WO2022191468A1 - Dispositif électronique et procédé d'utilisation d'un capteur de pression barométrique de type carte dans un dispositif électronique - Google Patents

Dispositif électronique et procédé d'utilisation d'un capteur de pression barométrique de type carte dans un dispositif électronique Download PDF

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Publication number
WO2022191468A1
WO2022191468A1 PCT/KR2022/002522 KR2022002522W WO2022191468A1 WO 2022191468 A1 WO2022191468 A1 WO 2022191468A1 KR 2022002522 W KR2022002522 W KR 2022002522W WO 2022191468 A1 WO2022191468 A1 WO 2022191468A1
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WO
WIPO (PCT)
Prior art keywords
card type
pin
electronic device
module
pins
Prior art date
Application number
PCT/KR2022/002522
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English (en)
Korean (ko)
Inventor
김병준
박건희
전인태
Original Assignee
삼성전자 주식회사
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Application filed by 삼성전자 주식회사 filed Critical 삼성전자 주식회사
Publication of WO2022191468A1 publication Critical patent/WO2022191468A1/fr

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/21—Combinations with auxiliary equipment, e.g. with clocks or memoranda pads
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/3816—Mechanical arrangements for accommodating identification devices, e.g. cards or chips; with connectors for programming identification devices
    • H04B1/3818—Arrangements for facilitating insertion or removal of identification devices
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0274—Details of the structure or mounting of specific components for an electrical connector module
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M2201/00—Electronic components, circuits, software, systems or apparatus used in telephone systems
    • H04M2201/34—Microprocessors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M2201/00—Electronic components, circuits, software, systems or apparatus used in telephone systems
    • H04M2201/38—Displays
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M2250/00—Details of telephonic subscriber devices
    • H04M2250/12—Details of telephonic subscriber devices including a sensor for measuring a physical value, e.g. temperature or motion

Definitions

  • Various embodiments relate to an electronic device and a method of using a card-type barometric pressure sensor in the electronic device.
  • electronic devices are manufactured in the form of external parts rather than mounted inside, and external parts are mounted and used only when necessary.
  • external components are being miniaturized along with the miniaturization of electronic devices, and various interface devices (eg, connectors, etc.) in the electronic device for interfacing with various external components mounted in the electronic device are also being miniaturized.
  • the external component is a small card type (or memory) such as a memory card that can expand the storage space of the electronic device, or a subscriber identification module (SIM) card that is detachably installed for user authentication of the electronic device. card type).
  • SIM subscriber identification module
  • Various sensor modules are mounted and used for various sensing in an electronic device, but among the mounted sensing modules, the number of uses is small, so it may be efficient to mount and use only when necessary rather than to mount and use.
  • an air pressure sensor may be mounted and used for a waterproof function in an electronic device, but the waterproof function may be unnecessary or used a small number of times for some users. It may be efficient to use the sensor mounted.
  • a sensor module that performs various sensing in an electronic device is developed as a card type (or memory card type) component and can be used so that it can be mounted and detached
  • the electronic device can install a card type sensor module as needed rather than embedding the sensor module. Since it can be mounted and used, it can be helpful in securing a mounting area for components of an electronic device, and it can be effective because it is possible to save a sensor module mounting cost.
  • a card-type barometric pressure sensor that can be attached to and detached from the electronic device can be used instead of the built-in barometric pressure sensor in the electronic device, it can help to secure the mounting area of the electronic device’s components and reduce the cost of mounting the barometric sensor module. can be efficient.
  • an electronic device capable of using a card-type sensor module that can be mounted and detached instead of a built-in sensor module and a method for using a card-type sensor module in an electronic device may be provided.
  • a card-type memory eg, a memory card
  • a card-type sensor can be mounted using one connector, and when the card-type memory is installed, the card It is possible to provide an electronic device capable of performing a function corresponding to a type memory and performing a function corresponding to the card type sensor when the card type sensor is mounted, and a method of using a card type sensor in the electronic device.
  • an electronic device and a method of using a card-type barometric pressure sensor in an electronic device that enable confirmation of water resistance using the card-type barometric pressure sensor when the card-type barometric pressure sensor is installed.
  • the electronic device includes a housing including an opening, a connector disposed inside the housing and including a first plurality of pins, and detachably mounted to the connector through the opening, and a first card type module a tray including a first accommodating groove for accommodating a tray, and a processor connected to the connector, wherein the processor is configured to attach a first card type module to the connector based on a signal of at least one of the first plurality of pins.
  • the connection of the first card type module is based on the confirmation whether the first card type module is a first card type subscriber identification module (SIM) or a first card type barometric pressure sensor; Process a first signal input through the first plurality of pins in a first IO manner based on type SIM confirmation, and a second IO manner based on confirmation of the first card type barometric pressure sensor It may be set to process a second signal input through pins.
  • SIM subscriber identification module
  • a method of using a memory card type air pressure sensor in an electronic device includes: checking whether a first memory card type module is connected to a plurality of first pins of a connector disposed inside a housing of the electronic device; Confirming whether the first memory card type module is the first memory card or the first memory card type air pressure sensor based on the connection confirmation of the first memory card type module, the first IO method based on the first memory card confirmation processing a first signal inputted through the first plurality of pins, and a second signal inputted through the first plurality of pins in a second IO method based on confirmation of the first memory card type barometric pressure sensor It may include an operation to process .
  • the instructions are configured to cause the at least one processor to perform at least one operation when the instructions are executed by the at least one processor.
  • the operation may include checking whether the first memory card type module is connected to the first plurality of pins of the connector, and based on the connection check of the first memory card type module, the first memory card type module is connected to the first memory card.
  • An operation of determining whether the sensor is a first memory card type air pressure sensor, an operation of processing a first signal input through the first plurality of pins in a first IO method based on the identification of the first memory card, and the first memory It may include an operation of processing a second signal input through the first plurality of pins in a second IO method based on the card-type barometric pressure sensor confirmation.
  • a card-type barometric pressure sensor that can be mounted and detached in an electronic device instead of a built-in barometric pressure sensor in the electronic device, it is possible to help secure a mounting area for components of the electronic device and to reduce the cost of mounting the barometric sensor module.
  • FIG. 1 is a block diagram of an electronic device in a network environment according to an exemplary embodiment.
  • FIG. 2 is a perspective view of an electronic device according to an exemplary embodiment.
  • FIG. 3 is a perspective view illustrating a tray structure of an electronic device and a state in which the tray structure is discharged to the outside according to an exemplary embodiment
  • FIG. 4 is a perspective view illustrating a tray structure of an electronic device according to an exemplary embodiment.
  • 5A is a diagram illustrating a first card type module according to an embodiment.
  • 5B is a diagram illustrating a second card type module according to an embodiment.
  • 6A is a diagram illustrating a configuration of a first card type SIM according to an exemplary embodiment.
  • 6B is a diagram illustrating a configuration of a first card type sensor according to an embodiment.
  • FIG. 7 is a block diagram of an electronic device according to an exemplary embodiment.
  • FIG. 8 is a diagram for describing a configuration of a processor in an electronic device according to an exemplary embodiment.
  • FIG. 9A is a diagram for explaining an operation of a processor when a first card-type SIM and a second card-type memory are mounted and connected to the tray structure according to an exemplary embodiment
  • 9B is a view for explaining the operation of the processor when the first card type barometric pressure sensor is mounted and connected to the tray structure according to an embodiment.
  • 9C is a view for explaining an operation of a processor when a second card type air pressure sensor is mounted and connected to the tray structure according to an embodiment.
  • FIG. 10 is a flowchart illustrating an operation of using a first card type air pressure sensor in an electronic device according to an exemplary embodiment.
  • FIG. 11 is a flowchart illustrating an operation of using a second card type barometric pressure sensor in an electronic device according to an exemplary embodiment.
  • MCU 12 is a diagram illustrating a configuration of a micro controller unit (MCU) type barometric pressure sensor according to an exemplary embodiment.
  • MCU micro controller unit
  • FIG. 1 is a block diagram of an electronic device 101 in a network environment 100 according to various embodiments of the present disclosure.
  • an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or a second network 199 . It may communicate with at least one of the electronic device 104 and the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 .
  • a first network 198 eg, a short-range wireless communication network
  • a second network 199 e.g., a second network 199
  • the electronic device 101 may communicate with the electronic device 104 through the server 108 .
  • the electronic device 101 includes a processor 120 , a memory 130 , an input module 150 , a sound output module 155 , a display module 160 , an audio module 170 , and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or an antenna module 197 .
  • at least one of these components eg, the connection terminal 178
  • some of these components are integrated into one component (eg, display module 160 ). can be
  • the processor 120 for example, executes software (eg, a program 140) to execute at least one other component (eg, a hardware or software component) of the electronic device 101 connected to the processor 120. It can control and perform various data processing or operations. According to one embodiment, as at least part of data processing or operation, the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190 ) to the volatile memory 132 . may be stored in , process commands or data stored in the volatile memory 132 , and store the result data in the non-volatile memory 134 .
  • software eg, a program 140
  • the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190 ) to the volatile memory 132 .
  • the volatile memory 132 may be stored in , process commands or data stored in the volatile memory 132 , and store the result data in the non-volatile memory 134 .
  • the processor 120 is a main processor 121 (eg, a central processing unit or an application processor) or a secondary processor 123 (eg, a graphic processing unit, a neural network processing unit) a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor).
  • a main processor 121 eg, a central processing unit or an application processor
  • a secondary processor 123 eg, a graphic processing unit, a neural network processing unit
  • NPU neural processing unit
  • an image signal processor e.g., a sensor hub processor, or a communication processor.
  • the secondary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or when the main processor 121 is active (eg, executing an application). ), together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states.
  • the coprocessor 123 eg, an image signal processor or a communication processor
  • may be implemented as part of another functionally related component eg, the camera module 180 or the communication module 190. have.
  • the auxiliary processor 123 may include a hardware structure specialized for processing an artificial intelligence model.
  • Artificial intelligence models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself on which the artificial intelligence model is performed, or may be performed through a separate server (eg, the server 108).
  • the learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but in the above example not limited
  • the artificial intelligence model may include a plurality of artificial neural network layers.
  • Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the above example.
  • the artificial intelligence model may include, in addition to, or alternatively, a software structure in addition to the hardware structure.
  • the memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176 ) of the electronic device 101 .
  • the data may include, for example, input data or output data for software (eg, the program 140 ) and instructions related thereto.
  • the memory 130 may include a volatile memory 132 or a non-volatile memory 134 .
  • the program 140 may be stored as software in the memory 130 , and may include, for example, an operating system 142 , middleware 144 , or an application 146 .
  • the input module 150 may receive a command or data to be used by a component (eg, the processor 120 ) of the electronic device 101 from the outside (eg, a user) of the electronic device 101 .
  • the input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).
  • the sound output module 155 may output a sound signal to the outside of the electronic device 101 .
  • the sound output module 155 may include, for example, a speaker or a receiver.
  • the speaker can be used for general purposes such as multimedia playback or recording playback.
  • the receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from or as part of the speaker.
  • the display module 160 may visually provide information to the outside (eg, a user) of the electronic device 101 .
  • the display module 160 may include, for example, a control circuit for controlling a display, a hologram device, or a projector and a corresponding device.
  • the display module 160 may include a touch sensor configured to sense a touch or a pressure sensor configured to measure the intensity of a force generated by the touch.
  • the audio module 170 may convert a sound into an electric signal or, conversely, convert an electric signal into a sound. According to an embodiment, the audio module 170 acquires a sound through the input module 150 or an external electronic device (eg, a sound output module 155 ) directly or wirelessly connected to the electronic device 101 .
  • the electronic device 102) eg, a speaker or headphones
  • the sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the sensed state. can do.
  • the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.
  • the interface 177 may support one or more specified protocols that may be used by the electronic device 101 to directly or wirelessly connect with an external electronic device (eg, the electronic device 102 ).
  • the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
  • the connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102 ).
  • the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).
  • the haptic module 179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic sense.
  • the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
  • the camera module 180 may capture still images and moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
  • the power management module 188 may manage power supplied to the electronic device 101 .
  • the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).
  • PMIC power management integrated circuit
  • the battery 189 may supply power to at least one component of the electronic device 101 .
  • battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.
  • the communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). It can support establishment and communication performance through the established communication channel.
  • the communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication.
  • the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : It may include a local area network (LAN) communication module, or a power line communication module).
  • a wireless communication module 192 eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module
  • GNSS global navigation satellite system
  • wired communication module 194 eg, : It may include a local area network (LAN) communication module, or a power line communication module.
  • a corresponding communication module among these communication modules is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (eg, legacy It may communicate with the external electronic device 104 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (eg, a telecommunication network such as a LAN or a WAN).
  • a first network 198 eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)
  • a second network 199 eg, legacy It may communicate with the external electronic device 104 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (eg, a telecommunication network such as a LAN or a WAN).
  • a telecommunication network
  • the wireless communication module 192 uses subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199 .
  • subscriber information eg, International Mobile Subscriber Identifier (IMSI)
  • IMSI International Mobile Subscriber Identifier
  • the electronic device 101 may be identified or authenticated.
  • the wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, a new radio access technology (NR).
  • NR access technology includes high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency) -latency communications)).
  • eMBB enhanced mobile broadband
  • mMTC massive machine type communications
  • URLLC ultra-reliable and low-latency
  • the wireless communication module 192 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example.
  • a high frequency band eg, mmWave band
  • the wireless communication module 192 uses various techniques for securing performance in a high-frequency band, for example, beamforming, massive multiple-input and multiple-output (MIMO), all-dimensional multiplexing. It may support technologies such as full dimensional MIMO (FD-MIMO), an array antenna, analog beam-forming, or a large scale antenna.
  • the wireless communication module 192 may support various requirements defined in the electronic device 101 , an external electronic device (eg, the electronic device 104 ), or a network system (eg, the second network 199 ).
  • the wireless communication module 192 may provide a peak data rate (eg, 20 Gbps or more) for realizing 1eMBB, loss coverage (eg, 164 dB or less) for realizing mMTC, or U-plane latency for realizing URLLC ( Example: Downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) can be supported.
  • a peak data rate eg, 20 Gbps or more
  • loss coverage eg, 164 dB or less
  • U-plane latency for realizing URLLC
  • the antenna module 197 may transmit or receive a signal or power to the outside (eg, an external electronic device).
  • the antenna module 197 may include an antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern.
  • the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected from the plurality of antennas by, for example, the communication module 190 . can be selected. A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna.
  • other components eg, a radio frequency integrated circuit (RFIC)
  • RFIC radio frequency integrated circuit
  • the antenna module 197 may form a mmWave antenna module.
  • the mmWave antenna module comprises a printed circuit board, an RFIC disposed on or adjacent to a first side (eg, underside) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band); and a plurality of antennas (eg, an array antenna) disposed on or adjacent to a second side (eg, top or side) of the printed circuit board and capable of transmitting or receiving signals of the designated high frequency band. can do.
  • peripheral devices eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)
  • GPIO general purpose input and output
  • SPI serial peripheral interface
  • MIPI mobile industry processor interface
  • the command or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 .
  • Each of the external electronic devices 102 or 104 may be the same as or different from the electronic device 101 .
  • all or part of the operations performed by the electronic device 101 may be executed by one or more external electronic devices 102 , 104 , or 108 .
  • the electronic device 101 may perform the function or service itself instead of executing the function or service itself.
  • one or more external electronic devices may be requested to perform at least a part of the function or the service.
  • One or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 101 .
  • the electronic device 101 may process the result as it is or additionally and provide it as at least a part of a response to the request.
  • cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used.
  • the electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing.
  • the external electronic device 104 may include an Internet of things (IoT) device.
  • the server 108 may be an intelligent server using machine learning and/or neural networks.
  • the external electronic device 104 or the server 108 may be included in the second network 199 .
  • the electronic device 101 may be applied to an intelligent service (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.
  • FIG. 2 is a perspective view of an electronic device according to an exemplary embodiment.
  • an electronic device 201 (eg, the electronic device 101 of FIG. 1 ) according to an embodiment has a first surface (or front) 220A and a second surface (or a rear surface) 220B. , and a housing 220 including a side surface 220C surrounding a space between the first side 220A and the second side 220B.
  • the housing includes: It may also refer to a structure forming a part of the first surface 220A, the second surface 220B, and the side surface 220C of Fig. 1.
  • the first surface 220A is at least a portion It may be formed by a substantially transparent front plate (not shown) (eg, a glass plate including various coating layers, or a polymer plate).
  • the front plate may be formed of the display 211 separately from the display 211 . It may be formed on the outer front surface or may form the front surface of the display 211 integrally with the display 211.
  • the second surface 220B may be formed by a substantially opaque rear plate (not shown).
  • the back plate may be formed, for example, by coated or tinted glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing.
  • the side surface 220C may be formed by a side bezel structure (or "side member") 228 that engages the front plate 212 and the back plate and includes a metal and/or a polymer.
  • the back plate and side bezel structures 228 are integrally formed and may include the same material (eg, a metal material such as aluminum).
  • the electronic device 201 includes a display 211 , an audio module 213 , 217 , 224 , a sensor module 214 , a camera module 215 , a fingerprint sensor 215 , and a key input device ( At least one of 226 and 227 , a light emitting device 216 , and connector holes 218 and 219 may be included.
  • the electronic device 201 may omit at least one of the components (eg, the fingerprint sensor 215 or the light emitting device 216 ) or additionally include other components.
  • the display 211 may be exposed through, for example, a substantial portion of the front plate.
  • the front plate is formed to be larger than the screen of the display 211 , so that the screen of the display 211 may be exposed through a part of the front plate.
  • the front plate may be formed to have the same size as the screen of the display 211 .
  • a recess or opening is formed in a part of the screen display area of the display 211 , and the audio module 224 is aligned with the recess or opening, and the sensor It may include at least one of a module 214 , a camera module 215 , and a light emitting device 216 .
  • the display 211 is coupled to or adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer detecting a magnetic field type stylus pen. can be placed.
  • the audio modules 213 , 217 , and 224 may include a microphone hole 213 and speaker holes 217 and 224 .
  • a microphone for acquiring an external sound may be disposed therein, and in some embodiments, a plurality of microphones may be disposed to detect the direction of the sound.
  • the speaker holes 217 and 224 may include an external speaker hole 217 and a call receiver hole 224 .
  • the speaker holes 217 and 224 and the microphone hole 213 may be implemented as a single hole, or a speaker may be included without the speaker holes 217 and 224 (eg, a piezo speaker).
  • the sensor modules 214 and 215 may generate an electrical signal or data value corresponding to an internal operating state of the electronic device 201 or an external environmental state.
  • the sensor modules 214 , 215 may include, for example, the electronic device 201 , a first sensor module 214 (eg, a proximity sensor or/and an illuminance sensor) disposed on the first surface 220A of the housing 220 . ) and/or a second sensor module 215 (eg, a fingerprint sensor).
  • the electronic device 201 may further include a third sensor module (not shown) (eg, an HRM sensor) disposed on the second surface 220B of the housing 220 .
  • the fingerprint sensor may be disposed on the first surface 220A (eg, the display 211) as well as the second surface 220B of the housing 220.
  • the electronic device 201 may include a sensor module, not shown, for example.
  • it may further include at least one of a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, and a humidity sensor.
  • the camera module 215 includes a first camera device 215 disposed on a first side 220A of an electronic device 201 and a second camera device disposed on a second side 220B of the electronic device 201 (not shown), and/or a flash (not shown).
  • the camera devices 215 and not shown may include one or more lenses, an image sensor, and/or an image signal processor.
  • the flash may include, for example, a light emitting diode or a xenon lamp.
  • two or more lenses (infrared cameras, wide angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device 201 .
  • the key input devices 226 and 227 may be disposed in the form of soft keys on the display 211 or may be disposed as hardware keys.
  • the key input device 266 may be disposed in the form of a soft key on the display 211
  • the key input device 277 may be disposed in the form of a hardware key on the side surface 220C of the housing 220 .
  • the electronic device 201 may not include some or all of the above-mentioned key input devices 226 and 227, or may further include other key input devices.
  • the light emitting device 216 may be disposed, for example, on the first surface 220A of the housing 220 .
  • the light emitting device 216 may provide, for example, state information of the electronic device 201 in the form of light.
  • the light emitting device 216 may provide, for example, a light source that is interlocked with the operation of the camera module 215 .
  • the light emitting element 216 may include, for example, an LED, an IR LED, and a xenon lamp.
  • the connector holes 218 and 219 include a first connector hole 218 that can accommodate a connector (eg, a USB connector) for transmitting and receiving power and/or data to and from an external electronic device, and It may include a second connector hole (eg, earphone jack) 219 capable of accommodating a connector for transmitting/receiving an audio signal to/from an external electronic device.
  • the connector holes 218 and 219 may be configured as one connector hole capable of both transmitting and receiving power and/or data to and from an external electronic device and an audio signal to and from an external electronic device.
  • FIG. 3 is a perspective view illustrating a tray structure of an electronic device and a state in which the tray structure is discharged to the outside according to an exemplary embodiment
  • an upper surface 220D of the electronic device 201 of FIG. 2 is coupled to a display 211 and a rear plate (not shown), and an upper bezel including a metal and/or a polymer. structure (or “top bezel” or “top member”) 229 .
  • the back plate and the side bezel structure 228 and the top bezel structure 229 are integrally formed and may include the same material (eg, a metal material such as aluminum).
  • a first opening 311 and a second opening 312 formed adjacent to the first opening 311 may be formed on the outer surface of the upper bezel 229 according to an embodiment, and the tray structure 305 may be formed therein. It may be inserted into the top bezel 229 through the first opening 311 .
  • a sealing member (not shown) may be inserted into the second opening 312 , and the sealing member may seal a portion of the second opening 312 .
  • the sealing member is formed in the tray structure 305 as the tray structure 305 is inserted into the top bezel 229 through the first opening 311 , and a portion of the tray hole corresponding to the second opening 312 . can be sealed.
  • the tray structure 305 may be detachably coupled to the upper bezel 229 through the first opening 311 and the second opening 311 of the upper bezel 229 .
  • the tray structure 305 is discharged to the outside of the upper bezel 229 while being separated from the upper bezel 229 (by a user's manipulation) in a state inserted into the upper bezel 229, or the upper surface In a state in which the bezel 229 is discharged to the outside, it may be inserted into the top bezel 229 .
  • FIG. 4 is a perspective view illustrating a tray structure of an electronic device according to an exemplary embodiment.
  • the tray structure 305 may include a accommodating part 351 for accommodating a card type (or memory card type) module.
  • the accommodating part 351 includes a first accommodating space 353 accommodating a first card type module, a second accommodating space 354 accommodating a second card type module, and the first accommodating space 353 . ) and a partition 352 separating the second accommodation space 354 may be provided.
  • the first power (or voltage) eg, 3V
  • the two-card type module is mounted in the second accommodating space 354 , it may operate by receiving the second power (or voltage) (eg, 1.8V) from the electronic device 101 .
  • the first card type module may include a first card type subscriber identity module (SIM) or a first card type sensor
  • the second card type module may include a second card type memory (eg, micro SD). memory card) or a second card type sensor.
  • SIM subscriber identity module
  • the first card-type sensor and the second card-type sensor may include an air pressure sensor.
  • the first card type module and the second card type module are accommodated in both the first accommodating space 353 and the second accommodating space 354 of the tray structure 305 so that the first card type module and the second Card type modules can be used simultaneously.
  • the first card type module or the second card type module is accommodated in only one of the first accommodating space 353 and the second accommodating space 354 of the tray structure 305, so that only one may be used. .
  • a tray hole 356 corresponding to the second opening 312 may be formed at one end 355 of the tray structure 305 .
  • FIG. 5A is a diagram illustrating a first card type module according to an embodiment
  • FIG. 5B is a diagram illustrating a second card type module and a second card type module according to an embodiment.
  • the first card type module may include a first card type SIM 511 or a first card type sensor 513 .
  • the first card-type sensor 513 according to an embodiment has the same size and shape as the first card-type SIM 511 , but may include components that perform a sensor function rather than a SIM function.
  • the first card type sensor 513 is the same as or similar to the shape of the first card type SIM 511 or the shape of the first receiving space 353 in which the first card type SIM 511 is mounted, Any sensor capable of a sensing operation within the housing 220 may be used.
  • the first card type sensor 523 may be a first card type air pressure sensor.
  • the second card type module may include a second card type memory (eg, a micro SD memory card) 521 or a second card type sensor 523 .
  • the second card type sensor 521 according to an embodiment is the same as or similar to the shape of the second card type memory 521 or the shape of the second accommodating space 354 in which the second card type memory 521 is mounted. , as long as a sensor capable of a sensing operation within the housing 220 may be any sensor.
  • the second card type sensor 523 may be a second card type air pressure sensor.
  • FIG. 6A is a diagram illustrating a configuration of a first card-type SIM according to an embodiment
  • FIG. 6B is a diagram illustrating a configuration of a first card-type sensor and a first card-type sensor according to an embodiment.
  • the first card type SIM 611 may include a SIM_RST pin 631 , a SIM_CLK pin 632 , and a SIM_DAT pin 633 .
  • the first card type SIM 611 may include an interface for communication with the electronic device 101 .
  • An interface for communication with the electronic device 101 may include, for example, a SIM_RST pin 631 , a SIM_CLK pin 632 , and/or a SIM_DAT pin 633 .
  • the first card type sensor 613 may be a first card type air pressure sensor.
  • the first card type barometric pressure sensor 613 may include a barometric pressure sensor 650 , a card interface 660 , an I2C_CLK pin 672 , and an I2C_DAT pin 673 .
  • the barometric pressure sensor 650 may sense barometric pressure and output a signal (or barometric pressure sensing result signal) related to barometric pressure sensing through the I2C_CLK pin 672 and the I2C_DAT pin 673 .
  • the card interface 660 may interface between the barometric pressure sensor 650 and the I2C_CLK pin 672 and the I2C_DAT pin 673 .
  • FIG. 7 is a block diagram of an electronic device according to an exemplary embodiment.
  • an electronic device 701 (eg, the electronic device 101 of FIG. 1 ) according to an embodiment may include all or a part of the electronic device 101 illustrated in FIG. 1 .
  • an electronic device 701 may include a connector 710 , a processor 720 , a memory 730 , a display 760 , and a power management module 788 , and a tray 755 may be inserted.
  • the tray 755 includes a first card type SIM 511 or 611 , first card type air pressure sensors 513 and 613 , a second card type memory 521 , or a second card type air pressure sensor 523 . ) may be mounted and inserted into the electronic device 710 .
  • the connector 710 may include a plurality of pins, and through at least some or all of the plurality of pins, the first card type SIM 511 or 611 and the first card type barometric pressure sensors 513 and 613 ), the second card type memory 521 , or the second card type barometric pressure sensor 523 and the processor 720 may be connected.
  • the plurality of pins include a first plurality of pins connectable to the first card type SIM 511 or 611 or the first card type barometric pressure sensor 513 or 613 and a second card type memory 521 or second
  • the card-type barometric pressure sensor 523 may include a plurality of second connectable pins.
  • the processor 720 may be electrically connected to a plurality of pins of the connector 710 .
  • the processor 720 according to an embodiment is configured to connect to the connector 710 based on a signal of at least one of the first plurality of pins (eg, a first detection pin, or a first interrupt pin, or a pin for SIM_RST). Whether the first card type module (eg, the first card type SIM 511 or 611 or the first card type barometric pressure sensor 513 or 613) is connected may be checked.
  • the processor 720 connects the connector 710 to a first card type module (eg, a first card type SIM 511 or 611) or a first The connection of the card-type barometric pressure sensor 513 or 613) can be checked.
  • the first plurality of pins may include a first pin, a second pin, and a third pin, and the processor 720 may use the first pin through the first pin based on the connection of the first card module. It is possible to transmit a reset signal to the card type module, provide a clock to the first card type module through the second pin, and transmit data to the first card type module through the third pin.
  • the processor 720 is configured to connect the second card to the connector 710 through at least one pin (eg, a second detection pin, or a second interrupt pin, or a pin for SDC_CMD) among a plurality of second pins. Whether a type module (eg, the second card type memory 521 or the second card type air pressure sensor 523) is connected may be checked. For example, when the signal from the SDC_CMD pin is changed from a high signal to a low signal, the processor 720 connects the second card type module (eg, the second card type memory 521 ) or the second card to the connector 710 . The connection of the type air pressure sensor 523) can be confirmed.
  • a type module eg, the second card type memory 521 or the second card type air pressure sensor 523
  • the second plurality of pins may include a fourth pin, a fifth pin, and a sixth pin
  • the processor 720 may use the fourth pin based on the connection of the second card type module. It can be configured to provide a command to the second card type module, provide a clock to the second card type module through the fifth pin, and transmit data to the second card type module through the sixth pin have.
  • the processor 720 determines whether the first card type module is the first card type SIM 511 or 611 or the first card type barometric pressure sensor 513 or 613 when the first card type module connection is confirmed. can be checked According to an embodiment, when the connection of the first card type module is confirmed, the processor 720 may include pins for the first card type SIM 511 or 611 (eg, pins for the SIM card (SIM_RST pins, SIM_CLK pins, SIM_DAT pins).
  • pins for the first card type SIM 511 or 611 eg, pins for the SIM card (SIM_RST pins, SIM_CLK pins, SIM_DAT pins).
  • SIM/memory card device driver a signal input to the memory card device 725 (or SIM/memory card device driver, hereinafter referred to as SIM/memory card device driver) can be processed by probing (or driving) to check whether there is an error.
  • the processor 720 may determine that the connected first card type module is the first card type SIM 511 or 611 .
  • the processor 720 sets the SIM_RST pin, the SIM_CLK pin, and the SIM_DAT pin to the pins for the first card type barometric pressure sensor 513 or 613, respectively (eg, the first GPIO pin (GPIO111 pin)) , 2nd GPIO pin (eg GPIO112 pin), and 3rd GPIO pin (eg GPIO113 pin)), the signal input through the GPIO111 pin, GPIO112 pin, and/or GPIO113 pin is transmitted through the I2C emulation technique. By processing, it may be confirmed whether the connected first card type module is the first card type barometric pressure sensor 513 or 613 .
  • the processor 720 maintains the SIM IO method when the first card type SIM 511 or 611 is confirmed in the connector 710, and a pin for SIM_RST, a pin for SIM_CLK, and/or a pin for SIM_DAT.
  • a function corresponding to the first card type SIM 511 or 611 may be performed by processing a signal input through the SIM/memory card device driver 725 .
  • the processor 720 is the second IO method input through the GPIO111 pin, the GPIO112 pin, and/or the GPIO113 pin when the first card type barometric pressure sensor 513 or 613 is connected to the connector 710.
  • the signal may be processed using the barometric pressure sensor driver 727 to perform a function corresponding to the first card type barometric pressure sensor 513 or 613 .
  • the processor 720 determines whether the second card type module is the second card type memory 621 (eg, micro SD card) when the connection of the second card type module is confirmed, or whether the second card type barometric pressure sensor ( 623) can be verified. According to an embodiment, when the second card type module connection is confirmed, the processor 720 performs pins for the second card type memory 621 (eg, pins for the micro SD card (SDC_CMD pin, SDC_CLK pin, and SDC_DAT pin). )), the signal input based on the third IO (input/output) (eg SD IO) is processed by probing (or driving) the SIM/memory card device driver 725 to check whether there is an error. have.
  • the second card type memory 621 eg, micro SD card
  • the processor 720 may determine that the connected second card type module is the second card type memory 621 when no error occurs. According to an embodiment, when an error occurs, the processor 720 sets a pin for SDC_CMD, a pin for SDC_CLK, and a pin for SDC_DAT to the pins for the second card type barometric pressure sensor 623 (eg, GPIO111 pin, GPIO112 pin, and GPIO113 pin). By designating as , the signal input through the GPIO111 pin, the GPIO112 pin, and/or the GPIO113 pin is processed through the I2C emulation technique to check whether the connected second card type module is the second card type barometric pressure sensor 623. .
  • a pin for SDC_CMD e.g, GPIO111 pin, GPIO112 pin, and GPIO113 pin.
  • the processor 720 maintains the third IO (eg, SD IO) method when the second card type memory 621 (eg, micro SD card) is confirmed in the connector 710 , and for SDC_CMD
  • a function corresponding to the second card type memory 621 may be performed by using the SIM/memory card device driver 725 with a signal input through the pin, the SDC_CLK pin, and/or the SDC_DAT pin.
  • the processor 720 when the second card type barometric pressure sensor 623 is connected to the connector 710, the processor 720 is configured to use a GPIO111 pin, a GPIO112 pin, and/or a GPIO113 pin through the second IO (eg, GPIO) method.
  • a function corresponding to the second card type barometric pressure sensor 623 may be performed by processing an input signal input to the barometric pressure sensor driver 727 .
  • the processor 720 sets the IO method from the SIM or SD I0 method to the GPIO method when the first card type air pressure sensor 513 or 613 or the second card type air pressure sensor 623 is connected, and , the first card type barometric pressure sensor (513 or 613) or the second card type barometric pressure sensor (623) is controlled to provide power (eg, current or voltage), the first card type barometric pressure sensor (513 or 613) or the second Barometric pressure sensing information may be obtained based on a signal received from the 2-card type barometric pressure sensor 623 in a GPIO manner.
  • the processor 720 checks whether the waterproof function of the electronic device 701 is normal (pass or fail) based on the barometric pressure sensing information, and displays whether the waterproof function is normal on the display 760 or externally through communication. can be sent to
  • the memory 730 may store various data used by at least one component (eg, the processor 720 , the display 760 , and the power management module 788 ) of the electronic device 701 .
  • the data may include, for example, input data or output data for software (eg, a program) and instructions related thereto.
  • the memory 730 may store instructions for performing an operation of the electronic device 701 (or the processor 720 ).
  • the display 760 may include a touch screen, and may display various types of display data based on the operation of the processor 720 .
  • the display 760 may display an air pressure sensing result or display data related to whether the waterproof function is normal based on the air pressure sensing result.
  • the power management module 788 supplies power to each component of the electronic device 701 , and based on the control of the processor 720 , a first card type module connected through the connector 710 and/or It can supply power (eg, current or voltage) to the second card type module.
  • an opening eg, the third embodiment of FIG. 3 ) a housing (eg, housing 220 of FIG. 2 ) including one opening 311 ), a connector disposed inside the housing and having a first plurality of pins (eg, connector 710 of FIG. 7 ), the opening A tray (eg, 305 of FIG. 3 ) that is detachably mounted on the connector through a tray (eg, 305 of FIG. 3 ) including a first accommodating groove (eg, 353 of FIG.
  • a processor for accommodating a first card type module, and connected to the connector a processor (eg, the processor 120 of FIG. 1 or the processor 720 of FIG. 7 ), wherein the processor is configured to include a signal of a first pin (eg, a SIM_RST pin) of the first plurality of pins, based on a signal of the connector check whether the first card type module is connected to the , and based on the first card type module access confirmation, the first card type module is connected to the first card type SIM (eg, the first card type SIM 511 in FIG. Or whether the first card type SIM 611 of FIG. 6 ) or a first card type air pressure sensor (eg, the first card type air pressure sensor 521 of FIG.
  • the first card type SIM eg, the first card type SIM 511 in FIG. Or whether the first card type SIM 611 of FIG. 6
  • a first card type air pressure sensor eg, the first card type air pressure sensor 521 of FIG.
  • the first card type air pressure sensor 621 of FIG. 6 check, process a first signal input through the first plurality of pins in a first IO manner based on the first card type SIM confirmation, and a second IO based on the first card type barometric pressure sensor confirmation manner to process a second signal input through the first plurality of pins.
  • the electronic device further includes a display (eg, the display 160 of FIG. 1 or the display 760 of FIG. 7 ), and the processor is configured to: to drive the barometric pressure sensor driver, process a second signal input through the first plurality of pins using the barometric pressure sensor driver to obtain barometric pressure information, and a waterproof function of the electronic device is normal based on the barometric pressure information It is possible to check whether or not the waterproof function is normal and to display on the display whether the waterproof function is normal.
  • a display eg, the display 160 of FIG. 1 or the display 760 of FIG. 7
  • the processor is configured to: to drive the barometric pressure sensor driver, process a second signal input through the first plurality of pins using the barometric pressure sensor driver to obtain barometric pressure information, and a waterproof function of the electronic device is normal based on the barometric pressure information It is possible to check whether or not the waterproof function is normal and to display on the display whether the waterproof function is normal.
  • the first IO scheme may include a SIM IO scheme
  • the second IO scheme may include a GPIO scheme
  • the processor processes signals input through a plurality of first pins based on the first IO to check whether there is an error, and when no error occurs It may be configured to confirm that the connected first card type module is the first card type SIM, and confirm that the connected first card type module is not the first card type SIM when an error occurs.
  • the processor processes the signals input through the first plurality of pins through the second IO-based I2C emulation technique, and based on the processing result, the connected first It may be configured to check whether the card-type module is the first card-type barometric pressure sensor.
  • the first plurality of pins include a first pin, a second pin, and a third pin
  • the processor is configured to use the first pin through the first pin based on the connection of the first card type module. It may be configured to reset the first card type module, provide a clock to the first card type module through the second pin, and transmit data to the first card type module by enriching the third pin.
  • the connector further includes a second plurality of pins
  • the tray has a second receiving groove (eg, the second receiving groove 354 of FIG. 3 ) for accommodating the second card type module.
  • the processor determines whether a second card type module is connected to the connector based on a signal of at least one pin of the second plurality of pins, and the second card type module connection is determined based on the confirmation.
  • the second card type module is a second card type memory (eg, the second card type memory 521 of FIG. 5 ) or a second card type air pressure sensor (eg, the second card type air pressure sensor 523 of FIG.
  • the third IO scheme may include an SD IO scheme.
  • the second card type memory may include a micro SD card memory
  • the second card type air pressure sensor may include a micro SD card type air pressure sensor
  • the second plurality of pins include a fourth pin, a fifth pin, and a sixth pin
  • the processor is configured to use the fourth pin through the fourth pin based on the connection of the second card type module. It may be configured to provide a command to a second card type module, provide a clock to the second card type module through the fifth pin, and transmit data to the second card type module through the sixth pin .
  • FIG. 8 is a diagram for describing a configuration of a processor in an electronic device according to an exemplary embodiment.
  • an electronic device eg, the electronic device 101 of FIG. 1 , the electronic device 201 of FIG. 2 , or the electronic device 701 of FIG. 7
  • the processor 720 eg, the processor 120 in FIG. 1
  • the processor 720 includes a SW IRQ Handler (or software interrupt handler) 723 , a SIM/memory card driver 725 , and a barometric pressure sensor driver 727 .
  • SW IRQ Handler or software interrupt handler
  • the SW IRQ Handler 723 , the SIM/memory card driver 725 , and/or the barometric pressure sensor driver 727 are each a program executed by the processor 720 as a functional (software) module, or each It may be a separate processor that performs the function.
  • the SW IRQ Handler 723 may include a first pin mux 721 and a second pin mux 722 .
  • the first pin mux 721 may be connected to a first plurality of pins 711 among a plurality of pins of the connector 710 .
  • the first plurality of pins 711 may be pins for a first card type module (eg, a first card type SIM 511 or 611 or a first card type barometric pressure sensor 513 or 613 ).
  • the second pin mux 722 may be connected to a second plurality of pins 712 among a plurality of pins of the connector 710 .
  • the second plurality of pins 712 according to an embodiment may be pins for a second card type module (eg, the second card type memory 621 or the second card type barometric pressure sensor 623 ).
  • the SW IRQ Handler 723 includes at least one pin (a first pin 71 (eg, a first detection pin, a first interrupt pin, or a SIM_RST pin) among a plurality of first pins 711 . )), whether the first card type module (eg, the first card type SIM 511 or 611 or the first card type barometric pressure sensor 513 or 613) is connected to the connector 710 may be checked based on the signal.
  • a first pin 71 eg, a first detection pin, a first interrupt pin, or a SIM_RST pin
  • the SW IRQ Handler 723 is connected to the first card type module (eg, the first card type SIM 511 or 611) or the first card-type barometric pressure sensor 513 or 613) may be checked.
  • the first card type module eg, the first card type SIM 511 or 611
  • the first card-type barometric pressure sensor 513 or 613 may be checked.
  • the SW IRQ Handler 723 is based on a signal of a fourth pin 72 (eg, a second detection pin, or a second interrupt pin, or a pin for SDC_CMD) among a plurality of second pins 712 .
  • a fourth pin 72 eg, a second detection pin, or a second interrupt pin, or a pin for SDC_CMD
  • the second card type module eg, the second card type memory 621 or the second card type barometric pressure sensor 623
  • the SW IRQ Handler 723 connects the connector 710 to the second card type module (eg, the second card type memory 621).
  • the connection of the second card type air pressure sensor 623) may be checked.
  • the SW IRQ Handler 723 determines that the first card type module is the first card type SIM) (511 or 611) or the first card type barometric pressure sensor 513 or 613 may be confirmed. According to an embodiment, the SW IRQ Handler 723 transmits a signal processing method input from the first plurality of pins 711 through the first pin mux 721 when a first card type module connection interrupt occurs to a first IO (input).
  • the SW IRQ Handler 723 may determine that the connected first card type module is the first card type SIM 511 or 611 when no error occurs.
  • the SW IRQ Handler 723 sets a pin for SIM_RST, a pin for SIM_CLK, and a pin for SIM_DAT to the pins for the first card type barometric pressure sensor 513 or 613, respectively (eg, GPIO111 pin, GPIO112 pin, and GPIO113 pin), the signal input through the GPIO111 pin, the GPIO112 pin, and/or the GPIO113 pin is processed through the I2C emulation technique so that the connected first card type module is a first card type barometric pressure sensor 513 or 613) can be verified.
  • a pin for SIM_RST e.g, GPIO111 pin, GPIO112 pin, and GPIO113 pin
  • the signal input through the GPIO111 pin, the GPIO112 pin, and/or the GPIO113 pin is processed through the I2C emulation technique so that the connected first card type module is a first card type barometric pressure sensor 513 or 613) can be
  • the SW IRQ Handler 723 maintains the SIM IO method of the first pin mux 721 when the connection of the first card type SIM 511 or 611 to the connector 710 is confirmed, and the first The SIM/memory card driver 725 may be driven to process a signal input through a plurality of pins 711 (eg, a SIM_RST pin, a SIM_CLK pin, and/or a SIM_DAT pin).
  • the SW IRQ Handler 723 is configured to connect the first plurality of pins 711 through the first pin mux 721 when the first card type air pressure sensor 513 or 613 is connected to the connector 710 .
  • the barometric pressure sensor driver 727 may be driven to process a signal input through the first plurality of pins 711 .
  • the SW IRQ Handler 723 determines that the second card type module is connected to the second card type memory (eg, SD) when the second card type module connection is confirmed (eg, when the second card type module connection interrupt occurs). card) 621 or the second card type barometric pressure sensor 623 . According to an embodiment, the SW IRQ Handler 723 transmits a signal processing method input from the second plurality of pins 712 through the second pin mux 722 to the third IO (eg, when a second card type module connection interrupt occurs). : SD IO) method, and processing the signals input from the second plurality of pins 712 by probing (or driving) the SIM/memory card driver 725 to check whether there is an error. According to an embodiment, the SW IRQ Handler 723 may confirm that the connected second card type module is the second card type memory 621 when no error occurs.
  • the SW IRQ Handler 723 may confirm that the connected second card type module is the second card type memory 621 when no error occurs.
  • the SW IRQ Handler 723 uses a pin for SDC_CMD, a pin for SDC_CLK, and a pin for SDC_DAT as pins for the second card type barometric pressure sensor 623 (eg, GPIO111 pin, GPIO112 pin, and GPIO113). pin) to process the signal input through the GPIO111 pin, the GPIO112 pin, and/or the GPIO113 pin through the I2C emulation technique to check whether the connected second card type module is the second card type barometric pressure sensor 623 can
  • the SW IRQ Handler 723 maintains the SD IO method of the second pin mux 722 when the connection of the second card type memory 621 is confirmed, and the second plurality of pins 712 ( Example: The SIM/memory card driver 725 may be driven to process a signal input through the SDC_CMD pin, SDC_CLK pin, and/or SDC_DAT pin).
  • the SW IRQ Handler 723 determines the properties of the second plurality of pins 712 through the second pin mux 722 when the second card type barometric pressure sensor 623 is connected to the connector 710 .
  • the barometric pressure sensor driver 727 may be driven to process a signal input through the second plurality of pins 712 .
  • the SIM/memory card driver 725 may use a first IO or a third IO method (eg, a SIM or SD IO method) from the first plurality of pins 711 and/or the second plurality of pins 712 . ) can be driven to process the input signal.
  • a first IO or a third IO method eg, a SIM or SD IO method
  • the barometric pressure sensor driver 727 is to be driven to process the input signal of the second IO (eg, GPIO method) from the first plurality of pins 711 and/or the second plurality of pins 712 .
  • the second IO eg, GPIO method
  • FIG. 9A is a diagram for explaining an operation of a processor when a first card-type SIM and a second card-type memory are mounted and connected to the tray structure according to an exemplary embodiment
  • a tray structure 755 of an electronic device (eg, the electronic device 101 of FIG. 1 , the electronic device 201 of FIG. 2 , or the electronic device 701 of FIG. 7 ) according to an embodiment is shown.
  • the first card-type SIM 611 is mounted in the first accommodating space (eg, the first accommodating space 353 of FIG. 3 ), and in the second accommodating space (eg, the second accommodating space 354 of FIG. 3 ).
  • a second card type memory 621 may be mounted therein.
  • the power management module A first power (or a first voltage (eg, 3V)) from 788 may be provided to the first card type SIM 611
  • a second power or a second voltage (eg, 3V) from the power management module 788 ) : 1.8V)
  • the first card type SIM 611 and the second card type memory 621 are mounted in the tray structure 755 according to an embodiment.
  • the pins of the first card type SIM 611 are connected to the first plurality of pins 711 of the connector 710 and may be connected, and pins (eg, SDC_CMD pin, SDC_CLK pin, and SDC_DAT pin) of the second card type memory 621 may be connected to a plurality of second pins 712 of the connector 710 .
  • the SW IRQ Handler 723 of the processor 720 has a first pin 71 (eg, a first detection pin, a first interrupt pin, or a SIM_RST pin) among a plurality of first pins 711 . ), it can be confirmed that the first card type module is connected to the connector 710 based on the signal (eg, the first interrupt signal), and the fourth pin 72 among the second plurality of pins 721 (eg: It may be confirmed that the second card type module is connected to the connector 710 based on a signal (eg, a second interrupt signal) of the second detection pin, the second interrupt pin, or the SDC_CMD pin.
  • a signal eg, a second interrupt signal
  • the SW IRQ Handler 723 of the processor 720 provides the first power (or voltage (eg, 3V) to the first card type module based on the first card type module and the second card type module connection confirmation. ) and may control the power management module 788 to provide the second power (or voltage (eg, 1.8V)) to the second card type module.
  • first power or voltage (eg, 3V)
  • second power or voltage (eg, 1.8V)
  • the SW IRQ Handler 723 determines the signal processing method input from the first plurality of pins 711 through the first pin mux 721 when the first memory card type module connection is confirmed as the first IO (input/output) (eg, SIM IO) method, and processing the signals input from the first plurality of pins 711 by probing (or driving) the SIM/memory card driver 725, so that no error occurs It can be confirmed that the connected first card type module is the first card type SIM 511 or 611 .
  • the first IO input/output
  • SIM IO input/output
  • the SW IRQ Handler 723 sets the signal processing method input from the second plurality of pins 712 through the second pin mux 722 to the third IO ( Example: SD IO) method, the signal input from the second plurality of pins 712 is processed by probing (or driving) the SIM/memory card driver 725, and when no error occurs, the connected second card It can be confirmed that the type module is the second card type memory 621 .
  • the SW IRQ Handler 723 is the SIM of the first pin mux 721 when the connection of the first card type SIM 511 or 611 and the second card type memory 621 to the connector 710 is confirmed.
  • the IO method and the SD IO method of the second pin mux 722 are maintained, and the signal input through the plurality of first pins 711 (eg, a pin for SIM_RST, a pin for SIM_CLK, and/or a pin for SIM_DAT) and the second pin are inputted.
  • the SIM/memory card driver 725 may be driven to process a signal input through a plurality of pins 712 (eg, a pin for SDC_CMD, a pin for SDC_CLK, and/or a pin for SDC_DAT).
  • a pin for SDC_CMD a pin for SDC_CMD
  • a pin for SDC_CLK a pin for SDC_CLK
  • a pin for SDC_DAT a pin for SDC_DAT
  • the SIM/memory card driver 725 may include a first IO and/or a third IO (eg, SIM IO and/or a first IO and/or a third IO from a first plurality of pins 711 and/or a second plurality of pins 712 ). Alternatively, it may be driven to process an input signal of SD IO).
  • a first IO and/or a third IO eg, SIM IO and/or a first IO and/or a third IO from a first plurality of pins 711 and/or a second plurality of pins 712 .
  • it may be driven to process an input signal of SD IO).
  • 9B is a view for explaining the operation of the processor when the first card type barometric pressure sensor is mounted and connected to the tray structure according to an embodiment.
  • a tray structure 755 of an electronic device (eg, the electronic device 101 of FIG. 1 , the electronic device 201 of FIG. 2 , or the electronic device 701 of FIG. 7 ) according to an embodiment is shown.
  • the first card type air pressure sensor 613 is mounted in the first accommodating space (eg, the first accommodating space 353 of FIG. 3 ), and the second accommodating space (eg, the second accommodating space 354 of FIG.
  • the pins of the first card type air pressure sensor 613 may be connected to at least some of the first plurality of pins 711 of the connector 710 .
  • the SW IRQ Handler 723 of the processor 720 has a first pin 71 (eg, a first detection pin, a first interrupt pin, or a SIM_RST pin) among a plurality of first pins 711 . ), it can be confirmed that the first card type module is connected to the connector 710 based on the signal.
  • a first pin 71 eg, a first detection pin, a first interrupt pin, or a SIM_RST pin
  • the SW IRQ Handler 723 of the processor 720 provides a first power (or a first voltage (eg, 3V)) to the first card type module based on the first card type module connection confirmation.
  • the power management module 788 may be controlled.
  • the SW IRQ Handler 723 sets the signal processing method input from the first plurality of pins 711 through the first pin mux 721 to the first IO ( Example: SIM IO) method, the signal input from the first plurality of pins 711 is processed by probing (or driving) the SIM/memory card driver 725, and when an error occurs, the connected first card type It may be confirmed that the module is not the first card type SIM 511 or 611 .
  • SIM IO SIM IO
  • the SW IRQ Handler 723 sets a pin for SIM_RST, a pin for SIM_CLK, and a pin for SIM_DAT when an error occurs, respectively, to pins for the first card type barometric pressure sensor 613 (eg, GPIO111 pin, GPIO112 pin, and GPIO113). pin) to process the signal input through the GPIO111 pin, the GPIO112 pin, and/or the GPIO113 pin through the I2C Emulation technique to check whether the connected first card type module is the first card type barometric pressure sensor 613 can
  • the first card type barometric pressure sensor 613 eg, GPIO111 pin, GPIO112 pin, and GPIO113. pin
  • the SW IRQ Handler 723 is the first plurality of pins 711 through the first pin mux 721 when the connection of the first card type barometric pressure sensor 613 to the connector 710 is confirmed.
  • the barometric pressure sensor driver 727 may be driven to process a signal input through the first plurality of pins 711 .
  • the barometric pressure sensor driver 727 may be driven to process an input signal of the second IO (eg, GPIO) from the plurality of first pins 711 .
  • the second IO eg, GPIO
  • 9C is a view for explaining an operation of a processor when a second card type air pressure sensor is mounted and connected to the tray structure according to an embodiment.
  • a tray structure 755 of an electronic device (eg, the electronic device 101 of FIG. 1 , the electronic device 201 of FIG. 2 , or the electronic device 701 of FIG. 7 ) according to an exemplary embodiment.
  • a second card-type barometric pressure sensor 623 is mounted in the second accommodating space (eg, the second accommodating space 354 of FIG. 3) of the ) may be empty.
  • the pins of the second card type barometric pressure sensor 623 may be connected to at least some of the second plurality of pins 712 of the connector 710 .
  • the SW IRQ Handler 723 of the processor 720 is a fourth pin 72 (eg, a second detection pin, or a second interrupt pin, or a pin for SDC_CMD) among a plurality of second pins 712 . ), it can be confirmed that the second card type module is connected to the connector 710 based on the signal.
  • a fourth pin 72 eg, a second detection pin, or a second interrupt pin, or a pin for SDC_CMD
  • the SW IRQ Handler 723 of the processor 720 is powered to provide the second power (or voltage (eg, 1.8V)) to the second card type module based on the second card type module connection confirmation.
  • the management module 788 may be controlled.
  • the SW IRQ Handler 723 sets the signal processing method input from the second plurality of pins 712 through the second pin mux 722 to the third IO ( Example: SD IO) method, the signal input from the second plurality of pins 712 is processed by probing (or driving) the SIM/memory card driver 725, and when an error occurs, the connected second card type It can be confirmed that the module is not the second card type memory 621 .
  • the SW IRQ Handler 723 sets the pin for SDC_CMD, the pin for SDC_CLK, and the pin for SDC_DAT to the pins for the second card type barometric pressure sensor 623 (eg, GPIO111 pin, GPIO112 pin, and GPIO113 pin), the signal input through the GPIO111 pin, the GPIO112 pin, and/or the GPIO113 pin is processed through the I2C emulation technique to determine whether the connected second card type module is the second card type barometric pressure sensor 623 can be checked
  • the second card type barometric pressure sensor 623 eg, GPIO111 pin, GPIO112 pin, and GPIO113 pin
  • the SW IRQ Handler 723 is connected to the connector 710 through the second plurality of pins 712 through the second pin mux 722 when the connection of the second card type barometric pressure sensor 623 is confirmed.
  • the barometric pressure sensor driver 727 may be driven to process a signal input by the second IO (eg, GPIO) method.
  • the barometric pressure sensor driver 727 may be driven to process the input signal of the second IO from the second plurality of pins 712 .
  • the method of using a card type air pressure sensor in an electronic device may include the electronic device
  • the first card type SIM eg, the first card type SIM in FIG. 5
  • a first card type barometric pressure sensor eg, the first card type barometric pressure sensor 513 of FIG. 5 or the first card type barometric pressure sensor 613 of FIG. 6 )
  • an operation of processing a first signal input through the first plurality of pins in a first IO method based on the first card type SIM confirmation and an operation of confirming the first card type air pressure sensor and processing a second signal input through the first plurality of pins in a second IO method based on the second IO method.
  • the method includes an operation of driving a barometric pressure sensor driver based on the first card type barometric pressure sensor confirmation, and processing a second signal input through the first plurality of pins using the barometric pressure sensor driver to obtain air pressure information, checking whether the waterproof function of the electronic device is normal based on the barometric pressure information, and a display of the electronic device (eg, the display 160 of FIG. 1 or the display of FIG. 7 ) 760)), indicating whether the waterproof function is normal.
  • a display of the electronic device eg, the display 160 of FIG. 1 or the display of FIG. 7 ) 760
  • the first IO scheme may include a SIM IO scheme
  • the second IO scheme may include a GPIO scheme
  • the method processes signals input through the first plurality of pins based on the first IO to check whether there is an error, no error occurs confirming that the connected first card type module is the first card type SIM when an error occurs, and confirming that the connected first card type module is not the first card type SIM when an error occurs have.
  • the signal input through the first plurality of pins is processed through the second IO-based I2C emulation technique, and the connected first card is based on the processing result. It may be confirmed whether the type module is the first card type barometric pressure sensor.
  • the first plurality of pins include a first pin, a second pin, and a third pin
  • the method includes the first pin through the first pin based on the connection of the first card type module.
  • SIM_RST reset signal
  • SIM_CLK clock
  • SIM_DAT transmitting
  • the signal of the fourth pin (eg, SDC_CMD) among the second plurality of pins (eg, the second plurality of pins 712 of FIG. 7 ) of the connector disposed inside the housing of the electronic device based on the operation of confirming whether the second memory card type module is connected to the connector, the second card type module is connected to the second card type memory (eg, the second card type memory (eg, 2 card type memory 521) or the second card type air pressure sensor (eg, the second card type air pressure sensor 521 in FIG. 5), the third IO method based on the second card type memory check processing a third signal input through the second plurality of pins. and processing a fourth signal input through the second plurality of pins in the second IO method based on the confirmation of the second card type barometric pressure sensor.
  • the second card type memory eg, the second card type memory (eg, 2 card type memory 521) or the second card type air pressure sensor (eg, the second card type air pressure sensor 521 in FIG. 5
  • the second card type memory may include a micro SD card type memory
  • the second card type air pressure sensor may include a micro SD card type air pressure sensor
  • the second plurality of pins include a fourth pin, a fifth pin, and a sixth pin, and based on the connection of the second card type module, through the fourth pin Provides a command (eg, SDC_CMD) to the second card type module, provides a clock (eg, SDC_CLK) to the second card type module through the fifth pin, and provides the second card type through the sixth pin It may further include an operation of transmitting data (eg, SDC_DAT) to the module.
  • a command eg, SDC_CMD
  • a clock eg, SDC_CLK
  • SDC_DAT transmitting data
  • FIG. 10 is a flowchart illustrating an operation of using a first card type air pressure sensor in an electronic device according to an exemplary embodiment.
  • a processor of an electronic device (eg, the electronic device 101 of FIG. 1 , the electronic device 201 of FIG. 2 , or the electronic device 701 of FIG. 7 ) according to an embodiment (eg, FIG.
  • the processor 120 of 1 or the processor 720 of FIG. 7 ) may perform at least one of operations 1010 to 1040 .
  • the processor 720 responds to a signal of a first pin (eg, a first detection pin, or a first interrupt pin, or a pin for SIM_RST) among a plurality of first pins of the connector 710 . based on whether the first card-type module (eg, the first card-type SIM 511 or 611 or the first card-type barometric pressure sensor 513 or 613) is connected to the connector 710 may be checked.
  • a first pin eg, a first detection pin, or a first interrupt pin, or a pin for SIM_RST
  • the processor 720 may connect a first card type module (eg, a first card type SIM 511 or 611) or a first card type module (eg, a first card type SIM 511 or 611) to the connector 710 1
  • a first card type module eg, a first card type SIM 511 or 611
  • a first card type module eg, a first card type SIM 511 or 611
  • the processor 720 determines whether the first card type module is the first card type SIM 511 or 611 when the connection to the first card type module is confirmed, or the first card type barometric pressure sensor 613 . ) can be checked. For example, when the connection to the first card type module is confirmed, the processor 720 may use pins for the first card type SIM 511 or 611 (eg, pins for the SIM card (SIM_RST pin, SIM_CLK pin, SIM_DAT pin). ) through a first IO (input/output) (eg, SIM IO)-based signal by probing (or driving) the SIM/memory card driver 725 and processing to determine whether an error exists.
  • pins for the first card type SIM 511 or 611 eg, pins for the SIM card (SIM_RST pin, SIM_CLK pin, SIM_DAT pin.
  • a first IO input/output
  • SIM IO input/output
  • the processor 720 may determine that the connected first card type module is the first card type SIM 511 or 611 when an error does not occur, and when an error occurs, the connected first card type module It can be confirmed that the first card type is not the SIM 511 or 611. According to an exemplary embodiment, when an error occurs, the processor 720 identifies the SIM_RST pin, the SIM_CLK pin, and the SIM_DAT pin as the first card type barometric pressure sensor, respectively.
  • the signal input through the GPIO111 pin, GPIO112 pin, and/or GPIO113 pin is processed through I2C Emulation technique to process the connected first It may be confirmed whether the first card type module is the first card type barometric pressure sensor 613 .
  • the processor 720 determines the first plurality of pins 711 (eg, SIM_RST) in a first IO method (eg, SIM IO method) when the first card type SIM 511 or 611 is checked.
  • a signal input through a pin for SIM_CLK and/or a pin for SIM_DAT may be processed using the SIM/memory card driver 725 .
  • the processor 720 maintains the first IO method when the connection of the first card type SIM 511 or 611 to the connector 710 is confirmed, and the first plurality of pins 711 (eg: A signal input through the SIM_RST pin, SIM_CLK pin, and/or SIM_DAT pin) is processed using the SIM/memory card driver 725 to perform a function corresponding to the first card type SIM 511 or 611.
  • the first plurality of pins 711 eg: A signal input through the SIM_RST pin, SIM_CLK pin, and/or SIM_DAT pin
  • the processor 720 applies a signal input through the first plurality of pins 711 in the second IO (eg, GPIO) method when the first card type barometric pressure sensor 613 is checked. It can be processed using the sensor driver 727 .
  • the processor 720 sets the attributes of the first plurality of pins 711 for a SIM_RST pin, a SIM_CLK pin, and a SIM_DAT.
  • designate the pins for the first card type barometric pressure sensor 613 (eg, GPIO111 pin, GPIO112 pin, and GPIO113 pin) from A signal input through the plurality of pins 711 may be processed using the barometric pressure sensor driver 727 to perform a function corresponding to the first card type barometric pressure sensor 613 .
  • FIG. 11 is a flowchart illustrating an operation of using a second card type barometric pressure sensor in an electronic device according to an exemplary embodiment.
  • a processor of an electronic device (eg, the electronic device 101 of FIG. 1 , the electronic device 201 of FIG. 2 , or the electronic device 701 of FIG. 7 ) according to an embodiment (eg, FIG.
  • the processor 120 of 1 or the processor 720 of FIG. 7 ) may perform at least one of operations 1110 to 1140 .
  • the processor 720 receives a signal of at least one pin (eg, a second detection pin, or a second interrupt pin, or a pin for SDC_CMD) among a plurality of second pins of the connector 710 . based on whether the second card type module (eg, the second card type memory 621 or the second card type barometric pressure sensor 623) is connected to the connector 710 may be checked. For example, when the signal from the SDC_CMD pin is changed from a high signal to a low signal, the processor 720 may connect the second card type module (eg, the second card type memory 621 ) or the second card type to the connector 710 . The connection of the atmospheric pressure sensor 623) can be confirmed.
  • a signal of at least one pin eg, a second detection pin, or a second interrupt pin, or a pin for SDC_CMD
  • the processor 720 may connect the second card type module (eg, the second card type memory 621 ) or the second card type to the connector 710 .
  • the processor 720 determines whether the second card type module is the second card type memory (eg, micro SD card) 621 when the connection of the second card type module is confirmed. It can be confirmed whether it is a type barometric pressure sensor 623 . For example, when the second card type module connection is confirmed, the processor 720 may use pins for the second card type memory 621 (eg, pins for a micro SD card (eg, a pin for SD_CMD, a pin for SD_CLK, a pin for SD_DAT).
  • pins for the second card type memory 621 eg, pins for a micro SD card (eg, a pin for SD_CMD, a pin for SD_CLK, a pin for SD_DAT).
  • a third IO (input/output) (eg SD IO)-based signal is processed by probing (or driving) the SIM/memory card driver 725 to check whether there is an error.
  • the processor 720 may determine that the connected second card type module is the second card type memory 621 when an error does not occur, and when an error occurs, the connected second card type module It can be confirmed that it is not the second card type memory 621.
  • the processor 720 sets the SD_CMD pin, SD_CLK pin, and SD_DAT pin to the second card type barometric pressure sensor 623, respectively.
  • the second card type connected by processing the signal input through the GPIO111 pin, GPIO112 pin, and/or GPIO113 pin through the I2C emulation technique by designating the pins for It may be confirmed whether the module is the second card type barometric pressure sensor 623 .
  • the processor 720 determines the second plurality of pins 712 (eg, SDC_CMD pin) in a third IO method (eg, SD IO method) when checking the second card type memory 621 .
  • SDC_CLK pin and/or SDC_DAT pin may be processed using the SIM/memory card driver 725 .
  • the processor 720 maintains the third IO method (eg, SD IO method) when the connection of the second card type memory 621 to the connector 710 is confirmed, and the second plurality of pins ( 712) (eg, pin for SD_CMD, pin for SD_CLK, and/or pin for SD_DAT) processes the signal input through the SIM/memory card driver 725 to function corresponding to the second card type memory 621 can be performed.
  • the third IO method eg, SD IO method
  • the second plurality of pins ( 712) eg, pin for SD_CMD, pin for SD_CLK, and/or pin for SD_DAT
  • the processor 720 applies a signal input through the second plurality of pins 712 in a second IO (eg, GPIO) method when the second card type barometric pressure sensor 623 is checked. It can be processed using the sensor driver 727 .
  • a second IO eg, GPIO
  • the processor 720 sets the properties of the second plurality of pins 712 to a pin for SD_CMD, a pin for SD_CLK, and / Or designate the SD_DAT pin to the pins for the second card type barometric pressure sensor 623 (eg GPIO111 pin, GPIO112 pin, and GPIO113 pin), and set the third IO (SD IO) method to the second IO (eg GPIO) method, and processing a signal input through the second plurality of pins 711 using the barometric pressure sensor driver 727 to perform a function corresponding to the second card type barometric pressure sensor 623 .
  • SD IO third IO
  • MCU 12 is a diagram illustrating a configuration of a micro controller unit (MCU) type barometric pressure sensor according to an exemplary embodiment.
  • MCU micro controller unit
  • the MCU-type barometric pressure sensor 1215 may be a first card (eg, SIM card) type or a second card (eg, micro SD card) type.
  • the tray structure eg, the electronic device of FIG. 1 , the electronic device 201 of FIG. 2 , or the electronic device 701 of FIG. 7
  • the electronic device of FIG. 3 It may be accommodated in the first accommodating space (eg, the first accommodating space 353 of FIG. 3 ) of the tray structure 305 , and may be accommodated in the second accommodating space 353 when implemented as a second card type. .
  • the MCU-type barometric pressure sensor 1215 may include an MCU 1210 , a barometric pressure sensor 1220 , a capacitor array 1230 , a power source 1240 , and a light emitting diode (LED) 1250 .
  • the MCU 1210 may include firmware and may operate based on the firmware.
  • the MCU 1210 detects that the MCU-type barometric pressure sensor 1215 is mounted on the tray structure 305 of the electronic device 701 and is inserted into the electronic device 701, or a connector ( Based on sensing that the connection to the 710 is connected, the barometric pressure sensor 1220 may be activated (enabled, or operated).
  • the MCU 1210 may check whether the waterproof function of the electronic device 701 is normal based on the atmospheric pressure sensing result from the atmospheric pressure sensor 1220 . For example, when the atmospheric pressure sensing result value is less than the first value, the MCU 1210 may confirm that the waterproof function does not operate normally.
  • the MCU 1110 may confirm that the waterproof function normally operates when the atmospheric pressure sensing result value is equal to or greater than the first value.
  • the MCU 1210 may control the light emission of the LED 1250 to indicate that the waterproof function is normal (eg, a green LED is turned on).
  • the MCU 1210 may control the light emission of the LED 1250 to indicate that the waterproof function is not normal (eg, turn on a red LED).
  • the air pressure sensor 1220 may sense air pressure and transmit a sensing result to the MCU 1210 .
  • the capacitor array 1230 includes at least one capacitor for providing the power (or voltage, or current) of the power source 1240 to the MCU 1210 , the barometric pressure sensor 1220 , and the LED 1250 .
  • the power source 1240 converts power (or voltage, or current) received from the electronic device 701 when the self-bow power or the MCU-type barometric pressure sensor 1215 is inserted into the electronic device 701 to the MCU 1210 . ), the barometric pressure sensor 1220 , the capacitor array 1230 , and the LED 1250 .
  • the LED 1250 includes a light emitting diode, and may perform a light emitting operation in a specified color (eg, red or green) based on the control of the MCU 1210 .
  • a specified color eg, red or green
  • the processor 720 of the electronic device 701 checks the connection of the MCU-type barometric pressure sensor 1215 or the power management module 788 to provide power after the MCU-type barometric pressure sensor 1215 is connected and inserted. can be controlled.
  • the user inserts the tray structure 305 equipped with the MCU-type barometric pressure sensor 1215 into the electronic device 701 and discharges the tray structure 305 after a predetermined time elapses.
  • the waterproof function of the electronic device 701 is normal through the light emission state (eg, light emission color, red, or green color) of the LED 1250 of the MCU-type barometric pressure sensor 1215 .
  • the electronic device may have various types of devices.
  • the electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device.
  • a portable communication device eg, a smart phone
  • a computer device e.g., a smart phone
  • a portable multimedia device e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a wearable device e.g., a smart bracelet
  • a home appliance device e.g., a home appliance
  • first, second, or first or second may simply be used to distinguish an element from other elements in question, and may refer elements to other aspects (e.g., importance or order) is not limited. It is said that one (eg, first) component is “coupled” or “connected” to another (eg, second) component, with or without the terms “functionally” or “communicatively”. When referenced, it means that one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.
  • module may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as, for example, logic, logic block, component, or circuit.
  • a module may be an integrally formed part or a minimum unit or a part of the part that performs one or more functions.
  • the module may be implemented in the form of an application-specific integrated circuit (ASIC).
  • ASIC application-specific integrated circuit
  • Various embodiments of the present document include one or more stored in a storage medium (eg, internal memory 136 or external memory 138) readable by a machine (eg, electronic device 101). It may be implemented as software (eg, program 140) including instructions.
  • the processor eg, the processor 120
  • the device eg, the electronic device 101
  • the one or more instructions may include code generated by a compiler or code executable by an interpreter.
  • the device-readable storage medium may be provided in the form of a non-transitory storage medium.
  • 'non-transitory' only means that the storage medium is a tangible device and does not contain a signal (eg, electromagnetic wave), and this term is used in cases where data is semi-permanently stored in the storage medium and It does not distinguish between temporary storage cases.
  • a signal eg, electromagnetic wave
  • the method according to various embodiments disclosed in this document may be included in a computer program product and provided.
  • Computer program products may be traded between sellers and buyers as commodities.
  • the computer program product is distributed in the form of a machine-readable storage medium (eg compact disc read only memory (CD-ROM)), or through an application store (eg Play Store TM ) or on two user devices ( It can be distributed (eg downloaded or uploaded) directly or online between smartphones (eg smartphones).
  • a portion of the computer program product may be temporarily stored or temporarily created in a machine-readable storage medium such as a memory of a server of a manufacturer, a server of an application store, or a relay server.
  • each component eg, a module or a program of the above-described components may include a singular or a plurality of entities.
  • one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added.
  • a plurality of components eg, a module or a program
  • the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. .
  • operations performed by a module, program, or other component are executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations are executed in a different order, omitted, or , or one or more other operations may be added.
  • the instructions are configured to cause the at least one processor to perform at least one operation when the instructions are executed by the at least one processor.
  • the operation may include checking whether the first card type module is connected to the first plurality of pins of the connector, and determining whether the first card type module is a first card type SIM based on the connection check of the first card type module.

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  • Computer Networks & Wireless Communication (AREA)
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Abstract

Selon divers modes de réalisation, un dispositif électronique peut comprendre : un boîtier comportant une ouverture ; un connecteur disposé dans le boîtier et comportant de multiples premières broches ; un plateau monté de manière amovible sur le connecteur à travers l'ouverture et comportant une première rainure de réception conçue pour recevoir un premier module de type carte ; et un processeur connecté au connecteur. Le processeur est configuré pour : déterminer si le premier module de type carte est connecté au connecteur sur la base d'un signal provenant d'au moins une des multiples premières broches ; sur la base de la détermination de la connexion du premier module de type carte, déterminer si le premier module de type carte est un premier module d'identification d'abonné (SIM) de type carte ou un premier capteur de pression barométrique de type carte ; et, s'il est déterminé qu'il s'agit du premier SIM de type carte, traiter au moyen d'un premier procédé E/S un premier signal entré par l'intermédiaire des multiples premières broches ; ou, s'il est déterminé qu'il s'agit du premier capteur de pression barométrique de type carte, traiter au moyen d'un second procédé E/S un second signal entré par l'intermédiaire des multiples premières broches. Divers autres modes de réalisation sont également possibles.
PCT/KR2022/002522 2021-03-12 2022-02-21 Dispositif électronique et procédé d'utilisation d'un capteur de pression barométrique de type carte dans un dispositif électronique WO2022191468A1 (fr)

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