WO2022202485A1 - Composition de résine photosensible, élément photosensible et procédé de production d'un corps stratifié - Google Patents

Composition de résine photosensible, élément photosensible et procédé de production d'un corps stratifié Download PDF

Info

Publication number
WO2022202485A1
WO2022202485A1 PCT/JP2022/011565 JP2022011565W WO2022202485A1 WO 2022202485 A1 WO2022202485 A1 WO 2022202485A1 JP 2022011565 W JP2022011565 W JP 2022011565W WO 2022202485 A1 WO2022202485 A1 WO 2022202485A1
Authority
WO
WIPO (PCT)
Prior art keywords
mass
photosensitive resin
less
parts
resin composition
Prior art date
Application number
PCT/JP2022/011565
Other languages
English (en)
Japanese (ja)
Inventor
祐作 渡邉
聡 大友
真生 成田
敬司 小野
明子 武田
Original Assignee
昭和電工マテリアルズ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 昭和電工マテリアルズ株式会社 filed Critical 昭和電工マテリアルズ株式会社
Priority to JP2022561081A priority Critical patent/JP7287581B2/ja
Priority to CN202280004068.XA priority patent/CN117043677A/zh
Priority to KR1020227038216A priority patent/KR20230161863A/ko
Publication of WO2022202485A1 publication Critical patent/WO2022202485A1/fr

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/12—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by mechanical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/16—Layered products comprising a layer of synthetic resin specially treated, e.g. irradiated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

Definitions

  • the present disclosure relates to a photosensitive resin composition, a photosensitive element, a laminate manufacturing method, and the like.
  • a resist pattern is formed to obtain desired wiring.
  • a resist pattern can be formed by exposing and developing a photosensitive resin layer obtained using a photosensitive resin composition.
  • Various compositions have been studied as the photosensitive resin composition.
  • Patent Document 1 describes a photosensitive resin composition containing an anthracene derivative.
  • a cured product pattern used as a resist pattern is obtained, for example, by photocuring (exposing) a photosensitive resin layer disposed on a substrate, and then developing and removing an uncured portion (unexposed portion) of the photosensitive resin layer. It is formed by Then, after the portion of the substrate where the cured product pattern is not formed is treated (for example, plating), the cured product pattern is peeled off (removed). In this case, from the viewpoint of efficiency, etc., it is required to shorten the peeling time required for peeling the cured portion.
  • An object of one aspect of the present disclosure is to provide a photosensitive resin composition capable of shortening the peeling time of the cured portion. Another object of the present invention is to provide a photosensitive element using the photosensitive resin composition. Another object of the present invention is to provide a method for producing a laminate using the photosensitive resin composition described above.
  • One aspect of the present disclosure contains a binder polymer, a photopolymerizable compound, a photopolymerization initiator, and a hydrogen donor, and the photopolymerizable compound includes a compound having a ditrimethylolpropane skeleton. It relates to a flexible resin composition.
  • the peeling time of the cured portion of the photosensitive resin composition can be shortened.
  • Another aspect of the present disclosure relates to a photosensitive element comprising a support and a photosensitive resin layer disposed on the support, wherein the photosensitive resin layer contains the photosensitive resin composition described above. .
  • Another aspect of the present disclosure includes a step of disposing a photosensitive resin layer on a substrate using the above-described photosensitive resin composition or the above-described photosensitive element, and partially removing the photosensitive resin layer a step of photocuring; a step of removing an uncured portion of the photosensitive resin layer to form a cured product pattern; and a step of forming a laminate.
  • a photosensitive resin composition capable of shortening the peeling time of the cured portion.
  • a photosensitive element using the photosensitive resin composition.
  • a method for producing a laminate using the photosensitive resin composition described above it is possible to provide application of the photosensitive resin composition or photosensitive element to formation of a resist pattern.
  • FIG. 1 is a schematic cross-sectional view showing an example of a photosensitive element
  • FIG. It is a schematic diagram which shows an example of the manufacturing method of a laminated body.
  • a or more in the numerical range means A and the range exceeding A.
  • a or less in a numerical range means A and a range less than A.
  • the upper limit value or lower limit value of the numerical range in one step can be arbitrarily combined with the upper limit value or lower limit of the numerical range in another step.
  • the upper or lower limits of the numerical ranges may be replaced with the values shown in the examples.
  • “A or B” may include either A or B, or may include both.
  • each component in the composition means the total amount of the plurality of substances present in the composition unless otherwise specified when there are multiple substances corresponding to each component in the composition.
  • layer includes not only a shape structure formed over the entire surface but also a shape structure formed partially when observed as a plan view.
  • process is included in the term not only as an independent process, but also as long as the intended action of the process is achieved even if it is not clearly distinguishable from other processes.
  • (Meth)acrylate means at least one of acrylate and its corresponding methacrylate. The same applies to other similar expressions such as "(meth)acrylic acid”.
  • An “alkyl group” may be linear, branched or cyclic, unless otherwise specified.
  • a "(poly)oxyalkylene group” means at least one of an oxyalkylene group and a polyoxyalkylene group (a group in which two or more alkylene groups are linked by an ether bond). The same applies to other similar expressions such as "(poly)oxyethylene group” and "(poly)oxypropylene group”.
  • EO-modified means a compound having a (poly)oxyethylene group.
  • PO-modified means a compound having a (poly)oxypropylene group.
  • EO/PO-modified means a compound having a (poly)oxyethylene group and/or a (poly)oxypropylene group.
  • the solid content of the photosensitive resin composition refers to the non-volatile content excluding volatile substances (water, solvent, etc.) in the photosensitive resin composition. That is, the term “solid content” refers to components (components other than the solvent) that remain without volatilizing when the photosensitive resin composition dries, and includes components that are liquid, starch syrup-like, or wax-like at room temperature (25° C.).
  • the photosensitive resin composition according to the present embodiment includes (A) a binder polymer ((A) component), (B) a photopolymerizable compound ((B) component), and (C) a photopolymerization initiator ((C ) component) and (D) a hydrogen donor ((D) component), and the photopolymerizable compound includes a compound having a ditrimethylolpropane skeleton.
  • the photosensitive resin composition according to this embodiment can be used as, for example, a negative photosensitive resin composition.
  • the photosensitive resin composition according to this embodiment is photocurable, and a cured product can be obtained by photocuring the photosensitive resin composition.
  • the cured product according to this embodiment is a cured product (photocured product) of the photosensitive resin composition according to this embodiment.
  • the cured product according to the present embodiment may be patterned (cured product pattern) or may be a resist pattern.
  • the minimum or maximum visible light transmittance of the photosensitive resin composition and the cured product e.g., visible light transmittance at a thickness of 5.0 ⁇ m
  • the minimum or maximum visible light transmittance of the photosensitive resin composition and the cured product is 90% or less, less than 90%, or 85%. or less, or 80% or less.
  • the visible light transmittance for example, the transmittance in the wavelength range of 400 to 700 nm can be used.
  • the thickness of the cured product according to this embodiment may be 1 ⁇ m or more, 5 ⁇ m or more, 10 ⁇ m or more, 15 ⁇ m or more, 20 ⁇ m or more, or 25 ⁇ m or more.
  • the thickness of the cured product according to this embodiment may be 100 ⁇ m or less, 80 ⁇ m or less, 50 ⁇ m or less, 40 ⁇ m or less, 30 ⁇ m or less, or 25 ⁇ m or less. From these viewpoints, the thickness of the cured product according to this embodiment may be 1 to 100 ⁇ m, 10 to 50 ⁇ m, or 15 to 40 ⁇ m.
  • the peeling time required for peeling (removing) the cured portion (exposed portion) of the photosensitive resin composition can be shortened.
  • the peeling time of the cured portion when the cured portion of the photosensitive resin composition is immersed in a 3.0% by mass NaOH aqueous solution (50 ° C.) can be shortened.
  • the photosensitive resin composition according to this embodiment excellent sensitivity to actinic rays can be obtained.
  • the uncured portion can be satisfactorily removed by development processing, and excellent resolution can be obtained.
  • the photosensitive resin composition according to this embodiment contains a binder polymer as component (A).
  • Component (A) includes acrylic resins, styrene resins, epoxy resins, amide resins, amide epoxy resins, alkyd resins, phenol resins, and the like.
  • Acrylic resins are resins having a compound ((meth)acrylic acid compound) having a (meth)acryloyl group as a monomer unit, and styrene resins, epoxy resins, and amide resins having the monomer units.
  • amidoepoxy resins, alkyd resins and phenolic resins belong to acrylic resins.
  • the (A) component may contain an acrylic resin from the viewpoint of easily shortening the peeling time of the cured portion and from the viewpoint of easily obtaining excellent sensitivity, resolution and adhesion.
  • the content of the acrylic resin is 50 mass based on the total mass of the component (A) from the viewpoint of easily shortening the peeling time of the cured part and from the viewpoint of easily obtaining excellent sensitivity, resolution and adhesion. % or more, more than 50% by mass, 70% by mass or more, 90% by mass or more, 95% by mass or more, 98% by mass or more, 99% by mass or more, or substantially 100% by mass ((A) component is substantially It may be a mode) made of an acrylic resin.
  • Examples of compounds having a (meth)acryloyl group include (meth)acrylic acid and (meth)acrylic acid esters.
  • (Meth)acrylates include alkyl (meth)acrylates (alkyl (meth)acrylates; excluding compounds corresponding to cycloalkyl (meth)acrylates), cycloalkyl (meth)acrylates ((meth) cycloalkyl acrylate), aryl (meth)acrylate (aryl (meth)acrylate), (meth)acrylamide compounds (diacetone acrylamide, etc.), glycidyl (meth)acrylate, styryl (meth)acrylic acid, etc. is mentioned.
  • the component (A) may have (meth)acrylic acid as a monomer unit from the viewpoint of easily shortening the peeling time of the cured portion, and from the viewpoint of easily obtaining excellent sensitivity, resolution and adhesion. .
  • the content of the monomer unit of (meth)acrylic acid is from the viewpoint of easily shortening the peeling time of the cured part, and excellent sensitivity , from the viewpoint of easily obtaining resolution and adhesion, the total amount of the monomer units constituting the component (A) may be within the following ranges.
  • the content of the monomer units of (meth)acrylic acid is 1% by mass or more, 5% by mass or more, 10% by mass or more, 12% by mass or more, 15% by mass or more, 18% by mass or more, 20% by mass or more, Alternatively, it may be 25% by mass or more.
  • the content of the monomer units of (meth)acrylic acid may be 50% by mass or less, less than 50% by mass, 45% by mass or less, 40% by mass or less, 35% by mass or less, or 30% by mass or less. . From these viewpoints, the content of the (meth)acrylic acid monomer unit may be 1 to 50% by mass, 10 to 45% by mass, or 15 to 40% by mass.
  • Component (A) has an alkyl (meth)acrylate as a monomer unit from the viewpoint of easily shortening the peeling time of the cured portion and from the viewpoint of easily obtaining excellent sensitivity, resolution and adhesion. good.
  • alkyl group of alkyl (meth)acrylate include methyl group, ethyl group, propyl group, butyl group, pentyl group, hexyl group, heptyl group, octyl group, nonyl group, decyl group, undecyl group and dodecyl group. and the alkyl groups may be of various structural isomers.
  • the number of carbon atoms in the alkyl group of the alkyl (meth)acrylate is 1 to 4, 1 to 3 from the viewpoint of easily shortening the peeling time of the cured portion and from the viewpoint of easily obtaining excellent sensitivity, resolution and adhesion. , 2-3, or 1-2.
  • the alkyl group of the alkyl (meth)acrylate may have a substituent.
  • substituents include hydroxy group, amino group, epoxy group, furyl group, halogeno group (fluoro group, chloro group, bromo group, etc.).
  • Component (A) includes dimethylaminoethyl (meth)acrylate, diethylaminoethyl (meth)acrylate, 2,2,2-trifluoroethyl (meth)acrylate, 2,2,3 (meth)acrylate, 3-tetrafluoropropyl, ⁇ -chloro(meth)acrylic acid, ⁇ -bromo(meth)acrylic acid and the like.
  • Component (A) has a hydroxyalkyl (meth)acrylate as a monomer unit from the viewpoint of easily shortening the peeling time of the cured part and from the viewpoint of easily obtaining excellent sensitivity, resolution and adhesion.
  • Hydroxyalkyl (meth)acrylates include hydroxymethyl (meth)acrylate, hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, hydroxybutyl (meth)acrylate, hydroxypentyl (meth)acrylate, Hydroxyhexyl (meth)acrylate and the like can be mentioned.
  • the content of the monomer unit of hydroxyalkyl (meth)acrylate in the case of having it as a monomer unit is from the viewpoint of easily shortening the peeling time of the cured part, and excellent sensitivity, resolution and adhesion. From the viewpoint of ease of use, the following ranges may be used based on the total amount of the monomer units constituting component (A).
  • the content of the monomer units described above may be 0.1% by mass or more, 0.5% by mass or more, 1% by mass or more, 2% by mass or more, or 3% by mass or more.
  • the content of the above monomer units is 20% by mass or less, 18% by mass or less, 15% by mass or less, 12% by mass or less, 10% by mass or less, 8% by mass or less, 5% by mass or less, or 3% by mass. % or less. From these points of view, the content of the above monomer units may be 0.1 to 20% by mass, 0.5 to 10% by mass, or 1 to 8% by mass.
  • Component (A) has an aryl (meth)acrylate as a monomer unit from the viewpoint of easily shortening the peeling time of the cured part and from the viewpoint of easily obtaining excellent sensitivity, resolution and adhesion. good.
  • Aryl (meth)acrylates include benzyl (meth)acrylate, phenyl (meth)acrylate, and naphthyl (meth)acrylate.
  • the content of the monomer unit of the aryl (meth)acrylate is such that the peeling time of the cured portion is easily shortened, and an excellent From the viewpoint of easily obtaining the sensitivity, resolution and adhesion, the total amount of the monomer units constituting the component (A) may be within the following ranges.
  • the content of the monomer units of the aryl (meth)acrylate may be 1% by mass or more, 5% by mass or more, 10% by mass or more, 15% by mass or more, or 20% by mass or more.
  • the content of the monomer unit of the aryl (meth)acrylate is 50% by mass or less, less than 50% by mass, 45% by mass or less, 40% by mass or less, 35% by mass or less, 30% by mass or less, and 25% by mass or less. , or 20% by mass or less. From these viewpoints, the content of the monomer units of the aryl (meth)acrylate may be 1 to 50% by mass, 5 to 40% by mass, or 10 to 30% by mass.
  • the (A) component may have a styrene compound as a monomer unit from the viewpoint of easily shortening the peeling time of the cured portion and from the viewpoint of easily obtaining excellent sensitivity, resolution and adhesion.
  • Styrene compounds include styrene and styrene derivatives. Examples of styrene derivatives include vinyltoluene and ⁇ -methylstyrene.
  • Component (A) is a monomer unit of hydroxyalkyl (meth)acrylate and a styrene compound from the viewpoint of easily shortening the peeling time of the cured part and from the viewpoint of easily obtaining excellent sensitivity, resolution and adhesion. may have as
  • the content of the monomer unit of the styrene compound is used from the viewpoint of easily shortening the peeling time of the cured part, and excellent sensitivity, resolution and adhesion. From the viewpoint of easily obtaining properties, it may be in the following range based on the total amount of the monomer units constituting the component (A).
  • the content of the monomer unit of the styrene compound is 10% by mass or more, 20% by mass or more, 25% by mass or more, 30% by mass or more, 35% by mass or more, 40% by mass or more, 45% by mass or more, and 47% by mass. or more, or 50% by mass or more.
  • the content of the monomer unit of the styrene compound is 90% by mass or less, 85% by mass or less, 80% by mass or less, 75% by mass or less, 70% by mass or less, 65% by mass or less, 60% by mass or less, and 55% by mass. or less, or 50% by mass or less. From these viewpoints, the content of the monomer unit of the styrene compound is 10 to 90% by mass, 30 to 90% by mass, 40 to 90% by mass, 50 to 90% by mass, 10 to 70% by mass, 30 to 70% by mass. % by weight, 40-70% by weight, 50-70% by weight, 10-50% by weight, 30-50% by weight, or 40-50% by weight.
  • the (A) component may have other monomers as monomer units.
  • monomers include vinyl alcohol ethers (vinyl-n-butyl ether, etc.), (meth)acrylonitrile, maleic acid, maleic anhydride, maleic acid monoesters (monomethyl maleate, monoethyl maleate, maleic monoisopropyl acid, etc.), fumaric acid, cinnamic acid, ⁇ -cyanocinnamic acid, itaconic acid, crotonic acid, propiolic acid and the like.
  • the content of the monomer units of the monomer having a carbazole ring is 0.1 mol% or less and 0.1 mol% based on the total amount of the monomer units constituting component (A). It may be less than, 0.01 mol % or less, 0.001 mol % or less, or substantially 0 mol %.
  • Component (A) may not contain a binder polymer having a carbazole ring. That is, the photosensitive resin composition according to this embodiment does not need to contain a binder polymer having a carbazole ring.
  • the acid value of the component (A) may fall within the following ranges from the viewpoints of easily shortening the peeling time of the cured portion and from the viewpoints of easily obtaining excellent sensitivity, resolution and adhesion.
  • the acid value of component (A) is 80 mgKOH/g or more, 90 mgKOH/g or more, 100 mgKOH/g or more, 100 mgKOH/g or more, 120 mgKOH/g or more, 140 mgKOH/g or more, 150 mgKOH/g or more, 160 mgKOH/g or more, or , 170 mg KOH/g or more.
  • the acid value of component (A) may be 250 mgKOH/g or less, 240 mgKOH/g or less, 230 mgKOH/g or less, 210 mgKOH/g or less, 200 mgKOH/g or less, or 180 mgKOH/g or less. From these viewpoints, the acid value of component (A) may be 80-250 mgKOH/g, 100-230 mgKOH/g, or 150-200 mgKOH/g.
  • the acid value of component (A) can be adjusted by adjusting the content of the monomer units (for example, the monomer units of (meth)acrylic acid) constituting component (A).
  • the acid value of component (A) can be measured by the method described in Examples.
  • the acid value can be calculated by the following formula.
  • a volatile component such as a synthetic solvent or a dilution solvent
  • Acid value 0.1 x Vf x 56.1/(Wp x I/100)
  • Vf represents the titration amount (unit: mL) of the KOH (potassium hydroxide) aqueous solution
  • Wp represents the mass (unit: g) of the solution containing the component (A) to be measured
  • I indicates the percentage of non-volatile matter in the solution containing the component (A) to be measured (unit: % by mass).
  • the weight average molecular weight (Mw) of component (A) may be within the following range from the viewpoint of easily shortening the peeling time of the cured portion and from the viewpoint of easily obtaining excellent sensitivity, resolution and adhesion.
  • the weight average molecular weight of component (A) may be 10,000 or more, 20,000 or more, 25,000 or more, 30,000 or more, or 35,000 or more.
  • the weight average molecular weight of component (A) may be 100,000 or less, 80,000 or less, 70,000 or less, less than 70,000, 65,000 or less, 60,000 or less, 50,000 or less, 40,000 or less, or 35,000 or less. From these viewpoints, the weight average molecular weight of component (A) may be 10,000 to 100,000, 20,000 to 50,000, or 30,000 to 40,000.
  • the number average molecular weight (Mn) of component (A) may be within the following range from the viewpoint of easily shortening the peeling time of the cured portion and from the viewpoint of easily obtaining excellent sensitivity, resolution and adhesion.
  • Component (A) may have a number average molecular weight of 5,000 or more, 10,000 or more, 12,000 or more, 15,000 or more, or 16,000 or more.
  • the number average molecular weight of component (A) may be 50,000 or less, 40,000 or less, 35,000 or less, 30,000 or less, 25,000 or less, 20,000 or less, or 16,000 or less. From these viewpoints, the number average molecular weight of component (A) may be 5,000 to 50,000, 10,000 to 25,000, or 15,000 to 20,000.
  • the degree of dispersion (weight average molecular weight/number average molecular weight) of the component (A) is within the following range from the viewpoint of easily shortening the peeling time of the cured portion, and from the viewpoint of easily obtaining excellent sensitivity, resolution and adhesion.
  • can be Component (A) may have a dispersity of 1.0 or more, 1.5 or more, 1.8 or more, 2.0 or more, or 2.1 or more.
  • Component (A) may have a dispersity of 3.0 or less, 2.8 or less, 2.5 or less, 2.3 or less, or 2.2 or less. From these viewpoints, the component (A) may have a dispersity of 1.0 to 3.0, 1.5 to 2.5, or 1.8 to 2.3.
  • the weight average molecular weight and number average molecular weight can be measured, for example, by gel permeation chromatography (GPC) using a standard polystyrene calibration curve. More specifically, it can be measured under the conditions described in Examples. If it is difficult to measure a compound having a low molecular weight by the above weight average molecular weight and number average molecular weight measurement methods, the molecular weight can be measured by another method and the average value can be calculated.
  • GPC gel permeation chromatography
  • the content of component (A) is based on the total solid content of the photosensitive resin composition, from the viewpoint of easily shortening the peeling time of the cured part, and from the viewpoint of easily obtaining excellent sensitivity, resolution and adhesion. It may be in the following range.
  • the content of component (A) is 10% by mass or more, 20% by mass or more, 30% by mass or more, 40% by mass or more, 45% by mass or more, or 50% by mass or more from the viewpoint of excellent film formability. It's okay.
  • the content of component (A) may be 90% by mass or less, 80% by mass or less, 75% by mass or less, 70% by mass or less, 65% by mass or less, 60% by mass or less, or 55% by mass or less. From these viewpoints, the content of component (A) may be 10 to 90% by mass, 30 to 70% by mass, or 40 to 60% by mass.
  • the content of component (A) is from the viewpoint of easily shortening the peeling time of the cured part, and from the viewpoint of easily obtaining excellent sensitivity, resolution and adhesion, the total amount of component (A) and component (B) is 100 It may be in the following range with respect to parts by mass. From the viewpoint of excellent film formability, the content of component (A) is 10 parts by mass or more, 20 parts by mass or more, 30 parts by mass or more, 40 parts by mass or more, 45 parts by mass or more, 50 parts by mass or more, or It may be 55 parts by mass or more.
  • the content of component (A) may be 90 parts by mass or less, 80 parts by mass or less, 75 parts by mass or less, 70 parts by mass or less, 65 parts by mass or less, or 60 parts by mass or less. From these viewpoints, the content of component (A) may be 10 to 90 parts by mass, 30 to 70 parts by mass, or 40 to 60 parts by mass.
  • the photosensitive resin composition according to the present embodiment contains a photopolymerizable compound as the component (B), and the photopolymerizable compound contains a compound having a ditrimethylolpropane skeleton.
  • the photopolymerizable compound is a compound polymerized by light, and may be, for example, a compound having an ethylenically unsaturated bond.
  • Component (B) contains a (meth)acrylic acid compound having a ditrimethylolpropane skeleton from the viewpoint of easily shortening the peeling time of the cured portion and from the viewpoint of easily obtaining excellent sensitivity, resolution and adhesion. good.
  • the number of (meth)acryloyl groups in the (meth)acrylic acid compound having a ditrimethylolpropane skeleton is from the viewpoint of easily shortening the peeling time of the cured part, and excellent sensitivity and resolution. From the viewpoint of easily obtaining properties and adhesion, the following ranges may be used.
  • the number of (meth)acryloyl groups may be 2 or more, 3 or more, or 4 or more.
  • the number of (meth)acryloyl groups may be 8 or less, 7 or less, 6 or less, 5 or less, or 4 or less. From these points of view, the number of (meth)acryloyl groups may be 2-8 or 3-6, and may be 4.
  • a (poly) oxyalkylene group e.g.
  • the compound having a ditrimethylolpropane skeleton may have a polyoxyethylene group from the viewpoint of particularly easily shortening the peeling time of the cured portion and from the viewpoint of particularly easily obtaining excellent sensitivity.
  • a compound having a ditrimethylolpropane skeleton may have a polyoxypropylene group from the viewpoint of easily obtaining excellent resolution and adhesion.
  • the number of oxyalkylene groups (total per molecule), the number of oxyethylene groups, or the number of oxypropylene groups in the compound having a ditrimethylolpropane skeleton may be within the following ranges.
  • the number of the above groups is 1 or more, 2 or more, 3 or more, 4 or more, 6 or more, 8 or more, from the viewpoint of easily shortening the peeling time of the cured portion and from the viewpoint of easily obtaining excellent sensitivity and adhesion. It may be 10 or more, 12 or more, 15 or more, 18 or more, or 20 or more.
  • the number of the above groups is 30 or more, 25 or less, 20 or less, 18 or less, 15 or less, 12 or less, 10 or less, 8 or less, 6 or less, or 4 may be: From these points of view, the numbers of the groups mentioned above are 1 to 30, 4 to 20, 8 to 20, 12 to 20, 16 to 20, 4 to 16, 8 to 16, 12 to 16, 4 to 12, 8 to It may be 12, or 4-8.
  • the molecular weight of the compound having a ditrimethylolpropane skeleton is 250 or more, 300 or more, 400 or more, 500 or more, 600 or more from the viewpoint of easily shortening the peeling time of the cured part and from the viewpoint of easily obtaining excellent sensitivity and adhesion. , 650 or more, 700 or more, 800 or more, 1000 or more, 1050 or more, 1100 or more, 1200 or more, or 1400 or more.
  • the molecular weight of the compound having a ditrimethylolpropane skeleton may be 1500 or more, 1600 or more, or 1700 or more from the viewpoint of easily obtaining excellent resolution and adhesion.
  • the molecular weight of the compound having a ditrimethylolpropane skeleton is 10,000 or less, less than 10,000, 8,000 or less, and 6,000 from the viewpoint of easily shortening the peeling time of the cured portion and from the viewpoint of easily obtaining excellent sensitivity, resolution, and adhesion. 5000 or less, 3000 or less, 2000 or less, or 1800 or less.
  • the molecular weight of the compound having a ditrimethylolpropane skeleton may be 1,700 or less, 1,600 or less, or 1,500 or less, from the viewpoint of particularly easily shortening the peeling time of the cured portion and from the viewpoint of particularly easily obtaining excellent sensitivity.
  • the molecular weight of the compound having a ditrimethylolpropane skeleton may be 1400 or less, 1200 or less, 1100 or less, 1050 or less, 1000 or less, 800 or less, or 700 or less from the viewpoint of easily obtaining excellent resolution. From these viewpoints, the molecular weight of the compound having a ditrimethylolpropane skeleton is 250 to 10000, 500 to 5000, 600 to 2000, 800 to 2000, 1200 to 2000, 1500 to 2000, 600 to 1500, 800 to 1500, 1200 to It may be 1500, 600-1200, 800-1200, or 600-800.
  • the content of the compound having a ditrimethylolpropane skeleton is based on the total mass of the component (B) from the viewpoint of easily shortening the peeling time of the cured portion and from the viewpoint of easily obtaining excellent sensitivity, resolution and adhesion. may be in the following range.
  • the content of the compound having a ditrimethylolpropane skeleton may be 1% by mass or more, 3% by mass or more, 5% by mass or more, 8% by mass or more, 10% by mass or more, or 11% by mass or more.
  • the content of the compound having a ditrimethylolpropane skeleton is 50% by mass or less, less than 50% by mass, 40% by mass or less, 30% by mass or less, 20% by mass or less, 18% by mass or less, 15% by mass or less, or 12% by mass. % by mass or less. From these points of view, the content of the compound having a ditrimethylolpropane skeleton may be 1 to 50% by mass, 5 to 30% by mass, or 8 to 20% by mass.
  • the content of the compound having a ditrimethylolpropane skeleton is the total solid content of the photosensitive resin composition, from the viewpoint of easily shortening the peeling time of the cured part, and from the viewpoint of easily obtaining excellent sensitivity, resolution and adhesion. may be in the following ranges based on The content of the compound having a ditrimethylolpropane skeleton is 0.1% by mass or more, 0.5% by mass or more, 1% by mass or more, 2% by mass or more, 3% by mass or more, 4% by mass or more; It may be 5% by mass or more.
  • the content of the compound having a ditrimethylolpropane skeleton is 20% by mass or less, 15% by mass or less, 10% by mass or less, 8% by mass or less, 6% by mass or less, 5% by mass or less, or less than 5% by mass. you can From these viewpoints, the content of the compound having a ditrimethylolpropane skeleton is 0.1 to 20% by mass, 1 to 20% by mass, 3 to 20% by mass, 0.1 to 10% by mass, 1 to 10% by mass. , 3 to 10% by mass, 0.1 to 8% by mass, 1 to 8% by mass, 3 to 8% by mass, 0.1 to 5% by mass, 1 to 5% by mass, or 3 to 5% by mass you can
  • the content of the compound having a ditrimethylolpropane skeleton is the component (A) and the component (B) from the viewpoint of easily shortening the peeling time of the cured portion and from the viewpoint of easily obtaining excellent sensitivity, resolution and adhesion. It may be in the following range with respect to 100 parts by mass of the total amount.
  • the compound having a ditrimethylolpropane skeleton is 0.1 parts by mass or more, 0.5 parts by mass or more, 1 part by mass or more, 2 parts by mass or more, 3 parts by mass or more, 4 parts by mass or more, 4.5 parts by mass or more, Alternatively, it may be 5 parts by mass or more.
  • the content of the compound having a ditrimethylolpropane skeleton may be 20 parts by mass or less, 15 parts by mass or less, 10 parts by mass or less, 8 parts by mass or less, 6 parts by mass or less, or 5 parts by mass or less. From these viewpoints, the content of the compound having a ditrimethylolpropane skeleton is 0.1 to 20 parts by mass, 1 to 20 parts by mass, 3 to 20 parts by mass, 5 to 20 parts by mass, and 0.1 to 10 parts by mass.
  • the (B) component may contain a compound that does not have a ditrimethylolpropane skeleton.
  • Compounds not having a ditrimethylolpropane skeleton include bisphenol A-type (meth)acrylic acid compounds, EO-modified di(meth)acrylates, PO-modified di(meth)acrylates, EO/PO-modified di(meth)acrylates, polyalkylene Glycol di(meth)acrylate (polyethylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, etc.), EO-modified polyalkylene glycol di(meth)acrylate, PO-modified polyalkylene glycol di(meth)acrylate, EO/PO modified polyalkylene glycol di(meth)acrylate, trimethylolpropane di(meth)acrylate, trimethylolpropane tri(meth)acrylate, EO-modified trimethylolpropane tri(meth)acrylate,
  • Component (B) is a bisphenol A type (meth)acrylic acid compound (ditrimethylolpropane skeleton) from the viewpoint of easily shortening the peeling time of the cured part, and from the viewpoint of easily obtaining excellent sensitivity, resolution and adhesion.
  • Component (B) is a 2,2-bis(4-((meth)acryloxy poly ethoxy)phenyl)propane and may include 2,2-bis(4-((meth)acryloxypentaethoxy)phenyl)propane.
  • the content of the bisphenol A type (meth)acrylic acid compound is the total mass of the component (B) from the viewpoint of easily shortening the peeling time of the cured part and from the viewpoint of easily obtaining excellent sensitivity, resolution and adhesion. may be in the following ranges based on The content of the bisphenol A type (meth)acrylic acid compound may be 50% by mass or more, 50% by mass or more, 60% by mass or more, 65% by mass or more, 70% by mass or more, or 75% by mass or more.
  • the content of the bisphenol A type (meth)acrylic acid compound is 99% by mass or less, 97% by mass or less, 95% by mass or less, 92% by mass or less, 90% by mass or less, 89% by mass or less, 85% by mass or less, or , 80% by mass or less. From these viewpoints, the content of the bisphenol A type (meth)acrylic acid compound may be 50 to 99% by mass, 60 to 95% by mass, or 70 to 90% by mass.
  • the content of the bisphenol A type (meth)acrylic acid compound is the solid content of the photosensitive resin composition from the viewpoint of easily shortening the peeling time of the cured part, and from the viewpoint of easily obtaining excellent sensitivity, resolution and adhesion. It may be in the following ranges based on the total amount.
  • the content of the bisphenol A type (meth)acrylic acid compound is 1% by mass or more, 5% by mass or more, 10% by mass or more, 15% by mass or more, 20% by mass or more, 25% by mass or more, or 30% by mass or more.
  • the content of the bisphenol A type (meth)acrylic acid compound is 70% by mass or less, 65% by mass or less, 60% by mass or less, 55% by mass or less, 50% by mass or less, 45% by mass or less, 40% by mass or less, or , 35% by mass or less. From these viewpoints, the content of the bisphenol A type (meth)acrylic acid compound is 1 to 70% by mass, 10 to 70% by mass, 20 to 70% by mass, 30 to 70% by mass, 1 to 50% by mass, 10 ⁇ 50% by weight, 20-50% by weight, 30-50% by weight, 1-40% by weight, 10-40% by weight, 20-40% by weight, or 30-40% by weight.
  • the content of the component (B) is based on the total solid content of the photosensitive resin composition, from the viewpoint of easily shortening the peeling time of the cured part, and from the viewpoint of easily obtaining excellent sensitivity, resolution and adhesion. It may be in the following range.
  • the content of component (B) may be 10% by mass or more, 15% by mass or more, 20% by mass or more, 25% by mass or more, 30% by mass or more, 35% by mass or more, or 40% by mass or more.
  • the content of component (B) is 90% by mass or less, 80% by mass or less, 70% by mass or less, 65% by mass or less, 60% by mass or less, 55% by mass or less, 50% by mass or less, or 45% by mass or less.
  • component (B) is 10 to 90% by mass, 20 to 90% by mass, 30 to 90% by mass, 40 to 90% by mass, 10 to 70% by mass, 20 to 70% by mass, 30-70% by weight, 40-70% by weight, 10-50% by weight, 20-50% by weight, 30-50% by weight, or 40-50% by weight.
  • the content of component (B) is from the viewpoint of easily shortening the peeling time of the cured part, and from the viewpoint of easily obtaining excellent sensitivity, resolution and adhesion, the total amount of component (A) and component (B) is 100. It may be in the following range with respect to parts by mass.
  • the content of component (B) may be 10 parts by mass or more, 20 parts by mass or more, 25 parts by mass or more, 30 parts by mass or more, 35 parts by mass or more, or 40 parts by mass or more.
  • the content of component (B) may be 90 parts by mass or less, 80 parts by mass or less, 70 parts by mass or less, 60 parts by mass or less, 55 parts by mass or less, 50 parts by mass or less, or 45 parts by mass or less.
  • component (B) is 10 to 90 parts by mass, 20 to 90 parts by mass, 30 to 90 parts by mass, 40 to 90 parts by mass, 10 to 70 parts by mass, 20 to 70 parts by mass, 30 to 70 parts by weight, 40 to 70 parts by weight, 10 to 50 parts by weight, 20 to 50 parts by weight, 30 to 50 parts by weight, or 40 to 50 parts by weight.
  • the photosensitive resin composition according to this embodiment contains a photopolymerization initiator as the (C) component.
  • Component (C) includes hexaarylbiimidazole compounds; benzophenone, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-1-butanone, 2-(dimethylamino)-2-[(4- methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone, 4-(2-hydroxyethoxy)phenyl-2-(hydroxy-2-propyl)ketone, 2-methyl-1- Aromatic ketones such as [4-(methylthio)phenyl]-2-morpholino-propanone-1; quinone compounds such as alkylanthraquinone; benzoin ether compounds such as benzoin alkyl ether; benzoin compounds such as benzoin and alkylbenzoin; benzyl derivatives such as; bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide; bis(2,6-dimethylbenzoyl)-2
  • the (C) component may contain a hexaarylbiimidazole compound from the viewpoint of easily shortening the peeling time of the cured portion and from the viewpoint of easily obtaining excellent sensitivity, resolution and adhesion.
  • the aryl group in the hexaarylbiimidazole compound may be a phenyl group or the like.
  • a hydrogen atom bonded to an aryl group in the hexaarylbiimidazole compound may be substituted with a halogen atom (such as a chlorine atom).
  • the hexaarylbiimidazole compound may be a 2,4,5-triarylimidazole dimer.
  • 2,4,5-triarylimidazole dimer examples include 2-(o-chlorophenyl)-4,5-diphenylimidazole dimer, 2-(o-chlorophenyl)-4,5-bis-(m- methoxyphenyl)imidazole dimer, 2-(p-methoxyphenyl)-4,5-diphenylimidazole dimer, and the like.
  • the hexaarylbiimidazole compound is 2-(o-chlorophenyl)-4,5-diphenylimidazole from the viewpoint of easily shortening the peeling time of the cured part and from the viewpoint of easily obtaining excellent sensitivity, resolution and adhesion.
  • Dimers may be included and may include 2,2'-bis(o-chlorophenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole.
  • the content of the hexaarylbiimidazole compound is 50 based on the total amount of the component (C) from the viewpoint of easily shortening the peeling time of the cured part and from the viewpoint of easily obtaining excellent sensitivity, resolution and adhesion. % by mass or more, more than 50% by mass, 70% by mass or more, 90% by mass or more, 95% by mass or more, 98% by mass or more, 99% by mass or more, or substantially 100% by mass (component (C) is substantially and a hexaarylbiimidazole compound).
  • the content of component (C) is based on the total solid content of the photosensitive resin composition, from the viewpoint of easily shortening the peeling time of the cured part, and from the viewpoint of easily obtaining excellent sensitivity, resolution and adhesion. It may be in the following range.
  • the content of component (C) is 0.1% by mass or more, 0.5% by mass or more, 1% by mass or more, 2% by mass or more, 3% by mass or more, 4% by mass or more, 5% by mass or more, or It may be 5.5% by mass or more.
  • the content of component (C) may be 20% by mass or less, 15% by mass or less, 12% by mass or less, 10% by mass or less, 8% by mass or less, 7% by mass or less, or 6% by mass or less. From these viewpoints, the content of component (C) may be 0.1 to 20% by mass, 1 to 10% by mass, or 3 to 8% by mass.
  • the content of component (C) is, from the viewpoint of easily shortening the peeling time of the cured part, and from the viewpoint of easily obtaining excellent sensitivity, resolution and adhesion, the total amount of component (A) and component (B) is 100. It may be in the following range with respect to parts by mass.
  • the content of component (C) is 0.1 parts by mass or more, 0.5 parts by mass or more, 1 part by mass or more, 2 parts by mass or more, 3 parts by mass or more, 4 parts by mass or more, 5 parts by mass or more. It may be 5 parts by mass or more, or 6 parts by mass or more.
  • the content of component (C) may be 20 parts by mass or less, 15 parts by mass or less, 12 parts by mass or less, 10 parts by mass or less, 8 parts by mass or less, 7 parts by mass or less, or 6 parts by mass or less. From these viewpoints, the content of component (C) may be 0.1 to 20 parts by mass, 1 to 10 parts by mass, or 3 to 8 parts by mass.
  • the photosensitive resin composition according to the present embodiment contains a hydrogen donor (excluding compounds corresponding to component (A), component (B), or component (C)) as component (D).
  • Hydrogen donors include bis[4-(dimethylamino)phenyl]methane, bis[4-(diethylamino)phenyl]methane, leucocrystal violet, N-phenylglycine and the like.
  • the content of component (D) is from the viewpoint of easily shortening the peeling time of the cured part, and from the viewpoint of easily obtaining excellent sensitivity, resolution and adhesion, the total amount of component (A) and component (B) is 100. It may be in the following range with respect to parts by mass.
  • the content of component (D) may be 0.1 parts by mass or more, 0.2 parts by mass or more, 0.3 parts by mass or more, 0.4 parts by mass or more, or 0.5 parts by mass or more.
  • the content of component (D) is 5 parts by mass or less, 3 parts by mass or less, 2 parts by mass or less, 1.5 parts by mass or less, 1 mass part or less, 0.8 parts by mass or less, 0.7 parts by mass or less, Alternatively, it may be 0.5 parts by mass or less. From these viewpoints, the content of component (D) may be 0.1 to 5 parts by mass, 0.2 to 1 part by mass, or 0.3 to 0.8 parts by mass.
  • the photosensitive resin composition according to this embodiment may contain an anthracene compound as the (E) component.
  • the (E) component can be used as an anthracene-based sensitizer (photosensitizer).
  • Component (E) includes 9,10-dibutoxyanthracene, 9,10-diphenylanthracene, 9,10-diethoxyanthracene and the like.
  • the (E) component may contain 9,10-dibutoxyanthracene from the viewpoint of easily shortening the peeling time of the cured portion and from the viewpoint of easily obtaining excellent sensitivity, resolution and adhesion.
  • the content of the component is based on the total solid content of the photosensitive resin composition, from the viewpoint of easily shortening the peeling time of the cured part, and from the viewpoint of easily obtaining excellent sensitivity, resolution and adhesion. It may be in the following range.
  • the content of component (E) is 0.01% by mass or more, 0.05% by mass or more, 0.1% by mass or more, 0.2% by mass or more, 0.3% by mass or more, 0.4% by mass or more , 0.5% by mass or more, or 0.55% by mass or more.
  • component (E) is 5% by mass or less, 3% by mass or less, 2% by mass or less, 1.5% by mass or less, 1% by mass or less, less than 1% by mass, 0.8% by mass or less, 0.8% by mass or less. It may be 7% by mass or less, or 0.6% by mass or less.
  • the content of component (E) is 0.01 to 5% by mass, 0.1 to 5% by mass, 0.3 to 5% by mass, 0.5 to 5% by mass, 0.01 to 1% by mass, 0.1 to 1% by mass, 0.3 to 1% by mass, 0.5 to 1% by mass, 0.01% by mass or more and less than 1% by mass, 0.1% by mass or more and less than 1% by mass, 0.3% by mass or more and less than 1% by mass, 0.5% by mass or more and less than 1% by mass, 0.01 to 0.8% by mass, 0.1 to 0.8% by mass, 0.3 to 0.8% by mass %, or 0.5 to 0.8 mass %.
  • the content of component (E) is from the viewpoint of easily shortening the peeling time of the cured part, and from the viewpoint of easily obtaining excellent sensitivity, resolution and adhesion, the total amount of component (A) and component (B) is 100. It may be in the following range with respect to parts by mass.
  • the content of component (E) is 0.01 parts by mass or more, 0.05 parts by mass or more, 0.1 parts by mass or more, 0.2 parts by mass or more, 0.3 parts by mass or more, 0.4 parts by mass or more , 0.5 parts by mass or more, 0.6 parts by mass or more, or 0.65 parts by mass or more.
  • component (E) is 5 parts by mass or less, 3 parts by mass or less, 2 parts by mass or less, 1.5 parts by mass or less, 1 part by mass or less, less than 1 part by mass, or 0.8 parts by mass or less, or It may be 0.7 parts by mass or less.
  • component (E) is 0.01 to 5 parts by mass, 0.1 to 5 parts by mass, 0.3 to 5 parts by mass, 0.5 to 5 parts by mass, 0.01 to 1 part by mass, 0.1 to 1 part by mass, 0.3 to 1 part by mass, 0.5 to 1 part by mass, 0.01 part by mass or more and less than 1 part by mass, 0.1 part by mass or more and less than 1 part by mass, 0.3 parts by mass or more and less than 1 part by mass, 0.5 parts by mass or more and less than 1 part by mass, 0.01 to 0.8 parts by mass, 0.1 to 0.8 parts by mass, 0.3 to 0.8 parts by mass parts, or 0.5 to 0.8 parts by mass.
  • the photosensitive resin composition according to this embodiment may contain a polymerization inhibitor as the (F) component.
  • the component (F) suppresses polymerization in unexposed areas during resist pattern formation, and tends to improve resolution.
  • Polymerization inhibitors include t-butylcatechol (eg 4-t-butylcatechol), hindered amines (eg 2,2,6,6-tetramethyl-4-hydroxypiperidine-1-oxyl), 4-hydroxy-2, 2,6,6-tetramethylpiperidine-N-oxyl and the like.
  • the content of component (F) may be within the following range with respect to 100 parts by mass of the total amount of components (A) and (B). From the viewpoint of easily obtaining excellent sensitivity and resolution, the content of component (F) is 0.001 parts by mass or more, 0.003 parts by mass or more, 0.005 parts by mass or more, 0.01 parts by mass or more, It may be 0.015 parts by mass or more, 0.02 parts by mass or more, or 0.025 parts by mass or more.
  • the content of component (F) is 0.1 parts by mass or less, 0.05 parts by mass or less, 0.04 parts by mass or less, or 0.03 parts by mass or less from the viewpoint of easily obtaining excellent sensitivity and adhesion. can be From these viewpoints, the content of component (F) may be 0.001 to 0.1 parts by mass, 0.005 to 0.05 parts by mass, or 0.01 to 0.04 parts by mass.
  • the photosensitive resin composition according to this embodiment may contain an organic solvent.
  • Organic solvents include methanol, ethanol, acetone, methyl ethyl ketone, methyl cellosolve, ethyl cellosolve, toluene, N,N-dimethylformamide, propylene glycol monomethyl ether and the like.
  • the photosensitive resin composition according to this embodiment may contain components other than the components described above.
  • Other ingredients include dyes (malachite green, etc.), photosensitizers (excluding anthracene compounds), tribromophenylsulfone, photocoloring agents, thermal coloration inhibitors, plasticizers (p-toluenesulfonamide, etc.), and pigments. , fillers, antifoaming agents, flame retardants, stabilizers (light stabilizers, etc.), adhesion imparting agents, leveling agents, peeling accelerators, antioxidants, fragrances, imaging agents, thermal cross-linking agents, and the like.
  • the content of aluminum powder (aluminum particles), the content of aluminum alloy powder (alloy powder containing aluminum; aluminum alloy particles), or the sum of aluminum powder and aluminum alloy powder The amount is 20% by mass or less, less than 20% by mass, 10% by mass or less, 1% by mass or less, 0.1% by mass or less, 0.01% by mass or less, based on the total solid content of the photosensitive resin composition, Alternatively, it may be substantially 0% by mass.
  • the photosensitive resin composition according to this embodiment may not contain at least one selected from the group consisting of aluminum powder (aluminum particles) and aluminum alloy powder (aluminum alloy particles).
  • a photosensitive element according to this embodiment includes a support and a photosensitive resin layer disposed on the support, and the photosensitive resin layer contains the photosensitive resin composition according to this embodiment.
  • the photosensitive element according to this embodiment may comprise a protective layer disposed on the photosensitive resin layer.
  • the photosensitive element according to this embodiment may comprise a cushion layer, an adhesive layer, a light absorbing layer, a gas barrier layer, and the like.
  • the photosensitive element may be in the form of a sheet, or in the form of a photosensitive element roll wound around a core.
  • FIG. 1 is a schematic cross-sectional view showing an example of a photosensitive element.
  • a photosensitive element 1 includes a support (support film) 2, a photosensitive resin layer 3 disposed on the support 2, and a protective layer ( protective film) 4;
  • the photosensitive resin layer 3 is made of the photosensitive resin composition according to this embodiment.
  • the photosensitive element 1 can be obtained, for example, by the following procedure.
  • the photosensitive resin layer 3 is formed on the support 2 .
  • the photosensitive resin layer 3 can be formed, for example, by drying a coating layer formed by applying a photosensitive resin composition containing an organic solvent.
  • a protective layer 4 is arranged on the photosensitive resin layer 3 .
  • Each of the support and the protective layer may be a polymer film having heat resistance and solvent resistance, such as a polyester film (polyethylene terephthalate film, etc.), a polyolefin film (polyethylene film, polypropylene film, etc.), a hydrocarbon-based polymer (polyolefin film, etc.). excluding film).
  • the type of film forming the protective layer and the type of film forming the support may be the same or different.
  • the thickness of the support may be 1 ⁇ m or more, 5 ⁇ m or more, 10 ⁇ m or more, or 15 ⁇ m or more from the viewpoint of easily suppressing damage to the support when the support is peeled off from the photosensitive resin layer.
  • the thickness of the support may be 100 ⁇ m or less, 50 ⁇ m or less, 30 ⁇ m or less, or 20 ⁇ m or less from the viewpoint of favorable exposure when exposed through the support. From these points of view, the thickness of the support may be 1 to 100 ⁇ m.
  • the thickness of the protective layer is 1 ⁇ m or more, 5 ⁇ m or more, 10 ⁇ m or more, or It may be 15 ⁇ m or more.
  • the thickness of the protective layer may be 100 ⁇ m or less, 50 ⁇ m or less, or 30 ⁇ m or less from the viewpoint of easily improving productivity. From these points of view, the protective layer may have a thickness of 1 to 100 ⁇ m.
  • the thickness of the photosensitive resin layer (the thickness after drying; when the photosensitive resin composition contains an organic solvent, the thickness after volatilizing the organic solvent) may be within the following range.
  • the thickness of the photosensitive resin layer is 1 ⁇ m or more, 5 ⁇ m or more, 10 ⁇ m or more, 15 ⁇ m or more, 20 ⁇ m or more, or 25 ⁇ m or more from the viewpoint of easy coating of the photosensitive resin composition and easy improvement of productivity.
  • the thickness of the photosensitive resin layer may be 100 ⁇ m or less, 50 ⁇ m or less, 40 ⁇ m or less, 30 ⁇ m or less, or 25 ⁇ m or less from the viewpoint of easily obtaining excellent adhesion and resolution.
  • the thickness of the photosensitive resin layer is 1 to 100 ⁇ m, 5 to 100 ⁇ m, 10 to 100 ⁇ m, 20 to 100 ⁇ m, 1 to 50 ⁇ m, 5 to 50 ⁇ m, 10 to 50 ⁇ m, 20 to 50 ⁇ m, 1 to 30 ⁇ m, It may be 5-30 ⁇ m, 10-30 ⁇ m, or 20-30 ⁇ m.
  • the method for producing a laminate according to the present embodiment includes a photosensitive resin layer placement step of placing a photosensitive resin layer on a substrate (for example, a substrate) using the photosensitive resin composition or the photosensitive element according to the present embodiment. Then, an exposure step of photocuring (exposing) a portion of the photosensitive resin layer, a developing step of removing the uncured portion (unexposed portion) of the photosensitive resin layer to form a cured product pattern, and a substrate and a metal layer forming step of forming a metal layer on at least a portion of the portion where the cured product pattern is not formed.
  • the laminate according to this embodiment is obtained by the method for producing a laminate according to this embodiment, and may be a wiring board (for example, a printed wiring board).
  • the laminate according to the present embodiment includes a substrate, a cured product pattern (cured product according to the present embodiment) arranged on the substrate, and at least one part of the substrate where the cured product pattern is not formed. and a metal layer disposed on the part.
  • a photosensitive resin layer made of the photosensitive resin composition according to the present embodiment is placed on the substrate.
  • the photosensitive resin layer may be formed by applying and drying a photosensitive resin composition on a substrate, and after removing the protective layer from the photosensitive element, heating the photosensitive resin layer of the photosensitive element. It may be formed by pressing against the base material while holding.
  • an actinic ray is irradiated with a mask placed on the photosensitive resin layer, and a region other than the region where the mask is placed in the photosensitive resin layer may be exposed and photocured. Instead, a part of the photosensitive resin layer may be exposed and photocured by irradiating actinic rays in a desired pattern by a direct drawing exposure method such as an LDI exposure method or a DLP exposure method.
  • an ultraviolet light source or a visible light source may be used, and carbon arc lamps, mercury vapor arc lamps, high pressure mercury lamps, ultra-high pressure mercury lamps, xenon lamps, gas lasers (argon lasers, etc.), solid-state lasers (YAG lasers, etc.). , and semiconductor lasers.
  • the development method in the development process may be, for example, wet development or dry development.
  • Wet development can be carried out by using a developer corresponding to the photosensitive resin composition, for example, by dipping, puddle, spraying, brushing, slapping, scrubbing, rocking immersion, and the like.
  • the developer is appropriately selected according to the constitution of the photosensitive resin composition, and may be an alkaline developer or an organic solvent developer.
  • Alkaline developers include alkali hydroxides such as lithium, sodium or potassium hydroxide; alkali carbonates such as lithium, sodium, potassium or ammonium carbonates or bicarbonates; alkali metals such as potassium phosphate and sodium phosphate. Phosphates; alkali metal pyrophosphates such as sodium pyrophosphate and potassium pyrophosphate; borax; sodium metasilicate; tetramethylammonium hydroxide; ethanolamine; ethylenediamine; diethylenetriamine; It may be an aqueous solution containing a base such as 3-propanediol; 1,3-diamino-2-propanol; morpholine.
  • alkali hydroxides such as lithium, sodium or potassium hydroxide
  • alkali carbonates such as lithium, sodium, potassium or ammonium carbonates or bicarbonates
  • alkali metals such as potassium phosphate and sodium phosphate.
  • Phosphates alkali metal pyrophosphates such as sodium
  • the organic solvent developer may contain organic solvents such as 1,1,1-trichloroethane, N-methylpyrrolidone, N,N-dimethylformamide, cyclohexanone, methylisobutylketone and ⁇ -butyrolactone.
  • organic solvents such as 1,1,1-trichloroethane, N-methylpyrrolidone, N,N-dimethylformamide, cyclohexanone, methylisobutylketone and ⁇ -butyrolactone.
  • the metal layer in the metal layer forming step may be, for example, a metal copper layer.
  • the metal layer can be formed by plating, for example.
  • the plating treatment may be one or both of electrolytic plating treatment and electroless plating treatment.
  • the method for manufacturing a laminate according to the present embodiment includes a step of further curing the resist pattern by heating at 60 to 250° C. or exposing at 0.2 to 10 J/cm 2 after the developing step. you can
  • the method for manufacturing a laminate according to this embodiment may include a step of removing the cured product pattern after the metal layer forming step.
  • the cured product pattern can be removed by, for example, developing with a strong alkaline aqueous solution by an immersion method, a spray method, or the like.
  • FIG. 2 is a schematic diagram showing an example of a method for manufacturing a laminate (method for manufacturing a wiring board).
  • the conductor layer 10b may be, for example, a metallic copper layer.
  • the photosensitive resin layer 12 is arranged on the conductor layer 10b of the substrate 10 (photosensitive resin layer arrangement step).
  • the photosensitive resin layer arranging step the photosensitive resin layer 12 is arranged on the conductor layer 10b of the substrate 10 using the photosensitive resin composition or the photosensitive element according to the present embodiment.
  • actinic rays L are irradiated with the mask 14 placed on the photosensitive resin layer 12, and the area of the photosensitive resin layer 12 other than the area where the mask 14 is placed is exposed. is exposed to photocure.
  • a resist pattern 12a made of (a cured product of a photosensitive resin layer) is formed.
  • a wiring layer (metal layer) 16 is formed on a portion of the conductor layer 10b of the substrate 10 where the resist pattern 12a is not formed.
  • the wiring layer 16 may be made of the same material as the conductor layer 10b, or may be made of a different material.
  • the conductor layer 10c is formed by removing the resist pattern 12a and removing the conductor layer 10b provided at the position corresponding to the resist pattern 12a.
  • the wiring substrate 18 including the conductor layer 10c and the wiring layer 16 arranged on the insulating layer 10a is obtained.
  • the conductor layer 10b can be removed by an etching process.
  • the etching solution is appropriately selected according to the type of the conductor layer 10b, and may be, for example, a cupric chloride solution, a ferric chloride solution, an alkaline etching solution, a hydrogen peroxide etching solution, or the like.
  • Solution (a) by mixing 27 parts by mass of methacrylic acid, 3 parts by mass of 2-hydroxyethyl methacrylate, 20 parts by mass of benzyl methacrylate, 50 parts by mass of styrene, and 0.9 parts by mass of azobisisobutyronitrile was prepared.
  • a solution (b) was prepared by dissolving 0.5 parts by mass of azobisisobutyronitrile in 50 parts by mass of a mixture of 30 parts by mass of methyl cellosolve and 20 parts by mass of toluene.
  • the temperature of the solution in the flask was raised to 90°C over 30 minutes, and the temperature was maintained at 90°C for 2 hours, then stirring was stopped and the solution was cooled to room temperature (25°C) to obtain a binder polymer solution.
  • the non-volatile content (solid content) of the binder polymer solution was 56% by mass.
  • the acid value of the binder polymer was 176 mgKOH/g.
  • the acid value was measured by the following procedure. First, 1 g of a binder polymer whose acid value is to be measured was accurately weighed, and then 30 g of acetone was added to the binder polymer to uniformly dissolve the binder polymer to obtain a solution. Then, after adding an appropriate amount of phenolphthalein as an indicator to the solution, titration was performed using a 0.1N KOH (potassium hydroxide) aqueous solution. The acid value was obtained by calculating the mass (unit: mg) of KOH required to neutralize the acetone solution of the binder polymer.
  • the binder polymer had a weight average molecular weight (Mw) of 35,000 and a number average molecular weight (Mn) of 16,000.
  • Mw weight average molecular weight
  • Mn number average molecular weight
  • the weight-average molecular weight and number-average molecular weight were measured by gel permeation chromatography (GPC) under the following conditions and derived by conversion using a standard polystyrene calibration curve.
  • ⁇ Preparation of photosensitive resin composition> 100 parts by mass of the binder polymer solution described above (binder polymer (non-volatile): 56 parts by mass), EO-modified ditrimethylolpropane tetramethacrylate (EO group: 4 (total value), molecular weight: 698, manufactured by Toho Chemical Industry Co., Ltd.
  • Example 2 EO-modified ditrimethylolpropane tetramethacrylate (EO groups: 4 (total value)) was changed to EO-modified ditrimethylolpropane tetramethacrylate (EO groups: 12 (total value), molecular weight: 1050, manufactured by Toho Chemical Industry Co., Ltd.)
  • a photosensitive resin composition was prepared in the same manner as in Example 1 except for
  • Example 3 EO-modified ditrimethylolpropane tetramethacrylate (EO group: 4 (total value)) was changed to EO-modified ditrimethylolpropane tetramethacrylate (EO group: 20 (total value), molecular weight: 1402, manufactured by Toho Chemical Industry Co., Ltd.)
  • a photosensitive resin composition was prepared in the same manner as in Example 1 except for
  • Example 4 EO-modified ditrimethylolpropane tetramethacrylate (EO group: 4 (total value)) was changed to PO-modified ditrimethylolpropane tetramethacrylate (PO group: 20 (total value), molecular weight: 1762, manufactured by Toho Chemical Industry Co., Ltd.)
  • a photosensitive resin composition was prepared in the same manner as in Example 1 except for
  • Example 5 EO-modified ditrimethylolpropane tetramethacrylate (EO group: 4 (total value)) (EO) (PO)-modified ditrimethylolpropane tetramethacrylate (EO group: 12 (total value), PO group: 8 (total value), Toho A photosensitive resin composition was prepared in the same manner as in Example 1, except that the resin was changed to (manufactured by Kagaku Kogyo Co., Ltd.).
  • EO-modified ditrimethylolpropane tetramethacrylate (EO group: 4 (total value)) was changed to EO-modified bisphenol A dimethacrylate (molecular weight: 1686, manufactured by Miwon, trade name: Miramer M2301), and the amount of BCIM used was changed to 5 mass. parts, the amount of 4-t-butylcatechol used was changed to 0.01 parts by mass, and the amount of malachite green used was changed to 0.01 parts by mass.
  • a photosensitive resin composition was prepared.
  • (Comparative example 2) EO-modified ditrimethylolpropane tetramethacrylate (EO group: 4 (total value)) to 2,2-bis(4-(methacryloxyethoxypropoxy)phenyl)propane (ethylene oxide average 12 mol and propylene oxide average 4 mol adduct, molecular weight: 1125, Showa Denko Materials Co., Ltd., trade name: FA-3200MY), the amount of BCIM used was changed to 5 parts by mass, and the amount of 4-t-butylcatechol used was changed to 0.01 parts by mass.
  • a photosensitive resin composition was prepared in the same manner as in Example 1, except that the amount of malachite green used was changed to 0.01 part by mass.
  • a polyethylene terephthalate film (manufactured by Toray Industries, Inc., trade name "FS-31") having a thickness of 16 ⁇ m was prepared as a support. After coating the above-mentioned photosensitive resin composition on the support so that the thickness is uniform, the photosensitive resin layer (thickness after drying) is obtained by sequentially drying in a hot air convection dryer at 80 ° C. thickness: 25 ⁇ m).
  • a polyethylene film manufactured by Tamapoly Co., Ltd., trade name "NF-15" was laminated as a protective layer to this photosensitive resin layer to obtain a photosensitive element comprising a support, a photosensitive resin layer and a protective layer in this order. .
  • a copper clad laminate (substrate, manufactured by Showa Denko Materials Co., Ltd., trade name: MCL-E-67) provided with copper foil (thickness: 35 ⁇ m) arranged on both sides of a glass epoxy material is subjected to pickling and After washing with water, it was dried in an air stream.
  • the photosensitive A laminate comprising a flexible resin layer and a support in this order was obtained.
  • Lamination was carried out using heat rolls at 110° C. at a pressure of 0.4 MPa and a roll speed of 1.0 m/min.
  • sensitivity After placing a 41-stage step tablet (manufactured by Showa Denko Materials Co., Ltd.) on the support of the above laminate, a direct exposure machine (manufactured by Via Mechanics Co., Ltd., (trade name: DE-1UH), the photosensitive resin layer was exposed through the support at an exposure amount (irradiation energy amount) such that the number of steps remaining after development of the 41-step tablet was 15 steps.
  • the sensitivity (photosensitivity) was evaluated based on the amount of exposure (unit: mJ/cm 2 ) at this time. Table 1 shows the results. It means that the lower the exposure amount, the better the sensitivity.
  • the support After exposure, the support is peeled off from the laminate to expose the photosensitive resin layer, and an unexposed area is removed by spraying a 1.0% by mass sodium carbonate aqueous solution at 30° C. for twice the minimum development time. Removed. After development, the space portion (unexposed portion) is removed without residue, and the line portion (exposed portion) is formed without meandering or chipping. evaluated. Table 1 shows the results. A smaller value means better resolution.
  • the above minimum development time was evaluated in advance by the following procedure. First, after cutting the laminate into a rectangular shape (12.5 cm ⁇ 4 cm), the support was peeled off to obtain a test piece. Next, the unexposed photosensitive resin layer in the test piece is spray-developed at a pressure of 0.18 MPa using a 1.0% by mass sodium carbonate aqueous solution at 30° C., and the unexposed photosensitive resin layer is completely removed. The minimum development time (MD) was obtained as the shortest time at which the development was visually confirmed.
  • MD minimum development time
  • the support After exposure, the support is peeled off from the laminate to expose the photosensitive resin layer, and an unexposed area is removed by spraying a 1.0% by mass sodium carbonate aqueous solution at 30° C. for twice the minimum development time. Removed. After development, the space portion (unexposed portion) is removed without residue, and the line portion (exposed portion) is formed without meandering or chipping. did. Table 1 shows the results. A smaller value means better adhesion.
  • the photosensitive resin layer was exposed by peeling the support from the laminate. Then, a test sample was obtained by developing in the same manner as in the evaluation of resolution described above. Next, the test piece was immersed in a 3.0% by mass NaOH aqueous solution heated to 50° C. in a constant temperature bath, and the peeling time until the photosensitive resin layer after development was completely peeled off (removed). was measured. Table 1 shows the results. It means that the shorter the peeling time, the better the peeling properties.

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Laminated Bodies (AREA)

Abstract

L'invention concerne une composition de résine photosensible qui contient un polymère liant, un composé photopolymérisable, un initiateur de photopolymérisation et un donneur d'hydrogène, le composé photopolymérisable contenant un composé ayant un squelette ditriméthylolpropane. Un élément photosensible 1 est équipé d'un corps de support 2 et d'une couche de résine photosensible 3 positionnée sur le corps de support 2, la couche de résine photosensible 3 contenant la composition de résine photosensible susmentionnée.
PCT/JP2022/011565 2021-03-24 2022-03-15 Composition de résine photosensible, élément photosensible et procédé de production d'un corps stratifié WO2022202485A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2022561081A JP7287581B2 (ja) 2021-03-24 2022-03-15 感光性樹脂組成物、感光性エレメント、及び、積層体の製造方法
CN202280004068.XA CN117043677A (zh) 2021-03-24 2022-03-15 感光性树脂组合物、感光性元件及层叠体的制造方法
KR1020227038216A KR20230161863A (ko) 2021-03-24 2022-03-15 감광성 수지 조성물, 감광성 엘리먼트, 및, 적층체의 제조 방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021050122 2021-03-24
JP2021-050122 2021-03-24

Publications (1)

Publication Number Publication Date
WO2022202485A1 true WO2022202485A1 (fr) 2022-09-29

Family

ID=83397235

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2022/011565 WO2022202485A1 (fr) 2021-03-24 2022-03-15 Composition de résine photosensible, élément photosensible et procédé de production d'un corps stratifié

Country Status (5)

Country Link
JP (1) JP7287581B2 (fr)
KR (1) KR20230161863A (fr)
CN (1) CN117043677A (fr)
TW (1) TW202244078A (fr)
WO (1) WO2022202485A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010061042A (ja) * 2008-09-05 2010-03-18 Fujifilm Corp 平版印刷版の作製方法
JP2016071379A (ja) * 2014-09-30 2016-05-09 富士フイルム株式会社 感光性組成物、硬化膜の製造方法、硬化膜、液晶表示装置、有機エレクトロルミネッセンス表示装置、タッチパネル及びタッチパネル表示装置
WO2018061707A1 (fr) * 2016-09-29 2018-04-05 富士フイルム株式会社 Procédé de fabrication d'un panneau tactile
WO2021192058A1 (fr) * 2020-03-24 2021-09-30 昭和電工マテリアルズ株式会社 Composition de résine photosensible, élément photosensible et procédé de production de carte de câblage

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8105759B2 (en) 2005-07-05 2012-01-31 Hitachi Chemical Company, Ltd. Photosensitive resin composition, and, photosensitive element, method for forming resist pattern, method for manufacturing printed wiring board and method for manufacturing partition wall for plasma display panel using the composition

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010061042A (ja) * 2008-09-05 2010-03-18 Fujifilm Corp 平版印刷版の作製方法
JP2016071379A (ja) * 2014-09-30 2016-05-09 富士フイルム株式会社 感光性組成物、硬化膜の製造方法、硬化膜、液晶表示装置、有機エレクトロルミネッセンス表示装置、タッチパネル及びタッチパネル表示装置
WO2018061707A1 (fr) * 2016-09-29 2018-04-05 富士フイルム株式会社 Procédé de fabrication d'un panneau tactile
WO2021192058A1 (fr) * 2020-03-24 2021-09-30 昭和電工マテリアルズ株式会社 Composition de résine photosensible, élément photosensible et procédé de production de carte de câblage

Also Published As

Publication number Publication date
JP7287581B2 (ja) 2023-06-06
TW202244078A (zh) 2022-11-16
CN117043677A (zh) 2023-11-10
KR20230161863A (ko) 2023-11-28
JPWO2022202485A1 (fr) 2022-09-29

Similar Documents

Publication Publication Date Title
JP5626428B2 (ja) 感光性樹脂組成物、並びにこれを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP5327310B2 (ja) 感光性樹脂組成物、並びにこれを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
WO2023074629A1 (fr) Composition de résine photosensible, élément photosensible, et procédé de fabrication de stratifié
WO2022191127A1 (fr) Film photosensible, élément photosensible et procédé de production de stratifié
JP7058336B2 (ja) 光増感剤、感光性樹脂組成物、感光性エレメント、及び配線基板の製造方法
JP5532551B2 (ja) 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
WO2021193232A1 (fr) Composition de résine photosensible, élément photosensible et procédé de production de carte de câblage
JP2017040710A (ja) 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
WO2022202485A1 (fr) Composition de résine photosensible, élément photosensible et procédé de production d'un corps stratifié
JP2004326084A (ja) 感光性エレメント、これを用いたレジストパターンの形成方法及びプリント配線板の製造方法
WO2023058600A1 (fr) Composition de résine photosensible, élément photosensible et procédé de production d'un corps stratifié
WO2016043162A1 (fr) Composition de résine photosensible, élément photosensible, méthode de production de substrat avec un motif de résist et procédé de production de carte de câblage imprimé
WO2024142487A1 (fr) Composition de résine photosensible, élément photosensible et procédé de production de carte de câblage
WO2023136105A1 (fr) Composition de résine photosensible, élément photosensible et procédé de production de stratifié
WO2023012985A1 (fr) Film photosensible, élément photosensible et procédé de production d'un corps multicouche
WO2024142486A1 (fr) Élément photosensible et procédé de production de carte de circuit imprimé
WO2024195502A1 (fr) Composition de résine photosensible, élément photosensible, procédé de formation de motif de réserve et procédé de production de carte de circuit imprimé
WO2024210041A1 (fr) Composition de résine photosensible, élément photosensible, procédé de formation de motif de réserve, et procédé de production de carte de circuit imprimé
WO2024134889A1 (fr) Composition de résine photosensible, élément photosensible, procédé de formation de motif de réserve, et procédé de production de carte de circuit imprimé
WO2024190470A1 (fr) Composition de résine photosensible, élément photosensible, produit durci, procédé de formation de motif de résine photosensible, et procédé de fabrication de carte de circuit imprimé
WO2023238299A1 (fr) Résine soluble dans les alcalis, composition de résine photosensible, élément photosensible, procédé de formation de motif de réserve, et procédé de production de carte de circuit imprimé
JP2004151257A (ja) 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法

Legal Events

Date Code Title Description
ENP Entry into the national phase

Ref document number: 2022561081

Country of ref document: JP

Kind code of ref document: A

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 22775275

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 202280004068.X

Country of ref document: CN

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 22775275

Country of ref document: EP

Kind code of ref document: A1