WO2022213422A1 - 驱动基板及显示面板 - Google Patents

驱动基板及显示面板 Download PDF

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Publication number
WO2022213422A1
WO2022213422A1 PCT/CN2021/088377 CN2021088377W WO2022213422A1 WO 2022213422 A1 WO2022213422 A1 WO 2022213422A1 CN 2021088377 W CN2021088377 W CN 2021088377W WO 2022213422 A1 WO2022213422 A1 WO 2022213422A1
Authority
WO
WIPO (PCT)
Prior art keywords
scratch
binding
circuit board
flexible circuit
base
Prior art date
Application number
PCT/CN2021/088377
Other languages
English (en)
French (fr)
Inventor
程希
Original Assignee
Tcl华星光电技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tcl华星光电技术有限公司 filed Critical Tcl华星光电技术有限公司
Priority to US17/296,237 priority Critical patent/US20240032206A1/en
Publication of WO2022213422A1 publication Critical patent/WO2022213422A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/056—Folded around rigid support or component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display

Definitions

  • the present application relates to the field of display technology, and in particular, to a driving substrate and a display panel.
  • OLED Organic Light-Emitting Diode
  • Micro Light Emitting Diode Micro Light Emitted Diode, Micro LED
  • Mini/Micro LED backplanes currently only support the application of small-sized display panels, when used as backlights for large-sized TVs (60-inch, 75-inch, etc.), multiple backplanes are often spliced together.
  • large-scale splicing technology the demand for seamless splicing is becoming more and more urgent, so the narrow border splicing technology was born.
  • the flexible circuit board needs to bypass the glass edge and stick to the back of the glass substrate. The bent part of the flexible circuit board is at risk of being scratched by the glass edge, which will lead to poor display in severe cases.
  • Embodiments of the present application provide a driving substrate and a display panel to solve the technical problem that the flexible circuit board in the prior art Mini/Micro LED backplane is easily scratched by the glass edge.
  • Embodiments of the present application provide a driving substrate, which includes:
  • a flexible circuit board the flexible circuit board is disposed on the binding surface of the first binding portion, and is bent from the binding surface to the side of the first binding portion away from the binding surface , the flexible circuit board includes a bending part, an anti-scratch structure is arranged between the bending part and the first binding part, and the bending part is attached to the anti-scratch structure.
  • a surface of the anti-scratch structure close to the bending portion is a curved surface.
  • the surface of the anti-scratch structure close to the bending portion is a circular arc surface.
  • the anti-scratch structure includes a first anti-scratch portion and a second anti-scratch portion, and the second anti-scratch portion is located in the first anti-scratch portion.
  • the part is close to the side of the bending part;
  • the side of the first anti-scratch portion close to the second anti-scratch portion has a groove, the second anti-scratch portion is filled in the groove, and the bent portion is attached to the first anti-scratch portion.
  • Two anti-scratch parts, the elastic modulus of the second anti-scratch part is smaller than the elastic modulus of the first anti-scratch part.
  • the anti-scratch structure includes a first anti-scratch portion, and a side of the first anti-scratch portion close to the bending portion is a plane, the plane and The binding surfaces are connected, and the angle formed between the plane and the binding surface is greater than 90 degrees and less than 180 degrees.
  • the anti-scratch structure includes a second anti-scratch portion, and the second anti-scratch portion is disposed on the plane of the first anti-scratch portion , the bending portion is attached to the second anti-scratch portion, and the elastic modulus of the second anti-scratch portion is smaller than the elastic modulus of the first anti-scratch portion.
  • the first anti-scratch portion is integrally formed with the base.
  • the anti-scratch structure includes a base portion and an anti-scratch portion, the base portion and the base are integrally formed, and the anti-scratch portion is located near the base portion.
  • the bending part On one side of the bending part, the bending part is attached to the anti-scratch part, and the elastic modulus of the anti-scratch part is smaller than the elastic modulus of the base part.
  • the anti-scratch portion is a lubricating layer.
  • the base portion has a transition surface, the transition surface is connected to the binding surface, the scratch-resistant portion covers the transition surface, and is separated from the transition surface.
  • the face is bent to the side of the base.
  • the flexible circuit board further includes a second binding portion, the second binding portion is located on the binding surface and is connected to the bending portion, In the direction perpendicular to the plane where the binding surface is located, from the direction away from the second binding part to the direction close to the second binding part, the part of the anti-scratch part located on the transition surface The thickness gradually increases.
  • Embodiments of the present application provide a driving substrate, which includes:
  • a flexible circuit board the flexible circuit board is disposed on the binding surface of the first binding portion, and is bent from the binding surface to the side of the first binding portion away from the binding surface , the flexible circuit board includes a bending part, an anti-scratch structure is arranged between the bending part and the first binding part, and the bending part is attached to the anti-scratch structure;
  • the driver chip is disposed on a side of the first binding portion away from the binding surface, and is located at an end of the flexible circuit board;
  • An external circuit board is disposed on the side of the first binding portion away from the binding surface, and is used for transmitting control signals to the flexible circuit board.
  • Embodiments of the present application further provide a display panel, which includes a driving substrate, and the driving substrate includes:
  • a flexible circuit board the flexible circuit board is disposed on the binding surface of the first binding portion, and is bent from the binding surface to the side of the first binding portion away from the binding surface , the flexible circuit board includes a bending part, an anti-scratch structure is arranged between the bending part and the first binding part, and the bending part is attached to the anti-scratch structure.
  • a surface of the anti-scratch structure close to the bending portion is a curved surface.
  • the anti-scratch structure includes a first anti-scratch portion and a second anti-scratch portion, and the second anti-scratch portion is located in the first anti-scratch portion.
  • the part is close to the side of the bending part;
  • the side of the first anti-scratch portion close to the second anti-scratch portion has a groove, the second anti-scratch portion is filled in the groove, and the bent portion is attached to the first anti-scratch portion.
  • Two anti-scratch parts, the elastic modulus of the second anti-scratch part is smaller than the elastic modulus of the first anti-scratch part.
  • the anti-scratch structure includes a first anti-scratch portion, and a side of the first anti-scratch portion close to the bending portion is a plane, the plane and The binding surfaces are connected, and the angle formed between the plane and the binding surface is greater than 90 degrees and less than 180 degrees.
  • the anti-scratch structure includes a second anti-scratch portion, and the second anti-scratch portion is disposed on the plane of the first anti-scratch portion , the bending portion is attached to the second anti-scratch portion, and the elastic modulus of the second anti-scratch portion is smaller than the elastic modulus of the first anti-scratch portion.
  • the anti-scratch structure includes a base portion and an anti-scratch portion, the base portion and the base are integrally formed, and the anti-scratch portion is located near the base portion.
  • the bending part On one side of the bending part, the bending part is attached to the anti-scratch part, and the elastic modulus of the anti-scratch part is smaller than the elastic modulus of the base part.
  • the base portion has a transition surface, the transition surface is connected to the binding surface, the scratch-resistant portion covers the transition surface, and is separated from the transition surface.
  • the face is bent to the side of the base.
  • the flexible circuit board further includes a second binding portion, the second binding portion is located on the binding surface and is connected to the bending portion, In the direction perpendicular to the plane where the binding surface is located, from the direction away from the second binding part to the direction close to the second binding part, the part of the anti-scratch part located on the transition surface The thickness gradually increases.
  • the driving substrate provided by the present application provides an anti-scratch structure between the bending part of the flexible circuit board and the first binding part of the base, and makes the bending part fit. Due to the anti-scratch structure, the risk of scratches caused by direct contact between the bent portion of the flexible circuit board and the substrate can be reduced, thereby improving the display failure phenomenon caused by damage to the flexible circuit board.
  • FIG. 1 is a schematic top view of a driving substrate provided by the present application.
  • Fig. 2 is a schematic cross-sectional view of the driving substrate shown in Fig. 1 along the line A-A' of the first embodiment.
  • Fig. 3 is a schematic cross-sectional view of the driving substrate shown in Fig. 1 along the line A-A' of the second embodiment.
  • Fig. 4 is a schematic cross-sectional view of the driving substrate shown in Fig. 1 along the line A-A' of the third embodiment.
  • Fig. 5 is a schematic cross-sectional view of the driving substrate shown in Fig. 1 along the line A-A' of the fourth embodiment.
  • Fig. 6 is a schematic cross-sectional view of the driving substrate shown in Fig. 1 along the line A-A' of the fifth embodiment.
  • Fig. 7 is a schematic cross-sectional view of the driving substrate shown in Fig. 1 along the line A-A' of the sixth embodiment.
  • Fig. 8 is a schematic cross-sectional view of the driving substrate shown in Fig. 1 along the line A-A' of the seventh embodiment.
  • Fig. 9 is a schematic cross-sectional view of the driving substrate shown in Fig. 1 along the line A-A' of the eighth embodiment.
  • Embodiments of the present application provide a driving substrate and a display panel. Each of them will be described in detail below. It should be noted that the description order of the following embodiments is not intended to limit the preferred order of the embodiments.
  • the driving substrate may be a Mini/Micro LED backplane for Mini/Micro LED display; the driving substrate may also be an array substrate, which is used for liquid crystal display or organic light emitting diode display.
  • the driving substrate may also be an array substrate, which is used for liquid crystal display or organic light emitting diode display.
  • the following embodiments of this application only use the driving substrate as Mini/Micro
  • the structure of the LED backplane will be described as an example, but it is not limited to this.
  • a first embodiment of the present application provides a driving substrate 10 .
  • the driving substrate 10 includes a base 11 , a flexible circuit board 12 , a driving chip 13 and an external circuit board 14 .
  • the base 11 has a first binding portion 111 .
  • the flexible circuit board 12 is disposed on the binding surface 111a of the first binding portion 111, and is bent from the binding surface 111a to a side of the first binding portion 111 away from the binding surface 111a.
  • the flexible circuit board 12 includes a bending portion 121 .
  • An anti-scratch structure 15 is disposed between the bending portion 121 and the first binding portion 111 .
  • the bent portion 121 is attached to the anti-scratch structure 15 .
  • the driving chip 13 and the external circuit board 14 are both disposed on the side of the first binding portion 111 away from the binding surface 111a.
  • the driving chip 13 is disposed at the end of the flexible circuit board 12 and is used for providing driving signals to the flexible circuit board 12 .
  • the external circuit board 14 is used for providing control signals and transmitting the control signals to the flexible circuit board 12 to realize display driving.
  • the base 11 is a rigid substrate.
  • the rigid substrate may be glass.
  • a plurality of LED chips 16 are provided on the substrate 11 .
  • the LED chip 16 is located in the light emitting area of the base 11 and is used to provide a light source for the driving substrate 10 .
  • the LED chip 16 may be a Mini LED chip or a Micro LED.
  • the driving substrate 10 further includes a protective layer 17 .
  • the protective layer 17 is used to protect the flexible circuit board 12 .
  • the protective layer 17 not only protects the binding part of the flexible circuit board 12 from being eroded by water and oxygen, but also protects the flexible circuit board 12 from being scratched by the outside world.
  • the material of the protective layer 17 may be a resin material, such as epoxy resin or acrylic resin, etc.
  • the material of the protective layer 17 is not specifically limited in this application.
  • the surface of the anti-scratch structure 15 close to the bending portion 121 is a curved surface.
  • the surface of the anti-scratch structure 15 close to the bending portion 121 is a circular arc surface 15a.
  • the binding surface of the base is connected to its side surface, and the included angle between the two is a right angle, so that during the bending process of the flexible circuit board, the bending part of the flexible circuit board is
  • the contact between the substrates is point contact, so that the flexible circuit at the contact is easily scratched by the substrate, thereby greatly reducing the signal transmission performance of the flexible circuit board and increasing the risk of poor display of the display panel.
  • the surface of the anti-scratch structure 15 close to the bending portion 121 is set as the arc surface 15a, so that the contact between the bending portion 121 and the anti-scratch structure 15 is ensured.
  • the bending portion 121 smoothly transitions from the binding surface 111a to the arcuate surface 15a, thereby effectively reducing the risk of scratching of the flexible circuit board 12 during bending.
  • the specific size of the arc of the circular arc surface 15a can be set according to the size of the anti-scratch structure 15, which is not specifically limited in this application.
  • the anti-scratch structure 15 is integrally formed with the base 11 .
  • the surface of the anti-scratch structure 15 may be edged with a slate, so as to form an arc surface 15a with a smooth surface.
  • the anti-scratch structure 15 having the arc surface 15a may also be formed by a process such as laser cutting or grinding. The present application does not specifically limit the specific method for forming the arc surface 15a.
  • the anti-scratch structure 15 and the base 11 are integrally formed, in the process design of the above-mentioned edging treatment, it is necessary to avoid the peripheral wiring of the non-light-emitting area of the driving substrate 10 to avoid driving the light-emitting area. influences.
  • an anti-scratch structure 15 is arranged between the bent portion 121 of the flexible circuit board 12 and the first binding portion 111 of the base 11 , and the bent portion 121 is attached to the anti-scratch structure 15 to prevent scratches.
  • the surface of the wound structure 15 close to the bending portion 121 is a circular arc surface 15a.
  • the surface of the anti-scratch structure 15 close to the bending portion 121 is set as the arc surface 15a, so that the contact between the bending portion 121 and the anti-scratch structure 15 is surface contact, and the bending portion 121 is self-binding
  • the fixed surface 111a smoothly transitions to the circular arc surface 15a, which can effectively reduce the risk of scratches generated when the flexible circuit board 12 is bent, thereby helping to improve the driving performance of the driving substrate 10 and reducing the improvement caused by damage to the flexible circuit board 12. display defects.
  • a second embodiment of the present application provides a driving substrate 10 .
  • the driving substrate 10 includes a base 11 , a flexible circuit board 12 , a driving chip 13 and an external circuit board 14 .
  • the base 11 has a first binding portion 111 .
  • the flexible circuit board 12 is disposed on the binding surface 111a of the first binding portion 111, and is bent from the binding surface 111a to a side of the first binding portion 111 away from the binding surface 111a.
  • the flexible circuit board 12 includes a bending portion 121 .
  • An anti-scratch structure 15 is disposed between the bending portion 121 and the first binding portion 111 .
  • the bent portion 121 is attached to the anti-scratch structure 15 .
  • the driving chip 13 and the external circuit board 14 are both disposed on the side of the first binding portion 111 away from the binding surface 111a.
  • the driving chip 13 is disposed at the end of the flexible circuit board 12 and is used for providing driving signals to the flexible circuit board 12 .
  • the external circuit board 14 is used for providing control signals and transmitting the control signals to the flexible circuit board 12 to realize in-plane driving.
  • the base 11 is a rigid substrate.
  • the rigid substrate may be glass.
  • a plurality of LED chips 16 are provided on the substrate 11 .
  • the LED chip 16 is located in the light emitting area of the base 11 and is used to provide a light source for the driving substrate 10 .
  • the LED chip 16 may be a Mini LED chip or a Micro LED.
  • the driving substrate 10 further includes a protective layer 17 .
  • the protective layer 17 is used to protect the flexible circuit board 12 .
  • the protective layer 17 not only protects the binding part of the flexible circuit board 12 from being eroded by water and oxygen, but also protects the flexible circuit board 12 from being scratched by the outside world.
  • the material of the protective layer 17 may be a resin material, such as epoxy resin or acrylic resin, etc.
  • the material of the protective layer 17 is not specifically limited in this application.
  • the surface of the anti-scratch structure 15 close to the bending portion 121 is a plane 15b.
  • the flat surface 15b is connected to the binding surface 111a.
  • the angle R formed between the plane 15b and the binding surface 111a is greater than 90 degrees and less than 180 degrees. Specifically, the size of the angle R may be 95 degrees, 100 degrees, 120 degrees, 125 degrees or 150 degrees, and so on. The specific size of the angle R can be selected according to actual application requirements, which is not limited in this application.
  • the binding surface of the base is connected to the side surface, and the included angle between the two is a right angle, so that during the bending process of the flexible circuit board, the bending portion of the flexible circuit board is connected to the side surface.
  • the contact between the substrates is point contact, so that the flexible circuit at the contact is easily scratched by the substrate, thereby greatly reducing the signal transmission performance of the flexible circuit board and increasing the risk of poor display of the display panel.
  • the surface of the anti-scratch structure 15 close to the bending portion 121 is set as the plane 15b, and the angle R formed between the plane 15b and the binding surface 111a is greater than 90 degrees And less than 180 degrees, compared with the prior art, the risk of scratching the bending portion 121 of the flexible circuit board 12 during the bending process can be reduced.
  • the above arrangement reduces the difficulty of the process operation, which is beneficial to save the process cost.
  • the anti-scratch structure 15 is integrally formed with the base 11 .
  • the surface of the anti-scratch portion may be edged with a slate, so as to form a flat surface 15b with a smooth surface.
  • the anti-scratch structure 15 having the plane 15b can also be formed by a process such as laser cutting, and the specific method for forming the plane 15b is not specifically limited in the present application.
  • the anti-scratch structure 15 and the base 11 are integrally formed, in the process design of the above-mentioned edging treatment, it is necessary to avoid the peripheral wiring of the non-light-emitting area of the driving substrate 10 to avoid driving the light-emitting area. influences.
  • the surface of the anti-scratch structure 15 close to the bending portion 121 is set as the plane 15b, and the angle R formed between the plane 15b and the binding surface 111a is greater than 90 degrees and less than 180 degrees, thereby effectively reducing the flexible circuit.
  • the risk of scratching the board 12 during the bending process is beneficial to improve the driving performance of the driving substrate 10 and reduce and improve the display defects caused by the damage of the flexible circuit board 12 .
  • the above arrangement can also reduce the difficulty of the process operation, which is beneficial to reduce the process cost.
  • a third embodiment of the present application provides a driving substrate 10 .
  • the driving substrate 10 includes a base 11 , a flexible circuit board 12 , a driving chip 13 and an external circuit board 14 .
  • the base 11 has a first binding portion 111 .
  • the flexible circuit board 12 is disposed on the binding surface 111a of the first binding portion 111, and is bent from the binding surface 111a to a side of the first binding portion 111 away from the binding surface 111a.
  • the flexible circuit board 12 includes a bending portion 121 .
  • An anti-scratch structure 15 is disposed between the bending portion 121 and the first binding portion 111 .
  • the bent portion 121 is attached to the anti-scratch structure 15 .
  • the driving chip 13 and the external circuit board 14 are both disposed on the side of the first binding portion 111 away from the binding surface 111a.
  • the driving chip 13 is disposed at the end of the flexible circuit board 12 and is used for providing driving signals to the flexible circuit board 12 .
  • the external circuit board 14 is used for providing control signals and transmitting the control signals to the flexible circuit board 12 to realize in-plane driving.
  • the base 11 is a rigid substrate.
  • the rigid substrate may be glass.
  • a plurality of LED chips 16 are provided on the substrate 11 .
  • the LED chip 16 is located in the light emitting area of the base 11 and is used to provide a light source for the driving substrate 10 .
  • the LED chip 16 may be a Mini LED chip or a Micro LED.
  • the driving substrate 10 further includes a protective layer 17 .
  • the protective layer 17 is used to protect the flexible circuit board 12 .
  • the protective layer 17 not only protects the binding part of the flexible circuit board 12 from being eroded by water and oxygen, but also protects the flexible circuit board 12 from being scratched by the outside world.
  • the material of the protective layer 17 may be a resin material, such as epoxy resin or acrylic resin, etc.
  • the material of the protective layer 17 is not specifically limited in this application.
  • the anti-scratch structure 15 includes a first anti-scratch portion 151 and a second anti-scratch portion 152 .
  • the second anti-scratch portion 152 is located on the side of the first anti-scratch portion 151 close to the bending portion 121 .
  • the surface of the first anti-scratch portion 151 close to the bending portion 121 is a plane 151a.
  • the plane 151a is connected to the binding surface 111a, and the angle R formed between the plane 151a and the binding surface 111a is greater than 90 degrees and less than 180 degrees.
  • the size of the angle R may be 95 degrees, 100 degrees, 120 degrees, 125 degrees or 150 degrees, and so on.
  • the specific size of the angle R can be selected according to actual application requirements, which is not limited in this application.
  • the binding surface of the base is connected to the side surface, and the included angle between the two is a right angle, so that during the bending process of the flexible circuit board, the bending portion of the flexible circuit board is connected to the side surface.
  • the contact between the substrates is point contact, so that the flexible circuit at the contact is easily scratched by the substrate, thereby greatly reducing the signal transmission performance of the flexible circuit board and increasing the risk of poor display of the display panel.
  • the surface of the first anti-scratch portion 151 close to the bending portion 121 is set as a plane 151a, and the angle R formed between the plane 151a and the binding surface 111a is greater than 90 degrees and less than 180 degrees, compared with the prior art, can reduce the risk of scratches on the bending portion 121 of the flexible circuit board 12 during the bending process.
  • the above arrangement reduces the difficulty of the process operation, which is beneficial to save the process cost.
  • the first anti-scratch portion 151 is integrally formed with the base 11 .
  • the surface of the first anti-scratch portion 151 may be edged by using a slate, so as to form a flat surface 151a with a smooth surface.
  • the first anti-scratch portion 151 having the flat surface 151a may also be formed by a process such as laser cutting, and the specific method for forming the flat surface is not specifically limited in the present application.
  • first anti-scratch portion 151 and the base 11 are integrally formed, in the process design of the above-mentioned edging treatment, it is necessary to avoid the peripheral wiring of the non-light-emitting area of the driving substrate 10 to avoid damage to the light-emitting area. drive affects.
  • the second anti-scratch portion 152 is disposed on the flat surface 151 a of the first anti-scratch portion 151 .
  • the bent portion 121 is attached to the second anti-scratch portion 152 .
  • the elastic modulus of the second anti-scratch portion 152 is smaller than that of the first anti-scratch portion 151 .
  • the second anti-scratch portion 152 is provided between the first anti-scratch portion 151 and the bending portion 121 , and the elastic modulus of the second anti-scratch portion 152 is smaller than the elasticity of the first anti-scratch portion 151 Modulus, compared with the first anti-scratch portion 151, the second anti-scratch portion 152 has better deformability, so as to further improve the contact between the bending portion 121 of the flexible circuit board and the first anti-scratch portion 151 risk of scratching.
  • the material of the second anti-scratch portion 152 may be a hard material or a flexible material. In this embodiment, the material of the second anti-scratch portion 152 is a flexible material.
  • the second anti-scratch portion 152 may be a lubricating layer.
  • the surface of the lubricating layer is smooth.
  • the material of the lubricating layer can be a material such as varnish, which has lubricating effect and certain adhesion. Therefore, by using the lubricating layer, the risk of scratching the flexible circuit board 12 can be reduced, and the adhesion between the bending part 121 of the flexible circuit board 12 and the first anti-scratch part 151 can also be improved, so as to avoid the flexibility When the adhesion between the circuit board 12 and the first anti-scratch portion 151 is poor, loosening occurs and the driving performance thereof is affected.
  • the cross-sectional shape of the second anti-scratch portion 152 perpendicular to the plane where the substrate 11 is located is a right triangle, and the right angle of the right triangle is in contact with the bending portion 121 .
  • the surface of the second anti-scratch portion 152 close to the bending portion 121 is flush with the binding surface 111 a and the side surface of the base 11 .
  • the second anti-scratch portion 152 is formed on the plane 151a of the first anti-scratch portion 151 by means of printing, printing, coating or spraying.
  • the surface of the first anti-scratch portion 151 close to the bending portion 121 is set as a plane 151a, and the angle R formed between the plane 151a and the binding surface 111a is greater than 90 degrees and less than 180 degrees, the second anti-scratch
  • the wound portion 152 is set as a lubricating layer, which can improve the adhesion between the bending portion 121 of the flexible circuit board 12 and the first anti-scratch portion 151 while reducing the risk of scratching the flexible circuit board 12, thereby avoiding the The looseness of the flexible circuit board 12 affects its driving performance.
  • the difference between the driving substrate 10 provided by the fourth embodiment of the present application and the third embodiment is that the side of the second anti-scratch portion 152 close to the bending portion 121 is an arc surface 151b.
  • the risk of scratching the bending portion 121 of the flexible circuit board 12 can be further reduced.
  • the above arrangement reduces the requirements on the shape of the second anti-scratch portion 152, thereby helping to reduce the difficulty of work and operation, so as to reduce the process cost.
  • a fifth embodiment of the present application provides a driving substrate 10 .
  • the driving substrate 10 includes a base 11 , a flexible circuit board 12 , a driving chip 13 and an external circuit board 14 .
  • the base 11 has a first binding portion 111 .
  • the flexible circuit board 12 is disposed on the binding surface 111a of the first binding portion 111, and is bent from the binding surface 111a to a side of the first binding portion 111 away from the binding surface 111a.
  • the flexible circuit board 12 includes a bending portion 121 .
  • An anti-scratch structure 15 is disposed between the bending portion 121 and the first binding portion 111 .
  • the bent portion 121 is attached to the anti-scratch structure 15 .
  • the driving chip 13 is disposed at the end of the flexible circuit board 12 and is used for providing driving signals to the flexible circuit board 12 .
  • the external circuit board 14 is used for providing control signals and transmitting the control signals to the flexible circuit board 12 to realize in-plane driving.
  • the base 11 is a rigid substrate.
  • the rigid substrate may be glass.
  • a plurality of LED chips 16 are provided on the substrate 11 .
  • the LED chip 16 is located in the light emitting area of the base 11 and is used to provide a light source for the driving substrate 10 .
  • the LED chip 16 may be a Mini LED chip or a Micro LED.
  • the driving substrate 10 further includes a protective layer 17 .
  • the protective layer 17 is used to protect the flexible circuit board 12 .
  • the protective layer 17 not only protects the binding part of the flexible circuit board 12 from being eroded by water and oxygen, but also protects the flexible circuit board 12 from being scratched by the outside world.
  • the material of the protective layer 17 may be a resin material, such as epoxy resin or acrylic resin, etc.
  • the material of the protective layer 17 is not specifically limited in this application.
  • the anti-scratch structure 15 includes a first anti-scratch portion 151 and a second anti-scratch portion 152 .
  • the second anti-scratch portion 152 is located on the side of the first anti-scratch portion 151 close to the bending portion 121 .
  • a side of the first anti-scratch portion 151 close to the second anti-scratch portion 152 has a groove 151c.
  • the second anti-scratch portion 152 is filled in the groove 151c.
  • the bent portion 121 is attached to the second anti-scratch portion 152 .
  • the elastic modulus of the second anti-scratch portion 152 is smaller than that of the first anti-scratch portion 151 .
  • the first anti-scratch portion 151 is integrally formed with the base 11 .
  • the surface of the first anti-scratch portion 151 may be edged by using a stone, so as to form the groove 151 c on the first anti-scratch portion 151 .
  • the first anti-scratch portion 151 having the groove 151c may also be formed by a process such as laser cutting, and the specific method for forming the above plane is not specifically limited in the present application.
  • first anti-scratch portion 151 and the base 11 are integrally formed, in the process design of the above-mentioned edging treatment, it is necessary to avoid the peripheral wiring of the non-light-emitting area of the driving substrate 10 to avoid damage to the light-emitting area. drive affects.
  • the second anti-scratch portion 152 is arranged in the groove 151c on the first anti-scratch portion 151, and the elastic modulus of the second anti-scratch portion 152 is smaller than that of the first anti-scratch portion.
  • the second anti-scratch portion 152 has better deformability, which can further improve the bending portion 121 and the first anti-scratch portion of the flexible circuit board. 151 Risk of scratching at the contact.
  • the material of the second anti-scratch portion 152 may be a hard material or a flexible material. In this embodiment, the material of the second anti-scratch portion 152 is a flexible material.
  • the second anti-scratch portion 152 may be a lubricating layer.
  • the surface of the lubricating layer is smooth.
  • the material of the lubricating layer can be a material such as varnish, which has lubricating effect and certain adhesion. Therefore, by using the lubricating layer, the risk of scratching the flexible circuit board 12 can be reduced, and the adhesion between the bending part 121 of the flexible circuit board 12 and the first anti-scratch part 151 can also be improved, so as to avoid the flexibility When the adhesion between the circuit board 12 and the first anti-scratch portion 151 is poor, loosening occurs and the driving performance thereof is affected.
  • the second anti-scratch portion 152 is formed in the groove 151c on the first anti-scratch portion 151 by means of printing, printing, coating or spraying.
  • a groove 151c is provided on the side of the first anti-scratch portion 151 close to the bending portion 121, and the second anti-scratch portion 152 is filled in the groove 151c.
  • the elasticity of the second anti-scratch portion 152 The modulus is smaller than the elastic modulus of the first anti-scratch portion 151 , thereby reducing the risk of scratches on the flexible circuit board 12 and at the same time increasing the distance between the bending portion 121 of the flexible circuit board 12 and the first anti-scratch portion 151 Therefore, the driving performance of the flexible circuit board 12 can be prevented from being affected by the looseness of the flexible circuit board.
  • a sixth embodiment of the present application provides a driving substrate 10 .
  • the driving substrate 10 includes a base 11 , a flexible circuit board 12 , a driving chip 13 and an external circuit board 14 .
  • the base 11 has a first binding portion 111 .
  • the flexible circuit board 12 is disposed on the binding surface 111a of the first binding portion 111, and is bent from the binding surface 111a to a side of the first binding portion 111 away from the binding surface 111a.
  • the flexible circuit board 12 includes a bending portion 121 .
  • An anti-scratch structure 15 is disposed between the bending portion 121 and the first binding portion 111 .
  • the bent portion 121 is attached to the anti-scratch structure 15 .
  • the driving chip 13 and the external circuit board 14 are both disposed on the side of the first binding portion 111 away from the binding surface 111a.
  • the driving chip 13 is disposed at the end of the flexible circuit board 12 and is used for providing driving signals to the flexible circuit board 12 .
  • the external circuit board 14 is used for providing control signals and transmitting the control signals to the flexible circuit board 12 to realize in-plane driving.
  • the base 11 is a rigid substrate.
  • the rigid substrate may be glass.
  • a plurality of LED chips 16 are provided on the substrate 11 .
  • the LED chip 16 is located in the light emitting area of the base 11 and is used to provide a light source for the driving substrate 10 .
  • the LED chip 16 may be a Mini LED chip or a Micro LED.
  • the driving substrate 10 further includes a protective layer 17 .
  • the protective layer 17 is used to protect the flexible circuit board 12 .
  • the protective layer 17 not only protects the binding part of the flexible circuit board 12 from being eroded by water and oxygen, but also protects the flexible circuit board 12 from being scratched by the outside world.
  • the material of the protective layer 17 may be a resin material, such as epoxy resin or acrylic resin, etc.
  • the material of the protective layer 17 is not specifically limited in this application.
  • the anti-scratch structure 15 includes a base portion 151 and an anti-scratch portion 152 .
  • the anti-scratch portion 152 is located on the side of the base portion 151 close to the bent portion 121 .
  • the base 151 has a transition surface 151d.
  • the transition surface 151d is connected to the binding surface 111a.
  • the anti-scratch portion 152 covers the transition surface 151 d and is bent from the transition surface 151 d to the side surface of the base portion 151 .
  • the bent portion 121 is attached to the anti-scratch portion 152 .
  • the elastic modulus of the scratch prevention portion 152 is smaller than that of the base portion 151 .
  • the base portion 151 and the base 11 are integrally formed.
  • the base 151 is the edge portion of the substrate 11 close to the binding area. In this embodiment, it is not necessary to perform an edge grinding process on the base portion 151 .
  • the anti-scratch portion 152 is directly formed on the base 151 , and then the flexible circuit board 12 is bound.
  • the anti-scratch portion 152 is provided between the base 11 and the bent portion 121 of the flexible circuit board 12, and the elastic modulus of the anti-scratch portion 152 is smaller than that of the base portion 151, because the base portion 151 and the base 11 are integrally formed. Therefore, compared with the base 11 , the anti-scratch portion 152 has better deformability, thereby improving the risk of scratches at the contact between the bent portion 121 of the flexible circuit board 12 and the base portion 151 .
  • the material of the anti-scratch portion 152 may be a hard material or a flexible material. In this embodiment, the material of the anti-scratch portion 152 is a flexible material. In the actual process operation, the anti-scratch portion 152 may be formed on the surface of the base portion 151 by means of printing, printing, coating or spraying.
  • the anti-scratch portion 152 is a lubricating layer.
  • the surface of the lubricating layer is smooth.
  • the material of the lubricating layer can be a material such as varnish, which has lubricating effect and certain adhesion. Therefore, by using the lubricating layer, the risk of scratching the flexible circuit board 12 can be reduced, and the adhesion between the bent portion 121 of the flexible circuit board 12 and the base portion 151 can also be improved, so as to avoid the occurrence of damage caused by the flexible circuit board 12 and the first When the adhesion between the anti-scratch parts 152 is poor, loosening occurs and the driving performance thereof is affected.
  • the flexible circuit board 12 further includes a second binding portion 122 .
  • the second binding portion 122 is located on the binding surface 111 a and is connected to the bending portion 121 .
  • the thickness of the portion of the anti-scratch portion 152 on the transition surface 151d is the same.
  • the thickness of the anti-scratch portion 152 is between 1 ⁇ m and 100 ⁇ m, such as 1 ⁇ m, 10 ⁇ m, 25 ⁇ m, 50 ⁇ m, 75 ⁇ m or 100 ⁇ m, and the specific thickness of the anti-scratch portion 152 can be based on The actual process conditions and application requirements are selected, which is not limited in this application.
  • the difference between the driving substrate 10 provided by the seventh embodiment of the present application and the sixth embodiment is that the driving substrate 10 is away from the second binding portion 122 in the direction perpendicular to the plane where the binding surface 111 a is located.
  • the thickness of the portion of the anti-scratch portion 152 located on the transition surface 151d gradually increases toward the direction close to the second binding portion 122 .
  • the above arrangement enables the second binding portion 122 to smoothly transition from the binding surface 111 a to the transition surface 151 d , thereby reducing the risk of scratches on the flexible circuit board 12 and avoiding the impact of the first binding portion due to the setting of the anti-scratch portion 152 . Binding between 111 and the second binding part 122 .
  • the difference between the driving substrate 10 provided by the eighth embodiment of the present application and the seventh embodiment is that the surface of the anti-scratch portion 152 close to the bending portion 121 is an arc surface.
  • the above arrangement can further reduce the risk of scratches on the flexible circuit board 12 and reduce the requirements for the coating morphology of the scratch-resistant portion 152 , so as to improve the display defects, and at the same time, it can reduce the difficulty of process operation and reduce the process cost.
  • An embodiment of the present application further provides a display panel, the display panel includes a driving substrate, and the driving substrate may be the driving substrate 10 described in any of the foregoing embodiments, or may be a panel formed by splicing at least two driving substrates 10 .
  • the specific structure of the driving substrate 10 can be referred to the description of the embodiment, which is not repeated here.
  • the driving substrate provided by the present application provides an anti-scratch structure between the bending part of the flexible circuit board and the first binding part of the base, and makes the bending part fit. Due to the anti-scratch structure, the risk of scratches caused by direct contact between the bent portion of the flexible circuit board and the substrate can be reduced, thereby improving the display failure phenomenon caused by damage to the flexible circuit board.
  • a driving substrate and a display panel provided by the embodiments of the present application have been introduced in detail above.
  • the principles and implementations of the present application are described with specific examples in this article.
  • the content of this description should not be construed as LIMITATIONS ON THIS APPLICATION.

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Abstract

一种驱动基板（10）及显示面板，驱动基板（10）包括基底（11）以及柔性电路板（12），基底（11）具有第一绑定部（111），柔性电路板（12）设置于第一绑定部（111）的绑定面（111a）上，且自绑定面（111a）弯折至第一绑定部（111）远离绑定面（111a）的一侧，柔性电路板（12）包括一弯折部（121），弯折部（121）和第一绑定部（111）之间设有一防刮伤结构（15），弯折部（12）贴合于防刮伤结构（15）。

Description

驱动基板及显示面板 技术领域
本申请涉及显示技术领域，具体涉及一种驱动基板及显示面板。
 背景技术
随着高阶TV市场对画质的要求越来越高，提升显示画质成为高阶TV的一个新需求。目前8K有机发光二极管（Organic Light-Emitting Diode，OLED）受限于补偿电路、背板技术及驱动设计等问题，尚需开发。而迷你型发光二极管(Mini Light Emitted Diode，Mini LED)或微型发光二极管(Micro Light Emitted Diode，Micro LED)作为一个全新的显示技术，在亮度、功耗上较OLED有明显优势。
 技术问题
由于Mini/Micro LED背板目前仅支持小尺寸显示面板的应用，因此在作为大尺寸TV（60寸、75寸等）的背光时，往往需要多块背板拼接而成。随着大尺寸拼接技术的发展，目前对于无缝拼接的需求越来越急迫，因此诞生了窄边框拼接技术。特别是在玻璃基Mini/Micro LED的应用上，柔性电路板需要绕过玻璃边缘贴到玻璃基板背面，柔性电路板弯折的部分存在被玻璃边缘刮伤的风险，严重时会导致显示不良。
 技术解决方案
本申请实施例提供一种驱动基板及显示面板，以解决现有技术的Mini/Micro LED背板中存在的柔性电路板易被玻璃边缘刮伤的技术问题。
本申请实施例提供一种驱动基板，其包括：
基底，所述基底具有第一绑定部；以及
柔性电路板，所述柔性电路板设置于所述第一绑定部的绑定面上，且自所述绑定面弯折至所述第一绑定部远离所述绑定面的一侧，所述柔性电路板包括一弯折部，所述弯折部和所述第一绑定部之间设有一防刮伤结构，所述弯折部贴合于所述防刮伤结构。
可选的，在本申请的一些实施例中，所述防刮伤结构靠近所述弯折部的表面为曲面。
可选的，在本申请的一些实施例中，所述防刮伤结构靠近所述弯折部的表面为圆弧面。
可选的，在本申请的一些实施例中，所述防刮伤结构包括第一防刮伤部和第二防刮伤部，所述第二防刮伤部位于所述第一防刮伤部靠近所述弯折部的一侧；
所述第一防刮伤部靠近所述第二防刮伤部的一侧具有一凹槽，第二防刮伤部填充于所述凹槽内，所述弯折部贴合于所述第二防刮伤部，所述第二防刮伤部的弹性模量小于所述第一防刮伤部的弹性模量。
可选的，在本申请的一些实施例中，所述防刮伤结构包括第一防刮伤部，所述第一防刮伤部靠近所述弯折部的一面为平面，所述平面与所述绑定面相连，所述平面与所述绑定面之间形成的角度大于90度且小于180度。
可选的，在本申请的一些实施例中，所述防刮伤结构包括第二防刮伤部，所述第二防刮伤部设置于所述第一防刮伤部的所述平面上，所述弯折部贴合于所述第二防刮伤部，所述第二防刮伤部的弹性模量小于所述第一防刮伤部的弹性模量。
可选的，在本申请的一些实施例中，所述第一防刮伤部与所述基底一体成型。
可选的，在本申请的一些实施例中，所述防刮伤结构包括一基部和一防刮伤部，所述基部与所述基底一体成型，所述防刮伤部位于所述基部靠近所述弯折部的一侧，所述弯折部贴合于所述防刮伤部，所述防刮伤部的弹性模量小于所述基部的弹性模量。
可选的，在本申请的一些实施例中，所述防刮伤部为一润滑层。
可选的，在本申请的一些实施例中，所述基部具有一过渡面，所述过渡面与所述绑定面相连，所述防刮伤部覆盖所述过渡面，且自所述过渡面弯折至所述基部的侧面。
可选的，在本申请的一些实施例中，所述柔性电路板还包括第二绑定部，所述第二绑定部位于所述绑定面上，且与所述弯折部相连，在垂直于所述绑定面所在平面的方向上，自远离所述第二绑定部至靠近所述第二绑定部的方向，所述防刮伤部位于所述过渡面上的部分的厚度逐渐增大。
本申请实施例提供一种驱动基板，其包括：
基底，所述基底具有第一绑定部；
柔性电路板，所述柔性电路板设置于所述第一绑定部的绑定面上，且自所述绑定面弯折至所述第一绑定部远离所述绑定面的一侧，所述柔性电路板包括一弯折部，所述弯折部和所述第一绑定部之间设有一防刮伤结构，所述弯折部贴合于所述防刮伤结构；
驱动芯片，所述驱动芯片设置于所述第一绑定部远离所述绑定面的一侧，并位于所述柔性电路板的端部；以及
外置电路板，所述外置电路板设置于所述第一绑定部远离所述绑定面的一侧，用于将控制信号传输至所述柔性电路板中。
本申请实施例还提供一种显示面板，其包括驱动基板，所述驱动基板包括：
基底，所述基底具有第一绑定部；以及
柔性电路板，所述柔性电路板设置于所述第一绑定部的绑定面上，且自所述绑定面弯折至所述第一绑定部远离所述绑定面的一侧，所述柔性电路板包括一弯折部，所述弯折部和所述第一绑定部之间设有一防刮伤结构，所述弯折部贴合于所述防刮伤结构。
可选的，在本申请的一些实施例中，所述防刮伤结构靠近所述弯折部的表面为曲面。
可选的，在本申请的一些实施例中，所述防刮伤结构包括第一防刮伤部和第二防刮伤部，所述第二防刮伤部位于所述第一防刮伤部靠近所述弯折部的一侧；
所述第一防刮伤部靠近所述第二防刮伤部的一侧具有一凹槽，第二防刮伤部填充于所述凹槽内，所述弯折部贴合于所述第二防刮伤部，所述第二防刮伤部的弹性模量小于所述第一防刮伤部的弹性模量。
可选的，在本申请的一些实施例中，所述防刮伤结构包括第一防刮伤部，所述第一防刮伤部靠近所述弯折部的一面为平面，所述平面与所述绑定面相连，所述平面与所述绑定面之间形成的角度大于90度且小于180度。
可选的，在本申请的一些实施例中，所述防刮伤结构包括第二防刮伤部，所述第二防刮伤部设置于所述第一防刮伤部的所述平面上，所述弯折部贴合于所述第二防刮伤部，所述第二防刮伤部的弹性模量小于所述第一防刮伤部的弹性模量。
可选的，在本申请的一些实施例中，所述防刮伤结构包括一基部和一防刮伤部，所述基部与所述基底一体成型，所述防刮伤部位于所述基部靠近所述弯折部的一侧，所述弯折部贴合于所述防刮伤部，所述防刮伤部的弹性模量小于所述基部的弹性模量。
可选的，在本申请的一些实施例中，所述基部具有一过渡面，所述过渡面与所述绑定面相连，所述防刮伤部覆盖所述过渡面，且自所述过渡面弯折至所述基部的侧面。
可选的，在本申请的一些实施例中，所述柔性电路板还包括第二绑定部，所述第二绑定部位于所述绑定面上，且与所述弯折部相连，在垂直于所述绑定面所在平面的方向上，自远离所述第二绑定部至靠近所述第二绑定部的方向，所述防刮伤部位于所述过渡面上的部分的厚度逐渐增大。
 有益效果
相较于现有技术中的驱动基板，本申请提供的驱动基板通过在柔性电路板的弯折部与基底的第一绑定部之间设置一防刮伤结构，并使弯折部贴合于防刮伤结构，进而可以降低柔性电路板的弯折部与基底之间因直接接触而导致的刮伤风险，从而改善了因柔性电路板损伤而导致的显示不良现象。
 附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本申请提供的驱动基板的俯视示意图。
图2是图1所示的驱动基板沿A-A’线的第一种实施例的剖面示意图。
图3是图1所示的驱动基板沿A-A’线的第二种实施例的剖面示意图。
图4是图1所示的驱动基板沿A-A’线的第三种实施例的剖面示意图。
图5是图1所示的驱动基板沿A-A’线的第四种实施例的剖面示意图。
图6是图1所示的驱动基板沿A-A’线的第五种实施例的剖面示意图。
图7是图1所示的驱动基板沿A-A’线的第六种实施例的剖面示意图。
图8是图1所示的驱动基板沿A-A’线的第七种实施例的剖面示意图。
图9是图1所示的驱动基板沿A-A’线的第八种实施例的剖面示意图。
 本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请实施例提供一种驱动基板及显示面板。以下分别进行详细说明。需说明的是，以下实施例的描述顺序不作为对实施例优选顺序的限定。
需要说明的是，在本申请中，驱动基板可以为Mini/Micro LED背板，用于Mini/Micro LED显示；驱动基板也可以为阵列基板，用于液晶显示或有机发光二极管显示。本申请以下各实施例仅以驱动基板为Mini/Micro LED背板时的结构为例进行说明，但并不限于此。
请参照图1和图2，本申请第一种实施例提供一种驱动基板10。驱动基板10包括基底11、柔性电路板12、驱动芯片13以及外置电路板14。基底11具有第一绑定部111。柔性电路板12设置于第一绑定部111的绑定面111a上，且自绑定面111a弯折至第一绑定部111远离绑定面111a的一侧。柔性电路板12包括一弯折部121。弯折部121和第一绑定部111之间设有一防刮伤结构15。弯折部121贴合于防刮伤结构15。驱动芯片13和外置电路板14均设置于第一绑定部111远离绑定面111a的一侧。驱动芯片13设置于柔性电路板12的端部，用于向柔性电路板12提供驱动信号。外置电路板14用于提供控制信号，并将控制信号传输至柔性电路板12中，以实现显示驱动。
在本实施例中，基底11为硬质基板。所述硬质基板可以为玻璃。基底11上设有多个LED芯片16。LED芯片16位于基底11的发光区域，用于为驱动基板10提供光源。其中，LED芯片16可以为Mini LED芯片或Micro LED。
在本实施例中，驱动基板10还包括保护层17。保护层17用于保护柔性电路板12，具体的，保护层17在保护柔性电路板12的绑定部分不受水氧侵蚀的同时，还起到保护柔性电路板12不受外界刮伤的作用。其中，保护层17的材料可以为树脂材料，如可以为环氧树脂或丙烯酸树脂，等等，本申请对保护层17的材料不作具体限定。
其中，防刮伤结构15靠近弯折部121的表面为曲面。在本实施例中，防刮伤结构15靠近弯折部121的表面为圆弧面15a。
在现有技术的驱动基板中，基底的绑定面与其侧面相连，且两者之间的夹角为直角，由此使得在柔性电路板的弯折过程中，柔性电路板的弯折部分与基底之间的接触为点接触，导致接触处的柔性电路极易被基底刮伤，从而大大降低了柔性电路板的信号传输性能，增加了显示面板的显示不良风险。
针对现有技术中存在的上述技术问题，本实施例通过将防刮伤结构15靠近弯折部121的表面设为圆弧面15a，使得弯折部121与防刮伤结构15之间的接触为面接触，且弯折部121自绑定面111a平滑过渡至圆弧面15a，进而能够有效降低柔性电路板12在弯折时产生的刮伤风险。
需要说明的是，上述圆弧面15a的弧度越大，柔性电路板12在弯折时产生的刮伤风险越低。圆弧面15a弧度的具体大小可以根据防刮伤结构15的尺寸进行设定，本申请对此不作具体限定。
在本实施例中，防刮伤结构15与基底11一体成型。在实际工艺操作中，可以采用砥石对防刮伤结构15的表面进行磨边处理，以形成表面光滑的圆弧面15a。在一些实施例中，还可以采用激光切割或者打磨等工艺形成具有圆弧面15a的防刮伤结构15，本申请对上述圆弧面15a的具体形成方法不作具体限定。
需要说明的是，由于防刮伤结构15与基底11一体成型，在进行上述磨边处理的工艺设计中，需要避开驱动基板10非发光区域的外围走线，以避免对发光区域的驱动造成影响。
本实施例在柔性电路板12的弯折部121和基底11的第一绑定部111之间设置一防刮伤结构15，并使弯折部121贴合于防刮伤结构15，防刮伤结构15靠近弯折部121的表面为圆弧面15a。本实施例通过将防刮伤结构15靠近弯折部121的表面设为圆弧面15a，使得弯折部121与防刮伤结构15之间的接触为面接触，且弯折部121自绑定面111a平滑过渡至圆弧面15a，进而能够有效降低柔性电路板12在弯折时产生的刮伤风险，从而有利于提高驱动基板10的驱动性能，降低改善因柔性电路板12损伤而导致的显示不良现象。
请参照图3，本申请第二种实施例提供一种驱动基板10。驱动基板10包括基底11、柔性电路板12、驱动芯片13以及外置电路板14。基底11具有第一绑定部111。柔性电路板12设置于第一绑定部111的绑定面111a上，且自绑定面111a弯折至第一绑定部111远离绑定面111a的一侧。柔性电路板12包括一弯折部121。弯折部121和第一绑定部111之间设有一防刮伤结构15。弯折部121贴合于防刮伤结构15。驱动芯片13和外置电路板14均设置于第一绑定部111远离绑定面111a的一侧。驱动芯片13设置于柔性电路板12的端部，用于向柔性电路板12提供驱动信号。外置电路板14用于提供控制信号，并将控制信号传输至柔性电路板12中，以实现面内驱动。
在本实施例中，基底11为硬质基板。所述硬质基板可以为玻璃。基底11上设有多个LED芯片16。LED芯片16位于基底11的发光区域，用于为驱动基板10提供光源。其中，LED芯片16可以为Mini LED芯片或Micro LED。
在本实施例中，驱动基板10还包括保护层17。保护层17用于保护柔性电路板12，具体的，保护层17在保护柔性电路板12的绑定部分不受水氧侵蚀的同时，还起到保护柔性电路板12不受外界刮伤的作用。其中，保护层17的材料可以为树脂材料，如可以为环氧树脂或丙烯酸树脂，等等，本申请对保护层17的材料不作具体限定。
其中，防刮伤结构15靠近弯折部121的一面为平面15b。平面15b与绑定面111a相连。平面15b与绑定面111a之间形成的角度R大于90度且小于180度。具体的，角度R的大小可以为95度、100度、120度、125度或150度，等等。角度R的具体大小可以根据实际应用需求进行选择，本申请对此不作限定。
在现有技术的驱动基板中，基底的绑定面与侧面相连，且两者之间的夹角为直角，由此使得在柔性电路板的弯折过程中，柔性电路板的弯折部分与基底之间的接触为点接触，导致接触处的柔性电路极易被基底刮伤，从而大大降低了柔性电路板的信号传输性能，增加了显示面板的显示不良风险。
针对现有技术中存在的上述技术问题，本实施例通过将防刮伤结构15靠近弯折部121的一面设为平面15b，且平面15b与绑定面111a之间形成的角度R大于90度且小于180度，相较于现有技术，能够降低柔性电路板12的弯折部121在弯折过程中的刮伤风险。另外，上述设置降低了工艺操作的难度，有利于节约工艺成本。
在本实施例中，防刮伤结构15与基底11一体成型。在实际工艺操作中，可以采用砥石对防刮伤部的表面进行磨边处理，以形成表面光滑的平面15b。在一些实施例中，还可以采用激光切割等工艺形成具有平面15b的防刮伤结构15，本申请对上述平面15b的具体形成方法不作具体限定。
需要说明的是，由于防刮伤结构15与基底11一体成型，在进行上述磨边处理的工艺设计中，需要避开驱动基板10非发光区域的外围走线，以避免对发光区域的驱动造成影响。
本实施例通过将防刮伤结构15靠近弯折部121的一面设为平面15b，且平面15b与绑定面111a之间形成的角度R大于90度且小于180度，进而能够有效降低柔性电路板12在弯折过程中的刮伤风险，从而有利于提高驱动基板10的驱动性能，降低改善因柔性电路板12损伤而导致的显示不良现象。另外，上述设置还可以降低工艺操作难度，有利于降低工艺成本。
请参照图4，本申请第三种实施例提供一种驱动基板10。驱动基板10包括基底11、柔性电路板12、驱动芯片13以及外置电路板14。基底11具有第一绑定部111。柔性电路板12设置于第一绑定部111的绑定面111a上，且自绑定面111a弯折至第一绑定部111远离绑定面111a的一侧。柔性电路板12包括一弯折部121。弯折部121和第一绑定部111之间设有一防刮伤结构15。弯折部121贴合于防刮伤结构15。驱动芯片13和外置电路板14均设置于第一绑定部111远离绑定面111a的一侧。驱动芯片13设置于柔性电路板12的端部，用于向柔性电路板12提供驱动信号。外置电路板14用于提供控制信号，并将控制信号传输至柔性电路板12中，以实现面内驱动。
在本实施例中，基底11为硬质基板。所述硬质基板可以为玻璃。基底11上设有多个LED芯片16。LED芯片16位于基底11的发光区域，用于为驱动基板10提供光源。其中，LED芯片16可以为Mini LED芯片或Micro LED。
在本实施例中，驱动基板10还包括保护层17。保护层17用于保护柔性电路板12，具体的，保护层17在保护柔性电路板12的绑定部分不受水氧侵蚀的同时，还起到保护柔性电路板12不受外界刮伤的作用。其中，保护层17的材料可以为树脂材料，如可以为环氧树脂或丙烯酸树脂，等等，本申请对保护层17的材料不作具体限定。
防刮伤结构15包括第一防刮伤部151和第二防刮伤部152。第二防刮伤部152位于第一防刮伤部151靠近弯折部121的一侧。
具体的，第一防刮伤部151靠近弯折部121的一面为平面151a。平面151a与绑定面111a相连，且与绑定面111a之间形成的角度R大于90度且小于180度。其中，角度R的大小可以为95度、100度、120度、125度或150度，等等。角度R的具体大小可以根据实际应用需求进行选择，本申请对此不作限定。
在现有技术的驱动基板中，基底的绑定面与侧面相连，且两者之间的夹角为直角，由此使得在柔性电路板的弯折过程中，柔性电路板的弯折部分与基底之间的接触为点接触，导致接触处的柔性电路极易被基底刮伤，从而大大降低了柔性电路板的信号传输性能，增加了显示面板的显示不良风险。
针对现有技术中存在的上述技术问题，本实施例通过将第一防刮伤部151靠近弯折部121的一面设为平面151a，且平面151a与绑定面111a之间形成的角度R大于90度且小于180度，相较于现有技术，能够降低柔性电路板12的弯折部121在弯折过程中的刮伤风险。另外，上述设置降低了工艺操作的难度，有利于节约工艺成本。
在本实施例中，第一防刮伤部151与基底11一体成型。在实际工艺操作中，可以采用砥石对第一防刮伤部151的表面进行磨边处理，以形成表面光滑的平面151a。在一些实施例中，还可以采用激光切割等工艺形成具有所述平面151a的第一防刮伤部151，本申请对上述平面的具体形成方法不作具体限定。
需要说明的是，由于第一防刮伤部151与基底11一体成型，在进行上述磨边处理的工艺设计中，需要避开驱动基板10非发光区域的外围走线，以避免对发光区域的驱动造成影响。
第二防刮伤部152设置于第一防刮伤部151的平面151a上。弯折部121贴合于第二防刮伤部152。第二防刮伤部152的弹性模量小于第一防刮伤部151的弹性模量。
上述设置通过在第一防刮伤部151和弯折部121之间设置第二防刮伤部152，且使第二防刮伤部152的弹性模量小于第一防刮伤部151的弹性模量，相较于第一防刮伤部151，第二防刮伤部152具有较佳的形变能力，从而能够进一步改善柔性线路板的弯折部121与第一防刮伤部151接触处的刮伤风险。
其中，第二防刮伤部152的材料可以为硬质材料，也可以为柔性材料。在本实施例中，第二防刮伤部152的材料为柔性材料。
具体的，第二防刮伤部152可以为一润滑层。所述润滑层的表面光滑。所述润滑层的材料可以为光油等具有润滑作用并具有一定粘附性的材料。由此，通过使用润滑层，在降低柔性电路板12刮伤风险的同时，还可以提高柔性电路板12的弯折部121与第一防刮伤部151之间的附着力，从而避免因柔性电路板12与第一防刮伤部151之间附着力差时发生松动而影响其驱动性能。
在本实施中，第二防刮伤部152在垂直于基底11所在平面的截面形状为直角三角形，所述直角三角形的直角与弯折部121接触。第二防刮伤部152靠近弯折部121的表面与基底11的绑定面111a及侧面均齐平。
在实际工艺操作时，采用印刷、打印、涂覆或喷涂等方式在第一防刮伤部151的平面151a上形成第二防刮伤部152。
本实施例通过将第一防刮伤部151靠近弯折部121的一面设为平面151a，且平面151a与绑定面111a之间形成的角度R大于90度且小于180度，第二防刮伤部152设为一润滑层，在降低柔性电路板12刮伤风险的同时，还可以提高柔性电路板12的弯折部121与第一防刮伤部151之间的附着力，从而避免因柔性电路板12松动而影响其驱动性能。
请参照图5，本申请第四实施例提供的驱动基板10与第三种实施例的不同之处在于：第二防刮伤部152靠近弯折部121的一面为弧面151b。
本实施例通过将第二防刮伤部152靠近弯折部121的一面设为弧面151b，可以进一步降低柔性电路板12的弯折部121的刮伤风险。另外，上述设置降低了对第二防刮伤部152形貌的要求，从而有利于降低工作操作难度，以降低工艺成本。
请参照图6，本申请第五种实施例提供一种驱动基板10。驱动基板10包括基底11、柔性电路板12、驱动芯片13以及外置电路板14。基底11具有第一绑定部111。柔性电路板12设置于第一绑定部111的绑定面111a上，且自绑定面111a弯折至第一绑定部111远离绑定面111a的一侧。柔性电路板12包括一弯折部121。弯折部121和第一绑定部111之间设有一防刮伤结构15。弯折部121贴合于防刮伤结构15。驱动芯片13设置于柔性电路板12的端部，用于向柔性电路板12提供驱动信号。外置电路板14用于提供控制信号，并将控制信号传输至柔性电路板12中，以实现面内驱动。
在本实施例中，基底11为硬质基板。所述硬质基板可以为玻璃。基底11上设有多个LED芯片16。LED芯片16位于基底11的发光区域，用于为驱动基板10提供光源。其中，LED芯片16可以为Mini LED芯片或Micro LED。
在本实施例中，驱动基板10还包括保护层17。保护层17用于保护柔性电路板12，具体的，保护层17在保护柔性电路板12的绑定部分不受水氧侵蚀的同时，还起到保护柔性电路板12不受外界刮伤的作用。其中，保护层17的材料可以为树脂材料，如可以为环氧树脂或丙烯酸树脂，等等，本申请对保护层17的材料不作具体限定。
防刮伤结构15包括第一防刮伤部151和第二防刮伤部152。第二防刮伤部152位于第一防刮伤部151靠近弯折部121的一侧。
具体的，第一防刮伤部151靠近第二防刮伤部152的一侧具有一凹槽151c。第二防刮伤部152填充于凹槽151c内。弯折部121贴合于第二防刮伤部152。第二防刮伤部152的弹性模量小于第一防刮伤部151的弹性模量。
在本实施例中，第一防刮伤部151与基底11一体成型。在实际工艺操作中，可以采用砥石对第一防刮伤部151的表面进行磨边处理，以在第一防刮伤部151上形成凹槽151c。在一些实施例中，还可以采用激光切割等工艺形成具有所述凹槽151c的第一防刮伤部151，本申请对上述平面的具体形成方法不作具体限定。
需要说明的是，由于第一防刮伤部151与基底11一体成型，在进行上述磨边处理的工艺设计中，需要避开驱动基板10非发光区域的外围走线，以避免对发光区域的驱动造成影响。
进一步的，本实施例通过在第一防刮伤部151上的凹槽151c内设置第二防刮伤部152，且使第二防刮伤部152的弹性模量小于第一防刮伤部151的弹性模量，相较于第一防刮伤部151，第二防刮伤部152具有较佳的形变能力，从而能够进一步改善柔性线路板的弯折部121与第一防刮伤部151接触处的刮伤风险。
其中，第二防刮伤部152的材料可以为硬质材料，也可以为柔性材料。在本实施例中，第二防刮伤部152的材料为柔性材料。
具体的，第二防刮伤部152可以为一润滑层。所述润滑层的表面光滑。所述润滑层的材料可以为光油等具有润滑作用并具有一定粘附性的材料。由此，通过使用润滑层，在降低柔性电路板12刮伤风险的同时，还可以提高柔性电路板12的弯折部121与第一防刮伤部151之间的附着力，从而避免因柔性电路板12与第一防刮伤部151之间附着力差时发生松动而影响其驱动性能。
在实际工艺操作时，采用印刷、打印、涂覆或喷涂等方式在第一防刮伤部151上的凹槽151c内形成第二防刮伤部152。
本实施例通过将第一防刮伤部151靠近弯折部121的一侧设置一凹槽151c，并在凹槽151c内填充第二防刮伤部152，第二防刮伤部152的弹性模量小于第一防刮伤部151的弹性模量，进而在降低柔性电路板12刮伤风险的同时，还可以提高柔性电路板12的弯折部121与第一防刮伤部151之间的附着力，从而避免因柔性电路板12松动而影响其驱动性能。
请参照图7，本申请第六种实施例提供一种驱动基板10。驱动基板10包括基底11、柔性电路板12、驱动芯片13以及外置电路板14。基底11具有第一绑定部111。柔性电路板12设置于第一绑定部111的绑定面111a上，且自绑定面111a弯折至第一绑定部111远离绑定面111a的一侧。柔性电路板12包括一弯折部121。弯折部121和第一绑定部111之间设有一防刮伤结构15。弯折部121贴合于防刮伤结构15。驱动芯片13和外置电路板14均设置于第一绑定部111远离绑定面111a的一侧。驱动芯片13设置于柔性电路板12的端部，用于向柔性电路板12提供驱动信号。外置电路板14用于提供控制信号，并将控制信号传输至柔性电路板12中，以实现面内驱动。
在本实施例中，基底11为硬质基板。所述硬质基板可以为玻璃。基底11上设有多个LED芯片16。LED芯片16位于基底11的发光区域，用于为驱动基板10提供光源。其中，LED芯片16可以为Mini LED芯片或Micro LED。
在本实施例中，驱动基板10还包括保护层17。保护层17用于保护柔性电路板12，具体的，保护层17在保护柔性电路板12的绑定部分不受水氧侵蚀的同时，还起到保护柔性电路板12不受外界刮伤的作用。其中，保护层17的材料可以为树脂材料，如可以为环氧树脂或丙烯酸树脂，等等，本申请对保护层17的材料不作具体限定。
在本实施例中，防刮伤结构15包括一基部151和一防刮伤部152。防刮伤部152位于基部151靠近弯折部121的一侧。基部151具有一过渡面151d。过渡面151d与绑定面111a相连。防刮伤部152覆盖过渡面151d，且自过渡面151d弯折至基部151的侧面。弯折部121贴合于防刮伤部152。防刮伤部152的弹性模量小于基部151的弹性模量。
其中，基部151与基底11一体成型。在柔性电路板12绑定之前，基部151即为基底11中靠近绑定区域的边缘部分。在本实施例中，无需对基部151进行磨边处理工艺。在基底11（加上基部151）上形成LED芯片16以及相应外围走线之后，在基部151上直接形成防刮伤部152，然后进行柔性电路板12的绑定作业。
上述设置通过在基底11和柔性电路板12的弯折部121之间设置防刮伤部152，防刮伤部152的弹性模量小于基部151的弹性模量，由于基部151与基底11一体成型，因而相较于基底11，防刮伤部152具有较佳的形变能力，从而能够改善柔性电路板12的弯折部121与基部151接触处的刮伤风险。
其中，防刮伤部152的材料可以为硬质材料，也可以为柔性材料。在本实施例中，防刮伤部152的材料为柔性材料。在实际工艺操作时，可以采用印刷、打印、涂覆或喷涂等方式在基部151的表面形成防刮伤部152。
在本实施例中，防刮伤部152为一润滑层。所述润滑层的表面光滑。所述润滑层的材料可以为光油等具有润滑作用并具有一定粘附性的材料。由此，通过使用润滑层，在降低柔性电路板12刮伤风险的同时，还可以提高柔性电路板12的弯折部121与基部151之间的附着力，从而避免因柔性电路板12与第一防刮伤部152之间附着力差时发生松动而影响其驱动性能。
在本实施例中，柔性电路板12还包括第二绑定部122。第二绑定部122位于绑定面111a上，且与弯折部121相连。在垂直于绑定面111a所在平面的方向上，自远离第二绑定部122至靠近第二绑定部122的方向，防刮伤部152位于过渡面151d上的部分的厚度相同。
其中，防刮伤部152的厚度介于1微米至100微米之间，如可以为1微米、10微米、25微米、50微米、75微米或100微米，防刮伤部152的具体厚度可以根据实际工艺条件及应用需求进行选择，本申请对此不作限定。
请参照图8，本申请第七种实施例提供的驱动基板10与第六种实施例的不同之处在于：在垂直于绑定面111a所在平面的方向上，自远离第二绑定部122至靠近第二绑定部122的方向，防刮伤部152位于过渡面151d上的部分的厚度逐渐增大。
上述设置使得第二绑定部122自绑定面111a向过渡面151d平滑过渡，进而在降低柔性电路板12刮伤风险的同时，避免因防刮伤部152的设置而影响第一绑定部111和第二绑定部122之间的绑定。
请参照图9，本申请第八种实施例提供的驱动基板10与第七种实施例的不同之处在于：防刮伤部152靠近弯折部121的表面为弧面。
上述设置可以进一步降低柔性电路板12的刮伤风险，并降低对防刮伤部152涂覆形貌的要求，从而在改善显示不良现象的同时，能够降低工艺操作难度，以降低工艺成本。
本申请实施例还提供一种显示面板，所述显示面板包括驱动基板，所述驱动基板可以为前述任一实施例所述的驱动基板10，也可以为至少两个驱动基板10拼接形成的面板。其中，驱动基板10的具体结构可以参照实施例的描述，在此不再赘述。
相较于现有技术中的驱动基板，本申请提供的驱动基板通过在柔性电路板的弯折部与基底的第一绑定部之间设置一防刮伤结构，并使弯折部贴合于防刮伤结构，进而可以降低柔性电路板的弯折部与基底之间因直接接触而导致的刮伤风险，从而改善了因柔性电路板损伤而导致的显示不良现象。
以上对本申请实施例所提供的一种驱动基板及显示面板进行了详细的介绍，本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请的方法及其核心思想；同时，对于本领域的技术人员，依据本申请的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本申请的限制。

Claims (20)

  1. 一种驱动基板，其中，所述驱动基板包括：
    基底，所述基底具有第一绑定部；以及
    柔性电路板，所述柔性电路板设置于所述第一绑定部的绑定面上，且自所述绑定面弯折至所述第一绑定部远离所述绑定面的一侧，所述柔性电路板包括一弯折部，所述弯折部和所述第一绑定部之间设有一防刮伤结构，所述弯折部贴合于所述防刮伤结构。
  2. 根据权利要求1所述的驱动基板，其中，所述防刮伤结构靠近所述弯折部的表面为曲面。
  3. 根据权利要求2所述的驱动基板，其中，所述防刮伤结构靠近所述弯折部的表面为圆弧面。
  4. 根据权利要求1所述的驱动基板，其中，所述防刮伤结构包括第一防刮伤部和第二防刮伤部，所述第二防刮伤部位于所述第一防刮伤部靠近所述弯折部的一侧；
    所述第一防刮伤部靠近所述第二防刮伤部的一侧具有一凹槽，第二防刮伤部填充于所述凹槽内，所述弯折部贴合于所述第二防刮伤部，所述第二防刮伤部的弹性模量小于所述第一防刮伤部的弹性模量。
  5. 根据权利要求1所述的驱动基板，其中，所述防刮伤结构包括第一防刮伤部，所述第一防刮伤部靠近所述弯折部的一面为平面，所述平面与所述绑定面相连，所述平面与所述绑定面之间形成的角度大于90度且小于180度。
  6. 根据权利要求5所述的驱动基板，其中，所述防刮伤结构包括第二防刮伤部，所述第二防刮伤部设置于所述第一防刮伤部的所述平面上，所述弯折部贴合于所述第二防刮伤部，所述第二防刮伤部的弹性模量小于所述第一防刮伤部的弹性模量。
  7. 根据权利要求4所述的驱动基板，其中，所述第一防刮伤部与所述基底一体成型。
  8. 根据权利要求1所述的驱动基板，其中，所述防刮伤结构包括一基部和一防刮伤部，所述基部与所述基底一体成型，所述防刮伤部位于所述基部靠近所述弯折部的一侧，所述弯折部贴合于所述防刮伤部，所述防刮伤部的弹性模量小于所述基部的弹性模量。
  9. 根据权利要求8所述的驱动基板，其中，所述防刮伤部为一润滑层。
  10. 根据权利要求8所述的驱动基板，其中，所述基部具有一过渡面，所述过渡面与所述绑定面相连，所述防刮伤部覆盖所述过渡面，且自所述过渡面弯折至所述基部的侧面。
  11. 根据权利要求10所述的驱动基板，其中，所述柔性电路板还包括第二绑定部，所述第二绑定部位于所述绑定面上，且与所述弯折部相连，在垂直于所述绑定面所在平面的方向上，自远离所述第二绑定部至靠近所述第二绑定部的方向，所述防刮伤部位于所述过渡面上的部分的厚度逐渐增大。
  12. 一种驱动基板，其中，所述驱动基板包括：
    基底，所述基底具有第一绑定部；
    柔性电路板，所述柔性电路板设置于所述第一绑定部的绑定面上，且自所述绑定面弯折至所述第一绑定部远离所述绑定面的一侧，所述柔性电路板包括一弯折部，所述弯折部和所述第一绑定部之间设有一防刮伤结构，所述弯折部贴合于所述防刮伤结构；
    驱动芯片，所述驱动芯片设置于所述第一绑定部远离所述绑定面的一侧，并位于所述柔性电路板的端部；以及
    外置电路板，所述外置电路板设置于所述第一绑定部远离所述绑定面的一侧，用于将控制信号传输至所述柔性电路板中。
  13. 一种显示面板，其中，所述显示面板包括驱动基板，所述驱动基板包括：
    基底，所述基底具有第一绑定部；以及
    柔性电路板，所述柔性电路板设置于所述第一绑定部的绑定面上，且自所述绑定面弯折至所述第一绑定部远离所述绑定面的一侧，所述柔性电路板包括一弯折部，所述弯折部和所述第一绑定部之间设有一防刮伤结构，所述弯折部贴合于所述防刮伤结构。
  14. 根据权利要求13所述的显示面板，其中，所述防刮伤结构靠近所述弯折部的表面为曲面。
  15. 根据权利要求13所述的显示面板，其中，所述防刮伤结构包括第一防刮伤部和第二防刮伤部，所述第二防刮伤部位于所述第一防刮伤部靠近所述弯折部的一侧；
    所述第一防刮伤部靠近所述第二防刮伤部的一侧具有一凹槽，第二防刮伤部填充于所述凹槽内，所述弯折部贴合于所述第二防刮伤部，所述第二防刮伤部的弹性模量小于所述第一防刮伤部的弹性模量。
  16. 根据权利要求13所述的显示面板，其中，所述防刮伤结构包括第一防刮伤部，所述第一防刮伤部靠近所述弯折部的一面为平面，所述平面与所述绑定面相连，所述平面与所述绑定面之间形成的角度大于90度且小于180度。
  17. 根据权利要求16所述的显示面板，其中，所述防刮伤结构包括第二防刮伤部，所述第二防刮伤部设置于所述第一防刮伤部的所述平面上，所述弯折部贴合于所述第二防刮伤部，所述第二防刮伤部的弹性模量小于所述第一防刮伤部的弹性模量。
  18. 根据权利要求13所述的显示面板，其中，所述防刮伤结构包括一基部和一防刮伤部，所述基部与所述基底一体成型，所述防刮伤部位于所述基部靠近所述弯折部的一侧，所述弯折部贴合于所述防刮伤部，所述防刮伤部的弹性模量小于所述基部的弹性模量。
  19. 根据权利要求18所述的显示面板，其特征在于，所述基部具有一过渡面，所述过渡面与所述绑定面相连，所述防刮伤部覆盖所述过渡面，且自所述过渡面弯折至所述基部的侧面。
  20. 根据权利要求19所述的显示面板，其中，所述柔性电路板还包括第二绑定部，所述第二绑定部位于所述绑定面上，且与所述弯折部相连，在垂直于所述绑定面所在平面的方向上，自远离所述第二绑定部至靠近所述第二绑定部的方向，所述防刮伤部位于所述过渡面上的部分的厚度逐渐增大。
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