WO2022210627A1 - 積層セラミックコンデンサ - Google Patents

積層セラミックコンデンサ Download PDF

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Publication number
WO2022210627A1
WO2022210627A1 PCT/JP2022/015246 JP2022015246W WO2022210627A1 WO 2022210627 A1 WO2022210627 A1 WO 2022210627A1 JP 2022015246 W JP2022015246 W JP 2022015246W WO 2022210627 A1 WO2022210627 A1 WO 2022210627A1
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WO
WIPO (PCT)
Prior art keywords
electrode
internal
ceramic capacitor
internal electrode
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2022/015246
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English (en)
French (fr)
Japanese (ja)
Inventor
徹 若松
大介 濱田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP2023511324A priority Critical patent/JP7652244B2/ja
Priority to CN202280019007.0A priority patent/CN116918013A/zh
Publication of WO2022210627A1 publication Critical patent/WO2022210627A1/ja
Priority to US18/373,345 priority patent/US20240021370A1/en
Anticipated expiration legal-status Critical
Priority to JP2025040183A priority patent/JP2025083495A/ja
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/008—Selection of materials
    • H01G4/0085—Fried electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
    • H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
    • H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals

Definitions

  • the present invention relates to a multilayer ceramic capacitor, and more particularly to the metal composition of internal electrodes provided in the multilayer ceramic capacitor.
  • a multilayer ceramic capacitor generally includes a laminate having a plurality of laminated dielectric layers and a plurality of internal electrodes arranged along the interface between the dielectric layers, and an outer surface of the laminate having and a plurality of external electrodes provided and electrically connected to the internal electrodes.
  • the internal electrodes are known to contain Ni as a main component, as described in Japanese Patent Application Laid-Open No. 11-283867 (Patent Document 1), for example.
  • the present invention has been made in view of such problems, and aims to provide a multilayer ceramic capacitor having a thinner dielectric layer and exhibiting excellent reliability even when a voltage having a high electric field strength is applied. With the goal.
  • a multilayer ceramic capacitor according to the present invention includes a laminate having a plurality of laminated dielectric layers made of ceramic and a plurality of internal electrodes respectively arranged along a plurality of interfaces between the dielectric layers; a plurality of external electrodes provided on the external surface of the body and electrically connected to the internal electrodes.
  • the internal electrodes include a plurality of first internal electrodes and a plurality of second internal electrodes alternately arranged in the stacking direction of the laminate, and the external electrodes are first external electrodes electrically connected to the first internal electrodes. an electrode; and a second external electrode electrically connected to the second internal electrode.
  • a voltage is applied between the first external electrode and the second external electrode such that the first internal electrode is a positive electrode and the second internal electrode is a negative electrode.
  • Polarity based on direction is defined, the first internal electrode having a first metal composition comprising Ni and Sn and the second internal electrode having a second metal composition comprising Ni.
  • composition of the first metal and the composition of the second metal differ in at least one of the type and content of the constituent elements.
  • the present invention it is possible to suppress deterioration of the insulation of the multilayer ceramic capacitor when a voltage is applied, and thus obtain a multilayer ceramic capacitor with excellent reliability.
  • the first metal composition of the first internal electrode contains Sn, the reliability of the multilayer ceramic capacitor when a voltage is applied can be further improved.
  • the melting point can be made higher than when Cu is the main component, for example. Therefore, since the first internal electrode and the second internal electrode can be made thinner, the number of laminations can be increased while maintaining the outer dimensions of the multilayer ceramic capacitor, and as a result, the acquired capacitance can be increased. can be done.
  • FIG. 1 is a cross-sectional view schematically showing a laminated ceramic capacitor 1 according to one embodiment of the invention
  • FIG. 2 is a diagram for explaining standard electrode potentials of metal elements contained in each of a first internal electrode (positive electrode) 4 and a second internal electrode (negative electrode) 5 in the multilayer ceramic capacitor 1 shown in FIG. 1;
  • FIG. 1 is a cross-sectional view schematically showing a laminated ceramic capacitor 1 according to one embodiment of the invention
  • FIG. 2 is a diagram for explaining standard electrode potentials of metal elements contained in each of a first internal electrode (positive electrode) 4 and a second internal electrode (negative electrode) 5 in the multilayer ceramic capacitor 1 shown in FIG. 1;
  • the multilayer ceramic capacitor 1 includes a laminate 2.
  • the laminate 2 includes a plurality of laminated dielectric layers 3 made of ceramic and a plurality of internal electrodes 4 and 5 arranged along interfaces between the plurality of dielectric layers 3 .
  • the internal electrodes 4 and 5 are classified into a plurality of first internal electrodes 4 and a plurality of second internal electrodes 5 arranged alternately in the stacking direction of the laminate 3 .
  • External electrodes 6 and 7 are provided on the outer surface of the laminate 2, more specifically, on each end face facing each other.
  • the external electrodes 6 and 7 are classified into a first external electrode 6 electrically connected to the first internal electrode 4 and a second external electrode 7 electrically connected to the second internal electrode 5 .
  • the composition of the internal electrodes 4 and 5 will be described later.
  • the external electrodes 6 and 7 are mainly composed of Ag or Cu, for example.
  • the dielectric layer 3 contains a perovskite-type compound containing Ba and Ti (however, part of Ba may be replaced with Ca, and part of Ti may be replaced with Zr) as a main component. It preferably consists of a body ceramic. In particular, when the main component of the dielectric layer 3 is BaTiO 3 , it exhibits a high dielectric constant, and the multilayer ceramic capacitor 1 exhibits excellent reliability.
  • Dielectric layer 3 may contain, for example, rare earth elements, Mn, Mg, Si, etc. as subcomponents in addition to the main components.
  • the dielectric ceramic raw material powder is produced, for example, by a solid-phase synthesis method. Specifically, first, compound powders such as oxides and carbonates containing constituent elements of the main component are mixed in a predetermined ratio and calcined. In addition to the solid-phase synthesis method, a hydrothermal method or the like may be applied. In addition, the dielectric ceramic may contain alkali metals, transition metals, Cl, S, P, Hf, and the like in amounts that do not interfere with the effects of the present invention.
  • the multilayer ceramic capacitor 1 is manufactured, for example, as follows.
  • a ceramic slurry is prepared using the dielectric ceramic raw material powder obtained as described above.
  • a ceramic green sheet is formed by a sheet forming method or the like.
  • a conductive paste to be each of the internal electrodes 4 and 5 is applied by printing or the like onto predetermined ceramic green sheets among the plurality of ceramic green sheets.
  • After laminating a plurality of ceramic green sheets they are pressure-bonded to obtain a green laminate.
  • the green laminate is then fired.
  • the dielectric layer 3 made of dielectric ceramic is obtained.
  • the external electrodes 6 and 7 are formed on the end surfaces of the laminate 3 by baking or the like.
  • the voltage applied between the first external electrode 6 and the second external electrode 7 is adjusted such that the first internal electrode 4 is the positive electrode and the second internal electrode 5 is the negative electrode.
  • a first feature is that the polarity is determined based on the direction of application. Therefore, although not shown, it is preferable that, for example, the outer surface of the multilayer ceramic capacitor 1 is provided with a mark indicating polarity.
  • the multilayer ceramic capacitor to which the present invention is applied is not limited to the two-terminal type having the first external electrode 6 and the second external electrode 7 as shown in FIG. It may be of a multi-terminal type. In this case, between specific two sets of external electrodes selected from three or more external electrodes, that is, at least one first external A voltage may be applied between the electrode and at least one second external electrode.
  • a second feature of the multilayer ceramic capacitor 1 is that the metal compositions of the first internal electrodes 4 and the second internal electrodes 5 are selected as follows. That is, the first internal electrode 4 serving as a positive electrode has a first metal composition containing Ni and Sn, and the second internal electrode 5 serving as a negative electrode has a second metal composition containing Ni.
  • the trigger is negative electrode segregation of oxygen ions (positive segregation of oxygen vacancies) associated with voltage application. Therefore, it is expected that deterioration of the insulation of the multilayer ceramic capacitor can be suppressed by suppressing the negative electrode segregation of oxygen ions. Therefore, it is conceivable that the positive electrode contains an element whose oxide is stable and the negative electrode contains an element whose oxide is unstable. Based on this idea, negative electrode segregation can be suppressed by causing a reduction reaction (release of oxygen ions) at the negative electrode.
  • a metal element whose valence is likely to increase is present on the side of the first internal electrode 4 serving as the positive electrode.
  • a metal element whose valence is likely to decrease (having a high standard electrode potential) is used on the side of the second internal electrode 5 serving as the negative electrode.
  • the standard electrode potential is a value specific to an element. The lower the value, the more stable the oxide, and the higher the value, the more unstable the oxide.
  • the second internal electrode 5 on the negative electrode side contains a metal element with a standard electrode potential higher than the standard electrode potential of the metal element on the first internal electrode 4 on the positive electrode side.
  • the standard electrode potential of the first metal composition of the first internal electrode 4 on the positive electrode side may be included in the range of A
  • the standard electrode potential of the second metal composition of the second internal electrode 5 on the negative electrode side The potential should be included in the range of B.
  • Ni is -0.26V
  • Sn is -0.14V, +0.34 V for Cu
  • Ru is +0.46V
  • Rh is +0.76V
  • Ag is +0.8V
  • Os is +0.9V, +0.92 V for Pd
  • Ir is +1.16V, +1.19 V for Pt
  • Au is +1.52V.
  • the standard electrode potential of Ni contained in the first metal composition of the first internal electrode 4 is -0.26 V, and the standard electrode potential of Sn is -0.14 V, whereas the second metal composition of the second internal electrode 5
  • the standard electrode potential of Ni contained in is -0.26V.
  • Ni is easily passivated, which is a state in which it is not oxidized, and the standard electrode potential is assumed to be -0.26V. Therefore, when comparing the standard electrode potentials between the first internal electrode 4 and the second internal electrode 5, the standard electrode potential of Sn for the first internal electrode 4 is ⁇ 0.14 V, and the second As for the internal electrode 5, almost 0 V due to passivation of Ni is a reference.
  • the standard electrode potential given by the second internal electrode 5, which is the negative electrode is higher than the standard electrode potential given by the first internal electrode 4, which is the positive electrode. is used to suppress negative electrode segregation of oxygen ions (positive electrode segregation of oxygen vacancies) due to voltage application, and as a result, insulation deterioration during voltage application of the multilayer ceramic capacitor 1 can be suppressed.
  • a multilayer ceramic capacitor 1 can be obtained.
  • the second metal composition of the second internal electrode 5 may contain only Ni as described above, but Ni is the main component and Au, Pt, Ir, Pd, Os, It is preferable to use at least one metal element selected from Ag, Rh, Ru and Cu as an additive component. Au, Pt, Ir, Pd, Os, Ag, Rh and Ru contained in the second metal composition are noble metals.
  • the “main component” refers to the metal element having the highest content, more specifically, having a content of 50% or more. .
  • the standard electrode potential of Ni contained in the first metal composition of the first internal electrode 4 is ⁇ 0.26 V
  • the standard electrode potential of Sn is ⁇ 0.14 V
  • At least one metal element selected from Au, Pt, Ir, Pd, Os, Ag, Rh, Ru and Cu added to the second metal composition of the second internal electrode 5 as the negative electrode is A reduction reaction can be more induced in the internal electrode 5, and the negative electrode segregation of oxygen ions can be further suppressed.
  • the higher the standard electrode potential the more unstable the oxide.
  • the effect of suppressing negative electrode segregation of oxygen ions becomes higher.
  • the first metal composition of the first internal electrode 4 preferably does not contain a metal element having a higher standard electrode potential than Sn. This is because the relatively low standard electrode potential of the first metal composition can be advantageously maintained.
  • both the first metal composition of the first internal electrode 4 and the second metal composition of the second internal electrode 5 contain Ni, their melting points are higher than when Cu is the main component, for example. can do. Therefore, since the first internal electrode 4 and the second internal electrode 5 can be made thinner, the number of laminations can be increased while maintaining the outer dimensions of the multilayer ceramic capacitor 1. As a result, the obtained capacitance can be increased. can be raised.
  • Ni and Sn contained in the first metal composition of the first internal electrode 4 are contained in the conductive paste applied on the ceramic green sheets during the manufacturing of the multilayer ceramic capacitor 1, but Ni and Sn are contained in advance.
  • Ni and Sn may be contained in the conductive paste in the form of an alloy or intermetallic compound containing Ni and Sn, or Ni and Sn may be contained in the conductive paste in separate forms. Even when the second metal composition of the second internal electrode 5 contains a plurality of metal elements, even if it is contained in the conductive paste in advance in the form of an alloy or an intermetallic compound containing a plurality of metal elements, separate It may be contained in the conductive paste in the form of a metal element.
  • Ni and Sn contained in the first metal composition of the first internal electrode 4 are preferably alloyed with a plurality of these metal elements at the stage of the multilayer ceramic capacitor 1 as a product.
  • the second metal composition of the second internal electrode 5 contains a plurality of metal elements, these metal elements are preferably alloyed at the stage of the multilayer ceramic capacitor 1 as a product.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
PCT/JP2022/015246 2021-03-31 2022-03-29 積層セラミックコンデンサ Ceased WO2022210627A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2023511324A JP7652244B2 (ja) 2021-03-31 2022-03-29 積層セラミックコンデンサ
CN202280019007.0A CN116918013A (zh) 2021-03-31 2022-03-29 层叠陶瓷电容器
US18/373,345 US20240021370A1 (en) 2021-03-31 2023-09-27 Multilayer ceramic capacitor
JP2025040183A JP2025083495A (ja) 2021-03-31 2025-03-13 積層セラミックコンデンサ

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021058923 2021-03-31
JP2021-058923 2021-03-31

Related Child Applications (1)

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US18/373,345 Continuation US20240021370A1 (en) 2021-03-31 2023-09-27 Multilayer ceramic capacitor

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WO2022210627A1 true WO2022210627A1 (ja) 2022-10-06

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US (1) US20240021370A1 (https=)
JP (2) JP7652244B2 (https=)
CN (1) CN116918013A (https=)
WO (1) WO2022210627A1 (https=)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024202203A1 (ja) * 2023-03-30 2024-10-03 太陽誘電株式会社 積層セラミック電子部品、回路基板、および包装体
WO2024204572A1 (ja) * 2023-03-30 2024-10-03 太陽誘電株式会社 セラミック電子部品およびその製造方法
WO2024204743A1 (ja) * 2023-03-30 2024-10-03 太陽誘電株式会社 セラミック電子部品およびその製造方法
WO2024202204A1 (ja) * 2023-03-30 2024-10-03 太陽誘電株式会社 積層セラミック電子部品、回路基板、包装体、および積層セラミック電子部品の製造方法
WO2025004490A1 (ja) * 2023-06-30 2025-01-02 株式会社村田製作所 積層セラミックコンデンサ

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JP2017005019A (ja) * 2015-06-05 2017-01-05 株式会社村田製作所 積層セラミックコンデンサおよび積層セラミックコンデンサの製造方法
JP2018198292A (ja) * 2017-05-25 2018-12-13 株式会社村田製作所 積層セラミックコンデンサ
US20200058442A1 (en) * 2018-08-16 2020-02-20 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic electronic component and method of manufacturing the same

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KR100192563B1 (ko) * 1995-01-12 1999-06-15 무라따 야스따까 모놀리식 세라믹 커패시터
WO2014024538A1 (ja) * 2012-08-07 2014-02-13 株式会社村田製作所 積層セラミックコンデンサおよび積層セラミックコンデンサの製造方法
WO2014148373A1 (ja) * 2013-03-19 2014-09-25 株式会社村田製作所 積層セラミックコンデンサ
TWI530973B (zh) * 2013-08-02 2016-04-21 Murata Manufacturing Co Laminated ceramic capacitor and laminated ceramic capacitor manufacturing method
JP2015084399A (ja) * 2013-10-25 2015-04-30 サムソン エレクトロ−メカニックス カンパニーリミテッド． アレイ型積層セラミック電子部品及びその実装基板
KR102776268B1 (ko) * 2020-11-16 2025-03-07 삼성전기주식회사 내부 전극용 도전성 분말, 전자 부품 및 그 제조 방법
KR102880993B1 (ko) * 2020-11-19 2025-11-04 삼성전기주식회사 적층형 전자 부품 및 그 제조 방법

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JP2017005019A (ja) * 2015-06-05 2017-01-05 株式会社村田製作所 積層セラミックコンデンサおよび積層セラミックコンデンサの製造方法
JP2018198292A (ja) * 2017-05-25 2018-12-13 株式会社村田製作所 積層セラミックコンデンサ
US20200058442A1 (en) * 2018-08-16 2020-02-20 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic electronic component and method of manufacturing the same

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024202203A1 (ja) * 2023-03-30 2024-10-03 太陽誘電株式会社 積層セラミック電子部品、回路基板、および包装体
WO2024204572A1 (ja) * 2023-03-30 2024-10-03 太陽誘電株式会社 セラミック電子部品およびその製造方法
WO2024204743A1 (ja) * 2023-03-30 2024-10-03 太陽誘電株式会社 セラミック電子部品およびその製造方法
WO2024202204A1 (ja) * 2023-03-30 2024-10-03 太陽誘電株式会社 積層セラミック電子部品、回路基板、包装体、および積層セラミック電子部品の製造方法
KR20250162801A (ko) 2023-03-30 2025-11-19 다이요 유덴 가부시키가이샤 적층 세라믹 전자 부품, 회로 기판, 포장체 및 적층 세라믹 전자 부품의 제조 방법
WO2025004490A1 (ja) * 2023-06-30 2025-01-02 株式会社村田製作所 積層セラミックコンデンサ

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CN116918013A (zh) 2023-10-20
JP2025083495A (ja) 2025-05-30
JPWO2022210627A1 (https=) 2022-10-06
JP7652244B2 (ja) 2025-03-27
US20240021370A1 (en) 2024-01-18

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