WO2022086172A1 - Structure de bouton et dispositif électronique la comprenant - Google Patents

Structure de bouton et dispositif électronique la comprenant Download PDF

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Publication number
WO2022086172A1
WO2022086172A1 PCT/KR2021/014710 KR2021014710W WO2022086172A1 WO 2022086172 A1 WO2022086172 A1 WO 2022086172A1 KR 2021014710 W KR2021014710 W KR 2021014710W WO 2022086172 A1 WO2022086172 A1 WO 2022086172A1
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WO
WIPO (PCT)
Prior art keywords
electronic device
sensor
pressure
button
button structure
Prior art date
Application number
PCT/KR2021/014710
Other languages
English (en)
Korean (ko)
Inventor
조정규
박형순
김태균
Original Assignee
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 삼성전자 주식회사 filed Critical 삼성전자 주식회사
Publication of WO2022086172A1 publication Critical patent/WO2022086172A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
    • H01H13/02—Details
    • H01H13/26—Snap-action arrangements depending upon deformation of elastic members
    • H01H13/48—Snap-action arrangements depending upon deformation of elastic members using buckling of disc springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
    • H01H13/02—Details
    • H01H13/12—Movable parts; Contacts mounted thereon
    • H01H13/14—Operating parts, e.g. push-button
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/23—Construction or mounting of dials or of equivalent devices; Means for facilitating the use thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/23—Construction or mounting of dials or of equivalent devices; Means for facilitating the use thereof
    • H04M1/236—Construction or mounting of dials or of equivalent devices; Means for facilitating the use thereof including keys on side or rear faces

Definitions

  • an electronic device for example, an electronic device having a button structure as an input device.
  • An electronic device refers to a device that performs a specific function according to a loaded program, such as a desktop/laptop computer, a tablet PC, an electronic notebook, a portable multimedia player, a mobile communication terminal, an image/sound device, a vehicle navigation device, from home appliances. it means. For example, these electronic devices may output stored information as sound or image.
  • portable electronic devices such as laptop computers, tablet PCs, electronic notebooks, portable multimedia players, and mobile communication terminals, generally include a display device and a battery.
  • a desktop computer or the like is provided with an input device such as a keyboard or a mouse, and a remote controller is sometimes provided for home appliances.
  • a touch pad replacing a mouse is used as an input device
  • an electronic device such as a mobile communication terminal, a microphone and a keypad are used as traditional input devices, and recently, an input device using a stylus pen is widely used.
  • a large-capacity touch screen panel is provided on the front side.
  • input through the front display device as well as side keys and central on/off keys are separately installed as physical button structures on the side or periphery of the electronic device to execute power on/off, input and cancel It is installed separately as a side key and a center on/off key on the side or center of the electronic device to execute the camera, control the volume, lock/unlock the display unit, and the like.
  • a touch input for recognizing a contact or proximity of a display unit and a mechanical input such as a physical button structure may coexist.
  • a button structure of a mechanical type such as a button key provided in an electronic device
  • it is formed around the periphery of the display device, for example, a bezel area or a side part of the electronic device.
  • This mechanical type button structure has a large number of components constituting it, so that the space for mounting the button structure reduces the slimness of the electronic device.
  • the display device provided to the electronic device recently has a very large proportion of the electronic device, and in particular, the recent display device may be provided to extend not only the front side of the electronic device but also the periphery of the front side, for example, a part of the side surface. . Accordingly, the mounting space of the mechanical type button structure mounted on the side of the display device is inevitably narrow, or it is not possible to provide a mounting space for the button structure, or due to the button structure, a space for bending the display device to the side may not be able to provide
  • An object of the present document is to provide a button structure in which a power button, a volume button, and a button for executing other functions are integrated into one structure in order to reduce the number of button structures that may be provided in an electronic device, and an electronic device including the same.
  • a button structure for preventing a malfunction and an electronic device including the same are provided.
  • an electronic device including a button structure, comprising: a front plate facing a first direction; a rear plate facing a second direction opposite to the first direction; and a housing comprising a side member enclosing a space between the front plate and the rear plate; and a button structure in which at least a portion is exposed to the outside of the housing through at least a portion of the side member, wherein the button structure includes: a button body exposed to the outside of the housing; a flange for preventing the button structure from being separated from the inside of the housing in a direction opposite to the button pressing direction; a substrate portion formed on the inner surface of the button structure in the space; at least one capacitance sensor disposed on the first surface of the substrate part; and at least one pressure-sensitive sensor disposed on the first surface of the substrate unit or on a second surface facing in a direction opposite to the first surface.
  • a button body in a button structure, a button body (button body); a flange substantially integrally connected to the button body and configured to prevent the button structure from being separated in a direction opposite to the button pressing direction; a substrate unit; at least one capacitance sensor disposed on a first surface of the substrate unit; a dome switch disposed on the second surface of the substrate part; and at least one pressure-sensitive sensor disposed on the first surface or the second surface of the substrate part.
  • a button structure incorporating a power button, a volume button, and a button for executing other functions (eg, Bixby) and an electronic device including the same are disclosed, which can be disposed in the electronic device.
  • functions eg, Bixby
  • the button structure is disposed on the side of the electronic device, it is possible to distinguish an unintentional input of the user in various use environments, such as a bag or pocket, or an environment in which the button structure is exposed to moisture.
  • various use environments such as a bag or pocket, or an environment in which the button structure is exposed to moisture.
  • FIG. 1 is a block diagram of an electronic device in a network environment, according to various embodiments of the present disclosure
  • FIG. 2 is a perspective view of an electronic device according to various embodiments disclosed herein.
  • FIG. 3 is a diagram illustrating a button structure according to various embodiments disclosed herein.
  • FIG. 4 is a perspective view of a button structure, in accordance with various embodiments disclosed herein.
  • FIG. 5 is a schematic diagram showing a cross-section of a button structure, according to various embodiments disclosed in this document.
  • FIG. 6 is a view showing a top view of the button body, according to various embodiments disclosed in this document.
  • FIG. 7 is a view illustrating a top view of a sensor layer according to various embodiments disclosed in this document.
  • FIG. 8 is a diagram illustrating a pressure-sensitive sensor according to various embodiments disclosed herein.
  • 9A is a diagram illustrating a method of adjusting a volume key to a button structure (up) according to an embodiment disclosed in this document.
  • 9B is a diagram illustrating a method of adjusting a volume key to a button structure according to an embodiment disclosed in this document.
  • 10A is a diagram illustrating a method for adjusting a volume key to a button structure (up) according to another embodiment disclosed in this document.
  • 10B is a diagram illustrating a method of adjusting a volume key to a button structure according to another embodiment disclosed in this document.
  • 11A is a diagram illustrating a method of double taping a function button on a button structure, according to an embodiment disclosed in this document.
  • 11B is a diagram illustrating a method of operating a power button on a button structure according to an embodiment disclosed in this document.
  • FIG. 12 is a schematic diagram illustrating a cross-section of a button structure according to another embodiment from FIG. 5 .
  • FIG. 1 is a block diagram of an electronic device 101 in a network environment 100 according to various embodiments.
  • an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or a second network 199 . It may communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 .
  • a first network 198 eg, a short-range wireless communication network
  • a second network 199 e.g., a second network 199
  • the electronic device 101 may communicate with the electronic device 104 through the server 108 .
  • the electronic device 101 includes a processor 120 , a memory 130 , an input module 150 , a sound output module 155 , a display module 160 , an audio module 170 , and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or an antenna module 197 may be included.
  • at least one of these components eg, the connection terminal 178
  • may be omitted or one or more other components may be added to the electronic device 101 .
  • some of these components are integrated into one component (eg, display module 160 ). can be
  • the processor 120 for example, executes software (eg, a program 140) to execute at least one other component (eg, a hardware or software component) of the electronic device 101 connected to the processor 120 . It can control and perform various data processing or operations. According to one embodiment, as at least part of data processing or operation, the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190 ) to the volatile memory 132 . may be stored in the volatile memory 132 , and may process commands or data stored in the volatile memory 132 , and store the result data in the non-volatile memory 134 .
  • software eg, a program 140
  • the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190 ) to the volatile memory 132 .
  • the volatile memory 132 may be stored in the volatile memory 132 , and may process commands or data stored in the volatile memory 132 , and store the result data in the non-volatile memory 134 .
  • the processor 120 is the main processor 121 (eg, a central processing unit or an application processor) or a secondary processor 123 (eg, a graphic processing unit, a neural network processing unit) a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor).
  • the main processor 121 e.g, a central processing unit or an application processor
  • a secondary processor 123 eg, a graphic processing unit, a neural network processing unit
  • NPU neural processing unit
  • an image signal processor e.g., a sensor hub processor, or a communication processor.
  • the main processor 121 e.g, a central processing unit or an application processor
  • a secondary processor 123 eg, a graphic processing unit, a neural network processing unit
  • NPU neural processing unit
  • an image signal processor e.g., a sensor hub processor, or a communication processor.
  • the main processor 121 e.g, a central processing unit or an application processor
  • a secondary processor 123
  • the auxiliary processor 123 is, for example, on behalf of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or the main processor 121 is active (eg, executing an application). ), together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states.
  • the co-processor 123 eg, an image signal processor or a communication processor
  • may be implemented as part of another functionally related component eg, the camera module 180 or the communication module 190. there is.
  • the auxiliary processor 123 may include a hardware structure specialized for processing an artificial intelligence model.
  • Artificial intelligence models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself on which artificial intelligence is performed, or may be performed through a separate server (eg, the server 108).
  • the learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but in the above example not limited
  • the artificial intelligence model may include a plurality of artificial neural network layers.
  • Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the above example.
  • the artificial intelligence model may include, in addition to, or alternatively, a software structure in addition to the hardware structure.
  • the memory 130 may store various data used by at least one component of the electronic device 101 (eg, the processor 120 or the sensor module 176 ).
  • the data may include, for example, input data or output data for software (eg, the program 140 ) and instructions related thereto.
  • the memory 130 may include a volatile memory 132 or a non-volatile memory 134 .
  • the program 140 may be stored as software in the memory 130 , and may include, for example, an operating system 142 , middleware 144 , or an application 146 .
  • the input module 150 may receive a command or data to be used in a component (eg, the processor 120 ) of the electronic device 101 from the outside (eg, a user) of the electronic device 101 .
  • the input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).
  • the sound output module 155 may output a sound signal to the outside of the electronic device 101 .
  • the sound output module 155 may include, for example, a speaker or a receiver.
  • the speaker can be used for general purposes such as multimedia playback or recording playback.
  • the receiver may be used to receive an incoming call. According to one embodiment, the receiver may be implemented separately from or as part of the speaker.
  • the display module 160 may visually provide information to the outside (eg, a user) of the electronic device 101 .
  • the display module 160 may include, for example, a control circuit for controlling a display, a hologram device, or a projector and a corresponding device.
  • the display module 160 may include a touch sensor configured to sense a touch or a pressure sensor configured to measure the intensity of a force generated by the touch.
  • the audio module 170 may convert a sound into an electric signal or, conversely, convert an electric signal into a sound. According to an embodiment, the audio module 170 acquires a sound through the input module 150 , or an external electronic device (eg, a sound output module 155 ) connected directly or wirelessly with the electronic device 101 . A sound may be output through the electronic device 102 (eg, a speaker or headphones).
  • an external electronic device eg, a sound output module 155
  • a sound may be output through the electronic device 102 (eg, a speaker or headphones).
  • the sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, user state), and generates an electrical signal or data value corresponding to the sensed state. can do.
  • the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.
  • the interface 177 may support one or more designated protocols that may be used by the electronic device 101 to directly or wirelessly connect with an external electronic device (eg, the electronic device 102 ).
  • the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • SD card interface Secure Digital Card
  • the connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102 ).
  • the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).
  • the haptic module 179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic sense.
  • the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
  • the camera module 180 may capture still images and moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
  • the power management module 188 may manage power supplied to the electronic device 101 .
  • the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).
  • PMIC power management integrated circuit
  • the battery 189 may supply power to at least one component of the electronic device 101 .
  • battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.
  • the communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). It can support establishment and communication performance through the established communication channel.
  • the communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication.
  • the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : It may include a LAN (local area network) communication module, or a power line communication module).
  • GNSS global navigation satellite system
  • a corresponding communication module among these communication modules is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (eg, legacy It may communicate with the external electronic device 104 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (eg, a telecommunication network such as a LAN or a WAN).
  • a first network 198 eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)
  • a second network 199 eg, legacy It may communicate with the external electronic device 104 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (eg, a telecommunication network such as a LAN or a WAN).
  • a telecommunication network
  • the wireless communication module 192 uses the subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199 .
  • the electronic device 101 may be identified or authenticated.
  • the wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, a new radio access technology (NR).
  • NR access technology includes high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency) -latency communications)).
  • eMBB enhanced mobile broadband
  • mMTC massive machine type communications
  • URLLC ultra-reliable and low-latency
  • the wireless communication module 192 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example.
  • a high frequency band eg, mmWave band
  • the wireless communication module 192 includes various technologies for securing performance in a high-frequency band, for example, beamforming, massive multiple-input and multiple-output (MIMO), all-dimensional multiplexing. It may support technologies such as full dimensional MIMO (FD-MIMO), an array antenna, analog beam-forming, or a large scale antenna.
  • the wireless communication module 192 may support various requirements specified in the electronic device 101 , an external electronic device (eg, the electronic device 104 ), or a network system (eg, the second network 199 ).
  • the wireless communication module 192 may include a peak data rate (eg, 20 Gbps or more) for realizing eMBB, loss coverage (eg, 164 dB or less) for realizing mMTC, or U-plane latency for realizing URLLC ( Example: downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less).
  • a peak data rate eg, 20 Gbps or more
  • loss coverage eg, 164 dB or less
  • U-plane latency for realizing URLLC
  • the antenna module 197 may transmit or receive a signal or power to the outside (eg, an external electronic device).
  • the antenna module 197 may include an antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern.
  • the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected from the plurality of antennas by, for example, the communication module 190 . can be selected. A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna.
  • other components eg, a radio frequency integrated circuit (RFIC)
  • RFIC radio frequency integrated circuit
  • the antenna module 197 may form a mmWave antenna module.
  • the mmWave antenna module comprises a printed circuit board, an RFIC disposed on or adjacent to a first side (eg, bottom side) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band); and a plurality of antennas (eg, an array antenna) disposed on or adjacent to a second side (eg, top or side) of the printed circuit board and capable of transmitting or receiving signals of the designated high frequency band. can do.
  • peripheral devices eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)
  • GPIO general purpose input and output
  • SPI serial peripheral interface
  • MIPI mobile industry processor interface
  • the command or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 .
  • Each of the external electronic devices 102 or 104 may be the same as or different from the electronic device 101 .
  • all or a part of operations executed in the electronic device 101 may be executed in one or more external electronic devices 102 , 104 , or 108 .
  • the electronic device 101 may perform the function or service itself instead of executing the function or service itself.
  • one or more external electronic devices may be requested to perform at least a part of the function or the service.
  • One or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 101 .
  • the electronic device 101 may process the result as it is or additionally and provide it as at least a part of a response to the request.
  • cloud computing distributed computing, mobile edge computing (MEC), or client-server computing technology may be used.
  • the electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing.
  • the external electronic device 104 may include an Internet of things (IoT) device.
  • Server 108 may be an intelligent server using machine learning and/or neural networks.
  • the external electronic device 104 or the server 108 may be included in the second network 199 .
  • the electronic device 101 may be applied to an intelligent service (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.
  • FIG. 2 is a perspective view of an electronic device according to various embodiments disclosed herein.
  • an electronic device 200 includes a first surface (or a front surface) 210A, a second surface (or a rear surface), and a space between the first surface 210A and the second surface. It may include a housing 210 including a side surface surrounding the space. In another embodiment (not shown), the housing may refer to a structure forming part of the first surface 210A, the second surface, and side surfaces of FIG. 2 .
  • the first surface 210A may be formed by a front plate 202 (eg, a glass plate including various coating layers, or a polymer plate) that is at least partially transparent.
  • the second surface may be formed by a substantially opaque back plate (not shown).
  • the rear plate may face in a direction opposite to that of the front plate.
  • the back plate may be formed, for example, by coated or tinted glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials.
  • the side surface is coupled to the front plate 202 and the rear plate, and may be formed by a side member (or "side bezel structure") 211 including a metal and/or a polymer.
  • the back plate and side member 211 are integrally formed and may include the same material (eg, a metal material such as aluminum).
  • the front plate 202 comprises two first regions extending seamlessly from the first surface 210A toward the rear plate, the long edge of the front plate 202 . (long edge) can be included at both ends.
  • the electronic device 200 includes at least one of a display 201 , audio modules 203 and 204 , a camera module 205 , a connector hole 106 , and a key input device 300 . can do.
  • the electronic device 200 may omit at least one of the components or additionally include other components.
  • other components may be a sensor module or a light emitting device.
  • the display 201 may be visually exposed, for example, through a substantial portion of the front plate 202 . In some embodiments, at least a portion of the display 201 may be exposed through the second surface 210A and the front plate 202 forming edge regions of the side surface.
  • the surface (or the front plate 202 ) of the housing 210 may include a screen display area formed as the display 201 is visually exposed.
  • the screen display area may include a front surface 210A and edge areas.
  • the display 201 may include, for example, a liquid crystal display (LCD), a light emitting diode (LED) display, an organic light emitting diode (OLED) display, or a microelectromechanical system (MEMS) display, or an electronic paper display.
  • the display 201 may display, for example, various contents (eg, text, image, video, icon, or symbol) to the user.
  • a recess or opening is formed in a part of the screen display area of the display 101, and the audio module 203, 204 is aligned with the recess or opening. , it may include at least one of a camera module 205, a sensor module, and a light emitting device. In another embodiment (not shown), at least one of audio modules 203 and 204 , a camera module 205 , a sensor module, and a light emitting device may be included on the rear surface of the screen display area of the display 201 . .
  • the display 201 includes a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a touch panel (eg digitizer) or placed adjacent to it.
  • the audio modules 203 and 204 may include a microphone hole 203 and a speaker hole 204 .
  • a microphone for acquiring an external sound may be disposed therein, and in some embodiments, a plurality of microphones may be disposed to detect the direction of the sound.
  • the speaker hole 204 may include an external speaker hole 204 and a receiver (not shown) hole for a call.
  • the speaker hole 204 and the microphone hole 203 may be implemented as a single hole, or a speaker may be included without the speaker hole 204 (eg, a piezo speaker).
  • the audio modules 203 and 204 are not limited to the above structure, and various design changes may be made, such as mounting only some audio modules or adding a new audio module, depending on the structure of the electronic device 200 .
  • the sensor module may generate an electrical signal or data value corresponding to an internal operating state of the electronic device 200 or an external environmental state.
  • the electronic device 200 may include a sensor module not shown, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, It may further include at least one of a humidity sensor and an illuminance sensor.
  • the sensor module (not shown) is not limited to the above structure, and the design may be changed in various ways, such as mounting only some sensor modules or adding a new sensor module, depending on the structure of the electronic device 200 .
  • the camera module 205 may include a first camera device 205 disposed on the first surface 210A of the electronic device 200 , and a second camera device and/or a flash disposed on the second surface of the electronic device 200 .
  • the camera devices may include one or more lenses, an image sensor, and/or an image signal processor.
  • the flash may include, for example, a light emitting diode or a xenon lamp.
  • Some camera devices may include wide-angle and/or telephoto lenses. In some embodiments, two or more lenses (infrared cameras, wide angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device 200 .
  • the camera module 205 is not limited to the above structure, and may be designed and changed in various ways, such as mounting only some camera modules or adding a new camera module, depending on the structure of the electronic device 200 .
  • the electronic device 200 may include a plurality of camera modules (eg, a dual camera or a triple camera) each having different properties (eg, angle of view) or functions.
  • a plurality of camera modules 205 including lenses having different angles of view may be configured, and the electronic device 200 performs a camera module ( 205) can be controlled to change the angle of view.
  • at least one of the plurality of camera modules 205 may be a wide-angle camera, and at least the other may be a telephoto camera.
  • at least one of the plurality of camera modules 205 may be a front camera, and at least the other may be a rear camera.
  • the plurality of camera modules 205 may include at least one of a wide-angle camera, a telephoto camera, and an IR (infrared) camera (eg, a time of flight (TOF) camera, a structured light camera).
  • IR infrared
  • the IR camera may be operated as at least a part of the sensor module.
  • the TOF camera may be operated as at least a part of a sensor module (not shown) for detecting the distance to the subject.
  • the light emitting device may provide, for example, state information of the electronic device 200 in the form of light.
  • the light emitting device may provide, for example, a light source that is interlocked with the operation of the camera module 205 .
  • the light emitting element may comprise, for example, an LED, an IR LED and/or a xenon lamp.
  • the camera module 205 and/or the sensor module are arranged to contact the external environment through designated areas of the display 201 and the front plate 202 in the internal space of the electronic device 200 .
  • the designated area may be an area in which pixels are not disposed in the display 201 .
  • the designated area may be an area in which pixels are disposed in the display 201 .
  • at least a portion of the designated area may overlap the camera module 205 and/or the sensor module.
  • some sensor modules may be arranged to perform their functions without being visually exposed through the front plate 202 in the internal space of the electronic device.
  • the connector hole 206 includes a first connector hole 206 that may receive a connector (eg, a USB connector) for transmitting and receiving power and/or data to and from an external electronic device, and/or an external electronic device and audio It may include a second connector hole (eg, earphone jack) capable of accommodating a connector for transmitting and receiving a signal.
  • a connector eg, a USB connector
  • earphone jack e.g, earphone jack
  • the pen input device 207 (eg, a stylus pen) is guided into the interior of the housing 210 through a hole formed in a side surface of the housing 210 to be inserted or detached, and to facilitate detachment. It can include buttons.
  • a separate resonance circuit is built in the pen input device 207 to interwork with a touch panel (eg, a digitizer) included in the electronic device 200 .
  • the pen input device 207 may include an electro-magnetic resonance (EMR) method, an active electrical stylus (AES) method, and an electric coupled resonance (ECR) method.
  • EMR electro-magnetic resonance
  • AES active electrical stylus
  • ECR electric coupled resonance
  • the key input device 300 (hereinafter, referred to as a 'button structure 300 ') may be disposed on a side surface of the housing 210 .
  • the electronic device 200 may not include some or all of the above-mentioned key input devices 300 , and the non-included key input device 300 may include a soft key or the like on the display 201 . It may be implemented in other forms.
  • the key input device 300 may include a sensor module (eg, a fingerprint sensor).
  • FIG 3 is a diagram illustrating a button structure 300 according to various embodiments disclosed herein.
  • 4 is a perspective view of a button structure 300 , in accordance with various embodiments disclosed herein.
  • the button structure 300 may include a button body 301 , a flange 302 , and a substrate 310 .
  • the present invention is not necessarily limited thereto, and one or more of the above-described components may be omitted or other components may be added.
  • the button structure 300 may be configured to further include a dome switch 340 .
  • the bracket 220 shown in FIG. 4 may be included as a component of the housing 210 rather than a component of the button structure 300 .
  • the button structure 300 may have a size and shape to be inserted into a button hole of an electronic device (eg, the electronic device 200 of FIG. 2 ).
  • the button structure 300 includes a button body 301 (or button top) that exposes at least a part of the electronic device 200 to the outside, and a flange 302 for preventing the button body from being drawn out outside the mounted position.
  • the button structure 300 may include a substrate part 310 formed on an inner surface of the button structure 300 .
  • the substrate part 310 may have an elongated shape to be electrically connectable to other electronic components inside the electronic device 200 .
  • the substrate unit 310 may correspond to the flexible substrate unit 310 .
  • a button body 301 may be disposed on one surface of the substrate part 310 , and a dome switch 340 may be mounted on the other surface thereof.
  • the button structure 300 is a space defined by a front plate (eg, the front plate 202 of FIG. 2 ), a back plate, and a side member (eg, the side member 211 of FIG. 2 ) of the electronic device 200 ). It may be disposed inside the seating groove of the side member within (eg, the space S of FIG. 5 to be described later).
  • the electronic device 200 supports the structure of the button structure 300 and includes a bracket ( 220) may be further included.
  • the bracket 220 may be formed of a non-metal and/or a metal material.
  • the electronic device 200 may further include a block member 341 .
  • the block member 341 may be disposed between the dome switch 340 and the bracket 220 to form a contact to the dome switch 340 .
  • the block member 341 may be supported by the bracket 220 even if the user applies a force to the button structure 300 to limit movement.
  • the electronic device 200 may further include a fingerprint sensor 350 .
  • the fingerprint sensor 350 may receive a touch signal and recognize a fingerprint input to a button to identify a user.
  • the fingerprint sensor 350 may be disposed in various positions.
  • the fingerprint sensor 350 may be disposed between the button body 301 and the substrate part 310 .
  • the fingerprint sensor 350 may be mounted on one side of the substrate 310 .
  • the fingerprint sensor 350 may be mounted on both sides of the substrate 310 .
  • the fingerprint sensor 350 may be integrated into the button structure 300 .
  • a fingerprint sensor 350 may be formed on one surface (eg, a surface in contact with the substrate 310 ) of the button body 301 of the button structure 300 .
  • the fingerprint sensor 350 may be formed on another surface (eg, a surface that a user directly touches) of the button body 301 of the button structure 300 .
  • at least one conductive line for connecting the fingerprint sensor 350 to the substrate unit 310 may be formed inside the button body 301 . In this case, the fingerprint sensor may directly receive a touch input from the user to recognize the fingerprint.
  • an optical fingerprint recognition sensor may be proposed.
  • An optical fingerprint recognition sensor using light may be proposed.
  • the optical fingerprint recognition sensor using light may detect an image corresponding to at least a portion of the user's fingerprint (eg, a ridge portion or a valley portion) by irradiating light to the user's finger.
  • a capacitive fingerprint recognition sensor may be proposed.
  • Information on the user's fingerprint can be obtained by detecting a change in capacitance for each electrode according to the curvature of the ridge or valley in contact with the fingerprint recognition sensor.
  • an ultrasonic fingerprint recognition sensor may be proposed.
  • the ultrasonic fingerprint recognition sensor may obtain information on the user's fingerprint by comparing the amount of ultrasonic waves received according to the curvature of the ridge or trough with a pre-stored value.
  • the substrate unit 310 may be formed of a flexible printed circuit board. In this case, it may include a first FPCB (310a) and a second FPCB (310b).
  • the first FPCB 310a according to an embodiment, a capacitance sensor (capacitance sensor 320 to be described later in FIG. 5) may be mounted, and the dome switch 340 is mounted on the second FPCB 310b.
  • a flexible portion 310c for connecting the first FPCB 310a and the second FPCB 310b may be further included between the first FPCB 310a and the second FPCB 310b. For example, at least a portion of the flexible portion 310c may be formed in a “U” shape.
  • the flexible portion 310c includes a portion formed in a “U” shape, it may be advantageous to reduce the overall length or volume of the substrate portion 310 .
  • the capacitance sensor and the dome switch 340 formed so as to face two different directions with respect to the substrate unit 310 can be electrically connected, and at different positions of the substrate unit 310 .
  • Electrical connection to the disposed electronic component eg, the electronic component 310d
  • the substrate 310 may be reinforced by a plate made of metal (eg, steel, aluminum, alloy, etc.), plastic, or glass fiber.
  • An adhesive member (not shown) for bonding between the first FPCB 310a and the second FPCB 310b may be disposed on one side of the substrate 310 . Including an adhesive member (not shown), it is possible to stably maintain the shape of the button structure 300 in which a plurality of parts are laminated and bonded. According to an embodiment, the adhesive member (not shown) may be a double-sided adhesive tape.
  • the dome switch 340 may be mounted on one surface of the substrate unit 310 , for example, the second FPCB 310b.
  • the dome switch 340 may include a dome sheet for providing a contact function and a dome switch case for mounting the dome sheet.
  • the dome switch 340 may include a switch electrode (not shown) disposed on the substrate unit 310 (eg, the second FPCB 310b) or a circuit unit provided in the dome switch case.
  • FIG. 5 is a schematic diagram illustrating a cross-section of a button structure 300 according to various embodiments disclosed in this document.
  • 6 is a view showing a top view of the button body, according to various embodiments disclosed in this document.
  • 7 is a diagram illustrating a pressure-sensitive sensor according to various embodiments disclosed herein.
  • the button structure 300 includes a button body 301 , a flange 302 , and a substrate part 310 , and is disposed on the first surface 310-1 of the substrate part 310 .
  • at least one capacitance sensor 320 , and a pressure-sensitive sensor 330 may be included.
  • the button structure 300 may further include a dome switch 340 disposed on the second surface 310 - 2 of the substrate part 310 .
  • the first surface 310-1 of the substrate part 310 may be parallel to a direction (eg, the X-axis direction) toward which the upper surface of the button body 301 (hereinafter, referred to as a 'button top') faces.
  • the second surface 310 - 2 of the substrate part 310 may face in a direction opposite to that of the first surface 310 - 1 .
  • the button body 301 has a plate shape, and its touch surface can be pressed by a user.
  • the button body 301 may further include a flange 302 extending radially from the side of the button top, and the flange 212 is the button assembly 200 in the opposite direction to the button pressing direction when the button is pressed. can be prevented
  • the substrate unit 310 may have a laminated structure that provides a comfortable click operation to the user and provides stability to the button structure 300 .
  • the substrate unit 310 may have a configuration in which a capacitance sensor 320 and a dome switch 340 are mounted on one surface and the other surface, respectively, as shown in FIG. 5 , but is not limited thereto. As previously shown in FIGS. 3 and 4 , the capacitance sensor 320 and the dome switch 340 may be mounted on the flexible printed circuit board.
  • the capacitance sensor 320 may be provided to detect a capacitance change amount corresponding to the user input in response to the user input input through the button body 301 . For example, when a user touches, approaches, or presses a surface of the button body 301 , a change in capacitance may occur in the capacitance sensor 320 . That is, by sensing the capacitance change amount, the user's touch, proximity, or press may be recognized.
  • the button structure 300 may further include a sensor layer 311 in which a capacitance sensor 320 is formed on the first surface 310-1 of the substrate part 310 .
  • the sensor layer 311 may include a plurality of capacitance sensors 320 , and the plurality of capacitance sensors 320 may be disposed to be spaced apart from each other at regular intervals in one direction.
  • the sensor layer 311 may be formed of an insulating material to secure a predetermined distance between adjacent sensors 320 .
  • a spacer 312 for forming a gap d between the button body 301 and the sensor layer 311 may be formed on the sensor layer 311 .
  • the spacer 312 may be provided to fix or elastically support the button body 301 and/or the flange 302 .
  • the spacer 312 may be disposed between the flange 302 and the sensor layer 311 to fix the button body 301 and the sensor layer 311 to be spaced apart from each other.
  • the spacer 312 may be made of a silicone material or a urethane material.
  • the pressure-sensitive sensor 330 is a sensor for detecting micro-displacement when a user touches, and may be a sensor formed in a dome type.
  • the pressure-sensitive sensor 330 may include a metal dome 331 .
  • the pressure-sensitive sensor 330 may further include a dome sheet surrounding the metal dome.
  • the dome sheet may have an exterior skin, such as a exterior member made of rubber, a plastic such as polyethylene terephthalate, or any other suitable material, according to various embodiments.
  • the metal dome may be formed of a conductive material with gold or other suitable conductive material attached to the underside of the exterior skin.
  • the metal dome may be formed to convexly protrude upward from the substrate part 310 .
  • the metal dome may be soldered on the upper surface of the substrate part 310 .
  • the dome-type pressure sensor 330 may receive a pressing force from the button body 301 .
  • the shape of the dome may collapse.
  • the metal dome may be a hemispherical variable dome in which the pressure sensor has a convex center, and the shape is changed according to the pressure, and the shape is restored when the pressure is released.
  • the dome-type pressure-sensitive sensor 330 may be configured to output a continuously variable capacitance value as the shape of the dome collapses. For example, when the user presses the button structure 300 and the metal dome 331 is pressed, a minute change in the shape of the dome is sensed and a minute displacement according to a user input may be output.
  • the substrate 310 may further include a circuit for detecting a change in capacitance of the capacitance sensor 320 and the pressure-sensitive sensor 330 .
  • a transmission pattern and a reception pattern for detecting a capacitance value that varies according to the collapse of the shape of the metal dome 331 of the pressure-sensitive sensor 330 are formed on the substrate 310 or the sensor layer 311 . can be
  • the pressure-sensitive sensor 330 may be formed on the first surface 310-1 of the substrate part 310 and disposed adjacent to the capacitance sensor 320 .
  • the pressure-sensitive sensor 330 As the pressure-sensitive sensor 330 is disposed adjacent to the capacitance sensor 320 , along with the detection of a capacitance value using the capacitance sensor 320 for a user's touch input, the pressure-sensitive sensor 330 according to the user input It can measure minute displacement.
  • FIG 8 is a view illustrating a top view of the sensor layer 311 according to various embodiments disclosed herein.
  • a plurality of capacitance sensors 320 and a plurality of pressure-sensitive sensors 330 are alternately disposed on the first surface 310-1 of the substrate part 310 in one direction.
  • the one direction may mean a longitudinal direction (eg, a direction parallel to the Y-axis) of the button body 301 .
  • the capacitance value is sensed using the capacitance sensor 320 , and fine according to the user input by the pressure-sensitive sensor 330 . Displacement can be measured more precisely.
  • the first capacitance sensor 320 is disposed at the first position (1) of the sensor layer 311, the first pressure-sensitive sensor 330 is disposed at the second position (2), and the third position (3)
  • the second capacitance sensor 320 is disposed in the , the second pressure-sensitive sensor 330 is disposed at the fourth position (4), and the third capacitance sensor 330 is sequentially disposed at the fifth location (5). there is.
  • 9A is a diagram illustrating a method of adjusting a volume key in the button structure 300 according to an embodiment disclosed in this document.
  • 9B is a diagram illustrating a method of adjusting a volume key in the button structure 300 according to an embodiment disclosed in this document.
  • 10A is a diagram illustrating a method of adjusting a volume key in the button structure 300 according to another embodiment disclosed in this document.
  • 10B is a diagram illustrating a method of adjusting a volume key in the button structure 300 according to another embodiment disclosed in this document.
  • the plurality of capacitance sensors 320 and the plurality of pressure-sensitive sensors 330 described above through the embodiment shown in FIGS. 5 and 8 are provided on the first surface of the substrate part 310 .
  • the button structure 300 is shown when alternately arranged with each other toward one direction on the top.
  • a variable capacitance value output through the capacitance sensor 320 for the operation of the user pressing one end of the button body 301 and the operation of pressing the other end of the button body 302 . can be distinguished using
  • the operation of the user sliding the button body 301 in one direction and the operation of sliding the button body 302 in the other direction are output through the capacitance sensor 320 . It can be distinguished by using the variable capacitance value.
  • 11A is a diagram illustrating a method of double tapping a function button on a button structure 300 according to an embodiment disclosed in this document.
  • 11B is a diagram illustrating a method of operating a power button on a button structure according to an embodiment disclosed in this document.
  • the plurality of capacitance sensors 320 and the plurality of pressure-sensitive sensors 330 described above through the embodiment shown in FIGS. 5 and 8 are alternately disposed on the first surface of the substrate part 310 in one direction toward each other.
  • the button structure 300 when disposed, it is possible to distinguish between a light tapping action applied to the button structure 300 and a strong pressing operation.
  • the light tapping operation of FIG. 11A may be an operation of activating a function such as Bixby
  • the strong pressing operation of FIG. 11B may be an operation of activating power by pressing the dome switch 340 .
  • FIG. 12 is a schematic diagram illustrating a cross-section of the button structure 300 according to another embodiment from FIG. 5 .
  • the button structure 300 includes a button body 301 and a flange 302 , a substrate portion 310 , and is disposed on the first surface 310-1 of the substrate portion 310 , It may include at least one capacitance sensor 320 and a pressure-sensitive sensor 330 disposed on the second surface 310 - 2 of the substrate part 310 .
  • the button structure 300 may further include a dome switch 340 disposed on the second surface 310 - 2 of the substrate unit 310 .
  • the embodiment of FIG. 12 Only the capacitance sensor 320 may be disposed on the first surface 310 - 1 of the substrate 310 , and the pressure-sensitive sensor 330 may be disposed on the second surface 310 - 2 of the substrate 320 . . According to an embodiment, for example, the first position (1), the second position (2), and the third position (3) of the sensor layer 311 provided on the first surface 310-1 of the substrate part 310 . ), the capacitance sensors 320 may be disposed at the fourth position (4) and the fifth position (5).
  • the pressure-sensitive sensor 330 may be disposed on the second surface 310 - 2 of the substrate part 310 .
  • a plurality of pressure sensors 330 may be provided, and may be respectively disposed at the sixth position (6) and the seventh position (7) of the second surface 310 - 2 of the substrate part 310 .
  • the sixth position (6) may correspond to the second position (2)
  • the seventh position (7) may correspond to the fourth position (4).
  • the electronic device may have various types of devices.
  • the electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device.
  • a portable communication device eg, a smart phone
  • a computer device e.g., a smart phone
  • a portable multimedia device e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a wearable device e.g., a smart bracelet
  • a home appliance device e.g., a home appliance
  • first, second, or first or second may be used simply to distinguish the element from other elements in question, and may refer to elements in other aspects (e.g., importance or order) is not limited. It is said that one (eg, first) component is “coupled” or “connected” to another (eg, second) component, with or without the terms “functionally” or “communicatively”. When referenced, it means that one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.
  • module used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as, for example, logic, logic block, component, or circuit.
  • a module may be an integrally formed part or a minimum unit or a part of the part that performs one or more functions.
  • the module may be implemented in the form of an application-specific integrated circuit (ASIC).
  • ASIC application-specific integrated circuit
  • one or more instructions stored in a storage medium may be implemented as software (eg, the program 140) including
  • a processor eg, processor 120
  • a device eg, electronic device 101
  • the one or more instructions may include code generated by a compiler or code executable by an interpreter.
  • the device-readable storage medium may be provided in the form of a non-transitory storage medium.
  • 'non-transitory' only means that the storage medium is a tangible device and does not contain a signal (eg, electromagnetic wave), and this term refers to the case where data is semi-permanently stored in the storage medium and It does not distinguish between temporary storage cases.
  • a signal eg, electromagnetic wave
  • the method according to various embodiments disclosed in this document may be provided as included in a computer program product.
  • Computer program products may be traded between sellers and buyers as commodities.
  • the computer program product is distributed in the form of a machine-readable storage medium (eg compact disc read only memory (CD-ROM)), or via an application store (eg Play Store TM ) or on two user devices ( It can be distributed online (eg download or upload), directly between smartphones (eg smartphones).
  • a part of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium such as a memory of a server of a manufacturer, a server of an application store, or a relay server.
  • each component (eg, module or program) of the above-described components may include a singular or a plurality of entities, and some of the plurality of entities may be separately disposed in other components. there is.
  • one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added.
  • a plurality of components eg, a module or a program
  • the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. .
  • operations performed by a module, program, or other component are executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations are executed in a different order, or omitted. or one or more other operations may be added.
  • an electronic device including a button structure (eg, the button structure 300 of FIG. 5 ), a first direction (eg, the electronic device 200 of FIG. 2 ) : a front plate (eg, the front plate 202 of FIG. 2 ) facing the first direction 210A of FIG. 2 ) and a rear plate facing a second direction opposite to the first direction; and a housing (eg, the housing of FIG. 2 ) including a side member (eg, the side member 211 of FIG. 2 ) surrounding the space (eg, the space S of FIG. 5 ) between the front plate and the rear plate.
  • a button structure eg, the button structure 300 of FIG. 5
  • a first direction eg, the electronic device 200 of FIG. 2
  • a front plate eg, the front plate 202 of FIG. 2
  • a rear plate facing a second direction opposite to the first direction
  • a housing eg, the housing of FIG. 2
  • a side member eg, the side member 211 of FIG
  • a flange eg, the flange 302 in FIG. 5
  • a substrate portion eg, the substrate portion 310 of FIG. 5
  • at least one capacitance sensor eg, the capacitance sensor 320 of FIG.
  • the substrate unit eg, the first surface 310-1 of FIG. 5
  • at least one pressure-sensitive sensor eg, the pressure-sensitive sensor 330 of FIG. 5 disposed on the first surface of the substrate part or on a second surface facing in a direction opposite to the first surface.
  • the pressure-sensitive sensor may be formed in a dome type.
  • the pressure-sensitive sensor may be a hemispherical variable dome having a convex center, changing a shape according to pressure, and restoring the shape when the pressure is released.
  • the pressure-sensitive sensor may be a capacitive pressure-sensitive sensor that continuously changes capacitance by changing according to a touch on the button body.
  • the pressure-sensitive sensor may be formed on the first surface of the substrate part and disposed adjacent to the capacitance sensor.
  • a plurality of capacitance sensors and a plurality of pressure-sensitive sensors may be alternately disposed on the first surface in one direction.
  • the capacitance sensor 320 includes a plurality of capacitance sensors 320 , and the plurality of capacitance sensors 320 include a sensor layer 311 disposed on the first surface of the substrate part. It may be arranged to be spaced apart at regular intervals along one direction.
  • a spacer for forming a gap between the button body and the sensor layer 311 may be formed on the sensor layer 311 .
  • a fingerprint recognition sensor 350 may be further included.
  • the substrate may further include a dome switch (eg, dome switch 340 of FIG. 5 ) disposed on the second surface (eg, second surface 310 - 2 of FIG. 5 ).
  • a dome switch eg, dome switch 340 of FIG. 5
  • the second surface eg, second surface 310 - 2 of FIG. 5
  • the bracket 220 may further include a block member 341 formed on one surface for contacting the dome switch.
  • the pressure-sensitive sensor may be formed on the second surface of the substrate part and disposed adjacent to the dome switch.
  • the first block member 341 for contacting the dome switch and the second block member 342 for contacting the pressure sensor may further include a bracket 220 formed on one surface thereof. .
  • the button body (button body, 301); a flange 302 connected substantially integrally with the button body and preventing the button structure from being separated in a direction opposite to the button pressing direction; substrate 310; at least one capacitance sensor 320 disposed on the first surface of the substrate part; a dome switch 340 disposed on the second surface of the substrate part; and at least one pressure-sensitive sensor 330 disposed on the first surface or the second surface of the substrate part.
  • the pressure-sensitive sensor may provide a button structure, characterized in that formed in a dome type.
  • the pressure-sensitive sensor may provide a button structure that is a hemispherical variable dome in which the center is convex, the shape is changed according to the pressure, and the shape is restored when the pressure is released.
  • the pressure-sensitive sensor may provide a button structure that is a capacitive pressure-sensitive sensor that varies according to a touch on the button body to continuously change the capacitance.
  • the pressure-sensitive sensor may be formed on the first surface of the substrate part and disposed adjacent to the capacitance sensor.
  • a plurality of capacitance sensors and a plurality of pressure-sensitive sensors may be alternately disposed on the first surface in one direction.
  • the capacitance sensor 320 includes a plurality of capacitance sensors 320 , and the plurality of capacitance sensors 320 include a sensor layer 311 disposed on the first surface of the substrate part. It may be arranged to be spaced apart at regular intervals along one direction.
  • the pressure-sensitive sensor may be formed on the second surface of the substrate part and disposed adjacent to the dome switch.

Abstract

Divers ‌modes‌ ‌de‌ réalisation de ‌la‌ présente invention concernent un dispositif électronique, par exemple, un dispositif électronique, qui est un dispositif d'entrée, comprenant une structure de bouton. Selon divers modes de réalisation, il est fourni un dispositif électronique comprenant une structure de bouton, le dispositif électronique comprenant : un boîtier comprenant une plaque avant faisant face à une première direction, une plaque arrière faisant face à une seconde direction qui est opposée à la première direction, et un élément de surface latérale entourant l'espace entre la plaque avant et la plaque arrière ; et une structure de bouton ayant au moins une partie exposée à l'extérieur du boîtier à travers au moins une partie de l'élément de surface latérale. La structure de bouton comprend : un corps de bouton exposé à l'extérieur du boîtier ; une bride, qui est dans le boîtier, pour empêcher la structure de bouton d'être libérée dans la direction qui est opposée à une direction de pression de bouton ; une partie de substrat formée sur la surface interne de la structure de bouton dans l'espace ; au moins un capteur capacitif disposé sur une première surface de la partie de substrat ; et au moins un capteur sensible à la pression disposé sur la première surface de la partie de substrat ou une seconde surface qui est en vis-à-vis de la première surface.
PCT/KR2021/014710 2020-10-20 2021-10-20 Structure de bouton et dispositif électronique la comprenant WO2022086172A1 (fr)

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Application Number Priority Date Filing Date Title
KR10-2020-0136127 2020-10-20
KR1020200136127A KR20220052136A (ko) 2020-10-20 2020-10-20 버튼 구조물 및 이를 포함하는 전자 장치

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Citations (5)

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KR100472429B1 (ko) * 2002-10-18 2005-03-10 삼성전자주식회사 휴대용 무선단말기의 키패드 어셈블리 및 그 제어방법
KR20060000006U (ko) * 2006-10-09 2006-10-27 임종훈 플렉서블 디스플레이 스크린 장치를 구비한 터치스크린을구비한 디지털 카메라.
KR20150031968A (ko) * 2013-09-17 2015-03-25 주식회사 팬택 단말기
KR101666866B1 (ko) * 2015-12-29 2016-10-17 주식회사 하이딥 스마트폰
KR20180113218A (ko) * 2016-08-30 2018-10-15 애플 인크. 전자 디바이스를 위한 센서 어셈블리

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100472429B1 (ko) * 2002-10-18 2005-03-10 삼성전자주식회사 휴대용 무선단말기의 키패드 어셈블리 및 그 제어방법
KR20060000006U (ko) * 2006-10-09 2006-10-27 임종훈 플렉서블 디스플레이 스크린 장치를 구비한 터치스크린을구비한 디지털 카메라.
KR20150031968A (ko) * 2013-09-17 2015-03-25 주식회사 팬택 단말기
KR101666866B1 (ko) * 2015-12-29 2016-10-17 주식회사 하이딥 스마트폰
KR20180113218A (ko) * 2016-08-30 2018-10-15 애플 인크. 전자 디바이스를 위한 센서 어셈블리

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