WO2022218102A1 - 一种无基材的带rfid的防转移卷材或标签及其加工方法 - Google Patents

一种无基材的带rfid的防转移卷材或标签及其加工方法 Download PDF

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WO2022218102A1
WO2022218102A1 PCT/CN2022/081872 CN2022081872W WO2022218102A1 WO 2022218102 A1 WO2022218102 A1 WO 2022218102A1 CN 2022081872 W CN2022081872 W CN 2022081872W WO 2022218102 A1 WO2022218102 A1 WO 2022218102A1
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layer
metal antenna
rfid
label
printing
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PCT/CN2022/081872
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English (en)
French (fr)
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金南笙
蔡燕
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上海哲瀛商贸有限公司
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Publication of WO2022218102A1 publication Critical patent/WO2022218102A1/zh

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/10—Homopolymers or copolymers of methacrylic acid esters
    • C09J133/12—Homopolymers or copolymers of methyl methacrylate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07798—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card part of the antenna or the integrated circuit being adapted for rupturing or breaking, e.g. record carriers functioning as sealing devices for detecting not-authenticated opening of containers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/334—Applications of adhesives in processes or use of adhesives in the form of films or foils as a label
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/20—Presence of organic materials
    • C09J2400/28—Presence of paper
    • C09J2400/283—Presence of paper in the substrate

Definitions

  • the invention relates to the technical field of Internet anti-counterfeiting electronic labels, and particularly relates to a base material-free anti-transfer roll or label with RFID and a processing method thereof.
  • the present invention provides an anti-transfer roll or label with RFID without a base material and a processing method thereof. Broken, tamper-proof, transfer-proof, and single-use.
  • a base material-free anti-transfer roll or label with RFID comprising a printed layer, a composite layer, a chip, a metal antenna layer, an easily peelable thin layer, an adhesive material, and a bottom paper in order from top to bottom, and the printed layer
  • the lower surface of the composite layer is bonded to the upper surface of the composite layer
  • the lower surface of the composite layer is bonded to the upper surface of the chip
  • the lower surface of the chip is bonded to the upper surface of the metal antenna layer
  • the lower surface of the metal antenna layer The upper surface of the easily peelable thin layer
  • the lower surface of the easily peelable thin layer is bonded to the upper surface of the adhesive material
  • the lower surface of the adhesive material is bonded to the upper surface of the base paper.
  • a peelable transparent protective film is adhered to the upper surface of the printing layer.
  • the printing layer is produced by ink printing, transfer printing, electroplating or holography.
  • the chip is placed on the upper surface or the lower surface of a metal antenna layer, and the metal antenna layer is made of conductive metal materials, such as AL, CU or silver paste.
  • the easily peelable sheet is made of a peelable adhesive composition.
  • the peelable adhesive composition is a colorless release varnish or a tack-reducing glue.
  • the colorless isolation varnish is composed of acrylic resin, monomer, photoinitiator, auxiliary agent or solvent, and the constituent material of the colorless isolation varnish has the characteristics of peelability, acid and alkali resistance, and chemical resistance.
  • the detackifying glue is composed of reactive monomers methyl methacrylate (MMA), acrylic acid (AA), ethyl methacrylate, methoxyethyl acrylate, butyl acrylate (BA), reactive diluent, Heat curing agent, antioxidant and solvent composition.
  • a method for processing an RFID-free transfer-proof roll or label comprising the following steps:
  • the chip is compounded on the upper surface of the metal antenna layer that has completed the easy peelable thin layer bonding, and a loop is generated after connecting with conductive glue, and the making of the RFID dry inlay is completed;
  • the peelable adhesive composition in the step (2) is a colorless release varnish.
  • the peelable adhesive composition in the step (2) is a tack-reducing glue.
  • a step is added after the step (2): reducing the viscosity of the peelable adhesive composition by curing equipment, so as to speed up the peeling speed of the metal antenna bearing substrate, and the curing method adopted is temperature curing or UV curing.
  • the present invention adopts the peelable adhesive composition (colorless isolation varnish or adhesive that can reduce the viscosity) to make an easily peelable thin layer, so as to speed up the peeling speed of the bearing substrate for the metal antenna, and also improve the yield. Since the bearing substrate of the metal antenna itself has been peeled off, it is no longer retained in the layer structure of the entire product, so that the product itself will not be thick and hard, so that the product itself will be attached to the object, such as In case of criminals, the product needs to be removed. Since the product itself does not have any bearing material, it is immediately damaged and cannot be removed as a whole, so as to achieve complete fragility, anti-disclosure, anti-transfer, and meet the anti-counterfeiting requirements of one-time use.
  • the peelable adhesive composition colorless isolation varnish or adhesive that can reduce the viscosity
  • FIG. 1 is a schematic structural diagram of an RFID electronic tag in the prior art.
  • FIG. 2 is a schematic structural diagram of an anti-transfer roll or label with RFID in an embodiment of the present invention.
  • the roll material or label from top to bottom, includes a printing layer 1, a composite layer 2, a chip 3, a metal antenna layer 4, an easily peelable thin layer 5, a glue material 6, a backing paper 7, and a printing layer.
  • the lower surface of 1 is bonded to the upper surface of the composite layer 2, the lower surface of the composite layer 2 is bonded to the upper surface of the chip 3, the lower surface of the chip 3 is bonded to the upper surface of the metal antenna layer 4, and the lower surface of the metal antenna layer 4 is bonded.
  • the top surface of the easily peelable thin layer 5 is adhered to the surface, the bottom surface of the easy peelable thin layer 5 is adhered to the top surface of the adhesive material 6 , and the bottom surface of the adhesive material 6 is adhered to the top surface of the backing paper 7 .
  • a peelable transparent protective film is adhered to the upper surface of the printing layer 1 .
  • the printing layer 1 is produced by ink printing, transfer printing, electroplating or holography.
  • the chip 3 may be placed on the upper surface or the lower surface of the metal antenna layer 4 . In this embodiment, the chip 3 is placed on the upper surface of the metal antenna layer 4 .
  • the metal antenna layer 4 is made of conductive metal materials, such as AL, CU or silver paste.
  • the easily peelable thin layer 5 is made of a peelable adhesive composition, and the peelable adhesive composition is a colorless release varnish or a tack-reducing glue.
  • Colorless isolation varnish is composed of acrylic resin, monomer, photoinitiator, auxiliary agent or solvent.
  • the constituent material of colorless isolation varnish has the characteristics of peelability, acid and alkali resistance, and chemical resistance.
  • Detackifying glue is made of reactive monomers methyl methacrylate (MMA), acrylic acid (AA), ethyl methacrylate, methoxyethyl acrylate, butyl acrylate (BA), reactive diluent, heat curing agent, anti-aging agent and solvent composition.
  • a method for processing an RFID-free transfer-proof roll or label comprising the following steps:
  • the chip is compounded on the upper surface of the metal antenna layer that has been bonded with the easily peelable thin layer, and a loop is generated after connecting with conductive glue, and the production of the RFID dry inlay is completed;
  • the bearing base material of the metal antenna itself used in the present invention has been peeled off and no longer remains in the layer structure of the entire product, so that the product itself will not be thick and hard, so that the product itself will be attached to the object. Afterwards, if the criminals need to remove the product, because the product itself does not have any bearing material, it will be damaged immediately after being opened, and it cannot be removed as a whole, so as to achieve complete fragility, anti-disclosure, anti-transfer, and one-time satisfaction Anti-counterfeiting requirements for sexual use.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

一种无基材的带RFID的防转移卷材或标签，从上往下依次包括印刷层、复合层、芯片、金属天线层、易剥离性薄层、胶材、底纸，印刷层下表面粘接在芯片上表面，芯片下表面粘接金属天线层上表面，金属天线层的下表面粘接易剥离性薄层上表面，易剥离性薄层下表面粘接底纸上表面。印刷层上表面粘接有一层可剥离的透明保护膜。易剥离性薄层由可剥离粘合剂组合物制成，可剥离粘合剂组合物为无色隔离光油或可减粘性胶水。该产品增快了承载基材被剥离的速度，提高了成品率，不会造成产品偏厚或偏硬现象，由于产品本身没有任何承载材料，揭开后便立即损毁，无法被整体移除，能达到完全易碎、可防揭、可防转移、满足一次性使用的防伪要求。

Description

一种无基材的带RFID的防转移卷材或标签及其加工方法 技术领域
本发明涉及互联网防伪电子标签技术领域，且特别涉及一种无基材的带RFID的防转移卷材或标签及其加工方法。
背景技术
制假是当今世界上增长最快的经济犯罪之一，它对正当的商务和就业活动、公共卫生与健康和安全秩序等带来了极大的危害。据世贸组织统计，全世界受假冒伪劣产品影响的市场达到3000亿美元，每年假冒伪劣产品的成交额已占世界贸易总额的10％，在我国假冒伪劣产品规模是3000-4000亿元，特别是烟、酒、农资、食品、化妆品等行业，已是假冒伪劣商品的“重灾区”。防伪行业已成为21世界的朝阳产业，但是现有的RFID标签，受限于传统结构和材料，工艺方面的限制，在贴敷于对象物后，无法真正做到完全易碎、可防揭、可防转移的一系列防伪要求，从而无法有效保护“烟、酒、农资、食品、化妆品”等高档消费品不受假冒伪劣品的侵蚀，损害自身的品牌形象及商业信誉，造成无法挽回的商业损失。
目前国内市场中普遍采用的传统防伪技术不具备唯一性和独占性，往往致使一种防伪产品或技术出现后很快就会被复制，不能起到 真正的防伪作用。如图1所示，传统产品大致有①～⑧层结构，受限于材料，工艺的限制，第①层印刷用支撑基材和第⑥层金属天线承载用基材都不可避免的要滞留在整个产品的层结构之中，从而造成本身产品偏厚和偏硬，从而使产品本身贴敷在对象物后，极易被整体移除，无法达到完全易碎、可防揭、可防转移、满足一次性使用的防伪要求。
综上，使用传统的RFID电子标签生产工艺，已不能实现防揭，防转移，易碎的目的。因此，当今社会急需一种易碎、防伪防揭、防转移、可满足一次性使用、防转移、具备防伪功能的RFID智能标签。
发明内容
本发明提供了一种无基材的带RFID的防转移卷材或标签及其加工方法，其目的在于，通过使用全结构的无基材设计，使产品本身贴敷在对象物后，完全易碎、可防揭、可防转移、可满足一次性使用。
本发明是通过以下技术方案实现的：
一种无基材的带RFID的防转移卷材或标签，从上往下依次包括印刷层、复合层、芯片、金属天线层、易剥离性薄层、胶材、底纸，所述印刷层的下表面粘接在复合层的上表面，所述复合层的下表面粘结在芯片的上表面，所述芯片的下表面粘接金属天线层的上表面，所述金属天线层的下表面粘接易剥离性薄层的上表面，所述易剥离性薄层的下表面粘接胶材的上表面，所述胶材的下表面粘结底纸的上表面。
优选地，所述印刷层的上表面粘接有一层可剥离的透明保护膜。
优选地，所述印刷层采用油墨印、转印、电镀或全息制作方式。
优选地，所述芯片置于金属天线层的上表面或下表面，所述金属天线层采用导电金属材料，如AL、CU或银浆。
优选地，所述易剥离性薄层由可剥离粘合剂组合物制成。
优选地，所述可剥离粘合剂组合物为无色隔离光油或可减粘性胶水。
优选地，所述无色隔离光油由丙烯酸树脂、单体、光引发剂、助剂或溶剂组成，无色隔离光油的组成材料具有可剥离、耐酸碱、耐化学试剂的特性要求。
优选地，所述可减粘性胶水由反应单体甲基丙烯酸甲酯(MMA)、丙烯酸(AA)、甲基丙烯酸乙酯、丙烯酸甲氧乙酯、丙烯酸丁酯(BA)、活性稀释剂、热固化剂、防老剂和溶剂组成。
一种无基材的带RFID的防转移卷材或标签的加工方法，包括如下步骤：
(1)在印刷用承载基材或透明保护膜的下表面涂敷一层可印刷无色隔离光油，完成印刷层的制作；
(2)在金属天线用承载基材的上表面涂敷一层可剥离粘合剂组合物，完成易剥离性薄层的制作；
(3)将金属天线层的下表面粘接在易剥离性薄层的上表面，采用直接镭射切割，或是减法工艺的蚀刻天线制作法，或是加法工艺的金属镀的印制法，或是电镀金属膜的方法；
(4)将芯片复合在已完成易剥离性薄层粘结的金属天线层的上 表面，用导电胶进行连接后产生回路，完成RFID干inlay的制作；
(5)将位于金属天线层下表面的金属天线用承载基材撕开，将干inlay的芯片下侧的金属天线层的下表面，与带底纸的胶材的上表面进行复合，背胶在一起；
(6)将带印刷用承载基材或透明保护膜的印刷层与带胶材的金属天线层通过复合层粘合在一起，复合层由粘合材料制成，所述粘合材料采用热熔胶、水基胶或双面胶材；
(7)撕去印刷用承载基材，或按客户需求，保留可被剥离的透明保护膜，整个产品制作完成，根据客户需求可以是卷材或标签。
优选地，所述步骤(2)中的可剥离粘合剂组合物为无色隔离光油。
优选地，所述步骤(2)中的可剥离粘合剂组合物为可减粘性胶水。
优选地，所述步骤(2)后面增加一步骤：通过固化设备来降低可剥离粘合剂组合物的粘性，以增快金属天线用承载基材被剥离的速度，采用的固化方式为温度固化或UV固化。
有益效果：本发明采用可剥离粘合剂组合物(无色隔离光油或可减粘性胶水)制成易剥离性薄层，以增快金属天线用承载基材被剥离的速度，同时也提高了成品率。由于金属天线本身的承载用基材已被剥离，不再滞留于整个产品的层结构之中，从而不会造成本身产品偏厚和偏硬现象，从而使产品本身贴敷在对象物后，如遇不法分子需移除本产品，由于产品本身没有任何承载材料，立即损毁，无法达到被 整体移除，从而达到完全易碎、可防揭、可防转移、满足一次性使用的防伪要求。
附图说明
图1为现有技术中RFID电子标签的结构示意图。
图2为本发明一个实施例中带RFID的防转移卷材或标签的结构示意图。
图中个符号代表：1.印刷层；2.复合层；3.芯片；4.金属天线层；5.易剥离性薄层；6.胶材；7.底纸。
具体实施方式
下表面结合附图对本发明的实施例作详细说明：本实施例在以本发明技术方案为前提下进行实施，给出了详细的实施方式和具体的操作过程，但本发明的保护范围不限于下述的实施例。
如图2所示，卷材或标签，从上往下依次包括印刷层1、复合层2、芯片3、金属天线层4、易剥离性薄层5、胶材6、底纸7，印刷层1的下表面粘接在复合层2的上表面，复合层2的下表面粘结在芯片3的上表面，芯片3的下表面粘接金属天线层4的上表面，金属天线层4的下表面粘接易剥离性薄层5的上表面，易剥离性薄层5的下表面粘接胶材6的上表面，胶材6的下表面粘结底纸7的上表面。
印刷层1的上表面粘接有一层可剥离的透明保护膜。印刷层1采用油墨印、转印、电镀或全息制作方式。芯片3置于金属天线层4的 上表面或下表面均可，本实施例中芯片3置于金属天线层4的上表面。金属天线层4采用导电金属材料，如AL、CU或银浆。易剥离性薄层5由可剥离粘合剂组合物制成，可剥离粘合剂组合物为无色隔离光油或可减粘性胶水。无色隔离光油由丙烯酸树脂、单体、光引发剂、助剂或溶剂组成，无色隔离光油的组成材料具有可剥离、耐酸碱、耐化学试剂的特性要求。可减粘性胶水由反应单体甲基丙烯酸甲酯(MMA)、丙烯酸(AA)、甲基丙烯酸乙酯、丙烯酸甲氧乙酯、丙烯酸丁酯(BA)、活性稀释剂、热固化剂、防老剂和溶剂组成。
一种无基材的带RFID的防转移卷材或标签的加工方法，包括如下步骤：
(1)在印刷用承载基材或透明保护膜的下表面涂敷一层可印刷无色隔离光油，完成印刷层的制作；
(2)在金属天线用承载基材的上表面涂敷一层可剥离粘合剂组合物，完成易剥离性薄层的制作；
(3)将金属天线层的下表面粘接在易剥离性薄层的上表面，采用直接镭射切割，或是减法工艺的蚀刻天线制作法，或是加法工艺的金属镀的印制法，或是电镀金属膜的方法；
(4)将芯片复合在已完成易剥离性薄层粘结的金属天线层的上表面，用导电胶进行连接后产生回路，完成RFID干inlay的制作；
(5)将位于金属天线层下表面的金属天线用承载基材撕开，将干inlay的芯片下侧的金属天线层的下表面，与带底纸的胶材的上表面进行复合，背胶在一起；
(6)将带印刷用承载基材或透明保护膜的印刷层与带胶材的金属天线层通过复合层粘合在一起，复合层由粘合材料制成，所述粘合材料采用热熔胶、水基胶或双面胶材；
(7)撕去印刷用承载基材，或按客户需求，保留可被剥离的透明保护膜，整个产品制作完成，根据客户需求可以是卷材或标签。
本发明采用的金属天线本身的承载用基材已被剥离，不再滞留于整个产品的层结构之中，从而不会造成本身产品偏厚和偏硬现象，从而使产品本身贴敷在对象物后，如遇不法分子需移除本产品，由于产品本身没有任何承载材料，揭开后便立即损毁，无法达到被整体移除，从而达到完全易碎、可防揭、可防转移、满足一次性使用的防伪要求。
以上显示和描述了本发明的基本原理和主要特征和本发明的优点。本行业的技术人员应该了解，本发明不受上述实施例的限制，上述实施例和说明书中描述的只是说明本发明的原理，在不脱离本发明精神和范围的前提下，本发明还会有各种变化和改进，这些变化和改进都落入要求保护的本发明范围内。本发明要求保护范围由所附的权利要求书及其等效物界定。

Claims (10)

  1. 一种无基材的带RFID的防转移卷材或标签，其特征在于，从上往下依次包括印刷层、复合层、芯片、金属天线层、易剥离性薄层、胶材、底纸，所述印刷层的下表面粘接在复合层的上表面，所述复合层的下表面粘结在芯片的上表面，所述芯片的下表面粘接金属天线层的上表面，所述金属天线层的下表面粘接易剥离性薄层的上表面，所述易剥离性薄层的下表面粘接胶材的上表面，所述胶材的下表面粘结底纸的上表面。
  2. 根据权利要求1所述的一种无基材的带RFID的防转移卷材或标签，其特征在于，所述印刷层的上表面粘接有一层可剥离的透明保护膜。
  3. 根据权利要求1所述的一种无基材的带RFID的防转移卷材或标签，其特征在于，所述印刷层采用油墨印、转印、电镀或全息制作方式。
  4. 根据权利要求1所述的一种无基材的带RFID的防转移卷材或标签，其特征在于，所述芯片置于金属天线层的上表面或下表面，所述金属天线层采用导电金属材料，如AL、CU或银浆。
  5. 根据权利要求1所述的一种无基材的带RFID的防转移卷材或标签，其特征在于，所述易剥离性薄层由可剥离粘合剂组合物制成，所述可剥离粘合剂组合物为无色隔离光油或可减粘性胶水。
  6. 根据权利要求5所述的一种无基材的带RFID的防转移卷材或标签，其特征在于，所述无色隔离光油由丙烯酸树脂、单体、光引发 剂、助剂或溶剂组成，无色隔离光油的组成材料具有可剥离、耐酸碱、耐化学试剂的特性要求。
  7. 根据权利要求5所述的一种无基材的带RFID的防转移卷材或标签，其特征在于，所述可减粘性胶水由反应单体甲基丙烯酸甲酯、丙烯酸、甲基丙烯酸乙酯、丙烯酸甲氧乙酯、丙烯酸丁酯、活性稀释剂、热固化剂、防老剂和溶剂组成。
  8. 一种无基材的带RFID的防转移卷材或标签的加工方法，其特征在于，包括如下步骤：
    (1)在印刷用承载基材或透明保护膜的下表面涂敷一层可印刷无色隔离光油，完成印刷层的制作；
    (2)在金属天线用承载基材的上表面涂敷一层可剥离粘合剂组合物，完成易剥离性薄层的制作；
    (3)将金属天线层的下表面粘接在易剥离性薄层的上表面，采用直接镭射切割，或是减法工艺的蚀刻天线制作法，或是加法工艺的金属镀的印制法，或是电镀金属膜的方法；
    (4)将芯片复合在已完成易剥离性薄层粘结的金属天线层的上表面，用导电胶进行连接后产生回路，完成RFID干inlay的制作；
    (5)将位于金属天线层下表面的金属天线用承载基材撕开，将干inlay的芯片下侧的金属天线层的下表面，与带底纸的胶材的上表面进行复合，背胶在一起；
    (6)将带印刷用承载基材或透明保护膜的印刷层与带胶材的金属天线层通过复合层粘合在一起，复合层由粘合材料制成，所述粘合 材料采用热熔胶、水基胶或双面胶材；
    (7)撕去印刷用承载基材，或按客户需求，保留可被剥离的透明保护膜，整个产品制作完成，根据客户需求可以是卷材或标签。
  9. 根据权利要求8所述的一种无基材的带RFID的防转移卷材或标签的加工方法，其特征在于，所述步骤(2)中的可剥离粘合剂组合物为无色隔离光油或可减粘性胶水。
  10. 根据权利要求8所述的一种无基材的带RFID的防转移卷材或标签的加工方法，其特征在于，所述步骤(2)后面增加一步骤：通过固化设备来降低可剥离粘合剂组合物的粘性，以增快金属天线用承载基材被剥离的速度，采用的固化方式为温度固化或UV固化。
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