WO2022065857A1 - Dispositif électronique permettant le montage d'un support de stockage externe - Google Patents

Dispositif électronique permettant le montage d'un support de stockage externe Download PDF

Info

Publication number
WO2022065857A1
WO2022065857A1 PCT/KR2021/012907 KR2021012907W WO2022065857A1 WO 2022065857 A1 WO2022065857 A1 WO 2022065857A1 KR 2021012907 W KR2021012907 W KR 2021012907W WO 2022065857 A1 WO2022065857 A1 WO 2022065857A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic device
region
tray
area
housing
Prior art date
Application number
PCT/KR2021/012907
Other languages
English (en)
Korean (ko)
Inventor
박혼정
김용관
김용원
이형근
임형석
Original Assignee
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020210001540A external-priority patent/KR20220039519A/ko
Application filed by 삼성전자 주식회사 filed Critical 삼성전자 주식회사
Publication of WO2022065857A1 publication Critical patent/WO2022065857A1/fr

Links

Images

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets

Definitions

  • An embodiment of the present invention relates to an electronic device capable of mounting an external storage medium.
  • An external storage medium (eg, a memory card) may be mounted in the electronic device using a tray (or an adapter).
  • the tray may be a device for electrically or mechanically connecting an external storage medium to a connector of an electronic device.
  • the external storage medium may be detachably attached to the tray.
  • the tray on which the external storage medium is disposed may be inserted into a connector hole formed in the housing of the electronic device, and the external storage medium may be electrically connected to a connector positioned in the housing corresponding to the connector hole.
  • An external impact may be applied to the electronic device for reasons such as dropping the electronic device.
  • Deformation of the housing may occur due to an external impact, which may make it difficult to detach the tray for the external storage medium.
  • An embodiment of the present invention may provide an electronic device capable of mounting an external storage medium that enables the tray to be detached from the external storage medium even if the housing is deformed due to an external impact.
  • an electronic device includes a housing including an opening, and a tray insertable into the housing through the opening, wherein the tray is in a state in which the tray is inserted into the housing a first surface forming a part of the outer surface of the electronic device, a second surface positioned opposite to the first surface, and a side facing the surface of the opening when the tray is inserted into the housing; a cover portion and a support portion coupled to the second surface and on which an external storage medium is disposed, wherein the side surface of the cover portion includes a first area located closer to the first surface than the second surface, and the first a second region positioned closer to the second face than to a face, wherein the face of the opening includes a third region facing the first region with the tray inserted into the housing, and the second region and a fourth area facing the second area, and a second distance between at least a portion of the second area and the fourth area may be greater than a first distance between the first area and the third area.
  • the electronic device capable of mounting an external storage medium can improve reliability and usability of the electronic device by enabling the tray for the external storage medium to be detached even when the housing is deformed due to an external shock.
  • FIG. 1 is a block diagram of an electronic device in a network environment, according to various embodiments of the present disclosure
  • FIG. 2 is a perspective view of a front surface of an electronic device according to an exemplary embodiment
  • FIG. 3 is a perspective view of a rear surface of the electronic device of FIG. 2 according to an exemplary embodiment.
  • FIG. 4 is an exploded perspective view of the electronic device of FIG. 2 according to an exemplary embodiment.
  • FIG. 5 is a perspective view of a rear surface of an electronic device according to an exemplary embodiment
  • FIG. 6 illustrates a tray, an external storage medium, a side bezel structure, and a first support member, in one embodiment.
  • FIG 7 and 8 are diagrams for explaining the coupling structure between the cover part of the tray and the external storage medium support part, in one embodiment.
  • 11 is, for example, a side view of the cover part when looking at the cover part in the +z axis direction in FIG. 6 .
  • FIG. 12 is, for example, a side view of the cover part when looking at the cover part in the -z axis direction in FIG. 6 .
  • FIG. 14 is a partial cross-sectional view along an x-y plane of the electronic device shown in FIG. 5 , according to an exemplary embodiment.
  • FIG. 1 is a block diagram of an electronic device 101 in a network environment 100 according to various embodiments.
  • an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or a second network 199 . It may communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 .
  • a first network 198 eg, a short-range wireless communication network
  • a second network 199 e.g., a second network 199 . It may communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 .
  • the electronic device 101 includes a processor 120 , a memory 130 , an input module 150 , a sound output module 155 , a display module 160 , an audio module 170 , and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or an antenna module 197 may be included.
  • at least one of these components eg, the connection terminal 178
  • may be omitted or one or more other components may be added to the electronic device 101 .
  • some of these components are integrated into one component (eg, display module 160 ). can be
  • the processor 120 for example, executes software (eg, the program 140) to execute at least one other component (eg, hardware or software component) of the electronic device 101 connected to the processor 120. It can control and perform various data processing or operations. According to one embodiment, as at least part of data processing or computation, the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190 ) to the volatile memory 132 . may be stored in the volatile memory 132 , and may process commands or data stored in the volatile memory 132 , and store the result data in the non-volatile memory 134 .
  • software eg, the program 140
  • the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190 ) to the volatile memory 132 .
  • the volatile memory 132 may be stored in the volatile memory 132 , and may process commands or data stored in the volatile memory 132 , and store the result data in the non-volatile memory 134 .
  • the processor 120 is the main processor 121 (eg, a central processing unit or an application processor) or a secondary processor 123 (eg, a graphic processing unit, a neural network processing unit) a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor).
  • the main processor 121 e.g, a central processing unit or an application processor
  • a secondary processor 123 eg, a graphic processing unit, a neural network processing unit
  • NPU neural processing unit
  • an image signal processor e.g., a sensor hub processor, or a communication processor.
  • the main processor 121 e.g, a central processing unit or an application processor
  • a secondary processor 123 eg, a graphic processing unit, a neural network processing unit
  • NPU neural processing unit
  • an image signal processor e.g., a sensor hub processor, or a communication processor.
  • the main processor 121 e.g, a central processing unit or an application processor
  • a secondary processor 123
  • the auxiliary processor 123 is, for example, on behalf of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or the main processor 121 is active (eg, executing an application). ), together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states.
  • the co-processor 123 eg, an image signal processor or a communication processor
  • may be implemented as part of another functionally related component eg, the camera module 180 or the communication module 190. there is.
  • the auxiliary processor 123 may include a hardware structure specialized for processing an artificial intelligence model.
  • Artificial intelligence models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself on which artificial intelligence is performed, or may be performed through a separate server (eg, the server 108).
  • the learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but the above-described example is not limited to
  • the artificial intelligence model may include a plurality of artificial neural network layers.
  • Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks, or a combination of two or more of the above, but is not limited to the above example.
  • the artificial intelligence model may include, in addition to, or alternatively, a software structure in addition to the hardware structure.
  • the memory 130 may store various data used by at least one component of the electronic device 101 (eg, the processor 120 or the sensor module 176 ).
  • the data may include, for example, input data or output data for software (eg, the program 140 ) and instructions related thereto.
  • the memory 130 may include a volatile memory 132 or a non-volatile memory 134 .
  • the sound output module 155 may output a sound signal to the outside of the electronic device 101 .
  • the sound output module 155 may include, for example, a speaker or a receiver.
  • the speaker can be used for general purposes such as multimedia playback or recording playback.
  • the receiver may be used to receive an incoming call. According to one embodiment, the receiver may be implemented separately from or as part of the speaker.
  • the display module 160 may visually provide information to the outside (eg, a user) of the electronic device 101 .
  • the display module 160 may include, for example, a control circuit for controlling a display, a hologram device, or a projector and a corresponding device.
  • the display module 160 may include a touch sensor configured to sense a touch or a pressure sensor configured to measure the intensity of a force generated by the touch.
  • the audio module 170 may convert a sound into an electric signal or, conversely, convert an electric signal into a sound. According to an embodiment, the audio module 170 acquires a sound through the input module 150 or an external electronic device (eg, a sound output module 155 ) directly or wirelessly connected to the electronic device 101 . A sound may be output through the electronic device 102 (eg, a speaker or headphones).
  • an external electronic device eg, a sound output module 155
  • a sound may be output through the electronic device 102 (eg, a speaker or headphones).
  • the sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, user state), and generates an electrical signal or data value corresponding to the sensed state. can do.
  • the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.
  • the interface 177 may support one or more designated protocols that may be used for the electronic device 101 to directly or wirelessly connect with an external electronic device (eg, the electronic device 102 ).
  • the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • SD card interface Secure Digital Card
  • the connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102 ).
  • the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).
  • the haptic module 179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic sense.
  • the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
  • the camera module 180 may capture still images and moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
  • the power management module 188 may manage power supplied to the electronic device 101 .
  • the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).
  • PMIC power management integrated circuit
  • the battery 189 may supply power to at least one component of the electronic device 101 .
  • battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.
  • the communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). It can support establishment and communication performance through the established communication channel.
  • the communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication.
  • the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : It may include a LAN (local area network) communication module, or a power line communication module).
  • GNSS global navigation satellite system
  • the wireless communication module 192 includes various technologies for securing performance in a high-frequency band, for example, beamforming, massive multiple-input and multiple-output (MIMO), all-dimensional multiplexing. Technologies such as input/output (full dimensional MIMO (FD-MIMO)), array antenna, analog beam-forming, or large scale antenna may be supported.
  • the wireless communication module 192 may support various requirements specified in the electronic device 101 , an external electronic device (eg, the electronic device 104 ), or a network system (eg, the second network 199 ).
  • the wireless communication module 192 may include a peak data rate (eg, 20 Gbps or more) for realizing eMBB, loss coverage (eg, 164 dB or less) for realizing mMTC, or U-plane latency for realizing URLLC ( Example: downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less).
  • a peak data rate eg, 20 Gbps or more
  • loss coverage eg, 164 dB or less
  • U-plane latency for realizing URLLC
  • the antenna module 197 may form a mmWave antenna module.
  • the mmWave antenna module comprises a printed circuit board, an RFIC disposed on or adjacent to a first side (eg, underside) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band); and a plurality of antennas (eg, an array antenna) disposed on or adjacent to a second side (eg, top or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the designated high frequency band.
  • a first side eg, underside
  • a designated high frequency band eg, mmWave band
  • a plurality of antennas eg, an array antenna
  • peripheral devices eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)
  • GPIO general purpose input and output
  • SPI serial peripheral interface
  • MIPI mobile industry processor interface
  • One or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 101 .
  • the electronic device 101 may process the result as it is or additionally and provide it as at least a part of a response to the request.
  • cloud computing distributed computing, mobile edge computing (MEC), or client-server computing technology may be used.
  • the electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing.
  • the external electronic device 104 may include an Internet of things (IoT) device.
  • Server 108 may be an intelligent server using machine learning and/or neural networks.
  • the external electronic device 104 or the server 108 may be included in the second network 199 .
  • the electronic device 101 may be applied to an intelligent service (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.
  • module used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as, for example, logic, logic block, component, or circuit.
  • a module may be an integrally formed part or a minimum unit or a part of the part that performs one or more functions.
  • the module may be implemented in the form of an application-specific integrated circuit (ASIC).
  • ASIC application-specific integrated circuit
  • one or more instructions stored in a storage medium may be implemented as software (eg, the program 140) including
  • a processor eg, processor 120
  • a device eg, electronic device 101
  • the one or more instructions may include code generated by a compiler or code executable by an interpreter.
  • the device-readable storage medium may be provided in the form of a non-transitory storage medium.
  • 'non-transitory' only means that the storage medium is a tangible device and does not include a signal (eg, electromagnetic wave), and this term is used in cases where data is semi-permanently stored in the storage medium and It does not distinguish between temporary storage cases.
  • a signal eg, electromagnetic wave
  • each component eg, a module or a program of the above-described components may include a singular or a plurality of entities, and some of the plurality of entities may be separately disposed in other components. there is.
  • one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added.
  • a plurality of components eg, a module or a program
  • the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. .
  • operations performed by a module, program, or other component are executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations are executed in a different order, or omitted. or one or more other operations may be added.
  • the electronic device may have various types of devices.
  • the electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device.
  • a portable communication device eg, a smart phone
  • a computer device e.g., a smart phone
  • a portable multimedia device e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a wearable device e.g., a smart bracelet
  • a home appliance device e.g., a home appliance
  • FIG. 2 is a perspective view of a front surface of an electronic device 200 according to an exemplary embodiment.
  • 3 is a perspective view of a rear surface of the electronic device 200 of FIG. 2 according to an exemplary embodiment.
  • the electronic device 200 (eg, the electronic device 101 of FIG. 1 ) has a first side (or front) 210A, a second side (or a rear side) and a housing 210 including a side surface 210C surrounding a space between the first surface 210A and the second surface 210B.
  • the housing 210 may refer to a structure forming at least a portion of the first surface 210A, the second surface 210B, and the side surface 210C.
  • the first surface 210A may be formed by a front plate 201 (eg, a glass plate including various coating layers, or a polymer plate) at least a portion of which is substantially transparent.
  • the front plate 201 may include two first regions 210D that extend seamlessly by bending from the first side 210A toward the back plate 202 .
  • the first regions 210D may be formed adjacent to both long edges of the front plate 201 , respectively.
  • the rear plate 202 may include two second regions 210E that extend seamlessly from the second surface 210B toward the front plate 201 .
  • the second regions 210E may be formed adjacent to both long edges of the back plate 202 , respectively.
  • the side surface 210C has a first thickness (or width) (eg, a height in the z-axis direction) on the side where the first regions 210D or the second regions 210E are not located, and the first regions 210C Alternatively, the second thickness may be smaller than the first thickness at the side where the second regions 210E are located.
  • the front plate 201 may include one of the first regions 210D or may be implemented without the curved first regions 210D.
  • the back plate 202 may be implemented with one of the second regions 210E, or may be implemented without the curved second regions 210E.
  • a display area (eg, a screen display area or an active area) of the display 301 may be visually exposed through, for example, the front plate 201 .
  • the electronic device 200 may be implemented to maximize the display area exposed through the front plate 201 (eg, a large screen or a full screen).
  • the display 301 may be implemented to have an outer shape substantially the same as the outer shape of the front plate 201 .
  • the distance between the outer periphery of the display 301 and the outer periphery of the front plate 201 may be substantially the same.
  • the display 301 may include a touch sensing circuit.
  • the display 301 may include a pressure sensor capable of measuring the intensity (pressure) of the touch.
  • the display 301 may be coupled to or positioned adjacent to a digitizer that detects a magnetic field type electronic pen (eg, a stylus pen).
  • the audio modules 302 , 303 , 304 , 305 may include, for example, a first audio module 302 for a first microphone, a second audio module 303 for a second microphone, and a first audio module for a first speaker. It may include a third audio module 304, and a fourth audio module 305 for the second speaker.
  • the first audio module 302 may include, for example, a first microphone hole formed in the side surface 210C, and a first microphone positioned in the housing 210 corresponding to the first microphone hole.
  • the second audio module 303 may include, for example, a second microphone hole formed on the second surface 210B, and a second microphone positioned in the housing 210 to correspond to the second microphone hole.
  • the third audio module 304 may include, for example, a first speaker hole formed in the side surface 210C, and a first speaker positioned in the housing 210 corresponding to the first speaker hole.
  • the fourth audio module 305 may include, for example, a second speaker hole formed on the first surface 210A, and a second speaker positioned in the housing 210 to correspond to the second speaker hole.
  • the second speaker may be a receiver for calls.
  • the electronic device 200 may include a plurality of microphones provided to detect the direction of sound.
  • the speaker hole and the microphone hole may be implemented as one hole, or a speaker (eg, a piezo speaker) may be provided without the speaker hole.
  • the sensor module 306 may generate an electrical signal or data value corresponding to an internal operating state of the electronic device 200 or an external environmental state.
  • the sensor module 306 may include, for example, a proximity sensor that generates a signal regarding the proximity of an external object based on light passing through a partial region of the first surface 210A of the housing 210 .
  • the sensor module 306 may be various biometric sensors such as a fingerprint sensor for detecting biometric information based on light passing through a partial region of the first surface 210A.
  • the location of the sensor module 306 is not limited to the illustrated example and may vary.
  • the electronic device 200 may include a sensor module (not shown), for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, and a biometric sensor (eg, HRM). sensor), a temperature sensor, a humidity sensor, or an illuminance sensor (eg, the sensor module 306 ).
  • a sensor module for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, and a biometric sensor (eg, HRM). sensor), a temperature sensor, a humidity sensor, or an illuminance sensor (eg, the sensor module 306 ).
  • the camera modules 307 and 308 are, for example, in the interior of the housing 210 corresponding to the first camera module 307 positioned corresponding to the first surface 210A, and corresponding to the second surface 210B. positioned second camera modules 308 .
  • the first camera module 307 or the second camera modules 308 may include one or a plurality of lenses, an image sensor, and/or an image signal processor.
  • the second camera modules 308 may enable shooting of various angles of view.
  • the second camera modules 308 may measure the depth of field.
  • the flash 309 may be positioned corresponding to the second side 210B and may include, for example, a light emitting diode or a xenon lamp.
  • the light emitting device may be positioned, for example, in the interior of the housing 210 corresponding to the first surface 210A.
  • the light emitting device may provide state information of the electronic device 200 in the form of light.
  • the light emitting device may provide a light source that is interlocked with the operation of the first camera module 307 .
  • the light emitting element may include, for example, an LED, an IR LED or a xenon lamp.
  • the connector holes 311 and 312 are, for example, a first connector hole 311 capable of receiving a connector (eg, a USB connector) for transmitting and receiving power and/or data with an external electronic device, and an external A second connector hole (eg, earphone jack) 312 capable of accommodating a connector for transmitting and receiving an audio signal to and from the electronic device may be included.
  • a connector eg, a USB connector
  • a second connector hole (eg, earphone jack) 312 capable of accommodating a connector for transmitting and receiving an audio signal to and from the electronic device may be included.
  • the sensor module 306 or the first camera module 307 may be located on the back side of the display area of the display 301 , or below or beneath the display area of the display 301 . there is. In some embodiments, the sensor module 306 or the first camera module 307 is positioned in alignment with a recess or opening formed in the display area of the display 301 , or the recess or the opening At least part of it may be inserted and positioned. For example, the position of the sensor module 306 is not visually distinguished (or exposed), and a related function using the sensor module 306 may be performed.
  • the sensor module 306 includes an optical sensor
  • light related to an external environmental state eg, a user state
  • the sensor module 306 positioned overlapping the display area of the display 301 may be referred to as an in-display sensor.
  • the position of the first camera module 307 is not visually distinguished (or exposed), and a related function (eg, image capturing) using the first camera module 307 may be performed.
  • the first camera module 307 is disposed to overlap at least a portion of the display area and is not exposed to the outside while capturing an image of an external subject. can be obtained
  • At least one audio module may be located on the back of the display area of the display 301 , or below or beneath the display area of the display 301 . can In this case, the position of the audio module is not visually distinguished (or exposed), and a related function using the audio module may be performed.
  • the audio module may be positioned aligned with a recess or opening formed in the display area of the display 301 , or at least partially inserted into the recess or opening.
  • FIG. 4 is an exploded perspective view of the electronic device 200 of FIG. 2 according to an exemplary embodiment.
  • the electronic device 200 includes a front plate 201 , a rear plate 202 , a side bezel structure 203 , a first support member 410 (eg, a first bracket); It may include a first substrate assembly 421 , a second substrate assembly 422 , a battery 430 , a second support member 441 , a third support member 442 , or an antenna structure 450 . In some embodiments, the electronic device 200 may omit at least one of the components (eg, the second support member 441 or the third support member 442 ) or additionally include other components. .
  • a first support member 410 eg, a first bracket
  • the electronic device 200 may omit at least one of the components (eg, the second support member 441 or the third support member 442 ) or additionally include other components. .
  • the first support member 410 may be disposed inside the electronic device 200 and connected to the side bezel structure 203 , or may be integrally formed with the side bezel structure 203 .
  • the first support member 410 may be formed of a metal material and/or a non-metal material (eg, polymer).
  • the first support member 410 may include at least one first conductive part and at least one non-conductive part connected to the first conductive part.
  • the side bezel structure 203 may include a plurality of second conductive parts separated with the segmented part therebetween. At least a portion of the at least one first conductive portion and at least a portion of the plurality of second conductive portions may be integrally formed and may include the same metal material.
  • the at least one non-conductive portion may extend to the segmented portion to form an insulating portion 415 (refer to FIGS. 2, 3, or 4 ) between the plurality of second conductive portions.
  • the insulating portion 415 may form a portion of the side surface 210C (see FIG. 1 or 2 ).
  • the at least one non-conductive part may be formed through, for example, insert injection.
  • the insulator 415 may be defined or interpreted as part of the side bezel structure 203 .
  • the display 301 may be coupled to one surface of the first support member 410 and positioned between the first support member 410 and the front plate 201 , for example.
  • the first substrate assembly 421 and the second substrate assembly 422 are coupled to the other surface of the first support member 410 , for example, and are positioned between the first support member 410 and the back plate 202 . can be
  • the first substrate assembly 421 may include a first printed circuit board (PCB) (not shown).
  • the first substrate assembly 421 may include various electronic components electrically connected to the first printed circuit board.
  • the electronic components eg, the display 301 , the second audio module 303 , the fourth audio module 305 , the sensor module 306 , the camera modules 307 and 308 , the flash 309 , and a key input device) 310, or connectors
  • the first substrate assembly 421 may include a Main PCB, a slave PCB partially overlapping the Main PCB, and/or an interposer substrate between the Main PCB and the slave PCB. .
  • the second substrate assembly 422 when viewed from above the front plate 201 , may be disposed to be spaced apart from the first substrate assembly 421 with the battery 430 interposed therebetween.
  • the second board assembly 422 may include a second printed circuit board electrically connected to the first printed circuit board of the first board assembly 421 .
  • the second board assembly 422 may include various electronic components electrically connected to the second printed circuit board.
  • the electronic component eg, the first audio module 302 , the fifth audio module 304 , or connectors
  • the electronic component is disposed on a second printed circuit board, or through an electrical path such as a cable or FPCB, a second printed circuit board can be electrically connected to
  • the battery 430 may be positioned on the first support member 410 between the first support member 410 and the back plate 202 .
  • the battery 430 may be positioned between the first substrate assembly 421 and the second substrate assembly 422 when viewed from above the front plate 201 . At least a portion of the battery 430 may be disposed substantially coplanar with, for example, a first printed circuit board of the first board assembly 421 or a second printed circuit board of the second board assembly 422 . there is.
  • the battery 430 is a device for supplying power to at least one component of the electronic device 200 and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. .
  • the battery 430 may be integrally disposed inside the electronic device 200 , or may be disposed detachably from the electronic device 200 .
  • the second support member 441 may be positioned between the first support member 410 and the back plate 202 and engages the first support member 410 via a fastening element such as a bolt.
  • a fastening element such as a bolt.
  • can be At least a portion of the first substrate assembly 421 may be disposed between the first support member 410 and the second support member 441 , and the second support member 441 covers the first substrate assembly 421 . can be protected by
  • the third support member 442 may be positioned to be spaced apart from the second support member 441 with the battery 430 interposed therebetween when viewed from above the front plate 201 .
  • the third support member 442 may be disposed between the first support member 410 and the back plate 202 , and may be coupled to the first support member 410 through a fastening element such as a bolt.
  • At least a portion of the second substrate assembly 422 may be positioned between the first support member 410 and the third support member 442 , the third support member 442 covering the second substrate assembly 422 . can be protected by
  • the second support member 441 and/or the third support member 442 may be formed of a metal material and/or a non-metal material (eg, polymer). In some embodiments, the second support member 441 and/or the third support member 442 may be referred to as a rear case.
  • a single substrate assembly including a first substrate assembly 421 and a second substrate assembly 422 may be implemented.
  • the substrate assembly may include a portion extending between the battery 430 and the side bezel structure 203 .
  • an integral support member including the second support member 441 and the third support member 442 may be implemented.
  • the antenna structure 450 may be positioned between the second support member 441 and the back plate 202 .
  • the antenna structure 450 may include at least one conductive pattern used as a loop-type radiator.
  • the at least one conductive pattern may include a planar spiral conductive pattern (eg, a planar coil or a pattern coil).
  • the antenna structure 450 may be implemented in the form of a film such as, for example, an FPCB.
  • the electronic device 200 may further include various components according to its provision form. Although it is not possible to enumerate all of these components due to various variations according to the convergence trend of the electronic device 200 , components equivalent to the above-mentioned components are additionally added to the electronic device 200 . may be included. In various embodiments, specific components may be excluded from the above-described components or replaced with other components according to the form of provision thereof.
  • FIG 5 is a perspective view of a rear surface of the electronic device 200 according to an exemplary embodiment.
  • the electronic device 200 includes a rear plate 202 , a side bezel structure 203 , a second audio module 303 , second camera modules 308 , a flash 309 , or a tray ( tray) 550 .
  • the side bezel structure 203 may include a first side part 511 , a second side part 512 , a third side part 513 , and a fourth side part 514 .
  • the first side part 511 and the third side part 513 may be positioned opposite to each other and may be parallel to each other.
  • the second side part 512 may connect one end of the first side part 511 and one end of the third side part 513 .
  • the fourth side part 514 may connect the other end of the first side part 511 and the other end of the third side part 513 .
  • the second side portion 512 and the fourth side portion 514 may be positioned opposite to each other and may be parallel to each other. For example, referring to FIGS.
  • the first microphone hole of the first audio module 302 , the first speaker hole of the third audio module 304 , the first connector hole 311 , or The second connector hole 312 may be located at the third side portion 513 of the side bezel structure 203 .
  • the side bezel structure 203 includes a first corner part C1 to which the first side part 511 and the fourth side part 514 are connected, and a second corner part (C1) to which the first side part 511 and the second side part 512 are connected. C2), a third corner part C3 to which the second side part 512 and the third side part 513 are connected, and a fourth corner part C4 to which the third side part 513 and the fourth side part 514 are connected.
  • the first corner portion C1, the second corner portion C2, the third corner portion C3, and/or the fourth corner portion C4 may be formed in a curved shape.
  • the connector hole (or opening) 540 corresponding to the tray 550 may be located in the first side portion 511 of the side bezel structure 203 .
  • An external storage medium eg, a SIM card or a memory card
  • the tray 550 may be a device for electrically or mechanically connecting an external storage medium to the connector of the electronic device 200 .
  • the external storage medium may be detachably attached to the tray 550 .
  • the tray 550 on which the external storage medium is disposed is inserted into the connector hole 540 , and the external storage medium is located in the connector (eg, the first board in FIG. 4 ) in the electronic device 200 corresponding to the connector hole 540 . It may be electrically connected to a connector 460 located in the assembly 421 .
  • the connector hole 540 may be located closer to the first corner portion C2 than to the first corner portion C1 .
  • the connector hole 540 may be positioned between the second corner portion C1 and the insulating portion 415 .
  • FIG. 6 illustrates a tray 550 , an external storage medium 600 , a side bezel structure 203 , and a first support member 410 in one embodiment.
  • the first support member 410 may include, for example, at least one first conductive part 411 and at least one non-conductive part 412 .
  • the side bezel structure 203 may include a plurality of second conductive parts 641 . At least a portion of the at least one first conductive portion 411 may be integrally formed with at least a portion of the plurality of second conductive portions 641 .
  • the at least one non-conductive part 412 may extend to a segment between the plurality of second non-conductive parts 641 to form an insulating part 415 between the plurality of second non-conductive parts 641 .
  • a metal structure 650 (or a metal case) including at least one first conductive part 411 and a plurality of second conductive parts 641 .
  • the metal structure 650 and at least one non-conductive part 412 may be included, or the side bezel structure 203 and the first support member 410 may be included to be referred to as a front case 660 .
  • the metal structure 650 or the front case 660 may be defined or interpreted as a part of the housing 210 (refer to FIG. 2 or 3 ).
  • the front case 660 has a connector hole in the form of an opening that is penetrated in a direction (eg, -y-axis direction) from the first side part 511 to the third side part 513 ( 540) may be included.
  • the connector hole 540 may include a first opening 710 and a second opening 720 connected to the first opening 710 .
  • the first opening 710 may include a recessed space in a direction from the first side part 511 to the third side part 513 .
  • the second opening 720 may overlap the first opening 710 when viewed in a direction from the first side portion 511 to the third side portion 513 .
  • the tray 550 may include a cover unit 610 and an external storage medium support unit 620 coupled to the cover unit 610 .
  • the cover part 610 may be positioned in the first opening 710 of the connector hole 540 , and the side surface 210C of the electronic device 2 . ) may form part of it.
  • the cover portion 610 may be referred to by various other terms, such as a 'head'.
  • the connector hole ( 540 may include a surface 714 that faces in a direction (eg, a +y-axis direction) from the third side surface portion 513 to the first side surface portion 511 .
  • the cover part 610 has a shape that can be fitted into the first opening 710 , and when viewed in the -y-axis direction, the surface 714 may overlap the cover part 610 .
  • the external storage medium 600 may be disposed on the external storage medium support 620 using, for example, a fastening structure such as a snap-fit included in the external storage medium support 620 .
  • the external storage medium support 620 may be referred to by various other terms such as a 'card seat'.
  • the external storage medium 600 may include, for example, a subscriber identification module (SIM) card or a universal subscriber identification module (USIM) card.
  • SIM subscriber identification module
  • USIM universal subscriber identification module
  • the external storage medium 600 includes a memory card such as a compact flash (CF), a multi media card (MMC), a smart media card (SMC), a secure disk (SD), or a memory stick (MS). can do.
  • CF compact flash
  • MMC multi media card
  • SMC smart media card
  • SD secure disk
  • MS memory stick
  • FIG. 7 and 8 are diagrams for explaining the coupling structure between the cover part 610 and the external storage medium support part 620 of the tray 550, in one embodiment.
  • reference numeral '701' denotes a plan view of the cover part 610 when the cover part 610 is viewed in the +y-axis direction.
  • Reference numeral '702' denotes a plan view of the end 621 of the external storage medium support 620 when the external storage medium support 620 is viewed in the -y-axis direction.
  • the end 621 of the external storage medium support part 620 may be coupled to the cover part 610 .
  • Reference numerals '801' and '802' relate to a fastening operation between the end portion 621 of the cover unit 610 and the external storage medium support unit 620 with reference to FIG. 7 .
  • the cover part 610 may include a recess 750 in the form of a recess in the +y-axis direction.
  • the cover part 610 may include a first edge region 730 extending from the recess 750 in a shape that protrudes in a direction perpendicular to the y-axis direction.
  • the end 621 of the external storage medium support 620 may include a second edge region 740 in a shape that protrudes in a direction orthogonal to the y-axis direction. In the first operation indicated by reference numeral '801', the end 621 of the external storage medium support part 620 may be inserted into the recess 750 of the cover part 610 .
  • the end 621 of the external storage medium support 620 may be moved in the -x axis direction.
  • the first edge region 730 of the cover part 610 and the second edge region 740 included in the end 621 of the external storage medium support part 620 may overlap. Interference between the first edge region 730 and the second edge region 740 may prevent the end 621 of the external storage medium support 620 from being separated from the recess 750 of the cover part 610 .
  • an adhesive material may be positioned between the cover part 610 and the end 621 of the external storage medium support part 620 .
  • the adhesive material may include a variety of polymers.
  • the adhesive material may include, for example, a general adhesive material, a heat-reactive adhesive material, or a photo-reactive adhesive material.
  • the end portion 621 of the cover unit 610 and the external storage medium support unit 620 may be coupled in various other ways.
  • the end 621 of the cover part 610 and the external storage medium support part 620 may be coupled to each other through a fastening element such as a bolt or a snap fit.
  • the cover part 610 and the external storage medium support part 620 may include different materials.
  • the cover part 610 may include a metal material
  • the external storage medium support part 620 may include a non-metal material (eg, a polymer).
  • the cover part 610 may include a first metal material, and the external storage medium support part 620 may include a second metal material different from the first metal material.
  • the cover part 610 may include a first polymer, and the external storage medium support part 620 may include a second polymer different from the first polymer.
  • the cover part 610 and the external storage medium support part 620 may include the same metal material or the same non-metal material, and may be integrally formed.
  • the cover part 610 or the external storage medium support part 620 is formed of a polymer, for example, engineering plastic (eg, PC (polycarbonate), PMMA (polymethyl methacrylate)), engineering plastic is made of glass fiber. , or various polymers such as materials that are blended with various reinforcing substrates such as carbon fibers, such as fiber reinforced plastic (FRP).
  • PC polycarbonate
  • PMMA polymethyl methacrylate
  • FRP fiber reinforced plastic
  • the cover part 610 may include a first surface 611 , a second surface 612 , and a third surface 613 .
  • the first surface 611 may form a portion of the side surface 210C of the electronic device 200 in a state in which the tray 550 is completely inserted into the connector hole 540 .
  • the second surface 612 may be positioned on the opposite side to the first surface 611 , and may be coupled to the end 621 of the external storage medium support 620 .
  • the recess 750 of the cover part 610 into which the end 621 of the external storage medium support part 620 is inserted may be formed in the second surface 612 .
  • the third surface 613 may be a lateral surface (or a side surface) connected between the first surface 611 and the second surface 612 .
  • the first opening 710 of the connector hole 540 has a third surface 613 included in the cover part 610 of the tray 550 while the tray 550 is fully inserted into the connector hole 540 . It may include a fourth surface 713 facing it.
  • the third surface 613 of the cover part 610 is a first side area 613a, a second side area 613b, a third side area 613c, or a fourth side area. (613d) may be included.
  • the first side area 613a faces the rear surface 210B (refer to FIG. 3 ) of the electronic device 200
  • the second side area 613b may face the front surface 210A of the electronic device 200 .
  • the third side area 613c may have a curved shape connecting one end of the first side area 613a and one end of the second side area 613b, and is larger than the first corner portion C1 (see FIG. 5 ).
  • the fourth side area 613d may have a curved shape connecting the other end of the first side area 613a and the other end of the second side area 613b, and the first corner portion (C2) than the second corner portion C2. It can be located close to C2).
  • the third surface 613 of the cover part 610 is formed with the fourth surface 713 of the first opening 710 and It may include a first area 810 and a second area 820 that face each other.
  • the first region 810 may be located closer to the first surface 611 than the second surface 612 .
  • the second region 820 may be located closer to the second surface 612 than the first surface 611 of the cover part 610 .
  • the first region 810 and a partial region (eg, the third region) of the fourth surface 713 facing the first region 810 are They can be spaced 1 distance apart.
  • the metal structure 650 included in the front case 660 may be deformed due to an external impact caused by the fall of the electronic device 200 .
  • a portion of the metal structure 650 is formed on the second region 820 of the cover part 610 and the fourth surface ( 713) may be deformed while at least partially filling the space between them.
  • the space between the second region 820 of the cover part 610 and the fourth surface 713 of the first opening 710 is formed in the first opening 710 even if the metal structure 650 is deformed due to external impact. ) may contribute to enabling detachment of the cover part 610 for the .
  • FIG. 9 and 10 are perspective views of the cover part 610 according to an embodiment.
  • 11 is, for example, a side view of the cover part 610 when looking at the cover part 610 in the +z-axis direction in FIG. 6 .
  • FIG. 12 is, for example, a side view of the cover part 610 when looking at the cover part 610 in the -z axis direction in FIG. 6 .
  • the second area 820 included in the third surface 613 of the cover part 610 is the second area included in the first side area 613a.
  • the first part 821, the second part 822 included in the second side region 613b, and the first part 821 and the second part 822 are connected and included in the third side region 613c
  • a third portion 823 may be included.
  • the first part 821 , the second part 822 , and the third part 823 have the connector hole ( It may be a part that forms an empty space (or spaced space) of a relatively large volume together with the fourth surface 713 included in the first opening 710 of the 540 .
  • the first portion 821 is directed toward the front 210A (refer to FIG.
  • the second portion 822 is directed toward the rear surface 210B (refer to FIG. 3 ) of the electronic device 200 (eg, in the -z-axis direction) in a state in which the tray 550 is fully inserted into the connector hole 540 . It may include a flat portion 822a (toward the face), and a curved portion 822b connecting the flat portion 822a and the first region 810 .
  • the third portion 823 includes a fourth portion 824 connected to the first portion 821 , a fifth portion 825 connected to the second portion 822 , and a fourth portion 824 and a fifth portion 825 .
  • the fourth portion 824 includes, for example, a curved portion 824a that extends seamlessly by bending from the first portion 821 toward the second portion 822 , and the curved portion 824a and the first region 810 . It may include another curved portion 824b that connects them.
  • the fifth portion 825 includes, for example, a curved portion 825a that smoothly extends from the second portion 822 toward the first portion 821 , and the curved portion 825a and the first region 810 .
  • a curved surface may be formed instead of the curved portion 825b.
  • the sixth portion 826 of the second region 820 includes a flat portion 826a oriented in the -x-axis direction, and a curved portion connecting the flat portion 826a and the first region 810 . (826b).
  • a curved surface instead of the curved portion 826b, a curved surface (for example, refer to a dotted-dotted line (eg, an imaginary line) indicated by reference numeral '1101' shown in FIGS. 11 and 12) may be formed.
  • the flat portion 826a may be implemented by changing it to a curved portion having a convex shape in the -x axis direction or the +x axis direction.
  • At least one of the first portion 821 , the second portion 822 , the fourth portion 824 , and the fifth portion 825 may be omitted.
  • 13 is a cross-sectional view 1300 in an x-y plane of the electronic device 200 shown in FIG. 5 according to an embodiment.
  • 14 is a partial cross-sectional view 1400 in an x-y plane of the electronic device 200 shown in FIG. 5 according to an embodiment.
  • the first opening 710 of the connector hole 540 may be formed in the metal structure 650 of the front case 660 .
  • the second opening 720 of the connector hole 650 may overlap the first opening 710 when viewed in a direction in which the tray 550 is inserted into the connector hole 540 (eg, -y-axis direction). there is.
  • the first opening 710 may include a fourth surface 713 facing the third surface 613 (see FIG. 6 ) included in the cover part 610 of the tray 550 .
  • the fourth surface 713 of the first opening 710 includes a third area 1301 facing the first area 810 included in the third surface 613 of the cover part 610, and the cover part ( A fourth region 1302 facing the second region 820 (eg, the sixth portion 826 in FIG. 13 ) included in the third surface 613 of the 610 may be included.
  • the third region 1301 and the fourth region 1302 of the fourth surface 713 are, for example, parallel to a direction in which the tray 550 is inserted into the connector hole 540 (eg, -y-axis direction). and can be seamlessly connected without a difference in height in a direction orthogonal to the direction. In the example of FIG.
  • the electronic device 200 may be formed so as to be able to connect smoothly with the outer surface of the structure 203 (see FIG. 5 ) without a substantial gap.
  • An external impact may be applied to the electronic device 200 for reasons such as dropping of the electronic device 200 , and a collision between the metal structure 650 and the first region 810 of the cover part 610 may occur. Accordingly, a portion of the metal structure 650 may be deformed toward the second region 820 of the cover part 610 due to interference of the first region 810 of the cover part 610 .
  • the electronic device 200 may fall and an external impact may be applied to the second corner portion C2 , and a portion of the metal structure 650 may include the sixth portion 826 and the first portion of the cover portion 610 .
  • the opening 710 may be deformed while at least partially filling the space 1305 between the fourth regions 1302 (hereinafter, referred to as a deformable part corresponding space).
  • the deformable part corresponding space 1305 may contribute to the detachment of the cover part 610 with respect to the first opening 710 even if the metal structure 650 is deformed due to an external impact. For example, when an external impact is applied to the second corner portion C2 due to the fall of the electronic device 200 , a third side surface of the third surfaces 613 (see FIG. 6 ) of the cover portion 610 . A relatively large or concentrated collision may occur between region 613c (see FIG. 7 ) and metal structure 650 .
  • the portion for the medium deformable portion corresponding space 1305 (eg, the first portion 821 , the second portion 822 , and the third portion 823 of FIG. 7 ) is smaller than the extended second width H2.
  • the first region 810 may not include a curved or concave-convex shape, which means that even though the deformed portion 1304 of the metal structure 650 abuts the first region 810 , the first opening ( It is possible to reduce the influence on the detachment of the cover part 610 with respect to the 710 .
  • the cover portion 610 may have greater strength or greater rigidity (or rigidity characteristics) than the metal structure 650 , which means that the cover portion 610 has a metal structure against an external impact. It can contribute to not being deformed by (650).
  • the cover part 610 may include a metal material different from that of the metal structure 650 .
  • the cover part 610 may include the same metal material as the metal structure 650 . In this case, the cover part 610 may be coated to have a different surface hardness from that of the metal structure 650 .
  • the deformable portion corresponding space 1305 may accommodate the deformed portion 1304 of the metallic structure 650 due to, for example, an external impact, while the deformed portion 1304 of the metallic structure 650 may be a cover portion ( It may have a shape capable of reducing the effect of stress on the second region 820 of the 610 .
  • the deformable part corresponding space 1305 may be implemented in various other forms which are not limited to the example of FIG. 13 .
  • the third region 1301 and the fourth region 1302 may be parallel to a direction in which the tray 550 is inserted into the connector hole 540 (eg, a -y-axis direction), and the direction and may be formed at different heights in orthogonal directions.
  • a direction in which the tray 550 is inserted into the connector hole 540 eg, a -y-axis direction
  • the fourth region 1302 may be formed so as not to protrude in the +-axis direction than the third region 1301 , and may contribute to a larger volume of the deformable portion corresponding space 1305 .
  • the fourth region 1302 may be formed with an inclined surface or a curved surface that is not parallel to the third region 1301 .
  • a portion of the second region 820 for the deformable portion corresponding space 1305 eg, the first portion 821 , the second portion 822 , and the third portion 823 of FIG. 7 ).
  • the deformable portion corresponding space 1305 is, even if there is a deformation of the metal structure 650 due to an external impact, the end 621 of the cover portion 610 and the external storage medium support portion 620 is coupled. It is possible to reduce the effect of stress on the portion (hereinafter, the coupling portion) 1306 .
  • the engaging portion 1306 of the tray 550 is, for example, a recess 750 (see FIG. 7 ) formed in the second surface 612 of the cover portion 610 , and inserted into the recess 750 . It may include an end 621 of the external storage medium support 620 .
  • the coupling part 1306 of the tray 550 is, for example, a first edge area 730 (see FIG.
  • the coupling part 1306 of the tray 550 may include, for example, an adhesive material between the cover part 610 and the end 621 of the external storage medium support part 620 . Since the deformable portion corresponding space 1305 can accommodate the deformed portion 1304 without suppressing the deformation of the metal structure 650 with respect to an external shock, the external shock is applied to the cover portion 610 and the external storage medium support portion ( The influence on the coupling portion 1306 between the 620 can be reduced, thereby preventing the damage of the coupling portion 1306 to an external impact.
  • the deformable portion corresponding space 1305 is formed in a direction (eg, +y-axis direction) in which the tray 550 is separated from the connector hole 540 based on the coupling portion between the second surface and the support portion. ) can be implemented in a more extended form. This contributes to reducing the effect of an external shock applied due to the fall of the electronic device 200 on the coupling part 1306 between the cover part 610 and the external storage medium support part 620, Damage to the coupling portion 1306 can be prevented.
  • the structure enabling the detachment of the tray 550 is various external insertion components included in various electronic devices. can be applied to
  • a cover part (eg, the cover part 610 of FIG. 6 ) having a, and a support part (eg, FIG. 6 of the external storage medium support unit 620) may be included.
  • the side surface of the cover part has a first area located closer to the first surface than the second surface (eg, the first area 810 in FIG. 6 ), and a second area located closer to the second surface than the first surface. It may include a region (eg, the second region 820 of FIG. 6 ).
  • the surface of the opening may include a third region facing the first region (eg, a third region 1301 in FIG.
  • the second region 13 and the second region facing the first region in a state in which the tray is inserted into the housing. It may include a fourth region (eg, the fourth region 1302 of FIG. 13 ). a second distance (eg, FIG. 13 ) between at least a portion of the second region (eg, the first portion 821 , the second portion 822 , or the third portion 823 of FIG. 7 ) and the fourth region The second distance D2 of ) may be greater than a first distance between the first region and the third region (eg, the first distance D1 of FIG. 13 ).
  • the engaging portion (eg, the engaging portion 1306 in FIG. 13 ) may include a recess (eg, in FIG. 7 ) formed in the second surface (eg, the second surface 612 in FIG. 7 ). 7 ), and an end of the support part inserted into the recess (eg, an end 621 of FIG. 13 ).
  • the coupling portion (eg, the coupling portion 1306 of FIG. 13 ) may include the recess (eg, FIG. 7 ) in a direction orthogonal to a direction in which the tray is inserted into the housing.
  • a first edge region (eg, the first edge region 730 of FIG. 7 ) of the cover portion extending from the recess 750 of the and when viewed in a direction in which the tray is inserted into the housing, a second edge area overlapping the first edge area (eg, the second edge area 740 of FIG. 7 ) may be included.
  • the tray in the third area (eg, the third area 1301 of FIG. 13 ) and the fourth area (eg, the fourth area 1302 of FIG. 13 ), the tray is the It may be connected in a direction parallel to the direction to be inserted into the housing and perpendicular to the direction without a difference in height.
  • the tray in the third area (eg, the third area 1301 of FIG. 13 ) and the fourth area (eg, the fourth area 1302 of FIG. 13 ), the tray is the It may be formed at different heights in a direction parallel to the direction to be inserted into the housing and orthogonal to the direction.
  • At least a portion (eg, the first portion 821 , the second portion 822 , or the third portion 823 of FIG. 7 ) of the region (eg, the second region 820 of FIG. 6 ) may include: In a direction to be inserted into the housing, the width may be greater than that of the first region (eg, the first region 810 of FIG. 6 ).
  • At least a portion (eg, the sixth portion 826 of FIG. 13 ) of the region (eg, the second region 820 of FIG. 6 ) includes the fourth region (eg, the fourth region 1302 of FIG. 13 ) and It may include a facing planar portion (eg, the flat portion 826a of FIG. 13 ).
  • the housing may include a metal structure (eg, the metal structure 650 of FIG. 13 ) forming the opening (eg, the first opening 710 of FIG. 13 ).
  • a metal structure eg, the metal structure 650 of FIG. 13
  • the opening eg, the first opening 710 of FIG. 13
  • the cover part (eg, the cover part 610 of FIG. 6 ) may have greater strength or greater rigidity than the metal structure (eg, the metal structure 650 of FIG. 6 ). there is.
  • the cover part (eg, the cover part 610 of FIG. 6 ) includes a metal material
  • the support part eg, the external storage medium support part 620 of FIG. 6
  • the non-metallic material may include
  • the external storage medium may include a subscriber identification module (SIM) card.
  • SIM subscriber identification module
  • the housing eg, the housing 210 of FIG. 2 or 3
  • the housing is located opposite to the front plate (eg, the front plate 201 of FIG. 2 ), the front plate a rear plate (eg, the rear plate 202 of FIG. 3 ), and a side bezel structure (eg, the side bezel structure 203 of FIG. 5 ) that at least partially surrounds a space between the front plate and the rear plate. can do.
  • the side bezel structure includes a first side part (eg, the first side part 511 in FIG. 5), a third side part spaced apart from the first side part in parallel (eg, the third side part 513 in FIG. 5), the a second side part (eg, the second side part 512 of FIG.
  • the opening (eg, the connector hole 540 of FIG. 5 ) is located on the first side portion, and the third region (eg, the third region 1301 of FIG. 13 ) and the fourth region (eg, FIG. 13 ) In the fourth region 1302), the first side portion and the second side portion are greater than the first corner portion (eg, the first corner portion C1 of FIG. 5 ) connected to the first side portion and the fourth side portion. It may be located close to the connected second corner portion (eg, the second corner portion C2 of FIG. 5 ).

Abstract

Un dispositif électronique selon un mode de réalisation de la présente invention comprend : un boîtier comprenant une ouverture ; et un plateau pouvant être inséré dans le boîtier à travers l'ouverture. Le plateau comprend : une première surface formant une partie de la surface extérieure du dispositif électronique lorsque le plateau est inséré dans le boîtier ; une deuxième surface positionnée à l'opposé de la première surface ; une partie couvercle dotée d'une surface latérale faisant face à la surface de l'ouverture lorsque le plateau est inséré dans le boîtier ; et une partie support accouplée à la deuxième surface et sur laquelle est disposé le support de stockage externe. La surface latérale de la partie couvercle comprend : une première zone positionnée plus près de la première surface que la deuxième surface ; et une deuxième zone positionnée plus près de la deuxième surface que la première surface. La surface de l'ouverture comprend : une troisième zone faisant face à la première zone lorsque le plateau est inséré dans le boîtier ; et une quatrième zone faisant face à la deuxième zone. Une deuxième distance entre au moins une partie de la deuxième zone et la quatrième zone peut être supérieure à une première distance entre la première zone et la troisième zone. Divers autres modes de réalisation sont possibles.
PCT/KR2021/012907 2020-09-22 2021-09-17 Dispositif électronique permettant le montage d'un support de stockage externe WO2022065857A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2020-0122175 2020-09-22
KR20200122175 2020-09-22
KR1020210001540A KR20220039519A (ko) 2020-09-22 2021-01-06 외부저장매체를 장착 가능한 전자 장치
KR10-2021-0001540 2021-01-06

Publications (1)

Publication Number Publication Date
WO2022065857A1 true WO2022065857A1 (fr) 2022-03-31

Family

ID=80845676

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2021/012907 WO2022065857A1 (fr) 2020-09-22 2021-09-17 Dispositif électronique permettant le montage d'un support de stockage externe

Country Status (1)

Country Link
WO (1) WO2022065857A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013251024A (ja) * 2012-06-01 2013-12-12 Smk Corp 電子機器のトレイ式引出し部構造
KR20160090738A (ko) * 2015-01-22 2016-08-01 타이코 일렉트로닉스 저팬 지.케이. 카드 트레이 및 카드 커넥터
KR20170097977A (ko) * 2016-02-19 2017-08-29 삼성전자주식회사 전자 장치
JP2020024848A (ja) * 2018-08-07 2020-02-13 シャープ株式会社 カードトレイ及び電子機器
KR20200017446A (ko) * 2020-02-10 2020-02-18 삼성전자주식회사 휴대용 전자 장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013251024A (ja) * 2012-06-01 2013-12-12 Smk Corp 電子機器のトレイ式引出し部構造
KR20160090738A (ko) * 2015-01-22 2016-08-01 타이코 일렉트로닉스 저팬 지.케이. 카드 트레이 및 카드 커넥터
KR20170097977A (ko) * 2016-02-19 2017-08-29 삼성전자주식회사 전자 장치
JP2020024848A (ja) * 2018-08-07 2020-02-13 シャープ株式会社 カードトレイ及び電子機器
KR20200017446A (ko) * 2020-02-10 2020-02-18 삼성전자주식회사 휴대용 전자 장치

Similar Documents

Publication Publication Date Title
WO2020027528A1 (fr) Connecteur comprenant une partie de support pour supporter au moins une partie d'une broche conductrice, et dispositif électronique le comprenant
WO2021246668A1 (fr) Dispositif électronique comprenant de multiples cartes de circuit imprimé
WO2022075632A1 (fr) Dispositif électronique comprenant une antenne
WO2022139302A1 (fr) Structure d'antenne et dispositif électronique la comprenant
WO2022065857A1 (fr) Dispositif électronique permettant le montage d'un support de stockage externe
KR20220039519A (ko) 외부저장매체를 장착 가능한 전자 장치
WO2022065807A1 (fr) Structure de contact de module de caméra et dispositif électronique la comprenant
WO2022197155A1 (fr) Dispositif électronique comprenant une carte de circuit imprimé souple
WO2022270859A1 (fr) Dispositif de maintien pour disposition d'antenne et dispositif de communication mobile le comprenant
WO2022025679A1 (fr) Dispositif électronique comprenant une structure de renforcement pour la prévention des dommages
WO2022203300A1 (fr) Boîtier ayant un élément de ventilation disposé à l'intérieur de celui-ci, et dispositif électronique le comprenant
WO2023149631A1 (fr) Dispositif électronique comprenant une structure étanche à l'eau
WO2023054985A1 (fr) Dispositif électronique ayant une structure d'antenne
WO2023080565A1 (fr) Structure de connexion électrique de dispositif électronique, et dispositif électronique la comprenant
WO2022119298A1 (fr) Couvercle arrière et dispositif électronique le comprenant
WO2024043500A1 (fr) Dispositif électronique comprenant un pavé tactile
WO2023022517A1 (fr) Dispositif électronique comprenant une antenne
WO2024019361A1 (fr) Dispositif électronique comprenant un boîtier à l'intérieur duquel est formé un trou traversant
WO2022086172A1 (fr) Structure de bouton et dispositif électronique la comprenant
WO2022197133A1 (fr) Dispositif de couvercle pour dispositif électronique
WO2024025213A1 (fr) Dispositif électronique comprenant un ensemble de touches
WO2023234598A1 (fr) Dispositif électronique comprenant un ensemble clé
WO2023282495A1 (fr) Antenne et dispositif électronique comprenant celle-ci
WO2023033354A1 (fr) Dispositif électronique comprenant une carte de circuit imprimé souple
WO2022197012A1 (fr) Dispositif étanche à l'eau à touche et dispositif électronique comprenant un dispositif étanche à l'eau à touche

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21872885

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 21872885

Country of ref document: EP

Kind code of ref document: A1