WO2022197133A1 - Dispositif de couvercle pour dispositif électronique - Google Patents

Dispositif de couvercle pour dispositif électronique Download PDF

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Publication number
WO2022197133A1
WO2022197133A1 PCT/KR2022/003780 KR2022003780W WO2022197133A1 WO 2022197133 A1 WO2022197133 A1 WO 2022197133A1 KR 2022003780 W KR2022003780 W KR 2022003780W WO 2022197133 A1 WO2022197133 A1 WO 2022197133A1
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WO
WIPO (PCT)
Prior art keywords
electronic device
cover
sheet
area
region
Prior art date
Application number
PCT/KR2022/003780
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English (en)
Korean (ko)
Inventor
박성한
Original Assignee
삼성전자 주식회사
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Application filed by 삼성전자 주식회사 filed Critical 삼성전자 주식회사
Publication of WO2022197133A1 publication Critical patent/WO2022197133A1/fr

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1628—Carrying enclosures containing additional elements, e.g. case for a laptop and a printer
    • A—HUMAN NECESSITIES
    • A45—HAND OR TRAVELLING ARTICLES
    • A45C—PURSES; LUGGAGE; HAND CARRIED BAGS
    • A45C11/00—Receptacles for purposes not provided for in groups A45C1/00-A45C9/00
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1662—Details related to the integrated keyboard
    • G06F1/1669—Detachable keyboards
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1675—Miscellaneous details related to the relative movement between the different enclosures or enclosure parts
    • G06F1/1679—Miscellaneous details related to the relative movement between the different enclosures or enclosure parts for locking or maintaining the movable parts of the enclosure in a fixed position, e.g. latching mechanism at the edge of the display in a laptop or for the screen protective cover of a PDA
    • A—HUMAN NECESSITIES
    • A45—HAND OR TRAVELLING ARTICLES
    • A45C—PURSES; LUGGAGE; HAND CARRIED BAGS
    • A45C11/00—Receptacles for purposes not provided for in groups A45C1/00-A45C9/00
    • A45C2011/003—Receptacles for purposes not provided for in groups A45C1/00-A45C9/00 for portable computing devices, e.g. laptop, tablet, netbook, game boy, navigation system, calculator

Definitions

  • This document relates to a cover device for an electronic device.
  • cover device detachable to an electronic device such as a tablet personal computer (PC) or a smart phone and capable of protecting the electronic device.
  • PC personal computer
  • the cover device may include, for example, a folding part having flexibility and a cover part connected to the folding part.
  • the cover part may be opened and closed using the folding part.
  • the folding part In the closed state of the cover device, the folding part may be in a curved shape, and one surface of the electronic device (eg, a surface on which the screen is exposed) may be covered by the cover part.
  • the folding part may be formed to have a length that facilitates the opening and closing operation of the cover part, but may allow excessive movement of the cover part or reduce aesthetics.
  • An embodiment of the present document may provide a cover device for an electronic device for securing aesthetics while reducing the length of a folding part included in the cover device.
  • a cover device for an electronic device includes a connection structure detachable from the electronic device, and a cover member connected to the connection structure and capable of opening and closing one surface of the electronic device,
  • the connection structure includes a first surface attached to the electronic device and a second surface to which the cover member is attached, and the cover member includes a first sheet attached to a first area among the second surfaces and the second surface. and a second sheet attached to the second region, and a step may be formed between the first region and the second region.
  • the cover device for an electronic device may reduce the length of the folding part to reduce excessive movement of the cover part capable of covering one surface of the electronic device, and may improve aesthetics.
  • FIG. 1 is a block diagram of an electronic device in a network environment, in one embodiment.
  • FIG. 2 illustrates an electronic device and a cover device detachable from the electronic device according to an exemplary embodiment.
  • FIG 3 shows, in one embodiment, the cover arrangement in a closed state.
  • FIG 4 shows, in one embodiment, the cover arrangement in an open state.
  • FIG. 5 is an exploded view of a part of a cover device according to an embodiment.
  • FIG. 6 illustrates a state in which the second structure, the electrical path, the second sheet, and the support plate are coupled, in one embodiment.
  • FIG. 7 , 8 , 9 , and 10 show assembly operations for a cover device, in one embodiment.
  • FIG. 11 shows, in one embodiment, part of the cover arrangement in relation to the closed state of FIG. 3 .
  • FIG. 12 is, in one embodiment, a partial cross-sectional view taken along line A-A' in the cover device for the closed state of FIG. 3 ;
  • FIG. 13 illustrates a cross-sectional structure in the y-z plane of a portion indicated by reference numeral '1201' in the example of FIG. 12, according to an embodiment.
  • FIG. 14 is a partial cross-sectional view taken along line B-B' in the cover device for the closed state of FIG. 3, in one embodiment
  • FIG. 15 illustrates a cross-sectional structure in the y-z plane of a portion indicated by reference numeral '1401' in the example of FIG. 14, according to an embodiment.
  • FIG 16 illustrates a portion of the cover device with the electronic device and the cover portion open at an angle of about 180 degrees, in one embodiment.
  • FIG. 17 shows, in one embodiment, a cross-sectional structure of a cover device in relation to the example of FIG. 16 .
  • FIG. 1 is a block diagram of an electronic device 101 in a network environment 100 , in one embodiment.
  • an electronic device 101 communicates with an external electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or a second network 199 . ) (eg, a long-distance wireless communication network) to communicate with at least one of the external electronic device 104 and the server 108 .
  • the electronic device 101 may communicate with the external electronic device 104 through the server 108 .
  • the electronic device 101 includes a processor 120 , a memory 130 , an input module 150 , a sound output module 155 , a display module 160 , an audio module 170 , a sensor module 176 , and an interface 177 .
  • connection terminal 178 a connection terminal 178 , a haptic module 179 , a camera module 180 , a power management module 188 , a battery 189 , a communication module 190 , a subscriber identification module 196 , and/or an antenna module (197) may be included.
  • at least one of these components eg, the connection terminal 178, may be omitted or one or more other components may be added.
  • some of these components may be implemented with a single integrated circuitry.
  • the sensor module 176 , the camera module 180 , or the antenna module 197 may be implemented by being embedded in one component (eg, the display module 160 ).
  • the processor 120 executes software (eg, the program 140) to execute at least one other component (eg, a hardware or software component) of the electronic device 101 connected to the processor 120. It can control and perform various data processing or operations. As at least part of data processing or operation, the processor 120 loads a command or data received from another component (eg, the sensor module 176 or the communication module 190 ) into the volatile memory 132 , and , a command or data stored in the volatile memory 132 may be processed, and the result data may be stored in the nonvolatile memory 134 .
  • software eg, the program 140
  • the processor 120 loads a command or data received from another component (eg, the sensor module 176 or the communication module 190 ) into the volatile memory 132 , and , a command or data stored in the volatile memory 132 may be processed, and the result data may be stored in the nonvolatile memory 134 .
  • the processor 120 is a main processor 121 (eg, a central processing unit (CPU) or an application processor (AP)) or a secondary processor 123 (eg, independently or together) : Graphics processing unit (GPU), neural network processing unit (NPU), image signal processor (ISP), sensor hub processor, or communication processor (CP) )) may be included. Additionally or alternatively, the auxiliary processor 123 may be configured to use less power than the main processor 121 or to be specialized for a designated function. The auxiliary processor 123 may be implemented separately from or as a part of the main processor 121 .
  • main processor 121 eg, a central processing unit (CPU) or an application processor (AP)
  • a secondary processor 123 eg, independently or together
  • GPU Graphics processing unit
  • NPU neural network processing unit
  • ISP image signal processor
  • CP sensor hub processor
  • CP communication processor
  • the auxiliary processor 123 may be configured to use less power than the main processor 121 or to be specialized for a designated function
  • the secondary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or when the main processor 121 is active (eg, executing an application). ), together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states.
  • the coprocessor 123 eg, image signal processor (ISP) or communication processor (CP)
  • may be implemented as part of another functionally related component eg, camera module 180 or communication module 190). have.
  • the auxiliary processor 123 may include a specialized hardware structure to process an artificial intelligence model.
  • Artificial intelligence models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself on which the artificial intelligence model is performed, or may be performed through a separate server (eg, the server 108).
  • the learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but the above-described example is not limited to
  • the artificial intelligence model may include a plurality of artificial neural network layers.
  • Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted Boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent DNNs (BRDNNs), and deep neural networks. It may be any one of deep Q-networks, or a combination of two or more of the above, but is not limited to the above-described example.
  • the AI model may additionally or alternatively include software architecture.
  • the memory 130 may store various data used by at least one component of the electronic device 101 (eg, the processor 120 or the sensor module 176 ).
  • the various data may include, for example, input data or output data for software (eg, the program 140 ) and instructions related thereto.
  • Memory 130 may include volatile memory 132 , and/or non-volatile memory 134 .
  • the program 140 may be stored as software in the memory 130 , and may include, for example, an operating system 142 , middleware 144 , and/or applications 146 .
  • the input module 150 may receive a command or data to be used by another component (eg, the processor 120 ) of the electronic device 101 from the outside (eg, a user) of the electronic device 101 .
  • the input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).
  • the sound output module 155 may output a sound signal to the outside of the electronic device 101 .
  • the sound output module 155 may include, for example, a speaker or a receiver.
  • the speaker can be used for general purposes, such as multimedia playback or recording playback, and the receiver can be used for incoming calls.
  • the receiver may be implemented separately from or as part of the speaker.
  • the display module 160 may visually provide information to the outside (eg, a user) of the electronic device 101 .
  • the display module 160 may include, for example, a control circuit for controlling a display, a hologram device, or a projector and a corresponding device.
  • the display module 160 may include a touch circuit (eg, a touch sensor) configured to sense a touch, or a sensor circuit (eg, a pressure sensor) configured to measure the intensity of force generated by the touch.
  • the audio module 170 may convert a sound into an electric signal or, conversely, convert an electric signal into a sound.
  • the audio module 170 acquires a sound through the input module 150 or an external electronic device (eg, the external electronic device 102 ) directly or wirelessly connected to the sound output module 155 or the electronic device 101 . Sound can be output through (eg speakers, headphones, or keyboard).
  • the sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the sensed state. can do.
  • the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, Alternatively, it may include an illuminance sensor.
  • the interface 177 may support one or more designated protocols that may be used for the electronic device 101 to directly or wirelessly connect with an external electronic device (eg, the external electronic device 102 ).
  • the interface 177 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface.
  • HDMI high-definition multimedia interface
  • USB universal serial bus
  • SD card interface Secure Digital
  • the connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the external electronic device 102 ).
  • the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, and/or an audio connector (eg, a headphone connector).
  • the haptic module 179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic sense.
  • the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
  • the camera module 180 may capture still images and moving images.
  • the camera module 180 may include one or more lenses, image sensors, image signal processors (ISPs), or flashes.
  • ISPs image signal processors
  • the power management module 188 may manage power supplied to or consumed by the electronic device 101 .
  • the power management module 188 may be implemented, for example, as at least part of a power management integrated circuit (PMIC).
  • PMIC power management integrated circuit
  • the battery 189 may supply power to at least one component of the electronic device 101 .
  • Battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, and/or a fuel cell.
  • the communication module 190 is a direct (eg, wired) communication channel or wireless communication between the electronic device 101 and an external electronic device (eg, the external electronic device 102, the external electronic device 104, or the server 108). It is possible to support establishment of a channel and performing communication through the established communication channel.
  • the communication module 190 may include one or more communication processors (CPs) that operate independently of the processor 120 (eg, an application processor (AP)) and support direct (eg, wired) communication or wireless communication. .
  • CPs communication processors
  • AP application processor
  • the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, a local area network (LAN) communication module). ) communication module, or power line communication module).
  • GNSS global navigation satellite system
  • LAN local area network
  • the corresponding communication module is a first network 198 (eg, a short-range communication network such as Bluetooth (BLUETOOTH), WiFi (wireless fidelity) direct or IrDA (IR data association)) or a second network 199 ( For example: it may communicate with the external electronic device 104 through a legacy cellular network, a 5th generation (5G) network, a next-generation communication network, the Internet, or a telecommunication network such as a computer network (eg, LAN or WAN).
  • a first network 198 eg, a short-range communication network such as Bluetooth (BLUETOOTH), WiFi (wireless fidelity) direct or IrDA (IR data association)
  • a second network 199 For example: it may communicate with the external electronic device 104 through a legacy cellular network, a 5th generation (5G) network, a next-generation communication network, the Internet, or a telecommunication network such as a computer network (eg, LAN or WAN).
  • 5G 5th generation
  • the wireless communication module 192 communicates with the first network 198 or the second network 199 using subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the Subscriber Identity Module (SIM) 196 .
  • subscriber information eg, International Mobile Subscriber Identifier (IMSI)
  • SIM Subscriber Identity Module
  • the electronic device 101 may be identified or authenticated within the network.
  • the wireless communication module 192 may support a 5G network after a 4th generation (4G) network and a next-generation communication technology, for example, a new radio access technology (NR).
  • NR access technology includes high-speed transmission of high-capacity data (ie, enhanced mobile broadband (eMBB)), minimization of terminal power and access to multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (URLLC (ultra-reliable) and low-latency communications)).
  • eMBB enhanced mobile broadband
  • mMTC massive machine type communications
  • URLLC ultra-reliable and low-latency communications
  • the wireless communication module 192 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example.
  • a high frequency band eg, mmWave band
  • the wireless communication module 192 uses various techniques for securing performance in a high-frequency band, for example, beamforming, massive multiple-input and multiple-output (MIMO), all-dimensional multiplexing. Technologies such as input/output (full-dimensional MIMO (FD-MIMO)), array antenna, analog beam-forming, or large-scale antenna may be supported.
  • the wireless communication module 192 may support various requirements specified in the electronic device 101 , an external electronic device (eg, the external electronic device 104 ), or a network system (eg, the second network 199 ).
  • the wireless communication module 192 includes a peak data rate (eg, 20 Gbps or more) for realizing eMBB, loss coverage (eg, 164 dB or less) for realizing mMTC, or U- for realizing URLLC It can support plane latency (eg, downlink (DL) and uplink (UL) of 0.5 ms or less, or round trip 1 ms or less).
  • a peak data rate eg, 20 Gbps or more
  • loss coverage eg, 164 dB or less
  • U- for realizing URLLC
  • plane latency eg, downlink (DL) and uplink (UL) of 0.5 ms or less, or round trip 1 ms or less.
  • the antenna module 197 may transmit or receive a signal or power to the outside (eg, an external electronic device).
  • the antenna module 197 may include an antenna including a conductor formed on a substrate (eg, a printed circuit board (PCB)) or a radiator including a conductive pattern.
  • the antenna module 197 may include a plurality of antennas (eg, an antenna array). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected from the plurality of antennas by, for example, the communication module 190 . can be selected. A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna.
  • other components eg, a radio frequency integrated circuit (RFIC) may be additionally formed as a part of the antenna module 197 .
  • RFIC radio frequency integrated circuit
  • the antenna module 197 may form an mmWave antenna module.
  • the mmWave antenna module is disposed on or adjacent to a printed circuit board (PCB), a first side (eg, bottom side) of the printed circuit board, and a designated high frequency band (eg, mmWave band) an RFIC capable of supporting array antenna).
  • PCB printed circuit board
  • first side eg, bottom side
  • a designated high frequency band eg, mmWave band
  • an RFIC capable of supporting array antenna
  • peripheral devices eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)
  • GPIO general purpose input and output
  • SPI serial peripheral interface
  • MIPI mobile industry processor interface
  • the command or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 .
  • Each of the external electronic devices 102 or 104 may be the same as or different from the electronic device 101 . All or part of the operations performed by the electronic device 101 may be performed by one or more external electronic devices among the external electronic devices 102 , 104 , or 108 .
  • the electronic device 101 may perform the function or service itself instead of executing the function or service itself.
  • one or more external electronic devices may be requested to perform at least a part of the function or the service.
  • One or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 101 .
  • the electronic device 101 may process the result as it is or additionally and provide it as at least a part of a response to the request.
  • cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used.
  • the electronic device 101 may provide an ultra-low delay service using, for example, distributed computing or mobile edge computing (MEC).
  • the external electronic device 104 may include an Internet of things (IoT) device.
  • the server 108 may be an intelligent server using machine learning and/or neural networks.
  • the external electronic device 104 or the server 108 may be included in the second network 199 .
  • the electronic device 101 may be applied to an intelligent service (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.
  • an intelligent service eg, smart home, smart city, smart car, or health care
  • the electronic device may be a device of various types.
  • the electronic device may include a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device.
  • a portable communication device eg, a smart phone
  • a computer device e.g., a smart phone
  • a portable multimedia device e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a camera e.g., a camera
  • a wearable device e.g., a smart watch, or a smart watch, or a smart watch.
  • a home appliance device e.g., a smart bracelet
  • the electronic device is not limited to the above-described devices.
  • first”, “second”, or “first” or “second” may simply be used to distinguish the component from other such components, and refer to the component in another aspect (e.g., importance or order) is not limited.
  • connected it is meant that one component can be connected to the other component directly (eg, by wire), wirelessly, or through a third component.
  • module may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as, for example, logic, logical block, component, or circuit.
  • a module may be an integrally formed part or a minimum unit or a part of the part that performs one or more functions.
  • the module may be implemented in the form of an application-specific integrated circuit (ASIC).
  • ASIC application-specific integrated circuit
  • Various embodiments of the present document include one or more stored in a storage medium (eg, the internal memory 136 or the external memory 138) readable by a machine (eg, the electronic device 101). It may be implemented as software (eg, program 140) including instructions.
  • the processor eg, the processor 120
  • the device eg, the electronic device 101
  • the one or more instructions may include code generated by a compiler or code executable by an interpreter.
  • the device-readable storage medium may be provided in the form of a non-transitory storage medium.
  • 'non-transitory' only means that the storage medium is a tangible device and does not contain a signal (eg, electromagnetic wave), and this term is used in cases where data is semi-permanently stored in the storage medium and It does not distinguish between temporary storage cases.
  • a signal eg, electromagnetic wave
  • the method according to an embodiment of the present document may be provided by being included in a computer program product.
  • Computer program products may be traded between sellers and buyers as commodities.
  • the computer program product is distributed in the form of a machine-readable storage medium (eg compact disc read only memory (CD-ROM)), or via an application store (eg PLAYSTORE TM ) or two user devices (eg compact disc read only memory). : can be distributed (eg, downloaded or uploaded) online, directly between smartphones).
  • at least a portion of the computer program product may be temporarily stored or temporarily created in a machine-readable storage medium such as a memory of a server of a manufacturer, a server of an application store, or a relay server.
  • Each component (eg, a module or a program) of the above-described components may include a singular or a plurality of entities.
  • One or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added.
  • a plurality of components eg, a module or a program
  • the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration.
  • Operations performed by a module, program, or other component may be executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the above operations may be executed in a different order, omitted, or one or more other operations. can be added.
  • FIG. 2 shows an electronic device 2 and a cover device 3 detachable to the electronic device 2 according to an embodiment.
  • 3 shows, in one embodiment, the cover device 3 in a closed state.
  • 4 shows, in one embodiment, the cover device 3 in an open state. 3 and 4 , the electronic device 2 connected to the cover device 3 is omitted for better understanding of the embodiment.
  • FIG. 4 shows, for example, the cover device 3 in an open state with the electronic device 2 and the cover part 33 of FIG. 2 angled at an angle of about 90 degrees.
  • the electronic device 2 includes a front surface 21A of the electronic device 2 , a rear surface 21B of the electronic device 2 , and between the front surface 21A and the rear surface 21B. and a housing 21 providing a side surface 21C of the electronic device 2 that at least partially surrounds the space of the .
  • the housing 21 is a structure that provides at least a portion of a front surface 21A of the electronic device 2 , a rear surface 21B of the electronic device 2 , and a side surface 21C of the electronic device 2 . can refer to
  • the housing 21 may include a front plate 211 , a rear plate (not shown), and/or a side bezel structure (or side member) 213 . At least a portion of the front surface 21A of the electronic device 2 may be provided by a substantially transparent front plate 211 .
  • the front plate 211 may include, for example, a glass plate or a polymer plate including various coating layers.
  • the rear plate may be positioned opposite to the front plate 211 . At least a portion of the rear surface 21B of the electronic device 2 may be provided by a substantially opaque rear plate.
  • the back plate may be formed, for example, by coated or tinted glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing.
  • the side bezel structure 213 may surround at least a portion of the space between the front plate 211 and the rear plate. At least a portion of the side surface 21C of the electronic device 2 may be formed by the side bezel structure 213 .
  • the side bezel structure 213 may be formed of, for example, a ceramic, a polymer, a metal (eg, aluminum, stainless steel, or magnesium), or a combination of at least two of the above materials.
  • the back plate and side bezel structures 213 may be integrally formed and may include the same material (eg, a metal material such as aluminum, or a polymer material).
  • the electronic device 2 may be, for example, the electronic device 101 of FIG. 1 or may include at least one of components included in the electronic device 101 of FIG. 1 .
  • the electronic device 2 may include a display 22 , an input module, a sound output module, a first camera module, a second camera module, a sensor module, or at least one connection terminal.
  • the electronic device 2 may omit at least one of the components or additionally include other components.
  • the position or number of components included in the electronic device 2 is not limited to the illustrated example and may vary.
  • the display 22 (eg, the display module 160 of FIG. 1 ) may, for example, be positioned in the inner space of the housing 21 at least partially overlapping the front plate 211 .
  • the front plate 211 may protect the display 22 from the outside.
  • the light output from the display 22 may pass through the front plate 211 and travel to the outside.
  • the screen S of the electronic device 2 may refer to a region capable of expressing an image in the device including the display 22 and the front plate 211 , for example, the display region (or active part) of the display 22 . area) and a partial area of the front plate 211 overlapping the display area.
  • the front plate 211 may be integrally formed with the display 22 as a component included in the display 22 .
  • a border region surrounding the screen S among the front surfaces 21A of the electronic device 2 may be substantially opaque, and may provide a screen bezel B.
  • an opaque material may be disposed on the rear surface of the area corresponding to the screen bezel B of the front plate 211 .
  • the screen S may be further expanded without being limited to the illustrated example, and for example, the ratio of the screen S among the first surface 21A may be about 90% or more (eg, bezel-less). -less display or full screen display).
  • the display 22 may include a touch sensor (or touch sensing circuit) configured to sense a touch, or a pressure sensor configured to measure the strength of the force generated by the touch.
  • the display 22 may include or be coupled with an electromagnetic induction panel (eg, a digitizer) that detects a magnetic field type pen input device (eg, a stylus pen).
  • the input module may include, for example, a key input device (not shown) positioned on the side surface 21C of the housing 21 .
  • the location or number of key input devices may vary.
  • the input module may include, for example, a microphone positioned inside the housing 21 , and a microphone hole formed in the housing 21 to correspond to the microphone.
  • the position or number of input modules including the microphone and the corresponding microphone hole may vary.
  • the electronic device 2 may include a plurality of microphones capable of detecting the direction of sound.
  • the sound output module (eg, the sound output module 155 of FIG. 1 ) may include, for example, a speaker located inside the housing 21 , and a speaker hole formed in the housing 21 to correspond to the speaker. have.
  • the position or number of the sound output module including the speaker and the speaker hole corresponding thereto may vary.
  • the microphone hole and the speaker hole may be implemented as one hole.
  • a piezo speaker in which the speaker hole is omitted may be implemented.
  • the first camera module (eg, the camera module 180 of FIG. 1 ) may be located in the housing 21 corresponding to the screen bezel B, for example.
  • the second camera module (eg, the camera module 180 of FIG. 1 ) may be located inside the housing 21 corresponding to the rear surface 21B of the electronic device 2 .
  • the camera module or the second camera module may include one or more lenses, an image sensor, and/or an image signal processor.The location or number of camera modules may vary.
  • the display 22 may include an opening aligned with the first camera module.External light may reach the first camera module through an opening in the front plate 211 and display 22.
  • the display ( The opening of 22) may be provided in the form of a notch according to the position of the first camera module
  • the first camera module may be disposed at the bottom of the display 22, and the first camera module may perform a related function (eg, image capturing) without visually distinguishing (or exposing) the position of the .
  • the first camera module may be located on the rear surface of the display 22 or under the display 22 .
  • the first camera module may include a recess formed in the back surface of the display 22 ( recess)
  • the first camera module is disposed to overlap at least a part of the screen S, so that it is possible to acquire an image of an external subject without being visually exposed to the outside.
  • a portion of the display that is at least partially overlapped with the first camera module may include a different pixel structure and/or wiring structure compared to other areas, for example, a portion of the display 22 that is at least partially overlapped with the first camera module.
  • Regions may have different pixel densities compared to other regions
  • the pixel structures and/or wiring structures formed in some regions of the display 22 at least partially overlapped with the first camera module may include: It is possible to reduce the loss of light between the external and the first camera module. In some embodiments, pixels may not be disposed in some areas of the display 22 that at least partially overlap the first camera module.
  • the electronic device 2 may include a plurality of camera modules (eg, a dual camera module or a triple camera module) having different properties (eg, angle of view) or functions.
  • the plurality of camera modules may include a plurality of camera modules including lenses having different angles of view. It can be controlled to change the angle of view of the camera module.
  • the plurality of camera modules may include at least one of a wide-angle camera, a telephoto camera, a color camera, a monochrome camera, or an IR (infrared) camera (eg, a time of flight (TOF) camera, a structured light camera).
  • the IR camera may be operated as at least part of a sensor module.
  • a sensor module may generate an electrical signal or data value corresponding to an internal operating state of the electronic device 2 or an external environmental state.
  • the sensor module may include, for example, a proximity sensor, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor (eg, a fingerprint sensor, an HRM sensor), It may include at least one of a temperature sensor, a humidity sensor, and an illuminance sensor.
  • the sensor module may include an optical sensor located inside the housing 21 corresponding to the screen bezel (B).
  • the optical sensor may include, for example, a proximity sensor or an illuminance sensor.
  • the optical sensor may be aligned with an opening formed in the display 22 . External light may be introduced into the optical sensor through the openings of the front plate 211 and the display 22 .
  • an optical sensor may be disposed at the bottom of the display 22 , and the location of the optical sensor may perform a related function without being visually differentiated (or exposed).
  • the optical sensor may be located on the back of the display 22 , or below or beneath the display 22 .
  • the optical sensor may be positioned aligned with a recess formed in the back surface of the display 22 .
  • the optical sensor may be disposed to overlap at least a portion of the screen S, and may perform a sensing function without being exposed to the outside.
  • a portion of the display 22 that is at least partially overlapped with the optical sensor may include a pixel structure and/or a wiring structure different from other areas.
  • some regions of the display 22 that at least partially overlap with the optical sensor may have different pixel densities compared to other regions.
  • the sensor module may include an ultrasonic sensor positioned below the display 22 .
  • the pixel structure and/or wiring structure formed in a portion of the display 22 that is at least partially overlapped with the sensor module is formed when various types of signals related to the sensor module (eg, light or ultrasound) pass between the outside and the sensor module. that loss can be reduced.
  • a plurality of pixels may not be disposed in a portion of the display 22 that at least partially overlaps the sensor module.
  • the at least one connection terminal may include, for example, connectors (eg, an HDMI connector, a USB connector interface, an SD card connector, or a connector located inside the electronic device 2 ). audio connector) and connector holes formed in the housing 21 to correspond to the connectors.
  • the electronic device 2 may transmit and/or receive power and/or data with an external electronic device electrically connected to the connector through the connector hole. The position or number of the connector and the connector hole corresponding thereto may vary.
  • the electronic device 2 may include a detachable pen input device (eg, an electronic pen, a digital pen, or a stylus pen).
  • a detachable pen input device eg, an electronic pen, a digital pen, or a stylus pen.
  • the cover device 3 may include a connection part 31 , a folding part 32 , and a cover part 33 .
  • the connection part 31 may be detachably attached to the electronic device 2 .
  • the connection part 31 may be detachably attached to at least a part of the side surface 21C of the electronic device 2 .
  • the folding part 32 connects between the connection part 31 and the cover part 33 and may have flexibility.
  • the cover part 33 may be opened and closed using the folding part 32 .
  • the folding part 32 may be formed of a length that facilitates the opening and closing operation of the cover part 33 , and switching between the closed state and the open state of the cover device 3 , or between the open states of various open angles. can be bent
  • the folding part 320 may be defined or interpreted as a part of the cover part 33 .
  • the cover portion 33 at least partially surrounds the front surface 33A, the rear surface 33B positioned opposite to the front surface 33A, and the space between the front surface 33A and the rear surface 33B.
  • the side surface 33C may extend from one side 321 of the folding part 32 to the other side 322 , for example.
  • the cover portion 33 In the closed state of the cover device 3 , the cover portion 33 may be positioned so as to face and no longer come close to the front face 21A of the electronic device 2 , the front face 21A of the electronic device 2 and The front surface 33A of the cover part 33 may not be substantially exposed to the outside.
  • the side surface 33C of the cover 3 may be aligned with a portion of the side surface 21C of the electronic device 2 .
  • the cover device 3 is not in the closed state (eg, in the open state of the cover device 3 )
  • the front surface 21A of the electronic device 2 and the front surface 33A of the cover part 33 are not exposed to the outside.
  • the open state of the cover device 3 may vary depending on the open angle of the cover part 33 .
  • the cover device 3 may be electrically connected to the electronic device 2 .
  • the cover device 3 may include, for example, the external electronic device 102 of FIG. 1 .
  • the cover device 3 may include, for example, an electronic component such as a display module, an input module, a sound output module, a camera module, a sensor module, or at least one connection terminal.
  • the cover device 3 may include at least one of the components included in the electronic device 101 of FIG. 1 .
  • the electronic component included in the cover device 3 may be electrically connected to the electronic device 2 through the connection part 31 .
  • the cover device 3 when the cover device 3 is attached to the electronic device 2 , it becomes in the form of a foldable electronic device such as a laptop computer (or a notebook computer) and the electronic device 2 ) can be expanded.
  • the cover device 3 may include a keyboard 34 or a touch pad 35 located on the cover part 33 .
  • the input module 40 may be various in addition, for example, including one or more key input devices (eg, various function keys such as a power button) located on the front surface 33A of the cover part 33 .
  • the input module 40 may form a part of the front surface 33A of the cover part 33.
  • the electronic device 2 responds to a user input generated through the keyboard 35 or the touch pad 34. It can perform various actions (or functions).
  • connection part 31 of the cover device 3 is the connection part 31 of the electronic device 2 when the connection part 31 of the cover device 3 is attached to the side surface 21C of the electronic device 2 .
  • a first surface 310 facing the side surface 21C may be included.
  • the cover device 3 may include a plurality of terminals 36 exposed to the first surface 310 .
  • the connection part 31 of the cover device 3 is attached to the side surface 21C of the electronic device 2
  • the plurality of terminals 36 are exposed to the side surface 21C of the electronic device 2 .
  • the cover device 3 may include an electrical path for electrically connecting the plurality of terminals 36 and electronic components (eg, the keyboard 34 and the touch pad 35) included in the cover 3 .
  • the electrical path may include, for example, a flexible printed circuit board (FPCB) located inside the cover 3 .
  • the electrical path may extend from the connection part 31 to the cover part 33 through the folding part 32 , and the plurality of terminals 36 are located in the cover part 33 through the electrical path. may be electrically connected to the input module 40 .
  • the cover device 3 may include a plurality of protrusions 37 positioned on the first surface 310 .
  • the plurality of protrusions 37 may protrude with respect to the first surface 310 .
  • the plurality of protrusions 37 form a plurality of recesses formed in the side surface 21C of the electronic device 2 . It can be inserted into recesses (or grooves).
  • a structure in which the plurality of protrusions 37 are inserted into the plurality of recesses may contribute to a stable connection between the electronic device 2 and the connection part 31 of the cover device 3 .
  • the structure in which the plurality of protrusions 37 are inserted into the plurality of recesses guides the user to the position or direction in which the connection part 31 of the cover device 3 is attached to the side surface 21A of the electronic device 2 . can do.
  • the cover device 3 may include cushioning members 38 disposed on the cover part 33 .
  • the cushioning members 38 may mitigate an impact between the electronic device 2 and the cover part 33 when the cover device 3 is switched from an open state to a closed state.
  • the cushioning members 38 located in the cover part 33 are disposed on the front surface 21A of the electronic device 2 .
  • the cushioning members 38 may include various flexible members or elastic members (eg, rubber).
  • the cover device 3 may include a support cover portion 39 attachable to the rear surface 21B of the electronic device 2 .
  • the support cover part 39 is attached to the rear surface 21B of the electronic device 2 .
  • the support cover part 39 may be implemented to be foldable, and, for example, may be used to maintain the electronic device 2 in a state of being erected at various angles with respect to the cover part 33 .
  • the electronic device 2 may be referred to as a 'first electronic device', and the cover device 3 may be referred to as a 'second electronic device'.
  • the electronic device 2 may be referred to as a 'display device' as a device including a screen S.
  • the electronic device 2 may be defined to include a cover device 3 . In some embodiments, it may be referred to as a 'foldable electronic device', including the electronic device 2 and the cover device 3 .
  • the electronic device 2 and the cover device 3 may be referred to as a 'system'.
  • 5 is an exploded view of a part 300 of the cover device 3 according to an embodiment.
  • 6 shows, in one embodiment, the second structure 52 , the electrical path 60 , the second seat 82 , and the support plate 90 joined together.
  • the cover device 3 includes a connection structure 50 , an electrical path 60 , a plurality of first magnetic bodies 70 , a cover member 80 , and/or A support plate 90 may be included.
  • connection structure 50 may be attached to at least a part of the side surface 21C (refer to FIG. 2 ) of the electronic device 2 .
  • the connection structure 50 may be referred to by various other terms such as 'attachment structure', 'attachment structure', 'attachment structure', or 'support structure'.
  • the connection structure 50 may be included in the connection part 31 ( FIGS. 2 , 3 , or 4 ) of the cover device 3 .
  • the connection structure 50 may include a first surface 310 facing the side surface 21C of the electronic device 2 and a second surface 320 to which the cover member 80 is attached.
  • the connecting structure 50 may include, for example, a first structure 51 forming a first face 310 , and a second structure 51 coupled with the first structure 51 and forming a second face 320 ( 52) may be included.
  • the first structure 51 may include a plurality of protrusions 37 positioned on the first surface 310 .
  • the first structure 51 may include a plurality of through holes 511 formed in the first surface 310 corresponding to the plurality of terminals 36 .
  • the first end 61 of the electrical path 60 (eg, a flexible printed circuit board) may include a plurality of terminals 36 , wherein the first structure 51 and the second structure 52 are coupled to each other. It may be located in the inner space of the formed connection structure 50 .
  • the first end 61 of the electrical path 60 may be disposed or coupled to the second structure 52 .
  • the plurality of terminals 36 may be exposed to the outside through the plurality of through holes 511 of the first structure 51 , and may protrude with respect to the first surface 310 .
  • the plurality of terminals 36 may include a flexible conductive terminal that is in resilient contact with the plurality of terminals exposed to the side surface 21A (refer to FIG. 2 ) of the electronic device 2 .
  • the flexible conductive terminal may include, for example, a pogo pin.
  • the second end 62 of the electrical path 60 may be located in the cover portion 33 (FIG.
  • Electrical path 60 is an extension connecting the first end 61 located on the connecting structure 50 and the second end 62 located on the cover portion 33 (FIG. 2, 3, or 4).
  • 63 and the extension 63 may be positioned through an opening (not shown) formed in the second structure 52 .
  • the plurality of first magnetic bodies 70 may be located in the inner space of the connection structure 50 .
  • the connection structure 50 of the cover device 3 by using the attractive force between the plurality of first magnetic bodies 70 (eg, a plurality of magnets) and the plurality of second magnetic bodies included in the electronic device 2 . may be attached to the side surface 21C of the electronic device 2 .
  • the plurality of second magnetic materials may include, for example, a magnet or a material that magnetizes in a magnetic field.
  • the cover member 80 may be disposed on the connection structure 50 .
  • the cover member 80 may include a first sheet 81 and a second sheet 82 .
  • the first sheet 81 may be attached to or coupled to the first region 1301 (refer to FIG. 6 ) of the second surface 320 of the connection structure 50 .
  • the second sheet 82 may be attached to or coupled to the second region 1302 of the second surface 320 of the connection structure 50 .
  • the first sheet 81 and the second sheet 82 may be joined to overlap from a portion where the first region 1301 and the second region 1302 meet.
  • a thermally reactive adhesive between the first area 1301 of the first sheet 81 and the second side 320 and/or between the second area 1302 of the second sheet 82 and the second side 320 .
  • the folding part 32 (refer to FIGS. 2, 3, or 4) of the cover device 3 may include a portion in which the first sheet 81 and the second sheet 82 are overlapped and coupled.
  • the extension portion 63 of the electrical path 60 penetrates through the opening formed in the second structure 52 , and a portion of the first sheet 81 located in the folding portion 32 and the folding portion of the second sheet 82 . may extend between portions located at 32 .
  • the cover part 33 (refer to FIGS. 2, 3, or 4) of the cover device 3 may include another part in which the first sheet 81 and the second sheet 82 are overlapped and joined.
  • the side surface 33C (refer to FIG.
  • the cover part 33 may be formed by overlapping the first sheet 81 and the second sheet 82 .
  • the first sheet 81 and the second sheet 82 may be overlapped and bonded using a polymer adhesive material such as a heat-reactive adhesive, a general adhesive, and/or a double-sided tape.
  • the first sheet 81 and/or the second sheet 82 may include a fabric.
  • the first seat 81 and/or the second seat 82 may comprise leather.
  • the first sheet 81 and/or the second sheet 82 may include various polymers. The first sheet 81 and the second sheet 82 may include the same material or different materials.
  • the support plate 90 may be included in the cover part 33 (refer to FIGS. 2 , 3 or 4 ) of the cover device 3 .
  • the support plate 90 is, for example, a portion on which an electronic component positioned on the cover portion 33 of the cover device 3 is disposed, and may contribute to durability or rigidity (eg, torsional rigidity) of the cover portion 33 .
  • the support plate 90 may be referred to as a bracket or a mounting plate.
  • the input module 40 (see FIGS. 2 , 3 , or 4 ) may be disposed or coupled to the support plate 90 .
  • a portion of the extension 63 included in the electrical path 60 and the second end 62 may be disposed or coupled to the support plate 90 .
  • the support plate 90 may be disposed on the second seat 82 .
  • the support plate 90 may be bonded to the second sheet 82 using a heat-reactive adhesive, a general adhesive, and/or a polymer adhesive material such as double-sided tape.
  • the first sheet 81 may include an opening 811 , and the input module 40 (see FIGS. 2 , 3 , or 4 ) may be exposed to the outside through the opening 811 . . There is substantially no gap between the first sheet 81 and the input module 40 , and the support plate 90 may not be exposed to the outside.
  • a border region (not shown) of the support plate 90 adjacent to the opening 811 of the first sheet 81 is to be positioned between the first sheet 81 and the second sheet 82 .
  • an adhesive material may be positioned between the edge region of the first sheet 81 and the support plate 90 .
  • the first sheet 81 may be extended to cover a border area of the input module 40 , and the border area of the input module 40 may include the first sheet 81 and the second sheet 82 . ) can be located between In some embodiments, the first sheet 81 may be extended to cover a border area of the input module 40 , and the border area of the input module 40 may include the first sheet 81 and the second sheet 82 . can be located between In this case, an adhesive material may be positioned between the first sheet 81 and the edge region of the input module 40 .
  • the first end 61 of the electrical path 60 is disposed on the second structure 52 , and the second end 62 of the electrical path 60 is connected to a support plate ( 90) can be placed.
  • the first magnetic body 71 eg, one of the plurality of first magnetic bodies 70 of FIG. 5
  • the second sheet 82 may be disposed on the first assembly 301 formed in the first operation to form the second assembly 302 .
  • a partial area of the second sheet 82 may be coupled to the second structure 52
  • another partial area of the second sheet 82 may be coupled to the support plate 90 .
  • the first sheet 81 may be disposed on the second assembly 302 to form a third assembly 303 .
  • a partial area of the first sheet 81 may be coupled to the second structure 52
  • another partial area of the first sheet 81 may be coupled to the second sheet 82 .
  • the first structure 51 in a fourth operation, may be disposed on the third assembly 303 to form a part 300 of the cover device 3 shown in FIG. 5 .
  • the first structure 51 may be combined with the second structure 52 .
  • the first structure 51 and the second structure 52 may be joined by mechanical fastening such as bolt fastening or snap-fit fastening, or bonding using an adhesive member.
  • the assembly operations may be performed in a different order, omitted, or one or more other operations may be added.
  • FIG. 11 shows, in one embodiment, a part of the cover device 3 in the closed state of FIG. 3 .
  • FIG. 12 is, in one embodiment, a partial cross-sectional view 1200 on the line A-A′ in the cover device 3 in the closed state of FIG. 3 .
  • FIG. 13 shows a cross-sectional structure 1300 in the y-z plane for a portion indicated by reference numeral '1201' in the example of FIG. 12, in one embodiment.
  • FIG. 14 is, in one embodiment, a partial cross-sectional view 1400 on the line B-B′ in the cover device 3 in the closed state of FIG. 3 .
  • FIG. 15 shows a cross-sectional structure 1500 in the y-z plane for a portion indicated by reference numeral '1401' in the example of FIG. 14, in one embodiment.
  • Figure 16 shows, in one embodiment, a portion of the cover device 3 in an open state with the electronic device 2 and the cover portion 33 angled at about 180 degrees.
  • FIG. 17 shows, in one embodiment, a cross-sectional structure 1700 of the cover device 3 in relation to the example of FIG. 16 .
  • the connection structure 50 includes a first surface 310 facing the side surface 21C of the electronic device 2 and It may include a second surface 320 to which the cover member 80 is attached.
  • the first surface 310 may be formed by the first structure 51 of the connection structure 50 .
  • the first surface 310 may be formed in a shape corresponding to the side surface 21C of the electronic device 2 , thereby contributing to a stable connection between the electronic device 2 and the connection part 31 of the cover device 3 .
  • the second surface 320 may be formed by the second structure 52 of the connection structure 50 .
  • connection structure 50 is not limited to the illustrated example and may be implemented in various other forms forming the first surface 310 and the second surface 320 .
  • the second structure 52 includes a portion forming an internal space (not shown) of the connection structure 50 together with the first structure 51 as in the example of FIG. 15 , or as the example of FIG. 14 and the internal space. It may include a portion that is expanded to support the first structure 51 .
  • the first end 61 of the electrical path 60 (eg, a flexible printed circuit board) may be located inside the connection structure 50 .
  • An extension 63 of the electrical path 60 may extend from the first end 61 and be positioned through an opening 1304 formed in the second structure 52 .
  • a portion 631 of the extension portion 63 of the electrical path 60 located in the folding portion 32 is a third portion 812 located in the folding portion 32 of the first sheet 81 and the second sheet Among the 82 , it may extend between the fourth portion 822 positioned in the folding portion 32 .
  • An adhesive material may be positioned between the third portion 812 of the first sheet 81 and the fourth portion 822 of the second sheet 82 .
  • an adhesive material may be positioned between the fourth portions 822 between the fourth portions 822 .
  • the third portion 812 of the first sheet 81 or the fourth portion 822 of the second sheet 82 is a recess into which the portion 631 of the electrical path 60 may be inserted. (recess) (not shown) may be included, which may contribute to formation of an even thickness of the folding part 32 .
  • the second surface 52 of the connection structure 50 is a first region 1301 on which the first sheet 81 is disposed or coupled and a second area on which the second sheet 82 is disposed or coupled. region 1302 .
  • the first sheet 81 may include a first portion 811 extending from a third portion 812 , and the first portion 811 may be attached to the first region 1301 .
  • the second sheet 82 may include a second portion 821 extending from a fourth portion 822 , and the second portion 821 may be attached to the second region 1302 .
  • An adhesive material may be positioned between the first portion 811 and the first region 1301 and between the second portion 821 and the second region 132 .
  • the second surface 320 may include a third region 1303 (or a boundary portion) between the first region 1301 and the second region 1302 .
  • At least a portion of the third region 1303 may include, for example, a plane.
  • at least a portion of the third region 1303 may include a curved surface or an inclined surface.
  • a step 1305 may be formed between the first region 1301 and the second region 1302 . At least a portion of the third region 1303 may be positioned at the step 1305 .
  • the opening 1304 through which the extension 63 of the electrical path 60 is positioned may be formed in the third region 1303 or the step 1305 .
  • the step 1305 may indicate a shape having a height difference between the first area 1301 and the second area 1302 with respect to the third area 1303 .
  • the first boundary 1501 (see FIG. 15 or 17 ) between the first area 1301 and the third area 1303 is the second area between the second area 1302 and the third area 1303 . It may be closer to the first face 310 than to the second boundary 1502 (see FIG.
  • the first region 1301 to which the first sheet 81 is attached may include, for example, one surface of the second structure 52 extending from the first boundary 1501 to one side of the first structure 51 .
  • the second region 1302 to which the second sheet 82 is attached may be, for example, the other surface of the second structure 52 extending from the second boundary 1502 to the other side of the first structure 51 . .
  • a portion (not shown) of the first sheet 81 may be disposed to face the third region 1303 .
  • an adhesive material may be positioned between the third region 1303 and a portion of the first sheet 81 corresponding to the third region 1303 .
  • the change of state of the cover device 3 at a position adjacent to the second boundary 1502 , between the first portion 811 and the third portion 812 of the first sheet 81 .
  • the fifth portion 1310 may be bent.
  • the sixth portion 1320 between the second portion 821 and the fourth portion 822 of the second sheet 82 . can be bent.
  • the fifth portion 1201 of the first sheet 81 and the sixth portion 1202 of the second sheet 82 may be bent in opposite directions.
  • Changing the state of the cover device 3 may include, for example, a transition between a closed state and an open state, or a transition between open states of various open angles.
  • the cover device 3 when the cover device 3 is switched from the open state (see Fig. 17) to the closed state (see Fig. 15), the second region 1302, the third region 1303, and the second seat ( The first sheet 81 may be bent in the space 1505 formed by the fourth portion 822 of the 82 .
  • the first seat 811 and the third part 813 of the first seat 81 form an angle at which they can no longer come close.
  • the fifth portion 1310 of 81 may be bent.
  • the sixth portion 1320 of the second seat 82 When the cover device 3 is switched from the open state to the closed state, the sixth portion 1320 of the second seat 82 may be deformed from the open state to the unfolded state.
  • a plane at least partially included in the second part 821 and a plane included at least partly in the fourth part 822 may form an angle of about 180 degrees.
  • the first seat 81 is in the space 1505 corresponding to the height difference (or the step 1305 ) between the first region 1301 and the second region 1302 .
  • the second sheet 82 can form a smooth outer surface that does not protrude when viewed from the outside.
  • the third portion 812 of the first sheet 81 may not substantially protrude with respect to the first region 1301 .
  • the cover device 3 when the cover device 3 is switched from the closed state of FIG. 15 to the open state of FIG. 17 , the space formed by the first area 1301 and the third part 812 of the first seat 81 .
  • the second sheet 82 may be bent.
  • the cover device 3 when the cover device 3 is switched from the closed state of FIG. 15 to the open state of FIG. 17 , the second part 821 and the fourth part 822 of the second seat 82 form a narrow angle compared to the closed state.
  • the sixth portion 1320 of the second sheet 82 may be bent.
  • a plane at least partially included in the second part 821 and a plane included at least partly in the fourth part 822 may form an angle of about 90 degrees.
  • the fifth portion 1310 of the first seat 81 When the cover device 3 is switched from the closed state of FIG. 15 to the open state of FIG. 17 , the fifth portion 1310 of the first seat 81 may be deformed from the closed state to the unfolded state.
  • the step 1305 of the can contribute to reducing the length of the folding part 32 related to the state change of the cover device (3).
  • the electronic device 2 and the cover part 33 of the cover device 3 are placed on the floor of a plane in an open state (see FIGS. 16 and 17 ) at an angle of about 180 degrees, the electronic device 2 ) so that the rear surface 21B (see FIG. 2 ) and the rear surface 33B (see FIG. 2 ) of the cover part 33 do not lift off from the floor, the third area 1303 or the step 1305 is the electronic device 2 .
  • the rear surface 21B and the rear surface 33B of the cover part 33 may be positioned at substantially the same height.
  • the first seat 81 is The first region 1301 and the second region 1302 to have bending characteristics capable of reducing the effect of stress occurring in the fifth portion 1310 of the second sheet 82 and/or the sixth portion 1320 of the second sheet 82 .
  • a third region 1303 or a step 1305 therebetween may be located.
  • a cover device for an electronic device (eg, the electronic device 2 of FIG. 2 ) has a connection structure detachable to the electronic device (eg, the electronic device 2 ).
  • the connection structure 50 of FIG. 13 may be included.
  • the cover device may include a cover member (eg, the cover member 80 of FIG. 13 ) capable of opening and closing one surface of the electronic device.
  • the cover member may be connected to the connection structure.
  • the connection structure includes a first surface (eg, the first surface 310 of FIG. 13 ) attached to the electronic device and a second surface (eg, the second surface 320 of FIG. 13 ) to which the cover member is attached.
  • the cover member may include a first sheet (eg, the first sheet 81 in FIG. 13 ) attached to a first region (eg, the first region 1301 in FIG. 13 ) of the second surfaces and the second surface. and a second sheet (eg, the second sheet 82 of FIG. 13 ) attached to the second region (eg, the second region 1302 of FIG. 13 ).
  • a step eg, a step 1305 of FIG. 13 ) may be formed between the first area and the second area.
  • the second surface corresponds to the step (eg, the step 1305 of FIG. 13 ) in the first area (eg: a third region (eg, third region 1303 of FIG. 13 ) between the first region 1301 of FIG. 13 ) and the second region (eg, the second region 1302 of FIG. 13 ).
  • a first boundary between the first region and the third region eg, a first boundary 1501 in FIG. 15
  • a portion extending from the first region (eg, the first region 1301 of FIG. 13 ) of the first sheet (eg, the first sheet 81 of FIG. 13 ) : the third portion 812 of FIG. 13) and the second sheet (eg, the second sheet 82 of FIG. 13) extending from the second region (eg, the second region 1302 of FIG. 13)
  • the parts eg, the fourth part 822 of FIG. 13
  • the cover part eg, the cover part 33 of FIG. 2
  • the first sheet may face one surface (eg, the front surface 21A of FIG. 2 ) of the electronic device.
  • a portion extending from the first region (eg, the first region 1301 of FIG. 13 ) of the first sheet (eg, the first sheet 81 of FIG. 13 ) : the third portion 812 of FIG. 13) and the second sheet (eg, the second sheet 82 of FIG. 13) extending from the second region (eg, the second region 1302 of FIG. 13)
  • a portion eg, the fourth part 822 of FIG. 13
  • the connection structure eg, the connection structure 50 of FIG. 13
  • the cover part eg, the cover part 33 of FIG. 2 .
  • a folding part between them eg, the folding part 32 of FIG. 13
  • connection structure eg, the connection structure 50 of FIG. 13
  • an opening eg, the opening ( 1304)
  • the connection structure is an opening (eg, the opening ( 1304)) may be further included.
  • connection structure forms a first structure (eg, the first surface 310 of FIG. 13 ) forming the first surface (eg, the connection structure 50 of FIG. 13 ).
  • first structure 51 of FIG. 13 the first structure 51 of FIG. 13
  • second structure eg, the second structure 52 of FIG. 13 forming the second surface (eg, the second surface 320 of FIG. 13 ).
  • the cover device may include a flexible printed circuit board (eg, the electrical path 60 of FIG. 5 ) located inside the cover device. may include more.
  • the flexible printed circuit board includes a first end (eg, the first end 61 of FIG. 5 ) positioned at the connection structure (eg, the connection structure 50 of FIG. 5 ), and the cover part (eg, the connection structure 50 of FIG. 2 ).
  • a second end eg, the second end 62 of FIG. 5
  • the extension part may be positioned through the opening (eg, the opening 1304 of FIG. 13 ) positioned at the step (eg, the step 1305 of FIG. 13 ).
  • the first end (eg, the first end 61 of FIG. 5 ) is at least one electrically connected to the electronic device (eg, the electronic device 2 of FIG. 2 ). It may include a terminal (eg, the plurality of terminals 36 of FIG. 5 ).
  • the second end (eg, the second end 62 of FIG. 5 ) is an electronic component (eg, the input module 40 of FIG. 2 ) located in the cover part (eg, the cover part 33 of FIG. 2 ) can be electrically connected to.
  • the at least one terminal may include a flexible conductive terminal.
  • the flexible conductive terminal may be connected to the first surface (eg, in FIG. 5 ) through a through hole (eg, a plurality of through holes 511 in FIG. 5 ) formed in the connection structure (eg, the connection structure 50 in FIG. 5 ). of the first surface 310).
  • the at least one terminal may include a pogo pin.
  • the electronic component may include a keyboard (eg, the keyboard 34 of FIG. 2 ).
  • the electronic component eg, the input module 40 of FIG. 2
  • the electronic component may include a touch pad (eg, the touch pad 35 of FIG. 2 ).
  • the first sheet eg, the first sheet 81 of FIG. 5
  • the second sheet eg, the second sheet 82 of FIG. 5
  • connection structure eg, the connection structure 50 of FIG. 13
  • the connection structure is a side surface (eg, the side surface ( ) of FIG. 13 ) of the electronic device (eg, the electronic device 2 of FIG. 13 ). 21C)) may be detachable.
  • the cover part eg, the cover part 33 of FIG. 2
  • the cover part may open and close the screen of the electronic device (eg, the screen S of FIG. 2 ).
  • the cover device corresponds to a magnetic material included in the electronic device (eg, the electronic device 2 of FIG. 2 ), and the connection It may further include at least one magnet (eg, a plurality of first magnetic bodies 70 of FIG. 5 ) positioned in the structure (eg, the connection structure 50 of FIG. 5 ).
  • a cover device for an electronic device (eg, the electronic device 2 of FIG. 2 ) is a side surface (eg, FIG. 2 ) of the electronic device.
  • a detachable connection structure (eg, the connection structure 50 of FIG. 5 ) may be included on the side surface 21C of the .
  • the cover device may include a cover member (eg, the cover member 80 of FIG. 5 ) capable of opening and closing the front surface (eg, the front surface 21A of FIG. 2 ) of the electronic device.
  • the cover member may be connected to the connection structure.
  • the connection structure includes a first surface (eg, the first surface 310 of FIG.
  • the cover member may include a first sheet (eg, the first sheet 81 in FIG. 13 ) attached to a first region (eg, the first region 1301 in FIG. 13 ) of the second surfaces and the second surface. and a second sheet (eg, the second sheet 82 of FIG. 13 ) attached to the second region (eg, the second region 1302 of FIG. 13 ).
  • cover part eg, the cover part 33 of FIG. 2
  • the first sheet faces the front surface of the electronic device, and there is a step (eg, step 1305 in FIG. 13 ) between the first area and the second area. )) can be formed.
  • the second surface corresponds to the step (eg, the step 1305 of FIG. 13 ) in the first area (eg: a third region (eg, third region 1303 of FIG. 13 ) between the first region 1301 of FIG. 13 ) and the second region (eg, the second region 1302 of FIG. 13 ).
  • a first boundary between the first region and the third region eg, a first boundary 1501 in FIG. 15
  • the cover device may include a flexible printed circuit board (eg, the electrical path 60 of FIG. 5 ) located inside the cover device.
  • the flexible printed circuit board includes a first end (eg, the first end 61 of FIG. 5 ) positioned at the connection structure (eg, the connection structure 50 of FIG. 5 ), and the cover part (eg, the connection structure 50 of FIG. 2 ).
  • a second end eg, the second end 62 of FIG. 5 ) located on the cover portion 33
  • an extension connecting the first end and the second end eg, the extension of FIG. 5 ) 63)
  • the connection structure may include an opening (eg, the opening 1304 of FIG. 13 ) positioned at the step (eg, the step 1305 of FIG. 13 ).
  • the extension may be positioned through the opening.
  • the first end (eg, the first end 61 of FIG. 5 ) is at least one electrically connected to the electronic device (eg, the electronic device 2 of FIG. 2 ). It may include a terminal (eg, the plurality of terminals 36 of FIG. 5 ).
  • the second end (eg, the second end 62 of FIG. 5 ) is an electronic component (eg, the input module 40 of FIG. 2 ) located in the cover part (eg, the cover part 33 of FIG. 2 ) can be electrically connected to.
  • the electronic component may include a keyboard (eg, the keyboard 34 of FIG. 2 ) or a touch pad (eg, the touch pad 35 of FIG. 2 ). )) may be included.
  • the electronic device may include a display device (eg, the electronic device 2 of FIG. 2 ) and a cover device detachable to the display device (eg, the cover device 3 of FIG. 2 ).
  • the cover device may include a connection structure detachable from the display device (eg, the connection structure 50 of FIG. 13 ).
  • the cover device may include a cover member (eg, the cover member 80 of FIG. 13 ) capable of opening and closing the screen (eg, the screen S of FIG. 2 ) of the display device.
  • the cover member may be connected to the connection structure.
  • the connection structure includes a first surface (eg, the first surface 310 of FIG.
  • the cover member may include a first sheet (eg, the first sheet 81 in FIG. 13 ) attached to a first region (eg, the first region 1301 in FIG. 13 ) of the second surfaces and the second surface. and a second sheet (eg, the second sheet 82 of FIG. 13 ) attached to the second region (eg, the second region 1302 of FIG. 13 ).
  • a step eg, a step 1305 of FIG. 13 ) may be formed between the first area and the second area.

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Telephone Set Structure (AREA)
  • Push-Button Switches (AREA)
  • Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)

Abstract

Un dispositif de couvercle pour un dispositif électronique selon un mode de réalisation du présent document comprend : une structure de raccordement pouvant être attachée/détachée du dispositif électronique ; et un élément de couvercle relié à la structure de connexion et capable d'ouvrir et de fermer une surface du dispositif électronique, la structure de raccordement comprenant une première surface fixée au dispositif électronique et une seconde surface à laquelle est fixé l'élément de couvercle, et l'élément de couvercle comprenant une première feuille fixée à une première zone de la seconde surface et une seconde feuille fixée à une seconde zone de la seconde surface, une étape pouvant être formée entre la première zone et la seconde zone. Divers autres modes de réalisation sont possibles.
PCT/KR2022/003780 2021-03-19 2022-03-17 Dispositif de couvercle pour dispositif électronique WO2022197133A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2021-0036089 2021-03-19
KR1020210036089A KR20220131042A (ko) 2021-03-19 2021-03-19 전자 장치를 위한 커버 장치

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WO2022197133A1 true WO2022197133A1 (fr) 2022-09-22

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KR (1) KR20220131042A (fr)
WO (1) WO2022197133A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070211418A1 (en) * 2006-03-07 2007-09-13 Akira Iwamoto Case, portable information equipment using the same and manufacturing method of the case
KR20160138493A (ko) * 2014-03-28 2016-12-05 마이크로소프트 테크놀로지 라이센싱, 엘엘씨 입력 디바이스 부착
JP2017054950A (ja) * 2015-09-10 2017-03-16 パナソニックＩｐマネジメント株式会社 電子機器、電子機器の筐体、及び電子機器の筐体の補強部材
KR20170073924A (ko) * 2015-12-21 2017-06-29 삼성전자주식회사 결합구조를 포함하는 전자 장치
KR101816825B1 (ko) * 2012-08-08 2018-01-11 구글 엘엘씨 전자 디바이스 하우징 및 그 조립 방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070211418A1 (en) * 2006-03-07 2007-09-13 Akira Iwamoto Case, portable information equipment using the same and manufacturing method of the case
KR101816825B1 (ko) * 2012-08-08 2018-01-11 구글 엘엘씨 전자 디바이스 하우징 및 그 조립 방법
KR20160138493A (ko) * 2014-03-28 2016-12-05 마이크로소프트 테크놀로지 라이센싱, 엘엘씨 입력 디바이스 부착
JP2017054950A (ja) * 2015-09-10 2017-03-16 パナソニックＩｐマネジメント株式会社 電子機器、電子機器の筐体、及び電子機器の筐体の補強部材
KR20170073924A (ko) * 2015-12-21 2017-06-29 삼성전자주식회사 결합구조를 포함하는 전자 장치

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