmWave antenna module. According to one embodiment, the mmWave antenna module comprises a printed circuit board, an RFIC disposed on or adjacent to a first side (eg, bottom side) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band); and a plurality of antennas (eg, an array antenna) disposed on or adjacent to a second side (eg, top or side) of the printed circuit board and capable of transmitting or receiving signals of the designated high frequency band. can do.

At least some of the components are connected to each other through a communication method between peripheral devices (eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and a signal ( e.g. commands or data) can be exchanged with each other.

According to an embodiment, the command or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 . Each of the external

electronic devices

102 or 104 may be the same as or different from the electronic device 101 . According to an embodiment, all or part of the operations executed in the electronic device 101 may be executed in one or more of the external

electronic devices

102 , 104 , or 108 . For example, when the electronic device 101 needs to perform a function or service automatically or in response to a request from a user or other device, the electronic device 101 may perform the function or service itself instead of executing the function or service itself. Alternatively or additionally, one or more external electronic devices may be requested to perform at least a part of the function or the service. One or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 101 . The electronic device 101 may process the result as it is or additionally and provide it as at least a part of a response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an Internet of things (IoT) device. The server 108 may be an intelligent server using machine learning and/or neural networks. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199 . The electronic device 101 may be applied to an intelligent service (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.

The electronic device according to various embodiments disclosed in this document may have various types of devices. The electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device. The electronic device according to the embodiment of the present document is not limited to the above-described devices.

The various embodiments of this document and terms used therein are not intended to limit the technical features described in this document to specific embodiments, but it should be understood to include various modifications, equivalents, or substitutions of the embodiments. In connection with the description of the drawings, like reference numerals may be used for similar or related components. The singular form of the noun corresponding to the item may include one or more of the item, unless the relevant context clearly dictates otherwise. As used herein, "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C", and "A , B, or C," each of which may include any one of the items listed together in the corresponding one of the phrases, or all possible combinations thereof. Terms such as “first”, “second”, or “first” or “second” may simply be used to distinguish the component from other such components, and refer to those components in other aspects (e.g., importance or order) is not limited. It is said that one (eg, first) component is “coupled” or “connected” to another (eg, second) component, with or without the terms “functionally” or “communicatively”. When referenced, it means that one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.

The term “module” used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as, for example, logic, logic block, component, or circuit. can be used as A module may be an integrally formed part or a minimum unit or a part of the part that performs one or more functions. For example, according to an embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of the present document include one or more instructions stored in a storage medium (eg, internal memory 136 or external memory 138) readable by a machine (eg, electronic device 101). may be implemented as software (eg, the program 140) including For example, the processor (eg, the processor 120 ) of the device (eg, the electronic device 101 ) may call at least one of the one or more instructions stored from the storage medium and execute it. This makes it possible for the device to be operated to perform at least one function according to the called at least one command. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The device-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' only means that the storage medium is a tangible device and does not contain a signal (eg, electromagnetic wave), and this term is different from the case where data is semi-permanently stored in the storage medium. It does not distinguish between temporary storage cases.

According to one embodiment, the method according to various embodiments disclosed in this document may be provided in a computer program product (computer program product). Computer program products may be traded between sellers and buyers as commodities. The computer program product is distributed in the form of a machine-readable storage medium (eg compact disc read only memory (CD-ROM)), or via an application store (eg Play Store ^TM ) or on two user devices ( It can be distributed (eg downloaded or uploaded) directly or online between smartphones (eg: smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium such as a memory of a server of a manufacturer, a server of an application store, or a memory of a relay server.

According to various embodiments, each component (eg, a module or a program) of the above-described components may include a singular or a plurality of entities, and some of the plurality of entities may be separately disposed in other components. have. According to various embodiments, one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg, a module or a program) may be integrated into one component. In this case, the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component are executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations are executed in a different order, or omitted. , or one or more other operations may be added.

2 is a front perspective view of an electronic device, according to various embodiments of the present disclosure; 3 is a rear perspective view of an electronic device, according to various embodiments of the present disclosure;

2 and 3 , the electronic device 101 according to an exemplary embodiment has a front surface 310A, a rear surface 310B, and a side surface 310C surrounding a space between the front surface 310A and the rear surface 310B. ) may include a housing 310 including a. In another embodiment (not shown), the housing 310 may refer to a structure that forms part of the front surface 310A of FIG. 2 , the rear surface 310B of FIG. 3 , and the side surfaces 310C. According to one embodiment, the front surface 310A may be formed by a front plate 302 (eg, a glass plate including various coating layers, or a polymer plate) at least a portion of which is substantially transparent. The rear surface 310B may be formed by the rear plate 311 . The rear plate 311 may be formed of, for example, glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. The side surface 310C is coupled to the front plate 302 and the rear plate 311 and may be formed by a side bezel structure (or "side member") 318 including a metal and/or a polymer. In some embodiments, the back plate 311 and the side bezel structure 318 are integrally formed and may include the same material (eg, glass, a metallic material such as aluminum, or ceramic).

In the illustrated embodiment, the front plate 302 includes two first edge regions 310D extending seamlessly from the front surface 310A toward the rear plate 311, the front plate ( 302) may be included at both ends of the long edge. In the illustrated embodiment (see FIG. 3 ), the rear plate 311 includes two second edge regions 310E extending seamlessly from the rear surface 310B toward the front plate 302 at both ends of the long edge. can be included in In some embodiments, the front plate 302 (or the back plate 311 ) may include only one of the first edge regions 310D (or the second edge regions 310E). In another embodiment, some of the first edge areas 310D or the second edge areas 310E may not be included. In the above embodiments, when viewed from the side of the electronic device 101 , the side bezel structure 318 does not include the first edge regions 310D or the second edge regions 310E as described above. A side surface may have a first thickness (or width), and a side surface including the first edge areas 310D or second edge areas 310E may have a second thickness thinner than the first thickness.

According to an embodiment, the electronic device 101 includes a display 301 ,

audio modules

303 , 307 , 314 (eg, the audio module 170 of FIG. 1 ), and a sensor module (eg, the sensor module of FIG. 1 ). 176 ), camera modules 305 and 312 (eg, camera module 180 in FIG. 1 ), key input device 317 (eg, input module 150 in FIG. 1 ), and connector holes 308 , 309) (eg, the connection terminal 178 of FIG. 1 ). In some embodiments, the electronic device 101 may omit at least one of the components (eg, the connector hole 309 ) or additionally include other components.

According to one embodiment, the display 301 may be visually exposed through, for example, a substantial portion of the front plate 302 . In some embodiments, at least a portion of the display 301 may be exposed through the front plate 302 forming the front surface 310A and the first edge regions 310D. In some embodiments, the edge of the display 301 may be formed to be substantially the same as an adjacent outer shape of the front plate 302 . In another embodiment (not shown), in order to expand the area to which the display 301 is exposed, the distance between the periphery of the display 301 and the periphery of the front plate 302 may be substantially the same.

According to an embodiment, the surface (or the front plate 302 ) of the housing 310 may include a screen display area formed as the display 301 is visually exposed. For example, the screen display area may include a front surface 310A and first edge areas 310D.

In another embodiment (not shown), a recess or opening is formed in a part of the screen display area (eg, the front surface 310A and the first edge area 310D) of the display 301 , and the recess is formed. Alternatively, it may include at least one of an audio module 314 aligned with the opening, a sensor module (not shown), a light emitting device (not shown), and a camera module 305 . In another embodiment (not shown), on the rear surface of the screen display area of the display 301 , an audio module 314 , a sensor module (not shown), a camera module 305 , a fingerprint sensor (not shown), and a light emitting element (not shown) may include at least one or more of. In another embodiment (not shown), the display 301 is coupled to or adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer that detects a magnetic field type stylus pen. can be placed. In some embodiments, at least a portion of the key input device 317 may be disposed in the first edge regions 310D and/or the second edge regions 310E.

According to various embodiments, the first camera module 205 and/or the sensor module among the

camera modules

305 and 312 communicates with the external environment through the transparent area of the display 301 in the internal space of the electronic device 101 . It can be arranged so as to be in contact. According to an embodiment, the region facing the first camera module 305 of the display 301 may be formed as a transmissive region having a transmittance designated as a part of the region displaying content. According to one embodiment, the transmissive region may be formed to have a transmittance in a range of about 5% to about 20%. Such a transmission region may include a region overlapping an effective region (eg, an angle of view region) of the first camera module 305 through which light for generating an image by being imaged by an image sensor passes. For example, the transmissive area of the display 301 may include an area having lower pixel density and/or wiring density than the surrounding area. For example, the transmissive area may replace a recess or opening.

According to an embodiment, the

audio modules

303 , 307 , and 314 may include, for example, a microphone hole 303 and speaker holes 307 and 314 . In the microphone hole 303, a microphone for acquiring an external sound may be disposed therein, and in some embodiments, a plurality of microphones may be disposed to detect the direction of the sound. The speaker holes 307 and 314 may include an external speaker hole 307 and a call receiver hole 314 . In some embodiments, the speaker holes 307 and 314 and the microphone hole 303 may be implemented as a single hole, or a speaker may be included without the speaker holes 307 and 314 (eg, a piezo speaker). The

audio modules

303 , 307 , and 314 are not limited to the above structure, and various design changes may be made, such as mounting only some audio modules or adding a new audio module, depending on the structure of the electronic device 101 .

According to an embodiment, the sensor module (not shown) may generate, for example, an electrical signal or data value corresponding to an internal operating state of the electronic device 101 or an external environmental state. A sensor module (not shown) may include, for example, a first sensor module (eg, a proximity sensor) and/or a second sensor module (eg, a fingerprint sensor) disposed on the front surface 310A of the housing 310 , and/or Alternatively, a third sensor module (eg, an HRM sensor) and/or a fourth sensor module (eg, a fingerprint sensor) disposed on the rear surface 310B of the housing 310 may be included. In some embodiments (not shown), the fingerprint sensor may be disposed on the back 310B as well as the front 310A (eg, the display 301 ) of the housing 310 . The electronic device 101 may include a sensor module not shown, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, It may further include at least one of a humidity sensor and an illuminance sensor. The sensor module is not limited to the above structure, and the design may be changed in various ways, such as mounting only some sensor modules or adding a new sensor module, depending on the structure of the electronic device 101 .

According to an embodiment, the

camera modules

305 and 312 are, for example, a first camera module 305 disposed on the front surface 310A of the electronic device 101 , and a second camera module 305 disposed on the rear surface 310B of the electronic device 101 . It may include a camera module 312 and/or a flash (not shown). The

camera module

305, 312 may include one or more lenses, an image sensor, and/or an image signal processor. The flash (not shown) may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (infrared cameras, wide angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device 101 . The

camera modules

305 and 312 are not limited to the above structure, and various design changes may be made, such as mounting only some camera modules or adding a new camera module, depending on the structure of the electronic device 101 .

According to an embodiment, the electronic device 101 may include a plurality of camera modules (eg, a dual camera or a triple camera) each having different properties (eg, angle of view) or functions. For example, a plurality of

camera modules

305 and 312 including lenses having different angles of view may be formed, and the electronic device 101 performs a camera performed by the electronic device 101 based on a user's selection. It can be controlled to change the angle of view of the

modules

305 and 312 . For example, at least one of the

camera modules

305 and 312 may be a wide-angle camera, and at least the other may be a telephoto camera. Similarly, at least one of the

camera modules

305 and 312 may be a front camera, and at least the other may be a rear camera. In addition, the

camera modules

305 and 312 may include at least one of a wide-angle camera, a telephoto camera, and an IR (infrared) camera (eg, a time of flight (TOF) camera, a structured light camera). According to an embodiment, the IR camera may be operated as at least a part of the sensor module. For example, the TOF camera may be operated as at least a part of a sensor module (not shown) for detecting the distance to the subject.

According to an embodiment, the key input device 317 may be disposed on the side surface 310C of the housing 310 . In another embodiment, the electronic device 101 may not include some or all of the above-mentioned key input devices 317 and the not included key input devices 317 may be displayed on the display 301 , such as soft keys. It may be implemented in other forms. In some embodiments, the key input device may include a sensor module 316 disposed on the second side 310B of the housing 310 .

According to an embodiment, the light emitting device (not shown) may be disposed on the front surface 310A of the housing 310 , for example. The light emitting device (not shown) may provide, for example, state information of the electronic device 101 in the form of light. In another embodiment, the light emitting device (not shown) may provide, for example, a light source linked to the operation of the front camera module 305 . The light emitting device (not shown) may include, for example, an LED, an IR LED, and/or a xenon lamp.

According to one embodiment, the connector holes 308 and 309 are, for example, a first connector hole capable of receiving a connector (eg, a USB connector) for transmitting and receiving power and/or data with an external electronic device. 308 , and/or a second connector hole (eg, earphone jack) 309 capable of accommodating a connector for transmitting and receiving audio signals to and from an external electronic device.

According to an embodiment, the first camera module 305 of the

camera modules

305 and 312 and/or some sensor modules among the sensor modules (not shown) are exposed to the outside through at least a part of the display 301 . can be arranged as much as possible. For example, the camera module 305 may include a punch hole camera disposed inside a hole or recess formed on the rear surface of the display 301 . According to an embodiment, the second camera module 312 may be disposed inside the housing 310 so that the lens is exposed to the second surface 310B of the electronic device 101 . For example, the second camera module 312 may be disposed on a printed circuit board (eg, the printed circuit board 340 of FIG. 4 ).

According to an embodiment, the first camera module 305 and/or the sensor module may come into contact with the external environment through a transparent area from the internal space of the electronic device 101 to the front plate 302 of the display 301 . It can be arranged so that In addition, some sensor modules 304 may be arranged to perform their functions without being visually exposed through the front plate 302 in the internal space of the electronic device.

4 is an exploded perspective view of an electronic device, according to various embodiments of the present disclosure;

Referring to FIG. 4 , the electronic device 101 (eg, the electronic device 101 of FIGS. 1 to 3 ) according to various embodiments includes a support bracket 370 and a front plate 320 (eg, in FIG. 2 ). Front plate 302), display 330 (eg, display 301 in FIG. 2), printed circuit board 340 (eg, PCB, flexible PCB (FPCB), or rigid flexible PCB (RFPCB)), battery 350 (eg, the battery 189 of FIG. 1 ), the second support member 360 (eg, the rear case), the antenna 390 (eg, the antenna module 197 of FIG. 1 ), and the rear plate ( 380) (eg, the rear plate 311 of FIG. 2 ). The support bracket 370 of the electronic device 101 according to an embodiment may include a side bezel structure 318 (eg, the side bezel structure 318 of FIG. 2 ) and a first support member 372 . have.

In some embodiments, the electronic device 101 may omit at least one of the components (eg, the first support member 372 or the second support member 360 ) or additionally include other components. . At least one of the components of the electronic device 101 may be the same as or similar to at least one of the components of the electronic device 101 of FIG. 2 or 3 , and overlapping descriptions will be omitted below.

According to various embodiments, the first support member 372 may be disposed inside the electronic device 101 and connected to the side bezel structure 318 , or may be integrally formed with the side bezel structure 318 . The first support member 372 may be formed of, for example, a metal material and/or a non-metal (eg, polymer) material. The first support member 372 may have a display 330 coupled to one surface and a printed circuit board 340 coupled to the other surface.

According to various embodiments, the printed circuit board 340 may be equipped with a processor, a memory, and/or an interface. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. According to various embodiments, the printed circuit board 340 may include a flexible printed circuit board type radio frequency cable (FRC). For example, the printed circuit board 340 may be disposed on at least a portion of the first support member 372 , and an antenna module (eg, the antenna module 197 of FIG. 1 ) and a communication module (eg, of FIG. 1 ). It may be electrically connected to the communication module 190).

According to an embodiment, the memory may include, for example, a volatile memory or a non-volatile memory.

According to an embodiment, the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface. The interface may, for example, electrically or physically connect the electronic device 101 to an external electronic device, and may include a USB connector, an SD card/MMC connector, or an audio connector.

According to various embodiments, the battery 350 is a device for supplying power to at least one component of the electronic device 101 , for example, a non-rechargeable primary battery, or a rechargeable secondary battery, or fuel. It may include a battery. At least a portion of the battery 350 may be disposed substantially on the same plane as the printed circuit board 340 , for example. The battery 350 may be integrally disposed inside the electronic device 101 , or may be disposed detachably from the electronic device 101 .

According to various embodiments, the second support member 360 (eg, a rear case) may be disposed between the printed circuit board 340 and the antenna 390 . For example, the second support member 360 may include one surface to which at least one of the printed circuit board 340 and the battery 350 is coupled, and the other surface to which the antenna 390 is coupled.

According to various embodiments, the antenna 390 may be disposed between the rear plate 380 and the battery 350 . The antenna 390 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna. The antenna 390 may, for example, perform short-range communication with an external device or wirelessly transmit/receive power required for charging. In another embodiment, the antenna structure may be formed by a part of the side bezel structure 318 and/or the first support member 372 or a combination thereof.

According to various embodiments, the rear plate 380 may form at least a portion of the rear surface (eg, the second surface 310B of FIG. 3 ) of the electronic device 101 .

The antenna structure of the various embodiments of the present disclosure described above and the electronic device including the same are not limited by the above-described embodiments and drawings, and various substitutions, modifications and changes are possible within the technical scope of the present disclosure. It will be apparent to those of ordinary skill in the art to which this belongs.

5 is a rear view of an electronic device on which a rear plate is projected, according to various embodiments of the present disclosure;

Referring to FIG. 5 , the electronic device 400 includes a battery 530 , a first support member 512 , a first electrical component 510 , a display (not shown), a main printed circuit board 590 , and a second 1 may include a flexible printed circuit board 540 . The configuration of the battery 530, the first support member 512, the main printed circuit board 590, and the first flexible printed circuit board 780 of FIG. 5 includes the electronic device 101 of FIGS. 1 to 4; All or part of the configuration of the battery 350 , the first support member 372 , and the main printed circuit board 340 may be the same.

According to various embodiments, the display (not shown) may be electrically connected to the main printed circuit board 590 through the first flexible printed circuit board 580 . According to an embodiment, a display (not shown) may include a second flexible printed circuit board 560 electrically connected to a display driving circuit. The second flexible printed circuit board 560 is connected to the second connector 550 of the first flexible printed circuit board 580 through a first connector (eg, the first connector 422 of FIG. 4 ). can be connected According to an embodiment, the display 420 may include a second display surface 560 on which a first connector (eg, the first connector 422 of FIG. 6 ) is mounted. For example, the second display surface 560 may be coupled to the first connector 422 .

Referring to FIG. 6 , an electronic device (eg, the electronic device 400 of FIG. 5 ) may include a first component assembly 510 and a second component assembly 317 .

In the electronic device 400 of FIG. 6 , the first component assembly 510 and the second component assembly 317 may partially or entirely have the same configuration as the first component assembly and the second component assembly of FIGS. 3 to 5 .

The first component assembly 510 may include a first electrical component and a first connecting member 610 . According to an embodiment, the first electrical component of the first component assembly 510 may be a camera module. The first electrical component may include, for example, a lens assembly and an image sensor. The first connecting member 610 of the first component assembly 510 may extend from the first electrical component and may be disposed in contact with the second connecting member 630 of the second component assembly 317 . For example, the second connecting member 630 of the second component assembly 317 may be disposed in contact with the first connecting member 610 of the first component assembly 510 using the connecting member 620 . According to an embodiment, the connecting member 620 may include a clip or a Poron.

The second component assembly 317 may include a second electric component and a second connection member 630 . According to an embodiment, the second electric component of the second component assembly 317 may be a side key input device module. The second connection member 630 of the second component assembly 317 may extend from the second electrical component and be disposed in contact with the first connection member 610 . For example, the second connecting member 630 of the second component assembly 317 may be stacked on the second connecting member 610 of the first component assembly 510 using the connecting member 620 to be disposed in contact. have. According to an embodiment, the connecting member 620 may include a clip or a Poron.

Referring to FIG. 7A , portions A to A′ may be an enlarged portion of the main printed circuit board 790 .

According to an embodiment, the parts A to A' include a first component assembly 510 (eg, a camera module), a second component assembly 317 (side key input device), a main printed circuit board 590, and a first support member. 740 and display 750 are disclosed.

In the electronic device 400 of FIG. 7A , the main printed circuit board 590 , the first component assembly 510 , the second component assembly 317 , and the display 750 are the main printed circuit boards of FIGS. 3 to 5 , the first Some or all of the components of the first component assembly, the second component assembly, and the display may be the same.

According to an embodiment, the electronic device (eg, the electronic device 400 of FIG. 5 ) includes a main printed circuit board 590 , a first component assembly 510 , a second component assembly 317 , and a support member 750 . and a display 760 . The first component assembly 510 may include a first electric component and a first connection member 720 . The first component assembly 510 may be disposed adjacent to the support member 750 and/or the main printed circuit board 590 . For example, a portion of the first component assembly 510 may be disposed in contact with the support member 740 , and another portion may be disposed in contact with the main printed circuit board 590 .

According to an embodiment, the first electrical component of the first component assembly 510 may be a camera module. The first electrical component may include, for example, a lens assembly and an image sensor. The first connection member 720 of the first component assembly 510 may extend from the first electrical component and may be electrically connected to the main printed circuit board 590 . For example, the first connecting member 720 may extend from one end of the first electrical component toward the main printed circuit board 590 and face the second connecting member 710 of the main printed circuit board 590 . have.

According to an embodiment, the second component assembly 317 may include a second electrical component and a second connection member 730 . The second component assembly 317 may be disposed adjacent to the support member 750 and/or the main printed circuit board 590 . For example, a portion of the second component assembly 317 may be disposed in contact with the support member 750 , and another portion may be disposed in contact with the main printed circuit board 590 .

According to an embodiment, the second electric component of the second component assembly 317 may be a side key input device module. The second electrical component may include, for example, a flexible printed circuit board (FPCB). The second connecting member 730 of the second component assembly 317 extends from one end of the second electrical component toward the main printed circuit board 590, and the connecting member 720 is disposed on the first connecting member of the first component assembly. It can be placed in contact using According to an embodiment, the connecting member 720 may include a clip or a Poron.

According to an embodiment, the main printed circuit board 590 may be disposed adjacent to the first component assembly 510 and/or the second component assembly 317 . For example, a portion of the main printed circuit board 590 is disposed adjacent to the first electrical component of the first component assembly 510 , and a portion of the main printed circuit board 590 is disposed adjacent to the first electrical component of the first component assembly 510 . It may be disposed to be connected to the connection member, and a portion of the main printed circuit board 590 may be disposed to be connected to the second component assembly 317 .

According to an embodiment, the support member 750 may be disposed adjacent to the first component assembly 510 and/or the second component assembly 317 . For example, a portion of the support member 750 is disposed in contact with the first electrical component of the first component assembly 510 , and the other portion of the support member 750 is disposed in contact with the second connection member ( 730), and another portion of the support member may be disposed in contact with the second electrical component of the second component assembly 317. According to an embodiment, at least a portion of the display 760 may be loaded on the support member 750 . According to an embodiment, the support member 750 may include a bracket.

According to an embodiment of the present disclosure, when the second component assembly 317 is loaded on the first connection member of the first component assembly 510 , a mounting space may be further secured. For example, by changing the loading structure of the main printed circuit board as shown in FIG. 7A , a mounting space may be further secured, and the secured mounting space may be used for other purposes (eg, battery expansion). In addition, according to an embodiment of the present disclosure, when viewed from an upward direction (eg, when viewed from above the display 760 ), the first electrical component, the second electrical component, and a part of the main printed circuit board 590 . can be shown overlapping.

Referring to FIG. 7B , the first electric component 510 may be viewed as an enlarged part. According to an embodiment, the first electrical component 510 may be, for example, a camera module. The first electrical component 510 may include an image sensor 516 capable of converting the acquired light into a digital signal, and a camera housing accommodating at least one lens 515 . According to an embodiment, the first connection member 720 of the first electrical component 510 may extend from the first electrical component and may be electrically connected to a main printed circuit board (not shown).

Referring to FIG. 8 , an electric device (eg, the electronic device 400 of FIG. 5 ) may include a first component assembly 810 and a second component assembly 820 .

In the electronic device 400 of FIG. 8 , the main printed circuit board (not shown) and the first component assembly 810 are partially together with the main printed circuit board 590 and the first component assembly 810 of FIGS. 3 to 7B . Or they can all be the same.

According to an embodiment, the electronic device 400 may include a first component assembly 810 , a second component assembly 820 , and a flexible circuit board 850 . The first component assembly 810 may be disposed adjacent to the main circuit board (not shown), the flexible circuit board 850 and/or the second electrical component 820 of the second component assembly. For example, a portion of the first electrical component of the first component assembly may be disposed in contact with a main circuit board (not shown), and a portion of the first electrical component may be disposed in contact with a portion of the second electrical component of the second component assembly. and the other portion may be disposed in contact with a portion of the flexible circuit board.

According to an embodiment, the first component assembly 810 may include a first electrical component and a first connecting member 860 . According to an embodiment, the first electrical component of the first component assembly 810 may be a camera module. The first electrical component may include, for example, a lens assembly and an image sensor. The first connecting member 860 of the first component assembly 810 extends in one direction from the first electrical component to contact the 2-1 connecting member of the flexible circuit board 850 and the main printed circuit board (not shown). can be placed. For example, the first connection member 860 extends in one direction from one end of the first electrical component, and the 2-1 connection member is loaded on the first connection member 860 using the connection member 840 . can be placed in contact.

According to an embodiment, the flexible circuit board 850 may include a 2-1 th connection member and a 2-2 th connection member. According to an exemplary embodiment, the second-first connecting member of the flexible circuit board 850 may be disposed in contact with the first connecting member 860 of the first component assembly 810 . The second-first connecting member of the flexible circuit board 850 may be stacked on the first connecting member 860 using the connecting member 840 to be in contact with the first connecting member 860 . According to an exemplary embodiment, the second-second connecting member of the flexible circuit board 850 may be disposed in contact with the third connecting member of the second component assembly. For example, the third connecting member may be stacked on the second-second connecting member of the flexible circuit board 850 to be in contact with the second connecting member using the connecting member 840 .

According to an embodiment, the second component assembly 820 may include a second electrical component and a third connecting member. According to an embodiment, the second electrical component may include a speaker unit and a speaker enclosure. According to an embodiment, the third connecting member of the second component assembly may be disposed in contact with the second-first connecting member and the connecting member 840 . For example, the third connecting member may extend from one end of the second electrical component, and may be stacked on the 2-2 connecting member using the connecting member 840 to be contacted. According to an embodiment, the connecting member 840 may include a clip or a Poron.

According to an embodiment, the 2-1 connection member of the flexible circuit board 850 is loaded on the first connection member 860 of the first component assembly 810 to be electrically connected to the flexible circuit board 850 . When the third connecting member of the 820 of the second component assembly is loaded on the 2-2 connecting member and electrically connected, a mounting space may be further secured. For example, by changing the loading structure of the main printed circuit board, a mounting space may be further secured, and the secured mounting space may be used for other purposes (eg, battery expansion).

9A and 9B schematically illustrate a structure for electrically connecting electrical components using a connection member between electrical components according to an embodiment of the present disclosure.

Referring to FIGS. 9A and 9B , a configuration in which a first electrical component 930 and a second electrical component 910 are disposed in contact using a connection member 920 is disclosed. The first electrical component 930 and the second electrical component 910 of FIGS. 9A and 9B may be partially or entirely the same as the first electrical component 510 and the second electrical component 317 of FIGS. 3 to 7B. can

9A and 9B are enlarged views of a structure in which a first electrical component 930 (eg, a camera module) and a second electrical component 910 (eg, a side key input device) are electrically connected using a connection member 920 , is showing Referring to FIG. 9A , the connection member 920 may be attached to the first electrical component 930 . The first electrical component 930 and the second electrical component 910 may be electrically connected by loading the second electrical component 910 on the connection member attached to the first electrical component 930 . According to an embodiment, the connection member 920 may include a clip or a poron. According to an embodiment, the second electrical component 910 may include an FPCB.

Referring to FIG. 9B , according to an exemplary embodiment, the connection member 920 may be attached to the second electrical component 910 . The connection member 920 attached to the second electrical component 910 may be loaded on the first electrical component 930 to electrically connect the first electrical component 930 and the second electrical component 910 . According to an embodiment, the connection member 920 may include a clip or a poron. Also, according to an embodiment, the second electrical component 910 may include an FPCB.

10A to 10C are diagrams illustrating a connection structure and an arrangement structure of a flexible printed circuit board according to various embodiments of the present disclosure;

10A to 10C , the electronic device 400 may include a first electrical component, a flexible printed circuit board, and a second electrical component. The first electrical component, the flexible printed circuit board, and the second electrical component of FIGS. 10A to 10C may be partially or all the same as the first electrical component, the printed circuit board, and the second electrical component of FIGS. 3 to 9 .

Referring to FIG. 10A , the structure of the connection part 1010 of the first electrical component, the connection part 1020 of the second electrical component, and the flexible printed circuit board 1030 in the electronic device 400 is illustrated. The connecting portion 1010 of the first electric component and the connecting portion 1020 of the second electric component are loaded on the main printed circuit board 1030 and are electrically connected. According to an embodiment, the first electrical component may include, for example, a camera module, and the second electrical component may include, for example, a side key input device. According to an embodiment, although not shown, the connection part 1010 of the first electrical component and the connection part 1020 of the second electrical component and the flexible printed circuit board 1030 may be electrically connected using a connection member. have. According to an embodiment, the connecting member (not shown) may include a clip or a poron.

10B and 10C , the flexible printed circuit board 1030 may be bent. According to an embodiment, the connection part (not shown) of the first electrical component and the connection part 1020 of the second electrical component may be stacked on the flexible printed circuit board 1030 and electrically connected thereto. In an embodiment, the connection part of the first electrical component (not shown) and the connection part of the second electrical component bend the middle of the two parts connected to the flexible printed circuit board 1030, so that the connection part of the first electrical component and the second electrical component are connected. The connectors may face each other. According to an embodiment of the present disclosure, since the connection portion 1010 of the first electrical component and the connection portion 1020 of the second electrical component are facing each other, when viewed from above, the connection portion of the first electrical component and the second electrical component are Connections may overlap.

According to an embodiment of the present disclosure, by bending the middle portion of the contact between the connection portion 1010 and the second electrical component 1020 of the first electrical component and the flexible printed circuit board 1030, the connection portion of the first electrical component ( 1010) and the second electrical component 1020 may be configured to face each other to further secure a mounting space. For example, by changing the loading structure of the main printed circuit board, there is an effect of further securing a mounting space and using the secured mounting space for other purposes (eg, battery expansion).

According to an embodiment, the electric device (eg, the electronic device 400 of FIG. 5 ) includes a housing (eg, 310 of FIG. 3 ), located in the housing, and a first connecting member (eg, the first connection member (eg, the first of FIG. 7A )). a circuit board (eg, the main circuit board 590 of FIG. 7A ) including a connection member 710 ), a first electrical component, and a first circuit board disposed on the first connection member 710 of the circuit board a first component assembly (eg, the first component assembly 510 of FIG. 7A ) including two connecting members (eg, the second connection member 720 of FIG. 7A ), a second component, and the second component a second component assembly (317) including at least one third connecting member (eg, the third connecting member (730 of FIG. 7A)) disposed on the connecting member (720), wherein the second connecting member (720) The first component is electrically connected to the circuit board by forming an electrical contact with a first connecting member, and the third connecting member forms an electrical contact with the first connecting member through the second connecting member, A second component may be electrically connected to the circuit board.

According to an embodiment, in the electronic device, when the electronic device is viewed from the first direction, at least a portion of the first connecting member, the second connecting member, and the third connecting member may be overlapped.

According to an embodiment, the electronic device further includes a bracket for supporting at least a part of the first component assembly or the second component assembly, and between the bracket and the circuit board, the first connection member, the The second connecting member and the third connecting member may be stacked.

According to an embodiment, the third connection member of the electronic device may be disposed in contact with the bracket.

According to an embodiment, the magnetostatic device may further include a display disposed on the bracket in the housing.

According to an embodiment, the second component assembly of the electronic device may include a flexible printed circuit board.

According to an embodiment, the first connection member and the second connection member of the electronic device may include at least one of a poron and a C-clip.

According to an embodiment, the third connecting member of the electronic device may be a C-Clip.

According to an embodiment, the first component assembly of the electronic device may be a camera module, and the second component assembly may be a sidekey input device module.

According to an embodiment, the electrical device 400 includes a housing 310 , a circuit board 590 positioned within the housing and including a first connecting member in one region, a first electrical component, and the a first component assembly (810) including a second connection member (860) disposed on the first connection member (710) of a circuit board, a 3-1 connection member disposed on the second connection member; A flexible printed circuit board (FPCB, 850) including a 3-2 connection member spaced apart from the 3-1 connection member, and a second electrical component, and extending from the second component, and a second component assembly 820 including a fourth connection member connected to the 3-2 connection member disposed on the flexible circuit board, wherein the 3-1 connection member is in electrical contact with the first connection member to electrically connect the first component assembly to the circuit board, and the 3-2 connection member forms an electrical contact with the fourth connection member to electrically connect the second component assembly and the flexible circuit board can be connected to

According to an embodiment, in the electronic device, when the electronic device is viewed from the first direction, at least a portion of the first connection member and the 3-1 connection member may be overlapped.

According to an embodiment, in the electronic device, when the electronic device is viewed from the first direction, at least a portion of the 3-2 connection member and the fourth connection member may be overlapped.

According to an embodiment, the fourth connection member of the electronic device forms an electrical contact with the first connection member through the second connection member via the flexible circuit board, so that the second component assembly is connected to the circuit board. can be electrically connected to

According to an embodiment, the electronic device further includes a bracket for supporting at least a portion of the first component assembly or the second component assembly, and between the bracket and the circuit board, the first connecting member and the second component assembly. Two connecting members may be stacked.

According to an embodiment, the electronic device may include a display 960 disposed on the bracket in the housing.

According to an embodiment, the first connecting member and the second connecting member of the electronic device may include at least one of a poron and a C-clip.

According to an embodiment, the first component assembly of the electronic device may be a camera module and may include the second speaker module.

According to an embodiment, the 3-1 th connection member and the 3-2 th connection member of the electronic device may include a C-Clip.

According to an embodiment, it may be interpreted that the fourth connection member of the electronic device is in contact with the bracket.

Claims

In an electronic device,

housing;

a circuit board positioned in the housing and including a first connection member;

a first component assembly including a first electrical component and a second connecting member disposed over the first connecting member of the circuit board; and

a second component assembly comprising a second component and at least one third connecting member disposed over the second connecting member;

the second connecting member forms an electrical contact with the first connecting member to electrically connect the first component to the circuit board;

The third connecting member forms an electrical contact with the first connecting member through the second connecting member to electrically connect the second component to the circuit board.
The method of claim 1,

When the electronic device is viewed from the first direction, at least a portion of the first connecting member, the second connecting member, and the third connecting member is overlapped.
The method of claim 1,

The electronic device is

a bracket for supporting at least a portion of the first component assembly or the second component assembly;

An electronic device in which the first connecting member, the second connecting member, and the third connecting member are stacked between the bracket and the circuit board.
4. The method of claim 3,

The third connecting member is disposed in contact with the bracket.
5. The method of claim 4,

The electronic device further comprising a display disposed on the bracket in the housing.
According to claim 1,

The second component assembly includes an electronic device including a flexible printed circuit board (FPCB).
According to claim 1,

The electronic device of claim 1, wherein the first connection member and the second connection member include at least one of a poron and a C-clip.
According to claim 1,

The electronic device according to claim 1, wherein the third connecting member is a C-Clip.
The method of claim 1,

The electronic device of claim 1, wherein the first component assembly is a camera module, and the second component assembly is a sidekey module.
In an electronic device,

housing;

a circuit board positioned in the housing and including a first connection member in one region;

a first component assembly including a first electrical component and a second connecting member extending from the first electrical component and disposed over the first connecting member of the circuit board;

a flexible printed circuit board (FPCB) including at least one 3-1 connection member disposed on the second connection member and a 3-2 connection member spaced apart from the 3-1 connection member;

a second component assembly including a second electrical component and a fourth connection member extending from the second electrical component and disposed on the 3-2 connection member disposed on the flexible circuit board,

the second connecting member forms an electrical contact with the first connecting member to electrically connect the first component assembly to the circuit board;

The 3-2 connection member forms an electrical contact with the fourth connection member to electrically connect the second component assembly and the flexible circuit board.
11. The method of claim 10,

When the electronic device is viewed from the first direction, at least a portion of the first connection member and the 3-1 connection member are disposed to overlap each other.
11. The method of claim 10,

When the electronic device is viewed from the first direction, at least a portion of the 3-2 connection member and the fourth connection member are overlapped.
11. The method of claim 10,

The fourth connecting member forms an electrical contact with the first connecting member through the second connecting member via the flexible circuit board to electrically connect the second component assembly to the circuit board.
11. The method of claim 10,

The electronic device is

a bracket for supporting at least a portion of the first component assembly or the second component assembly;

An electronic device in which the first connecting member and the second connecting member are stacked between the bracket and the circuit board.
11. The method of claim 10,

the electronic device

The electronic device further comprising a bracket supporting at least a portion of the second component assembly and the flexible circuit board.