WO2023012985A1 - Film photosensible, élément photosensible et procédé de production d'un corps multicouche - Google Patents

Film photosensible, élément photosensible et procédé de production d'un corps multicouche Download PDF

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Publication number
WO2023012985A1
WO2023012985A1 PCT/JP2021/029189 JP2021029189W WO2023012985A1 WO 2023012985 A1 WO2023012985 A1 WO 2023012985A1 JP 2021029189 W JP2021029189 W JP 2021029189W WO 2023012985 A1 WO2023012985 A1 WO 2023012985A1
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Prior art keywords
mass
parts
less
component
content
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PCT/JP2021/029189
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English (en)
Japanese (ja)
Inventor
真生 成田
敬司 小野
志歩 田中
明子 武田
祐作 渡邉
Original Assignee
昭和電工マテリアルズ株式会社
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Application filed by 昭和電工マテリアルズ株式会社 filed Critical 昭和電工マテリアルズ株式会社
Priority to PCT/JP2021/029189 priority Critical patent/WO2023012985A1/fr
Priority to KR1020227035580A priority patent/KR20230154733A/ko
Priority to JP2022561676A priority patent/JPWO2022191125A1/ja
Priority to CN202280003952.1A priority patent/CN116848461A/zh
Priority to PCT/JP2022/009697 priority patent/WO2022191125A1/fr
Priority to US17/922,867 priority patent/US20230161248A1/en
Priority to EP22767081.7A priority patent/EP4307049A4/fr
Priority to TW111108374A priority patent/TW202307564A/zh
Publication of WO2023012985A1 publication Critical patent/WO2023012985A1/fr

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers

Definitions

  • the present disclosure relates to a photosensitive film, a photosensitive element, a laminate manufacturing method, and the like.
  • a resist pattern is formed to obtain desired wiring.
  • a resist pattern can be formed by exposing and developing a photosensitive film, which is a film-shaped photosensitive resin composition.
  • Various compositions have been studied as the photosensitive resin composition.
  • Patent Document 1 describes a photosensitive resin composition containing a binder polymer, a photopolymerizable compound, and a specific photopolymerization initiator.
  • the cured product pattern When forming a cured product pattern that can be used as a resist pattern using a photosensitive film, there is a case where the cured product pattern is formed while filling a recess (round hole) having a circular cross section with a photosensitive resin composition. be.
  • the cured product pattern is formed with voids in the recesses, and the followability (filling property) to the shape of the recesses may not be sufficient.
  • a photosensitive film having a thickness of 25 ⁇ m has been commonly used, there are cases where the thickness of the photosensitive film is required to be reduced to 20 ⁇ m or less for the purpose of reducing the thickness of the laminate.
  • the thickness of the photosensitive film is reduced in this way, the amount of the photosensitive resin composition for filling the concave portions is reduced, so that the cured product pattern is likely to be formed with voids in the concave portions. . Therefore, even when the thickness is 20 ⁇ m or less, the photosensitive film is required to have excellent conformability to concave portions having a circular cross section.
  • An object of one aspect of the present disclosure is to provide a photosensitive film having a thickness of 20 ⁇ m or less, which has excellent followability to concave portions having a circular cross section. Another aspect of the present disclosure aims to provide a photosensitive element using the photosensitive film. Another aspect of the present disclosure aims to provide a method for producing a laminate using the photosensitive film or photosensitive element described above.
  • One aspect of the present disclosure contains (A) a binder polymer, (B) a photopolymerizable compound, (C) a photopolymerization initiator, and (D) a pyrazoline compound, and has a thickness of 20 ⁇ m or less. , on photosensitive films.
  • Such a photosensitive film has a thickness of 20 ⁇ m or less, it has excellent conformability to recesses having a circular cross section.
  • Another aspect of the present disclosure relates to a photosensitive element comprising a support and a photosensitive resin layer disposed on the support, wherein the photosensitive resin layer is the photosensitive film described above.
  • Another aspect of the present disclosure includes an arrangement step of arranging a photosensitive resin layer on a substrate using the above-described photosensitive film or the above-described photosensitive element, and photocuring a part of the photosensitive resin layer. and removing at least part of the uncured portion of the photosensitive resin layer to form a cured product pattern.
  • a photosensitive film having a thickness of 20 ⁇ m or less it is possible to provide a photosensitive film having excellent followability to concave portions having a circular cross section.
  • a photosensitive element using the photosensitive film it is possible to provide a method for producing a laminate using the photosensitive film or photosensitive element described above.
  • FIG. 1 is a schematic cross-sectional view showing an example of a photosensitive element
  • a or more in the numerical range means A and the range exceeding A.
  • a or less in a numerical range means A and a range less than A.
  • the upper limit value or lower limit value of the numerical range in one step can be arbitrarily combined with the upper limit value or lower limit of the numerical range in another step.
  • the upper or lower limits of the numerical ranges may be replaced with the values shown in the examples.
  • “A or B” may include either A or B, or may include both.
  • each component in the composition means the total amount of the plurality of substances present in the composition unless otherwise specified when there are multiple substances corresponding to each component in the composition.
  • layer includes not only a shape structure formed over the entire surface but also a shape structure formed partially when observed as a plan view.
  • process is included in the term not only as an independent process, but also as long as the intended action of the process is achieved even if it is not clearly distinguishable from other processes.
  • (Meth)acrylate means at least one of acrylate and its corresponding methacrylate. The same applies to other similar expressions such as "(meth)acrylic acid”.
  • An “alkyl group” may be linear, branched or cyclic, unless otherwise specified.
  • the solid content of the photosensitive resin composition refers to the non-volatile content excluding volatile substances (water, solvent, etc.) in the photosensitive resin composition. That is, the solid content refers to the components (components other than the solvent) that remain without volatilizing when the photosensitive resin composition dries, and includes components that are liquid, starch syrup-like, or wax-like at room temperature (25°C).
  • the photosensitive film according to the present embodiment contains (A) a binder polymer, (B) a photopolymerizable compound, (C) a photopolymerization initiator, and (D) a pyrazoline compound, and the photosensitive film is 20 ⁇ m or less.
  • the photosensitive film according to this embodiment is a film-like photosensitive resin composition, and can be obtained by molding the photosensitive resin composition according to this embodiment into a film.
  • the photosensitive resin composition according to this embodiment can contain the same ingredients as the photosensitive film according to this embodiment.
  • the photosensitive film according to the present embodiment has a thickness of 20 ⁇ m or less, it has a followability (a round hole followability, a filling property, and a ). According to the photosensitive film according to the present embodiment, followability of less than 20000 ⁇ m 2 (preferably 15000 ⁇ m 2 or less) can be obtained in the evaluation described in Examples.
  • the present inventors presume as follows about the factors by which the photosensitive film and the photosensitive resin composition according to the present embodiment provide excellent conformability.
  • the factors are not limited to the following contents. That is, by using component (D) when using component (A), component (B), and component (C) in combination, various physical properties (crystallinity, melting point, etc.) of component (D) can be adjusted to form recesses with circular cross-sections. It acts favorably in a thermal process (such as lamination) when laminating a photosensitive film on a substrate having the same.
  • the photosensitive film according to the present embodiment only needs to have excellent followability when laminated on a substrate having a concave portion with a circular cross section. You may laminate
  • linear line portions, linear space portions adjacent to the line portions may form a cured product pattern having.
  • excellent resolution is a characteristic that the line portion and the space portion are formed well.
  • excellent adhesion is required as a characteristic for good formation of line portions and space portions.
  • the photosensitive film or photosensitive resin composition according to the present embodiment excellent resolution can be obtained when forming a cured pattern having a space width smaller than the line width. According to the photosensitive film according to the present embodiment, a resolution of, for example, 15 ⁇ m or less can be obtained in the evaluation described in Examples.
  • adhesion can be obtained when forming a cured product pattern having a line width smaller than the space width.
  • adhesion of, for example, 10 ⁇ m or less can be obtained in the evaluation described in Examples.
  • the photosensitive film or photosensitive resin composition according to the present embodiment it is possible to reduce the minimum time for removing the unexposed areas, and to obtain excellent developability.
  • the photosensitive film and the photosensitive resin composition according to the present embodiment excellent sensitivity to actinic rays (before change over time) can be obtained.
  • an exposure dose of, for example, 105 mJ/cm 2 or less can be obtained in the evaluation described in Examples.
  • the photosensitive film and photosensitive resin composition according to the present embodiment are photocurable, and a cured product can be obtained by photocuring the photosensitive film or photosensitive resin composition.
  • the cured product according to this embodiment is a cured product (photocured product) of the photosensitive film or photosensitive resin composition according to this embodiment.
  • the cured product according to the present embodiment may be patterned (cured product pattern) or may be a resist pattern.
  • the shape of the cured product pattern that can be obtained from the photosensitive film and the photosensitive resin composition according to this embodiment is not particularly limited.
  • the thickness of the photosensitive film according to this embodiment may be 20 ⁇ m or less, and the thickness of the cured product according to this embodiment may be 20 ⁇ m or less.
  • the thickness of the photosensitive film and cured product according to the present embodiment is 1 ⁇ m or more, 3 ⁇ m or more, 5 ⁇ m or more, and 5 ⁇ m from the viewpoint of easily obtaining excellent followability and from the viewpoint of easily obtaining a resist pattern with a sufficient thickness. It may be greater than, 7 ⁇ m or greater, greater than 7 ⁇ m, 8 ⁇ m or greater, 10 ⁇ m or greater, 10 ⁇ m or greater, 15 ⁇ m or greater, 18 ⁇ m or greater, or 19 ⁇ m or greater.
  • the thickness of the photosensitive film and the cured product according to this embodiment may be 19 ⁇ m or less from the viewpoint of easily obtaining excellent resolution and adhesion. From these viewpoints, the thickness of the photosensitive film and cured product according to the present embodiment may be 1 to 20 ⁇ m, 5 to 20 ⁇ m, or 15 to 20 ⁇ m. The thickness of the photosensitive film and cured product may be an average thickness of 10 locations.
  • the wavelength at which photosensitivity is exhibited in the photosensitive film and photosensitive resin composition according to the present embodiment is not particularly limited.
  • the photosensitive film and the photosensitive resin composition according to the present embodiment are, for example, light having a wavelength of 300 nm or more, 340 nm or more, 350 nm or more, 355 nm or more, 365 nm or more, 375 nm or more, 390 nm or more, 395 nm or more, or 405 nm or more.
  • the photosensitive film and photosensitive resin composition according to the present embodiment have photosensitivity to light having a wavelength of, for example, 500 nm or less, 440 nm or less, less than 440 nm, 436 nm or less, 420 nm or less, 410 nm or less, or 405 nm or less. you can Actinic rays having peaks within these wavelength ranges can be used in the exposure step described later.
  • the photosensitive film and photosensitive resin composition according to the present embodiment can be used, for example, as a negative photosensitive film and photosensitive resin composition.
  • application of the photosensitive resin composition, photosensitive film, or photosensitive element to the formation of a cured product pattern can be provided.
  • application of the photosensitive resin composition, photosensitive film, or photosensitive element to the production of wiring boards can be provided.
  • the photosensitive film and photosensitive resin composition according to this embodiment contain a binder polymer as the (A) component.
  • Component (A) includes acrylic resins, styrene resins, epoxy resins, amide resins, amide epoxy resins, alkyd resins, phenol resins, and the like.
  • Acrylic resins are resins having a compound ((meth)acrylic acid compound) having a (meth)acryloyl group as a monomer unit, and styrene resins, epoxy resins, and amide resins having the monomer units.
  • amidoepoxy resins, alkyd resins and phenolic resins belong to acrylic resins.
  • the component (A) does not have to contain a binder polymer having a phenolic hydroxyl group.
  • the (A) component may contain an acrylic resin from the viewpoint of easily obtaining excellent followability, resolution and adhesion.
  • the content of the acrylic resin is 50% by mass or more, more than 50% by mass, or 70% by mass or more, based on the total mass of the component (A), from the viewpoint of easily obtaining excellent followability, resolution, and adhesion. , 90% by mass or more, 95% by mass or more, 98% by mass or more, 99% by mass or more, or substantially 100% by mass (an aspect in which component (A) is substantially composed of an acrylic resin).
  • Examples of compounds having a (meth)acryloyl group include (meth)acrylic acid and (meth)acrylic acid esters.
  • (Meth)acrylates include alkyl (meth)acrylates (alkyl (meth)acrylates; excluding compounds corresponding to cycloalkyl (meth)acrylates), cycloalkyl (meth)acrylates ((meth) cycloalkyl acrylate), aryl (meth)acrylate (aryl (meth)acrylate), (meth)acrylamide compounds (diacetone acrylamide, etc.), glycidyl (meth)acrylate, styryl (meth)acrylic acid, etc. is mentioned.
  • the (A) component may have (meth)acrylic acid as a monomer unit from the viewpoint of easily obtaining excellent followability, resolution and adhesion.
  • (A) When the component has (meth)acrylic acid as a monomer unit, the content of the (meth)acrylic acid monomer unit is from the viewpoint of easily obtaining excellent followability, resolution and adhesion. , (A) may be within the following ranges based on the total amount of the monomer units constituting component (A).
  • the content of the monomer units of (meth)acrylic acid is 1% by mass or more, 5% by mass or more, 10% by mass or more, 12% by mass or more, 15% by mass or more, 18% by mass or more, 20% by mass or more, It may be 23% by mass or more, 25% by mass or more, or 27% by mass or more.
  • the content of the monomer units of (meth)acrylic acid is 50% by mass or less, less than 50% by mass, 45% by mass or less, 40% by mass or less, 37% by mass or less, 35% by mass or less, 32% by mass or less, It may be 30% by mass or less, or 27% by mass or less. From these points of view, the content of the (meth)acrylic acid monomer unit may be 1 to 50% by mass.
  • the (A) component may have an alkyl (meth)acrylate as a monomer unit from the viewpoint of easily obtaining excellent conformability, resolution and adhesion.
  • alkyl group of alkyl (meth)acrylate include methyl group, ethyl group, propyl group, butyl group, pentyl group, hexyl group, heptyl group, octyl group, nonyl group, decyl group, undecyl group and dodecyl group. and the alkyl groups may be of various structural isomers.
  • the number of carbon atoms in the alkyl group of the alkyl (meth)acrylate is 1 to 4, 1 to 3, 2 to 3, or 1 to 2 from the viewpoint of easily obtaining excellent followability, resolution and adhesion. you can
  • the alkyl group of the alkyl (meth)acrylate may have a substituent.
  • Substituents include a hydroxy group, a carboxy group, a carboxylic acid group, an aldehyde group, an alkoxy group (unsubstituted alkoxy group (structure having an unsubstituted alkyl group bonded to an oxygen atom), or a substituted alkoxy group (hydroxyalkoxy group, etc.)), carbonyl group, alkoxycarbonyl group, alkanoyl group (alkanoyl group having 2 to 12 carbon atoms, etc.), oxycarbonyl group, carbonyloxy group, amino group, epoxy group, furyl group, cyano group, halogeno group (fluoro group, chloro group, bromo group, etc.), nitro group, acetyl group, sulfonyl group, sulfonamide group and the like.
  • Component (A) includes dimethylaminoethyl (meth)acrylate, diethylaminoethyl (meth)acrylate, 2,2,2-trifluoroethyl (meth)acrylate, 2,2,3 (meth)acrylate, 3-tetrafluoropropyl, ⁇ -chloro(meth)acrylic acid, ⁇ -bromo(meth)acrylic acid and the like.
  • the (A) component may have hydroxyalkyl (meth)acrylate as a monomer unit from the viewpoint of easily obtaining excellent followability, resolution and adhesion.
  • Hydroxyalkyl (meth)acrylates include hydroxymethyl (meth)acrylate, hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, hydroxybutyl (meth)acrylate, hydroxypentyl (meth)acrylate, Hydroxyhexyl (meth)acrylate and the like can be mentioned.
  • the content of the monomer units of the hydroxyalkyl (meth)acrylate when it is present as a monomer unit may be within the following range based on the total amount of the monomer units constituting component (A).
  • the content of the above-mentioned monomer units is 0.10% by mass or more, 0.50% by mass or more, 1.0% by mass or more, 1 .5% by mass or more, 2.0% by mass or more, 2.5% by mass or more, or 3.0% by mass or more.
  • the content of the above-mentioned monomer units is 3.5% by mass or more, 4.0% by mass or more, 4.0% by mass or more, and 4 0.5% by mass or more, or 5.0% by mass or more.
  • the content of the above-mentioned monomer units is 20% by mass or less, 18% by mass or less, 15% by mass or less, 12% by mass or less, and 10% by mass. % or less, 8.0 mass % or less, 6.0 mass % or less, 5.5 mass % or less, or 5.0 mass % or less.
  • the content of the above-mentioned monomer units is 4.5% by mass or less, 4.0% by mass or less, 3.5% by mass or less, or 3.0% by mass from the viewpoint of easily obtaining excellent resolution. % or less. From these points of view, the content of the above monomer units may be 0.10 to 20% by mass, or 0.10 to 5.0% by mass.
  • the content of the monomer unit of the alkyl (meth)acrylate having 4 or more carbon atoms in the alkyl group is (A ) may be 1% by mass or less, less than 1% by mass, 0.1% by mass or less, or 0.01% by mass or less based on the total amount of the monomer units constituting the component.
  • the (A) component may have aryl (meth)acrylate as a monomer unit from the viewpoint of easily obtaining excellent conformability, resolution and adhesion.
  • Aryl (meth)acrylates include benzyl (meth)acrylate, phenyl (meth)acrylate, and naphthyl (meth)acrylate.
  • the content of the monomer units of the aryl (meth)acrylate is the total amount of the monomer units constituting the component (A).
  • the following range may be used as a reference.
  • the content of the monomer unit of the aryl (meth)acrylate is 1% by mass or more, 5% by mass or more, 10% by mass or more, and 12% by mass from the viewpoint of easily obtaining excellent followability, resolution and adhesion. % or more, 15 mass % or more, 18 mass % or more, or 20 mass % or more.
  • the content of the monomer unit of the aryl (meth)acrylate is 21% by mass or more, or 23% by mass, from the viewpoint of easily obtaining excellent sensitivity and developability, and from the viewpoint of easily obtaining excellent followability. or more.
  • the content of the monomer unit of the aryl (meth)acrylate is 50% by mass or less, less than 50% by mass, 45% by mass or less, and 40% by mass, from the viewpoint of easily obtaining excellent followability, resolution, and adhesion. % or less, 35 mass % or less, 30 mass % or less, 25 mass % or less, or 23 mass % or less.
  • the content of the monomer units of the aryl (meth)acrylate may be 21% by mass or less, or 20% by mass or less, from the viewpoint of easily obtaining even better resolution. From these viewpoints, the content of the monomer units of the aryl (meth)acrylate may be 1 to 50% by mass.
  • the (A) component may have a styrene compound (excluding compounds having a (meth)acryloyl group) as a monomer unit from the viewpoint of easily obtaining excellent followability, resolution and adhesion.
  • Styrene compounds include styrene and styrene derivatives. Examples of styrene derivatives include vinyltoluene and ⁇ -methylstyrene.
  • Component (A) may have (meth)acrylic acid and a styrene compound as monomer units from the viewpoint of easily obtaining excellent followability, resolution and adhesion, and hydroxyalkyl (meth)acrylate and It may have a styrene compound as a monomer unit, and may have an aryl (meth)acrylate and a styrene compound as a monomer unit.
  • the content of the monomer units of the styrene compound is within the following range based on the total amount of the monomer units constituting the component (A). good.
  • the content of the monomer unit of the styrene compound is 10% by mass or more, 15% by mass or more, 15% by mass or more, 20% by mass or more, 25% by mass or more, from the viewpoint of easily obtaining excellent followability, resolution and adhesion. It may be at least 30% by mass, at least 30% by mass, at least 35% by mass, at least 40% by mass, or at least 45% by mass.
  • the content of the monomer unit of the styrene compound may be 47% by mass or more, or 50% by mass or more from the viewpoint of easily obtaining even better resolution.
  • the content of the monomer unit of the styrene compound is 90% by mass or less, 85% by mass or less, 80% by mass or less, 75% by mass or less, 70% by mass or less, from the viewpoint of easily obtaining excellent followability, resolution and adhesion. % by mass or less, 65% by mass or less, 60% by mass or less, 55% by mass or less, or 50% by mass or less.
  • the content of the monomer unit of the styrene compound is 47% by mass or less, or 45% by mass or less from the viewpoint of easily obtaining excellent sensitivity and developability, and from the viewpoint of easily obtaining excellent followability. good. From these points of view, the content of monomer units in the styrene compound may be 10 to 90% by mass.
  • the (A) component may have other monomers as monomer units.
  • monomers include vinyl alcohol ethers (vinyl-n-butyl ether, etc.), (meth)acrylonitrile, maleic acid, maleic anhydride, maleic acid monoesters (monomethyl maleate, monoethyl maleate, maleic monoisopropyl acid, etc.), fumaric acid, cinnamic acid, ⁇ -cyanocinnamic acid, itaconic acid, crotonic acid, propiolic acid and the like.
  • the acid value of the component (A) is 80 mgKOH/g or more, 90 mgKOH/g or more, 100 mgKOH/g or more, and more than 100 mgKOH/g from the viewpoint of easily obtaining excellent sensitivity, developability, followability, resolution and adhesion. , 120 mg KOH/g or more, 140 mg KOH/g or more, 150 mg KOH/g or more, 160 mg KOH/g or more, 170 mg KOH/g or more, or 175 mg KOH/g or more.
  • the acid value of component (A) may be 176 mgKOH/g or more from the viewpoint of easily obtaining even better resolution.
  • the acid value of the component (A) is 250 mgKOH/g or less, 240 mgKOH/g or less, 230 mgKOH/g or less, or 210 mgKOH/g or less from the viewpoint of easily obtaining excellent sensitivity, developability, followability, resolution, and adhesion. , 200 mg KOH/g or less, 180 mg KOH/g or less, 178 mg KOH/g or less, or 176 mg KOH/g or less.
  • the acid value of component (A) may be 175 mgKOH/g or less from the viewpoint of easily obtaining even better sensitivity, developability and followability. From these points of view, the component (A) may have an acid value of 80 to 250 mgKOH/g.
  • the acid value of component (A) can be adjusted by adjusting the content of the monomer units (for example, the monomer units of (meth)acrylic acid) constituting component (A).
  • the acid value of component (A) can be measured by the method described in Examples.
  • the weight average molecular weight (Mw) of component (A) may be within the following range from the viewpoint of easily obtaining excellent sensitivity, developability, followability, resolution and adhesion.
  • the weight average molecular weight of component (A) may be 10,000 or more, 20,000 or more, 25,000 or more, 30,000 or more, or 35,000 or more.
  • the weight average molecular weight of component (A) may be 100,000 or less, 80,000 or less, 70,000 or less, less than 70,000, 65,000 or less, 60,000 or less, 50,000 or less, 40,000 or less, or 35,000 or less. From these viewpoints, the weight average molecular weight of component (A) may be 10,000 to 100,000, 20,000 to 50,000, or 30,000 to 40,000.
  • the number average molecular weight (Mn) of component (A) may be within the following range.
  • the number average molecular weight of component (A) is 5000 or more, 10000 or more, 12000 or more, 15000 or more, or 16000 or more from the viewpoint of easily obtaining excellent sensitivity, developability, followability, resolution and adhesion. you can
  • the number average molecular weight of component (A) may be 16,500 or more from the viewpoint of easily obtaining even better sensitivity, developability, and followability.
  • the number average molecular weight of component (A) is 50,000 or less, 40,000 or less, 35,000 or less, 30,000 or less, 25,000 or less, 20,000 or less, from the viewpoint of easily obtaining excellent sensitivity, developability, followability, resolution, and adhesion.
  • the number average molecular weight of component (A) may be 16,000 or less from the viewpoint of easily obtaining even better resolution. From these viewpoints, the number average molecular weight of component (A) may be 5,000 to 50,000, 10,000 to 25,000, or 15,000 to 20,000.
  • the degree of dispersion (weight average molecular weight/number average molecular weight) of component (A) may be within the following range.
  • the dispersion degree of component (A) is 1.00 or more, 1.50 or more, 1.80 or more, 2.00 or more from the viewpoint of easily obtaining excellent sensitivity, developability, followability, resolution and adhesion. , 2.10 or greater, or 2.12 or greater.
  • the dispersity of component (A) may be 2.15 or more, or 2.18 or more from the viewpoint of easily obtaining even better resolution.
  • the degree of dispersion of component (A) is 3.00 or less, 2.80 or less, 2.50 or less, 2.30 or less from the viewpoint of easily obtaining excellent sensitivity, developability, followability, resolution and adhesion.
  • component (A) may have a dispersity of 1.00 to 3.00.
  • the weight average molecular weight and number average molecular weight can be measured, for example, by gel permeation chromatography (GPC) using a standard polystyrene calibration curve. More specifically, it can be measured under the conditions described in Examples. If it is difficult to measure a compound having a low molecular weight by the above weight average molecular weight and number average molecular weight measurement methods, the molecular weight can be measured by another method and the average value can be calculated.
  • GPC gel permeation chromatography
  • the content of component (A) is based on the total amount of the photosensitive film or the total amount of the photosensitive resin composition (total solid content), from the viewpoint of easily obtaining excellent followability, resolution and adhesion. may be in the range of The content of component (A) is 10% by mass or more, 20% by mass or more, 30% by mass or more, 40% by mass or more, 45% by mass or more, or 50% by mass or more from the viewpoint of excellent film formability. It's okay.
  • the content of component (A) may be 90% by mass or less, 80% by mass or less, 75% by mass or less, 70% by mass or less, 65% by mass or less, 60% by mass or less, or 55% by mass or less. From these points of view, the content of component (A) may be 10 to 90% by mass.
  • the content of component (A) may be within the following range with respect to the total amount of 100 parts by mass of components (A) and (B).
  • the content of component (A) is 10 parts by mass or more, 20 parts by mass or more, 30 parts by mass or more, 40 parts by mass or more, or 45 parts by mass or more from the viewpoint of easily obtaining excellent followability, resolution and adhesion. , 50 parts by mass or more, 55 parts by mass or more, or 56 parts by mass or more.
  • the content of component (A) may be 57 parts by mass or more, or 58 parts by mass or more from the viewpoint of easily obtaining excellent developability.
  • the content of component (A) is 90 parts by mass or less, 80 parts by mass or less, 75 parts by mass or less, 70 parts by mass or less, or 65 parts by mass or less from the viewpoint of easily obtaining excellent followability, resolution, and adhesion. , 60 parts by mass or less, or 59 parts by mass or less.
  • the content of component (A) may be 58 parts by mass or less, 57 parts by mass or less, or 56 parts by mass or less from the viewpoint of easily obtaining excellent followability and from the viewpoint of easily obtaining excellent sensitivity. . From these viewpoints, the content of component (A) may be 10 to 90 parts by mass, or 40 to 70 parts by mass.
  • the content of the resin having a phenolic hydroxyl group is based on the total amount of the photosensitive film or the total amount of the photosensitive resin composition (total solid content). , 30% by mass or less, less than 30% by mass, 20% by mass or less, 10% by mass or less, 5% by mass or less, 1% by mass or less, or 0.1% by mass or less.
  • the photosensitive film and photosensitive resin composition according to the present embodiment may not contain a resin having a phenolic hydroxyl group (the above content may be substantially 0% by mass).
  • the photosensitive film and photosensitive resin composition according to the present embodiment contain photopolymerizable compounds (excluding compounds corresponding to pyrazoline compounds) as the (B) component.
  • a photopolymerizable compound is a compound that is polymerized by light.
  • the component (B) may be a compound having an ethylenically unsaturated bond and may be a compound ((meth)acrylic acid compound) having a (meth)acryloyl group.
  • Component (B) includes bisphenol A type (meth)acrylic acid compounds (excluding (meth)acrylic acid compounds having a polyoxyalkylene group), EO-modified di(meth)acrylates, PO-modified di(meth)acrylates, EO ⁇ PO-modified di(meth)acrylate, polyalkylene glycol di(meth)acrylate (polyethylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, etc.), EO-modified polyalkylene glycol di(meth)acrylate, PO-modified poly Alkylene glycol di(meth)acrylate, EO/PO-modified polyalkylene glycol di(meth)acrylate, trimethylolpropane di(meth)acrylate, trimethylolpropane tri(meth)acrylate, EO-modified trimethylolpropane tri(meth)acrylate, PO-modified trimethylolpropane tri(meth)acrylate, EO/PO-
  • EO-modified means a compound having a polyoxyethylene group.
  • PO-modified means a compound having a polyoxypropylene group.
  • EO/PO-modified means a compound having a polyoxyethylene group and/or a (poly)oxypropylene group.
  • the (B) component may contain a bisphenol A type (meth)acrylic acid compound from the viewpoint of easily obtaining excellent conformability, resolution and adhesion.
  • a bisphenol A type (meth)acrylic acid compound 2,2-bis(4-((meth)acryloxypolyethoxy)phenyl)propane (2,2-bis(4-((meth)acryloxypentaethoxy) phenyl)propane, etc.), 2,2-bis(4-((meth)acryloxypolypropoxy)phenyl)propane, 2,2-bis(4-((meth)acryloxypolybutoxy)phenyl)propane, 2, 2-bis(4-((meth)acryloxypolyethoxypolypropoxy)phenyl)propane and the like.
  • Component (B) may contain 2,2-bis(4-((meth)acryloxypolyethoxy)phenyl)propane from the viewpoint of easily obtaining excellent followability, resolution and adhesion. 2-bis(4-((meth)acryloxypentaethoxy)phenyl)propane may be included.
  • the molecular weight of the bisphenol A type (meth)acrylic acid compound may be within the following range from the viewpoint of easily obtaining excellent conformability, resolution and adhesion.
  • the molecular weight may be 100 or greater, 200 or greater, 300 or greater, 400 or greater, 450 or greater, 500 or greater, 600 or greater, 700 or greater, or 800 or greater.
  • the molecular weight may be 10000 or less, less than 10000, 8000 or less, 6000 or less, 5000 or less, 3000 or less, 2000 or less, 1500 or less, 1000 or less, 900 or less, 800 or less, 700 or less, 600 or less, or 500 or less. . From these points of view, the molecular weight may range from 100 to 10,000.
  • the content of the bisphenol A type (meth)acrylic acid compound may be within the following ranges based on the total mass of the component (B).
  • the content of the bisphenol A type (meth)acrylic acid compound is 50% by mass or more, more than 50% by mass, 60% by mass or more, 70% by mass or more from the viewpoint of easily obtaining excellent followability, resolution and adhesion. , or 75% by mass or more.
  • the content of the bisphenol A type (meth)acrylic acid compound is 80% by mass or more, 85% by mass or more, or 90% by mass from the viewpoint of easily obtaining excellent followability and from the viewpoint of easily obtaining excellent sensitivity. or more.
  • the content of the bisphenol A type (meth)acrylic acid compound is 100% by mass or less, and from the viewpoint of easily obtaining excellent followability, resolution and adhesion, it is less than 100% by mass, 99% by mass or less, and 98% by mass. % or less, 97 mass % or less, 95 mass % or less, 92 mass % or less, or 91 mass % or less.
  • the content of the bisphenol A type (meth)acrylic acid compound may be 90% by mass or less, 85% by mass or less, or 80% by mass or less from the viewpoint of easily obtaining excellent developability. From these points of view, the content of the bisphenol A type (meth)acrylic acid compound may be 50 to 100% by mass.
  • the content of the bisphenol A type (meth)acrylic acid compound may be within the following range with respect to 100 parts by mass of the total amount of the components (A) and (B).
  • the content of the bisphenol A type (meth)acrylic acid compound is 1 part by mass or more, 5 parts by mass or more, 10 parts by mass or more, or 20 parts by mass or more from the viewpoint of easily obtaining excellent followability, resolution and adhesion. , more than 20 parts by weight, more than 25 parts by weight, more than 25 parts by weight, more than 30 parts by weight, or more than 30 parts by weight.
  • the content of the bisphenol A type (meth)acrylic acid compound is 32 parts by mass or more, 35 parts by mass or more, more than 35 parts by mass, from the viewpoint of easily obtaining excellent followability and excellent sensitivity. It may be 38 parts by mass or more, or 40 parts by mass or more.
  • the content of the bisphenol A type (meth)acrylic acid compound is less than 100 parts by mass, 90 parts by mass or less, 80 parts by mass or less, or 70 parts by mass or less from the viewpoint of easily obtaining excellent followability, resolution and adhesion. , 60 parts by mass or less, 50 parts by mass or less, 45 parts by mass or less, or 40 parts by mass or less.
  • the content of the bisphenol A type (meth)acrylic acid compound may be 38 parts by mass or less, 35 parts by mass or less, less than 35 parts by mass, or 32 parts by mass or less from the viewpoint of easily obtaining excellent developability. From these points of view, the content of the bisphenol A type (meth)acrylic acid compound may be 1 part by mass or more and less than 100 parts by mass.
  • Component (B) is a (meth)acrylic acid compound having a polyoxyalkylene group (a group in which two or more alkylene groups are linked by an ether bond) from the viewpoint of easily obtaining excellent followability, resolution and adhesion. It may contain a (meth)acrylic acid compound having at least one selected from the group consisting of a polyoxyethylene group and a polyoxypropylene group.
  • the molecular weight of the (meth)acrylic acid compound having a polyoxyalkylene group may be within the following range from the viewpoint of easily obtaining excellent conformability, resolution and adhesion.
  • the molecular weight may be 100 or greater, 200 or greater, 300 or greater, 400 or greater, 500 or greater, 600 or greater, 700 or greater, 800 or greater, 900 or greater, 1000 or greater, or 1100 or greater.
  • the molecular weight may be 10,000 or less, less than 10,000, 8,000 or less, 6,000 or less, 5,000 or less, 3,000 or less, 2,000 or less, 1,500 or less, or 1,200 or less. From these points of view, the molecular weight may range from 100 to 10,000.
  • the content of the (meth)acrylic acid compound having a polyoxyalkylene group may be within the following ranges based on the total mass of component (B).
  • the content of the (meth)acrylic acid compound having a polyoxyalkylene group may exceed 0% by mass, 1% by mass or more, and 2% by mass from the viewpoint of easily obtaining excellent followability, resolution and adhesion. Above, it may be 3% by mass or more, 5% by mass or more, 8% by mass or more, or 9% by mass or more.
  • the content of the (meth)acrylic acid compound having a polyoxyalkylene group is 10% by mass or more, 12% by mass or more, 15% by mass or more, 18% by mass or more, and 20% by mass from the viewpoint of easily obtaining excellent developability. or more, or 23% by mass or more.
  • the content of the (meth)acrylic acid compound having a polyoxyalkylene group is 50% by mass or less, less than 50% by mass, 40% by mass or less, 30% by mass or less, from the viewpoint of easily obtaining excellent followability, resolution and adhesion. % by mass or less, or 25% by mass or less.
  • the content of the (meth)acrylic acid compound having a polyoxyalkylene group is 23% by mass or less, 20% by mass or less, and 18% by mass from the viewpoint of easily obtaining excellent followability and from the viewpoint of easily obtaining excellent sensitivity. % or less, 15 mass % or less, 12 mass % or less, or 10 mass % or less. From these points of view, the content of the (meth)acrylic acid compound having a polyoxyalkylene group may be more than 0% by mass and 50% by mass or less.
  • the content of the (meth)acrylic acid compound having a polyoxyalkylene group may be within the following range with respect to 100 parts by mass of the total amount of components (A) and (B).
  • the content of the (meth)acrylic acid compound having a polyoxyalkylene group is 0.10 parts by mass or more, 0.50 parts by mass or more, from the viewpoint of easily obtaining excellent followability, resolution and adhesion.
  • the content of the (meth)acrylic acid compound having a polyoxyalkylene group is 4.5 parts by mass or more, 5.0 parts by mass or more, 6.0 parts by mass or more, from the viewpoint of easily obtaining excellent developability. It may be 0 parts by mass or more, 8.0 parts by mass or more, 8.5 parts by mass or more, 9.0 parts by mass or more, or 9.5 parts by mass or more.
  • the content of the (meth)acrylic acid compound having a polyoxyalkylene group is 50 parts by mass or less, 30 parts by mass or less, 25 parts by mass or less, 20 parts by mass or less, from the viewpoint of easily obtaining excellent followability, resolution and adhesion. It may be no more than 18 parts by mass, no more than 15 parts by mass, no more than 12 parts by mass, no more than 10 parts by mass, or no more than 9.5 parts by mass.
  • the content of the (meth)acrylic acid compound having a polyoxyalkylene group is 9.0 parts by mass or less and 8.5 parts by mass from the viewpoint of easily obtaining excellent followability and from the viewpoint of easily obtaining excellent sensitivity.
  • the content of the (meth)acrylic acid compound having a polyoxyalkylene group may be 0.10 to 50 parts by mass.
  • the content of the (meth)acrylic acid compound having a polyoxyalkylene group may be in the following range with respect to 100 parts by mass of the bisphenol A type (meth)acrylic acid compound.
  • the content of the (meth)acrylic acid compound having a polyoxyalkylene group is 1 part by mass or more, 2 parts by mass or more, 3 parts by mass or more, 5 parts by mass or more, from the viewpoint of easily obtaining excellent followability, resolution and adhesion. It may be at least 8 parts by mass, or at least 10 parts by mass.
  • the content of the (meth)acrylic acid compound having a polyoxyalkylene group is 15 parts by mass or more, 20 parts by mass or more, 25 parts by mass or more, or 30 parts by mass or more from the viewpoint of easily obtaining excellent developability. you can
  • the content of the (meth)acrylic acid compound having a polyoxyalkylene group is 100 parts by mass or less, less than 100 parts by mass, 80 parts by mass or less, 50 parts by mass or less, from the viewpoint of easily obtaining excellent followability, resolution and adhesion. It may be no more than 45 parts by mass, no more than 40 parts by mass, no more than 35 parts by mass, or no more than 30 parts by mass.
  • the content of the (meth)acrylic acid compound having a polyoxyalkylene group is 25 parts by mass or less, 20 parts by mass or less, and 15 parts by mass from the viewpoint of easily obtaining excellent followability and from the viewpoint of easily obtaining excellent sensitivity. parts or less, or 10 parts by mass or less. From these points of view, the content of the (meth)acrylic acid compound having a polyoxyalkylene group may be 1 to 100 parts by mass.
  • the content of component (B) may be within the following ranges based on the total amount of the photosensitive film or the total amount of the photosensitive resin composition (total solid content).
  • the content of component (B) is 10% by mass or more, 15% by mass or more, 20% by mass or more, 25% by mass or more, and 30% by mass or more from the viewpoint of easily obtaining excellent followability, resolution, and adhesion. , 35% by mass or more, or 38% by mass or more.
  • the content of the component (B) may be 40% by mass or more, or 41% by mass or more, from the viewpoint of easily obtaining excellent followability and from the viewpoint of easily obtaining excellent sensitivity.
  • the content of component (B) is 90% by mass or less, 80% by mass or less, 70% by mass or less, 65% by mass or less, or 60% by mass or less from the viewpoint of easily obtaining excellent followability, resolution, and adhesion. , 55 mass % or less, 50 mass % or less, 45 mass % or less, or 42 mass % or less.
  • the content of component (B) may be 41% by mass or less, or 40% by mass or less from the viewpoint of easily obtaining excellent developability. From these viewpoints, the content of component (B) may be 10 to 90% by mass.
  • the content of component (B) may be within the following range with respect to 100 parts by mass of the total amount of components (A) and (B).
  • the content of component (B) is 10 parts by mass or more, 20 parts by mass or more, 25 parts by mass or more, 30 parts by mass or more, or 35 parts by mass or more from the viewpoint of easily obtaining excellent followability, resolution and adhesion. , 40 parts by mass or more, or 41 parts by mass or more.
  • the content of the component (B) may be 42 parts by mass or more, 43 parts by mass or more, or 44 parts by mass or more from the viewpoint of easily obtaining excellent followability and from the viewpoint of easily obtaining excellent sensitivity. .
  • the content of component (B) is 90 parts by mass or less, 80 parts by mass or less, 70 parts by mass or less, 60 parts by mass or less, or 55 parts by mass or less from the viewpoint of easily obtaining excellent followability, resolution, and adhesion. , 50 parts by mass or less, 45 parts by mass or less, or 44 parts by mass or less.
  • the content of component (B) may be 43 parts by mass or less, or 42 parts by mass or less from the viewpoint of easily obtaining excellent developability. From these viewpoints, the content of component (B) may be 10 to 90 parts by mass, or 30 to 60 parts by mass.
  • the total amount of the compound having three or more ethylenically unsaturated groups and the di(meth)acrylate compound having a bisphenol A skeleton is the component (A) It may be 20 parts by mass or less, less than 20 parts by mass, 10 parts by mass or less, 1 part by mass or less, or 0.1 parts by mass or less with respect to 100 parts by mass of the total amount of component (B).
  • the photosensitive film and photosensitive resin composition according to the present embodiment contain at least one compound selected from the group consisting of a compound having three or more ethylenically unsaturated groups and a di(meth)acrylate compound having a bisphenol A skeleton. It may not be contained (the content may be substantially 0 parts by mass with respect to 100 parts by mass of the total amount of components (A) and (B)).
  • the content of the photopolymerizable compound having an ethylenically unsaturated group and an isocyanuric ring structure is 100 parts by mass of the total amount of components (A) and (B). 1 part by mass or less, less than 1 part by mass, 0.1 part by mass or less, 0.01 part by mass or less, or 0.001 part by mass or less.
  • the photosensitive film and photosensitive resin composition according to the present embodiment may not contain a photopolymerizable compound having an ethylenically unsaturated group and an isocyanuric ring structure (the above content is substantially 0 parts by mass. may be).
  • the content of is 3 parts by mass or less, less than 3 parts by mass, 1 part by mass or less, 0.1 parts by mass or less, or 0.01 parts by mass with respect to 100 parts by mass of the total amount of components (A) and (B) It may be less than or equal to parts by mass.
  • the photosensitive film and the photosensitive resin composition according to the present embodiment are at least one selected from the group consisting of a photopolymerizable compound having a pentaerythritol-derived skeleton and a photopolymerizable compound having a dipentaerythritol-derived skeleton. may not be contained (the content may be substantially 0 parts by mass with respect to 100 parts by mass of the total amount of components (A) and (B)).
  • the photosensitive film and photosensitive resin composition from the group consisting of a (meth)acrylic acid compound having a skeleton derived from pentaerythritol and a (meth)acrylic acid compound having a skeleton derived from dipentaerythritol
  • the content of at least one selected is 3 parts by mass or less, less than 3 parts by mass, 1 part by mass or less, 0.1 parts by mass or less, or , 0.01 parts by mass or less.
  • the photosensitive film and the photosensitive resin composition according to the present embodiment are selected from the group consisting of (meth)acrylic acid compounds having a pentaerythritol-derived skeleton and (meth)acrylic acid compounds having a dipentaerythritol-derived skeleton. At least one selected may not be contained (the content may be substantially 0 parts by mass with respect to 100 parts by mass of the total amount of components (A) and (B)).
  • the content of the bisphenol F-type (meth)acrylic acid compound is 5% by mass or less and less than 5% by mass, based on the total mass of the component (B). , 1% by weight or less, less than 1% by weight, 0.1% by weight or less, or substantially 0% by weight.
  • the content of the bisphenol F-type (meth)acrylic acid compound is the total amount of the photosensitive film or the total amount of the photosensitive resin composition (total solid content). 0.2% by mass or less, 0.15% by mass or less, less than 0.15% by mass, 0.1% by mass or less, or 0.01% by mass or less.
  • the photosensitive film and photosensitive resin composition according to the present embodiment may not contain a bisphenol F-type (meth)acrylic acid compound (the above content may be substantially 0% by mass).
  • the content of the epoxy compound having two or more oxirane rings is 20 parts by mass or less and 20 parts by mass with respect to 100 parts by mass of component (A). It may be less than, 10 parts by weight or less, less than 10 parts by weight, 1 part by weight or less, or substantially 0 parts by weight.
  • the photosensitive film and photosensitive resin composition according to the present embodiment may not contain an epoxy compound having two or more oxirane rings (the content of the epoxy compound having two or more oxirane rings is It may be substantially 0% by mass based on the total amount of the film or the total amount of the photosensitive resin composition (the total solid content)).
  • the photosensitive film and photosensitive resin composition according to the present embodiment contain a photopolymerization initiator (excluding compounds corresponding to pyrazoline compounds) as the (C) component.
  • Component (C) includes hexaarylbiimidazole compounds; benzophenone, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-1-butanone, 2-(dimethylamino)-2-[(4- methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone, 4-(2-hydroxyethoxy)phenyl-2-(hydroxy-2-propyl)ketone, 2-methyl-1- Aromatic ketones such as [4-(methylthio)phenyl]-2-morpholino-propanone-1; quinone compounds such as alkylanthraquinone; benzoin ether compounds such as benzoin alkyl ether; benzoin compounds such as benzoin and alkylbenzoin; benzyl derivatives such as; bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide; bis(2,6-dimethylbenzoyl)-2
  • the (C) component may contain a hexaarylbiimidazole compound from the viewpoint of easily obtaining excellent followability, resolution and adhesion.
  • the aryl group in the hexaarylbiimidazole compound may be a phenyl group or the like.
  • a hydrogen atom bonded to an aryl group in the hexaarylbiimidazole compound may be substituted with a halogen atom (such as a chlorine atom).
  • the hexaarylbiimidazole compound may be a 2,4,5-triarylimidazole dimer.
  • 2,4,5-triarylimidazole dimer examples include 2-(o-chlorophenyl)-4,5-diphenylimidazole dimer, 2-(o-chlorophenyl)-4,5-bis-(m- methoxyphenyl)imidazole dimer, 2-(p-methoxyphenyl)-4,5-diphenylimidazole dimer, and the like.
  • the hexaarylbiimidazole compound may contain 2-(o-chlorophenyl)-4,5-diphenylimidazole dimer from the viewpoint of easily obtaining excellent followability, resolution and adhesion, and 2,2' -bis(o-chlorophenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole.
  • the content of the hexaarylbiimidazole compound is 50% by mass or more, more than 50% by mass, or 70% by mass, based on the total amount of component (C), from the viewpoint of easily obtaining excellent followability, resolution, and adhesion. Above, 90% by mass or more, 95% by mass or more, 98% by mass or more, 99% by mass or more, or substantially 100% by mass (an aspect in which the component (C) is substantially composed of a hexaarylbiimidazole compound) you can
  • the content of component (C) is based on the total amount of the photosensitive film or the total amount of the photosensitive resin composition (total solid content), from the viewpoint of easily obtaining excellent followability, resolution and adhesion. may be in the range of The content of component (C) is 0.10% by mass or more, 0.50% by mass or more, 1.0% by mass or more, 2.0% by mass or more, 3.0% by mass or more, 4.0% by mass or more , 4.5% by mass or more, or 4.7% by mass or more.
  • the content of component (C) is 20% by mass or less, 15% by mass or less, 12% by mass or less, 10% by mass or less, 8.0% by mass or less, 7.0% by mass or less, 6.0% by mass or less, Alternatively, it may be 5.0% by mass or less. From these viewpoints, the content of component (C) may be 0.10 to 20% by mass.
  • the content of component (C) may be in the following range with respect to 100 parts by mass of the total amount of components (A) and (B), from the viewpoint of easily obtaining excellent followability, resolution and adhesion. .
  • the content of component (C) is 0.10 parts by mass or more, 0.50 parts by mass or more, 1.0 parts by mass or more, 2.0 parts by mass or more, 3.0 parts by mass or more, 3.5 parts by mass or more , 4.0 parts by mass or more, 4.5 parts by mass or more, or 5.0 parts by mass or more.
  • the content of component (C) is 20 parts by mass or less, 15 parts by mass or less, 12 parts by mass or less, 10 parts by mass or less, 8.0 parts by mass or less, 7.0 parts by mass or less, 6.0 parts by mass or less, Alternatively, it may be 5.5 parts by mass or less. From these points of view, the content of component (C) may be 0.10 to 20 parts by mass.
  • the photosensitive film and photosensitive resin composition according to the present embodiment contain a pyrazoline compound (a compound having a pyrazoline ring) as component (D).
  • component (D) A component can be used as a sensitizer (photosensitizer).
  • the molecular weight of component (D) may be less than 10,000.
  • Pyrazoline compounds include 1-pyrazoline compounds, 2-pyrazoline compounds, and 3-pyrazoline compounds.
  • the pyrazoline compound may contain a 2-pyrazoline compound from the viewpoint of easily obtaining excellent followability, resolution and adhesion.
  • the pyrazoline compound may have a substituent that binds to the pyrazoline ring, and may include compounds that have a substituent that binds to at least one selected from the group consisting of the 1-, 3- and 5-positions of the pyrazoline ring.
  • substituents include alkyl groups (alkyl groups having 1 to 20 carbon atoms (acyclic alkyl groups), cycloalkyl groups having 5 to 12 carbon atoms, etc.), aryl groups (phenyl groups, aralkyl groups (benzyl group, phenethyl group, etc.
  • the benzene ring of the aryl group may have a substituent, such as an alkyl group, an alkoxy group (methoxy group, ethoxy group, propoxy group, etc.), a halogeno group (fluoro group, chloro group, bromo group, etc.). , a sulfonamide group, and the like.
  • the substituent may be an alkylester group (eg, an alkylester group having 1 to 6 carbon atoms), an alkylamino group (eg, an alkylamino group having 1 to 20 carbon atoms), or the like.
  • Component (D) consists of a compound represented by the following general formula (d1) and a compound represented by the following general formula (d2) from the viewpoint of easily obtaining excellent followability, resolution and adhesion. It may contain at least one selected from the group, and may contain a compound represented by the following general formula (d1).
  • R d11 , R d12 and R d13 each independently represent an alkoxy group (eg, an alkoxy group having 1 to 10 carbon atoms) or an alkyl group (eg, an alkyl group having 1 to 3 carbon atoms); , d11, d12 and d13 each independently represent an integer of 0 to 5.
  • d11 is 2 or more, a plurality of R d11 may be the same or different, and when d12 is 2 or more, a plurality of R d12 may be the same. They may be different, and when d13 is 2 or more, a plurality of R d13 may be the same or different.
  • R d11 , R d12 and R d13 is an alkoxy group (eg, an alkoxy group having 1 to 10 carbon atoms) or an alkyl group (eg, an alkyl group having 1 to 3 carbon atoms). It's okay. At least one selected from the group consisting of R d12 and R d13 may be an alkoxy group, a methoxy group, an ethoxy group or a propoxy group from the viewpoint of easily obtaining excellent followability, resolution and adhesion. good. d11 may be 0 from the viewpoint of easily obtaining excellent followability, resolution and adhesion.
  • At least one selected from the group consisting of d12 and d13 may be 0, 1, 2 or 3, or 1 from the viewpoint of easily obtaining excellent followability, resolution and adhesion.
  • the sum of d11, d12 and d13 may be 0-6 or 1-6.
  • R d21 and R d22 are each independently an alkyl group (an alkyl group having 1 to 20 carbon atoms (acyclic alkyl group), a cycloalkyl group having 5 to 12 carbon atoms, etc.), an alkoxy group, (for example, an alkoxy group having 1 to 6 carbon atoms), an amino group, a halogeno group, a carboxy group, a cyano group, a nitro group, an acetyl group, a sulfonyl group, or a sulfonamide group, and d21 and d22 are each independently Indicates an integer from 0 to 5.
  • d21 is 2 or more, a plurality of R d21 may be the same or different, and when d22 is 2 or more, a plurality of R d22 may be the same. can be different.
  • R d21 may be a halogeno group, a fluoro group, a chloro group, or a bromo group.
  • R d22 may be a sulfonamide group. At least one selected from the group consisting of d21 and d22 may be 0, 1, 2 or 3, and may be 1.
  • pyrazoline compounds include 1-phenyl-3-(4-isopropylstyryl)-5-(4-isopropylphenyl)-pyrazoline, 1-phenyl-3-(4-tert-butyl-styryl)-5-(4- tert-butylphenyl)-pyrazoline, 1-phenyl-3-(4-methoxystyryl)-5-(4-methoxyphenyl)-pyrazoline, 1-phenyl-3-(3,5-dimethoxystyryl)-5-( 3,5-dimethoxyphenyl)-pyrazoline, 1-phenyl-3-(3,4-dimethoxystyryl)-5-(3,4-dimethoxyphenyl)-pyrazoline, 1-phenyl-3-(2,6-dimethoxy styryl)-5-(2,6-dimethoxyphenyl)-pyrazoline, 1-phenyl-3-(2,5-dimethoxystyryl)-5
  • the pyrazoline compound is a compound having an aryl group bonded to the pyrazoline ring (two or more (eg, 2 to 3) aryl groups bonded to the pyrazoline ring) from the viewpoint of easily obtaining excellent followability, resolution and adhesion.
  • ⁇ may include a compound having an aryl group bonded to at least one selected from the group consisting of 1-position, 3-position and 5-position of the pyrazoline ring, 1-position of the pyrazoline ring, 3-position and a compound having a phenyl group (a phenyl group which may have a substituent) bonded to at least one selected from the group consisting of the 5-position, 1-phenyl-3-(4-methoxystyryl)-5- (4-Methoxyphenyl)pyrazoline and at least one selected from the group consisting of 4-[[3-(4-chlorophenyl)-4,5-dihydro-1H-pyrazol]-1-yl]benzenesulfonamide OK.
  • the content of component (D) may be within the following ranges based on the total amount of the photosensitive film or the total amount of the photosensitive resin composition (total solid content).
  • the content of component (D) is 0.01% by mass or more, 0.03% by mass or more, 0.05% by mass or more, and 0.08% by mass, from the viewpoint of easily obtaining excellent followability, resolution, and adhesion.
  • % by mass or more 0.10% by mass or more, more than 0.10% by mass, 0.12% by mass or more, 0.15% by mass or more, 0.18% by mass or more, or 0.19% by mass or more good.
  • the content of the component (D) is 0.20% by mass or more, 0.23% by mass or more, 0.25% by mass or more from the viewpoint of easily obtaining excellent adhesion and from the viewpoint of easily obtaining excellent sensitivity. , or 0.28% by mass or more.
  • the content of component (D) is 5.0% by mass or less, 3.0% by mass or less, 1.0% by mass or less, and 0.80 from the viewpoint of easily obtaining excellent followability, resolution, and adhesion. % by mass or less, 0.70 mass % or less, 0.60 mass % or less, 0.50 mass % or less, 0.40 mass % or less, 0.35 mass % or less, 0.30 mass % or less, or 0. It may be 28% by mass or less.
  • the content of component (D) is 0.25% by mass or less, 0.23% by mass or less, 0.20% by mass or less, or 0.19% by mass or less from the viewpoint of easily obtaining excellent followability. It's okay. From these viewpoints, the content of component (D) may be 0.01 to 5.0% by mass, or 0.10 to 1.0% by mass.
  • the content of component (D) may be within the following range with respect to the total amount of 100 parts by mass of components (A) and (B).
  • the content of component (D) is 0.01 parts by mass or more, 0.02 parts by mass or more, more than 0.02 parts by mass, and 0.03 from the viewpoint of easily obtaining excellent followability, resolution, and adhesion. parts by mass or more, 0.05 parts by mass or more, 0.08 parts by mass or more, 0.10 parts by mass or more, more than 0.10 parts by mass, 0.12 parts by mass or more, 0.15 parts by mass or more, 0.18 parts by mass parts or more, or 0.20 parts by mass or more.
  • the content of the component (D) is 0.21 parts by mass or more, 0.23 parts by mass or more, and 0.25 parts by mass or more from the viewpoint of easily obtaining excellent adhesion and from the viewpoint of easily obtaining excellent sensitivity. , 0.28 parts by mass or more, or 0.30 parts by mass or more.
  • the content of component (D) is 5.0 parts by mass or less, 3.0 parts by mass or less, 1.0 parts by mass or less, and 0.80 from the viewpoint of easily obtaining excellent followability, resolution, and adhesion. Parts by mass or less, 0.70 parts by mass or less, 0.60 parts by mass or less, 0.50 parts by mass or less, 0.40 parts by mass or less, 0.35 parts by mass or less, or 0.30 parts by mass or less good.
  • the content of component (D) is 0.28 parts by mass or less, 0.25 parts by mass or less, 0.23 parts by mass or less, 0.21 parts by mass or less, or It may be 0.20 parts by mass or less. From these viewpoints, the content of component (D) may be 0.01 to 5.0 parts by mass, 0.03 to 5.0 parts by mass, or 0.10 to 1.0 parts by mass.
  • the content of component (D) may be within the following ranges per 100 parts by mass of component (A).
  • the content of component (D) is 0.01 parts by mass or more, 0.03 parts by mass or more, 0.05 parts by mass or more, and 0.08 parts by mass from the viewpoint of easily obtaining excellent followability, resolution, and adhesion. parts by mass or more, 0.10 parts by mass or more, 0.15 parts by mass or more, 0.20 parts by mass or more, 0.25 parts by mass or more, 0.30 parts by mass or more, 0.35 parts by mass or more, or 0. It may be 36 parts by mass or more.
  • the content of the component (D) is 0.40 parts by mass or more, 0.45 parts by mass or more, and 0.50 parts by mass or more from the viewpoint of easily obtaining excellent adhesion and from the viewpoint of easily obtaining excellent sensitivity. , or 0.54 parts by mass or more.
  • the content of component (D) is 5.0 parts by mass or less, 3.0 parts by mass or less, 1.0 parts by mass or less, and 0.80 from the viewpoint of easily obtaining excellent followability, resolution, and adhesion. It may be 0.70 parts by mass or less, 0.60 parts by mass or less, 0.55 parts by mass or less, or 0.54 parts by mass or less.
  • the content of component (D) is 0.54 parts by mass or less, 0.50 parts by mass or less, 0.45 parts by mass or less, 0.40 parts by mass or less, or It may be 0.36 parts by mass or less. From these viewpoints, the content of component (D) may be 0.01 to 5.0 parts by mass, 0.04 to 5.0 parts by mass, or 0.10 to 1.0 parts by mass.
  • the content of component (D) may be within the following ranges per 100 parts by mass of component (B).
  • the content of component (D) is 0.01 parts by mass or more, 0.03 parts by mass or more, 0.05 parts by mass or more, and 0.08 parts by mass from the viewpoint of easily obtaining excellent followability, resolution, and adhesion. Parts by mass or more, 0.10 parts by mass or more, 0.15 parts by mass or more, 0.20 parts by mass or more, 0.25 parts by mass or more, 0.30 parts by mass or more, 0.35 parts by mass or more, 0.40 mass parts parts or more, or 0.45 parts by mass or more.
  • the content of component (D) is 0.50 parts by mass or more, 0.51 parts by mass or more, and 0.55 parts by mass or more from the viewpoint of easily obtaining excellent adhesion and from the viewpoint of easily obtaining excellent sensitivity. , 0.60 parts by mass or more, 0.65 parts by mass or more, or 0.68 parts by mass or more.
  • the content of component (D) is 5.0 parts by mass or less, 3.0 parts by mass or less, 1.0 parts by mass or less, and 0.80 from the viewpoint of easily obtaining excellent followability, resolution, and adhesion. It may be 0.70 parts by mass or less, or 0.68 parts by mass or less.
  • the content of component (D) is 0.65 parts by mass or less, 0.60 parts by mass or less, 0.55 parts by mass or less, 0.51 parts by mass or less, 0.65 parts by mass or less, 0.51 parts by mass or less, or 0.60 parts by mass or less, from the viewpoint of easily obtaining excellent followability. It may be 50 parts by mass or less, or 0.45 parts by mass or less. From these viewpoints, the content of component (D) may be 0.01 to 5.0 parts by mass, 0.05 to 5.0 parts by mass, or 0.10 to 1.0 parts by mass.
  • the content of component (D) may be within the following range with respect to 100 parts by mass of the total amount of components (C) and (D).
  • the content of component (D) is 0.10 parts by mass or more, 0.50 parts by mass or more, 0.80 parts by mass or more, and 1.0 part by mass from the viewpoint of easily obtaining excellent followability, resolution and adhesion. Parts by mass or more, 1.5 parts by mass or more, 2.0 parts by mass or more, 2.5 parts by mass or more, 3.0 parts by mass or more, 3.5 parts by mass or more, or 3.8 parts by mass or more good.
  • the content of component (D) is 4.0 parts by mass or more, 4.5 parts by mass or more, and 5.0 parts by mass or more from the viewpoint of easily obtaining excellent adhesion and from the viewpoint of easily obtaining excellent sensitivity. , more than 5.0 parts by mass, 5.5 parts by mass or more, or 5.7 parts by mass or more.
  • the content of component (D) is 20 parts by mass or less, 15 parts by mass or less, 10 parts by mass or less, 9.0 parts by mass or less, from the viewpoint of easily obtaining excellent followability, resolution and adhesion. It may be 0 parts by mass or less, 7.0 parts by mass or less, 6.0 parts by mass or less, or 5.7 parts by mass or less.
  • the content of component (D) is 5.5 parts by mass or less, 5.0 parts by mass or less, less than 5.0 parts by mass, 4.5 parts by mass or less, 4. It may be 0 parts by mass or less, or 3.8 parts by mass or less. From these viewpoints, the content of component (D) may be 0.10 to 20 parts by mass, or 1.0 to 10 parts by mass.
  • the photosensitive film and photosensitive resin composition according to the present embodiment may contain a polymerization inhibitor (excluding compounds corresponding to any of the components (A) to (D)), and contains a polymerization inhibitor. It doesn't have to be.
  • a polymerization inhibitor suppresses polymerization in an unexposed area during formation of a resist pattern, and tends to improve stability of sensitivity over time and resolution.
  • Polymerization inhibitors include catechol compounds (eg, tert-butylcatechol such as 4-tert-butylcatechol), hindered amines (eg, 2,2,6,6-tetramethyl-4-hydroxypiperidine-1-oxyl), 4 -hydroxy-2,2,6,6-tetramethylpiperidine-N-oxyl and the like.
  • the photosensitive film and the photosensitive resin composition according to the present embodiment may contain a catechol compound from the viewpoint of easily obtaining excellent sensitivity and stability over time.
  • the content of the polymerization inhibitor may be within the following range with respect to the total amount of 100 parts by mass of components (A) and (B).
  • the content of the polymerization inhibitor is 0.001 parts by mass or more, 0.003 parts by mass or more, 0.005 parts by mass or more, and 0.008 parts by mass from the viewpoint of easily obtaining excellent followability, resolution, and adhesion. parts or more, or 0.010 parts by mass or more.
  • the content of the polymerization inhibitor may be 0.011 parts by mass or more, 0.012 parts by mass or more, or 0.015 parts by mass or more from the viewpoint of easily obtaining even better resolution.
  • the content of the polymerization inhibitor is 0.100 parts by mass or less, 0.050 parts by mass or less, 0.040 parts by mass or less, and 0.030 parts by mass from the viewpoint of easily obtaining excellent followability, resolution, and adhesion. parts or less, 0.020 parts by mass or less, or 0.015 parts by mass or less.
  • the content of the polymerization inhibitor is 0.012 parts by mass or less, 0.011 parts by mass or less, or 0.010 parts by mass from the viewpoint of easily obtaining excellent followability and from the viewpoint of easily obtaining excellent sensitivity. may be: From these points of view, the content of the polymerization inhibitor may be 0.001 to 0.100 parts by mass.
  • the content of the polymerization inhibitor may be 0 parts by mass or may exceed 0 parts by mass.
  • the photosensitive resin composition according to this embodiment may contain an organic solvent.
  • Organic solvents include methanol, ethanol, acetone, methyl ethyl ketone, methyl cellosolve, ethyl cellosolve, toluene, N,N-dimethylformamide, propylene glycol monomethyl ether and the like.
  • the photosensitive film and photosensitive resin composition according to the present embodiment may contain other components (excluding compounds corresponding to any of components (A) to (D)) other than the components described above.
  • Other components include hydrogen donors (bis[4-(dimethylamino)phenyl]methane, bis[4-(diethylamino)phenyl]methane, leuco crystal violet, N-phenylglycine, etc.) and dyes (malachite green, etc.).
  • mercapto group-containing Hydrogen donor sensitizer, photocoloring agent, anti-thermocoloring agent, plasticizer (p-toluenesulfonamide, etc.), pigment, filler, antifoaming agent, flame retardant, stabilizer, adhesion imparting agent, leveling agents, release accelerators, antioxidants, perfumes, imaging agents, thermal cross-linking agents, thermal radical polymerization initiators, and the like.
  • the content of the thermal radical polymerization initiator is based on the total amount of the photosensitive film or the total amount of the photosensitive resin composition (total solid content), It may be 0.5% by mass or less, less than 0.5% by mass, 0.1% by mass or less, 0.01% by mass or less, or 0.001% by mass or less.
  • the photosensitive film and photosensitive resin composition according to the present embodiment may not contain a thermal radical polymerization initiator (the above content may be substantially 0% by mass).
  • a vinyl polymer e.g., a vinyl polymer containing a side chain having an epoxy group
  • an oxetane compound e.g., even if it has a substituent
  • the content of at least one selected from the group consisting of oxetane compounds having two or more good oxetane rings is 20% by mass based on the total amount of the photosensitive film or the total amount of the photosensitive resin composition (total solid content). Below, it may be less than 20% by mass, 10% by mass or less, 1% by mass or less, 0.1% by mass or less, 0.01% by mass or less, or 0.001% by mass or less.
  • the photosensitive film and photosensitive resin composition according to the present embodiment include a vinyl polymer (e.g., a vinyl polymer containing a side chain having an epoxy group) and an oxetane compound (e.g., even if it has a substituent oxetane compounds having two or more good oxetane rings) may not be contained (the above content may be substantially 0% by mass).
  • a vinyl polymer e.g., a vinyl polymer containing a side chain having an epoxy group
  • an oxetane compound e.g., even if it has a substituent oxetane compounds having two or more good oxetane rings
  • the content of at least one selected from the group consisting of anthracene compounds, distyrylbenzene compounds and naphthalene compounds is the total amount of the photosensitive film or the photosensitive resin It may be 0.01% by mass or less, less than 0.01% by mass, 0.001% by mass or less, or 0.0001% by mass or less based on the total amount of the composition (total solid content).
  • the photosensitive film and photosensitive resin composition according to the present embodiment may not contain at least one selected from the group consisting of an anthracene compound, a distyrylbenzene compound and a naphthalene compound (the above content is substantially 0). % by mass).
  • the content of the nitroxyl compound is based on 100 parts by mass of component (A) or 100 parts by mass of the total amount of components (A) and (B). , 0.005 parts by weight or less, less than 0.005 parts by weight, 0.001 parts by weight or less, or 0.0001 parts by weight or less.
  • the photosensitive film and photosensitive resin composition according to the present embodiment may not contain a nitroxyl compound (the above content may be substantially 0 parts by mass).
  • the content of the mercapto compound is 0.1 part by mass or less, 0.1 part by mass or less with respect to 100 parts by mass as the total amount of components (A) and (B). It may be less than 1 part by weight, 0.001 parts by weight or less, less than 0.001 parts by weight, or 0.0001 parts by weight or less.
  • the photosensitive film and photosensitive resin composition according to the present embodiment may not contain a mercapto compound (the above content may be substantially 0 parts by mass).
  • a photosensitive element according to this embodiment includes a support and a photosensitive resin layer disposed on the support, and the photosensitive resin layer is the photosensitive film according to this embodiment.
  • the photosensitive element according to this embodiment may comprise a protective layer disposed on the photosensitive resin layer.
  • the photosensitive element according to this embodiment may comprise a cushion layer, an adhesive layer, a light absorbing layer, a gas barrier layer, and the like.
  • the photosensitive element may be in the form of a sheet, or in the form of a photosensitive element roll wound around a core.
  • FIG. 1 is a schematic cross-sectional view showing an example of a photosensitive element.
  • the photosensitive element 1 includes a support (support film) 2, a photosensitive resin layer (photosensitive film) 3 disposed on the support 2, and a photosensitive resin layer 3 disposed on the and a protective layer (protective film) 4.
  • the photosensitive resin layer 3 is made of the photosensitive resin composition according to this embodiment.
  • the photosensitive element 1 can be obtained, for example, by the following procedure.
  • the photosensitive resin layer 3 is formed on the support 2 .
  • the photosensitive resin layer 3 can be formed, for example, by drying a coating layer formed by applying a photosensitive resin composition containing an organic solvent.
  • a protective layer 4 is arranged on the photosensitive resin layer 3 .
  • Each of the support and the protective layer may be a polymer film having heat resistance and solvent resistance, such as a polyester film (polyethylene terephthalate film, etc.), a polyolefin film (polyethylene film, polypropylene film, etc.), a hydrocarbon-based polymer (polyolefin film, etc.). excluding film).
  • the type of film forming the protective layer and the type of film forming the support may be the same or different.
  • the thickness of the support may be 1 ⁇ m or more, 5 ⁇ m or more, 10 ⁇ m or more, or 15 ⁇ m or more from the viewpoint of easily suppressing damage to the support when the support is peeled off from the photosensitive resin layer.
  • the thickness of the support may be 100 ⁇ m or less, 50 ⁇ m or less, 30 ⁇ m or less, or 20 ⁇ m or less from the viewpoint of favorable exposure when exposed through the support.
  • the thickness of the protective layer is 1 ⁇ m or more, 5 ⁇ m or more, 10 ⁇ m or more, or It may be 15 ⁇ m or more.
  • the thickness of the protective layer may be 100 ⁇ m or less, 50 ⁇ m or less, or 30 ⁇ m or less from the viewpoint of easily improving productivity.
  • the method for producing a laminate according to the present embodiment includes an arrangement step of arranging a photosensitive resin layer on a substrate (for example, a substrate) using the photosensitive film, the photosensitive element, or the photosensitive resin composition according to the present embodiment. (Photosensitive resin layer arranging step), an exposure step of photocuring (exposing) a part of the photosensitive resin layer, and removing at least a part of the uncured portion (unexposed portion) of the photosensitive resin layer and a developing step of forming a cured product pattern.
  • the laminate according to this embodiment is obtained by the method for producing a laminate according to this embodiment, and may be a wiring board (for example, a printed wiring board).
  • the laminate according to the present embodiment may be in a mode including a substrate and a cured product pattern (cured product according to the present embodiment) arranged on the substrate.
  • the base material may have recesses.
  • the cross-sectional shape of the concave portion (cross-sectional shape perpendicular to the stacking direction) may be circular (for example, substantially perfect circular), rectangular, linear (linear), or the like.
  • the concave portion of the substrate may be a bottomed concave portion.
  • the diameter (for example, maximum diameter) or depth (length in the stacking direction) of the recess may be within the following ranges.
  • the diameter of the recess may be 10 ⁇ m or more, 30 ⁇ m or more, 50 ⁇ m or more, 80 ⁇ m or more, 100 ⁇ m or more, 120 ⁇ m or more, 150 ⁇ m or more, 180 ⁇ m or more, or 200 ⁇ m or more.
  • the diameter of the recess may be 500 ⁇ m or less, 400 ⁇ m or less, 300 ⁇ m or less, 250 ⁇ m or less, or 200 ⁇ m or less. From these points of view, the diameter of the recess may be 10 to 500 ⁇ m.
  • the depth of the recess may be 1 ⁇ m or more, 3 ⁇ m or more, 5 ⁇ m or more, 6 ⁇ m or more, or 8 ⁇ m or more.
  • the depth of the recess may be 20 ⁇ m or less, 18 ⁇ m or less, 15 ⁇ m or less, 12 ⁇ m or less, 10 ⁇ m or less, or 8 ⁇ m or less.
  • the depth of the recess may be 1-20 ⁇ m.
  • a photosensitive resin layer made of the photosensitive resin composition according to the present embodiment is placed on the substrate.
  • the photosensitive resin layer may be formed by removing the protective layer from the photosensitive element and pressing the photosensitive resin layer of the photosensitive element onto the substrate while heating. It may be formed by coating and drying on the material.
  • the base material has a concave portion having the above diameter (for example, a diameter of 500 ⁇ m or less), and at least a part of the photosensitive resin layer is arranged in the concave portion in the placing step. It's okay.
  • an actinic ray is irradiated with a mask placed on the photosensitive resin layer, and a region other than the region where the mask is placed in the photosensitive resin layer may be exposed and photocured. Instead, a part of the photosensitive resin layer may be exposed and photocured by irradiating actinic rays in a desired pattern by a direct drawing exposure method such as an LDI exposure method or a DLP exposure method.
  • an ultraviolet light source or a visible light source may be used, such as a carbon arc lamp, a mercury vapor arc lamp, a high-pressure mercury lamp, a xenon lamp, a gas laser (such as an argon laser), a solid-state laser (such as a YAG laser), a semiconductor laser, and the like. is mentioned.
  • the development method in the development process may be, for example, wet development or dry development.
  • Wet development can be carried out by using a developer corresponding to the photosensitive resin composition, for example, by dipping, puddle, spraying, brushing, slapping, scrubbing, rocking immersion, and the like.
  • the developer is appropriately selected according to the constitution of the photosensitive resin composition, and may be an alkaline developer or an organic solvent developer.
  • Alkaline developers include alkali hydroxides such as lithium, sodium or potassium hydroxide; alkali carbonates such as lithium, sodium, potassium or ammonium carbonates or bicarbonates; alkali metals such as potassium phosphate and sodium phosphate. Phosphates; alkali metal pyrophosphates such as sodium pyrophosphate and potassium pyrophosphate; borax; sodium metasilicate; tetramethylammonium hydroxide; ethanolamine; ethylenediamine; diethylenetriamine; It may be an aqueous solution containing a base such as 3-propanediol; 1,3-diamino-2-propanol; morpholine.
  • alkali hydroxides such as lithium, sodium or potassium hydroxide
  • alkali carbonates such as lithium, sodium, potassium or ammonium carbonates or bicarbonates
  • alkali metals such as potassium phosphate and sodium phosphate.
  • Phosphates alkali metal pyrophosphates such as sodium
  • the organic solvent developer may contain organic solvents such as 1,1,1-trichloroethane, N-methylpyrrolidone, N,N-dimethylformamide, cyclohexanone, methylisobutylketone and ⁇ -butyrolactone.
  • organic solvents such as 1,1,1-trichloroethane, N-methylpyrrolidone, N,N-dimethylformamide, cyclohexanone, methylisobutylketone and ⁇ -butyrolactone.
  • the method for producing a laminate according to the present embodiment may include, after the developing step, a metal layer forming step of forming a metal layer on at least part of the portion of the substrate where the cured product pattern is not formed.
  • the laminate according to the present embodiment includes a substrate, a cured product pattern (cured product according to the present embodiment) arranged on the substrate, and at least one part of the substrate where the cured product pattern is not formed. and a metal layer disposed on the part.
  • the metal layer in the metal layer forming step may be, for example, a metal copper layer.
  • the metal layer can be formed by plating, for example.
  • the plating treatment may be one or both of electrolytic plating treatment and electroless plating treatment.
  • the method for manufacturing a laminate according to the present embodiment includes a step of further curing the resist pattern by heating at 60 to 250° C. or exposing at 0.2 to 10 J/cm 2 after the developing step. you can
  • the method for manufacturing a laminate according to this embodiment may include a step of removing the cured product pattern after the metal layer forming step.
  • the cured product pattern can be removed by, for example, developing with a strong alkaline aqueous solution by an immersion method, a spray method, or the like.
  • Solution (a) by mixing 27 parts by mass of methacrylic acid, 3 parts by mass of 2-hydroxyethyl methacrylate, 20 parts by mass of benzyl methacrylate, 50 parts by mass of styrene, and 0.9 parts by mass of azobisisobutyronitrile was prepared.
  • a solution (b) was prepared by dissolving 0.5 parts by mass of azobisisobutyronitrile in 50 parts by mass of a mixture of 30 parts by mass of methyl cellosolve and 20 parts by mass of toluene.
  • the solution (a) was dropped into the flask over 4 hours at a constant dropping rate, the solution in the flask was stirred at 80° C. for 2 hours.
  • the solution (b) was added dropwise into the flask over 10 minutes at a constant dropping rate, and then the solution in the flask was stirred at 80° C. for 3 hours.
  • the solution in the flask was heated to 95°C over 1 hour and kept at 90°C for 2 hours, then stirring was stopped and the solution was cooled to room temperature (25°C) to obtain a solution of binder polymer A1.
  • the non-volatile content (solid content) of the solution of binder polymer A1 was 49% by mass.
  • the acid value of binder polymer A1 was 176 mgKOH/g.
  • the binder polymer A1 had a weight average molecular weight (Mw) of 35,000 and a number average molecular weight (Mn) of 16,000.
  • Mw weight average molecular weight
  • Mn number average molecular weight
  • the weight-average molecular weight and number-average molecular weight were measured by gel permeation chromatography (GPC) under the following conditions and derived by conversion using a standard polystyrene calibration curve.
  • the non-volatile content (solid content) of the solution of binder polymer A2 was 49% by mass.
  • the binder polymer A2 had an acid value of 175 mgKOH/g, a weight average molecular weight (Mw) of 35,000, and a number average molecular weight (Mn) of 16,500.
  • a photosensitive resin composition was prepared by mixing each component shown in Table 1, 16 parts by mass of toluene, 6 parts by mass of methanol, and 10 parts by mass of acetone.
  • Table 1 shows the amount (parts by mass) of each component, and the amount of the binder polymer and FA-321M (70) is the weight of the non-volatile matter (solid content). Details of each component shown in Table 1 are as follows.
  • BCIM 2,2'-bis(o-chlorophenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole (manufactured by Hampford)
  • TBC 4-tert-butyl catechol (manufactured by DIC Corporation, trade name “DIC-TBC”)
  • LCV Leuco Crystal Violet (manufactured by Yamada Chemical Industry Co., Ltd.)
  • MKG Malachite Green (manufactured by Osaka Organic Chemical Industry Co., Ltd.)
  • SF-808H a mixture of carboxybenzotriazole, 5-amino-1H-tetrazole and methoxypropanol (manufactured by Sanwa Kasei Co., Ltd.)
  • a polyethylene terephthalate film (manufactured by Toray Industries, Inc., trade name “FB-40”) having a thickness of 16 ⁇ m was prepared as a support. After coating the above-mentioned photosensitive resin composition on the support so that the thickness becomes uniform, the photosensitive resin composition is sequentially dried in a hot air convection dryer at 70° C. and 110° C. to obtain a photosensitive resin layer (photosensitive film. An average thickness of 10 locations after drying: 19 ⁇ m) was formed.
  • a polyethylene film (manufactured by Tamapoly Co., Ltd., trade name "NF-15") was laminated as a protective layer to this photosensitive resin layer to obtain a photosensitive element comprising a support, a photosensitive resin layer and a protective layer in this order. .
  • a copper-clad laminate (substrate, manufactured by Showa Denko Materials Co., Ltd., trade name: MCL-E-67) with copper foil (thickness: 18 ⁇ m) arranged on both sides of a glass epoxy material is pickled and washed with water. Afterwards, the substrate was obtained by drying with an air stream. Next, after heating this substrate to 80° C., while peeling off the protective layer, the photosensitive element is laminated so that the photosensitive resin layer is in contact with the copper surface, thereby forming a substrate (copper-clad laminate ), a photosensitive resin layer, and a support in this order to obtain a laminate A. Lamination was performed using heat rolls at 110° C. at a pressure of 0.4 MPa and a roll speed of 1.5 m/min.
  • a copper-clad laminate (substrate, manufactured by Showa Denko Materials Co., Ltd., trade name: MCL-E-67) with copper foil (thickness: 18 ⁇ m) arranged on both sides of a glass epoxy material is pickled and washed with water. Afterwards, the substrate was obtained by drying with an air flow. Next, round holes (cross-sectional shape: substantially perfect circle) having a diameter of 200 ⁇ m and a depth of 8 ⁇ m were formed in this substrate at 25 locations (arrangement: 5 ⁇ 5, shortest distance between adjacent round holes: 2 cm).
  • the support After exposure, the support is peeled off from the laminate A to expose the photosensitive resin layer, and a 1% by weight sodium carbonate aqueous solution is sprayed at 30° C. for twice the minimum development time described above, thereby removing the unexposed area. removed.
  • the resolution was evaluated by Table 1 shows the results. A smaller value means better resolution.
  • the support After exposure, the support is peeled off from the laminate A to expose the photosensitive resin layer, and a 1% by weight sodium carbonate aqueous solution is sprayed at 30° C. for twice the minimum development time described above, thereby removing the unexposed area. removed.
  • the adhesion was evaluated by Table 1 shows the results. A smaller value means better adhesion.

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Abstract

Un film photosensible comprend (A) un polymère liant, (B) un composé photopolymérisable, (C) un initiateur de photopolymérisation et (D) un composé de pyrazoline, et il a une épaisseur de 20 µm ou moins. Un élément photosensible 1 est pourvu d'un corps de support 2 et d'une couche de résine photosensible 3 qui est disposée sur le corps de support 2, la couche de résine photosensible 3 étant le film photosensible ci-décrit. Un procédé de production d'un corps multicouche comprend : une étape d'agencement dans laquelle une couche de résine photosensible est disposée sur un matériau de base à l'aide du film photosensible ci-décrit ou de l'élément photosensible 1 ci-décrit ; une étape dans laquelle une partie de la couche de résine photosensible est photodurcie ; et une étape dans laquelle un motif de produit durci est formé en éliminant au moins une partie d'une partie non durcie de la couche de résine photosensible.
PCT/JP2021/029189 2021-03-09 2021-08-05 Film photosensible, élément photosensible et procédé de production d'un corps multicouche WO2023012985A1 (fr)

Priority Applications (8)

Application Number Priority Date Filing Date Title
PCT/JP2021/029189 WO2023012985A1 (fr) 2021-08-05 2021-08-05 Film photosensible, élément photosensible et procédé de production d'un corps multicouche
KR1020227035580A KR20230154733A (ko) 2021-03-09 2022-03-07 감광성 필름, 감광성 엘리먼트, 및, 적층체의 제조 방법
JP2022561676A JPWO2022191125A1 (fr) 2021-03-09 2022-03-07
CN202280003952.1A CN116848461A (zh) 2021-03-09 2022-03-07 感光性膜、感光性元件及层叠体的制造方法
PCT/JP2022/009697 WO2022191125A1 (fr) 2021-03-09 2022-03-07 Film photosensible, élément photosensible et procédé de production pour produit stratifié
US17/922,867 US20230161248A1 (en) 2021-03-09 2022-03-07 Photosensitive film, photosensitive element, and method for producing laminate
EP22767081.7A EP4307049A4 (fr) 2021-03-09 2022-03-07 Film photosensible, élément photosensible et procédé de production pour produit stratifié
TW111108374A TW202307564A (zh) 2021-08-05 2022-03-08 感光性薄膜、感光性元件及積層體之製造方法

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JP2007122028A (ja) * 2005-09-28 2007-05-17 Asahi Kasei Electronics Co Ltd 感光性樹脂組成物およびその積層体
JP2017040710A (ja) * 2015-08-18 2017-02-23 日立化成株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP2019109543A (ja) * 2014-05-23 2019-07-04 日立化成株式会社 レジストパターンの形成方法、プリント配線板の製造方法、投影露光用感光性樹脂組成物及び感光性エレメント

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007122028A (ja) * 2005-09-28 2007-05-17 Asahi Kasei Electronics Co Ltd 感光性樹脂組成物およびその積層体
JP2019109543A (ja) * 2014-05-23 2019-07-04 日立化成株式会社 レジストパターンの形成方法、プリント配線板の製造方法、投影露光用感光性樹脂組成物及び感光性エレメント
JP2017040710A (ja) * 2015-08-18 2017-02-23 日立化成株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法

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