WO2022180972A1 - 超音波検査装置 - Google Patents

超音波検査装置 Download PDF

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Publication number
WO2022180972A1
WO2022180972A1 PCT/JP2021/043849 JP2021043849W WO2022180972A1 WO 2022180972 A1 WO2022180972 A1 WO 2022180972A1 JP 2021043849 W JP2021043849 W JP 2021043849W WO 2022180972 A1 WO2022180972 A1 WO 2022180972A1
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WO
WIPO (PCT)
Prior art keywords
probe
incident
unit
eccentrically arranged
receiving probe
Prior art date
Application number
PCT/JP2021/043849
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
睦三 鈴木
友輔 高麗
茂 大野
Original Assignee
株式会社日立パワーソリューションズ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社日立パワーソリューションズ filed Critical 株式会社日立パワーソリューションズ
Priority to KR1020237028772A priority Critical patent/KR20230133375A/ko
Priority to CN202180094530.5A priority patent/CN116917730A/zh
Publication of WO2022180972A1 publication Critical patent/WO2022180972A1/ja

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G01N29/11—Analysing solids by measuring attenuation of acoustic waves
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/24—Probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/24—Probes
    • G01N29/2437—Piezoelectric probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/44—Processing the detected response signal, e.g. electronic circuits specially adapted therefor
    • G01N29/48—Processing the detected response signal, e.g. electronic circuits specially adapted therefor by amplitude comparison
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/01—Indexing codes associated with the measuring variable
    • G01N2291/015—Attenuation, scattering
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/02—Indexing codes associated with the analysed material
    • G01N2291/028—Material parameters
    • G01N2291/0289—Internal structure, e.g. defects, grain size, texture
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/04—Wave modes and trajectories
    • G01N2291/052—Perpendicular incidence, angular propagation

Definitions

  • FIG. 1 is a diagram showing the configuration of the ultrasonic inspection apparatus Z of the first embodiment.
  • the scanning measuring device 1 is shown in a schematic cross-sectional view.
  • FIG. 1 shows an orthogonal three-axis coordinate system including the x-axis as the horizontal direction on the page, the y-axis as the vertical direction on the page, and the z-axis as the vertical direction on the page.
  • the ultrasonic inspection device Z detects the defect D by observing this change.
  • the receiving probes 121 that receive the ultrasonic beam U those arranged at positions where the eccentric distance L is greater than zero are defined as the eccentrically arranged receiving probes 120, and the eccentric distance L is zero. is defined as a coaxially arranged receiving probe 140 (FIG. 2A, etc.).
  • the receiving probe 121 is a term encompassing the eccentrically arranged receiving probe 120 and the coaxially arranged receiving probe 140, and is a name representing a probe that receives ultrasonic waves regardless of the eccentric distance L.
  • the eccentric distance L is set as follows, although the details will be described later. That is, the eccentricity distance L is set to a distance at which the scattered wave U1 (FIG. 6B) generated by the scattering of the ultrasonic beam U at the defect portion D of the object to be inspected E can be received. Alternatively, the eccentric A distance L is set. Alternatively, the eccentric distance L is set to a distance at which received signals other than noise are not detected when the sound portion N of the object to be inspected E is irradiated.
  • the eccentric receiving probe 120 is displaced from the transmitting probe 110 by the eccentric distance L in the x-axis direction in FIG.
  • An eccentrically positioned receive probe 120 may be positioned at .
  • the eccentric receiving probe 120 may be placed at L1 in the x-axis direction and at L2 in the y-axis direction (that is, the position of (L1, L2) when the position of the transmitting probe 110 on the xy plane is the origin). .
  • the receiving sound axis AX2 is defined as the sound axis of the propagation path of the virtual ultrasonic beam when it is assumed that the eccentrically arranged receiving probe 120 emits the ultrasonic beam U.
  • the receiving sound axis AX2 is the central axis of the virtual ultrasonic beam when it is assumed that the eccentrically arranged receiving probe 120 emits the ultrasonic beam U.
  • the probe surface of the eccentrically arranged receiving probe 120 has a planar shape as a macroscopic shape, but as a microscopic shape, for example, a large number of minute projections (unit incident portions 1331) are formed on the surface. have. Therefore, the reception sound axis AX2 is a normal line extending from the surface (probe surface) when the surface (probe surface) is smoothed without the minute projections (unit incident portion 1331).
  • the transmission probe 110 When the transmission probe 110 is installed such that the transmission sound axis AX1 is perpendicular to the horizontal plane (the xy plane in FIG. 1), the propagation path of the ultrasonic beam U is not refracted. That is, the transmission sound axis AX1 is not refracted.
  • FIG. 2B is a diagram showing a case in which the transmission probe 110 is arranged at an angle ⁇ from the normal direction to the surface of the object E to be inspected.
  • the transmission sound axis AX1 is indicated by a solid arrow
  • the reception sound axis AX2 is indicated by a dashed-dotted arrow.
  • the propagation path of the ultrasonic beam U is refracted at the refraction angle ⁇ at the interface between the object to be inspected E and the fluid F.
  • FIG. Therefore, the transmission sound axis AX1 is bent (refracted) as indicated by the solid line arrow in FIG. 2B.
  • the eccentric distance L can be determined, for example, by using a standard sample that is made of the same material as the object to be inspected E and that has a defective portion D inside. Then, the eccentric distance L can be determined based on the position at which the ultrasonic beam U is irradiated to the defect portion D of the standard sample and the ultrasonic beam U or the scattered wave U1 can be received.
  • the eccentric distance adjustment unit 105 preferably adjusts the eccentric distance L to a distance at which the scattered wave U1 generated by the scattering of the irradiated ultrasonic beam U at the defect portion D of the object to be inspected E can be received. . By doing so, the scattered wave U1 peculiar to the defect portion D can be detected, and the detection accuracy of the defect portion D can be improved.
  • FIG. 7A is a diagram showing the propagation path of an ultrasonic beam U in a conventional ultrasonic inspection method, and shows the time of incidence on a healthy portion N.
  • FIG. 7B is a diagram showing the propagation path of the ultrasonic beam U in the conventional ultrasonic inspection method, and shows the time of incidence on the defect portion D.
  • FIG. in the conventional ultrasonic inspection method for example, as described in Patent Document 1, the coaxially arranged receiving probe 140 as the transmitting probe 110 and the receiving probe 121 is arranged so that the transmitting sound axis AX1 and the receiving sound axis AX2 are aligned. is placed.
  • the surface shape of the unit incident portion 1331 includes a curved line in a cross-sectional view (for example, FIG. 10A) including the receiving sound axis AX2. By including curves, it is possible to increase the number of normals NL and widen the range of the incident angle ⁇ in which the received signal strength can be increased.
  • a virtual cylinder 1342 indicated by a chain double-dashed line is a virtual cylinder, and a portion protruding from the surface of the incident portion 133 (indicated by a solid line in FIG. 10A) has substance.
  • the line indicated by the two-dot chain line inside the incident portion 133 in FIG. 10A is a virtual line for explanation and has no substance. That is, the shape of the incident portion 133 shown in FIG. 10A represents a shape having a convex shape that is a plurality of unit incident portions 1331 .
  • the meanings of the virtual pillars 1342 and 1343 are the same for FIGS. 20A, 23, 24 and the like.
  • the scattered wave U1 can be received.
  • the transmission system 210 is a system that generates the voltage applied to the transmission probe 110 .
  • the transmission system 210 has a waveform generator 211 and a signal amplifier 212 .
  • a waveform generator 211 generates a burst wave signal.
  • the generated burst wave signal is amplified by the signal amplifier 212 .
  • the voltage output from signal amplifier 212 is applied to transmit probe 110 .
  • FIG. 17 is a diagram explaining the reason why the effects of the second embodiment are produced.
  • Scattered wave U1 propagates in a direction deviated from transmission sound axis AX1. Therefore, as shown in FIG. 17, when the scattered wave U1 reaches the outside of the object to be inspected E, it forms a non-zero angle ⁇ 2 with the normal vector of the surface of the object to be inspected E and the interface between the object to be inspected E and the outside.
  • the angle of the scattered wave U1 emitted from the surface of the object E to be inspected has an angle ⁇ 2 which is a non-zero exit angle with respect to the normal line direction of the surface of the object E to be inspected.
  • the path of the scattered wave U1 which is the ultrasonic beam U, changes depending on the depth position of the defect D and the like. Therefore, it is preferable that the length a of the piezoelectric conversion element 132 is large, so that reception leakage of the scattered wave U1 at the wide piezoelectric conversion element 132 (FIG. 10A) can be suppressed.
  • the eccentrically arranged receiving probe 150 that receives the scattered wave U1 has high directivity.
  • the unit incidence part 1371 has a part of the side shape of the virtual cylinder 1343, which is a virtual cylinder, on the surface.
  • the virtual cylinder 1343 is an elliptical cylinder, unlike the virtual cylinder 1342 (FIG. 10C) which is a true cylinder.
  • the unit incidence part 1371 is formed by cutting the surface shape of an elliptical cylinder (semi-elliptic cylinder) in half so as to include the central axis and major axis of the side surface shape of the imaginary cylinder 1343, which is an elliptical cylinder, into a convex shape, for example. Prepare for.
  • FIG. 24 is a view for explaining the structure of the eccentrically arranged receiving probe 120 of the seventh embodiment, viewed from the side.
  • the incidence section 138 of the seventh embodiment is the same as the incidence section 134 (FIG. 20A) of the third embodiment, except that a unit incidence section 1381 is provided instead of the unit incidence section 1341 (FIG. 20A).
  • the allowable reception angle of the eccentrically arranged reception probe 120 can be expanded, and reception leakage of the scattered wave U1 can be suppressed.
  • FIG. 28 is a functional block diagram of the ultrasonic inspection apparatus Z of the tenth embodiment.
  • the output signal of the eccentrically placed receiving probe 120 is input to the receiving system 220a, amplified by the signal amplifier 222, and then extracted by the waveform analyzing section 224 for signal amplitude information (signal strength information).
  • Signal strength information is input to the data processing unit 201 .
  • the output signal of the coaxially arranged receiving probe 140 is input to the receiving system 220b, amplified by the signal amplifier 223, and then extracted by the waveform analyzing section 221 for signal amplitude information (signal strength information). Since the receiving sound axis AX2 of the coaxially arranged receiving probe 140 is installed so as to coincide with the transmitting sound axis AX1 of the transmitting probe 110, the amount of transmission of the ultrasonic beam U is blocked at the defect portion D, so that the coaxially arranged receiving probe 140 The amplitude of the received signal of receive probe 140 decreases at defect D.
  • the output signal of waveform analysis section 221 of reception system 220 b to which coaxially arranged reception probe 140 is connected is input to data processing section 201 .
  • the ultrasonic inspection apparatus Z of the eleventh embodiment inspects an object E to be inspected by causing an ultrasonic beam U to enter the object E to be inspected E through a liquid W that is a fluid F.
  • the object E to be inspected is placed below the liquid surface L0 of the liquid W and is immersed in the liquid W. As shown in FIG.
  • the path of the scattered wave U1 changes somewhat depending on the depth, shape, inclination, etc. of the defect portion D.
  • the scattering angle (the angle formed by the scattered wave U1 with respect to the transmission sound axis AX1) when scattering is usually about the same. Therefore, the deeper the defect D, the closer the scattered wave U1 to the transmission sound axis AX1, and the shallower the defect D, the farther the scattered wave U1 from the transmission sound axis AX1. Therefore, by using a plurality of unit probes 120a and using information about which position of the unit probe 120a received the signal, it is possible to obtain information about the defect portion D (depth of the defect portion D, etc.).
  • FIG. 32 is a diagram showing the arrangement of the eccentrically arranged receiving probes 120 in the thirteenth embodiment, and is a diagram in which the unit probes 120a arranged in the vertical direction are inclined in the twelfth embodiment.
  • a plurality of unit probes 120a are arranged symmetrically with respect to the transmission sound axis AX1. Therefore, at least two unit probes 120a are arranged at positions with the same eccentric distance L.
  • FIG. In the illustrated example, three unit probes 120a are symmetrically arranged on both sides of the transmission sound axis AX1 in plan view including the transmission sound axis AX1.
  • Two unit probes 120a are arranged at each position of three different eccentric distances L, respectively. Note that the unit probes 120a are arranged at an angle as in the second embodiment (FIG. 16).
  • the scanning and measuring apparatus 1 may further include a coaxially arranged receiving probe 140 (FIG. 27).
  • a coaxially arranged receiving probe 140 By further providing the coaxially arranged receiving probe 140, whether the defect D is large or small, it can be efficiently and easily detected.
  • each configuration, function, etc. described above may be realized by software by a processor such as the CPU 252 interpreting and executing a program for realizing each function.
  • a processor such as the CPU 252 interpreting and executing a program for realizing each function.
  • IC Integrated Circuit
  • SD Secure Digital

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
PCT/JP2021/043849 2021-02-26 2021-11-30 超音波検査装置 WO2022180972A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020237028772A KR20230133375A (ko) 2021-02-26 2021-11-30 초음파 검사 장치
CN202180094530.5A CN116917730A (zh) 2021-02-26 2021-11-30 超声波检查装置

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JP2021029814A JP7489345B2 (ja) 2021-02-26 2021-02-26 超音波検査装置
JP2021-029814 2021-02-26

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KR (1) KR20230133375A (zh)
CN (1) CN116917730A (zh)
TW (1) TWI813121B (zh)
WO (1) WO2022180972A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220283125A1 (en) * 2019-08-28 2022-09-08 Hitachi Power Solutions Co., Ltd. Ultrasonic Inspection System and Ultrasonic Inspection Method

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57110932A (en) * 1980-12-27 1982-07-10 Toyota Motor Corp Leakage detection of sealed container and device thereof
JPH09298795A (ja) * 1996-03-06 1997-11-18 Mitsubishi Heavy Ind Ltd 超音波センサ
JP2005315636A (ja) * 2004-04-27 2005-11-10 Tohoku Univ 閉じたき裂の定量評価法、及び閉じたき裂の定量評価装置
JP2011095171A (ja) * 2009-10-30 2011-05-12 Sumitomo Chemical Co Ltd 欠陥検査システム、並びに、それに用いる、欠陥検査用撮影装置、欠陥検査用画像処理装置、欠陥検査用画像処理プログラム、記録媒体、および欠陥検査用画像処理方法
JP2012013447A (ja) * 2010-06-29 2012-01-19 Hitachi Cable Ltd 半導体単結晶中の欠陥検査方法
US20140216158A1 (en) * 2011-08-17 2014-08-07 Sergio José Sanabria Martin Air coupled ultrasonic contactless method for non-destructive determination of defects in laminated structures
WO2019224119A2 (en) * 2018-05-25 2019-11-28 Pva Tepla Analytical Systems Gmbh Ultrasonic microscope and carrier for carrying an acoustic pulse transducer
JP2020143938A (ja) * 2019-03-04 2020-09-10 中道鉄工株式会社 超音波式漏れ検査装置
JP2020186914A (ja) * 2019-05-09 2020-11-19 株式会社日立パワーソリューションズ 超音波検査装置及び超音波検査システム

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JP4903032B2 (ja) 2006-11-24 2012-03-21 ジャパンプローブ株式会社 空中超音波探傷システム
FR2963443B1 (fr) * 2010-07-28 2012-08-17 Commissariat Energie Atomique Procede de commande de transducteurs d'une sonde a ultrasons, programme d'ordinateur correspondant et dispositif de sondage a ultrasons
JP5873773B2 (ja) * 2012-07-19 2016-03-01 株式会社日立パワーソリューションズ 測定周波数可変超音波映像装置
CN104374828A (zh) * 2014-11-18 2015-02-25 上海岩土工程勘察设计研究院有限公司 一种隐患探测的超声波层析成像方法
TWI539152B (zh) * 2015-05-14 2016-06-21 Univ Chang Gung Biological sensor and the method of detecting the concentration of the analyte in the sample
TWI699525B (zh) * 2019-05-21 2020-07-21 中華學校財團法人中華科技大學 三維相位移瑕疵檢測方法及系統

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57110932A (en) * 1980-12-27 1982-07-10 Toyota Motor Corp Leakage detection of sealed container and device thereof
JPH09298795A (ja) * 1996-03-06 1997-11-18 Mitsubishi Heavy Ind Ltd 超音波センサ
JP2005315636A (ja) * 2004-04-27 2005-11-10 Tohoku Univ 閉じたき裂の定量評価法、及び閉じたき裂の定量評価装置
JP2011095171A (ja) * 2009-10-30 2011-05-12 Sumitomo Chemical Co Ltd 欠陥検査システム、並びに、それに用いる、欠陥検査用撮影装置、欠陥検査用画像処理装置、欠陥検査用画像処理プログラム、記録媒体、および欠陥検査用画像処理方法
JP2012013447A (ja) * 2010-06-29 2012-01-19 Hitachi Cable Ltd 半導体単結晶中の欠陥検査方法
US20140216158A1 (en) * 2011-08-17 2014-08-07 Sergio José Sanabria Martin Air coupled ultrasonic contactless method for non-destructive determination of defects in laminated structures
WO2019224119A2 (en) * 2018-05-25 2019-11-28 Pva Tepla Analytical Systems Gmbh Ultrasonic microscope and carrier for carrying an acoustic pulse transducer
JP2020143938A (ja) * 2019-03-04 2020-09-10 中道鉄工株式会社 超音波式漏れ検査装置
JP2020186914A (ja) * 2019-05-09 2020-11-19 株式会社日立パワーソリューションズ 超音波検査装置及び超音波検査システム

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220283125A1 (en) * 2019-08-28 2022-09-08 Hitachi Power Solutions Co., Ltd. Ultrasonic Inspection System and Ultrasonic Inspection Method

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TWI813121B (zh) 2023-08-21
JP2022131075A (ja) 2022-09-07
KR20230133375A (ko) 2023-09-19
TW202234059A (zh) 2022-09-01
CN116917730A (zh) 2023-10-20
JP7489345B2 (ja) 2024-05-23

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