WO2022197133A1

WO2022197133A1 - Cover device for electronic device

Info

Publication number: WO2022197133A1
Application number: PCT/KR2022/003780
Authority: WO
Inventors: 박성한
Original assignee: 삼성전자 주식회사
Priority date: 2021-03-19
Filing date: 2022-03-17
Publication date: 2022-09-22
Also published as: KR20220131042A

Abstract

A cover device for an electronic device according to one embodiment of the present document comprises: a connection structure attachable/detachable to/from the electronic device; and a cover member connected to the connection structure and capable of opening and closing one surface of the electronic device, wherein the connection structure includes a first surface attached to the electronic device and a second surface to which the cover member is attached, and wherein the cover member includes a first sheet attached to a first area of the second surface and a second sheet attached to a second area of the second surface, wherein a step may be formed between the first area and the second area. Various other embodiments are possible.

Description

Cover device for electronic devices

This document relates to a cover device for an electronic device.

There is a cover device detachable to an electronic device such as a tablet personal computer (PC) or a smart phone and capable of protecting the electronic device.

The cover device may include, for example, a folding part having flexibility and a cover part connected to the folding part. The cover part may be opened and closed using the folding part. In the closed state of the cover device, the folding part may be in a curved shape, and one surface of the electronic device (eg, a surface on which the screen is exposed) may be covered by the cover part. The folding part may be formed to have a length that facilitates the opening and closing operation of the cover part, but may allow excessive movement of the cover part or reduce aesthetics.

An embodiment of the present document may provide a cover device for an electronic device for securing aesthetics while reducing the length of a folding part included in the cover device.

The technical problems to be achieved in this document are not limited to the technical problems mentioned above, and other technical problems not mentioned will be understood by those of ordinary skill in the art to which the present invention belongs from the description below. .

According to one embodiment of the present document, a cover device for an electronic device includes a connection structure detachable from the electronic device, and a cover member connected to the connection structure and capable of opening and closing one surface of the electronic device, The connection structure includes a first surface attached to the electronic device and a second surface to which the cover member is attached, and the cover member includes a first sheet attached to a first area among the second surfaces and the second surface. and a second sheet attached to the second region, and a step may be formed between the first region and the second region.

The cover device for an electronic device according to an embodiment of the present document may reduce the length of the folding part to reduce excessive movement of the cover part capable of covering one surface of the electronic device, and may improve aesthetics.

In addition, effects that can be obtained or predicted by various embodiments of the present document are to be disclosed directly or implicitly in the detailed description of the embodiments of this document. For example, various effects predicted according to various embodiments of the present document will be disclosed in the detailed description to be described later.

1 is a block diagram of an electronic device in a network environment, in one embodiment.

2 illustrates an electronic device and a cover device detachable from the electronic device according to an exemplary embodiment.

3 shows, in one embodiment, the cover arrangement in a closed state.

4 shows, in one embodiment, the cover arrangement in an open state.

5 is an exploded view of a part of a cover device according to an embodiment.

6 illustrates a state in which the second structure, the electrical path, the second sheet, and the support plate are coupled, in one embodiment.

7 , 8 , 9 , and 10 show assembly operations for a cover device, in one embodiment.

FIG. 11 shows, in one embodiment, part of the cover arrangement in relation to the closed state of FIG. 3 .

FIG. 12 is, in one embodiment, a partial cross-sectional view taken along line A-A' in the cover device for the closed state of FIG. 3 ;

FIG. 13 illustrates a cross-sectional structure in the y-z plane of a portion indicated by reference numeral '1201' in the example of FIG. 12, according to an embodiment.

FIG. 14 is a partial cross-sectional view taken along line B-B' in the cover device for the closed state of FIG. 3, in one embodiment;

FIG. 15 illustrates a cross-sectional structure in the y-z plane of a portion indicated by reference numeral '1401' in the example of FIG. 14, according to an embodiment.

16 illustrates a portion of the cover device with the electronic device and the cover portion open at an angle of about 180 degrees, in one embodiment.

FIG. 17 shows, in one embodiment, a cross-sectional structure of a cover device in relation to the example of FIG. 16 .

Hereinafter, various embodiments of the present document will be described with reference to the accompanying drawings.

1 is a block diagram of an electronic device 101 in a network environment 100 , in one embodiment.

Referring to FIG. 1 , in a network environment 100 , an electronic device 101 communicates with an external electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or a second network 199 . ) (eg, a long-distance wireless communication network) to communicate with at least one of the external electronic device 104 and the server 108 . The electronic device 101 may communicate with the external electronic device 104 through the server 108 . The electronic device 101 includes a processor 120 , a memory 130 , an input module 150 , a sound output module 155 , a display module 160 , an audio module 170 , a sensor module 176 , and an interface 177 . ), a connection terminal 178 , a haptic module 179 , a camera module 180 , a power management module 188 , a battery 189 , a communication module 190 , a subscriber identification module 196 , and/or an antenna module (197) may be included. In some embodiments of the present document, in the electronic device 101, at least one of these components (eg, the connection terminal 178) may be omitted or one or more other components may be added. In some embodiments of this document, some of these components may be implemented with a single integrated circuitry. For example, the sensor module 176 , the camera module 180 , or the antenna module 197 may be implemented by being embedded in one component (eg, the display module 160 ).

The processor 120, for example, executes software (eg, the program 140) to execute at least one other component (eg, a hardware or software component) of the electronic device 101 connected to the processor 120. It can control and perform various data processing or operations. As at least part of data processing or operation, the processor 120 loads a command or data received from another component (eg, the sensor module 176 or the communication module 190 ) into the volatile memory 132 , and , a command or data stored in the volatile memory 132 may be processed, and the result data may be stored in the nonvolatile memory 134 . The processor 120 is a main processor 121 (eg, a central processing unit (CPU) or an application processor (AP)) or a secondary processor 123 (eg, independently or together) : Graphics processing unit (GPU), neural network processing unit (NPU), image signal processor (ISP), sensor hub processor, or communication processor (CP) )) may be included. Additionally or alternatively, the auxiliary processor 123 may be configured to use less power than the main processor 121 or to be specialized for a designated function. The auxiliary processor 123 may be implemented separately from or as a part of the main processor 121 .

The secondary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or when the main processor 121 is active (eg, executing an application). ), together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states. The coprocessor 123 (eg, image signal processor (ISP) or communication processor (CP)) may be implemented as part of another functionally related component (eg, camera module 180 or communication module 190). have. According to an embodiment of this document, the auxiliary processor 123 (eg, a neural network processing device) may include a specialized hardware structure to process an artificial intelligence model. Artificial intelligence models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself on which the artificial intelligence model is performed, or may be performed through a separate server (eg, the server 108). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but the above-described example is not limited to The artificial intelligence model may include a plurality of artificial neural network layers. Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted Boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent DNNs (BRDNNs), and deep neural networks. It may be any one of deep Q-networks, or a combination of two or more of the above, but is not limited to the above-described example. In addition to hardware architecture, the AI model may additionally or alternatively include software architecture.

The memory 130 may store various data used by at least one component of the electronic device 101 (eg, the processor 120 or the sensor module 176 ). The various data may include, for example, input data or output data for software (eg, the program 140 ) and instructions related thereto. Memory 130 may include volatile memory 132 , and/or non-volatile memory 134 .

The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system 142 , middleware 144 , and/or applications 146 .

The input module 150 may receive a command or data to be used by another component (eg, the processor 120 ) of the electronic device 101 from the outside (eg, a user) of the electronic device 101 . The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).

The sound output module 155 may output a sound signal to the outside of the electronic device 101 . The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback, and the receiver can be used for incoming calls. The receiver may be implemented separately from or as part of the speaker.

The display module 160 may visually provide information to the outside (eg, a user) of the electronic device 101 . The display module 160 may include, for example, a control circuit for controlling a display, a hologram device, or a projector and a corresponding device. The display module 160 may include a touch circuit (eg, a touch sensor) configured to sense a touch, or a sensor circuit (eg, a pressure sensor) configured to measure the intensity of force generated by the touch.

The audio module 170 may convert a sound into an electric signal or, conversely, convert an electric signal into a sound. The audio module 170 acquires a sound through the input module 150 or an external electronic device (eg, the external electronic device 102 ) directly or wirelessly connected to the sound output module 155 or the electronic device 101 . Sound can be output through (eg speakers, headphones, or keyboard).

The sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the sensed state. can do. The sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, Alternatively, it may include an illuminance sensor.

The interface 177 may support one or more designated protocols that may be used for the electronic device 101 to directly or wirelessly connect with an external electronic device (eg, the external electronic device 102 ). The interface 177 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the external electronic device 102 ). The connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, and/or an audio connector (eg, a headphone connector).

The haptic module 179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic sense. The haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 may capture still images and moving images. The camera module 180 may include one or more lenses, image sensors, image signal processors (ISPs), or flashes.

The power management module 188 may manage power supplied to or consumed by the electronic device 101 . The power management module 188 may be implemented, for example, as at least part of a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101 . Battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, and/or a fuel cell.

The communication module 190 is a direct (eg, wired) communication channel or wireless communication between the electronic device 101 and an external electronic device (eg, the external electronic device 102, the external electronic device 104, or the server 108). It is possible to support establishment of a channel and performing communication through the established communication channel. The communication module 190 may include one or more communication processors (CPs) that operate independently of the processor 120 (eg, an application processor (AP)) and support direct (eg, wired) communication or wireless communication. . The communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, a local area network (LAN) communication module). ) communication module, or power line communication module). Among these communication modules, the corresponding communication module is a first network 198 (eg, a short-range communication network such as Bluetooth (BLUETOOTH), WiFi (wireless fidelity) direct or IrDA (IR data association)) or a second network 199 ( For example: it may communicate with the external electronic device 104 through a legacy cellular network, a ^5th generation (5G) network, a next-generation communication network, the Internet, or a telecommunication network such as a computer network (eg, LAN or WAN). These various types of communication modules may be integrated into one component (eg, a single chip) or may be implemented as a plurality of components (eg, multiple chips) separate from each other. The wireless communication module 192 communicates with the first network 198 or the second network 199 using subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the Subscriber Identity Module (SIM) 196 . The electronic device 101 may be identified or authenticated within the network.

The wireless communication module 192 may support a 5G network after a ^4th generation (4G) network and a next-generation communication technology, for example, a new radio access technology (NR). NR access technology includes high-speed transmission of high-capacity data (ie, enhanced mobile broadband (eMBB)), minimization of terminal power and access to multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (URLLC (ultra-reliable) and low-latency communications)). The wireless communication module 192 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example. The wireless communication module 192 uses various techniques for securing performance in a high-frequency band, for example, beamforming, massive multiple-input and multiple-output (MIMO), all-dimensional multiplexing. Technologies such as input/output (full-dimensional MIMO (FD-MIMO)), array antenna, analog beam-forming, or large-scale antenna may be supported. The wireless communication module 192 may support various requirements specified in the electronic device 101 , an external electronic device (eg, the external electronic device 104 ), or a network system (eg, the second network 199 ). According to an embodiment of the present document, the wireless communication module 192 includes a peak data rate (eg, 20 Gbps or more) for realizing eMBB, loss coverage (eg, 164 dB or less) for realizing mMTC, or U- for realizing URLLC It can support plane latency (eg, downlink (DL) and uplink (UL) of 0.5 ms or less, or round trip 1 ms or less).

The antenna module 197 may transmit or receive a signal or power to the outside (eg, an external electronic device). The antenna module 197 may include an antenna including a conductor formed on a substrate (eg, a printed circuit board (PCB)) or a radiator including a conductive pattern. The antenna module 197 may include a plurality of antennas (eg, an antenna array). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected from the plurality of antennas by, for example, the communication module 190 . can be selected. A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna. In addition to the radiator, other components (eg, a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module 197 .

According to various embodiments of the present document, the antenna module 197 may form an mmWave antenna module. According to an embodiment of the present document, the mmWave antenna module is disposed on or adjacent to a printed circuit board (PCB), a first side (eg, bottom side) of the printed circuit board, and a designated high frequency band (eg, mmWave band) an RFIC capable of supporting array antenna).

At least some of the components are connected to each other through a communication method between peripheral devices (eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and a signal ( e.g. commands or data) can be exchanged with each other.

The command or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 . Each of the external

electronic devices

102 or 104 may be the same as or different from the electronic device 101 . All or part of the operations performed by the electronic device 101 may be performed by one or more external electronic devices among the external

electronic devices

102 , 104 , or 108 . For example, when the electronic device 101 needs to perform a function or service automatically or in response to a request from a user or other device, the electronic device 101 may perform the function or service itself instead of executing the function or service itself. Alternatively or additionally, one or more external electronic devices may be requested to perform at least a part of the function or the service. One or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 101 . The electronic device 101 may process the result as it is or additionally and provide it as at least a part of a response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device 101 may provide an ultra-low delay service using, for example, distributed computing or mobile edge computing (MEC). In another embodiment of this document, the external electronic device 104 may include an Internet of things (IoT) device. The server 108 may be an intelligent server using machine learning and/or neural networks. According to an embodiment of this document, the external electronic device 104 or the server 108 may be included in the second network 199 . The electronic device 101 may be applied to an intelligent service (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.

The electronic device according to an embodiment of the present document may be a device of various types. The electronic device may include a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device. However, the electronic device is not limited to the above-described devices.

Various embodiments of this document and terms used therein are not limited to specific embodiments of the technical features described in this document. In connection with the description of the drawings, like reference numerals may be used for similar or related components. The singular form of the noun corresponding to the item may include one or more of the item, unless the relevant context clearly dictates otherwise. As used herein, "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C", and "A , B, or C," each of which may include any one of the items listed together in the corresponding one of the phrases, or all possible combinations thereof. Terms such as “first”, “second”, or “first” or “second” may simply be used to distinguish the component from other such components, and refer to the component in another aspect (e.g., importance or order) is not limited. "coupled" or "connects" one element (eg, a first component) to another (eg, a second component) with or without the terms "functionally" or "communicatively" When referred to as "connected", it is meant that one component can be connected to the other component directly (eg, by wire), wirelessly, or through a third component.

The term “module” may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as, for example, logic, logical block, component, or circuit. A module may be an integrally formed part or a minimum unit or a part of the part that performs one or more functions. For example, according to an embodiment of this document, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of the present document include one or more stored in a storage medium (eg, the internal memory 136 or the external memory 138) readable by a machine (eg, the electronic device 101). It may be implemented as software (eg, program 140) including instructions. For example, the processor (eg, the processor 120 ) of the device (eg, the electronic device 101 ) may call at least one of the one or more instructions stored from the storage medium and execute it. This makes it possible for the device to be operated to perform at least one function according to the called at least one command. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The device-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' only means that the storage medium is a tangible device and does not contain a signal (eg, electromagnetic wave), and this term is used in cases where data is semi-permanently stored in the storage medium and It does not distinguish between temporary storage cases.

The method according to an embodiment of the present document may be provided by being included in a computer program product. Computer program products may be traded between sellers and buyers as commodities. The computer program product is distributed in the form of a machine-readable storage medium (eg compact disc read only memory (CD-ROM)), or via an application store (eg PLAYSTORE ^TM ) or two user devices (eg compact disc read only memory). : can be distributed (eg, downloaded or uploaded) online, directly between smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created in a machine-readable storage medium such as a memory of a server of a manufacturer, a server of an application store, or a relay server.

Each component (eg, a module or a program) of the above-described components may include a singular or a plurality of entities. One or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg, a module or a program) may be integrated into one component. In this case, the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. . Operations performed by a module, program, or other component may be executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the above operations may be executed in a different order, omitted, or one or more other operations. can be added.

2 shows an electronic device 2 and a cover device 3 detachable to the electronic device 2 according to an embodiment. 3 shows, in one embodiment, the cover device 3 in a closed state. 4 shows, in one embodiment, the cover device 3 in an open state. 3 and 4 , the electronic device 2 connected to the cover device 3 is omitted for better understanding of the embodiment. FIG. 4 shows, for example, the cover device 3 in an open state with the electronic device 2 and the cover part 33 of FIG. 2 angled at an angle of about 90 degrees.

Referring to FIG. 2 , in one embodiment, the electronic device 2 includes a front surface 21A of the electronic device 2 , a rear surface 21B of the electronic device 2 , and between the front surface 21A and the rear surface 21B. and a housing 21 providing a side surface 21C of the electronic device 2 that at least partially surrounds the space of the . In some embodiments, the housing 21 is a structure that provides at least a portion of a front surface 21A of the electronic device 2 , a rear surface 21B of the electronic device 2 , and a side surface 21C of the electronic device 2 . can refer to

According to an embodiment, the housing 21 may include a front plate 211 , a rear plate (not shown), and/or a side bezel structure (or side member) 213 . At least a portion of the front surface 21A of the electronic device 2 may be provided by a substantially transparent front plate 211 . The front plate 211 may include, for example, a glass plate or a polymer plate including various coating layers. The rear plate may be positioned opposite to the front plate 211 . At least a portion of the rear surface 21B of the electronic device 2 may be provided by a substantially opaque rear plate. The back plate may be formed, for example, by coated or tinted glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing. The side bezel structure 213 may surround at least a portion of the space between the front plate 211 and the rear plate. At least a portion of the side surface 21C of the electronic device 2 may be formed by the side bezel structure 213 . The side bezel structure 213 may be formed of, for example, a ceramic, a polymer, a metal (eg, aluminum, stainless steel, or magnesium), or a combination of at least two of the above materials. In some embodiments, the back plate and side bezel structures 213 may be integrally formed and may include the same material (eg, a metal material such as aluminum, or a polymer material).

The electronic device 2 may be, for example, the electronic device 101 of FIG. 1 or may include at least one of components included in the electronic device 101 of FIG. 1 . In an embodiment, the electronic device 2 may include a display 22 , an input module, a sound output module, a first camera module, a second camera module, a sensor module, or at least one connection terminal. In some embodiments, the electronic device 2 may omit at least one of the components or additionally include other components. The position or number of components included in the electronic device 2 is not limited to the illustrated example and may vary.

The display 22 (eg, the display module 160 of FIG. 1 ) may, for example, be positioned in the inner space of the housing 21 at least partially overlapping the front plate 211 . The front plate 211 may protect the display 22 from the outside. The light output from the display 22 may pass through the front plate 211 and travel to the outside. The screen S of the electronic device 2 may refer to a region capable of expressing an image in the device including the display 22 and the front plate 211 , for example, the display region (or active part) of the display 22 . area) and a partial area of the front plate 211 overlapping the display area. In some embodiments, the front plate 211 may be integrally formed with the display 22 as a component included in the display 22 . A border region surrounding the screen S among the front surfaces 21A of the electronic device 2 may be substantially opaque, and may provide a screen bezel B. For example, an opaque material may be disposed on the rear surface of the area corresponding to the screen bezel B of the front plate 211 . The screen S may be further expanded without being limited to the illustrated example, and for example, the ratio of the screen S among the first surface 21A may be about 90% or more (eg, bezel-less). -less display or full screen display). In some embodiments, the display 22 may include a touch sensor (or touch sensing circuit) configured to sense a touch, or a pressure sensor configured to measure the strength of the force generated by the touch. In some embodiments, the display 22 may include or be coupled with an electromagnetic induction panel (eg, a digitizer) that detects a magnetic field type pen input device (eg, a stylus pen).

The input module (eg, the input module 150 of FIG. 1 ) may include, for example, a key input device (not shown) positioned on the side surface 21C of the housing 21 . The location or number of key input devices may vary. The input module may include, for example, a microphone positioned inside the housing 21 , and a microphone hole formed in the housing 21 to correspond to the microphone. The position or number of input modules including the microphone and the corresponding microphone hole may vary. In some embodiments, the electronic device 2 may include a plurality of microphones capable of detecting the direction of sound.

The sound output module (eg, the sound output module 155 of FIG. 1 ) may include, for example, a speaker located inside the housing 21 , and a speaker hole formed in the housing 21 to correspond to the speaker. have. The position or number of the sound output module including the speaker and the speaker hole corresponding thereto may vary. In some embodiments, the microphone hole and the speaker hole may be implemented as one hole. In some embodiments, a piezo speaker in which the speaker hole is omitted may be implemented.

The first camera module (eg, the camera module 180 of FIG. 1 ) may be located in the housing 21 corresponding to the screen bezel B, for example. The second camera module (eg, the camera module 180 of FIG. 1 ) may be located inside the housing 21 corresponding to the rear surface 21B of the electronic device 2 . The camera module or the second camera module may include one or more lenses, an image sensor, and/or an image signal processor.The location or number of camera modules may vary. In some embodiments, the display 22 ) may include an opening aligned with the first camera module.External light may reach the first camera module through an opening in the front plate 211 and display 22. In some embodiments, the display ( The opening of 22) may be provided in the form of a notch according to the position of the first camera module In some embodiments, the first camera module may be disposed at the bottom of the display 22, and the first camera module may perform a related function (eg, image capturing) without visually distinguishing (or exposing) the position of the . For example, the first camera module may be located on the rear surface of the display 22 or under the display 22 . It may be located below or beneath, and may include an under display camera (UDC), in some embodiments, the first camera module may include a recess formed in the back surface of the display 22 ( recess) The first camera module is disposed to overlap at least a part of the screen S, so that it is possible to acquire an image of an external subject without being visually exposed to the outside. In this case, A portion of the display that is at least partially overlapped with the first camera module may include a different pixel structure and/or wiring structure compared to other areas, for example, a portion of the display 22 that is at least partially overlapped with the first camera module. Regions may have different pixel densities compared to other regions The pixel structures and/or wiring structures formed in some regions of the display 22 at least partially overlapped with the first camera module may include: It is possible to reduce the loss of light between the external and the first camera module. In some embodiments, pixels may not be disposed in some areas of the display 22 that at least partially overlap the first camera module. In some embodiments, the electronic device 2 may include a plurality of camera modules (eg, a dual camera module or a triple camera module) having different properties (eg, angle of view) or functions. For example, the plurality of camera modules may include a plurality of camera modules including lenses having different angles of view. It can be controlled to change the angle of view of the camera module. The plurality of camera modules may include at least one of a wide-angle camera, a telephoto camera, a color camera, a monochrome camera, or an IR (infrared) camera (eg, a time of flight (TOF) camera, a structured light camera). In some embodiments, the IR camera may be operated as at least part of a sensor module.

A sensor module (not shown) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device 2 or an external environmental state. The sensor module may include, for example, a proximity sensor, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor (eg, a fingerprint sensor, an HRM sensor), It may include at least one of a temperature sensor, a humidity sensor, and an illuminance sensor. In one embodiment, the sensor module may include an optical sensor located inside the housing 21 corresponding to the screen bezel (B). The optical sensor may include, for example, a proximity sensor or an illuminance sensor. In some embodiments, the optical sensor may be aligned with an opening formed in the display 22 . External light may be introduced into the optical sensor through the openings of the front plate 211 and the display 22 . In some embodiments, an optical sensor may be disposed at the bottom of the display 22 , and the location of the optical sensor may perform a related function without being visually differentiated (or exposed). For example, the optical sensor may be located on the back of the display 22 , or below or beneath the display 22 . In some embodiments, the optical sensor may be positioned aligned with a recess formed in the back surface of the display 22 . The optical sensor may be disposed to overlap at least a portion of the screen S, and may perform a sensing function without being exposed to the outside. In this case, a portion of the display 22 that is at least partially overlapped with the optical sensor may include a pixel structure and/or a wiring structure different from other areas. For example, some regions of the display 22 that at least partially overlap with the optical sensor may have different pixel densities compared to other regions. In some embodiments, the sensor module may include an ultrasonic sensor positioned below the display 22 . The pixel structure and/or wiring structure formed in a portion of the display 22 that is at least partially overlapped with the sensor module is formed when various types of signals related to the sensor module (eg, light or ultrasound) pass between the outside and the sensor module. that loss can be reduced. In some embodiments, a plurality of pixels may not be disposed in a portion of the display 22 that at least partially overlaps the sensor module.

The at least one connection terminal (eg, the connection terminal 178 of FIG. 1 ) may include, for example, connectors (eg, an HDMI connector, a USB connector interface, an SD card connector, or a connector located inside the electronic device 2 ). audio connector) and connector holes formed in the housing 21 to correspond to the connectors. The electronic device 2 may transmit and/or receive power and/or data with an external electronic device electrically connected to the connector through the connector hole. The position or number of the connector and the connector hole corresponding thereto may vary.

According to an embodiment, the electronic device 2 may include a detachable pen input device (eg, an electronic pen, a digital pen, or a stylus pen).

2 , 3 , and 4 , in one embodiment, the cover device 3 may include a connection part 31 , a folding part 32 , and a cover part 33 . The connection part 31 may be detachably attached to the electronic device 2 . In an embodiment, the connection part 31 may be detachably attached to at least a part of the side surface 21C of the electronic device 2 . For example, by using the attractive force between the first magnetic body included in the connection part 31 and the second magnetic body included in the electronic device 2 , the connection part 31 of the cover device 3 is connected to the electronic device 2 . It may be attached to the side surface 21C. The folding part 32 connects between the connection part 31 and the cover part 33 and may have flexibility. The cover part 33 may be opened and closed using the folding part 32 . The folding part 32 may be formed of a length that facilitates the opening and closing operation of the cover part 33 , and switching between the closed state and the open state of the cover device 3 , or between the open states of various open angles. can be bent In some embodiments, the folding part 320 may be defined or interpreted as a part of the cover part 33 .

According to one embodiment, the cover portion 33 at least partially surrounds the front surface 33A, the rear surface 33B positioned opposite to the front surface 33A, and the space between the front surface 33A and the rear surface 33B. may include a side surface (33C). The side surface 33C may extend from one side 321 of the folding part 32 to the other side 322 , for example. In the closed state of the cover device 3 , the cover portion 33 may be positioned so as to face and no longer come close to the front face 21A of the electronic device 2 , the front face 21A of the electronic device 2 and The front surface 33A of the cover part 33 may not be substantially exposed to the outside. In the closed state of the cover device 3 , the side surface 33C of the cover 3 may be aligned with a portion of the side surface 21C of the electronic device 2 . When the cover device 3 is not in the closed state (eg, in the open state of the cover device 3 ), the front surface 21A of the electronic device 2 and the front surface 33A of the cover part 33 are not exposed to the outside. can The open state of the cover device 3 may vary depending on the open angle of the cover part 33 . For example, there may be an open state in which the front surface 21A of the electronic device 2 and the front surface 33A of the cover part 33 form an acute angle, about 180 degrees, or an obtuse angle. For another example, there may be an open state in which the cover part 33 is positioned so as not to come close to it while facing the rear surface 21B of the electronic device 2 .

According to an embodiment, the cover device 3 may be electrically connected to the electronic device 2 . The cover device 3 may include, for example, the external electronic device 102 of FIG. 1 . The cover device 3 may include, for example, an electronic component such as a display module, an input module, a sound output module, a camera module, a sensor module, or at least one connection terminal. In some embodiments, the cover device 3 may include at least one of the components included in the electronic device 101 of FIG. 1 . The electronic component included in the cover device 3 may be electrically connected to the electronic device 2 through the connection part 31 . In one embodiment, when the cover device 3 is attached to the electronic device 2 , it becomes in the form of a foldable electronic device such as a laptop computer (or a notebook computer) and the electronic device 2 ) can be expanded.For example, the cover device 3 may include a keyboard 34 or a touch pad 35 located on the cover part 33 . The input module 40 may be various in addition, for example, including one or more key input devices (eg, various function keys such as a power button) located on the front surface 33A of the cover part 33 . The input module 40 may form a part of the front surface 33A of the cover part 33. The electronic device 2 responds to a user input generated through the keyboard 35 or the touch pad 34. It can perform various actions (or functions).

According to one embodiment, the connection part 31 of the cover device 3 is the connection part 31 of the electronic device 2 when the connection part 31 of the cover device 3 is attached to the side surface 21C of the electronic device 2 . A first surface 310 facing the side surface 21C may be included. The cover device 3 may include a plurality of terminals 36 exposed to the first surface 310 . When the connection part 31 of the cover device 3 is attached to the side surface 21C of the electronic device 2 , the plurality of terminals 36 are exposed to the side surface 21C of the electronic device 2 . ) may be electrically connected to a plurality of terminals (not shown). The cover device 3 may include an electrical path for electrically connecting the plurality of terminals 36 and electronic components (eg, the keyboard 34 and the touch pad 35) included in the cover 3 . The electrical path may include, for example, a flexible printed circuit board (FPCB) located inside the cover 3 . In one embodiment, the electrical path may extend from the connection part 31 to the cover part 33 through the folding part 32 , and the plurality of terminals 36 are located in the cover part 33 through the electrical path. may be electrically connected to the input module 40 .

According to an embodiment, the cover device 3 may include a plurality of protrusions 37 positioned on the first surface 310 . The plurality of protrusions 37 may protrude with respect to the first surface 310 . When the connecting portion 31 of the cover device 3 is attached to the side surface 21C of the electronic device 2 , the plurality of protrusions 37 form a plurality of recesses formed in the side surface 21C of the electronic device 2 . It can be inserted into recesses (or grooves). A structure in which the plurality of protrusions 37 are inserted into the plurality of recesses may contribute to a stable connection between the electronic device 2 and the connection part 31 of the cover device 3 . The structure in which the plurality of protrusions 37 are inserted into the plurality of recesses guides the user to the position or direction in which the connection part 31 of the cover device 3 is attached to the side surface 21A of the electronic device 2 . can do.

According to an embodiment, the cover device 3 may include cushioning members 38 disposed on the cover part 33 . The cushioning members 38 may mitigate an impact between the electronic device 2 and the cover part 33 when the cover device 3 is switched from an open state to a closed state. For example, when the cover device 3 is switched from an open state (refer to FIG. 2 ) to a closed state, the cushioning members 38 located in the cover part 33 are disposed on the front surface 21A of the electronic device 2 . can be in flexible contact with The cushioning members 38 may include various flexible members or elastic members (eg, rubber).

According to one embodiment, the cover device 3 may include a support cover portion 39 attachable to the rear surface 21B of the electronic device 2 . For example, by using the attractive force between the magnetic body included in the support cover part 39 and the magnetic body included in the electronic device 2 , the support cover part 39 is attached to the rear surface 21B of the electronic device 2 . can be The support cover part 39 may be implemented to be foldable, and, for example, may be used to maintain the electronic device 2 in a state of being erected at various angles with respect to the cover part 33 .

In some embodiments, the electronic device 2 may be referred to as a 'first electronic device', and the cover device 3 may be referred to as a 'second electronic device'. In some embodiments, the electronic device 2 may be referred to as a 'display device' as a device including a screen S. In some embodiments, the electronic device 2 may be defined to include a cover device 3 . In some embodiments, it may be referred to as a 'foldable electronic device', including the electronic device 2 and the cover device 3 . In some embodiments, the electronic device 2 and the cover device 3 may be referred to as a 'system'.

5 is an exploded view of a part 300 of the cover device 3 according to an embodiment. 6 shows, in one embodiment, the second structure 52 , the electrical path 60 , the second seat 82 , and the support plate 90 joined together.

5 and 6 , in one embodiment, the cover device 3 includes a connection structure 50 , an electrical path 60 , a plurality of first magnetic bodies 70 , a cover member 80 , and/or A support plate 90 may be included.

According to an embodiment, the connection structure 50 may be attached to at least a part of the side surface 21C (refer to FIG. 2 ) of the electronic device 2 . In some embodiments, the connection structure 50 may be referred to by various other terms such as 'attachment structure', 'attachment structure', 'attachment structure', or 'support structure'. The connection structure 50 may be included in the connection part 31 ( FIGS. 2 , 3 , or 4 ) of the cover device 3 . The connection structure 50 may include a first surface 310 facing the side surface 21C of the electronic device 2 and a second surface 320 to which the cover member 80 is attached. The connecting structure 50 may include, for example, a first structure 51 forming a first face 310 , and a second structure 51 coupled with the first structure 51 and forming a second face 320 ( 52) may be included. The first structure 51 may include a plurality of protrusions 37 positioned on the first surface 310 . The first structure 51 may include a plurality of through holes 511 formed in the first surface 310 corresponding to the plurality of terminals 36 . The first end 61 of the electrical path 60 (eg, a flexible printed circuit board) may include a plurality of terminals 36 , wherein the first structure 51 and the second structure 52 are coupled to each other. It may be located in the inner space of the formed connection structure 50 . The first end 61 of the electrical path 60 may be disposed or coupled to the second structure 52 . The plurality of terminals 36 may be exposed to the outside through the plurality of through holes 511 of the first structure 51 , and may protrude with respect to the first surface 310 . In an embodiment, the plurality of terminals 36 may include a flexible conductive terminal that is in resilient contact with the plurality of terminals exposed to the side surface 21A (refer to FIG. 2 ) of the electronic device 2 . The flexible conductive terminal may include, for example, a pogo pin. The second end 62 of the electrical path 60 may be located in the cover portion 33 (FIG. 2, 3, or 4) of the cover device 3, the electronic component ( For example, it may include a connector electrically connected to the input module 40 of FIG. 2, 3, or 4). Electrical path 60 is an extension connecting the first end 61 located on the connecting structure 50 and the second end 62 located on the cover portion 33 (FIG. 2, 3, or 4). 63 , and the extension 63 may be positioned through an opening (not shown) formed in the second structure 52 .

According to an embodiment, the plurality of first magnetic bodies 70 may be located in the inner space of the connection structure 50 . The connection structure 50 of the cover device 3 by using the attractive force between the plurality of first magnetic bodies 70 (eg, a plurality of magnets) and the plurality of second magnetic bodies included in the electronic device 2 . may be attached to the side surface 21C of the electronic device 2 . The plurality of second magnetic materials may include, for example, a magnet or a material that magnetizes in a magnetic field.

According to an embodiment, the cover member 80 may be disposed on the connection structure 50 . The cover member 80 may include a first sheet 81 and a second sheet 82 . The first sheet 81 may be attached to or coupled to the first region 1301 (refer to FIG. 6 ) of the second surface 320 of the connection structure 50 . The second sheet 82 may be attached to or coupled to the second region 1302 of the second surface 320 of the connection structure 50 . The first sheet 81 and the second sheet 82 may be joined to overlap from a portion where the first region 1301 and the second region 1302 meet. A thermally reactive adhesive between the first area 1301 of the first sheet 81 and the second side 320 and/or between the second area 1302 of the second sheet 82 and the second side 320 . , a general adhesive, and/or a polymeric adhesive material such as double-sided tape may be positioned. The folding part 32 (refer to FIGS. 2, 3, or 4) of the cover device 3 may include a portion in which the first sheet 81 and the second sheet 82 are overlapped and coupled. The extension portion 63 of the electrical path 60 penetrates through the opening formed in the second structure 52 , and a portion of the first sheet 81 located in the folding portion 32 and the folding portion of the second sheet 82 . may extend between portions located at 32 . The cover part 33 (refer to FIGS. 2, 3, or 4) of the cover device 3 may include another part in which the first sheet 81 and the second sheet 82 are overlapped and joined. The side surface 33C (refer to FIG. 2 or 3 ) of the cover part 33 may be formed by overlapping the first sheet 81 and the second sheet 82 . The first sheet 81 and the second sheet 82 may be overlapped and bonded using a polymer adhesive material such as a heat-reactive adhesive, a general adhesive, and/or a double-sided tape.

According to one embodiment, the first sheet 81 and/or the second sheet 82 may include a fabric. In some embodiments, the first seat 81 and/or the second seat 82 may comprise leather. In some embodiments, the first sheet 81 and/or the second sheet 82 may include various polymers. The first sheet 81 and the second sheet 82 may include the same material or different materials.

According to an embodiment, the support plate 90 may be included in the cover part 33 (refer to FIGS. 2 , 3 or 4 ) of the cover device 3 . The support plate 90 is, for example, a portion on which an electronic component positioned on the cover portion 33 of the cover device 3 is disposed, and may contribute to durability or rigidity (eg, torsional rigidity) of the cover portion 33 . can The support plate 90 may be referred to as a bracket or a mounting plate. In one embodiment, the input module 40 (see FIGS. 2 , 3 , or 4 ) may be disposed or coupled to the support plate 90 . In one embodiment, a portion of the extension 63 included in the electrical path 60 and the second end 62 may be disposed or coupled to the support plate 90 . In one embodiment, the support plate 90 may be disposed on the second seat 82 . The support plate 90 may be bonded to the second sheet 82 using a heat-reactive adhesive, a general adhesive, and/or a polymer adhesive material such as double-sided tape. In one embodiment, the first sheet 81 may include an opening 811 , and the input module 40 (see FIGS. 2 , 3 , or 4 ) may be exposed to the outside through the opening 811 . . There is substantially no gap between the first sheet 81 and the input module 40 , and the support plate 90 may not be exposed to the outside.

According to one embodiment, a border region (not shown) of the support plate 90 adjacent to the opening 811 of the first sheet 81 is to be positioned between the first sheet 81 and the second sheet 82 . can In this case, an adhesive material may be positioned between the edge region of the first sheet 81 and the support plate 90 .

According to some embodiments, the first sheet 81 may be extended to cover a border area of the input module 40 , and the border area of the input module 40 may include the first sheet 81 and the second sheet 82 . ) can be located between In some embodiments, the first sheet 81 may be extended to cover a border area of the input module 40 , and the border area of the input module 40 may include the first sheet 81 and the second sheet 82 . can be located between In this case, an adhesive material may be positioned between the first sheet 81 and the edge region of the input module 40 .

7 , 8 , 9 and 10 show assembly operations with respect to the cover device 3 , in one embodiment.

Referring to FIG. 7 , in a first operation, the first end 61 of the electrical path 60 is disposed on the second structure 52 , and the second end 62 of the electrical path 60 is connected to a support plate ( 90) can be placed. In a first operation, the first magnetic body 71 (eg, one of the plurality of first magnetic bodies 70 of FIG. 5 ) may be disposed in the second structure 52 . 7 and 8 , in the second operation, the second sheet 82 may be disposed on the first assembly 301 formed in the first operation to form the second assembly 302 . In one embodiment, a partial area of the second sheet 82 may be coupled to the second structure 52 , and another partial area of the second sheet 82 may be coupled to the support plate 90 . 8 and 9 , in the third operation, the first sheet 81 may be disposed on the second assembly 302 to form a third assembly 303 . In one embodiment, a partial area of the first sheet 81 may be coupled to the second structure 52 , and another partial area of the first sheet 81 may be coupled to the second sheet 82 . 9 and 10 , in a fourth operation, the first structure 51 may be disposed on the third assembly 303 to form a part 300 of the cover device 3 shown in FIG. 5 . . The first structure 51 may be combined with the second structure 52 . For example, the first structure 51 and the second structure 52 may be joined by mechanical fastening such as bolt fastening or snap-fit fastening, or bonding using an adhesive member. can The assembly operations may be performed in a different order, omitted, or one or more other operations may be added.

FIG. 11 shows, in one embodiment, a part of the cover device 3 in the closed state of FIG. 3 . FIG. 12 is, in one embodiment, a partial cross-sectional view 1200 on the line A-A′ in the cover device 3 in the closed state of FIG. 3 . FIG. 13 shows a cross-sectional structure 1300 in the y-z plane for a portion indicated by reference numeral '1201' in the example of FIG. 12, in one embodiment. FIG. 14 is, in one embodiment, a partial cross-sectional view 1400 on the line B-B′ in the cover device 3 in the closed state of FIG. 3 . FIG. 15 shows a cross-sectional structure 1500 in the y-z plane for a portion indicated by reference numeral '1401' in the example of FIG. 14, in one embodiment. Figure 16 shows, in one embodiment, a portion of the cover device 3 in an open state with the electronic device 2 and the cover portion 33 angled at about 180 degrees. FIG. 17 shows, in one embodiment, a cross-sectional structure 1700 of the cover device 3 in relation to the example of FIG. 16 .

11 , 12 , 13 , 14 , 15 , 16 , and 17 , in one embodiment, the connection structure 50 includes a first surface 310 facing the side surface 21C of the electronic device 2 and It may include a second surface 320 to which the cover member 80 is attached. The first surface 310 may be formed by the first structure 51 of the connection structure 50 . The first surface 310 may be formed in a shape corresponding to the side surface 21C of the electronic device 2 , thereby contributing to a stable connection between the electronic device 2 and the connection part 31 of the cover device 3 . The second surface 320 may be formed by the second structure 52 of the connection structure 50 . In some embodiments, the connection structure 50 is not limited to the illustrated example and may be implemented in various other forms forming the first surface 310 and the second surface 320 . The second structure 52 includes a portion forming an internal space (not shown) of the connection structure 50 together with the first structure 51 as in the example of FIG. 15 , or as the example of FIG. 14 and the internal space. It may include a portion that is expanded to support the first structure 51 . The first end 61 of the electrical path 60 (eg, a flexible printed circuit board) may be located inside the connection structure 50 . An extension 63 of the electrical path 60 may extend from the first end 61 and be positioned through an opening 1304 formed in the second structure 52 . A portion 631 of the extension portion 63 of the electrical path 60 located in the folding portion 32 is a third portion 812 located in the folding portion 32 of the first sheet 81 and the second sheet Among the 82 , it may extend between the fourth portion 822 positioned in the folding portion 32 . An adhesive material may be positioned between the third portion 812 of the first sheet 81 and the fourth portion 822 of the second sheet 82 . In some embodiments, between the portion 631 of the electrical path 60 and the third portion 812 of the first sheet 81 , and/or the portion 631 of the electrical path 60 and the second sheet 82 ), an adhesive material may be positioned between the fourth portions 822 . In some embodiments, the third portion 812 of the first sheet 81 or the fourth portion 822 of the second sheet 82 is a recess into which the portion 631 of the electrical path 60 may be inserted. (recess) (not shown) may be included, which may contribute to formation of an even thickness of the folding part 32 .

According to an embodiment, the second surface 52 of the connection structure 50 is a first region 1301 on which the first sheet 81 is disposed or coupled and a second area on which the second sheet 82 is disposed or coupled. region 1302 . For example, the first sheet 81 may include a first portion 811 extending from a third portion 812 , and the first portion 811 may be attached to the first region 1301 . . For example, the second sheet 82 may include a second portion 821 extending from a fourth portion 822 , and the second portion 821 may be attached to the second region 1302 . . An adhesive material may be positioned between the first portion 811 and the first region 1301 and between the second portion 821 and the second region 132 . In one embodiment, the second surface 320 may include a third region 1303 (or a boundary portion) between the first region 1301 and the second region 1302 . At least a portion of the third region 1303 may include, for example, a plane. In some embodiments, at least a portion of the third region 1303 may include a curved surface or an inclined surface.

According to an embodiment, a step 1305 may be formed between the first region 1301 and the second region 1302 . At least a portion of the third region 1303 may be positioned at the step 1305 . The opening 1304 through which the extension 63 of the electrical path 60 is positioned may be formed in the third region 1303 or the step 1305 . The step 1305 may indicate a shape having a height difference between the first area 1301 and the second area 1302 with respect to the third area 1303 . In one embodiment, the first boundary 1501 (see FIG. 15 or 17 ) between the first area 1301 and the third area 1303 is the second area between the second area 1302 and the third area 1303 . It may be closer to the first face 310 than to the second boundary 1502 (see FIG. 15 or 17 ). The first region 1301 to which the first sheet 81 is attached may include, for example, one surface of the second structure 52 extending from the first boundary 1501 to one side of the first structure 51 . can The second region 1302 to which the second sheet 82 is attached may be, for example, the other surface of the second structure 52 extending from the second boundary 1502 to the other side of the first structure 51 . .

According to an embodiment, a portion (not shown) of the first sheet 81 may be disposed to face the third region 1303 . In some embodiments, an adhesive material may be positioned between the third region 1303 and a portion of the first sheet 81 corresponding to the third region 1303 .

According to one embodiment, in the change of state of the cover device 3 , at a position adjacent to the second boundary 1502 , between the first portion 811 and the third portion 812 of the first sheet 81 . The fifth portion 1310 may be bent. In the change of state of the cover device 3 , at a position adjacent to the second boundary 1502 , the sixth portion 1320 between the second portion 821 and the fourth portion 822 of the second sheet 82 . can be bent. In the change of state of the cover device 3 , the fifth portion 1201 of the first sheet 81 and the sixth portion 1202 of the second sheet 82 may be bent in opposite directions. Changing the state of the cover device 3 may include, for example, a transition between a closed state and an open state, or a transition between open states of various open angles.

According to one embodiment, when the cover device 3 is switched from the open state (see Fig. 17) to the closed state (see Fig. 15), the second region 1302, the third region 1303, and the second seat ( The first sheet 81 may be bent in the space 1505 formed by the fourth portion 822 of the 82 . When the cover device 3 is switched from the open state to the closed state, the first seat 811 and the third part 813 of the first seat 81 form an angle at which they can no longer come close. The fifth portion 1310 of 81 may be bent. When the cover device 3 is switched from the open state to the closed state, the sixth portion 1320 of the second seat 82 may be deformed from the open state to the unfolded state. For example, in the closed state of the cover device 3 , a plane at least partially included in the second part 821 and a plane included at least partly in the fourth part 822 may form an angle of about 180 degrees. In the closed state of the cover device 3 , the first seat 81 is in the space 1505 corresponding to the height difference (or the step 1305 ) between the first region 1301 and the second region 1302 . As such, the second sheet 82 can form a smooth outer surface that does not protrude when viewed from the outside. For example, in the closed state of the cover device 3 , the third portion 812 of the first sheet 81 may not substantially protrude with respect to the first region 1301 .

According to one embodiment, when the cover device 3 is switched from the closed state of FIG. 15 to the open state of FIG. 17 , the space formed by the first area 1301 and the third part 812 of the first seat 81 . At 1705, the second sheet 82 may be bent. When the cover device 3 is switched from the closed state of FIG. 15 to the open state of FIG. 17 , the second part 821 and the fourth part 822 of the second seat 82 form a narrow angle compared to the closed state. The sixth portion 1320 of the second sheet 82 may be bent. For example, in the open state of FIG. 17 , a plane at least partially included in the second part 821 and a plane included at least partly in the fourth part 822 may form an angle of about 90 degrees. When the cover device 3 is switched from the closed state of FIG. 15 to the open state of FIG. 17 , the fifth portion 1310 of the first seat 81 may be deformed from the closed state to the unfolded state.

According to one embodiment, between the first area 1301 of the connecting structure 50 in which the first sheet 81 is disposed and the second area 1302 of the connecting structure 50 in which the second sheet 82 is disposed. The step 1305 of the can contribute to reducing the length of the folding part 32 related to the state change of the cover device (3).

According to one embodiment, when the electronic device 2 and the cover part 33 of the cover device 3 are placed on the floor of a plane in an open state (see FIGS. 16 and 17 ) at an angle of about 180 degrees, the electronic device 2 ) so that the rear surface 21B (see FIG. 2 ) and the rear surface 33B (see FIG. 2 ) of the cover part 33 do not lift off from the floor, the third area 1303 or the step 1305 is the electronic device 2 . The rear surface 21B and the rear surface 33B of the cover part 33 may be positioned at substantially the same height.

According to one embodiment, when the cover device 3 is switched between a closed state (see Figs. 11, 12, 13, 14, and 15) and an open state (see Figs. 16 and 17), the first seat 81 is The first region 1301 and the second region 1302 to have bending characteristics capable of reducing the effect of stress occurring in the fifth portion 1310 of the second sheet 82 and/or the sixth portion 1320 of the second sheet 82 . A third region 1303 or a step 1305 therebetween may be located.

According to an embodiment of the present document, a cover device (eg, the cover device 3 of FIG. 2 ) for an electronic device (eg, the electronic device 2 of FIG. 2 ) has a connection structure detachable to the electronic device (eg, the electronic device 2 ). : the connection structure 50 of FIG. 13) may be included. The cover device may include a cover member (eg, the cover member 80 of FIG. 13 ) capable of opening and closing one surface of the electronic device. The cover member may be connected to the connection structure. The connection structure includes a first surface (eg, the first surface 310 of FIG. 13 ) attached to the electronic device and a second surface (eg, the second surface 320 of FIG. 13 ) to which the cover member is attached. may include The cover member may include a first sheet (eg, the first sheet 81 in FIG. 13 ) attached to a first region (eg, the first region 1301 in FIG. 13 ) of the second surfaces and the second surface. and a second sheet (eg, the second sheet 82 of FIG. 13 ) attached to the second region (eg, the second region 1302 of FIG. 13 ). A step (eg, a step 1305 of FIG. 13 ) may be formed between the first area and the second area.

According to an embodiment of the present document, the second surface (eg, the second surface 320 of FIG. 13 ) corresponds to the step (eg, the step 1305 of FIG. 13 ) in the first area (eg: a third region (eg, third region 1303 of FIG. 13 ) between the first region 1301 of FIG. 13 ) and the second region (eg, the second region 1302 of FIG. 13 ). can A first boundary between the first region and the third region (eg, a first boundary 1501 in FIG. 15 ) is a second boundary between the second region and the third region (eg, a second boundary in FIG. 15 ). It may be closer to the first surface (eg, the first surface 310 of FIG. 15 ) than the boundary 1502 ).

According to an embodiment of the present document, a portion (eg, the first region 1301 of FIG. 13 ) extending from the first region (eg, the first region 1301 of FIG. 13 ) of the first sheet (eg, the first sheet 81 of FIG. 13 ) : the third portion 812 of FIG. 13) and the second sheet (eg, the second sheet 82 of FIG. 13) extending from the second region (eg, the second region 1302 of FIG. 13) The parts (eg, the fourth part 822 of FIG. 13 ) may be overlapped and combined to form a cover part (eg, the cover part 33 of FIG. 2 ) capable of opening and closing one surface of the electronic device. When the cover part is positioned to cover one surface of the electronic device, the first sheet may face one surface (eg, the front surface 21A of FIG. 2 ) of the electronic device.

According to an embodiment of the present document, a portion (eg, the first region 1301 of FIG. 13 ) extending from the first region (eg, the first region 1301 of FIG. 13 ) of the first sheet (eg, the first sheet 81 of FIG. 13 ) : the third portion 812 of FIG. 13) and the second sheet (eg, the second sheet 82 of FIG. 13) extending from the second region (eg, the second region 1302 of FIG. 13) A portion (eg, the fourth part 822 of FIG. 13 ) is overlapped and coupled to the connection structure (eg, the connection structure 50 of FIG. 13 ) and the cover part (eg, the cover part 33 of FIG. 2 ). A folding part between them (eg, the folding part 32 of FIG. 13 ) may be further formed.

According to an embodiment of the present document, the connection structure (eg, the connection structure 50 of FIG. 13 ) is an opening (eg, the opening ( 1304)) may be further included.

According to an embodiment of the present document, the connection structure (eg, the connection structure 50 of FIG. 13 ) forms a first structure (eg, the first surface 310 of FIG. 13 ) forming the first surface (eg, the connection structure 50 of FIG. 13 ). : the first structure 51 of FIG. 13 ), and a second structure (eg, the second structure 52 of FIG. 13 ) forming the second surface (eg, the second surface 320 of FIG. 13 ). may include

According to an embodiment of the present document, the cover device (eg, the cover device 3 of FIG. 2 ) may include a flexible printed circuit board (eg, the electrical path 60 of FIG. 5 ) located inside the cover device. may include more. The flexible printed circuit board includes a first end (eg, the first end 61 of FIG. 5 ) positioned at the connection structure (eg, the connection structure 50 of FIG. 5 ), and the cover part (eg, the connection structure 50 of FIG. 2 ). a second end (eg, the second end 62 of FIG. 5 ) located on the cover portion 33 ), and an extension connecting the first end and the second end (eg, the extension of FIG. 5 ) 63)) may be included. The extension part may be positioned through the opening (eg, the opening 1304 of FIG. 13 ) positioned at the step (eg, the step 1305 of FIG. 13 ).

According to an embodiment of the present document, the first end (eg, the first end 61 of FIG. 5 ) is at least one electrically connected to the electronic device (eg, the electronic device 2 of FIG. 2 ). It may include a terminal (eg, the plurality of terminals 36 of FIG. 5 ). The second end (eg, the second end 62 of FIG. 5 ) is an electronic component (eg, the input module 40 of FIG. 2 ) located in the cover part (eg, the cover part 33 of FIG. 2 ) can be electrically connected to.

According to an embodiment of the present document, the at least one terminal (eg, the plurality of terminals 36 of FIG. 5 ) may include a flexible conductive terminal. The flexible conductive terminal may be connected to the first surface (eg, in FIG. 5 ) through a through hole (eg, a plurality of through holes 511 in FIG. 5 ) formed in the connection structure (eg, the connection structure 50 in FIG. 5 ). of the first surface 310).

According to an embodiment of the present document, the at least one terminal (eg, the plurality of terminals 36 of FIG. 5 ) may include a pogo pin.

According to an embodiment of this document, the electronic component (eg, the input module 40 of FIG. 2 ) may include a keyboard (eg, the keyboard 34 of FIG. 2 ).

According to an embodiment of this document, the electronic component (eg, the input module 40 of FIG. 2 ) may include a touch pad (eg, the touch pad 35 of FIG. 2 ).

According to an embodiment of the present document, the first sheet (eg, the first sheet 81 of FIG. 5 ) or the second sheet (eg, the second sheet 82 of FIG. 5 ) may include a fabric. have.

According to an embodiment of the present document, the connection structure (eg, the connection structure 50 of FIG. 13 ) is a side surface (eg, the side surface ( ) of FIG. 13 ) of the electronic device (eg, the electronic device 2 of FIG. 13 ). 21C)) may be detachable. The cover part (eg, the cover part 33 of FIG. 2 ) may open and close the screen of the electronic device (eg, the screen S of FIG. 2 ).

According to an embodiment of the present document, the cover device (eg, the cover device 3 of FIG. 5 ) corresponds to a magnetic material included in the electronic device (eg, the electronic device 2 of FIG. 2 ), and the connection It may further include at least one magnet (eg, a plurality of first magnetic bodies 70 of FIG. 5 ) positioned in the structure (eg, the connection structure 50 of FIG. 5 ).

According to an embodiment of this document, a cover device (eg, the cover device 3 of FIG. 2 ) for an electronic device (eg, the electronic device 2 of FIG. 2 ) is a side surface (eg, FIG. 2 ) of the electronic device. A detachable connection structure (eg, the connection structure 50 of FIG. 5 ) may be included on the side surface 21C of the . The cover device may include a cover member (eg, the cover member 80 of FIG. 5 ) capable of opening and closing the front surface (eg, the front surface 21A of FIG. 2 ) of the electronic device. The cover member may be connected to the connection structure. The connection structure includes a first surface (eg, the first surface 310 of FIG. 13 ) attached to the electronic device and a second surface (eg, the second surface 320 of FIG. 13 ) to which the cover member is attached. may include The cover member may include a first sheet (eg, the first sheet 81 in FIG. 13 ) attached to a first region (eg, the first region 1301 in FIG. 13 ) of the second surfaces and the second surface. and a second sheet (eg, the second sheet 82 of FIG. 13 ) attached to the second region (eg, the second region 1302 of FIG. 13 ). A portion of the first sheet extending from the first region (eg, the third portion 812 in FIG. 13 ) and a portion of the second sheet extending from the second region (eg, the fourth portion of FIG. 13 ) 822)) may be overlapped and combined to form a cover part (eg, the cover part 33 of FIG. 2 ) capable of opening and closing one surface of the electronic device. When the cover part is positioned to cover one surface of the electronic device, the first sheet faces the front surface of the electronic device, and there is a step (eg, step 1305 in FIG. 13 ) between the first area and the second area. )) can be formed.

According to an embodiment of the present document, the cover device (eg, the cover device 3 of FIG. 5 ) may include a flexible printed circuit board (eg, the electrical path 60 of FIG. 5 ) located inside the cover device. may include more. The flexible printed circuit board includes a first end (eg, the first end 61 of FIG. 5 ) positioned at the connection structure (eg, the connection structure 50 of FIG. 5 ), and the cover part (eg, the connection structure 50 of FIG. 2 ). a second end (eg, the second end 62 of FIG. 5 ) located on the cover portion 33 ), and an extension connecting the first end and the second end (eg, the extension of FIG. 5 ) 63)) may be included. The connection structure may include an opening (eg, the opening 1304 of FIG. 13 ) positioned at the step (eg, the step 1305 of FIG. 13 ). The extension may be positioned through the opening.

According to an embodiment of the present document, the electronic component (eg, the input module 40 of FIG. 2 ) may include a keyboard (eg, the keyboard 34 of FIG. 2 ) or a touch pad (eg, the touch pad 35 of FIG. 2 ). )) may be included.

According to an embodiment of the present document, the electronic device may include a display device (eg, the electronic device 2 of FIG. 2 ) and a cover device detachable to the display device (eg, the cover device 3 of FIG. 2 ). can The cover device may include a connection structure detachable from the display device (eg, the connection structure 50 of FIG. 13 ). The cover device may include a cover member (eg, the cover member 80 of FIG. 13 ) capable of opening and closing the screen (eg, the screen S of FIG. 2 ) of the display device. The cover member may be connected to the connection structure. The connection structure includes a first surface (eg, the first surface 310 of FIG. 13 ) attached to the display device and a second surface (eg, the second surface 320 of FIG. 13 ) to which the cover member is attached. may include The cover member may include a first sheet (eg, the first sheet 81 in FIG. 13 ) attached to a first region (eg, the first region 1301 in FIG. 13 ) of the second surfaces and the second surface. and a second sheet (eg, the second sheet 82 of FIG. 13 ) attached to the second region (eg, the second region 1302 of FIG. 13 ). A step (eg, a step 1305 of FIG. 13 ) may be formed between the first area and the second area.

Embodiments disclosed in this document and drawings are merely presented as specific examples to easily explain technical content according to the embodiments and help understanding of the embodiments, and are not intended to limit the scope of the embodiments. Therefore, the scope of various embodiments of the present document should be construed as including all changes or modifications other than the embodiments disclosed herein as being included in the scope of various embodiments of the present document.

Claims

A cover device for an electronic device, comprising:

a connection structure detachable from the electronic device; and

and a cover member connected to the connection structure and capable of opening and closing one surface of the electronic device;

The connection structure includes a first surface attached to the electronic device and a second surface to which the cover member is attached,

The cover member includes a first sheet attached to a first area of the second surfaces and a second sheet attached to a second area of the second surfaces,

A step difference is formed between the first area and the second area.
The method of claim 1,

The second surface further includes a third area between the first area and the second area corresponding to the step difference,

A first boundary between the first area and the third area is closer to the first surface than a second boundary between the second area and the third area.
3. The method of claim 2,

A portion of the first sheet extending from the first region and a portion of the second sheet extending from the second region are overlapped and combined to form a cover portion capable of opening and closing one surface of the electronic device,

When the cover part is positioned to cover one surface of the electronic device, the first sheet faces the one surface of the electronic device.
4. The method of claim 3,

and a portion of the first sheet extending from the first region and a portion of the second sheet extending from the second region are overlapped and combined to further form a folding part between the connection structure and the cover part.
The method of claim 1,

The connecting structure is a cover device further comprising an opening located in the step.
The method of claim 1,

The connection structure includes a first structure forming the first surface, and a second structure forming the second surface.
The method of claim 1,

Further comprising a flexible printed circuit board positioned inside the cover device,

the flexible printed circuit board includes a first end positioned in the connecting structure, a second end positioned in the cover part, and an extension connecting the first end and the second end;

The extension portion is a cover device positioned through the opening positioned in the step.
8. The method of claim 7,

The first end includes at least one terminal electrically connected to the electronic device,

The second end of the cover device is electrically connected to the electronic component located in the cover portion.
9. The method of claim 8,

the at least one terminal comprises a flexible conductive terminal;

The flexible conductive terminal is exposed to the first surface through a through hole formed in the connection structure.
10. The method of claim 9,

and the at least one terminal comprises a pogo pin.
9. The method of claim 8,

The electronic component is a cover device including a keyboard.
9. The method of claim 8,

The electronic component is a cover device including a touch pad.
The method of claim 1,

The first sheet or the second sheet comprises a fabric (fabric) cover device.
The method of claim 1,

The connection structure is detachable from the side of the electronic device,

The cover unit is a cover device capable of opening and closing the screen of the electronic device.
The method of claim 1,

Corresponding to the magnetic material included in the electronic device, the cover device further comprising at least one magnet positioned in the connection structure.