WO2022039435A1 - Boîtier et dispositif électronique le comprenant - Google Patents

Boîtier et dispositif électronique le comprenant Download PDF

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Publication number
WO2022039435A1
WO2022039435A1 PCT/KR2021/010621 KR2021010621W WO2022039435A1 WO 2022039435 A1 WO2022039435 A1 WO 2022039435A1 KR 2021010621 W KR2021010621 W KR 2021010621W WO 2022039435 A1 WO2022039435 A1 WO 2022039435A1
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WIPO (PCT)
Prior art keywords
thin film
electronic device
film layer
curvature
concave
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PCT/KR2021/010621
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English (en)
Korean (ko)
Inventor
임창묵
김영삼
김진정
서수영
김현범
김형민
서지윤
Original Assignee
삼성전자 주식회사
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Publication of WO2022039435A1 publication Critical patent/WO2022039435A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0017—Casings, cabinets or drawers for electric apparatus with operator interface units
    • H05K5/0018—Casings, cabinets or drawers for electric apparatus with operator interface units having an electronic display
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
    • G02B1/11—Anti-reflection coatings
    • G02B1/118—Anti-reflection coatings having sub-optical wavelength surface structures designed to provide an enhanced transmittance, e.g. moth-eye structures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
    • G02B1/14—Protective coatings, e.g. hard coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0086—Casings, cabinets or drawers for electric apparatus portable, e.g. battery operated apparatus

Definitions

  • Various embodiments of the present disclosure relate to a case and an electronic device including the same.
  • An electronic device is a device that performs a specific function according to a loaded program, such as an electronic notebook, a portable multimedia player, a mobile communication terminal, a tablet PC, an image/audio device, a desktop/laptop computer, and a vehicle navigation device from a home appliance can mean For example, these electronic devices may output stored information as sound or image.
  • various functions may be mounted in one electronic device such as a mobile communication terminal in recent years.
  • entertainment functions such as games
  • multimedia functions such as music/video playback
  • communication and security functions such as mobile banking
  • functions such as schedule management and electronic wallets are being integrated into one electronic device.
  • Such electronic devices are being miniaturized so that users can conveniently carry them.
  • a multilayer thin film using the interference effect of a high refractive index material and a low refractive index material may be used.
  • the antireflection film formed of the multilayer thin film may require a lot of coating time and cost to form a thick thin film.
  • the surface hardness may be reduced. Reduced surface hardness can cause peeling or damage of the thin film.
  • the antireflection film formed as a multilayer thin film has an antireflection effect only for a specific viewing (night) angle (eg, based on 90 degrees) depending on the refractive index and coating thickness, and the antireflection effect decreases as the viewing (night) angle increases. and visibility may be reduced.
  • an anti-reflection (AR) film used in the case may be configured as a single layer, thereby reducing manufacturing time and cost.
  • the anti-reflection film used for the case uses a single high-hardness thin film layer (eg, a single-layer structure), it is possible to prevent damage to the thin film and lower the visual visibility of the damaged surface.
  • a single high-hardness thin film layer eg, a single-layer structure
  • the anti-reflection film used in the case may form a concave-convex structure pattern on a portion of the high-hardness single thin film layer to improve display visibility.
  • the anti-contamination layer is disposed on a surface on which the concave-convex structure pattern is formed on a part of the high-hardness single thin film layer of the anti-reflection film used in the case, the wear resistance of the anti-pollution layer may be improved.
  • An electronic device may include a display, a transparent plate disposed on the display, and a single thin film layer disposed on one surface of the transparent plate.
  • the thin film layer includes a first thin film region having a hardness equal to or greater than the transparent plate hardness and forming a first specified thickness, and a second thin film having a second specified thickness formed on the first thin film region and including a concave-convex structure pattern having a curvature. It may contain areas.
  • An electronic device includes a case that forms at least a part of an exterior of the electronic device, a battery disposed in an inner space of the case, and a battery disposed in the inner space and transmits information to the outside It may include a display for displaying.
  • the case includes a glass plate disposed on the display, a thin film layer disposed on one surface of the glass plate, in which an uneven structure pattern having a curvature is formed in an upper region facing the opposite side of the glass plate, and contamination disposed on the thin film layer It may include a protective layer for prevention.
  • a case according to various embodiments of the present disclosure includes a glass plate, a thin film layer disposed on one surface of the glass plate, a first thin film region having a hardness greater than or equal to the glass plate hardness, and a dry or wet etching process on the first thin film region It may include a thin film layer formed by and including a second thin film region including a concave-convex structure pattern having a curvature, and an anti-contamination layer disposed on the thin film layer.
  • the case of the electronic device according to various embodiments of the present disclosure may include an anti-reflection (AR) film having a single-layer structure.
  • AR anti-reflection
  • the electronic device uses a single high-hardness thin film layer (eg, a single-layer structure), it is possible to prevent damage to the thin film and lower the visual visibility of the damaged surface.
  • a single high-hardness thin film layer eg, a single-layer structure
  • an anti-reflection effect and display visibility may be improved by forming a concave-convex structure pattern on a portion of the high-hardness single thin film layer.
  • a protective layer may be coated on a portion of the high-hardness single thin film layer on the concave-convex structure pattern.
  • Surface contact of the protective layer is increased by the concave-convex structure pattern, so that mechanical adhesion of the protective layer is improved, and thus, anti fingerprint (AF) performance can be improved.
  • AF anti fingerprint
  • FIG. 1 is a block diagram of an electronic device in a network environment, according to various embodiments.
  • FIG. 2 is a front perspective view of an electronic device, according to various embodiments of the present disclosure.
  • FIG. 3 is a rear perspective view of an electronic device, according to various embodiments of the present disclosure.
  • FIG. 4 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure.
  • FIG. 5 is a cross-sectional view illustrating a case forming at least a portion of a housing of an electronic device according to one of various embodiments of the present disclosure
  • FIG. 6 is a flowchart illustrating a method of manufacturing a case forming at least a portion of a housing of an electronic device, according to another one of various embodiments of the present disclosure.
  • FIG. 7 is a schematic diagram schematically illustrating a method of manufacturing a case forming at least a portion of a housing of an electronic device according to another one of various embodiments of the present disclosure
  • FIG. 8 is a cross-sectional view schematically illustrating a coupling relationship between a thin film layer and a protective layer in a case forming at least a portion of a housing of an electronic device according to one of various embodiments of the present disclosure.
  • 9A is a view illustrating peeling off a case (eg, a thin film layer having a single-layer structure) forming at least a portion of a housing of an electronic device according to one of various embodiments of the present disclosure
  • 9B is a view illustrating peeling off a case (eg, a thin film layer having a multi-layer structure) forming at least a portion of a housing of a general electronic device.
  • a case eg, a thin film layer having a multi-layer structure
  • 10A is a cross-sectional view schematically illustrating a path through which light is incident in a case forming at least a portion of a housing of an electronic device according to one of various embodiments of the present disclosure
  • 10B is a graph illustrating an effect of improving reflectance according to a viewing angle in a case forming at least a part of a housing of an electronic device according to one of various embodiments of the present disclosure
  • FIG. 1 is a block diagram of an electronic device in a network environment, according to various embodiments of the present disclosure
  • an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or a second network 199 . It may communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 .
  • a first network 198 eg, a short-range wireless communication network
  • a second network 199 e.g., a second network 199 . It may communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 .
  • the electronic device 101 includes a processor 120 , a memory 130 , an input module 150 , a sound output module 155 , a display module 160 , an audio module 170 , and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or an antenna module 197 may be included.
  • at least one of these components eg, the connection terminal 178
  • may be omitted or one or more other components may be added to the electronic device 101 .
  • some of these components are integrated into one component (eg, display module 160 ). can be
  • the processor 120 for example, executes software (eg, the program 140 ) to execute at least one other component (eg, a hardware or software component) of the electronic device 101 connected to the processor 120 . It can control and perform various data processing or operations. According to one embodiment, as at least part of data processing or operation, the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190 ) to the volatile memory 132 . may be stored in the volatile memory 132 , and may process commands or data stored in the volatile memory 132 , and store the result data in the non-volatile memory 134 .
  • software eg, the program 140
  • the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190 ) to the volatile memory 132 .
  • the volatile memory 132 may be stored in the volatile memory 132 , and may process commands or data stored in the volatile memory 132 , and store the result data in the non-volatile memory 134 .
  • the processor 120 is the main processor 121 (eg, a central processing unit or an application processor), or a secondary processor 123 (eg, a graphic processing unit, a neural network processing unit) capable of operating independently or together with the main processor 121 .
  • NPU neural processing unit
  • image signal processor sensor hub processor, or communication processor
  • the main processor 121 uses less power than the main processor 121 or is set to be specialized for a specified function.
  • the auxiliary processor 123 may be implemented separately from or as a part of the main processor 121 .
  • the auxiliary processor 123 is, for example, on behalf of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or the main processor 121 is active (eg, executing an application). ), together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states.
  • the co-processor 123 eg, an image signal processor or a communication processor
  • may be implemented as part of another functionally related component eg, the camera module 180 or the communication module 190. there is.
  • the auxiliary processor 123 may include a hardware structure specialized for processing an artificial intelligence model.
  • Artificial intelligence models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself on which artificial intelligence is performed, or may be performed through a separate server (eg, the server 108).
  • the learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but in the above example not limited
  • the artificial intelligence model may include a plurality of artificial neural network layers.
  • Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the above example.
  • the artificial intelligence model may include, in addition to, or alternatively, a software structure in addition to the hardware structure.
  • the memory 130 may store various data used by at least one component of the electronic device 101 (eg, the processor 120 or the sensor module 176 ).
  • the data may include, for example, input data or output data for software (eg, the program 140 ) and instructions related thereto.
  • the memory 130 may include a volatile memory 132 or a non-volatile memory 134 .
  • the program 140 may be stored as software in the memory 130 , and may include, for example, an operating system 142 , middleware 144 , or an application 146 .
  • the input module 150 may receive a command or data to be used in a component (eg, the processor 120 ) of the electronic device 101 from the outside (eg, a user) of the electronic device 101 .
  • the input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).
  • the sound output module 155 may output a sound signal to the outside of the electronic device 101 .
  • the sound output module 155 may include, for example, a speaker or a receiver.
  • the speaker can be used for general purposes such as multimedia playback or recording playback.
  • the receiver may be used to receive an incoming call. According to one embodiment, the receiver may be implemented separately from or as part of the speaker.
  • the display module 160 may visually provide information to the outside (eg, a user) of the electronic device 101 .
  • the display module 160 may include, for example, a control circuit for controlling a display, a hologram device, or a projector and a corresponding device.
  • the display module 160 may include a touch sensor configured to sense a touch or a pressure sensor configured to measure the intensity of a force generated by the touch.
  • the audio module 170 may convert a sound into an electric signal or, conversely, convert an electric signal into a sound. According to an embodiment, the audio module 170 acquires a sound through the input module 150 or an external electronic device (eg, a sound output module 155 ) directly or wirelessly connected to the electronic device 101 . The sound may be output through the electronic device 102 (eg, a speaker or headphones).
  • an external electronic device eg, a sound output module 155
  • the sound may be output through the electronic device 102 (eg, a speaker or headphones).
  • the sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, user state), and generates an electrical signal or data value corresponding to the sensed state. can do.
  • the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.
  • the interface 177 may support one or more specified protocols that may be used by the electronic device 101 to directly or wirelessly connect with an external electronic device (eg, the electronic device 102 ).
  • the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
  • the connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102 ).
  • the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).
  • the haptic module 179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic sense.
  • the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
  • the camera module 180 may capture still images and moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
  • the power management module 188 may manage power supplied to the electronic device 101 .
  • the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).
  • PMIC power management integrated circuit
  • the battery 189 may supply power to at least one component of the electronic device 101 .
  • battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.
  • the communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). It can support establishment and communication performance through the established communication channel.
  • the communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication.
  • the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : It may include a LAN (local area network) communication module, or a power line communication module).
  • GNSS global navigation satellite system
  • a corresponding communication module among these communication modules is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (eg, legacy It may communicate with an external electronic device through a cellular network, a 5G network, a next-generation communication network, the Internet, or a telecommunication network such as a computer network (eg, LAN or WAN).
  • a first network 198 eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)
  • a second network 199 eg, legacy It may communicate with an external electronic device through a cellular network, a 5G network, a next-generation communication network, the Internet, or a telecommunication network such as a computer network (eg, LAN or WAN).
  • a telecommunication network such as a computer network (eg, LAN
  • the wireless communication module 192 uses the subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199 .
  • the electronic device 101 may be identified or authenticated.
  • the wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, a new radio access technology (NR).
  • NR access technology includes high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency) -latency communications)).
  • eMBB enhanced mobile broadband
  • mMTC massive machine type communications
  • URLLC ultra-reliable and low-latency
  • the wireless communication module 192 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example.
  • a high frequency band eg, mmWave band
  • the wireless communication module 192 includes various technologies for securing performance in a high-frequency band, for example, beamforming, massive multiple-input and multiple-output (MIMO), all-dimensional multiplexing. It may support technologies such as full dimensional MIMO (FD-MIMO), an array antenna, analog beam-forming, or a large scale antenna.
  • the wireless communication module 192 may support various requirements specified in the electronic device 101 , an external electronic device (eg, the electronic device 104 ), or a network system (eg, the second network 199 ).
  • the wireless communication module 192 may include a peak data rate (eg, 20 Gbps or more) for realizing eMBB, loss coverage (eg, 164 dB or less) for realizing mMTC, or U-plane latency for realizing URLLC ( Example: downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less).
  • a peak data rate eg, 20 Gbps or more
  • loss coverage eg, 164 dB or less
  • U-plane latency for realizing URLLC
  • the antenna module 197 may transmit or receive a signal or power to the outside (eg, an external electronic device).
  • the antenna module may include an antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern.
  • the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected from the plurality of antennas by, for example, the communication module 190 . can be selected. A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna.
  • other components eg, a radio frequency integrated circuit (RFIC)
  • RFIC radio frequency integrated circuit
  • the antenna module 197 may form a mmWave antenna module.
  • the mmWave antenna module comprises a printed circuit board, an RFIC disposed on or adjacent to a first side (eg, bottom side) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band); and a plurality of antennas (eg, an array antenna) disposed on or adjacent to a second side (eg, top or side) of the printed circuit board and capable of transmitting or receiving signals of the designated high frequency band. can do.
  • peripheral devices eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)
  • GPIO general purpose input and output
  • SPI serial peripheral interface
  • MIPI mobile industry processor interface
  • the command or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 .
  • Each of the external electronic devices 102 or 104 may be the same as or different from the electronic device 101 .
  • all or part of the operations performed by the electronic device 101 may be executed by one or more external devices among the external electronic devices 102 , 104 , or 108 .
  • the electronic device 101 may perform the function or service itself instead of executing the function or service itself.
  • one or more external electronic devices may be requested to perform at least a part of the function or the service.
  • One or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 101 .
  • the electronic device 101 may process the result as it is or additionally and provide it as at least a part of a response to the request.
  • cloud computing distributed computing, mobile edge computing (MEC), or client-server computing technology may be used.
  • the electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing.
  • the external electronic device 104 may include an Internet of things (IoT) device.
  • Server 108 may be an intelligent server using machine learning and/or neural networks.
  • the external electronic device 104 or the server 108 may be included in the second network 199 .
  • the electronic device 101 may be applied to an intelligent service (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.
  • the electronic device may have various types of devices.
  • the electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device.
  • a portable communication device eg, a smart phone
  • a computer device e.g., a smart phone
  • a portable multimedia device e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a wearable device e.g., a smart bracelet
  • a home appliance device e.g., a home appliance
  • first”, “second”, or “first” or “second” may simply be used to distinguish the component from other components in question, and may refer to components in other aspects (e.g., importance or order) is not limited. It is said that one (eg, first) component is “coupled” or “connected” to another (eg, second) component, with or without the terms “functionally” or “communicatively”. When referenced, it means that one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.
  • module used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as, for example, logic, logic block, component, or circuit.
  • a module may be an integrally formed part or a minimum unit or a part of the part that performs one or more functions.
  • the module may be implemented in the form of an application-specific integrated circuit (ASIC).
  • ASIC application-specific integrated circuit
  • one or more instructions stored in a storage medium may be implemented as software (eg, the program 140) including
  • a processor eg, processor 120
  • a device eg, electronic device 101
  • the one or more instructions may include code generated by a compiler or code executable by an interpreter.
  • the device-readable storage medium may be provided in the form of a non-transitory storage medium.
  • 'non-transitory' only means that the storage medium is a tangible device and does not contain a signal (eg, electromagnetic wave), and this term is used in cases where data is semi-permanently stored in the storage medium and It does not distinguish between temporary storage cases.
  • a signal eg, electromagnetic wave
  • the method according to various embodiments disclosed in this document may be provided as included in a computer program product.
  • Computer program products may be traded between sellers and buyers as commodities.
  • the computer program product is distributed in the form of a machine-readable storage medium (eg compact disc read only memory (CD-ROM)), or via an application store (eg Play Store TM ) or on two user devices ( It can be distributed online (eg download or upload), directly between smartphones (eg smartphones).
  • a part of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium such as a memory of a server of a manufacturer, a server of an application store, or a relay server.
  • each component (eg, module or program) of the above-described components may include a singular or a plurality of entities, and some of the plurality of entities may be separately disposed in other components. there is.
  • one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added.
  • a plurality of components eg, a module or a program
  • the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. .
  • operations performed by a module, program, or other component are executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations are executed in a different order, or omitted. or one or more other operations may be added.
  • FIG. 2 is a front perspective view of an electronic device, according to various embodiments of the present disclosure
  • 3 is a rear perspective view of an electronic device, according to various embodiments of the present disclosure
  • the electronic device 101 has a front surface 310A, a rear surface 310B, and a side surface 310C surrounding a space between the front surface 310A and the rear surface 310B.
  • a housing 310 including a may refer to a structure that forms part of the front surface 310A of FIG. 2 , the rear surface 310B of FIG. 3 , and the side surfaces 310C.
  • the front surface 310A may be formed by a front plate 302 (eg, a glass plate including various coating layers or a polymer plate) at least a portion of which is substantially transparent.
  • the rear surface 310B may be formed by the rear surface plate 311 .
  • the back plate 311 may be formed of, for example, glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials.
  • the side surface 310C is coupled to the front plate 302 and the rear plate 311 and may be formed by a side bezel structure (or “side member”) 318 including a metal and/or a polymer.
  • the back plate 311 and the side bezel structure 318 are integrally formed and may include the same material (eg, glass, a metallic material such as aluminum, or ceramic).
  • the front plate 302 includes two first edge regions 310D extending seamlessly from the front surface 310A toward the rear plate 311, the front plate ( 302) may be included at both ends of the long edge.
  • the rear plate 311 includes two second edge regions 310E extending seamlessly from the rear surface 310B toward the front plate 302 at both ends of the long edge.
  • the front plate 302 (or the back plate 311 ) may include only one of the first edge regions 310D (or the second edge regions 310E). In another embodiment, some of the first edge areas 310D or the second edge areas 310E may not be included.
  • the side bezel structure 318 when viewed from the side of the electronic device 101 , does not include the first edge regions 310D or the second edge regions 310E as described above.
  • the side may have a first thickness (or width), and the side including the first edge regions 310D or the second edge regions 310E may have a second thickness that is thinner than the first thickness.
  • the electronic device 101 includes a display 301 , audio modules 303 , 307 , 314 (eg, the audio module 170 of FIG. 1 ), and a sensor module (eg, the sensor module of FIG. 1 ). 176), camera modules 305, 312, 313 (eg, camera module 180 in FIG. 1), key input device 317 (eg, input module 150 in FIG. 1), and a connector hole ( 308 and 309 (eg, the connection terminal 178 of FIG. 1 ).
  • the electronic device 101 may omit at least one of the components (eg, the connector hole 309 ) or additionally include other components.
  • the display 301 may be visually exposed through, for example, a substantial portion of the front plate 302 .
  • at least a portion of the display 301 may be exposed through the front plate 302 forming the front surface 310A and the first edge regions 310D.
  • the edge of the display 301 may be formed to be substantially the same as an adjacent outer shape of the front plate 302 .
  • the distance between the periphery of the display 301 and the periphery of the front plate 302 may be substantially the same.
  • the surface (or the front plate 302 ) of the housing 310 may include a screen display area formed as the display 301 is visually exposed.
  • the screen display area may include a front surface 310A and first edge areas 310D.
  • a recess or opening is formed in a part of the screen display area (eg, the front surface 310A and the first edge area 310D) of the display 301 , and the recess Alternatively, it may include at least one of an audio module 314 aligned with the opening, a sensor module (not shown), a light emitting device (not shown), and a camera module 305 .
  • an audio module 314 on the rear surface of the screen display area of the display 301 , an audio module 314 , a sensor module (not shown), a camera module 305 , a fingerprint sensor (not shown), and a light emitting element (not shown) may include at least one or more of.
  • the display 301 is coupled to or adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer detecting a magnetic field type stylus pen. can be placed.
  • a pressure sensor capable of measuring the intensity (pressure) of a touch
  • a digitizer detecting a magnetic field type stylus pen.
  • at least a portion of the key input device 317 may be disposed in the first edge regions 310D and/or the second edge regions 310E.
  • the audio modules 303 , 307 , and 314 may include, for example, a microphone hole 303 and speaker holes 307 and 314 .
  • a microphone for acquiring an external sound may be disposed therein, and in some embodiments, a plurality of microphones may be disposed to detect the direction of the sound.
  • the speaker holes 307 and 314 may include an external speaker hole 307 and a call receiver hole 314 .
  • the speaker holes 307 and 314 and the microphone hole 303 may be implemented as a single hole, or a speaker may be included without the speaker holes 307 and 314 (eg, a piezo speaker).
  • the audio modules 303 , 307 , and 314 are not limited to the above structure, and various design changes may be made depending on the structure of the electronic device 101 , such as mounting only some audio modules or adding a new audio module.
  • the sensor module may generate, for example, an electrical signal or data value corresponding to an internal operating state of the electronic device 101 or an external environmental state.
  • a sensor module includes, for example, a first sensor module (eg, a proximity sensor) and/or a second sensor module (eg, a fingerprint sensor) disposed on the front surface 310A of the housing 310 , and/or Alternatively, a third sensor module (eg, an HRM sensor) and/or a fourth sensor module (eg, a fingerprint sensor) disposed on the rear surface 310B of the housing 310 may be included.
  • a first sensor module eg, a proximity sensor
  • a second sensor module eg, a fingerprint sensor
  • a third sensor module eg, an HRM sensor
  • a fourth sensor module eg, a fingerprint sensor
  • the fingerprint sensor may be disposed on the back 310B as well as the front 310A (eg, the display 301 ) of the housing 310 .
  • the electronic device 101 may include a sensor module not shown, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, It may further include at least one of a humidity sensor and an illuminance sensor.
  • the sensor module is not limited to the above structure, and various design changes may be made, such as mounting only some sensor modules or adding a new sensor module, depending on the structure of the electronic device 101 .
  • the camera modules 305 , 312 , and 313 are, for example, a front camera module 305 disposed on the front surface 310A of the electronic device 101 , and a rear surface disposed on the rear surface 310B of the electronic device 101 . It may include a camera module 312 , and/or a flash 313 .
  • the camera module 305, 312 may include one or more lenses, an image sensor, and/or an image signal processor.
  • the flash 313 may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (infrared cameras, wide angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device 101 .
  • the camera modules 305 , 312 , and 313 are not limited to the above structure, and may be designed and changed in various ways, such as mounting only some camera modules or adding a new camera module, depending on the structure of the electronic device 101 .
  • the electronic device 101 may include a plurality of camera modules (eg, a dual camera or a triple camera) each having different properties (eg, angle of view) or functions.
  • a plurality of camera modules 305 and 312 including lenses having different angles of view may be configured, and the electronic device 101 performs a camera performed by the electronic device 101 based on a user's selection. It can be controlled to change the angle of view of the modules 305 and 312 .
  • at least one of the plurality of camera modules 305 and 312 may be a wide-angle camera, and at least the other may be a telephoto camera.
  • the plurality of camera modules 305 and 312 may be a front camera, and at least the other may be a rear camera.
  • the plurality of camera modules 305 and 312 may include at least one of a wide-angle camera, a telephoto camera, and an IR (infrared) camera (eg, a time of flight (TOF) camera, a structured light camera).
  • the IR camera may be operated as at least a part of the sensor module.
  • the TOF camera may be operated as at least a part of a sensor module (not shown) for detecting the distance to the subject.
  • the key input device 317 may be disposed on the side surface 310C of the housing 310 .
  • the electronic device 101 may not include some or all of the above-mentioned key input devices 317 and the not included key input devices 317 are displayed on the display 301 , such as soft keys. It may be implemented in other forms.
  • the key input device may include a sensor module 316 disposed on the second side 310B of the housing 310 .
  • a light emitting device may be disposed on, for example, the front surface 310A of the housing 310 .
  • the light emitting device (not shown) may provide, for example, state information of the electronic device 101 in the form of light.
  • the light emitting device may provide, for example, a light source linked to the operation of the front camera module 305 .
  • the light emitting device (not shown) may include, for example, an LED, an IR LED, and/or a xenon lamp.
  • the connector holes 308 and 309 are, for example, a first connector hole capable of receiving a connector (eg, a USB connector) for transmitting and receiving power and/or data with an external electronic device.
  • a connector eg, a USB connector
  • a second connector hole eg, earphone jack
  • the camera module 305 and 312 of the camera modules 305 and 312 and/or some of the sensor modules are exposed to the outside through at least a part of the display 301 .
  • the camera module 305 may include a punch hole camera disposed inside a hole or recess formed on the rear surface of the display 301 .
  • the camera module 312 may be disposed inside the housing 310 so that the lens is exposed to the second surface 310B of the electronic device 101 .
  • the camera module 312 may be disposed on a printed circuit board (eg, the printed circuit board 340 of FIG. 4 ).
  • the camera module 305 and/or the sensor module may be in contact with the external environment through a transparent area from the internal space of the electronic device 101 to the front plate 302 of the display 301 . can be placed.
  • some sensor modules 304 may be arranged to perform their functions without being visually exposed through the front plate 302 in the internal space of the electronic device.
  • FIG. 4 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure.
  • the electronic device 101 (eg, the electronic device 101 of FIGS. 1 to 3 ) according to various embodiments includes a side bezel structure 331 (eg, the side bezel structure 318 of FIG. 2 ). )), a first support member 332 , a front plate 320 (eg, the front plate 302 of FIG. 2 ), a display 330 (eg, the display 301 of FIG. 2 ), a printed circuit board 340 . ) (eg, PCB, flexible PCB (FPCB), or rigid flexible PCB (RFPCB)), battery 350 (eg, battery 189 in FIG.
  • a side bezel structure 331 eg, the side bezel structure 318 of FIG. 2 ).
  • a first support member 332 eg, a front plate 320 (eg, the front plate 302 of FIG. 2 ), a display 330 (eg, the display 301 of FIG. 2 ), a printed circuit board 340 .
  • PCB flexible PCB
  • the electronic device 101 may omit at least one of the components (eg, the first support member 332 or the second support member 360 ) or additionally include other components. . At least one of the components of the electronic device 101 may be the same as or similar to at least one of the components of the electronic device 101 of FIG. 2 or 3 , and overlapping descriptions will be omitted below.
  • the first support member 332 may be disposed inside the electronic device 101 and may be connected to the side bezel structure 331 or may be integrally formed with the side bezel structure 331 .
  • the first support member 332 may be formed of, for example, a metal material and/or a non-metal (eg, polymer) material.
  • the first support member 332 may have a display 330 coupled to one surface and a printed circuit board 340 coupled to the other surface.
  • the printed circuit board 340 may be equipped with a processor, a memory, and/or an interface.
  • the processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.
  • the printed circuit board 340 may include a flexible printed circuit board type radio frequency cable (FRC).
  • FRC radio frequency cable
  • the printed circuit board 340 may be disposed on at least a portion of the first support member 332 , and an antenna module (eg, the antenna module 197 of FIG. 1 ) and a communication module (eg, of FIG. 1 ). It may be electrically connected to the communication module 190).
  • the memory may include, for example, a volatile memory or a non-volatile memory.
  • the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • the interface may, for example, electrically or physically connect the electronic device 101 to an external electronic device, and may include a USB connector, an SD card/MMC connector, or an audio connector.
  • the battery 350 is a device for supplying power to at least one component of the electronic device 101 , for example, a non-rechargeable primary battery, or a rechargeable secondary battery, or fuel. It may include a battery. At least a portion of the battery 350 may be disposed substantially on the same plane as the printed circuit board 340 . The battery 350 may be integrally disposed inside the electronic device 101 , or may be disposed detachably from the electronic device 101 .
  • the second support member 360 (eg, a rear case) may be disposed between the printed circuit board 340 and the antenna 370 .
  • the second support member 360 may include one surface to which at least one of the printed circuit board 340 and the battery 350 is coupled, and the other surface to which the antenna 370 is coupled.
  • the antenna 370 may be disposed between the rear plate 380 and the battery 350 .
  • the antenna 370 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna.
  • the antenna 370 may, for example, perform short-range communication with an external device or wirelessly transmit/receive power required for charging.
  • the antenna structure may be formed by a part of the side bezel structure 331 and/or the first support member 332 or a combination thereof.
  • the rear plate 380 may form at least a portion of the rear surface (eg, the second surface 310B of FIG. 3 ) of the electronic device 101 .
  • 5 is a cross-sectional view illustrating a case forming at least a portion of a housing of an electronic device according to one of various embodiments of the present disclosure
  • 6 is a flowchart illustrating a method of manufacturing a case forming at least a portion of a housing of an electronic device, according to another one of various embodiments of the present disclosure
  • 7 is a schematic diagram schematically illustrating a method of manufacturing a case forming at least a portion of a housing of an electronic device according to another one of various embodiments of the present disclosure
  • the electronic device (eg, the electronic device 101 of FIGS. 1 to 4 ) includes a housing (eg, the housing 310 of FIGS. 2 to 3 ), a display (eg, the display 330 of FIG. 4 ). ) may be included.
  • the housing 301 may include a case 500 that forms at least a part of the exterior of the electronic device 101 .
  • the case 500 may be the same as some or all of the front plate 310A, the rear plate 310B, or the side bezel structure 318 of FIGS. 2 and 3 .
  • the case 500 may be formed by stacking a plurality of layers.
  • the case 500 has a structure for protecting the front surface of the display 330 and may be formed of a transparent material as a whole.
  • the case 500 may include a transparent plate 510 and a thin film layer 520 , and the thin film layer 520 includes a first thin film region 520a and a second thin film region 520b .
  • the case 500 may further include a protective layer 540 on the thin film layer 520 .
  • the transparent plate 510 includes a transparent material that can substantially transmit light, and is formed by, for example, glass, ceramic, polymer, or at least one or a combination of these materials.
  • the transparent plate 510 has a first surface 511 facing the first direction (+Z-axis direction) and a second surface facing the second direction (-Z-axis direction) opposite to the first direction (+Z-axis direction). (512).
  • the transparent plate 510 may be cut or molded into a shape required for the appearance of the electronic device. For example, at least a portion (eg, an edge region) may be formed as a curved surface extending seamlessly, and may have four corner portions in a curved shape like the front plate or the rear plate of FIG. 2 or 3 .
  • the thin film layer 520 may include a first thin film region 520a and a second thin film region 520b in which a pattern of specified shapes is formed in at least some regions of the first thin film region 520a. there is. According to an embodiment, the thin film layer 520 may provide an optical transmittance of at least 70%.
  • the first thin film region 520a may be formed on the first surface 511 of the transparent plate 510 by using at least one of physical vapor deposition (PVD), chemical vapor deposition (CVD), or wet coating method. It may be a thin film having a thickness of several tens of nm to several thousand nm formed thereon. According to some embodiments, the first thin film region 520a may be formed as a single-layer thin film having high hardness in order to improve the scratch resistance of the transparent plate 510 . For example, the hardness of the first thin film region 520a may be higher than that of the transparent plate 510 . As another example, the first thin film region 520a may have a hardness higher than that of the tempered glass, for example, Vicker's hardness 200 g load, 650 kgf/mm 2 or more.
  • the first thin film region 520a may correspond to a lower region of the thin film layer 520 and may form a first specified thickness.
  • the first specified thickness of the first thin film region 520a may be smaller than the thickness of the transparent plate 510 .
  • the first thin film region 520a has an optical transmittance of 70% or more and may be designed with at least one of nitride, oxide nitride, DLC, ZnO, or SiH having a hardness higher than that of chemically strengthened glass. .
  • the second thin film region 520b is formed by using at least one of a wet or dry etching method on at least a portion of the surface of the thin film layer 520 on which the process for forming the first thin film region 520a is completed, It may be a thin film formed to have a thickness of several tens of nm to several thousand nm.
  • the second thin film region 520b may be a thin film causing interference in a visible light region (eg, 380 nm to 780 nm).
  • the second thin film region 520b may correspond to an upper region of the thin film layer 520 and may form a second specified thickness.
  • the second specified thickness of the second thin film region 520b may be different from the first specified thickness of the first thin film region 520a.
  • the second specified thickness may be less than the first specified thickness.
  • the second thin film region 520b may be positioned on the first thin film region 520a to form a concave-convex structure pattern P having a curvature.
  • the concave-convex structure pattern P having a curvature may be formed by an arrangement of a plurality of protruding portions forming a curvature having a slope that decreases as the distance from the transparent plate 510 increases.
  • the concave-convex structure pattern P having a curvature when viewed from the top of the thin film layer 520 (when viewed in the -Z direction), is spaced apart from each other and has a plurality of structures formed of at least a circular or oval shape.
  • the concave-convex structure pattern P having the upper curvature may be an arrangement of hemispherical shapes protruding upward with respect to the upper surface of the first thin film region 520a.
  • the second thin film region 520b may provide a cross-sectional reflection of 4.5% or less due to the concave-convex structure pattern P having a curvature.
  • the second thin film region 520b may provide a cross-sectional reflection of 4.0% or less due to the concave-convex structure pattern P having a curvature.
  • the concave-convex structure pattern P having the curvature of the second thin film region 520b may be manufactured to have a shape corresponding to a moth eye pattern.
  • the moth eye may have a concave-convex structure having a fine curvature.
  • the plurality of repetitively arranged concave-convex structures are modeled after a moth's eye structure, and the surface of the thin film layer 520 using a continuously variable curvature from the surface in contact with the air to the surface of the first thin film region 520a. can be made low-refractive.
  • a high hardness first thin film region 520a having optical properties is formed on the transparent plate 510 and the second thin film region 520b is disposed on the first thin film region 520a,
  • an anti-reflection (AR) film that is lower than that of glass may be formed.
  • the thin film layer 520 is a thin film composed of a single layer as a whole, and the first thin film region 520a and the second thin film region 520b may be made of the same material.
  • the patterning of the concave-convex structure having a fine curvature disposed on the surface of the first thin film region 520a may form a curvature to be inclined outwardly from the first thin film region 520a.
  • the surface refractive index is lower than that of the transparent plate, and thus, it is possible to provide an anti-reflection effect in the visible light region.
  • the protective layer 540 may be formed on the outer surface of the case 500 and may prevent contamination of the external environment by dust or oil.
  • the protective layer 550 may be formed of a substantially transparent material to allow external light to be incident to the inside.
  • the protective layer 550 is a coating layer disposed on the thin film layer 520 , depending on the selection during manufacture, in a dry or wet method, at least of an anti fingerprint (AF) coating layer, an anti smudge (AS) coating layer, or an invisible fingerprint (IF) coating layer.
  • AF anti fingerprint
  • AS anti smudge
  • IF invisible fingerprint
  • the protective layer 540 is disposed on the second thin film region 520b of the thin film layer 520 and is formed as a thin film, so that the protective layer 540 has a curvature formed in the second thin film region 520b.
  • An outer surface corresponding to the uneven structure pattern P may be formed.
  • a plurality of concave-convex structures are formed on the outer surface of the protective layer 550 to reduce an area in contact with the user's finger, thereby reducing contamination of the case 500 due to oil from the user's finger.
  • the protective layer 540 exposes a surface protruding to the outside according to the plurality of concavo-convex structures, so that when a user touches it, it provides a texture that can be felt and prevents water repellency and/or fingerprint prevention. can provide
  • the transparent plate 510 may be provided.
  • the transparent plate 510 may be a glass plate that can substantially transmit light.
  • a high hardness thin film layer 520 may be formed on one surface of the transparent plate 510 (eg, the opposite surface on which the display 330 is positioned).
  • the thin film layer 520 may be formed to have a thickness of several tens of nm to several thousand nm on the transparent plate 510 by using at least one of physical vapor deposition (PVD), chemical vapor deposition (CVD), or a wet coating method. there is.
  • a concave-convex structure pattern P having a curvature may be formed on the upper surface of the high hardness thin film layer 520 .
  • the concave-convex structures forming the concave-convex structure pattern P may be manufactured using a dry or wet etching method, and may be formed to have a thickness of several tens of nm to several thousand nm. Accordingly, the first thin film region 520a in contact with the transparent plate 510 is positioned in the lower region of the thin film layer 520 , and the upper region of the high hardness thin film layer 520 is exposed to the outside of the second thin film region 520b This can be located
  • the protective layer 540 may be coated on the upper surface of the thin film layer 520 .
  • the protective layer 540 may be coated while maintaining a shape corresponding to the shape of the concave-convex structures formed in the second thin film region 520b.
  • the configuration of the process 4000 may be excluded according to the operator's selection.
  • the protective layer 540 is shown in the form of a chemical bond combined with the second thin film region 520b.
  • FIG. 8 is a cross-sectional view schematically illustrating a coupling relationship between a thin film layer and a protective layer in a case forming at least a portion of a housing of an electronic device according to one of various embodiments of the present disclosure.
  • the electronic device (eg, the electronic device 101 of FIGS. 1 to 4 ) includes a case 500 (eg, the housing of FIGS. 2 to 3 ) that forms at least a part of the exterior of the electronic device 101 . (310))).
  • the case 500 may be the same as some or all of the front plate 310A, the rear plate 310B, or the side bezel structure 318 of FIGS. 2 and 3 .
  • the case 500 may be formed by stacking a plurality of layers.
  • the case 500 may include a transparent plate 510 , a thin film layer 520 , and a protective layer 540 , and the thin film layer 520 includes a first thin film region 520a and a second thin film region 520b .
  • the configuration of the transparent plate 510 , the thin film layer 520 , and the protective layer 540 of FIG. 8 is the same as the configuration of the transparent plate 510 , the thin film layer 520 , and the protective layer 540 of FIGS. 5 to 7 . or all may be the same.
  • the protective layer 540 is disposed on the second thin film region 520b of the thin film layer 520 and is implemented as a fine thin film to be manufactured in a shape corresponding to the shape of the second thin film region 520b.
  • the protective layer 540 is formed on the concave-convex structure pattern P having the fine curvature of the two thin film regions 520b and is coated to surround the outer surface of the case, thereby improving anti-contamination performance.
  • the protective layer 540 comes into contact with the concave-convex structure pattern P having a fine curvature of the second thin film region 520b of the thin film layer 520 , so that mechanical adhesion can be increased, and thus, high reflection prevention (AR; anti reflection) coating can be provided.
  • AR anti reflection
  • the concave-convex structure pattern P of the second thin film region 520b includes a plurality of concavo-convex structures protruding toward the thin film layer 540 , and the protective layer 540 penetrates into a gap between the plurality of concavo-convex structures. Accordingly, an area in contact with the thin film layer 520 may be increased. Accordingly, a structure in which mechanical adhesion is improved may be provided, and anti-reflection (AR) performance may be improved.
  • AR anti-reflection
  • anti fingerprint (AF) performance may be improved.
  • [Table 1] [Table 2] shows the AF (anti fingerprint) performance results of various experimental examples and comparative proposals of the present disclosure.
  • the AF performance of the pattern layer and the protective layer on which the moss-eye pattern is formed is measured by other AF companies (eg, Experimental Example A, Experimental Example B, Experimental Example C, and Experimental Example D). ) can be compared with drugs (eg, common glass / AF). It can be seen that the average AF performance coated with other AF companies' chemicals, for example, the number of contact times in the abrasion resistance test is about 5000 to 7,000 times on average. It can be seen that the moss-eye patterned AF performance according to the present disclosure is approximately 24,000 times.
  • 9A is a view illustrating peeling off a case (eg, a thin film layer having a single-layer structure) forming at least a portion of a housing of an electronic device according to one of various embodiments of the present disclosure
  • 9B is a view illustrating peeling off a case (eg, a thin film layer having a multi-layer structure) forming at least a portion of a housing of a general electronic device.
  • the electronic device (eg, the electronic device 101 of FIGS. 1 to 4 ) includes a case 500 (eg, the housing of FIGS. 2 to 3 ) that forms at least a part of the exterior of the electronic device 101 . (310))).
  • the case 500 may be the same as some or all of the front plate 310A, the rear plate 310B, or the side bezel structure 318 of FIGS. 2 and 3 .
  • the case (eg, the case 500 of FIG. 5 ) may be formed by stacking a plurality of layers.
  • the case may include a transparent plate (eg, the transparent plate 510 of FIG. 5 ), a thin film layer (eg, the thin film layer 520 of FIG. 5 ), and a protective layer (eg, the protective layer 540 of FIG. 5 ).
  • the thin film layer may include a first thin film region (eg, the first thin film region 520a of FIG. 5 ) and a second thin film region (eg, the second thin film region 520b of FIG. 5 ).
  • the thin film layer 520 may be a thin film forming one layer.
  • the thin film layer used in the general case 500 uses a multi-layer thin film layer to take advantage of the interference effect of the high refractive material and the low refractive material.
  • the reflectivity can be adjusted according to the increase in the thin film stacking structure, and a considerable number of thin film layers and thick thicknesses are formed for AR effect above a certain level, which may require a lot of time and cost.
  • a low-strength material eg, an oxide film
  • the surface hardness may be reduced.
  • a part of the thin film layer may be easily peeled off by abrasion, and the visual visibility of the damaged area may be increased due to the difference in surface reflectance between the normal surface and the damaged surface.
  • the thin film layer of the case may be formed as a single thin film layer.
  • the surface of the high-hardness thin film layer on which the concave-convex structure pattern with curvature is formed is formed as a single-layer thin film, there is no peeling of some thin films from the surface, and even if damaged or worn, the difference in surface reflectance does not occur significantly, so the visual visibility of the damaged area is lowered and AR performance persistence can be maintained.
  • 10A is a cross-sectional view schematically illustrating a path through which light is incident in a case forming at least a portion of a housing of an electronic device according to one of various embodiments of the present disclosure
  • 10B is a graph illustrating an effect of improving reflectance according to a viewing angle in a case forming at least a part of a housing of an electronic device according to one of various embodiments of the present disclosure
  • the case (eg, the case 500 of FIG. 5 ) may be formed by stacking a plurality of layers.
  • the case may include a transparent plate (eg, the transparent plate 510 of FIG. 5 ), and a thin film layer (eg, the thin film layer 520 of FIG. 5 ), wherein the thin film layer is a first thin film region (eg, the first thin film region of FIG. 5 ).
  • the thin film region 520a) and a second thin film region (eg, the second thin film region 520b of FIG. 5 ) may be included.
  • the thin film layer 520 may be a thin film forming one layer.
  • the thin film layer used in a general case uses a multi-layer thin film layer to take advantage of the interference effect of the high refractive material and the low refractive material.
  • the reflectance according to the incident angle can be confirmed by L2 of FIG. 10B .
  • the reflectivity rapidly increases according to the change of the incident angle, and the multilayer thin film layer may be a coating layer optimized for normal incidence of light (viewing angle of 90 degrees). Accordingly, when the case is viewed from the side (viewing angle is less than 90 degrees), visibility may be deteriorated.
  • the single thin film layer 520 used in the case 500 according to the present disclosure is a thin film layer on which the concavo-convex structure pattern P is formed. Due to the concavo-convex structures having a fine curvature, the surface refractive index may be lower than that of the glass plate 510 .
  • the single thin film layer 520 can check the reflectance according to the incident angle by L1 of FIG. 10B .
  • the single thin film layer 520 may maintain the basic reflectivity even if the incident angle increases as the dependence on the incident angle decreases. Accordingly, when the case is viewed from the side (the viewing angle is 90 degrees or less), the visibility does not deteriorate and the side visibility of the display can be increased.
  • An electronic device (eg, the electronic device 101 of FIGS. 1 to 4 ) according to various embodiments of the present disclosure includes a display (eg, the display 330 of FIG. 4 ) and a transparent plate (eg, FIG. 4 ) disposed on the display. 5), and a single thin film layer (eg, the thin film layer 520 of FIG. 5 ) disposed on one surface of the transparent plate.
  • the thin film layer is formed on a first thin film region (eg, the first thin film region 520a in FIG. 5 ) having a hardness greater than or equal to the transparent plate hardness and forming a first specified thickness, and the first thin film region, and has a curvature
  • a second thin film region (eg, the second thin film region 520b of FIG. 5 ) having a second predetermined thickness including the concave-convex structure pattern (eg, the uneven structure pattern P of FIG. 5 ) may be included.
  • the concave-convex structure pattern having the curvature of the second thin film region may be formed on at least a portion of a surface of the thin film layer through a dry or wet etching process.
  • the concavo-convex structure pattern having the curvature of the second thin film region may include an arrangement of a plurality of protruding portions forming a curvature having a slope that decreases as the distance from the transparent plate increases.
  • the concave-convex structure pattern having the curvature of the second thin film region may be formed to correspond to a moth eye pattern.
  • a plurality of structures including at least a portion of a plurality of circular or elliptical shapes spaced apart from each other are arranged in a plurality.
  • the first specified thickness may be greater than the second specified thickness.
  • the electronic device further includes a protective layer disposed in contact with the second thin film region to prevent contamination of the case, wherein the protective layer has a concave-convex structure pattern having the curvature of the second thin film region. It is possible to provide a surface shape corresponding to
  • At least a portion of the protective layer may be in contact with a side surface of the thin film layer as it penetrates into a gap formed between the plurality of concave-convex structures of the concave-convex structure pattern.
  • At least a portion of the protective layer when viewed from the side of the case, at least a portion of the protective layer may be disposed to overlap at least a portion of the thin film layer.
  • the thin film layer may provide an optical transmittance of at least 70%.
  • the second thin film region of the thin film layer may provide a cross-sectional reflection of 4.0% or less due to the concavo-convex structure pattern having the curvature.
  • the concave-convex structure pattern having the curvature of the second thin film region may be formed with a fine curvature having a thickness of several tens of nm to several thousand nm.
  • the first thin film region is formed by at least one of physical vapor deposition (PVD), chemical vapor deposition (CVD), or a wet coating method
  • the second thin film region is configured to form the first thin film region. It may be formed on the surface of the thin film layer on which the process is completed through a dry or wet etching process.
  • An electronic device (eg, the electronic device 101 of FIGS. 1 to 4 ) according to various embodiments of the present disclosure includes a case (eg, the case 500 of FIG. 5 ) that forms at least a part of an exterior of the electronic device;
  • a battery eg, the battery 350 of FIG. 4
  • a display eg, the display 330 of FIG. 4
  • the case includes a glass plate (eg, the transparent plate 510 of FIG.
  • a thin film layer disposed on one surface of the glass plate, and has a concave-convex structure having a curvature in an upper region facing the opposite side of the glass plate It may include a patterned thin film layer (eg, the thin film layer 520 of FIG. 5 ), and a protective layer for preventing contamination (eg, the protective layer 540 of FIG. 5 ) disposed on the thin film layer.
  • a patterned thin film layer eg, the thin film layer 520 of FIG. 5
  • a protective layer for preventing contamination eg, the protective layer 540 of FIG. 5
  • the concave-convex structure pattern having the curvature may be formed on at least a portion of a surface of the thin film layer through a dry or wet etching process.
  • the concave-convex structure pattern having the curvature may be formed to correspond to a moth eye pattern.
  • the protective layer may provide a surface shape corresponding to the concave-convex structure pattern having the curvature of the thin film layer.
  • the case (eg, the case 500 of FIG. 5 ) according to various embodiments of the present disclosure includes a glass plate (eg, the transparent plate 510 of FIG. 5 ), a thin film layer disposed on one surface of the glass plate, and the glass A thin film layer including a first thin film region having a hardness equal to or greater than plate hardness, and a second thin film region formed on the first thin film region by a dry or wet etching process and including a concave-convex structure pattern having curvature (eg, FIG. 5 ) of the thin film layer 520), and a protective layer (eg, the protective layer 540 of FIG. 5 ) disposed on the thin film layer for preventing contamination.
  • a glass plate eg, the transparent plate 510 of FIG. 5
  • the glass A thin film layer including a first thin film region having a hardness equal to or greater than plate hardness, and a second thin film region formed on the first thin film region by a dry or wet etching process and including
  • the concave-convex structure pattern having the curvature of the second thin film region may be formed on at least a portion of a surface of the thin film layer through a dry or wet etching process.
  • the protective layer may provide a surface shape corresponding to the concave-convex structure pattern having the curvature of the second thin film region.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Telephone Set Structure (AREA)

Abstract

Un dispositif électronique selon divers modes de réalisation de la présente divulgation peut comprendre : un dispositif d'affichage ; une plaque transparente disposée sur le dispositif d'affichage ; et une seule couche de film mince disposée sur une surface de la plaque transparente. La couche de film mince peut comprendre : une première région de film mince qui a une dureté supérieure ou égale à la dureté de la plaque transparente et forme une première épaisseur spécifiée ; et une seconde région de film mince qui est formée sur la première région de film mince, comprend un motif de structure concave/convexe ayant une courbure, et a une seconde épaisseur spécifiée.
PCT/KR2021/010621 2020-08-21 2021-08-11 Boîtier et dispositif électronique le comprenant WO2022039435A1 (fr)

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Application Number Priority Date Filing Date Title
KR10-2020-0105328 2020-08-21
KR1020200105328A KR20220023510A (ko) 2020-08-21 2020-08-21 케이스 및 이를 포함하는 전자 장치

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WO2022039435A1 true WO2022039435A1 (fr) 2022-02-24

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Publication number Priority date Publication date Assignee Title
WO2024063542A1 (fr) * 2022-09-20 2024-03-28 삼성전자 주식회사 Dispositif électronique comprenant un boîtier, et procédé et appareil de fabrication de celui-ci

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070159698A1 (en) * 2004-12-03 2007-07-12 Sharp Kabushiki Kaisha Antireflective member, optical element, display device, method of making stamper and method of making antireflective member using the stamper
JP2013142821A (ja) * 2012-01-11 2013-07-22 Dainippon Printing Co Ltd 反射防止フィルム
JP2015059977A (ja) * 2013-09-17 2015-03-30 富士フイルム株式会社 透明微細凹凸構造体の製造方法
KR20160149847A (ko) * 2015-06-19 2016-12-28 삼성전자주식회사 반사 방지 필름, 그 필름을 포함한 전자 장치, 및 그 필름의 제조방법과 제조장치
US20200200947A1 (en) * 2017-08-29 2020-06-25 General Plasma, Inc. Multilayer antireflective articles and methods of forming the same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070159698A1 (en) * 2004-12-03 2007-07-12 Sharp Kabushiki Kaisha Antireflective member, optical element, display device, method of making stamper and method of making antireflective member using the stamper
JP2013142821A (ja) * 2012-01-11 2013-07-22 Dainippon Printing Co Ltd 反射防止フィルム
JP2015059977A (ja) * 2013-09-17 2015-03-30 富士フイルム株式会社 透明微細凹凸構造体の製造方法
KR20160149847A (ko) * 2015-06-19 2016-12-28 삼성전자주식회사 반사 방지 필름, 그 필름을 포함한 전자 장치, 및 그 필름의 제조방법과 제조장치
US20200200947A1 (en) * 2017-08-29 2020-06-25 General Plasma, Inc. Multilayer antireflective articles and methods of forming the same

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