WO2023063598A1 - Ensemble acoustique et dispositif électronique le comprenant - Google Patents

Ensemble acoustique et dispositif électronique le comprenant Download PDF

Info

Publication number
WO2023063598A1
WO2023063598A1 PCT/KR2022/013811 KR2022013811W WO2023063598A1 WO 2023063598 A1 WO2023063598 A1 WO 2023063598A1 KR 2022013811 W KR2022013811 W KR 2022013811W WO 2023063598 A1 WO2023063598 A1 WO 2023063598A1
Authority
WO
WIPO (PCT)
Prior art keywords
bracket
electronic device
acoustic component
acoustic
component cover
Prior art date
Application number
PCT/KR2022/013811
Other languages
English (en)
Korean (ko)
Inventor
김윤섭
김성중
안상훈
이승훈
박석철
임동언
Original Assignee
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전자 주식회사 filed Critical 삼성전자 주식회사
Publication of WO2023063598A1 publication Critical patent/WO2023063598A1/fr

Links

Images

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1684—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
    • G06F1/1688—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675 the I/O peripheral being integrated loudspeakers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1628—Carrying enclosures containing additional elements, e.g. case for a laptop and a printer
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means

Definitions

  • Various embodiments of the present disclosure relate to an acoustic assembly and an electronic device including the same.
  • Electronic devices include home appliances, electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, video/audio devices, desktop/laptop computers, and vehicle navigation devices that perform specific functions according to installed programs. can mean For example, these electronic devices may output stored information as sound or image.
  • a single electronic device such as a mobile communication terminal may be equipped with various functions. For example, not only communication functions, but also entertainment functions such as games, multimedia functions such as music/video playback, communication and security functions such as mobile banking, and functions such as schedule management and electronic wallets are integrated into one electronic device. will be.
  • These electronic devices are miniaturized so that users can conveniently carry them.
  • an electronic device including an acoustic component such as a microphone or a speaker may include an acoustic component cover to cover at least a part of an acoustic path.
  • the acoustic component cover may be implemented as a sealing structure by being attached to the exterior of the acoustic component and a support member on which the acoustic component is mounted. Since the acoustic component cover attached to the exterior of the support member with tape does not have a separate pressurizing structure, umbilical leakage may occur due to uneven attachment and/or lifting of the tape due to poor compression.
  • one surface of an acoustic component cover for covering at least a part of a sound path is attached to a support member (eg, a rear bracket), and the other surface is lifted by a bracket (eg, a front bracket) that presses the cover.
  • a support member eg, a rear bracket
  • a bracket eg, a front bracket
  • An electronic device includes: a housing including a first bracket including a through hole and a second bracket coupled to the first bracket to form an internal space; and an acoustic assembly disposed adjacent to the through hole.
  • the acoustic component may include an acoustic component, a circuit board including a first acoustic hole formed in an area on which the acoustic component is disposed and corresponding to a location of the acoustic component, and an acoustic component cover positioned within the internal space.
  • the acoustic component cover has a first surface including a first area facing the circuit board and a second area facing the second bracket, a surface opposite to the first surface, and along an edge portion of the acoustic component cover. It may include a second surface disposed to adhere to the first bracket, and a second sound hole formed to correspond to the first sound hole.
  • An electronic device includes: a housing including a first bracket and a second bracket combined with the first bracket to form an inner space; an acoustic component positioned in the inner space; and the acoustic component are disposed. , a circuit board including a first sound hole formed in an area corresponding to the location of the acoustic component, and an acoustic component cover disposed between the first bracket and the second bracket and covering at least a portion of the acoustic component.
  • the acoustic component cover forms a first surface including a first area facing the circuit board and a second area extending from the first area toward the outside of the electronic device, and a surface opposite to the first surface; , A second surface bonded to the second bracket along an edge portion and forming a sound pipe together with the first bracket or the second bracket, and a second sound hole formed to correspond to the first sound hole.
  • the electronic device may limit the sound leakage of the acoustic component by improving the sealing structure of the acoustic assembly. For example, as the acoustic component cover providing a part of the acoustic path is disposed inside the housing and presses both sides of the housing, acoustic performance may be stabilized by limiting the sound leakage caused by lifting.
  • FIG. 1 is a block diagram of an electronic device in a network environment, according to various embodiments.
  • FIG. 2 is a front perspective view of an electronic device according to various embodiments of the present disclosure.
  • FIG. 3 is a rear perspective view of an electronic device according to various embodiments of the present disclosure.
  • FIG. 4 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure.
  • FIG. 5 is an exploded perspective view illustrating an acoustic assembly and surrounding structures thereof according to various embodiments of the present disclosure.
  • FIG. 6 is a projected view illustrating an acoustic assembly disposed on a rear bracket when viewed from the front of an electronic device according to various embodiments of the present disclosure
  • FIG. 7 is a cross-sectional view illustrating an acoustic assembly and surrounding structures thereof, according to various embodiments of the present disclosure.
  • FIG. 8 is a perspective view illustrating a structure in which an acoustic component cover is mounted on a rear bracket according to various embodiments of the present disclosure.
  • 9A is a front view of an acoustic component cover according to various embodiments of the present disclosure.
  • 9B is a rear view of an acoustic component cover according to various embodiments of the present disclosure.
  • FIG. 9C is a cross-sectional view of the acoustic component cover of FIG. 9A according to various embodiments of the present disclosure taken along the line AA'.
  • 9D is a side view of an acoustic component cover according to various embodiments of the present disclosure.
  • FIG. 10 is a perspective view illustrating an acoustic assembly disposed in an electronic device and surrounding structures thereof according to various embodiments of the present disclosure.
  • FIG. 11 is a cross-sectional view of a portion of the electronic device of FIG. 10 taken along line BB' according to various embodiments of the present disclosure.
  • FIG. 12 is a perspective view illustrating an acoustic assembly disposed in an electronic device and surrounding structures thereof according to various embodiments of the present disclosure.
  • FIG. 13 is a cross-sectional view of a portion of the electronic device of FIG. 12 taken along the line C-C′ according to various embodiments of the present disclosure.
  • FIG. 14 is a cross-sectional view illustrating an acoustic assembly and surrounding structures thereof, according to various embodiments of the present disclosure.
  • FIG. 15 is a perspective view illustrating an acoustic assembly disposed in one area of a front bracket according to various embodiments of the present disclosure
  • 16 is a cross-sectional view illustrating an acoustic assembly and surrounding structures thereof, according to various embodiments of the present disclosure.
  • FIG. 17 is an exploded perspective view illustrating an acoustic component cover and a region of a rear bracket in which the acoustic component cover is disposed, according to various embodiments of the present disclosure
  • FIG. 18 is a cross-sectional view of an acoustic assembly and its surrounding structures taken at a different part from that of FIG. 16 according to various embodiments of the present disclosure.
  • FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure.
  • an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or through a second network 199. It is possible to communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to one embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 .
  • the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or the antenna module 197 may be included.
  • at least one of these components eg, the connection terminal 178) may be omitted or one or more other components may be added.
  • some of these components eg, sensor module 176, camera module 180, or antenna module 197) are integrated into a single component (eg, display module 160). It can be.
  • the processor 120 for example, executes software (eg, the program 140) to cause at least one other component (eg, hardware or software component) of the electronic device 101 connected to the processor 120. It can control and perform various data processing or calculations. According to one embodiment, as at least part of data processing or operation, processor 120 transfers instructions or data received from other components (e.g., sensor module 176 or communication module 190) to volatile memory 132. , processing commands or data stored in the volatile memory 132 , and storing resultant data in the non-volatile memory 134 .
  • software eg, the program 140
  • processor 120 transfers instructions or data received from other components (e.g., sensor module 176 or communication module 190) to volatile memory 132. , processing commands or data stored in the volatile memory 132 , and storing resultant data in the non-volatile memory 134 .
  • the processor 120 may include a main processor 121 (eg, a central processing unit or an application processor), or a secondary processor 123 (eg, a graphic processing unit, a neural network processing unit) that may operate independently of or together with the main processor 121 .
  • main processor 121 eg, a central processing unit or an application processor
  • secondary processor 123 eg, a graphic processing unit, a neural network processing unit
  • the main processor 121 e.g, a central processing unit or an application processor
  • a secondary processor 123 eg, a graphic processing unit, a neural network processing unit
  • image signal processor e.g., image signal processor, sensor hub processor, or communication processor.
  • the secondary processor 123 may be implemented separately from or as part of the main processor 121 .
  • the secondary processor 123 may, for example, take the place of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or the main processor 121 is active (eg, running an application). ) state, together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states.
  • the auxiliary processor 123 eg, image signal processor or communication processor
  • the auxiliary processor 123 may include a hardware structure specialized for processing an artificial intelligence model.
  • AI models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself where artificial intelligence is performed, or may be performed through a separate server (eg, the server 108).
  • the learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning or reinforcement learning, but in the above example Not limited.
  • the artificial intelligence model may include a plurality of artificial neural network layers.
  • Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the foregoing, but is not limited to the foregoing examples.
  • the artificial intelligence model may include, in addition or alternatively, software structures in addition to hardware structures.
  • the memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101 .
  • the data may include, for example, input data or output data for software (eg, program 140) and commands related thereto.
  • the memory 130 may include volatile memory 132 or non-volatile memory 134 .
  • the program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142 , middleware 144 , or an application 146 .
  • the input module 150 may receive a command or data to be used by a component (eg, the processor 120) of the electronic device 101 from the outside of the electronic device 101 (eg, a user).
  • the input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).
  • the sound output module 155 may output sound signals to the outside of the electronic device 101 .
  • the sound output module 155 may include, for example, a speaker or a receiver.
  • the speaker can be used for general purposes such as multimedia playback or recording playback.
  • a receiver may be used to receive an incoming call. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.
  • the display module 160 can visually provide information to the outside of the electronic device 101 (eg, a user).
  • the display module 160 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the device.
  • the display module 160 may include a touch sensor configured to detect a touch or a pressure sensor configured to measure the intensity of force generated by the touch.
  • the audio module 170 may convert sound into an electrical signal or vice versa. According to an embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device connected directly or wirelessly to the electronic device 101 (eg: Sound may be output through the electronic device 102 (eg, a speaker or a headphone).
  • the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device connected directly or wirelessly to the electronic device 101 (eg: Sound may be output through the electronic device 102 (eg, a speaker or a headphone).
  • the sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the detected state. can do.
  • the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a bio sensor, It may include a temperature sensor, humidity sensor, or light sensor.
  • the interface 177 may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device 101 to an external electronic device (eg, the electronic device 102).
  • the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • SD card interface Secure Digital Card interface
  • audio interface audio interface
  • connection terminal 178 may include a connector through which the electronic device 101 may be physically connected to an external electronic device (eg, the electronic device 102).
  • the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).
  • the haptic module 179 may convert electrical signals into mechanical stimuli (eg, vibration or motion) or electrical stimuli that a user may perceive through tactile or kinesthetic senses.
  • the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
  • the camera module 180 may capture still images and moving images. According to one embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
  • the power management module 188 may manage power supplied to the electronic device 101 .
  • the power management module 188 may be implemented as at least part of a power management integrated circuit (PMIC), for example.
  • PMIC power management integrated circuit
  • the battery 189 may supply power to at least one component of the electronic device 101 .
  • the battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.
  • the communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). Establishment and communication through the established communication channel may be supported.
  • the communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication.
  • the communication module 190 may be a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, a : a local area network (LAN) communication module or a power line communication module).
  • a corresponding communication module is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (eg, a legacy communication module).
  • the wireless communication module 192 uses subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199.
  • IMSI International Mobile Subscriber Identifier
  • the wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, NR access technology (new radio access technology).
  • NR access technologies include high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and access of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low latency (URLLC)).
  • eMBB enhanced mobile broadband
  • mMTC massive machine type communications
  • URLLC ultra-reliable and low latency
  • -latency communications can be supported.
  • the wireless communication module 192 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example.
  • the wireless communication module 192 uses various technologies for securing performance in a high frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. Technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna may be supported.
  • the wireless communication module 192 may support various requirements defined for the electronic device 101, an external electronic device (eg, the electronic device 104), or a network system (eg, the second network 199).
  • the wireless communication module 192 is a peak data rate for eMBB realization (eg, 20 Gbps or more), a loss coverage for mMTC realization (eg, 164 dB or less), or a U-plane latency for URLLC realization (eg, Example: downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip 1 ms or less) may be supported.
  • eMBB peak data rate for eMBB realization
  • a loss coverage for mMTC realization eg, 164 dB or less
  • U-plane latency for URLLC realization eg, Example: downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip 1 ms or less
  • the antenna module 197 may transmit or receive signals or power to the outside (eg, an external electronic device).
  • the antenna module may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (eg, PCB).
  • the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is selected from the plurality of antennas by the communication module 190, for example. can be chosen A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna.
  • other components eg, a radio frequency integrated circuit (RFIC) may be additionally formed as a part of the antenna module 197 in addition to the radiator.
  • RFIC radio frequency integrated circuit
  • the antenna module 197 may form a mmWave antenna module.
  • the mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first surface (eg, a lower surface) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band); and a plurality of antennas (eg, array antennas) disposed on or adjacent to a second surface (eg, a top surface or a side surface) of the printed circuit board and capable of transmitting or receiving signals of the designated high frequency band. can do.
  • peripheral devices eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)
  • signal e.g. commands or data
  • commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 .
  • Each of the external electronic devices 102 or 104 may be the same as or different from the electronic device 101 .
  • all or part of operations executed in the electronic device 101 may be executed in one or more external devices among the external electronic devices 102 , 104 , and 108 .
  • the electronic device 101 when the electronic device 101 needs to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 101 instead of executing the function or service by itself.
  • one or more external electronic devices may be requested to perform the function or at least part of the service.
  • One or more external electronic devices receiving the request may execute at least a part of the requested function or service or an additional function or service related to the request, and deliver the execution result to the electronic device 101 .
  • the electronic device 101 may provide the result as at least part of a response to the request as it is or additionally processed.
  • cloud computing distributed computing, mobile edge computing (MEC), or client-server computing technology may be used.
  • the electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing.
  • the external electronic device 104 may include an internet of things (IoT) device.
  • Server 108 may be an intelligent server using machine learning and/or neural networks. According to one embodiment, the external electronic device 104 or server 108 may be included in the second network 199 .
  • the electronic device 101 may be applied to intelligent services (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.
  • Electronic devices may be devices of various types.
  • the electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance.
  • a portable communication device eg, a smart phone
  • a computer device e.g., a smart phone
  • a portable multimedia device e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a camera e.g., a camera
  • a wearable device e.g., a smart bracelet
  • first, second, or first or secondary may simply be used to distinguish that component from other corresponding components, and may refer to that component in other respects (eg, importance or order) is not limited.
  • a (eg, first) component is said to be “coupled” or “connected” to another (eg, second) component, with or without the terms “functionally” or “communicatively.”
  • the certain component may be connected to the other component directly (eg by wire), wirelessly, or through a third component.
  • module used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as, for example, logic, logical blocks, parts, or circuits.
  • a module may be an integrally constructed component or a minimal unit of components or a portion thereof that performs one or more functions.
  • the module may be implemented in the form of an application-specific integrated circuit (ASIC).
  • ASIC application-specific integrated circuit
  • a storage medium eg, internal memory 136 or external memory 138
  • a machine eg, electronic device 101
  • a processor eg, the processor 120
  • a device eg, the electronic device 101
  • the one or more instructions may include code generated by a compiler or code executable by an interpreter.
  • the device-readable storage medium may be provided in the form of a non-transitory storage medium.
  • the storage medium is a tangible device and does not contain a signal (e.g. electromagnetic wave), and this term refers to the case where data is stored semi-permanently in the storage medium. It does not discriminate when it is temporarily stored.
  • a signal e.g. electromagnetic wave
  • the method according to various embodiments disclosed in this document may be included and provided in a computer program product.
  • Computer program products may be traded between sellers and buyers as commodities.
  • a computer program product is distributed in the form of a device-readable storage medium (e.g. compact disc read only memory (CD-ROM)), or through an application store (e.g. Play Store TM ) or on two user devices (e.g. It can be distributed (eg downloaded or uploaded) online, directly between smart phones.
  • a device e.g. compact disc read only memory (CD-ROM)
  • an application store e.g. Play Store TM
  • It can be distributed (eg downloaded or uploaded) online, directly between smart phones.
  • at least part of the computer program product may be temporarily stored or temporarily created in a storage medium readable by a device such as a manufacturer's server, an application store server, or a relay server's memory.
  • each component (eg, module or program) of the above-described components may include a single object or a plurality of entities, and some of the plurality of entities may be separately disposed in other components. there is.
  • one or more components or operations among the aforementioned corresponding components may be omitted, or one or more other components or operations may be added.
  • a plurality of components eg modules or programs
  • the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by a corresponding component of the plurality of components prior to the integration. .
  • the actions performed by a module, program, or other component are executed sequentially, in parallel, iteratively, or heuristically, or one or more of the actions are executed in a different order, or omitted. or one or more other actions may be added.
  • FIG. 2 is a front perspective view of an electronic device according to various embodiments of the present disclosure.
  • 3 is a rear perspective view of an electronic device according to various embodiments of the present disclosure;
  • the electronic device 101 has a front side 310A, a back side 310B, and a side surface 310C surrounding a space between the front side 310A and the back side 310B. It may include a housing 310 including a). In another embodiment (not shown), the housing 310 may refer to a structure forming some of the front face 310A of FIG. 2 , the rear face 310B and the side face 310C of FIG. 3 . According to one embodiment, the front surface 310A may be formed by a front plate 302 (eg, a glass plate or a polymer plate including various coating layers) that is substantially transparent at least in part.
  • a front plate 302 eg, a glass plate or a polymer plate including various coating layers
  • the rear surface 310B may be formed by the rear plate 311 .
  • the rear plate 311 may be formed of, for example, glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials.
  • the side surface 310C may be formed by a side bezel structure (or "side member") 318 coupled to the front plate 302 and the rear plate 311 and including metal and/or polymer.
  • the back plate 311 and the side bezel structure 318 may be integrally formed and include the same material (eg, glass, a metal material such as aluminum, or ceramic).
  • the front plate 302 includes two first edge regions 310D curved from the front surface 310A toward the rear plate 311 and extending seamlessly, the front plate ( 302) at both ends of the long edge.
  • the rear plate 311 has two second edge regions 310E that are curved from the rear surface 310B toward the front plate 302 and extend seamlessly at both ends of the long edges.
  • the front plate 302 (or the rear plate 311) may include only one of the first edge regions 310D (or the second edge regions 310E). In another embodiment, some of the first edge regions 310D or the second edge regions 310E may not be included.
  • the side bezel structure 318 when viewed from the side of the electronic device 101, has a side that does not include the first edge areas 310D or the second edge areas 310E.
  • a side surface may have a first thickness (or width), and a side surface including the first edge regions 310D or the second edge regions 310E may have a second thickness smaller than the first thickness.
  • the electronic device 101 includes a display 301, audio modules 303, 307, and 314 (eg, the audio module 170 of FIG. 1), and a sensor module (eg, the sensor module of FIG. 1 ). (176)), camera modules 305, 312, 313 (eg, camera module 180 of FIG. 1), a key input device 317 (eg, input module 150 of FIG. 1), and a connector hole ( 308 and 309) (eg, the connection terminal 178 of FIG. 1).
  • the electronic device 101 may omit at least one of the components (eg, the connector hole 309) or may additionally include other components.
  • the display 301 may be visually exposed, for example, through a substantial portion of the front plate 302 .
  • at least a portion of the display 301 may be exposed through the front plate 302 forming the front surface 310A and the first edge regions 310D.
  • a corner of the display 301 may be substantially identical to an adjacent outer shape of the front plate 302 .
  • the distance between the outer edge of the display 301 and the outer edge of the front plate 302 may be substantially the same.
  • the surface of the housing 310 may include a screen display area formed as the display 301 is visually exposed.
  • the screen display area may include a front surface 310A and first edge areas 310D.
  • a recess or an opening is formed in a portion of a screen display area (eg, the front surface 310A and the first edge area 310D) of the display 301, and the recess Alternatively, at least one of an audio module 314, a sensor module (not shown), a light emitting device (not shown), and a camera module 305 aligned with the opening may be included.
  • an audio module 314, a sensor module (not shown), a camera module 305, a fingerprint sensor (not shown), and a light emitting element (not shown) may include at least one or more.
  • the display 301 is coupled to or adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer that detects a magnetic stylus pen. can be placed.
  • a touch sensing circuit capable of measuring the intensity (pressure) of a touch
  • a digitizer capable of measuring the intensity (pressure) of a touch
  • a digitizer that detects a magnetic stylus pen.
  • at least a portion of the key input device 317 may be disposed in the first edge areas 310D and/or the second edge areas 310E.
  • the audio modules 303 , 307 , and 314 may include, for example, a microphone hole 303 and speaker holes 307 and 314 .
  • a microphone for acquiring external sound may be disposed inside the microphone hole 303, and in some embodiments, a plurality of microphones may be disposed to detect the direction of sound.
  • the speaker holes 307 and 314 may include an external speaker hole 307 and a receiver hole 314 for communication.
  • the speaker holes 307 and 314 and the microphone hole 303 may be implemented as one hole, or a speaker may be included without the speaker holes 307 and 314 (eg, a piezo speaker).
  • the audio modules 303 , 307 , and 314 are not limited to the above structure, and may be variously designed depending on the structure of the electronic device 101, such as mounting only some audio modules or adding new audio modules.
  • the sensor module may generate an electrical signal or data value corresponding to an internal operating state of the electronic device 101 or an external environmental state.
  • the sensor module may include, for example, a first sensor module (eg, a proximity sensor) and/or a second sensor module (eg, a fingerprint sensor) disposed on the front surface 310A of the housing 310, and/or Alternatively, a third sensor module (eg, HRM sensor) and/or a fourth sensor module (eg, fingerprint sensor) disposed on the rear surface 310B of the housing 310 may be included.
  • the fingerprint sensor may be disposed on the rear surface 310B as well as the front surface 310A (eg, the display 301 ) of the housing 310 .
  • the electronic device 101 includes a sensor module (not shown), for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, At least one of a humidity sensor and an illuminance sensor may be further included.
  • the sensor module is not limited to the above structure, and depending on the structure of the electronic device 101, the design may be variously changed, such as mounting only some sensor modules or adding a new sensor module.
  • the camera modules 305, 312, and 313 are, for example, a front camera module 305 disposed on the front side 310A of the electronic device 101, and a rear side disposed on the rear side 310B.
  • a camera module 312 and/or a flash 313 may be included.
  • the camera modules 305 and 312 may include one or a plurality of lenses, an image sensor, and/or an image signal processor.
  • the flash 313 may include, for example, a light emitting diode or a xenon lamp.
  • two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one side of electronic device 101 .
  • the camera modules 305 , 312 , and 313 are not limited to the above structure, and may be variously designed depending on the structure of the electronic device 101, such as mounting only some camera modules or adding new camera modules.
  • the electronic device 101 may include a plurality of camera modules (eg, a dual camera or a triple camera) each having a different property (eg, angle of view) or function.
  • a plurality of camera modules 305 and 312 including lenses having different angles of view may be configured, and the electronic device 101 is a camera that is performed in the electronic device 101 based on a user's selection. It is possible to control the viewing angles of the modules 305 and 312 to be changed.
  • at least one of the plurality of camera modules 305 and 312 may be a wide-angle camera and at least the other may be a telephoto camera.
  • the plurality of camera modules 305 and 312 may be a front camera, and at least another one may be a rear camera.
  • the plurality of camera modules 305 and 312 may include at least one of a wide-angle camera, a telephoto camera, or an infrared (IR) camera (eg, a time of flight (TOF) camera or a structured light camera).
  • IR infrared
  • TOF time of flight
  • the IR camera may operate as at least a part of the sensor module.
  • the TOF camera may operate as at least a part of a sensor module (not shown) for detecting a distance to a subject.
  • the key input device 317 may be disposed on the side surface 310C of the housing 310 .
  • the electronic device 101 may not include some or all of the above-mentioned key input devices 317, and the key input devices 317 that are not included are on the display 301, such as soft keys. It can be implemented in different forms.
  • the key input device may include a sensor module 316 disposed on the second side 310B of the housing 310 .
  • a light emitting device may be disposed on, for example, the front surface 310A of the housing 310 .
  • a light emitting element (not shown) may provide, for example, state information of the electronic device 101 in the form of light.
  • a light emitting device may provide a light source that interlocks with the operation of the front camera module 305, for example.
  • the light emitting device may include, for example, an LED, an IR LED, and/or a xenon lamp.
  • the connector holes 308 and 309 are, for example, a first connector hole capable of receiving a connector (eg, a USB connector) for transmitting and receiving power and/or data to and from an external electronic device.
  • a connector eg, a USB connector
  • a second connector hole eg, earphone jack
  • the camera module 305 of the camera modules 305 and 312 and/or some of the sensor modules are exposed to the outside through at least a portion of the display 301.
  • the camera module 305 may include a punch hole camera disposed inside a hole or recess formed on the rear surface of the display 301 .
  • the camera module 312 may be disposed inside the housing 310 such that the lens is exposed to the second surface 310B of the electronic device 101 .
  • the camera module 312 may be disposed on a printed circuit board (eg, the printed circuit board 340 of FIG. 4 ).
  • the camera module 305 and/or the sensor module may be in contact with the external environment through a transparent area from the internal space of the electronic device 101 to the front plate 302 of the display 301. can be placed. Also, some sensor modules 304 may be arranged to perform their functions without being visually exposed through the front plate 302 in the internal space of the electronic device.
  • FIG. 4 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure.
  • an electronic device 101 (eg, the electronic device 101 of FIGS. 1 to 3 ) according to various embodiments includes a support bracket 370 and a front plate 320 (eg, the electronic device 101 of FIG. 2 ).
  • front plate 302 includes display module 330 (eg display 301 of FIG. 2), printed circuit board 340 (eg PCB, flexible PCB (FPCB), or rigid flexible PCB (RFPCB)), Battery 350 (eg, battery 189 in FIG. 1), second support member 360 (eg, rear structure), antenna (not shown) (eg, antenna module 197 in FIG. 1), and rear plate 380 (eg, back plate 311 of FIG. 2 ).
  • display module 330 eg display 301 of FIG. 2
  • printed circuit board 340 eg PCB, flexible PCB (FPCB), or rigid flexible PCB (RFPCB)
  • Battery 350 eg, battery 189 in FIG. 1
  • second support member 360 eg, rear structure
  • antenna not shown
  • the electronic device 101 may further include a camera module 312 including a camera assembly 312a and a camera decoration 315 , a fixing member 410 , and a conductive member 420 .
  • the support bracket 370 of the electronic device 101 may include a side bezel structure 371 (eg, the side bezel structure 318 of FIG. 2 ) and a first support member 372 . there is.
  • the electronic device 101 may omit at least one of the components (eg, the first support member 372 or the second support member 360) or may additionally include other components. . At least one of the components of the electronic device 101 may be the same as or similar to at least one of the components of the electronic device 101 of FIG. 2 or 3 , and duplicate descriptions are omitted below.
  • the first support member 372 may be disposed inside the electronic device 101 and connected to the side bezel structure 371 or integrally formed with the side bezel structure 371 .
  • the first support member 372 may be formed of, for example, a metal material and/or a non-metal (eg, polymer) material.
  • the display module 330 may be coupled to one surface of the first support member 372 and the printed circuit board 340 may be coupled to the other surface.
  • a processor, a memory, and/or an interface may be mounted on the printed circuit board 340 .
  • the processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.
  • the printed circuit board 340 may include a flexible printed circuit board type radio frequency cable (FRC).
  • FRC radio frequency cable
  • the printed circuit board 340 may be disposed on at least a portion of the first support member 372, an antenna module (eg, the antenna module 197 of FIG. 1) and a communication module (eg, the antenna module 197 of FIG. 1). It may be electrically connected to the communication module 190).
  • the memory may include, for example, volatile memory or non-volatile memory.
  • the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • the interface may electrically or physically connect the electronic device 101 to an external electronic device, and may include a USB connector, an SD card/MMC connector, or an audio connector.
  • the battery 350 is a device for supplying power to at least one component of the electronic device 101, and is, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel.
  • a battery may be included. At least a portion of the battery 350 may be disposed on a substantially coplanar surface with the printed circuit board 340 , for example.
  • the battery 350 may be integrally disposed inside the electronic device 101 or may be disposed detachably from the electronic device 101 .
  • the second support member 360 (eg, a rear structure) may be disposed between the printed circuit board 340 and the antenna.
  • the second support member 360 may include one surface to which at least one of the printed circuit board 340 or the battery 350 is coupled and the other surface to which the antenna is coupled.
  • the antenna 390 may be disposed between the rear plate 380 and the battery 350 .
  • the antenna may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna.
  • NFC near field communication
  • MST magnetic secure transmission
  • the antenna may, for example, perform short-range communication with an external device or wirelessly transmit/receive power required for charging.
  • an antenna structure may be formed by a part of the side bezel structure 371 and/or the first support member 372 or a combination thereof.
  • the rear plate 380 may form at least a part of the rear surface (eg, the second surface 310B of FIG. 3 ) of the electronic device 101 .
  • 5 is an exploded perspective view illustrating an acoustic assembly and surrounding structures thereof according to various embodiments of the present disclosure.
  • 6 is a projected view illustrating an acoustic assembly disposed on a rear bracket when viewed from the front of an electronic device according to various embodiments of the present disclosure;
  • 7 is a cross-sectional view illustrating an acoustic assembly and surrounding structures thereof, according to various embodiments of the present disclosure.
  • an electronic device may include a rear plate 380 , a front bracket 410 , a rear bracket 420 , and a sound assembly 430 .
  • the structures of the rear plate 380, the front bracket 410, and the rear bracket 420 of FIGS. 5 to 7 are the rear plate 380, the support bracket 370, and the second support member 360 of FIG. (e.g. rear structure) may be partially or entirely identical to the structure of the rear structure.
  • the sound assembly 430 of FIGS. 5 to 7 may be partially or entirely the same as the sound output device 155 or the audio module 170 of FIG. 1 .
  • the acoustic assembly 430 includes an acoustic component 431, a circuit board 432, an acoustic component cover 500, a sealing member 433, an adhesive member 434, and a gasket 435. can do.
  • the acoustic component 431 may be at least one of a microphone and a speaker.
  • the acoustic component 431 may be located in the inner space S formed by the front bracket 410 and the rear bracket 420 .
  • at least a portion of the circuit board 432 is positioned in the inner space S, and the acoustic component 431 is on one surface of the circuit board 432 (eg, one surface of the circuit board 432 facing the +Z-axis direction). ) can be placed.
  • the circuit board 432 may include a first sound hole 432a in an area corresponding to the position of the sound component 431 .
  • the first sound hole 432a may be formed to pass through the circuit board 432, and thus, the sound generated from the sound component 431 passes through the first sound hole 432a, under the sound component 431 ( For example, it may be transmitted to the acoustic conduit 590 disposed in the -Z-axis direction).
  • the circuit board 432 may be a separate board for electrically connecting the main printed circuit board (eg, the printed circuit board 340 of FIG. 4 ) and the acoustic component 431 .
  • the circuit board 432 may be a main printed circuit board (eg, the printed circuit board 340 of FIG. 4 ) on which a processor is mounted.
  • the acoustic component cover 500 is located in the inner space S formed by the front bracket 410 and the rear bracket 420, partially covers the acoustic component 431, and the acoustic component 431 ) can provide a conduit through which the sound generated in
  • the acoustic component cover 500 may be formed of an elastic material such as rubber.
  • the acoustic component cover 500 made of an elastic material can flexibly respond to dimensional tolerances considered during assembly due to its compression characteristics.
  • the acoustic part cover 500 may be formed of an injection material such as plastic.
  • the acoustic component cover 500 made of an injection material may provide dimensional stability during assembly and improved adhesion to an adhesive member compared to the acoustic component cover 500 made of an elastic material.
  • the acoustic component cover 500 corresponds to a first surface 510 facing the front bracket 410, a second surface 520 facing the rear bracket 420, and a first sound hole 432a. It may include a second sound hole 530 formed to be.
  • the first surface 510 may be one surface facing the +Z axis
  • the second surface 520 may be formed as one surface facing the -Z axis.
  • the first surface 510 of the acoustic component cover 500 includes a first area 511 facing the circuit board 432 and a second area 512 adjacent to the first area 511.
  • the first region 511 of the first surface 510 may be connected to the circuit board 432 through the first sealing member 433a.
  • the first sealing member 433a may seal between the first surface 510 of the acoustic component cover 500 and the circuit board 432 .
  • the first sealing member 433a may be disposed between the first surface 510 of the acoustic component cover 500 and the circuit board 432 in a non-adhesive state.
  • the first sealing member 433a may include an elastic material.
  • the first sealing member 433a may restrict or reduce leakage of sound generated from the acoustic component 431 to a path other than a designated section. In addition, the first sealing member 433a may seal foreign substances such as fluid from flowing into the acoustic component 431 .
  • the second area 512 of the first surface 510 may directly face a portion of the front bracket 410 .
  • the second area 512 of the first surface 510 may be connected to a portion of the front bracket 410 through the second sealing member 433b.
  • the second sealing member 433b may seal between the first surface 510 of the acoustic component cover 500 and the front bracket 410 .
  • the second sealing member 433b may be disposed between the first surface 510 of the acoustic component cover 500 and the front bracket 410 in a non-adhesive state.
  • the second sealing member 433b may include an elastic material.
  • the second sealing member 433b may limit or reduce leakage of sound generated from the acoustic component 431 to a path other than a designated section.
  • the second sealing member 433b may seal foreign substances such as fluid from flowing into the inner space S in which the acoustic component 431 is mounted.
  • the first surface 510 of the acoustic component cover 500 may be implemented in a stepped shape.
  • the first surface 510 of the acoustic component cover 500 may include a first area 511 and a second area 512 having different heights. Based on the flat part of the rear plate 380 (or rear bracket 420), the first area 511 forms the 1-1st height, and the second area 512 forms the 1-2nd height. The 1-2 height may be greater than the 1-1 height.
  • the second surface 520 of the acoustic component cover 500 may form an opposite surface to the first surface 510 and may be disposed to adhere to the rear bracket 420 along an edge portion.
  • the acoustic component cover 500 may be adhered to a portion of the rear bracket 420 by an adhesive member 434 having a closed loop shape disposed along the edge portion of the second surface 520.
  • the closed loop shape of the adhesive member 434 is just one example, and the design can be changed into various shapes for fixing the second surface 520 of the acoustic part cover 500 on the rear bracket 420.
  • the second surface 520 of the acoustic component cover 500 may be implemented as an inclined surface.
  • the second surface 520 may have a designated slope so as to gradually approach the back plate 380 from an outer direction to an inner direction of the electronic device 101 .
  • the second surface 520 of the acoustic component cover 500 includes a first end 521 facing the inside of the electronic device 101 and a second end facing the outside of the electronic device 101. 522, the first end 521 may form a 2-1 height, and the second end 522 may form a 2-2 height based on the flat portion of the back plate 380. And, the height of the 2-2 may be greater than the height of the 2-1.
  • the first end 521 of the second surface 520 may form a surface (eg, an opposite surface) opposite to the first region 511 of the first surface 510
  • the second end 522 may form a surface (eg, an opposite surface) opposite to the second region 512 of the first surface 510
  • the first end 521 and the second end 522 of the second surface 520 are portions of an edge portion of the second surface 520 and may be a portion where a portion of the adhesive member 434 is disposed.
  • the second sound hole 530 of the acoustic component cover 500 is formed at a position corresponding to the first sound hole 432a of the circuit board 432 and has a corresponding size (eg, diameter). It can be.
  • the second sound hole 530 may be formed to pass through a portion of the sound component cover 500 .
  • the second sound hole 530 is formed in one area of the first area 511 of the first surface 510 and penetrates the first end 521 of the second surface 520 and the adjacent area.
  • the sound generated from the acoustic component 431 passes through the first sound hole 432a and the second sound hole 530, and the second surface 520 of the acoustic component cover 500 and the rear bracket 420 It can be transmitted to the acoustic conduit 590 formed by the.
  • gaskets 435 may be disposed in the first sound hole 432a and the second sound hole 530 and the surrounding area.
  • the gasket 435 is disposed between the first sound hole 432a and the second sound hole 530 and may include an opening through which air passes.
  • the gasket 435 may provide a waterproof function capable of blocking external fluid or foreign substances.
  • the gasket 435 is disposed on a passage through which sound of the acoustic component 431 passes, and may include a material such as Gore-tex.
  • the gasket 435 is a thin film, and an adhesive member may be disposed on the front or rear surface to be fixedly disposed on the seating surface (eg, the first region 511 of the first surface 510) of the acoustic component cover 500. there is.
  • the acoustic assembly 430 may be located in the inner space S formed by the front bracket 410 and the rear bracket 420 .
  • a sealing member eg, first and second The sealing members 433a and 433b
  • the circuit board 432, and the acoustic component 431 may be positioned, and an adhesive member 434 is provided under the acoustic component cover 500 (eg, in the -Z-axis direction).
  • a sound conduit 590 may be located.
  • the rear bracket 420 may include a through hole 420a connected to the outside of the electronic device 101 .
  • the through hole 420a may be a passage through which sound generated from the acoustic component 431 is transmitted to the outside or externally generated sound is transmitted to the acoustic component 431 .
  • an adhesive member 434 is disposed along the edge of the second surface 520 (eg, the surface facing the -Z axis) of the acoustic component cover 500 to be fixed to the rear bracket 420.
  • the rear bracket 420 may include a first portion 421 formed in an area corresponding to the first end 521 of the second surface 520 .
  • the first part 421 may be provided in the shape of an inclined surface corresponding to the first end 521 forming the inclined surface, and in the shape of a groove (eg, a groove having an inclination) so that the first end 521 can be seated therein. can be provided.
  • the rear bracket 420 may include a second part 422 formed in an area corresponding to the second end 522 of the second surface 520 .
  • the second portion 422 may be provided in an inclined surface shape corresponding to the second end portion 522 forming an inclined surface, an upper surface supporting the acoustic part cover 500, and a lower surface supporting a portion of the through hole 420a.
  • the second surface 520 of the acoustic component cover 500 and the rear bracket 420 may form an acoustic conduit 590 toward the through hole 420a.
  • the sound generated by the acoustic component 431 may pass through the first sound hole 432a of the circuit board 432 and the second sound hole 530 of the acoustic component cover 500, and may be transferred to the sound pipe 590. there is.
  • the sound moving along the sound conduit 590 may pass through the through hole 420a to the outside.
  • the acoustic component cover 500 is located between the front bracket 410 and the rear bracket 420, adheres to the rear bracket 420, and is disposed to be pressed by the front bracket 410. , lifting in the electronic device 101 can be prevented and eumsaem can be limited.
  • the second sealing member 433b is disposed, and the second area 512 ) and the second sealing member 433b as the front bracket 410 presses, the acoustic part cover 500 may be stably fixed in the inner space S.
  • a compressible material may be used as the second sealing member 433b to prevent the acoustic part cover 500 from floating.
  • FIG. 8 is a perspective view illustrating a structure in which an acoustic component cover is mounted on a rear bracket according to various embodiments of the present disclosure.
  • 9A is a front view of an acoustic component cover according to various embodiments of the present disclosure.
  • 9B is a rear view of an acoustic component cover according to various embodiments of the present disclosure.
  • FIG. 9C is a cross-sectional view of the acoustic component cover of FIG. 9A according to various embodiments of the present disclosure taken along the line AA'.
  • 9D is a side view of an acoustic component cover according to various embodiments of the present disclosure.
  • an electronic device (eg, the electronic device 101 of FIGS. 1 to 4 ) is disposed between a front bracket (eg, the front bracket 410 of FIGS. 5 to 7 ) and a rear bracket 420 It may include an acoustic assembly (eg, the acoustic assembly 430 of FIGS. 5 to 7 ).
  • the acoustic component 430 may include an acoustic component (eg, the acoustic component 431 of FIGS. 5 to 7 ) and an acoustic component cover 500 covering at least a portion of the acoustic component 431 and forming an acoustic pipe.
  • the structures of the rear bracket 420 and the sound assembly 430 of FIGS. 8, 9a, 9b, 9c, and 9d are similar to the rear bracket 420 and the sound assembly 430 of FIGS. 5 to 7 It may be partially or entirely identical to the structure of
  • the acoustic component cover 500 may be fitted into the recess 425 of the rear bracket 420 .
  • the second surface 520 of the acoustic component cover 500 may be fixed to the recess 425 of the rear bracket 420 by an adhesive member 434 .
  • a portion of the acoustic component cover 500 (eg, the first cover portion 500a) may be inserted into the recess 425.
  • the acoustic component cover 500 may include a first cover part 500a and a second cover part 500b extending from the first cover part 500a.
  • the first cover part 500a and the second cover part 500b may be integrally formed.
  • the first cover part 500a may be disposed toward the inside of the electronic device 101, and the second cover part 500b may be disposed toward the outside of the electronic device 101.
  • the surface of the first cover part 500a facing the +Z-axis direction and the surface of the second cover part 500b facing the +Z-axis direction are inserted into the recess 425, they may form different heights. there is.
  • the surface facing the +Z-axis direction of the first cover part 500a has a stepped shape with respect to the surface of the second cover part 500b facing the +Z-axis direction.
  • the height of the surface facing the +Z-axis direction may be relatively higher than the surface of the first cover portion 500a facing the +Z-axis direction.
  • the surface facing the -Z-axis direction of the first cover part 500a and the surface facing the -Z-axis direction of the second cover part 500b form one surface that forms a specified inclination with respect to the surfaces facing the +Z-axis direction. can be formed as
  • the first surface 510 formed in a stepped shape is compared with the first area 511 and the first area 511 .
  • a relatively high second region 512 may be included.
  • the first region 511 may be a surface of the first cover part 500a facing the +Z-axis direction
  • the second region 512 may be the surface of the second cover part 500b facing the +Z-axis direction. It can be cotton.
  • a second sound hole 530 through which sound of the sound component 431 passes may be formed in the first area 511 .
  • the first sealing member 433a disposed on the first region 511 may be formed to cover at least a portion of the second sound hole 530 so as not to cover the second sound hole 530 .
  • the first sealing member 433a may be manufactured in a closed loop shape.
  • the first sealing member 433a may be made of a compressible material such as a sponge for stable sealing when pressed by a circuit board (eg, the circuit board 432 of FIG. 7 ).
  • the second sealing member 433b disposed on the second region 512 is disposed to substantially cover the entire second region 512, and when pressed by the front bracket 410, It may be made of a compressible material such as a sponge for sealing.
  • the second surface 520 forming an inclined surface is a second sound hole through which the sound of the acoustic component 431 passes. (530) may be formed.
  • An adhesive member 434 having a closed loop shape is disposed at an edge of the second surface 520 to fix the acoustic part cover 500 to the rear bracket 420 .
  • FIG. 10 is a perspective view illustrating an acoustic assembly disposed in an electronic device and surrounding structures thereof according to various embodiments of the present disclosure.
  • FIG. 11 is a cross-sectional view of a portion of the electronic device of FIG. 10 taken along line BB' according to various embodiments of the present disclosure.
  • an electronic device may include a front bracket 410 , a rear bracket 420 , a sound assembly 430 , and a fixing member 610 .
  • the acoustic component 430 may include an acoustic component (eg, the acoustic component 431 of FIG. 7 ), an acoustic component cover 500 , a sealing member 433 , and an adhesive member 434 .
  • the structures of the front bracket 410, the rear bracket 420, and the acoustic assembly 430 of FIGS. 10 and 11 are the front bracket 410, the rear bracket 420, and the acoustic assembly of FIGS. 5 to 7 ( 430) may be partially or entirely identical to the structure.
  • 10 is a projection view of the electronic device 101 viewed from the rear side.
  • the acoustic assembly 430 may be positioned within the inner space S formed by the front bracket 410 and the rear bracket 420 .
  • the acoustic component cover 500 may be disposed between the front bracket 410 and the rear bracket 420, partially cover the acoustic component 431, and provide a passage through which sound generated from the acoustic component 431 passes. .
  • the fixing member 610 may be disposed adjacent to the acoustic assembly 430 .
  • the fixing member 610 is disposed adjacent to the acoustic component cover 500 of the acoustic assembly 430, and strongly couples the front bracket 410 and the rear bracket 420 so that the front bracket 410 and the rear bracket 410
  • the acoustic component cover 500 (and/or the adhesive member 434) disposed between the brackets 420 may limit leakage of sound generated from the acoustic component 431 without floating with surrounding structures.
  • the front bracket 410 and the rear bracket 420 may be formed with openings and/or holes.
  • the fixing member 610 may be a component such as a screw
  • the front bracket 410 may form a threaded groove corresponding to the screw
  • the rear bracket 420 may form a groove corresponding to the screw. It is possible to form a through hole formed with a thread corresponding to the.
  • the fixing member 610 may be formed to penetrate the rear bracket 420 and the circuit board 432 mounted between the rear brackets 420, and the circuit board 432 may be formed to penetrate the fixing member 610. ) may be formed.
  • FIG. 12 is a perspective view illustrating an acoustic assembly disposed in an electronic device and surrounding structures thereof according to various embodiments of the present disclosure.
  • FIG. 13 is a cross-sectional view of a portion of the electronic device of FIG. 12 taken along the line C-C′ according to various embodiments of the present disclosure.
  • an electronic device may include a front bracket 410 , a rear bracket 420 , and an acoustic assembly 430 .
  • the acoustic component 430 may include an acoustic component (eg, the acoustic component 431 of FIG. 7 ) and an acoustic component cover 500 .
  • the structures of the front bracket 410, the rear bracket 420, and the acoustic assembly 430 of FIGS. 12 and 13 are the front bracket 410, the rear bracket 420, and the acoustic assembly of FIGS. 5 to 7 ( 430) may be partially or entirely identical to the structure.
  • the acoustic component cover 500 is located in an inner space formed by the front bracket 410 and the rear bracket 420, partially covers the acoustic component 431, and generates noise from the acoustic component 431.
  • a conduit through which sound passes may be provided.
  • the front bracket 410 and the rear bracket 420 may include coupling portions 620 for coupling with each other.
  • the coupling portions 620 are disposed adjacent to the acoustic part cover 500 of the acoustic assembly 430, and strongly couple the front bracket 410 and the rear bracket 420 to form the front bracket 410 and the rear bracket 420.
  • the acoustic component cover 500 (and/or the adhesive member 434) disposed therebetween may limit leakage of sound generated from the acoustic component 431 without floating with surrounding structures.
  • the coupling portions 620 may be formed in one region of the front bracket 410 and one region corresponding to the one region of the rear bracket 420 so as to be fitted to each other.
  • the coupling portion of the rear bracket 420 when the coupling portion of the rear bracket 420 is provided as a hook-shaped protruding structure 428, the coupling portion of the front bracket 410 may be formed as a concave structure 418 that can be fitted with the hook shape. there is.
  • the coupling portion of the front bracket 410 is provided in a hook-shaped protruding structure
  • the coupling portion of the rear bracket 420 may be formed in a concave structure capable of being fitted with the hook shape.
  • the coupling portion of the front bracket 410 and the coupling portion of the rear bracket 420 may each be formed in plurality.
  • the coupling portion of the front bracket 410 and the coupling portion of the rear bracket 420 may be spaced apart from each other with the acoustic part cover 500 interposed therebetween.
  • 14 is a cross-sectional view illustrating an acoustic assembly and surrounding structures thereof, according to various embodiments of the present disclosure.
  • 15 is a perspective view illustrating an acoustic assembly disposed in one area of a front bracket according to various embodiments of the present disclosure;
  • an electronic device may include a rear plate 380 , a front bracket 410 , a rear bracket 420 , and a sound assembly 430 .
  • the structure of the rear plate 380, the front bracket 410, the rear bracket 420 and the sound assembly 430 of FIGS. 14 and 15 includes the rear plate 380, the front bracket 410 of FIGS. 5 to 7, Some or all of the structures of the rear bracket 420 and the sound assembly 430 may be the same.
  • the acoustic assembly 430 may be positioned within the inner space S formed by the front bracket 410 and the rear bracket 420 .
  • the acoustic component 430 may include an acoustic component 431 , a circuit board 432 , an acoustic component cover 500 , a sealing member 433 , an adhesive member 434 , and a gasket 435 .
  • configurations different from those of the acoustic assembly 430 of FIGS. 5 to 7 will be mainly described.
  • the acoustic component 431 may be at least one of a microphone and a speaker.
  • the acoustic component 431 may be located in the recess 437 formed in the rear bracket 420 in the inner space S.
  • at least a portion of the circuit board 432 is positioned in the inner space S, and the acoustic component 431 is disposed on one surface of the circuit board 432 (eg, one surface of the circuit board 432 facing the -Z-axis direction). ) can be placed.
  • the circuit board 432 may include a first sound hole 432a in an area corresponding to the position of the sound component 431 .
  • the first sound hole 432a may be formed to pass through the circuit board 432, and thus, the sound generated from the sound component 431 passes through the first sound hole 432a and is placed on the sound component 431 ( For example, it may be transmitted to the sound pipe (eg, the first pipe 591) disposed in the +Z-axis direction).
  • the acoustic component cover 500 is located between the front bracket 410 and the rear bracket 420, partially covers the acoustic component 431, and allows sound generated from the acoustic component 431 to pass through.
  • conduit can be provided.
  • the acoustic component cover 500 may be implemented in a plate shape.
  • the acoustic part cover 500 has a first surface 510 facing the rear bracket 420, a second surface 520 facing the front bracket 410, and a second sound hole formed to correspond to the first sound hole 432a. (530).
  • the first surface 510 may be one surface facing the -Z axis
  • the second surface 520 may be formed as one surface facing the +Z axis.
  • the first surface 510 of the acoustic component cover 500 includes a first area 511 facing the circuit board 432 and a second area 512 adjacent to the first area 511.
  • the first region 511 of the first surface 510 may be connected to the circuit board 432 through the first sealing member 433a.
  • the first sealing member 433a may seal between the first surface 510 of the acoustic component cover 500 and the circuit board 432 .
  • the first sealing member 433a may be disposed between the first surface 510 of the acoustic component cover 500 and the circuit board 432 in a non-adhesive state.
  • the first sealing member 433a may include an elastic material.
  • the second area 512 of the first surface 510 may directly face a portion of the rear bracket 420 .
  • the second region 512 of the first surface 510 may be connected to a portion of the rear bracket 420 through a second sealing member (not shown).
  • the second sealing member may seal between the first surface 510 of the acoustic component cover 500 and the rear bracket 420 .
  • the second sealing member may be disposed between the first surface 510 of the acoustic component cover 500 and the front bracket 410 in a non-adhesive state.
  • the second surface 520 of the acoustic component cover 500 forms an opposite surface to the first surface 510 and may be formed as a flat surface.
  • the second surface 520 of the acoustic component cover 500 may be disposed to be adhered to the front bracket 410 along an edge portion.
  • a portion of the front bracket 410 may be adhered to by an adhesive member 434 having a closed loop shape disposed along an edge portion of the second surface 520 .
  • a plurality of second sound holes 530 of the acoustic part cover 500 may be provided.
  • the 2-1st sound hole 530a of the acoustic component cover 500 may be formed at a position corresponding to the first sound hole 432a of the circuit board 432 and in a size corresponding to that.
  • the second sound hole 530 may be formed to pass through one area of the sound component cover 500 .
  • the 2-2 sound hole 530b of the acoustic component cover 500 has a size corresponding to that of the 2-1 sound hole 530a of the circuit board 432 and may be positioned adjacent to the through-hole 420a. .
  • the 2-2 sound hole 530b may be formed to pass through one area of the acoustic component cover 500 .
  • the sound generated by the acoustic part 431 passes through the first sound hole 432a and the 2-1 sound hole 530a, and the first sound formed by the front bracket 410 and the sound part cover 500 It may pass through the conduit 591 and pass through the 2-2 sound hole 530b.
  • the rear bracket 420 may include a second conduit 592 extending from the 2-2 sound hole 530b and a through hole 420a connected to the outside of the electronic device 101. .
  • the sound passing through the 2-2 sound hole 530b may travel to the outside through the second conduit 592 and the through hole 420a.
  • FIG. 16 is a cross-sectional view illustrating an acoustic assembly and surrounding structures thereof, according to various embodiments of the present disclosure.
  • 17 is an exploded perspective view illustrating an acoustic component cover and a region of a rear bracket in which the acoustic component cover is disposed, according to various embodiments of the present disclosure;
  • FIG. 18 is a cross-sectional view of an acoustic assembly and its surrounding structures taken at a different part from that of FIG. 16 according to various embodiments of the present disclosure.
  • an electronic device may include a rear plate 380 , a front bracket 410 , a rear bracket 420 , and a sound assembly 430 .
  • the structures of the rear plate 380, the front bracket 410, the rear bracket 420 and the sound assembly 430 of FIGS. 16 to 18 include the rear plate 380, the front bracket 410 of FIGS. 5 to 7, Some or all of the structures of the rear bracket 420 and the sound assembly 430 may be the same.
  • the acoustic assembly 430 may be positioned within the inner space S formed by the front bracket 410 and the rear bracket 420 .
  • the acoustic component 430 may include an acoustic component 431 , a circuit board 432 , an acoustic component cover 500 , a sealing member 433 , an adhesive member 434 , and a gasket 435 .
  • configurations different from those of the acoustic assembly 430 of FIGS. 5 to 7 will be mainly described.
  • the circuit board 432 may include a first sound hole 432a in an area corresponding to the position of the sound component 431 .
  • the first sound hole 432a may be formed to pass through the circuit board 432, and thus, the sound generated from the sound component 431 passes through the first sound hole 432a, under the sound component 431 ( For example, it may be transmitted to the acoustic conduit 590 disposed in the -Z-axis direction).
  • the acoustic component cover 500 is located between the front bracket 410 and the rear bracket 420, partially covers the acoustic component 431, and allows sound generated from the acoustic component 431 to pass through. conduits can be provided.
  • the acoustic component cover 500 corresponds to a first surface 510 facing the front bracket 410, a second surface 520 facing the rear bracket 420, and a first sound hole 432a. It may include a second sound hole 530 formed to be.
  • the first surface 510 of the acoustic component cover 500 has a first area 511 facing the circuit board 432 and a second area having a different height from the first area 511. (512).
  • the first region 511 of the first surface 510 may be connected to the circuit board 432 through the first sealing member 433a.
  • the first sealing member 433a may seal between the first surface 510 of the acoustic component cover 500 and the circuit board 432 .
  • the first sealing member 433a may be disposed between the first surface 510 of the acoustic component cover 500 and the circuit board 432 in a non-adhesive state.
  • the second area 512 of the first surface 510 may directly face a portion of the front bracket 410 .
  • the second region 512 of the first surface 510 may have a groove 512a formed in a central portion and an edge portion connected to a portion of the front bracket 410 through a second sealing member 433b.
  • the second sealing member 433b may seal between the first surface 510 of the acoustic component cover 500 and the front bracket 410 .
  • the second sealing member 433b may be disposed between the first surface 510 of the acoustic component cover 500 and the front bracket 410 in a non-adhesive state.
  • at least a portion of the first surface 510 of the acoustic component cover 500 may be implemented in a stepped shape.
  • the second surface 520 of the acoustic component cover 500 may form an opposite surface to the first surface 510 and may be disposed to adhere to the rear bracket 420 along an edge portion.
  • a portion of the rear bracket 420 may be adhered to by an adhesive member 434 having a closed loop shape disposed along an edge portion of the second surface 520 .
  • the second surface 520 of the acoustic component cover 500 may be implemented as an inclined surface.
  • the first surface 523 of the second surface 520 may form a surface opposite to the first area, and may form a flat surface parallel to the first area 511 .
  • the second surface 524 of the second surface 520 may have a designated slope to gradually approach the rear plate 380 from an outer direction to an inner direction of the electronic device 101 .
  • the boundary portion R of the first surface 523 and the second surface 524 of the acoustic component cover 500 is a portion where a straight line and an oblique line meet when viewed in a cross section, and are implemented to form curvatures that smoothly connect to each other.
  • the adhesive member 434 disposed on the second surface 520 of the acoustic component cover 500 can be adhered without lifting due to the boundary portion R forming the curvature.
  • the second sound hole 530 of the acoustic component cover 500 may be formed at a position corresponding to the first sound hole 432a of the circuit board 432 and in a size corresponding to that.
  • gaskets 435 may be disposed in the first sound hole 432a and the second sound hole 530 and the surrounding area.
  • the rear bracket 420 may include a through hole 420a connected to the outside of the electronic device 101 .
  • the through hole 420a may provide a passage through which sound generated from the acoustic component 431 is transferred to the outside or sound generated from the outside is transmitted to the acoustic component 431 .
  • the second surface 520 of the acoustic component cover 500 and the rear bracket 420 may form an acoustic conduit 590 toward the through hole 420a.
  • the acoustic conduit 590 may include a straight conduit formed by the first surface 523 of the second face 520 and an oblique conduit formed by the second surface 524 of the second face 520. .
  • the sound generated by the acoustic component 431 may pass through the first sound hole 432a of the circuit board 432 and the second sound hole 530 of the acoustic component cover 500, and may be transferred to the sound pipe 590. there is.
  • the sound moving along the sound conduit 590 may pass through the through hole 420a to the outside.
  • the acoustic component cover 500 is located between the front bracket 410 and the rear bracket 420, adheres to the rear bracket 420, and is disposed to be pressed by the front bracket 410. , it is possible to prevent lifting in the electronic device 101 and to limit eumsaem.
  • An electronic device (eg, the electronic device 101 of FIGS. 1 to 4 ) according to various embodiments includes a first bracket (eg, 420 of FIG. 7 ) including a through hole (eg, 420a of FIG. 7 ) and the A housing (eg, the housing 310 in FIGS. 2 and 3 ) including a second bracket (eg, 410 in FIG. 7 ) combined with the first bracket to form an inner space (eg, S in FIG. 7 ), and An acoustic assembly (eg, 430 of FIG. 7 ) disposed adjacent to the through hole may be included.
  • the acoustic assembly may include a circuit including an acoustic component (eg, 431 in FIG.
  • the acoustic component cover includes a first surface (eg, 511 in FIG. 7 ) facing the circuit board and a second area (eg, 512 in FIG. 7 ) facing the second bracket.
  • a first surface eg, 511 in FIG. 7
  • a second area eg, 512 in FIG. 7
  • a second sound hole eg, 530 in FIG. 7
  • a second sound hole formed to correspond to may be included.
  • the second surface of the acoustic component cover and one region of the first bracket may form an acoustic conduit (eg, 590 in FIG. 7 ) toward the through hole.
  • At least a portion of the second surface of the acoustic component cover may form an inclined surface.
  • the first area of the first surface of the acoustic component cover is connected to the circuit board through a first sealing member (eg, 433a of FIG. 7 ), and the first area of the acoustic component cover is connected to the circuit board.
  • the second region of one surface may be connected to the second bracket through a second sealing member (eg, 433b in FIG. 7 ).
  • the acoustic component cover is disposed between the first bracket and the second bracket, and the second surface of the acoustic component cover is adhered to at least a part of the first bracket, and the acoustic component cover is attached to the acoustic component cover.
  • the second region of the first surface of the part cover may be arranged to be pressed by the second bracket.
  • the first surface of the acoustic component cover may include a stepped shape.
  • the first area forms a first height based on a flat portion of the first bracket
  • the second area forms a first height based on a flat portion of the first bracket.
  • a second height may be formed based on the portion, and the second height may be greater than the first height.
  • the second surface of the acoustic component cover may include a first end (eg, 521 of FIG. 7 ) facing the inside of the electronic device and a second end (eg, 521 of FIG. 7 ) facing the outside of the electronic device. : 522 of FIG. 7 ), and an inclined surface gradually away from the second bracket may be formed from the second end toward the first end.
  • an adhesive member (eg, 434 in FIG. 7 ) is disposed on the first end and the second end of the second surface of the acoustic component cover, so that the acoustic component cover is attached to the first bracket. It may be fixed to at least some areas.
  • the at least partial area of the first bracket is a groove-shaped first part (eg, 421 in FIG. 7 ) in which the first end portion can be seated, and an inclined surface corresponding to the second end portion. It may include a second part (eg, 422 of FIG. 7 ) formed.
  • the sound generated by the acoustic component passes through the first sound hole of the circuit board and the second sound hole of the acoustic component cover, and the second surface of the acoustic component cover and the first sound hole of the acoustic component cover. 1 may move toward the through hole through the sound pipe formed by the bracket.
  • the electronic device may further include a gasket (for example, 435 of FIG. 7 ) disposed between the first sound hole and the second sound hole and having an opening through which air passes.
  • a gasket for example, 435 of FIG. 7
  • the electronic device may further include a fixing member (eg, 610 of FIG. 7 ) disposed adjacent to the acoustic component cover and coupled to the second bracket and the first bracket.
  • a fixing member eg, 610 of FIG. 7
  • the electronic device is disposed adjacent to the acoustic component cover, and is formed on a side surface of the second bracket and a side surface of the first bracket for fitting and coupling the second bracket and the first bracket (e.g., : 620 of FIG. 7) may be further included.
  • the second surface of the acoustic component cover is formed to face the first region of the first surface and has a flat first surface (eg, 523 of FIG. 18 ) and the electronic device from the first surface. It may include a second surface (eg, 524 in FIG. 18 ) extending outward and forming an inclined surface.
  • a boundary portion (eg, R in FIG. 18 ) of the first surface and the second surface may form a curvature.
  • An electronic device (eg, the electronic device 101 of FIGS. 1 to 4 ) according to various embodiments of the present disclosure includes a housing including a first bracket and a second bracket combined with the first bracket to form an inner space.
  • a housing including a first bracket and a second bracket combined with the first bracket to form an inner space.
  • an acoustic component located in the inner space eg 431 in FIG. 7
  • a second area in which the acoustic component is disposed and formed in a region corresponding to the location of the acoustic component.
  • 1 circuit board including a sound hole (eg, 432 in FIG. 7 ), and an acoustic component cover disposed between the first bracket and the second bracket and covering at least a portion of the acoustic component (eg, 432 in FIG.
  • the acoustic component cover may include a first surface (eg, 510 in FIG. 7 ) including a first area facing the circuit board and a second area extending from the first area toward the outside of the electronic device; A second surface (eg, 520 in FIG. 7 ) forming a surface opposite to the first surface, adhered to the second bracket along an edge portion, and forming a sound pipe together with the first bracket or the second bracket; and A second sound hole (eg, 530 in FIG. 7 ) formed to correspond to the first sound hole may be included.
  • a first surface eg, 510 in FIG. 7
  • a second surface eg, 520 in FIG. 7
  • a second sound hole eg, 530 in FIG. 7
  • At least a portion of the second surface of the acoustic component cover may form an inclined surface.
  • the second area of the first surface of the acoustic component cover is formed by the first bracket. It can be arranged to be pressurized.
  • the first surface of the acoustic component cover may include a stepped shape.

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Otolaryngology (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Telephone Set Structure (AREA)

Abstract

Un dispositif électronique selon divers modes de réalisation de la présente invention comprend : un boîtier comprenant un premier support qui comprend un trou traversant et un second support couplé au premier support de façon à former un espace interne ; et un ensemble acoustique disposé de manière adjacente au trou traversant. L'ensemble acoustique peut comprendre : un composant acoustique ; une carte de circuit sur laquelle est disposé le composant acoustique et comprenant un premier trou acoustique formé dans une zone correspondant à l'emplacement du composant acoustique ; et un couvercle de composant acoustique disposé à l'intérieur de l'espace interne. Le couvercle de composant acoustique peut comprendre : une première surface comprenant une première zone faisant face à la carte de circuit et une seconde zone faisant face au second support ; une seconde surface formant une surface opposée à la première surface et disposée de façon à être collée au premier support le long d'une partie de bord ; et un second trou acoustique formé de façon à correspondre au premier trou acoustique.
PCT/KR2022/013811 2021-10-15 2022-09-15 Ensemble acoustique et dispositif électronique le comprenant WO2023063598A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2021-0137548 2021-10-15
KR1020210137548A KR20230054015A (ko) 2021-10-15 2021-10-15 음향 어셈블리 및 이를 포함하는 전자 장치

Publications (1)

Publication Number Publication Date
WO2023063598A1 true WO2023063598A1 (fr) 2023-04-20

Family

ID=85988384

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2022/013811 WO2023063598A1 (fr) 2021-10-15 2022-09-15 Ensemble acoustique et dispositif électronique le comprenant

Country Status (2)

Country Link
KR (1) KR20230054015A (fr)
WO (1) WO2023063598A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140040975A (ko) * 2012-09-27 2014-04-04 엘지전자 주식회사 이동단말기
WO2016174834A1 (fr) * 2015-04-28 2016-11-03 シャープ株式会社 Dispositif électronique doté d'élément électronique acoustique intégré
US20200107446A1 (en) * 2017-03-23 2020-04-02 Huawei Technologies Co., Ltd. Electronic Device Comprising an Audio Channel Assembly
CN210518454U (zh) * 2019-12-03 2020-05-12 无锡闻泰信息技术有限公司 终端设备的麦克风音腔密封结构以及终端设备
CN214281613U (zh) * 2021-03-29 2021-09-24 维沃移动通信有限公司 电子设备

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140040975A (ko) * 2012-09-27 2014-04-04 엘지전자 주식회사 이동단말기
WO2016174834A1 (fr) * 2015-04-28 2016-11-03 シャープ株式会社 Dispositif électronique doté d'élément électronique acoustique intégré
US20200107446A1 (en) * 2017-03-23 2020-04-02 Huawei Technologies Co., Ltd. Electronic Device Comprising an Audio Channel Assembly
CN210518454U (zh) * 2019-12-03 2020-05-12 无锡闻泰信息技术有限公司 终端设备的麦克风音腔密封结构以及终端设备
CN214281613U (zh) * 2021-03-29 2021-09-24 维沃移动通信有限公司 电子设备

Also Published As

Publication number Publication date
KR20230054015A (ko) 2023-04-24

Similar Documents

Publication Publication Date Title
WO2021045409A1 (fr) Dispositif électronique comprenant une structure de dissipation de chaleur
WO2021029528A1 (fr) Dispositif électronique comprenant une ouverture
WO2022154470A1 (fr) Appareil électronique comprenant un module de microphone
WO2023063598A1 (fr) Ensemble acoustique et dispositif électronique le comprenant
WO2022250349A1 (fr) Appareil électronique comprenant un élément de blindage
WO2023287000A1 (fr) Dispositif électronique incluant un capteur d'empreintes digitales
WO2024096362A1 (fr) Structure étanche à l'eau et dispositif électronique la comprenant
WO2022154317A1 (fr) Structure de contact de module de caméra et appareil électronique la comprenant
WO2023090972A1 (fr) Dispositif électronique comprenant une carte de circuit imprimé flexible
WO2022131630A1 (fr) Dispositif électronique
WO2024025117A1 (fr) Connecteur comprenant une structure de masse, et dispositif électronique le comprenant
WO2023096415A1 (fr) Dispositif électronique comprenant un dispositif d'affichage et antenne disposée de manière adjacente au dispositif d'affichage
WO2022065807A1 (fr) Structure de contact de module de caméra et dispositif électronique la comprenant
WO2023113161A1 (fr) Dispositif électronique comprenant un microphone et un module flash
WO2022203293A1 (fr) Dispositif de bouton et dispositif électronique le comprenant
WO2023022454A1 (fr) Module de haut-parleur et dispositif électronique le comprenant
WO2022114565A1 (fr) Dispositif électronique comprenant affichage
WO2022215873A1 (fr) Dispositif électronique comprenant une structure de dissipation de chaleur
WO2023063631A1 (fr) Dispositif électronique comprenant une antenne
WO2023075367A1 (fr) Carte de circuit imprimé et dispositif électronique la comprenant
WO2023018107A1 (fr) Dispositif électronique ayant une structure étanche à l'eau appliquée à celui-ci
WO2024025271A1 (fr) Dispositif d'affichage flexible et dispositif électronique le comprenant
WO2023234598A1 (fr) Dispositif électronique comprenant un ensemble clé
WO2023014162A1 (fr) Dispositif de caméra et dispositif électronique comprenant un dispositif de caméra
WO2024090866A1 (fr) Dispositif électronique comprenant un boîtier de blindage

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 22881227

Country of ref document: EP

Kind code of ref document: A1