WO2022209788A1 - Composant électrique et procédé de production d'un composant électrique - Google Patents

Composant électrique et procédé de production d'un composant électrique Download PDF

Info

Publication number
WO2022209788A1
WO2022209788A1 PCT/JP2022/011063 JP2022011063W WO2022209788A1 WO 2022209788 A1 WO2022209788 A1 WO 2022209788A1 JP 2022011063 W JP2022011063 W JP 2022011063W WO 2022209788 A1 WO2022209788 A1 WO 2022209788A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin
base film
circuit member
electrical equipment
electrical component
Prior art date
Application number
PCT/JP2022/011063
Other languages
English (en)
Japanese (ja)
Inventor
宏晃 小嶋
辰雄 平林
Original Assignee
株式会社オートネットワーク技術研究所
住友電装株式会社
住友電気工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社オートネットワーク技術研究所, 住友電装株式会社, 住友電気工業株式会社 filed Critical 株式会社オートネットワーク技術研究所
Publication of WO2022209788A1 publication Critical patent/WO2022209788A1/fr

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern

Definitions

  • the present disclosure relates to an electrical component and a method of manufacturing the electrical component.
  • This application claims priority based on Japanese Patent Application No. 2021-055051 filed in Japan on March 29, 2021, and incorporates all the contents described in the Japanese application.
  • Patent Literature 1 discloses a printed wiring board, which is a circuit member having a wiring pattern formed on an insulating base material.
  • the wiring pattern in Patent Document 1 is formed by printing a conductive ink containing metal nanoparticles on an insulating substrate.
  • Patent Document 2 discloses an electrical component in which a plastic layer is formed on a circuit member.
  • the circuit member of U.S. Pat. No. 6,200,005 comprises a substrate film containing an electrically insulating material and conductive traces printed on the substrate film. Conductive traces correspond to wiring patterns.
  • JP 2018-74055 A Japanese Patent Publication No. 2020-517120
  • An electrical component of the present disclosure includes a circuit member and a resin member integrated with the circuit member.
  • the circuit member includes a base film made of an insulating resin and a wiring pattern provided on the base film.
  • the wiring pattern includes a wiring portion formed on the base film and a plating layer formed on the surface of the wiring portion.
  • the wiring portion includes a plurality of copper particles, a binder made of thermosetting resin, and an antioxidant, and the plating layer is made of copper.
  • a method for manufacturing an electrical component according to the present disclosure includes a step A of fabricating a circuit member including a base film made of an insulating resin and wiring patterns provided on the base film; and a step B of integrating.
  • the step A includes a step A1 of preparing the base film, a step A2 of preparing a conductive paste containing a plurality of copper particles, a binder made of a thermosetting resin, and an antioxidant; A step A3 of printing the conductive paste on the material film in a wiring pattern, a step A4 of forming a wiring portion by hardening the binder by heat treatment, and a step A4 of forming a wiring portion, and plating the surface of the wiring portion with copper. and Step A5 of forming a layer.
  • FIG. 1 is a schematic plan view of an electrical component described in Embodiment 1.
  • FIG. FIG. 2 is a cross-sectional view schematically showing the vertical relationship of each component of the electrical equipment described in Embodiment 1.
  • FIG. FIG. 3 is an enlarged view schematically showing the surface of the wiring portion of the electrical equipment described in Embodiment 1.
  • FIG. 4A and 4B are explanatory diagrams illustrating a part of the manufacturing process of the electrical equipment described in the first embodiment.
  • FIG. 5 is an explanatory diagram illustrating a part of the manufacturing process of the electrical equipment described in the first embodiment.
  • FIG. 6 is a cross-sectional view schematically showing the vertical relationship of each component of the electrical equipment described in Embodiment 2.
  • FIG. FIG. 7 is a cross-sectional view schematically showing the vertical relationship of each component of the electrical equipment described in Embodiment 3.
  • FIG. FIG. 8 is a cross-sectional view schematically showing the vertical relationship of each component of the electrical equipment described in the fourth embodiment.
  • Patent Document 1 describes that silver, gold, copper, or the like can be used as the metal nanoparticles forming the wiring pattern.
  • the metal that can be used for the metal nanoparticles is essentially silver.
  • the copper nanoparticles are generally coated with a polymer material to prevent aggregation and oxidation.
  • a polymer material In order to decompose this coating and sinter the copper nanoparticles together, it is necessary to heat-treat the printed wiring pattern at a high temperature of 200° C. or higher. At this time, there is a problem that oxidation of the copper nanoparticles is likely to be accelerated and a problem that the substrate may be damaged.
  • one object of the present disclosure is to provide an electrical component having a wiring pattern made of copper and a method for manufacturing the same.
  • the electrical equipment of the present disclosure is made of copper and has a wiring pattern with excellent conductivity. Therefore, ion migration is less likely to occur in the electrical component of the present disclosure.
  • the method for manufacturing an electrical component according to the present disclosure can manufacture an electrical component whose wiring pattern is made of copper.
  • An electrical component includes a circuit member and a resin member integrated with the circuit member.
  • the circuit member includes a base film made of an insulating resin and a wiring pattern provided on the base film.
  • the wiring pattern includes a wiring portion formed on the base film and a plating layer formed on the surface of the wiring portion.
  • the wiring portion includes a plurality of copper particles, a binder made of thermosetting resin, and an antioxidant, and the plating layer is made of copper.
  • a plurality of copper particles are integrated with a thermosetting resin binder. Therefore, the contact between the copper particles in the wiring portion is good, and the wiring portion has high conductivity. Moreover, since the wiring portion contains an antioxidant, the copper particles are less likely to be oxidized during and after the manufacturing of the wiring portion. Therefore, the conductivity of the wiring portion is likely to be maintained for a long period of time.
  • the surface of the wiring part is covered with a copper plating layer.
  • the plating layer supplements the conductivity of the wiring portion and improves the conductivity of the wiring pattern.
  • Ion migration is less likely to occur in wiring patterns made of copper. Therefore, the quality of the electrical equipment is likely to be maintained over a long period of time. Also, since copper is cheaper than silver, the manufacturing cost of electrical equipment is low.
  • the electrical component according to the embodiment further comprising an additional member for adding at least one of decorativeness, electromagnetic properties, mechanical properties, and chemical properties to the electrical component, the additional member comprising: It may be integrated with at least one of the circuit member and the resin member.
  • Additional members with decorative properties are, for example, those with colors and patterns.
  • the electromagnetic properties are, for example, electromagnetic shielding properties.
  • Mechanical properties are, for example, impact resistance and cushioning properties.
  • Chemical properties are, for example, translucency, water repellency, chemical resistance, and weather resistance.
  • the base film may be made of a thermoplastic resin.
  • the circuit member is integrated with the resin member as defined in the electrical component manufacturing method described later. At that time, the circuit members are exposed to heat. If the substrate film of the circuit member is made of a thermoplastic resin, the shape of the circuit member can be changed when the resin member is integrated with the circuit member.
  • the base film may have a thickness of 0.025 mm or more and 1 mm or less.
  • the thickness of the base film is 0.025 mm or more, cracks and wrinkles are less likely to occur in the base film when the circuit member and the resin member are integrated. If the thickness of the base film is 1 mm or less, the base film can be easily deformed into a desired shape when integrating the circuit member and the resin member.
  • the heat shrinkage rate of the base film in an air atmosphere at 150° C. for 30 minutes may be 5% or less.
  • the base film has a predetermined heat resistance.
  • Heat resistance in the present disclosure is defined by the thermal shrinkage rate of the base film in a heated atmosphere.
  • the heat-resistant substrate film defined in Mode ⁇ 5> is less likely to be damaged by the heat treatment.
  • each of the plurality of copper particles may be scaly.
  • each copper particle is scaly, the contact area between adjacent copper particles increases. Therefore, the conductivity of the wiring pattern is improved.
  • the plurality of copper particles may have an average particle diameter of 1 ⁇ m or more and 20 ⁇ m or less.
  • the wiring portion of the electrical component of the embodiment is formed on the base film by printing. If the average particle size of the plurality of copper particles is within the above range, the wiring portion can be formed by printing. Printing is for example screen printing, flexographic printing, gravure printing, gravure offset printing, dispenser printing or inkjet printing.
  • the specific surface area of the copper particles will be considerably smaller than the specific surface area of the copper nanoparticles. If the specific surface area of the copper particles is reduced, the copper particles are less likely to be oxidized, and the influence of the oxidation of the copper particles on the electrical conductivity of the wiring portion is reduced.
  • the plating layer may have a thickness of 0.01 ⁇ m or more and 50 ⁇ m or less.
  • the thickness of the plating layer is 0.01 ⁇ m or more, the conductivity of the wiring pattern can be sufficiently secured. If the thickness of the plating layer is 50 ⁇ m or less, the time required for forming the plating layer is short, so the productivity of electrical equipment is improved. Furthermore, it is desirable that the thickness of the plating layer is 1 ⁇ m or more and 10 ⁇ m or less.
  • thermosetting resin is at least one selected from the group consisting of phenol resin, urea resin, melamine resin, epoxy resin, unsaturated polyester resin, polyurethane resin, and silicone resin. May contain seeds.
  • thermosetting resin constituting the binder is one of the thermosetting resins listed above, the adhesion between the wiring portion and the base film is improved. As a result, the wiring portion is less likely to peel off from the substrate.
  • the insulating resin is polycarbonate resin, polystyrene resin, acrylonitrile-butadiene-styrene resin, liquid crystal polymer resin, polytetrafluoroethylene resin, polyethylene naphthalate resin, polyethylene terephthalate resin, nylon. At least one selected from the group consisting of resin, polyphenylene sulfide resin, polyphenylene ether resin, modified polyphenylene ether resin, syndiotactic polystyrene resin, and cycloolefin polymer resin may be included.
  • the insulating resins listed above are thermoplastic resins. If the base film is a thermoplastic resin, the shape of the base film can be greatly changed during the production of electrical equipment.
  • the electrical component according to the embodiment may further include a protective layer covering a portion of the wiring pattern, and the protective layer may include at least one of a coverlay and a solder resist.
  • the protective layer protects the wiring pattern electrically and physically. Coverlays are suitable for protecting bent portions of circuit members. Solder resist is suitable for protecting flat portions of circuit members.
  • a method for manufacturing an electrical component includes a step A of fabricating a circuit member including a base film made of an insulating resin and a wiring pattern provided on the base film; and a step B of integrating the resin member with the member.
  • the step A includes a step A1 of preparing the base film, a step A2 of preparing a conductive paste containing a plurality of copper particles, a binder made of a thermosetting resin, and an antioxidant; A step A3 of printing the conductive paste on the material film in a wiring pattern, a step A4 of forming a wiring portion by hardening the binder by heat treatment, and a step A4 of forming a wiring portion, and plating the surface of the wiring portion with copper. and Step A5 of forming a layer.
  • the electrical component according to the embodiment can be manufactured.
  • the conductive paste which is the material of the wiring portion, contains a thermosetting resin binder.
  • the wiring portion is formed by hardening the binder by heat treatment. At this time, the binder shrinks and the copper particles come into sufficient contact with each other. As a result, the conductivity of the wiring portion is ensured.
  • the temperature of the heat treatment for hardening the binder is lower than the temperature for firing the nanoparticles in Patent Document 1. Therefore, the copper particles are less likely to oxidize and the base film is less likely to be damaged by the heat treatment of the binder. Furthermore, since the conductive paste contains an antioxidant, the copper particles are less likely to be oxidized during heat treatment of the binder.
  • a copper plating layer is formed on the surface of the wiring portion.
  • the plating layer made of copper supplements the conductivity of the wiring portion and improves the conductivity of the wiring pattern.
  • the method for manufacturing the electrical component includes a step B of integrating the circuit member with the resin member.
  • the circuit members are exposed to heat. Since the binder contained in the wiring portion of the circuit member is a thermosetting resin, the wiring portion is less likely to be damaged by the heat in step B. Moreover, since the wiring portion contains an antioxidant, the copper particles contained in the wiring portion are less likely to be oxidized by the heat in step B.
  • the electrical component can be formed into a desired shape if the base film of the circuit member is made of a thermoplastic resin.
  • the shape of the electrical component can be formed in the shape of a vehicle panel that includes the interior lights of the vehicle.
  • Process A in the manufacturing method of the above electrical equipment is an additive method in which a structure is added on the base film.
  • the additive method significantly reduces waste generation compared to the subtractive method.
  • the subtractive method is a method of forming a wiring pattern by removing unnecessary copper foil with chemicals such as etching.
  • a resin member is added to the circuit member.
  • the method for manufacturing an electrical component does not include a step of removing the structure with a chemical solution. Therefore, the above method for manufacturing an electrical component can reduce the environmental load during manufacturing of the electrical component.
  • the electrical equipment 1 of Embodiment 1 shown in FIG. 1 is used as an interior panel of a vehicle.
  • the electrical equipment 1 includes a circuit member 2 and a resin member 3 integrated with the circuit member 2 .
  • the circuit member 2 is an electric circuit including wiring patterns 21 .
  • the resin member 3 constitutes an interior panel.
  • the electrical equipment 1 of this example further includes an additional member 4 , a protective layer 5 and a mounting component 6 .
  • the configuration of the electrical component 1 of this example will be described in detail below.
  • FIG. 2 is a diagram schematically showing the vertical relationship of each component of the electrical component 1 shown in FIG.
  • the circuit member 2 includes a base film 20 and wiring patterns 21 provided on the base film 20 .
  • the base film 20 is a film made of an insulating resin.
  • the insulating resin forming the base film 20 is preferably a thermoplastic resin.
  • the circuit member 2 is integrated with the resin member 3 when the electrical component 1 is manufactured. At that time, the circuit member 2 is exposed to heat. If the substrate film 20 is made of a thermoplastic resin, the shape of the circuit member 2 can be changed when the resin member 3 is integrated with the circuit member 2 .
  • Thermoplastic resins include polycarbonate resin, polystyrene resin, acrylonitrile-butadiene styrene resin, liquid crystal polymer resin, polytetrafluoroethylene resin, polyethylene resin. Phthalate resin, polyethylene terephthalate resin, nylon resin, polyphenylene sulfide resin, polyphenylene ether resin, modified polyphenylene ether resin, syndiotactic polystyrene It contains at least one selected from resins and cycloolefin polymer resins.
  • liquid crystal polymer resins polytetrafluoroethylene resins, polyethylene naphthalate resins, nylon resins, polyphenylene sulfide resins, polyphenylene ether resins, modified polyphenylene ether resins, syndiotactic polystyrene resins, and cycloolefin polymer resins have excellent dielectric properties. ing. Therefore, by forming the base film 20 from these thermoplastic resins, the electrical component 1 suitable for high-speed and high-frequency applications can be obtained. In addition, these thermoplastic resins are difficult to shrink by heat treatment. Therefore, when the shape of the base film 20 is deformed, the base film 20 can be easily deformed into a desired shape.
  • the thickness of the base film 20 is preferably 0.025 mm or more and 1 mm or less, for example. If the thickness of the base film 20 is 0.025 mm or more, when the circuit member 2 and the resin member 3 are integrated, the base film 20 is less likely to crack or wrinkle. If the thickness of the base film 20 is 1 mm or less, the base film 20 can be easily deformed into a desired shape when integrating the circuit member 2 and the resin member 3 .
  • the base film 20 preferably has a predetermined heat resistance.
  • the heat resistance of the base film 20 in this example is defined by the heat shrinkage rate of the base film 20 in an air atmosphere of 150° C. ⁇ 30 minutes of 5% or less.
  • the thermal shrinkage rate of the base film 20 is determined by ⁇ (length of the base film 20 before heating ⁇ length of the base film 20 after heating)/length of the base film 20 before heating ⁇ 100. .
  • a more preferable heat shrinkage rate is 3% or less. If the heat shrinkage rate in the heating atmosphere is 5% or less, it is possible to suppress damage to the base film 20 during manufacturing of the electrical component 1 of the embodiment.
  • both the heat shrinkage of the base film in MD and the heat shrinkage of the base film in TD are preferably 5% or less, more preferably 3% or less. preferable.
  • the wiring pattern 21 includes a wiring portion 211 formed on the base film 20 and a plating layer 212 formed on the surface of the wiring portion 211 .
  • the wiring portion 211 has the same shape as the wiring pattern 21 when the wiring pattern 21 is viewed from above as shown in FIG.
  • FIG. 3 is an enlarged view schematically showing the surface of the wiring portion 211.
  • wiring portion 211 includes a plurality of copper particles 21p and binder 21b. Furthermore, the wiring part 211 contains an antioxidant.
  • the cross-sectional area of the wiring part 211 is appropriately selected so as to satisfy the conductivity required for the wiring pattern 21 .
  • the cross-sectional area of the wiring part 211 is 0.0001 mm 2 or more and 0.5 mm 2 or less.
  • the thickness of the wiring portion 211 is, for example, 10 ⁇ m or more and 50 ⁇ m or less. If the thickness of the wiring portion 211 is 10 ⁇ m or more, the contact between the copper particles 21p contained in the wiring portion 211 is sufficiently ensured. If the thickness of the wiring part 211 is 50 ⁇ m or less, the wiring part 211 can be easily formed by printing.
  • the copper particles 21p of this example are particles of pure copper or a copper alloy.
  • the average particle diameter of the copper particles 21p is preferably 1 ⁇ m or more and 20 ⁇ m or less.
  • the wiring portion 211 of the electrical component 1 of this example is formed on the base film 20 by printing. If the average particle size of the plurality of copper particles 21p is within the above range, the wiring portion 211 can be formed by printing.
  • the lower limit of the average particle size of the copper particles 21p may be 2 ⁇ m, or even 3 ⁇ m.
  • the upper limit of the average particle size of the copper particles 21p may be 18 ⁇ m, or even 15 ⁇ m. Therefore, the average particle size of the copper particles 21p may be 2 ⁇ m or more and 18 ⁇ m or less, and further 3 ⁇ m or more and 15 ⁇ m or less.
  • the average particle size of the copper particles 21p can be obtained by microscopically observing a cross section perpendicular to the thickness direction of the wiring portion 211. First, microscopic images of five or more fields of view are acquired from the cross section of the wiring portion 211 . Each microscopic image is binarized to determine the particle size of all particles in the image.
  • the particle size of the copper particles 21p to be measured is the length of the major axis direction of the copper particles 21p in the cross section. The length in the major axis direction is the same as the length of the long side of the quadrangle circumscribing the copper particles 21p.
  • the average value of all particle sizes is the average particle size of the copper particles 21p.
  • the shape of the copper particles 21p is not particularly limited.
  • the copper particles 21p may be spherical or irregularly shaped.
  • the copper particles 21p of this example are scaly particles.
  • the aspect ratio of the scaly particles that is, the ratio of the length of the scaly particles in the long axis direction to the length in the short axis direction is preferably 2.5 or more and 5.0 or less. If each copper particle 21p is scale-like, it is likely that the copper particles 21p are stacked in the thickness direction of the wiring portion 211 .
  • the copper particles 21p stacked in the thickness direction are likely to come into surface contact with each other, and the contact area between the copper particles 21p increases. As a result, the conductivity of the wiring pattern 21 is improved.
  • the content of the copper particles 21p in the wiring portion 211 is preferably 50% by mass or more and 90% by mass or less. If the content of copper particles 21p is 50% by mass or more, the conductivity of wiring portion 211 is sufficiently ensured. If the content of copper particles 21p is 90% by mass or less, a sufficient amount of binder 21b is arranged in the gaps between the plurality of copper particles 21p. As a result, the plurality of copper particles 21p are strongly integrated. A more preferable content of the copper particles 21p is 60% by mass or more and 85% by mass or less. A more preferable content of the copper particles 21p is 65% by mass or more and 80% by mass or less.
  • the mass ratio of the copper particles 21p in the wiring portion 211 is obtained as follows. First, the microscopic images of five or more fields of view in the cross section orthogonal to the thickness direction of the wiring portion 211 are binarized. The area ratio of the copper particles 21p in each microscope image is obtained. The area ratios in all fields of view are averaged, and the average value is regarded as the volume ratio of the copper particles 21p in the wiring part 211 . By multiplying the volume ratio of the copper particles 21p by the specific gravity of copper and by multiplying the volume ratio of the binder 21b by the specific gravity of the binder 21b, the mass ratio of the copper particles 21p in the wiring part 211 is obtained.
  • the binder 21b is a thermosetting resin that integrates the multiple copper particles 21p.
  • Thermosetting resins include, for example, phenol resins, urea resins, melanin resins, epoxy resins, unsaturated polyester resins, polyurethane resins, and silicone resins. ) is a resin. These thermosetting resins improve the adhesion between the wiring portion 211 and the base film 20 . As a result, the wiring part 211 is difficult to separate from the base film 20 .
  • Phenol resin is particularly preferable as the thermosetting resin that constitutes the binder 21b. Phenolic resin has reducing properties. Therefore, the phenol resin suppresses oxidation of the copper particles 21p. Furthermore, as the phenol resin, a resol type phenol resin is preferable. Resol-type phenolic resins are self-reactive and do not require curing agents.
  • the antioxidant is a chemical substance that suppresses oxidation of the copper particles 21p.
  • the antioxidant may be dispersed in the binder 21b or contained in the copper particles 21p.
  • Antioxidants are, for example, amine antioxidants, phenolic antioxidants, and phenylamine antioxidants.
  • polyol-based solvents such as ethylene glycol and polyethylene glycol having reducing properties may be contained.
  • the plating layer 212 covers the surface of the wiring portion 211 . More specifically, the plating layer 212 covers the portion of the wiring portion 211 excluding the portion in close contact with the base film 20 .
  • the plating layer 212 is composed of copper.
  • the plating layer 212 is formed by electroless plating, electrolytic plating, or the like.
  • the plating layer 212 made of copper supplements the conductivity of the wiring portion 211 and improves the conductivity of the wiring pattern 21 . Therefore, the resistivity of the plating layer 212 is preferably 50 ⁇ cm or less, more preferably 30 ⁇ cm or less.
  • the thickness of the plating layer 212 is preferably 0.01 ⁇ m or more and 50 ⁇ m or less. If the thickness of the plating layer 212 is 0.01 ⁇ m or more, the electrical conductivity of the wiring pattern 21 can be sufficiently secured. If the plating layer 212 is 50 ⁇ m or less, the time required to form the plating layer 212 is short, so the productivity of the electrical component 1 is improved.
  • the lower thickness limit may be 1 ⁇ m, 1.5 ⁇ m, or 2 ⁇ m.
  • the upper thickness limit may be 10 ⁇ m, 7.5 ⁇ m, or 5 ⁇ m. Therefore, the thickness of the plating layer 212 may be 1 ⁇ m or more and 10 ⁇ m or less, 1.5 ⁇ m or more and 7.5 ⁇ m or less, or 2 ⁇ m or more and 5 ⁇ m or less.
  • Protective layer 5 includes at least one of a coverlay and a solder resist.
  • the wiring pattern 21 is electrically and physically protected by the protective layer 5 .
  • a coverlay is an insulating film with an adhesive layer. The coverlay is suitable for protecting the wiring pattern 21 provided at the bent portion of the circuit member 2 .
  • the solder resist is obtained by curing the undiluted solution applied on the circuit member 2 . Solder resist is suitable for protecting the wiring pattern 21 provided on the flat portion of the circuit member 2 .
  • the mounted component 6 is an electrical component that is attached to the circuit member 2 later.
  • Mounted components 6 are, for example, LED lights, IC chips, and capacitors.
  • the resin member 3 integrated with the circuit member 2 is a member that supports the circuit member 2 . Moreover, the resin member 3 is a member that plays a role of maintaining the shape of the electrical component 1 .
  • the resin member 3 may be block-shaped or panel-shaped.
  • the resin member 3 may also serve as an exterior panel or an interior panel of the machine on which the electrical component 1 is mounted. For example, as shown in FIG. 1, there is a form in which the circuit member 2 constitutes the wiring of the interior light, and the resin member 3 has the shape of the interior panel in the vicinity of the interior light.
  • the resin member 3 may be a cover for closing an opening provided in an instrument panel or an armrest, or an operation panel provided with switches for a power window or a display.
  • the resin member 3 is made of insulating resin with excellent strength and durability.
  • acrylonitrile-butadiene-styrene resin, polypropylene resin, polystyrene resin, polycarbonate resin, vinyl chloride resin, acrylic resin, or the like is suitable.
  • the resin member 3 is integrated with the first surface 20A or the second surface 20B of the circuit member 2, as shown in FIG. 20 A of 1st surfaces are surfaces in which the wiring pattern 21 in the circuit member 2 is provided.
  • the second surface 20B is the surface opposite to the first surface 20A.
  • the resin member 3 of this example is integrated with the second surface 20B of the circuit member 2 .
  • At least one of a primer and an adhesive may exist between the resin member 3 and the circuit member 2 .
  • the primer and adhesive strengthen the bonding between the resin member 3 and the circuit member 2 .
  • the primer is mainly composed of, for example, polyurethane resin or acrylic resin.
  • the adhesive is, for example, an acrylic adhesive.
  • the additional member 4 is a member that adds characteristics to the electrical component 1 .
  • the properties are, for example, at least one of decorative properties, electromagnetic properties, mechanical properties, and chemical properties.
  • the additional member 4 having decorativeness is, for example, colored or patterned.
  • the electromagnetic properties are, for example, electromagnetic shielding properties.
  • Mechanical properties are, for example, impact resistance and cushioning properties.
  • Chemical properties are translucency, water repellency, chemical resistance, and weather resistance.
  • the additional member 4 may be composed of an organic material such as an insulating resin, metal, or an inorganic material such as ceramics. Of course, the additional member 4 may be a composite of insulating resin and metal. The material of the additional member 4 is appropriately selected according to the properties required for the additional member 4 .
  • the additional member 4 is integrated with at least one of the circuit member 2 and the resin member 3 .
  • the additional member 4 of this example is integrated with the resin member 3 .
  • ⁇ Summary ⁇ In the wiring portion 211 of the electrical component 1 of this example, as shown in FIG. 3, a plurality of copper particles 21p are integrated with a thermosetting resin binder 21b. Therefore, the contact between the copper particles 21p in the wiring portion 211 is good, and the conductivity of the wiring portion 211 is high. Moreover, since the wiring portion 211 contains an antioxidant, the copper particles 21p are less likely to be oxidized during and after the manufacturing of the wiring portion 211 . Therefore, the wiring portion 211 has excellent conductivity.
  • the surface of the wiring portion 211 is covered with a copper plating layer 212, as shown in FIG. Therefore, the copper particles 21p (FIG. 3) in the wiring portion 211 are less likely to be oxidized.
  • the plating layer 212 secures the conductivity of the wiring pattern 21 together with the wiring portion 211 . Therefore, the conductivity of the wiring portion 211 is likely to be maintained for a long period of time.
  • Ion migration is less likely to occur in the wiring pattern 21 made of copper. Therefore, the quality of the electrical equipment 1 is likely to be maintained over a long period of time. Moreover, since copper is cheaper than silver, the manufacturing cost of the electrical equipment 1 is reduced.
  • the electrical component 1 of this example includes a resin member 3.
  • the resin member 3 maintains the shape of the electrical component 1 and suppresses damage to the circuit member 2 .
  • the electrical component 1 of this example includes an additional member 4.
  • the additional member 4 imparts decorativeness and functionality to the electrical equipment 1 . Therefore, the application of the electrical equipment 1 is expanded.
  • the electrical equipment 1 of Embodiment 1 is produced, for example, by the following steps. - Process A for producing the circuit member 2 - Step B of integrating the resin member 3 with the circuit member 2 - Step C of integrating the additional member 4 with at least one of the circuit member 2 or the resin member 3
  • Process B or Process C may be performed first.
  • Process B and process C may be performed simultaneously.
  • the step C is omitted.
  • Process A includes the following processes A1 to A6. - Step A1 of preparing the base film 20 Step A2 of preparing a conductive paste containing a plurality of copper particles 21p, a binder 21b made of a thermosetting resin, and an antioxidant - Step A3 of printing a conductive paste in a wiring pattern on the base film 20 - Step A4 of forming the wiring portion 211 by hardening the binder 21b by heat treatment - Step A5 of forming the plating layer 212 by plating the surface of the wiring portion 211 with copper - Step A6 of forming a protective layer 5 covering a part of the wiring pattern 21
  • the base film 20 prepared in step A1 is the base film 20 described in the electrical component 1 item.
  • a surface treatment is, for example, plasma irradiation, corona irradiation, or UV irradiation applied to the surface of the base film 20 .
  • the surface treatment may be a primer treatment applied to the surface of the base film 20 .
  • primers include polyurethane primers and acrylic primers.
  • the conductive paste prepared in step A2 contains the copper particles 21p, the binder 21b, and the antioxidant described in the item of the electrical component 1.
  • the conductive paste may contain a volatile solvent. The solvent adjusts the viscosity of the conductive paste.
  • a conductive paste is printed on the base film 20.
  • Printing is for example screen printing, flexographic printing, gravure printing, gravure offset printing, dispenser printing or inkjet printing. If the average particle size of the copper particles 21p contained in the conductive paste is 1 ⁇ m or more and 20 ⁇ m or less, the tip of the nozzle used in inkjet printing and dispenser printing is less likely to be clogged with the copper particles 21p. Therefore, the conductive paste can be printed without problems even by inkjet printing and dispenser printing.
  • step A4 the conductive paste printed in the form of a wiring pattern is heat-treated.
  • the wiring part 211 is formed by hardening the binder 21b of the conductive paste by this heat treatment.
  • the base film 20 is also exposed to heat together with the conductive paste. Therefore, the heat treatment temperature is preferably 150° C. or lower. This temperature is lower than the temperature for firing the nanoparticles in Patent Document 1.
  • the firing temperature is, for example, 200° C. or higher. If the heat treatment temperature is 150° C. or less, the copper particles 21p are less likely to be oxidized and the base film 20 is less likely to be damaged.
  • a copper plating layer 212 is formed on the surface of the wiring portion 211.
  • Plating may be electroless plating or electrolytic plating.
  • a protective layer 5 containing at least one of a coverlay and a solder resist is formed.
  • a method for forming a coverlay and a method for forming a solder resist are known.
  • the surface of the circuit member 2 is screen-printed with a UV-curable solder resist.
  • the protective layer 5 is formed by irradiating the solder resist with UV.
  • Process B is performed, for example, by insert molding or vacuum pressure molding. Process B can also be implemented by adhesion or the like.
  • the process B carried out by insert molding will be explained based on FIG. In FIG. 4, the circuit member 2 and the additional member 4 are arranged inside the mold 8 . At this time, a gap is formed between the circuit member 2 and the additional member 4 . A resin, which is a raw material of the resin member 3, is injected into this gap. As a result, the circuit member 2 and the additional member 4 are integrated by the resin member 3 . In this example, process B and process C are performed simultaneously.
  • a circuit member 2 on which mounted components 6 are mounted is used.
  • the mounting component 6 may be attached to the circuit member 2 after the circuit member 2 and the additional member 4 are integrated with the resin member 3 .
  • a mold 9 for vacuum and pressure molding includes a chamber 90 and a movable mold 91 .
  • Circuit member 2 is supported within chamber 90 .
  • An upper space and a lower space are separated with the circuit member 2 interposed therebetween.
  • the resin member 3 along the shape of the movable mold 91 is arranged in the movable mold 91 .
  • the circuit member 2 is heated by a heater or the like, and the space between the circuit member 2 and the movable molding die 91 is evacuated. Since the inside of the chamber 90 is partitioned by the circuit member 2, the space above the circuit member 2 is not evacuated.
  • the movable molding die 91 is moved upward to integrate the circuit member 2 and the resin member 3 together. At this time, the circuit member 2 deforms into a shape along the shape of the resin member 3 .
  • Process C is performed by insert molding, vacuum pressure molding, or the like. Process C can also be implemented by adhesion or the like. Step C can be carried out independently of Step B, can be carried out after Step B, or can be carried out before Step B.
  • Embodiment 2 an electrical component 1 in which the positions of the resin member 3 and the additional member 4 with respect to the circuit member 2 are different from those in Embodiment 1 will be described with reference to FIG.
  • the wiring portion and the plated layer are collectively referred to as a wiring pattern 21, and illustration of the protective layer is also omitted. This point also applies to FIGS. 7 and 8, which will be described later.
  • the additional member 4 is integrated with the first surface 20A of the circuit member 2 .
  • the resin member 3 is integrated with the second surface 20B of the circuit member 2 .
  • the additional member 4 is made of a translucent material and the mounting component 6 is an LED light, lighting of the LED light can be confirmed from the outside of the additional member 4 .
  • the electrical component 1 of this example is produced by, for example, insert-molding the resin member 3 on the second surface 20B of the circuit member 2 and then insert-molding the additional member 4 on the first surface 20A of the circuit member 2 .
  • the first surface 20A is covered with the additional member 4, so the protective layer covering the wiring pattern 21 may be omitted.
  • the resin member 3 may be integrated with the first surface 20A and the additional member 4 may be integrated with the second surface 20B.
  • Embodiment 3 an electrical component 1 having an arrangement different from that in Embodiments 1 and 2 will be described with reference to FIG.
  • the additional member 4 and the resin member 3 are integrated in order from the second surface 20B of the circuit member 2 .
  • the electrical component 1 of this example is manufactured by insert-molding the additional member 4 between the second surface 20B of the circuit member 2 and the plate-like resin member 3, for example.
  • Embodiment 4 an electrical component 1 having an arrangement different from that in Embodiments 1 to 3 will be described with reference to FIG.
  • the resin member 3 and the additional member 4 are integrated in order from the first surface 20A of the circuit member 2 .
  • the electrical component 1 of this example is manufactured by insert-molding the resin member 3 between the first surface 20A of the circuit member 2 and the plate-shaped additional member 4, for example.
  • the first surface 20A is covered with the resin member 3 and the additional member 4, so the protective layer covering the wiring pattern 21 may be omitted.
  • circuit member 20 base film 21 wiring pattern 211 wiring portion 212 plating layer 20A first surface 20B second surface 21b binder 21p copper particles 3 resin member 4 additional member 5 protective layer 6 mounting component 8 gold mold 9 mold 90 chamber, 91 movable mold

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

L'invention concerne un composant électrique qui est pourvu d'un élément de circuit et d'un élément en résine qui est intégré à l'élément de circuit, l'élément de circuit étant pourvu d'un film de matériau de base qui est configuré à partir d'une résine isolante, et d'un motif de câblage qui est disposé sur le film de matériau de base ; le motif de câblage est pourvu d'une partie de câblage qui est formée sur le film de matériau de base, et d'une couche de placage qui est formée sur la surface de la partie de câblage ; la partie de câblage contient une pluralité de particules de cuivre, un liant qui est configuré à partir d'une résine thermodurcissable, et un antioxydant ; et la couche de placage est constituée de cuivre.
PCT/JP2022/011063 2021-03-29 2022-03-11 Composant électrique et procédé de production d'un composant électrique WO2022209788A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021055051A JP2022152324A (ja) 2021-03-29 2021-03-29 電装品、及び電装品の製造方法
JP2021-055051 2021-03-29

Publications (1)

Publication Number Publication Date
WO2022209788A1 true WO2022209788A1 (fr) 2022-10-06

Family

ID=83456212

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2022/011063 WO2022209788A1 (fr) 2021-03-29 2022-03-11 Composant électrique et procédé de production d'un composant électrique

Country Status (2)

Country Link
JP (1) JP2022152324A (fr)
WO (1) WO2022209788A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62229601A (ja) * 1986-03-28 1987-10-08 古河電気工業株式会社 樹脂硬化型導電性ペ−ストおよび導電性回路板の製造方法
JPH07142819A (ja) * 1993-11-12 1995-06-02 Dainippon Printing Co Ltd 一体型プリント配線板成形体
WO2016013473A1 (fr) * 2014-07-24 2016-01-28 学校法人福岡大学 Carte de circuit imprimé et son procédé de fabrication
JP2019189680A (ja) * 2018-04-19 2019-10-31 東洋インキＳｃホールディングス株式会社 成形フィルム用導電性組成物、成形フィルム、成形体およびその製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62229601A (ja) * 1986-03-28 1987-10-08 古河電気工業株式会社 樹脂硬化型導電性ペ−ストおよび導電性回路板の製造方法
JPH07142819A (ja) * 1993-11-12 1995-06-02 Dainippon Printing Co Ltd 一体型プリント配線板成形体
WO2016013473A1 (fr) * 2014-07-24 2016-01-28 学校法人福岡大学 Carte de circuit imprimé et son procédé de fabrication
JP2019189680A (ja) * 2018-04-19 2019-10-31 東洋インキＳｃホールディングス株式会社 成形フィルム用導電性組成物、成形フィルム、成形体およびその製造方法

Also Published As

Publication number Publication date
JP2022152324A (ja) 2022-10-12

Similar Documents

Publication Publication Date Title
US5220488A (en) Injection molded printed circuits
CN106574135B (zh) 分子油墨
US20090191358A1 (en) Method for Generation of Metal Surface Structures and Apparatus Therefor
KR102282488B1 (ko) 애플리케이션 특정 전자기기 패키징 시스템, 방법 및 디바이스
WO1987001557A1 (fr) Fabrication de circuits electriques
KR101693974B1 (ko) 전도성 구리 잉크 및 광소결을 이용한 다층인쇄 회로기판의 제조방법 및 이로부터 제조된 다층인쇄 회로기판
KR20140088169A (ko) 전도성 패턴 형성 방법
CN105870026B (zh) 载体、其制造方法及使用载体制造无芯封装基板的方法
JPWO2019017363A1 (ja) 導電性パターン領域を有する構造体及びその製造方法、積層体及びその製造方法、並びに、銅配線
WO2016063907A1 (fr) Carte de circuit imprimé du type film et son procédé de production
EP1531654B1 (fr) Plaque à circuit de forme tridimensionelle, composant et leur procédé de fabrication
US20120073863A1 (en) Anodized heat-radiating substrate and method of manufacturing the same
KR20190098959A (ko) 인쇄 전자
WO2022209788A1 (fr) Composant électrique et procédé de production d'un composant électrique
CN102469691A (zh) 印刷电路板及其制造方法
CN104883865A (zh) 一种高效能低成本电磁屏蔽膜及其制造方法
CN110708940A (zh) 电磁波屏蔽膜及其制造方法、以及带有电磁波屏蔽膜的印刷线路板
JP7386844B2 (ja) オーバーモールドされたプリント電子部品及びその製造方法
EP0424796A2 (fr) Circuit imprimé fabriqué par moulage par injection
JP6885413B2 (ja) 導電パターン基板の製造方法
CN103313504A (zh) 一种无膜柔性印刷电路板及其制备方法
JP2016086013A (ja) フィルム状プリント回路板及びその製造方法
WO2023145577A1 (fr) Composant électrique et procédé de fabrication de composant électrique
KR101859979B1 (ko) 광 소결용 잉크 조성물을 이용한 3차원 배선기판 및 그의 제조 장치
JP2008192789A (ja) 成形加工用回路基板、および、これを成形加工して得られる立体回路基板

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 22780009

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 22780009

Country of ref document: EP

Kind code of ref document: A1