WO2022209788A1 - Electric component and method for producing electric component - Google Patents

Abstract

An electric component which is provided with a circuit member and a resin member that is integrated with the circuit member, wherein: the circuit member is provided with a base material film that is configured from an insulating resin, and a wiring pattern that is provided on the base material film; the wiring pattern is provided with a wiring part that is formed on the base material film, and a plating layer that is formed on the surface of the wiring part; the wiring part contains a plurality of copper particles, a binder that is configured from a thermosetting resin, and an antioxidant; and the plating layer is configured from copper.

Description

Electrical equipment and method for manufacturing electrical equipment

The present disclosure relates to an electrical component and a method of manufacturing the electrical component.
This application claims priority based on Japanese Patent Application No. 2021-055051 filed in Japan on March 29, 2021, and incorporates all the contents described in the Japanese application.

A circuit member is known that includes a base material made of an insulating resin and a wiring pattern provided on the base material. For example, Patent Literature 1 discloses a printed wiring board, which is a circuit member having a wiring pattern formed on an insulating base material. The wiring pattern in Patent Document 1 is formed by printing a conductive ink containing metal nanoparticles on an insulating substrate.

Patent Document 2 discloses an electrical component in which a plastic layer is formed on a circuit member. The circuit member of U.S. Pat. No. 6,200,005 comprises a substrate film containing an electrically insulating material and conductive traces printed on the substrate film. Conductive traces correspond to wiring patterns.

JP 2018-74055 A Japanese Patent Publication No. 2020-517120

An electrical component of the present disclosure includes a circuit member and a resin member integrated with the circuit member. The circuit member includes a base film made of an insulating resin and a wiring pattern provided on the base film. The wiring pattern includes a wiring portion formed on the base film and a plating layer formed on the surface of the wiring portion. The wiring portion includes a plurality of copper particles, a binder made of thermosetting resin, and an antioxidant, and the plating layer is made of copper.

A method for manufacturing an electrical component according to the present disclosure includes a step A of fabricating a circuit member including a base film made of an insulating resin and wiring patterns provided on the base film; and a step B of integrating. The step A includes a step A1 of preparing the base film, a step A2 of preparing a conductive paste containing a plurality of copper particles, a binder made of a thermosetting resin, and an antioxidant; A step A3 of printing the conductive paste on the material film in a wiring pattern, a step A4 of forming a wiring portion by hardening the binder by heat treatment, and a step A4 of forming a wiring portion, and plating the surface of the wiring portion with copper. and Step A5 of forming a layer.

FIG. 1 is a schematic plan view of an electrical component described in Embodiment 1. FIG. FIG. 2 is a cross-sectional view schematically showing the vertical relationship of each component of the electrical equipment described in Embodiment 1. FIG. FIG. 3 is an enlarged view schematically showing the surface of the wiring portion of the electrical equipment described in Embodiment 1. FIG. 4A and 4B are explanatory diagrams illustrating a part of the manufacturing process of the electrical equipment described in the first embodiment. FIG. 5 is an explanatory diagram illustrating a part of the manufacturing process of the electrical equipment described in the first embodiment. FIG. 6 is a cross-sectional view schematically showing the vertical relationship of each component of the electrical equipment described in Embodiment 2. FIG. FIG. 7 is a cross-sectional view schematically showing the vertical relationship of each component of the electrical equipment described in Embodiment 3. FIG. FIG. 8 is a cross-sectional view schematically showing the vertical relationship of each component of the electrical equipment described in the fourth embodiment.

[Problems to be Solved by the Present Disclosure]
Patent Document 1 describes that silver, gold, copper, or the like can be used as the metal nanoparticles forming the wiring pattern. However, as described in an embodiment of US Pat. No. 6,200,000, the metal that can be used for the metal nanoparticles is essentially silver.

There is a problem that ion migration is likely to occur in circuit members with wiring patterns made of silver. If ion migration occurs in the circuit member, the function of the circuit member may be impaired. Another problem is that circuit members having wiring patterns made of silver are expensive. Therefore, there is a need to configure wiring patterns mainly of copper. Copper is low cost and less likely to cause ion migration. However, copper has a problem that it is easily oxidized during baking, and as a result, the conductivity of the wiring pattern is easily lowered.

　When using copper nanoparticles to print wiring patterns, the copper nanoparticles are generally coated with a polymer material to prevent aggregation and oxidation. In order to decompose this coating and sinter the copper nanoparticles together, it is necessary to heat-treat the printed wiring pattern at a high temperature of 200° C. or higher. At this time, there is a problem that oxidation of the copper nanoparticles is likely to be accelerated and a problem that the substrate may be damaged.

In view of the above circumstances, one object of the present disclosure is to provide an electrical component having a wiring pattern made of copper and a method for manufacturing the same.

[Effect of the present disclosure]
The electrical equipment of the present disclosure is made of copper and has a wiring pattern with excellent conductivity. Therefore, ion migration is less likely to occur in the electrical component of the present disclosure.

The method for manufacturing an electrical component according to the present disclosure can manufacture an electrical component whose wiring pattern is made of copper.

[Description of Embodiments of the Present Disclosure]
First, the contents of the embodiments of the present disclosure will be listed and described.

<1> An electrical component according to an embodiment includes a circuit member and a resin member integrated with the circuit member. The circuit member includes a base film made of an insulating resin and a wiring pattern provided on the base film. The wiring pattern includes a wiring portion formed on the base film and a plating layer formed on the surface of the wiring portion. The wiring portion includes a plurality of copper particles, a binder made of thermosetting resin, and an antioxidant, and the plating layer is made of copper.

In the wiring portion of the electrical component according to the embodiment, a plurality of copper particles are integrated with a thermosetting resin binder. Therefore, the contact between the copper particles in the wiring portion is good, and the wiring portion has high conductivity. Moreover, since the wiring portion contains an antioxidant, the copper particles are less likely to be oxidized during and after the manufacturing of the wiring portion. Therefore, the conductivity of the wiring portion is likely to be maintained for a long period of time.

The surface of the wiring part is covered with a copper plating layer. The plating layer supplements the conductivity of the wiring portion and improves the conductivity of the wiring pattern.

Ion migration is less likely to occur in wiring patterns made of copper. Therefore, the quality of the electrical equipment is likely to be maintained over a long period of time. Also, since copper is cheaper than silver, the manufacturing cost of electrical equipment is low.

<2> The electrical component according to the embodiment, further comprising an additional member for adding at least one of decorativeness, electromagnetic properties, mechanical properties, and chemical properties to the electrical component, the additional member comprising: It may be integrated with at least one of the circuit member and the resin member.

Additional members with decorative properties are, for example, those with colors and patterns. The electromagnetic properties are, for example, electromagnetic shielding properties. Mechanical properties are, for example, impact resistance and cushioning properties. Chemical properties are, for example, translucency, water repellency, chemical resistance, and weather resistance. By providing the electrical equipment with the additional member, the characteristics of the additional member, such as decorativeness and functionality, are imparted to the electrical equipment. Therefore, the application of electrical equipment is expanded.

<3> In the electrical component according to the embodiment, the base film may be made of a thermoplastic resin.

The circuit member is integrated with the resin member as defined in the electrical component manufacturing method described later. At that time, the circuit members are exposed to heat. If the substrate film of the circuit member is made of a thermoplastic resin, the shape of the circuit member can be changed when the resin member is integrated with the circuit member.

<4> In the electrical component according to the embodiment, the base film may have a thickness of 0.025 mm or more and 1 mm or less.

If the thickness of the base film is 0.025 mm or more, cracks and wrinkles are less likely to occur in the base film when the circuit member and the resin member are integrated. If the thickness of the base film is 1 mm or less, the base film can be easily deformed into a desired shape when integrating the circuit member and the resin member.

<5> In the electrical component according to the embodiment, the heat shrinkage rate of the base film in an air atmosphere at 150° C. for 30 minutes may be 5% or less.

As stipulated in the electrical component manufacturing method described later, circuit members are exposed to heat multiple times. For example, heat is applied to the circuit member by heat treatment for hardening the binder. Therefore, it is preferable that the base film has a predetermined heat resistance. Heat resistance in the present disclosure is defined by the thermal shrinkage rate of the base film in a heated atmosphere. The heat-resistant substrate film defined in Mode <5> is less likely to be damaged by the heat treatment. When the base film is a directional film, the heat shrinkage of the base film in MD (machine direction) and the heat shrinkage of the base film in TD (transverse direction) are both preferably 5% or less.

<6> In the electrical component according to the embodiment, each of the plurality of copper particles may be scaly.

If each copper particle is scaly, the contact area between adjacent copper particles increases. Therefore, the conductivity of the wiring pattern is improved.

<7> In the electrical component according to the embodiment, the plurality of copper particles may have an average particle diameter of 1 μm or more and 20 μm or less.

As stipulated in the electrical component manufacturing method described later, the wiring portion of the electrical component of the embodiment is formed on the base film by printing. If the average particle size of the plurality of copper particles is within the above range, the wiring portion can be formed by printing. Printing is for example screen printing, flexographic printing, gravure printing, gravure offset printing, dispenser printing or inkjet printing.

If the average particle size of the plurality of copper particles is within the above range, the specific surface area of the copper particles will be considerably smaller than the specific surface area of the copper nanoparticles. If the specific surface area of the copper particles is reduced, the copper particles are less likely to be oxidized, and the influence of the oxidation of the copper particles on the electrical conductivity of the wiring portion is reduced.

<8> In the electrical equipment according to the embodiment, the plating layer may have a thickness of 0.01 μm or more and 50 μm or less.

If the thickness of the plating layer is 0.01 μm or more, the conductivity of the wiring pattern can be sufficiently secured. If the thickness of the plating layer is 50 μm or less, the time required for forming the plating layer is short, so the productivity of electrical equipment is improved. Furthermore, it is desirable that the thickness of the plating layer is 1 μm or more and 10 μm or less.

<9> In the electrical component according to the embodiment, the thermosetting resin is at least one selected from the group consisting of phenol resin, urea resin, melamine resin, epoxy resin, unsaturated polyester resin, polyurethane resin, and silicone resin. May contain seeds.

If the thermosetting resin constituting the binder is one of the thermosetting resins listed above, the adhesion between the wiring portion and the base film is improved. As a result, the wiring portion is less likely to peel off from the substrate.

<10> In the electrical equipment according to the embodiment, the insulating resin is polycarbonate resin, polystyrene resin, acrylonitrile-butadiene-styrene resin, liquid crystal polymer resin, polytetrafluoroethylene resin, polyethylene naphthalate resin, polyethylene terephthalate resin, nylon. At least one selected from the group consisting of resin, polyphenylene sulfide resin, polyphenylene ether resin, modified polyphenylene ether resin, syndiotactic polystyrene resin, and cycloolefin polymer resin may be included.

The insulating resins listed above are thermoplastic resins. If the base film is a thermoplastic resin, the shape of the base film can be greatly changed during the production of electrical equipment.

<11> The electrical component according to the embodiment may further include a protective layer covering a portion of the wiring pattern, and the protective layer may include at least one of a coverlay and a solder resist.

The protective layer protects the wiring pattern electrically and physically. Coverlays are suitable for protecting bent portions of circuit members. Solder resist is suitable for protecting flat portions of circuit members.

<12> A method for manufacturing an electrical component according to an embodiment includes a step A of fabricating a circuit member including a base film made of an insulating resin and a wiring pattern provided on the base film; and a step B of integrating the resin member with the member. The step A includes a step A1 of preparing the base film, a step A2 of preparing a conductive paste containing a plurality of copper particles, a binder made of a thermosetting resin, and an antioxidant; A step A3 of printing the conductive paste on the material film in a wiring pattern, a step A4 of forming a wiring portion by hardening the binder by heat treatment, and a step A4 of forming a wiring portion, and plating the surface of the wiring portion with copper. and Step A5 of forming a layer.

According to the method for manufacturing an electrical component, the electrical component according to the embodiment can be manufactured.
In the method for manufacturing an electrical component, the conductive paste, which is the material of the wiring portion, contains a thermosetting resin binder. The wiring portion is formed by hardening the binder by heat treatment. At this time, the binder shrinks and the copper particles come into sufficient contact with each other. As a result, the conductivity of the wiring portion is ensured.

Here, the temperature of the heat treatment for hardening the binder is lower than the temperature for firing the nanoparticles in Patent Document 1. Therefore, the copper particles are less likely to oxidize and the base film is less likely to be damaged by the heat treatment of the binder. Furthermore, since the conductive paste contains an antioxidant, the copper particles are less likely to be oxidized during heat treatment of the binder.

In the method for manufacturing the electrical component, a copper plating layer is formed on the surface of the wiring portion. The plating layer made of copper supplements the conductivity of the wiring portion and improves the conductivity of the wiring pattern.

The method for manufacturing the electrical component includes a step B of integrating the circuit member with the resin member. In this step B, the circuit members are exposed to heat. Since the binder contained in the wiring portion of the circuit member is a thermosetting resin, the wiring portion is less likely to be damaged by the heat in step B. Moreover, since the wiring portion contains an antioxidant, the copper particles contained in the wiring portion are less likely to be oxidized by the heat in step B.

In the process B of the manufacturing method for the electrical component, the electrical component can be formed into a desired shape if the base film of the circuit member is made of a thermoplastic resin. For example, the shape of the electrical component can be formed in the shape of a vehicle panel that includes the interior lights of the vehicle.

　Process A in the manufacturing method of the above electrical equipment is an additive method in which a structure is added on the base film. The additive method significantly reduces waste generation compared to the subtractive method. The subtractive method is a method of forming a wiring pattern by removing unnecessary copper foil with chemicals such as etching. Also in the process B, a resin member is added to the circuit member. In other words, the method for manufacturing an electrical component does not include a step of removing the structure with a chemical solution. Therefore, the above method for manufacturing an electrical component can reduce the environmental load during manufacturing of the electrical component.

[Details of the embodiment of the present disclosure]
Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings as appropriate. The same reference numerals in the drawings indicate the same names.

<Embodiment 1>
The electrical equipment 1 of Embodiment 1 shown in FIG. 1 is used as an interior panel of a vehicle. The electrical equipment 1 includes a circuit member 2 and a resin member 3 integrated with the circuit member 2 . The circuit member 2 is an electric circuit including wiring patterns 21 . The resin member 3 constitutes an interior panel. The electrical equipment 1 of this example further includes an additional member 4 , a protective layer 5 and a mounting component 6 . The configuration of the electrical component 1 of this example will be described in detail below.

≪Circuit material≫
In describing the circuit member 2, FIG. 2 is mainly referred to. FIG. 2 is a diagram schematically showing the vertical relationship of each component of the electrical component 1 shown in FIG. As shown in FIG. 2 , the circuit member 2 includes a base film 20 and wiring patterns 21 provided on the base film 20 .

(Base film)
The base film 20 is a film made of an insulating resin. The insulating resin forming the base film 20 is preferably a thermoplastic resin. As will be described later, the circuit member 2 is integrated with the resin member 3 when the electrical component 1 is manufactured. At that time, the circuit member 2 is exposed to heat. If the substrate film 20 is made of a thermoplastic resin, the shape of the circuit member 2 can be changed when the resin member 3 is integrated with the circuit member 2 .

Thermoplastic resins include polycarbonate resin, polystyrene resin, acrylonitrile-butadiene styrene resin, liquid crystal polymer resin, polytetrafluoroethylene resin, polyethylene resin. Phthalate resin, polyethylene terephthalate resin, nylon resin, polyphenylene sulfide resin, polyphenylene ether resin, modified polyphenylene ether resin, syndiotactic polystyrene It contains at least one selected from resins and cycloolefin polymer resins.

In particular, liquid crystal polymer resins, polytetrafluoroethylene resins, polyethylene naphthalate resins, nylon resins, polyphenylene sulfide resins, polyphenylene ether resins, modified polyphenylene ether resins, syndiotactic polystyrene resins, and cycloolefin polymer resins have excellent dielectric properties. ing. Therefore, by forming the base film 20 from these thermoplastic resins, the electrical component 1 suitable for high-speed and high-frequency applications can be obtained. In addition, these thermoplastic resins are difficult to shrink by heat treatment. Therefore, when the shape of the base film 20 is deformed, the base film 20 can be easily deformed into a desired shape.

The thickness of the base film 20 is preferably 0.025 mm or more and 1 mm or less, for example. If the thickness of the base film 20 is 0.025 mm or more, when the circuit member 2 and the resin member 3 are integrated, the base film 20 is less likely to crack or wrinkle. If the thickness of the base film 20 is 1 mm or less, the base film 20 can be easily deformed into a desired shape when integrating the circuit member 2 and the resin member 3 .

The base film 20 preferably has a predetermined heat resistance. The heat resistance of the base film 20 in this example is defined by the heat shrinkage rate of the base film 20 in an air atmosphere of 150° C.×30 minutes of 5% or less. The thermal shrinkage rate of the base film 20 is determined by {(length of the base film 20 before heating−length of the base film 20 after heating)/length of the base film 20 before heating}×100. . A more preferable heat shrinkage rate is 3% or less. If the heat shrinkage rate in the heating atmosphere is 5% or less, it is possible to suppress damage to the base film 20 during manufacturing of the electrical component 1 of the embodiment. When the base film 20 is a directional film, both the heat shrinkage of the base film in MD and the heat shrinkage of the base film in TD are preferably 5% or less, more preferably 3% or less. preferable.

(wiring pattern)
The wiring pattern 21 includes a wiring portion 211 formed on the base film 20 and a plating layer 212 formed on the surface of the wiring portion 211 . The wiring portion 211 has the same shape as the wiring pattern 21 when the wiring pattern 21 is viewed from above as shown in FIG.

FIG. 3 is an enlarged view schematically showing the surface of the wiring portion 211. As shown in FIG. As shown in FIG. 3, wiring portion 211 includes a plurality of copper particles 21p and binder 21b. Furthermore, the wiring part 211 contains an antioxidant. The cross-sectional area of the wiring part 211 is appropriately selected so as to satisfy the conductivity required for the wiring pattern 21 . For example, the cross-sectional area of the wiring part 211 is 0.0001 mm ² or more and 0.5 mm ² or less. The thickness of the wiring portion 211 is, for example, 10 μm or more and 50 μm or less. If the thickness of the wiring portion 211 is 10 μm or more, the contact between the copper particles 21p contained in the wiring portion 211 is sufficiently ensured. If the thickness of the wiring part 211 is 50 μm or less, the wiring part 211 can be easily formed by printing.

The copper particles 21p of this example are particles of pure copper or a copper alloy. The average particle diameter of the copper particles 21p is preferably 1 μm or more and 20 μm or less. As specified in the manufacturing method of the electrical component described later, the wiring portion 211 of the electrical component 1 of this example is formed on the base film 20 by printing. If the average particle size of the plurality of copper particles 21p is within the above range, the wiring portion 211 can be formed by printing. The lower limit of the average particle size of the copper particles 21p may be 2 μm, or even 3 μm. Moreover, the upper limit of the average particle size of the copper particles 21p may be 18 μm, or even 15 μm. Therefore, the average particle size of the copper particles 21p may be 2 μm or more and 18 μm or less, and further 3 μm or more and 15 μm or less.

The average particle size of the copper particles 21p can be obtained by microscopically observing a cross section perpendicular to the thickness direction of the wiring portion 211. First, microscopic images of five or more fields of view are acquired from the cross section of the wiring portion 211 . Each microscopic image is binarized to determine the particle size of all particles in the image. The particle size of the copper particles 21p to be measured is the length of the major axis direction of the copper particles 21p in the cross section. The length in the major axis direction is the same as the length of the long side of the quadrangle circumscribing the copper particles 21p. The average value of all particle sizes is the average particle size of the copper particles 21p.

The shape of the copper particles 21p is not particularly limited. The copper particles 21p may be spherical or irregularly shaped. The copper particles 21p of this example are scaly particles. The aspect ratio of the scaly particles, that is, the ratio of the length of the scaly particles in the long axis direction to the length in the short axis direction is preferably 2.5 or more and 5.0 or less. If each copper particle 21p is scale-like, it is likely that the copper particles 21p are stacked in the thickness direction of the wiring portion 211 . The copper particles 21p stacked in the thickness direction are likely to come into surface contact with each other, and the contact area between the copper particles 21p increases. As a result, the conductivity of the wiring pattern 21 is improved.

The content of the copper particles 21p in the wiring portion 211 is preferably 50% by mass or more and 90% by mass or less. If the content of copper particles 21p is 50% by mass or more, the conductivity of wiring portion 211 is sufficiently ensured. If the content of copper particles 21p is 90% by mass or less, a sufficient amount of binder 21b is arranged in the gaps between the plurality of copper particles 21p. As a result, the plurality of copper particles 21p are strongly integrated. A more preferable content of the copper particles 21p is 60% by mass or more and 85% by mass or less. A more preferable content of the copper particles 21p is 65% by mass or more and 80% by mass or less.

The mass ratio of the copper particles 21p in the wiring portion 211 is obtained as follows. First, the microscopic images of five or more fields of view in the cross section orthogonal to the thickness direction of the wiring portion 211 are binarized. The area ratio of the copper particles 21p in each microscope image is obtained. The area ratios in all fields of view are averaged, and the average value is regarded as the volume ratio of the copper particles 21p in the wiring part 211 . By multiplying the volume ratio of the copper particles 21p by the specific gravity of copper and by multiplying the volume ratio of the binder 21b by the specific gravity of the binder 21b, the mass ratio of the copper particles 21p in the wiring part 211 is obtained.

The binder 21b is a thermosetting resin that integrates the multiple copper particles 21p. Thermosetting resins include, for example, phenol resins, urea resins, melanin resins, epoxy resins, unsaturated polyester resins, polyurethane resins, and silicone resins. ) is a resin. These thermosetting resins improve the adhesion between the wiring portion 211 and the base film 20 . As a result, the wiring part 211 is difficult to separate from the base film 20 .

Phenol resin is particularly preferable as the thermosetting resin that constitutes the binder 21b. Phenolic resin has reducing properties. Therefore, the phenol resin suppresses oxidation of the copper particles 21p. Furthermore, as the phenol resin, a resol type phenol resin is preferable. Resol-type phenolic resins are self-reactive and do not require curing agents.

The antioxidant is a chemical substance that suppresses oxidation of the copper particles 21p. The antioxidant may be dispersed in the binder 21b or contained in the copper particles 21p. Antioxidants are, for example, amine antioxidants, phenolic antioxidants, and phenylamine antioxidants. In addition, polyol-based solvents such as ethylene glycol and polyethylene glycol having reducing properties may be contained.

As shown in FIG. 2 , the plating layer 212 covers the surface of the wiring portion 211 . More specifically, the plating layer 212 covers the portion of the wiring portion 211 excluding the portion in close contact with the base film 20 . The plating layer 212 is composed of copper. The plating layer 212 is formed by electroless plating, electrolytic plating, or the like.

The plating layer 212 made of copper supplements the conductivity of the wiring portion 211 and improves the conductivity of the wiring pattern 21 . Therefore, the resistivity of the plating layer 212 is preferably 50 μΩ·cm or less, more preferably 30 μΩ·cm or less.

The thickness of the plating layer 212 is preferably 0.01 μm or more and 50 μm or less. If the thickness of the plating layer 212 is 0.01 μm or more, the electrical conductivity of the wiring pattern 21 can be sufficiently secured. If the plating layer 212 is 50 μm or less, the time required to form the plating layer 212 is short, so the productivity of the electrical component 1 is improved. The lower thickness limit may be 1 μm, 1.5 μm, or 2 μm. The upper thickness limit may be 10 μm, 7.5 μm, or 5 μm. Therefore, the thickness of the plating layer 212 may be 1 μm or more and 10 μm or less, 1.5 μm or more and 7.5 μm or less, or 2 μm or more and 5 μm or less.

≪Protective layer≫
As shown in FIGS. 1 and 2, part of the wiring pattern 21 is covered with the protective layer 5 . Protective layer 5 includes at least one of a coverlay and a solder resist. The wiring pattern 21 is electrically and physically protected by the protective layer 5 . A coverlay is an insulating film with an adhesive layer. The coverlay is suitable for protecting the wiring pattern 21 provided at the bent portion of the circuit member 2 . The solder resist is obtained by curing the undiluted solution applied on the circuit member 2 . Solder resist is suitable for protecting the wiring pattern 21 provided on the flat portion of the circuit member 2 .

≪Mounted parts≫
The mounted component 6 is an electrical component that is attached to the circuit member 2 later. Mounted components 6 are, for example, LED lights, IC chips, and capacitors.

≪Resin member≫
The resin member 3 integrated with the circuit member 2 is a member that supports the circuit member 2 . Moreover, the resin member 3 is a member that plays a role of maintaining the shape of the electrical component 1 . The resin member 3 may be block-shaped or panel-shaped. The resin member 3 may also serve as an exterior panel or an interior panel of the machine on which the electrical component 1 is mounted. For example, as shown in FIG. 1, there is a form in which the circuit member 2 constitutes the wiring of the interior light, and the resin member 3 has the shape of the interior panel in the vicinity of the interior light. In addition, the resin member 3 may be a cover for closing an opening provided in an instrument panel or an armrest, or an operation panel provided with switches for a power window or a display.

The resin member 3 is made of insulating resin with excellent strength and durability. For example, acrylonitrile-butadiene-styrene resin, polypropylene resin, polystyrene resin, polycarbonate resin, vinyl chloride resin, acrylic resin, or the like is suitable.

The resin member 3 is integrated with the first surface 20A or the second surface 20B of the circuit member 2, as shown in FIG. 20 A of 1st surfaces are surfaces in which the wiring pattern 21 in the circuit member 2 is provided. The second surface 20B is the surface opposite to the first surface 20A. The resin member 3 of this example is integrated with the second surface 20B of the circuit member 2 .

At least one of a primer and an adhesive may exist between the resin member 3 and the circuit member 2 . The primer and adhesive strengthen the bonding between the resin member 3 and the circuit member 2 . The primer is mainly composed of, for example, polyurethane resin or acrylic resin. The adhesive is, for example, an acrylic adhesive.

≪Additional parts≫
The additional member 4 is a member that adds characteristics to the electrical component 1 . The properties are, for example, at least one of decorative properties, electromagnetic properties, mechanical properties, and chemical properties. The additional member 4 having decorativeness is, for example, colored or patterned. For example, when the electrical component 1 is used for an interior panel of a vehicle, the additional member 4 improves the texture of the interior. The electromagnetic properties are, for example, electromagnetic shielding properties. Mechanical properties are, for example, impact resistance and cushioning properties. Chemical properties are translucency, water repellency, chemical resistance, and weather resistance. By using the additional member 4 having the predetermined property, the electrical component 1 is provided with the property of the additional member 4 . For example, if the additional member 4 functions as an electromagnetic shield, there is no need to separately provide an electromagnetic shield for the electrical equipment 1 .

The additional member 4 may be composed of an organic material such as an insulating resin, metal, or an inorganic material such as ceramics. Of course, the additional member 4 may be a composite of insulating resin and metal. The material of the additional member 4 is appropriately selected according to the properties required for the additional member 4 .

The additional member 4 is integrated with at least one of the circuit member 2 and the resin member 3 . The additional member 4 of this example is integrated with the resin member 3 .

≪Summary≫
In the wiring portion 211 of the electrical component 1 of this example, as shown in FIG. 3, a plurality of copper particles 21p are integrated with a thermosetting resin binder 21b. Therefore, the contact between the copper particles 21p in the wiring portion 211 is good, and the conductivity of the wiring portion 211 is high. Moreover, since the wiring portion 211 contains an antioxidant, the copper particles 21p are less likely to be oxidized during and after the manufacturing of the wiring portion 211 . Therefore, the wiring portion 211 has excellent conductivity.

The surface of the wiring portion 211 is covered with a copper plating layer 212, as shown in FIG. Therefore, the copper particles 21p (FIG. 3) in the wiring portion 211 are less likely to be oxidized. In addition, the plating layer 212 secures the conductivity of the wiring pattern 21 together with the wiring portion 211 . Therefore, the conductivity of the wiring portion 211 is likely to be maintained for a long period of time.

Ion migration is less likely to occur in the wiring pattern 21 made of copper. Therefore, the quality of the electrical equipment 1 is likely to be maintained over a long period of time. Moreover, since copper is cheaper than silver, the manufacturing cost of the electrical equipment 1 is reduced.

The electrical component 1 of this example includes a resin member 3. The resin member 3 maintains the shape of the electrical component 1 and suppresses damage to the circuit member 2 .

The electrical component 1 of this example includes an additional member 4. The additional member 4 imparts decorativeness and functionality to the electrical equipment 1 . Therefore, the application of the electrical equipment 1 is expanded.

≪Manufacturing method of electrical equipment≫
The electrical equipment 1 of Embodiment 1 is produced, for example, by the following steps.
- Process A for producing the circuit member 2
- Step B of integrating the resin member 3 with the circuit member 2
- Step C of integrating the additional member 4 with at least one of the circuit member 2 or the resin member 3

Either Process B or Process C may be performed first. Process B and process C may be performed simultaneously. Here, unlike this example, when the electrical component 1 does not include the additional member 4, the step C is omitted.

(Step A)
Process A includes the following processes A1 to A6.
- Step A1 of preparing the base film 20
Step A2 of preparing a conductive paste containing a plurality of copper particles 21p, a binder 21b made of a thermosetting resin, and an antioxidant
- Step A3 of printing a conductive paste in a wiring pattern on the base film 20
- Step A4 of forming the wiring portion 211 by hardening the binder 21b by heat treatment
- Step A5 of forming the plating layer 212 by plating the surface of the wiring portion 211 with copper
- Step A6 of forming a protective layer 5 covering a part of the wiring pattern 21

The base film 20 prepared in step A1 is the base film 20 described in the electrical component 1 item. In order to improve the adhesion between the base film 20 and the wiring pattern 21, it is preferable to subject the base film 20 to a surface treatment. The surface treatment is, for example, plasma irradiation, corona irradiation, or UV irradiation applied to the surface of the base film 20 . Alternatively, the surface treatment may be a primer treatment applied to the surface of the base film 20 . Examples of primers include polyurethane primers and acrylic primers.

The conductive paste prepared in step A2 contains the copper particles 21p, the binder 21b, and the antioxidant described in the item of the electrical component 1. The conductive paste may contain a volatile solvent. The solvent adjusts the viscosity of the conductive paste.

In step A3, a conductive paste is printed on the base film 20. Printing is for example screen printing, flexographic printing, gravure printing, gravure offset printing, dispenser printing or inkjet printing. If the average particle size of the copper particles 21p contained in the conductive paste is 1 μm or more and 20 μm or less, the tip of the nozzle used in inkjet printing and dispenser printing is less likely to be clogged with the copper particles 21p. Therefore, the conductive paste can be printed without problems even by inkjet printing and dispenser printing.

In step A4, the conductive paste printed in the form of a wiring pattern is heat-treated. The wiring part 211 is formed by hardening the binder 21b of the conductive paste by this heat treatment. At this time, the base film 20 is also exposed to heat together with the conductive paste. Therefore, the heat treatment temperature is preferably 150° C. or lower. This temperature is lower than the temperature for firing the nanoparticles in Patent Document 1. The firing temperature is, for example, 200° C. or higher. If the heat treatment temperature is 150° C. or less, the copper particles 21p are less likely to be oxidized and the base film 20 is less likely to be damaged.

In step A5, a copper plating layer 212 is formed on the surface of the wiring portion 211. Plating may be electroless plating or electrolytic plating.

In step A6, a protective layer 5 containing at least one of a coverlay and a solder resist is formed. A method for forming a coverlay and a method for forming a solder resist are known. For example, in the case of a solder resist, the surface of the circuit member 2 is screen-printed with a UV-curable solder resist. Then, the protective layer 5 is formed by irradiating the solder resist with UV.

(Step B)
Process B is performed, for example, by insert molding or vacuum pressure molding. Process B can also be implemented by adhesion or the like.

The process B carried out by insert molding will be explained based on FIG. In FIG. 4, the circuit member 2 and the additional member 4 are arranged inside the mold 8 . At this time, a gap is formed between the circuit member 2 and the additional member 4 . A resin, which is a raw material of the resin member 3, is injected into this gap. As a result, the circuit member 2 and the additional member 4 are integrated by the resin member 3 . In this example, process B and process C are performed simultaneously.

In the example shown in FIG. 4, a circuit member 2 on which mounted components 6 are mounted is used. The mounting component 6 may be attached to the circuit member 2 after the circuit member 2 and the additional member 4 are integrated with the resin member 3 .

The process B carried out by vacuum pressure forming will be explained based on FIG. A mold 9 for vacuum and pressure molding includes a chamber 90 and a movable mold 91 . Circuit member 2 is supported within chamber 90 . An upper space and a lower space are separated with the circuit member 2 interposed therebetween.

As shown in the upper part of FIG. 5 , the resin member 3 along the shape of the movable mold 91 is arranged in the movable mold 91 . From this state, the circuit member 2 is heated by a heater or the like, and the space between the circuit member 2 and the movable molding die 91 is evacuated. Since the inside of the chamber 90 is partitioned by the circuit member 2, the space above the circuit member 2 is not evacuated. Next, as shown in the lower part of FIG. 5, the movable molding die 91 is moved upward to integrate the circuit member 2 and the resin member 3 together. At this time, the circuit member 2 deforms into a shape along the shape of the resin member 3 .

(Process C)
Process C, like process B, is performed by insert molding, vacuum pressure molding, or the like. Process C can also be implemented by adhesion or the like. Step C can be carried out independently of Step B, can be carried out after Step B, or can be carried out before Step B.

<Embodiment 2>
In Embodiment 2, an electrical component 1 in which the positions of the resin member 3 and the additional member 4 with respect to the circuit member 2 are different from those in Embodiment 1 will be described with reference to FIG. In FIG. 6, the wiring portion and the plated layer are collectively referred to as a wiring pattern 21, and illustration of the protective layer is also omitted. This point also applies to FIGS. 7 and 8, which will be described later.

　In the electrical component 1 shown in FIG. 6, the additional member 4 is integrated with the first surface 20A of the circuit member 2 . Moreover, the resin member 3 is integrated with the second surface 20B of the circuit member 2 . If the additional member 4 is made of a translucent material and the mounting component 6 is an LED light, lighting of the LED light can be confirmed from the outside of the additional member 4 . The electrical component 1 of this example is produced by, for example, insert-molding the resin member 3 on the second surface 20B of the circuit member 2 and then insert-molding the additional member 4 on the first surface 20A of the circuit member 2 . Here, in the electrical component 1 of this example, the first surface 20A is covered with the additional member 4, so the protective layer covering the wiring pattern 21 may be omitted.

As a modification of the second embodiment, the resin member 3 may be integrated with the first surface 20A and the additional member 4 may be integrated with the second surface 20B.

<Embodiment 3>
In Embodiment 3, an electrical component 1 having an arrangement different from that in Embodiments 1 and 2 will be described with reference to FIG.

In the electrical component 1 shown in FIG. 7, the additional member 4 and the resin member 3 are integrated in order from the second surface 20B of the circuit member 2 . The electrical component 1 of this example is manufactured by insert-molding the additional member 4 between the second surface 20B of the circuit member 2 and the plate-like resin member 3, for example.

<Embodiment 4>
In Embodiment 4, an electrical component 1 having an arrangement different from that in Embodiments 1 to 3 will be described with reference to FIG.

In the electrical component 1 shown in FIG. 8 , the resin member 3 and the additional member 4 are integrated in order from the first surface 20A of the circuit member 2 . The electrical component 1 of this example is manufactured by insert-molding the resin member 3 between the first surface 20A of the circuit member 2 and the plate-shaped additional member 4, for example. Here, in the electrical component 1 of this example, the first surface 20A is covered with the resin member 3 and the additional member 4, so the protective layer covering the wiring pattern 21 may be omitted.

The present invention is not limited to these examples, but is indicated by the scope of the claims, and is intended to include all modifications within the scope and meaning equivalent to the scope of the claims.

1 electrical component 2 circuit member 20 base film 21 wiring pattern 211 wiring portion 212 plating layer 20A first surface 20B second surface 21b binder 21p copper particles 3 resin member 4 additional member 5 protective layer 6 mounting component 8 gold mold 9 mold 90 chamber, 91 movable mold

Claims (12)

1. a circuit member;
   and a resin member integrated with the circuit member,
   The circuit member is
   a base film made of an insulating resin;
   A wiring pattern provided on the base film,
   The wiring pattern is
   a wiring portion formed on the base film;
   A plating layer formed on the surface of the wiring portion,
   The wiring part is
   a plurality of copper particles;
   a binder made of a thermosetting resin;
   an antioxidant and
   The plating layer is made of copper,
   electrical equipment.
2. An additional member that imparts at least one of decorativeness, electromagnetic properties, mechanical properties, and chemical properties to the electrical equipment,
   2. The electrical equipment according to claim 1, wherein said additional member is integrated with at least one of said circuit member and said resin member.
3. The electrical component according to claim 1 or claim 2, wherein the base film is made of a thermoplastic resin.
4. The electrical component according to any one of claims 1 to 3, wherein the base film has a thickness of 0.025 mm or more and 1 mm or less.
5. The electrical component according to any one of claims 1 to 4, wherein the heat shrinkage of the base film in an air atmosphere at 150°C for 30 minutes is 5% or less.
6. The electrical equipment according to any one of claims 1 to 5, wherein each of the plurality of copper particles is scale-shaped.
7. The electrical equipment according to any one of claims 1 to 6, wherein the average particle size of the plurality of copper particles is 1 µm or more and 20 µm or less.
8. The electrical component according to any one of claims 1 to 7, wherein the plating layer has a thickness of 0.01 µm or more and 50 µm or less.
9. 9. The thermosetting resin contains at least one selected from the group consisting of phenol resin, urea resin, melamine resin, epoxy resin, unsaturated polyester resin, polyurethane resin, and silicone resin. The electrical equipment according to any one of items 1 and 2.
10. The insulating resin includes polycarbonate resin, polystyrene resin, acrylonitrile-butadiene-styrene resin, liquid crystal polymer resin, polytetrafluoroethylene resin, polyethylene naphthalate resin, polyethylene terephthalate resin, nylon resin, polyphenylene sulfide resin, polyphenylene ether resin, modified 10. The electrical equipment according to any one of claims 1 to 9, comprising at least one selected from the group consisting of polyphenylene ether resin, syndiotactic polystyrene resin, and cycloolefin polymer resin.
11. A protective layer covering a portion of the wiring pattern,
    The electrical equipment according to any one of claims 1 to 10, wherein the protective layer includes at least one of a coverlay and a solder resist.
12. A step A of producing a circuit member comprising a base film made of an insulating resin and a wiring pattern provided on the base film;
    A step B of integrating a resin member with the circuit member,
    The step A is
    A step A1 of preparing the base film;
    Step A2 of preparing a conductive paste containing a plurality of copper particles, a binder made of a thermosetting resin, and an antioxidant;
    A step A3 of printing the conductive paste in the form of a wiring pattern on the base film;
    A step A4 of forming a wiring portion by hardening the binder by heat treatment;
    A step A5 of forming a plating layer by plating copper on the surface of the wiring part,
    Manufacturing method of electrical equipment.

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