WO2022197155A1 - Dispositif électronique comprenant une carte de circuit imprimé souple - Google Patents

Dispositif électronique comprenant une carte de circuit imprimé souple Download PDF

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Publication number
WO2022197155A1
WO2022197155A1 PCT/KR2022/003841 KR2022003841W WO2022197155A1 WO 2022197155 A1 WO2022197155 A1 WO 2022197155A1 KR 2022003841 W KR2022003841 W KR 2022003841W WO 2022197155 A1 WO2022197155 A1 WO 2022197155A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic device
circuit board
connecting member
component
component assembly
Prior art date
Application number
PCT/KR2022/003841
Other languages
English (en)
Korean (ko)
Inventor
박정훈
조정규
강승구
이용승
손동일
Original Assignee
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전자 주식회사 filed Critical 삼성전자 주식회사
Publication of WO2022197155A1 publication Critical patent/WO2022197155A1/fr

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0262—Details of the structure or mounting of specific components for a battery compartment
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0274—Details of the structure or mounting of specific components for an electrical connector module
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit

Definitions

  • the battery 189 may supply power to at least one component of the electronic device 101 .
  • battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.
  • first”, “second”, or “first” or “second” may simply be used to distinguish the component from other such components, and refer to those components in other aspects (e.g., importance or order) is not limited. It is said that one (eg, first) component is “coupled” or “connected” to another (eg, second) component, with or without the terms “functionally” or “communicatively”. When referenced, it means that one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.
  • module used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as, for example, logic, logic block, component, or circuit.
  • a module may be an integrally formed part or a minimum unit or a part of the part that performs one or more functions.
  • the module may be implemented in the form of an application-specific integrated circuit (ASIC).
  • ASIC application-specific integrated circuit
  • the first camera module 205 and/or the sensor module among the camera modules 305 and 312 communicates with the external environment through the transparent area of the display 301 in the internal space of the electronic device 101 . It can be arranged so as to be in contact.
  • the region facing the first camera module 305 of the display 301 may be formed as a transmissive region having a transmittance designated as a part of the region displaying content.
  • the transmissive region may be formed to have a transmittance in a range of about 5% to about 20%.
  • the first support member 372 may be disposed inside the electronic device 101 and connected to the side bezel structure 318 , or may be integrally formed with the side bezel structure 318 .
  • the first support member 372 may be formed of, for example, a metal material and/or a non-metal (eg, polymer) material.
  • the first support member 372 may have a display 330 coupled to one surface and a printed circuit board 340 coupled to the other surface.
  • the second electric component of the second component assembly 317 may be a side key input device module.
  • the second electrical component may include, for example, a flexible printed circuit board (FPCB).
  • the second connecting member 730 of the second component assembly 317 extends from one end of the second electrical component toward the main printed circuit board 590, and the connecting member 720 is disposed on the first connecting member of the first component assembly. It can be placed in contact using
  • the connecting member 720 may include a clip or a Poron.
  • the support member 750 may be disposed adjacent to the first component assembly 510 and/or the second component assembly 317 .
  • a portion of the support member 750 is disposed in contact with the first electrical component of the first component assembly 510
  • the other portion of the support member 750 is disposed in contact with the second connection member ( 730)
  • another portion of the support member may be disposed in contact with the second electrical component of the second component assembly 317.
  • at least a portion of the display 760 may be loaded on the support member 750 .
  • the support member 750 may include a bracket.
  • a mounting space when the second component assembly 317 is loaded on the first connection member of the first component assembly 510 , a mounting space may be further secured.
  • a mounting space may be further secured, and the secured mounting space may be used for other purposes (eg, battery expansion).
  • the first electrical component, the second electrical component, and a part of the main printed circuit board 590 . can be shown overlapping.
  • the second component assembly 820 may include a second electrical component and a third connecting member.
  • the second electrical component may include a speaker unit and a speaker enclosure.
  • the third connecting member of the second component assembly may be disposed in contact with the second-first connecting member and the connecting member 840 .
  • the third connecting member may extend from one end of the second electrical component, and may be stacked on the 2-2 connecting member using the connecting member 840 to be contacted.
  • the connecting member 840 may include a clip or a Poron.
  • connection member 920 may be attached to the first electrical component 930 .
  • the first electrical component 930 and the second electrical component 910 may be electrically connected by loading the second electrical component 910 on the connection member attached to the first electrical component 930 .
  • the connection member 920 may include a clip or a poron.
  • the second electrical component 910 may include an FPCB.
  • the third connection member of the electronic device may be disposed in contact with the bracket.

Landscapes

  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Control Of Eletrric Generators (AREA)
  • Control Of Electric Motors In General (AREA)
  • Electronic Switches (AREA)
  • Telephone Set Structure (AREA)

Abstract

Un dispositif électronique selon divers modes de réalisation de la présente divulgation comprend : un premier ensemble composant comprenant un boîtier, une carte de circuit imprimé positionnée à l'intérieur du boîtier et ayant un premier élément de connexion disposé dans une région, un premier composant, et un deuxième élément de connexion s'étendant à partir du premier composant et disposé sur le premier élément de connexion de la carte de circuit imprimé ; et un second ensemble composant comprenant un second composant et au moins un troisième élément de connexion s'étendant à partir du second composant et disposé sur le deuxième élément de connexion, le deuxième élément de connexion formant un contact électrique avec le premier élément de connexion de façon à connecter électriquement le premier composant à la carte de circuit imprimé, et le troisième élément de connexion formant un contact électrique avec le premier élément de connexion par l'intermédiaire du deuxième élément de connexion de façon à connecter électriquement le second composant à la carte de circuit imprimé. Divers autres modes de réalisation sont possibles.
PCT/KR2022/003841 2021-03-19 2022-03-18 Dispositif électronique comprenant une carte de circuit imprimé souple WO2022197155A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2021-0036004 2021-03-19
KR1020210036004A KR20220131013A (ko) 2021-03-19 2021-03-19 플렉서블 회로기판를 포함하는 전자장치

Publications (1)

Publication Number Publication Date
WO2022197155A1 true WO2022197155A1 (fr) 2022-09-22

Family

ID=83321542

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2022/003841 WO2022197155A1 (fr) 2021-03-19 2022-03-18 Dispositif électronique comprenant une carte de circuit imprimé souple

Country Status (2)

Country Link
KR (1) KR20220131013A (fr)
WO (1) WO2022197155A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170013682A (ko) * 2015-07-28 2017-02-07 삼성전자주식회사 안테나 장치 및 그것을 포함하는 전자 장치
KR20170140691A (ko) * 2016-06-13 2017-12-21 삼성전자주식회사 고주파 전송회로를 포함하는 전자 장치
KR20180115153A (ko) * 2017-04-12 2018-10-22 삼성전자주식회사 도전성 경로를 가지는 지지 구조물 및 이를 포함하는 전자 장치
KR20190027141A (ko) * 2017-09-06 2019-03-14 삼성전자주식회사 인쇄 회로 기판 어셈블리
KR20190101545A (ko) * 2018-02-23 2019-09-02 삼성전자주식회사 휘어진 상태로 유지되는 가요성 회로기판을 포함하는 카메라 모듈 어셈블리 및 이를 포함하는 전자 장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170013682A (ko) * 2015-07-28 2017-02-07 삼성전자주식회사 안테나 장치 및 그것을 포함하는 전자 장치
KR20170140691A (ko) * 2016-06-13 2017-12-21 삼성전자주식회사 고주파 전송회로를 포함하는 전자 장치
KR20180115153A (ko) * 2017-04-12 2018-10-22 삼성전자주식회사 도전성 경로를 가지는 지지 구조물 및 이를 포함하는 전자 장치
KR20190027141A (ko) * 2017-09-06 2019-03-14 삼성전자주식회사 인쇄 회로 기판 어셈블리
KR20190101545A (ko) * 2018-02-23 2019-09-02 삼성전자주식회사 휘어진 상태로 유지되는 가요성 회로기판을 포함하는 카메라 모듈 어셈블리 및 이를 포함하는 전자 장치

Also Published As

Publication number Publication date
KR20220131013A (ko) 2022-09-27

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