WO2022220622A1 - Appareil électronique comprenant un cadre de connexion de structure et une plaque - Google Patents

Appareil électronique comprenant un cadre de connexion de structure et une plaque Download PDF

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Publication number
WO2022220622A1
WO2022220622A1 PCT/KR2022/005432 KR2022005432W WO2022220622A1 WO 2022220622 A1 WO2022220622 A1 WO 2022220622A1 KR 2022005432 W KR2022005432 W KR 2022005432W WO 2022220622 A1 WO2022220622 A1 WO 2022220622A1
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WO
WIPO (PCT)
Prior art keywords
electronic device
connection part
edge
welding
frame
Prior art date
Application number
PCT/KR2022/005432
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English (en)
Korean (ko)
Inventor
신광하
박정규
신윤성
조영경
윤병욱
Original Assignee
삼성전자 주식회사
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Application filed by 삼성전자 주식회사 filed Critical 삼성전자 주식회사
Publication of WO2022220622A1 publication Critical patent/WO2022220622A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/04—Metal casings
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/0249—Details of the mechanical connection between the housing parts or relating to the method of assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0017—Casings, cabinets or drawers for electric apparatus with operator interface units
    • H05K5/0018—Casings, cabinets or drawers for electric apparatus with operator interface units having an electronic display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0086—Casings, cabinets or drawers for electric apparatus portable, e.g. battery operated apparatus
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Definitions

  • Embodiments disclosed in this document relate to an electronic device including a structure connecting a frame and a plate.
  • the electronic device may include a frame structure that forms a side surface of the electronic device. Also, the electronic device may include a plate for supporting various electronic components (eg, a battery) therein. During the assembly process of the electronic device, the frame structure and the plate may be coupled, and the frame structure and the plate may be coupled through welding.
  • various electronic components eg, a battery
  • pores may occur when welding metals, and when two different metals are welded, the number and size of pores may vary depending on the silicon (Si) content of the metal to be welded.
  • Si silicon
  • the amount of pores generated They can be numerous and large in size.
  • Various embodiments disclosed in this document provide a structure and method capable of increasing the bonding strength between a frame and a plate of an electronic device.
  • an electronic device may include a metal frame forming at least a portion of a side surface of the electronic device and a metal plate disposed in the electronic device, wherein the metal frame is a first part of the metal frame. may include a first connection portion extending from a point, the metal plate may include a second connection portion corresponding to the first connection portion, wherein the second connection portion is the first connection portion along an edge of the first connection portion may be in contact with, and the metal frame and the metal plate may be coupled to each other by welding performed along at least one edge of the first connection part.
  • an electronic device may include a metal frame forming at least a portion of a side surface of the electronic device and a metal plate disposed in the electronic device, wherein the metal frame is a first part of the metal frame.
  • the metal frame is a first part of the metal frame.
  • the metal frame may include a first connecting portion extending from a point by a first length, the first connecting portion may have a first width shorter than the first length, and the metal plate may include a second connecting portion corresponding to the first connecting portion.
  • the second connection part may be in contact with the first connection part along an edge of the first connection part, and the metal frame and the metal plate may be coupled by welding to the edge of the first connection part.
  • the silicon content of the metal frame may be lower than the silicon content of the metal plate.
  • the bonding strength of the bond between the frame structure and the metal plate may be increased through line welding along the edge of the first connection part of the frame structure.
  • the bonding strength may be increased through double line welding along the first edge and the second edge of the first connection part of the frame structure.
  • FIG. 1 is a block diagram of an electronic device in a network environment, according to various embodiments of the present disclosure
  • FIG. 2 is a view illustrating a front and a side view of an electronic device according to an exemplary embodiment.
  • FIG. 3 is an exploded perspective view of an electronic device according to an exemplary embodiment
  • FIG. 4A is a view illustrating a first connection part and a third connection part and a plate of a frame structure as viewed from a rear side of an electronic device according to an exemplary embodiment.
  • 4B is a view comparing the width length of the first connection part and the third connection part and the length in the extending direction, according to an exemplary embodiment.
  • 4C is a view illustrating a second connection part and a fourth connection part of a plate viewed from the rear side of the electronic device according to an exemplary embodiment.
  • 5A is a view of the first connection part and the second connection part viewed from the front of the electronic device when the first connection part is accommodated in the second connection part, according to an exemplary embodiment
  • FIG. 5B is a view of the first connection part and the second connection part when the first connection part is accommodated in the second connection part, as viewed from the rear side of the electronic device, according to an exemplary embodiment
  • FIG. 6 is a view illustrating a welding part between the first connection part and the second connection part by welding to the first connection part according to an embodiment.
  • FIG. 7 is a view showing an injection member is added in the embodiment of FIG. 6 according to an embodiment.
  • FIG. 8 is a view illustrating a flow chart of processing and coupling of a frame structure and a plate according to an embodiment.
  • FIG. 9 is a diagram illustrating a specific example of a frame structure and a plate corresponding to the flowchart of FIG. 8 according to an embodiment.
  • FIG. 10 is a view for comparing the number and size of pores generated according to the silicon content of the metal to be welded according to an embodiment.
  • FIG. 11 is a diagram for comparing point welding and line welding according to an exemplary embodiment.
  • FIG. 12 is a view for explaining an electrical connection relationship between a first frame and a plate by welding according to an embodiment.
  • FIG. 13 is a graph illustrating antenna radiation performance according to whether a frame structure and a plate are coupled when power is supplied to a point of the frame structure according to an embodiment.
  • FIG. 1 is a block diagram of an electronic device 101 in a network environment 100, according to various embodiments.
  • an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or a second network 199 . It may communicate with at least one of the electronic device 104 and the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 .
  • a first network 198 eg, a short-range wireless communication network
  • a second network 199 e.g., a second network 199
  • the electronic device 101 may communicate with the electronic device 104 through the server 108 .
  • the electronic device 101 includes a processor 120 , a memory 130 , an input module 150 , a sound output module 155 , a display module 160 , an audio module 170 , and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or an antenna module 197 .
  • at least one of these components eg, the connection terminal 178
  • some of these components are integrated into one component (eg, display module 160 ). can be
  • the processor 120 for example, executes software (eg, a program 140) to execute at least one other component (eg, a hardware or software component) of the electronic device 101 connected to the processor 120. It can control and perform various data processing or operations. According to one embodiment, as at least part of data processing or operation, the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190 ) to the volatile memory 132 . may be stored in , process commands or data stored in the volatile memory 132 , and store the result data in the non-volatile memory 134 .
  • software eg, a program 140
  • the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190 ) to the volatile memory 132 .
  • the volatile memory 132 may be stored in , process commands or data stored in the volatile memory 132 , and store the result data in the non-volatile memory 134 .
  • the processor 120 is the main processor 121 (eg, a central processing unit or an application processor) or a secondary processor 123 (eg, a graphic processing unit, a neural network processing unit (eg, a graphic processing unit, a neural network processing unit) a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor).
  • the main processor 121 eg, a central processing unit or an application processor
  • a secondary processor 123 eg, a graphic processing unit, a neural network processing unit (eg, a graphic processing unit, a neural network processing unit) a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor.
  • the main processor 121 e.g, a central processing unit or an application processor
  • a secondary processor 123 eg, a graphic processing unit, a neural network processing unit (eg, a graphic processing unit, a neural network processing unit) a neural processing unit (NPU), an image signal processor, a
  • the secondary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or when the main processor 121 is active (eg, executing an application). ), together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states.
  • the coprocessor 123 eg, an image signal processor or a communication processor
  • may be implemented as part of another functionally related component eg, the camera module 180 or the communication module 190 ). have.
  • the auxiliary processor 123 may include a hardware structure specialized for processing an artificial intelligence model.
  • Artificial intelligence models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself on which the artificial intelligence model is performed, or may be performed through a separate server (eg, the server 108).
  • the learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but in the above example not limited
  • the artificial intelligence model may include a plurality of artificial neural network layers.
  • Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the above example.
  • the artificial intelligence model may include, in addition to, or alternatively, a software structure in addition to the hardware structure.
  • the memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176 ) of the electronic device 101 .
  • the data may include, for example, input data or output data for software (eg, the program 140 ) and instructions related thereto.
  • the memory 130 may include a volatile memory 132 or a non-volatile memory 134 .
  • the program 140 may be stored as software in the memory 130 , and may include, for example, an operating system 142 , middleware 144 , or an application 146 .
  • the input module 150 may receive a command or data to be used by a component (eg, the processor 120 ) of the electronic device 101 from the outside (eg, a user) of the electronic device 101 .
  • the input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).
  • the sound output module 155 may output a sound signal to the outside of the electronic device 101 .
  • the sound output module 155 may include, for example, a speaker or a receiver.
  • the speaker can be used for general purposes such as multimedia playback or recording playback.
  • the receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from or as part of the speaker.
  • the display module 160 may visually provide information to the outside (eg, a user) of the electronic device 101 .
  • the display module 160 may include, for example, a control circuit for controlling a display, a hologram device, or a projector and a corresponding device.
  • the display module 160 may include a touch sensor configured to sense a touch or a pressure sensor configured to measure the intensity of a force generated by the touch.
  • the audio module 170 may convert a sound into an electric signal or, conversely, convert an electric signal into a sound. According to an embodiment, the audio module 170 acquires a sound through the input module 150 , or an external electronic device (eg, a sound output module 155 ) connected directly or wirelessly with the electronic device 101 .
  • the electronic device 102) eg, a speaker or headphones
  • the electronic device 102 may output a sound.
  • the sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the sensed state. can do.
  • the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.
  • the interface 177 may support one or more specified protocols that may be used by the electronic device 101 to directly or wirelessly connect with an external electronic device (eg, the electronic device 102 ).
  • the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
  • the connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102 ).
  • the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).
  • the haptic module 179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic sense.
  • the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
  • the camera module 180 may capture still images and moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
  • the power management module 188 may manage power supplied to the electronic device 101 .
  • the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).
  • PMIC power management integrated circuit
  • the battery 189 may supply power to at least one component of the electronic device 101 .
  • battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.
  • the communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). It can support establishment and communication performance through the established communication channel.
  • the communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication.
  • the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : It may include a local area network (LAN) communication module, or a power line communication module).
  • a wireless communication module 192 eg, a cellular communication module, a short-range communication module, or a global navigation satellite system (GNSS) communication module
  • GNSS global navigation satellite system
  • wired communication module 194 eg, : It may include a local area network (LAN) communication module, or a power line communication module.
  • a corresponding communication module among these communication modules is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (eg, legacy It may communicate with the external electronic device 104 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (eg, a telecommunication network such as a LAN or a WAN).
  • a first network 198 eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)
  • a second network 199 eg, legacy It may communicate with the external electronic device 104 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (eg, a telecommunication network such as a LAN or a WAN).
  • a telecommunication network
  • the wireless communication module 192 uses subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199 .
  • subscriber information eg, International Mobile Subscriber Identifier (IMSI)
  • IMSI International Mobile Subscriber Identifier
  • the electronic device 101 may be identified or authenticated.
  • the wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, a new radio access technology (NR).
  • NR access technology includes high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency) -latency communications)).
  • eMBB enhanced mobile broadband
  • mMTC massive machine type communications
  • URLLC ultra-reliable and low-latency
  • the wireless communication module 192 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example.
  • a high frequency band eg, mmWave band
  • the wireless communication module 192 uses various techniques for securing performance in a high-frequency band, for example, beamforming, massive multiple-input and multiple-output (MIMO), all-dimensional multiplexing. It may support technologies such as full dimensional MIMO (FD-MIMO), an array antenna, analog beam-forming, or a large scale antenna.
  • the wireless communication module 192 may support various requirements defined in the electronic device 101 , an external electronic device (eg, the electronic device 104 ), or a network system (eg, the second network 199 ).
  • the wireless communication module 192 may include a peak data rate (eg, 20 Gbps or more) for realizing eMBB, loss coverage (eg, 164 dB or less) for realizing mMTC, or U-plane latency for realizing URLLC ( Example: Downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) can be supported.
  • a peak data rate eg, 20 Gbps or more
  • loss coverage eg, 164 dB or less
  • U-plane latency for realizing URLLC
  • the antenna module 197 may transmit or receive a signal or power to the outside (eg, an external electronic device).
  • the antenna module 197 may include an antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern.
  • the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected from the plurality of antennas by, for example, the communication module 190 . can be selected. A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna.
  • other components eg, a radio frequency integrated circuit (RFIC)
  • RFIC radio frequency integrated circuit
  • the antenna module 197 may form a mmWave antenna module.
  • the mmWave antenna module comprises a printed circuit board, an RFIC disposed on or adjacent to a first side (eg, bottom side) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band); and a plurality of antennas (eg, an array antenna) disposed on or adjacent to a second side (eg, top or side) of the printed circuit board and capable of transmitting or receiving signals of the designated high frequency band. can do.
  • peripheral devices eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)
  • GPIO general purpose input and output
  • SPI serial peripheral interface
  • MIPI mobile industry processor interface
  • the command or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 .
  • Each of the external electronic devices 102 or 104 may be the same as or different from the electronic device 101 .
  • all or a part of operations executed in the electronic device 101 may be executed in one or more external electronic devices 102 , 104 , or 108 .
  • the electronic device 101 may perform the function or service itself instead of executing the function or service itself.
  • one or more external electronic devices may be requested to perform at least a part of the function or the service.
  • One or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 101 .
  • the electronic device 101 may process the result as it is or additionally and provide it as at least a part of a response to the request.
  • cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used.
  • the electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing.
  • the external electronic device 104 may include an Internet of things (IoT) device.
  • the server 108 may be an intelligent server using machine learning and/or neural networks.
  • the external electronic device 104 or the server 108 may be included in the second network 199 .
  • the electronic device 101 may be applied to an intelligent service (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.
  • FIG. 2 is a view illustrating a front and a side view of an electronic device according to an exemplary embodiment.
  • the electronic device 101 may include a frame structure 210 and a display 260 .
  • the surface on which the display 260 is disposed may be defined as the front surface of the electronic device 101
  • the opposite surface of the front surface may be defined as the rear surface of the electronic device 101
  • a surface surrounding the space between the front and rear surfaces may be defined as a side surface of the electronic device 101 .
  • the frame structure 210 may form at least a portion of a side surface of the electronic device 101 .
  • the frame structure 210 includes a first frame 211 , a second frame 212 , a third frame 213 , a fourth frame 214 and/or a fifth frame 215 . can do.
  • at least a portion of the frame structure 210 may include a conductive material (eg, metal).
  • the segmental part 200 may be disposed on a side surface of the electronic device 101 to be included in the frame structure 210 .
  • the first segment 201 may be positioned between the first frame 211 and the fifth frame 215 .
  • the second segment 202 may be positioned between the first frame 211 and the second frame 212
  • the third segment 202 may be positioned between the second frame 212 and the third frame 213
  • the segmented part 203 may be positioned
  • the fourth segmented part 204 may be positioned between the third frame 213 and the fourth frame 214
  • the fourth frame 214 and the fifth frame A fifth segment 205 may be positioned between the 215 .
  • the segmental part 200 may include an insulating material (eg, ceramic, plastic, or resin).
  • the segmental part 200 may be described as a structure separate from the frame structure 210 .
  • the frame structure 210 may be formed of a conductive material
  • the segmented portion 200 may be formed of a non-conductive material
  • the segmented portion 200 may be formed of a frame structure 210 together with the electronic device 101 . ) can be formed.
  • the display 260 may occupy most of the front surface of the electronic device 101 .
  • the display 260 may emit light from a pixel to transmit information to a user, and the light emitted from the pixel may be transmitted to the outside of the electronic device 101 through the display 260 .
  • the display 260 may include a protective layer such as tempered glass.
  • the electronic device 101 illustrated in FIG. 2 corresponds to one example, and the form of the device to which the technical idea disclosed in this document is applied is not limited.
  • the technical idea disclosed in this document is applicable to various user devices.
  • the technical idea disclosed in this document may be applied to a foldable electronic device that can be folded in a horizontal direction or a foldable electronic device in a vertical direction, a tablet, or a notebook computer.
  • the flexible display may be drawn out from or drawn into the housing of the electronic device depending on the state of the electronic device.
  • the technical idea disclosed in the document may be applied.
  • FIG. 3 is an exploded perspective view of an electronic device according to an exemplary embodiment
  • the electronic device 101 includes a display 260 , a frame structure 210 , a plate 310 , a battery 320 , a printed circuit board (PCB) 330 , and a bracket ( bracket) 340 and/or a rear cover 350 .
  • a display 260 the electronic device 101 includes a display 260 , a frame structure 210 , a plate 310 , a battery 320 , a printed circuit board (PCB) 330 , and a bracket ( bracket) 340 and/or a rear cover 350 .
  • PCB printed circuit board
  • At least a portion of the frame structure 210 may operate as an antenna radiator for transmitting and receiving wireless communication signals.
  • At least a portion of the frame structure 210 used as the antenna radiator may include a conductive material (eg, metal).
  • the plate 310 may be disposed inside the electronic device 101 .
  • the plate 310 may be coupled to a frame structure 210 forming a side surface of the electronic device 101 .
  • the plate 310 may support various components of the electronic device 101 or provide a space for fixing components of the electronic device 101 .
  • the plate 310 may be disposed under the display 260 (eg, in the -z direction) to support the display 260 .
  • the plate 310 may provide a space for fixing the battery 320 .
  • the battery 320 may be fixed by the plate 310 and disposed inside the electronic device 101 .
  • the battery 320 may store power required for the electronic device 101 .
  • battery 320 may include a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.
  • the battery 320 may be integrally disposed inside the electronic device 101 , or may be disposed to be detachably attached from the electronic device 101 .
  • the PCB 330 may be disposed between the plate 310 and the bracket 340 .
  • the PCB 330 may be supported by a plate 310 and/or a bracket 340 .
  • a processor 120 , a memory 130 , and an interface 177 may be located in the PCB 330 .
  • the PCB 330 may provide an electrical connection path between various components of the electronic device 101 .
  • the camera module 112 , the battery 320 , the display 260 and the processor 120 are each directly or indirectly electrically connected to the PCB 330 , and the processor 120 is connected to the PCB 330 . It may be operatively coupled to the camera module 112 , the battery 320 , and the display 260 through an electrical connection path provided by the .
  • the bracket 340 may be disposed under the PCB 330 and the battery 320 (eg, in the -z direction) to support the PCB 330 and the battery 320 .
  • the bracket 340 may include a metal and/or a non-metal (eg, a polymer).
  • the rear cover 350 may be disposed under the bracket 340 (eg, -z direction). In an embodiment, the rear cover 350 may be physically coupled to the frame structure 210 .
  • the rear cover 350 may be coupled to the frame structure 210 by at least one coupling member (eg, a screw) not shown.
  • the back cover 350 may be coupled to the frame structure 210 by an adhesive member (eg, an adhesive tape or an adhesive solution) not shown.
  • the back cover 350 is made of coated or tinted glass, ceramic, polymer, metal (eg, aluminum, stainless steel, or magnesium), or a combination of at least two of the above materials. can be formed.
  • the rear cover 350 may include a curved portion that is bent toward the frame structure 210 forming at least a portion of the side surface and extends seamlessly.
  • FIG. 4A is a view illustrating a first connection part and a third connection part and a plate of a frame structure as viewed from a rear side of an electronic device according to an exemplary embodiment.
  • the first frame 211 may be coupled to the plate 310 .
  • the first frame 211 may include a first portion 211a coupled to the plate 310 .
  • the first frame 211 includes a first connection part 411 and a third connection part 412 extending in an inward direction of the electronic device 101 . may include.
  • the first connection part 411 may include a plurality of surfaces.
  • the first connection part 411 may include a first surface 411a, a second surface 411b parallel to the first surface 411a, and/or a third surface 411c.
  • the first surface 411a may be in contact with the third surface 411c and the first edge 431
  • the second surface 411b may be in contact with the third surface 411c and the second edge 432 .
  • the first surface 411a may correspond to a surface facing the +z direction
  • the second surface 411b may correspond to a surface facing the -z direction
  • the third surface 411c may be a surface facing the -z direction. It may correspond to a surface surrounding the space between the first surface 411a and the second surface 411b.
  • the third connection part 412 may include a plurality of surfaces.
  • the third connection part 412 may include a fourth surface 412a, a fifth surface 412b parallel to the fourth surface 412a, and a sixth surface 412c.
  • the fourth surface 412a and the sixth surface 412c may contact the third edge 433
  • the fifth surface 412b and the sixth surface 412c may contact the fourth edge 434 .
  • the fourth surface 412a may correspond to a surface facing the +z direction
  • the fifth surface 412b may correspond to a surface facing the -z direction
  • the sixth surface 412c may correspond to the It may correspond to a surface surrounding the space between the fourth surface 412a and the fifth surface 412b.
  • first edge 431 illustrated in FIG. 4A may extend along the third surface 411c like the second edge 432 .
  • third edge 433 illustrated in FIG. 4A is covered by the third connection part 412 and only partially illustrated in the drawing, but may extend along the sixth surface 412c like the fourth edge 434 .
  • first connection part 411 and/or the third connection part 412 may have various shapes.
  • first connection part 411 and/or the third connection part 412 may have a U-shaped shape.
  • first connection part 411 and/or the third connection part 412 may have a rectangular shape.
  • the first connection part 411 and the third connection part 412 of the first frame 211 disclosed in this document may be replaced with terms of a first coupling protrusion and a second coupling protrusion in order, respectively.
  • the position and number of the connection parts (eg, the first connection part 411 ) of the first frame 211 are not limited to the position and number of the connection parts shown in FIG. 4A .
  • the first frame 211 may further include a connection part in addition to the first connection part 411 and the third connection part 412 .
  • the first connection part 411 and the third connection part 412 may be positioned side by side.
  • first connection part 411 and the third connection part 412 for coupling between the first frame 211 and the plate 310 are illustrated, but this is an example, and the second frame of the frame structure 210 is shown.
  • 212 , the third frame 213 , the fourth frame 214 , and/or the fifth frame 215 may include additional connections for coupling with the plate 310 .
  • the plate 310 includes a second frame 212 , a third frame 213 , a fourth frame 214 and/or a second connection part 421 and a fourth connection part 422 , which will be described later in FIG. 4C . 5 It may further include a connection portion corresponding to the additional connection portion of the frame 215 .
  • 4B is a view comparing the width length of the first connection part and the third connection part and the length in the extending direction, according to an exemplary embodiment.
  • the first connection part 411 and/or the third connection part 412 have a length longer than a width and are located at a point of the first frame 211 ( 101) may extend in the inward direction.
  • the first connecting portion 411 may have a width length of the first length L1
  • the first connecting portion 411 may have a second length L2 longer than the first length L1 and the first It may extend in a first direction (eg, a +x direction) from a first point of the frame 211 .
  • the third connecting portion 412 may have a width length of the third length L3, and the third connecting portion 412 may have a fourth length L4 longer than the third length L3. It may extend in a second direction (eg, a +y direction) from a second point of the first frame.
  • 4C is a view illustrating a second connection part and a fourth connection part of a plate viewed from the rear side of the electronic device according to an exemplary embodiment.
  • the plate 310 may include a second portion 310a coupled to the frame structure 210 .
  • the plate 310 may include a second connection part 421 corresponding to the first connection part 411 in the second part 310a, A fourth connection part 422 may be included to correspond to the third connection part 412 .
  • the second connection part 421 and/or the fourth connection part 422 of the plate 310 has the shape of the first connection part 411 and/or the third connection part 412 of the first frame 211 . may have a groove shape corresponding to .
  • the second connection part 421 may have a U-shaped groove shape.
  • the second connection part 421 and the fourth connection part 422 disclosed in this document may be replaced with terms of a first accommodating groove and a second accommodating groove in order, respectively.
  • the first frame 211 may include a first coupling protrusion and/or a second coupling protrusion
  • the plate 310 may include a first receiving groove and/or a second coupling protrusion corresponding to the first coupling protrusion. It may include a second receiving groove corresponding to the.
  • the first coupling protrusion of the first frame 211 may be coupled to the first receiving groove of the plate 310
  • the second coupling protrusion of the first frame 211 may be coupled to the second receiving recess of the plate 310 . can do.
  • 5A is a view of the first connection part and the second connection part viewed from the front of the electronic device when the first connection part is accommodated in the second connection part, according to an exemplary embodiment
  • the first connection part 411 may be engaged with the second connection part 421 along the first edge 431 .
  • the third connection part 412 may be engaged with the fourth connection part 422 along the third edge 433 .
  • the second connection part 421 may contact the third surface 411c of the first connection part 411 in one area.
  • the fourth connection part 422 may contact the sixth surface 412c of the third connection part 412 in one area.
  • FIG. 5B is a view of the first connection part and the second connection part when the first connection part is accommodated in the second connection part, as viewed from the rear side of the electronic device, according to an exemplary embodiment
  • the first connection part 411 may be engaged with the second connection part 421 along the second edge 432 .
  • the third connector 412 may be engaged with the fourth connector 422 along the fourth edge 434 .
  • FIG. 6 is a view illustrating a welding part between the first connection part and the second connection part by welding to the first connection part according to an embodiment.
  • the first frame 211 and the first connection part 411 and the third connection part 412 respectively extending from the first frame 211 are made of silicon ( Si) may include a low metal content.
  • the first frame 211, the first connection part 411, and the third connection part 412 may include a metal having a silicon content of about 0.3 to 1.0% (eg, an Al 60-based aluminum alloy).
  • the plate 310 may include a metal (eg, S33N) having a silicon content of about 6.2 to 6.7%.
  • the number or size of pores generated by welding may be smaller than when welding to a metal having a relatively high silicon content.
  • welding may be performed for a longer period of time than when welding to a metal having a relatively high silicon content. Therefore, when welding to a metal having a relatively low silicon content, cracks can be prevented by reducing the number and size of pores, and joint strength can be increased through long-term welding.
  • welding may be performed on the first connection portion 411 having a relatively low silicon content in order to couple the first connection portion 411 and the second connection portion 421 .
  • a relatively small number of pores may be generated, and welding may be possible for a long time. Accordingly, the first connection part 411 and the second connection part 421 may be coupled to each other with high bonding strength.
  • the third connection part 412 and the fourth connection part 422 may be coupled with high bonding strength.
  • the first connecting portion 411 may be welded along the first edge 431 .
  • the first connecting portion 411 may be welded at the first welding portion 611 along the first edge 431 to be coupled to the second connecting portion 421 .
  • the first connection portion 411 may be welded at the second welding portion 612 along the first edge 431 to be coupled to the second connection portion 421 .
  • the first connecting portion 411 may be welded along the second edge 432 .
  • the first connection portion 411 may be welded to the third welding portion 613 along the second edge 432 to be coupled to the second connection portion 421 .
  • first connection portion 411 may be welded at the fourth weld portion 614 along the second edge 432 to be coupled to the second connection portion 421 .
  • first connection part 411 and the second connection part 421 are double welded along the first edge 431 and the second edge 432 and combined, the first connection part 411 and the second connection part 421 are Compared to the case of welding along one edge, it can be joined more reliably.
  • the third connection part 412 may be welded along the third edge 433 .
  • the third connection portion 412 may be welded at the fifth welding portion 615 along the third edge 433 to be coupled to the fourth connection portion 422 .
  • the third connection portion 412 may be welded at the sixth weld portion 616 along the third edge 433 to be coupled to the fourth connection portion 422 .
  • the third connector 412 may be welded along the fourth edge 434 .
  • the third connection portion 412 may be welded along the fourth edge 434 at the seventh weld portion 617 to be coupled to the fourth connection portion 422 .
  • the third connector 412 may be welded along the fourth edge 434 at the eighth welded portion 618 to engage the fourth connector 422 .
  • the third connecting portion 412 and the fourth connecting portion 422 are double welded along the third edge 433 and the fourth edge 434 and coupled, the third connecting portion 412 and the fourth connecting portion 422 are Compared to the case of welding along one edge, it can be joined more reliably.
  • the first connection part 411 and the second connection part 421 are line-welded along the first edge 431 and/or the second edge 432 , the welding to a point Compared to point welding, the first connection part 411 and the second connection part 421 may be coupled with high bonding strength. Accordingly, it is possible to prevent the disconnection of the connection between the first connection part 411 and the second connection part 421 due to the occurrence of a crack when there is an external shock or shaking with respect to the electronic device 101 .
  • the third connection portion 412 and the fourth connection portion 422 are line welded along the third edge 433 and/or the fourth edge 434, the third connection portion 412 and the fourth connection portion ( 422) can be combined with high bonding strength.
  • the first welding part through long-time welding to the first connection part 411 having a low silicon content 611 , second welded portion 612 , third welded portion 613 , and/or fourth welded portion 614 may have a weld depth greater than or equal to a specified length.
  • the second welding portion 612 may have a welding depth of the first depth D1 .
  • the first welding portion 611 , the second welding portion 612 , the third welding portion 613 and/or the fourth welding portion of the first connection portion 411 and the second connection portion 421 may have a weld depth greater than or equal to a specified length.
  • the second welding portion 612 may have a welding depth of the first depth D1 .
  • the first welding portion 611 , the second welding portion 612 , the third welding portion 613 and/or the fourth welding portion of the first connection portion 411 and the second connection portion 421 may have a weld depth greater than or equal to a specified length.
  • the second welding portion 612 may have a welding depth of
  • the first connecting portion 411 and the second connecting portion 421 may be joined with a high joint strength.
  • the fifth welded portion 615 , the sixth welded portion 616 , the seventh welded portion 617 , and/or the eighth welded portion that is a welded portion of the third and fourth connecting portions 412 and 422 .
  • the portion 618 has a welding depth greater than or equal to a specified length, the third connection portion 412 and the fourth connection portion 422 may be joined with high bonding strength.
  • FIG. 7 is a view showing an injection member is added in the embodiment of FIG. 6 according to an embodiment.
  • the electronic device 101 may further include a first connection part 411 , a third connection part 412 , and/or an injection member 700 disposed on the plate 310 .
  • the injection member 700 may be disposed in a first direction (eg, a +z direction) and/or a second direction (eg, a -z direction) with respect to the plate 310 .
  • the injection member 700 is disposed adjacent to the first connection part 411, the third connection part 412, and the plate 310, and the first connection part 411, the first connection part 411 when there is an external shock or shaking. 3 It is possible to minimize the impact applied to the connection portion 412 and the plate 310 .
  • the injection member 700 may include an insulating material (eg, plastic resin), and the frame structure 210 and the plate 310 are electrically connected through the first connection part 411 and the second connection part 421 . impact can be minimized.
  • the injection member 700 including the insulating material is formed with the first connection part 411 and the second connection part 421 . and may not be electromagnetically coupled.
  • FIG. 8 is a view illustrating a flow chart of processing and coupling of a frame structure and a plate according to an embodiment.
  • the frame structure 210 and the plate 310 of the electronic device 101 may be processed in process 801 according to an embodiment.
  • the frame structure 210 and the plate 310 to be processed may include a conductive material (eg, aluminum).
  • the silicon content of the frame structure 210 may be lower than the silicon content of the plate 310 .
  • welding of the frame structure 210 and the plate 310 may be performed.
  • welding between the frame structure 210 and the plate 310 may be performed through laser welding on the frame structure 210 having a relatively low silicon content.
  • welding may be performed according to various welding methods (eg, ultrasonic welding).
  • welding to the frame structure 210 may be performed through line welding along an edge of a connection portion (eg, the first connection portion 411) of the frame structure 210 .
  • insert injection may be performed on the frame structure 210 and the plate 310 coupled by welding.
  • the injection member 700 may be disposed adjacent to the frame structure 210 and the plate 310 as shown in FIG. 7 .
  • Additional processing may be performed on the frame structure 210 in step 807 according to an embodiment.
  • cutting of the edge of the frame structure 210 may be performed according to the standard of the electronic device 101 .
  • FIG. 9 is a diagram illustrating a specific example of a frame structure and a plate corresponding to the flowchart of FIG. 8 according to an embodiment.
  • the first step of FIG. 9 shows the frame structure 210 and the plate 310 formed through the process 801 of FIG. 8 .
  • the second step shows the frame structure 210 and the plate 310 joined by welding in step 803 of FIG. 8 .
  • the third step shows the injection member 700 inserted into the frame structure 210 and plate 310 joined in step 805 of FIG. 8 .
  • the fourth step is a diagram illustrating a shape in which additional processing is performed along a portion of an edge of the frame structure 210 according to the standard of the electronic device 101 in step 807 of FIG. 8 .
  • FIG. 10 is a view for comparing the number and size of pores generated according to the silicon content of the metal to be welded according to an embodiment.
  • a metal having a relatively low silicon content (eg, Al 60 series) according to an embodiment may have a smaller number of pores generated by welding compared to a metal having a relatively high silicon content (eg, S33N). and the pore size may be smaller. Accordingly, cracks due to pores generated by welding to metals having a relatively low silicon content (eg, AL 60 series) can be prevented, and high bonding strength can be secured during welding.
  • the frame structure 210 and the plate 310 through welding to a connection portion containing a metal having a relatively low silicon content provides a high bonding strength when combined.
  • FIG. 11 is a diagram for comparing point welding and line welding according to an exemplary embodiment.
  • connection through welding may be possible in a wider area than point welding.
  • the frame structure 210 and the plate 310 through line welding for the connection portion may be combined in a larger area than point welding. Accordingly, the frame structure 210 and the plate 310 may have high bonding strength when combined through line welding.
  • line welding may refer to a welding method in which welding is performed for a length longer than a specified length along an edge of a connection part (eg, the first connection part 411 ) of the frame structure 210 .
  • FIG. 12 is a view for explaining an electrical connection relationship between a first frame and a plate by welding according to an embodiment.
  • the first frame 211 and the plate 310 may be electrically connected to each other through at least one welding portion with respect to the first connecting portion 411 .
  • the first frame 211 and the plate 310 may include a first welded portion 611 , a second welded portion 612 , a third welded portion 613 and/or a first welded portion 613 to the first connection 411 . It may be electrically connected through the fourth welding portion 614 .
  • the first frame 211 and the plate 310 are electrically connected to each other.
  • the first frame 211 and the plate 310 are connected to the second It may be electrically connected through a weld portion 612 , a third weld portion 613 , and/or a fourth weld portion 614 .
  • the first frame 211 and the plate 310 are connected to the fourth welding portion It may be electrically connected through (614).
  • the first frame 211 and the plate 310 may be electrically connected to each other through at least one welding portion to the third connecting portion 412 .
  • the first frame 211 and the plate 310 may be connected to a fifth welded portion 615 , a sixth welded portion 616 , a seventh welded portion 617 and/or to the third connection 412 . It may be electrically connected through the eighth welding portion 618 .
  • the first frame 211 and the plate 310 are first 3 It may be electrically connected through the connection part 412 . Accordingly, the first frame 211 and the plate 310 may have a stable electrical connection relationship through the plurality of welding parts.
  • FIG. 13 is a graph illustrating antenna radiation performance according to whether a frame structure and a plate are coupled when power is supplied to a point of the frame structure according to an embodiment.
  • a radiation performance graph 1301 of (hereinafter, a first graph) is shown.
  • the antenna radiation performance graph 1302 using the frame structure 210 (hereinafter, A second graph) is shown.
  • the second graph 1302 shows a lower radiation efficiency than the first graph 1301 in a frequency band of about 1,400 to 1800 MHz. Therefore, when the coupling between the frame structure 210 and the plate 310 is separated, it can be seen that the antenna using the frame structure 210 of the electronic device 101 deteriorates in radiation efficiency in a frequency band of about 1,400 to 1800 MHz. have.
  • the frame structure 210 and the plate 310 may be electrically connected through a plurality of welding portions. Even if some of the welding parts are broken, the frame structure 210 and the plate 310 may be electrically connected, and accordingly, the electronic device 101 deteriorates radiation efficiency in a frequency band of about 1,400 to 1800 MHz. can be prevented from becoming
  • An electronic device may include a metal frame forming at least a portion of a side surface of the electronic device and a metal plate disposed in the electronic device, wherein the metal frame is a first point of the metal frame may include a first connection portion extending from the , the metal plate may include a second connection portion corresponding to the first connection portion, the second connection portion along the edge of the first connection portion and the first connection portion may be in contact, and the metal frame and the metal plate may be coupled to each other by welding performed along at least one edge of the first connection part.
  • the silicon content of the metal frame may be lower than the silicon content of the metal plate.
  • the silicon content of the metal frame may correspond to 0.3 to 1.0%.
  • the silicon content of the metal plate may correspond to 6.2 to 6.7%.
  • the first connection part may include a first surface, a second surface parallel to the first surface, and a third surface surrounding the first surface and the second surface, and the first The at least one edge of the connection part may include a first edge formed by the first surface and the third surface and a second edge formed by the second surface and the third surface.
  • the metal frame and the metal plate may be electrically connected by welding to the first edge.
  • the metal frame and the metal plate may be electrically connected by welding to the first edge and the second edge.
  • the second connection part may be coupled to the third surface of the first connection part in one region.
  • the metal frame and the metal plate may be coupled to each other having a predetermined depth in a direction from the first edge to the second edge.
  • the first connection part may have a first width, and the first connection part may extend from the first point of the metal frame by a first length greater than the first width.
  • the first connection part may have a U-shaped shape.
  • an injection member disposed adjacent to the first connection part and the second connection part may be further included.
  • the first connection part may extend inward of the electronic device from the first point of the metal frame.
  • the metal frame may include a third connection part extending from a second point of the metal frame
  • the metal plate may include a fourth connection part corresponding to the third connection part
  • the A third connection part may be in contact with the fourth connection part along an edge of the fourth connection part
  • the metal frame and the metal plate may be coupled by welding to at least one edge of the fourth connection part.
  • the first connection part and the third connection part of the metal frame may be electrically connected through the metal plate.
  • the electronic device may include a metal frame forming at least a part of a side surface of the electronic device and a metal plate disposed in the electronic device, wherein the metal frame is formed at a first point at a first point of the metal frame.
  • the metal frame may include a first connection portion extending by a length, the first connection portion may have a first width shorter than the first length, the metal plate may include a second connection portion corresponding to the first connection portion and the second connection part may be in contact with the first connection part along an edge of the first connection part, and the metal frame and the metal plate may be coupled to each other by welding to the edge of the first connection part, and
  • the silicon content of the metal frame may be lower than the silicon content of the metal plate.
  • the silicon content of the metal frame may correspond to 0.3 to 1.0%.
  • the silicon content of the metal plate may correspond to 6.2 to 6.7%.
  • the metal frame may include a third connection part extending from a second point of the metal frame
  • the metal plate may include a fourth connection part corresponding to the third connection part
  • the A fourth connection part may be in contact with the third connection part along an edge of the third connection part, and the metal frame and the metal plate may be coupled by welding to the edge of the third connection part.
  • the first connection part and the second connection part may be electrically connected by welding to an edge of the first connection part.
  • the electronic device may have various types of devices.
  • the electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device.
  • a portable communication device eg, a smart phone
  • a computer device e.g., a smart phone
  • a portable multimedia device e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a wearable device e.g., a smart bracelet
  • a home appliance device e.g., a home appliance
  • first, second, or first or second may simply be used to distinguish an element from other elements in question, and may refer elements to other aspects (e.g., importance or order) is not limited. It is said that one (eg, first) component is “coupled” or “connected” to another (eg, second) component, with or without the terms “functionally” or “communicatively”. When referenced, it means that one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.
  • module used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as, for example, logic, logic block, component, or circuit.
  • a module may be an integrally formed part or a minimum unit or a part of the part that performs one or more functions.
  • the module may be implemented in the form of an application-specific integrated circuit (ASIC).
  • ASIC application-specific integrated circuit
  • Various embodiments of the present document include one or more instructions stored in a storage medium (eg, internal memory 136 or external memory 138) readable by a machine (eg, electronic device 101).
  • a storage medium eg, internal memory 136 or external memory 138
  • the processor eg, the processor 120
  • the device eg, the electronic device 101
  • the one or more instructions may include code generated by a compiler or code executable by an interpreter.
  • the device-readable storage medium may be provided in the form of a non-transitory storage medium.
  • 'non-transitory' only means that the storage medium is a tangible device and does not contain a signal (eg, electromagnetic wave), and this term is used in cases where data is semi-permanently stored in the storage medium and It does not distinguish between temporary storage cases.
  • a signal eg, electromagnetic wave
  • the method according to various embodiments disclosed in this document may be provided in a computer program product (computer program product).
  • Computer program products may be traded between sellers and buyers as commodities.
  • the computer program product is distributed in the form of a machine-readable storage medium (eg compact disc read only memory (CD-ROM)), or via an application store (eg Play Store TM ) or on two user devices ( It can be distributed (eg downloaded or uploaded) directly, online between smartphones (eg: smartphones).
  • a portion of the computer program product may be temporarily stored or temporarily created in a machine-readable storage medium such as a memory of a server of a manufacturer, a server of an application store, or a relay server.
  • each component eg, a module or a program of the above-described components may include a singular or a plurality of entities, and some of the plurality of entities may be separately disposed in other components. have.
  • one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added.
  • a plurality of components eg, a module or a program
  • the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. .
  • operations performed by a module, program, or other component are executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations are executed in a different order, or omitted. , or one or more other operations may be added.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Signal Processing (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

Un dispositif électronique selon divers modes de réalisation de la présente divulgation peut comprendre un cadre métallique formant au moins une partie de la surface latérale de l'appareil électronique, et une plaque métallique disposée dans l'appareil électronique. Le cadre métallique peut comprendre une première partie de liaison qui s'étend à partir d'un premier point du cadre métallique, et la plaque métallique peut comprendre une seconde partie de liaison correspondant à la première partie de liaison. La seconde partie de liaison peut venir en contact avec la première partie de liaison le long du bord de la première partie de liaison, et le cadre métallique et la plaque métallique peuvent être accouplés par l'intermédiaire d'une opération de soudage réalisée le long d'au moins un bord de la première partie de liaison.
PCT/KR2022/005432 2021-04-14 2022-04-14 Appareil électronique comprenant un cadre de connexion de structure et une plaque WO2022220622A1 (fr)

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KR1020210048590A KR20220142173A (ko) 2021-04-14 2021-04-14 프레임과 플레이트를 연결하는 구조를 포함하는 전자 장치

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002124781A (ja) * 2000-10-12 2002-04-26 Furukawa Electric Co Ltd:The 電子機器用筐体
KR101618694B1 (ko) * 2015-01-02 2016-05-18 안성룡 금속 케이스 제조방법
KR20190027304A (ko) * 2017-09-06 2019-03-14 진야하오 정밀 금속 과학기술 (심천) 주식회사 분절식 외부 프레임을 구비하는 휴대폰 중간판
KR20190037738A (ko) * 2017-09-29 2019-04-08 엘지전자 주식회사 이동 단말기
US20200384585A1 (en) * 2018-01-17 2020-12-10 Guangdong Everwin Precision Technology Co., Ltd. Process of processing middle frame of mobile phone

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002124781A (ja) * 2000-10-12 2002-04-26 Furukawa Electric Co Ltd:The 電子機器用筐体
KR101618694B1 (ko) * 2015-01-02 2016-05-18 안성룡 금속 케이스 제조방법
KR20190027304A (ko) * 2017-09-06 2019-03-14 진야하오 정밀 금속 과학기술 (심천) 주식회사 분절식 외부 프레임을 구비하는 휴대폰 중간판
KR20190037738A (ko) * 2017-09-29 2019-04-08 엘지전자 주식회사 이동 단말기
US20200384585A1 (en) * 2018-01-17 2020-12-10 Guangdong Everwin Precision Technology Co., Ltd. Process of processing middle frame of mobile phone

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