WO2021261793A1 - Dispositif électronique comprenant un interposeur englobant des éléments de circuit disposés sur une carte de circuit imprimé - Google Patents

Dispositif électronique comprenant un interposeur englobant des éléments de circuit disposés sur une carte de circuit imprimé Download PDF

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Publication number
WO2021261793A1
WO2021261793A1 PCT/KR2021/006871 KR2021006871W WO2021261793A1 WO 2021261793 A1 WO2021261793 A1 WO 2021261793A1 KR 2021006871 W KR2021006871 W KR 2021006871W WO 2021261793 A1 WO2021261793 A1 WO 2021261793A1
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WO
WIPO (PCT)
Prior art keywords
conductive region
interposer
disposed
circuit board
printed circuit
Prior art date
Application number
PCT/KR2021/006871
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English (en)
Korean (ko)
Inventor
박정훈
손동일
강승구
Original Assignee
삼성전자 주식회사
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Application filed by 삼성전자 주식회사 filed Critical 삼성전자 주식회사
Publication of WO2021261793A1 publication Critical patent/WO2021261793A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing

Definitions

  • Embodiments disclosed in this document relate to an electronic device including an interposer surrounding a circuit element disposed on a printed circuit board.
  • the electronic device may include a substrate on which a plurality of electronic components are mounted.
  • functions installed in electronic devices such as smartphones are increasingly diversified, clock frequencies of electronic components are increasing and data transmission rates are increasing.
  • Electromagnetic interference can be generated by electronic components operating at high frequencies. Electromagnetic interference may act as noise during RF communication of the electronic device, thereby reducing RF communication performance.
  • a shield can for shielding may be used, a shielding agent may be applied, or an electromagnetic wave absorbing member may be used.
  • the shield can is made of a metal material and can cover electronic components.
  • a substrate used in the electronic device may be miniaturized. Due to the miniaturization of the substrate, a method of stacking and using a plurality of substrates through an interposer may be utilized. At this time, plating may be performed on the side of the interposer for EMI shielding. However, in the manufacturing process of the interposer, a portion that is not plated may occur on a portion of the plating on the side of the interposer.
  • Embodiments disclosed in this document include an interposer disposed between the first printed circuit board and the second printed circuit board, and form a continuous plating shielding surface when viewed from the center of the interposer in the lateral direction to shield
  • An object of the present invention is to provide an electronic device capable of forming a shielding space with improved performance.
  • an electronic device includes: a first printed circuit board on which one or more circuit elements are disposed; Surrounding at least some circuit elements of the one or more circuit elements, forming an inner surface adjacent to the at least some circuit elements, an outer surface on a surface opposite to the inner surface, and a plurality of vias between the inner surface and the outer surface formed interposer; and a second printed circuit board electrically connected to the first printed circuit board through the plurality of vias.
  • the interposer may include an intaglio on at least a portion of the inner surface or the outer surface, and may include a continuous conductive shielding surface when viewed from the center of the interposer toward the inner surface.
  • an electronic device may include: a first printed circuit board on which one or more circuit elements are disposed; Surrounding at least some circuit elements of the one or more circuit elements, forming an inner surface adjacent to the at least some circuit elements, an outer surface on a surface opposite to the inner surface, and a plurality of vias between the inner surface and the outer surface formed interposer; and a second printed circuit board electrically connected to the first printed circuit board through the plurality of vias.
  • the interposer includes a plurality of layers, and includes a first conductive region disposed on a first layer and a second conductive region disposed on a second layer among the plurality of layers, and in the center of the interposer, the inner When viewed from the side, the first conductive region and the second conductive region may be continuously disposed.
  • FIG. 1 is a perspective view of a front surface of an electronic device according to an exemplary embodiment
  • FIG. 2 is a perspective view of a rear surface of the electronic device of FIG. 1 .
  • FIG. 3 is an exploded perspective view of the electronic device of FIG. 1 .
  • FIG. 4 is an exploded perspective view of a first printed circuit board and a second printed circuit board of the electronic device of FIG. 3 .
  • 5A is a diagram illustrating an example of a process of forming an interposer included in an electronic device according to an embodiment.
  • 5B is a diagram illustrating another example of a process of forming an interposer included in an electronic device according to various embodiments of the present disclosure
  • FIG. 6 is a diagram illustrating an example of an interposer as viewed from a portion A of FIG. 5A in the Z-axis direction.
  • FIG. 7 is a diagram illustrating another example of an interposer when viewed from a portion A of FIG. 5A in the Z-axis direction.
  • FIG. 8 is a diagram illustrating another example of an interposer as viewed from a portion A of FIG. 5A in the Z-axis direction.
  • FIG. 9 is a diagram illustrating another example of an interposer as viewed from a portion A of FIG. 5A in the Z-axis direction.
  • FIG. 10 is a diagram illustrating another example of an interposer as viewed from a portion A of FIG. 5A in the Z-axis direction.
  • FIG. 11 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure.
  • FIG. 1 is a perspective view of a front surface of an electronic device according to an exemplary embodiment
  • FIG. 2 is a perspective view of a rear surface of the electronic device of FIG. 1 .
  • an electronic device 100 includes a first surface (or front surface) 110A, a second surface (or rear surface) 110B, and a first surface 110A. and a housing 110 including a side surface 110C surrounding the space between the second surfaces 110B.
  • the housing may refer to a structure that forms part of the first surface 110A, the second surface 110B, and the side surface 110C of FIG. 1 .
  • the first surface 110A may be formed by the front plate 102 (eg, a glass plate including various coating layers, or a polymer plate) at least a portion of which is substantially transparent.
  • the second surface 110B may be formed by the substantially opaque back plate 111 .
  • the back plate 111 is formed by, for example, coated or colored glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials.
  • the side surface 110C is coupled to the front plate 102 and the rear plate 111 and may be formed by a side bezel structure (or "side member") 118 including a metal and/or a polymer.
  • the back plate 111 and the side bezel structure 118 are integrally formed and may include the same material (eg, a metal material such as aluminum).
  • the front plate 102 includes two first regions 110D that extend seamlessly from the first surface 110A toward the rear plate 111 by bending the front plate. It may include both ends of the long edge of (102).
  • the rear plate 111 has two second regions 110E that extend seamlessly by bending from the second surface 110B toward the front plate 102 with long edges. It can be included at both ends.
  • the front plate 102 (or the rear plate 111 ) may include only one of the first regions 110D (or the second regions 110E). In another embodiment, some of the first regions 110D or the second regions 110E may not be included.
  • the side bezel structure 118 when viewed from the side of the electronic device 100 , is the first side bezel structure 118 on the side where the first regions 110D or the second regions 110E as described above are not included. It may have a thickness (or width) of 1, and may have a second thickness that is thinner than the first thickness at a side surface including the first regions 110D or the second regions 110E.
  • the electronic device 100 includes a display 101 , an audio module 103 , 107 , 114 , a sensor module 104 , 116 , 119 , a camera module 105 , 112 , 113 , and a key input. at least one of a device 117 , a light emitting element 106 , and connector holes 108 , 109 . In some embodiments, the electronic device 100 may omit at least one of the components (eg, the key input device 117 or the light emitting device 106 ) or additionally include other components.
  • the display 101 may be exposed through a substantial portion of the front plate 102 , for example. In some embodiments, at least a portion of the display 101 may be exposed through the front plate 102 forming the first areas 110D of the first surface 110A and the side surface 110C. In some embodiments, the edge of the display 101 may be formed to be substantially the same as an adjacent outer shape of the front plate 102 . In another embodiment (not shown), in order to expand the area to which the display 101 is exposed, the distance between the periphery of the display 101 and the periphery of the front plate 102 may be substantially the same.
  • a recess or opening is formed in a part of the screen display area of the display 101, and the audio module 114 and the sensor are aligned with the recess or the opening. It may include at least one of a module 104 , a camera module 105 , and a light emitting device 106 . In another embodiment (not shown), an audio module 114 , a sensor module 104 , a camera module 105 , a fingerprint sensor 116 , and a light emitting element 106 on the rear surface of the screen display area of the display 101 . ) may include at least one or more of.
  • the display 101 is coupled to or adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer detecting a magnetic field type stylus pen. can be placed.
  • a pressure sensor capable of measuring the intensity (pressure) of a touch
  • a digitizer detecting a magnetic field type stylus pen.
  • at least a portion of the sensor module 104 , 119 , and/or at least a portion of the key input device 117 , the first area 110D, and/or the second area 110E can be placed in
  • the audio modules 103 , 107 , and 114 may include a microphone hole 103 and speaker holes 107 and 114 .
  • a microphone for acquiring an external sound may be disposed therein, and in some embodiments, a plurality of microphones may be disposed to detect the direction of the sound.
  • the speaker holes 107 and 114 may include an external speaker hole 107 and a receiver hole 114 for a call.
  • the speaker holes 107 and 114 and the microphone hole 103 may be implemented as a single hole, or a speaker may be included without the speaker holes 107 and 114 (eg, a piezo speaker).
  • the sensor modules 104 , 116 , and 119 may generate electrical signals or data values corresponding to an internal operating state of the electronic device 100 or an external environmental state.
  • the sensor modules 104 , 116 , 119 include, for example, a first sensor module 104 (eg, a proximity sensor) and/or a second sensor module ( (not shown) (eg, a fingerprint sensor), and/or a third sensor module 119 (eg, HRM sensor) and/or a fourth sensor module 116 disposed on the second side 110B of the housing 110 . ) (eg fingerprint sensor).
  • the fingerprint sensor may be disposed on the first surface 110A (eg, the display 101) as well as on the second surface 110B of the housing 110.
  • the electronic device 100 may include a sensor module not shown, for example, at least one of a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor 104, may include
  • the camera modules 105 , 112 , and 113 include a first camera device 105 disposed on the first surface 110A of the electronic device 100 , and a second camera device 112 disposed on the second surface 110B of the electronic device 100 . ), and/or a flash 113 .
  • the camera devices 105 , 112 may include one or more lenses, an image sensor, and/or an image signal processor.
  • the flash 113 may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (infrared cameras, wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device 100 .
  • the key input device 117 may be disposed on the side surface 110C of the housing 110 .
  • the electronic device 100 may not include some or all of the above-mentioned key input devices 117 , and the not included key input devices 117 may be displayed on the display 101 as soft keys, etc. It can be implemented in the form
  • the key input device may include a sensor module 116 disposed on the second surface 110B of the housing 110 .
  • the light emitting element 106 may be disposed, for example, on the first surface 110A of the housing 110 .
  • the light emitting device 106 may provide, for example, state information of the electronic device 100 in the form of light.
  • the light emitting device 106 may provide, for example, a light source that is interlocked with the operation of the camera module 105 .
  • the light emitting element 106 may include, for example, an LED, an IR LED, and a xenon lamp.
  • the connector holes 108 and 109 include a first connector hole 108 capable of receiving a connector (eg, a USB connector) for transmitting and receiving power and/or data to and from an external electronic device, and/or an external electronic device. and a second connector hole (eg, earphone jack) 109 that can accommodate a connector for transmitting and receiving audio signals.
  • a connector eg, a USB connector
  • a second connector hole eg, earphone jack
  • FIG. 3 is an exploded perspective view of the electronic device of FIG. 1 .
  • 4 is an exploded perspective view of a first printed circuit board and a second printed circuit board of the electronic device of FIG. 3 .
  • the electronic device 100 includes a side bezel structure 140 (eg, a side member), a first support member 141 (eg, a bracket), a front plate 120 , a display 130 ,
  • the first printed circuit board 150 , the battery 159 , the second support member 160 (eg, the rear case), the antenna 170 , the rear plate 180 , the second printed circuit board 190 , and the interposer (200) may be included.
  • the electronic device 100 may omit at least one of the components (eg, the first support member 141 or the second support member 160 ) or additionally include other components. .
  • At least one of the components of the electronic device 100 may be the same as or similar to at least one of the components of the electronic device 100 of FIG. 1 or 2 , and overlapping descriptions will be omitted below.
  • the first support member 141 may be disposed inside the electronic device 100 and connected to the side bezel structure 140 , or may be integrally formed with the side bezel structure 140 .
  • the first support member 141 may be formed of, for example, a metal material and/or a non-metal (eg, polymer) material.
  • the first support member 141 may have a display 130 coupled to one surface and a first printed circuit board 150 coupled to the other surface.
  • a processor, a memory, and/or an interface may be mounted on the first printed circuit board 150 .
  • the processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.
  • Memory may include, for example, volatile memory or non-volatile memory.
  • the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • the interface may, for example, electrically or physically connect the electronic device 100 to an external electronic device, and may include a USB connector, an SD card/MMC connector, or an audio connector.
  • the battery 159 is a device for supplying power to at least one component of the electronic device 100 and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. . At least a portion of the battery 159 may be disposed substantially on the same plane as the first printed circuit board 150 .
  • the battery 159 may be integrally disposed inside the electronic device 100 , or may be disposed detachably from the electronic device 100 .
  • the antenna 170 may be disposed between the rear plate 180 and the battery 159 .
  • the antenna 170 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna.
  • the antenna 170 may, for example, perform short-range communication with an external device or wirelessly transmit/receive power required for charging.
  • the antenna structure may be formed by a part of the side bezel structure 140 and/or the first support member 141 or a combination thereof.
  • the electronic device 100 includes a first printed circuit board 150 (eg, a main circuit board, a first board) and a second printed circuit board 190 (eg, a sub circuit board;
  • the second substrate may further include an interposer 200 forming a shielding space 203 therebetween.
  • the interposer 200 may be formed of a ring member having various shapes (eg, polygonal, circular).
  • the first printed circuit board 150 may include one or more electric elements (eg, the first electric element 152 and the second electric element 154), a wiring electrically connecting the electric elements, or a ground. (GND) may be included.
  • one or more electric elements eg, the first electric element 152 and the second electric element 154
  • a wiring electrically connecting the electric elements e.g., the first electric element 152 and the second electric element 154
  • a ground. (GND) may be included.
  • the second printed circuit board 190 is the first printed circuit board 150 according to the type and/or function of the electric element 192 mounted on the second printed circuit board 190 . It may be disposed on the first surface 1501 or the second surface 1502 of the first printed circuit board 150 opposite to the first surface 1501 .
  • the interposer is configured to surround the shielding space 203 between the first printed circuit board 150 and the second printed circuit board 190 so as to surround the first printed circuit board 150 and the second printed circuit board. It may be formed between 190 .
  • the second printed circuit board 190 is disposed in the rear plate 180 direction (eg, the rear direction of the electronic device 100 ) (or the first printed circuit board 150 ). and the back plate 180), and the interposer 200 includes a second side 1502 of the first printed circuit board 150 (eg, a second side 1502 facing the back plate 180).
  • the second printed circuit board 190 is disposed in the direction of the front plate 120 (eg, the front direction of the electronic device 100 ) (or the first printed circuit board 150 and the first support) is disposed between the members 141), and the interposer 200 is disposed on the first side 1501 of the first printed circuit board 150 (eg, the first side 1501 facing the front plate 120) can be
  • the second printed circuit board 190 may be disposed between the first printed circuit board 150 and the rear plate 180 . That is, the second printed circuit board 190 may be disposed on the second surface 1502 of the first printed circuit board 150 facing the rear plate 180 .
  • the second printed circuit board 190 may be an antenna substrate emitting an RF signal.
  • the third electrical device 192 included in the second printed circuit board 190 may include a communication module.
  • the second printed circuit board 190 is to be disposed between the first printed circuit board 150 and the rear plate 180 so that the RF signal radiated from the second printed circuit board 190 passes through the rear plate 180 .
  • the second printed circuit board 190 is disposed between the first printed circuit board 150 and the first support member 141 (eg, a bracket included in the side member 140 of FIG. 3 ).
  • the second printed circuit board 190 may include one or more electric elements (eg, the third electric element 192 ), wirings electrically connecting the electric elements, and a ground.
  • the electric device mounted on the first printed circuit board 150 or the second printed circuit board 190 may include an active element and a passive element.
  • the first printed circuit board 150 and the second printed circuit board 190 may be spaced apart so that a predetermined space (eg, the shielding space 203 of FIG. 4 ) is formed therebetween.
  • At least a portion of the second printed circuit board 190 may face at least a portion of the first printed circuit board 150 .
  • the interposer 200 has a first surface 201 , a second surface 202 opposite to the first surface 201 , and a first surface 201 and a second surface 202 . It may include a side 204 connecting the.
  • the first surface 201 of the interposer 200 may be disposed on the first printed circuit board 150
  • the second surface 202 may be disposed on the second printed circuit board 190 .
  • the interposer 200 may be disposed on the first surface 1501 or the second surface 1502 of the first printed circuit board 150 .
  • the interposer 200 when the second printed circuit board 190 faces the back plate 180 , the interposer 200 is the second surface 1502 of the first printed circuit board 150 as shown in FIG. 4 . can be placed in
  • the interposer 200 when the second printed circuit board 190 faces the front plate 120 , the interposer 200 may be disposed on the first surface 1501 of the first printed circuit board 150 .
  • the interposer 200 may be disposed to surround at least a partial area of the first printed circuit board 150 .
  • the interposer 200 forms a shielding space 203 therein, and at least one electrical element may be disposed on the first printed circuit board 150 included in the shielding space 203 .
  • the first electrical element 152 may be disposed on the first printed circuit board 150 inside the shielding space 203 , and the first printed circuit board 150 outside the shielding space 203 .
  • a second electrical element 154 may be disposed there.
  • the second printed circuit board 190 may include a first surface 1901 facing the outside of the shielding space 203 and a second surface 1902 facing the inside of the shielding space 203 . have. At least a portion of the second surface 1902 of the second printed circuit board 190 may be surrounded by the interposer 200 .
  • a third electrical element 192 may be disposed on the second printed circuit board 190 inside the shielding space 203 .
  • the second printed circuit board 190 may be formed in various sizes.
  • the second printed circuit board 190 is formed to have the same size as the first printed circuit board 150 , or the second printed circuit board 190 is formed to be smaller than the first printed circuit board 150 , or , or the second printed circuit board 190 may be formed to be larger than the first printed circuit board 150 .
  • the second printed circuit board 190 may be formed in a shape corresponding to the shape of the interposer 200 .
  • the shapes of the first printed circuit board 150 and the second printed circuit board 190 shown in the drawings are only examples, and each board may be formed in various shapes.
  • 5A is a diagram illustrating an example of a process of forming an interposer included in an electronic device according to an embodiment.
  • 501 shows an interposer disk 20 including an interposer array.
  • 502 shows the interposer 200 including the non-conductive region 206 by removing a bridge (eg, the first bridge 21 and the second bridge 22) after side plating is performed on the interposer array.
  • 503 shows the interposer 200 comprising a conductive shield that is continuous through a first conductive region 205 and a second conductive region 208 .
  • the interposer 200 may be formed by separating and processing a part of the interposer original plate 20 (eg, a printed circuit board (PCB) original plate).
  • an interposer array may be formed on the interposer disk 20 .
  • the interposer array may include preliminary interposers 20_1 , 20_2 , and 20_3 .
  • the preliminary interposers 20_1 , 20_2 , and 20_3 may be connected through a bridge (eg, the first bridge 21 and the second bridge 22 ).
  • a plurality of slits eg, the slits 207 of FIGS. 6 to 10
  • a plurality of conductive vias may be formed in the preliminary interposers 20_1 , 20_2 , and 20_3 .
  • a plating operation may be performed on a side surface of the interposer array and an inner surface of the plurality of slits (eg, the slits 207 ). A portion of the bridge and the slit is removed through a cutting operation, and as in 503 , the interposer 200 may be separated from the interposer disk 20 .
  • the interposer 200 may include a first conductive region 205 and a second conductive region 208 .
  • the first conductive region 205 and the second conductive region 208 form a continuous conductive shielding surface, so that the interposer 200 ) may improve shielding performance against electrical noise transmitted through conductive vias.
  • the bridge eg, the first bridge ( 21) or a non-conductive region 206 may be formed in the cut portion of the second bridge 22. If a signal including electrical noise is transmitted through the conductive via adjacent to the non-conductive region 206 , the electrical noise may not be shielded by only the first conductive region 205 .
  • 5B is a diagram illustrating another example of a process of forming an interposer included in an electronic device according to various embodiments of the present disclosure
  • 5B, 511 shows an interposer disk 20 including an interposer array.
  • 512 shows the interposer 200 comprising a conductive shield that is continuous through a first conductive region 205 and a second conductive region 208 .
  • the interposer 200 may be formed by separating and processing a portion of the interposer disk 20 .
  • an interposer array may be formed on the interposer disk 20 .
  • the interposer array may include preliminary interposers 20_1 , 20_2 , and 20_3 .
  • the preliminary interposers 20_1 , 20_2 , and 20_3 may be connected through the bridge 21 .
  • the preliminary interposers 20_1 , 20_2 , and 20_3 may not include an internal bridge (eg, the second bridge 22 of FIG. 5A ).
  • the internal bridge may not be formed in the interposer array. Since the forming process of the interposer 200 of FIG. 5B is the same as or similar to the forming process of FIG. 5A , the overlapping description in the forming process of the interposer 200 will be omitted.
  • FIG. 6 is a diagram illustrating an example of an interposer as viewed from a portion A of FIG. 5A in the Z-axis direction.
  • the first state 601 and the second state 602 of FIG. 6 show an example of a process of forming the interposer 200 .
  • the side view 603 shows the inner surface of the interposer 200 viewed in the direction of the arrow B (eg, the inner surface direction of the interposer 200 from the center of the interposer 200, the negative direction of the Y-axis). .
  • a slit 207 may be formed in the interposer disk 20 .
  • a plating operation eg, the first conductive region 205 and the second conductive region 208
  • a plurality of conductive vias may be formed on the interposer disk 20 .
  • a part of the bridge eg, the first bridge 21 or the second bridge 22
  • the slit 207 is removed through a cutting operation, and the interposer 200 is an interposer disk. (20) can be separated.
  • An intaglio 610 may be formed on the interposer 200 through the cutting operation.
  • the interposer 200 may include the first conductive region 205 on at least a portion of the inner surface or the outer surface.
  • the interposer 200 may include a second conductive region 208 in a portion of the intaglio 610 .
  • the first conductive region ( 205 ) and the second conductive region 208 may be sequentially (or partially overlapping) disposed.
  • the first conductive region 205 and the second conductive region 208 may form a continuous conductive shielding surface.
  • first conductive region 205 and the second conductive region 208 may be disposed on different layers within the interposer 200 .
  • a non-conductive region 209 may be disposed between the first conductive region 205 and the second conductive region 208 .
  • the second conductive regions 208 may be partially overlapped when viewed in the direction of the arrow (B).
  • the first conductive region 205 and the second conductive region 208 may be connected to the ground of the first printed circuit board 150 or the second printed circuit board 190 of FIG. 4 .
  • the first conductive region 205 and the second conductive region 208 may be directly connected to the ground of the first printed circuit board 150 or the second printed circuit board 190 .
  • the first conductive region 205 and the second conductive region 208 may be connected to adjacent conductive vias, the adjacent conductive vias being connected to the ground of the first printed circuit board 150 or the second printed circuit board 190 .
  • the first conductive region 205 and the second conductive region 208 disposed on the inner surface or the outer surface of the interposer 200 have improved shielding with respect to the conductive via included in the interposer 200 .
  • performance can be provided.
  • the second conductive region 208 may transmit the electromagnetic noise to the inner surface of the interposer 200 or reduce or prevent emission through the outer surface (eg, the electromagnetic noise from affecting the first electrical component 152 , the second electrical component 154 , or the third electrical component of FIG. 4 ); can
  • FIG. 7 is a diagram illustrating another example of an interposer when viewed from a portion A of FIG. 5A in the Z-axis direction.
  • the first state 701 and the second state 702 of FIG. 7 show an example of a process of forming the interposer 200 .
  • the side view 703 shows the inner surface of the interposer 200 viewed in the direction of the arrow B (eg, the inner surface direction of the interposer 200 from the center of the interposer 200, the negative direction of the Y-axis). .
  • the interposer 200 including the intaglio 710 in the interposer disk 20 may be formed.
  • the process of forming the interposer 200 may be the same as or similar to the process of forming the interposer 200 of FIG. 6 , and overlapping descriptions will be omitted below.
  • a portion of the slit 207 may be bent to partially overlap the first conductive region 205 when viewed in the X-axis direction, unlike the case of FIG. 6 .
  • the intaglio 710 may have a reduced volume than the intaglio 610 in FIG. 6 .
  • the distance between the second conductive region 208 and the adjacent conductive via may be increased compared to the case of FIG. 6 .
  • the interposer 200 may include the first conductive region 205 on at least a portion of the inner surface or the outer surface.
  • the interposer 200 may include a second conductive region 208 in a portion of the intaglio 710 .
  • the first conductive region ( 205 ) and the second conductive region 208 may be sequentially (or partially overlapping) disposed.
  • the first conductive region 205 and the second conductive region 208 may form a continuous conductive shielding surface.
  • first conductive region 205 and the second conductive region 208 may be disposed on different layers within the interposer 200 .
  • a non-conductive region 209 may be disposed between the first conductive region 205 and the second conductive region 208 .
  • the second conductive regions 208 may be partially overlapped when viewed in the direction of the arrow (B).
  • the first conductive region 205 and the second conductive region 208 disposed on the inner surface or the outer surface of the interposer 200 have improved shielding with respect to the conductive via included in the interposer 200 .
  • performance can be provided.
  • the second conductive region 208 may transmit the electromagnetic noise to the inner surface of the interposer 200 or reduce or prevent emission through the outer surface (eg, the electromagnetic noise from affecting the first electrical component 152 , the second electrical component 154 , or the third electrical component of FIG. 4 ); can
  • a conductive via adjacent to the second conductive region 208 may have a larger diameter than other vias.
  • FIG. 8 is a diagram illustrating another example of an interposer as viewed from a portion A of FIG. 5A in the Z-axis direction.
  • the first state 801 and the second state 802 of FIG. 8 show an example of a process of forming the interposer 200 .
  • the side view 803 shows the inner surface of the interposer 200 viewed in the direction of the arrow B (eg, the inner surface direction of the interposer 200 from the center of the interposer 200, the negative direction of the Y-axis). .
  • the interposer 200 including the intaglio 810 in the interposer disk 20 may be formed.
  • the process of forming the interposer 200 may be the same as or similar to the process of forming the interposer 200 of FIG. 6 or FIG. 7 , and overlapping descriptions will be omitted below.
  • a portion of the slit 207 may be bent to partially overlap the first conductive region 205 when viewed in the X-axis direction, unlike the case of FIG. 6 . have.
  • the bridge eg, the first bridge 21 or the second bridge 22
  • the non-conductive region 209 may be disposed on a plane extending from the first conductive region 205 .
  • the intaglio 810 may have a reduced volume than the intaglio 710 in FIG. 7 .
  • the interposer 200 may include the first conductive region 205 on at least a portion of the inner surface or the outer surface.
  • the interposer 200 may include a second conductive region 208 in a portion of the intaglio 810 .
  • the first conductive region ( 205 ) and the second conductive region 208 may be sequentially (or partially overlapping) disposed.
  • the non-conductive region 209 is disposed between the first conductive region 205 and the second conductive region 208 in the X-axis direction, but the second conductive region 208 in the Y-axis direction. It may be disposed to overlap the non-conductive region 209 . Accordingly, when viewed in the direction of the arrow B, the first conductive region 205 and the second conductive region 208 may form a continuous conductive shielding surface. For example, the first conductive region 205 and the second conductive region 208 may be disposed on different layers within the interposer 200 . A non-conductive region 209 may be disposed between the first conductive region 205 and the second conductive region 208 . The second conductive regions 208 may be partially overlapped when viewed in the direction of the arrow (B).
  • the first conductive region 205 and the second conductive region 208 disposed on the inner surface or the outer surface of the interposer 200 have improved shielding with respect to the conductive via included in the interposer 200 .
  • performance can be provided.
  • the second conductive region 208 may transmit the electromagnetic noise to the inner surface of the interposer 200 or reduce or prevent emission through the outer surface (eg, the electromagnetic noise from affecting the first electrical component 152 , the second electrical component 154 , or the third electrical component of FIG. 4 ); can
  • a conductive via adjacent to the second conductive region 208 may have a larger diameter than other vias.
  • FIG. 9 is a diagram illustrating another example of an interposer as viewed from a portion A of FIG. 5A in the Z-axis direction.
  • the first state 901 and the second state 902 of FIG. 9 show an example of a process of forming the interposer 200 .
  • the side view 903 shows the inner surface of the interposer 200 viewed in the direction of the arrow B (eg, the inner surface direction of the interposer 200 from the center of the interposer 200, the negative direction of the Y-axis). .
  • the interposer 200 including the intaglio 910 in the interposer disk 20 may be formed through the first state 901 and the second state 902 .
  • the process of forming the interposer 200 may be the same as or similar to the process of forming the interposer 200 of FIG. 6 , and overlapping descriptions will be omitted below.
  • the length of the slit 207 in the X-axis direction may be smaller than the width of the bridge (eg, the first bridge 21 or the second bridge 22 ).
  • the non-conductive region 209 may be disposed between one edge of the first conductive region 205 and one edge of the second conductive region 208 .
  • the cutting operation may be performed more easily than in the case of FIG. 6 or FIG. 7 .
  • the interposer 200 may include the first conductive region 205 on at least a portion of the inner surface or the outer surface.
  • the interposer 200 may include a second conductive region 208 in a portion of the intaglio 910 .
  • the first conductive region ( 205 ) and the second conductive region 208 may be sequentially disposed to be spaced apart by a specific interval (eg, the non-conductive region 209 ).
  • the specific interval has a relatively small length (eg, 1/10 of the length of the second conductive region 208 in the X-axis direction) compared to the length of the second conductive region 208 in the X-axis direction.
  • the poser 200 may provide improved shielding performance compared to a case in which a shielding surface is formed using conductive vias instead of the second conductive region 208 .
  • the first conductive region 205 and the second conductive region 208 disposed on the inner surface or the outer surface of the interposer 200 have improved shielding with respect to the conductive via included in the interposer 200 .
  • performance can be provided.
  • the second conductive region 208 may transmit the electromagnetic noise to the inner surface of the interposer 200 or reduce or prevent emission through the outer surface (eg, the electromagnetic noise from affecting the first electrical component 152 , the second electrical component 154 , or the third electrical component of FIG. 4 ); can
  • FIG. 10 is a diagram illustrating another example of an interposer as viewed from a portion A of FIG. 5A in the Z-axis direction.
  • the first state 1001 and the second state 1002 of FIG. 10 show an example of a process of forming the interposer 200 .
  • the side view 1003 shows the inner surface of the interposer 200 viewed in the direction of the arrow B (eg, the inner surface direction of the interposer 200 from the center of the interposer 200, the negative direction of the Y-axis). .
  • the interposer disk 20 is a bridge (eg, the first bridge 21 or the second bridge 22 ))
  • the interposer 200 including the second conductive region 208 corresponding to may be formed.
  • the process of forming the interposer 200 may be the same as or similar to the process of forming the interposer 200 of FIG. 6 , and overlapping descriptions will be omitted below.
  • the length of the slit 207 in the X-axis direction may be greater than or equal to the width of the bridge.
  • the non-conductive region 206 may be disposed between adjacent first conductive regions 205 . In this case, when the bridge (eg, the first bridge 21 or the second bridge 22) is removed, the cutting operation may be performed more easily than in the case of FIG. 6 or FIG. 7 .
  • the non-conductive region 206 may be disposed on a plane in which the first conductive region 205 extends.
  • the interposer 200 may include the first conductive region 205 on at least a portion of the inner surface or the outer surface.
  • the first conductive region ( 205 ) and the second conductive region 208 may be sequentially (or partially overlapping) disposed.
  • the non-conductive regions 206 are disposed between the first conductive regions 205 when viewed in the direction of the arrow B, but the second conductive regions 208 are non-conductive in the Y-axis direction. It may be disposed overlapping the region 206 .
  • the first conductive region 205 and the second conductive region 208 may form a continuous conductive shielding surface.
  • the first conductive region 205 and the second conductive region 208 may be disposed on different layers within the interposer 200 .
  • the first conductive region 205 and the second conductive region 208 disposed on the inner surface or the outer surface of the interposer 200 have improved shielding with respect to the conductive via included in the interposer 200 .
  • performance can be provided.
  • the second conductive region 208 receives the electromagnetic noise from the interposer 200 . to reduce emissions through the inner or outer surface (eg, the electromagnetic noise affecting the first electrical component 152, the second electrical component 154, or the third electrical component of FIG. 4); or can be prevented.
  • FIG. 11 is a block diagram of an electronic device 1101 in a network environment 1100 according to various embodiments of the present disclosure.
  • the electronic device 1101 communicates with the electronic device 1102 through a first network 1198 (eg, a short-range wireless communication network) or a second network 1199 . It may communicate with the electronic device 1104 or the server 1108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 1101 may communicate with the electronic device 1104 through the server 1108 .
  • a first network 1198 eg, a short-range wireless communication network
  • the server 1108 e.g, a long-distance wireless communication network
  • the electronic device 1101 includes a processor 1120 , a memory 1130 , an input module 1150 , a sound output module 1155 , a display module 1160 , an audio module 1170 , and a sensor module ( 1176), interface 1177, connection terminal 1178, haptic module 1179, camera module 1180, power management module 1188, battery 1189, communication module 1190, subscriber identification module 1196 , or an antenna module 1197 may be included.
  • at least one of these components eg, the connection terminal 1178
  • some of these components are integrated into one component (eg, display module 1160 ). can be
  • the processor 1120 for example, executes software (eg, a program 1140) to execute at least one other component (eg, hardware or software component) of the electronic device 1101 connected to the processor 1120. It can control and perform various data processing or operations. According to an embodiment, as at least part of data processing or operation, the processor 1120 may store a command or data received from another component (eg, the sensor module 1176 or the communication module 1190 ) into the volatile memory 1132 . , process the command or data stored in the volatile memory 1132 , and store the result data in the non-volatile memory 1134 .
  • software eg, a program 1140
  • the processor 1120 may store a command or data received from another component (eg, the sensor module 1176 or the communication module 1190 ) into the volatile memory 1132 . , process the command or data stored in the volatile memory 1132 , and store the result data in the non-volatile memory 1134 .
  • the processor 1120 is a main processor 1121 (eg, a central processing unit or an application processor) or a secondary processor 1123 (eg, a graphic processing unit, a neural network processing unit (eg, a graphic processing unit, a neural network processing unit) a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor).
  • a main processor 1121 e.g, a central processing unit or an application processor
  • a secondary processor 1123 eg, a graphic processing unit, a neural network processing unit (eg, a graphic processing unit, a neural network processing unit) a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor.
  • the electronic device 1101 includes a main processor 1121 and a sub-processor 1123
  • the sub-processor 1123 uses less power than the main processor 1121 or is set to specialize in a specified function.
  • the auxiliary processor 1123 may be implemented separately from or as a part of the main processor
  • the coprocessor 1123 may be, for example, on behalf of the main processor 1121 while the main processor 1121 is in an inactive (eg, sleep) state, or the main processor 1121 is active (eg, executing an application). ), together with the main processor 1121, at least one of the components of the electronic device 1101 (eg, the display module 1160, the sensor module 1176, or the communication module 1190) It is possible to control at least some of the related functions or states.
  • the auxiliary processor 1123 eg, an image signal processor or a communication processor
  • the auxiliary processor 1123 may include a hardware structure specialized in processing an artificial intelligence model.
  • Artificial intelligence models can be created through machine learning. Such learning may be performed, for example, in the electronic device 1101 itself on which artificial intelligence is performed, or may be performed through a separate server (eg, the server 1108).
  • the learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but in the above example not limited
  • the artificial intelligence model may include a plurality of artificial neural network layers.
  • Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the above example.
  • the artificial intelligence model may include, in addition to, or alternatively, a software structure in addition to the hardware structure.
  • the memory 1130 may store various data used by at least one component (eg, the processor 1120 or the sensor module 1176 ) of the electronic device 1101 .
  • the data may include, for example, input data or output data for software (eg, the program 1140 ) and instructions related thereto.
  • the memory 1130 may include a volatile memory 1132 or a non-volatile memory 1134 .
  • the program 1140 may be stored as software in the memory 1130 , and may include, for example, an operating system 1142 , middleware 1144 , or an application 1146 .
  • the input module 1150 may receive a command or data to be used in a component (eg, the processor 1120 ) of the electronic device 1101 from the outside (eg, a user) of the electronic device 1101 .
  • the input module 1150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).
  • the sound output module 1155 may output a sound signal to the outside of the electronic device 1101 .
  • the sound output module 1155 may include, for example, a speaker or a receiver.
  • the speaker can be used for general purposes such as multimedia playback or recording playback.
  • the receiver may be used to receive an incoming call. According to an embodiment, the receiver may be implemented separately from or as a part of the speaker.
  • the display module 1160 may visually provide information to the outside (eg, a user) of the electronic device 1101 .
  • the display module 1160 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the corresponding device.
  • the display module 1160 may include a touch sensor configured to sense a touch or a pressure sensor configured to measure the intensity of a force generated by the touch.
  • the audio module 1170 may convert a sound into an electric signal or, conversely, convert an electric signal into a sound. According to an embodiment, the audio module 1170 acquires a sound through the input module 1150 or an external electronic device (eg, a sound output module 1155 ) directly or wirelessly connected to the electronic device 1101 .
  • the electronic device 1102) eg, a speaker or headphones
  • the sensor module 1176 detects an operating state (eg, power or temperature) of the electronic device 1101 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the sensed state. can do.
  • the sensor module 1176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.
  • the interface 1177 may support one or more specified protocols that may be used for the electronic device 1101 to directly or wirelessly connect with an external electronic device (eg, the electronic device 1102).
  • the interface 1177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • SD card interface Secure Digital Card
  • connection terminal 1178 may include a connector through which the electronic device 1101 can be physically connected to an external electronic device (eg, the electronic device 1102 ).
  • the connection terminal 1178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).
  • the haptic module 1179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic sense.
  • the haptic module 1179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
  • the camera module 1180 may capture still images and moving images. According to an embodiment, the camera module 1180 may include one or more lenses, image sensors, image signal processors, or flashes.
  • the power management module 1188 may manage power supplied to the electronic device 1101 .
  • the power management module 1188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).
  • PMIC power management integrated circuit
  • the battery 1189 may supply power to at least one component of the electronic device 1101 .
  • the battery 1189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.
  • the communication module 1190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 1101 and an external electronic device (eg, the electronic device 1102, the electronic device 1104, or the server 1108). It can support establishment and communication performance through the established communication channel.
  • the communication module 1190 operates independently of the processor 1120 (eg, an application processor) and may include one or more communication processors supporting direct (eg, wired) communication or wireless communication.
  • the communication module 1190 may include a wireless communication module 1192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 1194 (eg, : It may include a LAN (local area network) communication module, or a power line communication module).
  • a wireless communication module 1192 eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module
  • GNSS global navigation satellite system
  • wired communication module 1194 eg, : It may include a LAN (local area network) communication module, or a power line communication module.
  • a corresponding communication module among these communication modules is a first network 1198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 1199 (eg, legacy It may communicate with the external electronic device 1104 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (eg, a telecommunication network such as a LAN or WAN).
  • a first network 1198 eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)
  • a second network 1199 eg, legacy It may communicate with the external electronic device 1104 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (eg, a telecommunication network such as a LAN or WAN).
  • a telecommunication network such as a
  • the wireless communication module 1192 uses subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 1196 within a communication network such as the first network 1198 or the second network 1199 .
  • subscriber information eg, International Mobile Subscriber Identifier (IMSI)
  • IMSI International Mobile Subscriber Identifier
  • the electronic device 1101 may be identified or authenticated.
  • the wireless communication module 1192 may support a 5G network after a 4G network and a next-generation communication technology, for example, a new radio access technology (NR).
  • NR access technology includes high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency) -latency communications)).
  • eMBB enhanced mobile broadband
  • mMTC massive machine type communications
  • URLLC ultra-reliable and low-latency
  • the wireless communication module 1192 may support a high frequency band (eg, mmWave band) in order to achieve a high data rate, for example.
  • a high frequency band eg, mmWave band
  • the wireless communication module 1192 uses various technologies for securing performance in a high-frequency band, for example, beamforming, massive multiple-input and multiple-output (MIMO), all-dimensional multiplexing. It may support technologies such as full dimensional MIMO (FD-MIMO), an array antenna, analog beam-forming, or a large scale antenna.
  • the wireless communication module 1192 may support various requirements specified in the electronic device 1101 , an external electronic device (eg, the electronic device 1104 ), or a network system (eg, the second network 1199 ).
  • the wireless communication module 1192 provides a peak data rate (eg, 20 Gbps or more) for realization of eMBB, loss coverage for realization of mMTC (eg, 164 dB or less), or U-plane latency for realization of URLLC ( Example: downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less).
  • a peak data rate eg, 20 Gbps or more
  • mMTC eg, 164 dB or less
  • U-plane latency for realization of URLLC
  • the antenna module 1197 may transmit or receive a signal or power to the outside (eg, an external electronic device).
  • the antenna module 1197 may include an antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern.
  • the antenna module 1197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 1198 or the second network 1199 is connected from the plurality of antennas by, for example, the communication module 1190 . can be selected. A signal or power may be transmitted or received between the communication module 1190 and an external electronic device through the selected at least one antenna.
  • other components eg, a radio frequency integrated circuit (RFIC)
  • RFIC radio frequency integrated circuit
  • the antenna module 1197 may form a mmWave antenna module.
  • the mmWave antenna module comprises a printed circuit board, an RFIC disposed on or adjacent to a first side (eg, bottom side) of the printed circuit board and capable of supporting a specified high frequency band (eg, mmWave band); and a plurality of antennas (eg, an array antenna) disposed on or adjacent to a second side (eg, top or side) of the printed circuit board and capable of transmitting or receiving signals of the designated high frequency band. can do.
  • peripheral devices eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)
  • signal eg commands or data
  • a command or data may be transmitted or received between the electronic device 1101 and the external electronic device 1104 through the server 1108 connected to the second network 1199 .
  • Each of the external electronic devices 1102 or 1104 may be the same or a different type of the electronic device 1101 .
  • all or a part of operations executed by the electronic device 1101 may be executed by one or more external electronic devices 1102 , 1104 , or 1108 .
  • the electronic device 1101 may perform the function or service itself instead of executing the function or service itself.
  • one or more external electronic devices may be requested to perform at least a part of the function or the service.
  • One or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 1101 .
  • the electronic device 1101 may process the result as it is or additionally and provide it as at least a part of a response to the request.
  • cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used.
  • the electronic device 1101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing.
  • the external electronic device 1104 may include an Internet of things (IoT) device.
  • IoT Internet of things
  • Server 1108 may be an intelligent server using machine learning and/or neural networks.
  • the external electronic device 1104 or the server 1108 may be included in the second network 1199 .
  • the electronic device 1101 may be applied to an intelligent service (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.
  • the electronic device may be a device of various types.
  • the electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device.
  • a portable communication device eg, a smart phone
  • a computer device e.g., a laptop, a desktop, a tablet, or a portable multimedia device
  • portable medical device e.g., a portable medical device
  • camera e.g., a camera
  • a wearable device e.g., a smart watch
  • a home appliance device e.g., a smart bracelet
  • first, second, or first or second may be used simply to distinguish the element from other elements in question, and may refer to elements in other aspects (e.g., importance or order) is not limited. It is said that one (eg, first) component is “coupled” or “connected” to another (eg, second) component, with or without the terms “functionally” or “communicatively”. When referenced, it means that one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.
  • module used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, for example, and interchangeably with terms such as logic, logic block, component, or circuit.
  • a module may be an integrally formed part or a minimum unit or a part of the part that performs one or more functions.
  • the module may be implemented in the form of an application-specific integrated circuit (ASIC).
  • ASIC application-specific integrated circuit
  • one or more instructions stored in a storage medium may be implemented as software (eg, the program 1140) including
  • a processor eg, processor 1120 of a device (eg, electronic device 1101 ) may call at least one command among one or more commands stored from a storage medium and execute it. This makes it possible for the device to be operated to perform at least one function according to the called at least one command.
  • the one or more instructions may include code generated by a compiler or code executable by an interpreter.
  • the device-readable storage medium may be provided in the form of a non-transitory storage medium.
  • 'non-transitory' only means that the storage medium is a tangible device and does not include a signal (eg, electromagnetic wave), and this term is used in cases where data is semi-permanently stored in the storage medium and It does not distinguish between temporary storage cases.
  • a signal eg, electromagnetic wave
  • the method according to various embodiments disclosed in this document may be provided by being included in a computer program product.
  • Computer program products may be traded between sellers and buyers as commodities.
  • the computer program product is distributed in the form of a device-readable storage medium (eg compact disc read only memory (CD-ROM)), or via an application store (eg Play Store) or on two user devices ( It can be distributed (eg downloaded or uploaded) directly between smartphones (eg: smartphones) and online.
  • a part of the computer program product may be temporarily stored or temporarily created in a machine-readable storage medium such as a memory of a server of a manufacturer, a server of an application store, or a relay server.
  • each component eg, a module or a program of the above-described components may include a singular or a plurality of entities, and some of the plurality of entities may be separately disposed in other components. .
  • one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added.
  • a plurality of components eg, a module or a program
  • the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. .
  • operations performed by a module, program, or other component are executed sequentially, in parallel, repetitively, or heuristically, or one or more of the operations are executed in a different order, omitted, or , or one or more other operations may be added.

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Abstract

L'invention concerne un dispositif électronique comprenant : une première carte de circuit imprimé sur laquelle un ou plusieurs éléments de circuit sont disposés ; un interposeur, qui englobe au moins une partie du ou des éléments de circuit, a une surface interne qui est adjacente aux au moins certains éléments de circuit et une surface externe sur la surface opposée à la surface interne, et comporte une pluralité de trous d'interconnexion formés entre la surface interne et la surface externe ; et une seconde carte de circuit imprimé connectée électriquement à la première carte de circuit imprimé à travers la pluralité de trous d'interconnexion. L'interposeur peut comprendre des gravures dans au moins une partie de la surface interne ou de la surface externe, et une surface de blindage conductrice qui est continue lorsqu'elle est vue depuis le centre de l'interposeur vers la surface interne. Divers autres modes de réalisation identifiés dans la description sont également possibles.
PCT/KR2021/006871 2020-06-24 2021-06-02 Dispositif électronique comprenant un interposeur englobant des éléments de circuit disposés sur une carte de circuit imprimé WO2021261793A1 (fr)

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KR10-2020-0077141 2020-06-24
KR1020200077141A KR20210158606A (ko) 2020-06-24 2020-06-24 인쇄 회로 기판에 배치된 회로 소자를 둘러싸는 인터포저를 포함하는 전자 장치

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Citations (5)

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